WO2022205506A1 - 显示面板 - Google Patents

显示面板 Download PDF

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Publication number
WO2022205506A1
WO2022205506A1 PCT/CN2021/087354 CN2021087354W WO2022205506A1 WO 2022205506 A1 WO2022205506 A1 WO 2022205506A1 CN 2021087354 W CN2021087354 W CN 2021087354W WO 2022205506 A1 WO2022205506 A1 WO 2022205506A1
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WO
WIPO (PCT)
Prior art keywords
region
area
display panel
width
backplane
Prior art date
Application number
PCT/CN2021/087354
Other languages
English (en)
French (fr)
Inventor
杨俊�
游魁华
黄鹏
Original Assignee
武汉华星光电半导体显示技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电半导体显示技术有限公司
Priority to US17/289,224 priority Critical patent/US20240099083A1/en
Publication of WO2022205506A1 publication Critical patent/WO2022205506A1/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H10K59/1315—Interconnections, e.g. wiring lines or terminals comprising structures specially adapted for lowering the resistance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/17—Passive-matrix OLED displays
    • H10K59/179—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/90—Assemblies of multiple devices comprising at least one organic light-emitting element

Definitions

  • the present application relates to the field of display technology, and in particular, to a display panel.
  • OLED organic light emitting diode
  • the inventors of the present application found that as the size of the panel increases, the size of the terminal area also increases, and the backplane of the terminal area is prone to appear when the terminal area is bent. Wrinkling and warping, resulting in inability to complete the bending of the terminal area or even breakage of the metal lines.
  • the embodiments of the present application provide a display panel, which can reduce the risk of wrinkling and warping of the backplane of the terminal area when the terminal area is bent.
  • An embodiment of the present application provides a display panel, which includes a display portion, a bent portion, and a terminal portion, wherein the bent portion is connected between the display portion and the terminal portion, wherein the terminal portion includes:
  • binding substrate is disposed on the first backplane
  • the thickened layer comprising a first portion
  • the orthographic projection of the first backplane on the plane where the binding substrate is located is the first projection
  • the orthographic projection of the circuit board on the plane where the binding substrate is located is the second projection
  • the terminal portion includes a first area and a second area, and the first area is an overlapping area of the first projection and the second projection;
  • the second area is connected to the first area and is disposed on one side of the first area; the first direction is parallel to the longitudinal direction of the first backplane;
  • the first portion is disposed in the second region and extends from the junction of the first region and the second region to a side away from the first region.
  • the terminal portion includes a third area; in the first direction, the third area is connected to the first area and is disposed on the other side of the first area ;
  • the thickened layer includes a second portion, and the second portion is arranged in the third region;
  • the second portion extends from the junction of the first region and the third region to a side away from the first region.
  • the thickened layer further includes a third part, the third part is disposed in the first region, and the third part is connected to the first part.
  • the thickened layer further includes a fourth part, the fourth part is disposed in the first region, and the fourth part is connected to the second part.
  • the terminal portion includes a third area; in the first direction, the third area is connected to the first area and is disposed in the first area the other side; the thickened layer includes a second part, and the second part is arranged in the third area;
  • the second portion extends from the junction of the first region and the third region to a side away from the first region;
  • the third part is connected to the second part.
  • the length of the first portion is less than or equal to the length of the second region.
  • the width of the first portion is smaller than or equal to the width of the first region.
  • the thickness of the first portion decreases or does not change in a direction away from the first region from the junction of the first region and the second region.
  • the length of the thickened layer is less than or equal to the length of the first backplane.
  • the width of the thickened layer is less than or equal to the width of the first region.
  • the thickness of the thickened layer decreases or does not increase. Change.
  • the thickened layer is disposed on a side of the first backplane away from the binding substrate.
  • the thickened layer and the first back plate are integrally formed.
  • the thickened layer is provided on the binding substrate.
  • the first part and the second part are provided on the binding substrate, and the third part is provided on the circuit board.
  • the binding substrate includes:
  • the first substrate is disposed on the first backplane
  • the metal layer is disposed on the first substrate, and the metal layer includes connection terminals;
  • the insulating layer is disposed on the metal layer and exposes the connection terminals.
  • the width of the thickened layer is greater than the width of the first region, and less than or equal to the width of the first backplane.
  • the width of the first portion is greater than the width of the first region, and is less than or equal to the width of the first backplane.
  • the width of the second portion is smaller than or equal to the width of the first region.
  • the width of the third portion is smaller than or equal to the width of the first region.
  • the width of the fourth portion is smaller than or equal to the width of the first region.
  • a terminal part includes a first backplane, a binding substrate, a circuit board and a thickened layer.
  • the binding substrate is arranged on the first backplane; the circuit board is arranged on the binding substrate.
  • the thickening layer includes a first part; the orthographic projection of the first backplane on the plane where the binding substrate is located is the first projection, and the orthographic projection of the circuit board on the plane where the binding substrate is located is the second projection; the terminal part includes a first projection area and second area, the first area is formed by overlapping the first projection and the second projection; in the first direction, the second area is connected with the first area and is arranged on one side of the first area; the first direction and the first area The longitudinal direction of the back plate is parallel; the first part is arranged in the second area and extends from the junction of the first area and the second area to a side away from the first area.
  • a thickened layer is provided in the second area and/or the third area of the terminal portion to reduce the risk of wrinkling and warping of the first backplane.
  • FIG. 1 is a schematic top-view structural diagram of a display panel provided in a first embodiment of the present application in a flat state;
  • Fig. 2 is the sectional structure schematic diagram along AA line in Fig. 1;
  • FIG. 3 is a schematic cross-sectional structural diagram of the display panel provided in the first embodiment of the present application in a bent state
  • FIG. 4 is a schematic bottom view structural diagram of the display panel provided in the first embodiment of the present application in a flat state
  • FIG. 5 is a schematic bottom view structure diagram of the display panel provided in the second embodiment of the present application in a flat state
  • FIG. 6 is a schematic bottom view structure diagram of a display panel provided in a third embodiment of the present application in a flat state
  • FIG. 7 is a graph showing the width of the thickened layer and the warped height of the first backplane when the display panel is in a bent state according to the third embodiment of the present application;
  • FIG. 8 is a schematic top-view structural diagram of a display panel provided in a fourth embodiment of the present application in a flat state
  • Fig. 9 is the sectional structure schematic diagram along BB line in Fig. 8;
  • FIG. 10 is a schematic cross-sectional structural diagram of the display panel provided in the fourth embodiment of the present application in a bent state
  • FIG. 11 is a schematic top-view structural diagram of a display panel provided in a fifth embodiment of the present application in a flat state;
  • FIG. 12 is a schematic top-view structural diagram of the display panel provided in the sixth embodiment of the present application in a flat state.
  • Embodiments of the present application provide a display panel. Details are described below. It should be noted that the description order of the following embodiments is not intended to limit the preferred order of the embodiments.
  • FIG. 1 is a schematic top view of the display panel provided in the first embodiment of the present application in a flat state
  • FIG. 2 is a cross-sectional structural schematic diagram along line AA in FIG. 1
  • An embodiment provides a schematic cross-sectional structural diagram of a display panel in a bent state.
  • the display panel 1000 includes a display part 100 , a bending part 200 and a terminal part 300 .
  • the bent portion 200 is connected between the display portion 100 and the terminal portion 300 .
  • the terminal part 300 includes a first backplane 31 , a bonding substrate 32 , a circuit board 33 and a thickened layer 34 .
  • the binding substrate 32 is provided on the first backplane 31 .
  • the circuit board 33 is provided on the bonding substrate 32 .
  • the thickened layer 34 is disposed on the side of the first backplane 31 away from the binding substrate 32 .
  • the binding substrate 32 includes a first substrate 321 , a first wiring 322 , a connection terminal 323 and a first insulating layer 324 .
  • the first substrate 321 is disposed on the first backplane 31 .
  • the connection terminal 323 is connected to the first trace 322 .
  • the first traces 322 and the connection terminals 323 are disposed on the same layer and on the first substrate 321 .
  • the first insulating layer 324 covers the first traces 322 and exposes the connection terminals 323 .
  • the thickened layer 34 and the first back plate 31 are integrally formed. That is, the material of the thickened layer 34 is the same as that of the first backplane 31 . That is to say, the thickened first back plate 31 can be prepared at the incoming end, wherein the thickened part is the thickened layer 34 .
  • the material of the thickened layer 34 is different from the material of the first backplane 31 .
  • the elastic modulus of the thickened layer 34 is greater than the elastic modulus of the first backplane 31 , so as to improve the effect of suppressing the warpage of the first backplane 31 .
  • the circuit board 33 may be a printed circuit board or a flexible circuit board.
  • the circuit board 33 is electrically connected to the connection terminals 323 .
  • the bent portion 200 includes a second substrate 21 , a second wiring 22 and a second insulating layer 23 arranged in sequence.
  • the display part 100 includes a second backplane 11 , a third substrate 12 and a display module 13 arranged in sequence.
  • the display module 13 may be one of an organic light emitting diode display module, a liquid crystal display module, a micro LED display module or a Mini-LED display module.
  • the display panel 1000 of the first embodiment is described by taking the display module 13 being an organic light emitting diode display module as an example, but it is not limited thereto.
  • the first substrate 321 , the second substrate 21 and the third substrate 12 are connected in sequence, and the materials of the three may be the same or different.
  • the first substrate 321 , the second substrate 21 and the third substrate 12 are integrally formed.
  • the first wiring 322 is connected to the second wiring 22 .
  • the second wiring 22 is electrically connected to the display module 13 .
  • the materials of the first wiring 322 and the second wiring 22 are the same, and they are integrally formed.
  • the materials of the first wire 322 and the material of the second wire 22 may also be different.
  • the first insulating layer 324 is connected to the second insulating layer 23 .
  • the materials of the first insulating layer 324 and the second insulating layer 23 are the same, and they are integrally formed.
  • the materials of the first insulating layer 324 and the second insulating layer 23 may also be different.
  • the orthographic projection of the first backplane 31 on the plane where the binding substrate 32 is located is the first projection 31 a
  • the circuit board 33 is located on the binding substrate 32 .
  • the orthographic projection of the plane is the second projection 33a.
  • the terminal part 300 includes a first area 3a, a second area 3b and a third area 3c.
  • the first area 3a is the overlapping area of the first projection 31a and the second projection 33a.
  • the second area 3b, the first area 3a and the third area 3c are connected in sequence.
  • the first direction x is parallel to the longitudinal direction of the first backplane 31 .
  • the second direction y is perpendicular to the first direction x.
  • the second area 3b is connected to the first area 3a and is disposed on one side of the first area 3a.
  • the third area 3c is connected to the first area 3a and is disposed on the other side of the first area 3a.
  • the thickened layer 34 includes a first portion 341 and a second portion 342 .
  • the first portion 341 is provided in the second region 3b.
  • the second portion 342 is provided in the third area 3c.
  • the first portion 341 extends from the junction of the first region 3a and the second region 3b to a side away from the first region 3a.
  • the second portion 342 extends from the junction of the first region 3a and the third region 3c to a side away from the first region 3a.
  • thickened layers 34 are disposed on the first backplane 31 corresponding to the second area 3b and the third area 3c to reduce the risk of wrinkles and warping at both ends of the first backplane 31 .
  • the length l1 of the first portion 341 is less than or equal to the length L1 of the second region 3b.
  • the second region 3b extends from the boundary of the first region 3a to the boundary of the first backplane 31 .
  • the length l2 of the second portion 342 is less than or equal to the length L2 of the third region 3c.
  • the third area 3c extends from the boundary of the first area 3a to another boundary of the first backplane 31 .
  • the first part 341 extends from the junction of the first area 3a and the second area 3b to a side away from the first area 3a, wherein the longer the length l1 of the first part 341, the longer the length l1 of the first part 341 is, the more it is transmitted from the middle of the terminal part 300
  • the second portion 342 extends from the junction of the first region 3a and the third region 3c to the side away from the first region 3a, wherein the longer the length l2 of the second portion 342, the inhibiting effect transmitted from the middle of the terminal portion 300 The further the distance can be reached, the smaller the degree of warpage of the portion of the first back plate 31 corresponding to the third region 3c is.
  • the length l1 of the first portion 341 is equal to the length L1 of the second region 3b.
  • the length l2 of the second portion 342 is equal to the length l2 of the third region 3c.
  • the lengths of the first portion 341 and the second portion 342 are different.
  • the width n1 of the first portion 341 is smaller than or equal to the width N of the first region 3a.
  • the width n2 of the second portion 342 is smaller than or equal to the width N of the first region 3a.
  • the warpage degree at both ends of the first backplane 31 can be improved.
  • the widths of the first portion 341 and the second portion 342 are equal to the width of the first region 3a, the effect of improving the warpage degree at both ends of the first back plate 31 is the best.
  • the widths of the first portion 341 and the second portion 342 are both equal to the width of the first region 3a.
  • the width n1 of the first portion 341 is greater than the width N of the first region 3 a and less than or equal to the width of the first backplane 31 .
  • the width n2 of the second portion 342 is greater than the width N of the first region 3 a and less than or equal to the width of the first backplane 31 .
  • the widths of the first portion 341 and the second portion 342 are different.
  • the thickness d of the first portion 341 decreases or does not change.
  • the effect of suppressing the warpage of the first back plate 31 is better than that when the thickness of the first part 341 decreases.
  • the thickness of the first part 341 is decreased, which can save material on the one hand, and save space for the installation of other devices on the other hand.
  • the thickness of the first portion 341 does not change in the direction away from the first region 3a from the junction of the first region 3a and the second region 3b.
  • the thickness d of the second portion 342 decreases or does not change.
  • the effect of suppressing the warpage of the first back plate 31 is better than that when the thickness of the second portion 342 decreases.
  • the thickness of the second portion 342 is decreased, which can save material on the one hand, and save space for the installation of other devices on the other hand.
  • the thickness of the first portion 341 does not change in the direction away from the first region 3a from the junction of the first region 3a and the second region 3b.
  • the thickness of the second portion 342 does not change in the direction away from the first region 3a from the junction of the first region 3a and the third region 3c.
  • the thickness of the thickened layer 34 is less than 900 microns. Since the bending diameter of the bending portion 200 is about 900 microns, such a setting ensures that the bending portion 200 can be bent to an optimal state.
  • the display panel 2000 of the second embodiment is based on the display panel 1000 of the first embodiment, and the following structural features are added:
  • the thickened layer 34 also includes a third portion 343 and a fourth portion 344 .
  • the third portion 343 is disposed in the first region 3 a, and the third portion 343 is connected to the first portion 341 .
  • the fourth portion 344 is disposed in the first region 3 a, and the fourth portion 344 is connected to the second portion 342 .
  • the third part 343 and the fourth part 344 are not connected.
  • the third part 343 and the fourth part 344 are arranged to improve the effect of the thickened layer 34 on suppressing the warpage of the two ends of the first backplane 31 .
  • the widths n3 and n4 of the third portion 343 and the fourth portion 344 are both equal to the width N of the first region 3a.
  • the width n3 of the third portion 343 is greater than the width N of the first region 3 a and less than or equal to the width of the first backplane 31 .
  • the width n4 of the fourth portion 344 is greater than the width N of the first region 3 a and less than or equal to the width of the first backplane 31 .
  • the width n3 of the third portion 343 is smaller than the width N of the first region 3a.
  • the width n4 of the fourth portion 344 is smaller than the width N of the first region 3a.
  • the lengths l3 and l4 of the third portion 343 and the fourth portion 344 are both smaller than the length of the first region 3a.
  • the thicknesses of the third portion 343 and the fourth portion 344 are equal. In some embodiments, the thicknesses of the third portion 343 and the fourth portion 344 are both smaller than the thickness d of the first portion 341 or the second portion 342 to save space.
  • the materials of the first part 341 , the second part 342 , the third part 343 and the fourth part 344 are the same.
  • the display panel 3000 of the third embodiment is based on the display panel 1000 of the first embodiment, and the following structural features are added:
  • the thickened layer 34 also includes a third portion 343 .
  • the third portion 343 is provided in the first region 3a.
  • the third portion 343 is connected to the first portion 341 and the second portion 342, respectively.
  • the third portion 343 is provided to improve the effect of the thickened layer 34 on suppressing the warpage at both ends of the first backplane 31 .
  • the length l of the thickened layer 34 is less than or equal to the length L of the first backplane 31 .
  • the thickened layer 34 includes the third part 343, and the longer the extension of the first part 341 and the second part 342 is, the farther the inhibitory effect transmitted from the middle of the terminal part 300 can be, then the The less warpage at both ends.
  • the length l of the thickened layer 34 is equal to the length of the first backplane 31 .
  • the width n of the thickened layer 34 is smaller than or equal to the width N of the first region 3a.
  • the width of the first backplane 31 is 11 mm, and the width N of the first region 3a is 5.5 mm.
  • the width n of the thickened layer 34 is between 0 mm and 5.5 mm, the As the width n of the thickened layer 34 increases, the effect of the thickened layer 34 on the warpage at both ends of the first back plate 31 is better; when the width n of the thickened layer 34 is between 5.5 mm and 11 mm, with increasing As the width n of the thick layer 34 increases, the effect of the thick layer 34 on the warpage at both ends of the first back plate 31 is worse.
  • the thickened layer 34 has the best effect of suppressing warpage at both ends of the first backplane 31 .
  • the width n of the thickened layer 34 is greater than the width N of the first region 3 a and less than or equal to the width of the first backplane 31 .
  • the thickness of the thickened layer 34 decreases or does not change.
  • the thickness of the thickened layer 34 when the thickness of the thickened layer 34 is constant, the effect of suppressing the warpage of the first back plate 31 is better than that when the thickness of the thickened layer 34 is decreased. However, the thickness of the thickened layer 34 is decreased, which can save materials on the one hand, and save space for the installation of other devices on the other hand.
  • the thickness of the thickened layer 34 is unchanged in the direction from the center line Q of the first region 3 a to the direction away from the center line Q.
  • the thickness of the thickened layer 34 is less than 900 microns. Since the bending diameter of the bending portion 200 is about 900 microns, this setting ensures that the bending portion 200 can be bent to an optimal state, and the effect of suppressing the warpage of the first back plate 31 is the greatest. change.
  • FIG. 8 is a schematic top view of the display panel provided in the fourth embodiment of the present application in a flat state
  • FIG. 9 is a cross-sectional structural schematic diagram along line BB in FIG. 8
  • the display panel 4000 of the present fourth embodiment includes the display part 100 , the bending part 200 and the terminal part 300 .
  • the bent portion 200 is connected between the display portion 100 and the terminal portion 300 .
  • the terminal part 300 includes a first backplane 31 , a bonding substrate 32 , a circuit board 33 and a thickened layer 34 .
  • the binding substrate 32 is provided on the first backplane 31 .
  • the circuit board 33 is provided on the bonding substrate 32 .
  • the orthographic projection of the first backplane 31 on the plane where the binding substrate 32 is located is the first projection 31a
  • the orthographic projection of the circuit board 33 on the plane where the binding substrate 32 is located is the second projection 33a
  • the terminal part 300 includes a first area 3a, a second area 3b and a third area 3c.
  • the first area 3a is the overlapping area of the first projection 31a and the second projection 33a.
  • the second area 3b, the first area 3a and the third area 3c are connected in sequence.
  • the first direction x is parallel to the longitudinal direction of the first backplane 31 .
  • the second direction y is perpendicular to the first direction x.
  • the second area 3b is connected to the first area 3a and is disposed on one side of the first area 3a.
  • the third area 3c is connected to the first area 3a and is disposed on the other side of the first area 3a.
  • the thickened layer 34 includes a first portion 341 and a second portion 342 .
  • the first portion 341 is provided in the second region 3b.
  • the second portion 342 is provided in the third area 3c.
  • the first portion 341 extends from the junction of the first region 3a and the second region 3b to a side away from the first region 3a.
  • the second portion 342 extends from the junction of the first region 3a and the third region 3c to a side away from the first region 3a.
  • the difference between the display panel 4000 of the fourth embodiment and the display panel 1000 of the first embodiment is that the thickened layer 34 is disposed on the binding substrate 32 .
  • the first part 341 and the second part 342 are both disposed on the binding substrate 32 and connected to the edge of the circuit board 33 .
  • thickened layers 34 are disposed on the bonding substrate 32 corresponding to the second region 3b and the third region 3c to reduce the risk of wrinkles and warping at both ends of the first backplane 31 .
  • the structure of the display panel 4000 of the fourth embodiment is similar to or the same as that of the display panel 1000 of the first embodiment.
  • the display panel 5000 of the fifth embodiment includes a display part 100 , a bending part 200 and a terminal part 300 .
  • the bent portion 200 is connected between the display portion 100 and the terminal portion 300 .
  • the terminal part 300 includes a first backplane 31 , a bonding substrate 32 , a circuit board 33 and a thickened layer 34 .
  • the binding substrate 32 is provided on the first backplane 31 .
  • the circuit board 33 is provided on the bonding substrate 32 .
  • the thickened layer 34 is disposed on the side of the first backplane 31 away from the binding substrate 32 .
  • the orthographic projection of the first backplane 31 on the plane where the binding substrate 32 is located is the first projection 31a
  • the orthographic projection of the circuit board 33 on the plane where the binding substrate 32 is located is the second projection 33a
  • the terminal part 300 includes a first area 3a, a second area 3b and a third area 3c.
  • the first area 3a is the overlapping area of the first projection 31a and the second projection 33a.
  • the first direction x is parallel to the longitudinal direction of the first backplane 31 .
  • the thickened layer 34 includes a first portion 341 , a second portion 342 , a third portion 343 and a fourth portion 344 .
  • the first portion 341 is provided in the second region 3b.
  • the second portion 342 is provided in the third area 3c.
  • the third portion 343 is disposed in the first region 3 a, and the third portion 343 is connected to the first portion 341 .
  • the fourth portion 344 is disposed in the first region 3 a, and the fourth portion 344 is connected to the second portion 342 .
  • the third portion 343 and the fourth portion 344 are not connected.
  • the difference between the display panel 5000 of the fifth embodiment and the display panel 2000 of the second embodiment is that the thickened layer 34 is disposed on the binding substrate 32 .
  • first part 341 and the second part 342 are both disposed on the binding substrate 32
  • third part 343 and the fourth part 344 are disposed on the circuit board 33 .
  • the third part 343 and the fourth part 344 are disposed on the circuit board 33 to improve the effect of the thickened layer 34 on the warpage of the first backplane 31 at both ends.
  • the structure of the display panel 5000 of the fifth embodiment is similar to or the same as that of the display panel 2000 of the second embodiment.
  • the display panel 6000 of the sixth embodiment includes a display part 100 , a bending part 200 and a terminal part 300 .
  • the bent portion 200 is connected between the display portion 100 and the terminal portion 300 .
  • the terminal part 300 includes a first backplane 31 , a bonding substrate 32 , a circuit board 33 and a thickened layer 34 .
  • the binding substrate 32 is provided on the first backplane 31 .
  • the circuit board 33 is provided on the bonding substrate 32 .
  • the thickened layer 34 is disposed on the side of the first backplane 31 away from the binding substrate 32 .
  • the orthographic projection of the first backplane 31 on the plane where the binding substrate 32 is located is the first projection 31a
  • the orthographic projection of the circuit board 33 on the plane where the binding substrate 32 is located is the second projection 33a
  • the terminal part 300 includes a first area 3a, a second area 3b and a third area 3c.
  • the first area 3a is the overlapping area of the first projection 31a and the second projection 33a.
  • the first direction x is parallel to the longitudinal direction of the first backplane 31 .
  • the thickened layer 34 includes a first portion 341 , a second portion 342 and a third portion 343 .
  • the first portion 341 is provided in the second region 3b.
  • the second portion 342 is provided in the third area 3c.
  • the third portion 343 is provided in the first region 3a.
  • the third portion 343 is connected to the first portion 341 and the second portion 342, respectively.
  • the difference between the display panel 6000 of the sixth embodiment and the display panel 3000 of the third embodiment is that the first part 341 and the second part 342 are disposed on the binding substrate 32 .
  • the third portion 343 is provided on the circuit board 33 .
  • the third portion 343 is disposed on the circuit board 33 to improve the effect of the thickened layer 34 on the warpage of the two ends of the first backplane 31 .
  • the structure of the display panel 6000 of the sixth embodiment is similar to or the same as that of the display panel 3000 of the third embodiment.
  • the thickened layer is disposed at least in the second area and/or the third area, so as to reduce the risk of warping of the first backplane during the bending process.
  • a display panel provided by the embodiments of the present application has been introduced in detail above, and the principles and implementations of the present application are described with specific examples. Its core idea; at the same time, for those skilled in the art, according to the idea of the application, there will be changes in the specific implementation and application scope. In summary, the content of this specification should not be construed as a limitation to the application. .

Abstract

本申请公开了一种显示面板，加厚层包括第一部分；第一背板于绑定基板所在平面的正投影为第一投影，电路板于绑定基板所在平面的正投影为第二投影；端子部分包括一第一区域和第二区域，第一区域为第一投影和第二投影的重叠区域；第一部分设置在第二区域，且自第一区域和第二区域的交界处向远离第一区域的一侧延伸。

Description

显示面板 技术领域
本申请涉及显示技术领域，具体涉及一种显示面板。
 背景技术
有机发光二极管（OLED）显示屏模组工艺中，弯折端子区是达成窄边框目标的关键技术之一。
在对现有技术的研究和实践过程中，本申请的发明人发现，随着面板尺寸的增大，端子区尺寸也越来越大，在进行端子区弯折时端子区的背板容易出现褶皱和翘曲，导致无法完成端子区的弯折甚至出现金属线路断裂的情况。
 技术问题
本申请实施例提供一种显示面板，可以降低端子区在弯折时端子区的背板容易出现褶皱和翘曲的风险。
 技术解决方案
本申请实施例提供一种显示面板，其包括显示部分、弯折部分和端子部分，所述弯折部分连接在所述显示部分和所述端子部分之间，其中，所述端子部分包括：
第一背板；
绑定基板，所述绑定基板设置在所述第一背板上；
电路板，所述电路板设置在所述绑定基板上；以及
加厚层，所述加厚层包括第一部分；
其中，所述第一背板于所述绑定基板所在平面的正投影为第一投影，所述电路板于所述绑定基板所在平面的正投影为第二投影；
所述端子部分包括一第一区域和第二区域，所述第一区域为所述第一投影和所述第二投影的重叠区域；
在第一方向上，所述第二区域与所述第一区域相连且设置在所述第一区域的一侧；所述第一方向与所述第一背板的长边方向平行；
所述第一部分设置在所述第二区域，且自所述第一区域和所述第二区域的交界处向远离所述第一区域的一侧延伸。
在本申请的一些实施例中，所述端子部分包括第三区域；在所述第一方向上，所述第三区域与所述第一区域相连且设置在所述第一区域的另一侧；所述加厚层包括第二部分，所述第二部分设置在所述第三区域；
所述第二部分自所述第一区域和所述第三区域的交界处向远离所述第一区域的一侧延伸。
可选的，在本申请的一些实施例中，所述加厚层还包括第三部分，所述第三部分设置在所述第一区域，所述第三部分与所述第一部分相连。
可选的，在本申请的一些实施例中，所述加厚层还包括第四部分，所述第四部分设置在所述第一区域，所述第四部分与所述第二部分相连。
可选的，在本申请的一些实施例中，所述端子部分包括第三区域；在所述第一方向上，所述第三区域与所述第一区域相连且设置在所述第一区域的另一侧；所述加厚层包括第二部分，所述第二部分设置在所述第三区域；
所述第二部分自所述第一区域和所述第三区域的交界处向远离所述第一区域的一侧延伸；
所述第三部分与所述第二部分相连。
可选的，在本申请的一些实施例中，所述第一部分的长度小于或等于所述第二区域的长度。
可选的，在本申请的一些实施例中，所述第一部分的宽度小于或等于所述第一区域的宽度。
可选的，在本申请的一些实施例中，自所述第一区域和所述第二区域的交界处向远离所述第一区域的方向上，所述第一部分的厚度递减或不变。
可选的，在本申请的一些实施例中，所述加厚层的长度小于或等于所述第一背板的长度。
可选的，在本申请的一些实施例中，所述加厚层的宽度小于或等于所述第一区域的宽度。
可选的，在本申请的一些实施例中，在所述第一方向上，自所述第一区域的中心线向远离所述中心线的方向上，所述加厚层的厚度递减或不变。
可选的，在本申请的一些实施例中，所述加厚层设置在所述第一背板远离所述绑定基板的一面上。
可选的，在本申请的一些实施例中，所述加厚层与所述第一背板为一体成型结构。
可选的，在本申请的一些实施例中，所述加厚层设置在所述绑定基板上。
可选的，在本申请的一些实施例中，所述第一部分和所述第二部分设置在所述绑定基板上，所述第三部分设置在所述电路板上。
可选的，在本申请的一些实施例中，所述绑定基板包括：
第一基板，所述第一基板设置在所述第一背板上；
金属层，所述金属层设置在所述第一基板上，所述金属层包括连接端子；
绝缘层，所述绝缘层设置在所述金属层上且裸露出所述连接端子。
可选的，在本申请的一些实施例中，所述加厚层的宽度大于所述第一区域的宽度，且小于或等于所述第一背板的宽度。
可选的，在本申请的一些实施例中，所述第一部分的宽度大于所述第一区域的宽度，且小于或等于所述第一背板的宽度。
可选的，在本申请的一些实施例中，所述第二部分的宽度小于或等于所述第一区域的宽度。
可选的，在本申请的一些实施例中，所述第三部分的宽度小于或等于所述第一区域的宽度。
可选的，在本申请的一些实施例中，所述第四部分的宽度小于或等于所述第一区域的宽度。
 有益效果
本申请公开了一种显示面板，在显示面板中，端子部分包括第一背板、绑定基板、电路板和加厚层，绑定基板设置在第一背板上；电路板设置在绑定基板上；加厚层包括第一部分；第一背板于绑定基板所在平面的正投影为第一投影，电路板于绑定基板所在平面的正投影为第二投影；端子部分包括一第一区域和第二区域，第一区域由第一投影和第二投影重叠形成；在第一方向上，第二区域与第一区域相连且设置在第一区域的一侧；第一方向与第一背板的长边方向平行；第一部分设置在第二区域，且自第一区域和第二区域的交界处向远离第一区域的一侧延伸。本申请在端子部分的第二区域和/第三区域设置加厚层，以减低第一背板发生褶皱和翘曲的风险。
 附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请第一实施例提供的显示面板处于平展状态的俯视结构示意图；
图2是图1中沿AA线的剖视结构示意图；
图3是本申请第一实施例提供的显示面板处于弯折状态的剖视结构示意图；
图4是本申请第一实施例提供的显示面板处于平展状态的仰视结构示意图；
图5是本申请第二实施例提供的显示面板处于平展状态的仰视结构示意图；
图6是本申请第三实施例提供的显示面板处于平展状态的仰视结构示意图；
图7是本申请第三实施例提供的显示面板在弯折状态时加厚层的宽度与第一背板发生翘曲的高度的曲线图；
图8是本申请第四实施例提供的显示面板处于平展状态的俯视结构示意图；
图9是图8中沿BB线的剖视结构示意图；
图10是本申请第四实施例提供的显示面板处于弯折状态的剖视结构示意图；
图11是本申请第五实施例提供的显示面板处于平展状态的俯视结构示意图；
图12是本申请第六实施例提供的显示面板处于平展状态的俯视结构示意图。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。此外，应当理解的是，此处所描述的具体实施方式仅用于说明和解释本申请，并不用于限制本申请。在本申请中，在未作相反说明的情况下，使用的方位词如“上”和“下”通常是指装置实际使用或工作状态下的上和下，具体为附图中的图面方向；而“内”和“外”则是针对装置的轮廓而言的。
本申请实施例提供一种显示面板。下文进行详细说明。需说明的是，以下实施例的描述顺序不作为对实施例优选顺序的限定。
请参照图1至图3，图1是本申请第一实施例提供的显示面板处于平展状态的俯视结构示意图；图2是图1中沿AA线的剖视结构示意图；图3是本申请第一实施例提供的显示面板处于弯折状态的剖视结构示意图。
在本申请所提供的第一实施例的显示面板1000中，显示面板1000包括显示部分100、弯折部分200和端子部分300。弯折部分200连接在显示部分100和端子部分300之间。
端子部分300包括第一背板31、绑定基板32、电路板33和加厚层34。绑定基板32设置在第一背板31上。电路板33设置在绑定基板32上。加厚层34设置在第一背板31远离绑定基板32的一面上。
可选的，绑定基板32包括第一基板321、第一走线322、连接端子323和第一绝缘层324。第一基板321设置在第一背板31上。连接端子323连接于第一走线322。第一走线322和连接端子323同层设置，且设置在第一基板321上。第一绝缘层324覆盖在第一走线322上且裸露出连接端子323。
可选的，加厚层34与第一背板31为一体成型结构。也即，加厚层34的材料和所述第一背板31的材质一样。也就是说，在来料端的时候就可以制备成加厚的第一背板31，其中加厚的部分为加厚层34。
在一些实施例中，加厚层34的材料与第一背板31的材料不同。可选的，加厚层34的弹性模量大于第一背板31的弹性模量，以提高对第一背板31发生翘曲的抑制效果。
可选的，电路板33可以是印刷电路板或柔性电路板。电路板33电性连接于连接端子323。
弯折部分200包括依次设置的第二基板21、第二走线22和第二绝缘层23。
显示部分100包括依次设置的第二背板11、第三基板12和显示模组13。可选的，显示模组13可以是有机发光二极管显示模组、液晶显示模组、微型LED显示模组或Mini-LED显示模组中的一种。本第一实施例的显示面板1000以显示模组13是有机发光二极管显示模组为例进行说明，但不限于此。
可选的，第一基板321、第二基板21和第三基板12依次相连，且三者的材料可以一致也可以不一致。在本第一实施例的显示面板1000中，第一基板321、第二基板21和第三基板12一体成型。
第一走线322和第二走线22相连。第二走线22电性连接于显示模组13。第一走线322和第二走线22的材料相同，二者一体成型。可选的，在一些实施例中，第一走线322和第二走线22的材料也可以不同。
第一绝缘层324和第二绝缘层23相连。第一绝缘层324和第二绝缘层23的材料相同，二者一体成型。可选的，在一些实施例中，第一绝缘层324和第二绝缘层23的材料也可以不同。
在本第一实施例的显示面板1000中，请参照图1和图4，第一背板31于绑定基板32所在平面的正投影为第一投影31a，电路板33于绑定基板32所在平面的正投影为第二投影33a。
端子部分300包括一第一区域3a、第二区域3b和第三区域3c。第一区域3a为第一投影31a和第二投影33a的重叠区域。
在第一方向x上，第二区域3b、第一区域3a和第三区域3c依次相连。第一方向x与第一背板31的长边方向平行。另外，第二方向y垂直于第一方向x。
具体的，第二区域3b与第一区域3a相连且设置在第一区域3a的一侧。第三区域3c与第一区域3a相连且设置在第一区域3a的另一侧。
加厚层34包括第一部分341和第二部分342。第一部分341设置在第二区域3b。第二部分342设置在第三区域3c。
第一部分341自第一区域3a和第二区域3b的交界处向远离第一区域3a的一侧延伸。
第二部分342自第一区域3a和第三区域3c的交界处向远离第一区域3a的一侧延伸。
本第一实施例的显示面板1000采用在第一背板31对应于第二区域3b和第三区域3c设置加厚层34，以减低第一背板31的两端发生褶皱和翘曲的风险。
可选的，在本第一实施例的显示面板1000中，第一部分341的长度l1小于或等于第二区域3b的长度L1。其中在第一方向x上，第二区域3b从第一区域3a的边界延伸至第一背板31的边界。
第二部分342的长度l2小于或等于第三区域3c的长度L2。其中在第一方向x上，第三区域3c从第一区域3a的边界延伸至第一背板31的另一边界。
可以理解的是，第一部分341从第一区域3a和第二区域3b的交界处向远离第一区域3a的一侧延伸，其中第一部分341的长度l1越长，从端子部分300的中间传递出的抑制作用就可以到达到更远，则第一背板31对应于第二区域3b的部分的翘曲程度越小。
第二部分342从第一区域3a和第三区域3c的交界处向远离第一区域3a的一侧延伸，其中第二部分342的长度l2越长，从端子部分300的中间传递出的抑制作用就可以到达到更远，则第一背板31对应于第三区域3c的部分的翘曲程度越小。
因此，在本第一实施例的显示面板1000中，第一部分341的长度l1等于第二区域3b的长度L1。第二部分342的长度l2等于第三区域3c的长度l2。
在一些实施例中，第一部分341和第二部分342的长度不同。
可选的，第一部分341的宽度n1小于或等于第一区域3a的宽度N。第二部分342的宽度n2小于或等于第一区域3a的宽度N。
根据实验可知，只要第一部分341设置在第二区域3b，第二部分342设置在第三区域3c，便可改善第一背板31两端的翘曲程度。其中当第一部分341和第二部分342的宽度等于第一区域3a的宽度时，对改善第一背板31两端的翘曲程度的效果最好。
因此，在本第一实施例的显示面板1000中，第一部分341和第二部分342的宽度均等于第一区域3a的宽度。
在一些实施例中，第一部分341的宽度n1大于第一区域3a的宽度N，且小于或等于第一背板31的宽度。第二部分342的宽度n2大于第一区域3a的宽度N，且小于或等于第一背板31的宽度。
在一些实施例中，第一部分341和第二部分342的宽度不同。
可选的，自第一区域3a和第二区域3b的交界处向远离第一区域3a的方向上，第一部分341的厚度d递减或不变。
其中，第一部分341的厚度不变时其对第一背板31发生翘曲的抑制效果比第一部分341的厚度递减时的抑制效果更好。但是，第一部分341的厚度采用递减的方式，一方面可节省材料，另一方面可为其他器件的安装节省空间。
在本第一实施例的显示面板1000中，自第一区域3a和第二区域3b的交界处向远离第一区域3a的方向上，第一部分341的厚度不变。
可选的，自第一区域3a和第三区域3c的交界处向远离第一区域3a的方向上，第二部分342的厚度d递减或不变。
其中，第二部分342的厚度不变时其对第一背板31发生翘曲的抑制效果比第二部分342的厚度递减时的抑制效果更好。但是，第二部分342的厚度采用递减的方式，一方面可节省材料，另一方面可为其他器件的安装节省空间。
在本第一实施例的显示面板1000中，自第一区域3a和第二区域3b的交界处向远离第一区域3a的方向上，第一部分341的厚度不变。自第一区域3a和第三区域3c的交界处向远离第一区域3a的方向上，第二部分342的厚度不变。
可选的，加厚层34的厚度小于900微米。由于弯折部分200的弯折直径大概为900微米，因此这样的设置，以保障弯折部分200可以弯折至最佳状态。
请参照图5，本第二实施例的显示面板2000在第一实施例的显示面板1000的基础上，还增加了以下结构特征：
加厚层34还包括第三部分343和第四部分344。第三部分343设置在第一区域3a，第三部分343与第一部分341相连。第四部分344设置在第一区域3a，第四部分344与第二部分342相连。
其中第三部分343和第四部分344不相连。
本第二实施例的显示面板2000通过设置第三部分343和第四部分344，以提高加厚层34对第一背板31两端发生翘曲的抑制效果。
可选的，第三部分343和第四部分344的宽度n3、n4均等于第一区域3a的宽度N。
在一些实施例中，第三部分343的宽度n3大于第一区域3a的宽度N，且小于或等于第一背板31的宽度。第四部分344的宽度n4大于第一区域3a的宽度N，且小于或等于第一背板31的宽度。
在一些实施例中，第三部分343的宽度n3小于第一区域3a的宽度N。第四部分344的宽度n4小于第一区域3a的宽度N。
可选的，第三部分343和第四部分344的长度l3、l4均小于第一区域3a的长度。
可选的，第三部分343和第四部分344的厚度相等。在一些实施例中，第三部分343和第四部分344的厚度均小于第一部分341或第二部分342的厚度d，以节省空间。
可选的，第一部分341、第二部分342、第三部分343和第四部分344的材料相同。
请参照图6，本第三实施例的显示面板3000在第一实施例的显示面板1000的基础上，还增加了以下结构特征：
加厚层34还包括第三部分343。第三部分343设置在第一区域3a。第三部分343分别与第一部分341和第二部分342相连。
本第三实施例的显示面板3000通过设置第三部分343，以提高加厚层34对第一背板31两端发生翘曲的抑制效果。
可选的，加厚层34的长度l小于或等于第一背板31的长度L。
其中加厚层34包括第三部分343，且第一部分341和第二部分342的延伸越长，从端子部分300的中间传递出的抑制作用就可以到达到更远，则第一背板31的两端的翘曲程度越小。
因此，在本第三实施例的显示面板3000中，加厚层34的长度l等于第一背板31的长度。
可选的，加厚层34的宽度n小于或等于第一区域3a的宽度N。
在第三实施例的显示面板3000中，第一背板31的宽度为11毫米，第一区域3a的宽度N为5.5毫米。请参照图7，根据实验可知，在显示面板3000发生弯折且在加厚层34的长度l不变的情况下，当加厚层34的宽度n介于0毫米至5.5毫米时，随着加厚层34的宽度n的增加，加厚层34对第一背板31两端翘曲的抑制效果越好；当加厚层34的宽度n介于5.5毫米至11毫米时，随着加厚层34的宽度n的增加，加厚层34对第一背板31两端翘曲的抑制效果越差。
因此当加厚层34的宽度n等于5.5毫米时，即加厚层34的宽度等于第一区域3a的宽度N，加厚层34对第一背板31两端翘曲的抑制效果最好。
在一些实施例中，加厚层34的宽度n大于第一区域3a的宽度N，且小于或等于第一背板31的宽度。
可选的，在第一方向x，自第一区域3a的中心线Q向远离中心线Q的方向上，加厚层34的厚度递减或不变。
其中，加厚层34的厚度不变时其对第一背板31发生翘曲的抑制效果比加厚层34的厚度递减时的抑制效果更好。但是，加厚层34的厚度采用递减的方式，一方面可节省材料，另一方面可为其他器件的安装节省空间。
在本第三实施例的显示面板3000中，自第一区域3a的中心线Q向远离中心线Q的方向上，加厚层34的厚度不变。
可选的，加厚层34的厚度小于900微米。由于弯折部分200的弯折直径介于900微米左右，因此这样的设置，以保障弯折部分200可以弯折至最佳状态的情况下，对第一背板31发生翘曲的抑制效果最大化。
请参照图8至图10，图8是本申请第四实施例提供的显示面板处于平展状态的俯视结构示意图；图9是图8中沿BB线的剖视结构示意图；图10是本申请第四实施例提供的显示面板处于弯折状态的剖视结构示意图。
在本第四实施例的显示面板4000中，显示面板4000包括显示部分100、弯折部分200和端子部分300。弯折部分200连接在显示部分100和端子部分300之间。
端子部分300包括第一背板31、绑定基板32、电路板33和加厚层34。绑定基板32设置在第一背板31上。电路板33设置在绑定基板32上。
第一背板31于绑定基板32所在平面的正投影为第一投影31a，电路板33于绑定基板32所在平面的正投影为第二投影33a。
端子部分300包括一第一区域3a、第二区域3b和第三区域3c。第一区域3a为第一投影31a和第二投影33a的重叠区域。
在第一方向x上，第二区域3b、第一区域3a和第三区域3c依次相连。第一方向x与第一背板31的长边方向平行。另外，第二方向y垂直于第一方向x。
具体的，第二区域3b与第一区域3a相连且设置在第一区域3a的一侧。第三区域3c与第一区域3a相连且设置在第一区域3a的另一侧。
加厚层34包括第一部分341和第二部分342。第一部分341设置在第二区域3b。第二部分342设置在第三区域3c。
第一部分341自第一区域3a和第二区域3b的交界处向远离第一区域3a的一侧延伸。第二部分342自第一区域3a和第三区域3c的交界处向远离第一区域3a的一侧延伸。
其中，本第四实施例的显示面板4000与第一实施例的显示面板1000的不同之处在于：加厚层34设置在绑定基板32上。
具体的，第一部分341和第二部分342均设置在绑定基板32上，且与电路板33的边缘相连。
本第四实施例的显示面板4000采用在绑定基板32对应于第二区域3b和第三区域3c设置加厚层34，以减低第一背板31的两端发生褶皱和翘曲的风险。
本第四实施例的显示面板4000的结构与第一实施例的显示面板1000的结构相似或相同，具体可参照第一实施例的显示面板1000的内容，此处不再赘述。
请参照图11，在本第五实施例的显示面板5000中，第五实施例的显示面板5000包括显示部分100、弯折部分200和端子部分300。弯折部分200连接在显示部分100和端子部分300之间。
端子部分300包括第一背板31、绑定基板32、电路板33和加厚层34。绑定基板32设置在第一背板31上。电路板33设置在绑定基板32上。加厚层34设置在第一背板31远离绑定基板32的一面上。
第一背板31于绑定基板32所在平面的正投影为第一投影31a，电路板33于绑定基板32所在平面的正投影为第二投影33a。
端子部分300包括一第一区域3a、第二区域3b和第三区域3c。第一区域3a为第一投影31a和第二投影33a的重叠区域。
在第一方向x上，第二区域3b、第一区域3a和第三区域3c依次相连。第一方向x与第一背板31的长边方向平行。
加厚层34包括第一部分341、第二部分342、第三部分343和第四部分344。第一部分341设置在第二区域3b。第二部分342设置在第三区域3c。第三部分343设置在第一区域3a，第三部分343与第一部分341相连。第四部分344设置在第一区域3a，第四部分344与第二部分342相连。第三部分343和第四部分344不相连。
其中，本第五实施例的显示面板5000与第二实施例的显示面板2000的不同之处在于：加厚层34设置在绑定基板32上。
具体的，第一部分341和第二部分342均设置在绑定基板32上，第三部分343和第四部分344设置在电路板33上。
本第五实施例的显示面板5000通过将第三部分343和第四部分344设置在电路板33上，以提高加厚层34对第一背板31两端发生翘曲的抑制效果。
本第五实施例的显示面板5000的结构与第二实施例的显示面板2000的结构相似或相同，具体可参照第二实施例的显示面板2000的内容，此处不再赘述。
请参照图12，在本第六实施例的显示面板6000中，第六实施例的显示面板6000包括显示部分100、弯折部分200和端子部分300。弯折部分200连接在显示部分100和端子部分300之间。
端子部分300包括第一背板31、绑定基板32、电路板33和加厚层34。绑定基板32设置在第一背板31上。电路板33设置在绑定基板32上。加厚层34设置在第一背板31远离绑定基板32的一面上。
第一背板31于绑定基板32所在平面的正投影为第一投影31a，电路板33于绑定基板32所在平面的正投影为第二投影33a。
端子部分300包括一第一区域3a、第二区域3b和第三区域3c。第一区域3a为第一投影31a和第二投影33a的重叠区域。
在第一方向x上，第二区域3b、第一区域3a和第三区域3c依次相连。第一方向x与第一背板31的长边方向平行。
加厚层34包括第一部分341、第二部分342和第三部分343。第一部分341设置在第二区域3b。第二部分342设置在第三区域3c。第三部分343设置在第一区域3a。第三部分343分别与第一部分341和第二部分342相连。
其中，本第六实施例的显示面板6000与第三实施例的显示面板3000的不同之处在于：第一部分341和第二部分342设置在绑定基板32上。第三部分343设置在电路板33上。
本第六实施例的显示面板6000通过将第三部分343设置在电路板33上，以提高加厚层34对第一背板31两端发生翘曲的抑制效果。
本第六实施例的显示面板6000的结构与第三实施例的显示面板3000的结构相似或相同，具体可参照第三实施例的显示面板3000的内容，此处不再赘述。
在本申请实施例提供的显示面板中，将加厚层至少设置在第二区域和/或第三区域，以降低在弯折的过程中第一背板发生翘曲的风险。
以上对本申请实施例所提供的一种显示面板进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的方法及其核心思想；同时，对于本领域的技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本申请的限制。

Claims (20)

  1. 一种显示面板，其包括显示部分、弯折部分和端子部分，所述弯折部分连接在所述显示部分和所述端子部分之间，其中，所述端子部分包括：
    第一背板；
    绑定基板，所述绑定基板设置在所述第一背板上；
    电路板，所述电路板设置在所述绑定基板上；以及
    加厚层，所述加厚层包括第一部分；
    其中，所述第一背板于所述绑定基板所在平面的正投影为第一投影，所述电路板于所述绑定基板所在平面的正投影为第二投影；
    所述端子部分包括一第一区域和第二区域，所述第一区域为所述第一投影和所述第二投影的重叠区域；
    在第一方向上，所述第二区域与所述第一区域相连且设置在所述第一区域的一侧；所述第一方向与所述第一背板的长边方向平行；
    所述第一部分设置在所述第二区域，且自所述第一区域和所述第二区域的交界处向远离所述第一区域的一侧延伸。
  2. 根据权利要求1所述的显示面板，其中，所述端子部分包括第三区域；在所述第一方向上，所述第三区域与所述第一区域相连且设置在所述第一区域的另一侧；所述加厚层包括第二部分，所述第二部分设置在所述第三区域；
    所述第二部分自所述第一区域和所述第三区域的交界处向远离所述第一区域的一侧延伸。
  3. 根据权利要求1所述的显示面板，其中，所述加厚层还包括第三部分，所述第三部分设置在所述第一区域，所述第三部分与所述第一部分相连。
  4. 根据权利要求2所述的显示面板，其中，所述加厚层还包括第四部分，所述第四部分设置在所述第一区域，所述第四部分与所述第二部分相连。
  5. 根据权利要求3所述的显示面板，其中，所述端子部分包括第三区域；在所述第一方向上，所述第三区域与所述第一区域相连且设置在所述第一区域的另一侧；所述加厚层包括第二部分，所述第二部分设置在所述第三区域；
    所述第二部分自所述第一区域和所述第三区域的交界处向远离所述第一区域的一侧延伸；
    所述第三部分与所述第二部分相连。
  6. 根据权利要求1所述的显示面板，其中，所述第一部分的长度小于或等于所述第二区域的长度。
  7. 根据权利要求1所述显示面板，其中，所述第一部分的宽度小于或等于所述第一区域的宽度。
  8. 根据权利要求1所述显示面板，其中，自所述第一区域和所述第二区域的交界处向远离所述第一区域的方向上，所述第一部分的厚度递减或不变。
  9. 根据权利要求5所述显示面板，其中，所述加厚层的长度小于或等于所述第一背板的长度。
  10. 根据权利要求5所述显示面板，其中，所述加厚层的宽度小于或等于所述第一区域的宽度。
  11. 根据权利要求5所述显示面板，其中，在所述第一方向上，自所述第一区域的中心线向远离所述中心线的方向上，所述加厚层的厚度递减或不变。
  12. 根据权利要求1所述的显示面板，其中，所述加厚层设置在所述第一背板远离所述绑定基板的一面上。
  13. 根据权利要求12所述的显示面板，其中，所述加厚层与所述第一背板为一体成型结构。
  14. 根据权利要求1所述显示面板，其中，所述加厚层设置在所述绑定基板上。
  15. 根据权利要求5所述显示面板，其中，所述第一部分和所述第二部分设置在所述绑定基板上，所述第三部分设置在所述电路板上。
  16. 根据权利要求5所述显示面板，其中，所述加厚层的宽度大于所述第一区域的宽度，且小于或等于所述第一背板的宽度。
  17. 根据权利要求1所述的显示面板，其中，所述第一部分的宽度大于所述第一区域的宽度，且小于或等于所述第一背板的宽度。
  18. 根据权利要求2所述的显示面板，其中，所述第二部分的宽度小于或等于所述第一区域的宽度。
  19. 根据权利要求3所述的显示面板，其中，所述第三部分的宽度小于或等于所述第一区域的宽度。
  20. 根据权利要求4所述的显示面板，其中，所述第四部分的宽度小于或等于所述第一区域的宽度。
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