WO2022205560A1 - 一种毫米波通讯芯片、显示装置及方法 - Google Patents

一种毫米波通讯芯片、显示装置及方法 Download PDF

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Publication number
WO2022205560A1
WO2022205560A1 PCT/CN2021/092343 CN2021092343W WO2022205560A1 WO 2022205560 A1 WO2022205560 A1 WO 2022205560A1 CN 2021092343 W CN2021092343 W CN 2021092343W WO 2022205560 A1 WO2022205560 A1 WO 2022205560A1
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WO
WIPO (PCT)
Prior art keywords
module
wave communication
data
communication chip
millimeter
Prior art date
Application number
PCT/CN2021/092343
Other languages
English (en)
French (fr)
Inventor
李成
金文学
Original Assignee
德氪微电子(深圳)有限公司
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Application filed by 德氪微电子(深圳)有限公司 filed Critical 德氪微电子(深圳)有限公司
Priority to KR1020237035530A priority Critical patent/KR20230157480A/ko
Priority to EP21934211.0A priority patent/EP4318958A1/en
Publication of WO2022205560A1 publication Critical patent/WO2022205560A1/zh
Priority to US18/477,459 priority patent/US20240028289A1/en

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/14—Digital output to display device ; Cooperation and interconnection of the display device with other functional units
    • G06F3/147—Digital output to display device ; Cooperation and interconnection of the display device with other functional units using display panels
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/2092—Details of a display terminals using a flat panel, the details relating to the control arrangement of the display terminal and to the interfaces thereto
    • G09G3/2096—Details of the interface to the display terminal specific for a flat panel
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/40—Circuits
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/14—Digital output to display device ; Cooperation and interconnection of the display device with other functional units
    • G06F3/1423—Digital output to display device ; Cooperation and interconnection of the display device with other functional units controlling a plurality of local displays, e.g. CRT and flat panel display
    • G06F3/1446—Digital output to display device ; Cooperation and interconnection of the display device with other functional units controlling a plurality of local displays, e.g. CRT and flat panel display display composed of modules, e.g. video walls
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B7/00—Radio transmission systems, i.e. using radiation field
    • H04B7/24—Radio transmission systems, i.e. using radiation field for communication between two or more posts
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04J—MULTIPLEX COMMUNICATION
    • H04J3/00—Time-division multiplex systems
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04J—MULTIPLEX COMMUNICATION
    • H04J3/00—Time-division multiplex systems
    • H04J3/02—Details
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2300/00—Aspects of the constitution of display devices
    • G09G2300/02—Composition of display devices
    • G09G2300/026—Video wall, i.e. juxtaposition of a plurality of screens to create a display screen of bigger dimensions
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2360/00—Aspects of the architecture of display systems
    • G09G2360/04—Display device controller operating with a plurality of display units
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2370/00—Aspects of data communication
    • G09G2370/04—Exchange of auxiliary data, i.e. other than image data, between monitor and graphics controller
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2370/00—Aspects of data communication
    • G09G2370/12—Use of DVI or HDMI protocol in interfaces along the display data pipeline
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2370/00—Aspects of data communication
    • G09G2370/16—Use of wireless transmission of display information
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D30/00—Reducing energy consumption in communication networks
    • Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks

Definitions

  • the present application relates to the field of communications, and in particular, to a millimeter wave communication chip, a display device and a method.
  • splicer also known as video wall control, video wall splicer, display wall splicer, etc.
  • main function is to divide a complete image signal into N blocks and then assign them to N video display units (such as back and forth).
  • Casting unit to complete a large-screen dynamic image display screen composed of multiple ordinary video units, which can support simultaneous access of multiple video devices.
  • connection between the relevant backplane and the display module is usually connected by communication lines.
  • the connection line between the backplane and the display module also needs to be added with cables such as power lines and data lines. It is conceivable that there are many cables between the backplane and the display device. Too many communication cables cause the connection between the backplane and the display module to be intricate, difficult to connect and consume. A lot of time to sort out the problems with the many lines of communication.
  • the technical problem to be solved by this application is to propose a millimeter wave communication chip, a display device and a method.
  • the millimeter wave communication chip can realize the communication connection between the first terminal and the second terminal, so the display device has both It can realize the wireless communication connection between the backplane and the LED module, and realize the effect of communication without connecting many communication cables between the backplane and the LED module, so that the layout of the LED module can be more light and flexible.
  • a millimeter wave communication chip provided by this application includes;
  • RF module used to send and receive data
  • SerDes module used for conversion between parallel data and serial data
  • TDM module control the data transmission direction of the RF module and the SerDes module by means of time division multiplexing
  • the TDM module sends a control signal to the SerDes module and the RF module, the RF module sends serial data to the SerDes module, and the SerDes module sends the serial data to the SerDes module.
  • the module converts the serial data to parallel data and sends it to the first terminal.
  • it also includes a data processing module, and the SerDes module is communicatively connected to the first terminal through the data processing module;
  • the data processing module is used to receive the control signal of the TDM module.
  • the data is sent to the first terminal after being analyzed and processed.
  • the data cache module for establishing communication between the data processing module and the interface module
  • the data processing module When the data processing module receives the data of the second terminal, the data processing module sends the data of the second terminal to the data buffer module for buffering, and the interface module of the data buffer module then transmits the data of the second terminal to the interface module.
  • a display device using millimeter wave communication comprising: a backplane and an LED module, the backplane is used for acquiring input data, and after analysis and processing, image data is generated and sent to the LED module, and the LED module is used for receiving the backplane.
  • the video data sent by the board is analyzed and displayed by the LED, wherein, the above-mentioned millimeter-wave communication chip is also included, and the millimeter-wave communication chip includes a first millimeter-wave communication chip and a second millimeter-wave communication chip;
  • the first millimeter-wave communication chip is arranged on the LED module, and the second millimeter-wave communication chip is arranged on the backplane;
  • the LED module includes an output main control board
  • the first millimeter wave communication chip is used for communication connection with the backplane
  • the output main control board is used for receiving the data of the first millimeter wave communication chip for output display
  • the first millimeter wave communication chip is electrically connected to the output main control board;
  • the backplane includes an MCU main control board
  • the second millimeter-wave communication chip is used for receiving the control signal and related data of the MCU main control board, and communicating with the LED module;
  • the MCU main control board is used for receiving each input signal, analyzing and processing it, and controlling the operation of the second millimeter wave communication chip;
  • the second millimeter wave communication chip is electrically connected to the MCU main control board.
  • the first millimeter-wave communication chip and the second millimeter-wave communication chip are communicatively connected, and the first millimeter-wave communication chip and the second millimeter-wave communication chip are time-division multiplexed. communication method.
  • it further includes: an input module, the input module is connected to the backplane in communication, and the input module is used for inputting image signals.
  • the input module includes: a third millimeter-wave communication chip and an input main control board, the third millimeter-wave communication chip is used for communicating with the first millimeter-wave communication chip and sending image signals to the first millimeter wave communication chip.
  • it further includes: an input module, the input module is connected to the backplane in communication, and the input module is used for inputting image signals.
  • the input module includes: a third millimeter-wave communication chip and an input main control board, the third millimeter-wave communication chip is used for communicating with the first millimeter-wave communication chip and sending image signals to the first millimeter wave communication chip.
  • the output video interface circuit includes a high-definition output chip and an HDMI interface, a signal output end of the high-definition output chip is electrically connected to the HDMI interface, and a signal input end of the high-definition output chip is connected to the HDMI interface.
  • the output main control board is electrically connected.
  • the output audio separation circuit includes a decoding chip; the signal input end of the decoding chip is electrically connected to the output main control board.
  • a method for using millimeter-wave communication, applied to the above-mentioned display device using millimeter-wave communication includes:
  • the display device is powered on, and the second millimeter wave communication chip is in a wireless receiving state
  • the method further includes:
  • the MCU main control board reads the status information of the LED module through the first millimeter wave communication chip
  • it also includes:
  • the MCU main control board sends a corresponding command to the LED module through the first millimeter wave communication chip
  • the first millimeter wave communication chip receives the return data of the LED module
  • the MCU main control board reads the valid state of the returned data of the first millimeter wave communication chip.
  • the application provides a millimeter wave communication chip, a display device and a method.
  • the millimeter wave communication chip can realize the communication connection between the first terminal and the second terminal. Therefore, the backplane and the LED module in the display device are respectively provided with the first millimeter wave
  • the communication chip and the second millimeter wave communication chip, the wireless communication of the two millimeter wave communication chips can realize the wireless communication connection between the backplane and the LED module, and the backplane sends the display data to the LED module through the second millimeter wave communication chip.
  • the LED module receives the display data of the backplane through the first millimeter-ratio communication chip for display and sends the feedback data to the backplane; through the wireless communication between the millimeter-wave communication chips, the realization of The effect of communication can be achieved without connecting numerous communication cables between the backplane and the LED module, which makes the layout of the LED module more portable and flexible.
  • FIG. 1 is a schematic diagram of a millimeter-wave communication chip provided in the specific embodiment of the application;
  • FIG. 2 is a schematic diagram 1 of a display device using millimeter wave communication provided in the specific embodiment of the present application;
  • FIG. 3 is a second schematic diagram of a display device using millimeter wave communication provided in the specific embodiment of the application;
  • FIG. 4 is a schematic diagram 1 of the millimeter wave communication method provided in the specific embodiment of the present application.
  • FIG. 5 is a second schematic diagram of the millimeter wave communication method provided in the specific embodiment of the present application.
  • FIG. 6 is a schematic diagram 3 of a millimeter wave communication method provided in the specific embodiment of the present application.
  • Figure identification 1 LED module; 11 first millimeter wave communication chip; 12 output main control board; 13 output video interface circuit; 14 output audio separation circuit; 2 backplane; 21 second millimeter wave communication chip; 22MCU main control board ; 3 input modules; 31 input main control boards; 32 third millimeter wave communication chips; 4 TDM modules; 5 RF modules; 6 SerDes modules; 7 data processing modules; 8 data cache modules; 9 interface modules.
  • RF module radio frequency module, which realizes the function of wireless sending and receiving;
  • SerDes module short for English SERializer (serializer)/DESerializer (deserializer);
  • TDM module Time division multiplexing module, which interleaves different signals in different time periods and transmits along the same channel; at the receiving end, a certain method is used to extract the signals in each time period and restore them to the original Signal communication technology. This technology can transmit multiple signals on the same channel;
  • Backplane It is the main control circuit board set in the splicing processor, and the backplane plays the role of input and output control of image signals.
  • a millimeter wave communication chip includes;
  • RF module 5 used to send and receive data
  • SerDes module 6 used for conversion between parallel data and serial data
  • TDM module 4 control the data transmission direction of RF module 5 and SerDes module 6 by means of time division multiplexing;
  • the TDM module 4 sends a control signal to the SerDes module 6 and the RF module 5, the SerDes module 6 converts the parallel data into serial data and sends it to the RF module 5, and the RF module 5 converts the serial data into serial data. sending line data to the second terminal;
  • the TDM module 4 sends a control signal to the SerDes module 6 and the RF module 5, the RF module 5 sends the serial data to the SerDes module 6, and the SerDes module 6 converts the serial data into parallel data and send to the first terminal.
  • the first terminal and the second terminal are terminals on both ends of the millimeter wave communication chip, which can be the backplane and the LED module, the main control device and the controlled device, etc.
  • the millimeter wave communication chip has the functions of receiving and sending data.
  • the TDM module 4 uses time division multiplexing to complete the switching function of the transmission direction of the entire data channel according to the needs, that is, the TDM module 4 is used to realize the switching between the received data and the transmitted data of the millimeter wave communication chip;
  • the millimeter-wave communication chip Since the millimeter-wave communication chip will be placed on one of the terminals for operation, this embodiment is performed for the angle of placing the millimeter-wave communication chip on the first terminal, and the second terminal also has a wireless communication function.
  • the second terminal can also be equipped with a millimeter-wave communication chip or other wireless communication modules; when the millimeter-wave communication chip receives and sends data, the data flow is that the SerDes module 6 receives the data and sends it to the RF module 5, and then the RF module 5 sends the data.
  • the millimeter wave communication chip receives data
  • the data flow is to be sent to the SerDes module 6 after the RF module 5 receives the data, and then sent to the first terminal by the SerDes module 6;
  • the TDM module 4 is based on different In the case of time division multiplexing, the switching function of the transmission direction of the entire data channel is completed.
  • it also includes a data processing module 7, and the SerDes module 6 is communicated and connected with the first terminal through the data processing module 7;
  • the data processing module 7 is used to receive the control signal of the TDM module 4, and the data processing module 7 analyzes and processes the data of the first terminal and sends it to the SerDes module 6 according to the control signal, or analyzes and processes the data of the SerDes module 6. sent to the first terminal.
  • the data processing module 7 is used to combine or separate data.
  • the data processing module 7 combines and processes the data of the first terminal. , and send the merged data to the SerDes module 6; or, when the SerDes module 6 module transmits the data of the second terminal to the data processing module 7, the data processing module 7 separates the data of the second terminal, and The separated data is sent to the first terminal through several interface modules 9;
  • the TDM module 4 plays the role of controlling the data flow direction between the first terminal and the second terminal, and the data module combines or separates the data according to the current control data flow direction of the TDM module 4 .
  • interface modules 9 and data cache modules 8 are also included;
  • an interface module 9 for connecting with the first terminal
  • the data cache module 8 is used to establish the communication between the data processing module 7 and the interface module 9;
  • the interface module 9 When the interface module 9 receives the data of the first terminal, the interface module 9 sends the data of the first terminal to the data buffering module 8 for buffering, and the data buffering module 8 transmits the data of the first terminal to the data processing module 7;
  • the data processing module 7 When the data processing module 7 receives the data of the second terminal, the data processing module 7 sends the data of the second terminal to the data buffer module 8 for buffering, and the interface module 9 of the data buffer module 8 transmits the data of the second terminal to the interface module. 9.
  • the millimeter-wave communication chip is placed on the first terminal, so the interface module 9 is connected to the first terminal.
  • the millimeter-wave communication chip is installed on the second terminal
  • the interface; several interface modules 9 are used to receive different data signals, and the data buffer module 8 mainly plays the role of buffering the data transmitted by the first terminal to the data processing module 7;
  • the several interface modules 9 include: I2C/SPI/UART interface, LVDS interface and single-ended parallel interface;
  • the data buffer module 8 includes: High-Speed Parallel Data module and Side-Band Data module;
  • the High-Speed Parallel Data module is responsible for the buffering of data transmitted by the LVDS interface and the single-ended parallel interface, and
  • the Side-Band Data module is responsible for the buffering of data transmitted by the I2C/SPI/UART interface.
  • the first type the first terminal sends data to the second terminal;
  • the TDM mode controls the data processing module 7, the SerDes module 6 and the RF module 5 by means of time division multiplexing according to the transmission direction of the output of the first terminal to the second terminal , realize the transmission of the data of the first terminal to the second terminal;
  • the specific transmission process is: the millimeter wave communication chip receives various data of the first terminal through the I2C/SPI/UART interface, LVDS interface and single-ended parallel interface, and passes through the High- While the Speed Parallel Data module and the Side-Band Data module are buffering, various data of the first terminal are sent to the data processing module 7, and the data processing module 7 combines various data of the first terminal and sends it to the SerDes module 6 , the data received by the interface module 9 are all parallel data, so the SerDes module 6 converts the received parallel data into serial data and sends it to the RF module 5, and the RF module 5 transmits the data of the first terminal through millimeter wave wireless transmission. to the
  • the second type the second terminal feeds back data to the first terminal;
  • the TDM mode controls the data processing module 7, the SerDes module 6 and the RF module 5 by means of time division multiplexing according to the transmission direction of the output of the second terminal to the first terminal , realize the transmission of the data of the second terminal to the first terminal;
  • the specific transmission process is: the RF module 5 receives the feedback data of the second terminal through millimeter wave wireless communication, and sends the feedback data to the SerDes module 6, because the RF module 5 receives
  • the data is serial data, so the SerDes module 6 converts the serial data of the second terminal into parallel data and sends it to the data processing module 7.
  • the data processing module 7 separates the data after receiving the parallel data, and separates the separated data.
  • a display device using millimeter wave communication includes: a backplane 2 and an LED module 1.
  • the backplane 2 is used to obtain input data, and analyze and process it to generate The image data is sent to the LED module 1, and the LED module 1 is used to receive the video data sent by the backplane 2, and display it through the LED after analysis.
  • the LED module 1 includes a first millimeter wave communication chip 11 and an output main control board 12.
  • the first millimeter wave communication chip 11 is used for communication connection with the backplane 2, and the output main control board 12 is used for receiving the data of the first millimeter wave communication chip 11 for output display.
  • the first millimeter wave communication chip 11 and the output main control board 12 is electrically connected;
  • the backplane 2 includes a second millimeter wave communication chip 21 and an MCU main control board 22, and the second millimeter wave communication chip 21 is used to receive the control signal and related data of the MCU main control board 22, and communicate with the LED module 1 Communication connection;
  • the MCU main control board 22 is used to receive and analyze the input signals, and control the operation of the second millimeter wave communication chip 21 ;
  • the second millimeter wave communication chip 21 is electrically connected to the MCU main control board 22 .
  • the backplane 2 is connected to several LED modules 1. When the backplane 2 is connected to many LED modules 1, there will be a lot of connection cables, and the connection is complicated.
  • Group 1 also needs to be provided with a connection interface for a communication cable.
  • the connection interface will occupy a lot of space on the backplane 2 or the LED module 1.
  • the backplane 2 in this embodiment is provided with a first millimeter-wave communication chip 11 and the LED module 1.
  • the provided second millimeter-wave communication chip 21 adopts the communication method of time division multiplexing for communication connection, and the data exchange through the millimeter-wave communication chip replaces the function of the cable, so that the cable can be omitted at the same time as the backplane 2 and the LED module. 1 can not be provided with a communication connection interface, which simplifies the structural settings of the backplane 2 and the LED module 1 .
  • it further includes: an input module 3, the input module 3 is connected to the backplane 2 in communication, and the input module 3 is used for inputting image signals. Specifically, the input module 3 is used to input image signals to the backplane 2. Usually, the input module 3 inputs a number of image signals to the backplane 2. The backplane 2 is analyzed and processed and then sent to the LED module 1. 1 for display, and finally realize the effect of splicing display and so on.
  • the input module 3 includes: a third millimeter-wave communication chip 32 and an input main control board 31 , and the third millimeter-wave communication chip 32 is used for communicating with the first millimeter-wave communication chip 11 and sending image signals to The first millimeter wave communication chip 11 .
  • the input main control board 31 is used to control the signal transmission of the third millimeter-wave communication chip 32, and the third millimeter-wave hair receiving core is used to send the corresponding image signal to the first millimeter-wave communication chip 11, and time division multiplexing is also used. method of communication.
  • the LED module 1 further includes an output video interface circuit 13 and an output audio separation circuit 14 , the first output interface of the output main control board 12 is electrically connected to the output video interface circuit 13 , and the output main control board 12 is electrically connected to the output video interface circuit 13 .
  • the second output interface is electrically connected to the output audio separation circuit 14 .
  • the output video interface circuit 13 is used for independent output of video signals
  • the output audio separation circuit 14 is used for independent output of audio signals, because in actual use, there may be cases of independent output of video signals or independent output of audio signals
  • the video signal and the audio signal can be independently output, which means that this embodiment can also realize the splicing output of video and audio, which increases the application scope of this embodiment.
  • the output audio separation circuit 14 includes a decoding chip; the signal input end of the decoding chip is electrically connected to the output main control board 12 .
  • the output audio separation circuit 14 includes a decoding chip, and the signal input end of the decoding chip is electrically connected to the output main control board 12.
  • the decoding chip can realize the decoding of the audio signal, so that after the audio signal is output, It can be played through a speaker, and since an independent output audio separation circuit 14 is provided, the independent output of audio signals can be realized.
  • Step 110 the display device is powered on, and the second millimeter wave communication chip 21 is in a wireless receiving state;
  • Step 130 configure the second millimeter wave communication chip 21;
  • Step 140 the backplane 2 sends display data, the first millimeter wave communication chip 11 communicates with the second millimeter wave communication chip 21 , and the display data is displayed on the LED module 1 .
  • the second millimeter wave set on the LED module 1 is in a wireless receiving state by default, and the first millimeter wave chip set on the backplane 2 is configured by the MCU main control board 22 of the backplane 2 setting, establishing wireless communication with the second millimeter wave communication chip 21;
  • the MCU main control board 22 can configure the second millimeter wave communication chip 21 through the first millimeter wave communication chip 11; If the output main control board 12 is provided with a control chip similar to an MCU, the second millimeter-wave communication chip 21 can be configured through the control chip of the LED module 1;
  • the backplane 2 sends display data, the first millimeter wave communication chip 11 communicates with the second millimeter wave communication chip 21, and the display data is displayed on the LED module 1.
  • the specific process is: the backplane 2 sends the display data to the first millimeter wave
  • the second millimeter-wave communication chip 21 after configuring the second millimeter-wave communication chip 21, it further includes:
  • Step 131 the MCU main control board 22 reads the status information of the LED module 1 through the first millimeter wave communication chip 11;
  • Step 132 initialize and configure the LED module 1 .
  • the MCU main control board 22 reads initialization status information such as FLASH information on the LED module 1 through the first millimeter wave communication chip 11. According to the read initialization status information, the MCU main control board 22 also needs to combine the current needs The task to be performed or the corresponding initialization configuration is performed on the LED module 1 .
  • it also includes the steps of:
  • Step 210 if it is necessary to read the returned information of the LED module 1;
  • Step 220 the MCU main control board 22 sends a corresponding command to the LED module 1 through the first millimeter wave communication chip 11;
  • Step 230 the first millimeter wave communication chip 11 receives the return data from the LED module 1;
  • Step 240 the MCU main control board 22 reads the valid state of the returned data of the first millimeter wave communication chip 11 .
  • the backplane 2 needs to read the return information of the LED module 1, it sends a corresponding command to the LED module 1 through the first millimeter-wave communication chip 11, and the LED module 1 feeds back the corresponding data information according to the corresponding command , the first millimeter wave receives the feedback data information and reads the returned data, and then uses the SPI/UART/I2C interface to read;
  • the MCU main control board 22 can also control the display device to enter the sleep state or wake up the display device to enter the working state again as required.

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Abstract

一种毫米波通讯芯片、显示装置及方法，毫米波通讯芯片可以实现第一终端和第二终端的通讯连接，显示装置中背板（2）与LED模组（1）分别设有第一毫米波通讯芯片（11）和第二毫米波通讯芯片（21），两个毫米波通讯芯片的无线通讯，既可以实现背板（2）与LED模组（1）的无线通讯连接，背板（2）通过第二毫米波通讯芯片（21）发送显示数据至LED模组（1）以及接受LED模组（1）的反馈数据，LED模组（1）通过第一毫米波通讯芯片（11）接收背板（2）的显示数据进行显示同时将反馈数据发送至背板（2）；通过毫米波通讯芯片之间的无线通讯，实现了背板（2）与LED模组（1）之间无需连接众多的通讯线缆也能实现通讯的效果，使得LED模组（1）的布局可以更为的轻便灵活。

Description

一种毫米波通讯芯片、显示装置及方法
本申请要求2021年3月31日申请的，申请号为202110347141.0，名称为“一种采用毫米波通讯的显示装置”的中国专利申请的优先权，在此将其全文引入作为参考。
技术领域
本申请涉及通讯领域，具体涉及一种毫米波通讯芯片、显示装置及方法。
 背景技术
相关的显示装置，例如画面拼接器又称电视墙控制、电视墙拼接器、显示墙拼接器等，主要功能是将一个完整的图像信号划分成N块后分配给N个视频显示单元(如背投单元)，完成用多个普通视频单元组成一个超大屏幕动态图像显示屏，可以支持多种视频设备的同时接入。
 技术问题
相关的背板与显示模块的连接方式通常采用通讯线连接，背板与显示模块的连接线除了众多的通讯线，还需要加上电源线数据线等线缆，以及通常一个背板会与多个显示模块连接，可想而知背板与显示装置之间的线缆是非常的多，过多的通讯线缆造成了背板与显示模块之间的连线错综复杂，连接难度大且需要消耗大量时间去理清众多通讯线的问题。
 技术解决方案
为了克服相关技术的缺陷，本申请所要解决的技术问题在于提出一种毫米波通讯芯片、显示装置及方法，毫米波通讯芯片可以实现第一终端和第二终端的通讯连接，因此显示装置上既可以实现了背板与LED模组的无线通讯连接，实现了背板与LED模组之间无需连接众多的通讯线缆也能实现通讯的效果，使得LED模组的布局可以更为的轻便灵活。
为达此目的，本申请采用以下技术方案：
本申请提供的一种毫米波通讯芯片，所述毫米波通讯芯片包括；
RF模块：用于接发数据；
SerDes模块：用于并行数据串行数据之间的转换；
TDM模块：采用时分复用的方式控制所述RF模块和所述SerDes模块的数据传输方向；
所述SerDes模块接收第一终端的并行数据时，所述TDM模块发送控制信号至所述SerDes模块和所述RF模块，所述SerDes模块将并行数据转换为串行数据并发送至所述RF模块，所述RF模块将所述串行数据发送至第二终端；
所述RF模块接收第二终端的串行数据时，所述TDM模块发送控制信号至所述SerDes模块和所述RF模块，所述RF模块将串行数据发送至所述SerDes模块，所述SerDes模块将串行数据转换为并行数据并发送至第一终端。
在一实施例中，还包括数据处理模块，所述SerDes模块通过所述数据处理模块与第一终端通讯连接；
所述数据处理模块用于接收所述TDM模块的控制信号，所述数据处理模块根据控制信号，将第一终端的数据进行分析处理后发送至所述SerDes模块，或者是将所述SerDes模块的数据进行分析处理后发送至第一终端。
在一实施例中，还包括若干个接口模块和数据缓存模块；
所述接口模块，用于与第一终端连接；
所述数据缓存模块，用于建立所述数据处理模块与所述接口模块之间的通讯；
当所述接口模块接收第一终端的数据时，所述接口模块将第一终端的数据发送至所述数据缓存模块进行缓存，所述数据缓存模块再将第一终端的数据传输至所述数据处理模块；
当所述数据处理模块接收第二终端的数据时，所述数据处理模块将第二终端的数据发送至所述数据缓存模块进行缓存，所述数据缓存模块接口模块再将第二终端的数据传输至所述接口模块。
一种采用毫米波通讯的显示装置，包括：背板和LED模组，背板用于获取输入数据，并进行分析处理后生成图像数据发送至LED模组，LED模组用于接收所述背板发送的视频数据，解析后通过LED进行显示，其中，还包括上述的毫米波通讯芯片，所述毫米波通讯芯片包括第一毫米波通讯芯片和第二毫米波通讯芯片；
所述第一毫米波通讯芯片设于所述LED模组上，所述第二毫米波通讯芯片设于所述背板上；
所述LED模组包括输出主控板；
所述第一毫米波通讯芯片用于与所述背板进行通讯连接；
所述输出主控板用于接收所述第一毫米波通讯芯片的数据进行输出显示；
所述第一毫米波通讯芯片与所述输出主控板电连接；
所述背板包括MCU主控板；
所述第二毫米波通讯芯片用于接收MCU主控板的控制信号及相关数据，并与所述LED模组通讯连接；
所述MCU主控板用于接收各输入信号并进行分析处理，并控制所述第二毫米波通讯芯片的运行；
所述第二毫米波通讯芯片与所述MCU主控板电连接。
在一实施例中，所述第一毫米波通讯芯片与所述第二毫米波通讯芯片之间通讯连接，所述第一毫米波通讯芯片与所述第二毫米波通讯芯片进行时分复用的通讯方式。
在一实施例中，还包括：输入模块，所述输入模块与所述背板通讯连接，所述输入模块用于输入图像信号。
在一实施例中，所述输入模块包括：第三毫米波通讯芯片和输入主控板，所述第三毫米波通讯芯片用于与所述第一毫米波通讯芯片通讯连接，并发送图像信号至所述第一毫米波通讯芯片。
在一实施例中，还包括：输入模块，所述输入模块与所述背板通讯连接，所述输入模块用于输入图像信号。
在一实施例中，所述输入模块包括：第三毫米波通讯芯片和输入主控板，所述第三毫米波通讯芯片用于与所述第一毫米波通讯芯片通讯连接，并发送图像信号至所述第一毫米波通讯芯片。
在一实施例中，所述LED模组还包括：包括输出视频接口电路以及输出音频分离电路，所述输出主控板的第一输出接口与所述输出视频接口电路电连接，所述输出主控板的第二输出接口与所述输出音频分离电路电连接。
在一实施例中，所述输出视频接口电路包括高清输出芯片、及HDMI接口，所述高清输出芯片的信号输出端与所述HDMI接口电连接，所述高清输出芯片的信号输入端与所述输出主控板电连接。
在一实施例中，所述输出音频分离电路包括解码芯片；所述解码芯片的信号输入端与所述输出主控板电连接。
一种采用毫米波通讯的方法，应用于上述的一种采用毫米波通讯的显示装置，包括：
所述显示装置上电，所述第二毫米波通讯芯片处于无线接收状态；
配置所述第一毫米波通讯芯片，并建立与所述第二毫米波通讯芯片间的无线通讯；
配置所述第二毫米波通讯芯片；
所述背板发送显示数据，所述第一毫米波通讯芯片与所述第二毫米波通讯芯片进行通讯，显示数据在所述LED模组上进行显示。
在一实施例中，所述配置所述第二毫米波通讯芯片之后还包括：
所述MCU主控板通过所述第一毫米波通讯芯片进行读取所述LED模组的状态信息；
对所述LED模组进行初始化配置。
在一实施例中，还包括：
若需要读取LED模组的回传信息；
则所述MCU主控板通过所述第一毫米波通讯芯片发送相应命令至所述LED模组；
所述第一毫米波通讯芯片接收所述LED模组的回传数据；
所述MCU主控板读取第一毫米波通讯芯片的回传数据有效状态。
 有益效果
本申请的有益效果为：
本申请提供的一种毫米波通讯芯片、显示装置及方法，毫米波通讯芯片可以实现第一终端和第二终端的通讯连接，因此显示装置中背板与LED模组分别设有第一毫米波通讯芯片和第二毫米波通讯芯片，两个毫米波通讯芯片的无线通讯，既可以实现了背板与LED模组的无线通讯连接，背板通过第二毫米波通讯芯片发送显示数据至LED模组以及接受LED模组的反馈数据，LED模组通过第一毫米比通讯芯片接收背板的显示数据进行显示同时将反馈数据发送至背板；通过毫米波通讯芯片之间的无线通讯，实现了背板与LED模组之间无需连接众多的通讯线缆也能实现通讯的效果，使得LED模组的布局可以更为的轻便灵活。
 附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1为本申请具体实施方式中提供的采用毫米波通讯芯片的示意图；
图2为本申请具体实施方式中提供的采用毫米波通讯的显示装置的示意图一；
图3为本申请具体实施方式中提供的采用毫米波通讯的显示装置的示意图二；
图4为本申请具体实施方式中提供的采用毫米波通讯方法的示意图一；
图5为本申请具体实施方式中提供的采用毫米波通讯方法的示意图二；
图6为本申请具体实施方式中提供的采用毫米波通讯方法的示意图三。
附图标识：1LED模组；11第一毫米波通讯芯片；12输出主控板；13输出视频接口电路；14输出音频分离电路；2背板；21第二毫米波通讯芯片；22MCU主控板；3输入模块；31输入主控板；32第三毫米波通讯芯片；4 TDM模块；5 RF模块；6 SerDes模块；7数据处理模块；8数据缓存模块；9接口模块。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
对于本申请文件中出现的本领域技术人员常用的名词解释如下：
RF模块：射频模块，实现无线接发功能；
SerDes模块：是英文SERializer(串行器)/DESerializer(解串器)的简称；
TDM模块：时分复用模块，是将不同的信号相互交织在不同的时间段内，沿着同一个信道传输；在接收端再用某种方法，将各个时间段内的信号提取出来还原成原始信号的通信技术。这种技术可以在同一个信道上传输多路信号；
背板：是设于拼接处理器中的主控电路板，背板起到图像信号的输入输出控制的作用。
下面结合附图并通过具体实施方式来进一步说明本申请的技术方案。
实施例一
如图1所示，一种毫米波通讯芯片，毫米波通讯芯片包括；
RF模块5：用于接发数据；
SerDes模块6：用于并行数据串行数据之间的转换；
TDM模块4：采用时分复用的方式控制RF模块5和SerDes模块6的数据传输方向；
SerDes模块6接收第一终端的并行数据时，TDM模块4发送控制信号至SerDes模块6和RF模块5，SerDes模块6将并行数据转换为串行数据并发送至RF模块5，RF模块5将串行数据发送至第二终端；
RF模块5接收第二终端的串行数据时，TDM模块4发送控制信号至SerDes模块6和RF模块5，RF模块5将串行数据发送至SerDes模块6，SerDes模块6将串行数据转换为并行数据并发送至第一终端。
具体的，第一终端与第二终端为毫米波通讯芯片通讯两端的终端，可以是背板与LED模组、主控装置与被控装置等，毫米波通讯芯片具备接收和发送数据的功能，TDM模块4根据需要，采用时分复用的方式完成整个数据通路传输方向的切换功能，即TDM模块4用于实现毫米波通讯芯片的接收数据和发送数据之间切换；
由于毫米波通讯芯片会置于其中一个终端上进行运行的，因此本实施例是对于将毫米波通讯芯片置于第一终端上的角度来进行的，同时第二终端也是具备无线通讯功能的，第二终端可以同样设置毫米波通讯芯片亦可以设置其他无线通讯模块；当毫米波通讯芯片接发送数据时，数据流向为由SerDes模块6接收数据后发送至RF模块5，再由RF模块5发送至第二终端；反之，当毫米波通讯芯片接收数据时，数据流向为由RF模块5接收数据后发送至SerDes模块6，再由SerDes模块6发送至第一终端；TDM模块4则是根据不同的情况采用时分复用的方式完成整个数据通路传输方向的切换功能。
在一实施例中，还包括数据处理模块7，SerDes模块6通过数据处理模块7与第一终端通讯连接；
数据处理模块7用于接收TDM模块4的控制信号，数据处理模块7根据控制信号，将第一终端的数据进行分析处理后发送至SerDes模块6，或者是将SerDes模块6的数据进行分析处理后发送至第一终端。
具体的，数据处理模块7是用于对数据进行合并或者分离，当第一终端的数据通过若干个接口模块9传输至数据处理模块7时，数据处理模块7对第一终端的数据进行合并处理，并将合并后的数据发送至SerDes模块6；或者是，当SerDes模块6模块将第二终端的数据传输至数据处理模块7时，数据处理模块7将第二终端的数据进行分离处理，并将分离后的数据通过若干个接口模块9发送至第一终端；
TDM模块4起到控制第一终端与第二终端之间的数据流向的作用，根据TDM模块4的当前控制数据流向，数据模块对数据的合并或者分离的作用。
在一实施例中，还包括若干个接口模块9和数据缓存模块8；
接口模块9，用于与第一终端连接；
数据缓存模块8，用于建立数据处理模块7与接口模块9之间的通讯；
当接口模块9接收第一终端的数据时，接口模块9将第一终端的数据发送至数据缓存模块8进行缓存，数据缓存模块8再将第一终端的数据传输至数据处理模块7；
当数据处理模块7接收第二终端的数据时，数据处理模块7将第二终端的数据发送至数据缓存模块8进行缓存，数据缓存模块8接口模块9再将第二终端的数据传输至接口模块9。
具体的，根据上述可知本实施例中是将本毫米波通讯芯片置于第一终端上的，因此接口模块9是与第一终端连接，同理，若毫米波通讯芯片设于第二终端上则接口；若干个接口模块9用于接收不同的数据信号，数据缓存模块8主要起到第一终端传输至数据处理模块7的数据进行缓存作用；
本实施例中若干个接口模块9包括：I2C/SPI/UART接口、LVDS接口以及单端并行接口；数据缓存模块8包括：High-Speed Parallel Data模块和Side-Band Data模块；其中High-Speed Parallel Data模块负责LVDS接口和单端并行接口传输数据的缓存，Side-Band Data模块负责I2C/SPI/UART接口传输数据的缓存。
综上，本实施例的工作情况有两种：
第一种：第一终端发送数据至第二终端；TDM模根据第一终端的输出传输至第二终端的传输方向，采用时分复用的方式控制数据处理模块7、SerDes模块6及RF模块5，实现将第一终端的数据传输至第二终端；具体传输过程为：毫米波通讯芯片通过I2C/SPI/UART接口、LVDS接口以及单端并行接口接收第一终端的各种数据，经过High-Speed Parallel Data模块和Side-Band Data模块进行缓存的同时将第一终端的各种数据发送至数据处理模块7，数据处理模块7将第一终端的各种数据进行合并处理后发送至SerDes模块6，接口模块9接收的数据均是并行数据，因此SerDes模块6将接收到的并行数据转换为串行数据后发送至RF模块5，RF模块5再通过毫米波无线传输将第一终端的数据发送至第二终端；
第二种：第二终端反馈数据至第一终端；TDM模根据第二终端的输出传输至第一终端的传输方向，采用时分复用的方式控制数据处理模块7、SerDes模块6及RF模块5，实现将第二终端的数据传输至第一终端；具体传输过程为：RF模块5通过毫米波无线通讯接收第二终端的反馈数据，并将反馈数据发送至SerDes模块6，由于RF模块5接收的为串行数据，因此SerDes模块6将第二终端的串行数据转换为并行数据并发送至数据处理模块7，数据处理模块7接收到并行数据后对数据进行分离处理，并将分离后的数据发送至High-Speed Parallel Data模块和Side-Band Data模块，High-Speed Parallel Data模块和Side-Band Data模块对分离后的书数据发送至I2C/SPI/UART接口、LVDS接口以及单端并行接口的同时进行缓存处理，最后由I2C/SPI/UART接口、LVDS接口以及单端并行接口将数据发送至第一终端。
实施例二
如图2-3所示，本实施例中提供的一种采用毫米波通讯的显示装置，包括：背板2和LED模组1，背板2用于获取输入数据，并进行分析处理后生成图像数据发送至LED模组1，LED模组1用于接收背板2发送的视频数据，解析后通过LED进行显示，LED模组1包括第一毫米波通讯芯片11和输出主控板12，第一毫米波通讯芯片11用于与背板2进行通讯连接，输出主控板12用于接收第一毫米波通讯芯片11的数据进行输出显示，第一毫米波通讯芯片11与输出主控板12电连接；背板2包括第二毫米波通讯芯片21和MCU主控板22，第二毫米波通讯芯片21用于接收MCU主控板22的控制信号及相关数据，并与LED模组1通讯连接；MCU主控板22用于接收各输入信号并进行分析处理，并控制第二毫米波通讯芯片21的运行；第二毫米波通讯芯片21与MCU主控板22电连接。具体的，背板2与若干个LED模组1连接，当背板2会与众多的LED模组1连接时，连接线缆会非常的多，在连接时错综复杂，且背板2和LED模组1还需设置通讯线缆的连接接口，连接接口会占据背板2或者LED模组1不少空间结构，本实施例的背板2设有第一毫米波通讯芯片11与LED模组1设有的第二毫米波通讯芯片21采用时分复用的通讯方式进行通讯连接，通过毫米波通讯芯片进行数据交互代替线缆的功能，以此可以省去线缆同时背板2和LED模组1均可以不用设置通讯连接接口，简化了背板2和LED模组1的结构设置。
在一实施例中，第一毫米波通讯芯片11与第二毫米波通讯芯片21之间通讯连接，第一毫米波通讯芯片11与第二毫米波通讯芯片21进行时分复用的通讯方式。具体的，时分复用是将提供给整个信道传输信息的时间划分成若干时间片（简称时隙），并将这些时隙分配给每一个信号源使用，每一路信号在自己的时隙内独占信道进行数据传输，时分复用技术的特点是时隙事先规划分配好且固定不变，所以有时也叫同步时分复用，其优点是时隙分配固定，便于调节控制，适于数字信息的传输，因此用于本申请的第一毫米波通讯芯片11和第二毫米波通讯芯片21传输图像信息稳定且便于调节。
在一实施例中，还包括：输入模块3，输入模块3与背板2通讯连接，输入模块3用于输入图像信号。具体的，输入模块3用于输入图像信号至背板2，通常是由输入模块3输入若干个图像信号至背板2，背板2经过分析处理再发送至LED模组1，通过LED模组1进行显示，最终实现拼接显示等效果。
在一实施例中，输入模块3包括：第三毫米波通讯芯片32和输入主控板31，第三毫米波通讯芯片32用于与第一毫米波通讯芯片11通讯连接，并发送图像信号至第一毫米波通讯芯片11。具体的，输入主控板31用于控制第三毫米波通讯芯片32的信号发送，第三毫米波接发芯用于发送对应的图像信号至第一毫米波通讯芯片11，同样采用时分复用的通讯方式。
在一实施例中，LED模组1还包括：包括输出视频接口电路13以及输出音频分离电路14，输出主控板12的第一输出接口与输出视频接口电路13电连接，输出主控板12的第二输出接口与输出音频分离电路14电连接。具体的，输出视频接口电路13用于视频信号进行独立输出，输出音频分离电路14用于音频信号进行独立输出，由于在实际使用的情况下，会存在独立输出视频信号或者独立输出音频信号的情况，同时视频信号和音频信号可以独立输出，也就意味着本实施例还能实现视频和音频的拼接输出，增加了本实施例的使用范围。
在一实施例中，输出视频接口电路13包括高清输出芯片、及HDMI接口，高清输出芯片的信号输出端与HDMI接口电连接，高清输出芯片的信号输入端与输出主控板12电连接。具体的，为了便于视频信号进行独立输出，输出视频接口电路13包括高清输出芯片、及HDMI接口，高清输出芯片的信号输出端与HDMI接口电连接，高清输出芯片的信号输入端与输出主控板12电连接，由于设置了独立的输出视频接口电路13，故可以实现视频信号的单独输出。
在一实施例中，输出音频分离电路14包括解码芯片；解码芯片的信号输入端与输出主控板12电连接。具体的，为了便于音频信号进行独立输出，输出音频分离电路14包括解码芯片，解码芯片的信号输入端与输出主控板12电连接，通过解码芯片能够实现音频信号的解码，使得音频信号输出后能够通过播音器进行播放，由于设置了独立的输出音频分离电路14，故可以实现音频信号的单独输出。
实施例三
如图4-6所示，一种采用毫米波通讯的方法，应用于上述的一种采用毫米波通讯的显示装置，包括如下步骤：
步骤110，显示装置上电，第二毫米波通讯芯片21处于无线接收状态；
步骤120，配置第一毫米波通讯芯片11，并建立与第二毫米波通讯芯片21间的无线通讯；
步骤130，配置第二毫米波通讯芯片21；
步骤140，背板2发送显示数据，第一毫米波通讯芯片11与第二毫米波通讯芯片21进行通讯，显示数据在LED模组1上进行显示。
具体的，当显示装置上电时，设于LED模组1的第二毫米波默认处于无线接收状态，设于背板2的第一毫米波芯片由背板2的MCU主控板22进行配置设置，建立与第二毫米波通讯芯片21间的无线通讯；
配置第二毫米波通讯芯片21有两种方式，第一，MCU主控板22可以通过第一毫米波通讯芯片11对第二毫米波通讯芯片21进行配置；第二，若LED模组1的输出主控板12设有类似于MCU的控制芯片，则可以通过LED模组1的控制芯片对第二毫米波通讯芯片21进行配置；
背板2发送显示数据，第一毫米波通讯芯片11与第二毫米波通讯芯片21进行通讯，显示数据在LED模组1上进行显示，具体过程为：背板2发送显示数据至第一毫米波通讯芯片11，由于第一毫米波通讯芯片11与第二毫米波通讯芯片21无线通讯连接，因此，由第一毫米波通讯芯片11将显示数据发送至第二毫米波通讯芯片21，第二毫米波通讯芯片21接收显示数据后传输至LED模组1的输出控制板，输出控制板将显示数据进行输出至LED模组1进行显示。
在一实施例中，配置第二毫米波通讯芯片21之后还包括：
步骤131，MCU主控板22通过第一毫米波通讯芯片11进行读取LED模组1的状态信息；
步骤132，对LED模组1进行初始化配置。
具体的，MCU主控板22通过第一毫米波通讯芯片11进行读取LED模组1上的FLASH信息等初始化状态信息，根据读取的初始化状态信息，MCU主控板22还需要结合当前需要执行的任务或者，对LED模组1进行相应的初始化配置。
在一实施例中，还包括步骤：
步骤210，若需要读取LED模组1的回传信息；
步骤220，则MCU主控板22通过第一毫米波通讯芯片11发送相应命令至LED模组1；
步骤230，所述第一毫米波通讯芯片11接收LED模组1的回传数据；
步骤240，MCU主控板22读取第一毫米波通讯芯片11的回传数据有效状态。
具体的，若背板2需要读取LED模组1的回传信息，则发送通过第一毫米波通讯芯片11发送相应命令至LED模组1，LED模组1根据相应命令反馈对应的数据信息，第一毫米波接收反馈的数据信息并读取回传数据，再使用SPI/UART/I2C接口读取；
进一步的，MCU主控板22还可以根据需要控制显示装置进入睡眠状态或唤醒显示装置重新进入工作状态。
以上所述仅为本申请的较佳实施例而已，并不用以限制本申请，凡在本申请的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本申请的保护范围之内。

Claims (10)

  1. 一种毫米波通讯芯片，其中，所述毫米波通讯芯片包括；
    RF模块：用于接发数据；
    SerDes模块：用于并行数据串行数据之间的转换；
    TDM模块：采用时分复用的方式控制所述RF模块和所述SerDes模块的数据传输方向；
    所述SerDes模块接收第一终端的并行数据时，所述TDM模块发送控制信号至所述SerDes模块和所述RF模块，所述SerDes模块将并行数据转换为串行数据并发送至所述RF模块，所述RF模块将所述串行数据发送至第二终端；
    所述RF模块接收第二终端的串行数据时，所述TDM模块发送控制信号至所述SerDes模块和所述RF模块，所述RF模块将串行数据发送至所述SerDes模块，所述SerDes模块将串行数据转换为并行数据并发送至第一终端。
  2. 如权利要求1所述的一种毫米波通讯芯片，其中，还包括数据处理模块，所述SerDes模块通过所述数据处理模块与第一终端通讯连接；
    所述数据处理模块用于接收所述TDM模块的控制信号，所述数据处理模块根据控制信号，将第一终端的数据进行分析处理后发送至所述SerDes模块，或者是将所述SerDes模块的数据进行分析处理后发送至第一终端。
  3. 如权利要求2所述的一种毫米波通讯芯片，其中，还包括若干个接口模块和数据缓存模块；
    所述接口模块，用于与第一终端连接；
    所述数据缓存模块，用于建立所述数据处理模块与所述接口模块之间的通讯；
    当所述接口模块接收第一终端的数据时，所述接口模块将第一终端的数据发送至所述数据缓存模块进行缓存，所述数据缓存模块再将第一终端的数据传输至所述数据处理模块；
    当所述数据处理模块接收第二终端的数据时，所述数据处理模块将第二终端的数据发送至所述数据缓存模块进行缓存，所述数据缓存模块接口模块再将第二终端的数据传输至所述接口模块。
  4. 一种采用毫米波通讯的显示装置，包括：背板和LED模组，背板用于获取输入数据，并进行分析处理后生成图像数据发送至LED模组，LED模组用于接收所述背板发送的视频数据，解析后通过LED进行显示，其中，还包括权利要求1-3所述的毫米波通讯芯片，所述毫米波通讯芯片包括第一毫米波通讯芯片和第二毫米波通讯芯片；
    所述第一毫米波通讯芯片设于所述LED模组上，所述第二毫米波通讯芯片设于所述背板上；
    所述LED模组包括输出主控板；
    所述第一毫米波通讯芯片用于与所述背板进行通讯连接；
    所述输出主控板用于接收所述第一毫米波通讯芯片的数据进行输出显示；
    所述第一毫米波通讯芯片与所述输出主控板电连接；
    所述背板包括MCU主控板；
    所述第二毫米波通讯芯片用于接收MCU主控板的控制信号及相关数据，并与所述LED模组通讯连接；
    所述MCU主控板用于接收各输入信号并进行分析处理，并控制所述第二毫米波通讯芯片的运行；
    所述第二毫米波通讯芯片与所述MCU主控板电连接。
  5. 如权利要求4所述的一种采用毫米波通讯的显示装置，其中，所述第一毫米波通讯芯片与所述第二毫米波通讯芯片之间通讯连接，所述第一毫米波通讯芯片与所述第二毫米波通讯芯片进行时分复用的通讯方式。
  6. 如权利要求4所述的一种采用毫米波通讯的显示装置，其中，还包括：输入模块，所述输入模块与所述背板通讯连接，所述输入模块用于输入图像信号。
  7. 如权利要求6所述的一种采用毫米波通讯的显示装置，其中，所述输入模块包括：第三毫米波通讯芯片和输入主控板，所述第三毫米波通讯芯片用于与所述第一毫米波通讯芯片通讯连接，并发送图像信号至所述第一毫米波通讯芯片。
  8. 一种采用毫米波通讯的方法，其中，应用于权利要求4-7所述的一种采用毫米波通讯的显示装置，包括：
    所述显示装置上电，所述第二毫米波通讯芯片处于无线接收状态；
    配置所述第一毫米波通讯芯片，并建立与所述第二毫米波通讯芯片间的无线通讯；
    配置所述第二毫米波通讯芯片；
    所述背板发送显示数据，所述第一毫米波通讯芯片与所述第二毫米波通讯芯片进行通讯，显示数据在所述LED模组上进行显示。
  9. 如权利要求8所述的一种采用毫米波通讯的方法，其中，所述配置所述第二毫米波通讯芯片之后还包括：
    所述MCU主控板通过所述第一毫米波通讯芯片进行读取所述LED模组的状态信息；
    对所述LED模组进行初始化配置。
  10. 如权利要求8所述的一种采用毫米波通讯的方法，其中，还包括：
    若需要读取LED模组的回传信息；
    则所述MCU主控板通过所述第一毫米波通讯芯片发送相应命令至所述LED模组；
    所述第一毫米波通讯芯片接收所述LED模组的回传数据；
    所述MCU主控板读取第一毫米波通讯芯片的回传数据有效状态。
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