WO2022205749A1 - 锅体组件及其温度控制方法以及烹饪器具 - Google Patents

锅体组件及其温度控制方法以及烹饪器具 Download PDF

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Publication number
WO2022205749A1
WO2022205749A1 PCT/CN2021/113883 CN2021113883W WO2022205749A1 WO 2022205749 A1 WO2022205749 A1 WO 2022205749A1 CN 2021113883 W CN2021113883 W CN 2021113883W WO 2022205749 A1 WO2022205749 A1 WO 2022205749A1
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WIPO (PCT)
Prior art keywords
temperature
pot
assembly
pot body
cooking mode
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PCT/CN2021/113883
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English (en)
French (fr)
Inventor
吕伟刚
程志喜
杨云
梅若愚
薛钊强
Original Assignee
佛山市顺德区美的电热电器制造有限公司
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Publication of WO2022205749A1 publication Critical patent/WO2022205749A1/zh

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    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
    • A47J36/00—Parts, details or accessories of cooking-vessels
    • A47J36/24—Warming devices
    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
    • A47J27/00—Cooking-vessels
    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
    • A47J36/00—Parts, details or accessories of cooking-vessels
    • A47J36/32—Time-controlled igniting mechanisms or alarm devices

Definitions

  • the present application relates to the technical field of household electrical appliances, and in particular, to a pot body assembly and a temperature control method thereof, a cooking utensil, and a computer-readable storage medium.
  • multi-functional cooking utensils With the improvement of living standards, people's requirements for food are getting higher and higher. Different cooking methods can obtain different flavors, so multi-functional cooking utensils came into being. Compared with the traditional single-function cooking utensils, the multi-functional cooking utensils have diversified functions, which is beneficial to reduce the number of cooking utensils and save limited space.
  • the present application provides a pan assembly and a temperature control method thereof, a cooking appliance and a computer-readable storage medium, which solve the problem of temperature control of a multifunctional cooking appliance in different cooking modes.
  • the first technical solution adopted in the present application is to provide a pot body assembly, which includes a pot body, a heating assembly and a temperature control assembly.
  • the pot body is used for accommodating the food to be cooked.
  • the heating assembly is used to heat the pot body.
  • the temperature control assembly is used to detect the temperature inside the pot and the temperature of the bottom of the pot, and is also used to control the heating assembly according to the temperature in the pot in response to the first cooking mode, and control the heating assembly according to the temperature in the bottom of the pot in response to the second cooking mode heating element.
  • the temperature control assembly includes a first temperature sensor, a second temperature sensor and a temperature controller.
  • the first temperature sensor is arranged on the pot body, and is used for detecting the temperature in the pot body.
  • the second temperature sensor is arranged on the pot body and/or the heating assembly, and is used to detect the temperature of the bottom of the pot body.
  • the temperature controller is connected to the first temperature sensor and the second temperature sensor for controlling the heating assembly according to the temperature inside the pot in response to the first cooking mode, and controlling the heating assembly according to the temperature of the bottom of the pot in response to the second cooking mode.
  • the first temperature sensor is arranged on the side of the pot body.
  • the temperature controller is disposed on the heating assembly, and the first temperature sensor and the temperature controller perform signal transmission in a wireless manner.
  • the temperature controller is configured to, in response to the first cooking mode, control the heating component to increase the temperature in the pot when the temperature in the pot is lower than the first temperature range, and when the temperature in the pot is higher than the first temperature range , control the heating component to make the temperature in the pot drop.
  • the temperature controller is further configured to, in response to the first cooking mode, control the heating assembly to reduce the temperature of the bottom of the pot when the temperature of the bottom of the pot is higher than a first threshold; wherein the first threshold is greater than or equal to the first threshold The maximum value of the temperature range.
  • the first temperature range is 100-140°C
  • the value range of the first threshold is between 140-180°C.
  • the temperature controller is configured to, in response to the second cooking mode, control the heating assembly to increase the temperature of the bottom of the pot when the temperature of the bottom of the pot is lower than the second temperature range; the temperature at the bottom of the pot is higher than the temperature of the bottom of the pot. In the second temperature range, control the heating component to reduce the temperature of the bottom of the pot body.
  • the temperature controller is further configured to, in response to the second cooking mode, control the heating component to decrease the temperature in the pot when the temperature in the pot is higher than the second threshold; wherein the second threshold is less than or equal to the second temperature range the minimum value of .
  • the second temperature range is 210-290°C, and the value range of the second threshold is between 160-200°C.
  • the cooking temperature of the second cooking mode is higher than the cooking temperature of the first cooking mode.
  • the first cooking mode is a pressure cooking mode
  • the second cooking mode is an air frying cooking mode
  • the second technical solution adopted in the present application is to provide a cooking utensil, the cooking utensil comprising any one of the above pot body assemblies.
  • the cooking appliance further includes a pot cover assembly, a fan assembly and a driving assembly.
  • the pot cover assembly is used in cooperation with the pot body assembly to realize the first cooking mode.
  • the fan assembly is arranged on the side of the pot cover assembly close to the pot body assembly.
  • the driving assembly is arranged on the side of the pot cover assembly away from the pot body assembly, and is used for driving the fan assembly to work. The pot body assembly, the pot cover assembly, the fan assembly and the driving assembly are used together to realize the second cooking mode.
  • the fan assembly includes a fan blade and a first magnetic member
  • the driving assembly includes a motor and a second magnetic member, and the second magnetic member is arranged corresponding to the first magnetic member; the motor drives the wind through the second magnetic member and the first magnetic member.
  • the third technical solution adopted in the present application is to provide a temperature control method for a pot body assembly, the pot body assembly includes a pot body and a heating assembly, the heating assembly is used for heating the pot body, and the temperature control method includes: obtaining the pot body the temperature of the pot body and the temperature of the bottom of the pot body; obtain the cooking mode in which the pot body assembly is located, and the cooking mode includes a first cooking mode and a second cooking mode; in response to the first cooking mode, control the heating assembly according to the temperature in the pot body; In the second cooking mode, the heating element is controlled according to the temperature of the bottom of the pot.
  • controlling the heating assembly according to the temperature in the pot includes: in response to the first cooking mode, when the temperature in the pot is lower than the first temperature range, controlling the heating assembly to make the temperature in the pot When the temperature in the pot body is higher than the first temperature range, the heating component is controlled to decrease the temperature in the pot body.
  • controlling the heating assembly according to the temperature of the bottom of the pot body includes: in response to the second cooking mode, when the temperature of the bottom of the pot body is lower than the second temperature range, controlling the heating assembly to make the pot body The temperature of the bottom is increased; when the temperature of the bottom of the pot body is higher than the second temperature range, the heating assembly is controlled to reduce the temperature of the bottom of the pot body.
  • the fourth technical solution adopted in the present application is to provide a computer-readable storage medium, where computer instructions are stored in the computer-readable storage medium, and when the computer instructions are executed, the above temperature control method is implemented.
  • the heating assembly in the first cooking mode, the heating assembly is controlled according to the temperature in the pot body, and in the second cooking mode, the heating assembly is controlled according to the temperature at the bottom of the pot body, so that different temperatures are used in different cooking modes
  • the control scheme can achieve the best cooking effect in different cooking modes.
  • FIG. 1 is a schematic structural diagram of an embodiment of a cooking utensil of the present application.
  • Fig. 2 is the exploded structure schematic diagram of the cooking utensil shown in Fig. 1;
  • Fig. 3 is the exploded structure schematic diagram of the partial structure of the cooking utensil shown in Fig. 1;
  • Fig. 4 is another structural schematic diagram of the cooking utensil shown in Fig. 1;
  • Fig. 5 is the sectional structure schematic diagram of the cooking utensil described in Fig. 1;
  • FIG. 6 is a schematic structural diagram of the heating assembly of the cooking appliance shown in FIG. 1;
  • Fig. 7 is the exploded structure schematic diagram of the partial structure of the heating assembly shown in Fig. 6;
  • FIG. 8 is a graph showing the variation of the temperature in the pot body with time in the first cooking mode of the cooking appliance shown in FIG. 1;
  • FIG. 9 is a graph showing the variation of the temperature of the bottom of the pot body with time in the second cooking mode of the cooking appliance shown in FIG. 1;
  • FIG. 10 is a schematic flowchart of an embodiment of a temperature control method for a pot body assembly of the present application
  • FIG. 11 is a schematic structural diagram of an embodiment of a computer-readable storage medium of the present application.
  • the cooking utensils described in the embodiments of the cooking utensils of the present application are multifunctional cooking utensils, which have a first cooking mode and a second cooking mode.
  • the cooking temperature of the second cooking mode may be higher than that of the first cooking mode, for example, the first cooking mode may be a pressure cooking mode, and the second cooking mode may be an air fry cooking mode.
  • the cooking temperature of the second cooking mode may also be comparable to the cooking temperature of the first cooking mode.
  • the first cooking mode is the pressure cooking mode
  • the second cooking mode is the air-frying cooking mode as an example to specifically describe the embodiment of the cooking appliance.
  • the present application does not limit this.
  • the first cooking mode can also be a stewing mode at normal pressure
  • the second cooking mode can also be a baking cooking mode.
  • Those skilled in the art can use it according to actual needs. to make a selection.
  • the cooking appliance may further include a third cooking mode, a fourth cooking mode, or even more cooking modes, which are not limited in this application, and can be designed by those skilled in the art according to actual needs.
  • FIG. 1 is a schematic structural diagram of an embodiment of a cooking appliance of the present application
  • FIG. 2 is a schematic diagram of an exploded structure of the cooking appliance shown in FIG. 1
  • the cooking appliance 500 described in the cooking appliance embodiments of the present application may include a pot body assembly 100 , a pot cover assembly 200 , a fan assembly 300 and a driving assembly 400 .
  • the pot body assembly 100 and the pot cover assembly 200 cooperate to realize a pressure cooking mode.
  • the pot body assembly 100 , the pot cover assembly 200 , the fan assembly 300 and the driving assembly 400 cooperate to realize the air frying cooking mode.
  • the pot body assembly 100 is used for accommodating food to be cooked and heating the food to be cooked.
  • the pot cover assembly 200 is covered on the pot body assembly 100 for sealing the pot body assembly 100 .
  • the pot lid assembly 200 may include a pot lid body (not marked in the drawings) and an exhaust valve (not marked in the drawings) provided on the pot lid body, so as to cooperate with the pot body assembly 100 to realize Pressure cooking mode.
  • the fan assembly 300 is disposed on the side of the pot cover assembly 200 close to the pot body assembly 100 .
  • the driving assembly 400 is disposed on the side of the pot cover assembly 200 away from the pot body assembly 100 , and is used for driving the fan assembly 300 to work.
  • the driving assembly 400 drives the fan assembly 300 to work to circulate the air inside the pot body assembly 100 . Therefore, the pot body assembly 100 , the pot cover assembly 200 , the fan assembly 300 and the driving assembly 400 cooperate to realize the air frying cooking mode.
  • FIG. 3 is an exploded schematic diagram of a partial structure of the cooking appliance shown in FIG. 1 .
  • the fan assembly 300 includes a fan blade 310 and a first magnetic member 320 .
  • the driving assembly 400 includes a motor 430 and a second magnetic member 440 , and the second magnetic member 440 is disposed corresponding to the first magnetic member 320 .
  • the motor 430 drives the fan blade 310 to rotate through the second magnetic member 440 and the first magnetic member 320, so as to realize the air circulation in the pot assembly 100, thereby realizing the air frying cooking mode.
  • the driving assembly 400 also includes an upper cover 410 and a lower cover 420 .
  • the upper cover 410 and the lower cover 420 are enclosed to form a cavity (not marked in the drawings), and the motor 430 and the second magnetic member 440 are disposed in the cavity.
  • the second magnetic member 440 is disposed on the side of the motor 430 close to the pot cover assembly 200 .
  • a magnetic isolation sheet 450 is also disposed between the second magnetic member 440 and the motor 430 .
  • the first magnetic member 320 is disposed on the side of the fan blade 310 close to the pot cover assembly 200 , and is disposed correspondingly to the second magnetic member 440 .
  • the motor 430 drives the fan blade 310 to rotate through the second magnetic member 440 and the second magnetic member 440, so as to realize the air circulation in the pot assembly 100, so as to realize the air frying cooking mode.
  • both the driving assembly 400 and the fan assembly 300 may be detachably mounted on the pot cover assembly 200 .
  • FIG. 4 which is another schematic structural diagram of the cooking utensil shown in FIG. 1
  • the driving assembly 400 is not installed on the pot cover assembly 200
  • the fan assembly 300 does not rotate, and the inside of the pot body assembly 100 cannot be formed.
  • the cooking appliance 500 can only implement a pressure cooking mode.
  • the cooking appliance 500 may be configured to enable the air fryer cooking mode, but not the pressure cooking mode, to avoid In the air frying cooking mode, the inside of the pot body assembly 100 is pressurized, causing a safety accident.
  • the cooking appliance 500 can be configured to implement both the air fryer cooking mode and the pressure cooking mode.
  • the application does not limit this, and those skilled in the art can choose according to actual needs.
  • both the fan assembly 300 and the drive assembly 400 may be non-removable.
  • one of the fan assembly 300 and the driving assembly 400 is detachable, and the other is not detachable, for example, the fan assembly 300 is not detachable, and the driving assembly 400 is detachable, or the driving assembly 400 is not detachable, and the fan assembly 300 is detachable.
  • This application is not limited, and those skilled in the art can make selections according to actual needs.
  • FIG. 5 is a schematic cross-sectional structure diagram of the cooking appliance shown in FIG. 1 .
  • the pot body assembly 100 described in the pot body assembly embodiments of the present application includes a pot body 10 , a heating assembly 20 and a temperature control assembly 30 .
  • the pot body 10 is used for accommodating the food to be cooked.
  • the heating assembly 20 is used for heating the pot body 10 .
  • the temperature control assembly 30 is used for detecting the temperature in the pot body 10 and the temperature at the bottom of the pot body 10, and also for controlling the heating assembly 20 according to the temperature in the pot body 10 in response to the first cooking mode, and in response to the second cooking mode , and control the heating assembly 20 according to the temperature of the bottom of the pot body 10 .
  • the heating assembly In the first cooking mode, the heating assembly is controlled according to the temperature in the pot body, and in the second cooking mode, the heating assembly is controlled according to the temperature at the bottom of the pot body, so that different temperature control schemes are adopted in different cooking modes. The best cooking effect can be achieved in the cooking mode.
  • controlling the heating assembly 20 according to the temperature in the pot body 10 is beneficial to achieve a better cooking effect.
  • the reason is that the temperature in the pot body 10 can truly reflect the real temperature of the food to be cooked, and can also truly reflect the cooking pressure in the pot body 10 .
  • controlling the heating assembly 20 with the temperature in the pot body 10 is beneficial to control the temperature of the food to be cooked and the pressure in the pot body 10 within a certain range, so as to achieve the best cooking effect in the pressure cooking mode.
  • controlling the heating assembly 20 according to the temperature of the bottom of the pot body 10 is beneficial to protect the heating assembly 20 .
  • the reason is that in the air frying cooking mode, the working temperature of the heating assembly 20 is higher than that in the pressure cooking mode, and the temperature change in the pot body 10 will have a certain delay compared with the temperature change at the bottom of the pot body 10 . If the temperature of the heating assembly 20 is controlled inside, the temperature of the pot body 10 may not reach the upper limit, and the temperature of the heating assembly 20 itself is already high, which may easily lead to overheating of the heating assembly 20 .
  • the first cooking mode may also be a stewing mode at normal pressure
  • the second cooking mode may also be a baking cooking mode.
  • Those skilled in the art can use the actual cooking mode. needs to choose.
  • FIG. 6 is a schematic structural diagram of the heating assembly of the cooking appliance shown in FIG. 1 .
  • the heating assembly 20 may include a heating body 201 and a heating side post 202 .
  • the heating body 201 is used for heating the pot body 10 .
  • the heating body 201 may include a housing 2012, a panel 2011, and a heating source (not shown in FIG. 6).
  • the panel 2011 serves as the working surface of the heating assembly 20 and is covered on the casing 2012 .
  • the housing 2012 and the panel 2011 together form an accommodating space (not marked in the drawings) for accommodating the heating source.
  • the heating source may be a heating coil, and the specific structure of the heating source is not limited in the present application, and those skilled in the art can select according to actual needs.
  • the heating side column 202 extends from the outer wall of the heating body 201 in a direction away from the heating body 201 .
  • the heated jamb 202 may include a jamb body 2021 and a trim 2022 .
  • the side pillar body 2021 is integrally formed with the housing 2012 , and extends from the outer wall of the housing 2012 in a direction away from the housing 2012 , and the decorative piece 2022 can be sleeved on the side pillar body 2021 .
  • the arrangement of the decorative pieces 2022 is beneficial to improve the appearance of the heating assembly 20 .
  • the arrangement of the decorative pieces 2022 enables the heating body 201 and the heating side pillars 202 to have different colors.
  • the side post body 2021 and the housing 2012 are integrally formed, it is difficult to achieve two-color injection molding of the side post body 2021 and the housing 2012 due to the limitations of the prior art.
  • the arrangement of the decorative pieces 2022 can also improve the consistency of the appearance of the heating assembly 20 .
  • the heating jamb 202 may not include the decorative piece 2022, or, in order to make the heating jamb 202 and the heating body 201 present different colors, the jamb body 2021 and The housing 2012 can also be assembled in two pieces, which is not limited in this application, and those skilled in the art can choose according to actual needs.
  • the pot body 10 may include a pot body body 101 and a pot body side post 102 .
  • the pot body 101 is used for accommodating the food to be cooked, and is provided corresponding to the heating body 201 .
  • the pot body side post 102 extends from the outer wall of the pot body body 101 in a direction away from the pot body body 101 , and is disposed corresponding to the heating side post 202 .
  • the pot body side post 102 and the pot body body 101 may be integrally formed, or may be two-piece configuration, which is not limited in this application, and those skilled in the art can choose according to actual needs. Electrical components such as buttons and indicator lights can be arranged on the side post 102 of the pot body.
  • the color of the pot body 101 and the heating body 201 may be the same, and the colors of the pot body side post 102 and the heating side post 202 may be the same.
  • the color of the pot body side post 102 and the heating side post 202 may be different from the colors of the pot body body 101 and the heating body 201, so that the pot body assembly 100 has a brighter appearance and color matching.
  • the pot body 10 and the heating assembly 20 may be detachable to facilitate cleaning of the pot body 10 .
  • the pot body 10 and the heating assembly 20 may also be non-detachable, which is not limited in this application, and those skilled in the art can choose according to actual needs.
  • FIG. 7 is an exploded schematic diagram of a partial structure of the heating element shown in FIG. 6 .
  • the temperature control assembly 30 may include a first temperature sensor 301, a second temperature sensor 302, and a temperature controller 303 (labeled in Figure 7).
  • the first temperature sensor 301 is disposed on the pot body 10 for detecting the temperature in the pot body 10 .
  • the second temperature sensor 302 is disposed on the heating assembly 20 for detecting the temperature of the bottom of the pot body 10 .
  • the temperature controller 303 is arranged on the heating assembly 20 and is connected to the first temperature sensor 301 and the second temperature sensor 302, for responding to the first cooking mode, controlling the heating assembly 20 according to the temperature in the pot body 10, and responding to the first cooking mode. In the second cooking mode, the heating assembly 20 is controlled according to the temperature of the bottom of the pot body 10 .
  • the first temperature sensor 301 may be disposed on the side of the pot body 10 to more truly reflect the temperature of the food to be cooked. In some embodiments, the first temperature sensor 301 may also be disposed on the pot cover assembly 200, or disposed on the top of the pot body 10, which is not limited in this application, and those skilled in the art can select according to actual needs.
  • the first temperature sensor 301 may be disposed in the side post 102 of the pot body and extend to the side of the pot body 101 to detect the temperature of the side of the pot body 101, and more truly reflect the temperature of the food to be cooked .
  • the second temperature sensor 302 may be disposed on the side surface of the heating assembly 20 close to the pot body 10 .
  • the second temperature sensor 302 may be disposed close to the heating assembly 20 facing the center of the pot body 10 .
  • the surface of one side of the pot body 10 is not limited in the present application, and those skilled in the art can select according to actual needs.
  • the second temperature sensor 302 may be disposed on the side surface of the heating body 201 close to the pot body 101 .
  • the second temperature sensor 302 may be disposed on the heating body 201 close to the pot facing the geometric center of the pot body 101 .
  • One side surface of the body body 101 is disposed on the side surface of the heating body 201 close to the pot.
  • the temperature controller 303 may specifically be a printed circuit board (PCB).
  • the temperature controller 303 may be disposed in the heating side column 202, and at least a part of the structure of the temperature controller 303 may extend from the heating side column 202 to control the heating body 201, as shown in FIG. 7 .
  • the temperature controller 303 is connected to the first temperature sensor 301 to receive the temperature signal in the pot body 10 .
  • the temperature controller 303 is connected with the second temperature sensor 302 to receive the temperature signal of the bottom of the pot body 10 .
  • the temperature controller 303 and the first temperature sensor 301 and the second temperature sensor 302 may be connected by lines or wirelessly, which are not limited in this application, and those skilled in the art can choose according to actual needs.
  • the signal transmission between the temperature controller 303 and the first temperature sensor 301 may be performed in a wireless manner.
  • a side surface of the side post body 2021 close to the side post 102 of the pot body can be provided with a sinking groove 20211 , the sinking groove 20211 is provided with a transmitting coil plate 304 , and the decorative piece 2022 is sleeved on the side post body 2021 , the transmitting coil plate 304 is fixed in the sink 20211.
  • the transmitting coil plate 304 and the temperature controller 303 can be connected by wires.
  • the side surface of the side post 102 of the pot body close to the heating side post 202 may be provided with a receiving coil plate (not shown in the drawings), the receiving coil plate and the transmitting coil plate 304 are correspondingly arranged, and the receiving coil plate and the first temperature sensor 301 connected by wires.
  • the pot body 10 and the heating assembly 20 are detachable.
  • the transmitting coil plate 304 and the receiving coil plate can be used to supply power to the first temperature sensor 301, and can also be used to supply other electrical components of the pot body 10 (such as , buttons, indicator lights, etc.) to supply power.
  • the transmitting coil plate 304 and the receiving coil plate can also be used to transmit the temperature signal detected by the first temperature sensor 301 to the temperature controller 303 .
  • the temperature controller 303 and the second temperature sensor 302 may be connected through a line, which is within the scope of easy understanding by those skilled in the art, and will not be repeated here.
  • the pot body 10 may further include an inner container, an outer shell and a base.
  • the inner pot is arranged in the accommodating space formed by the shell and the base, and is used to accommodate the food to be cooked.
  • the second temperature sensor 302 can be arranged in the base to detect the temperature of the bottom of the pot body 10.
  • the temperature controller 303 can also be arranged in the base, and is connected with the first temperature sensor 301 and the second temperature sensor 302 through a line.
  • the temperature controller 303 controls the heating assembly 20 according to the temperature in the pot body 10 in response to the first cooking mode. It may mean that: in response to the first cooking mode, the temperature controller 303 controls the heating assembly 20 to increase the temperature in the pot body 10 when the temperature in the pot body 10 is lower than the first temperature range, and the temperature in the pot body 10 increases. When the temperature is higher than the first temperature range, the heating assembly 20 is controlled to decrease the temperature in the pot body 10 . That is, in the first cooking mode, the temperature controller 303 controls the temperature in the pot body 10 within the first temperature range by controlling the heating assembly 20 .
  • controlling the heating assembly 20 to increase the temperature in the pot body 10 may refer to controlling the heating assembly 20 to open to increase the temperature in the pot body 10; it may also mean controlling the heating assembly 20 to increase the heating power to raise the temperature in the pot body 10 .
  • This application does not limit this, and those skilled in the art can make selections according to actual needs.
  • the heating assembly 20 is controlled to decrease the temperature in the pot body 10 . It may mean that the heating assembly 20 is controlled to be turned off to reduce the temperature in the pot body 10; This application does not limit this, and those skilled in the art can make selections according to actual needs.
  • the first temperature range may be 100-140° C. to achieve better cooking effect.
  • the lower limit of the first temperature range may be between 80-120°C
  • the upper limit of the first temperature range may be between 120-160°C, and those skilled in the art may choose according to actual needs,
  • the first temperature range may be 90-130°C, 80-120°C, and so on.
  • the temperature controller 303 is further configured to control the heating assembly 20 to lower the temperature of the bottom of the pot 10 when the temperature of the bottom of the pot 10 is higher than the first threshold in response to the first cooking mode.
  • the first threshold value is greater than or equal to the maximum value of the first temperature range.
  • controlling the heating assembly 20 to reduce the temperature at the bottom of the pot body 10 may refer to controlling the heating assembly 20 to be turned off to reduce the temperature at the bottom of the pot body 10; it may also mean controlling the heating assembly 20 to reduce the heating power, In order to reduce the temperature of the bottom of the pot body 10 .
  • This application does not limit this, and those skilled in the art can make selections according to actual needs.
  • the value range of the first threshold may be between 140-180°C.
  • the first threshold may be 140° C., 150° C., 160° C., 170° C., 180° C., which is not limited in this application, and those skilled in the art can select according to actual needs.
  • the first threshold may be the dry-burn protection temperature in the pressure cooking mode. That is to say, when the temperature of the bottom of the pot body 10 is higher than the first threshold, it means that dry burning may occur. At this time, controlling the heating assembly 20 to reduce the temperature of the bottom of the pot body 10 is beneficial to avoid safety accidents.
  • FIG. 8 is a graph showing the variation of the temperature in the pot body 10 with time in the first cooking mode of the cooking appliance shown in FIG. 1 .
  • A1 represents the lower limit value of the first temperature range
  • A2 represents the upper limit value of the first temperature range
  • A3 represents the first threshold value.
  • the temperature controller 303 controls the heating assembly 20 according to the temperature in the pot body 10 in response to the first cooking mode, so that the temperature in the pot body 10 fluctuates within the first temperature range.
  • the temperature controller 303 controls the heating assembly 20 according to the temperature of the bottom of the pot body 10 in response to the second cooking mode. It may mean that: in response to the second cooking mode, the temperature controller 303 controls the heating assembly 20 to increase the temperature of the bottom of the pot 10 when the temperature of the bottom of the pot 10 is lower than the second temperature range; When the temperature is higher than the second temperature range, the heating assembly 20 is controlled to reduce the temperature of the bottom of the pot body 10 . That is, in the second cooking mode, the temperature controller 303 controls the temperature of the bottom of the pot body 10 within the second temperature range.
  • controlling the heating assembly 20 to increase the temperature of the bottom of the pot body 10 may refer to controlling the heating assembly 20 to open to increase the temperature of the bottom of the pot body 10; it may also mean controlling the heating assembly 20 to increase The heating power increases the temperature of the bottom of the pot body 10 .
  • This application does not limit this, and those skilled in the art can make selections according to actual needs.
  • the second temperature range may be 210-290° C., at this time, the temperature in the pot body 10 is relatively stable, which is beneficial to achieve better cooking effect.
  • the lower limit of the second temperature range may be between 190-230°C
  • the upper limit of the second temperature range may be between 270-310°C, and those skilled in the art may choose according to actual needs,
  • the second temperature range may be 200-280°C, 220-300°C, and so on.
  • the upper limit of the second temperature range may be a protection temperature threshold of the heating assembly 20 .
  • the heating assembly 20 may be damaged.
  • the temperature of the bottom of the pot body 10 is lower than the protection temperature threshold, the heating assembly 20 can work safely.
  • the temperature controller 303 is further configured to control the heating assembly 20 to reduce the temperature in the pot body 10 when the temperature in the pot body 10 is higher than the second threshold value in response to the second cooking mode.
  • the second threshold is less than or equal to the minimum value of the second temperature range.
  • the value range of the second threshold may be between 160-200°C.
  • the first threshold may be 160° C., 170° C., 180° C., 190° C., 200° C., which is not limited in this application, and those skilled in the art can select according to actual needs.
  • the second threshold may be the highest temperature the food can withstand in the air fryer cooking mode. That is to say, when the temperature inside the pot body 10 is higher than the second threshold, the inside of the pot body 10 is overheated, which may affect the flavor of the food. better cooking results.
  • FIG. 9 is a graph showing the variation of the temperature of the bottom of the pot body 10 with time in the second cooking mode of the cooking appliance shown in FIG. 1 .
  • A4 represents the lower limit value of the second temperature range
  • A5 represents the upper limit value of the second temperature range
  • A6 represents the second threshold value.
  • the temperature controller 303 controls the heating assembly 20 according to the temperature of the bottom of the pot 10 in response to the second cooking mode, so that the temperature of the bottom of the pot 10 fluctuates within the second temperature range.
  • first”, “second” and “third” in this application are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, a feature defined as “first”, “second”, “third” may expressly or implicitly include at least one of that feature.
  • "a plurality of” means at least two, such as two, three, etc., unless otherwise expressly and specifically defined. All directional indications (such as up, down, left, right, front, rear%) in the embodiments of the present application are only used to explain the relative positional relationship between components under a certain posture (as shown in the accompanying drawings).
  • FIG. 10 is a schematic flowchart of an embodiment of a temperature control method for a pot assembly of the present application.
  • the specific structure of the pot body assembly has been described in detail above, and will not be repeated here.
  • the temperature control method of the pot body assembly includes:
  • S20 Obtain the cooking mode in which the pot body assembly is located, where the cooking mode includes a first cooking mode and a second cooking mode.
  • S20 may also precede S10.
  • S10 and S20 are not limited in this application, and those skilled in the art can select according to actual needs.
  • controlling the heating assembly according to the temperature in the pot body may be implemented by the following steps included:
  • the heating assembly In response to the first cooking mode, when the temperature in the pot is lower than the first temperature range, the heating assembly is controlled to increase the temperature in the pot, and when the temperature in the pot is higher than the first temperature range, the heating assembly is controlled to make the temperature in the pot increase. Temperature drop.
  • controlling the heating assembly according to the temperature of the bottom of the pot body may be implemented by the following steps included:
  • the heating assembly In response to the second cooking mode, when the temperature of the bottom of the pot body is lower than the second temperature range, the heating assembly is controlled to increase the temperature of the bottom of the pot body; when the temperature of the bottom of the pot body is higher than the second temperature range, the heating assembly is controlled Lower the temperature of the bottom of the pot.
  • FIG. 11 is a schematic structural diagram of an embodiment of a computer-readable storage medium of the present application.
  • the present application also provides a computer-readable storage medium 800, where the computer-readable storage medium 800 stores computer instructions, and the computer instructions implement the above control method when executed.
  • the technical solution of the present application can be embodied in the form of a software product in essence, or the part that contributes to the prior art, or all or part of the technical solution, and the computer software product is stored in a computer-readable storage medium 800, It includes several computer instructions (program data) for causing a computer device (which may be a personal computer, a server, or a network device, etc.) or a processor to execute all or part of the steps of the methods of various embodiments of the present invention.
  • a computer device which may be a personal computer, a server, or a network device, etc.
  • the aforementioned computer-readable storage medium 800 includes: a U disk, a removable hard disk, a read-only memory (ROM, Read-Only Memory), a random access memory (RAM, Random Access Memory), a magnetic disk or an optical disk and other media, and Electronic devices such as a computer, a mobile phone, a notebook computer, a tablet computer, and a camera having the above-mentioned computer-readable storage medium 800 .

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Abstract

锅体组件（100）及其温度控制方法、烹饪器具（500）以及计算机可读存储介质。其中，锅体组件（100）包括锅体（10）、加热组件（20）以及温度控制组件（30）。锅体（10）用于容纳待烹饪的食物。加热组件（20）用于对锅体（10）进行加热。温度控制组件（30）用于检测锅体（10）内的温度及锅体（10）底部的温度，还用于响应于第一烹饪模式，根据锅体（10）内的温度控制加热组件（20），响应于第二烹饪模式，根据锅体（10）底部的温度控制加热组件（20），解决了多功能烹饪器具在不同烹饪模式下的温度控制的问题。

Description

锅体组件及其温度控制方法以及烹饪器具
本申请要求于2021年3月30号提交的申请号为“2021103411405”，发明名称为“锅体组件及其温度控制方法以及烹饪器具”的中国专利申请的优先权，并通过引用方式将其全部并入本申请。
【技术领域】
本申请涉及生活电器的技术领域，具体涉及一种锅体组件及其温度控制方法、烹饪器具以及计算机可读存储介质。
【背景技术】
随着生活水平的提高，人们对食物的要求也越来越高。不同的烹饪方法能够获得不同的风味，因此，多功能烹饪器具应运而生。相比于传统的单一功能的烹饪器具，多功能烹饪器具功能多样化，有利于减少烹饪器具的台数，节约有限的空间位置。
目前，如何实现不同烹饪模式下的温度控制以获取最佳的烹饪效果，仍是一个亟待解决的问题。
【发明内容】
本申请提供一种锅体组件及其温度控制方法、烹饪器具以及计算机可读存储介质，解决了多功能烹饪器具在不同烹饪模式下的温度控制的问题。
本申请采用的第一个技术方案是：提供一种锅体组件，该锅体组件包括锅体、加热组件以及温度控制组件。其中，锅体用于容纳待烹饪的食物。加热组件用于对锅体进行加热。温度控制组件用于检测锅体内的温度及锅体底部的温度，还用于响应于第一烹饪模式，根据锅体内的温度控制加热组件，响应于第二烹饪模式，根据锅体底部的温度控制加热组件。
可选地，温度控制组件包括第一温度传感器、第二温度传感器以及温度控制器。其中，第一温度传感器设置于锅体，用于检测锅体内的温度。第二温度传感器设置于锅体和/或加热组件，用于检测锅体底部的温度。温度控制器与第一温度传感器以及第二温度传感器连接，用于响应于第一烹饪模式，根据锅体内的温度控制加热组件，响应于第二烹饪模式，根据锅体底部的温度控制加热 组件。
可选地，第一温度传感器设置于锅体的侧部。
可选地，温度控制器设置于加热组件，第一温度传感器与温度控制器之间通过无线的方式进行信号传输。
可选地，温度控制器用于响应于第一烹饪模式，在锅体内的温度低于第一温度范围时，控制加热组件使锅体内的温度上升，在锅体内的温度高于第一温度范围时，控制加热组件使锅体内的温度下降。
可选地，温度控制器还用于响应于第一烹饪模式，在锅体底部的温度高于第一阈值时，控制加热组件使锅体底部的温度降低；其中，第一阈值大于等于第一温度范围的最大值。
可选地，第一温度范围为100-140℃，第一阈值的取值范围在140-180℃之间。
可选地，温度控制器用于响应于第二烹饪模式，在锅体底部的温度低于第二温度范围时，控制加热组件使锅体底部的温度升高；在锅体底部的温度高于第二温度范围时，控制加热组件使锅体底部的温度降低。
可选地，温度控制器还用于响应于第二烹饪模式，在锅体内的温度高于第二阈值时，控制加热组件使锅体内的温度降低；其中，第二阈值小于等于第二温度范围的最小值。
可选地，第二温度范围为210-290℃，第二阈值的取值范围在160-200℃之间。
可选地，第二烹饪模式的烹饪温度高于第一烹饪模式的烹饪温度。
可选地，第一烹饪模式为压力烹饪模式，第二烹饪模式为空炸烹饪模式。
本申请采用的第二个技术方案是：提供一种烹饪器具，该烹饪器具包括以上任一的锅体组件。
可选地，该烹饪器具还包括锅盖组件、风机组件以及驱动组件。其中，锅盖组件与锅体组件配合使用实现第一烹饪模式。风机组件设置于锅盖组件的靠近锅体组件的一侧。驱动组件设置于锅盖组件的远离锅体组件的一侧，用于驱动风机组件工作。锅体组件、锅盖组件、风机组件以及驱动组件配合使用实现第二烹饪模式。
可选地，风机组件包括风叶和第一磁性件；驱动组件包括电机和第二磁性件，第二磁性件与第一磁性件对应设置；电机通过第二磁性件和第一磁性件带 动风叶转动。
本申请采用的第三个技术方案是：提供一种锅体组件的温度控制方法，锅体组件包括锅体和加热组件，加热组件用于对锅体进行加热，温度控制方法包括：获取锅体内的温度及锅体底部的温度；获取锅体组件所处的烹饪模式，烹饪模式包括第一烹饪模式和第二烹饪模式；响应于第一烹饪模式时，根据锅体内的温度控制加热组件；响应于第二烹饪模式，根据锅体底部的温度控制加热组件。
可选地，响应于第一烹饪模式，根据锅体内的温度控制加热组件，包括：响应于第一烹饪模式，在锅体内的温度低于第一温度范围时，控制加热组件使锅体内的温度上升，在锅体内的温度高于第一温度范围时，控制加热组件使锅体内的温度下降。
可选地，响应于第二烹饪模式，根据锅体底部的温度控制加热组件，包括：响应于第二烹饪模式，在锅体底部的温度低于第二温度范围时，控制加热组件使锅体底部的温度升高；在锅体底部的温度高于第二温度范围时，控制加热组件使锅体底部的温度降低。
本申请采用的第四个技术方案是：提供一种计算机可读存储介质，计算机可读存储介质存储有计算机指令，计算机指令在被执行时实现以上的温度控制方法。
本申请的有益效果：在第一烹饪模式下，根据锅体内的温度控制加热组件，在第二烹饪模式下，根据锅体底部的温度控制加热组件，从而在不同的烹饪模式下采用不同的温度控制方案，在不同的烹饪模式下都能达到较佳的烹饪效果。
【附图说明】
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请烹饪器具实施例的一结构示意图；
图2是图1所示的烹饪器具的分解结构示意图；
图3是图1所示的烹饪器具的部分结构的分解结构示意图；
图4是图1所示的烹饪器具的另一结构示意图；
图5是图1所述的烹饪器具的剖面结构示意图；
图6是图1所示的烹饪器具的加热组件的结构示意图；
图7是图6所示的加热组件的部分结构的分解结构示意图；
图8是图1所示的烹饪器具在第一烹饪模式下锅体内的温度随时间的变化曲线图；
图9是图1所示的烹饪器具在第二烹饪模式下锅体底部的温度随时间的变化曲线图；
图10是本申请锅体组件的温度控制方法实施例的一流程示意图；
图11是本申请计算机可读存储介质实施例的一结构示意图。
【具体实施方式】
下面结合附图和实施例，对本申请作进一步的详细描述。特别指出的是，以下实施例仅用于说明本申请，但不对本申请的范围进行限定。同样的，以下实施例仅为本申请的部分实施例而非全部实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本申请保护的范围。
在本申请中提及“实施例”意味着，结合实施例描述的特定特征、结构或特性可以包含在本申请的至少一个实施例中。在说明书中的各个位置出现该短语并不一定均是指相同的实施例，也不是与其它实施例互斥的独立的或备选的实施例。本领域技术人员显式地和隐式地理解的是，本文所描述的实施例可以与其它实施例相结合。
本申请烹饪器具实施例所描述的烹饪器具为多功能烹饪器具，具有第一烹饪模式和第二烹饪模式。在一些实施方式中，第二烹饪模式的烹饪温度可以高于第一烹饪模式，比如，第一烹饪模式可以是压力烹饪模式，第二烹饪模式可以是空炸烹饪模式。当然，在一些实施方式中，第二烹饪模式的烹饪温度也可以与第一烹饪模式的烹饪温度相当。
接下来，将以第一烹饪模式是压力烹饪模式，第二烹饪模式是空炸烹饪模式为例，来对烹饪器具实施例进行具体的说明。当然，本申请并不对此进行限制，在一些实施方式中，第一烹饪模式也可以是常压的炖煮模式，第二烹饪模式也可以是烘烤烹饪模式，本领域技术人员可以根据实际需求进行选择。
在一些实施例方式中，该烹饪器具还可以包括第三烹饪模式、第四烹饪模式，甚至更多的烹饪模式，本申请不作限制，本领域技术人员可以根据实际需 求进行设计。
请一参阅图1及图2，图1是本申请烹饪器具实施例的一结构示意图；图2是图1所示的烹饪器具的分解结构示意图。本申请烹饪器具实施例所描述的烹饪器具500可以包括锅体组件100、锅盖组件200、风机组件300以及驱动组件400。其中，锅体组件100和锅盖组件200配合可以实现压力烹饪模式。锅体组件100、锅盖组件200、风机组件300以及驱动组件400配合可以实现空炸烹饪模式。
其中，锅体组件100用于容纳待烹饪的食物并对待烹饪的食物进行加热。锅盖组件200盖设于锅体组件100上，用于对锅体组件100进行密封。举例而言，锅盖组件200可以包括锅盖本体(附图中未标注)以及开设在所述锅盖本体上的排气阀(附图中未标注)，以与锅体组件100配合，实现压力烹饪模式。
如图2所示，风机组件300设置于锅盖组件200的靠近锅体组件100的一侧。驱动组件400设置于锅盖组件200的远离锅体组件100的一侧，用于驱动风机组件300工作。驱动组件400驱动风机组件300工作，使得锅体组件100内部的空气循环，因此，锅体组件100、锅盖组件200、风机组件300以及驱动组件400配合可以实现空炸烹饪模式。
请参阅图3，图3是图1所示的烹饪器具的部分结构的分解结构示意图。具体地，风机组件300包括风叶310和第一磁性件320。驱动组件400包括电机430和第二磁性件440，第二磁性件440与第一磁性件320对应设置。电机430通过第二磁性件440和第一磁性件320带动风叶310转动，以实现锅体组件100内的空气循环，从而实现空炸烹饪模式。
驱动组件400还包括上盖410和下盖420。上盖410和下盖420围设形成容腔(附图中未标注)，电机430和第二磁性件440设置于容腔内。第二磁性件440设置于电机430的靠近锅盖组件200的一侧。第二磁性件440和电机430之间还设置有隔磁片450。第一磁性件320设置于风叶310的靠近锅盖组件200的一侧，并与第二磁性件440对应设置。电机430通过第二磁性件440和第二磁性件440带动风叶310转动，以实现锅体组件100内的空气循环，从而实现空炸烹饪模式。
可选地，驱动组件400和风机组件300都可以可拆卸的安装于锅盖组件200上。
当驱动组件400和风机组件300中的任意一者未被安装于锅盖组件200上， 或者两者均未被安装于锅盖组件200上时，锅体组件100内部无法形成空气循环，烹饪器具500仅能实现压力烹饪模式。如图4所示，图4是图1所示的烹饪器具的另一结构示意图，当驱动组件400未被安装于锅盖组件200上时，风机组件300不转动，锅体组件100内部无法形成空气循环，烹饪器具500仅能实现压力烹饪模式。
在一些实施方式中，当驱动组件400和风机组件300两者均被安装于锅盖组件200上时，烹饪器具500可以被设置为能实现空炸烹饪模式，但不能实现压力烹饪模式，以避免空炸烹饪模式下，锅体组件100内部起压，造成安全事故。
在一些实施方式中，当驱动组件400和风机组件300两者均被安装于锅盖组件200上时，烹饪器具500可以被设置为既能实现空炸烹饪模式，又能实现压力烹饪模式，本申请对此不作限制，本领域技术人员可以根据实际需求进行选择。
此外，在一些实施方式中，风机组件300和驱动组件400均可以是不可拆卸的。或者风机组件300和驱动组件400其中的一者可拆卸，另一者不可拆卸，比如风机组件300不可拆卸，驱动组件400可拆卸，或者驱动组件400不可拆卸，风机组件300可拆卸，对此，本申请不作限制，本领域技术人员可以根据实际需求进行选择。
关于锅体组件100的具体结构，请参阅以下本申请锅体组件100实施例的详细描述。
请参阅图5，图5是图1所述的烹饪器具的剖面结构示意图。本申请锅体组件实施例所描述的锅体组件100包括锅体10、加热组件20以及温度控制组件30。其中，锅体10用于容纳待烹饪的食物。加热组件20用于对锅体10进行加热。温度控制组件30用于检测锅体10内的温度及锅体10底部的温度，还用于响应于第一烹饪模式，根据锅体10内的温度控制加热组件20，并响应于第二烹饪模式，根据锅体10底部的温度控制加热组件20。
在第一烹饪模式下，根据锅体内的温度控制加热组件，在第二烹饪模式下，根据锅体底部的温度控制加热组件，从而在不同的烹饪模式下采用不同的温度控制方案，在不同的烹饪模式下都能达到较佳的烹饪效果。
接下来仍然以第一烹饪模式为压力烹饪模式，第二烹饪模式为空炸烹饪模式，对本实施例的有益效果进行说明：
压力烹饪模式下，根据锅体10内的温度控制加热组件20有利于达到较佳的烹饪效果。原因在于，锅体10内的温度能够真实反映待烹饪食物的真实温度，还能够真实反映锅体10内的烹饪压力。此时，以锅体10内的温度控制加热组件20，有利于将待烹饪食物的温度以及锅体10内的压力控制在一定范围内，以达到压力烹饪模式下的最佳烹饪效果。
空炸烹饪模式下，根据锅体10底部的温度控制加热组件20有利于保护加热组件20。原因在于，空炸烹饪模式下，加热组件20的工作温度高于压力烹饪模式，而锅体10内温度的变化相比于锅体10底部的温度变化会有一定的延迟，若根据锅体10内的温度控制加热组件20，有可能出现锅体10的温度未达到上限值，而加热组件20本身温度已经很高的情况，容易导致加热组件20的过热。
当然，本申请并不对此进行限制，在一些实施例方式中，第一烹饪模式也可以是常压的炖煮模式，第二烹饪模式也可以是烘烤烹饪模式，本领域技术人员可以根据实际需求进行选择。
如图6所示，图6是图1所示的烹饪器具的加热组件的结构示意图。具体地，加热组件20可以包括加热本体201和加热侧柱202。其中，加热本体201用于对锅体10进行加热。加热本体201可以包括壳体2012、面板2011以及加热源(图6中未示出)。面板2011作为加热组件20的工作表面，盖设在壳体2012上。壳体2012与面板2011共同围设形成容纳空间(附图中未标注)，用于容纳加热源。举例而言，加热源可以是加热线圈，本申请对加热源的具体结构不作限制，本领域技术人员可以根据实际需求进行选择。
其中，加热侧柱202自加热本体201的外壁向远离加热本体201的方向延伸。加热侧柱202可以包括侧柱本体2021和装饰件2022。侧柱本体2021与壳体2012一体成型设置，自壳体2012的外壁向远离壳体2012的方向延伸，装饰件2022可以套设在侧柱本体2021上。
装饰件2022的设置有利于提高加热组件20的外观。一方面，装饰件2022的设置使得加热本体201和加热侧柱202能够具有不同的颜色。侧柱本体2021和壳体2012一体成型设置时，受到现有技术工艺的限制，难以实现侧柱本体2021和壳体2012的双色注塑。另一方面，在加热本体201和加热侧柱202的颜色相同时，装饰件2022的设置也能够提高加热组件20外观的一致性。侧柱本体2021和壳体2012一体成型设置时，受到现有技术工艺的限制，由于结构比较复杂，即使侧柱本体2021和壳体2012单色注塑，也难以保证侧柱本体2021和壳体2012 外观的一致性。
当然，本申请并不对此进行限制，在一些实施方式中，加热侧柱202也可以不包括装饰件2022，或者，为了使加热侧柱202与加热本体201呈现不同的颜色，侧柱本体2021和壳体2012也可以是两件式组装在一起的，本申请不作限制，本领域技术人员可以根据实际需求进行选择。
请一并参阅图1及图5，锅体10可以包括锅体本体101和锅体侧柱102。锅体本体101用于容纳待烹饪的食物，并对应加热本体201设置。锅体侧柱102自锅体本体101的外壁向远离锅体本体101的方向延伸，并对应加热侧柱202设置。锅体侧柱102与锅体本体101可以是一体成型设置，也可以是两件式设置的，本申请不作限制，本领域技术人员可以根据实际需求进行选择。按键、指示灯等电性元件可以设置在锅体侧柱102上。
举例而言，锅体本体101和加热本体201的颜色可以是一致的，锅体侧柱102和加热侧柱202的颜色可以是一致的。并且，锅体侧柱102和加热侧柱202的颜色与锅体本体101和加热本体201的颜色可以不同，以使锅体组件100具有较为亮眼的外观配色。
锅体10与加热组件20之间可以是可拆卸的，方便对锅体10进行清洗。在一些实施方式中，锅体10与加热组件20之间也可以是不可拆卸的，本申请不作限制，本领域技术人员可以根据实际需求进行选择。
请一并参阅图5及图7，图7是图6所示的加热组件的部分结构的分解结构示意图。温度控制组件30可以包括第一温度传感器301、第二温度传感器302以及温度控制器303(标注在图7中)。其中，第一温度传感器301设置于锅体10，用于检测锅体10内的温度。第二温度传感器302设置于加热组件20，用于检测锅体10底部的温度。温度控制器303设置于加热组件20，并与第一温度传感器301以及第二温度传感器302连接，用于响应于第一烹饪模式，根据锅体10内的温度控制加热组件20，并响应于第二烹饪模式，根据锅体10底部的温度控制加热组件20。
如图5所示，第一温度传感器301可以设置于锅体10的侧部，以更真实的反应待烹饪食物的温度。在一些实施方式中，第一温度传感器301也可以设置在锅盖组件200上，或者设置在锅体10的顶部，本申请不作限制，本领域技术人员可以根据实际需求进行选择。
具体地，第一温度传感器301可以设置在锅体侧柱102内，并延伸至锅体 本体101的侧部，以检测锅体本体101的侧部的温度，更真实的反应待烹饪食物的温度。
如图5所示，第二温度传感器302可以设置于加热组件20的靠近锅体10的一侧表面，比如，第二温度传感器302可以正对锅体10的正中央设置在加热组件20的靠近锅体10的一侧表面，本申请不作限制，本领域技术人员可以根据实际需求进行选择。
具体地，第二温度传感器302可以设置在加热本体201的靠近锅体本体101的一侧表面，比如，第二温度传感器302可以正对锅体本体101的几何中心设置在加热本体201的靠近锅体本体101的一侧表面。
温度控制器303具体可以为PCB(Printed Circuit Board)电路板。温度控制器303可以设置在加热侧柱202内，温度控制器303的至少部分结构可以伸出于加热侧柱202，以对加热本体201进行控制，如图7所示。
温度控制器303与第一温度传感器301连接，以接收锅体10内的温度信号。温度控制器303与第二温度传感器302连接，以接收锅体10底部的温度信号。具体地，温度控制器303与第一温度传感器301与第二温度传感器302之间可以通过线路连接，也可以无线连接，本申请不作限制，本领域技术人员可以根据实际需求进行选择。
具体地，温度控制器303与第一温度传感器301之间可以通过无线的方式进行信号传输。
请继续参阅图7，侧柱本体2021的靠近锅体侧柱102的一侧表面可以设置有沉槽20211，沉槽20211内设置有发射线圈板304，装饰件2022套设在侧柱本体2021上，将发射线圈板304固设于沉槽20211内。发射线圈板304与温度控制器303之间可以通过线路连接。锅体侧柱102的靠近加热侧柱202的一侧表面可以设置有接收线圈板(附图中未示出)，接收线圈板与发射线圈板304对应设置，接收线圈板与第一温度传感器301之间通过线路连接。
锅体10与加热组件20之间可拆卸，一方面，发射线圈板304与接收线圈板配合可以用于向第一温度传感器301供电，还可以用于向锅体10的其它电性元件(比如，按键、指示灯等)供电。另一方面，发射线圈板304与接收线圈板配合还可以用于将第一温度传感器301所检测到的温度信号传递给温度控制器303。
具体地，温度控制器303与第二温度传感器302之间可以通过线路连接， 在本领域技术人员容易理解的范围之内，此处不再赘述。
在一些实施方式中，锅体10还可以包括内胆、外壳和底座。其中，内胆设置于外壳和底座共同围设形成的容纳空间内，用于容纳待烹饪的食物，第二温度传感器302可以设置在底座中，用于检测锅体10底部的温度，温度控制器303也可以设置在底座中，与第一温度传感器301及第二温度传感器302之间通过线路连接。
温度控制器303响应于第一烹饪模式，根据锅体10内的温度控制加热组件20。可以是指：温度控制器303响应于第一烹饪模式，在锅体10内的温度低于第一温度范围时，控制加热组件20使锅体10内的温度上升，在锅体10内的温度高于第一温度范围时，控制加热组件20使锅体10内的温度下降。也就是说，在第一烹饪模式下，温度控制器303通过控制加热组件20将锅体10内的温度控制在第一温度范围内。
本申请中，控制加热组件20使锅体10内的温度上升，可以是指，控制加热组件20打开，以使锅体10内的温度上升；也可以是指，控制加热组件20的增大加热功率，以使锅体10内的温度上升。本申请对此不作限制，本领域技术人员可以根据实际需求进行选择。
同理，本申请中，控制加热组件20使锅体10内的温度下降。可以是指，控制加热组件20关闭，以使锅体10内的温度下降；也可以是指，控制加热组件20减小加热功率，以使锅体10内的温度下降。本申请对此不作限制，本领域技术人员可以根据实际需求进行选择。
其中，第一温度范围可以为100-140℃，以达到较佳的烹饪效果。在一些实施方式中，第一温度范围的下限制可以在80-120℃之间，第一温度范围的上限值可以在120-160℃之间，本领域技术人员可以根据实际需求进行选择，比如第一温度范围可以是90-130℃，80-120℃等等。
此外，温度控制器303还用于响应于第一烹饪模式，在锅体10底部的温度高于第一阈值时，控制加热组件20使锅体10底部的温度降低。其中，第一阈值大于等于第一温度范围的最大值。
本申请中，控制加热组件20使锅体10底部的温度降低，可以是指，控制加热组件20关闭，以使锅体10底部的温度降低；也可以是指控制加热组件20减小加热功率，以使锅体10底部的温度降低。本申请对此不作限制，本领域技术人员可以根据实际需求进行选择。
具体地，第一阈值的取值范围可以在140-180℃之间。举例而言，第一阈值可以是140℃、150℃、160℃、170℃、180℃，本申请对此不作限制，本领域技术人员可以根据实际需求进行选择。第一阈值可以是压力烹饪模式下的干烧防护温度。也就是说，当锅体10底部的温度高于第一阈值时，意味着可能出现干烧，此时，控制加热组件20使锅体10底部的温度降低，有利于避免出现安全事故。
请参阅图8，图8是图1所示的烹饪器具在第一烹饪模式下锅体10内的温度随时间的变化曲线图。其中，A1表示第一温度范围的下限值，A2表示第一温度范围的上限值，A3表示第一阈值。如图8所示，温度控制器303响应于第一烹饪模式，根据锅体10内的温度控制加热组件20，使得锅体10内的温度在第一温度范围内波动。
温度控制器303响应于第二烹饪模式，根据锅体10底部的温度控制加热组件20。可以是指：温度控制器303响应于第二烹饪模式，在锅体10底部的温度低于第二温度范围时，控制加热组件20使锅体10底部的温度升高；在锅体10底部的温度高于第二温度范围时，控制加热组件20使锅体10底部的温度降低。也就是说，在第二烹饪模式下，温度控制器303将锅体10底部的温度控制在第二温度范围内。
本申请中，控制加热组件20使锅体10底部的温度升高，可以是指，控制加热组件20打开，以使锅体10底部的温度升高；也可以是指，控制加热组件20增大加热功率，以使锅体10底部的温度升高。本申请对此不作限制，本领域技术人员可以根据实际需求进行选择。
其中，第二温度范围可以为210-290℃，此时，锅体10内的温度也比较稳定，有利于达到较佳的烹饪效果。在一些实施方式中，第二温度范围的下限制可以在190-230℃之间，第二温度范围的上限值可以在270-310℃之间，本领域技术人员可以根据实际需求进行选择，比如第二温度范围可以是200-280℃，220-300℃等等。
在一些实施方式中，第二温度范围的上限值可以是加热组件20的保护温度阈值。锅体10底部的温度超过该保护温度阈值时，有可能会导致加热组件20的损坏。锅体10底部的温度低于该保护温度阈值时，加热组件20可以安全地工作。
此外，温度控制器303还用于响应于第二烹饪模式，在锅体10内的温度高 于第二阈值时，控制加热组件20使锅体10内的温度降低。其中，第二阈值小于等于第二温度范围的最小值。
具体地，第二阈值的取值范围可以在160-200℃之间。举例而言，第一阈值可以是160℃、170℃、180℃、190℃、200℃，本申请对此不作限制，本领域技术人员可以根据实际需求进行选择。第二阈值可以是空炸烹饪模式下食物所能承受的最高温度。也就是说，当锅体10内的温度高于第二阈值时，锅体10内部过热，可能会影响食物的风味，此时，控制加热组件20使锅体10内的温度降低，有利于保证较佳的烹饪效果。
请参阅图9，图9是图1所示的烹饪器具在第二烹饪模式下锅体10底部的温度随时间的变化曲线图。其中，A4表示第二温度范围的下限值，A5表示第二温度范围的上限值，A6表示第二阈值。如图9所示，温度控制器303响应于第二烹饪模式，根据锅体10底部的温度控制加热组件20，使得锅体10底部的温度在第二温度范围内波动。
本申请中的术语“第一”、“第二”、“第三”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”、“第三”的特征可以明示或者隐含地包括至少一个该特征。本申请的描述中，“多个”的含义是至少两个，例如两个，三个等，除非另有明确具体的限定。本申请实施例中所有方向性指示(诸如上、下、左、右、前、后……)仅用于解释在某一特定姿态(如附图所示)下各部件之间的相对位置关系、运动情况等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。此外，术语“包括”和“具有”以及它们任何变形，意图在于覆盖不排他的包含。例如包含了一系列步骤或单元的过程、方法、系统、产品或设备没有限定于已列出的步骤或单元，而是可选地还包括没有列出的步骤或单元，或可选地还包括对于这些过程、方法、产品或设备固有的其它步骤或单元。
请参阅图10，图10是本申请锅体组件的温度控制方法实施例的一流程示意图。关于锅体组件的具体结构，前文已有详细的描述，此处不再赘述。该锅体组件的温度控制方法包括：
S10：获取锅体内的温度及锅体底部的温度。
关于该步骤的详细描述，前文已有记载，此处不再赘述。
S20：获取锅体组件所处的烹饪模式，烹饪模式包括第一烹饪模式和第二烹饪模式。
关于该步骤的详细描述，前文已有记载，此处不再赘述。在一些实施方式中，S20也可以在S10之前。关于S10和S20的具体先后顺序，本申请不作限制，本领域技术人员可以根据实际需求进行选择。
S30：响应于第一烹饪模式时，根据锅体内的温度控制加热组件；响应于第二烹饪模式，根据锅体底部的温度控制加热组件。
响应于第一烹饪模式时，根据锅体内的温度控制加热组件，具体可以通过其所包括的如下步骤实现：
响应于第一烹饪模式，在锅体内的温度低于第一温度范围时，控制加热组件使锅体内的温度上升，在锅体内的温度高于第一温度范围时，控制加热组件使锅体内的温度下降。
关于该步骤的详细描述，前文已有记载，此处不再赘述。
响应于第二烹饪模式，根据锅体底部的温度控制加热组件，具体可以通过其所包括的如下步骤实现：
响应于第二烹饪模式，在锅体底部的温度低于第二温度范围时，控制加热组件使锅体底部的温度升高；在锅体底部的温度高于第二温度范围时，控制加热组件使锅体底部的温度降低。
关于该步骤的详细描述，前文已有记载，此处不再赘述。
请参阅图11，图11是本申请计算机可读存储介质实施例的一结构示意图。本申请还提供一种计算机可读存储介质800，计算机可读存储介质800存储有计算机指令，计算机指令在被执行时实现以上的控制方法。
本申请的技术方案本质上或者说对现有技术做出贡献的部分或者该技术方案的全部或部分可以以软件产品的形式体现出来，该计算机软件产品存储在一个计算机可读存储介质800中，包括若干计算机指令(程序数据)用以使得一台计算机设备(可以是个人计算机，服务器，或者网络设备等)或处理器(processor)执行本发明各个实施方式方法的全部或部分步骤。而前述的计算机可读存储介质800包括：U盘、移动硬盘、只读存储器(ROM，Read-Only Memory)、随机存取存储器(RAM，Random Access Memory)、磁碟或者光盘等各种介质以及具有上述计算机可读存储介质800的电脑、手机、笔记本电脑、平板电脑、相机等电子设备。
以上所述仅为本申请的部分实施例，并非因此限制本申请的保护范围，凡是利用本申请说明书及附图内容所作的等效装置或等效流程变换，或直接或间 接运用在其他相关的技术领域，均同理包括在本申请的专利保护范围内。

Claims (19)

  1. 一种锅体组件，其特征在于，包括：
    锅体，用于容纳待烹饪的食物；
    加热组件，用于对所述锅体进行加热；以及
    温度控制组件，用于检测所述锅体内的温度及所述锅体底部的温度，还用于响应于第一烹饪模式，根据所述锅体内的温度控制所述加热组件，响应于第二烹饪模式，根据所述锅体底部的温度控制所述加热组件。
  2. 根据权利要求1所述的锅体组件，其特征在于，所述温度控制组件包括：
    第一温度传感器，设置于所述锅体，用于检测所述锅体内的温度；
    第二温度传感器，设置于所述锅体或所述加热组件，用于检测所述锅体底部的温度；以及
    温度控制器，与所述第一温度传感器和所述第二温度传感器连接，用于响应于第一烹饪模式，根据所述锅体内的温度控制所述加热组件，响应于第二烹饪模式，根据所述锅体底部的温度控制所述加热组件。
  3. 根据权利要求2所述的锅体组件，其特征在于，所述第一温度传感器设置于所述锅体的侧部。
  4. 根据权利要求2所述的锅体组件，其特征在于，所述温度控制器设置于所述加热组件，所述第一温度传感器与所述温度控制器之间通过无线的方式进行信号传输。
  5. 根据权利要求2所述的锅体组件，其特征在于，所述温度控制器用于响应于所述第一烹饪模式，在所述锅体内的温度低于第一温度范围时，控制所述加热组件使所述锅体内的温度上升，在所述锅体内的温度高于所述第一温度范围时，控制所述加热组件使所述锅体内的温度下降。
  6. 根据权利要求5所述的锅体组件，其特征在于，所述温度控制器还用于响应于所述第一烹饪模式，在所述锅体底部的温度高于第一阈值时，控制所述加热组件使所述锅体底部的温度降低；
    其中，所述第一阈值大于等于所述第一温度范围的最大值。
  7. 根据权利要求6所述的锅体组件，其特征在于，所述第一温度范围为100-140℃，所述第一阈值的取值范围在140-180℃之间。
  8. 根据权利要求2所述的锅体组件，其特征在于，所述温度控制器用于响 应于所述第二烹饪模式，在所述锅体底部的温度低于第二温度范围时，控制所述加热组件使所述锅体底部的温度升高；在所述锅体底部的温度高于所述第二温度范围时，控制所述加热组件使所述锅体底部的温度降低。
  9. 根据权利要求8所述的锅体组件，其特征在于，所述温度控制器还用于响应于所述第二烹饪模式，在所述锅体内的温度高于第二阈值时，控制所述加热组件使所述锅体内的温度降低；
    其中，所述第二阈值小于等于所述第二温度范围的最小值。
  10. 根据权利要求9所述的锅体组件，其特征在于，所述第二温度范围为210-290℃，所述第二阈值的取值范围在160-200℃之间。
  11. 根据权利要求1所述的锅体组件，其特征在于，所述第二烹饪模式的烹饪温度高于所述第一烹饪模式的烹饪温度。
  12. 根据权利要求11所述的锅体组件，其特征在于，所述第一烹饪模式为压力烹饪模式，所述第二烹饪模式为空炸烹饪模式。
  13. 一种烹饪器具，其特征在于，包括权利要求1-12中任一项所述的锅体组件。
  14. 根据权利要求13所述的烹饪器具，其特征在于，还包括：
    锅盖组件，与所述锅体组件配合使用实现所述第一烹饪模式；
    风机组件，设置于所述锅盖组件的靠近所述锅体组件的一侧；及
    驱动组件，设置于所述锅盖组件的远离所述锅体组件的一侧，用于驱动所述风机组件工作；
    其中，所述锅体组件、所述锅盖组件、所述风机组件以及所述驱动组件配合使用实现所述第二烹饪模式。
  15. 根据权利要求14所述的烹饪器具，其特征在于，所述风机组件包括风叶和第一磁性件；所述驱动组件包括电机和第二磁性件，所述第二磁性件与所述第一磁性件对应设置；所述电机通过所述第二磁性件和所述第一磁性件带动所述风叶转动。
  16. 一种锅体组件的温度控制方法，所述锅体组件包括锅体和加热组件，所述加热组件用于对所述锅体进行加热，其特征在于，所述温度控制方法包括：
    获取所述锅体内的温度及所述锅体底部的温度；
    获取所述锅体组件所处的烹饪模式，所述烹饪模式包括第一烹饪模式和第二烹饪模式；
    响应于第一烹饪模式，根据所述锅体内的温度控制所述加热组件；
    响应于第二烹饪模式，根据所述锅体底部的温度控制所述加热组件。
  17. 根据权利要求16所述的温度控制方法，其特征在于，所述响应于第一烹饪模式，根据所述锅体内的温度控制所述加热组件，包括：
    响应于所述第一烹饪模式，在所述锅体内的温度低于第一温度范围时，控制所述加热组件使所述锅体内的温度上升，在所述锅体内的温度高于所述第一温度范围时，控制所述加热组件使所述锅体内的温度下降。
  18. 根据权利要求16所述的温度控制方法，其特征在于，所述响应于第二烹饪模式，根据所述锅体底部的温度控制所述加热组件，包括：
    响应于所述第二烹饪模式，在所述锅体底部的温度低于第二温度范围时，控制所述加热组件使所述锅体底部的温度升高；在所述锅体底部的温度高于所述第二温度范围时，控制所述加热组件使所述锅体底部的温度降低。
  19. 一种计算机可读存储介质，其特征在于，所述计算机可读存储介质存储有计算机指令，所述计算机指令在被执行时实现权利要求16-18任一项所述的温度控制方法。
PCT/CN2021/113883 2021-03-30 2021-08-20 锅体组件及其温度控制方法以及烹饪器具 WO2022205749A1 (zh)

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