WO2022211401A1 - Numériseur et dispositif d'affichage d'image le comprenant - Google Patents

Numériseur et dispositif d'affichage d'image le comprenant Download PDF

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Publication number
WO2022211401A1
WO2022211401A1 PCT/KR2022/004296 KR2022004296W WO2022211401A1 WO 2022211401 A1 WO2022211401 A1 WO 2022211401A1 KR 2022004296 W KR2022004296 W KR 2022004296W WO 2022211401 A1 WO2022211401 A1 WO 2022211401A1
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WIPO (PCT)
Prior art keywords
layer
conductive
pad
digitizer
pad part
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PCT/KR2022/004296
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English (en)
Korean (ko)
Inventor
박민혁
유성우
이동엽
오근태
Original Assignee
동우화인켐 주식회사
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Publication of WO2022211401A1 publication Critical patent/WO2022211401A1/fr

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04107—Shielding in digitiser, i.e. guard or shielding arrangements, mostly for capacitive touchscreens, e.g. driven shields, driven grounds

Definitions

  • the present invention relates to a digitizer and an image display device including the same. More particularly, it relates to a digitizer including a multilayer conductive structure and an image display device including the same.
  • an image display device is implemented in the form of, for example, a smartphone.
  • electronic devices in which a touch panel or a touch sensor is attached to a display panel of the image display device to select a menu displayed on a window surface to implement an information input function are being developed.
  • a digitizer that converts analog coordinate information into a digital signal by an electromagnetic method is disposed on the back side of the image display device.
  • the digitizer can use electromagnetic induction to convert the current flowing through the conductive line into a magnetic field to transmit the frequency to the input pen. Therefore, it is desirable to increase the thickness of the conductive line to generate a sufficient magnetic field.
  • a flexible printed circuit board may be bonded onto the pads of the digitizer and to connect the digitizer with a driving integrated circuit chip. Accordingly, the thickness of the structure including the digitizer may be further increased. In this case, the foldable and bending characteristics of the digitizer may be deteriorated, and the flexible characteristics of the image display device may also be deteriorated.
  • One object of the present invention is to provide a digitizer having improved mechanical and electrical efficiency.
  • An object of the present invention is to provide an image display device including a digitizer having improved mechanical and electrical efficiency.
  • a base layer including a pad region; a lower conductive layer disposed on the upper surface of the base layer; an interlayer insulating layer formed on the upper surface of the base layer and covering the lower conductive layer; an upper conductive layer disposed on the interlayer insulating layer and electrically connected to the lower conductive layer; a passivation layer formed on the interlayer insulating layer and covering the upper conductive layer; a first pad portion disposed on the pad region of the base layer; and a second pad part in contact with the first pad part on the pad region of the base layer, wherein any one of the first pad part and the second pad part has a bonding part in contact with the upper surface of the base layer.
  • the lower conductive layer includes a plurality of first lower conductive lines and a plurality of second lower conductive lines extending in a second direction parallel to the upper surface of the base layer
  • the upper conductive layer is parallel to the upper surface of the base layer and includes a plurality of first upper conductive lines and a plurality of second upper conductive lines extending in a first direction perpendicular to the second direction, the digitizer.
  • the first conductive coil includes a plurality of first conductive coils extending in the first direction and arranged along the second direction
  • the second conductive coil extends in the second direction and includes a plurality of second conductive coils arranged along the first direction.
  • the circuit board may be directly bonded to the pad region on the base layer by extending the lower conductive layer and the upper conductive layer to the pad region.
  • the circuit board can be stably bonded with high adhesion.
  • the upper conductive layer and the lower conductive layer may be in contact with each other in the pad region to increase signal and current transmission efficiency through the circuit board. Therefore, it is possible to improve the current supply efficiency and electromagnetic induction efficiency as a whole of the digitizer.
  • FIG. 1 is a schematic cross-sectional view showing a digitizer according to exemplary embodiments.
  • FIGS. 2 and 3 are schematic plan views illustrating conductive coils included in a digitizer according to example embodiments.
  • FIG. 4 is a schematic plan view illustrating a digitizer according to exemplary embodiments.
  • FIG. 5 is a schematic cross-sectional view illustrating a digitizer according to some exemplary embodiments.
  • FIG. 6 is a schematic cross-sectional view illustrating a digitizer according to a comparative example.
  • FIG. 7 is a schematic cross-sectional view illustrating an image display apparatus according to example embodiments.
  • SUMMARY Embodiments of the present invention provide a digitizer including conductive patterns having a multilayer structure and having improved electrical characteristics and bending/folding reliability. Also provided is an image display device including a digitizer.
  • first direction and second direction are defined as a first direction and a second direction.
  • first direction and the second direction may cross each other perpendicularly.
  • the first direction may correspond to a width direction, a row direction, or an X-direction of the digitizer 100 .
  • the second direction may correspond to a longitudinal direction, a column direction, or a Y-direction of the digitizer 100 .
  • FIG. 1 is a schematic cross-sectional view showing a digitizer according to exemplary embodiments.
  • 2 and 3 are schematic plan views illustrating conductive coils included in a digitizer according to example embodiments.
  • FIG. 1 includes a cross-section cut in the thickness direction along the line I-I' shown in FIG. 2 and a cross-section in the pad region PR.
  • the digitizer 100 may include a lower conductive layer 110 and an upper conductive layer 130 formed on a base layer 105 .
  • the lower conductive layer 110 and the upper conductive layer 130 may be separated in different layers with the interlayer insulating layer 120 interposed therebetween.
  • the substrate layer 105 is used to encompass a support layer or a film-type substrate for forming the conductive layers 110 and 130 and the interlayer insulating layer 120 .
  • the base layer 105 may include a polymer applicable to a flexible display.
  • the polymer include cyclic olefin polymer (COP), polyethylene terephthalate (PET), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyphenylene sulfide (PPS), poly Allylate (polyallylate), polyimide (PI), cellulose acetate propionate (CAP), polyethersulfone (PES), cellulose triacetate (TAC), polycarbonate (PC), cyclic olefin copolymer (COC), poly Methyl methacrylate (PMMA), etc. are mentioned.
  • COP cyclic olefin polymer
  • PET polyethylene terephthalate
  • PAR polyacrylate
  • PEI polyetherimide
  • the base layer 105 may include polyimide to secure stable bending properties.
  • the lower conductive layer 110 and the upper conductive layer 130 may each include a low-resistance metal.
  • the lower conductive layer 110 and the upper conductive layer 130 are silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium ( Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc ( Zn), tin (Sn), molybdenum (Mo), calcium (Ca), or an alloy containing at least two of them.
  • the lower conductive layer 110 and the upper conductive layer 130 may include copper or a copper alloy to realize low resistance.
  • the interlayer insulating layer 120 may be formed on the upper surface of the base layer 105 to cover the lower conductive layer 110 .
  • the interlayer insulating layer 120 may include an organic insulating material such as an epoxy-based resin, an acrylic resin, a siloxane-based resin, or a polyimide-based resin, or an inorganic insulating material such as silicon oxide or silicon nitride.
  • the interlayer insulating layer 120 may be formed using an organic insulating material to improve flexible properties.
  • the upper conductive layer 130 may be formed on the interlayer insulating layer 120 .
  • the passivation layer 140 may be formed on the interlayer insulating layer 120 to cover the upper conductive layer 130 .
  • the passivation layer 140 may include an organic insulating material such as an epoxy-based resin, an acrylic resin, a siloxane-based resin, or a polyimide-based resin, or an inorganic insulating material such as silicon oxide or silicon nitride.
  • the passivation layer 140 may be formed using an organic insulating material to improve flexible properties.
  • Each of the interlayer insulating layer 120 and the passivation layer 140 may have a thickness in the range of about 1.5 to 20 ⁇ m to improve bending/folding properties.
  • a pad region PR may be disposed at one end of the base layer 105 .
  • the pad part 150 may be disposed in the pad area PR.
  • the pad unit 150 may include a first pad unit 152 and a second pad unit 154 .
  • the first pad part 152 may be included in the lower conductive layer 110 .
  • the second pad part 154 may be included in the upper conductive layer 130 .
  • the first pad part 152 may include the same material as the lower conductive layer 110 and may be formed together to have substantially the same thickness.
  • the second pad part 154 may include the same material as the upper conductive layer 130 and may be formed to have substantially the same thickness.
  • the first pad unit 152 may contact the upper surface of the base layer 105
  • the second pad unit 154 may contact the first pad unit 152
  • the second pad part 154 may contact the top surface and sidewalls of the first pad part 152 in the pad region PR, and may contact the top surface of the base layer 105 .
  • the passivation layer 140 may partially cover the pad part 150 . In some embodiments, the passivation layer 140 may cover the first pad part 152 and partially cover the second pad part 154 .
  • a portion of the second pad part 154 may be exposed from the passivation layer 140 .
  • a portion of the second pad part 154 in contact with the upper surface of the base layer 105 may be partially exposed from the passivation layer 140 .
  • the circuit board 190 may be bonded to the pad unit 150 through a conductive intermediate structure 180 such as an anisotropic conductive film (ACF).
  • the circuit board 190 may include, for example, a flexible printed circuit board (FPCB).
  • one end of the circuit board 190 may be bonded to the pad unit 150 as described above, and the other end of the circuit board 190 may be electrically connected to a digitizer driving integrated circuit (IC) chip. Accordingly, current application and signal transmission may be performed from the digitizer driving integrated circuit chip to the conductive layers 110 and 130 of the digitizer 100 .
  • IC digitizer driving integrated circuit
  • the circuit board 190 may be bonded through a direct pressing process on the exposed portion of the second pad unit 154 through the conductive intermediary structure 180 .
  • the pad region PR has a stacked structure of the base layer 105 , the pad part 150 (eg, the second pad part 154 ), the conductive intermediate structure 180 , and the circuit board 190 . It may include a bonding portion (BP) having a.
  • the bonding part BP may be used as a term referring to an exposed part of the second pad part 154 .
  • the interlayer insulating layer 120 and the passivation layer 140 may be excluded or removed. Accordingly, the circuit board 190 may be press-bonded on the pad unit 150 without a step difference due to the interlayer insulating layer 120 and/or the passivation layer 140 .
  • the bonding pressure may be sufficiently transferred to the conductive intermediary structure 180 , so that adhesion between the pad unit 150 and the circuit board 190 may be improved.
  • an anisotropic conductive film is used as the conductive intermediate structure 180 , conduction through the conductive balls dispersed in the conductive intermediate structure 180 may be uniformly implemented.
  • a bottom surface (eg, a bonding surface) of the conductive intermediate structure 180 may not contact the interlayer insulating layer 120 and the passivation layer 140 . Accordingly, a substantially flat bonding surface can be provided.
  • the pad part 150 may be formed such that the first pad part 152 and the second pad part 154 contact each other to increase the conductive area of the pad part 150 . Accordingly, the electromagnetic induction phenomenon in the conductive coils included in the digitizer 100 may be amplified by reducing the contact resistance or bonding resistance with the circuit board 190 .
  • the digitizer 100 may include a first conductive coil 50 and a second conductive coil 70 .
  • the first conductive coil 50 and the second conductive coil 70 may be defined by combining the lower conductive layer 110 and the upper conductive layer 130 by the contacts 135 and 137 .
  • the lower conductive layer 110 may include a first lower conductive line 112 (see FIG. 3 ) and a second lower conductive line 114 (see FIG. 2 ).
  • the upper conductive layer 130 may include a first upper conductive line 132 (see FIG. 2 ) and a second upper conductive line 134 (see FIG. 3 ).
  • the first lower conductive line 112 and the second lower conductive line 114 may extend in the second direction.
  • the length of the second lower conductive line 114 may be smaller than the length of the first lower conductive line 112 .
  • the first upper conductive line 132 and the second upper conductive line 134 may extend in a first direction.
  • the length of the second upper conductive line 134 may be smaller than the length of the first upper conductive line 132 .
  • the first upper conductive line 132 of the upper conductive layer 130 and the second lower conductive line 114 of the lower conductive layer 110 are coupled to each other to form a first conductive coil 50 . can form.
  • the first upper conductive line 132 and the second lower conductive line 114 may together form a first conductive coil 50 to serve as a sensing line for an input pen through electromagnetic induction.
  • first upper conductive line 132 and the second lower conductive line 114 may be electrically connected to each other through the first contact 135 .
  • a plurality of first upper conductive lines 132 and a plurality of second lower conductive lines 114 are electrically connected to each other through a plurality of first contacts 135 to form a single first conductive coil 50 .
  • a plurality of conductive loops may be included. For example, four first conductive loops may be included in one first conductive coil 50 .
  • the first conductive loops may have different sizes or areas in a planar direction.
  • the first contact 135 may pass through the interlayer insulating layer 120 to be formed substantially integrally with the first upper conductive line 132 .
  • a first trace 60 may be connected to any one of the first conductive loops.
  • the first trace 60 may include a first input line 62 and a first output line 64 .
  • the first trace 60 may extend in the second direction, for example.
  • a first input line 62 is connected to a first conductive loop of any one of the first conductive loops, and a first output line 64 is connected to a first conductive loop of the other of the first conductive loops.
  • the first input line 62 may be connected to an innermost first conductive loop among the first conductive loops.
  • the first output line 64 may be connected to an outermost first conductive loop among the first conductive loops.
  • the current input from the first input line 62 may alternately cycle through the lower conductive layer 110 and the upper conductive layer 130 through the first conductive loops, and may be discharged through the first output line 64 . have.
  • the first input line 62 and the first output line 64 may be included in the lower conductive layer 110 .
  • the lower conductive layer 110 may further include a first internal connection line 114a.
  • the first internal connection line 114a may connect adjacent first conductive loops to each other.
  • the first lower conductive line 112 of the lower conductive layer 110 and the second upper conductive line 134 of the upper conductive layer 130 are coupled to each other to form a second conductive coil 70 . can form.
  • the first lower conductive line 112 and the second upper conductive line 134 may be provided together as a sensing line for an input pen through electromagnetic induction by forming a second conductive coil 70 together.
  • first lower conductive line 112 and the second upper conductive line 134 may be electrically connected to each other through the second contact 137 .
  • a plurality of first lower conductive lines 112 and a plurality of second upper conductive lines 134 are electrically connected to each other through a plurality of second contacts 137 to form a single second conductive coil 70 .
  • a plurality of conductive loops may be included. For example, four second conductive loops may be included in one second conductive coil 70 .
  • the second conductive loops may have different sizes or areas in a planar direction.
  • the second contact 137 may be formed substantially integrally with the second upper conductive line 134 through the interlayer insulating layer 120 .
  • a second trace 80 may be connected to any one of the second conductive loops.
  • the second trace 80 may include a second input line 82 and a second output line 84 .
  • the second trace 80 may extend in the second direction.
  • the second input line 82 may be connected to an innermost second conductive loop among the second conductive loops.
  • the second output line 84 may be connected to an outermost second conductive loop among the second conductive loops.
  • the current input from the second input line 82 may alternately cycle through the lower conductive layer 110 and the upper conductive layer 130 through the second conductive loops, and may be discharged through the second output line 84 . have.
  • the second input line 82 and the second output line 84 may be included in the lower conductive layer 110 .
  • the upper conductive layer 130 may further include an external connection line 134a.
  • the second input line 82 and the second output line 84 may be connected to the second conductive loop and the second contact 137 by the external connection line 134a.
  • the external connection line 134a may be connected to two different second conductive coils.
  • the second output line 84 connected to one of the second conductive coils 70 may be connected to the second input line 82 of the other second conductive coil 70 through the external connection line 134a. may be
  • the upper conductive layer 130 may further include a second internal connection line 134b.
  • a second internal connection line 134b For example, adjacent second conductive loops in the second conductive coil 70 may be connected to each other by the second internal connection line 134b.
  • the number of conductive loops in the conductive coil may be adjusted in consideration of the size and resolution of the image display device.
  • the first conductive coil 50 and the second conductive coil 70 may each include a plurality of conductive loops having different sizes.
  • the conductive loop is formed by connecting the lower conductive layer 110 and the upper conductive layer 130 through the contacts 135 and 137 , the number of loops of the conductive coil in a limited space is efficiently increased and electromagnetic induction efficiency is achieved. can improve
  • both the lower conductive layer 110 and the upper conductive layer 130 may be disposed on the upper surface of the base layer 105 . Accordingly, when bending or folding through the base layer 105 , the stress direction for the lower conductive layer 110 and the upper conductive layer 130 may be adjusted in the same manner.
  • tensile stress when tensile stress is applied to the bottom surface of the base layer 105 , compressive stress may be applied to the lower conductive layer 110 and the upper conductive layer 130 . Accordingly, a neutral plane in which stress is canceled may be easily generated to be adjacent to the conductive layers 110 and 130 . Accordingly, stress applied to the conductive layers 110 and 130 may be relieved, thereby reducing or preventing electrode cracking due to bending.
  • the thickness of the lower conductive layer 110 may be greater than the thickness of the upper conductive layer 130 .
  • the thickness of the first lower conductive line 112 may be greater than the thickness of the first upper conductive line 132 .
  • the first upper conductive line 132 may extend in a first direction (eg, a row direction or a width direction) and intersect the folding axis.
  • first direction eg, a row direction or a width direction
  • first upper conductive line 132 may be perpendicular to the folding axis.
  • the first lower conductive line 112 may extend in a second direction (a column direction or a length direction) and may be substantially parallel to the folding axis.
  • the prevention of cracks in the conductive line may be reduced or suppressed.
  • the first lower conductive line 112 that is parallel to the folding axis and is relatively free from bending/folding stress is formed to have a large thickness, so that a sufficient electromagnetic induction effect may be realized by expanding a current path through the conductive coil.
  • the second lower conductive line 114 may also have a greater thickness than the second upper conductive line 134 .
  • the thickness of the lower conductive layer 110 may be about 5 to 20 ⁇ m, preferably 10 ⁇ m or more, for example 10 to 10 ⁇ m. It may be 20 ⁇ m.
  • the thickness of the upper conductive layer 130 may be 6 ⁇ m or less, preferably about 1 to 6 ⁇ m.
  • FIG. 4 is a schematic plan view illustrating a digitizer according to exemplary embodiments.
  • the detailed structure/configuration of the conductive coil and the illustration of the traces 60 and 80 are omitted in FIG. 4 .
  • a plurality of first conductive coils 50 and second conductive coils 70 may be arranged on the upper surface of the base layer 105 .
  • the first conductive coil 50 may extend in the first direction or the row direction.
  • the plurality of first conductive coils 50 may be arranged along the second direction or the column direction.
  • first conductive coils 50 - 1 to 50 - n may be sequentially arranged along the second direction (n is a natural number).
  • the first conductive coils 50 may partially overlap each other and may be arranged in the second direction.
  • the second conductive coil 70 may extend in the second direction or the column direction.
  • the plurality of second conductive coils 70 may be arranged along the first direction or the row direction.
  • m second conductive coils 70 - 1 to 70 - m may be sequentially arranged in the first direction.
  • the second conductive coils 70 may partially overlap each other and may be arranged along the first direction.
  • the substrate layer 105 includes a main region 102 , and the conductive coils 50 , 70 may be arranged on the main region 102 of the substrate layer 105 .
  • the main area 102 may include an active area in which sensing of the input pen is substantially performed.
  • the pad region PR may be disposed at one end of the base layer 105 .
  • the pad area PR may protrude from one end of the main area 102 .
  • pad parts 150 may be arranged on the pad area PR.
  • the pad unit 150 may be connected to the traces 60 and 80 described with reference to FIGS. 2 and 3 .
  • the plurality of pad units 150 may be connected to the traces 60 and 80 , respectively. Accordingly, an array of the plurality of pad units 150 may be formed on the pad area PR.
  • the pad part 150 or the bonding part BP may be disposed on the same layer or on the same level as the lower conductive layer 110 . Accordingly, it is possible to implement an electrical connection with an external circuit without an additional increase in thickness.
  • the central portion of the base layer 105 may include a folding portion FP.
  • a folding shaft 90 extending in the second direction may be positioned in the folding part FP.
  • the digitizer 100 according to example embodiments may be bent or folded around the folding axis 90 .
  • the thickness of the first upper conductive line 132 or the second upper conductive line 134 crossing the folding axis 90 may be relatively small. Accordingly, it is possible to prevent cracking of the upper conductive layer 130 to which bending stress is directly applied and to increase flexibility.
  • the thicknesses of the first lower conductive line 112 and the second lower conductive line 114 parallel to the folding axis 90 and having relatively small bending stress are increased to reduce resistance and improve the efficiency of generating a magnetic field through the conductive coil. can do it
  • FIG. 5 is a schematic cross-sectional view illustrating a digitizer according to some exemplary embodiments. Detailed descriptions of configurations and structures substantially the same as or similar to those described with reference to FIG. 1 will be omitted.
  • a portion of the upper surface of the first pad part 152 may be covered by the interlayer insulating layer 120 in the pad region PR, and the remaining portion of the first pad part 152 may be covered with the interlayer insulating layer ( 120) can be exposed.
  • the second pad part 154 may be formed on the interlayer insulating layer 120 .
  • the second pad part 154 is formed along the top surface and sidewalls of the interlayer insulating layer 120 in the pad region PR, and may contact the first pad part 152 .
  • the passivation layer 140 may cover the second pad part 154 and partially cover the first pad part 152 .
  • the bonding part BP may have a stacked structure of the base layer 105 , the first pad part 152 , the conductive intermediate structure 180 , and the circuit board 190 .
  • the bonding part BP may be used as a term referring to an exposed part of the first pad part 152 .
  • FIG. 6 is a schematic cross-sectional view illustrating a digitizer according to a comparative example. For convenience of explanation, FIG. 6 shows only the pad area included in the digitizer of the comparative example.
  • the interlayer insulating layer 120 may be formed on the first pad part 152 , and a via hole passing through the interlayer insulating layer 120 may be formed. have.
  • the second pad part 154 is formed on the interlayer insulating layer 120 and may contact the first pad part 152 through the via hole.
  • the passivation layer 140 may partially cover the second pad part 154 and expose a portion of the second pad part 154 .
  • the exposed portion of the second pad part 154 may serve as a bonding part.
  • the conductive intermediate structure 180 may be inserted into the via hole, and the circuit board 190 may be pressed onto the conductive intermediate structure 180 through the via hole to be bonded to the second pad part 154 .
  • the bonding process is performed in a state in which the step difference due to the interlayer insulating layer 120 and the passivation layer 140 and the via hole structure remain in the pad region. Accordingly, the distribution of the conductive balls included in the conductive intermediate structure 180 is not uniformly implemented. In addition, sufficient adhesion of the circuit board 190 may not be secured due to the step.
  • the stacked structure of the first pad part 152 and the second pad part 154 is maintained in the pad region PR, and the interlayer insulating layer ( 120) and passivation layer 140 may be excluded. Accordingly, the bonding reliability of the circuit board 190 may be improved while reducing the circuit connection resistance in the pad area PA.
  • only one of the first pad part 152 and the second pad part 154 may remain in the bonding part BP. Accordingly, it is possible to reduce the thickness of the bonding portion BP, which is a substantial bonding bonding area, and to improve the pressing efficiency in the bonding process.
  • FIG. 7 is a schematic cross-sectional view illustrating an image display apparatus according to example embodiments.
  • the image display apparatus may include the display panel 360 , the touch sensor 200 , and the digitizer 100 according to the above-described exemplary embodiments.
  • the digitizer 100 may be disposed under the display panel 360 .
  • the digitizer 100 may be disposed between the display panel 360 and the rear cover 380 .
  • the digitizer 100 includes relatively thick conductive lines for efficiency in generating a magnetic field using electromagnetic induction, and may include a plurality of conductive coils. Accordingly, the digitizer 100 may be disposed under the display panel 360 so as not to be recognized by a user of the image display apparatus.
  • Conductive lines included in the digitizer 100 may not be recognized by a user. Accordingly, each of the conductive lines included in the digitizer 100 may be formed as a solid line including the above-described metal without employing a mesh structure to improve transmittance.
  • a sufficient current path may be secured by the conductive line to enhance electromagnetic induction efficiency.
  • the main board 370 may be disposed between the digitizer 100 and the rear cover 380 .
  • a digitizer driving IC chip 375 may be mounted on the main board 370 .
  • the circuit board 190 connected through the pad region PR or the bonding portion BP of the digitizer 100 is connected to the main board 370 to form the digitizer driving IC chip 375 from the digitizer 100 .
  • Current supply to the furnace and signal control may be performed.
  • the touch sensor IC chip 374 may be mounted on the main board 370 .
  • the touch sensor 200 to be described later may be electrically connected to the touch sensor IC chip 374 by being connected to the main board 370 through a flexible printed circuit board.
  • an application processor (AP) chip 372 may be mounted on the main board 370 to control the operation of the display panel 360 .
  • the display panel 360 may include a pixel electrode 310 , a pixel defining layer 320 , a display layer 330 , a counter electrode 340 , and an encapsulation layer 350 disposed on the panel substrate 300 .
  • a pixel circuit including a thin film transistor (TFT) may be formed on the panel substrate 300 , and an insulating layer covering the pixel circuit may be formed.
  • the pixel electrode 310 may be electrically connected to, for example, a drain electrode of a TFT on the insulating layer.
  • the pixel defining layer 320 may be formed on the insulating layer to expose the pixel electrode 310 to define a pixel area.
  • a display layer 330 is formed on the pixel electrode 310 , and the display layer 330 may include, for example, a liquid crystal layer or an organic light emitting layer.
  • a counter electrode 340 may be disposed on the pixel defining layer 320 and the display layer 330 .
  • the opposing electrode 340 may be provided as a common electrode or a cathode of the image display device, for example.
  • An encapsulation layer 350 for protecting the display panel 360 may be stacked on the opposite electrode 340 .
  • the touch sensor 200 may be stacked on the display panel 360 and disposed toward the window substrate 230 .
  • the touch sensor 200 may generate capacitance by a user's touch input through the surface of the window substrate 230 .
  • the touch sensor 200 may include a sensing electrode or sensing channels having a thickness smaller than that of the conductive layer included in the digitizer 100 so as not to be recognized by the user.
  • the thickness of the sensing electrode or the sensing channel may be less than 1 ⁇ m or less than 0.5 ⁇ m.
  • Each of the sensing electrodes or the sensing channels may be independently disposed in one single layer to interact with an adjacent sensing electrode or sensing channel to generate capacitance.
  • the touch sensor 200 may be coupled to the display panel 360 through the adhesive layer 260 .
  • the window substrate 230 includes, for example, a hard coating film and thin glass, and in an embodiment, a light blocking pattern 235 may be formed on a peripheral portion of one surface of the window substrate 230 .
  • the light blocking pattern 235 may include, for example, a color printing pattern.
  • a bezel part or a non-display area of the image display device may be defined by the light blocking pattern 235 .
  • a polarization layer 210 may be disposed between the window substrate 230 and the touch sensor 200 .
  • the polarizing layer 210 may include a coated polarizer or a polarizing plate.
  • the polarization layer 210 may be directly bonded to the one surface of the window substrate 230 or may be attached through the first adhesive layer 220 .
  • the touch sensor 200 may be coupled to the polarization layer 210 through the second adhesive layer 225 .
  • the window substrate 230 , the polarization layer 210 , and the touch sensor 200 may be sequentially disposed from the user's viewing side.
  • the sensing electrodes of the touch sensor 200 are disposed under the polarization layer 210 , it is possible to more effectively prevent the sensing electrode from being viewed.
  • the touch sensor 200 may be directly transferred onto the window substrate 230 or the polarization layer 210 .
  • the window substrate 230 , the touch sensor 200 , and the polarization layer 210 may be disposed in the order from the user's viewing side.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Position Input By Displaying (AREA)

Abstract

Un numériseur comprend : une couche de substrat comprenant une zone de tampon; une couche conductrice inférieure disposée sur la surface supérieure de la couche de substrat; une couche isolante inter-couche formée sur la surface supérieure de la couche de substrat et recouvrant la couche conductrice inférieure; une couche conductrice supérieure disposée sur la couche isolante inter-couche et connectée électriquement à la couche conductrice inférieure; une couche de passivation formée sur la couche isolante inter-couche et recouvrant la couche conductrice supérieure; une première partie de tampon disposée sur la zone de tampon de la couche de substrat; et une seconde partie de tampon venant en contact avec la première partie de tampon sur la zone de tampon de la couche de substrat. Au moins l'une de la première partie de tampon et de la seconde partie de tampon comprend une partie de liaison venant en contact avec la surface supérieure de la couche de substrat.
PCT/KR2022/004296 2021-03-29 2022-03-28 Numériseur et dispositif d'affichage d'image le comprenant WO2022211401A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2021-0040600 2021-03-29
KR1020210040600A KR20220135066A (ko) 2021-03-29 2021-03-29 디지타이저 및 이를 포함하는 화상 표시 장치

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WO2022211401A1 true WO2022211401A1 (fr) 2022-10-06

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KR (1) KR20220135066A (fr)
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009157200A (ja) * 2007-12-27 2009-07-16 Sharp Corp 表示装置及びその製造方法
KR101230191B1 (ko) * 2010-12-14 2013-02-06 삼성디스플레이 주식회사 터치 스크린 패널 및 그 제조방법
KR20150092817A (ko) * 2014-02-05 2015-08-17 삼성디스플레이 주식회사 액정 표시 장치 및 이를 위한 디지타이저 모듈
KR20150135565A (ko) * 2014-05-22 2015-12-03 전자부품연구원 디지타이저 전극을 갖는 터치패널 및 그 제조방법
KR102036293B1 (ko) * 2017-03-22 2019-10-24 동우 화인켐 주식회사 전극 접속 구조물 및 터치 센서

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101750564B1 (ko) 2011-01-05 2017-06-23 삼성전자주식회사 디지타이저 일체형 디스플레이 모듈

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009157200A (ja) * 2007-12-27 2009-07-16 Sharp Corp 表示装置及びその製造方法
KR101230191B1 (ko) * 2010-12-14 2013-02-06 삼성디스플레이 주식회사 터치 스크린 패널 및 그 제조방법
KR20150092817A (ko) * 2014-02-05 2015-08-17 삼성디스플레이 주식회사 액정 표시 장치 및 이를 위한 디지타이저 모듈
KR20150135565A (ko) * 2014-05-22 2015-12-03 전자부품연구원 디지타이저 전극을 갖는 터치패널 및 그 제조방법
KR102036293B1 (ko) * 2017-03-22 2019-10-24 동우 화인켐 주식회사 전극 접속 구조물 및 터치 센서

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