WO2022205596A1

WO2022205596A1 - Method and device for fault detection, storage medium, and baby incubator

Info

Publication number: WO2022205596A1
Application number: PCT/CN2021/096309
Authority: WO
Inventors: 杜常境; 刘嵩; 李智斌; 谭超; 陈子祥
Original assignee: 深圳市科曼医疗设备有限公司
Priority date: 2021-03-29
Filing date: 2021-05-27
Publication date: 2022-10-06
Also published as: CN113125045A

Abstract

The present application discloses a method and device for fault detection, a storage medium, and a baby incubator. The fault detection method comprises: determining a first target heating working mode according to user setting information; acquiring a voltage value of a first target probe socket end corresponding to the first target heating working mode; and performing fault detection according to the voltage value of the first target probe socket end, so as to determine whether the first target probe has a fault. By executing the fault detection method, whether a first target probe has a fault can be determined according to the voltage value of a first target probe socket end, thereby achieving the objective of detecting in real time whether a fault has occurred in a first target probe.

Description

Fault detection method and device, storage medium and incubator

technical field

The invention relates to the technical field of fault detection, in particular to a fault detection method and device, a storage medium and an incubator.

Background technique

The existing incubator products have two working modes: box temperature and skin temperature; the box temperature mode is to set the target temperature in the incubator, and monitor the temperature in the incubator through the box temperature probe. If the monitoring box temperature does not reach the set temperature If the target temperature is set, the temperature in the box will be heated up through the temperature control module, so that the temperature in the box will reach the set target temperature; the skin temperature mode is to set the target value of the baby's body temperature, which is monitored by the body temperature probe attached to the baby's body. The baby's body temperature controls the temperature of the incubator. If the body temperature monitored by the body temperature probe does not reach the set target body temperature, the temperature in the incubator will rise through the temperature control module, so that the baby's body temperature will rise and reach the set target. Body temperature; the user can select the appropriate working mode according to the actual use needs, and cultivate and monitor the baby.

technical problem

Existing incubator products use the set working mode and the temperature monitored by the temperature probe associated with the working mode to control the temperature of the incubator; if the temperature probe associated with the set working mode fails and cannot When the failure of the temperature probe is detected, it is easy to put the life of the baby in the box at risk.

technical solutions

Based on this, it is necessary to propose a fault detection method and device, a storage medium and an incubator for the above problems. The purpose of the present invention is to implement the fault detection method, so as to realize the real-time detection of whether the first target probe is faulty. Purpose.

In a first aspect, the present application provides a fault detection method, the fault detection method comprising:

Determine the first target heating working mode according to the user setting information; the first target heating working mode is the box temperature working mode or the body temperature working mode;

obtaining the voltage value of the socket end of the first target probe corresponding to the first target heating working mode, where the first target probe is a box temperature probe or a body temperature probe;

Perform fault detection according to the voltage value at the socket end of the first target probe to determine whether the first target probe is faulty.

Optionally, performing fault detection according to the voltage value of the socket end of the first target probe, and determining whether the first target probe is faulty, includes:

If the voltage value of the socket end of the first target probe is greater than the preset open-circuit voltage value, it is determined that the first target probe is faulty and the state of the first target probe is off;

If the voltage value of the socket end of the first target probe is less than the preset short-circuit voltage value, it is determined that the first target probe is faulty and the state of the first target probe is short-circuit;

Wherein, the preset short-circuit voltage value is smaller than the preset open-circuit voltage value.

Optionally, after determining that the first target probe is faulty, the method includes:

The first target heating working mode is set to a non-selectable state, and the alarm module is controlled to alarm the failure of the first target probe.

Optionally, after the first target heating working mode is set to a non-selectable state, and the alarm module is controlled to perform a fault alarm for the first target probe, the method includes:

Determine the target switching working mode according to the user setting information; the target switching working mode is the automatic switching working mode or the manual switching working mode;

If the target switching working mode is the automatic switching working mode, the voltage value of the socket end of the second target probe is obtained, and whether the second target probe is faulty is determined according to the voltage value of the socket end of the second target probe, and the first target probe is faulty. The second target probe is a box temperature probe or a body temperature probe;

If it is determined that the second target probe is not faulty, switch to the second target heating working mode and execute the second target heating working mode.

Optionally, the fault detection method further includes:

If it is determined that the second target probe is faulty, the second target heating working mode is set to a non-selectable state, the heating module is controlled to be turned off, and the alarm module is controlled to alarm the second target probe fault and the heating module is turned off. .

Optionally, after the first target heating working mode is set to a non-selectable state, and the alarm module is controlled to perform a fault alarm for the first target probe, the method further includes:

If the target switching working mode is the manual switching working mode, the heating module is controlled to be turned off and the alarm module is controlled to give an alarm for the heating module to be turned off.

Optionally, before determining the first target heating working mode according to the user setting information, the method includes:

Obtain the state of the Hall switch; the Hall switch is installed on the casing of the box body in which the box temperature probe and the body temperature probe are installed;

If the state of the Hall switch is OFF, it is determined that both the box temperature probe and the body temperature probe are faulty, the box temperature working mode and the body temperature working mode are both set to the non-selectable state, and the heating module is controlled Close, and control the alarm module to alarm for box temperature probe failure, body temperature probe failure alarm and heating module shutdown alarm;

If the state of the Hall switch is ON, then return to the step of determining the first target heating working mode according to the user setting information.

In a second aspect, the present application provides a fault detection device, the fault detection device comprising:

a first determination module, configured to determine a first target heating working mode according to user setting information; the first target heating working mode is a box temperature working mode or a body temperature working mode;

an acquisition module, configured to acquire the voltage value of the socket end of the first target probe corresponding to the first target heating working mode, where the first target probe is a box temperature probe or a body temperature probe;

The second determination module is configured to perform fault detection according to the voltage value of the socket end of the first target probe, and determine whether the first target probe is faulty.

In a third aspect, the present application provides a computer-readable storage medium, which stores a computer program, and when the computer program is executed by a processor, causes the processor to perform the following steps:

In a fourth aspect, the present application provides an incubator, comprising a memory and a processor, wherein the memory stores a computer program, and when the computer program is executed by the processor, the processor performs the following steps:

beneficial effect

Implementing the embodiments of the present application will have the following beneficial effects:

Adopting a fault detection method and device, a storage medium and an incubator of the present invention, the fault detection method includes: determining a first target heating working mode according to user setting information; acquiring a first target probe corresponding to the first target heating working mode The voltage value of the socket end; the fault detection is performed according to the voltage value of the socket end of the first target probe to determine whether the first target probe is faulty. By executing the fault detection method, whether the first target probe is faulty can be determined according to the voltage value of the socket end of the first target probe, thereby realizing the purpose of real-time detection of whether the first target probe is faulty.

Description of drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the accompanying drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only These are some embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings without any creative effort.

in:

1 is a schematic flowchart of a fault detection method in an embodiment of the present application;

FIG. 2 is a schematic flowchart of additional steps of the fault detection method in the embodiment shown in FIG. 1 of the application;

3 is another schematic flowchart of the fault detection method in the embodiment of the present application;

4 is a schematic structural diagram of a fault detection device in an embodiment of the present application;

FIG. 5 is a structural block diagram of an incubator in an embodiment of the present application.

Embodiments of the present invention

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.

Please refer to FIG. 1 , which is a schematic flowchart of a fault detection method in an embodiment of the present application. The fault detection method includes:

Step 101: Determine a first target heating working mode according to user setting information; the first target heating working mode is a box temperature working mode or a body temperature working mode;

Step 102: Obtain the voltage value of the socket end of the first target probe corresponding to the first target heating working mode, where the first target probe is a box temperature probe or a body temperature probe;

Step 103: Perform fault detection according to the voltage value of the socket end of the first target probe to determine whether the first target probe is faulty.

In the embodiment of the present application, the fault detection method is applied to a fault detection system, and the fault detection system includes: a main control chip module, a box temperature probe and a body temperature probe; both the box temperature probe and the body temperature probe are electrically connected to the main control chip module; the user The first target heating working mode is set through the human-computer interaction terminal, wherein the human-computer interaction terminal can be the upper computer of the fault detection system or the equipment terminal installed with the fault detection system, and other forms of human-computer can also be used in practical applications. The interaction method is not limited here.

Further, when the main control chip module determines that the first target heating working mode is the box temperature working mode according to the user setting information, the main control chip module obtains the voltage value of the socket end electrically connected between the box temperature probe and the main control chip module, and obtains the voltage value according to the obtained temperature. The magnitude of the voltage value at the socket end of the box temperature probe to determine whether the box temperature probe is faulty; when the main control chip module determines that the first target heating working mode is the body temperature working mode according to the user setting information, the main control chip module obtains the body temperature probe and the temperature probe. The voltage value of the socket end electrically connected to the main control chip module is determined, and whether the body temperature probe is faulty is determined according to the acquired voltage value of the socket end of the body temperature probe.

Specifically, in a feasible implementation manner, the main control chip module includes: a first chip and a second chip, the second chip, the box temperature probe and the body temperature probe are all electrically connected to the first chip; the second chip is used for receiving The user sets the information and determines the first target heating working mode according to the user setting information, and then sends the fault detection instruction of the first target probe corresponding to the first target heating working mode to the first chip, and the first chip receives the first target probe. After the fault detection instruction of the first target probe, obtain the voltage value of the socket end of the first target probe electrically connected to the first chip according to the fault detection command of the first target probe, and the first chip according to the acquired voltage value of the socket end of the first target probe Perform fault detection on the first target probe, determine whether the first target probe is faulty, and feed back the fault detection result of the first target probe to the second chip.

It should be noted that the above is only a feasible implementation manner of the fault detection system to which the fault detection method is applied, which is not limited here.

In the embodiment of the present application, the fault detection method includes: determining a first target heating working mode according to user setting information; obtaining a voltage value of the first target probe socket corresponding to the first target heating working mode; The voltage value is used for fault detection to determine whether the first target probe is faulty. By executing the fault detection method, whether the first target probe is faulty can be determined according to the voltage value of the socket end of the first target probe, thereby realizing the purpose of real-time detection of whether the first target probe is faulty.

In a feasible implementation manner, fault detection is performed according to the voltage value of the socket end of the first target probe, and a specific fault detection method for determining whether the first target probe is faulty includes: if the voltage value of the socket end of the first target probe is greater than a preset open circuit voltage value, it is determined that the first target probe is faulty and the state of the first target probe is off; if the voltage value at the socket end of the first target probe is less than the preset short-circuit voltage value, it is determined that the first target probe is faulty and the first target probe is faulty The state of is short circuit; wherein, the preset short circuit voltage value is less than the preset open circuit voltage value.

In this embodiment of the present application, two preset voltage values may be preset for detecting whether the first target probe is faulty, and the two preset voltage values are specifically a preset open-circuit voltage value and a preset short-circuit voltage value, wherein , the preset open circuit voltage value is used to detect whether the first target probe has a falling off fault, the preset short circuit voltage value is used to detect whether the first target probe has a short circuit fault, and the preset short circuit voltage value is less than the preset open circuit voltage value. In a feasible implementation manner, when the main control chip module determines that the first target heating working mode is the box temperature working mode according to the user setting information, the main control chip module obtains the value of the socket end where the box temperature probe is electrically connected to the main control chip module. voltage value, the main control chip module compares the obtained voltage value of the socket end of the box temperature probe with the preset open circuit voltage value; when the voltage value of the socket end of the box temperature probe is greater than the preset open circuit voltage value, it is determined that the box temperature probe appears Fault and the state of the box temperature probe is off; when the voltage value of the socket end of the box temperature probe is less than or equal to the preset open circuit voltage value, the main control chip module will obtain the box temperature probe socket end voltage value and preset short-circuit voltage When the voltage value of the socket end of the box temperature probe is less than the preset short-circuit voltage value, it is determined that the box temperature probe is faulty and the status of the box temperature probe is short circuit; when the voltage value of the socket end of the box temperature probe is greater than or equal to the preset value When the short-circuit voltage value is detected, make sure that the box temperature probe is not faulty.

Or, when the main control chip module determines that the first target heating working mode is the body temperature working mode according to the user setting information, the main control chip module compares the acquired voltage value of the socket end of the body temperature probe with the preset disconnection voltage value; When the voltage value of the socket end of the probe is greater than the preset breaking voltage value, it is determined that the body temperature probe is faulty and the state of the body temperature probe is off; when the voltage value of the socket end of the body temperature probe is less than or equal to the preset breaking voltage value, the main control chip module will The obtained voltage value of the socket end of the body temperature probe is compared with the preset short circuit voltage value; when the voltage value of the socket end of the body temperature probe is less than the preset short circuit voltage value, it is determined that the body temperature probe is faulty and the state of the body temperature probe is short circuit; When the voltage value of the socket end of the probe is greater than or equal to the preset short-circuit voltage value, it is determined that the body temperature probe is not faulty.

It should be noted that the above is only a feasible implementation manner of detecting the fault of the first target probe according to the voltage value of the socket end of the first target probe, the preset open-circuit voltage value and the preset short-circuit voltage value. After the main control chip module determines that the first target heating working mode is the box temperature working mode or the body temperature working mode according to the user setting information, the main control chip module first obtains the voltage value of the socket end of the first target probe and the preset short-circuit voltage value. For comparison, after it is determined that the voltage value of the socket end of the first target probe is greater than or equal to the preset short-circuit voltage value and it is determined that the first target probe is not faulty, then the voltage of the socket end of the first target probe obtained by the main control chip module is determined. The value is compared with the preset trip voltage value. In practical applications, the order of comparing the voltage value of the socket end of the first target probe obtained by the main control chip module with the preset open-circuit voltage value and the preset short-circuit voltage value is not limited here, and for different types of The same preset open-circuit voltage value and preset short-circuit voltage value can be set for the temperature probes of the Do limit.

In a feasible implementation manner, the main control chip module includes: a first chip and a second chip, the second chip, the box temperature probe and the body temperature probe are all electrically connected to the first chip; the second chip is used for receiving user setting information and determine the first target heating working mode according to the user setting information, and then the second chip sends the fault detection instruction of the first target probe corresponding to the first target heating working mode to the first chip, and the first chip receives the first target After the fault detection instruction of the probe, obtain the voltage value of the socket end where the first target probe is electrically connected to the first chip according to the fault detection instruction of the first target probe, and the first chip compares the acquired voltage value of the socket end of the first target probe with the voltage value of the socket end of the first target probe. The preset short-circuit voltage values are compared; when the voltage value of the socket end of the first target probe is less than the preset short-circuit voltage value, it is determined that the first target probe is faulty and the state of the first target probe is short-circuit, and the first target probe is in a short-circuit state. The fault detection result in the state of short circuit is fed back to the second chip; when the voltage value of the socket end of the first target probe is greater than or equal to the preset short circuit voltage value, the first chip module will obtain the obtained voltage value of the socket end of the first target probe Compare with the preset open circuit voltage value; when the voltage value of the socket end of the first target probe is greater than the preset open circuit voltage value, it is determined that the first target probe is faulty and the state of the first target probe is off, and the first target probe is removed. The state of the fault detection result of falling off is fed back to the second chip; when the voltage value of the socket end of the first target probe is less than or equal to the preset open-circuit voltage value, it is determined that the first target probe is not faulty, and the first target probe is not faulty. The non-faulty fault detection result is fed back to the second chip.

In the embodiment of the present application, by using the acquired voltage value of the socket end of the first target probe to compare with the preset open-circuit voltage value and the preset short-circuit voltage value, it is possible to determine whether the first target probe is faulty at the same time. , it can also be determined that the specific fault type of the first target probe is falling off or short circuit.

In a feasible implementation manner, after determining that the first target probe is faulty, the method includes: setting the first target heating working mode to a non-selectable state, and controlling the alarm module to alarm the first target probe failure.

In the embodiment of the present application, the main control chip module determines the first target heating working mode according to the user setting information and performs fault detection on the first target probe corresponding to the first target heating working mode. The fault detection result obtained is the first target probe After the failure of falling off or short circuit occurs, the main control chip module will set the first target heating working mode function of the interactive end where the device installed with the fault detection system interacts with the user to the non-selectable state, and then after the first target probe fails. , the user can no longer select and set the first target heating working mode, which prevents the equipment from working normally due to the user's mistaken selection of the heating working mode in which the probe fails.

Further, the fault detection system also includes an alarm module, which is electrically connected to the main control chip module. When the main control chip module detects that the first target probe is faulty, the main control chip module will control the alarm module electrically connected to it to carry out the operation. The first target probe fault alarm. Specifically, the alarm module may include: a display screen, a display light and/or a buzzer. When the main control chip module detects that the first target probe is faulty, the main control chip module will control the display screen in the alarm module to display the first target probe. The information of the target probe and the fault information of the first target probe. For example, when the first target probe is a box temperature probe and the fault type of the first target probe is detached, then the display screen can specifically display: "Box temperature probe failure: detached At the same time, when the main control chip module detects that the first target probe is faulty, the main control chip module will also control the display light in the alarm module to flash and the buzzer in the alarm module to emit an alarm sound, and then pass the The alarm module realizes the effect of reminding users of faults.

In a feasible implementation manner, the main control chip module includes: a first chip and a second chip, the second chip, the box temperature probe, the body temperature probe and the alarm module are all electrically connected to the first chip; After the set information determines the first target heating working mode and sends the first target probe fault detection instruction to the first chip, the first chip performs fault detection on the first target probe and feeds back the fault detection result to the second chip. The chip sends the first target probe fault alarm instruction to the first chip according to the first target probe fault detection result fed back by the first chip, and the first chip controls the alarm module electrically connected to it according to the received first target probe fault alarm instruction The first target probe failure alarm is performed.

It should be noted that the specific structure of the above-mentioned alarm module is only a feasible implementation manner. In practical applications, the alarm module may also have other components, composition forms, and specific alarm implementation methods, which are not limited here.

Please refer to FIG. 2 , which is a schematic flowchart of the additional steps of the fault detection method in the embodiment shown in FIG. 1 of the application, after setting the first target heating working mode to a non-selectable state, and controlling the alarm module to alarm the first target probe fault ,include:

Step 201: Determine a target switching working mode according to user setting information; the target switching working mode is an automatic switching working mode or a manual switching working mode;

Step 202: If the target switching working mode is the automatic switching working mode, obtain the voltage value of the socket end of the second target probe, and determine whether the second target probe is faulty according to the voltage value of the socket end of the second target probe, The second target probe is a box temperature probe or a body temperature probe;

Step 203: If it is determined that the second target probe is not faulty, switch to the second target heating working mode and execute the second target heating working mode.

In the embodiment of the present application, after the main control chip module determines that the first target probe is faulty, the main control chip module will also determine the target switching working mode according to the user setting information, and according to the failure information of the first target probe failure and the target Execution steps after switching the working mode is determined.

Specifically, after it is determined that the first target probe is faulty, when it is determined that the target switching working mode is the automatic switching working mode, the main control chip module will automatically perform fault detection on the second target probe, and the main control chip module obtains the second target probe. The voltage value of the socket end is compared with the voltage value of the socket end of the second target probe and the preset open circuit voltage value; when the voltage value of the socket end of the second target probe is greater than the preset open circuit voltage value, it is determined that the second target probe is faulty and the second target probe is faulty. The state of the target probe is off; when the voltage value of the socket end of the second target probe is less than or equal to the preset open circuit voltage value, the main control chip module will obtain the voltage value of the socket end of the second target probe and the preset short circuit voltage value Compare; when the voltage value of the socket end of the second target probe is less than the preset short-circuit voltage value, it is determined that the second target probe is faulty and the state of the second target probe is short circuit; when the voltage value of the socket end of the second target probe is greater than or When it is equal to the preset short-circuit voltage value, it is determined that the second target probe is not faulty, and the heating operation mode is automatically switched from the first target heating operation mode to the second target heating operation mode.

In the embodiment of the present application, the fault detection system further includes: a heating module, which is electrically connected to the main control chip module; the fault detection method further includes: if it is determined that the second target probe is faulty, setting the second target to a heating working mode Set to a non-selectable state, control the heating module to turn off, and control the alarm module to alarm the second target probe failure and the heating module to turn off the alarm.

In the embodiment of the present application, when it is determined that the second target probe has a fault of falling off or short-circuiting, the main control chip module will set the function of the second target heating working mode of the interactive end where the device installed with the fault detection system interacts with the user to In the non-selectable state, after the second target probe fails, the user can no longer select and set the second target heating working mode, which avoids the device from being unable to work normally due to the user's mistaken selection of the heating working mode in which the probe fails.

Further, after it is determined that the second target probe falls off or is short-circuited, the main control chip module will also turn off the heating module electrically connected to it, and control the alarm module to perform a second target probe failure alarm and a heating module shutdown alarm. Specifically, it can be understood that the display screen in the alarm module has already displayed the fault alarm information of the first target probe. On this basis, the display screen in the alarm module will also display the fault alarm information of the second target probe and the heating module is turned off. Alarm information, for example, the display in the alarm module simultaneously displays: "box temperature probe failure: off!, body temperature probe failure: short circuit!, heating module has been turned off!"; at the same time, the alarm module can specifically include a display light, the display light Flashing, or the alarm module can specifically include three display lights, corresponding to the box temperature probe, body temperature probe and heating module respectively, and the three display lights flash at the same time; at the same time, the buzzer in the alarm module can also emit an alarm sound at the same time. . Furthermore, the effect of reminding users of faults is realized through the alarm module.

It should be noted that the above is only a feasible implementation method for detecting the fault of the second target probe according to the voltage value of the socket end of the second target probe, the preset open-circuit voltage value and the preset short-circuit voltage value. The order of comparing the voltage value of the socket end of the second target probe obtained by the main control chip module with the preset open-circuit voltage value and the preset short-circuit voltage value is not limited here, and can be set for different types of temperature measuring probes. For the same preset open-circuit voltage value and preset short-circuit voltage value, different preset open-circuit voltage values and preset short-circuit voltage values can also be set for different types of temperature measuring probes according to actual conditions, which are not limited here.

In a feasible implementation manner, the main control chip module includes: a first chip and a second chip, the second chip, the box temperature probe, the body temperature probe and the alarm module are all electrically connected to the first chip; The setting information determines the first target heating working mode and sends the first target probe fault detection instruction to the first chip. The first chip performs fault detection on the first target probe and feeds back the fault detection result to the second chip. The first target probe fault detection result fed back by the first chip sends the first target probe fault alarm command to the first chip, and the first chip controls the alarm module electrically connected to it to perform the first target probe fault alarm command according to the received first target probe fault alarm command. After a target probe fault alarm, the second chip determines that the target switching working mode is the automatic switching working mode according to the user setting information, and according to the fault information of the first target probe failure and the automatic switching working mode, the second target probe fault detection command is set to Sent to the first chip, the first chip performs fault detection on the second target probe according to the received second target probe fault detection instruction, and the first chip will be based on the second target probe. The fault detection result of the second target probe determined by the preset short-circuit voltage value is fed back to the second chip; when the fault detection result of the second target probe received by the second chip is that the second target probe is not faulty, the second chip switches the probe The command is sent to the first chip, and the first chip switches the heating working mode from the first target heating working mode to the second target heating working mode according to the received probe switching command; when the second target probe received by the second chip fails When the detection result is that the second target probe fails, the first chip feeds back the detection result of the second target probe failure to the second chip, and the second chip controls the corresponding control according to the received detection result of the second target probe failure. The command is sent to the first chip. The first chip sets the second target heating working mode function to a non-selectable state and turns off the heating module according to the received control command. At the same time, it controls the alarm module to alarm the second target probe fault and the heating module Turn off the alarm.

In the embodiment of the present application, the user can automatically switch the working mode by selecting the setting, so that after any one of the box temperature probe and the body temperature probe fails, and the other probe does not fail, control the probe from the faulty probe. The corresponding heating working mode is automatically switched to the heating working mode corresponding to the unfailed probe. When only one of the two probes fails, it can be switched to the unfaulted probe to continue the temperature measurement, ensuring that The equipment operates as normal as possible.

Further, in a feasible implementation manner, the first target heating working mode is set to a non-selectable state, and after controlling the alarm module to alarm the fault of the first target probe, it also includes: if the target switching working mode is manual switching work mode, control the heating module to turn off and control the alarm module to alarm the heating module to turn off.

Specifically, after it is determined that the first target probe is faulty, when it is determined that the target switching working mode is the manual switching working mode, the main control chip module will turn off the heating module electrically connected to it, and control the alarm module to perform a heating module shutdown alarm. In this switching working mode, the user needs to manually select the second target heating working mode, and the main control chip module will determine the second target heating working mode according to the user setting information, and then obtain the second target heating working mode corresponding to the second target heating working mode. The voltage value of the socket end of the probe is determined, and whether the second target probe is faulty is determined according to the voltage value of the socket end of the second target probe, the preset open circuit voltage value and the preset short circuit voltage value.

In a feasible implementation manner, the main control chip module includes: a first chip and a second chip; the second chip, the box temperature probe, the body temperature probe and the alarm module are all electrically connected to the first chip; The setting information determines the first target heating working mode and sends the first target probe fault detection instruction to the first chip. The first chip performs fault detection on the first target probe and feeds back the fault detection result to the second chip. The first target probe fault detection result fed back by the first chip sends the first target probe fault alarm command to the first chip, and the first chip controls the alarm module electrically connected to it to perform the first target probe fault alarm command according to the received first target probe fault alarm command. After a target probe fault alarm, the second chip determines the target switching working mode as the manual switching working mode according to the user setting information, and issues the corresponding control command to the first target probe according to the fault information and the manual switching working mode. A chip, the first chip turns off the heating module according to the received control command, and at the same time controls the alarm module to give an alarm for turning off the heating module.

In the embodiment of the present application, by setting two switching working modes, the automatic switching working mode and the manual switching working mode, the user's choice in switching the working mode is increased, and the use experience of the user is improved.

In a feasible implementation manner, please refer to FIG. 3 , which is another schematic flowchart of the fault detection method in the embodiment of the present application. Before determining the first target heating working mode according to the user setting information, the steps include:

Step 301, obtaining the state of the Hall switch; the Hall switch is installed on the casing of the box body inside which the box temperature probe and the body temperature probe are installed;

Step 302: If the state of the Hall switch is OFF, it is determined that both the box temperature probe and the body temperature probe are faulty, and both the box temperature working mode and the body temperature working mode are set to a non-selectable state, Control the heating module to turn off, and control the alarm module to alarm the box temperature probe failure, the temperature probe failure alarm and the heating module shutdown alarm;

Step 303: If the state of the Hall switch is ON, return to the step of determining the first target heating working mode according to the user setting information.

In the embodiment of the present application, the fault detection system includes: a main control chip module, a box temperature probe, a body temperature probe, a Hall switch, a heating module and an alarm module; wherein, the box temperature probe and the body temperature probe are simultaneously installed in a box body, The Hall switch is installed on the shell of the box body, and the box temperature probe, body temperature probe, Hall switch, heating module and alarm module are all electrically connected with the main control chip module; Before the fault detection, the state of the Hall switch will be obtained first. When the state of the Hall switch is OFF, it means that the box body has fallen off, so it can be determined that both the box temperature probe and the body temperature probe installed in the box body have fallen off fault. , then the main control chip module will set both the box temperature working mode and the body temperature working mode to the non-selectable state, control the heating module to turn off, and control the alarm module to alarm the box temperature probe failure, the body temperature probe failure alarm and the heating module shutdown alarm.

Further, when the state of the Hall switch is ON, it means that the box body has not fallen off, so the control chip module returns to execute any one of the fault detection methods in the embodiments shown in FIG. 1 to FIG. 2 .

In a feasible implementation manner, the main control chip module includes: a first chip and a second chip; the second chip, the box temperature probe, the body temperature probe, the Hall switch, the heating module and the alarm module are all electrically connected to the first chip ; The second chip first sends the Hall switch state detection instruction to the first chip, and the first chip obtains the state of the Hall switch according to the received Hall switch state detection instruction. When the state of the Hall switch is OFF, the description At this time, the box body has fallen off, so it can be determined that both the box temperature probe and the body temperature probe installed in the box body have fallen off, then the first chip will fall off the box temperature probe and the body temperature probe determined according to the state of the Hall switch. The fault detection result is fed back to the second chip, and the second chip sends the corresponding control command to the first chip. The first chip sets both the box temperature working mode and the body temperature working mode to the non-selectable state according to the control command, and controls the heating module. Close, and control the alarm module to alarm the box temperature probe failure, the temperature probe failure alarm and the heating module shutdown alarm.

In the embodiment of the present application, by setting the Hall switch, it is possible to directly detect through the state of the Hall switch when the box body on which the box temperature probe and the body temperature probe are installed falls off, causing both the box temperature probe and the body temperature probe to fall off. , without the effect of fault detection of the box temperature probe and the body temperature probe separately.

In a feasible implementation manner, the fault detection of the first target probe and the second target probe by the main control chip module or the first chip and the fault detection by acquiring the state of the Hall switch may be performed synchronously and in real time, It is only that when the main control chip module or the second chip determines whether the first target probe or the second target probe fails, the real-time fault detection result of the corresponding target probe needs to be obtained.

Please refer to FIG. 4 , which is a schematic structural diagram of a fault detection device in an embodiment of the present application. The fault detection device includes:

The first determination module 401 is configured to determine a first target heating working mode according to user setting information; the first target heating working mode is a box temperature working mode or a body temperature working mode;

an obtaining module 402, configured to obtain the voltage value of the first target probe socket end corresponding to the first target heating working mode, where the first target probe is a box temperature probe or a body temperature probe;

The second determining module 403 is configured to perform fault detection according to the voltage value of the socket end of the first target probe, and determine whether the first target probe is faulty.

In the embodiment of the present application, the first determination module 401 is called to determine the first target heating working mode according to the user setting information, the voltage value of the first target probe socket corresponding to the first target heating working mode is obtained by calling the obtaining module 402, and By invoking the second determining module 403 to perform fault detection according to the voltage value at the socket end of the first target probe to determine whether the first target probe is faulty, thereby realizing the purpose of real-time detection of whether the first target probe is faulty

Figure 5 shows the internal structure of the incubator in one embodiment. Specifically, the incubator may be a terminal or a server. As shown in Figure 5, the incubator includes a processor, memory and a network interface connected through a system bus. Wherein, the memory includes a non-volatile storage medium and an internal memory. The non-volatile storage medium of the incubator stores an operating system, and also stores a computer program. When the computer program is executed by the processor, the processor can implement the fault detection method. A computer program can also be stored in the internal memory, and when the computer program is executed by the processor, the processor can execute the fault detection method. Those skilled in the art can understand that the structure shown in FIG. 5 is only a block diagram of a part of the structure related to the solution of the present application, and does not constitute a limitation on the incubator to which the solution of the present application is applied. The case may include more or fewer components than shown in the figures, or combine certain components, or have a different arrangement of components.

In one embodiment, an incubator is proposed, comprising a memory and a processor, wherein the memory stores a computer program, and when the computer program is executed by the processor, the processor performs the following steps:

In the embodiment of the present application, the incubator is installed with a fault detection system, and the incubator can execute the fault detection method through the fault detection system. When it is determined that the first target probe is not faulty, the main control chip module controls the first target probe to perform temperature collection, and compares the received temperature collected by the first target probe with the target temperature, and the main control chip module according to the comparison result Control the output state of the heating module; when the temperature collected by the first target probe is greater than the target temperature, the main control chip module controls the heating module to turn off; when the temperature collected by the first target probe is less than the target temperature, the main control chip module controls the heating The module is turned on, and the more the temperature collected by the first target probe differs from the target temperature, the greater the output power of the heating module controlled by the main control chip module.

It can be understood that when the switching working mode set by the user is the automatic switching working mode, after detecting that the first target probe is faulty and detecting that the second target probe is not faulty, the heating working mode automatically starts from the first target heating work. The mode is switched to the second target heating working mode, and the main control chip module, the second target probe and the heating module execute the same control method of the output state of the heating module as described above.

In a feasible implementation manner, the main control chip module includes: a first chip and a second chip; when the second chip determines that the first target probe is not faulty according to the fault detection result of the first target probe fed back by the first chip , the second chip sends an instruction to execute the first target heating working mode and the corresponding target temperature to the first chip, the first chip controls the first target probe to perform temperature collection according to the received instruction, and the received first target The temperature collected by the probe is compared with the target temperature, and the first chip controls the output state of the heating module according to the comparison result; when the temperature collected by the first target probe is greater than the target temperature, the first chip controls the heating module to turn off; when the first target When the temperature collected by the probe is lower than the target temperature, the first chip controls the heating module to turn on, and the more the temperature collected by the first target probe differs from the target temperature, the greater the output power of the first chip controls the heating module.

In one embodiment, a computer-readable storage medium is provided, which stores a computer program, and when the computer program is executed by a processor, causes the processor to perform the following steps:

Those of ordinary skill in the art can understand that all or part of the processes in the methods of the above embodiments can be implemented by instructing relevant hardware through a computer program, and the program can be stored in a non-volatile computer-readable storage medium , when the program is executed, it may include the flow of the above-mentioned method embodiments. Wherein, any reference to memory, storage, database or other medium used in the various embodiments provided in this application may include non-volatile and/or volatile memory. Nonvolatile memory may include read only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in various forms such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous chain Road (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.

The technical features of the above embodiments can be combined arbitrarily. In order to make the description simple, all possible combinations of the technical features in the above embodiments are not described. However, as long as there is no contradiction in the combination of these technical features It is considered to be the range described in this specification.

The above-mentioned embodiments only represent several embodiments of the present application, and the descriptions thereof are relatively specific and detailed, but should not be construed as a limitation on the scope of the patent of the present application. It should be pointed out that for those skilled in the art, without departing from the concept of the present application, several modifications and improvements can be made, which all belong to the protection scope of the present application. Therefore, the scope of protection of the patent of the present application shall be subject to the appended claims.

Claims

A fault detection method, characterized in that the fault detection method comprises:

Determine the first target heating working mode according to the user setting information; the first target heating working mode is the box temperature working mode or the body temperature working mode;

obtaining the voltage value of the socket end of the first target probe corresponding to the first target heating working mode, where the first target probe is a box temperature probe or a body temperature probe;

Perform fault detection according to the voltage value at the socket end of the first target probe to determine whether the first target probe is faulty.
The fault detection method according to claim 1, wherein the performing fault detection according to the voltage value of the socket end of the first target probe, and determining whether the first target probe is faulty, comprises:

If the voltage value of the socket end of the first target probe is greater than the preset open-circuit voltage value, it is determined that the first target probe is faulty and the state of the first target probe is off;

If the voltage value of the socket end of the first target probe is less than the preset short-circuit voltage value, it is determined that the first target probe is faulty and the state of the first target probe is short-circuit;

Wherein, the preset short-circuit voltage value is smaller than the preset open-circuit voltage value.
The fault detection method according to claim 2, wherein after determining that the first target probe is faulty, the method comprises:

The first target heating working mode is set to a non-selectable state, and the alarm module is controlled to alarm the failure of the first target probe.
The fault detection method according to claim 3, characterized in that, after the first target heating working mode is set to a non-selectable state, and the alarm module is controlled to perform a fault alarm for the first target probe, the method comprises:

Determine the target switching working mode according to the user setting information; the target switching working mode is the automatic switching working mode or the manual switching working mode;

If the target switching working mode is the automatic switching working mode, the voltage value of the socket end of the second target probe is obtained, and whether the second target probe is faulty is determined according to the voltage value of the socket end of the second target probe, and the first target probe is faulty. The second target probe is a box temperature probe or a body temperature probe;

If it is determined that the second target probe is not faulty, switch to the second target heating working mode and execute the second target heating working mode.
The fault detection method according to claim 4, wherein the fault detection method further comprises:

If it is determined that the second target probe is faulty, the second target heating working mode is set to a non-selectable state, the heating module is controlled to be turned off, and the alarm module is controlled to alarm the second target probe fault and the heating module is turned off. .
The fault detection method according to claim 4, wherein after setting the first target heating working mode to a non-selectable state and controlling the alarm module to alarm the first target probe fault, the method further comprises:

If the target switching working mode is the manual switching working mode, the heating module is controlled to be turned off and the alarm module is controlled to give an alarm for the heating module to be turned off.
The fault detection method according to claim 1, wherein before determining the first target heating working mode according to the user setting information, the method comprises:

Obtain the state of the Hall switch; the Hall switch is installed on the casing of the box body in which the box temperature probe and the body temperature probe are installed;

If the state of the Hall switch is OFF, it is determined that both the box temperature probe and the body temperature probe are faulty, the box temperature working mode and the body temperature working mode are both set to the non-selectable state, and the heating module is controlled Close, and control the alarm module to alarm for box temperature probe failure, body temperature probe failure alarm and heating module shutdown alarm;

If the state of the Hall switch is ON, then return to the step of determining the first target heating working mode according to the user setting information.
A fault detection device, characterized in that the fault detection device comprises:

a first determination module, configured to determine a first target heating working mode according to user setting information; the first target heating working mode is a box temperature working mode or a body temperature working mode;

an acquisition module, configured to acquire the voltage value of the socket end of the first target probe corresponding to the first target heating working mode, where the first target probe is a box temperature probe or a body temperature probe;

The second determination module is configured to perform fault detection according to the voltage value of the socket end of the first target probe, and determine whether the first target probe is faulty.
A computer-readable storage medium storing a computer program, when the computer program is executed by a processor, the processor causes the processor to perform the steps of the fault detection method according to any one of claims 1 to 7.
An incubator, comprising a memory and a processor, wherein the memory stores a computer program, and when the computer program is executed by the processor, the processor is made to perform as described in any one of claims 1 to 7 The steps of the fault detection method.