WO2022206632A1 - 连接器单体、连接器、电路板、电子设备及电子系统 - Google Patents

连接器单体、连接器、电路板、电子设备及电子系统 Download PDF

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Publication number
WO2022206632A1
WO2022206632A1 PCT/CN2022/083211 CN2022083211W WO2022206632A1 WO 2022206632 A1 WO2022206632 A1 WO 2022206632A1 CN 2022083211 W CN2022083211 W CN 2022083211W WO 2022206632 A1 WO2022206632 A1 WO 2022206632A1
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WO
WIPO (PCT)
Prior art keywords
connector
male
pin
female
circuit board
Prior art date
Application number
PCT/CN2022/083211
Other languages
English (en)
French (fr)
Inventor
杨张卫
王洪利
苏天杰
黄圣贤
黄双刚
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to EP22778814.8A priority Critical patent/EP4297192A4/en
Publication of WO2022206632A1 publication Critical patent/WO2022206632A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/79—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB

Definitions

  • the present application relates to the technical field of electronic system accessories, and in particular, to a connector unit, a connector, a circuit board, an electronic device and an electronic system.
  • a connector is an indispensable part of electronic products. It is used in the circuit where the circuit is blocked or between independent circuits to set up a bridge of communication, so that the current can flow and the circuit can achieve the predetermined function.
  • the application of connectors is more and more extensive.
  • connectors have been widely used in electronic devices such as mobile phones and tablets.
  • the connector can electrically connect a PCB (printed circuit board, printed circuit board) and an FPC (flexible printed circuit) in an electronic device.
  • Embodiments of the present application provide a connector unit, a connector, a circuit board, an electronic device, and an electronic system, which can improve the problem of poor SI caused by using a connector to electrically connect different electronic devices together.
  • a connector unit in a first aspect, includes a first contact piece and a second contact piece; the first contact piece includes a first contact terminal and a first pin electrically connected to the first contact terminal.
  • the second contact piece includes a second contact terminal and a second pin electrically connected to the second contact terminal; wherein, the first contact terminal and the first pin electrically connected to it are integrally formed, and the second contact terminal and the second contact terminal are electrically connected to it.
  • the second pin is integrally formed; the area of the welding surface of the first pin is smaller than the area of the welding surface of the second pin.
  • the size of the pads on the circuit board is designed according to the size of the pins soldered on it, and the connector unit includes the first pin and the first pin.
  • the relative area between a pin, the first pad and the reference ground layer of the circuit board is smaller than the relative area between the second pin, the second pad and the reference ground layer of the circuit board.
  • the capacitance formula the first pin
  • the parasitic capacitance between the first pad and the reference ground layer of the circuit board will be reduced relative to the parasitic capacitance between the second pin, the second pad and the reference ground layer of the circuit board, so according to the characteristic impedance calculation formula,
  • the characteristic impedance of the connector unit at the location of the first pin will increase, so that the mismatch between the characteristic impedance of the connector unit at the location of the first pin and the characteristic impedance of the traces of the circuit board can be improved It reduces the reflection of the signal on the first pin when it is transmitted between the connector unit and the circuit board, improves the SI, and reduces the signal on the first pin between the connector and the circuit board. The reflection that exists during transmission increases the SI.
  • the value range of the area of the welding surface of the first pin is 0.0016mm 2 -7.8804mm 2
  • the value range of the area of the welding surface of the second pin is 0.004mm 2 -8mm 2
  • the value range of the area of the welding surface of the first pin is 0.0016mm 2 to 7.8804mm 2
  • the parasitic capacitance between the first pin, the first pad and the reference ground layer of the circuit board can be reduced, and the The characteristic impedance of the connector body at the location of a pin.
  • the value range of the area of the soldering surface of the second pin is 0.004 mm 2 to 8 mm 2 , the reliability of the soldering between the single connector and the circuit board can be ensured.
  • the difference between the area of the soldering surface of the second pin and the area of the soldering surface of the first pin ranges from 0.024 mm 2 to 7.9984 mm 2 .
  • the first contact piece and the second contact piece are arranged along the length direction of the connector unit; along the width direction of the connector unit, the length of the welding surface of the first pin is smaller than that of the second lead The length of the welding surface of the foot.
  • the width direction of the connector unit by making the length of the welding surface of the first pin smaller than the length of the welding surface of the second pin, the area of the welding surface of the first pin can be made smaller than that of the second pin. The area of the soldering surface of the lead.
  • the length of the welding surface of the first pin ranges from 0.02 mm to 3.98 mm
  • the length of the welding surface of the second pin ranges from 0.02 mm to 3.98 mm.
  • the range is 0.04mm to 4mm.
  • the length of the soldering surface of the first pin can be reduced relative to the length of the soldering surface of the second pin.
  • the difference between the length of the soldering surface of the second pin and the length of the soldering surface of the first pin ranges from 0.02 mm to 3.98 mm.
  • the first pin is a high-speed signal pin
  • the second pin is a non-high-speed signal pin.
  • the high-speed signal pins are used to transmit high-speed signals
  • the non-high-speed signal pins are used to transmit non-high-speed signals. Since the signal integrity transmitted between the connector unit and the circuit board is mainly related to the high-speed signal, when the first pin is the high-speed signal pin, it can reduce the time when the high-speed signal is transmitted between the connector unit and the circuit board. The presence of reflections, and the signal integrity mainly depends on the high-speed signal, this way, the SI can be further improved.
  • the non-high-speed signal pins are low-speed signal pins, power pins or ground pins.
  • the low-speed signal pin can be, for example, a control signal pin or a low-speed clock signal pin.
  • the low-speed signal pins are used to transmit low-speed signals
  • the power pins are used to transmit power signals
  • the ground pins are used to transmit ground signals.
  • the first contact piece and the second contact piece are arranged along the length direction of the connector unit; the cross-sectional area of the first contact terminal along the width direction of the connector unit is smaller than that of the second contact terminal along the width direction of the connector unit.
  • the area of the cross-section in the width direction of the single connector is smaller than that of the second contact terminal along the width direction of the connector unit.
  • the contact between the first contact terminal and its adjacent contact terminals The parasitic capacitance is small, so the characteristic impedance at the position of the first contact terminal is larger, so that the characteristic impedance of the connector unit at the position of the first contact terminal and the characteristic impedance of the trace of the circuit board can be improved.
  • the problem of matching reduces the reflection that exists when the signal on the first contact terminal is transmitted between the connector unit and the circuit board, and improves the SI. Since the first pin is electrically connected to the first contact terminal, the reflection that exists when the signal on the first pin is transmitted between the connector unit and the circuit board can be further reduced.
  • a connector in a second aspect, includes a connector male head and a connector female seat, and the connector male head and the connector female seat are snap-connected; the connector male head is the connector provided in the above first aspect A single body; and/or, the connector female seat is the connector single body provided by the first aspect.
  • the male connector is the single connector provided in the first aspect, the male connector has the same technical effect as the single connector provided in the first aspect, which will not be repeated here.
  • the connector receptacle is the connector unit provided in the first aspect
  • the connector receptacle has the same technical effect as the connector unit provided in the first aspect, which will not be repeated here.
  • the male connector includes a first contact piece and a second contact piece
  • the female connector includes a first contact piece and a second contact piece; wherein, due to the first contact of the male connector The first contact terminal in the connector is snap-connected with the first contact terminal in the first contact part of the connector female, and the second contact terminal in the second contact part of the connector male is connected with the second contact terminal of the connector female
  • the second contact terminal in the contact piece is snap-inserted connection, so that the snap-insertion connection of the connector male head and the connector female seat can be realized.
  • the first contact terminal of the male connector is connected with the first contact terminal of the female connector through a contact point
  • the second contact terminal of the male connector is connected to the female connector.
  • the second contact terminal is connected through a plurality of contact points by means of snap-insertion. Since the first contact terminal of the male connector is connected with the first contact terminal of the female connector through a contact point, the first contact between the first contact terminal of the male connector and the female connector can be reduced. Signals transmitted on the terminals are reflected, further improving SI. When the signal transmitted on the first contact terminal and the first female contact terminal is a high-speed signal, the SI of the high-speed signal can be improved.
  • the second contact terminal of the connector male is connected with the second contact terminal of the connector female through a plurality of contact points, the buckle between the connector male and the connector female can be ensured. The insertion force ensures the reliability of the button insertion.
  • the male connector of the connector further includes an auxiliary contact terminal; the material of the auxiliary contact terminal is a non-conductive material; the first contact terminal of the male connector and the first contact terminal of the female connector also pass through Auxiliary contact terminals snap-in connection.
  • the snap-pulling force of the connector male head and the connector female seat can be increased, so that the snap-fit reliability of the connector male head and the connector female seat can be further ensured.
  • the connector is a board-to-board BTB connector, a type-C connector, a low voltage differential signal LVDS connector, an M.2 connector or a WTB connector.
  • a circuit board in a third aspect, includes a signal terminal layer and a reference ground layer arranged in layers, the reference ground layer covers the signal terminal layer, and the signal terminal layer includes a first pad and a second pad; wherein the first solder pad The area of the soldering surface of the pad is smaller than the area of the soldering surface of the second pad.
  • the capacitance formula shows that the characteristic impedance of the connector unit at the location of the first pin will increase, so that the characteristic impedance of the connector unit at the location of the first pin and the wiring of the circuit board can be improved.
  • the problem that the characteristic impedance of the line does not match reduces the reflection of the signal on the first pin and the first pad when it is transmitted between the connector unit and the circuit board, improves the SI, and reduces the first lead.
  • the reflection that exists when the signal on the pin and the first pad is transmitted between the connector and the circuit board improves the SI.
  • the value range of the area of the welding surface of the first pad is 0.0055mm 2 -23.8004mm 2
  • the value range of the area of the welding surface of the second pad is 0.0091mm 2 -24mm 2
  • the value range of the area of the welding surface of the first pad is 0.0055mm 2 to 23.8004mm 2
  • the parasitic capacitance between the first pin, the first pad and the reference ground layer of the circuit board can be reduced, and the The characteristic impedance of the connector body at the location of a pin.
  • the value of the area of the welding surface of the second pad is in the range of 0.0091 mm 2 to 24 mm 2 , the reliability of the welding of the single connector and the circuit board can be ensured.
  • the difference between the area of the welding surface of the second pad and the area of the welding surface of the first pad is in the range of 0.0036 mm 2 to 23.9945 mm 2 .
  • the first pads and the second pads are arranged along a first direction; along a direction perpendicular to the first direction, the length of the bonding surface of the first bonding pad is shorter than that of the second bonding pad length.
  • the circuit board along the direction perpendicular to the first direction, by making the length of the soldering surface of the first pad smaller than the length of the soldering surface of the second pad, the area of the soldering surface of the first pad can be smaller than that of the second pad. The area of the soldering surface of the second pad.
  • the length of the welding surface of the first pad ranges from 0.05 mm to 5.98 mm, and the length of the welding surface of the second pad is 0.07 mm. mm ⁇ 6mm.
  • the length of the bonding surface of the first pad can be reduced relative to the length of the bonding surface of the second bonding pad.
  • the difference between the length of the bonding surface of the second pad and the length of the bonding surface of the first bonding pad ranges from 0.02 mm to 5.95 mm.
  • the circuit board is a printed circuit board or a flexible circuit board.
  • an electronic device which includes a circuit board and a connector unit mounted on the circuit board; wherein the connector unit is the connector unit provided in the first aspect, and the circuit board is the above-mentioned connector unit.
  • the electronic device has the same technical effect as the circuit board provided in the third aspect, and reference may be made to the description of the third aspect, which will not be repeated here.
  • the connector unit is a connector male or a connector female.
  • a fifth aspect provides an electronic system, which includes the connector provided in the fourth aspect, a first electronic device, and a second electronic device; the connector male is electrically connected to the first electronic device, and the connector female is connected to the first electronic device.
  • the second electronic device is electrically connected;
  • the connector male head includes a first pin and a second pin, the area of the welding surface of the first pin is smaller than the area of the welding surface of the second pin, and the first electronic device is the third The circuit board provided by the aspect;
  • the first pin of the connector male is electrically connected to the first pad of the first electronic device, and the second pin of the connector male is electrically connected to the second pad of the first electronic device;
  • the connector socket includes a first pin and a second pin, the area of the soldering surface of the first pin is smaller than the area of the soldering surface of the second pin, and the second electronic device is provided by the third aspect.
  • the circuit board; the first pin of the connector female is electrically connected with the first pad of the second electronic device, and the second pin of the connector female is electrically connected with the second pad of the second electronic device.
  • the electronic system has the same technical effect as the circuit board provided in the third aspect, and reference may be made to the description of the third aspect, which will not be repeated here.
  • the electronic system is a first electronic device, and the connector, the first electronic device and the second electronic device are arranged in the first electronic device.
  • the electronic system includes a first electronic device and a second electronic device; the connector male head and the first electronic device are arranged in the first electronic device, and the connector female seat and the second electronic device are arranged in the in the second electronic device.
  • FIG. 1 is a schematic structural diagram of a first electronic device according to an embodiment of the present application
  • FIG. 2 is a schematic structural diagram of an electronic system provided by an embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of a connector provided by an embodiment of the present application.
  • FIG. 4 is a schematic structural diagram of a connector male installed on a first electronic device according to an embodiment of the present application
  • FIG. 5 is a schematic structural diagram of a connector male head provided by an embodiment of the present application.
  • FIG. 6 is an exploded view of a male connector of an embodiment of the present application.
  • FIG. 7a is a schematic structural diagram of a first male contact piece or a second male contact piece according to an embodiment of the present application
  • 7b is a schematic structural diagram of a first male contact piece provided by an embodiment of the application.
  • FIG. 8 is a schematic structural diagram of a first circuit board or a fourth circuit board according to an embodiment of the present application.
  • 9a is a side view of the positional relationship between a first male header pin, a first male header pad, and a first reference ground layer, or a second male header pin, a second male header pin, a second male header pin, a second male header pin, a second male header pin, a second male header pin, a second male header pin Side view of the positional relationship between the header pad and the first reference ground layer;
  • FIG. 9b is a top view of the positional relationship between the first male header pin, the first male header pad, and the first reference ground layer according to an embodiment of the application, or, the second male header pin, the second male header Top view of the positional relationship between the pad and the first reference ground layer;
  • FIG. 10 is a schematic structural diagram of a connector socket mounted on a second electronic device according to an embodiment of the application.
  • FIG. 11 is a schematic structural diagram of a connector receptacle provided by an embodiment of the application.
  • FIG. 12 is an exploded view of a connector socket provided by an embodiment of the application.
  • FIG. 13 is a schematic structural diagram of a female contact piece provided by an embodiment of the application.
  • FIG. 14 is a schematic structural diagram of a second circuit board provided by an embodiment of the application.
  • FIG. 15a is a schematic structural diagram of a plug connection between a connector male and a connector female according to an embodiment of the application;
  • Fig. 15b is a schematic structural diagram of a snap connection between a connector male and a connector female according to another embodiment of the present application.
  • 16 is a schematic structural diagram of a connector male provided by the related art.
  • FIG. 17 is a schematic structural diagram of a plug connection between a male connector of a connector and a female connector of the connector provided by the related art
  • FIG. 19 is a schematic structural diagram of a connector socket mounted on a second electronic device according to another embodiment of the application.
  • FIG. 20 is a schematic structural diagram of a connector receptacle provided by an embodiment of the present application.
  • FIG. 21 is an exploded view of a connector receptacle provided by an embodiment of the present application.
  • electrical connection may be a direct electrical connection or an indirect electrical connection through an intermediate medium.
  • words such as “exemplary” or “for example” are used to represent examples, illustrations or illustrations. Any embodiments or designs described in the embodiments of the present application as “exemplary” or “such as” should not be construed as preferred or advantageous over other embodiments or designs. Rather, use of words such as “exemplary” or “such as” is intended to present the related concepts in a specific manner.
  • "and/or” which describes the association relationship of the associated objects, indicates that there can be three kinds of relationships, for example, A and/or B can indicate that A exists alone, A and B exist at the same time, and they exist independently The case of B, where A and B can be singular or plural.
  • the character "/" generally indicates that the associated objects are an "or" relationship.
  • direction indications such as up, down, left, right, front and rear, etc. used to explain the structures and movements of different components in the present application are relative. These indications are appropriate when the parts are in the positions shown in the figures. However, if the description of the element location changes, these directional indications will also change accordingly.
  • Embodiments of the present application provide an electronic system, which may be one electronic device, such as a first electronic device; the electronic system may also include multiple electronic devices, such as a second electronic device and a third electronic device.
  • the first electronic device, the second electronic device and the third electronic device may be, for example, a mobile phone (mobile phone), a tablet computer (pad), a personal digital assistant (PDA), a TV, a smart wearable product (for example, smart watches, smart bracelets), virtual reality (VR) terminal equipment, augmented reality (AR) terminal equipment, cable assemblies, etc.
  • a mobile phone mobile phone
  • PDA personal digital assistant
  • TV TV
  • smart wearable product for example, smart watches, smart bracelets
  • VR virtual reality
  • AR augmented reality
  • cable assemblies etc.
  • the specific implementation manners of the first electronic device, the second electronic device, and the third electronic device are not particularly limited in the embodiments of the present application.
  • the structures of the second electronic device and the third electronic device may refer to the structure of the first electronic device.
  • the structure of the first electronic device 1 mainly includes a display panel 11 , a middle frame 12 and a rear case 13 .
  • the display panel 11 and the rear case 13 are respectively located on two sides of the middle frame 12 and connected by the middle frame 12 .
  • the above-mentioned display panel 11 includes a plurality of pixels located in an active area (AA).
  • the above-mentioned first electronic device 1 may further include a display driving circuit for driving a plurality of pixels for display, and the display driving circuit may be electrically connected to the plurality of pixels.
  • the display driver circuit may be a display driver integrated circuit (DDIC).
  • the DDIC may be disposed in the non-display area of the display panel, or may be disposed independently of the display panel 11 .
  • the above-mentioned first electronic device 1 may also include a printed circuit board (printed circuit board, PCB) arranged on the middle frame 12, and a system on chip (System on Chip, SoC), a power management chip (power management chip) installed on the PCB.
  • PCB printed circuit board
  • SoC System on Chip
  • a power management chip power management chip
  • An application processor application processor, AP
  • the power IC is not shown in Figure 1.
  • the DDIC in FIG. 1 can be electrically connected to the PCB through a flexible printed circuit (FPC).
  • FPC flexible printed circuit
  • the power IC on the PCB can provide the working voltage for the DDIC
  • the AP on the PCB can provide the DDIC with display data to display the actual image information.
  • the DDIC is used to receive the signal transmitted by the PCB and transmit the signal to the display panel 11 according to a specific timing control, so as to drive the display panel 11 to emit light.
  • the FPC provides a signal transmission connection path between the PCB and the display panel 11 , one end of the FPC is bonded on the display panel 11 through an anisotropic conductive film, and the other end is electrically connected to the PCB.
  • the main structure of the electronic system provided by the embodiment of the present application includes a connector 10 , a first electronic device 20 and a second electronic device 30 , and the connector includes two connector units, two connector units It can be a connector male head and a connector female seat respectively, the connector male head is buckled and connected with the connector female seat, the connector male head is electrically connected with the first electronic device 20, and the connector female seat is electrically connected with the second electronic device 30. connect.
  • the connector male is electrically connected to the first electronic device 20
  • the connector female is electrically connected to the second electronic device 30 and the connector male is snap-connected to the connector female, so the first electronic device can be connected to the first electronic device through the connector.
  • the device 20 and the second electronic device 30 are electrically connected together.
  • the electronic system is the first electronic device
  • the above-mentioned connector male head, connector female base, first electronic device 20 and second electronic device 30 are all applied in the first electronic device, that is, the first electronic device includes Connector male head, connector female base, first electronic device 20, second electronic device 30.
  • the first electronic device may be the above-mentioned mobile phone
  • the first electronic device 20 may be an FPC in the mobile phone
  • the second electronic device 30 may be a PCB in the mobile phone
  • the male connector of the connector is electrically connected to the FPC
  • the female connector of the connector is electrically connected to the FPC. It is electrically connected with the PCB, so that the FPC and the PCB in the mobile phone can be electrically connected together through the connector 10 .
  • the above-mentioned male connector of the connector and the first electronic device 20 electrically connected thereto can be applied to an electronic device, and the female connector and the The second electronic device 30 can be applied to another electronic device, that is, the second electronic device includes a connector male head and the first electronic device 20 electrically connected thereto, and the third electronic device includes a connector female base and a second electronic device electrically connected thereto.
  • Electronic device 30 .
  • the second electronic device may be a cable assembly
  • the first electronic device 20 may be a cable
  • the third electronic device may be a TV
  • the second electronic device 30 may be a PCB in the TV
  • the male connector of the connector is electrically connected to the cable.
  • the female connector of the connector is electrically connected to the PCB, so that the PCB and the cable in the TV can be electrically connected together through the connector 10 .
  • first electronic device 20 and second electronic device 30 may both be circuit boards.
  • first electronic device 20 is a circuit board
  • second electronic device 30 is a cable; or, the first electronic device 20 is a cable, and the second electronic device 30 is a circuit board.
  • the circuit board may be, for example, a PCB or an FPC.
  • the above connector can be, for example, a BTB (board to board) connector, a type-C connector, an LVDS (low voltage differential signaling, low voltage differential signaling) connector, an M.2 connector, or a WTB (wire to board, wire-to-board) connector.
  • BTB board to board
  • LVDS low voltage differential signaling, low voltage differential signaling
  • M.2 M.2
  • WTB wireless to board, wire-to-board
  • FIG. 3 is a schematic structural diagram of a connector 10 seen from the side of the male head of the connector according to an embodiment of the present application. As shown in FIG. 3 , the connector 10 includes a connector male 100 and a connector female 200 .
  • FIG. 4 shows a perspective view of the male connector 100 mounted on the first electronic device 20, and the first electronic device 20 in FIG. 4 is a circuit board.
  • the male connector 100 has a straight parallelepiped profile.
  • the direction in which the straight parallelepiped connector male head 100 extends is referred to as the “length direction” (ie, the Y direction in FIG. 4 )
  • the direction parallel to the plane of the first electronic device 20 and perpendicular to the “length direction” is referred to as As the “width direction” (ie, the X direction in FIG. 4 )
  • the direction perpendicular to the plane of the first electronic device 20 is referred to as the “height direction” (ie, the Z direction in FIG. 4 ).
  • the side where the connector male head 100 is installed on the first electronic device 20 may be referred to as the “installation side” or the “lower side", and the side that fits with the connector female seat 200 One side is called the “mating side” or “upper side”.
  • FIG. 5 shows a structural view of the connector male 100 viewed from the mounting side.
  • FIG. 6 shows an exploded view of the male connector 100
  • FIG. 6 is an exploded view of the male connector 100 seen from the mounting side.
  • the male connector 100 includes a housing (HSG) (to distinguish it from the housing in the female connector 200 , the housing of the male connector 100 is hereinafter referred to as the male housing 101 ), a plurality of male contact pieces 102 and a pair of male fixing feet (also referred to as male helmets) 103 .
  • HSG housing
  • the male fixing pins 103 can be used for transmitting power signals or ground signals, for example.
  • the male housing 101 can be formed on the male contact 102 and the male fixing pin 103 by injection molding.
  • the above-mentioned plurality of male contacts 102 include a plurality of first contacts and a plurality of second contacts.
  • the first contact piece in the connector male head 100 is hereinafter referred to as the first male head contact piece 104
  • the connector male head 100 is referred to as the first male head contact piece 104
  • the second contact in is referred to as the second male contact 105 .
  • each first male contact 104 includes a first contact terminal and a first pin electrically connected to the first contact terminal, in order to connect the first contact terminal in the connector male 100 and the first pin are distinguished from the first contact terminal and the first pin in the connector socket 200 described below, and the first contact terminal in the first male contact piece 104 is hereinafter referred to as the first male contact terminal.
  • the first pin in the first male header contact piece 104 is referred to as the first male header pin 1042 .
  • the first male contact terminal 1041 and the first male pin 1042 electrically connected to the first male contact terminal 1041 are integrally formed.
  • Each of the second male header contacts 105 includes a second contact terminal and a second pin electrically connected to the second contact terminal, in order to connect the second contact terminal and the second pin in the connector male header 100 with the following
  • the second contact terminal in the socket 200 is distinguished from the second pin, and the second contact terminal in the second male contact 105 is hereinafter referred to as the second male contact terminal 1051, and the second male contact is referred to as the second male contact terminal 1051.
  • the second pin in 105 is referred to as the second male header pin 1052 .
  • the second male contact terminal 1051 and the second male pin 1052 electrically connected to the second male contact terminal 1051 are integrally formed.
  • the first male contact terminal 1041 in the first male contact piece 104 and the second male contact terminal 1051 in the second male contact piece 105 are used for buckling connection with the connector socket 200, and the first male contact
  • the first male pin 1042 in the contact piece 104 and the second male pin 1052 in the second male contact piece 105 are used for electrical connection with the first electronic device 20 to ensure that the connector male head 100 is connected to the first Electrical connection of electronic device 20 .
  • the first male pin 1042, the second male pin 1052 and the first electronic device 20 may be electrically connected together by welding.
  • the connector male head 100 when installed on the first electronic device 20, the above-mentioned male head fixing pins 103 are welded on the first electronic device 20, which can further strengthen the connector male head 100 and the first electronic device 20. Electrical connections between devices 20 .
  • the second male header contact piece 105 includes the second male header The contact terminal 1051 and the second male pin 1052 electrically connected to the second male contact terminal 1051, thus the number of the first male contact 104, the first male contact terminal 1041, the first male pin 1042 and the The arrangement is completely the same, and the number and arrangement of the second male contact piece 105 , the second male contact terminal 1051 , and the second male pin 1052 are completely the same.
  • the first male contact 104 , the first male contact terminal 1041 , the first male pin 1042 , and the second male contact are described by taking the first male contact 104 and the second male contact 105 as examples. 105.
  • Arrangement of the second male contact terminal 1051 and the second male pin 1052, the plurality of first male contacts 104 and the plurality of second male contacts 105 can be along the length of the connector male 100
  • the direction of the connector male head 100 is sequentially arranged on one side of the connector male head 100; the plurality of first male head contact pieces 104 and the plurality of second male head contact pieces 105 can also be arranged in sequence along the length direction of the connector male head 100 on the connector. Opposite sides of the male header 100 .
  • first male header pin 1042 and the second male header pin 1052 the arrangement of the first male header pin 1042 and the second male header pin 1052 can be set as required.
  • one or more second male header pins 1052 are disposed between two adjacent first male header pins 1042.
  • two or more first male header pins 1042 are a group, and one or more second male header pins 1052 are disposed between a group of first male header pins 1042 .
  • FIG. 5 uses two first male header pins 1042 as a group, and a second male header pin 1052 is arranged between a group of first male header pins 1042 as an example for illustration. It should be understood that when using the first male header pins 1042 to transmit differential signals, an even number of the first male header pins 1042 should be in a group, for example, two first male header pins 1042 in a group.
  • the number of the first male contact piece 104 and the number of the second male contact piece 105 can be set as required.
  • the area of the welding surface of the first male header pin 1042 is smaller than the area of the soldering surface of the second male header pin 1052 .
  • the area of the soldering surface of the first male header pin 1042 ranges from 0.0016 mm 2 to 7.8804 mm 2 .
  • the area of the soldering surface of the first male pin 1042 ranges from 0.0016 mm 2 to 1.9404 mm 2 .
  • the area of the soldering surface of the first male pin 1042 may be 0.0016mm 2 , 0.020mm 2 , 1.0mm 2 , 1.5mm 2 , 1.9404mm 2 , 5.0mm 2 or 7.8804mm 2 .
  • the area of the soldering surface of the second male pin 1052 ranges from 0.004 mm 2 to 8 mm 2 .
  • the area of the soldering surface of the second male pin 1052 ranges from 0.004 mm 2 to 2 mm 2 .
  • the area of the soldering surface of the second male pin 1052 may be 0.004mm 2 , 0.01mm 2 , 0.1mm 2 , 1mm 2 , 1.5mm 2 , 2mm 2 , 5mm 2 or 8mm 2 .
  • the difference between the area of the soldering surface of the second male header pin 1052 and the area of the soldering surface of the first male header pin 1042 ranges from 0.024 mm 2 to 7.9984 mm 2 .
  • the difference between the area of the soldering surface of the second male header pin 1052 and the area of the soldering surface of the first male header pin 1042 ranges from 0.024 mm 2 to 1.9984 mm 2 .
  • the difference between the area of the soldering surface of the second male header pin 1052 and the area of the soldering surface of the first male header pin 1042 may be 0.024mm 2 , 0.03mm 2 , 1mm 2 , 1.5mm 2 or 1.9984mm 2 Wait.
  • the first contact piece 102 and the second contact piece 103 are formed along the connector pin.
  • the headers 100 are arranged in the length direction; along the width direction of the connector male header 100 , the length of the soldering surface of the first male header pin 1042 is smaller than the length of the soldering surface of the second male header pin 1052 .
  • the length of the welding surface of the first male header pin 1042 ranges from 0.02 mm to 3.98 mm.
  • the length of the welding surface of the first male header pin 1042 ranges from 0.02 mm to 1.98 mm.
  • the length of the welding surface of the first male header pin 1042 may be 0.02 mm, 1 mm, 1.98 mm, 2 mm, 3 mm, or 3.98 mm.
  • the length of the soldering surface of the second male header pin 1052 ranges from 0.04 mm to 4 mm.
  • the length of the welding surface of the second male header pin 1052 ranges from 0.04 mm to 2 mm.
  • the lengths of the soldering surfaces of the second male header pins 1052 may be 0.04 mm, 0.1 mm, 1 mm, 2 mm, 2.5 mm, and 5 mm.
  • the difference between the length of the soldering surface of the second male header pin 1052 and the length of the soldering surface of the first male header pin 1042 ranges from 0.02 mm to 3.98 mm. .
  • the difference between the length of the soldering surface of the second male header pin 1052 and the length of the soldering surface of the first male header pin 1042 ranges from 0.02 mm to 1.98 mm. .
  • the difference between the length of the soldering surface of the second male header pin 1052 and the length of the soldering surface of the first male header pin 1042 may be 0.02mm, 0.1mm, 1.0mm , 1.98mm, 3mm or 3.98mm, etc.
  • the width of the soldering surface of the first male header pin 1042 and the width of the soldering surface of the second male header pin 1052 may be the same or different.
  • the width of the soldering surface of the first male header pin 1042 ranges from 0.08 mm to 1.98 mm.
  • the width of the soldering surface of the first male header pin 1042 ranges from 0.08 mm to 0.98 mm.
  • the width of the soldering surface of the first male header pin 1042 may be 0.08 mm, 0.98 mm, 1 mm, and 1.98 mm.
  • the width of the soldering surface of the second male header pin 1052 ranges from 0.1 mm to 2 mm.
  • the width of the soldering surface of the second male header pin 1052 ranges from 0.1 mm to 1 mm.
  • the width of the soldering surface of the second male header pin 1052 may be 0.1 mm, 0.8 mm, 1 mm, 1.5 mm or 2 mm.
  • the difference between the width of the soldering surface of the second male header pin 1052 and the width of the soldering surface of the first male header pin 1042 ranges from 0.02 mm to 1.92 mm. .
  • the difference between the width of the soldering surface of the second male header pin 1052 and the width of the soldering surface of the first male header pin 1042 ranges from 0.02 mm to 0.92 mm .
  • the difference between the width of the soldering surface of the second male header pin 1052 and the width of the soldering surface of the first male header pin 1042 may be 0.02mm, 0.92mm, 1mm, 1.5mm or 1.92mm.
  • the first male header pin 1042 in order to detect the welding conditions of the first male header pins 1042 and the second male header pins 1052 with the first electronic device 20 respectively during the appearance inspection, all the first male header pins 1042 , the second male header pin 1052 should be able to be seen.
  • the first male header 101 is located in the first The part of the male header pin 1042 can be retracted simultaneously with the first male header pin 1042 to ensure that all the first male header pins 1042 and the second male header pins 1052 can be seen, which is convenient for soldering. quality inspection.
  • the first electronic device 20 electrically connected to the connector male head 100 is a circuit board, which is hereinafter referred to as a first circuit board in order to distinguish it from other circuit boards in the embodiments of the present application.
  • the first circuit board may be a PCB or an FPC.
  • the first circuit board 300 includes a signal terminal layer, a reference ground layer (also referred to as a GND layer) and a signal line layer that are stacked in sequence.
  • the first circuit board 300 is hereinafter described as follows:
  • the signal terminal layer in the circuit board is called the first signal terminal layer 301
  • the reference ground layer in the first circuit board 300 is called the first reference ground layer 302
  • the signal line layer in the first circuit board 300 is called the first signal line layer 303.
  • the first reference ground layer 302 covers the first signal terminal layer 301. Since the first reference ground layer 302 covers the first signal terminal layer 301, mutual interference between the first signal terminal layer 301 and the first signal line layer 303 can be avoided.
  • the first signal terminal layer 301 includes a plurality of pads.
  • the first circuit board 300 further includes a first insulating layer disposed between the first signal terminal layer 301 and the first reference ground layer 302 .
  • the first circuit board 300 further includes a second insulating layer disposed between the first reference ground layer 302 and the first signal wire layer 303 . The first insulating layer and the second insulating layer are not shown in FIG. 8 .
  • the size of the pads on the first circuit board 300 is designed according to the size of the pins soldered thereon. Since the above-mentioned connector male head 100 is mounted on the first circuit board 300 , the soldering surfaces of the first male header pins 1042 and the soldering surfaces of the second male header pins 1052 of the connector male header 100 are both soldered on the first circuit board 300 . The soldering surface of the pad of the circuit board 300 is used to realize the electrical connection between the connector male head 100 and the first circuit board 300 .
  • the connector male head 100 in this embodiment includes a first male header pin 1042 and a second male header pin 1052
  • the area of the soldering surface of the first male header pin 1042 is smaller than that of the soldering surface of the second male header pin 1052 Therefore, the first signal terminal layer 301 in this embodiment includes a first pad and a second pad, in order to connect the first pad and the first pad in the first circuit board 300 electrically connected with the connector male
  • the second pad is distinguished from the first pad and the second pad in the fourth circuit board that is electrically connected to the connector female base 200 , and the first circuit board that is electrically connected to the connector male head 100 below
  • the first pad in the 300 is referred to as the first male pad 3011
  • the second pad in the first circuit board 300 electrically connected to the connector male 100 is referred to as the second male pad 3012 .
  • the area of the soldering surface of the first male header pad 3011 is smaller than the area of the soldering surface of the second male header pad 3012 .
  • the area of the soldering surface of the first male header pad 3011 ranges from 0.0055 mm 2 to 23.8004 mm 2 .
  • the area of the soldering surface of the first male header pad 3011 ranges from 0.0055 mm 2 to 11.8604 mm 2 .
  • the area of the soldering surface of the first male header pad 3011 may be 0.0055mm 2 , 1.0mm 2 , 5.0mm 2 , 11.8604mm 2 , 15mm 2 , 20mm 2 , 23.8004mm 2 .
  • the area of the soldering surface of the second male header pad 3012 ranges from 0.0091 mm 2 to 24 mm 2 . In some examples, the area of the soldering surface of the second male header pad 3012 ranges from 0.0091 mm 2 to 12 mm 2 .
  • the area of the soldering surface of the second male pad 3012 may be 0.0091 mm 2 , 1.0 mm 2 , 5.0 mm 2 , 12 mm 2 , 20 mm 2 , and 24 mm 2 .
  • the difference between the area of the soldering surface of the second male header pad 3012 and the area of the soldering surface of the first male header pad 3011 ranges from 0.0036 mm 2 to 23.9945 mm 2 .
  • the difference between the area of the soldering surface of the second male header pad 3012 and the area of the soldering surface of the first male header pad 3011 ranges from 0.0036 mm 2 to 11.9945 mm 2 .
  • soldering surfaces of the first male header pins 1042 and the soldering surfaces of the first male header pads 3011 are both parallel to the first reference ground layer 302 .
  • the soldering surfaces of the first male pins 1042 of the male connector 100 are soldered to the first circuit
  • the soldering surface of the first male header pad 3011 of the board 300 and the soldering surface of the second male header pin 1052 of the connector male header 100 are soldered to the soldering surface of the second male header pad 3012 of the first circuit board 300 , so as to realize the electrical connection between the male connector 100 and the first circuit board 300 .
  • the first male header pad 3011 and the second male header pad 3012 Arranged along the first direction; along the direction perpendicular to the first direction, the length of the bonding surface of the first male header pad 3011 is smaller than the length of the bonding surface of the second male header pad 3012 .
  • the length of the welding surface of the first male header pad 3011 ranges from 0.05 mm to 5.98 mm.
  • the length of the welding surface of the first male header pad 3011 ranges from 0.05 mm to 3.98 mm.
  • the length of the welding surface of the first male header pad 3011 may be 0.05mm, 1mm, 1.5mm, 3mm, 3.98mm or 5.98mm.
  • the length of the welding surface of the second male header pad 3012 ranges from 0.07 mm to 6 mm.
  • the length of the welding surface of the second male header pad 3012 ranges from 0.07 mm to 4 mm.
  • the length of the soldering surface of the second male header pad 3012 may be 0.07 mm, 1 mm, 2 mm, 4 mm or 6 mm.
  • the difference between the length of the soldering surface of the second male header pad 3012 and the length of the soldering surface of the first male header pad 3011 ranges from 0.02 mm to 5.95 mm.
  • the difference between the length of the bonding surface of the second male header pad 3012 and the length of the bonding surface of the first male header pad 3011 ranges from 0.02 mm to 3.95 mm.
  • the difference between the length of the soldering surface of the second male header pad 3012 and the length of the soldering surface of the first male header pad 3011 may be 0.02mm, 1mm, 2mm, 3.95mm , 5mm or 5.95mm.
  • the width of the bonding surface of the first male header pad 3011 and the width of the bonding surface of the second male header pad 3012 may be the same or different.
  • the width of the welding surface of the first male header pad 3011 ranges from 0.11 mm to 3.98 mm.
  • the width of the welding surface of the first male header pad 3011 ranges from 0.11 mm to 2.98 mm.
  • the width of the welding surface of the first male header pad 3011 may be 0.11 mm, 2 mm, 2.98 mm, 3 mm or 3.98 mm.
  • the width of the welding surface of the second male header pad 3012 ranges from 0.13 mm to 4 mm.
  • the width of the welding surface of the second male header pad 3012 ranges from 0.13 mm to 3 mm.
  • the width of the welding surface of the second male header pad 3012 may be 0.13 mm, 1 mm, 3 mm or 4 mm.
  • the difference between the width of the bonding surface of the second male header pad 3012 and the width of the bonding surface of the first male header pad 3011 ranges from 0.02 mm to 3.89 mm.
  • the difference between the width of the bonding surface of the second male header pad 3012 and the width of the bonding surface of the first male header pad 3011 ranges from 0.02 mm to 2.89 mm.
  • the difference between the width of the soldering surface of the second male header pad 3012 and the width of the soldering surface of the first male header pad 3011 may be 0.02mm, 1mm, 1.5mm, 2mm, 2.89mm or 3.89mm etc.
  • a circuit board such as a PCB or an FPC is usually composed of multiple layers of films, and the thickness of the film layers is very thin, and the wiring density of the circuit board is high, so the characteristic impedance of the wiring of the circuit board is generally relatively large.
  • the characteristic impedance of the connector 10 is generally relatively small, that is, the characteristic impedance of the connector male head 100 and the connector female base 200 in the connector 10 are generally relatively small.
  • the characteristic impedance of the male connector 100 does not match the characteristic impedance of the traces of the first circuit board 300 (generally, the characteristic impedance of the male connector 100 is The impedance is smaller than the characteristic impedance of the traces of the first circuit board 300 ), the signal between the connector male head 100 and the first circuit board 300 may be reflected during transmission, which may lead to the problem of poor SI.
  • Z is the characteristic impedance
  • L is the parasitic inductance
  • C is the parasitic capacitance
  • the pads of the first circuit board 300 namely the first male pad 3011 and the second male pad 3012 and the pads of the first circuit board 300 Parasitic capacitance will be generated between the first reference ground layers 302 .
  • the soldering surface of the first male pin 1042 of the connector male 100 is soldered to the soldering surface of the first male pad 3011, and the second male The soldering surface of the pin 1052 is soldered to the soldering surface of the second male header pad 3012 , so the parasitic capacitance between the connector male header 100 and the first circuit board 300 , that is, the first male header of the first circuit board 300 is soldered.
  • Parasitic capacitance between the pad 3011 and the second male pad 3012 and the first reference ground layer 302 In FIG. 9a , d represents the distance between the first male header pad 3011 or the second male header pad 3012 and the first reference ground layer 302 .
  • L represents the length of the bonding surface of the first male header pad 3011 along the direction perpendicular to the first direction
  • W represents the width of the bonding surface of the first male header pad 3011 along the first direction
  • L represents the length of the bonding surface of the second male header pad 3012 along the direction perpendicular to the first direction
  • W represents the width of the bonding surface of the second male header pad 3012 along the first direction
  • the area of the soldering surface of the first male pin 1042 of the male connector 100 is smaller than that of the second male pin 1052
  • the area of the soldering surface, the area of the soldering surface of the first male header pad 3011 of the first circuit board 300 is smaller than that of the second male header pad 3012
  • the soldering surface of the first male header pin 1042 is soldered to the first male header solder
  • the soldering surface of the second male header pin 1052 is soldered to the soldering surface of the second male header pad 3012, so the first male header pin 1042, the first male header pad 3011 and the first
  • the relative area between the first reference ground layer 302 of the circuit board 300 is smaller than the relative area between the second male header pins 1052 , the second male header pads 3012 and the first reference ground layer 302 of the first circuit board 300 , according to the capacitance formula Among them, C is the capacitance,
  • the parasitic capacitance between the pad 3011 and the first reference ground layer 302 of the first circuit board 300 is relative to that between the second male header pin 1052 , the second male header pad 3012 and the first reference ground layer 302 of the first circuit board 300 Therefore, according to the characteristic impedance calculation formula, it can be known that the characteristic impedance of the connector male head 100 at the position of the first male head pin 1042 will increase, so that the position of the first male head pin 1042 can be improved.
  • the problem of mismatch between the characteristic impedance of the connector male head 100 at the location and the characteristic impedance of the traces of the first circuit board 300 reduces the signal on the first male head pin 1042 between the connector male head 100 and the first circuit
  • the reflection that exists during transmission between the plates 300 increases the SI.
  • the length and/or width of the soldering surface of the second male head pin 1052 can also be increased to ensure the connector The soldering force between the male header pins 105 of the male header 100 and the first circuit board 300 meets the requirements.
  • the connector male head 100 includes a plurality of first male head contact terminals 1041 and a plurality of second male head contact terminals 1051 arranged along its length direction, two adjacent male head contact terminals (the two Each male contact terminal can be two first male contact terminals 1041, two second male contact terminals 1051, and of course one first male contact terminal 1041 and one second male contact terminal 1051) will also generate parasitic capacitance, and the parasitic capacitance will also affect the characteristic impedance of the connector male head 100 .
  • first male contact terminal 1041 and the second male contact terminal 1051 need to be in contact with the connector female base 200 when the connector male head 100 is snap-connected to the connector female base 200, if all the first The cross-sectional area of the male contact terminal 1041 and all the second male contact terminals 1051 along the width direction of the connector male head 100 is reduced, so the connector male head 100 is snap-connected to the connector female base 200 Insufficient snap-insertion force may occur, thereby affecting the snap-fit reliability of the connector male head 100 and the connector female base 200 .
  • the cross-sectional area of some of the male contact terminals along the width direction of the connector male 100 can be reduced, which can not only reduce the parasitic capacitance between two adjacent male contact terminals, but also reduce the The reliability of the buckling between the male connector 100 and the female connector 200 is ensured.
  • the cross-sectional area of the first male contact terminal 1041 along the width direction of the connector male 100 is smaller than the cross-sectional area of the second male contact terminal 1051 along the width direction of the connector male 100 .
  • the first male contact terminal 1041 along the width direction of the connector male 100 is smaller than the cross-sectional area of the second male contact terminal 1051 along the width direction of the connector male 100, the first male contact terminal
  • the parasitic capacitance between 1041 and the adjacent second male contact terminal 1051 is small, so the characteristic impedance at the location of the first male contact terminal 1041 is relatively large, so that the first male contact terminal can be improved.
  • FIG. 7b is a schematic structural diagram of a first male contact piece 104 according to an embodiment of the present application.
  • the first male header contact piece 104 includes a first male contact terminal 1041 and a first male pin 1042 .
  • the male header contact piece 102 provided in FIG. 7a is the second male header contact piece 105
  • the second male header contact piece 105 includes a second male header contact terminal 1051 and a second male header pin 1052
  • FIG. 7a It can be seen from FIG. 7b that the first male contact terminal 1041 is partially reduced relative to the second male contact terminal 1051, so that the cross-sectional area of the first male contact terminal 1041 along the width direction of the connector male 100 is smaller than that of the second male contact terminal 1041.
  • the area of the cross section of the male contact terminal 1051 along the width direction of the connector male 100 is a schematic structural diagram of a first male contact piece 104 according to an embodiment of the present application.
  • the first male header contact piece 104 includes a first male contact terminal 1041 and a
  • the signal integrity transmitted between the connector male header 100 and the first circuit board 300 is mainly related to high-speed signals
  • the first male header pin 1042 is a high-speed signal (high-speed signal, HS signal) pin
  • the second male header pin 1052 is a non-high-speed signal pin.
  • the non-high-speed signal pin may be, for example, a low-speed signal pin, a power supply pin or a ground pin.
  • the low-speed signal pin may be, for example, a control signal pin or a low-speed clock signal pin.
  • first male header pins 1042 are electrically connected to the first male header contact terminals 1041, the soldering surfaces of the first male header pins 1042 are soldered to the soldering surfaces of the first male header pads 3011.
  • a male header pin 1042 is a high-speed signal pin, both the first male header contact terminal 1041 and the first male header pad 3011 transmit high-speed signals.
  • the soldering surface of the second male header pin 1052 is soldered to the soldering surface of the second male header pad 3012, so when the second male header pin 1052 is soldered When the male header pin 1052 is a non-high-speed signal pin, the second male header contact terminal 1051 and the second male header pad 3012 transmit non-high-speed signals.
  • first male header pins 1042 are high-speed signal pins
  • the second male header pins 1052 are non-high-speed signal pins
  • FIG. 10 shows a perspective view of the connector receptacle 200 mounted on the second electronic device 30 .
  • the second electronic device 30 in FIG. 10 is illustrated by taking a circuit board as an example.
  • the connector receptacle 200 has a straight parallelepiped profile.
  • the direction in which the straight parallelepiped connector receptacle 200 extends is referred to as the “length direction” (ie, the Y direction in FIG. 10 )
  • the direction parallel to the plane of the second electronic device 30 and perpendicular to the “length direction” is referred to as the “length direction”.
  • the “width direction” ie, the X direction in FIG.
  • the direction perpendicular to the plane of the second electronic device 30 is referred to as the "height direction” (ie, the Z direction in FIG. 10 ).
  • the side where the connector female 200 is installed on the second electronic device 30 may be referred to as the “installation side” or the “lower side”, and the side that is matched with the connector male 100 One side is called the “mating side” or "upper side”.
  • FIG. 11 shows a structural view of the connector receptacle 200 seen from the mounting side.
  • FIG. 12 shows an exploded view of the connector receptacle 200
  • FIG. 12 is an exploded view of the connector receptacle 200 seen from the mounting side.
  • the connector receptacle 200 includes a housing (in order to distinguish it from the housing in the above-mentioned connector male 100 , the housing of the connector receptacle 200 is hereinafter referred to as a receptacle housing 201 ), a plurality of A female seat contact piece 202 , a pair of female seat fixing feet (also referred to as female seat armor) 203 and a pair of female seat middle islands 204 .
  • the dimensions of the plurality of female socket contacts 202 are the same.
  • the female base fixing feet 203 can be used to transmit power signals or ground signals, for example.
  • the socket housing 201 can be formed on the socket contact piece 202 , the socket fixing feet 203 and the socket middle island 204 by injection molding.
  • each female contact 202 includes a female contact terminal 205 and a female pin 206 electrically connected to the female contact terminal 205 .
  • the female socket contact terminal 205 and the female socket pin 206 electrically connected with the female socket contact terminal 205 are integrally formed.
  • the female contact terminal 205 in the above-mentioned female contact piece 202 is used for the first male contact terminal 1041 in the above-mentioned first male contact piece 104 and the second male contact terminal 1051 in the second male contact piece 105
  • the female socket pins 206 in the female socket contact piece 202 are used for electrical connection with the second electronic device 30 to ensure the electrical connection between the connector socket 200 and the second electronic device 30 .
  • the female socket pins 206 and the second electronic device 30 can be electrically connected together by soldering.
  • the connector female seat 200 when the connector female seat 200 is installed on the second electronic device 30, the female seat fixing feet 203 and the inner island 204 of the female seat are welded on the second electronic device 30, so that the connector female seat 200 can be further strengthened. Electrical connection with the second electronic device 30 .
  • the female contact piece 202 includes the female socket contact terminal 205 and the female socket pin 206 electrically connected with the female socket contact terminal 205, the number of the female socket contact piece 202, the female socket contact terminal 205 and the female socket pin 206 And the arrangement is exactly the same.
  • the female seat contact piece 202 as an example to illustrate the arrangement of the female seat contact piece 202 , the female seat contact terminal 205 and the female seat pin 206 It is arranged on one side of the connector female seat 200 ; a plurality of female seat contact pieces 202 can also be arranged on opposite sides of the connector female seat 200 in sequence along the length direction of the connector female seat 200 .
  • the male contact 102 of the male connector 100 includes the first male contact 104 and the second male contact 105
  • the first male contact piece 104 includes a first male header contact terminal 1041 and a first male header pin 1042
  • the second male header contact piece 105 includes a second male header contact terminal 1051 and a second male header pin 1052
  • the plurality of female contacts 202 in the female connector 200 can be divided into first contacts according to the first male contacts 104 and the second male contacts 105 in the male connector 100 and the second contact piece, in order to distinguish it from the first contact piece and the second contact piece in the connector male head 100
  • the first contact piece in the connector female base 200 is called the first female base contact piece, which will connect the
  • the second contact in the socket 200 is referred to as a second female contact.
  • the first female contact is electrically connected to the first male contact 104
  • the second female contact is electrically connected to the second male contact 105
  • the first female contact piece includes a first contact terminal and a first pin electrically connected to the first contact terminal
  • the second female contact piece includes a second contact terminal and a second pin electrically connected to the second contact terminal.
  • the first and second pins in the female connector 200 are The pins are referred to as first female pins
  • the second pins in the connector female 200 are referred to as second female pins.
  • the first contact terminal in the connector female base 200 is hereinafter The contact terminal is called a first female contact terminal, and the second contact terminal in the connector female 200 is called a second female contact terminal.
  • the first socket pin and the first socket contact terminal in the connector socket 200 are integrally formed, and the second socket pin and the second socket contact terminal are integrally formed.
  • the first female contact terminal in the connector female 200 is snap-connected with the first male contact terminal 1041 in the connector male 100, and the second female contact terminal in the connector female 200 is connected with the connector male
  • the second male contact terminal 1051 in the 100 is snap-connected, so as to realize the snap-fit connection between the connector female 200 and the connector male 100 .
  • the dimensions of the plurality of female contacts 202 are the same, the dimensions of the plurality of female contact terminals 205 in the connector female 200 are the same, that is, the first female contacts in the connector female 200 are in contact with each other.
  • the dimensions of the terminals and the second receptacle contact terminals are the same.
  • the sizes of the plurality of socket pins 206 in the connector socket 200 are the same, that is, the sizes of the first socket pins and the second socket pins in the connector socket 200 are the same.
  • the value range of the area of the soldering surface of the female pin 206 is the same as the value range of the area of the soldering surface of the second male pin 1052 , which can be referred to above and will not be repeated here.
  • the value range of the length of the welding surface of the female pin 206 is the same as that along the width direction of the connector male 100 .
  • the value range of the length of the plane is the same, which can be referred to above, and will not be repeated here.
  • the value range of the width of the soldering surface of the female pin 206 is the same as the value range of the width of the second male pin 1052 along the length direction of the connector male 100 .
  • the value range of the width of the welding surface is the same, which can be referred to above, and will not be repeated here.
  • the arrangement of the socket pins is the same as the arrangement of the first male pin 1042 and the second male pin 1052 in the male connector 100 .
  • the first male pin 100 in the male connector 100 please refer to the first male pin 100 in the male connector 100 above.
  • the arrangement of the header pins 1042 and the second male header pins 1052 will not be repeated here.
  • the second electronic device 30 electrically connected to the connector socket 200 may be a circuit board, such as a PCB or FPC, or a cable.
  • the second electronic device 30 electrically connected to the connector socket 200 is taken as a circuit board as an example, and the second electronic device 30 is exemplarily introduced. for the second circuit board.
  • the second circuit board 400 includes a signal terminal layer, a reference ground layer and a signal line layer that are stacked in sequence.
  • the second circuit board 400 will be The signal terminal layer in the circuit board is called the second signal terminal layer 401
  • the reference ground layer in the second circuit board 400 is called the second reference ground layer 402
  • the signal line layer in the second circuit board 400 is called the second signal line layer 403.
  • the second reference ground layer 402 covers the second signal terminal layer 401.
  • the second signal terminal layer 401 includes a plurality of third pads 4011, and the sizes of the plurality of third pads 4011 are the same.
  • the first circuit board 400 further includes a third insulating layer disposed between the second signal terminal layer 401 and the second reference ground layer 402 .
  • the first circuit board 400 further includes a fourth insulating layer disposed between the second reference ground layer 402 and the second signal wire layer 403 .
  • the third insulating layer and the fourth insulating layer are not shown in FIG. 14 .
  • the plurality of socket pins 206 on the connector socket 200 are The sizes are the same, so the sizes of the plurality of third pads 4011 on the second circuit board 400 are the same.
  • the value range of the area of the soldering surface of the third pad 4011 is the same as the value range of the area of the soldering surface of the second male header 3012 , which can be referred to above, and will not be repeated here.
  • the value range of the length of the welding surface of the third pads 4011 is the same as that along the direction perpendicular to the first direction.
  • the value range of the length of the welding surface of the disk 3012 is the same, which can be referred to above, and will not be repeated here.
  • the value range of the width of the welding surface of the third pads 4011 is the same as that along the first direction, the welding of the second male pads 3012
  • the value range of the width of the surface is the same, which can be referred to above, and will not be repeated here.
  • the soldering surfaces of the female pins 206 of the female connector 200 are soldered to the third soldering surfaces of the second circuit board 400 .
  • the soldering surface of the plate 4011 is used to realize the electrical connection between the connector socket 200 and the second circuit board 400 .
  • the first male contact terminal 1041 , the second male contact terminal 1051 of the connector male 100 and the connector female 200 are connected between the above-mentioned connector male head 100 and the above-mentioned connector female base 200 .
  • the female socket contact terminals 205 are connected together by snap-insertion, the following two implementations can be exemplified.
  • the first type as shown in FIG. 15a , the first male contact terminal 1041 and the second male contact terminal 1051 of the connector male 100 in the connector 10 pass through the female contact terminal 205 of the connector female 200
  • a plurality of contact points for example, two contact points (contact point A and contact point B) are snap-connected, that is, the first male contact terminal 1041 of the connector male 100 is in contact with the first female socket of the connector female 200
  • the terminal 2051 is connected by a plurality of contact points, such as two contact points
  • the second male contact terminal 1051 of the connector male head 100 and the second female contact terminal 2052 of the connector female base 200 are connected by a plurality of contact points, For example, two contact points are snap-connected.
  • the connector 10, the connector male head 100, and the connector female seat 200 in FIG. 15a are all schematic cross-sectional views along the width direction of the connector 10.
  • the second type As shown in FIG. 15b, the first male contact terminal 1041 of the connector male 100 in the connector 10 is connected with the first female contact terminal 2051 of the connector female 200 through a contact point A. , the second male contact terminal 1051 of the connector male head 100 and the second female contact terminal 2052 of the connector female base 200 are inserted through a plurality of contact points, such as two contact points (contact point A and contact point B) connect.
  • connector 10 the connector male head 100 , and the connector female base 200 in FIG. 15 b are all schematic cross-sectional views along the width direction of the connector 10 .
  • the first male The area of the cross section of the contact terminal 1041 along the width direction of the male connector 100 is smaller than the area of the cross section of the second male contact terminal 1051 along the width direction of the male connector 100 .
  • the second way is used for the snap connection between the male connector 100 and the female connector 200 , since the first male contact terminal 1041 of the male connector 100 is in contact with the first female connector of the female connector 200 The terminals 2051 are connected through a contact point A, so that the reflection of the signal transmitted on the first male contact terminal 1041 of the connector male head 100 and the first female contact terminal 2051 of the connector female base 200 can be reduced, thereby further improving the SI.
  • the signals transmitted on the first male contact terminal 1041 and the first female contact terminal 2051 are high-speed signals, the SI of the high-speed signals can be improved.
  • the second male contact terminal 1051 of the connector male 100 is connected with the second female contact terminal 2052 of the connector female 200 through a plurality of contact points, it can ensure the connector male 100
  • the snap-in and pull-out force with the connector female seat 200 ensures the reliability of snap-in.
  • the male connector 100 further includes an auxiliary contact terminal 106; the material of the auxiliary contact terminal 106 is a non-conductive material; the first male contact terminal 1041 of the male connector 100 is connected to the female connector The first female contact terminal 2051 of the 200 is also connected through the auxiliary contact terminal 106 by snap-insertion.
  • the non-conductive material may be, for example, plastic, rubber, or the like.
  • the connector male 100 also Including the auxiliary contact terminal 106, the first male contact terminal 1041 of the connector male head 100 and the first female base contact terminal 2051 of the connector female base 200 are also buckled and connected through the auxiliary contact terminal 106, so that the connector male head can be added.
  • 100 and the female connector 200 of the buckle insertion force in this way, it can further ensure the reliability of the buckle of the male connector 100 and the female connector 200 .
  • the connector 10 includes a male connector 100 and a female connector 200
  • FIG. 16 is a structural diagram of the male connector 100 seen from the installation side provided in the related art.
  • the main structure of the connector male 100 in the connector 10 provided by the related art includes a male housing 101 , a plurality of male contacts 102 and a pair of male fixing feet 103 .
  • the male contact 102 includes a male contact terminal 102a and a male pin 102b electrically connected to the male contact terminal 102a; the size of the plurality of male contacts 102 is the same, that is, the size of the plurality of male contact terminals 102a Likewise, the sizes of the plurality of male header pins 102b are the same.
  • the structure of the circuit board electrically connected to the male connector 100 is the same as that of the second circuit board 400 described above. Reference may be made to FIG. 14 and the above description of the second circuit board 400 , which will not be repeated here.
  • the plurality of male pins 102b in the male connector 100 are identical to the plurality of pads on the circuit board. A corresponding connection.
  • the structure of the connector receptacle 200 provided by the related art is the same as the structure of the connector receptacle 200 provided in the first embodiment.
  • the structure of the connector receptacle 200 provided by the related art reference may be made to the above description and FIGS. 11 and 12 , here No longer.
  • the structure of the circuit board electrically connected to the connector receptacle 200 is the same as that of the second circuit board 400 described above.
  • the structure is the same, and reference may be made to FIG. 14 and the above description of the second circuit board 400 , which will not be repeated here.
  • FIG. 17 the structure of the connector 10 provided in the related art when the connector male 100 and the connector female 200 are snap-connected is shown in FIG. 17 .
  • the male contact terminal 102 a of the connector male 100 and the female contact terminal 205 in the connector female 200 are both electrically connected through two contact points (eg, contact point A and contact point B in FIG. 17 ) .
  • the size of the plurality of male pins 102b in the male connector 100 is the same, the size of the plurality of male pins 102b in the circuit board is the same as that in the male connector 100.
  • the dimensions of the pads 102b corresponding to one-to-one electrical connection are the same. Therefore, in the related art, the relative area between the male header pins 102b, the pads and the reference ground layer is relatively large, resulting in a large gap between the connector male header 100 and the circuit board.
  • the parasitic capacitance is large, which in turn causes the characteristic impedance of the male connector 100 to be small.
  • the dimensions of the plurality of female pins 206 in the connector female 200 are the same, and the pads in the circuit board that are electrically connected to the plurality of female pins 206 in the connector female 200 correspond to each other in one-to-one correspondence.
  • the relative area between the female socket pins 206, the pads and the reference ground layer is relatively large, resulting in a large parasitic capacitance between the connector socket 200 and the circuit board, which in turn causes the connector
  • the characteristic impedance of the female base 200 is relatively small, so that the characteristic impedance of the connector female base 200 and the characteristic impedance of the traces of the circuit board electrically connected to it will not match, which will cause the signal to appear during the transmission process. reflection, which brings about the problem of poor SI. Based on this, the characteristic impedance of the connector 10 and the characteristic impedance of the traces of the two circuit boards electrically connected thereto may not match, which may lead to reflection of signals during transmission, resulting in poor SI.
  • the characteristic impedance of the wiring of the circuit board is not easy to adjust.
  • the characteristic impedance of the connector 10 can be adjusted to match the characteristic impedance of the connector 10 with the characteristic impedance of the traces of the circuit board, thereby Reduce the reflection that exists during signal transmission and improve the problem of poor SI.
  • the characteristic impedance can be adjusted by parasitic capacitance, and according to the above capacitance calculation formula, it can be known that the size of the capacitance can be changed by adjusting ⁇ , S and d.
  • FIG. 18 shows a circuit board electrically connected to the connector male head 100 , which is hereinafter referred to as a third circuit board 500 for the convenience of distinguishing it from other circuit boards in the embodiments of the present application.
  • the third circuit board 500 includes a signal terminal layer, a reference ground layer and a signal line layer that are stacked in sequence.
  • the third circuit board 500 is hereinafter described as The signal terminal layer in the circuit board is called the third signal terminal layer 501 , the reference ground layer in the third circuit board 500 is called the third reference ground layer 502 , and the signal line layer in the third circuit board 500 is called the third signal line layer 503.
  • the third signal terminal layer 501 includes a plurality of fourth pads 5011 , and the sizes of the plurality of fourth pads 5011 are the same. After hollowing out the third reference ground layer 502 , as shown in FIG.
  • the third reference ground layer 502 includes a hollow area 5021 , and the hollow area 5021 covers part of the fourth pads 5011 in the third signal terminal layer 501 , for the convenience of description , the fourth pad 5011 covered by the hollow area 5021 is represented by the fourth pad 5011a.
  • the soldering surface of the male pin 105 of the male connector 100 is soldered to the soldering surface of the fourth pad 5011 of the third circuit board 500, since the part of the fourth pad 5011a facing the third reference ground layer 502 is hollow, so the male pin 102 b and the fourth pad 5011 a do not generate parasitic capacitance with the third reference ground layer 502 , but generate parasitic capacitance with the third signal line layer 503 below the third reference ground layer 502 .
  • the distance between the fourth pad 5011a and the third signal line layer 503 is greater than the distance between the fourth pad 5011a and the third reference ground layer 502, the distance between the fourth pad 5011a and the third signal line layer 503
  • the parasitic capacitance is smaller than the parasitic capacitance between the fourth pad 5011a and the third reference ground layer 502 . Based on this, by hollowing out the reference ground layer in the circuit board, the parasitic capacitance between the connector male head 100 and the circuit board can also be reduced, so as to improve the characteristic impedance of the connector male head 100 .
  • the third signal line layer 503 is not shielded by the third reference ground layer 502. signal may radiate, which can cause interference problems.
  • other areas need to be occupied for wiring, which reduces the board-level wiring space, affects the outgoing lines, and increases the cost of manufacturing the circuit board.
  • the parasitic capacitance between the connector male 100 and the first circuit board 300 is changed by changing S, that is, the first male pin 1042 in the connector male 100 is reduced.
  • the area of the soldering surface of the first circuit board 300 is reduced, and the area of the soldering surface of the first male header pad 3011 that is electrically connected to the first male header pin 1042 of the connector male header 100 is reduced.
  • the parasitic capacitance between the connector male header 100 and the first circuit board 300 at the position of the first male header pin 1042 will be reduced, so that the first male header can be increased
  • the characteristic impedance of the connector male head 100 at the position of the pin 1042, so that the characteristic impedance of the connector male head 100 at the position of the first male head pin 1042 is matched with the characteristic impedance of the traces of the first circuit board 300 , thereby reducing the reflection of the signal on the first male header pin 1042 during transmission between the connector male header 100 and the first circuit board 300 , thereby improving the SI.
  • the first embodiment changes the connector at the position of the first male head pin 1042 by changing the method of S.
  • the parasitic capacitance between the male header 100 and the first circuit board 300 will not cause signal radiation and will not increase the cost.
  • ⁇ can also be adjusted by adjusting the material of the first insulating layer between the first signal terminal layer 301 and the first reference ground layer 302 in the first circuit board 300 to change the relationship between the connector male head 100 and the first reference ground layer 302 .
  • the magnitude of the parasitic capacitance between the first circuit boards 300 In some examples, in order to make the parasitic capacitance between the male connector 100 and the first circuit board 300 small, the material of the first insulating layer should be selected to have a low dielectric constant.
  • ⁇ can also be adjusted by adjusting the material between two adjacent male contact terminals to change the parasitic capacitance between two adjacent male contact terminals, since the male contact 102 is installed in the On the male header housing 101 , that is, ⁇ can also be adjusted by adjusting the material of the male header housing 101 , so as to change the parasitic capacitance between two adjacent male header contact terminals.
  • the male housing 101 in order to reduce the parasitic capacitance between two adjacent male contact terminals, the male housing 101 should be selected to have a low dielectric constant.
  • the second electronic device 30 is simulated respectively to detect and compare the characteristic impedance of the connector 10 and the signal quality transmitted through the connector 10 provided in the first embodiment and the related art.
  • the signal quality can be represented by insertion loss and return loss, and the simulation results are shown in Table 1.
  • the first male pin 1042 in the connector 10 provided in the first embodiment is a high-speed signal pin.
  • the first electronic device 20 is a PCB and the second electronic device 30 is an FPC as an example.
  • the structure of the PCB used in the simulation mainly includes a first cover layer (cover layer), a first copper foil (copper) layer, a polypropylene (polypropylene, PP) layer, a second copper foil layer and a second cover layer stacked in sequence.
  • the thickness of the first covering layer is 25 ⁇ m
  • the thickness of the first copper foil layer is 20 ⁇ m
  • the thickness of the polypropylene layer is 76 ⁇ m
  • the thickness of the second copper foil layer is 15 ⁇ m
  • the thickness of the second covering layer is 25 ⁇ m.
  • the dielectric constant DK of the polypropylene layer is 3.5
  • the dielectric loss angle coefficient DF is 0.02.
  • the first cover layer and the second cover layer are used to protect the PCB, the first copper foil layer is the signal terminal layer, the first copper foil layer includes a plurality of pads, and the second copper foil layer is the reference ground layer.
  • the difference from the PCB that is electrically connected to the connector male head 100 of the connector 10 provided in the first embodiment and the PCB that is electrically connected to the connector male head 100 of the connector 10 provided in the related art is that it is different from the one provided in the first embodiment.
  • the structure of the first copper foil layer of the PCB to which the connector male head 100 of the connector 10 is electrically connected is different from that of the first copper foil layer of the PCB to which the connector male head 100 of the connector 10 provided in the related art is electrically connected. Referring to the above description, the structures of other layers are the same.
  • the structure of the FPC used in the simulation mainly includes a third covering layer, a third copper foil layer, a polyimide (polyimide, PI) layer, a fourth copper foil layer and a fourth covering layer which are stacked in sequence.
  • the thickness of the first covering layer is 20 ⁇ m
  • the thickness of the first copper foil layer is 12 ⁇ m
  • the thickness of the polyimide layer is 50 ⁇ m
  • the thickness of the second copper foil layer is 12 ⁇ m
  • the thickness of the second covering layer is 20 ⁇ m.
  • the dielectric constant DK of the polyimide layer is 3.3
  • the dielectric loss angle coefficient DF is 0.02.
  • the third cover layer and the fourth cover layer are used to protect the FPC, the third copper foil layer is the signal terminal layer, the third copper foil layer includes a plurality of pads, and the fourth copper foil layer is the reference ground layer.
  • the structure of the FPC electrically connected to the connector female seat 200 of the connector 10 provided in the first embodiment and the FPC electrically connected to the connector female seat 200 of the connector 10 provided by the related art is exactly the same.
  • the characteristic impedance of the PCB trace and the characteristic impedance of the FPC trace used for the simulation are about 90 ⁇ (ohms).
  • a TDR (time domain reflectometry, time domain reflectometry) method can be used to measure the characteristic impedance of the connector 10 in the simulation process.
  • Table 1 detects the insertion loss and return loss at frequencies of 5 GHz and 10 GHz, respectively.
  • the connector 10 provided in the first embodiment has improved characteristic impedance, insertion loss, and return loss compared to the connector 10 provided by the related art.
  • the characteristic impedance of the connector 10 provided in the first embodiment is increased by 7.3 ohms, and when the frequency is 5 GHz, the insertion loss is increased by 0.07, and the return loss is increased by -4.2.
  • the frequency is 105 GHz , the insertion loss is increased by 0.17, and the return loss is increased by -6.6.
  • the connector 10 provided in the first embodiment has obvious benefits for high-speed signals compared to the connector 10 provided by the related art.
  • the difference between the second embodiment and the first embodiment is that the connector receptacle 200 provided in the second embodiment and the structure of the connector receptacle 200 electrically connected to the second electronic device 30 are the same as the connector receptacle provided in the first embodiment. 200 and the structure electrically connected to the second electronic device 30 with the female connector 200 are different.
  • the structure of the electronic device 20 is the same.
  • the male connector 100 provided in the second embodiment includes a male housing 101 , a plurality of male contacts 102 and a pair of male fixing feet 103 .
  • the plurality of male header contacts 102 include a plurality of first male header contacts 104 and a plurality of second male header contacts 105, and each of the first male header contacts 104 includes a first male header contact terminal 1041 and a first male header contact terminal 1041 and a first male header contact terminal 1041.
  • each of the second male header contacts 105 includes a second male header contact terminal 1051 and a second male header pin electrically connected to the second male header contact terminal 1051 1052.
  • the area of the soldering surface of the first male pin 1042 is smaller than the area of the soldering surface of the second male pin 1052 .
  • the first electronic device 20 provided in the second embodiment is a first circuit board 300
  • the first circuit board 300 includes a first signal terminal layer 301 , a first reference ground layer 302 and a first signal line layer 303 that are stacked in sequence.
  • the first signal terminal layer 301 includes a first male header pad 3011 and a second male header pad 3012 ; wherein the area of the soldering surface of the first male header pad 3011 is smaller than the area of the soldering surface of the second male header pad 3012 .
  • connection relationship between the connector male head 100 and the first electronic device 20, as well as the description of the specific structure of the connector male head 100 and the description of the specific structure of the first circuit board 300 may refer to the above-mentioned first embodiment. It will not be repeated here.
  • the connector male head 100 provided in the second embodiment and the first electronic device 20 electrically connected to the connector male head 100 is the same as that of the connector male head 100 provided in the first embodiment and the electrical connection with the connector male head 100
  • the structure of the first electronic device 20 is the same, so the connector male head 100 and the first electronic device 20 provided in the second embodiment have the same technical effect as the connector male head 100 and the first electronic device 20 provided in the first embodiment. Reference may be made to Embodiment 1, which will not be repeated here.
  • the structure of the connector female base 200 provided in the second embodiment and the second electronic device 30 electrically connected to the connector female base 200 will be described below.
  • FIG. 19 shows a perspective view of the connector receptacle 200 installed on the second electronic device 30 .
  • the second electronic device 30 is used as an example of a circuit board for illustration.
  • FIG. 20 shows a structural view of the connector receptacle 200 seen from the mounting side.
  • FIG. 21 shows an exploded view of the connector receptacle 200
  • FIG. 21 is an exploded view of the connector receptacle 200 seen from the mounting side.
  • the female connector 200 includes a female housing 201 , a plurality of female contacts 202 , a pair of female fixing feet 203 and a pair of female islands 204 .
  • the plurality of female contacts 202 includes a plurality of first contacts and a plurality of second contacts.
  • the first contact piece in the connector female socket 200 is hereinafter referred to as the first female socket contact piece 207
  • the connector female socket 200 is referred to as the first female socket contact piece 207
  • the second contact in is referred to as the second female contact 208 .
  • the structures of the first female contact piece 207 and the second female contact piece 208 in the second embodiment are similar to those of the female socket contact piece 202 in the first embodiment.
  • the structure of the seat contact 208 can be referred to FIG. 13 .
  • the first female contact 207 includes a first contact terminal and a first pin electrically connected to the first contact terminal, in order to connect the first contact terminal and the first pin in the connector female 200 with The first contact terminal in the male connector 100 is distinguished from the first pin.
  • the first contact terminal in the first female contact 207 is hereinafter referred to as the first female contact terminal 2051, and the first female contact is referred to as the first female contact 2051.
  • the first pin in 207 is referred to as the first female pin 2061 .
  • the first receptacle contact terminal 2051 and the first receptacle pin 2061 electrically connected to the first receptacle contact terminal 2051 are integrally formed.
  • Each of the second female contacts 208 includes a second contact terminal and a second pin electrically connected to the second contact terminal, in order to connect the second contact terminal and the second pin in the connector female 200 with the connector male
  • the second contact terminal in the header 100 is distinguished from the second pin, and the second contact terminal in the second female contact 208 is hereinafter referred to as the second female contact terminal 2052 , and the second female contact 208 is referred to as the second contact terminal 2052 .
  • the second pin is called the second female pin 2062.
  • the second female base contact terminal 2052 and the second female base pin 2062 electrically connected to the second female base contact terminal 2052 are integrally formed.
  • the plurality of receptacle contact terminals 205 in the connector receptacle 200 include a plurality of first receptacle contact terminals 2051 and a plurality of second receptacle contact terminals 2052
  • the plurality of receptacle pins in the connector receptacle 200 206 includes a plurality of first female pins 2061 and a plurality of second female pins 2062 .
  • first female pin 2061 , the second female pin 2062 and the second electronic device 30 may be electrically connected together by welding.
  • first receptacle contact terminal 2051 the second receptacle contact terminal 2052, the first receptacle pin 2061, the second receptacle pin 2062 and the role of the receptacle fixing pin 203 can refer to the first embodiment. It will not be repeated here.
  • the second female contact 208 includes the second female contact The contact terminals 2052 and the second receptacle pins 2062 electrically connected to the second receptacle contact terminals 2052, thus the number of the first receptacle contacts 207, the first receptacle contact terminals 2051, the first receptacle pins 2061, and the The arrangement is completely the same, and the number and arrangement of the second female contacts 208 , the second female contact terminals 2052 , and the second female pins 2062 are completely the same.
  • the first female contact 207, the first female contact terminal 2051, the first female pin 2061, and the second female contact are described by taking the first female contact 207 and the second female contact 208 as examples. 208.
  • Arrangement of the second female contact terminals 2052 and the second female pins 2062, the plurality of first female contacts 207 and the plurality of second female contacts 208 can be along the length of the connector female 200
  • the direction (that is, the Y direction in FIG. 21 ) is sequentially arranged on one side of the connector female seat 200 ; a plurality of first female seat contact pieces 207 and a plurality of second female seat contact pieces 208 can also be arranged along the connector female seat 200
  • the length direction of the connectors is sequentially arranged on opposite sides of the connector female seat 200 .
  • the area of the welding surface of the first female lead 2061 is smaller than the area of the welding surface of the second female lead 2062 .
  • the value range of the area of the welding surface of the first female pin 2061 can be the same as the value range of the area of the welding surface of the first male pin 1042, which can be referred to above, and is not repeated here. Repeat.
  • the value range of the area of the soldering surface of the second female pin 2062 may be the same as the value range of the area of the soldering surface of the second male pin 1052, which can be referred to above, and will not be repeated here.
  • the difference between the area of the soldering surface of the second female pin 2062 and the area of the soldering surface of the first female pin 2061 can be the same as the area of the soldering surface of the second male pin 1052 and the first male pin
  • the difference range of the areas of the soldering surfaces of the pins 1042 is the same, which can be referred to above, and will not be repeated here.
  • the first receptacle pin 2061 and the second receptacle pin 2062 Arranged along the length direction of the connector female seat 200; along the width direction of the connector female seat 200, the length of the welding surface of the first female seat pin 2061 is smaller than the length of the welding surface of the second female seat pin 2062.
  • the value range of the length of the welding surface of the first female seat pin 2061 can be the same as that along the width direction of the connector male header 100, the first male header pin 1042
  • the value range of the length of the welding surface is the same, which can be referred to above, and will not be repeated here.
  • the value range of the length of the welding surface of the second female seat pin 2062 can be the same as the length of the welding surface of the second male header pin 1052 along the width direction of the connector male head 100.
  • the value range of is the same, which can be referred to above, and will not be repeated here.
  • the difference range between the length of the welding surface of the second female seat pin 2062 and the length of the welding surface of the first female seat pin 2061 can be the same as the width along the connector male head 100 Direction, the difference between the length of the welding surface of the second male pin 1052 and the length of the welding surface of the first male pin 1042 is the same, which can be referred to above, and will not be repeated here.
  • the width of the welding surface of the first receptacle pin 2061 and the width of the soldering surface of the second receptacle pin 2062 may be the same or different.
  • the value range of the width of the welding surface of the first female base pin 2061 can be the same as that of the width of the welding surface of the first male head pin 1042 along the length direction of the connector male head 100.
  • the value range of is the same, which can be referred to above, and will not be repeated here.
  • the value range of the width of the welding surface of the second female base pin 2062 can be the same as that of the width of the welding surface of the second male head pin 1052 along the length direction of the connector male head 100 .
  • the value range of is the same, which can be referred to above, and will not be repeated here.
  • the difference range between the width of the welding surface of the second socket pin 2062 and the width of the welding surface of the first socket pin 2061 can be the same as the width along the connector male head 100 direction, the difference between the width of the soldering surface of the second male pin 1052 and the width of the soldering surface of the first male pin 1042 is the same, which can be referred to above, and will not be repeated here.
  • the female socket pins 206 should be able to be seen. Since the plurality of female pins 206 of the connector female 200 include the first female pins 2061 and the second female pins 2062, when along the width direction of the connector female 200, the first female pins 2061 When the length of the welding surface is small, in order to ensure that the first socket pin 2061 can be seen, the part of the socket housing 201 located at the first socket pin 2061 can be synchronized with the first socket pin 2061. to ensure that all the first and second female pins 2061 and 2062 can be seen, which is convenient for quality inspection after soldering.
  • the arrangement of the first female contact terminals 2051 and the second female contact terminals 2052 in the connector female 200 and the first female pins 2061 and 2061 in the connector female 200 The arrangement of the second female pin 2062 is the same as the arrangement of the first male pin 1042 and the second male pin 1052 in the connector male header 100 .
  • the arrangement of the first male header pins 1042 and the second male header pins 1052 will not be repeated here.
  • the second electronic device 30 electrically connected to the connector socket 200 is a circuit board. It is a fourth circuit board, and the fourth circuit board can be, for example, a PCB or an FPC.
  • the structure of the fourth circuit board is similar to that of the first circuit board 300 .
  • the fourth circuit board 600 includes a signal terminal layer, a reference ground layer and a signal line layer that are stacked in sequence.
  • the fourth circuit board 600 will be The signal terminal layer in the circuit board is called the fourth signal terminal layer 601
  • the reference ground layer in the fourth circuit board 600 is called the fourth reference ground layer 602
  • the signal line layer in the fourth circuit board 600 is called the fourth signal line layer 603.
  • the fourth reference ground layer 602 covers the fourth signal terminal layer 601. Since the fourth reference ground layer 602 covers the fourth signal terminal layer 601, mutual interference between the fourth signal terminal layer 601 and the fourth signal line layer 603 can be avoided.
  • the fourth signal terminal layer 601 includes a plurality of pads.
  • the fourth circuit board 600 further includes a fifth insulating layer disposed between the fourth signal terminal layer 601 and the fourth reference ground layer 602 .
  • the fourth circuit board 600 further includes a sixth insulating layer disposed between the fourth reference ground layer 602 and the fourth signal wire layer 603 .
  • the fifth insulating layer and the sixth insulating layer are not shown in FIG. 8 .
  • the size of the pads of the fourth circuit board 600 is designed according to the size of the pins soldered thereon.
  • the female seat pins 206 of the connector female seat 200 are welded on the pads of the fourth circuit board 600, so as to realize the connection between the connector female seat 200 and the fourth circuit board 600.
  • the connector socket 200 in this embodiment includes a first socket pin 2061 and a second socket pin 2062, and the area of the welding surface of the first socket pin 2061 is smaller than that of the second socket pin 2062.
  • the plurality of pads of the fourth signal terminal layer 601 in this embodiment include a first pad and a second pad, in order to electrically connect the pads in the fourth circuit board 600 with the connector female
  • the first pad and the second pad are distinguished from the first pad and the second pad in the first circuit board 300 electrically connected to the connector male header 100, and will be electrically connected to the connector female base 200 below.
  • the first pad in the fourth circuit board 600 is referred to as the first female pad 6011
  • the second pad in the fourth circuit board 600 electrically connected to the connector female 200 is referred to as the second female pad Disc 6012.
  • the area of the soldering surface of the first female pad 6011 is smaller than that of the soldering surface of the second female pad 6012 .
  • the value range of the area of the soldering surface of the first female pad 6011 can be the same as the value range of the area of the soldering surface of the first male pad 3011 , please refer to the above-mentioned first male pad The value range of the area of the welding surface of 3011 will not be repeated here.
  • the value range of the area of the soldering surface of the second female pad 6012 may be the same as the value range of the area of the soldering surface of the second male pad 3012 , and reference may be made to the above-mentioned welding surface of the second male pad 3012 The value range of the area will not be repeated here.
  • the difference range between the area of the soldering surface of the second female pad 6012 and the area of the soldering surface of the first female pad 6011 can be the same as the area of the soldering surface of the second male pad 3012 and the first male header.
  • the difference range of the area of the welding surface of the disk 3011 is the same, which can be referred to above, and will not be repeated here.
  • the soldering surfaces of the first socket pins 2061 of the connector socket 200 are welded to the fourth circuit
  • the soldering surface of the first female seat pad 6011 of the board 600, the soldering surface of the second female seat pin 2062 of the connector female seat 200 is soldered to the soldering surface of the second female seat pad 6012 of the fourth circuit board 600 , so as to realize the electrical connection between the connector socket 200 and the fourth circuit board 600 .
  • the first receptacle pad 6011 and the second receptacle pad 6012 Arranged along the first direction; along the direction perpendicular to the first direction, the length of the soldering surface of the first female pad 6011 is smaller than the length of the soldering surface of the second female pad 6012 .
  • the value range of the length of the welding surface of the first female pad 6011 can be the same as that of the above-mentioned direction perpendicular to the first direction, the length of the first male pad 3011
  • the value range of the length of the welding surface is the same, which can be referred to above, and will not be repeated here.
  • the value range of the length of the welding surface of the second female pad 6012 may be the same as the above-mentioned length of the welding surface of the second male pad 3012 in the direction perpendicular to the first direction.
  • the value ranges are the same, which can be referred to above, and will not be repeated here.
  • the range of the difference between the length of the soldering surface of the second female pad 6012 and the length of the soldering surface of the first female pad 6011 may be the same as that of the second male pad 3012.
  • the difference range between the length of the soldering surface and the length of the soldering surface of the first male header pad 3011 is the same, which can be referred to above, and will not be repeated here.
  • the width of the soldering surface of the first female pad 6011 and the width of the soldering surface of the second female pad 6012 may be the same or different.
  • the value range of the width of the welding surface of the first female pad 6011 can be the same as the value range of the width of the welding surface of the first male header pad 3011, which can be referred to above, and is not repeated here. Repeat.
  • the value range of the width of the welding surface of the second female pad 6012 can be the same as the value range of the width of the welding surface of the second male pad 3012, which can be referred to above, and is not repeated here. Repeat.
  • the range of the difference between the width of the soldering surface of the second female pad 6012 and the width of the soldering surface of the first female pad 6011 can be the same as the width of the soldering surface of the second male pad 3012.
  • the difference range of the widths of the welding surfaces of the first male header pads 3011 is the same, which can be referred to above, and will not be repeated here.
  • the area of the welding surface of the first socket pin 2061 of the connector socket 200 is smaller than that of the second socket pin 2062
  • the area of the soldering surface, the area of the soldering surface of the first receptacle pad 6011 of the fourth circuit board 600 is smaller than the area of the soldering surface of the second receptacle pad 6012, and the soldering surface of the first receptacle pin 2061 is soldered to
  • the soldering surface of the first female seat pad 6011 and the soldering surface of the second female seat pin 2062 are soldered to the soldering surface of the second female seat pad 6012, so the first female seat pin 2061 and the first female seat are welded together.
  • the relative area between the pad 6011 and the fourth reference ground layer 602 of the fourth circuit board 600 is smaller than the area between the second receptacle pins 2062 , the second receptacle pads 6012 and the fourth reference ground layer 602 of the fourth circuit board 600 .
  • Relative area according to the capacitance formula, it can be known that the parasitic capacitance between the first receptacle pin 2061, the first receptacle pad 6011 and the fourth reference ground layer 602 of the fourth circuit board 600 is relative to the second receptacle pin 2062, The parasitic capacitance between the second receptacle pad 6012 and the fourth reference ground layer 602 of the fourth circuit board 600 will be reduced.
  • the characteristic impedance calculation formula it can be known that the connector receptacle at the position of the first receptacle pin 2061 is located.
  • the characteristic impedance of 200 will increase, so that the problem of mismatch between the characteristic impedance of the connector female base 200 at the position of the first female base pin 2061 and the characteristic impedance of the trace of the fourth circuit board 600 can be improved, and the problem of mismatching can be reduced.
  • the reflection that exists when the signal on the small first female pin 2061 is transmitted between the connector female 200 and the fourth circuit board 600 improves the SI.
  • the length and/or width of the soldering surface of the second socket pin 2062 can also be increased to ensure the connector The soldering force between the female socket pins 206 of the female socket 200 and the fourth circuit board 600 meets the requirements.
  • the connector receptacle 200 since the connector receptacle 200 includes a plurality of receptacle contact terminals 205 arranged along its length direction, parasitic capacitance will also be generated between two adjacent receptacle contact terminals 205, and the parasitic capacitance will also affect the The characteristic impedance of the connector receptacle 200 . Since the female connector 200 is snap-connected to the male connector 100, the female contact terminals 205 need to be in contact with the male contact terminals 104. If all the female contact terminals 205 are placed along the width direction of the connector female 200 The area of the cross-sectional area is reduced, so the connector female 200 will have insufficient buckle insertion force when it is connected with the connector male 100, which will affect the connector male 100 and the connector female 200. Reliability of snap fit.
  • the cross-sectional area of some of the female contact terminals 205 along the width direction of the connector female 200 can be reduced, so that the parasitic capacitance between adjacent female contact terminals 205 can be reduced, and the The reliability of the buckling between the male connector 100 and the female connector 200 is ensured.
  • the cross-sectional area of the first receptacle contact terminal 2051 along the width direction of the connector receptacle 200 is smaller than the cross-sectional area of the second receptacle contact terminal 2052 along the width direction of the connector receptacle 200 .
  • the first female contact terminal 2051 along the width direction of the connector female 200 is smaller than the cross-sectional area of the second female contact terminal 2052 along the width direction of the connector female 200, the first female contact terminal 2051 and The parasitic capacitance between the adjacent female contact terminals 205 is small, so the characteristic impedance at the position of the first female contact terminal 2051 is relatively large, so that the position of the first female contact terminal 2051 can be improved.
  • the problem that the characteristic impedance of the traces of the connector socket 200 and the fourth circuit board 400 does not match reduces the transmission of the signal on the first socket contact terminal 2051 between the connector socket 200 and the fourth circuit board 400 When the reflection exists, it increases the SI. Since the first female socket pins 2061 are electrically connected to the first female socket contact terminals 2051 , the transmission of signals on the first female socket pins 2061 between the connector socket 200 and the fourth circuit board 600 can be further reduced. reflections that exist.
  • ⁇ can also be adjusted by adjusting the material of the fifth insulating layer between the fourth signal terminal layer 601 and the fourth reference ground layer 602 in the fourth circuit board 600 to change the connector socket 200 and the The magnitude of the parasitic capacitance between the fourth circuit boards 600 .
  • the selected material of the fifth insulating layer should have a low dielectric constant.
  • ⁇ can also be adjusted by adjusting the material between the two adjacent female contact terminals 205 to change the parasitic capacitance between the two adjacent female contact terminals 205. Since the female contact 202 Installed on the female housing 201 , that is, ⁇ can also be adjusted by adjusting the material of the female housing 201 , so as to change the parasitic capacitance between two adjacent female contact terminals 205 . In some examples, in order to reduce the parasitic capacitance between two adjacent female contact terminals 205, the female housing 201 should be selected to have a low dielectric constant.
  • the first socket pin 2061 is a high-speed signal pin
  • the second socket pin 2061 is a high-speed signal pin
  • the second socket pin 2061 is a high-speed signal pin
  • the socket pins 2062 are non-high-speed signal pins.
  • first female base pin 2061 is electrically connected to the first female base contact terminal 2051, the welding surface of the first female base pin 2061 is welded to the welding surface of the first female base pad 6011.
  • a female pin 2061 is a high-speed signal pin, both the first female contact terminal 2051 and the first female pad 6011 transmit high-speed signals.
  • the soldering surface of the second female base pin 2062 is welded to the welding surface of the second female base pad 6012, so when the second female base pin 2062 is welded
  • the receptacle pin 2062 is a non-high-speed signal pin
  • the second receptacle contact terminal 2052 and the second receptacle pad 6012 transmit non-high-speed signals.
  • the first female pin 2061 is a high-speed signal pin
  • the second female pin 2062 is a non-high-speed signal pin
  • it can reduce the transmission of high-speed signals between the connector female 200 and the fourth circuit board 600 .
  • the presence of reflections, and the signal integrity mainly depends on the high-speed signal, this way, the SI can be further improved.
  • the plug-in connection method of the male contact terminal 104 of the connector male head 100 and the female contact terminal 205 of the connector female base 200 in the connector 10 and the corresponding technical effect can refer to the first embodiment. It will not be repeated here.
  • the difference between the third embodiment and the second embodiment is that the structure of the connector male head 100 provided in the third embodiment and the first electronic device 20 electrically connected to the connector male head 100 is the same as that of the connector male head provided in the second embodiment. 100 and the first electronic device 20 electrically connected to the male connector 100 are different in structure.
  • the connector receptacle 200 provided in the third embodiment and the structure of the connector receptacle 200 and the connector receptacle 200 electrically connected to the second electronic device 30 are the same as the connector receptacle 200 provided in the second embodiment and the connector receptacle 200 electrically connected to the second electronic device 30
  • the structure of the electronic device 30 is the same.
  • the connector receptacle 200 provided in the third embodiment includes a receptacle housing 201 , a plurality of receptacle contacts 202 , a pair of receptacle fixing feet 203 and a pair of receptacle islands 204 .
  • the plurality of female contacts 202 include a plurality of first female contacts 207 and a plurality of second female contacts 208 .
  • the first receptacle contact piece 207 includes a first receptacle contact terminal 2051 and a first receptacle pin 2061 electrically connected to the first receptacle contact terminal 2051 , the first receptacle contact terminal 2051 and the first receptacle contact terminal 2051
  • the first female socket pins 2061 electrically connected to 2051 are integrally formed.
  • the second receptacle contact 208 includes a second receptacle contact terminal 2052 and a second receptacle pin 2062 electrically connected to the second receptacle contact terminal 2052, the second receptacle contact terminal 2052 and the second receptacle contact terminal 2052
  • the second female base pins 2062 electrically connected to 2052 are integrally formed. Wherein, the area of the welding surface of the first receptacle pin 2061 is smaller than the area of the soldering surface of the second receptacle pin 2062 .
  • the second electronic device 30 provided in the third embodiment is a fourth circuit board 600
  • the fourth circuit board 600 includes a fourth signal terminal layer 601 , a fourth reference ground layer 602 and a fourth signal line layer 603 that are stacked in sequence.
  • the fourth signal terminal layer 601 includes a first receptacle pad 6011 and a second receptacle pad 6012 ; wherein the area of the soldering surface of the first receptacle pad 6011 is smaller than the area of the soldering surface of the second receptacle pad 6012 .
  • connection relationship between the connector socket 200 and the fourth circuit board 600 may refer to the above-mentioned second embodiment. It will not be repeated here.
  • the structure of the connector receptacle 200 provided in the third embodiment and the structure of the connector receptacle 200 electrically connected to the second electronic device 30 is the same as that of the connector receptacle 200 provided in the second embodiment and the electrical connection with the connector receptacle 200
  • the structure of the second electronic device 30 is the same, so the connector receptacle 200 and the second electronic device 30 provided in the third embodiment have the same technical effect as the connector receptacle 200 and the second electronic device 30 provided in the second embodiment.
  • the structure of the device 20 is the same.
  • the main structure of the male connector 100 provided in the third embodiment includes a male housing 101 , a plurality of male contacts 102 and a pair of male fixing feet 103 .
  • the male contact 102 includes a male contact terminal 102a and a male pin 102b electrically connected to the male contact terminal 102a; the size of the plurality of male contacts 102 is the same, that is, the size of the plurality of male contact terminals 102a Likewise, the sizes of the plurality of male header pins 102b are the same.
  • the value range of the area of the soldering surface of the male header pin 102b is the same as the value range of the area of the soldering surface of the second male header pin 1052, which can be referred to above, and will not be repeated here.
  • the length of the soldering surface of the male header pin 102 b is in the range of the same value as the width direction of the connector male header 100 .
  • the value range of the length of the plane is the same, which can be referred to above, and will not be repeated here.
  • the value range of the width of the soldering surface of the male head pin 102 b is the same as that along the length direction of the connector male head 100 .
  • the value range of the width of the surface is the same, which can be referred to above, and will not be repeated here.
  • the structure of the circuit board electrically connected to the male connector 100 is the same as the structure of the second circuit board 400 described above.
  • FIG. 14 and the above description of the second circuit board 400 which will not be repeated here.
  • the connection relationship between the male connector 100 and the circuit board can be referred to the description of the related art in the first embodiment, It will not be repeated here.
  • the male contact terminal 104 of the connector male 100 and the female contact terminal 205 of the connector female 200 in the connector 10 can be connected through a plurality of contact points (for example, two contact points) through a snap connection , so as to realize the snap connection between the male connector 100 and the female connector 200 .
  • Embodiment 4 and Embodiment 1, Embodiment 2 and Embodiment 3 above is that in Embodiment 1, the welding surfaces of some of the male header pins (ie, the first male header pins 1042 ) in the connector male header 100 are welded together. The area is reduced, and the area of the soldering surface of the part of the pads in the first circuit board 300 that is electrically connected to the connector male header 100 (ie, the first male header pad 3011 ) is reduced.
  • the second embodiment is to reduce the area of the soldering surface of some of the male header pins (ie, the first male header pins 1042 ) in the connector male header 100 , and connect the first circuit board 300 that is electrically connected to the connector male header 100 .
  • the area of the welding surface of some of the pads is reduced, and the area of the welding surface of some of the female pins (ie the first female pins 2061 ) in the connector socket 200 is reduced.
  • the third embodiment is to reduce the area of the soldering surface of some of the female socket pins (ie, the first female socket pins 2061 ) in the connector socket 200 , and connect the fourth circuit board 600 that is electrically connected to the connector socket 200 .
  • the area of the soldering surface of part of the pads is reduced.
  • the areas of the soldering surfaces of all the male pins 102b in the male connector 100 are reduced, and the soldering surfaces of all the pads in the circuit board that are electrically connected to the male connector 100 are reduced in size. area is reduced. And/or, the area of the soldering surface of all the female socket pins in the connector female seat 200 is reduced, and the area of the soldering surface of all the pads in the circuit board electrically connected to the connector female seat 200 is reduced .
  • the structure of the connector male head 100 and the structure of the connector female base 200 may refer to the first embodiment, the second embodiment and the third embodiment, and the description of the fourth embodiment will not be repeated.
  • the areas of the soldering surfaces of all the male pins 102b in the male connector 100 are reduced, and all the pads in the circuit board that are electrically connected to the male connector 100 are soldered.
  • the value range of the area of the soldering surface of the male pin 102 of the male connector 100 can be the same as that of the soldering surface of the first male pin 1042 in the above-mentioned first embodiment.
  • the value range of the area is the same, and reference may be made to the description of the value range of the area of the welding surface of the pair of first male header pins 1042 in the above embodiment, which will not be repeated here.
  • the length of the soldering surface of the male head pin 102b may be in the same range as the first male head along the width direction of the connector male head 100 in the first embodiment.
  • the value ranges of the lengths of the soldering surfaces of the pins 1042 are the same, and reference may be made to the description of the value ranges of the lengths of the soldering surfaces of the pair of first male pins 1042 in the above-mentioned embodiment, which will not be repeated here.
  • the value range of the width of the soldering surface of the male head pin 102b may be the same as that in the above-mentioned first embodiment along the length direction of the connector male head 100.
  • the value ranges of the widths of the soldering surfaces of the pins 1042 are the same, and reference may be made to the description of the ranges of the widths of the soldering surfaces of the first male header pins 1042 in the above embodiment, which will not be repeated here.
  • the value range of the area of the soldering surface of all the pads in the circuit board electrically connected to the connector male head 100 may be the same as the area of the soldering surface of the first male header pad 3011 in the above-mentioned first embodiment.
  • the value range is the same, and reference may be made to the description of the value range of the area of the welding surface of the pair of first male header pads 3011 in the above-mentioned embodiment, which will not be repeated here.
  • the value range of the lengths of the soldering surfaces of all the pads in the circuit board electrically connected to the male connector 100 may be the same as that of the first embodiment above.
  • the value range of the length of the welding surface of the first male header pad 3011 is the same. Please refer to the description of the value range of the length of the welding surface of the first male header pad 3011 in the above-mentioned embodiment. It is not repeated here.
  • the value range of the width of the soldering surfaces of all the pads in the circuit board electrically connected to the connector male head 100 may be the same as that of the first embodiment along the first direction.
  • the value ranges of the widths of the soldering surfaces of the header pads 3011 are the same, and reference may be made to the description of the value ranges of the widths of the soldering surfaces of the first male header pads 3011 in the above embodiment, which will not be repeated here.
  • the areas of the soldering surfaces of all the male pins 102b in the male connector 100 are reduced, the areas of soldering surfaces of all the pads in the circuit board that are electrically connected to the male connector 100 are reduced, so that the The parasitic capacitance between the male pin 102b, the pad of the circuit board and the reference ground layer of the circuit board is greatly reduced, so that the characteristic impedance of the connector male 100 can be effectively increased, so that the connection can be significantly reduced
  • the characteristic impedance of the connector male head 100 does not match the characteristic impedance of the traces of the circuit board, which reduces the reflection that exists when the signal is transmitted between the connector male head 100 and the circuit board, and further improves the SI.
  • the areas of the soldering surfaces of all the female socket pins in the connector female seat 200 are reduced, and the soldering surfaces of all the pads in the circuit board electrically connected to the connector female seat 200 are reduced.
  • the value range of the area of the soldering surface of all the female socket pins in the connector socket 200 can be the same as that of the first socket pin 2061 in the second embodiment above.
  • the value range of the area of the welding surface is the same, and reference may be made to the description of the value range of the area of the welding surface of the first female base pin 2061 in the second embodiment, which will not be repeated here.
  • the lengths of the soldering surfaces of all the receptacle pins in the connector receptacle 200 may be in the same range as the lengths along the connector receptacle 200 in the second embodiment above.
  • the value range of the length of the welding surface of the first female base pin 2061 is the same. Please refer to the description of the value range of the length of the welding surface of the first female base pin 2061 in the second embodiment. Repeat.
  • the widths of the soldering surfaces of all the female receptacle pins in the connector receptacle 200 may be in the same range as the widths along the connector receptacle 200 in the second embodiment above.
  • the value range of the width of the welding surface of the first female base pin 2061 is the same. Please refer to the description of the value range of the width of the welding surface of the first female base pin 2061 in the second embodiment. Repeat.
  • the value range of the area of the soldering surface of all the pads in the circuit board electrically connected to the connector female seat 200 may be the same as the area of the soldering surface of the first female seat pad 6011 in the second embodiment above.
  • the value range is the same, and reference may be made to the description of the value range of the area of the welding surface of the first female pad 6011 in the second embodiment, which will not be repeated here.
  • the value range of the lengths of the soldering surfaces of all the pads in the circuit board electrically connected to the female connector 200 is the same as that of the above-mentioned second embodiment along the direction perpendicular to the first direction.
  • the direction of the direction, the value range of the length of the welding surface of the first female pad 6011 is the same, you can refer to the description of the value range of the length of the welding surface of the first female pad 6011 in the second embodiment above, here No longer.
  • the value ranges of the widths of the soldering surfaces of all the pads in the circuit board electrically connected to the connector female base 200 are the same as those of the second embodiment described above, along the first direction, the first female base
  • the value range of the width of the welding surface of the pad 6011 is the same, and reference may be made to the description of the value range of the width of the welding surface of the first receptacle pad 6011 in the second embodiment, which is not repeated here.
  • the characteristic impedance of the connector socket 200 does not match the characteristic impedance of the traces of the circuit board, which reduces the reflection of the signal during transmission between the connector socket 200 and the circuit board, and further improves the SI.
  • the connector female seat 200 may be the connector female seat 200 provided in the first embodiment, or the connector female seat 200 provided in the second embodiment.
  • the connector The male head 100 may be the connector male head 100 provided in the first embodiment, or may be the connector male head 100 provided in the third embodiment.

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Abstract

本申请实施例提供一种连接器单体、连接器、电路板、电子设备及电子系统，涉及电子系统配件技术领域，可以改善利用连接器将不同电子器件电连接在一起时，导致的SI差的问题。该所述连接器单体包括第一接触件和第二接触件；所述第一接触件包括第一接触端子以及与所述第一接触端子电连接的第一引脚；所述第二接触件包括第二接触端子和与所述第二接触端子电连接的第二引脚；其中，所述第一接触端子和与其电连接的所述第一引脚一体成型，所述第二接触端子和与其电连接的所述第二引脚一体成型；所述第一引脚的焊接面的面积小于所述第二引脚的焊接面的面积。

Description

连接器单体、连接器、电路板、电子设备及电子系统
本申请要求于2021年03月30日提交国家知识产权局、申请号为202120653373.4、发明名称为“连接器单体、连接器、电路板、电子设备及电子系统”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及电子系统配件技术领域，尤其涉及一种连接器单体、连接器、电路板、电子设备及电子系统。
背景技术
连接器是电子产品中不可缺少的一种部件，用在电路内被阻断处或独立不通的电路之间，架起沟通的桥梁，从而使电流流通，进而使电路实现预定的功能。随着电子技术的发展，连接器的应用越来越广泛。目前，连接器已广泛应用于手机、平板等电子设备中。在连接器应用于电子设备中时，主要用于将电子设备中不同的电子器件电连接在一起。例如，连接器可以将电子设备中的PCB(printed circuit board，印刷电路板)与FPC(flexible printed circuit)电连接在一起。
然而，以连接器用于将PCB和FPC电连接在一起为例，由于连接器的特征阻抗与PCB走线的特征阻抗和FPC走线的特征阻抗不匹配，因而信号在传输过程中会存在反射，从而会导致SI(signal integrity，信号完整性)差的问题。
发明内容
本申请实施例提供一种连接器单体、连接器、电路板、电子设备及电子系统，可以改善利用连接器将不同电子器件电连接在一起时，导致的SI差的问题。
为达到上述目的，本申请采用如下技术方案：
第一方面，提供一种连接器单体，该连接器单体包括第一接触件和第二接触件；第一接触件包括第一接触端子以及与第一接触端子电连接的第一引脚；第二接触件包括第二接触端子和与第二接触端子电连接的第二引脚；其中，第一接触端子和与其电连接的第一引脚一体成型，第二接触端子和与其电连接的第二引脚一体成型；第一引脚的焊接面的面积小于第二引脚的焊接面的面积。由于连接器单体安装于电路板上时，电路板上的焊盘尺寸在设计时，是根据焊接在其上的引脚的尺寸来设计的，而连接器单体包括第一引脚和第二引脚；第一引脚的焊接面的面积小于第二引脚的焊接面的面积，因此在设计电路板时，电路板包括第一焊盘和第二焊盘，第一焊盘的焊接面的面积小于第二焊盘的焊接面的面积。当连接器单体安装于电路板上时，第一引脚的焊接面焊接于第一焊盘的焊接面上，第二引脚的焊接面焊接于第二焊盘的焊接面上，由于第一引脚、第一焊盘与电路板的参考地层之间的相对面积小于第二引脚、第二焊 盘与电路板的参考地层之间的相对面积，根据电容公式可知，第一引脚、第一焊盘与电路板的参考地层之间的寄生电容相对于第二引脚、第二焊盘与电路板的参考地层之间的寄生电容会减小，因此根据特征阻抗计算公式可知，第一引脚所在位置处的连接器单体的特征阻抗会增加，这样一来，可以改善第一引脚所在位置处的连接器单体的特征阻抗和电路板的走线的特征阻抗不匹配的问题，减小了第一引脚上的信号在连接器单体和电路板之间传输时存在的反射，提高SI，进而减小了第一引脚上的信号在连接器和电路板之间传输时存在的反射，提高SI。
在一种可能的实施方式中，第一引脚的焊接面的面积的取值范围为0.0016mm 2～7.8804mm 2，第二引脚的焊接面的面积的取值范围为0.004mm 2～8mm 2。当第一引脚的焊接面的面积的取值范围为0.0016mm 2～7.8804mm 2时，可以减小第一引脚、第一焊盘与电路板的参考地层之间的寄生电容，提高第一引脚所在位置处的连接器单体的特征阻抗。当第二引脚的焊接面的面积的取值范围为0.004mm 2～8mm 2时，可以确保连接器单体与电路板焊接的可靠性。
在一种可能的实施方式中，第二引脚的焊接面的面积与第一引脚的焊接面的面积的差值范围为0.024mm 2～7.9984mm 2。
在一种可能的实施方式中，第一接触件和第二接触件沿连接器单体的长度方向排列；沿连接器单体的宽度方向，第一引脚的焊接面的长度小于第二引脚的焊接面的长度。在设计时，沿连接器单体的宽度方向，通过使第一引脚的焊接面的长度小于第二引脚的焊接面的长度，从而可以使得第一引脚的焊接面的面积小于第二引脚的焊接面的面积。
在一种可能的实施方式中，沿连接器单体的宽度方向，第一引脚的焊接面的长度的取值范围为0.02mm～3.98mm，第二引脚的焊接面的长度的取值范围为0.04mm～4mm。可以使第一引脚的焊接面的长度相对于第二引脚的焊接面的长度减小。
在一种可能的实施方式中，沿连接器单体的宽度方向，第二引脚的焊接面的长度与第一引脚的焊接面的长度的差值范围为0.02mm～3.98mm。
在一种可能的实施方式中，第一引脚为高速信号引脚，第二引脚为非高速信号引脚。此处，高速信号引脚用于传输高速信号，非高速信号引脚用于传输非高速信号。由于连接器单体和电路板之间传输的信号完整性主要与高速信号有关，当第一引脚为高速信号引脚时，可以减小高速信号在连接器单体和电路板之间传输时存在的反射，而信号完整性主要取决于高速信号，这样一来，可以进一步提高SI。
在一种可能的实施方式中，非高速信号引脚为低速信号引脚、电源引脚或接地引脚。低速信号引脚例如可以为控制信号引脚或低速时钟信号引脚。此处，低速信号引脚用于传输低速信号，电源引脚用于传输电源信号，接地引脚用于传输接地信号。
在一种可能的实施方式中，第一接触件和第二接触件沿连接器单体的长度方向排列；第一接触端子沿连接器单体的宽度方向的截面的面积小于第二接触端子沿连接器单体的宽度方向的截面的面积。由于第一接触端子沿连接器单体的宽度方向的截面的面积小于第二接触端子沿连接器单体的宽度方向的截面的面积，因而第一接触端子和与其相邻的接触端子之间的寄生电容较小，因此第一接触端子所在位置处的特征阻抗 较大，这样一来，可以改善第一接触端子所在位置处的连接器单体的特征阻抗和电路板的走线的特征阻抗不匹配的问题，减小第一接触端子上的信号在连接器单体和电路板之间传输时存在的反射，提高SI。由于第一引脚与第一接触端子电连接，因而也可以进一步减小第一引脚上的信号在连接器单体和电路板之间传输时存在的反射。
第二方面，提供一种连接器，该连接器包括连接器公头和连接器母座，连接器公头和连接器母座扣插连接；连接器公头为上述第一方面提供的连接器单体；和/或，连接器母座为上述第一方面提供的连接器单体。当连接器公头为上述第一方面提供的连接器单体时，连接器公头具有与上述第一方面提供的连接器单体相同的技术效果，此处不再赘述。当连接器母座为上述第一方面提供的连接器单体时，连接器母座具有与上述第一方面提供的连接器单体相同的技术效果，此处不再赘述。
在一种可能的实施方式中，连接器公头包括第一接触件和第二接触件，连接器母座包括第一接触件和第二接触件；其中，由于连接器公头的第一接触件中的第一接触端子与连接器母座的第一接触件中的第一接触端子扣插连接，连接器公头的第二接触件中的第二接触端子与连接器母座的第二接触件中的第二接触端子扣插连接，因而可以实现连接器公头和连接器母座的扣插连接。
在一种可能的实施方式中，连接器公头的第一接触端子与连接器母座的第一接触端子通过一个接触点扣插连接，连接器公头的第二接触端子与连接器母座的第二接触端子通过多个接触点扣插连接。由于连接器公头的第一接触端子与连接器母座的第一接触端子通过一个接触点扣插连接，因而可以减小连接器公头的第一接触端子和连接器母座的第一接触端子上传输的信号反射，进一步提高SI。在第一接触端子和第一母座接触端子上传输的信号为高速信号时，可以提高高速信号的SI。在此基础上，由于连接器公头的第二接触端子与连接器母座的第二接触端子通过多个接触点扣插连接，因而可以确保连接器公头与连接器母座之间的扣插拔力，保证了扣插的可靠性。
在一种可能的实施方式中，连接器公头还包括辅助接触端子；辅助接触端子的材料为非导电材料；连接器公头的第一接触端子与连接器母座的第一接触端子还通过辅助接触端子扣插连接。这样可以增加连接器公头和连接器母座的扣插拔力，这样一来，便可以进一步确保连接器公头和连接器母座的扣合可靠性。
在一种可能的实施方式中，连接器为板对板BTB连接器、type-C连接器、低电压差分信号LVDS连接器、M.2连接器或WTB连接器。
第三方面，提供一种电路板，该电路板包括层叠设置的信号端子层和参考地层，参考地层覆盖信号端子层，信号端子层包括第一焊盘和第二焊盘；其中，第一焊盘的焊接面的面积小于第二焊盘的焊接面的面积。当第一方面提供的连接器单体安装与该电路板上时，第一引脚的焊接面焊接于第一焊盘的焊接面上，第二引脚的焊接面焊接于第二焊盘的焊接面上，由于第一引脚、第一焊盘与电路板的参考地层之间的相对面积小于第二引脚、第二焊盘与电路板的参考地层之间的相对面积，根据电容公式可知，第一引脚、第一焊盘与电路板的参考地层之间的寄生电容相对于第二引脚、第二焊盘与电路板的参考地层之间的寄生电容会减小，因此根据特征阻抗计算公式可知，第一引脚所在位置处的连接器单体的特征阻抗会增加，这样一来，可以改善第一引脚所在位置处的连接器单体的特征阻抗和电路板的走线的特征阻抗不匹配的问题，减小 了第一引脚和第一焊盘上的信号在连接器单体和电路板之间传输时存在的反射，提高SI，进而减小了第一引脚和第一焊盘上的信号在连接器和电路板之间传输时存在的反射，提高SI。
在一种可能的实施方式中，第一焊盘的焊接面的面积的取值范围为0.0055mm 2～23.8004mm 2，第二焊盘的焊接面的面积的取值范围为0.0091mm 2～24mm 2。当第一焊盘的焊接面的面积的取值范围为0.0055mm 2～23.8004mm 2时，可以减小第一引脚、第一焊盘与电路板的参考地层之间的寄生电容，提高第一引脚所在位置处的连接器单体的特征阻抗。当第二焊盘的焊接面的面积的取值范围为0.0091mm 2～24mm 2时，可以确保连接器单体与电路板焊接的可靠性。
在一种可能的实施方式中，第二焊盘的焊接面的面积与第一焊盘的焊接面的面积的差值范围为0.0036mm 2～23.9945mm 2。
在一种可能的实施方式中，第一焊盘和第二焊盘沿第一方向排列；沿垂直于第一方向的方向，第一焊盘的焊接面的长度小于第二焊盘的焊接面的长度。在设计电路板时，沿垂直于第一方向的方向，通过使第一焊盘的焊接面的长度小于第二焊盘的焊接面的长度，从而可以是第一焊盘的焊接面的面积小于第二焊盘的焊接面的面积。
在一种可能的实施方式中，沿垂直于第一方向的方向，第一焊盘的焊接面的长度的取值范围为0.05mm～5.98mm，第二焊盘的焊接面的长度范围为0.07mm～6mm。可以使第一焊盘的焊接面的长度相对于第二焊盘的焊接面的长度减小。
在一种可能的实施方式中，沿垂直于第一方向的方向，第二焊盘的焊接面的长度与第一焊盘的焊接面的长度的差值范围为0.02mm～5.95mm。
在一种可能的实施方式中，电路板为印刷电路板或柔性电路板。
第四方面，提供一种电子设备，该电子设备包括电路板和安装在电路板上的连接器单体；其中，连接器单体为上述第一方面提供的连接器单体，电路板为上述第三方面提供的电路板；连接器单体的第一引脚的焊接面焊接于电路板的第一焊盘的焊接面上，连接器单体的第二引脚的焊接面焊接于电路板的第二焊盘的焊接面上。此处，该电子设备具有与第三方面提供的电路板相同的技术效果，可以参考上述第三方面的描述，此处不再赘述。
在一种可能的实施方式中，连接器单体为连接器公头或连接器母座。
第五方面，提供一种电子系统，该电子系统包括上述第四方面提供的连接器、第一电子器件和第二电子器件；连接器公头与第一电子器件电连接，连接器母座与第二电子器件电连接；连接器公头包括第一引脚和第二引脚，第一引脚的焊接面的面积小于第二引脚的焊接面的面积，第一电子器件为上述第三方面提供的电路板；连接器公头的第一引脚与第一电子器件的第一焊盘电连接，连接器公头的第二引脚与第一电子器件的第二焊盘电连接；和/或，连接器母座包括第一引脚和第二引脚，第一引脚的焊接面的面积小于第二引脚的焊接面的面积，第二电子器件为上述第三方面提供的电路板；连接器母座的第一引脚与第二电子器件的第一焊盘电连接，连接器母座的第二引脚与第二电子器件的第二焊盘电连接。此处，该电子系统具有与第三方面提供的电路板相同的技术效果，可以参考上述第三方面的描述，此处不再赘述。
在一种可能的实施方式中，电子系统为第一电子设备，连接器、第一电子器件和第二电子器件设置于第一电子设备中。
在一种可能的实施方式中，电子系统包括第一电子设备和第二电子设备；连接器公头和第一电子器件设置于第一电子设备中，连接器母座和第二电子器件设置于第二电子设备中。
附图说明
图1为本申请的实施例提供的一种第一电子设备的结构示意图；
图2为本申请的实施例提供的一种电子系统的结构示意图；
图3为本申请的实施例提供的一种连接器的结构示意图；
图4为本申请的实施例提供的一种连接器公头安装在第一电子器件上的结构示意图；
图5为本申请的实施例提供的一种连接器公头的结构示意图；
图6为本申请的实施例提供的一种连接器公头的爆炸图；
图7a为本申请的实施例提供的一种第一公头接触件或第二公头接触件的结构示意图；
图7b为本申请的实施例提供的一种第一公头接触件的结构示意图；
图8为本申请的实施例提供的一种第一电路板或第四电路板的结构示意图；
图9a为本申请的实施例提供的一种第一公头引脚、第一公头焊盘与第一参考地层之间的位置关系侧视图，或者，第二公头引脚、第二公头焊盘与第一参考地层之间的位置关系侧视图；
图9b为本申请的实施例提供的一种第一公头引脚、第一公头焊盘与第一参考地层之间的位置关系俯视图，或者，第二公头引脚、第二公头焊盘与第一参考地层之间的位置关系俯视图；
图10为本申请的实施例提供的一种连接器母座安装在第二电子器件上的结构示意图；
图11为本申请的实施例提供的一种连接器母座的结构示意图；
图12为本申请的实施例提供的一种连接器母座的爆炸图；
图13为本申请的实施例提供的一种母座接触件的结构示意图；
图14为本申请的实施例提供的一种第二电路板的结构示意图；
图15a为本申请的实施例提供的一种连接器公头和连接器母座扣插连接的结构示意图；
图15b为本申请的另一实施例提供的一种连接器公头和连接器母座扣插连接的结构示意图；
图16为相关技术提供的一种连接器公头的结构示意图；
图17为相关技术提供的一种连接器公头和连接器母座扣插连接的结构示意图；
图18为相关技术提供的一种第三电路板的结构示意图；
图19为本申请的另一实施例提供的一种连接器母座安装在第二电子器件上的结构示意图；
图20为本申请的实施例提供的一种连接器母座的结构示意图；
图21为本申请的实施例提供的一种连接器母座的爆炸图。
附图标记：1-第一电子设备；10-连接器；11-显示面板；12-中框；13-后壳；20-第一电子器件；30-第二电子器件；100-连接器公头；101-公头壳体；102-公头接触件；102a-公头接触端子；102b-公头引脚；103-公头固定脚；104-第一公头接触件；105-第二公头接触件；106-辅助接触端子；200-连接器母座；201-母座壳体；202-母座接触件；203-母座固定脚；204-母座中岛；205-母座接触端子；206-母座引脚；207-第一母座接触件；208-第二母座接触件；300-第一电路板；301-第一信号端子层；302-第一参考地层；303-第一信号线层；400-第二电路板；401-第二信号端子层；402-第二参考地层；403-第二信号线层；500-第三电路板；501-第三信号端子层；502-第三参考地层；503-第三信号线层；600-第四电路板；601-第四信号端子层；602-第四参考地层；603-第四信号线层；1041-第一公头接触端子；1042-第一公头引脚；1051-第二公头接触端子；1052-第二公头引脚；2051-第一母座接触端子；2052-第二母座接触端子；2061-第一母座引脚；2062-第二母座引脚；3011-第一公头焊盘；3012-第二公头焊盘；4011-第三焊盘；5011-第四焊盘；5021-镂空区；6011-第一母座焊盘；6012-第二母座焊盘。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。
以下，术语“第一”、“第二”等仅用于描述方便，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”等的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请的描述中，除非另有说明，“多个”的含义是两个或两个以上。
在本申请实施例中，除非另有明确的规定和限定，术语“电连接”可以是直接的电性连接，也可以通过中间媒介间接的电性连接。
在本申请实施例中，“示例性的”或者“例如”等词用于表示作例子、例证或说明。本申请实施例中被描述为“示例性的”或者“例如”的任何实施例或设计方案不应被解释为比其它实施例或设计方案更优选或更具优势。确切而言，使用“示例性的”或“例如”等词旨在以具体方式呈现相关概念。
在本申请实施例中，“和/或”，描述关联对象的关联关系，表示可以存在三种关系，例如，A和/或B，可以表示：单独存在A，同时存在A和B，单独存在B的情况，其中A，B可以是单数或者复数。字符“/”一般表示前后关联对象是一种“或”的关系。
在本申请实施例中，例如上、下、左、右、前和后等用于解释本申请中不同部件的结构和运动的方向指示是相对的。当部件处于图中所示的位置时，这些指示是恰当的。但是，如果元件位置的说明发生变化，那么这些方向指示也将会相应地发生变化。
本申请实施例提供一种电子系统，该电子系统可以为一个电子设备，例如第一电 子设备；该电子系统也可以包括多个电子设备，例如，包括第二电子设备和第三电子设备。
其中，第一电子设备、第二电子设备和第三电子设备例如可以为手机(mobile phone)、平板电脑(pad)、个人数字助理(personal digital assistant，PDA)、电视、智能穿戴产品(例如，智能手表、智能手环)、虚拟现实(virtual reality，VR)终端设备、增强现实(augmented reality，AR)终端设备、线缆组件等。本申请实施例对第一电子设备、第二电子设备和第三电子设备的具体实现方式不作特殊限制。
以下为了方便说明，是以上述第一电子设备为手机为例进行的说明。在第二电子设备或第三电子设备为手机的情况下，第二电子设备和第三电子设备的结构可以参考第一电子设备的结构。如图1所示，第一电子设备1的结构主要包括显示面板11、中框12以及后壳13。显示面板11和后壳13分别位于中框12的两侧，并通过中框12连接。
上述的显示面板11包括位于显示区(active area，AA)的多个像素。上述的第一电子设备1还可以包括用于驱动多个像素进行显示的显示驱动电路，该显示驱动电路可以与多个像素电连接。示例的，该显示驱动电路可以为显示驱动芯片(display driver integrated circuit，DDIC)。DDIC可以设置于显示面板的非显示区中，也可以独立于显示面板11设置。
上述的第一电子设备1还可以包括设置于中框12上的印刷电路板(printed circuit board，PCB)，以及安装于该PCB上的片上系统(System on Chip，SoC)、电源管理芯片(power IC)。该SoC内可以设置有应用处理器(application processor，AP)。图1中未示意出power IC。
图1中的DDIC可以通过柔性电路板(flexible printed circuit，FPC)与PCB电连接。这样一来，PCB上的power IC可以为DDIC提供工作电压；PCB上的AP可以为DDIC提供显示数据，用以展示实际的图像信息。DDIC用于接收PCB传输的信号并将信号按照特定的时序控制输送给显示面板11，以驱动显示面板11发光。其中，FPC为PCB和显示面板11之间提供信号传输连接路径，FPC的一端通过异向导电膜绑定(bonding)在显示面板11上，另一端与PCB电连接在一起。
如图2所示，本申请实施例提供的电子系统的主要结构包括连接器10、第一电子器件20和第二电子器件30，连接器包括两个连接器单体，两个连接器单体可以分别为连接器公头和连接器母座，连接器公头与连接器母座扣插连接，连接器公头与第一电子器件20电连接，连接器母座与第二电子器件30电连接。
由于连接器公头与第一电子器件20电连接，连接器母座与第二电子器件30电连接，而连接器公头与连接器母座扣插连接，因而可以通过连接器将第一电子器件20和第二电子器件30电连接在一起。
在电子系统为第一电子设备的情况下，上述的连接器公头、连接器母座、第一电子器件20、第二电子器件30均应用于第一电子设备中，即第一电子设备包括连接器公头、连接器母座、第一电子器件20、第二电子器件30。
示例的，第一电子设备可以为上述的手机，第一电子器件20可以为手机中的FPC，第二电子器件30可以为手机中的PCB，连接器公头与FPC电连接，连接器母 座与PCB电连接，这样一来，手机中的FPC和PCB可以通过连接器10电连接在一起。
在电子系统包括第二电子设备和第三电子设备的情况下，上述的连接器公头和与其电连接的第一电子器件20可以应用于一个电子设备中，连接器母座和与其电连接的第二电子器件30可以应用于另一个电子设备，即第二电子设备包括连接器公头和与其电连接的第一电子器件20，第三电子设备包括连接器母座和与其电连接的第二电子器件30。
示例的，第二电子设备可以线缆组件，第一电子器件20可以为线缆，第三电子设备可以为电视，第二电子器件30可以为电视中的PCB，连接器公头与线缆电连接，连接器母座与PCB电连接，这样一来，电视中的PCB和线缆可以通过连接器10电连接在一起。
此外，在一些示例中，上述的第一电子器件20和第二电子器件30可以均为电路板。在另一些示例中，第一电子器件20为电路板，第二电子器件30为线缆；或者，第一电子器件20为线缆，第二电子器件30为电路板。此处，电路板例如可以为PCB或FPC。
上述的连接器例如可以为BTB(board to board，板对板)连接器、type-C连接器、LVDS(low voltage differential signaling，低电压差分信号)连接器、M.2连接器或WTB(wire to board，线对板)连接器。下述以连接器10为BTB连接器为例对连接器进行说明。
以下示例性地提供四个具体的实施例，对连接器10中的连接器公头、连接器母座、与连接器公头电连接的第一电子器件20、与连接器母座电连接的第二电子器件30分别进行介绍。
实施例一
图3为本申请实施例提供的一种从连接器公头一侧看到的连接器10的结构示意图。如图3所示，连接器10包括连接器公头100和连接器母座200。
图4示出了安装在第一电子器件20上的连接器公头100的立体图，图4中的第一电子器件20为电路板。参考图4，连接器公头100具有直平行六面体轮廓。此外，将直平行六面体连接器公头100延伸的方向称为“长度方向”(即图4中的Y方向)，将平行于第一电子器件20的平面且垂直于“长度方向”的方向称为“宽度方向”(即图4中的X方向)，将与第一电子器件20的平面垂直的方向称为“高度方向”(即图4中的Z方向)。在本申请中，对于连接器公头100，可以将连接器公头100安装在第一电子器件20上的一侧称为“安装侧”或“下侧”，与连接器母座200配合的一侧称为“配合侧”或“上侧”。
图5示出了从安装侧看到的连接器公头100的结构图。图6示出了连接器公头100的爆炸图，图6为从安装侧看到的连接器公头100的爆炸图。如图6所示，连接器公头100包括壳体(housing，HSG)(为了和连接器母座200中的壳体区分，以下将连接器公头100的壳体称为公头壳体101)、多个公头接触件102以及一对公头固定脚(也可以称为公头盔甲)103。
此处，公头固定脚103例如可以用于传输电源信号或地信号。另外，在制作连接 器公头100时，可以在公头接触件102和公头固定脚103上通过注塑方式形成公头壳体101。
如图6所示，上述多个公头接触件102包括多个第一接触件和多个第二接触件。为了和连接器母座200中的第一接触件和第二接触件区分开，以下将连接器公头100中的第一接触件称为第一公头接触件104，将连接器公头100中的第二接触件称为第二公头接触件105。
如图7a所示，每个第一公头接触件104包括第一接触端子和与第一接触端子电连接的第一引脚(pin)，为了将连接器公头100中的第一接触端子和第一引脚与下述连接器母座200中的第一接触端子和第一引脚区分开，以下将第一公头接触件104中的第一接触端子称为第一公头接触端子1041，将第一公头接触件104中的第一引脚称为第一公头引脚1042。其中，第一公头接触端子1041和与第一公头接触端子1041电连接的第一公头引脚1042一体成型。每个第二公头接触件105包括第二接触端子和与第二接触端子电连接的第二引脚，为了将连接器公头100中的第二接触端子和第二引脚与下述连接器母座200中的第二接触端子和第二引脚区分开，以下将第二公头接触件105中的第二接触端子称为第二公头接触端子1051，将第二公头接触件105中的第二引脚称为第二公头引脚1052。其中，第二公头接触端子1051和与第二公头接触端子1051电连接的第二公头引脚1052一体成型。
上述第一公头接触件104中的第一公头接触端子1041和第二公头接触件105中的第二公头接触端子1051用于和连接器母座200扣插连接，第一公头接触件104中的第一公头引脚1042和第二公头接触件105中的第二公头引脚1052用于和第一电子器件20电连接，以确保连接器公头100与第一电子器件20的电连接。此处，第一公头引脚1042、第二公头引脚1052和第一电子器件20可以通过焊接的方式电连接在一起。
在此基础上，在连接器公头100安装于第一电子器件20上时，上述的公头固定脚103焊接在第一电子器件20上，这样可以进一步加固连接器公头100和第一电子器件20之间的电连接。
此外，由于第一公头接触件104包括第一公头接触端子1041和与第一公头接触端子1041电连接的第一公头引脚1042，第二公头接触件105包括第二公头接触端子1051和与第二公头接触端子1051电连接的第二公头引脚1052，因而第一公头接触件104、第一公头接触端子1041、第一公头引脚1042的数量以及排布方式是完全相同的，第二公头接触件105、第二公头接触端子1051、第二公头引脚1052的数量以及排布方式是完全相同的。以第一公头接触件104和第二公头接触件105为例说明第一公头接触件104、第一公头接触端子1041、第一公头引脚1042，以及第二公头接触件105、第二公头接触端子1051、第二公头引脚1052的排布方式，多个第一公头接触件104和多个第二公头接触件105可以沿连接器公头100的长度方向，依次设置在连接器公头100的一侧；多个第一公头接触件104和多个第二公头接触件105也可以沿连接器公头100的长度方向，依次设置在连接器公头100的相对两侧。
另外，以第一公头引脚1042和第二公头引脚1052为例，第一公头引脚1042和第二公头引脚1052的排布方式，可以根据需要进行设置。例如，相邻两个第一公头 引脚1042之间设置一个或多个第二公头引脚1052。又例如，两个或多个第一公头引脚1042为一组，一组第一公头引脚1042之间设置一个或多个第二公头引脚1052。图5以两个第一公头引脚1042为一组，一组第一公头引脚1042之间设置一个第二公头引脚1052为例进行示意。应当理解到，当利用第一公头引脚1042传输差分信号时，偶数个第一公头引脚1042应为一组，例如，两个第一公头引脚1042为一组。
以第一公头接触件104和第二公头接触件105为例，上述第一公头接触件104的数量和第二公头接触件105的数量可以根据需要进行设置。
参考图5和图6，在本实施例中，第一公头引脚1042的焊接面的面积小于第二公头引脚1052的焊接面的面积。
在一些示例中，第一公头引脚1042的焊接面的面积的取值范围为0.0016mm 2～7.8804mm 2。
在一些示例中，第一公头引脚1042的焊接面的面积的取值范围为0.0016mm 2～1.9404mm 2。
例如，第一公头引脚1042的焊接面的面积可以为0.0016mm 2、0.020mm 2、1.0mm 2、1.5mm 2、1.9404mm 2、5.0mm 2或7.8804mm 2等。
在一些示例中，第二公头引脚1052的焊接面的面积的取值范围为0.004mm 2～8mm 2。
在一些示例中，第二公头引脚1052的焊接面的面积的取值范围为0.004mm 2～2mm 2。
例如，第二公头引脚1052的焊接面的面积可以为0.004mm 2、0.01mm 2、0.1mm 2、1mm 2、1.5mm 2、2mm 2、5mm 2或8mm 2等。
在一些示例中，第二公头引脚1052的焊接面的面积与第一公头引脚1042的焊接面的面积的差值范围为0.024mm 2～7.9984mm 2。
在一些示例中，第二公头引脚1052的焊接面的面积与第一公头引脚1042的焊接面的面积的差值范围为0.024mm 2～1.9984mm 2。
例如，第二公头引脚1052的焊接面的面积与第一公头引脚1042的焊接面的面积的差值可以为0.024mm 2、0.03mm 2、1mm 2、1.5mm 2或1.9984mm 2等。
在第一公头引脚1042的焊接面的面积小于第二公头引脚1052的焊接面的面积的情况下，在一些示例中，第一接触件102和第二接触件103沿连接器公头100的长度方向排列；沿连接器公头100的宽度方向，第一公头引脚1042的焊接面的长度小于第二公头引脚1052的焊接面的长度。
在一些示例中，沿连接器公头100的宽度方向，第一公头引脚1042的焊接面的长度的取值范围为0.02mm～3.98mm。
在一些示例中，沿连接器公头100的宽度方向，第一公头引脚1042的焊接面的长度的取值范围为0.02mm～1.98mm。
例如，沿连接器公头100的宽度方向，第一公头引脚1042的焊接面的长度可以为0.02mm、1mm、1.98mm、2mm、3mm或3.98mm等。
在一些示例中，沿连接器公头100的宽度方向，第二公头引脚1052的焊接面的长度的取值范围为0.04mm～4mm。
在一些示例中，沿连接器公头100的宽度方向，第二公头引脚1052的焊接面的长度的取值范围为0.04mm～2mm。
例如，沿连接器公头100的宽度方向，第二公头引脚1052的焊接面的长度可以为0.04mm、0.1mm、1mm、2mm、2.5mm、5mm。
在一些示例中，沿连接器公头100的宽度方向，第二公头引脚1052的焊接面的长度与第一公头引脚1042的焊接面的长度的差值范围为0.02mm～3.98mm。
在一些示例中，沿连接器公头100的宽度方向，第二公头引脚1052的焊接面的长度与第一公头引脚1042的焊接面的长度的差值范围为0.02mm～1.98mm。
例如，沿连接器公头100的宽度方向，第二公头引脚1052的焊接面的长度与第一公头引脚1042的焊接面的长度的差值可以为0.02mm、0.1mm、1.0mm、1.98mm、3mm或3.98mm等。
在此基础上，沿连接器公头100的长度方向，第一公头引脚1042的焊接面的宽度与第二公头引脚1052的焊接面的宽度可以相同，也可以不相同。
在一些示例中，沿连接器公头100的长度方向，第一公头引脚1042的焊接面的宽度的取值范围为0.08mm～1.98mm。
在一些示例中，沿连接器公头100的长度方向，第一公头引脚1042的焊接面的宽度的取值范围为0.08mm～0.98mm。
例如，沿连接器公头100的长度方向，第一公头引脚1042的焊接面的宽度可以为0.08mm、0.98mm、1mm、1.98mm。
在一些示例中，沿连接器公头100的长度方向，第二公头引脚1052的焊接面的宽度的取值范围为0.1mm～2mm。
在一些示例中，沿连接器公头100的长度方向，第二公头引脚1052的焊接面的宽度的取值范围为0.1mm～1mm。
例如，沿连接器公头100的长度方向，第二公头引脚1052的焊接面的宽度可以为0.1mm、0.8mm、1mm、1.5mm或2mm。
在一些示例中，沿连接器公头100的长度方向，第二公头引脚1052的焊接面的宽度与第一公头引脚1042的焊接面的宽度的差值范围为0.02mm～1.92mm。
在一些示例中，沿连接器公头100的长度方向，第二公头引脚1052的焊接面的宽度与第一公头引脚1042的焊接面的宽度的差值范围为0.02mm～0.92mm。
例如，沿连接器公头100的长度方向，第二公头引脚1052的焊接面的宽度与第一公头引脚1042的焊接面的宽度的差值可以为0.02mm、0.92mm、1mm、1.5mm或1.92mm。
需要说明的是，为了在外观检测时，能够检测到第一公头引脚1042、第二公头引脚1052分别和第一电子器件20的焊接情况，因而所有的第一公头引脚1042、第二公头引脚1052都应该能够被看到。当沿连接器公头100的宽度方向，第一公头引脚1042的焊接面的长度较小时，为了确保第一公头引脚1042能够被看到，因此公头壳体101中位于第一公头引脚1042处的部分可以同步跟第一公头引脚1042内缩，以保证所有的第一公头引脚1042和第二公头引脚1052都能被看到，方便焊接后进行质量检查。
基于上述，在本实施例中，与连接器公头100电连接的第一电子器件20为电路板，为了便于与本申请实施例中的其它电路板区分开，以下称为第一电路板。该第一电路板可以是PCB，也可以是FPC。
如图8所示，第一电路板300包括依次层叠设置的信号端子层、参考地层(也可以称为GND层)和信号线层。为了将第一电路板300中的信号端子层、参考地层和信号线层与本申请实施例的其它电路板中的信号端子层、参考地层和信号线层区分开，以下将第一电路板300中的信号端子层称为第一信号端子层301，将第一电路板300中的参考地层称为第一参考地层302，将第一电路板300中的信号线层称为第一信号线层303。其中，第一参考地层302覆盖第一信号端子层301，由于第一参考地层302覆盖第一信号端子层301，因而可以避免第一信号端子层301和第一信号线层303相互干扰。第一信号端子层301包括多个焊盘(pad)。
应当理解到，为了将第一信号端子层301和第一参考地层302间隔开，第一电路板300还包括设置在第一信号端子层301和第一参考地层302之间的第一绝缘层。同理，为了将第一参考地层302和第一信号线层303间隔开，第一电路板300还包括设置在第一参考地层302和第一信号线层303之间的第二绝缘层。图8中未示意出第一绝缘层和第二绝缘层。
可以理解的是，第一电路板300上的焊盘尺寸在设计时，是根据焊接在其上的引脚的尺寸来设计的。由于上述的连接器公头100安装在第一电路板300上时，连接器公头100的第一公头引脚1042的焊接面和第二公头引脚1052的焊接面均焊接在第一电路板300的焊盘的焊接面上，以实现连接器公头100和第一电路板300的电连接。而本实施例中的连接器公头100包括第一公头引脚1042和第二公头引脚1052，第一公头引脚1042的焊接面的面积小于第二公头引脚1052的焊接面的面积，因而本实施例中的第一信号端子层301包括第一焊盘和第二焊盘，为了将与连接器公头100电连接的第一电路板300中的第一焊盘和第二焊盘，和下述与连接器母座200电连接的第四电路板中的第一焊盘和第二焊盘区分开，以下将与连接器公头100电连接的第一电路板300中的第一焊盘称为第一公头焊盘3011，将与连接器公头100电连接的第一电路板300中的第二焊盘称为第二公头焊盘3012。其中，第一公头焊盘3011的焊接面的面积小于第二公头焊盘3012的焊接面的面积。
在一些示例中，第一公头焊盘3011的焊接面的面积的取值范围为0.0055mm 2～23.8004mm 2。
在一些示例中，第一公头焊盘3011的焊接面的面积的取值范围为0.0055mm 2～11.8604mm 2。
例如，第一公头焊盘3011的焊接面的面积可以为0.0055mm 2、1.0mm 2、5.0mm 2、11.8604mm 2、15mm 2、20mm 2、23.8004mm 2。
在一些示例中，第二公头焊盘3012的焊接面的面积的取值范围为0.0091mm 2～24mm 2。在一些示例中，第二公头焊盘3012的焊接面的面积的取值范围为0.0091mm 2～12mm 2。
例如，第二公头焊盘3012的焊接面的面积可以为0.0091mm 2、1.0mm 2、5.0mm 2、12mm 2、20mm 2、24mm 2。
在一些示例中，第二公头焊盘3012的焊接面的面积与第一公头焊盘3011的焊接面的面积的差值范围为0.0036mm 2～23.9945mm 2。
在一些示例中，第二公头焊盘3012的焊接面的面积与第一公头焊盘3011的焊接面的面积的差值范围为0.0036mm 2～11.9945mm 2。
应当理解到，第一公头引脚1042的焊接面、第一公头焊盘3011的焊接面均与第一参考地层302平行。
当第一电子器件20为第一电路板300，连接器公头100安装于第一电子器件20上时，上述连接器公头100的第一公头引脚1042的焊接面焊接于第一电路板300的第一公头焊盘3011的焊接面上，连接器公头100的第二公头引脚1052的焊接面焊接于第一电路板300的第二公头焊盘3012的焊接面上，以实现连接器公头100与第一电路板300的电连接。
在第一公头焊盘3011的焊接面的面积小于第二公头焊盘3012的焊接面的面积的情况下，在一些示例中，第一公头焊盘3011和第二公头焊盘3012沿第一方向排列；沿垂直于第一方向的方向，第一公头焊盘3011的焊接面的长度小于第二公头焊盘3012的焊接面的长度。
在一些示例中，沿垂直于第一方向的方向，第一公头焊盘3011的焊接面的长度的取值范围为0.05mm～5.98mm。
在一些示例中，沿垂直于第一方向的方向，第一公头焊盘3011的焊接面的长度的取值范围为0.05mm～3.98mm。
例如，沿垂直于第一方向的方向，第一公头焊盘3011的焊接面的长度可以为0.05mm、1mm、1.5mm、3mm、3.98mm或5.98mm。
在一些示例中，沿垂直于第一方向的方向，第二公头焊盘3012的焊接面的长度的取值范围为0.07mm～6mm。
在一些示例中，沿垂直于第一方向的方向，第二公头焊盘3012的焊接面的长度的取值范围为0.07mm～4mm。
例如，沿垂直于第一方向的方向，第二公头焊盘3012的焊接面的长度可以为0.07mm、1mm、2mm、4mm或6mm。
在一些示例中，沿垂直于第一方向的方向，第二公头焊盘3012的焊接面的长度与第一公头焊盘3011的焊接面的长度的差值范围为0.02mm～5.95mm。
在一些示例中，沿垂直于第一方向的方向，第二公头焊盘3012的焊接面的长度与第一公头焊盘3011的焊接面的长度的差值范围为0.02mm～3.95mm。
例如，沿垂直于第一方向的方向，第二公头焊盘3012的焊接面的长度与第一公头焊盘3011的焊接面的长度的差值可以为0.02mm、1mm、2mm、3.95mm、5mm或5.95mm。
在此基础上，沿第一方向，第一公头焊盘3011的焊接面的宽度和第二公头焊盘3012的焊接面的宽度可以相同，也可以不相同。
在一些示例中，沿第一方向，第一公头焊盘3011的焊接面的宽度的取值范围为0.11mm～3.98mm。
在一些示例中，沿第一方向，第一公头焊盘3011的焊接面的宽度的取值范围为 0.11mm～2.98mm。
例如，沿第一方向，第一公头焊盘3011的焊接面的宽度可以为0.11mm、2mm、2.98mm、3mm或3.98mm。
在一些示例中，沿第一方向，第二公头焊盘3012的焊接面的宽度的取值范围为0.13mm～4mm。
在一些示例中，沿第一方向，第二公头焊盘3012的焊接面的宽度的取值范围为0.13mm～3mm。
例如，沿第一方向，第二公头焊盘3012的焊接面的宽度可以为0.13mm、1mm、3mm或4mm。
在一些示例中，沿第一方向，第二公头焊盘3012的焊接面的宽度与第一公头焊盘3011的焊接面的宽度的差值范围为0.02mm～3.89mm。
在一些示例中，沿第一方向，第二公头焊盘3012的焊接面的宽度与第一公头焊盘3011的焊接面的宽度的差值范围为0.02mm～2.89mm。
例如，沿第一方向，第二公头焊盘3012的焊接面的宽度与第一公头焊盘3011的焊接面的宽度的差值可以为0.02mm、1mm、1.5mm、2mm、2.89mm或3.89mm等。
应当理解到，电路板例如PCB或FPC通常都是由多层膜层构成，膜层厚度很薄，且电路板的走线密度很高，因此电路板的走线的特征阻抗一般都比较大。而连接器10的特征阻抗一般都比较小，即连接器10中的连接器公头100和连接器母座200的特征阻抗一般都比较小。当连接器公头100与第一电路板300电连接时，若连接器公头100的特征阻抗和第一电路板300的走线的特征阻抗不匹配(一般地，连接器公头100的特征阻抗小于第一电路板300的走线的特征阻抗)，则连接器公头100与第一电路板300之间的信号在传输时会存在反射，从而会导致SI差的问题。
根据特征阻抗计算公式
Figure PCTCN2022083211-appb-000001
其中，Z为特征阻抗，L为寄生电感，C为寄生电容可知，连接器公头100的特征阻抗Z和连接器公头100与第一电路板300之间的寄生电容有关，连接器公头100与第一电路板300之间的寄生电容越小，连接器公头100的特征阻抗越大。
基于上述第一电路板300的结构可知，参考图9a和图9b，第一电路板300的焊盘，即第一公头焊盘3011和第二公头焊盘3012与第一电路板300的第一参考地层302之间会产生寄生电容。由于连接器公头100与第一电路板300电连接时，连接器公头100的第一公头引脚1042的焊接面焊接于第一公头焊盘3011的焊接面上，第二公头引脚1052的焊接面焊接于第二公头焊盘3012的焊接面上，因而连接器公头100与第一电路板300之间的寄生电容，即第一电路板300的第一公头焊盘3011和第二公头焊盘3012与第一参考地层302之间的寄生电容。图9a中d表示第一公头焊盘3011或第二公头焊盘3012与第一参考地层302之间的距离。图9b中L表示沿垂直于第一方向的方向，第一公头焊盘3011的焊接面的长度，W表示沿第一方向，第一 公头焊盘3011的焊接面的宽度，或者，L表示沿垂直于第一方向的方向，第二公头焊盘3012的焊接面的长度，W表示沿第一方向，第二公头焊盘3012的焊接面的宽度。
在本实施例中，当连接器公头100安装于第一电路板300上时，由于连接器公头100的第一公头引脚1042的焊接面的面积小于第二公头引脚1052的焊接面的面积，第一电路板300的第一公头焊盘3011的焊接面的面积小于第二公头焊盘3012，且第一公头引脚1042的焊接面焊接于第一公头焊盘3011的焊接面上，第二公头引脚1052的焊接面焊接于第二公头焊盘3012的焊接面上，因此第一公头引脚1042、第一公头焊盘3011与第一电路板300的第一参考地层302之间的相对面积小于第二公头引脚1052、第二公头焊盘3012与第一电路板300的第一参考地层302之间的相对面积，根据电容公式
Figure PCTCN2022083211-appb-000002
其中，C为电容，ε为介电常数，S为两个电极板之间正对的面积，d为两个电极板之间的距离可知，第一公头引脚1042、第一公头焊盘3011与第一电路板300的第一参考地层302之间的寄生电容相对于第二公头引脚1052、第二公头焊盘3012与第一电路板300的第一参考地层302之间的寄生电容会减小，因此根据特征阻抗计算公式可知第一公头引脚1042所在位置处的连接器公头100的特征阻抗会增加，这样一来，可以改善第一公头引脚1042所在位置处的连接器公头100的特征阻抗和第一电路板300的走线的特征阻抗不匹配的问题，减小第一公头引脚1042上的信号在连接器公头100和第一电路板300之间传输时存在的反射，提高SI。
在此基础上，本实施例中，在增加第一公头引脚1042所在位置处的连接器公头100的特征阻抗的同时，由于第二公头引脚1052和第二公头焊盘3012的焊接面的面积较大，因而可以利用第二公头引脚1052的焊接面焊接于第二公头焊盘3012的焊接面上，以使得连接器公头100和第一电路板300之间有较大的焊接力，从而确保了连接器公头100和第一电路板300之间牢固连接。
需要说明的是，若连接器公头100和第一电路板300的结合力不够，则还可以通过增大第二公头引脚1052的焊接面的长度和/或宽度的方式，确保连接器公头100的公头引脚105和第一电路板300之间的焊接力满足需求。
应当理解到，由于连接器公头100包括沿其长度方向排列的多个第一公头接触端子1041和多个第二公头接触端子1051，因而相邻的两个公头接触端子(这两个公头接触端子可以是两个第一公头接触端子1041，也可以是两个第二公头接触端子1051，当然还可以是一个第一公头接触端子1041和一个第二公头接触端子1051)之间也会产生寄生电容，该寄生电容也会影响连接器公头100的特征阻抗。由于连接器公头100在与连接器母座200在扣插连接时，第一公头接触端子1041和第二公头接触端子1051均要与连接器母座200接触，如果将所有的第一公头接触端子1041和所 有的第二公头接触端子1051均沿连接器公头100宽度方向的截面的面积都减小，那么连接器公头100在与连接器母座200在扣插连接时会出现扣插拔力不够的情况，从而会影响连接器公头100和连接器母座200扣合的可靠性。
基于此，本实施例可以将部分公头接触端子沿连接器公头100宽度方向的截面的面积减小，这样既可以减小相邻的两个公头接触端子之间的寄生电容，又可以保证连接器公头100和连接器母座200之间的扣合可靠性。
在一些示例中，上述第一公头接触端子1041沿连接器公头100的宽度方向的截面的面积小于第二公头接触端子1051沿连接器公头100的宽度方向的截面的面积。
由于第一公头接触端子1041沿连接器公头100的宽度方向的截面的面积小于第二公头接触端子1051沿连接器公头100的宽度方向的截面的面积，因而第一公头接触端子1041和与其相邻的第二公头接触端子1051之间的寄生电容较小，因此第一公头接触端子1041所在位置处的特征阻抗较大，这样一来，可以改善第一公头接触端子1041所在位置处的连接器公头100的特征阻抗和第一电路板300的走线的特征阻抗不匹配的问题，减小第一公头接触端子1041上的信号在连接器公头100和第一电路板300之间传输时存在的反射，提高SI。由于第一公头引脚1042与第一公头接触端子1041电连接，因而也可以进一步减小第一公头引脚1042上的信号在连接器公头100和第一电路板300之间传输时存在的反射。
图7b为本申请实施例提供的一种第一公头接触件104的结构示意图，第一公头接触件104包括第一公头接触端子1041和第一公头引脚1042。在图7a提供的公头接触件102为第二公头接触件105，第二公头接触件105包括第二公头接触端子1051和第二公头引脚1052的情况下，对比图7a和图7b可知，第一公头接触端子1041相对于第二公头接触端子1051减少了一部分，从而可以使得第一公头接触端子1041沿连接器公头100的宽度方向的截面的面积小于第二公头接触端子1051沿连接器公头100的宽度方向的截面的面积。
考虑到连接器公头100和第一电路板300之间传输的信号完整性主要与高速信号有关，基于此，在一些示例中，第一公头引脚1042为高速信号(high-speed signal，HS signal)引脚，第二公头引脚1052为非高速信号引脚。
此处，非高速信号引脚例如可以为低速信号引脚、电源引脚或接地引脚。其中，低速信号引脚例如可以为控制信号引脚或低速时钟信号引脚。
应当理解到，由于第一公头引脚1042与第一公头接触端子1041电连接，第一公头引脚1042的焊接面焊接于第一公头焊盘3011的焊接面上，因而当第一公头引脚1042为高速信号引脚时，第一公头接触端子1041和第一公头焊盘3011上传输的均是高速信号。同样的，由于第二公头引脚1052与第二公头接触端子1051电连接，第二公头引脚1052的焊接面焊接于第二公头焊盘3012的焊接面上，因而当第二公头引脚1052为非高速信号引脚时，第二公头接触端子1051和第二公头焊盘3012上传输的均是非高速信号。
由于第一公头引脚1042为高速信号引脚，第二公头引脚1052为非高速信号引脚，因而可以减小高速信号在连接器公头100和第一电路板300之间传输时存在的反射，而信号完整性主要取决于高速信号，这样一来，可以进一步提高SI。
图10示出了安装在第二电子器件30上的连接器母座200的立体图，图10中的第二电子器件30是以电路板为例进行的示意。参考图10，连接器母座200具有直平行六面体轮廓。此外，将直平行六面体连接器母座200延伸的方向称为“长度方向”(即图10中的Y方向)，将平行于第二电子器件30的平面且垂直于“长度方向”的方向称为“宽度方向”(即图10中的X方向)，将与第二电子器件30的平面垂直的方向称为“高度方向”(即图10中的Z方向)。在本申请中，对于连接器母座200，可以将连接器母座200安装在第二电子器件30上的一侧称为“安装侧”或“下侧”，与连接器公头100配合的一侧称为“配合侧”或“上侧”。
图11示出了从安装侧看到的连接器母座200的结构图。图12示出了连接器母座200的爆炸图，图12为从安装侧看到的连接器母座200的爆炸图。如图12所示，连接器母座200包括壳体(为了和上述连接器公头100中的壳体区分，以下将连接器母座200的壳体称为母座壳体201)、多个母座接触件202、一对母座固定脚(也可以称为母座盔甲)203和一对母座中岛204。其中，如图11和图12所示，多个母座接触件202的尺寸相同。
此处，母座固定脚203例如可以用于传输电源信号或地信号。在制作连接器母座200时，可以在母座接触件202、母座固定脚203和母座中岛204上通过注塑方式形成母座壳体201。
如图13所示，每个母座接触件202包括母座接触端子205和与母座接触端子205电连接的母座引脚206。其中，母座接触端子205和与母座接触端子205电连接的母座引脚206一体成型。
上述母座接触件202中的母座接触端子205用于和上述第一公头接触件104中的第一公头接触端子1041以及第二公头接触件105中的第二公头接触端子1051扣插连接，母座接触件202中的母座引脚206用于和第二电子器件30电连接，以确保连接器母座200与第二电子器件30的电连接。此处，母座引脚206和第二电子器件30可以通过焊接的方式电连接在一起。
在此基础上，在连接器母座200安装于第二电子器件30上时，母座固定脚203和母座中岛204焊接在第二电子器件30上，这样可以进一步加固连接器母座200与第二电子器件30之间的电连接。
此外，由于母座接触件202包括母座接触端子205和与母座接触端子205电连接的母座引脚206，因而母座接触件202、母座接触端子205和母座引脚206的数量以及排布方式是完全相同的。以母座接触件202为例说明母座接触件202、母座接触端子205和母座引脚206的排布方式，多个母座接触件202可以沿连接器母座200的长度方向，依次设置在连接器母座200的一侧；多个母座接触件202也可以沿连接器母座200的长度方向，依次设置在连接器母座200的相对两侧。
需要说明的是，为了在外观检测时，能够检测到母座引脚206与第二电子器件30的焊接情况，因而所有的母座引脚206应该能够被看到，方便焊接后进行质量检查。
在本实施例中，由于连接器母座200和连接器公头100扣插连接，而连接器公头100的公头接触件102包括第一公头接触件104和第二公头接触件105，第一公头接 触件104包括第一公头接触端子1041和第一公头引脚1042，第二公头接触件105包括第二公头接触端子1051和第二公头引脚1052，为了便于说明，因而可以根据连接器公头100中的第一公头接触件104和第二公头接触件105，将连接器母座200中的多个母座接触件202划分为第一接触件和第二接触件，为了和连接器公头100中的第一接触件和第二接触件区分开，将连接器母座200中的第一接触件称为第一母座接触件，将连接器母座200中的第二接触件称为第二母座接触件。第一母座接触件与第一公头接触件104电连接，第二母座接触件与第二公头接触件105电连接。第一母座接触件包括第一接触端子和与第一接触端子电连接的第一引脚，第二母座接触件包括第二接触端子和与第二接触端子电连接的第二引脚。为了将连接器母座200中的第一引脚和第二引脚与上述连接器公头100中的第一引脚和第二引脚区分开，以下将连接器母座200中的第一引脚称为第一母座引脚，将连接器母座200中的第二引脚称为第二母座引脚。为了将连接器母座200中的第一接触端子和第二接触端子与上述连接器公头100中的第一接触端子和第二接触端子区分开，以下将连接器母座200中的第一接触端子称为第一母座接触端子，将连接器母座200中的第二接触端子称为第二母座接触端子。其中，连接器母座200中的第一母座引脚和第一母座接触端子一体成型，第二母座引脚和第二母座接触端子一体成型。连接器母座200中的第一母座接触端子与连接器公头100中的第一公头接触端子1041扣插连接，连接器母座200中的第二母座接触端子与连接器公头100中的第二公头接触端子1051扣插连接，从而实现连接器母座200和连接器公头100的扣插连接。
在本实施例中，由于多个母座接触件202的尺寸相同，因而连接器母座200中的多个母座接触端子205的尺寸相同，即连接器母座200中的第一母座接触端子和第二母座接触端子的尺寸相同。连接器母座200中的多个母座引脚206的尺寸相同，即连接器母座200中的第一母座引脚和第二母座引脚的尺寸相同。
在一些示例中，母座引脚206的焊接面的面积的取值范围与上述第二公头引脚1052的焊接面的面积的取值范围相同，可以参考上述，此处不再赘述。
在一些示例中，沿连接器母座200的宽度方向，母座引脚206的焊接面的长度的取值范围与沿连接器公头100的宽度方向，上述第二公头引脚1052的焊接面的长度的取值范围相同，可以参考上述，此处不再赘述。
在一些示例中，沿连接器母座200的长度方向，母座引脚206的焊接面的宽度的取值范围与沿沿连接器公头100的长度方向，上述第二公头引脚1052的焊接面的宽度的取值范围相同，可以参考上述，此处不再赘述。
基于上述的连接关系，对于连接器母座200中的第一母座接触端子、第二母座接触端子的排布方式、以及连接器母座200中的第一母座引脚和第二母座引脚的排布方式，均与连接器公头100中第一公头引脚1042和第二公头引脚1052的排布方式相同，具体可以参考上述连接器公头100中第一公头引脚1042和第二公头引脚1052的排布方式，此处不再赘述。
基于上述的连接器母座200，在本实施例中，与连接器母座200电连接的第二电子器件30可以为电路板，例如PCB或FPC；也可以为线缆。
以下以与连接器母座200电连接的第二电子器件30为电路板为例，对第二电子 器件30进行示例性介绍，为了便于与本申请实施例中的其它电路板区分开，以下称为第二电路板。
如图14所示，第二电路板400包括依次层叠设置的信号端子层、参考地层和信号线层。为了将第二电路板400中的信号端子层、参考地层和信号线层与本申请实施例的其它电路板中的信号端子层、参考地层和信号线层区分开，以下将第二电路板400中的信号端子层称为第二信号端子层401，将第二电路板400中的参考地层称为第二参考地层402，将第二电路板400中的信号线层称为第二信号线层403。其中，第二参考地层402覆盖第二信号端子层401，由于第二参考地层402覆盖第二信号端子层401，因而可以避免第二信号端子层401和第二信号线层403相互干扰。第二信号端子层401包括多个第三焊盘4011，且多个第三焊盘4011的尺寸相同。
应当理解到，为了将第二信号端子层401和第二参考地层402间隔开，第一电路板400还包括设置在第二信号端子层401和第二参考地层402之间的第三绝缘层。同理，为了将第二参考地层402和第二信号线层403间隔开，第一电路板400还包括设置在第二参考地层402和第二信号线层403之间的第四绝缘层。图14中未示意出第三绝缘层和第四绝缘层。
由于第二电路板400的焊盘尺寸在设计时，是根据焊接在其上的引脚的尺寸来设计的，而本实施例中，连接器母座200上的多个母座引脚206的尺寸相同，因而第二电路板400上的多个第三焊盘4011的尺寸相同。
在一些示例中，第三焊盘4011的焊接面的面积的取值范围与上述第二公头焊盘3012的焊接面的面积的取值范围相同，可以参考上述，此处不再赘述。
在一些示例中，沿垂直于多个第三焊盘4011的排列方向的方向，第三焊盘4011的焊接面的长度的取值范围与沿垂直于第一方向的方向，第二公头焊盘3012的焊接面的长度的取值范围相同，可以参考上述，此处不再赘述。
在一些示例中，沿多个第三焊盘4011的排列方向的方向，第三焊盘4011的焊接面的宽度的取值范围与沿第一方向的方向，第二公头焊盘3012的焊接面的宽度的取值范围相同，可以参考上述，此处不再赘述。
当第二电子器件30为电路板，连接器母座200安装于第二电子器件30上时，连接器母座200的母座引脚206的焊接面焊接于第二电路板400的第三焊盘4011的焊接面上，从而实现连接器母座200与第二电路板400的电连接。
在此基础上，上述的连接器公头100和上述的连接器母座200之间通过连接器公头100的第一公头接触端子1041、第二公头接触端子1051和连接器母座200的母座接触端子205的扣插连接在一起时，示例性地可以有以下两种实现方式。
第一种：如图15a所示，连接器10中的连接器公头100的第一公头接触端子1041和第二公头接触端子1051均与连接器母座200的母座接触端子205通过多个接触点，例如两个接触点(接触点A和接触点B)扣插连接，即，连接器公头100的第一公头接触端子1041和连接器母座200的第一母座接触端子2051通过多个接触点，例如两个接触点扣插连接，连接器公头100的第二公头接触端子1051和连接器母座200的第二母座接触端子2052通过多个接触点，例如两个接触点扣插连接。
需要说明的是，图15a中的连接器10、连接器公头100、连接器母座200均是沿 连接器10宽度方向的截面示意图。
第二种：如图15b所示，连接器10中的连接器公头100的第一公头接触端子1041与连接器母座200的第一母座接触端子2051通过一个接触点A扣插连接，连接器公头100的第二公头接触端子1051与连接器母座200的第二母座接触端子2052通过多个接触点，例如两个接触点(接触点A和接触点B)扣插连接。
需要说明的是，图15b中的连接器10、连接器公头100、连接器母座200均是沿连接器10宽度方向的截面示意图。
应当理解到，当连接器公头100和连接器母座200之间采用第二种方式扣插连接时，在一些示例中，如图15b所示，对于连接器公头100，第一公头接触端子1041沿连接器公头100宽度方向的截面的面积小于第二公头接触端子1051沿连接器公头100宽度方向的截面的面积。
当连接器公头100和连接器母座200之间采用第二种方式扣插连接时，由于连接器公头100的第一公头接触端子1041与连接器母座200的第一母座接触端子2051通过一个接触点A扣插连接，因而可以减小连接器公头100的第一公头接触端子1041和连接器母座200的第一母座接触端子2051上传输的信号反射，进一步提高SI。在第一公头接触端子1041和第一母座接触端子2051上传输的信号为高速信号时，可以提高高速信号的SI。
在此基础上，由于连接器公头100的第二公头接触端子1051与连接器母座200的第二母座接触端子2052通过多个接触点扣插连接，因而可以确保连接器公头100与连接器母座200之间的扣插拔力，保证了扣插的可靠性。
基于上述，在连接器10中的连接器公头100的第一公头接触端子1041与连接器母座200的第一母座接触端子2051通过一个接触点A扣插连接的情况下，在一些示例中，如图15b所示，连接器公头100还包括辅助接触端子106；辅助接触端子106的材料为非导电材料；连接器公头100的第一公头接触端子1041与连接器母座200的第一母座接触端子2051还通过辅助接触端子106扣插连接。
此处，非导电材料例如可以为塑料、橡胶等。
由于在连接器10中的连接器公头100的第一公头接触端子1041与连接器母座200的第一母座接触端子2051通过一个接触点A扣插连接时，连接器公头100还包括辅助接触端子106，连接器公头100的第一公头接触端子1041与连接器母座200的第一母座接触端子2051还通过辅助接触端子106扣插连接，因而可以增加连接器公头100和连接器母座200的扣插拔力，这样一来，便可以进一步确保连接器公头100和连接器母座200的扣合可靠性。
相关技术中，连接器10包括连接器公头100和连接器母座200，图16为相关技术提供的从安装侧看到的连接器公头100的结构图。参考图16，相关技术提供的连接器10中连接器公头100的主要结构包括公头壳体101、多个公头接触件102以及一对公头固定脚103。其中，公头接触件102包括公头接触端子102a和与公头接触端子102a电连接的公头引脚102b；多个公头接触件102的尺寸相同，即多个公头接触端子102a的尺寸相同，多个公头引脚102b的尺寸相同。
相关技术中，在与连接器公头100电连接的第一电子器件20为电路板的情况 下，与连接器公头100电连接的电路板的结构与上述第二电路板400的结构相同，可以参考图14以及上述对第二电路板400的描述，此处不再赘述。
在此基础上，在与连接器公头100电连接的第一电子器件20为电路板的情况下，连接器公头100中的多个公头引脚102b与电路板的多个焊盘一一对应连接。
相关技术提供的连接器母座200的结构与实施例一提供的连接器母座200的结构相同，相关技术提供的连接器母座200的结构可以参考上述描述以及图11和图12，此处不再赘述。此外，在相关技术中，在与连接器母座200电连接的第二电子器件30为电路板的情况下，与连接器母座200电连接的电路板的结构与上述第二电路板400的结构相同，可以参考图14以及上述对第二电路板400的描述，此处不再赘述。
另外，相关技术提供的连接器10中连接器公头100和连接器母座200扣插连接时的结构如图17所示。参考图17，连接器公头100的公头接触端子102a和连接器母座200中的母座接触端子205均通过两个接触点(例如图17中的接触点A和接触点B)电连接。
基于上述对相关技术的描述可知，由于在相关技术中，连接器公头100中的多个公头引脚102b的尺寸相同，电路板中与连接器公头100中的多个公头引脚102b一一对应电连接的焊盘的尺寸相同，因此相关技术中，公头引脚102b、焊盘与参考地层之间的相对面积较大，从而导致连接器公头100和电路板之间的寄生电容较大，进而导致连接器公头100的特征阻抗较小，这样一来，连接器公头100的特征阻抗和与其电连接的电路板的走线的特征阻抗会出现不匹配的问题，从而会导致信号在传输过程中出现反射，带来SI差的问题。同样的，在相关技术中，连接器母座200中多个母座引脚206的尺寸相同，电路板中与连接器母座200中多个母座引脚206一一对应电连接的焊盘的尺寸相同，因此相关技术中，母座引脚206、焊盘与参考地层之间的相对面积较大，从而导致连接器母座200和电路板之间的寄生电容较大，进而导致连接器母座200的特征阻抗较小，这样一来，连接器母座200的特征阻抗和与其电连接的电路板的走线的特征阻抗会出现不匹配的问题，从而会导致信号在传输过程中出现反射，带来SI差的问题。基于此，连接器10的特征阻抗和与其电连接的两个电路板的走线的特征阻抗会出现不匹配的问题，从而会导致信号在传输过程中出现反射，带来SI差的问题。
由于电路板的布线比较复杂，因而电路板在设计完成后，电路板的走线的特征阻抗不易调整。为了使连接器10的特征阻抗与电路板的走线的特征阻抗匹配，因而可以通过调整连接器10的特征阻抗，以使连接器10的特征阻抗与电路板的走线的特征阻抗匹配，从而降低信号传输时存在的反射，改善SI差的问题。根据上述特征阻抗计算公式可知，特征阻抗可以通过寄生电容调整，而根据上述电容计算公式可知，可以通过调整ε、S和d来改变电容的大小。
以连接器公头100和与其电连接的电路板为例，若采用改变上述d的方式来改变电容的大小，则需要对电路板中的参考地层做挖空处理。示例的，图18为与连接器公头100电连接的电路板，为了便于与本申请实施例中的其它电路板区分开，以下称为第三电路板500。参考图18，第三电路板500包括依次层叠设置的信号端子层、 参考地层和信号线层。为了将第三电路板500中的信号端子层、参考地层和信号线层与本申请实施例的其它电路板中的信号端子层、参考地层和信号线层区分开，以下将第三电路板500中的信号端子层称为第三信号端子层501，将第三电路板500中的参考地层称为第三参考地层502，将第三电路板500中的信号线层称为第三信号线层503。其中，第三信号端子层501包括多个第四焊盘5011，多个第四焊盘5011的尺寸相同。对第三参考地层502做挖空处理后，如图18所示，第三参考地层502包括镂空区5021，镂空区5021覆盖第三信号端子层501中的部分第四焊盘5011，为了便于说明，被镂空区5021覆盖的第四焊盘5011用第四焊盘5011a表示。当连接器公头100的公头引脚105的焊接面焊接于第三电路板500的第四焊盘5011的焊接面上时，由于第四焊盘5011a正对第三参考地层502的部分是镂空的，因此公头引脚102b和第四焊盘5011a不会与第三参考地层502产生寄生电容，而是与第三参考地层502下方的第三信号线层503产生寄生电容。而由于第四焊盘5011a与第三信号线层503之间的间距大于第四焊盘5011a与第三参考地层502之间的间距，因此第四焊盘5011a与第三信号线层503之间的寄生电容小于第四焊盘5011a与第三参考地层502之间的寄生电容。基于此，通过对电路板中的参考地层做挖空处理，也可以减小连接器公头100与电路板之间的寄生电容，以提高连接器公头100的特征阻抗。
然而，对参考地层做挖空处理后，由于第三信号线层503中与第三参考地层502的镂空区5021正对的部分没有第三参考地层502的屏蔽，因而第三信号线层503上的信号可能会辐射，这样会带来干扰问题。而如果在第三参考地层502的镂空区5021覆盖的区域内不布线，则需要占用其它区域布线，从而导致板级布线空间降低，影响出线，增加了制作电路板的成本。
而在本实施例一中，是通过改变S的方式改变连接器公头100与第一电路板300之间的寄生电容，即由于减小了连接器公头100中第一公头引脚1042的焊接面的面积，且减小了第一电路板300中与连接器公头100的第一公头引脚1042电连接的第一公头焊盘3011的焊接面的面积，因而连接器公头100与第一电路板300电连接时，第一公头引脚1042所在位置处的连接器公头100与第一电路板300之间的寄生电容会减小，从而可以增加第一公头引脚1042所在位置处的连接器公头100的特征阻抗，以使第一公头引脚1042所在位置处的连接器公头100的特征阻抗与第一电路板300的走线的特征阻抗匹配，进而减小第一公头引脚1042上的信号在连接器公头100和第一电路板300之间传输时存在的反射，提高SI。相对于上述通过改变d的方式，改变连接器公头100与第一电路板300之间的寄生电容，本实施例一通过改变S的方式改变第一公头引脚1042所在位置处的连接器公头100与第一电路板300之间的寄生电容，不会导致信号的辐射，也不会增加成本。
在本实施例一中，还可以通过调整第一电路板300中第一信号端子层301和第一参考地层302之间的第一绝缘层的材料来调整ε，以改变连接器公头100与第一电路板300之间的寄生电容的大小。在一些示例中，为了使连接器公头100与第一电路板300之间的寄生电容较小，选取的第一绝缘层的材料应具有低的介电常数。
在此基础上，还可以通过调整相邻两个公头接触端子之间的材料来调整ε，以改变相邻的两个公头接触端子之间的寄生电容，由于公头接触件102安装在公头壳体 101上，即还可以通过调整公头壳体101的材料还调整ε，以改变相邻的两个公头接触端子之间的寄生电容。在一些示例中，为了减小相邻的两个公头接触端子之间的寄生电容，选取的公头壳体101应具有低的介电常数。
以下提供一个具体的示例，对实施例一提供的连接器10和与其电连接的第一电子器件20、第二电子器件30以及相关技术提供的连接器10和与其电连接的第一电子器件20、第二电子器件30分别进行仿真，以检测并对比实施例一和相关技术提供的连接器10的特征阻抗和通过连接器10传输的信号质量。信号质量可以用插损和回损来表示，仿真结果如表1所示。
需要说明的是，仿真时实施例一提供的连接器10中的第一公头引脚1042为高速信号引脚。仿真时以第一电子器件20为PCB，第二电子器件30为FPC为例。
仿真使用的PCB的结构主要包括依次层叠的第一覆盖层(cover lay)、第一铜箔(copper)层、聚丙烯(polypropylene，PP)层、第二铜箔层和第二覆盖层。其中，第一覆盖层的厚度为25μm，第一铜箔层的厚度为20μm，聚丙烯层的厚度为76μm，第二铜箔层的厚度为15μm，第二覆盖层的厚度为25μm。聚丙烯层的介电常数DK为3.5，介质损耗角系数DF为0.02。其中，第一覆盖层和第二覆盖层用于起保护PCB的作用，第一铜箔层即信号端子层，第一铜箔层包括多个焊盘，第二铜箔层即参考地层。与实施例一提供的连接器10的连接器公头100电连接的PCB和与相关技术提供的连接器10的连接器公头100电连接的PCB的不同之处在于，与实施例一提供的连接器10的连接器公头100电连接的PCB的第一铜箔层和与相关技术提供的连接器10的连接器公头100电连接的PCB的第一铜箔层的结构不同，具体可以参考上述描述，其它层的结构均相同。
仿真时使用的FPC的结构主要包括依次层叠的第三覆盖层、第三铜箔层、聚酰亚胺(polyimide，PI)层、第四铜箔层和第四覆盖层。其中，第一覆盖层的厚度为20μm，第一铜箔层的厚度为12μm，聚酰亚胺层的厚度为50μm，第二铜箔层的厚度为12μm，第二覆盖层的厚度为20μm。聚酰亚胺层的介电常数DK为3.3，介质损耗角系数DF为0.02。其中，第三覆盖层和第四覆盖层用于其保护FPC的作用，第三铜箔层即信号端子层，第三铜箔层包括多个焊盘，第四铜箔层即参考地层。与实施例一提供的连接器10的连接器母座200电连接的FPC和与相关技术提供的连接器10的连接器母座200电连接的FPC结构完全相同。
此处，仿真使用的PCB走线的特征阻抗和FPC走线的特征阻抗为90Ω(欧姆)左右。
此外，在仿真过程中可以利用TDR(time domain reflectometry，时域反射计)法测量连接器10的特征阻抗。
另外，为了确保检测结果的准确性，表1分别在频率为5GHz和10GHz的情况下，检测插损和回损。
表1
Figure PCTCN2022083211-appb-000003
Figure PCTCN2022083211-appb-000004
对比表1中的数据可知，实施例一提供的连接器10相对于相关技术提供的连接器10，特征阻抗、插损、回损都有提高。其中，实施例一提供的连接器10相对于相关技术提供的连接器10，特征阻抗提高了7.3欧姆，在频率为5GHz时，插损提高了0.07，回损提高了-4.2，在频率为105GHz时，插损提高了0.17，回损提高了-6.6。通过对比可知，实施例一提供的连接器10相对于相关技术提供的连接器10，对高速信号的收益明显。
实施例二
实施例二和实施例一的区别之处在于，实施例二提供的连接器母座200以及与连接器母座200电连接在第二电子器件30的结构与实施例一提供的连接器母座200以及与连接器母座200电连接在第二电子器件30的结构不同。
实施例二提供的连接器公头100和与连接器公头100电连接的第一电子器件20的结构与实施例一提供的连接器公头100和与连接器公头100电连接的第一电子器件20的结构相同。其中，实施例二提供的连接器公头100包括公头壳体101、多个公头接触件102以及一对公头固定脚103。多个公头接触件102包括多个第一公头接触件104和多个第二公头接触件105，每个第一公头接触件104包括第一公头接触端子1041和与第一公头接触端子1041电连接的第一公头引脚1042，每个第二公头接触件105包括第二公头接触端子1051和与第二公头接触端子1051电连接的第二公头引脚1052。其中，第一公头引脚1042的焊接面的面积小于第二公头引脚1052的焊接面的面积。
实施例二提供的第一电子器件20为第一电路板300，第一电路板300包括依次层叠设置的第一信号端子层301、第一参考地层302和第一信号线层303。第一信号端子层301包括第一公头焊盘3011和第二公头焊盘3012；其中，第一公头焊盘3011的焊接面的面积小于第二公头焊盘3012的焊接面的面积。
需要说明的是，连接器公头100和第一电子器件20的连接关系，以及连接器公头100的具体结构的描述、第一电路板300的具体结构的描述均可以参考上述实施例一，此处不再赘述。
此外，由于实施例二提供的连接器公头100和与连接器公头100电连接的第一电子器件20的结构与实施例一提供的连接器公头100和与连接器公头100电连接的第一电子器件20的结构相同，因而实施例二提供的连接器公头100和第一电子器件20具有与实施例一提供的连接器公头100和第一电子器件20相同的技术效果，可以参考实施例一，此处不再赘述。
以下对实施例二提供的连接器母座200和与连接器母座200电连接的第二电子器件30的结构进行说明。
图19示出了安装在第二电子器件30上的连接器母座200的立体图，图19中是以第二电子器件30为电路板为例进行的示意。图20示出了从安装侧看到的连接器母座200的结构图。图21示出了连接器母座200的爆炸图，图21为从安装侧看到的连接器母座200的爆炸图。如图21所示，连接器母座200包括母座壳体201、多个母座接触件202、一对母座固定脚203和一对母座中岛204。
如图21所示，多个母座接触件202包括多个第一接触件和多个第二接触件。为了和连接器公头100中的第一接触件和第二接触件区分开，以下将连接器母座200中的第一接触件称为第一母座接触件207，将连接器母座200中的第二接触件称为第二母座接触件208。
实施例二中第一母座接触件207、第二母座接触件208的结构与实施例一中母座接触件202的结构类似，实施例二中第一母座接触件207、第二母座接触件208的结构可以参考图13。
参考图13，第一母座接触件207包括第一接触端子和与第一接触端子电连接的第一引脚，为了将连接器母座200中的第一接触端子和第一引脚与连接器公头100中的第一接触端子和第一引脚区分开，以下将第一母座接触件207中的第一接触端子称为第一母座接触端子2051，将第一母座接触件207中的第一引脚称为第一母座引脚2061。其中，第一母座接触端子2051和与第一母座接触端子2051电连接的第一母座引脚2061一体成型。每个第二母座接触件208包括第二接触端子和与第二接触端子电连接的第二引脚，为了将连接器母座200中的第二接触端子和第二引脚与连接器公头100中的第二接触端子和第二引脚区分开，以下将第二母座接触件208中的第二接触端子称为第二母座接触端子2052，将第二母座接触件208中的第二引脚称为第二母座引脚2062。其中，第二母座接触端子2052和与第二母座接触端子2052电连接的第二母座引脚2062一体成型。即，连接器母座200中的多个母座接触端子205包括多个第一母座接触端子2051和多个第二母座接触端子2052，连接器母座200中的多个母座引脚206包括多个第一母座引脚2061和多个第二母座引脚2062。
此处，第一母座引脚2061、第二母座引脚2062和第二电子器件30可以通过焊接的方式电连接在一起。
此外，第一母座接触端子2051、第二母座接触端子2052、第一母座引脚2061、第二母座引脚2062的作用以及母座固定脚203的作用均可以参考实施例一，此处不再赘述。
另外，由于第一母座接触件207包括第一母座接触端子2051和与第一母座接触端子2051电连接的第一母座引脚2061，第二母座接触件208包括第二母座接触端子2052和与第二母座接触端子2052电连接的第二母座引脚2062，因而第一母座接触件207、第一母座接触端子2051、第一母座引脚2061的数量以及排布方式是完全相同的，第二母座接触件208、第二母座接触端子2052、第二母座引脚2062的数量以及排布方式是完全相同的。以第一母座接触件207和第二母座接触件208为例说明第一母座接触件207、第一母座接触端子2051、第一母座引脚2061，以及第二母座接触 件208、第二母座接触端子2052、第二母座引脚2062的排布方式，多个第一母座接触件207和多个第二母座接触件208可以沿连接器母座200的长度方向(即图21中的Y方向)，依次设置在连接器母座200的一侧；多个第一母座接触件207和多个第二母座接触件208也可以沿连接器母座200的长度方向，依次设置在连接器母座200的相对两侧。
参考图20和图21，在本实施例中，第一母座引脚2061的焊接面的面积小于第二母座引脚2062的焊接面的面积。
需要说明的是，第一母座引脚2061的焊接面的面积的取值范围可以与上述第一公头引脚1042的焊接面的面积的取值范围相同，可以参考上述，此处不再赘述。
第二母座引脚2062的焊接面的面积的取值范围可以与上述第二公头引脚1052的焊接面的面积的取值范围相同，可以参考上述，此处不再赘述。
第二母座引脚2062的焊接面的面积与第一母座引脚2061的焊接面的面积的差值范围，可以和上述第二公头引脚1052的焊接面的面积与第一公头引脚1042的焊接面的面积的差值范围相同，可以参考上述，此处不再赘述。
在第一母座引脚2061的焊接面的面积小于第二母座引脚2062的焊接面的面积的情况下，在一些示例中，第一母座引脚2061和第二母座引脚2062沿连接器母座200的长度方向排列；沿连接器母座200的宽度方向，第一母座引脚2061的焊接面的长度小于第二母座引脚2062的焊接面的长度。
需要说明的是，沿连接器母座200的宽度方向，第一母座引脚2061的焊接面的长度的取值范围可以与沿连接器公头100的宽度方向，第一公头引脚1042的焊接面的长度的取值范围相同，可以参考上述，此处不再赘述。
沿连接器母座200的宽度方向，第二母座引脚2062的焊接面的长度的取值范围可以与沿连接器公头100的宽度方向，第二公头引脚1052的焊接面的长度的取值范围相同，可以参考上述，此处不再赘述。
沿连接器母座200的宽度方向，第二母座引脚2062的焊接面的长度与第一母座引脚2061的焊接面的长度的差值范围，可以和沿连接器公头100的宽度方向，第二公头引脚1052的焊接面的长度与第一公头引脚1042的焊接面的长度的差值范围相同，可以参考上述，此处不再赘述。
在此基础上，沿连接器母座200的长度方向，第一母座引脚2061的焊接面的宽度和第二母座引脚2062的焊接面的宽度可以相同，也可以不相同。
沿连接器母座200的长度方向，第一母座引脚2061的焊接面的宽度的取值范围可以与沿连接器公头100的长度方向，第一公头引脚1042的焊接面的宽度的取值范围相同，可以参考上述，此处不再赘述。
沿连接器母座200的长度方向，第二母座引脚2062的焊接面的宽度的取值范围可以与沿连接器公头100的长度方向，第二公头引脚1052的焊接面的宽度的取值范围相同，可以参考上述，此处不再赘述。
沿连接器母座200的长度方向，第二母座引脚2062的焊接面的宽度与第一母座引脚2061的焊接面的宽度的差值范围，可以和沿连接器公头100的宽度方向，第二公头引脚1052的焊接面的宽度与第一公头引脚1042的焊接面的宽度的差值范围相 同，可以参考上述，此处不再赘述。
需要说明的是，为了在外观检测时，能够检测到母座引脚206与第二电子器件30的焊接情况，因而所有的母座引脚206都应该能够被看到。由于连接器母座200的多个母座引脚206包括第一母座引脚2061和第二母座引脚2062，当沿连接器母座200的宽度方向，第一母座引脚2061的焊接面的长度较小时，为了确保第一母座引脚2061能够被看到，因此母座壳体201中位于第一母座引脚2061处的部分可以同步跟第一母座引脚2061内缩，以保证所有的第一母座引脚2061和第二母座引脚2062都能被看到，方便焊接后进行质量检查。
基于上述的连接关系，对于连接器母座200中的第一母座接触端子2051、第二母座接触端子2052的排布方式、以及连接器母座200中的第一母座引脚2061和第二母座引脚2062的排布方式，均与连接器公头100中第一公头引脚1042和第二公头引脚1052的排布方式相同，具体可以参考上述连接器公头100中第一公头引脚1042和第二公头引脚1052的排布方式，此处不再赘述。
基于上述的连接器母座200，在本实施例中，与连接器母座200电连接的第二电子器件30为电路板，为了便于与本申请实施例中的其它电路板区分开，以下称为第四电路板，该第四电路板例如可以为PCB或FPC。
此处，第四电路板的结构与第一电路板300的结构类似。如图8所示，第四电路板600包括依次层叠设置的信号端子层、参考地层和信号线层。为了将第四电路板600中的信号端子层、参考地层和信号线层与本申请实施例的其它电路板中的信号端子层、参考地层和信号线层区分开，以下将第四电路板600中的信号端子层称为第四信号端子层601，将第四电路板600中的参考地层称为第四参考地层602，将第四电路板600中的信号线层称为第四信号线层603。其中，第四参考地层602覆盖第四信号端子层601，由于第四参考地层602覆盖第四信号端子层601，因而可以避免第四信号端子层601和第四信号线层603相互干扰。第四信号端子层601包括多个焊盘。
应当理解到，为了将第四信号端子层601和第四参考地层602间隔开，第四电路板600还包括设置在第四信号端子层601和第四参考地层602之间的第五绝缘层。同理，为了将第四参考地层6022和第四信号线层603间隔开，第四电路板600还包括设置在第四参考地层602和第四信号线层603之间的第六绝缘层。图8中未示意出第五绝缘层和第六绝缘层。
可以理解的是，第四电路板600的焊盘尺寸在设计时，是根据焊接在其上的引脚的尺寸来设计的。由于上述的连接器母座200安装在第四电路板600上时，连接器母座200的母座引脚206焊接在第四电路板600的焊盘上，以实现连接器母座200和第四电路板600的电连接。而本实施例中的连接器母座200包括第一母座引脚2061和第二母座引脚2062，第一母座引脚2061的焊接面的面积小于第二母座引脚2062的焊接面的面积，因而本实施例中的第四信号端子层601的多个焊盘包括第一焊盘和第二焊盘，为了将与连接器母座200电连接的第四电路板600中的第一焊盘和第二焊盘，和上述与连接器公头100电连接的第一电路板300中的第一焊盘和第二焊盘区分开，以下将与连接器母座200电连接的第四电路板600中的第一焊盘称为第一母座焊盘6011，将与连接器母座200电连接的第四电路板600中的第二焊盘称为第二母座 焊盘6012。其中，第一母座焊盘6011的焊接面的面积小于第二母座焊盘6012的焊接面的面积。
需要说明的是，第一母座焊盘6011的焊接面的面积的取值范围可以与第一公头焊盘3011的焊接面的面积的取值范围相同，可以参考上述第一公头焊盘3011的焊接面的面积的取值范围，此处不再赘述。
第二母座焊盘6012的焊接面的面积的取值范围可以与第二公头焊盘3012的焊接面的面积的取值范围相同，可以参考上述第二公头焊盘3012的焊接面的面积的取值范围，此处不再赘述。
第二母座焊盘6012的焊接面的面积与第一母座焊盘6011的焊接面的面积的差值范围，可以和第二公头焊盘3012的焊接面的面积与第一公头焊盘3011的焊接面的面积的差值范围相同，可以参考上述，此处不再赘述。
当第二电子器件30为第四电路板600，连接器母座200安装于第二电子器件30上时，上述连接器母座200的第一母座引脚2061的焊接面焊接于第四电路板600的第一母座焊盘6011的焊接面上，连接器母座200的第二母座引脚2062的焊接面焊接于第四电路板600的第二母座焊盘6012的焊接面上，以实现连接器母座200与第四电路板600的电连接。
在第一母座焊盘6011的焊接面的面积小于第二母座焊盘6012的焊接面的面积的情况下，在一些示例中，第一母座焊盘6011和第二母座焊盘6012沿第一方向排列；沿垂直于第一方向的方向，第一母座焊盘6011的焊接面的长度小于第二母座焊盘6012的焊接面的长度。
需要说明的是，沿垂直于第一方向的方向，第一母座焊盘6011的焊接面的长度的取值范围可以与上述沿垂直于第一方向的方向，第一公头焊盘3011的焊接面的长度的取值范围相同，可以参考上述，此处不再赘述。
沿垂直于第一方向的方向，第二母座焊盘6012的焊接面的长度的取值范围可以与上述沿垂直于第一方向的方向，第二公头焊盘3012的焊接面的长度的取值范围相同，可以参考上述，此处不再赘述。
沿垂直于第一方向的方向，第二母座焊盘6012的焊接面的长度与第一母座焊盘6011的焊接面的长度的差值范围，可以和上述第二公头焊盘3012的焊接面的长度与第一公头焊盘3011的焊接面的长度的差值范围相同，可以参考上述，此处不再赘述。
在此基础上，沿第一方向，第一母座焊盘6011的焊接面的宽度和第二母座焊盘6012的焊接面的宽度可以相同，也可以不相同。
沿第一方向，第一母座焊盘6011的焊接面的宽度的取值范围可以与上述第一公头焊盘3011的焊接面的宽度的取值范围相同，可以参考上述，此处不再赘述。
沿第一方向，第二母座焊盘6012的焊接面的宽度的取值范围可以与上述第二公头焊盘3012的焊接面的宽度的取值范围相同，可以参考上述，此处不再赘述。
沿第一方向，第二母座焊盘6012的焊接面的宽度与第一母座焊盘6011的焊接面的宽度的差值范围，可以和第二公头焊盘3012的焊接面的宽度与第一公头焊盘3011的焊接面的宽度的差值范围相同，可以参考上述，此处不再赘述。
在本实施例中，当连接器母座200安装于第四电路板600上时，由于连接器母座200的第一母座引脚2061的焊接面的面积小于第二母座引脚2062的焊接面的面积，第四电路板600的第一母座焊盘6011的焊接面的面积小于第二母座焊盘6012的焊接面的面积，且第一母座引脚2061的焊接面焊接于第一母座焊盘6011的焊接面上，第二母座引脚2062的焊接面焊接于第二母座焊盘6012的焊接面上，因此第一母座引脚2061、第一母座焊盘6011与第四电路板600的第四参考地层602之间的相对面积小于第二母座引脚2062、第二母座焊盘6012与第四电路板600的第四参考地层602之间的相对面积，根据电容公式可知，第一母座引脚2061、第一母座焊盘6011与第四电路板600的第四参考地层602之间的寄生电容相对于第二母座引脚2062、第二母座焊盘6012与第四电路板600的第四参考地层602之间的寄生电容会减小，因此根据特征阻抗计算公式可知第一母座引脚2061所在位置处的连接器母座200的特征阻抗会增加，这样一来，可以改善第一母座引脚2061所在位置处的连接器母座200的特征阻抗和第四电路板600的走线的特征阻抗不匹配的问题，减小第一母座引脚2061上的信号在连接器母座200和第四电路板600之间传输时存在的反射，提高SI。
在此基础上，本实施例中，在增加第一母座引脚2061所在位置处的连接器母座200的特征阻抗的同时，由于第二母座引脚2062和第二母座焊盘6012的焊接面的面积较大，因而可以利用第二母座引脚2062的焊接面焊接于第二母座焊盘6012的焊接面上，以使得连接器母座200和第四电路板600之间有较大的焊接力，从而确保了连接器母座200和第四电路板600之间牢固连接。
需要说明的是，若连接器母座200和第四电路板600的结合力不够，则还可以通过增大第二母座引脚2062的焊接面的长度和/或宽度的方式，确保连接器母座200的母座引脚206和第四电路板600之间的焊接力满足需求。
应当理解到，由于连接器母座200包括沿其长度方向排列的多个母座接触端子205，因而相邻的两个母座接触端子205之间也会产生寄生电容，该寄生电容也会影响连接器母座200的特征阻抗。由于连接器母座200在与连接器公头100在扣插连接时，母座接触端子205要与公头接触端子104接触，如果将所有的母座接触端子205沿连接器母座200宽度方向的截面的面积都减小，那么连接器母座200在与连接器公头100在扣插连接时会出现扣插拔力不够的情况，从而会影响连接器公头100和连接器母座200扣合的可靠性。
基于此，本实施例可以将部分母座接触端子205沿连接器母座200宽度方向的截面的面积减小，这样既可以减小相邻的母座接触端子205之间的寄生电容，又可以保证连接器公头100和连接器母座200之间的扣合可靠性。
在一些示例中，上述第一母座接触端子2051沿连接器母座200宽度方向的截面的面积小于第二母座接触端子2052沿连接器母座200宽度方向的截面的面积。
由于第一母座接触端子2051沿连接器母座200宽度方向的截面的面积小于第二母座接触端子2052沿连接器母座200宽度方向的截面的面积，因而第一母座接触端子2051和与其相邻的母座接触端子205之间的寄生电容较小，因此第一母座接触端子2051所在位置处的特征阻抗较大，这样一来，可以改善第一母座接触端子2051所 在位置处的连接器母座200和第四电路板400的走线的特征阻抗不匹配的问题，减小第一母座接触端子2051上的信号在连接器母座200和第四电路板400之间传输时存在的反射，提高SI。由于第一母座引脚2061与第一母座接触端子2051电连接，因而也可以进一步减小第一母座引脚2061上的信号在连接器母座200和第四电路板600之间传输时存在的反射。
在本实施例二中，还可以通过调整第四电路板600中第四信号端子层601和第四参考地层602之间的第五绝缘层的材料来调整ε，以改变连接器母座200和第四电路板600之间的寄生电容的大小。在一些示例中，为了使连接器母座200和第四电路板600之间的寄生电容较小，选取的第五绝缘层的材料应具有低的介电常数。
在此基础上，还可以通过调整相邻两个母座接触端子205之间的材料来调整ε，以改变相邻的两个母座接触端子205之间的寄生电容，由于母座接触件202安装在母座壳体201上，即还可以通过调整母座壳体201的材料还调整ε，以改变相邻的两个母座接触端子205之间的寄生电容。在一些示例中，为了减小相邻的两个母座接触端子205之间的寄生电容，选取的母座壳体201应具有低的介电常数。
考虑到连接器母座200和第四电路板600之间传输的信号完整性主要于高速信号有关，基于此，在一些示例中，第一母座引脚2061为高速信号引脚，第二母座引脚2062为非高速信号引脚。
此处，非高速信号引脚可以参考上述实施例一的描述，此处不再赘述。
应当理解到，由于第一母座引脚2061与第一母座接触端子2051电连接，第一母座引脚2061的焊接面焊接于第一母座焊盘6011的焊接面上，因而当第一母座引脚2061为高速信号引脚时，第一母座接触端子2051和第一母座焊盘6011上传输的均是高速信号。同样的，由于第二母座引脚2062与第二母座接触端子2052电连接，第二母座引脚2062的焊接面焊接于第二母座焊盘6012的焊接面上，因而当第二母座引脚2062为非高速信号引脚时，第二母座接触端子2052和第二母座焊盘6012上传输的均是非高速信号。
由于第一母座引脚2061为高速信号引脚，第二母座引脚2062为非高速信号引脚，因而可以减小高速信号在连接器母座200和第四电路板600之间传输时存在的反射，而信号完整性主要取决于高速信号，这样一来，可以进一步提高SI。
在本实施例中，连接器10中的连接器公头100的公头接触端子104和连接器母座200的母座接触端子205的扣插连接方式以及对应的技术效果可以参考实施例一，此处不再赘述。
实施例三
实施例三和实施例二的区别之处在于，实施例三提供的连接器公头100和与连接器公头100电连接的第一电子器件20的结构与实施例二提供的连接器公头100和与连接器公头100电连接的第一电子器件20的结构不同。
实施例三提供的连接器母座200以及与连接器母座200电连接在第二电子器件30的结构与实施例二提供的连接器母座200以及与连接器母座200电连接在第二电子器件30的结构相同。其中，参考图20和图21，实施例三提供的连接器母座200 包括母座壳体201、多个母座接触件202、一对母座固定脚203和一对母座中岛204。多个母座接触件202包括多个第一母座接触件207和多个第二母座接触件208。第一母座接触件207包括第一母座接触端子2051和与第一母座接触端子2051电连接的第一母座引脚2061，第一母座接触端子2051和与第一母座接触端子2051电连接的第一母座引脚2061一体成型。第二母座接触件208包括第二母座接触端子2052和与第二母座接触端子2052电连接的第二母座引脚2062，第二母座接触端子2052和与第二母座接触端子2052电连接的第二母座引脚2062一体成型。其中，第一母座引脚2061的焊接面的面积小于第二母座引脚2062的焊接面的面积。
参考图8，实施例三提供的第二电子器件30为第四电路板600，第四电路板600包括依次层叠设置的第四信号端子层601、第四参考地层602和第四信号线层603。第四信号端子层601包括第一母座焊盘6011和第二母座焊盘6012；其中，第一母座焊盘6011的焊接面的面积小于第二母座焊盘6012的焊接面的面积。
需要说明的是，连接器母座200和第四电路板600的连接关系，以及连接器母座200的具体结构的描述，第四电路板600的具体结构的描述均可以参考上述实施例二，此处不再赘述。
此外，由于实施例三提供的连接器母座200以及与连接器母座200电连接在第二电子器件30的结构与实施例二提供的连接器母座200以及与连接器母座200电连接在第二电子器件30的结构相同，因而实施例三提供的连接器母座200和第二电子器件30具有与实施例二提供的连接器母座200和第二电子器件30相同的技术效果，可以参考实施例二，此处不再赘述。
实施例三提供的连接器公头100和与连接器公头100电连接的第一电子器件20的结构与相关技术提供的连接器公头100和与连接器公头100电连接的第一电子器件20的结构相同。其中，实施例三提供的连接器公头100的主要结构包括公头壳体101、多个公头接触件102以及一对公头固定脚103。其中，公头接触件102包括公头接触端子102a和与公头接触端子102a电连接的公头引脚102b；多个公头接触件102的尺寸相同，即多个公头接触端子102a的尺寸相同，多个公头引脚102b的尺寸相同。
在一些示例中，公头引脚102b的焊接面的面积的取值范围与上述第二公头引脚1052的焊接面的面积的取值范围相同，可以参考上述，此处不再赘述。
在一些示例中，沿连接器公头100的宽度方向，公头引脚102b的焊接面的长度的取值范围与沿连接器公头100的宽度方向，上述第二公头引脚1052的焊接面的长度的取值范围相同，可以参考上述，此处不再赘述。
在一些示例中，沿连接器公头100的长度方向，公头引脚102b的焊接面的宽度的取值范围与沿连接器公头100的长度方向，上述第二公头引脚1052的焊接面的宽度的取值范围相同，可以参考上述，此处不再赘述。在实施例三中，在与连接器公头100电连接的第一电子器件20为电路板的情况下，与连接器公头100电连接的电路板的结构与上述第二电路板400的结构相同，可以参考图14以及上述对第二电路板400的描述，此处不再赘述。在此基础上，在与连接器公头100电连接的第一电子器件20为电路板的情况下，连接器公头100和电路板的连接关系，可以参考实施例一 中相关技术的描述，此处不再赘述。
在本实施例中，连接器10中的连接器公头100的公头接触端子104和连接器母座200的母座接触端子205可以通过多个接触点(例如两个接触点)扣插连接，以实现连接器公头100和连接器母座200的扣插连接。
实施例四
实施例四与上述实施例一、实施例二和实施例三的区别在于，实施例一是将连接器公头100中部分公头引脚(即第一公头引脚1042)的焊接面的面积减小，将与连接器公头100电连接的第一电路板300中部分焊盘(即第一公头焊盘3011)的焊接面的面积减小。实施例二是将连接器公头100中部分公头引脚(即第一公头引脚1042)的焊接面的面积减小，将与连接器公头100电连接的第一电路板300中部分焊盘(即第一公头焊盘3011)的焊接面的面积减小，且将连接器母座200中部分母座引脚(即第一母座引脚2061)的焊接面的面积减小，将与连接器母座200电连接的第四电路板600中部分焊盘(即第一母座焊盘6011)的焊接面的面积减小。实施例三是将连接器母座200中部分母座引脚(即第一母座引脚2061)的焊接面的面积减小，将与连接器母座200电连接的第四电路板600中部分焊盘(即第一母座焊盘6011)的焊接面的面积减小。
而本实施例四，将连接器公头100中所有的公头引脚102b的焊接面的面积都减小，将与连接器公头100电连接的电路板中所有的焊盘的焊接面的面积都减小。和/或，将连接器母座200中所有的母座引脚的焊接面的面积都减小，将与连接器母座200电连接的电路板中所有的焊盘的焊接面的面积减小。
在本实施例四中，连接器公头100的结构和连接器母座200的结构可以参考实施例一、实施例二和实施例三，本实施例四不再赘述。
在本实施例四中，在将连接器公头100中所有的公头引脚102b的焊接面的面积都减小，将与连接器公头100电连接的电路板中所有的焊盘的焊接面的面积都减小的情况，在一些示例中，连接器公头100中公头引脚102的焊接面的面积的取值范围可以与上述实施例一中第一公头引脚1042的焊接面的面积的取值范围相同，可以参考上述实施例一对第一公头引脚1042的焊接面的面积的取值范围的说明，此处不再赘述。
在一些示例中，沿连接器公头100的宽度方向，公头引脚102b的焊接面的长度的取值范围可以与上述实施例一中沿连接器公头100的宽度方向，第一公头引脚1042的焊接面的长度的取值范围相同，可以参考上述实施例一对第一公头引脚1042的焊接面的长度的取值范围的说明，此处不再赘述。
在一些示例中，沿连接器公头100的长度方向，公头引脚102b的焊接面的宽度的取值范围可以与上述实施例一中沿连接器公头100的长度方向，第一公头引脚1042的焊接面的宽度的取值范围相同，可以参考上述实施例一对第一公头引脚1042的焊接面的宽度的取值范围的说明，此处不再赘述。
在一些示例中，与连接器公头100电连接的电路板中所有的焊盘的焊接面的面积的取值范围可以与上述实施例一中第一公头焊盘3011的焊接面的面积的取值范围相 同，可以参考上述实施例一对第一公头焊盘3011的焊接面的面积的取值范围的说明，此处不再赘述。
在一些示例中，沿垂直于第一方向的方向，与连接器公头100电连接的电路板中所有的焊盘的焊接面的长度的取值范围可以与上述实施例一中沿垂直于第一方向的方向，第一公头焊盘3011的焊接面的长度的取值范围相同，可以参考上述实施例一对第一公头焊盘3011的焊接面的长度的取值范围的说明，此处不再赘述。
在一些示例中，沿第一方向，与连接器公头100电连接的电路板中所有的焊盘的焊接面的宽度的取值范围可以与上述实施例一中沿第一方向，第一公头焊盘3011的焊接面的宽度的取值范围相同，可以参考上述实施例一对第一公头焊盘3011的焊接面的宽度的取值范围的说明，此处不再赘述。
由于连接器公头100中所有的公头引脚102b的焊接面的面积都减小，与连接器公头100电连接的电路板中所有的焊盘的焊接面的面积都减小，因而可以极大地降低公头引脚102b、电路板的焊盘与电路板的参考地层之间的寄生电容，从而可以有效地增加连接器公头100的特征阻抗，这样一来，可以明显地减小连接器公头100的特征阻抗和电路板的走线的特征阻抗不匹配的问题，减小信号在连接器公头100和电路板之间传输时存在的反射，进一步提高SI。
在本实施例四中，在将连接器母座200中所有的母座引脚的焊接面的面积都减小，将与连接器母座200电连接的电路板中所有的焊盘的焊接面的面积都减小的情况下，在一些示例中，连接器母座200中所有的母座引脚的焊接面的面积的取值范围可以与上述实施例二中第一母座引脚2061的焊接面的面积的取值范围相同，可以参考上述实施例二对第一母座引脚2061的焊接面的面积的取值范围的说明，此处不再赘述。
在一些示例中，沿连接器母座200的宽度方向，连接器母座200中所有的母座引脚的焊接面的长度的取值范围可以与上述实施例二中沿连接器母座200的宽度方向，第一母座引脚2061的焊接面的长度的取值范围相同，可以参考上述实施例二对第一母座引脚2061的焊接面的长度的取值范围的说明，此处不再赘述。
在一些示例中，沿连接器母座200的长度方向，连接器母座200中所有的母座引脚的焊接面的宽度的取值范围可以与上述实施例二中沿连接器母座200的长度方向，第一母座引脚2061的焊接面的宽度的取值范围相同，可以参考上述实施例二对第一母座引脚2061的焊接面的宽度的取值范围的说明，此处不再赘述。
在一些示例中，与连接器母座200电连接的电路板中所有的焊盘的焊接面的面积的取值范围可以与上述实施例二中第一母座焊盘6011的焊接面的面积的取值范围相同，可以参考上述实施例二对第一母座焊盘6011的焊接面的面积的取值范围的说明，此处不再赘述。
在一些示例中，沿垂直于第一方向的方向，与连接器母座200电连接的电路板中所有的焊盘的焊接面的长度的取值范围和上述实施例二中沿垂直于第一方向的方向，第一母座焊盘6011的焊接面的长度的取值范围相同，可以参考上述实施例二对第一母座焊盘6011的焊接面的长度的取值范围的说明，此处不再赘述。
在一些示例中，沿第一方向，与连接器母座200电连接的电路板中所有的焊盘的 焊接面的宽度的取值范围和上述实施例二中沿第一方向，第一母座焊盘6011的焊接面的宽度的取值范围相同，可以参考上述实施例二对第一母座焊盘6011的焊接面的宽度的取值范围的说明，此处不再赘述。
由于连接器母座200中所有的母座引脚206的焊接面的面积都减小，与连接器母座200电连接的电路板中所有的焊盘的焊接面的面积都减小，因而可以极大地降低母座引脚206、电路板的焊盘与电路板的参考地层之间的寄生电容，从而可以有效地增加连接器母座200的特征阻抗，这样一来，可以明显地减小连接器母座200的特征阻抗和电路板的走线的特征阻抗不匹配的问题，减小信号在连接器母座200和电路板之间传输时存在的反射，进一步提高SI。
基于上述，需要说明的是，在将连接器公头100中所有的公头引脚102b的焊接面的面积都减小，将与连接器公头100电连接的电路板中所有的焊盘的焊接面的面积都减小；或者，将连接器母座200中所有的母座引脚的焊接面的面积都减小，将与连接器母座200电连接的电路板中所有的焊盘的焊接面的面积减小的情况下，当将连接器公头100中所有的公头引脚102b的焊接面的面积都减小，将与连接器公头100电连接的电路板中所有的焊盘的焊接面的面积都减小时，连接器母座200可以是实施例一提供的连接器母座200，也可以是实施例二提供的连接器母座200。当将连接器母座200中所有的母座引脚的焊接面的面积都减小，将与连接器母座200电连接的电路板中所有的焊盘的焊接面的面积减小时，连接器公头100可以是实施例一提供的连接器公头100，也可以是实施例三提供的连接器公头100。

Claims (26)

  1. 一种连接器单体，其特征在于，包括第一接触件和第二接触件；所述第一接触件包括第一接触端子以及与所述第一接触端子电连接的第一引脚；所述第二接触件包括第二接触端子和与所述第二接触端子电连接的第二引脚；
    其中，所述第一接触端子和与其电连接的所述第一引脚一体成型，所述第二接触端子和与其电连接的所述第二引脚一体成型；所述第一引脚的焊接面的面积小于所述第二引脚的焊接面的面积。
  2. 根据权利要求1所述的连接器单体，其特征在于，所述第一引脚的焊接面的面积的取值范围为0.0016mm 2～7.8804mm 2，所述第二引脚的焊接面的面积的取值范围为0.004mm 2～8mm 2。
  3. 根据权利要求1或2所述的连接器单体，其特征在于，所述第二引脚的焊接面的面积与所述第一引脚的焊接面的面积的差值范围为0.024mm 2～7.9984mm 2。
  4. 根据权利要求1所述的连接器单体，其特征在于，所述第一接触件和所述第二接触件沿所述连接器单体的长度方向排列；
    沿所述连接器单体的宽度方向，所述第一引脚的焊接面的长度小于所述第二引脚的焊接面的长度。
  5. 根据权利要求4所述的连接器单体，其特征在于，沿所述连接器单体的宽度方向，所述第一引脚的焊接面的长度的取值范围为0.02mm～3.98mm，所述第二引脚的焊接面的长度的取值范围为0.04mm～4mm。
  6. 根据权利要求4或5所述的连接器单体，其特征在于，沿所述连接器单体的宽度方向，所述第二引脚的焊接面的长度与所述第一引脚的焊接面的长度的差值范围为0.02mm～3.98mm。
  7. 根据权利要求1所述的连接器单体，其特征在于，所述第一引脚为高速信号引脚，所述第二引脚为非高速信号引脚。
  8. 根据权利要求7所述的连接器单体，其特征在于，所述非高速信号引脚为低速信号引脚、电源引脚或接地引脚。
  9. 根据权利要求1所述的连接器单体，其特征在于，所述第一接触件和所述第二接触件沿所述连接器单体的长度方向排列；
    所述第一接触端子沿所述连接器单体的宽度方向的截面的面积小于所述第二接触端子沿所述连接器单体的宽度方向的截面的面积。
  10. 一种连接器，其特征在于，包括连接器公头和连接器母座，所述连接器公头和所述连接器母座扣插连接；
    所述连接器公头为如权利要求1-9任一项所述的连接器单体；和/或，所述连接器母座为如权利要求1-9任一项所述的连接器单体。
  11. 根据权利要求10所述的连接器，其特征在于，所述连接器公头包括第一接触件和第二接触件，所述连接器母座包括第一接触件和第二接触件；
    其中，所述连接器公头的第一接触件中的第一接触端子与所述连接器母座的第一接触件中的第一接触端子扣插连接，所述连接器公头的第二接触件中的第二接触端子与所述连接器母座的第二接触件中的第二接触端子扣插连接。
  12. 根据权利要求11所述的连接器，其特征在于，所述连接器公头的第一接触端子与所述连接器母座的第一接触端子通过一个接触点扣插连接，所述连接器公头的第二接触端子与所述连接器母座的第二接触端子通过多个接触点扣插连接。
  13. 根据权利要求12所述的连接器，其特征在于，所述连接器公头还包括辅助接触端子；所述辅助接触端子的材料为非导电材料；
    所述连接器公头的第一接触端子与所述连接器母座的第一接触端子还通过所述辅助接触端子扣插连接。
  14. 根据权利要求13所述的连接器，其特征在于，所述连接器为板对板BTB连接器、type-C连接器、低电压差分信号LVDS连接器、M.2连接器或WTB连接器。
  15. 一种电路板，其特征在于，包括层叠设置的信号端子层和参考地层，所述参考地层覆盖所述信号端子层，所述信号端子层包括第一焊盘和第二焊盘；
    其中，所述第一焊盘的焊接面的面积小于所述第二焊盘的焊接面的面积。
  16. 根据权利要求15所述的电路板，其特征在于，所述第一焊盘的焊接面的面积的取值范围为0.0055mm 2～23.8004mm 2，所述第二焊盘的焊接面的面积的取值范围为0.0091mm 2～24mm 2。
  17. 根据权利要求15或16所述的电路板，其特征在于，所述第二焊盘的焊接面的面积与所述第一焊盘的焊接面的面积的差值范围为0.0036mm 2～23.9945mm 2。
  18. 根据权利要求15所述的电路板，其特征在于，所述第一焊盘和所述第二焊盘沿第一方向排列；
    沿垂直于所述第一方向的方向，所述第一焊盘的焊接面的长度小于所述第二焊盘的焊接面的长度。
  19. 根据权利要求18所述的电路板，其特征在于，沿垂直于所述第一方向的方向，所述第一焊盘的焊接面的长度的取值范围为0.05mm～5.98mm，所述第二焊盘的焊接面的长度范围为0.07mm～6mm。
  20. 根据权利要求18或19所述的电路板，其特征在于，沿垂直于所述第一方向的方向，所述第二焊盘的焊接面的长度与所述第一焊盘的焊接面的长度的差值范围为0.02mm～5.95mm。
  21. 根据权利要求15所述的电路板，其特征在于，所述电路板为印刷电路板或柔性电路板。
  22. 一种电子设备，其特征在于，包括电路板和安装在所述电路板上的连接器单体；
    其中，所述连接器单体为如权利要求1-9任一项所述的连接器单体，所述电路板为如权利要求15-21任一项所述的电路板；
    所述连接器单体的第一引脚的焊接面焊接于所述电路板的第一焊盘的焊接面上，所述连接器单体的第二引脚的焊接面焊接于所述电路板的第二焊盘的焊接面上。
  23. 根据权利要求22所述的电子设备，其特征在于，所述连接器单体为连接器公头或连接器母座。
  24. 一种电子系统，其特征在于，包括如权利要求10-14任一项所述的连接器、第一电子器件和第二电子器件；连接器公头与所述第一电子器件电连接，连接器母座 与所述第二电子器件电连接；
    所述连接器公头包括第一引脚和第二引脚，所述第一引脚的焊接面的面积小于所述第二引脚的焊接面的面积，所述第一电子器件为如权利要求15-21任一项所述的电路板；所述连接器公头的第一引脚与所述第一电子器件的第一焊盘电连接，所述连接器公头的第二引脚与所述第一电子器件的第二焊盘电连接；
    和/或，所述连接器母座包括第一引脚和第二引脚，所述第一引脚的焊接面的面积小于所述第二引脚的焊接面的面积，所述第二电子器件为如权利要求15-21任一项所述的电路板；所述连接器母座的第一引脚与所述第二电子器件的第一焊盘电连接，所述连接器母座的第二引脚与所述第二电子器件的第二焊盘电连接。
  25. 根据权利要求24所述的电子系统，其特征在于，所述电子系统为第一电子设备，所述连接器、所述第一电子器件和所述第二电子器件设置于所述第一电子设备中。
  26. 根据权利要求24所述的电子系统，其特征在于，所述电子系统包括第一电子设备和第二电子设备；
    所述连接器公头和所述第一电子器件设置于所述第一电子设备中，所述连接器母座和所述第二电子器件设置于所述第二电子设备中。
PCT/CN2022/083211 2021-03-30 2022-03-25 连接器单体、连接器、电路板、电子设备及电子系统 WO2022206632A1 (zh)

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CN215497153U (zh) * 2021-03-30 2022-01-11 华为技术有限公司 连接器单体、连接器、电路板、电子设备及电子系统
CN118523110A (zh) * 2023-02-17 2024-08-20 华为技术有限公司 连接器公座、连接器及电子设备

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