WO2022205917A1 - 液冷散热设备、机柜及系统 - Google Patents
液冷散热设备、机柜及系统 Download PDFInfo
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- WO2022205917A1 WO2022205917A1 PCT/CN2021/129144 CN2021129144W WO2022205917A1 WO 2022205917 A1 WO2022205917 A1 WO 2022205917A1 CN 2021129144 W CN2021129144 W CN 2021129144W WO 2022205917 A1 WO2022205917 A1 WO 2022205917A1
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- liquid
- condenser
- heat dissipation
- cooled heat
- cold plate
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 128
- 238000001816 cooling Methods 0.000 title claims abstract description 93
- 239000007788 liquid Substances 0.000 claims abstract description 106
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 53
- 230000007246 mechanism Effects 0.000 claims description 20
- 238000010438 heat treatment Methods 0.000 claims description 16
- 238000012546 transfer Methods 0.000 claims description 11
- 238000012423 maintenance Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 description 11
- 238000000034 method Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 210000005069 ears Anatomy 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000005057 refrigeration Methods 0.000 description 2
- 238000009834 vaporization Methods 0.000 description 2
- 230000008016 vaporization Effects 0.000 description 2
- 208000033999 Device damage Diseases 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/04—Arrangements of circuit components or wiring on supporting structure on conductive chassis
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20318—Condensers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20754—Air circulating in closed loop within cabinets
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Definitions
- the condenser is fixed on the outer side wall of the area where the pipeline outlet is located;
- Embodiments of the present application further provide a liquid-cooled heat dissipation system, including: the above-mentioned liquid-cooled heat-dissipation device, and the above-mentioned liquid-cooled heat-dissipation cabinet;
- FIG. 5 is a schematic structural diagram of the liquid cooling mechanisms 204A and 204B in the liquid cooling cooling cabinet 200 provided by another embodiment of the present application;
- this embodiment provides a condenser with a specific structure, specifically a condenser with a fin structure.
- the condenser 12A includes a base plate (not shown in FIG. 3), a housing 12A-1, a plurality of condenser fins 12A-2, a vapor inlet and a liquid outlet.
- a plurality of condensers may be fixed on the outer side wall of the chassis of a liquid-cooled heat-dissipating device. Therefore, a thermal pad needs to be provided on the side wall of each condenser, so that the condenser and the liquid When the cold plate in the cooling cooling cabinet is in contact, the heat transfer pad can be used for better heat transfer, so that the liquid cooling cooling device and the liquid cooling cooling cabinet can better cooperate to dissipate heat, thereby improving the cooling effect.
- the elastic member 204A-2 When the cold plate 204A-1 is not in contact with the thermally conductive pad (15A in FIG. 2 ) provided on the condenser (12A in FIG. 2 ), the elastic member 204A-2 is in a state of natural extension; in the cold plate 204A-1 When in contact with the thermally conductive pad (15A in FIG. 2 ) provided on the condenser (12A in FIG. 2 ), the elastic member 204A-2 is in a compressed state, so that the cold plate 204A-1 passes through the thermal conductive pad (15A in FIG. 2 ).
- the cold plate absorbs the heat of the condenser fixed on the outer wall of the chassis of the liquid-cooled heat-dissipation device to assist the condensation
- the evaporator quickly cools the high-temperature steam absorbed by the evaporator and vaporized by the heating electronic components into a liquid with a lower temperature.
- the steam inlet of the condenser needs to be opposite to the cold water inlet of the cold plate connected to the water inlet manifold, and the liquid outlet of the condenser needs to be connected to the cold plate.
- a cold plate is arranged in the liquid-cooled heat dissipation cabinet to assist the condenser in the liquid-cooled heat dissipation device to perform secondary heat dissipation, so that the liquid cooling and heat dissipation equipment can be better cooled.
- the heat-generating electronic components in the cold cooling device dissipate heat, which further improves the heat dissipation effect.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (10)
- 液冷散热设备,包括:机箱、电路板、蒸发器、发热电子元件、冷凝器、蒸汽管路和液体管路;所述机箱的外侧壁上开设管路出口,所述外侧壁为与所述机箱的机箱面板、IO口面板相接触的侧板外壁;所述电路板固定在所述机箱的内底面上;所述蒸发器以预设间隙固定在所述电路板上,与所述电路板形成一容置空间;所述发热电子元件安装在所述容置空间内的所述电路板上,且与所述电路板电性连接,与所述蒸发器热连接;所述冷凝器固定在所述管路出口所在区域的所述外侧壁上;所述蒸汽管路和所述液体管路穿过所述管路出口,将所述蒸发器和所述冷凝器连通;其中,在所述发热电子元件工作时,所述蒸发器内的液体吸收所述发热电子元件散发的热量汽化为蒸气,在内部蒸气压的作用下沿所述蒸气管路进入所述冷凝器,由所述冷凝器冷却为液体后沿所述液体管路返回所述蒸发器。
- 根据权利要求1所述的液冷散热设备,其中,所述冷凝器包括:基板、外壳、多个冷凝器翅片、蒸汽进口和液体出口;所述外壳和所述基板构成一密闭的腔体;所述多个冷凝器翅片并排间隔固定在所述腔体内的所述基板上;所述蒸汽进口与所述蒸汽管路连通,开设在与所述多个冷凝器翅片平行的所述外壳的侧壁上的一端;所述液体出口与所述液体管路连通,开设在所述蒸汽进口所在的所述侧壁上的另一端。
- 根据权利要求1所述的液冷散热设备,其中,所述冷凝器的个数为偶数个;所述机箱相对的两个外侧壁上,分别开设所述管路出口,所述冷凝器对称 固定在所述管路出口所在区域的所述外侧壁上。
- 根据权利要求1所述的液冷散热设备,其中,所述液冷散热设备还包括:导热垫;所述导热垫设置于所述冷凝器与液冷散热机柜中的冷板接触的一侧。
- 一种液冷散热机柜,其中,包括:靠近机柜前门的两个前立柱、靠近机柜后门的两个后立柱、用于放置如权利要求1至4任一项所述的液冷散热设备的机箱托板和与所述液冷散热设备的外侧壁上固定的冷凝器配合使用的液冷机构;所述机箱托板固定在所述两个前立柱和所述两个后立柱围成的区域中,并通过所述两个前立柱和所述两个后立柱固定;所述液冷机构固定在所述机箱托板上方区域,与所述冷凝器位于同一侧的所述后立柱上。
- 根据权利要求5所述的液冷散热机柜,其中,所述液冷机构包括:冷板、弹性件、进水管路、出水管路、冷板滑道结构、进水歧管和出水歧管;所述冷板滑道结构固定在所述后立柱上;所述弹性件的一端固定在所述后立柱上,且位于所述冷板滑道结构对应的区域之间;所述冷板与所述弹性件的另一端固定,可滑动的安装在所述冷板滑道结构内,并通过所述进水管路与所述进水歧管连通,通过所述出水管路与所述出水歧管连通;其中,在所述冷板未与设置在所述冷凝器上的导热垫接触时,所述弹性件处于自然伸长状态;在所述冷板与设置在所述冷凝器上的导热垫接触时,所述弹性件处于压缩状态,以使所述冷板通过所述导热垫与所述冷凝器进行接触传热,辅助所述冷凝器和位于所述液冷散热设备内的蒸发器为液冷散热设备内的发热电子元件散热。
- 根据权利要求6所述的液冷散热机柜,其中,所述冷板滑道结构包括:第一滑道和第二滑道;所述弹性件包括:第一固定部和第二固定部;所述第一滑道和所述第二滑道间隔预设距离固定在所述后立柱上,所述预设距离略大于所述冷板的厚度;所述冷板可滑动的安装在所述第一滑道和所述第二滑道构成的容纳空间中;所述第一固定部固定在所述冷板朝向所述后立柱的面上,所述第二固定部固定在所述后立柱朝向所述冷板的面上。
- 根据权利要求5至7任一项所述的液冷散热机柜,其中,所述冷凝器的蒸汽进口与所述冷板连接进水歧管的冷水入口相对设置,所述冷凝器的液体出口与所述冷板连接出水歧管的热水出口相对设置。
- 根据权利要求5至7任一项所述的液冷散热机柜,其中,所述液冷散热机柜还包括:机箱固定件;所述机箱固定件,用于将放置在所述机箱托板上的所述液冷散热设备固定在所述两个前立柱上,以使所述弹性件始终处于压缩状态。
- 一种液冷散热系统,其中,包括:如权利要求1至4任一项所述的液冷散热设备,以及如权利要求5至9任一项所述的液冷散热机柜;所述液冷散热设备放置于所述液冷散热机柜中的机箱托板上,并在延所述机箱托板装入液冷散热机柜时,使固定在所述液冷散热设备的外侧壁上的每一个冷凝器通过一个导热垫与固定在所述液冷散热机柜中的后立柱上的一个冷板接触,并使所述冷板延冷板滑道结构朝向所述后立柱的方向滑动,将位于所述冷板和所述后立柱之间的弹性件从自然伸长状态压缩到压缩状态,以使所述冷板通过所述导热垫与所述冷凝器进行接触传热,辅助所述冷凝器和位于所述液冷散热设备内的蒸发器为液冷散热设备内的发热电子元件散热。
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DE112021007450.4T DE112021007450T5 (de) | 2021-04-02 | 2021-11-05 | Flüssigkeitsgekühlte Wärmeableitungsvorrichtung, Schrank und System |
JP2023559839A JP2024513805A (ja) | 2021-04-02 | 2021-11-05 | 液冷放熱機器、キャビネット及びシステム |
US18/285,291 US20240057298A1 (en) | 2021-04-02 | 2021-11-05 | Liquid-cooling heat dissipation device, cabinet, and system |
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CN202110362479.3A CN113163683B (zh) | 2021-04-02 | 2021-04-02 | 液冷散热设备、机柜及系统 |
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CN113163683B (zh) * | 2021-04-02 | 2023-05-30 | 西安易朴通讯技术有限公司 | 液冷散热设备、机柜及系统 |
CN113641226A (zh) * | 2021-09-01 | 2021-11-12 | 中科可控信息产业有限公司 | 散热器装配系统及装配方法 |
CN115876010B (zh) * | 2022-03-18 | 2024-05-10 | 山东大学 | 一种组合形成的环路热管 |
CN116007416B (zh) * | 2022-03-18 | 2024-05-10 | 山东大学 | 一种歧管蒸发器环路热管 |
CN115052465A (zh) * | 2022-06-30 | 2022-09-13 | 西安易朴通讯技术有限公司 | 一种液冷装置 |
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