CN113125045A - Fault detection method and device, storage medium and infant incubator - Google Patents
Fault detection method and device, storage medium and infant incubator Download PDFInfo
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- CN113125045A CN113125045A CN202110331834.0A CN202110331834A CN113125045A CN 113125045 A CN113125045 A CN 113125045A CN 202110331834 A CN202110331834 A CN 202110331834A CN 113125045 A CN113125045 A CN 113125045A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K15/00—Testing or calibrating of thermometers
- G01K15/007—Testing
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61G—TRANSPORT, PERSONAL CONVEYANCES, OR ACCOMMODATION SPECIALLY ADAPTED FOR PATIENTS OR DISABLED PERSONS; OPERATING TABLES OR CHAIRS; CHAIRS FOR DENTISTRY; FUNERAL DEVICES
- A61G11/00—Baby-incubators; Couveuses
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
- G01R19/165—Indicating that current or voltage is either above or below a predetermined value or within or outside a predetermined range of values
- G01R19/16566—Circuits and arrangements for comparing voltage or current with one or several thresholds and for indicating the result not covered by subgroups G01R19/16504, G01R19/16528, G01R19/16533
- G01R19/16576—Circuits and arrangements for comparing voltage or current with one or several thresholds and for indicating the result not covered by subgroups G01R19/16504, G01R19/16528, G01R19/16533 comparing DC or AC voltage with one threshold
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/52—Testing for short-circuits, leakage current or ground faults
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/54—Testing for continuity
Abstract
The embodiment of the invention discloses a fault detection method and device, a storage medium and an infant incubator, wherein the fault detection method comprises the following steps: determining a first target heating working mode according to user setting information; acquiring a voltage value of a socket end of a first target probe corresponding to a first target heating working mode; and carrying out fault detection according to the voltage value of the socket end of the first target probe, and determining whether the first target probe has a fault. By executing the fault detection method, whether the first target probe fails or not can be determined according to the voltage value of the socket end of the first target probe, so that the purpose of detecting whether the first target probe fails or not in real time is achieved.
Description
Technical Field
The invention relates to the technical field of fault detection, in particular to a fault detection method and device, a storage medium and an infant incubator.
Background
The existing incubator product has two working modes of incubator temperature and skin temperature; the box temperature mode is to set a target temperature in the incubator, monitor the temperature in the incubator through a box temperature probe, and if the monitored temperature does not reach the set target temperature, heat the temperature in the incubator through a temperature control module so as to enable the temperature in the incubator to reach the set target temperature; the skin temperature mode is to set a target value of the body temperature of the infant, the temperature of the infant incubator is controlled by the body temperature monitored by the body temperature probe attached to the body of the infant, and if the body temperature monitored by the body temperature probe does not reach the set target body temperature, the temperature in the infant incubator can be raised through the temperature control module, so that the body temperature of the infant is raised and reaches the set target body temperature; the user can select a proper working mode according to actual use requirements to culture and monitor the infant. The existing incubator product controls the temperature of the incubator through a set working mode and the temperature monitored by a temperature probe associated with the working mode; if the temperature probe associated with the set working mode breaks down and the fault condition of the temperature probe cannot be detected, the life danger of the baby in the box is easily caused.
Disclosure of Invention
In view of the above, it is necessary to provide a fault detection method and apparatus, a storage medium, and a incubator, and an objective of the present invention is to implement the fault detection method, thereby achieving the purpose of detecting whether the first target probe has a fault in real time.
In a first aspect, the present application provides a fault detection method, comprising:
determining a first target heating working mode according to user setting information; the first target heating working mode is a box temperature working mode or a body temperature working mode;
acquiring a voltage value of a socket end of a first target probe corresponding to the first target heating working mode, wherein the first target probe is a box temperature probe or a body temperature probe;
and carrying out fault detection according to the voltage value of the socket end of the first target probe, and determining whether the first target probe has a fault.
Optionally, the performing fault detection according to the voltage value at the socket end of the first target probe to determine whether the first target probe has a fault includes:
if the voltage value of the socket end of the first target probe is larger than a preset open circuit voltage value, determining that the first target probe has a fault and the first target probe is in a falling state;
if the voltage value of the socket end of the first target probe is smaller than a preset short-circuit voltage value, determining that the first target probe fails and the state of the first target probe is short-circuit;
wherein the preset short-circuit voltage value is smaller than the preset open-circuit voltage value.
Optionally, after determining that the first target probe fails, the method includes:
and setting the first target heating working mode to be in an unselected state, and controlling an alarm module to carry out fault alarm on the first target probe.
Optionally, after the setting the first target heating operation mode to the non-selectable state and controlling the alarm module to perform the fault alarm on the first target probe, the method includes:
determining a target switching working mode according to user setting information; the target switching working mode is an automatic switching working mode or a manual switching working mode;
if the target switching working mode is the automatic switching working mode, acquiring a voltage value of a socket end of a second target probe, and determining whether the second target probe has a fault according to the voltage value of the socket end of the second target probe, wherein the second target probe is a box temperature probe or a body temperature probe;
and if the second target probe is determined not to have a fault, switching to a second target heating working mode and executing the second target heating working mode.
Optionally, the fault detection method further includes:
and if the second target probe is determined to have a fault, setting the second target heating working mode to be in an unselected state, controlling the heating module to be closed, and controlling the alarm module to perform fault alarm of the second target probe and closing alarm of the heating module.
Optionally, after the setting the first target heating operation mode to the non-selectable state and controlling the alarm module to perform the fault alarm on the first target probe, the method further includes:
and if the target switching working mode is the manual switching working mode, controlling the heating module to be closed and controlling the alarm module to perform heating module closing alarm.
Optionally, before determining the first target heating operation mode according to the user setting information, the method includes:
acquiring the state of a Hall switch; the Hall switch is arranged on a shell of the box body, and the box temperature probe and the body temperature probe are arranged in the shell;
if the state of the Hall switch is OFF, determining that both the box temperature probe and the body temperature probe have faults, setting both the box temperature working mode and the body temperature working mode to be in an unselected state, controlling the heating module to be closed, and controlling the alarm module to perform box temperature probe fault alarm, body temperature probe fault alarm and heating module closing alarm;
and if the state of the Hall switch is on, returning to the step of determining the first target heating working mode according to the user setting information.
In a second aspect, the present application provides a fault detection device comprising:
the first determining module is used for determining a first target heating working mode according to user setting information; the first target heating working mode is a box temperature working mode or a body temperature working mode;
the acquisition module is used for acquiring a voltage value of a socket end of a first target probe corresponding to the first target heating working mode, and the first target probe is a box temperature probe or a body temperature probe;
and the second determining module is used for carrying out fault detection according to the voltage value of the socket end of the first target probe and determining whether the first target probe has a fault.
In a third aspect, the present application provides a computer readable storage medium storing a computer program which, when executed by a processor, causes the processor to perform the steps of:
determining a first target heating working mode according to user setting information; the first target heating working mode is a box temperature working mode or a body temperature working mode;
acquiring a voltage value of a socket end of a first target probe corresponding to the first target heating working mode, wherein the first target probe is a box temperature probe or a body temperature probe;
and carrying out fault detection according to the voltage value of the socket end of the first target probe, and determining whether the first target probe has a fault.
In a fourth aspect, the present application provides a incubator comprising a memory and a processor, the memory storing a computer program that, when executed by the processor, causes the processor to perform the steps of:
determining a first target heating working mode according to user setting information; the first target heating working mode is a box temperature working mode or a body temperature working mode;
acquiring a voltage value of a socket end of a first target probe corresponding to the first target heating working mode, wherein the first target probe is a box temperature probe or a body temperature probe;
and carrying out fault detection according to the voltage value of the socket end of the first target probe, and determining whether the first target probe has a fault.
The embodiment of the invention has the following beneficial effects:
the invention relates to a fault detection method and a device, a storage medium and an infant incubator, wherein the fault detection method comprises the following steps: determining a first target heating working mode according to user setting information; acquiring a voltage value of a socket end of a first target probe corresponding to a first target heating working mode; and carrying out fault detection according to the voltage value of the socket end of the first target probe, and determining whether the first target probe has a fault. By executing the fault detection method, whether the first target probe fails or not can be determined according to the voltage value of the socket end of the first target probe, so that the purpose of detecting whether the first target probe fails or not in real time is achieved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Wherein:
FIG. 1 is a schematic flow chart of a fault detection method in an embodiment of the present application;
FIG. 2 is a flow chart illustrating additional steps of the fault detection method of the embodiment of FIG. 1 of the present application;
FIG. 3 is another schematic flow chart illustrating a fault detection method according to an embodiment of the present application;
FIG. 4 is a schematic structural diagram of a fault detection device in an embodiment of the present application;
FIG. 5 is a block diagram of the incubator according to the embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Please refer to fig. 1, which is a schematic flow chart of a fault detection method in an embodiment of the present application, the fault detection method includes:
102, acquiring a voltage value of a socket end of a first target probe corresponding to the first target heating working mode, wherein the first target probe is a box temperature probe or a body temperature probe;
103, carrying out fault detection according to the voltage value of the socket end of the first target probe, and determining whether the first target probe has a fault.
In an embodiment of the present application, a fault detection method is applied to a fault detection system, where the fault detection system includes: the main control chip module, the box temperature probe and the body temperature probe; the box temperature probe and the body temperature probe are electrically connected with the main control chip module; the user sets a first target heating working mode through the human-computer interaction end, wherein the human-computer interaction end can be an upper computer of the fault detection system or an equipment end provided with the fault detection system, and other forms of human-computer interaction modes can be provided in practical application, which are not limited here.
Further, when the main control chip module determines that the first target heating working mode is the box temperature working mode according to the user setting information, the main control chip module acquires a voltage value of a socket end of the box temperature probe electrically connected with the main control chip module, and determines whether the box temperature probe has a fault according to the acquired voltage value of the socket end of the box temperature probe; when the main control chip module determines that the first target heating working mode is the body temperature working mode according to the user setting information, the main control chip module acquires a voltage value of a socket end electrically connected with the body temperature probe and the main control chip module, and determines whether the body temperature probe fails according to the acquired voltage value of the socket end of the body temperature probe.
Specifically, in a feasible implementation manner, the main control chip module includes: the second chip, the box temperature probe and the body temperature probe are electrically connected with the first chip; the second chip is used for receiving user setting information and determining a first target heating working mode according to the user setting information, then sending a fault detection instruction of a first target probe corresponding to the first target heating working mode to the first chip, after the first chip receives the fault detection instruction of the first target probe, obtaining a voltage value of a socket end of the first target probe electrically connected with the first chip according to the fault detection instruction of the first target probe, and the first chip carries out fault detection on the first target probe according to the obtained voltage value of the socket end of the first target probe, determines whether the first target probe has a fault or not, and feeds a fault detection result of the first target probe back to the second chip.
It should be noted that the above is only one possible implementation manner of the fault detection system to which the fault detection method is applied, and is not limited herein.
In an embodiment of the present application, the fault detection method includes: determining a first target heating working mode according to user setting information; acquiring a voltage value of a socket end of a first target probe corresponding to a first target heating working mode; and carrying out fault detection according to the voltage value of the socket end of the first target probe, and determining whether the first target probe has a fault. By executing the fault detection method, whether the first target probe fails or not can be determined according to the voltage value of the socket end of the first target probe, so that the purpose of detecting whether the first target probe fails or not in real time is achieved.
In a possible implementation manner, the specific fault detection method for performing fault detection according to the voltage value at the socket end of the first target probe and determining whether the first target probe fails includes: if the voltage value of the socket end of the first target probe is larger than the preset open circuit voltage value, determining that the first target probe fails and the first target probe is in a falling state; if the voltage value of the socket end of the first target probe is smaller than the preset short-circuit voltage value, determining that the first target probe fails and the state of the first target probe is short-circuit; wherein, the preset short-circuit voltage value is smaller than the preset open-circuit voltage value.
In this embodiment of the application, two preset voltage values may be preset to detect whether the first target probe has a fault, where the two preset voltage values are specifically a preset open-circuit voltage value and a preset short-circuit voltage value, where the preset open-circuit voltage value is used to detect whether the first target probe has a fault that falls off, the preset short-circuit voltage value is used to detect whether the first target probe has a fault that is a short circuit, and the preset short-circuit voltage value is smaller than the preset open-circuit voltage value. In a feasible implementation manner, when the main control chip module determines that the first target heating working mode is the box temperature working mode according to the user setting information, the main control chip module acquires a voltage value of a socket end of the box temperature probe electrically connected with the main control chip module, and the main control chip module compares the acquired voltage value of the socket end of the box temperature probe with a preset open circuit voltage value; when the voltage value of the socket end of the box temperature probe is larger than the preset open circuit voltage value, determining that the box temperature probe has a fault and the box temperature probe is in a falling state; when the voltage value of the socket end of the box temperature probe is smaller than or equal to the preset open-circuit voltage value, the main control chip module compares the acquired voltage value of the socket end of the box temperature probe with the preset short-circuit voltage value; when the voltage value of the socket end of the box temperature probe is smaller than a preset short-circuit voltage value, determining that the box temperature probe has a fault and the box temperature probe is in a short-circuit state; and when the voltage value of the socket end of the box temperature probe is greater than or equal to the preset short-circuit voltage value, determining that the box temperature probe does not have a fault.
Or when the main control chip module determines that the first target heating working mode is the body temperature working mode according to the user setting information, the main control chip module compares the acquired voltage value of the socket end of the body temperature probe with a preset open circuit voltage value; when the voltage value of the socket end of the body temperature probe is larger than the preset open circuit voltage value, determining that the body temperature probe has a fault and the body temperature probe is in a falling state; when the voltage value of the socket end of the body temperature probe is smaller than or equal to the preset open-circuit voltage value, the main control chip module compares the acquired voltage value of the socket end of the body temperature probe with the preset short-circuit voltage value; when the voltage value of the socket end of the body temperature probe is smaller than the preset short-circuit voltage value, determining that the body temperature probe has a fault and the state of the body temperature probe is a short circuit; and when the voltage value of the socket end of the body temperature probe is greater than or equal to the preset short-circuit voltage value, determining that the body temperature probe has no fault.
It should be noted that, the above is only a feasible implementation manner for performing fault detection on the first target probe according to the voltage value of the socket end of the first target probe, the preset open-circuit voltage value and the preset short-circuit voltage value, specifically, after the main control chip module determines that the first target heating operation mode is the box temperature operation mode or the body temperature operation mode according to the user setting information, the voltage value of the socket end of the first target probe acquired by the main control chip module may be compared with the preset short-circuit voltage value, and after it is determined that the voltage value of the socket end of the first target probe is greater than or equal to the preset short-circuit voltage value and it is determined that the first target probe is not faulty, the voltage value of the socket end of the first target probe acquired by the main control chip module may be compared with the preset open-circuit voltage value. In practical application, the sequence of comparing the voltage value of the socket end of the first target probe acquired by the main control chip module with the preset open circuit voltage value and the preset short circuit voltage value is not limited, the same preset open circuit voltage value and the same preset short circuit voltage value can be set for different types of temperature probes, and different preset open circuit voltage values and different preset short circuit voltage values can be set for different types of temperature probes according to actual conditions.
In one possible implementation, the main control chip module includes: the second chip, the box temperature probe and the body temperature probe are electrically connected with the first chip; the second chip is used for receiving user setting information and determining a first target heating working mode according to the user setting information, then the second chip issues a fault detection instruction of a first target probe corresponding to the first target heating working mode to the first chip, after the first chip receives the fault detection instruction of the first target probe, a voltage value of a socket end of the first target probe electrically connected with the first chip is obtained according to the fault detection instruction of the first target probe, and the first chip compares the obtained voltage value of the socket end of the first target probe with a preset short-circuit voltage value; when the voltage value of the socket end of the first target probe is smaller than a preset short-circuit voltage value, determining that the first target probe has a fault and the state of the first target probe is short-circuit, and feeding back a fault detection result that the state of the first target probe is short-circuit to the second chip; when the voltage value of the socket end of the first target probe is larger than or equal to the preset short-circuit voltage value, the first chip module compares the acquired voltage value of the socket end of the first target probe with the preset open-circuit voltage value; when the voltage value of the socket end of the first target probe is larger than the preset open circuit voltage value, determining that the first target probe has a fault and the first target probe is in a falling state, and feeding back a fault detection result that the first target probe is in the falling state to the second chip; and when the voltage value of the socket end of the first target probe is smaller than or equal to the preset open circuit voltage value, determining that the first target probe does not have a fault, and feeding back a fault detection result of the first target probe, which does not have the fault, to the second chip.
In the embodiment of the application, the acquired voltage value of the socket end of the first target probe is compared with the preset open-circuit voltage value and the preset short-circuit voltage value respectively, so that whether the first target probe breaks down or not can be determined, and meanwhile, the specific fault type of the first target probe can be determined to be falling or short-circuit.
In one possible implementation, determining that the first target probe has failed comprises: and setting the first target heating working mode to be in an unselected state, and controlling an alarm module to carry out fault alarm on the first target probe.
In the embodiment of the application, after the main control chip module determines the first target heating working mode according to the user setting information and the fault detection result obtained by performing fault detection on the first target probe corresponding to the first target heating working mode is that the first target probe has a fault of falling off or short circuit, the main control chip module can set the first target heating working mode function of the interaction end where the equipment provided with the fault detection system and the user interact to an unselected state, and then after the first target probe has a fault, the user can not select and set the first target heating working mode any more, so that the situation that the equipment cannot normally work due to the fact that the user selects the heating working mode in which the probe has a fault by mistake is avoided.
Furthermore, the fault detection system also comprises an alarm module, wherein the alarm module is electrically connected with the main control chip module, and when the main control chip module detects that the first target probe has a fault, the main control chip module can control the alarm module electrically connected with the main control chip module to alarm the fault of the first target probe. Specifically, the alarm module may include: display screen, display lamp and/or bee calling organ, when the main control chip module detects first target probe and breaks down, the main control chip module can control the display screen among the alarm module and show the information of first target probe and the fault information of first target probe, for example, when first target probe is the trouble type of case temperature probe and first target probe for droing, specifically can show on the display screen so: "case temperature probe failure: drop out! "; meanwhile, when the main control chip module detects that the first target probe breaks down, the main control chip module can also control a display lamp in the alarm module to flash and a buzzer in the alarm module to give out alarm sound, and then the effect of fault reminding for a user is achieved through the alarm module.
In one possible implementation, the main control chip module includes: the second chip, the box temperature probe, the body temperature probe and the alarm module are all electrically connected with the first chip; after the second chip determines a first target heating working mode according to information set by a user and issues a first target probe fault detection instruction to the first chip, the first chip performs fault detection on the first target probe and feeds a fault detection result back to the second chip, the second chip issues a first target probe fault alarm instruction to the first chip according to the first target probe fault detection result fed back by the first chip, and the first chip controls an alarm module electrically connected with the first chip to perform first target probe fault alarm according to the received first target probe fault alarm instruction.
It should be noted that the specific structure of the alarm module is only a feasible implementation manner, and in practical application, the alarm module may also have other components, and a specific alarm implementation manner, which is not limited herein.
Referring to fig. 2, a schematic flow chart illustrating additional steps of the fault detection method in the embodiment of fig. 1 of the present application, after setting the first target heating operating mode to the non-selectable state and controlling the alarm module to perform the fault alarm on the first target probe, includes:
and 203, if the second target probe is determined not to have a fault, switching to a second target heating working mode and executing the second target heating working mode.
In the embodiment of the application, after the main control chip module determines that the first target probe has a fault, the main control chip module further determines a target switching working mode according to user setting information, and executes the steps after the fault information of the first target probe having the fault and the target switching working mode are determined.
Specifically, after the first target probe is determined to have a fault, when the target switching working mode is determined to be the automatic switching working mode, the main control chip module can automatically detect the fault of the second target probe, acquire the voltage value of the socket end of the second target probe and compare the voltage value of the socket end of the second target probe with a preset open circuit voltage value; when the voltage value of the socket end of the second target probe is larger than the preset open circuit voltage value, determining that the second target probe has a fault and the state of the second target probe is falling off; when the voltage value of the socket end of the second target probe is smaller than or equal to the preset open-circuit voltage value, the main control chip module compares the acquired voltage value of the socket end of the second target probe with the preset short-circuit voltage value; when the voltage value of the socket end of the second target probe is smaller than the preset short-circuit voltage value, determining that the second target probe has a fault and the state of the second target probe is a short circuit; and when the voltage value of the socket end of the second target probe is greater than or equal to the preset short-circuit voltage value, determining that the second target probe does not have a fault, and automatically switching the heating working mode from the first target heating working mode to the second target heating working mode.
In an embodiment of the present application, the fault detection system further includes: the heating module is electrically connected with the main control chip module; the fault detection method further comprises the following steps: and if the second target probe is determined to have a fault, setting the second target heating working mode to be in an unselected state, controlling the heating module to be closed, and controlling the alarm module to perform fault alarm of the second target probe and closing alarm of the heating module.
In the embodiment of the application, when it is determined that the second target probe has a fault such as falling off or short circuit, the main control chip module sets the function of the second target heating working mode of the interaction end where the equipment provided with the fault detection system and the user interact to be in an unselected state, so that after the second target probe has a fault, the user cannot select and set the second target heating working mode any more, and the problem that the equipment cannot normally work due to the fact that the user selects the heating working mode with the fault probe by mistake is avoided.
Further, after the second target probe is determined to have a fault of falling off or short circuit, the main control chip module also closes the heating module electrically connected with the main control chip module, and controls the alarm module to perform fault alarm of the second target probe and closing alarm of the heating module. Specifically, it can be understood that the display screen in the alarm module has already displayed the first target probe failure alarm information, and on this basis, the display screen in the alarm module can also display the second target probe failure alarm information and the heating module shutdown alarm information, for example, the display screen in the alarm module simultaneously displays: "case temperature probe failure: drop out! And body temperature probe fault: short circuit! With the heating module turned off! "; meanwhile, the alarm module can specifically comprise a display lamp which carries out flashing, or the alarm module can specifically comprise three display lamps which respectively correspond to the box temperature probe, the body temperature probe and the heating module and carry out flashing at the same time; meanwhile, a buzzer in the alarm module can also send out alarm sound at the same time. And then realized carrying out the effect that the trouble was reminded to the user through alarm module.
It should be noted that, in practical application, the sequence of comparing the voltage value of the socket end of the second target probe obtained by the main control chip module with the preset open-circuit voltage value and the preset short-circuit voltage value is not limited, and the same preset open-circuit voltage value and the same preset short-circuit voltage value can be set for different types of temperature probes, or different preset open-circuit voltage values and different preset short-circuit voltage values can be set for different types of temperature probes according to actual conditions, and the sequence is not limited here.
In one possible implementation, the main control chip module includes: the second chip, the box temperature probe, the body temperature probe and the alarm module are all electrically connected with the first chip; the second chip determines a first target heating working mode according to user setting information and issues a first target probe fault detection instruction to the first chip, the first chip performs fault detection on the first target probe and feeds a fault detection result back to the second chip, the second chip issues a first target probe fault alarm instruction to the first chip according to the first target probe fault detection result fed back by the first chip, the first chip controls an alarm module electrically connected with the first chip to perform fault alarm on the first target probe according to the received first target probe fault alarm instruction, the second chip determines that the target switching working mode is an automatic switching working mode according to the user setting information and issues a second target probe fault detection instruction to the first chip according to the fault information that the first target probe fails and the automatic switching working mode, and the first chip performs fault detection on the second target probe according to the received second target probe fault detection instruction The first chip feeds back a second target probe fault detection result determined according to the voltage value of the socket end of the second target probe, the preset open-circuit voltage value and the preset short-circuit voltage value to the second chip; when the second target probe fault detection result received by the second chip indicates that the second target probe does not have a fault, the second chip sends a probe switching instruction to the first chip, and the first chip switches the heating working mode from the first target heating working mode to the second target heating working mode according to the received probe switching instruction; when a second target probe fault detection result received by the second chip indicates that the second target probe is in fault, the first chip feeds the second target probe fault detection result back to the second chip, the second chip sends a corresponding control instruction to the first chip according to the received second target probe fault detection result, the first chip sets the second target heating working mode function to be in an unselected state according to the received control instruction and closes the heating module, and meanwhile controls the alarm module to perform second target probe fault alarm and heating module closing alarm.
In the embodiment of the application, the user can achieve the effect of controlling the automatic switching from the heating working mode corresponding to the probe with the fault to the heating working mode corresponding to the probe without the fault when any one of the box temperature probe and the body temperature probe has the fault and the other probe does not have the fault by selecting and setting the automatic switching working mode, and when only one of the two probes has the fault, the probe without the fault can be switched to continue temperature measurement, so that the maximum normal operation of the equipment is ensured.
Further, in a possible implementation manner, after setting the first target heating operation mode to an unselected state and controlling the alarm module to perform the first target probe fault alarm, the method further includes: and if the target switching working mode is the manual switching working mode, controlling the heating module to be closed and controlling the alarm module to perform heating module closing alarm.
Specifically, after the first target probe is determined to have a fault, when the target switching working mode is determined to be the manual switching working mode, the main control chip module closes the heating module electrically connected with the main control chip module, and controls the alarm module to perform heating module closing alarm. Under the switching working mode, a user needs to manually select a second target heating working mode, the main control chip module can determine the second target heating working mode according to user setting information, then the voltage value of the socket end of the second target probe corresponding to the second target heating working mode is obtained, and whether the second target probe breaks down or not is determined according to the voltage value of the socket end of the second target probe, the preset open circuit voltage value and the preset short circuit voltage value.
In one possible implementation, the main control chip module includes: a first chip and a second chip; the second chip, the box temperature probe, the body temperature probe and the alarm module are all electrically connected with the first chip; the second chip determines a first target heating working mode according to user setting information and sends a first target probe fault detection instruction to the first chip, the first chip detects the fault of the first target probe and feeds the fault detection result back to the second chip, the second chip sends a first target probe fault alarm instruction to the first chip according to the first target probe fault detection result fed back by the first chip, the first chip controls an alarm module electrically connected with the first chip to carry out first target probe fault alarm according to the received first target probe fault alarm instruction, the second chip determines that the target switching working mode is a manual switching working mode according to the user setting information and sends a corresponding control instruction to the first chip according to the fault information that the first target probe has a fault and the manual switching working mode, and the first chip closes the heating module according to the received control instruction, and meanwhile, the alarm module is controlled to perform heating module closing alarm.
In the embodiment of the application, two switching working modes, namely the automatic switching working mode and the manual switching working mode, are set, so that the selection of a user on the switching working mode is increased, and the use experience of the user is improved.
In a possible implementation manner, please refer to fig. 3, which is another schematic flow chart of the fault detection method in the embodiment of the present application, where before determining the first target heating operation mode according to the user setting information, the method includes:
301, acquiring the state of a Hall switch; the Hall switch is arranged on a shell of the box body, and the box temperature probe and the body temperature probe are arranged in the shell;
and 303, if the state of the Hall switch is on, returning to the step of determining the first target heating working mode according to the user setting information.
In an embodiment of the present application, a fault detection system includes: the device comprises a main control chip module, a box temperature probe, a body temperature probe, a Hall switch, a heating module and an alarm module; the box temperature probe, the body temperature probe, the Hall switch, the heating module and the alarm module are all electrically connected with the main control chip module; the main control chip module can firstly acquire the state of the Hall switch before carrying out fault detection on the box temperature probe or the body temperature probe, and when the state of the Hall switch is off, the box body drops at the moment, so that the box temperature probe and the body temperature probe which are installed in the box body can be determined to both have the dropping fault, the main control chip module can set the box temperature working mode and the body temperature working mode to be in the non-selectable state, the heating module is controlled to be closed, and the alarm module is controlled to carry out box temperature probe fault alarm, body temperature probe fault alarm and heating module closing alarm.
Further, when the hall switch is in an on state, it indicates that the cartridge does not fall off at this time, and therefore the control chip module returns to execute any one of the fault detection methods in the embodiments shown in fig. 1 to fig. 2.
In one possible implementation, the main control chip module includes: a first chip and a second chip; the second chip, the box temperature probe, the body temperature probe, the Hall switch, the heating module and the alarm module are all electrically connected with the first chip; the second chip firstly issues a Hall switch state detection instruction to the first chip, the first chip acquires the state of the Hall switch according to the received Hall switch state detection instruction, when the Hall switch is in a closed state, the box body falls off at the moment, so that the case temperature probe and the body temperature probe which are installed in the box body can be determined to have falling faults, the first chip feeds back the detection result of the case temperature probe and the body temperature probe which are determined according to the state of the Hall switch and have falling faults to the second chip, the second chip sends a corresponding control instruction to the first chip, the first chip sets the case temperature working mode and the body temperature working mode to be in an unselected state according to the control instruction, and controls the heating module to be closed, and controls the alarm module to perform case temperature probe fault alarm, body temperature probe fault alarm and heating module closing alarm.
In the embodiment of the application, the Hall switch is arranged, so that the state of the Hall switch can be directly detected when the box body provided with the box temperature probe and the body temperature probe falls off to cause the falling fault of the box temperature probe and the body temperature probe, and the effect of fault detection on the box temperature probe and the body temperature probe is not needed.
In a feasible implementation manner, the fault detection of the main control chip module or the first chip on the first target probe and the second target probe and the fault detection performed by acquiring the state of the hall switch may be performed synchronously in real time, and only when the main control chip module or the second chip determines whether the first target probe or the second target probe has a fault, the real-time fault detection result of the corresponding target probe needs to be acquired.
Please refer to fig. 4, which is a schematic structural diagram of a fault detection apparatus in an embodiment of the present application, the fault detection apparatus includes:
a first determining module 401, configured to determine a first target heating operation mode according to user setting information; the first target heating working mode is a box temperature working mode or a body temperature working mode;
an obtaining module 402, configured to obtain a voltage value at a socket end of a first target probe corresponding to the first target heating operating mode, where the first target probe is a box temperature probe or a body temperature probe;
a second determining module 403, configured to perform fault detection according to the voltage value at the socket end of the first target probe, and determine whether the first target probe has a fault.
In the embodiment of the present application, a first target heating operation mode is determined by calling the first determining module 401 according to user setting information, a voltage value of a socket end of a first target probe corresponding to the first target heating operation mode is obtained by calling the obtaining module 402, and fault detection is performed according to the voltage value of the socket end of the first target probe by calling the second determining module 403 to determine whether the first target probe is faulty, so as to achieve a purpose of detecting whether the first target probe is faulty in real time
FIG. 5 is a view showing the internal structure of the incubator in one embodiment. The infant incubator can be a terminal or a server. As shown in FIG. 5, the incubator includes a processor, memory, and a network interface connected by a system bus. Wherein the memory includes a non-volatile storage medium and an internal memory. The non-volatile storage medium of the incubator stores an operating system and may also store a computer program, which when executed by the processor, causes the processor to implement a fault detection method. The internal memory may also have stored therein a computer program that, when executed by the processor, causes the processor to perform the fault detection method. It will be understood by those skilled in the art that the configuration shown in FIG. 5 is a block diagram of only a portion of the configuration associated with the present application and does not constitute a limitation of the incubator to which the present application is applied, and that a particular incubator may include more or fewer components than shown, or combine certain components, or have a different arrangement of components.
In one embodiment, a incubator is provided, comprising a memory and a processor, the memory storing a computer program that, when executed by the processor, causes the processor to perform the steps of:
determining a first target heating working mode according to user setting information; the first target heating working mode is a box temperature working mode or a body temperature working mode;
acquiring a voltage value of a socket end of a first target probe corresponding to the first target heating working mode, wherein the first target probe is a box temperature probe or a body temperature probe;
and carrying out fault detection according to the voltage value of the socket end of the first target probe, and determining whether the first target probe has a fault.
In the embodiment of the present application, the incubator is equipped with a failure detection system, and the incubator can perform a failure detection method by the failure detection system. When the first target probe is determined not to have a fault, the main control chip module controls the first target probe to acquire temperature, compares the received temperature acquired by the first target probe with a target temperature, and controls the output state of the heating module according to a comparison result; when the temperature acquired by the first target probe is higher than the target temperature, the main control chip module controls the heating module to be closed; when the temperature collected by the first target probe is lower than the target temperature, the main control chip module controls the heating module to be started, and the more the difference between the temperature collected by the first target probe and the target temperature is, the larger the output power of the heating module is controlled by the main control chip module.
It can be understood that, when the switching operation mode set by the user is the automatic switching operation mode, after detecting that the first target probe has a fault and detecting that the second target probe has no fault, the heating operation mode is automatically switched from the first target heating operation mode to the second target heating operation mode, and the main control chip module, the second target probe and the heating module execute the same method for controlling the output state of the heating module as described above.
In one possible implementation, the main control chip module includes: a first chip and a second chip; when the second chip determines that the first target probe does not have a fault according to a fault detection result of the first target probe fed back by the first chip, the second chip sends an instruction for executing a first target heating working mode and corresponding target temperature to the first chip, the first chip controls the first target probe to carry out temperature acquisition according to the received instruction, the received temperature acquired by the first target probe is compared with the target temperature, and the first chip controls the output state of the heating module according to the comparison result; when the temperature acquired by the first target probe is higher than the target temperature, the first chip controls the heating module to be closed; when the temperature acquired by the first target probe is lower than the target temperature, the first chip controls the heating module to be started, and the output power of the first chip controls the heating module to be larger when the difference between the temperature acquired by the first target probe and the target temperature is larger.
In one embodiment, a computer-readable storage medium is proposed, in which a computer program is stored which, when executed by a processor, causes the processor to carry out the steps of:
determining a first target heating working mode according to user setting information; the first target heating working mode is a box temperature working mode or a body temperature working mode;
acquiring a voltage value of a socket end of a first target probe corresponding to the first target heating working mode, wherein the first target probe is a box temperature probe or a body temperature probe;
and carrying out fault detection according to the voltage value of the socket end of the first target probe, and determining whether the first target probe has a fault.
It will be understood by those skilled in the art that all or part of the processes of the methods of the embodiments described above can be implemented by a computer program, which can be stored in a non-volatile computer-readable storage medium, and can include the processes of the embodiments of the methods described above when the program is executed. Any reference to memory, storage, database, or other medium used in the embodiments provided herein may include non-volatile and/or volatile memory, among others. Non-volatile memory can include read-only memory (ROM), Programmable ROM (PROM), Electrically Programmable ROM (EPROM), Electrically Erasable Programmable ROM (EEPROM), or flash memory. Volatile memory can include Random Access Memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in a variety of forms such as Static RAM (SRAM), Dynamic RAM (DRAM), Synchronous DRAM (SDRAM), Double Data Rate SDRAM (DDRSDRAM), Enhanced SDRAM (ESDRAM), Synchronous Link DRAM (SLDRAM), Rambus Direct RAM (RDRAM), direct bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM).
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present application. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A fault detection method, characterized in that the fault detection method comprises:
determining a first target heating working mode according to user setting information; the first target heating working mode is a box temperature working mode or a body temperature working mode;
acquiring a voltage value of a socket end of a first target probe corresponding to the first target heating working mode, wherein the first target probe is a box temperature probe or a body temperature probe;
and carrying out fault detection according to the voltage value of the socket end of the first target probe, and determining whether the first target probe has a fault.
2. The method of fault detection according to claim 1, wherein said performing fault detection based on a voltage value at a socket end of the first target probe to determine whether the first target probe is faulty comprises:
if the voltage value of the socket end of the first target probe is larger than a preset open circuit voltage value, determining that the first target probe has a fault and the first target probe is in a falling state;
if the voltage value of the socket end of the first target probe is smaller than a preset short-circuit voltage value, determining that the first target probe fails and the state of the first target probe is short-circuit;
wherein the preset short-circuit voltage value is smaller than the preset open-circuit voltage value.
3. The method of fault detection according to claim 2, wherein said determining that the first target probe has failed comprises:
and setting the first target heating working mode to be in an unselected state, and controlling an alarm module to carry out fault alarm on the first target probe.
4. The method of claim 3, wherein the setting the first target heating mode of operation to the non-selectable state and controlling the alarm module to perform the first target probe fault alarm comprises:
determining a target switching working mode according to user setting information; the target switching working mode is an automatic switching working mode or a manual switching working mode;
if the target switching working mode is the automatic switching working mode, acquiring a voltage value of a socket end of a second target probe, and determining whether the second target probe has a fault according to the voltage value of the socket end of the second target probe, wherein the second target probe is a box temperature probe or a body temperature probe;
and if the second target probe is determined not to have a fault, switching to a second target heating working mode and executing the second target heating working mode.
5. The fault detection method of claim 4, further comprising:
and if the second target probe is determined to have a fault, setting the second target heating working mode to be in an unselected state, controlling the heating module to be closed, and controlling the alarm module to perform fault alarm of the second target probe and closing alarm of the heating module.
6. The method of claim 4, wherein after setting the first target heating mode of operation to the non-selectable state and controlling the alarm module to alarm for the first target probe failure, further comprising:
and if the target switching working mode is the manual switching working mode, controlling the heating module to be closed and controlling the alarm module to perform heating module closing alarm.
7. The fault detection method of claim 1, wherein prior to determining the first target heating mode of operation based on the user setting information, comprising:
acquiring the state of a Hall switch; the Hall switch is arranged on a shell of the box body, and the box temperature probe and the body temperature probe are arranged in the shell;
if the state of the Hall switch is OFF, determining that both the box temperature probe and the body temperature probe have faults, setting both the box temperature working mode and the body temperature working mode to be in an unselected state, controlling the heating module to be closed, and controlling the alarm module to perform box temperature probe fault alarm, body temperature probe fault alarm and heating module closing alarm;
and if the state of the Hall switch is on, returning to the step of determining the first target heating working mode according to the user setting information.
8. A fault detection device, characterized in that the fault detection device comprises:
the first determining module is used for determining a first target heating working mode according to user setting information; the first target heating working mode is a box temperature working mode or a body temperature working mode;
the acquisition module is used for acquiring a voltage value of a socket end of a first target probe corresponding to the first target heating working mode, and the first target probe is a box temperature probe or a body temperature probe;
and the second determining module is used for carrying out fault detection according to the voltage value of the socket end of the first target probe and determining whether the first target probe has a fault.
9. A computer-readable storage medium, storing a computer program which, when executed by a processor, causes the processor to carry out the steps of the fault detection method according to any one of claims 1 to 7.
10. A incubator comprising a memory and a processor, the memory storing a computer program which, when executed by the processor, causes the processor to carry out the steps of the fault detection method of any one of claims 1 to 7.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110331834.0A CN113125045A (en) | 2021-03-29 | 2021-03-29 | Fault detection method and device, storage medium and infant incubator |
| PCT/CN2021/096309 WO2022205596A1 (en) | 2021-03-29 | 2021-05-27 | Method and device for fault detection, storage medium, and baby incubator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202110331834.0A CN113125045A (en) | 2021-03-29 | 2021-03-29 | Fault detection method and device, storage medium and infant incubator |
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| CN113125045A true CN113125045A (en) | 2021-07-16 |
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| WO (1) | WO2022205596A1 (en) |
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| CN108670650A (en) * | 2018-06-26 | 2018-10-19 | 张玲 | A kind of pediatric nursing incubator |
| US20190000703A1 (en) * | 2017-06-28 | 2019-01-03 | General Electric Company | Infant Warming System and Method |
| CN209433528U (en) * | 2019-01-03 | 2019-09-24 | 闽南理工学院 | Infant monitoring device |
| CN211086633U (en) * | 2019-10-30 | 2020-07-24 | 浙江图维科技股份有限公司 | Terminal head enameling and falling detection device |
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2021
- 2021-03-29 CN CN202110331834.0A patent/CN113125045A/en active Pending
- 2021-05-27 WO PCT/CN2021/096309 patent/WO2022205596A1/en active Application Filing
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|---|---|---|---|---|
| GB1370662A (en) * | 1971-12-31 | 1974-10-16 | Draegerwerk Ag | Incubator for babies |
| US5162038A (en) * | 1989-12-04 | 1992-11-10 | Hill-Rom Company | Infant warmer open bed |
| CN103352286A (en) * | 2013-07-04 | 2013-10-16 | 杭州旭仁纺织机械有限公司 | Detection device for dobby |
| CN204797806U (en) * | 2015-02-05 | 2015-11-25 | 深圳市科曼医疗设备有限公司 | Skin temperature probe drop check out test set and baby radiation warming table |
| CN105575055A (en) * | 2016-02-06 | 2016-05-11 | 马美丽 | Medical comprehensive risk early-warning system and early-warning method |
| US20190000703A1 (en) * | 2017-06-28 | 2019-01-03 | General Electric Company | Infant Warming System and Method |
| CN108670650A (en) * | 2018-06-26 | 2018-10-19 | 张玲 | A kind of pediatric nursing incubator |
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| CN211086633U (en) * | 2019-10-30 | 2020-07-24 | 浙江图维科技股份有限公司 | Terminal head enameling and falling detection device |
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|---|---|
| WO2022205596A1 (en) | 2022-10-06 |
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Application publication date: 20210716 |