WO2022191127A1 - Photosensitive film, photosensitive element, and laminate production method - Google Patents
Photosensitive film, photosensitive element, and laminate production method Download PDFInfo
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- WO2022191127A1 WO2022191127A1 PCT/JP2022/009699 JP2022009699W WO2022191127A1 WO 2022191127 A1 WO2022191127 A1 WO 2022191127A1 JP 2022009699 W JP2022009699 W JP 2022009699W WO 2022191127 A1 WO2022191127 A1 WO 2022191127A1
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- YUENFNPLGJCNRB-UHFFFAOYSA-N anthracen-1-amine Chemical compound C1=CC=C2C=C3C(N)=CC=CC3=CC2=C1 YUENFNPLGJCNRB-UHFFFAOYSA-N 0.000 description 1
- YCSBALJAGZKWFF-UHFFFAOYSA-N anthracen-2-amine Chemical compound C1=CC=CC2=CC3=CC(N)=CC=C3C=C21 YCSBALJAGZKWFF-UHFFFAOYSA-N 0.000 description 1
- BKNBVEKCHVXGPH-UHFFFAOYSA-N anthracene-1,4,9,10-tetrol Chemical compound C1=CC=C2C(O)=C3C(O)=CC=C(O)C3=C(O)C2=C1 BKNBVEKCHVXGPH-UHFFFAOYSA-N 0.000 description 1
- YMNKUHIVVMFOFO-UHFFFAOYSA-N anthracene-9-carbaldehyde Chemical compound C1=CC=C2C(C=O)=C(C=CC=C3)C3=CC2=C1 YMNKUHIVVMFOFO-UHFFFAOYSA-N 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
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- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- AOJOEFVRHOZDFN-UHFFFAOYSA-N benzyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1=CC=CC=C1 AOJOEFVRHOZDFN-UHFFFAOYSA-N 0.000 description 1
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- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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- 238000006243 chemical reaction Methods 0.000 description 1
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- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
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- 125000004122 cyclic group Chemical group 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
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- XLYMOEINVGRTEX-UHFFFAOYSA-N fumaric acid monoethyl ester Natural products CCOC(=O)C=CC(O)=O XLYMOEINVGRTEX-UHFFFAOYSA-N 0.000 description 1
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- 230000014509 gene expression Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
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- 125000004029 hydroxymethyl group Chemical group [H]OC([H])([H])* 0.000 description 1
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- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- NKHAVTQWNUWKEO-IHWYPQMZSA-N methyl hydrogen fumarate Chemical compound COC(=O)\C=C/C(O)=O NKHAVTQWNUWKEO-IHWYPQMZSA-N 0.000 description 1
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- WBYWAXJHAXSJNI-UHFFFAOYSA-N methyl p-hydroxycinnamate Natural products OC(=O)C=CC1=CC=CC=C1 WBYWAXJHAXSJNI-UHFFFAOYSA-N 0.000 description 1
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- 239000012046 mixed solvent Substances 0.000 description 1
- OMNKZBIFPJNNIO-UHFFFAOYSA-N n-(2-methyl-4-oxopentan-2-yl)prop-2-enamide Chemical compound CC(=O)CC(C)(C)NC(=O)C=C OMNKZBIFPJNNIO-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000003136 n-heptyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
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- 150000002790 naphthalenes Chemical class 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002971 oxazolyl group Chemical group 0.000 description 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical group C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 1
- 125000003566 oxetanyl group Chemical group 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- KJFMBFZCATUALV-UHFFFAOYSA-N phenolphthalein Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C(=O)O1 KJFMBFZCATUALV-UHFFFAOYSA-N 0.000 description 1
- 235000021317 phosphate Nutrition 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 230000002165 photosensitisation Effects 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Substances [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 1
- 235000011181 potassium carbonates Nutrition 0.000 description 1
- 229910000160 potassium phosphate Inorganic materials 0.000 description 1
- 235000011009 potassium phosphates Nutrition 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- UORVCLMRJXCDCP-UHFFFAOYSA-N propynoic acid Chemical compound OC(=O)C#C UORVCLMRJXCDCP-UHFFFAOYSA-N 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- DNXIASIHZYFFRO-UHFFFAOYSA-N pyrazoline Chemical class C1CN=NC1 DNXIASIHZYFFRO-UHFFFAOYSA-N 0.000 description 1
- 150000004053 quinones Chemical class 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 238000005201 scrubbing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 235000011182 sodium carbonates Nutrition 0.000 description 1
- FQENQNTWSFEDLI-UHFFFAOYSA-J sodium diphosphate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)OP([O-])([O-])=O FQENQNTWSFEDLI-UHFFFAOYSA-J 0.000 description 1
- 235000019795 sodium metasilicate Nutrition 0.000 description 1
- 239000001488 sodium phosphate Substances 0.000 description 1
- 229910000162 sodium phosphate Inorganic materials 0.000 description 1
- 229940048086 sodium pyrophosphate Drugs 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 239000004328 sodium tetraborate Substances 0.000 description 1
- 235000010339 sodium tetraborate Nutrition 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229940124530 sulfonamide Drugs 0.000 description 1
- 150000003456 sulfonamides Chemical class 0.000 description 1
- 125000000542 sulfonic acid group Chemical group 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 description 1
- 235000019818 tetrasodium diphosphate Nutrition 0.000 description 1
- 239000001577 tetrasodium phosphonato phosphate Substances 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- LMYRWZFENFIFIT-UHFFFAOYSA-N toluene-4-sulfonamide Chemical compound CC1=CC=C(S(N)(=O)=O)C=C1 LMYRWZFENFIFIT-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- 238000000870 ultraviolet spectroscopy Methods 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
Definitions
- the present disclosure relates to a photosensitive film, a photosensitive element, a laminate manufacturing method, and the like.
- a resist pattern is formed to obtain desired wiring.
- a resist pattern can be formed by exposing and developing a photosensitive resin layer obtained using a photosensitive resin composition.
- Various compositions have been studied as the photosensitive resin composition.
- Patent Document 1 describes a photosensitive resin composition containing a binder polymer, a photopolymerizable compound, and a specific photopolymerization initiator.
- a photosensitive film can be obtained by molding the photosensitive resin composition into a film.
- a cured product pattern When forming a cured product pattern that can be used as a resist pattern using a photosensitive film or a photosensitive resin composition, it has linear line portions and linear space portions adjacent to the line portions. A cured product pattern may be formed. Then, when forming a cured product pattern in which the width of the space portion (space width) is smaller than the width of the line portion (line width), excellent resolution is a characteristic that the line portion and the space portion are formed well. Desired. Further, when forming a cured product pattern having a line width smaller than the space width, excellent adhesion is required as a characteristic for forming the line portions and the space portions satisfactorily.
- One aspect of the present disclosure is excellent resolution when forming a cured product pattern with a smaller space width than the line width, and excellent adhesion when forming a cured product pattern with a smaller line width than the space width. It is an object of the present invention to provide a photosensitive film capable of obtaining properties. Another aspect of the present disclosure aims to provide a photosensitive element using the photosensitive film. Another aspect of the present disclosure aims to provide a method for producing a laminate using the photosensitive film described above.
- One aspect of the present disclosure is a group consisting of (A) a binder polymer, (B) a photopolymerizable compound, (C) a photoinitiator, and (D) an anthracene compound, a pyrazoline compound, and a distyrylbenzene compound. and (E) a naphthalene compound.
- Another aspect of the present disclosure relates to a photosensitive element comprising a support and a photosensitive resin layer disposed on the support, wherein the photosensitive resin layer is the photosensitive film described above.
- Another aspect of the present disclosure includes a step of disposing a photosensitive resin layer on a substrate using the photosensitive film described above, a step of photocuring a part of the photosensitive resin layer, and a step of photocuring the photosensitive resin. a step of removing at least part of an uncured portion of the layer to form a cured product pattern;
- the present invention relates to a method for manufacturing a laminate.
- FIG. 1 is a schematic cross-sectional view showing an example of a photosensitive element
- FIG. It is a schematic diagram which shows an example of the manufacturing method of a laminated body.
- a numerical range indicated using “-” indicates a range that includes the numerical values before and after "-" as the minimum and maximum values, respectively.
- “A or more” in a numerical range means A and a range exceeding A.
- “A or less” in a numerical range means A and a range less than A.
- the upper limit value or lower limit value of the numerical range in one step can be arbitrarily combined with the upper limit value or lower limit of the numerical range in another step.
- the upper or lower limits of the numerical ranges may be replaced with the values shown in the examples.
- “A or B” may include either A or B, or may include both.
- each component in the composition means the total amount of the plurality of substances present in the composition unless otherwise specified when there are multiple substances corresponding to each component in the composition.
- the term “layer” includes not only a shape structure formed over the entire surface but also a shape structure formed partially when observed as a plan view.
- the term “process” is included in the term not only as an independent process, but also as long as the intended action of the process is achieved even if it is not clearly distinguishable from other processes.
- (Meth)acrylate means at least one of acrylate and its corresponding methacrylate. The same applies to other similar expressions such as "(meth)acrylic acid”.
- An “alkyl group” may be linear, branched or cyclic, unless otherwise specified.
- the solid content of the photosensitive resin composition refers to the non-volatile content excluding volatile substances (water, solvent, etc.) in the photosensitive resin composition. That is, the solid content refers to the components (components other than the solvent) that remain without volatilizing when the photosensitive resin composition dries, and includes components that are liquid, starch syrup-like, or wax-like at room temperature (25°C).
- the photosensitive film and photosensitive resin composition according to the present embodiment include (A) a binder polymer, (B) a photopolymerizable compound, (C) a photopolymerization initiator, (D) an anthracene compound, a pyrazoline compound, and at least one selected from the group consisting of distyrylbenzene compounds, and (E) a naphthalene compound.
- the photosensitive film according to this embodiment can be obtained by molding the photosensitive resin composition according to this embodiment into a film.
- the photosensitive film and the photosensitive resin composition according to the present embodiment excellent resolution when forming a cured product pattern having a space width smaller than the line width, and a line width smaller than the space width Excellent adhesion can be obtained when forming a cured product pattern.
- the photosensitive film and the photosensitive resin composition according to the present embodiment in the evaluation described in the Examples, for example, it is possible to obtain a resolution of 13 ⁇ m or less and an adhesion of 3 ⁇ m or less. can.
- the shape of the cured product pattern that can be obtained from the photosensitive film and the photosensitive resin composition according to this embodiment is not particularly limited.
- the present inventors presume as follows about the factors by which the photosensitive film and the photosensitive resin composition according to the present embodiment provide excellent resolution and adhesion.
- the factors are not limited to the following contents. That is, by using component (D) when component (A), component (B) and component (C) are used in combination, component (D) satisfactorily absorbs light and supplies a sufficient amount of energy to component (C). Therefore, good photosensitivity can be expressed (for example, good photosensitivity can be expressed by generating a sufficient amount of radicals in the exposed area and suppressing the diffusion of radicals to the unexposed area. ).
- good photosensitivity can be expressed by generating a sufficient amount of radicals in the exposed area and suppressing the diffusion of radicals to the unexposed area.
- the (E) component such action of the (D) component can be enhanced. Therefore, excellent resolution and adhesion can be obtained.
- the photosensitive film and the photosensitive resin composition according to this embodiment excellent sensitivity to actinic rays can also be obtained.
- an exposure dose of, for example, 108 mJ/cm 2 or less can be obtained in the evaluations described in the Examples.
- the thickness of the photosensitive film and the cured product according to the present embodiment is 1 ⁇ m or more, 3 ⁇ m or more, 5 ⁇ m or more, 7 ⁇ m or more, 10 ⁇ m or more, 15 ⁇ m or more, from the viewpoint of easily obtaining a resist pattern for obtaining wiring with a sufficient thickness. Above, it may be 18 ⁇ m or more, or 19 ⁇ m or more.
- the thickness of the photosensitive film and the cured product according to the present embodiment is 100 ⁇ m or less, 50 ⁇ m or less, 40 ⁇ m or less, 30 ⁇ m or less, 25 ⁇ m or less, 20 ⁇ m or less, or, from the viewpoint of easily obtaining excellent resolution and adhesion. It may be 19 ⁇ m or less. From these viewpoints, the thickness of the photosensitive film and the cured product according to this embodiment may be 1 to 100 ⁇ m, 5 to 100 ⁇ m, or 15 to 25 ⁇ m.
- the wavelength at which photosensitivity is exhibited in the photosensitive film and photosensitive resin composition according to the present embodiment is not particularly limited.
- the photosensitive film and the photosensitive resin composition according to the present embodiment are, for example, light having a wavelength of 300 nm or more, 340 nm or more, 350 nm or more, 355 nm or more, 365 nm or more, 375 nm or more, 390 nm or more, 395 nm or more, or 405 nm or more.
- the photosensitive film and photosensitive resin composition according to the present embodiment have photosensitivity to light having a wavelength of, for example, 500 nm or less, 440 nm or less, less than 440 nm, 436 nm or less, 420 nm or less, 410 nm or less, or 405 nm or less. you can Actinic rays having peaks within these wavelength ranges can be used in the exposure step described later.
- the photosensitive film and photosensitive resin composition according to the present embodiment can be used, for example, as a negative photosensitive film and photosensitive resin composition.
- the absorbance for light with a wavelength of 405 nm in the photosensitive film and the photosensitive resin composition according to the present embodiment may be within the following range.
- the absorbance for light with a wavelength of 405 nm may exceed 0, 0.01 or more, 0.05 or more, 0.1 or more, 0.15 or more, 0.2 or more, 0.25 or more, 0.27 or more, or , 0.3 or more.
- the absorbance for light with a wavelength of 405 nm may be 0.5 or less, 0.45 or less, 0.4 or less, 0.35 or less, 0.3 or less, or 0.27 or less. From these points of view, the absorbance for light with a wavelength of 405 nm may be greater than 0 and 0.5 or less.
- application of the photosensitive resin composition, photosensitive film, or photosensitive element to the formation of a cured product pattern can be provided.
- application of the photosensitive resin composition, photosensitive film, or photosensitive element to the production of wiring boards can be provided.
- the photosensitive film and photosensitive resin composition according to this embodiment contain a binder polymer as the (A) component.
- Component (A) includes acrylic resins, styrene resins, epoxy resins, amide resins, amide epoxy resins, alkyd resins, phenol resins, and the like.
- Acrylic resins are resins having a compound ((meth)acrylic acid compound) having a (meth)acryloyl group as a monomer unit, and styrene resins, epoxy resins, and amide resins having the monomer units.
- amidoepoxy resins, alkyd resins and phenolic resins belong to acrylic resins.
- the component (A) may contain a binder polymer having no phenolic hydroxyl group, or may not contain a binder polymer having a phenolic hydroxyl group.
- the component (A) may contain a binder polymer that does not have an epoxy group, or may not contain a binder polymer that has an epoxy group.
- the (A) component may contain an acrylic resin from the viewpoint of easily obtaining excellent resolution and adhesion.
- the content of the acrylic resin is 50% by mass or more, more than 50% by mass, 70% by mass or more, and 90% by mass, based on the total mass of component (A). % or more, 95% by mass or more, 98% by mass or more, 99% by mass or more, or substantially 100% by mass (an aspect in which component (A) is substantially composed of an acrylic resin).
- Examples of compounds having a (meth)acryloyl group include (meth)acrylic acid and (meth)acrylic acid esters.
- (Meth)acrylates include alkyl (meth)acrylates (alkyl (meth)acrylates; excluding compounds corresponding to cycloalkyl (meth)acrylates), cycloalkyl (meth)acrylates ((meth) cycloalkyl acrylate), aryl (meth)acrylate (aryl (meth)acrylate), (meth)acrylamide compounds (diacetone acrylamide, etc.), glycidyl (meth)acrylate, styryl (meth)acrylic acid, etc. is mentioned.
- the (A) component may have (meth)acrylic acid as a monomer unit from the viewpoint of easily obtaining excellent resolution and adhesion.
- the content of the monomer unit of (meth) acrylic acid is, from the viewpoint of easily obtaining excellent resolution and adhesion,
- It may be in the following ranges based on the total amount of the monomer units constituting the component.
- the content of (meth)acrylic acid monomer units may be 1% by mass or more, 5% by mass or more, 10% by mass or more, 15% by mass or more, 20% by mass or more, or 25% by mass or more. .
- the content of the monomer units of (meth)acrylic acid may be 50% by mass or less, less than 50% by mass, 45% by mass or less, 40% by mass or less, 35% by mass or less, or 30% by mass or less. . From these points of view, the content of the (meth)acrylic acid monomer unit may be 1 to 50% by mass.
- the (A) component may have an alkyl (meth)acrylate as a monomer unit from the viewpoint of easily obtaining excellent resolution and adhesion.
- alkyl group of alkyl (meth)acrylate include methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, heptyl group, octyl group, nonyl group, decyl group, undecyl group and dodecyl group. and the alkyl groups may be of various structural isomers.
- the number of carbon atoms in the alkyl group of the alkyl (meth)acrylate may be 1 to 4, 1 to 3, 2 to 3, or 1 to 2 from the viewpoint of easily obtaining excellent resolution and adhesion.
- the alkyl group of the alkyl (meth)acrylate may have a substituent.
- Substituents include a hydroxy group, a carboxy group, a carboxylic acid group, an aldehyde group, an alkoxy group (unsubstituted alkoxy group (structure having an unsubstituted alkyl group bonded to an oxygen atom), or a substituted alkoxy group (hydroxyalkoxy group, etc.)), carbonyl group, alkoxycarbonyl group, alkanoyl group (alkanoyl group having 2 to 12 carbon atoms, etc.), oxycarbonyl group, carbonyloxy group, amino group, epoxy group, furyl group, cyano group, halogeno group (fluoro group, chloro group, bromo group, etc.), nitro group, acetyl group, sulfonyl group, sulfonamide group and the like.
- alkyl (meth)acrylates examples include dimethylaminoethyl (meth)acrylate, diethylaminoethyl (meth)acrylate, 2,2,2-trifluoroethyl (meth)acrylate, 2,2-(meth)acrylate, 3,3-tetrafluoropropyl, ⁇ -chloro(meth)acrylic acid, ⁇ -bromo(meth)acrylic acid and the like.
- the (A) component may have hydroxyalkyl (meth)acrylate as a monomer unit from the viewpoint of easily obtaining excellent resolution and adhesion.
- Hydroxyalkyl (meth)acrylates include hydroxymethyl (meth)acrylate, hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, hydroxybutyl (meth)acrylate, hydroxypentyl (meth)acrylate, Hydroxyhexyl (meth)acrylate and the like can be mentioned.
- the content of the monomer unit of hydroxyalkyl (meth)acrylate in the case of having it as a monomer unit is the monomer unit constituting component (A) from the viewpoint of easily obtaining excellent resolution and adhesion. It may be in the following range based on the total amount of.
- the content of the monomer units described above may be 0.1% by mass or more, 0.5% by mass or more, 1% by mass or more, 2% by mass or more, or 3% by mass or more.
- the content of the above monomer units may be 20% by mass or less, 15% by mass or less, 10% by mass or less, 8% by mass or less, 5% by mass or less, or 3% by mass or less. From these points of view, the content of the above monomer units may be 0.1 to 20% by mass.
- the (A) component may have an aryl (meth)acrylate as a monomer unit from the viewpoint of easily obtaining excellent resolution and adhesion.
- Aryl (meth)acrylates include benzyl (meth)acrylate, phenyl (meth)acrylate, and naphthyl (meth)acrylate.
- the content of the monomer unit of the aryl (meth)acrylate is Based on the total amount of the monomer units constituting component (A), the following ranges may be used.
- the content of the monomer units of the aryl (meth)acrylate may be 1% by mass or more, 5% by mass or more, 10% by mass or more, 15% by mass or more, or 20% by mass or more.
- the content of the monomer unit of the aryl (meth)acrylate is 50% by mass or less, less than 50% by mass, 45% by mass or less, 40% by mass or less, 35% by mass or less, 30% by mass or less, and 25% by mass or less. , or 20% by mass or less. From these viewpoints, the content of the monomer units of the aryl (meth)acrylate may be 1 to 50% by mass.
- the (A) component may have a styrene compound (excluding compounds having a (meth)acryloyl group) as a monomer unit from the viewpoint of easily obtaining excellent resolution and adhesion.
- Styrene compounds include styrene and styrene derivatives. Examples of styrene derivatives include vinyltoluene and ⁇ -methylstyrene.
- Component (A) may have (meth)acrylic acid and a styrene compound as monomer units from the viewpoint of easily obtaining excellent resolution and adhesion. It may have as a monomer unit, and may have an aryl (meth)acrylate and a styrene compound as a monomer unit.
- the content of the monomer unit of the styrene compound should be It may be in the following ranges based on the total amount of the mer units.
- the content of the monomer unit of the styrene compound is 10% by mass or more, 10% by mass or more, 15% by mass or more, 15% by mass or more, 20% by mass or more, 20% by mass or more, 25% by mass or more, and 25% by mass. more than 30% by mass, more than 30% by mass, more than 35% by mass, more than 35% by mass, more than 40% by mass, more than 40% by mass, more than 45% by mass, more than 45% by mass, more than 47% by mass, or 50 % by mass or more.
- the content of the monomer unit of the styrene compound is 90% by mass or less, 85% by mass or less, 80% by mass or less, 75% by mass or less, 70% by mass or less, 65% by mass or less, 60% by mass or less, and 55% by mass. or less, or 50% by mass or less. From these points of view, the content of monomer units in the styrene compound may be 10 to 90% by mass.
- the content of the monomer unit of the styrene compound should be It may be in the following ranges based on the total amount of the mer units.
- the content of the monomer unit of the styrene compound is 10 mol% or more, 10 mol% or more, 15 mol% or more, 20 mol% or more, 20 mol% or more, 25 mol% or more, 30 mol% or more, 30 mol% or more, 35 mol% or more, 40 mol%. Above, it may be more than 40 mol %, 45 mol % or more, 50 mol % or more, or more than 50 mol %.
- the monomer unit content of the styrene compound may be 90 mol% or less, 85 mol% or less, 80 mol% or less, 75 mol% or less, 70 mol% or less, 65 mol% or less, 60 mol% or less, or 55 mol% or less. From these points of view, the content of monomer units in the styrene compound may be 10 to 90 mol %.
- the (A) component may have other monomers as monomer units.
- monomers include vinyl alcohol ethers (vinyl-n-butyl ether, etc.), (meth)acrylonitrile, maleic acid, maleic anhydride, maleic acid monoesters (monomethyl maleate, monoethyl maleate, maleic monoisopropyl acid, etc.), fumaric acid, cinnamic acid, ⁇ -cyanocinnamic acid, itaconic acid, crotonic acid, propiolic acid and the like.
- Component (A) may contain a binder polymer having no nitrogen-containing group, and does not contain a binder polymer having a nitrogen-containing group (for example, a binder polymer having a compound having a nitrogen-containing group as a monomer unit). good.
- the content of the monomer units of the compound having a nitrogen-containing group is 1 mol% or less, less than 1 mol%, or 0.1 mol, based on the total amount of the monomer units constituting component (A). % or less, or 0.01 mol % or less.
- the acid value of component (A) may be within the following range from the viewpoint of easily obtaining excellent resolution and adhesion.
- the acid value of component (A) is 80 mgKOH/g or more, 90 mgKOH/g or more, 100 mgKOH/g or more, 100 mgKOH/g or more, 120 mgKOH/g or more, 140 mgKOH/g or more, 150 mgKOH/g or more, 160 mgKOH/g or more, or , 170 mg KOH/g or more.
- the acid value of component (A) may be 250 mgKOH/g or less, 240 mgKOH/g or less, 230 mgKOH/g or less, 210 mgKOH/g or less, 200 mgKOH/g or less, or 180 mgKOH/g or less.
- the component (A) may have an acid value of 80 to 250 mgKOH/g.
- the acid value of component (A) can be adjusted by adjusting the content of the monomer units (for example, the monomer units of (meth)acrylic acid) constituting component (A).
- the acid value of component (A) can be measured by the method described in Examples.
- the weight average molecular weight (Mw) of component (A) may be within the following range from the viewpoint of easily obtaining excellent resolution and adhesion.
- the weight average molecular weight of component (A) may be 10,000 or more, 20,000 or more, 25,000 or more, 30,000 or more, or 35,000 or more.
- the weight average molecular weight of component (A) may be 100,000 or less, 80,000 or less, 70,000 or less, less than 70,000, 65,000 or less, 60,000 or less, 50,000 or less, 40,000 or less, or 35,000 or less. From these viewpoints, the weight average molecular weight of component (A) may be 10,000 to 100,000, 20,000 to 50,000, or 30,000 to 40,000.
- the number average molecular weight (Mn) of component (A) may be within the following range from the viewpoint of easily obtaining excellent resolution and adhesion.
- Component (A) may have a number average molecular weight of 5,000 or more, 10,000 or more, 12,000 or more, 15,000 or more, or 16,000 or more.
- the number average molecular weight of component (A) may be 50,000 or less, 40,000 or less, 35,000 or less, 30,000 or less, 25,000 or less, 20,000 or less, or 16,000 or less. From these viewpoints, the number average molecular weight of component (A) may be 5,000 to 50,000, 10,000 to 25,000, or 15,000 to 20,000.
- the degree of dispersion (weight average molecular weight/number average molecular weight) of component (A) may be within the following range from the viewpoint of easily obtaining excellent resolution and adhesion.
- Component (A) may have a dispersity of 1.0 or more, 1.5 or more, 1.8 or more, 2.0 or more, or 2.1 or more.
- Component (A) may have a dispersity of 3.0 or less, 2.8 or less, 2.5 or less, 2.3 or less, or 2.2 or less. From these points of view, the component (A) may have a dispersity of 1.0 to 3.0.
- the weight average molecular weight and number average molecular weight can be measured, for example, by gel permeation chromatography (GPC) using a standard polystyrene calibration curve. More specifically, it can be measured under the conditions described in Examples. If it is difficult to measure a compound having a low molecular weight by the above weight average molecular weight and number average molecular weight measurement methods, the molecular weight can be measured by another method and the average value can be calculated.
- GPC gel permeation chromatography
- the content of component (A) may be within the following range based on the total amount of the photosensitive film or the total amount of the photosensitive resin composition (total solid content).
- the content of component (A) is 10% by mass or more, 20% by mass or more, 30% by mass or more, and 40% by mass from the viewpoint of easily obtaining excellent resolution and adhesion, and from the viewpoint of excellent film formability. % or more, 45 mass % or more, or 50 mass % or more.
- the content of component (A) is 90% by mass or less, 80% by mass or less, 75% by mass or less, 70% by mass or less, 65% by mass or less, or 60% by mass, from the viewpoint of easily obtaining excellent resolution and adhesion. % or less, or 55% by mass or less. From these points of view, the content of component (A) may be 10 to 90% by mass.
- the content of component (A) may be within the following range with respect to the total amount of 100 parts by mass of components (A) and (B).
- the content of component (A) is 10 parts by mass or more, 20 parts by mass or more, 30 parts by mass or more, and 40 parts by mass from the viewpoint of easily obtaining excellent resolution and adhesion and from the viewpoint of excellent film formability. parts or more, 45 parts by mass or more, 50 parts by mass or more, or 55 parts by mass or more.
- the content of component (A) is 90 parts by mass or less, 80 parts by mass or less, 75 parts by mass or less, 70 parts by mass or less, 65 parts by mass or less, or It may be 60 parts by mass or less. From these viewpoints, the content of component (A) may be 10 to 90 parts by mass, or 40 to 70 parts by mass.
- the photosensitive film and photosensitive resin composition according to the present embodiment contain a photopolymerizable compound (excluding anthracene compound, pyrazoline compound, distyrylbenzene compound, or naphthalene compound) as component (B). do.
- a photopolymerizable compound is a compound that is polymerized by light.
- the component (B) may be a compound having an ethylenically unsaturated bond and may be a compound ((meth)acrylic acid compound) having a (meth)acryloyl group.
- Component (B) includes bisphenol A type (meth)acrylic acid compound, EO-modified di(meth)acrylate, PO-modified di(meth)acrylate, EO/PO-modified di(meth)acrylate, polyalkylene glycol di(meth) Acrylates (polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, etc.), EO-modified polyalkylene glycol di(meth)acrylate, PO-modified polyalkylene glycol di(meth)acrylate, EO/PO-modified polyalkylene glycol di(meth)acrylate (Meth)acrylate, trimethylolpropane di(meth)acrylate, trimethylolpropane tri(meth)acrylate, EO-modified trimethylolpropane tri(meth)acrylate, PO-modified trimethylolpropane tri(meth)acrylate, EO/PO-modified tri Methylolpropane
- EO-modified means a compound having a (poly)oxyethylene group.
- PO-modified means a compound having a (poly)oxypropylene group.
- EO/PO-modified means a compound having a (poly)oxyethylene group and/or a (poly)oxypropylene group.
- Component (B) is a photopolymerizable compound having a (poly)oxyethylene group (for example, (poly ) a (meth)acrylic acid compound having an oxyethylene group).
- the number of structural units of the oxyethylene group may be 1 or more, 2 or more, 3 or more, 4 or more, more than 4, 5 or more, 6 or more, 8 or more, or 10 or more.
- the number of structural units of the oxyethylene group may be 20 or less, 18 or less, 16 or less, 14 or less, 12 or less, 10 or less, 8 or less, 6 or less, 5 or less, 4 or less, 4 or less, or 3 or less. .
- the number of structural units of the oxyethylene group may be 1-20, 2-18, 4-16, or 6-10.
- the above number of structural units of oxyethylene groups is the total number of structural units of oxyethylene groups in the (poly)oxyethylene groups contained in the photopolymerizable compound.
- the number of structural units of the oxyethylene group is the number of structural units of the oxyethylene group in one (poly)oxyethylene group, and the number of structural units of the oxyethylene group in one (poly)oxyethylene group.
- the (B) component may contain a bisphenol A type (meth)acrylic acid compound from the viewpoint of easily obtaining excellent resolution and adhesion.
- a bisphenol A type (meth)acrylic acid compound 2,2-bis(4-((meth)acryloxypolyethoxy)phenyl)propane (2,2-bis(4-((meth)acryloxypentaethoxy) phenyl)propane, etc.), 2,2-bis(4-((meth)acryloxypolypropoxy)phenyl)propane, 2,2-bis(4-((meth)acryloxypolybutoxy)phenyl)propane, 2, 2-bis(4-((meth)acryloxypolyethoxypolypropoxy)phenyl)propane and the like.
- Component (B) may contain 2,2-bis(4-((meth)acryloxypolyethoxy)phenyl)propane from the viewpoint of easily obtaining excellent resolution and adhesion. (4-((meth)acryloxypentaethoxy)phenyl)propane may be included.
- the molecular weight of the bisphenol A type (meth)acrylic acid compound may be within the following range from the viewpoint of easily obtaining excellent resolution and adhesion.
- the molecular weight may be 100 or greater, 200 or greater, 300 or greater, 400 or greater, 450 or greater, 500 or greater, 600 or greater, 700 or greater, or 800 or greater.
- the molecular weight may be 10000 or less, less than 10000, 8000 or less, 6000 or less, 5000 or less, 3000 or less, 2000 or less, 1500 or less, 1000 or less, 900 or less, 800 or less, 700 or less, 600 or less, or 500 or less. . From these points of view, the molecular weight may range from 100 to 10,000.
- the content of the bisphenol A type (meth)acrylic acid compound may be within the following ranges based on the total mass of component (B).
- the content of the bisphenol A type (meth)acrylic acid compound is 50% by mass or more, 50% by mass or more, 60% by mass or more, 70% by mass or more, 80% by mass or more, 85% by mass or more, or 90% by mass or more.
- the content of the bisphenol A type (meth)acrylic acid compound is 100% by mass or less, less than 100% by mass, 99% by mass or less, 98% by mass or less, 97% by mass or less, 95% by mass or less, and 92% by mass or less. , or 91% by mass or less. From these points of view, the content of the bisphenol A type (meth)acrylic acid compound may be 50 to 100% by mass.
- the content of the bisphenol A type (meth)acrylic acid compound is within the following range with respect to 100 parts by mass of the total amount of components (A) and (B), from the viewpoint of easily obtaining excellent resolution and adhesion. you can
- the content of the bisphenol A type (meth)acrylic acid compound may be 1 part by mass or more, 5 parts by mass or more, 10 parts by mass or more, 20 parts by mass or more, 30 parts by mass or more, or 40 parts by mass or more.
- the content of the bisphenol A type (meth)acrylic acid compound is less than 100 parts by mass, 90 parts by mass or less, 80 parts by mass or less, 70 parts by mass or less, 60 parts by mass or less, 50 parts by mass or less, or 40 parts by mass or less. can be From these points of view, the content of the bisphenol A type (meth)acrylic acid compound may be 1 part by mass or more and less than 100 parts by mass.
- Component (B) is a (meth)acrylic acid compound (bisphenol A type (Meth)acrylic acid compound (excluding compounds corresponding to acrylic acid compounds) and having at least one selected from the group consisting of polyoxyethylene groups and polyoxypropylene groups (meth)acrylic acid compounds (bisphenol A type (meth) excluding compounds corresponding to acrylic acid compounds).
- the molecular weight of the (meth)acrylic acid compound having a polyoxyalkylene group may be within the following range from the viewpoint of easily obtaining excellent resolution and adhesion.
- the molecular weight may be 100 or greater, 200 or greater, 300 or greater, 400 or greater, 500 or greater, 600 or greater, 700 or greater, 800 or greater, 900 or greater, 1000 or greater, or 1100 or greater.
- the molecular weight may be 10,000 or less, less than 10,000, 8,000 or less, 6,000 or less, 5,000 or less, 3,000 or less, 2,000 or less, 1,500 or less, or 1,200 or less. From these points of view, the molecular weight may range from 100 to 10,000.
- the content of the (meth)acrylic acid compound having a polyoxyalkylene group may be within the following ranges based on the total mass of component (B).
- the content of the (meth)acrylic acid compound having a polyoxyalkylene group may exceed 0% by mass, 1% by mass or more, 2% by mass or more, 3% by mass or more, 5% by mass or more, 8% by mass or more, Alternatively, it may be 9% by mass or more.
- the content of the (meth)acrylic acid compound having a polyoxyalkylene group is 50% by mass or less, less than 50% by mass, 40% by mass or less, 30% by mass or less, 20% by mass or less, 15% by mass or less, or 10 % by mass or less. From these points of view, the content of the (meth)acrylic acid compound having a polyoxyalkylene group may be more than 0% by mass and 50% by mass or less.
- the content of the (meth)acrylic acid compound having a polyoxyalkylene group is the following per 100 parts by mass of the total amount of components (A) and (B). can be a range.
- the content of the (meth)acrylic acid compound having a polyoxyalkylene group is 0.1 parts by mass or more, 0.5 parts by mass or more, 1 part by mass or more, 2 parts by mass or more, 3 parts by mass or more, or 4 parts by mass It may be more than part.
- the content of the (meth)acrylic acid compound having a polyoxyalkylene group is 50 parts by mass or less, 30 parts by mass or less, 10 parts by mass or less, 8 parts by mass or less, 6 parts by mass or less, 5 parts by mass or less, and 5 parts by mass. It may be less than or 4 parts by mass or less. From these viewpoints, the content of the (meth)acrylic acid compound having a polyoxyalkylene group may be 0.1 to 50 parts by mass.
- the content of the bisphenol A type (meth)acrylic acid compound is excellent.
- the amount may be in the following range with respect to 100 parts by mass of the (meth)acrylic acid compound having a polyoxyalkylene group.
- the content of the bisphenol A type (meth)acrylic acid compound may be 1 part by mass or more, 2 parts by mass or more, 3 parts by mass or more, 5 parts by mass or more, 8 parts by mass or more, or 10 parts by mass or more.
- the content of the bisphenol A type (meth)acrylic acid compound is 100 parts by mass or less, less than 100 parts by mass, 80 parts by mass or less, 50 parts by mass or less, 30 parts by mass or less, 20 parts by mass or less, or 10 parts by mass or less. can be From these points of view, the content of the bisphenol A type (meth)acrylic acid compound may be 1 to 100 parts by mass.
- the content of component (B) is within the following range based on the total amount of the photosensitive film or the total amount of the photosensitive resin composition (total solid content). It's okay.
- the content of component (B) may be 10% by mass or more, 15% by mass or more, 20% by mass or more, 25% by mass or more, 30% by mass or more, 35% by mass or more, or 40% by mass or more.
- the content of component (B) is 90% by mass or less, 80% by mass or less, 70% by mass or less, 65% by mass or less, 60% by mass or less, 55% by mass or less, 50% by mass or less, or 45% by mass or less. can be From these viewpoints, the content of component (B) may be 10 to 90% by mass.
- the content of component (B) may be within the following range with respect to the total amount of 100 parts by mass of components (A) and (B).
- the content of component (B) may be 10 parts by mass or more, 20 parts by mass or more, 25 parts by mass or more, 30 parts by mass or more, 35 parts by mass or more, or 40 parts by mass or more.
- the content of component (B) may be 90 parts by mass or less, 80 parts by mass or less, 70 parts by mass or less, 60 parts by mass or less, 55 parts by mass or less, 50 parts by mass or less, or 45 parts by mass or less. From these viewpoints, the content of component (B) may be 10 to 90 parts by mass, or 30 to 60 parts by mass.
- the photosensitive film and photosensitive resin composition according to the present embodiment contain a photopolymerization initiator (excluding anthracene compound, pyrazoline compound, distyrylbenzene compound, or naphthalene compound) as component (C). do.
- a photopolymerization initiator excluding anthracene compound, pyrazoline compound, distyrylbenzene compound, or naphthalene compound
- Component (C) includes hexaarylbiimidazole compounds; benzophenone, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-1-butanone, 2-(dimethylamino)-2-[(4- methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone, 4-(2-hydroxyethoxy)phenyl-2-(hydroxy-2-propyl)ketone, 2-methyl-1- Aromatic ketones such as [4-(methylthio)phenyl]-2-morpholino-propanone-1; quinone compounds such as alkylanthraquinone; benzoin ether compounds such as benzoin alkyl ether; benzoin compounds such as benzoin and alkylbenzoin; benzyl derivatives such as; bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide; bis(2,6-dimethylbenzoyl)-2
- the (C) component may contain a hexaarylbiimidazole compound from the viewpoint of easily obtaining excellent resolution and adhesion.
- the aryl group in the hexaarylbiimidazole compound may be a phenyl group or the like.
- a hydrogen atom bonded to an aryl group in the hexaarylbiimidazole compound may be substituted with a halogen atom (such as a chlorine atom).
- the hexaarylbiimidazole compound may be a 2,4,5-triarylimidazole dimer.
- 2,4,5-triarylimidazole dimer examples include 2-(o-chlorophenyl)-4,5-diphenylimidazole dimer, 2-(o-chlorophenyl)-4,5-bis-(m- methoxyphenyl)imidazole dimer, 2-(p-methoxyphenyl)-4,5-diphenylimidazole dimer, and the like.
- the hexaarylbiimidazole compound may contain 2-(o-chlorophenyl)-4,5-diphenylimidazole dimer from the viewpoint of easily obtaining excellent resolution and adhesion, and 2,2'-bis( o-Chlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole.
- the content of the hexaarylbiimidazole compound is 50% by mass or more, more than 50% by mass, 70% by mass or more, 90% by mass or more, based on the total amount of component (C). % by mass or more, 95% by mass or more, 98% by mass or more, 99% by mass or more, or substantially 100% by mass (an aspect in which component (C) is substantially composed of a hexaarylbiimidazole compound).
- the content of component (C) is in the following range based on the total amount of the photosensitive film or the total amount of the photosensitive resin composition (total solid content) from the viewpoint of easily obtaining excellent resolution and adhesion. It's okay.
- the content of component (C) is 0.1% by mass or more, 0.5% by mass or more, 1% by mass or more, 2% by mass or more, 3% by mass or more, 4% by mass or more, 5% by mass or more, or It may be 5.5% by mass or more.
- the content of component (C) may be 20% by mass or less, 15% by mass or less, 12% by mass or less, 10% by mass or less, 8% by mass or less, 7% by mass or less, or 6% by mass or less. From these viewpoints, the content of component (C) may be 0.1 to 20% by mass.
- the content of component (C) may be within the following range with respect to the total amount of 100 parts by mass of components (A) and (B).
- the content of component (C) is 0.1 parts by mass or more, 0.5 parts by mass or more, 1 part by mass or more, 2 parts by mass or more, 3 parts by mass or more, 4 parts by mass or more, 5 parts by mass or more. It may be 5 parts by mass or more, or 6 parts by mass or more.
- the content of component (C) may be 20 parts by mass or less, 15 parts by mass or less, 12 parts by mass or less, 10 parts by mass or less, 8 parts by mass or less, 7 parts by mass or less, or 6 parts by mass or less. From these points of view, the content of component (C) may be 0.1 to 20 parts by mass.
- the photosensitive film and photosensitive resin composition according to the present embodiment contain, as the component (D), anthracene compounds (compounds having an anthracene ring; excluding compounds corresponding to naphthalene compounds), pyrazoline compounds (compounds having a pyrazoline ring; excluding compounds corresponding to anthracene compounds or naphthalene compounds) and distyrylbenzene compounds (compounds having a benzene ring with two styryl groups bonded; excluding compounds corresponding to anthracene compounds, pyrazoline compounds or naphthalene compounds) Contains at least one selected from the group.
- a component can be used as a sensitizer (photosensitizer).
- the photosensitive film and the photosensitive resin composition according to the present embodiment may be in an aspect that does not contain an anthracene compound, may be in an aspect that does not contain a pyrazoline compound, or does not contain a distyrylbenzene compound.
- the molecular weight of component (D) may be less than 10,000.
- the anthracene compound may have a substituent bonded to the anthracene ring and may have a substituent bonded to at least one selected from the group consisting of the 9- and 10-positions of the anthracene ring.
- substituents include alkyl groups (alkyl groups having 1 to 20 carbon atoms (acyclic alkyl groups), cycloalkyl groups having 5 to 12 carbon atoms, etc.), aryl groups (phenyl groups, aralkyl groups (benzyl group, phenethyl group, etc.
- the (D) component may contain a compound represented by the following general formula (d1) from the viewpoint of easily obtaining excellent resolution and adhesion.
- R d10 and R d11 are each independently an alkyl group (an alkyl group having 1 to 20 carbon atoms (acyclic alkyl group), a cycloalkyl group having 5 to 12 carbon atoms, etc.), a phenyl group, , a benzyl group, an alkanoyl group (eg, an alkanoyl group having 2 to 12 carbon atoms), or a benzoyl group.
- R d12 , R d13 , R d14 , R d15 , R d16 , R d17 , R d18 and R d19 are each independently a hydrogen atom, an alkyl group (eg, an alkyl group having 1 to 12 carbon atoms), a halogeno group, a cyano group, carboxy group, phenyl group, alkoxycarbonyl (eg, alkoxycarbonyl group having 2 to 6 carbon atoms), or benzoyl group. ]
- the alkyl group when the alkyl group has 2 or more carbon atoms (eg, 2 to 12), the alkyl group may have an oxygen atom between the carbon atoms of the main chain, and may be substituted with a hydroxy group. good.
- a cycloalkyl group may have an oxygen atom in the ring and may be substituted with a hydroxy group.
- Each of the phenyl group, benzyl group and benzoyl group is an alkyl group (eg, an alkyl group having 1 to 6 carbon atoms), a hydroxy group, a halogeno group, a cyano group, a carboxy group, a phenyl group, an alkoxy group (eg, an alkyl group having 1 to 6 carbon atoms). alkoxy group), a phenoxy group, and an alkoxycarbonyl group (for example, an alkoxycarbonyl group having 2 to 6 carbon atoms).
- R d12 , R d13 , R d14 , R d15 , R d16 , R d17 , R d18 and R d19 may be hydrogen atoms from the viewpoint of easily obtaining excellent resolution and adhesion.
- the anthracene compound does not have to have a hydroxy group in the molecule, and it does not have to have a hydroxyalkoxy group bonded to the anthracene ring.
- Component (D) may not contain, as an anthracene compound, an anthracene compound having a hydroxy group in the molecule, and may not contain an anthracene compound having a hydroxyalkoxy group bonded to an anthracene ring.
- Component (D) may not contain anthracene compounds having Component (D) may not contain, as an anthracene compound, an anthracene compound having substituents at positions other than the 9- and 10-positions of the anthracene ring.
- Component (D) may not contain, as an anthracene compound, an anthracene compound having a substituent having two or more oxygen atoms bonded to the anthracene ring.
- the number of carbon atoms in the alkoxy group may be within the following range from the viewpoint of easily obtaining excellent resolution and adhesion.
- the number of carbon atoms in the alkoxy group of OR d10 or OR d11 provides excellent resolution and adhesion. From the viewpoint of easily obtaining, the following ranges may be used.
- the number of carbon atoms in the alkoxy group may be 1 or more, 2 or more, 3 or more, or 4 or more.
- the number of carbon atoms in the alkoxy group may be 10 or less, 8 or less, 6 or less, 5 or less, 4 or less, or 3 or less. From these points of view, the alkoxy group may have 1 to 10 carbon atoms.
- anthracene compounds include 1-methylanthracene, 2-methylanthracene, 9-methylanthracene, 2-ethylanthracene, 2-butylanthracene, 9-vinylanthracene, 9-phenylanthracene, 1-aminoanthracene, 2-aminoanthracene, 9-(methylaminomethyl)anthracene, 9-acetylanthracene, 9-anthraldehyde, 9,10-dimethylanthracene, 9,10-diethoxyanthracene, 9,10-dipropoxyanthracene, 9,10-dibutoxyanthracene, 9,10-di(2-ethylhexyloxy)anthracene, 9,10-diphenylanthracene, 2-bromo-9,10-diphenylanthracene, 9-(4-bromophenyl)-10-phenylanthracene, 10-methyl
- the anthracene compound is a compound having an unsubstituted alkoxy group bonded to an anthracene ring (for example, a dialkoxy anthracene compound), which may include a compound having an unsubstituted alkoxy group bonded to at least one selected from the group consisting of the 9-position and 10-position of the anthracene ring, 9,10-dipropoxyanthracene and 9, It may contain at least one selected from the group consisting of 10-dibutoxyanthracene, and may contain 9,10-dibutoxyanthracene.
- component (D) should not contain compounds other than compounds having unsubstituted alkoxy groups bonded to the 9- and 10-positions of the anthracene ring as anthracene compounds. good. That is, the anthracene compound in component (D) may be a compound having unsubstituted alkoxy groups bonded to the 9- and 10-positions of the anthracene ring.
- the content of the compound having an unsubstituted alkoxy group bonded to the anthracene ring or the content of the anthracene compound having an unsubstituted alkoxy group bonded to the 9- and 10-positions of the anthracene ring provides excellent resolution and From the viewpoint of easily obtaining adhesion, based on the total mass of the anthracene compound (the total mass of the anthracene compound contained in the photosensitive film or the photosensitive resin composition), it is 50% by mass or more, more than 50% by mass, or 70% by mass or more.
- the anthracene compound substantially has an unsubstituted alkoxy group bonded to the anthracene ring compound, and may be 50 to 100% by mass.
- Pyrazoline compounds include 1-pyrazoline compounds, 2-pyrazoline compounds, and 3-pyrazoline compounds.
- the pyrazoline compound may contain a 2-pyrazoline compound from the viewpoint of easily obtaining excellent resolution and adhesion.
- the pyrazoline compound may have a substituent that binds to the pyrazoline ring, and may include compounds that have a substituent that binds to at least one selected from the group consisting of the 1-, 3- and 5-positions of the pyrazoline ring.
- substituents include alkyl groups (alkyl groups having 1 to 20 carbon atoms (acyclic alkyl groups), cycloalkyl groups having 5 to 12 carbon atoms, etc.), aryl groups (phenyl groups, aralkyl groups (benzyl group, phenethyl group, etc.
- the benzene ring of the aryl group may have a substituent, such as an alkyl group, an alkoxy group (methoxy group, ethoxy group, propoxy group, etc.), a halogeno group (fluoro group, chloro group, bromo group, etc.). , a sulfonamide group, and the like.
- the substituent may be an alkylester group (eg, an alkylester group having 1 to 6 carbon atoms), an alkylamino group (eg, an alkylamino group having 1 to 20 carbon atoms), or the like.
- Component (D) is selected from the group consisting of a compound represented by the following general formula (d21) and a compound represented by the following general formula (d22) from the viewpoint of easily obtaining excellent resolution and adhesion. may contain at least one
- R d211 , R d212 and R d213 are each independently an alkoxy group (eg, an alkoxy group having 1 to 10 carbon atoms) or an alkyl group (eg, an alkyl group having 1 to 3 carbon atoms).
- d211, d212 and d213 each independently represent an integer of 0 to 5.
- d211 is 2 or more
- a plurality of R d211 may be the same or different
- d212 is 2 or more
- a plurality of R d212 may be the same. They may be different
- d213 is 2 or more, a plurality of R d213 may be the same or different.
- At least one of R d211 , R d212 and R d213 is an alkoxy group (eg, an alkoxy group having 1 to 10 carbon atoms) or an alkyl group (eg, an alkyl group having 1 to 3 carbon atoms). It's okay. At least one selected from the group consisting of R d212 and R d213 may be an alkoxy group, a methoxy group, an ethoxy group or a propoxy group from the viewpoint of easily obtaining excellent resolution and adhesion. d211 may be 0 from the viewpoint of easily obtaining excellent resolution and adhesion.
- At least one selected from the group consisting of d212 and d213 may be 0, 1, 2 or 3, or 1 from the viewpoint of easily obtaining excellent resolution and adhesion.
- the sum of d211, d212 and d213 may be 0-6 or 1-6.
- R d221 and R d222 are each independently an alkyl group (an alkyl group having 1 to 20 carbon atoms (acyclic alkyl group), a cycloalkyl group having 5 to 12 carbon atoms, etc.), an alkoxy group, (for example, an alkoxy group having 1 to 6 carbon atoms), an amino group, a halogeno group, a carboxy group, a cyano group, a nitro group, an acetyl group, a sulfonyl group, or a sulfonamide group, and d221 and d222 are each independently Indicates an integer from 0 to 5.
- d221 is 2 or more, a plurality of R d221 may be the same or different, and when d222 is 2 or more, a plurality of R d222 may be the same. can be different.
- R d221 may be a halogeno group, a fluoro group, a chloro group, or a bromo group from the viewpoint of easily obtaining excellent resolution and adhesion.
- R d222 may be a sulfonamide group from the viewpoint of easily obtaining excellent resolution and adhesion. At least one selected from the group consisting of d221 and d222 may be 0, 1, 2 or 3, or 1 from the viewpoint of easily obtaining excellent resolution and adhesion.
- pyrazoline compounds include 1-phenyl-3-(4-isopropylstyryl)-5-(4-isopropylphenyl)-pyrazoline, 1-phenyl-3-(4-tert-butyl-styryl)-5-(4- tert-butylphenyl)-pyrazoline, 1-phenyl-3-(4-methoxystyryl)-5-(4-methoxyphenyl)-pyrazoline, 1-phenyl-3-(3,5-dimethoxystyryl)-5-( 3,5-dimethoxyphenyl)-pyrazoline, 1-phenyl-3-(3,4-dimethoxystyryl)-5-(3,4-dimethoxyphenyl)-pyrazoline, 1-phenyl-3-(2,6-dimethoxy styryl)-5-(2,6-dimethoxyphenyl)-pyrazoline, 1-phenyl-3-(2,5-dimethoxystyryl)-5
- the pyrazoline compound is a compound having an aryl group bonded to a pyrazoline ring (a compound having two or more (eg, 2 to 3) aryl groups bonded to a pyrazoline ring) from the viewpoint of easily obtaining excellent resolution and adhesion.
- the distyrylbenzene compound in the component (D).
- the benzene ring of the styryl group and the benzene ring in which two styryl groups are bonded may have a substituent.
- substituents include alkyl groups (alkyl groups having 1 to 20 carbon atoms (acyclic alkyl groups), cycloalkyl groups having 5 to 12 carbon atoms, etc.), aryl groups (phenyl groups, aralkyl groups (benzyl group, phenethyl group, etc.
- benzoyl group, etc. vinyl group, hydroxy group, carboxy group, carboxylic acid group, aldehyde group, alkoxy group (unsubstituted alkoxy group or substituted alkoxy group (hydroxyalkoxy group, etc.)), carbonyl group, alkoxycarbonyl group, alkanoyl group (alkanoyl group having 2 to 12 carbon atoms, etc.), oxycarbonyl group, carbonyloxy group, amino group, epoxy group, furyl group, cyano group, halogeno group (fluoro group, chloro group, bromo group, etc.), nitro group, acetyl group, sulfonyl group, sulfonamide group and the like.
- the (D) component may contain a compound represented by the following general formula (d3) from the viewpoint of easily obtaining excellent resolution and adhesion.
- R d31 , R d32 and R d33 represent a cyano group, d31 and d32 each independently represents an integer of 0 to 5, and d33 represents an integer of 0 to 4.
- At least one selected from the group consisting of d31 and d32 may be 1, 2, 3, 4 or 5 from the viewpoint of easily obtaining excellent resolution and adhesion. you can d33 may be 0, 1, 2 or 3, or may be 0 from the viewpoint of easily obtaining excellent resolution and adhesion.
- distyrylbenzene compounds include distyrylbenzene and dicyanodistyrylbenzene compounds.
- examples of the dicyanodistyrylbenzene compounds include 4'-(2-cyanostyryl)-2-stilbenecarbonitrile, 4'-(2-cyanostyryl)-3-stilbenecarbonitrile, 4'-(2-cyanostyryl)- 4-stilbenecarbonitrile, 1,4-bis(4-cyanostyryl)benzene and the like.
- the distyrylbenzene compound may include a dicyanodistyrylbenzene compound and may include 4'-(2-cyanostyryl)-3-stilbenecarbonitrile from the viewpoint of easily obtaining excellent resolution and adhesion.
- the content D1 is the content of component (D) (the total amount of the anthracene compound, the pyrazoline compound, and the distyrylbenzene compound; hereinafter the same), the content of the anthracene compound, the content of the pyrazoline compound, or the distyrylbenzene compound.
- the content of may be in the following range based on the total amount of the photosensitive film or the total amount of the photosensitive resin composition (total solid content) from the viewpoint of easily obtaining excellent resolution and adhesion.
- Content D1 is 0.01 mass % or more, 0.05 mass % or more, 0.1 mass % or more, 0.2 mass % or more, 0.25 mass % or more, 0.3 mass % or more, 0.4 % by mass or more, 0.5% by mass or more, or 0.6% by mass or more.
- the content D1 is 5% by mass or less, 3% by mass or less, 1% by mass or less, 0.8% by mass or less, 0.7% by mass or less, 0.6% by mass or less, 0.5% by mass or less, and 0.5% by mass or less. It may be 4% by mass or less, 0.3% by mass or less, or 0.25% by mass or less. From these points of view, the content D1 may be 0.01 to 5% by mass, or 0.1 to 1% by mass.
- the content of the component (D), the content of the anthracene compound, the content of the pyrazoline compound, or the content of the distyrylbenzene compound from the viewpoint of easily obtaining excellent resolution and adhesion, It may be in the following range with respect to 100 parts by mass of the total amount of components (A) and (B).
- Content D2 is 0.01 parts by mass or more, 0.05 parts by mass or more, 0.1 parts by mass or more, 0.2 parts by mass or more, 0.25 parts by mass or more, 0.3 parts by mass or more, 0.4 It may be at least 0.5 parts by mass, at least 0.6 parts by mass, or at least 0.65 parts by mass.
- the content D2 is 5 parts by mass or less, 3 parts by mass or less, 1 part by mass or less, 0.8 parts by mass or less, 0.7 parts by mass or less, 0.65 parts by mass or less, 0.6 parts by mass or less, and 0.6 parts by mass or less. It may be 5 parts by mass or less, 0.4 parts by mass or less, 0.3 parts by mass or less, or 0.25 parts by mass or less. From these points of view, the content D2 may be 0.01 to 5 parts by mass, or 0.1 to 1 part by mass.
- the content of the component (D), the content of the anthracene compound, or the content of the distyrylbenzene compound is 100 masses of the component (A) from the viewpoint of easily obtaining excellent resolution and adhesion. It may be in the following range with respect to the part.
- the content D3 is 0.1 parts by mass or more, 0.3 parts by mass or more, 0.4 parts by mass or more, 0.5 parts by mass or more, 0.8 parts by mass or more, 1 part by mass or more, more than 1 part by mass, Alternatively, it may be 1.1 parts by mass or more.
- Content D3 is 10 parts by mass or less, 8 parts by mass or less, 5 parts by mass or less, 3 parts by mass or less, 2 parts by mass or less, 1.5 parts by mass or less, 1.2 parts by mass or less, 1.1 parts by mass or less , 1 part by weight or less, less than 1 part by weight, 0.8 parts by weight or less, or 0.5 parts by weight or less. From these points of view, the content D3 may be 0.1 to 10 parts by mass, 0.5 to 5 parts by mass, or 1 to 3 parts by mass.
- the photosensitive film and photosensitive resin composition according to this embodiment contain a naphthalene compound (a compound having a naphthalene ring) as the component (E).
- the (E) component can be used as a sensitizing aid (photosensitizing aid).
- the molecular weight of component (E) may be less than 10,000.
- the naphthalene compound may have a substituent that binds to the naphthalene ring, and may have a substituent that binds to at least one selected from the group consisting of the 1- and 4-positions of the naphthalene ring.
- substituents include alkyl groups (alkyl groups having 1 to 20 carbon atoms (acyclic alkyl groups), cycloalkyl groups having 5 to 12 carbon atoms, etc.), aryl groups (phenyl groups, aralkyl groups (benzyl group, phenethyl group, etc.
- naphthalene compound may have no substituents at positions other than the 1- and 4-positions of the naphthalene ring.
- the naphthalene compound may be a naphthalene compound having no oxazole skeleton.
- the naphthalene compound may be a compound different from the vinyl naphthalene compound.
- the naphthalene compound may be a naphthalene compound having no ethylenically unsaturated bonds.
- the naphthalene compound may be a naphthalene compound having no anthracene ring.
- the number of carbon atoms in the alkoxy group in the naphthalene compound may be within the following range from the viewpoint of easily obtaining excellent resolution and adhesion.
- the number of carbon atoms in the alkoxy group may be 1 or more, or 2 or more.
- the number of carbon atoms in the alkoxy group may be 10 or less, 8 or less, 6 or less, 5 or less, 4 or less, 3 or less, or 2 or less. From these points of view, the alkoxy group may have 1 to 10 carbon atoms.
- the naphthalene compound may contain a compound represented by the following general formula (e).
- R e1 and R e2 each independently represent a halogeno group, an alkyl group (eg, an alkyl group having 1 to 8 carbon atoms), an aralkyl group, an alkoxy group, or an aryloxy group, and R e3 and R e4 each independently represent an alkyl group or a glycidyl group, e1 represents an integer of 0-2, and e2 represents an integer of 0-4.
- e1 represents 2
- a plurality of R e1 may be the same or different
- e2 is 2 or more, a plurality of R e2 may be the same or different. may be ]
- the alkyl groups of R e1 , R e2 , R e3 and R e4 may be C 1-9 alkyl groups optionally substituted with oxygen atoms.
- Such alkyl groups include methyl, ethyl, n-propyl, i-propyl, n-butyl, i-butyl, n-pentyl, n-hexyl, n-heptyl, n -octyl group, 2-ethylhexyl group, n-nonyl group, 2-hydroxyethyl group, 3-hydroxyethyl group, 2-hydroxypropyl group, 2-methoxyethoxy group, 2-ethoxyethoxy group, 2-phenoxyethoxy group, etc.
- Naphthalene compounds include 1-methoxynaphthalene, 1-ethoxynaphthalene, 1-propoxynaphthalene, 1-butoxynaphthalene, 1,4-dimethoxynaphthalene, 1-ethoxy-4-methoxynaphthalene, 1,4-diethoxynaphthalene, 1 ,4-bis(n-propoxy)naphthalene, 1,4-bis(n-butoxy)naphthalene, 1,4-bis(i-butoxy)naphthalene, 1,4-bis(n-pentyloxy)naphthalene, 1, 4-bis(i-pentyloxy)naphthalene, 1,4-bis(n-hexyloxy)naphthalene, 1,4-bis(n-heptyloxy)naphthalene, 1,4-bis(n-octyloxy)naphthalene, 1,4-bis(2-ethylhexyloxy)naphthalene, 1,4-
- the naphthalene compound may contain a compound having an alkoxy group bonded to the naphthalene ring (e.g., a compound having two alkoxy groups bonded to the naphthalene ring) from the viewpoint of easily obtaining excellent resolution and adhesion.
- a compound having an alkoxy group bonded to the naphthalene ring e.g., a compound having two alkoxy groups bonded to the naphthalene ring
- At least one selected from the group consisting of 1,4-dimethoxynaphthalene and 1,4-diethoxynaphthalene which may include a compound having an alkoxy group bonded to at least one selected from the group consisting of the 1- and 4-positions of the ring and may include 1,4-diethoxynaphthalene.
- the content of component (E) may be within the following range based on the total amount of the photosensitive film or the total amount of the photosensitive resin composition (total solid content). From the viewpoint of easily obtaining excellent adhesion and sensitivity, the content of component (E) is 0.01% by mass or more, 0.05% by mass or more, 0.1% by mass or more, 0.15% by mass or more, 0 .19% by mass or more, 0.2% by mass or more, 0.4% by mass or more, 0.5% by mass or more, 0.8% by mass or more, 0.9% by mass or more, 1% by mass or more, 1.5% by mass % or more, 2 mass % or more, or 2.3 mass % or more.
- the content of component (E) is 10% by mass or less, 8% by mass or less, 5% by mass or less, 3% by mass or less, 2.5% by mass or less, 2.3% by mass or less, 2% by mass or less, 1.5% by mass or less, 1% by mass or less, 0.9% by mass or less, 0.8% by mass or less, 0.5% by mass or less, 0.4% by mass or less, or 0.2% by mass or less. From these viewpoints, the content of component (E) may be 0.01 to 10% by mass, or 0.1 to 5% by mass.
- the content of component (E) may be within the following ranges with respect to 100 parts by mass of the total amount of components (A) and (B). From the viewpoint of easily obtaining excellent adhesion and sensitivity, the content of component (E) is 0.01 parts by mass or more, 0.05 parts by mass or more, 0.1 parts by mass or more, 0.15 parts by mass or more, 0 .2 parts by mass or more, 0.3 parts by mass or more, 0.5 parts by mass or more, 0.8 parts by mass or more, 1 part by mass or more, 1.5 parts by mass or more, 2 parts by mass or more, 2.5 parts by mass or more or 2.6 parts by mass or more.
- the content of component (E) is 10 parts by mass or less, 5 parts by mass or less, 3 parts by mass or less, 2.6 parts by mass or less, and 2.5 parts by mass from the viewpoint of easily obtaining excellent resolution and adhesion. 2 parts by mass or less, 1.5 parts by mass or less, 1 part by mass or less, 0.8 parts by mass or less, 0.5 parts by mass or less, 0.3 parts by mass or less, or 0.2 parts by mass or less you can From these viewpoints, the content of component (E) may be 0.01 to 10 parts by mass, or 0.1 to 5 parts by mass.
- the content of component (E) is 1000 parts by mass or less, 800 parts by mass or less, 500 parts by mass or less, 400 parts by mass or less, 300 parts by mass or less, or 200 parts by mass from the viewpoint of easily obtaining excellent resolution and adhesion. parts or less, 150 parts by mass or less, 100 parts by mass or less, 90 parts by mass or less, 80 parts by mass or less, 70 parts by mass or less, 50 parts by mass or less, or 40 parts by mass or less. From these points of view, the content of component (E) may be 1 to 1000 parts by mass, or 10 to 500 parts by mass.
- the photosensitive film and photosensitive resin composition according to the present embodiment may contain a polymerization inhibitor (excluding compounds corresponding to any of components (A) to (E)) as component (F).
- the component (F) suppresses polymerization in unexposed areas during resist pattern formation, and tends to improve resolution.
- Polymerization inhibitors include tert-butylcatechol (eg 4-tert-butylcatechol), hindered amines (eg 2,2,6,6-tetramethyl-4-hydroxypiperidine-1-oxyl), 4-hydroxy-2, 2,6,6-tetramethylpiperidine-N-oxyl and the like.
- the content of component (F) may be within the following range with respect to 100 parts by mass of the total amount of components (A) and (B).
- the content of component (F) is 0.001 parts by mass or more, 0.003 parts by mass or more, 0.005 parts by mass or more, and 0.01 parts by mass or more from the viewpoint of easily obtaining excellent resolution and adhesion. or 0.015 parts by mass or more.
- the content of component (F) is 0.1 parts by mass or less, 0.05 parts by mass or less, 0.04 parts by mass or less, and 0.03 parts by mass or less from the viewpoint of easily obtaining excellent resolution and adhesion. , or 0.02 parts by mass or less. From these points of view, the content of component (F) may be 0.001 to 0.1 part by mass.
- the photosensitive resin composition according to this embodiment may contain an organic solvent.
- Organic solvents include methanol, ethanol, acetone, methyl ethyl ketone, methyl cellosolve, ethyl cellosolve, toluene, N,N-dimethylformamide, propylene glycol monomethyl ether and the like.
- Sensitizer tribromophenyl sulfone, photocoloring agent, anti-thermocoloring agent, plasticizer (p-toluenesulfonamide, etc.), pigment, filler, antifoaming agent, flame retardant, stabilizer, adhesion imparting agent, Leveling agents, release accelerators, antioxidants, fragrances, imaging agents, thermal cross-linking agents and the like.
- the content of the thermal radical polymerization initiator is based on the total amount of the photosensitive film or the total amount of the photosensitive resin composition (total solid content), It may be 0.5% by mass or less, less than 0.5% by mass, 0.1% by mass or less, 0.01% by mass or less, or 0.001% by mass or less.
- the photosensitive film and photosensitive resin composition according to the present embodiment may not contain a thermal radical polymerization initiator (the above content may be substantially 0% by mass).
- a vinyl polymer e.g., a vinyl polymer containing a side chain having an epoxy group
- an oxetane compound e.g., even if it has a substituent
- the content of at least one selected from the group consisting of oxetane compounds having two or more good oxetane rings is 20% by mass based on the total amount of the photosensitive film or the total amount of the photosensitive resin composition (total solid content). Below, it may be less than 20% by mass, 10% by mass or less, 1% by mass or less, 0.1% by mass or less, 0.01% by mass or less, or 0.001% by mass or less.
- the photosensitive film and photosensitive resin composition according to the present embodiment include a vinyl polymer (e.g., a vinyl polymer containing a side chain having an epoxy group) and an oxetane compound (e.g., even if it has a substituent oxetane compounds having two or more good oxetane rings) may not be contained (the above content may be substantially 0% by mass).
- a vinyl polymer e.g., a vinyl polymer containing a side chain having an epoxy group
- an oxetane compound e.g., even if it has a substituent oxetane compounds having two or more good oxetane rings
- the content of the resin having a phenolic hydroxyl group or the content of the novolak resin having a phenolic hydroxyl group is the total amount of the photosensitive film or the photosensitive resin composition. Based on the total amount of the resin composition (total solid content), 30% by mass or less, less than 30% by mass, 15% by mass or less, less than 15% by mass, 10% by mass or less, 1% by mass or less, 0.1% by mass or less , or 0.01% by mass or less.
- the photosensitive film and the photosensitive resin composition according to the present embodiment may not contain a resin having a phenolic hydroxyl group (the above content may be substantially 0% by mass), and the phenolic hydroxyl group may be (the above content may be substantially 0% by mass).
- the content of an epoxy compound having two or more oxirane rings, or the content of an aliphatic or alicyclic epoxy compound having two or more oxirane rings is 40 parts by mass or less, less than 40 parts by mass, 20 parts by mass or less, less than 20 parts by mass, 10 parts by mass or less, less than 10 parts by mass, 1 part by mass or less, or 0 .1 parts by mass or less, or 0.01 parts by mass or less.
- the photosensitive film and photosensitive resin composition according to the present embodiment may not contain an epoxy compound having two or more oxirane rings (the above content may be substantially 0 parts by mass), It may not contain an aliphatic or cycloaliphatic epoxy compound having two or more oxirane rings (the aforementioned content may be substantially 0 parts by mass).
- the photosensitive film and the photosensitive resin composition according to the present embodiment may not contain a polymerizable compound having a cycloaliphatic group (the content of the polymerizable compound is the total amount of the photosensitive film, or the photosensitive may be substantially 0% by mass based on the total amount (total solid content) of the resin composition).
- the total amount of onium borate salt and onium gallate salt is 0.1 parts by mass or less and 0.1 parts by mass with respect to 100 parts by mass of component (A). It may be less than parts, 0.01 parts by mass or less, or 0.001 parts by mass or less.
- the photosensitive film and photosensitive resin composition according to this embodiment may not contain an onium borate salt and an onium gallate salt (the above total amount may be substantially 0 parts by mass).
- the content of the polyfunctional epoxy resin is 75 based on the total amount of the photosensitive film or the total amount of the photosensitive resin composition (total solid content). % by mass or less, less than 75% by mass, 50% by mass or less, 10% by mass or less, 1% by mass or less, 0.1% by mass or less, or 0.01% by mass or less.
- the photosensitive film and photosensitive resin composition according to the present embodiment may not contain a polyfunctional epoxy resin (the above content may be substantially 0% by mass).
- the photosensitive film and photosensitive resin composition according to the present embodiment may not contain a polyimide having at least one selected from the group consisting of carboxyl groups, phenolic hydroxyl groups, sulfonic acid groups and thiol groups (the polyimide
- the content may be substantially 0% by mass based on the total amount of the photosensitive film or the total amount of the photosensitive resin composition (the total solid content)).
- the content of the bisphenol F-type (meth)acrylic acid compound ((meth)acrylic acid compound having a bisphenol F structure), or the bisphenol F-type acrylic acid compound is, based on the total mass of component (B), 5% by mass or less, less than 5% by mass, 1% by mass or less, less than 1% by mass, 0.1% by mass or less, 0.01% by mass or less, Alternatively, it may be 0.001% by mass or less.
- the content of the bisphenol F-type (meth)acrylic acid compound or the content of the bisphenol F-type acrylic acid compound is the total amount of the photosensitive film, or Based on the total amount of the photosensitive resin composition (total solid content), 0.2% by mass or less, 0.15% by mass or less, less than 0.15% by mass, 0.1% by mass or less, or 0.01% by mass % or less.
- the photosensitive film and the photosensitive resin composition according to the present embodiment may not contain a bisphenol F-type (meth)acrylic acid compound (each content described above may be substantially 0% by mass), It may not contain a bisphenol F-type acrylic acid compound (each content described above may be substantially 0% by mass).
- the content of components other than the components (A) and (B) is 15 parts per 100 parts by mass of the component (B). It may be at least 19 parts by mass, at least 19 parts by mass, at least 20 parts by mass, at least 21 parts by mass, at least 22 parts by mass, or at least 23 parts by mass.
- the photosensitive film and photosensitive resin composition according to the present embodiment may not contain a polymer having a nitrogen-containing group (the content of the polymer having a nitrogen-containing group is the total amount of the photosensitive film, or It may be substantially 0% by mass based on the total amount (total solid content) of the photosensitive resin composition).
- the content of the acridine compound is the total amount of the photosensitive film or the total amount of the photosensitive resin composition (total solid content). may be 0.1% by mass or less, less than 0.1% by mass, 0.01% by mass or less, or 0.001% by mass or less.
- the photosensitive film and photosensitive resin composition according to the present embodiment may not contain an acridine compound (the above content may be substantially 0% by mass).
- a photosensitive element according to this embodiment includes a support and a photosensitive resin layer disposed on the support, and the photosensitive resin layer is the photosensitive film according to this embodiment.
- the photosensitive element according to this embodiment may comprise a protective layer disposed on the photosensitive resin layer.
- the photosensitive element according to this embodiment may comprise a cushion layer, an adhesive layer, a light absorbing layer, a gas barrier layer, and the like.
- the photosensitive element may be in the form of a sheet, or in the form of a photosensitive element roll wound around a core.
- FIG. 1 is a schematic cross-sectional view showing an example of a photosensitive element.
- the photosensitive element 1 includes a support (support film) 2, a photosensitive resin layer (photosensitive film) 3 disposed on the support 2, and a photosensitive resin layer 3 disposed on the and a protective layer (protective film) 4.
- the photosensitive resin layer 3 is made of the photosensitive resin composition according to this embodiment.
- the photosensitive element 1 can be obtained, for example, by the following procedure.
- the photosensitive resin layer 3 is formed on the support 2 .
- the photosensitive resin layer 3 can be formed, for example, by drying a coating layer formed by applying a photosensitive resin composition containing an organic solvent.
- a protective layer 4 is arranged on the photosensitive resin layer 3 .
- Each of the support and the protective layer may be a polymer film having heat resistance and solvent resistance, such as a polyester film (polyethylene terephthalate film, etc.), a polyolefin film (polyethylene film, polypropylene film, etc.), a hydrocarbon-based polymer (polyolefin film, etc.). excluding film).
- the type of film forming the protective layer and the type of film forming the support may be the same or different.
- the thickness of the support may be 1 ⁇ m or more, 5 ⁇ m or more, 10 ⁇ m or more, or 15 ⁇ m or more from the viewpoint of easily suppressing damage to the support when the support is peeled off from the photosensitive resin layer.
- the thickness of the support may be 100 ⁇ m or less, 50 ⁇ m or less, 30 ⁇ m or less, or 20 ⁇ m or less from the viewpoint of favorable exposure when exposed through the support.
- the thickness of the protective layer is 1 ⁇ m or more, 5 ⁇ m or more, 10 ⁇ m or more, or It may be 15 ⁇ m or more.
- the thickness of the protective layer may be 100 ⁇ m or less, 50 ⁇ m or less, or 30 ⁇ m or less from the viewpoint of easily improving productivity.
- the method for producing a laminate according to the present embodiment includes a photosensitive resin layer placement step of placing a photosensitive resin layer on a substrate (for example, a substrate) using the photosensitive element or the photosensitive resin composition according to the present embodiment.
- a metal layer forming step of forming a metal layer on at least part of a portion of the substrate where the cured product pattern is not formed.
- the laminate according to this embodiment is obtained by the method for producing a laminate according to this embodiment, and may be a wiring board (for example, a printed wiring board).
- the laminate according to the present embodiment includes a substrate, a cured product pattern (cured product according to the present embodiment) arranged on the substrate, and at least one part of the substrate where the cured product pattern is not formed. and a metal layer disposed on the part.
- a photosensitive resin layer made of the photosensitive resin composition according to the present embodiment is placed on the substrate.
- the photosensitive resin layer may be formed by removing the protective layer from the photosensitive element and pressing the photosensitive resin layer of the photosensitive element onto the substrate while heating. It may be formed by coating and drying on the material.
- an actinic ray is irradiated with a mask placed on the photosensitive resin layer, and a region other than the region where the mask is placed in the photosensitive resin layer may be exposed and photocured. Instead, a part of the photosensitive resin layer may be exposed and photocured by irradiating actinic rays in a desired pattern by a direct drawing exposure method such as an LDI exposure method or a DLP exposure method.
- an ultraviolet light source or a visible light source may be used, such as a carbon arc lamp, a mercury vapor arc lamp, a high-pressure mercury lamp, a xenon lamp, a gas laser (such as an argon laser), a solid-state laser (such as a YAG laser), a semiconductor laser, and the like. is mentioned.
- the development method in the development process may be, for example, wet development or dry development.
- Wet development can be carried out by using a developer corresponding to the photosensitive resin composition, for example, by dipping, puddle, spraying, brushing, slapping, scrubbing, rocking immersion, and the like.
- the developer is appropriately selected according to the constitution of the photosensitive resin composition, and may be an alkaline developer or an organic solvent developer.
- Alkaline developers include alkali hydroxides such as lithium, sodium or potassium hydroxide; alkali carbonates such as lithium, sodium, potassium or ammonium carbonates or bicarbonates; alkali metals such as potassium phosphate and sodium phosphate. Phosphates; alkali metal pyrophosphates such as sodium pyrophosphate and potassium pyrophosphate; borax; sodium metasilicate; tetramethylammonium hydroxide; ethanolamine; ethylenediamine; diethylenetriamine; It may be an aqueous solution containing a base such as 3-propanediol; 1,3-diamino-2-propanol; morpholine.
- alkali hydroxides such as lithium, sodium or potassium hydroxide
- alkali carbonates such as lithium, sodium, potassium or ammonium carbonates or bicarbonates
- alkali metals such as potassium phosphate and sodium phosphate.
- Phosphates alkali metal pyrophosphates such as sodium
- the organic solvent developer may contain organic solvents such as 1,1,1-trichloroethane, N-methylpyrrolidone, N,N-dimethylformamide, cyclohexanone, methylisobutylketone and ⁇ -butyrolactone.
- organic solvents such as 1,1,1-trichloroethane, N-methylpyrrolidone, N,N-dimethylformamide, cyclohexanone, methylisobutylketone and ⁇ -butyrolactone.
- the metal layer in the metal layer forming step may be, for example, a metal copper layer.
- the metal layer can be formed by plating, for example.
- the plating treatment may be one or both of electrolytic plating treatment and electroless plating treatment.
- the method for manufacturing a laminate according to the present embodiment includes a step of further curing the resist pattern by heating at 60 to 250° C. or exposing at 0.2 to 10 J/cm 2 after the developing step. you can
- the method for manufacturing a laminate according to this embodiment may include a step of removing the cured product pattern after the metal layer forming step.
- the cured product pattern can be removed by, for example, developing with a strong alkaline aqueous solution by an immersion method, a spray method, or the like.
- FIG. 2 is a schematic diagram showing an example of a method for manufacturing a laminate (method for manufacturing a wiring board).
- the conductor layer 10b may be, for example, a metallic copper layer.
- the photosensitive resin layer 12 is arranged on the conductor layer 10b of the substrate 10 (photosensitive resin layer arrangement step).
- the photosensitive resin layer arranging step the photosensitive resin layer 12 is arranged on the conductor layer 10b of the substrate 10 using the photosensitive element or the photosensitive resin composition according to this embodiment.
- actinic rays L are irradiated with the mask 14 placed on the photosensitive resin layer 12, and the area of the photosensitive resin layer 12 other than the area where the mask 14 is placed is exposed. is exposed to photocure.
- a resist pattern 12a made of (a cured product of a photosensitive resin layer) is formed.
- a wiring layer (metal layer) 16 is formed on a portion of the conductor layer 10b of the substrate 10 where the resist pattern 12a is not formed.
- the wiring layer 16 may be made of the same material as the conductor layer 10b, or may be made of a different material.
- the conductor layer 10c is formed by removing the resist pattern 12a and removing the conductor layer 10b provided at the position corresponding to the resist pattern 12a.
- the wiring substrate 18 including the conductor layer 10c and the wiring layer 16 arranged on the insulating layer 10a is obtained.
- the conductor layer 10b can be removed by an etching process.
- the etching solution is appropriately selected according to the type of the conductor layer 10b, and may be, for example, a cupric chloride solution, a ferric chloride solution, an alkaline etching solution, a hydrogen peroxide etching solution, or the like.
- Solution (a) by mixing 27 parts by mass of methacrylic acid, 3 parts by mass of 2-hydroxyethyl methacrylate, 20 parts by mass of benzyl methacrylate, 50 parts by mass of styrene, and 0.9 parts by mass of azobisisobutyronitrile was prepared.
- a solution (b) was prepared by dissolving 0.5 parts by mass of azobisisobutyronitrile in 50 parts by mass of a mixture of 30 parts by mass of methyl cellosolve and 20 parts by mass of toluene.
- the temperature of the solution in the flask was raised to 90°C over 30 minutes, and the temperature was maintained at 90°C for 2 hours, then stirring was stopped and the solution was cooled to room temperature (25°C) to obtain a binder polymer solution.
- the non-volatile content (solid content) of the binder polymer solution was 49% by mass.
- the acid value of the binder polymer was 176 mgKOH/g.
- the binder polymer had a weight average molecular weight (Mw) of 35,000 and a number average molecular weight (Mn) of 16,000.
- Mw weight average molecular weight
- Mn number average molecular weight
- the weight-average molecular weight and number-average molecular weight were measured by gel permeation chromatography (GPC) under the following conditions and derived by conversion using a standard polystyrene calibration curve.
- Example 2-4 A photosensitive resin composition was prepared in the same manner as in Example 1, except that the amount of sensitizing aid A used was changed to that shown in Table 1.
- Example 5 A photosensitive resin composition was prepared in the same manner as in Example 1 except that sensitizing aid A was changed to sensitizing aid B (1,4-dimethoxynaphthalene, Fujifilm Wako Pure Chemical Industries, Ltd.). .
- Example 7 0.650 parts by mass of sensitizer A1 and 0.234 parts by mass of sensitizer B1 (1-phenyl-3-(4-methoxystyryl)-5-(4-methoxyphenyl)-pyrazoline, Nippon Kagaku Co., Ltd.
- a photosensitive resin composition was prepared in the same manner as in Example 1, except that the resin was changed to PZ-501D manufactured by Kogyosho.
- Example 8 A photosensitive resin composition was prepared in the same manner as in Example 7, except that sensitizing aid A was changed to sensitizing aid B.
- Example 9 0.650 parts by weight of sensitizer A1 and 0.400 parts by weight of sensitizer B2 (4-[[3-(4-chlorophenyl)-4,5-dihydro-1H-pyrazol]-1-yl]benzene
- a photosensitive resin composition was prepared in the same manner as in Example 1, except that the sulfonamide was changed to Blankophor MAN 01) manufactured by Tanatex Chemicals Japan.
- Example 10 Same as Example 1 except that sensitizer A1 was changed to sensitizer C (4'-(2-cyanostyryl)-3-stilbenecarbonitrile, manufactured by BOC Sciences, trade name: Fluorescent Brightener ER-III)
- sensitizer C (4'-(2-cyanostyryl)-3-stilbenecarbonitrile, manufactured by BOC Sciences, trade name: Fluorescent Brightener ER-III)
- a photosensitive resin composition was prepared by performing the following.
- a polyethylene terephthalate film (manufactured by Toray Industries, Inc., trade name “FB-40”) having a thickness of 16 ⁇ m was prepared as a support. After coating the above-mentioned photosensitive resin composition on the support so that the thickness becomes uniform, the photosensitive resin composition is sequentially dried in a hot air convection dryer at 70° C. and 110° C. to obtain a photosensitive resin layer (photosensitive film. thickness after drying: 19 ⁇ m).
- a polyethylene film (manufactured by Tamapoly Co., Ltd., trade name "NF-15") was laminated as a protective layer to this photosensitive resin layer to obtain a photosensitive element comprising a support, a photosensitive resin layer and a protective layer in this order. .
- a copper clad laminate (substrate, manufactured by Showa Denko Materials Co., Ltd., trade name: MCL-E-67) provided with copper foil (thickness: 18 ⁇ m) arranged on both sides of a glass epoxy material is subjected to pickling and After washing with water, it was dried in an air stream.
- the photosensitive A laminate comprising a flexible resin layer and a support in this order was obtained.
- Lamination was performed using heat rolls at 110° C. at a pressure of 0.4 MPa and a roll speed of 1.5 m/min.
- the support was peeled off from the laminate to expose the photosensitive resin layer, and an unexposed area was removed by spraying a 1% by mass sodium carbonate aqueous solution at 30°C for twice the minimum development time. .
- the resolution was evaluated by Table 1 shows the results. A smaller value means better resolution.
- the above minimum development time was evaluated in advance by the following procedure. First, after cutting the laminate into a square (5 cm ⁇ 5 cm), the support was peeled off to obtain a test piece. Next, the unexposed photosensitive resin layer of the test piece was spray-developed at a pressure of 0.15 MPa using a 1% by weight aqueous sodium carbonate solution at 30° C. to confirm that the unexposed photosensitive resin layer was removed. The shortest visually identifiable time was taken as the minimum development time (MD). A full cone type nozzle was used. The distance between the test piece and the tip of the nozzle was 6 cm, and the test piece was arranged so that the center of the nozzle coincided with the center of the test piece.
- MD minimum development time
- the support was peeled off from the laminate to expose the photosensitive resin layer, and an unexposed area was removed by spraying a 1% by mass sodium carbonate aqueous solution at 30°C for twice the minimum development time. .
- the adhesion was evaluated by Table 1 shows the results. A smaller value means better adhesion.
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Abstract
Provided are: a photosensitive film containing (A) a binder polymer, (B) a photopolymerisable compound, (C) a photoinitiator, (D) at least one selected from the group consisting of an anthracene compound, a pyrazoline compound and a distrylbenzene compound, and (E) a naphthalene compound; a photosensitive element 1 comprising a support 2 and a photosensitive resin layer 3 placed on the support 2, the photosensitive resin layer 3 being said photosensitive film; and a laminate production method comprising a step for using the above-mentioned photosensitive film to place a photosensitive resin layer on a base material, a step for photocuring part of the photosensitive resin layer, a step for forming a cured pattern by removing at least part of the non-cured part of the photosensitive resin layer, and a step for forming a metal layer on at least part of a portion of the base material where the cured pattern was not formed.
Description
本開示は、感光性フィルム、感光性エレメント、積層体の製造方法等に関する。
The present disclosure relates to a photosensitive film, a photosensitive element, a laminate manufacturing method, and the like.
配線基板として用いることが可能な積層体の製造においては、所望の配線を得るためにレジストパターンが形成される。レジストパターンは、感光性樹脂組成物を用いて得られる感光性樹脂層を露光及び現像することにより形成することができる。感光性樹脂組成物としては、各種組成物が検討されている。例えば、下記特許文献１では、バインダーポリマーと、光重合性化合物と、特定の光重合開始剤と、を含有する感光性樹脂組成物が記載されている。感光性樹脂組成物をフィルム状に成形することにより感光性フィルムを得ることができる。
In manufacturing a laminate that can be used as a wiring board, a resist pattern is formed to obtain desired wiring. A resist pattern can be formed by exposing and developing a photosensitive resin layer obtained using a photosensitive resin composition. Various compositions have been studied as the photosensitive resin composition. For example, Patent Document 1 below describes a photosensitive resin composition containing a binder polymer, a photopolymerizable compound, and a specific photopolymerization initiator. A photosensitive film can be obtained by molding the photosensitive resin composition into a film.
感光性フィルム又は感光性樹脂組成物を用いて、レジストパターンとして用いることが可能な硬化物パターンを形成するに際して、直線状のライン部分と、ライン部分に隣接する直線状のスペース部分と、を有する硬化物パターンを形成する場合がある。そして、ライン部分の幅（ライン幅）よりもスペース部分の幅（スペース幅）が小さい硬化物パターンを形成する場合においてライン部分及びスペース部分が良好に形成される特性として、優れた解像性が求められる。また、スペース幅よりもライン幅が小さい硬化物パターンを形成する場合においてライン部分及びスペース部分が良好に形成される特性として、優れた密着性が求められる。
When forming a cured product pattern that can be used as a resist pattern using a photosensitive film or a photosensitive resin composition, it has linear line portions and linear space portions adjacent to the line portions. A cured product pattern may be formed. Then, when forming a cured product pattern in which the width of the space portion (space width) is smaller than the width of the line portion (line width), excellent resolution is a characteristic that the line portion and the space portion are formed well. Desired. Further, when forming a cured product pattern having a line width smaller than the space width, excellent adhesion is required as a characteristic for forming the line portions and the space portions satisfactorily.
本開示の一側面は、ライン幅よりもスペース幅が小さい硬化物パターンを形成する場合における優れた解像性、及び、スペース幅よりもライン幅が小さい硬化物パターンを形成する場合における優れた密着性を得ることが可能な感光性フィルムを提供することを目的とする。本開示の他の一側面は、当該感光性フィルムを用いた感光性エレメントを提供することを目的とする。本開示の他の一側面は、上述の感光性フィルムを用いた積層体の製造方法を提供することを目的とする。
One aspect of the present disclosure is excellent resolution when forming a cured product pattern with a smaller space width than the line width, and excellent adhesion when forming a cured product pattern with a smaller line width than the space width. It is an object of the present invention to provide a photosensitive film capable of obtaining properties. Another aspect of the present disclosure aims to provide a photosensitive element using the photosensitive film. Another aspect of the present disclosure aims to provide a method for producing a laminate using the photosensitive film described above.
本開示の一側面は、（Ａ）バインダーポリマーと、（Ｂ）光重合性化合物と、（Ｃ）光重合開始剤と、（Ｄ）アントラセン化合物、ピラゾリン化合物、及び、ジスチリルベンゼン化合物からなる群より選ばれる少なくとも一種と、（Ｅ）ナフタレン化合物と、を含有する、感光性フィルムに関する。
One aspect of the present disclosure is a group consisting of (A) a binder polymer, (B) a photopolymerizable compound, (C) a photoinitiator, and (D) an anthracene compound, a pyrazoline compound, and a distyrylbenzene compound. and (E) a naphthalene compound.
このような感光性フィルムによれば、ライン幅よりもスペース幅が小さい硬化物パターンを形成する場合における優れた解像性、及び、スペース幅よりもライン幅が小さい硬化物パターンを形成する場合における優れた密着性を得ることができる。
According to such a photosensitive film, when forming a cured product pattern with a space width smaller than the line width, excellent resolution, and when forming a cured product pattern with a line width smaller than the space width Excellent adhesion can be obtained.
本開示の他の一側面は、支持体と、当該支持体上に配置された感光性樹脂層と、を備え、前記感光性樹脂層が上述の感光性フィルムである、感光性エレメントに関する。
Another aspect of the present disclosure relates to a photosensitive element comprising a support and a photosensitive resin layer disposed on the support, wherein the photosensitive resin layer is the photosensitive film described above.
本開示の他の一側面は、上述の感光性フィルムを用いて感光性樹脂層を基材上に配置する工程と、前記感光性樹脂層の一部を光硬化させる工程と、前記感光性樹脂層の未硬化部の少なくとも一部を除去して硬化物パターンを形成する工程と、前記基材における前記硬化物パターンが形成されていない部分の少なくとも一部に金属層を形成する工程と、を備える、積層体の製造方法に関する。
Another aspect of the present disclosure includes a step of disposing a photosensitive resin layer on a substrate using the photosensitive film described above, a step of photocuring a part of the photosensitive resin layer, and a step of photocuring the photosensitive resin. a step of removing at least part of an uncured portion of the layer to form a cured product pattern; The present invention relates to a method for manufacturing a laminate.
本開示の一側面によれば、ライン幅よりもスペース幅が小さい硬化物パターンを形成する場合における優れた解像性、及び、スペース幅よりもライン幅が小さい硬化物パターンを形成する場合における優れた密着性を得ることが可能な感光性フィルムを提供することができる。本開示の他の一側面によれば、当該感光性フィルムを用いた感光性エレメントを提供することができる。本開示の他の一側面によれば、上述の感光性フィルムを用いた積層体の製造方法を提供することができる。
According to one aspect of the present disclosure, excellent resolution when forming a cured product pattern with a smaller space width than the line width, and excellent when forming a cured product pattern with a smaller line width than the space width It is possible to provide a photosensitive film capable of obtaining excellent adhesion. According to another aspect of the present disclosure, it is possible to provide a photosensitive element using the photosensitive film. According to another aspect of the present disclosure, it is possible to provide a method for manufacturing a laminate using the photosensitive film described above.
以下、本開示の実施形態について詳細に説明する。
Hereinafter, embodiments of the present disclosure will be described in detail.
本明細書において、「～」を用いて示された数値範囲は、「～」の前後に記載される数値をそれぞれ最小値及び最大値として含む範囲を示す。数値範囲の「Ａ以上」とは、Ａ、及び、Ａを超える範囲を意味する。数値範囲の「Ａ以下」とは、Ａ、及び、Ａ未満の範囲を意味する。本明細書に段階的に記載されている数値範囲において、ある段階の数値範囲の上限値又は下限値は、他の段階の数値範囲の上限値又は下限値と任意に組み合わせることができる。本明細書に記載されている数値範囲において、その数値範囲の上限値又は下限値は、実施例に示されている値に置き換えてよい。「Ａ又はＢ」とは、Ａ及びＢのどちらか一方を含んでいればよく、両方とも含んでいてもよい。本明細書に例示する材料は、特に断らない限り、１種を単独で又は２種以上を組み合わせて用いることができる。組成物中の各成分の含有量は、組成物中に各成分に該当する物質が複数存在する場合、特に断らない限り、組成物中に存在する当該複数の物質の合計量を意味する。「層」との語は、平面図として観察したときに、全面に形成されている形状の構造に加え、一部に形成されている形状の構造も包含される。「工程」との語は、独立した工程だけではなく、他の工程と明確に区別できない場合であってもその工程の所期の作用が達成されれば、本用語に含まれる。「（メタ）アクリレート」とは、アクリレート、及び、それに対応するメタクリレートの少なくとも一方を意味する。「（メタ）アクリル酸」等の他の類似の表現においても同様である。「アルキル基」は、特に断らない限り、直鎖状、分岐又は環状のいずれであってもよい。
In this specification, a numerical range indicated using "-" indicates a range that includes the numerical values before and after "-" as the minimum and maximum values, respectively. "A or more" in a numerical range means A and a range exceeding A. "A or less" in a numerical range means A and a range less than A. In the numerical ranges described stepwise in this specification, the upper limit value or lower limit value of the numerical range in one step can be arbitrarily combined with the upper limit value or lower limit of the numerical range in another step. In the numerical ranges described herein, the upper or lower limits of the numerical ranges may be replaced with the values shown in the examples. "A or B" may include either A or B, or may include both. The materials exemplified in this specification can be used singly or in combination of two or more unless otherwise specified. The content of each component in the composition means the total amount of the plurality of substances present in the composition unless otherwise specified when there are multiple substances corresponding to each component in the composition. The term "layer" includes not only a shape structure formed over the entire surface but also a shape structure formed partially when observed as a plan view. The term "process" is included in the term not only as an independent process, but also as long as the intended action of the process is achieved even if it is not clearly distinguishable from other processes. "(Meth)acrylate" means at least one of acrylate and its corresponding methacrylate. The same applies to other similar expressions such as "(meth)acrylic acid". An "alkyl group" may be linear, branched or cyclic, unless otherwise specified.
本明細書において、感光性樹脂組成物の固形分は、感光性樹脂組成物において、揮発する物質（水、溶媒等）を除いた不揮発分を指す。すなわち、当該固形分は、感光性樹脂組成物の乾燥において揮発せずに残る成分（溶媒以外の成分）を指し、室温（２５℃）で液状、水飴状又はワックス状の成分も含む。
In this specification, the solid content of the photosensitive resin composition refers to the non-volatile content excluding volatile substances (water, solvent, etc.) in the photosensitive resin composition. That is, the solid content refers to the components (components other than the solvent) that remain without volatilizing when the photosensitive resin composition dries, and includes components that are liquid, starch syrup-like, or wax-like at room temperature (25°C).
＜感光性フィルム、感光性樹脂組成物及び硬化物＞
本実施形態に係る感光性フィルム及び感光性樹脂組成物は、（Ａ）バインダーポリマーと、（Ｂ）光重合性化合物と、（Ｃ）光重合開始剤と、（Ｄ）アントラセン化合物、ピラゾリン化合物、及び、ジスチリルベンゼン化合物からなる群より選ばれる少なくとも一種と、（Ｅ）ナフタレン化合物と、を含有する。本実施形態に係る感光性フィルムは、本実施形態に係る感光性樹脂組成物をフィルム状に成形することにより得ることができる。 <Photosensitive film, photosensitive resin composition and cured product>
The photosensitive film and photosensitive resin composition according to the present embodiment include (A) a binder polymer, (B) a photopolymerizable compound, (C) a photopolymerization initiator, (D) an anthracene compound, a pyrazoline compound, and at least one selected from the group consisting of distyrylbenzene compounds, and (E) a naphthalene compound. The photosensitive film according to this embodiment can be obtained by molding the photosensitive resin composition according to this embodiment into a film.
本実施形態に係る感光性フィルム及び感光性樹脂組成物は、（Ａ）バインダーポリマーと、（Ｂ）光重合性化合物と、（Ｃ）光重合開始剤と、（Ｄ）アントラセン化合物、ピラゾリン化合物、及び、ジスチリルベンゼン化合物からなる群より選ばれる少なくとも一種と、（Ｅ）ナフタレン化合物と、を含有する。本実施形態に係る感光性フィルムは、本実施形態に係る感光性樹脂組成物をフィルム状に成形することにより得ることができる。 <Photosensitive film, photosensitive resin composition and cured product>
The photosensitive film and photosensitive resin composition according to the present embodiment include (A) a binder polymer, (B) a photopolymerizable compound, (C) a photopolymerization initiator, (D) an anthracene compound, a pyrazoline compound, and at least one selected from the group consisting of distyrylbenzene compounds, and (E) a naphthalene compound. The photosensitive film according to this embodiment can be obtained by molding the photosensitive resin composition according to this embodiment into a film.
本実施形態に係る感光性フィルム及び感光性樹脂組成物によれば、ライン幅よりもスペース幅が小さい硬化物パターンを形成する場合における優れた解像性、及び、スペース幅よりもライン幅が小さい硬化物パターンを形成する場合における優れた密着性を得ることができる。本実施形態に係る感光性フィルム及び感光性樹脂組成物によれば、実施例に記載の評価において、例えば、１３μｍ以下の解像性を得ることができると共に、３μｍ以下の密着性を得ることができる。本実施形態に係る感光性フィルム及び感光性樹脂組成物により得ることが可能な硬化物パターンの形状は、特に限られない。
According to the photosensitive film and the photosensitive resin composition according to the present embodiment, excellent resolution when forming a cured product pattern having a space width smaller than the line width, and a line width smaller than the space width Excellent adhesion can be obtained when forming a cured product pattern. According to the photosensitive film and the photosensitive resin composition according to the present embodiment, in the evaluation described in the Examples, for example, it is possible to obtain a resolution of 13 μm or less and an adhesion of 3 μm or less. can. The shape of the cured product pattern that can be obtained from the photosensitive film and the photosensitive resin composition according to this embodiment is not particularly limited.
本実施形態に係る感光性フィルム及び感光性樹脂組成物により優れた解像性及び密着性が得られる要因について、本発明者は下記のとおり推測している。但し、要因は下記の内容に限定されない。すなわち、（Ａ）成分、（Ｂ）成分及び（Ｃ）成分を併用するに際して（Ｄ）成分を用いることにより、（Ｄ）成分が良好に光吸収し充分量のエネルギーを（Ｃ）成分に供給するため感光性を良好に発現することができる（例えば、露光部において充分量のラジカルが発生すると共に未露光部へのラジカルの拡散が抑制されることにより感光性を良好に発現することができる）。また、（Ｅ）成分を用いることにより、（Ｄ）成分のこのような作用を増強することができる。そのため、優れた解像性及び密着性が得られる。
The present inventors presume as follows about the factors by which the photosensitive film and the photosensitive resin composition according to the present embodiment provide excellent resolution and adhesion. However, the factors are not limited to the following contents. That is, by using component (D) when component (A), component (B) and component (C) are used in combination, component (D) satisfactorily absorbs light and supplies a sufficient amount of energy to component (C). Therefore, good photosensitivity can be expressed (for example, good photosensitivity can be expressed by generating a sufficient amount of radicals in the exposed area and suppressing the diffusion of radicals to the unexposed area. ). Moreover, by using the (E) component, such action of the (D) component can be enhanced. Therefore, excellent resolution and adhesion can be obtained.
本実施形態に係る感光性フィルム及び感光性樹脂組成物によれば、活性光線に対する優れた感度を得ることもできる。本実施形態に係る感光性フィルム及び感光性樹脂組成物によれば、実施例に記載の評価において、例えば１０８ｍＪ／ｃｍ２以下の露光量を得ることができる。
According to the photosensitive film and the photosensitive resin composition according to this embodiment, excellent sensitivity to actinic rays can also be obtained. According to the photosensitive film and the photosensitive resin composition according to the present embodiment, an exposure dose of, for example, 108 mJ/cm 2 or less can be obtained in the evaluations described in the Examples.
本実施形態に係る感光性フィルム及び感光性樹脂組成物は、光硬化性を有し、当該感光性フィルム又は感光性樹脂組成物を光硬化することで硬化物を得ることができる。本実施形態に係る硬化物は、本実施形態に係る感光性フィルム又は感光性樹脂組成物の硬化物（光硬化物）である。本実施形態に係る硬化物は、パターン状（硬化物パターン）であってよく、レジストパターンであってよい。
The photosensitive film and photosensitive resin composition according to the present embodiment are photocurable, and a cured product can be obtained by photocuring the photosensitive film or photosensitive resin composition. The cured product according to this embodiment is a cured product (photocured product) of the photosensitive film or photosensitive resin composition according to this embodiment. The cured product according to the present embodiment may be patterned (cured product pattern) or may be a resist pattern.
本実施形態に係る感光性フィルム及び硬化物の厚さは、充分な厚さの配線を得るためのレジストパターンを得やすい観点から、１μｍ以上、３μｍ以上、５μｍ以上、７μｍ以上、１０μｍ以上、１５μｍ以上、１８μｍ以上、又は、１９μｍ以上であってよい。本実施形態に係る感光性フィルム及び硬化物の厚さは、優れた解像性及び密着性を得やすい観点から、１００μｍ以下、５０μｍ以下、４０μｍ以下、３０μｍ以下、２５μｍ以下、２０μｍ以下、又は、１９μｍ以下であってよい。これらの観点から、本実施形態に係る感光性フィルム及び硬化物の厚さは、１～１００μｍ、５～１００μｍ、又は、１５～２５μｍであってよい。
The thickness of the photosensitive film and the cured product according to the present embodiment is 1 μm or more, 3 μm or more, 5 μm or more, 7 μm or more, 10 μm or more, 15 μm or more, from the viewpoint of easily obtaining a resist pattern for obtaining wiring with a sufficient thickness. Above, it may be 18 μm or more, or 19 μm or more. The thickness of the photosensitive film and the cured product according to the present embodiment is 100 μm or less, 50 μm or less, 40 μm or less, 30 μm or less, 25 μm or less, 20 μm or less, or, from the viewpoint of easily obtaining excellent resolution and adhesion. It may be 19 μm or less. From these viewpoints, the thickness of the photosensitive film and the cured product according to this embodiment may be 1 to 100 μm, 5 to 100 μm, or 15 to 25 μm.
本実施形態に係る感光性フィルム及び感光性樹脂組成物において感光性が発現する波長は特に限定されない。本実施形態に係る感光性フィルム及び感光性樹脂組成物は、例えば、３００ｎｍ以上、３４０ｎｍ以上、３５０ｎｍ以上、３５５ｎｍ以上、３６５ｎｍ以上、３７５ｎｍ以上、３９０ｎｍ以上、３９５ｎｍ以上、又は、４０５ｎｍ以上の波長の光に対する感光性を有してよい。本実施形態に係る感光性フィルム及び感光性樹脂組成物は、例えば、５００ｎｍ以下、４４０ｎｍ以下、４４０ｎｍ未満、４３６ｎｍ以下、４２０ｎｍ以下、４１０ｎｍ以下、又は、４０５ｎｍ以下の波長の光に対する感光性を有してよい。後述の露光工程においては、これらの波長の範囲内にピークを有する活性光線を用いることができる。本実施形態に係る感光性フィルム及び感光性樹脂組成物は、例えば、ネガ型の感光性フィルム及び感光性樹脂組成物として用いることができる。
The wavelength at which photosensitivity is exhibited in the photosensitive film and photosensitive resin composition according to the present embodiment is not particularly limited. The photosensitive film and the photosensitive resin composition according to the present embodiment are, for example, light having a wavelength of 300 nm or more, 340 nm or more, 350 nm or more, 355 nm or more, 365 nm or more, 375 nm or more, 390 nm or more, 395 nm or more, or 405 nm or more. may be sensitive to The photosensitive film and photosensitive resin composition according to the present embodiment have photosensitivity to light having a wavelength of, for example, 500 nm or less, 440 nm or less, less than 440 nm, 436 nm or less, 420 nm or less, 410 nm or less, or 405 nm or less. you can Actinic rays having peaks within these wavelength ranges can be used in the exposure step described later. The photosensitive film and photosensitive resin composition according to the present embodiment can be used, for example, as a negative photosensitive film and photosensitive resin composition.
本実施形態に係る感光性フィルム及び感光性樹脂組成物における波長４０５ｎｍの光に対する吸光度（例えば、厚さ１９μｍの場合の吸光度）は、下記の範囲であってよい。波長４０５ｎｍの光に対する吸光度は、０を超えてよく、０．０１以上、０．０５以上、０．１以上、０．１５以上、０．２以上、０．２５以上、０．２７以上、又は、０．３以上であってよい。波長４０５ｎｍの光に対する吸光度は、０．５以下、０．４５以下、０．４以下、０．３５以下、０．３以下、又は、０．２７以下であってよい。これらの観点から、波長４０５ｎｍの光に対する吸光度は、０を超え０．５以下であってよい。
The absorbance for light with a wavelength of 405 nm in the photosensitive film and the photosensitive resin composition according to the present embodiment (for example, the absorbance at a thickness of 19 μm) may be within the following range. The absorbance for light with a wavelength of 405 nm may exceed 0, 0.01 or more, 0.05 or more, 0.1 or more, 0.15 or more, 0.2 or more, 0.25 or more, 0.27 or more, or , 0.3 or more. The absorbance for light with a wavelength of 405 nm may be 0.5 or less, 0.45 or less, 0.4 or less, 0.35 or less, 0.3 or less, or 0.27 or less. From these points of view, the absorbance for light with a wavelength of 405 nm may be greater than 0 and 0.5 or less.
本実施形態によれば、硬化物パターン（例えばレジストパターン）の形成への感光性樹脂組成物、感光性フィルム又は感光性エレメントの応用を提供することができる。本開示の他の一側面によれば、配線基板の製造への感光性樹脂組成物、感光性フィルム又は感光性エレメントの応用を提供することができる。
According to this embodiment, application of the photosensitive resin composition, photosensitive film, or photosensitive element to the formation of a cured product pattern (eg, resist pattern) can be provided. According to another aspect of the present disclosure, application of the photosensitive resin composition, photosensitive film, or photosensitive element to the production of wiring boards can be provided.
本実施形態に係る感光性フィルム及び感光性樹脂組成物は、（Ａ）成分としてバインダーポリマーを含有する。（Ａ）成分としては、アクリル系樹脂、スチレン系樹脂、エポキシ系樹脂、アミド系樹脂、アミドエポキシ系樹脂、アルキド系樹脂、フェノール系樹脂等が挙げられる。アクリル系樹脂は、（メタ）アクリロイル基を有する化合物（（メタ）アクリル酸化合物）を単量体単位として有する樹脂であり、当該単量体単位を有するスチレン系樹脂、エポキシ系樹脂、アミド系樹脂、アミドエポキシ系樹脂、アルキド系樹脂及びフェノール系樹脂はアクリル系樹脂に帰属する。（Ａ）成分は、フェノール性水酸基を有さないバインダーポリマーを含んでよく、フェノール性水酸基を有するバインダーポリマーを含まなくてよい。（Ａ）成分は、エポキシ基を有さないバインダーポリマーを含んでよく、エポキシ基を有するバインダーポリマーを含まなくてよい。
The photosensitive film and photosensitive resin composition according to this embodiment contain a binder polymer as the (A) component. Component (A) includes acrylic resins, styrene resins, epoxy resins, amide resins, amide epoxy resins, alkyd resins, phenol resins, and the like. Acrylic resins are resins having a compound ((meth)acrylic acid compound) having a (meth)acryloyl group as a monomer unit, and styrene resins, epoxy resins, and amide resins having the monomer units. , amidoepoxy resins, alkyd resins and phenolic resins belong to acrylic resins. The component (A) may contain a binder polymer having no phenolic hydroxyl group, or may not contain a binder polymer having a phenolic hydroxyl group. The component (A) may contain a binder polymer that does not have an epoxy group, or may not contain a binder polymer that has an epoxy group.
（Ａ）成分は、優れた解像性及び密着性を得やすい観点から、アクリル系樹脂を含んでよい。アクリル系樹脂の含有量は、優れた解像性及び密着性を得やすい観点から、（Ａ）成分の全質量を基準として、５０質量％以上、５０質量％超、７０質量％以上、９０質量％以上、９５質量％以上、９８質量％以上、９９質量％以上、又は、実質的に１００質量％（（Ａ）成分が実質的にアクリル系樹脂からなる態様）であってよい。
The (A) component may contain an acrylic resin from the viewpoint of easily obtaining excellent resolution and adhesion. From the viewpoint of easily obtaining excellent resolution and adhesion, the content of the acrylic resin is 50% by mass or more, more than 50% by mass, 70% by mass or more, and 90% by mass, based on the total mass of component (A). % or more, 95% by mass or more, 98% by mass or more, 99% by mass or more, or substantially 100% by mass (an aspect in which component (A) is substantially composed of an acrylic resin).
（メタ）アクリロイル基を有する化合物としては、（メタ）アクリル酸、（メタ）アクリル酸エステル等が挙げられる。（メタ）アクリル酸エステルとしては、（メタ）アクリル酸アルキル（（メタ）アクリル酸アルキルエステル。（メタ）アクリル酸シクロアルキルに該当する化合物を除く）、（メタ）アクリル酸シクロアルキル（（メタ）アクリル酸シクロアルキルエステル）、（メタ）アクリル酸アリール（（メタ）アクリル酸アリールエステル）、（メタ）アクリルアミド化合物（ジアセトンアクリルアミド等）、（メタ）アクリル酸グリシジルエステル、スチリル（メタ）アクリル酸などが挙げられる。
Examples of compounds having a (meth)acryloyl group include (meth)acrylic acid and (meth)acrylic acid esters. (Meth)acrylates include alkyl (meth)acrylates (alkyl (meth)acrylates; excluding compounds corresponding to cycloalkyl (meth)acrylates), cycloalkyl (meth)acrylates ((meth) cycloalkyl acrylate), aryl (meth)acrylate (aryl (meth)acrylate), (meth)acrylamide compounds (diacetone acrylamide, etc.), glycidyl (meth)acrylate, styryl (meth)acrylic acid, etc. is mentioned.
（Ａ）成分は、優れた解像性及び密着性を得やすい観点から、（メタ）アクリル酸を単量体単位として有してよい。（Ａ）成分が（メタ）アクリル酸を単量体単位として有する場合、（メタ）アクリル酸の単量体単位の含有量は、優れた解像性及び密着性を得やすい観点から、（Ａ）成分を構成する単量体単位の全量を基準として下記の範囲であってよい。（メタ）アクリル酸の単量体単位の含有量は、１質量％以上、５質量％以上、１０質量％以上、１５質量％以上、２０質量％以上、又は、２５質量％以上であってよい。（メタ）アクリル酸の単量体単位の含有量は、５０質量％以下、５０質量％未満、４５質量％以下、４０質量％以下、３５質量％以下、又は、３０質量％以下であってよい。これらの観点から、（メタ）アクリル酸の単量体単位の含有量は、１～５０質量％であってよい。
The (A) component may have (meth)acrylic acid as a monomer unit from the viewpoint of easily obtaining excellent resolution and adhesion. (A) When the component has (meth) acrylic acid as a monomer unit, the content of the monomer unit of (meth) acrylic acid is, from the viewpoint of easily obtaining excellent resolution and adhesion, (A ) It may be in the following ranges based on the total amount of the monomer units constituting the component. The content of (meth)acrylic acid monomer units may be 1% by mass or more, 5% by mass or more, 10% by mass or more, 15% by mass or more, 20% by mass or more, or 25% by mass or more. . The content of the monomer units of (meth)acrylic acid may be 50% by mass or less, less than 50% by mass, 45% by mass or less, 40% by mass or less, 35% by mass or less, or 30% by mass or less. . From these points of view, the content of the (meth)acrylic acid monomer unit may be 1 to 50% by mass.
（Ａ）成分は、優れた解像性及び密着性を得やすい観点から、（メタ）アクリル酸アルキルを単量体単位として有してよい。（メタ）アクリル酸アルキルのアルキル基としては、メチル基、エチル基、プロピル基、ブチル基、ペンチル基、ヘキシル基、ヘプチル基、オクチル基、ノニル基、デシル基、ウンデシル基、ドデシル基等が挙げられ、アルキル基は、各種構造異性体であってよい。（メタ）アクリル酸アルキルのアルキル基の炭素数は、優れた解像性及び密着性を得やすい観点から、１～４、１～３、２～３、又は、１～２であってよい。
The (A) component may have an alkyl (meth)acrylate as a monomer unit from the viewpoint of easily obtaining excellent resolution and adhesion. Examples of the alkyl group of alkyl (meth)acrylate include methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, heptyl group, octyl group, nonyl group, decyl group, undecyl group and dodecyl group. and the alkyl groups may be of various structural isomers. The number of carbon atoms in the alkyl group of the alkyl (meth)acrylate may be 1 to 4, 1 to 3, 2 to 3, or 1 to 2 from the viewpoint of easily obtaining excellent resolution and adhesion.
（メタ）アクリル酸アルキルのアルキル基は、置換基を有してよい。置換基としては、ヒドロキシ基、カルボキシ基、カルボン酸塩基、アルデヒド基、アルコキシ基（無置換のアルコキシ基（酸素原子に結合した無置換のアルキル基を有する構造）、又は、置換アルコキシ基（ヒドロキシアルコキシ基等））、カルボニル基、アルコキシカルボニル基、アルカノイル基（炭素数２～１２のアルカノイル基等）、オキシカルボニル基、カルボニルオキシ基、アミノ基、エポキシ基、フリル基、シアノ基、ハロゲノ基（フルオロ基、クロロ基、ブロモ基等）、ニトロ基、アセチル基、スルホニル基、スルホンアミド基などが挙げられる。（メタ）アクリル酸アルキルとしては、（メタ）アクリル酸ジメチルアミノエチル、（メタ）アクリル酸ジエチルアミノエチル、（メタ）アクリル酸２，２，２－トリフルオロエチル、（メタ）アクリル酸２，２，３，３－テトラフルオロプロピル、α－クロロ（メタ）アクリル酸、α－ブロモ（メタ）アクリル酸等が挙げられる。
The alkyl group of the alkyl (meth)acrylate may have a substituent. Substituents include a hydroxy group, a carboxy group, a carboxylic acid group, an aldehyde group, an alkoxy group (unsubstituted alkoxy group (structure having an unsubstituted alkyl group bonded to an oxygen atom), or a substituted alkoxy group (hydroxyalkoxy group, etc.)), carbonyl group, alkoxycarbonyl group, alkanoyl group (alkanoyl group having 2 to 12 carbon atoms, etc.), oxycarbonyl group, carbonyloxy group, amino group, epoxy group, furyl group, cyano group, halogeno group (fluoro group, chloro group, bromo group, etc.), nitro group, acetyl group, sulfonyl group, sulfonamide group and the like. Examples of alkyl (meth)acrylates include dimethylaminoethyl (meth)acrylate, diethylaminoethyl (meth)acrylate, 2,2,2-trifluoroethyl (meth)acrylate, 2,2-(meth)acrylate, 3,3-tetrafluoropropyl, α-chloro(meth)acrylic acid, α-bromo(meth)acrylic acid and the like.
（Ａ）成分は、優れた解像性及び密着性を得やすい観点から、（メタ）アクリル酸ヒドロキシアルキルを単量体単位として有してよい。（メタ）アクリル酸ヒドロキシアルキルとしては、（メタ）アクリル酸ヒドロキシメチル、（メタ）アクリル酸ヒドロキシエチル、（メタ）アクリル酸ヒドロキシプロピル、（メタ）アクリル酸ヒドロキシブチル、（メタ）アクリル酸ヒドロキシペンチル、（メタ）アクリル酸ヒドロキシヘキシル等が挙げられる。
The (A) component may have hydroxyalkyl (meth)acrylate as a monomer unit from the viewpoint of easily obtaining excellent resolution and adhesion. Hydroxyalkyl (meth)acrylates include hydroxymethyl (meth)acrylate, hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, hydroxybutyl (meth)acrylate, hydroxypentyl (meth)acrylate, Hydroxyhexyl (meth)acrylate and the like can be mentioned.
（Ａ）成分が（メタ）アクリル酸アルキルを単量体単位として有する場合における（メタ）アクリル酸アルキルの単量体単位の含有量、又は、（Ａ）成分が（メタ）アクリル酸ヒドロキシアルキルを単量体単位として有する場合における（メタ）アクリル酸ヒドロキシアルキルの単量体単位の含有量は、優れた解像性及び密着性を得やすい観点から、（Ａ）成分を構成する単量体単位の全量を基準として下記の範囲であってよい。上述の単量体単位の含有量は、０．１質量％以上、０．５質量％以上、１質量％以上、２質量％以上、又は、３質量％以上であってよい。上述の単量体単位の含有量は、２０質量％以下、１５質量％以下、１０質量％以下、８質量％以下、５質量％以下、又は、３質量％以下であってよい。これらの観点から、上述の単量体単位の含有量は、０．１～２０質量％であってよい。
(A) content of alkyl (meth)acrylate monomer units when component (A) has alkyl (meth)acrylate as a monomer unit, or component (A) contains hydroxyalkyl (meth)acrylate The content of the monomer unit of hydroxyalkyl (meth)acrylate in the case of having it as a monomer unit is the monomer unit constituting component (A) from the viewpoint of easily obtaining excellent resolution and adhesion. It may be in the following range based on the total amount of. The content of the monomer units described above may be 0.1% by mass or more, 0.5% by mass or more, 1% by mass or more, 2% by mass or more, or 3% by mass or more. The content of the above monomer units may be 20% by mass or less, 15% by mass or less, 10% by mass or less, 8% by mass or less, 5% by mass or less, or 3% by mass or less. From these points of view, the content of the above monomer units may be 0.1 to 20% by mass.
（Ａ）成分は、優れた解像性及び密着性を得やすい観点から、（メタ）アクリル酸アリールを単量体単位として有してよい。（メタ）アクリル酸アリールとしては、（メタ）アクリル酸ベンジル、（メタ）アクリル酸フェニル、（メタ）アクリル酸ナフチル等が挙げられる。
The (A) component may have an aryl (meth)acrylate as a monomer unit from the viewpoint of easily obtaining excellent resolution and adhesion. Aryl (meth)acrylates include benzyl (meth)acrylate, phenyl (meth)acrylate, and naphthyl (meth)acrylate.
（Ａ）成分が（メタ）アクリル酸アリールを単量体単位として有する場合、（メタ）アクリル酸アリールの単量体単位の含有量は、優れた解像性及び密着性を得やすい観点から、（Ａ）成分を構成する単量体単位の全量を基準として下記の範囲であってよい。（メタ）アクリル酸アリールの単量体単位の含有量は、１質量％以上、５質量％以上、１０質量％以上、１５質量％以上、又は、２０質量％以上であってよい。（メタ）アクリル酸アリールの単量体単位の含有量は、５０質量％以下、５０質量％未満、４５質量％以下、４０質量％以下、３５質量％以下、３０質量％以下、２５質量％以下、又は、２０質量％以下であってよい。これらの観点から、（メタ）アクリル酸アリールの単量体単位の含有量は、１～５０質量％であってよい。
When the component (A) has an aryl (meth)acrylate as a monomer unit, the content of the monomer unit of the aryl (meth)acrylate is Based on the total amount of the monomer units constituting component (A), the following ranges may be used. The content of the monomer units of the aryl (meth)acrylate may be 1% by mass or more, 5% by mass or more, 10% by mass or more, 15% by mass or more, or 20% by mass or more. The content of the monomer unit of the aryl (meth)acrylate is 50% by mass or less, less than 50% by mass, 45% by mass or less, 40% by mass or less, 35% by mass or less, 30% by mass or less, and 25% by mass or less. , or 20% by mass or less. From these viewpoints, the content of the monomer units of the aryl (meth)acrylate may be 1 to 50% by mass.
（Ａ）成分は、優れた解像性及び密着性を得やすい観点から、スチレン化合物（（メタ）アクリロイル基を有する化合物を除く）を単量体単位として有してよい。スチレン化合物としては、スチレン、スチレン誘導体等が挙げられる。スチレン誘導体は、ビニルトルエン、α－メチルスチレン等が挙げられる。（Ａ）成分は、優れた解像性及び密着性を得やすい観点から、（メタ）アクリル酸及びスチレン化合物を単量体単位として有してよく、（メタ）アクリル酸ヒドロキシアルキル及びスチレン化合物を単量体単位として有してよく、（メタ）アクリル酸アリール及びスチレン化合物を単量体単位として有してよい。
The (A) component may have a styrene compound (excluding compounds having a (meth)acryloyl group) as a monomer unit from the viewpoint of easily obtaining excellent resolution and adhesion. Styrene compounds include styrene and styrene derivatives. Examples of styrene derivatives include vinyltoluene and α-methylstyrene. Component (A) may have (meth)acrylic acid and a styrene compound as monomer units from the viewpoint of easily obtaining excellent resolution and adhesion. It may have as a monomer unit, and may have an aryl (meth)acrylate and a styrene compound as a monomer unit.
（Ａ）成分がスチレン化合物を単量体単位として有する場合、スチレン化合物の単量体単位の含有量は、優れた解像性及び密着性を得やすい観点から、（Ａ）成分を構成する単量体単位の全量を基準として下記の範囲であってよい。スチレン化合物の単量体単位の含有量は、１０質量％以上、１０質量％超、１５質量％以上、１５質量％超、２０質量％以上、２０質量％超、２５質量％以上、２５質量％超、３０質量％以上、３０質量％超、３５質量％以上、３５質量％超、４０質量％以上、４０質量％超、４５質量％以上、４５質量％超、４７質量％以上、又は、５０質量％以上であってよい。スチレン化合物の単量体単位の含有量は、９０質量％以下、８５質量％以下、８０質量％以下、７５質量％以下、７０質量％以下、６５質量％以下、６０質量％以下、５５質量％以下、又は、５０質量％以下であってよい。これらの観点から、スチレン化合物の単量体単位の含有量は、１０～９０質量％であってよい。
When component (A) has a styrene compound as a monomer unit, the content of the monomer unit of the styrene compound should be It may be in the following ranges based on the total amount of the mer units. The content of the monomer unit of the styrene compound is 10% by mass or more, 10% by mass or more, 15% by mass or more, 15% by mass or more, 20% by mass or more, 20% by mass or more, 25% by mass or more, and 25% by mass. more than 30% by mass, more than 30% by mass, more than 35% by mass, more than 35% by mass, more than 40% by mass, more than 40% by mass, more than 45% by mass, more than 45% by mass, more than 47% by mass, or 50 % by mass or more. The content of the monomer unit of the styrene compound is 90% by mass or less, 85% by mass or less, 80% by mass or less, 75% by mass or less, 70% by mass or less, 65% by mass or less, 60% by mass or less, and 55% by mass. or less, or 50% by mass or less. From these points of view, the content of monomer units in the styrene compound may be 10 to 90% by mass.
（Ａ）成分がスチレン化合物を単量体単位として有する場合、スチレン化合物の単量体単位の含有量は、優れた解像性及び密着性を得やすい観点から、（Ａ）成分を構成する単量体単位の全量を基準として下記の範囲であってよい。スチレン化合物の単量体単位の含有量は、１０ｍｏｌ％以上、１０ｍｏｌ％超、１５ｍｏｌ％以上、２０ｍｏｌ％以上、２０ｍｏｌ％超、２５ｍｏｌ％以上、３０ｍｏｌ％以上、３０ｍｏｌ％超、３５ｍｏｌ％以上、４０ｍｏｌ％以上、４０ｍｏｌ％超、４５ｍｏｌ％以上、５０ｍｏｌ％以上、又は、５０ｍｏｌ％超であってよい。スチレン化合物の単量体単位の含有量は、９０ｍｏｌ％以下、８５ｍｏｌ％以下、８０ｍｏｌ％以下、７５ｍｏｌ％以下、７０ｍｏｌ％以下、６５ｍｏｌ％以下、６０ｍｏｌ％以下、又は、５５ｍｏｌ％以下であってよい。これらの観点から、スチレン化合物の単量体単位の含有量は、１０～９０ｍｏｌ％であってよい。
When component (A) has a styrene compound as a monomer unit, the content of the monomer unit of the styrene compound should be It may be in the following ranges based on the total amount of the mer units. The content of the monomer unit of the styrene compound is 10 mol% or more, 10 mol% or more, 15 mol% or more, 20 mol% or more, 20 mol% or more, 25 mol% or more, 30 mol% or more, 30 mol% or more, 35 mol% or more, 40 mol%. Above, it may be more than 40 mol %, 45 mol % or more, 50 mol % or more, or more than 50 mol %. The monomer unit content of the styrene compound may be 90 mol% or less, 85 mol% or less, 80 mol% or less, 75 mol% or less, 70 mol% or less, 65 mol% or less, 60 mol% or less, or 55 mol% or less. From these points of view, the content of monomer units in the styrene compound may be 10 to 90 mol %.
（Ａ）成分は、その他の単量体を単量体単位として有してよい。このような単量体としては、ビニルアルコールのエーテル類（ビニル－ｎ－ブチルエーテル等）、（メタ）アクリロニトリル、マレイン酸、マレイン酸無水物、マレイン酸モノエステル（マレイン酸モノメチル、マレイン酸モノエチル、マレイン酸モノイソプロピル等）、フマール酸、ケイ皮酸、α－シアノケイ皮酸、イタコン酸、クロトン酸、プロピオール酸などが挙げられる。
The (A) component may have other monomers as monomer units. Such monomers include vinyl alcohol ethers (vinyl-n-butyl ether, etc.), (meth)acrylonitrile, maleic acid, maleic anhydride, maleic acid monoesters (monomethyl maleate, monoethyl maleate, maleic monoisopropyl acid, etc.), fumaric acid, cinnamic acid, α-cyanocinnamic acid, itaconic acid, crotonic acid, propiolic acid and the like.
（Ａ）成分は、含窒素基を有さないバインダーポリマーを含んでよく、含窒素基を有するバインダーポリマー（例えば、含窒素基を有する化合物を単量体単位として有するバインダーポリマー）を含まなくてよい。（Ａ）成分において、含窒素基を有する化合物の単量体単位の含有量は、（Ａ）成分を構成する単量体単位の全量を基準として、１ｍｏｌ％以下、１ｍｏｌ％未満、０．１ｍｏｌ％以下、又は、０．０１ｍｏｌ％以下であってよい。
Component (A) may contain a binder polymer having no nitrogen-containing group, and does not contain a binder polymer having a nitrogen-containing group (for example, a binder polymer having a compound having a nitrogen-containing group as a monomer unit). good. In component (A), the content of the monomer units of the compound having a nitrogen-containing group is 1 mol% or less, less than 1 mol%, or 0.1 mol, based on the total amount of the monomer units constituting component (A). % or less, or 0.01 mol % or less.
（Ａ）成分の酸価は、優れた解像性及び密着性を得やすい観点から、下記の範囲であってよい。（Ａ）成分の酸価は、８０ｍｇＫＯＨ／ｇ以上、９０ｍｇＫＯＨ／ｇ以上、１００ｍｇＫＯＨ／ｇ以上、１００ｍｇＫＯＨ／ｇ超、１２０ｍｇＫＯＨ／ｇ以上、１４０ｍｇＫＯＨ／ｇ以上、１５０ｍｇＫＯＨ／ｇ以上、１６０ｍｇＫＯＨ／ｇ以上、又は、１７０ｍｇＫＯＨ／ｇ以上であってよい。（Ａ）成分の酸価は、２５０ｍｇＫＯＨ／ｇ以下、２４０ｍｇＫＯＨ／ｇ以下、２３０ｍｇＫＯＨ／ｇ以下、２１０ｍｇＫＯＨ／ｇ以下、２００ｍｇＫＯＨ／ｇ以下、又は、１８０ｍｇＫＯＨ／ｇ以下であってよい。これらの観点から、（Ａ）成分の酸価は、８０～２５０ｍｇＫＯＨ／ｇであってよい。（Ａ）成分の酸価は、（Ａ）成分を構成する単量体単位（例えば（メタ）アクリル酸の単量体単位）の含有量により調整できる。（Ａ）成分の酸価は、実施例に記載の方法で測定することができる。
The acid value of component (A) may be within the following range from the viewpoint of easily obtaining excellent resolution and adhesion. The acid value of component (A) is 80 mgKOH/g or more, 90 mgKOH/g or more, 100 mgKOH/g or more, 100 mgKOH/g or more, 120 mgKOH/g or more, 140 mgKOH/g or more, 150 mgKOH/g or more, 160 mgKOH/g or more, or , 170 mg KOH/g or more. The acid value of component (A) may be 250 mgKOH/g or less, 240 mgKOH/g or less, 230 mgKOH/g or less, 210 mgKOH/g or less, 200 mgKOH/g or less, or 180 mgKOH/g or less. From these points of view, the component (A) may have an acid value of 80 to 250 mgKOH/g. The acid value of component (A) can be adjusted by adjusting the content of the monomer units (for example, the monomer units of (meth)acrylic acid) constituting component (A). The acid value of component (A) can be measured by the method described in Examples.
（Ａ）成分の重量平均分子量（Ｍｗ）は、優れた解像性及び密着性を得やすい観点から、下記の範囲であってよい。（Ａ）成分の重量平均分子量は、１００００以上、２００００以上、２５０００以上、３００００以上、又は、３５０００以上であってよい。（Ａ）成分の重量平均分子量は、１０００００以下、８００００以下、７００００以下、７００００未満、６５０００以下、６００００以下、５００００以下、４００００以下、又は、３５０００以下であってよい。これらの観点から、（Ａ）成分の重量平均分子量は、１００００～１０００００、２００００～５００００、又は、３００００～４００００であってよい。
The weight average molecular weight (Mw) of component (A) may be within the following range from the viewpoint of easily obtaining excellent resolution and adhesion. The weight average molecular weight of component (A) may be 10,000 or more, 20,000 or more, 25,000 or more, 30,000 or more, or 35,000 or more. The weight average molecular weight of component (A) may be 100,000 or less, 80,000 or less, 70,000 or less, less than 70,000, 65,000 or less, 60,000 or less, 50,000 or less, 40,000 or less, or 35,000 or less. From these viewpoints, the weight average molecular weight of component (A) may be 10,000 to 100,000, 20,000 to 50,000, or 30,000 to 40,000.
（Ａ）成分の数平均分子量（Ｍｎ）は、優れた解像性及び密着性を得やすい観点から、下記の範囲であってよい。（Ａ）成分の数平均分子量は、５０００以上、１００００以上、１２０００以上、１５０００以上、又は、１６０００以上であってよい。（Ａ）成分の数平均分子量は、５００００以下、４００００以下、３５０００以下、３００００以下、２５０００以下、２００００以下、又は、１６０００以下であってよい。これらの観点から、（Ａ）成分の数平均分子量は、５０００～５００００、１００００～２５０００、又は、１５０００～２００００であってよい。
The number average molecular weight (Mn) of component (A) may be within the following range from the viewpoint of easily obtaining excellent resolution and adhesion. Component (A) may have a number average molecular weight of 5,000 or more, 10,000 or more, 12,000 or more, 15,000 or more, or 16,000 or more. The number average molecular weight of component (A) may be 50,000 or less, 40,000 or less, 35,000 or less, 30,000 or less, 25,000 or less, 20,000 or less, or 16,000 or less. From these viewpoints, the number average molecular weight of component (A) may be 5,000 to 50,000, 10,000 to 25,000, or 15,000 to 20,000.
（Ａ）成分の分散度（重量平均分子量／数平均分子量）は、優れた解像性及び密着性を得やすい観点から、下記の範囲であってよい。（Ａ）成分の分散度は、１．０以上、１．５以上、１．８以上、２．０以上、又は、２．１以上であってよい。（Ａ）成分の分散度は、３．０以下、２．８以下、２．５以下、２．３以下、又は、２．２以下であってよい。これらの観点から、（Ａ）成分の分散度は、１．０～３．０であってよい。
The degree of dispersion (weight average molecular weight/number average molecular weight) of component (A) may be within the following range from the viewpoint of easily obtaining excellent resolution and adhesion. Component (A) may have a dispersity of 1.0 or more, 1.5 or more, 1.8 or more, 2.0 or more, or 2.1 or more. Component (A) may have a dispersity of 3.0 or less, 2.8 or less, 2.5 or less, 2.3 or less, or 2.2 or less. From these points of view, the component (A) may have a dispersity of 1.0 to 3.0.
重量平均分子量及び数平均分子量は、例えば、ゲルパーミエーションクロマトグラフィー（ＧＰＣ）により標準ポリスチレンの検量線を用いて測定することができる。より具体的には、実施例に記載の条件で測定することができる。分子量の低い化合物について、上述の重量平均分子量及び数平均分子量の測定方法で測定困難な場合には、他の方法で分子量を測定し、その平均値を算出することもできる。
The weight average molecular weight and number average molecular weight can be measured, for example, by gel permeation chromatography (GPC) using a standard polystyrene calibration curve. More specifically, it can be measured under the conditions described in Examples. If it is difficult to measure a compound having a low molecular weight by the above weight average molecular weight and number average molecular weight measurement methods, the molecular weight can be measured by another method and the average value can be calculated.
（Ａ）成分の含有量は、感光性フィルムの全量、又は、感光性樹脂組成物の全量（固形分全量）を基準として下記の範囲であってよい。（Ａ）成分の含有量は、優れた解像性及び密着性を得やすい観点、並びに、フィルムの成形性に優れる観点から、１０質量％以上、２０質量％以上、３０質量％以上、４０質量％以上、４５質量％以上、又は、５０質量％以上であってよい。（Ａ）成分の含有量は、優れた解像性及び密着性を得やすい観点から、９０質量％以下、８０質量％以下、７５質量％以下、７０質量％以下、６５質量％以下、６０質量％以下、又は、５５質量％以下であってよい。これらの観点から、（Ａ）成分の含有量は、１０～９０質量％であってよい。
The content of component (A) may be within the following range based on the total amount of the photosensitive film or the total amount of the photosensitive resin composition (total solid content). The content of component (A) is 10% by mass or more, 20% by mass or more, 30% by mass or more, and 40% by mass from the viewpoint of easily obtaining excellent resolution and adhesion, and from the viewpoint of excellent film formability. % or more, 45 mass % or more, or 50 mass % or more. The content of component (A) is 90% by mass or less, 80% by mass or less, 75% by mass or less, 70% by mass or less, 65% by mass or less, or 60% by mass, from the viewpoint of easily obtaining excellent resolution and adhesion. % or less, or 55% by mass or less. From these points of view, the content of component (A) may be 10 to 90% by mass.
（Ａ）成分の含有量は、（Ａ）成分及び（Ｂ）成分の総量１００質量部に対して下記の範囲であってよい。（Ａ）成分の含有量は、優れた解像性及び密着性を得やすい観点、並びに、フィルムの成形性に優れる観点から、１０質量部以上、２０質量部以上、３０質量部以上、４０質量部以上、４５質量部以上、５０質量部以上、又は、５５質量部以上であってよい。（Ａ）成分の含有量は、優れた解像性及び密着性を得やすい観点から、９０質量部以下、８０質量部以下、７５質量部以下、７０質量部以下、６５質量部以下、又は、６０質量部以下であってよい。これらの観点から、（Ａ）成分の含有量は、１０～９０質量部、又は、４０～７０質量部であってよい。
The content of component (A) may be within the following range with respect to the total amount of 100 parts by mass of components (A) and (B). The content of component (A) is 10 parts by mass or more, 20 parts by mass or more, 30 parts by mass or more, and 40 parts by mass from the viewpoint of easily obtaining excellent resolution and adhesion and from the viewpoint of excellent film formability. parts or more, 45 parts by mass or more, 50 parts by mass or more, or 55 parts by mass or more. The content of component (A) is 90 parts by mass or less, 80 parts by mass or less, 75 parts by mass or less, 70 parts by mass or less, 65 parts by mass or less, or It may be 60 parts by mass or less. From these viewpoints, the content of component (A) may be 10 to 90 parts by mass, or 40 to 70 parts by mass.
本実施形態に係る感光性フィルム及び感光性樹脂組成物は、（Ｂ）成分として光重合性化合物（アントラセン化合物、ピラゾリン化合物、ジスチリルベンゼン化合物、又は、ナフタレン化合物に該当する化合物を除く）を含有する。光重合性化合物は、光により重合する化合物である。（Ｂ）成分は、エチレン性不飽和結合を有する化合物であってよく、（メタ）アクリロイル基を有する化合物（（メタ）アクリル酸化合物）であってよい。
The photosensitive film and photosensitive resin composition according to the present embodiment contain a photopolymerizable compound (excluding anthracene compound, pyrazoline compound, distyrylbenzene compound, or naphthalene compound) as component (B). do. A photopolymerizable compound is a compound that is polymerized by light. The component (B) may be a compound having an ethylenically unsaturated bond and may be a compound ((meth)acrylic acid compound) having a (meth)acryloyl group.
（Ｂ）成分としては、ビスフェノールＡ型（メタ）アクリル酸化合物、ＥＯ変性ジ（メタ）アクリレート、ＰＯ変性ジ（メタ）アクリレート、ＥＯ・ＰＯ変性ジ（メタ）アクリレート、ポリアルキレングリコールジ（メタ）アクリレート（ポリエチレングリコールジ（メタ）アクリレート、ポリプロピレングリコールジ（メタ）アクリレート等）、ＥＯ変性ポリアルキレングリコールジ（メタ）アクリレート、ＰＯ変性ポリアルキレングリコールジ（メタ）アクリレート、ＥＯ・ＰＯ変性ポリアルキレングリコールジ（メタ）アクリレート、トリメチロールプロパンジ（メタ）アクリレート、トリメチロールプロパントリ（メタ）アクリレート、ＥＯ変性トリメチロールプロパントリ（メタ）アクリレート、ＰＯ変性トリメチロールプロパントリ（メタ）アクリレート、ＥＯ・ＰＯ変性トリメチロールプロパントリ（メタ）アクリレート、テトラメチロールメタントリ（メタ）アクリレート、テトラメチロールメタンテトラ（メタ）アクリレート、ＥＯ変性ペンタエリスリトールテトラ（メタ）アクリレート、ＰＯ変性ペンタエリスリトールテトラ（メタ）アクリレート、ＥＯ・ＰＯ変性ペンタエリスリトールテトラ（メタ）アクリレート、ＥＯ変性ジペンタエリスリトールヘキサ（メタ）アクリレート、ＰＯ変性ジペンタエリスリトールヘキサ（メタ）アクリレート、ＥＯ・ＰＯ変性ジペンタエリスリトールヘキサ（メタ）アクリレート、ノニルフェノキシポリエチレンオキシアクリレート、フタル酸系化合物、（メタ）アクリル酸アルキル、分子内に少なくとも１つのカチオン重合可能な環状エーテル基を有する光重合性化合物（オキセタン化合物等）などが挙げられる。「ＥＯ変性」とは、（ポリ）オキシエチレン基を有する化合物であることを意味する。「ＰＯ変性」とは、（ポリ）オキシプロピレン基を有する化合物であることを意味する。「ＥＯ・ＰＯ変性」とは、（ポリ）オキシエチレン基及び／又は（ポリ）オキシプロピレン基を有する化合物であることを意味する。
Component (B) includes bisphenol A type (meth)acrylic acid compound, EO-modified di(meth)acrylate, PO-modified di(meth)acrylate, EO/PO-modified di(meth)acrylate, polyalkylene glycol di(meth) Acrylates (polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, etc.), EO-modified polyalkylene glycol di(meth)acrylate, PO-modified polyalkylene glycol di(meth)acrylate, EO/PO-modified polyalkylene glycol di(meth)acrylate (Meth)acrylate, trimethylolpropane di(meth)acrylate, trimethylolpropane tri(meth)acrylate, EO-modified trimethylolpropane tri(meth)acrylate, PO-modified trimethylolpropane tri(meth)acrylate, EO/PO-modified tri Methylolpropane tri(meth)acrylate, tetramethylolmethane tri(meth)acrylate, tetramethylolmethane tetra(meth)acrylate, EO-modified pentaerythritol tetra(meth)acrylate, PO-modified pentaerythritol tetra(meth)acrylate, EO/PO-modified Pentaerythritol tetra(meth)acrylate, EO-modified dipentaerythritol hexa(meth)acrylate, PO-modified dipentaerythritol hexa(meth)acrylate, EO/PO-modified dipentaerythritol hexa(meth)acrylate, nonylphenoxypolyethyleneoxyacrylate, phthalate Acid compounds, alkyl (meth)acrylates, photopolymerizable compounds (oxetane compounds, etc.) having at least one cationically polymerizable cyclic ether group in the molecule, and the like. "EO-modified" means a compound having a (poly)oxyethylene group. "PO-modified" means a compound having a (poly)oxypropylene group. "EO/PO-modified" means a compound having a (poly)oxyethylene group and/or a (poly)oxypropylene group.
（Ｂ）成分は、優れた解像性及び密着性を得やすい観点から、オキシエチレン基の構造単位数が下記の範囲である（ポリ）オキシエチレン基を有する光重合性化合物（例えば、（ポリ）オキシエチレン基を有する（メタ）アクリル酸化合物）を含んでよい。オキシエチレン基の構造単位数は、１以上、２以上、３以上、４以上、４超、５以上、６以上、８以上、又は、１０以上であってよい。オキシエチレン基の構造単位数は、２０以下、１８以下、１６以下、１４以下、１２以下、１０以下、８以下、６以下、５以下、４以下、４未満、又は、３以下であってよい。これらの観点から、オキシエチレン基の構造単位数は、１～２０、２～１８、４～１６、又は、６～１０であってよい。上述のオキシエチレン基の構造単位数は、光重合性化合物に含まれる（ポリ）オキシエチレン基におけるオキシエチレン基の構造単位の総数である。例えば、光重合性化合物が二つの（ポリ）オキシエチレン基を有する場合、上述のオキシエチレン基の構造単位数は、一の（ポリ）オキシエチレン基におけるオキシエチレン基の構造単位数、及び、他の（ポリ）オキシエチレン基におけるオキシエチレン基の構造単位数の合計を対象とする。
Component (B) is a photopolymerizable compound having a (poly)oxyethylene group (for example, (poly ) a (meth)acrylic acid compound having an oxyethylene group). The number of structural units of the oxyethylene group may be 1 or more, 2 or more, 3 or more, 4 or more, more than 4, 5 or more, 6 or more, 8 or more, or 10 or more. The number of structural units of the oxyethylene group may be 20 or less, 18 or less, 16 or less, 14 or less, 12 or less, 10 or less, 8 or less, 6 or less, 5 or less, 4 or less, 4 or less, or 3 or less. . From these viewpoints, the number of structural units of the oxyethylene group may be 1-20, 2-18, 4-16, or 6-10. The above number of structural units of oxyethylene groups is the total number of structural units of oxyethylene groups in the (poly)oxyethylene groups contained in the photopolymerizable compound. For example, when the photopolymerizable compound has two (poly)oxyethylene groups, the number of structural units of the oxyethylene group is the number of structural units of the oxyethylene group in one (poly)oxyethylene group, and the number of structural units of the oxyethylene group in one (poly)oxyethylene group. The total number of structural units of the oxyethylene group in the (poly)oxyethylene group of
（Ｂ）成分は、優れた解像性及び密着性を得やすい観点から、ビスフェノールＡ型（メタ）アクリル酸化合物を含んでよい。ビスフェノールＡ型（メタ）アクリル酸化合物としては、２，２－ビス（４－（（メタ）アクリロキシポリエトキシ）フェニル）プロパン（２，２－ビス（４－（（メタ）アクリロキシペンタエトキシ）フェニル）プロパン等）、２，２－ビス（４－（（メタ）アクリロキシポリプロポキシ）フェニル）プロパン、２，２－ビス（４－（（メタ）アクリロキシポリブトキシ）フェニル）プロパン、２，２－ビス（４－（（メタ）アクリロキシポリエトキシポリプロポキシ）フェニル）プロパンなどが挙げられる。（Ｂ）成分は、優れた解像性及び密着性を得やすい観点から、２，２－ビス（４－（（メタ）アクリロキシポリエトキシ）フェニル）プロパンを含んでよく、２，２－ビス（４－（（メタ）アクリロキシペンタエトキシ）フェニル）プロパンを含んでよい。
The (B) component may contain a bisphenol A type (meth)acrylic acid compound from the viewpoint of easily obtaining excellent resolution and adhesion. As the bisphenol A type (meth)acrylic acid compound, 2,2-bis(4-((meth)acryloxypolyethoxy)phenyl)propane (2,2-bis(4-((meth)acryloxypentaethoxy) phenyl)propane, etc.), 2,2-bis(4-((meth)acryloxypolypropoxy)phenyl)propane, 2,2-bis(4-((meth)acryloxypolybutoxy)phenyl)propane, 2, 2-bis(4-((meth)acryloxypolyethoxypolypropoxy)phenyl)propane and the like. Component (B) may contain 2,2-bis(4-((meth)acryloxypolyethoxy)phenyl)propane from the viewpoint of easily obtaining excellent resolution and adhesion. (4-((meth)acryloxypentaethoxy)phenyl)propane may be included.
ビスフェノールＡ型（メタ）アクリル酸化合物の分子量は、優れた解像性及び密着性を得やすい観点から、下記の範囲であってよい。分子量は、１００以上、２００以上、３００以上、４００以上、４５０以上、５００以上、６００以上、７００以上、又は、８００以上であってよい。分子量は、１００００以下、１００００未満、８０００以下、６０００以下、５０００以下、３０００以下、２０００以下、１５００以下、１０００以下、９００以下、８００以下、７００以下、６００以下、又は、５００以下であってよい。これらの観点から、分子量は、１００～１００００であってよい。
The molecular weight of the bisphenol A type (meth)acrylic acid compound may be within the following range from the viewpoint of easily obtaining excellent resolution and adhesion. The molecular weight may be 100 or greater, 200 or greater, 300 or greater, 400 or greater, 450 or greater, 500 or greater, 600 or greater, 700 or greater, or 800 or greater. The molecular weight may be 10000 or less, less than 10000, 8000 or less, 6000 or less, 5000 or less, 3000 or less, 2000 or less, 1500 or less, 1000 or less, 900 or less, 800 or less, 700 or less, 600 or less, or 500 or less. . From these points of view, the molecular weight may range from 100 to 10,000.
ビスフェノールＡ型（メタ）アクリル酸化合物の含有量は、優れた解像性及び密着性を得やすい観点から、（Ｂ）成分の全質量を基準として下記の範囲であってよい。ビスフェノールＡ型（メタ）アクリル酸化合物の含有量は、５０質量％以上、５０質量％超、６０質量％以上、７０質量％以上、８０質量％以上、８５質量％以上、又は、９０質量％以上であってよい。ビスフェノールＡ型（メタ）アクリル酸化合物の含有量は、１００質量％以下であり、１００質量％未満、９９質量％以下、９８質量％以下、９７質量％以下、９５質量％以下、９２質量％以下、又は、９１質量％以下であってよい。これらの観点から、ビスフェノールＡ型（メタ）アクリル酸化合物の含有量は、５０～１００質量％であってよい。
From the viewpoint of easily obtaining excellent resolution and adhesion, the content of the bisphenol A type (meth)acrylic acid compound may be within the following ranges based on the total mass of component (B). The content of the bisphenol A type (meth)acrylic acid compound is 50% by mass or more, 50% by mass or more, 60% by mass or more, 70% by mass or more, 80% by mass or more, 85% by mass or more, or 90% by mass or more. can be The content of the bisphenol A type (meth)acrylic acid compound is 100% by mass or less, less than 100% by mass, 99% by mass or less, 98% by mass or less, 97% by mass or less, 95% by mass or less, and 92% by mass or less. , or 91% by mass or less. From these points of view, the content of the bisphenol A type (meth)acrylic acid compound may be 50 to 100% by mass.
ビスフェノールＡ型（メタ）アクリル酸化合物の含有量は、優れた解像性及び密着性を得やすい観点から、（Ａ）成分及び（Ｂ）成分の総量１００質量部に対して下記の範囲であってよい。ビスフェノールＡ型（メタ）アクリル酸化合物の含有量は、１質量部以上、５質量部以上、１０質量部以上、２０質量部以上、３０質量部以上、又は、４０質量部以上であってよい。ビスフェノールＡ型（メタ）アクリル酸化合物の含有量は、１００質量部未満、９０質量部以下、８０質量部以下、７０質量部以下、６０質量部以下、５０質量部以下、又は、４０質量部以下であってよい。これらの観点から、ビスフェノールＡ型（メタ）アクリル酸化合物の含有量は、１質量部以上１００質量部未満であってよい。
The content of the bisphenol A type (meth)acrylic acid compound is within the following range with respect to 100 parts by mass of the total amount of components (A) and (B), from the viewpoint of easily obtaining excellent resolution and adhesion. you can The content of the bisphenol A type (meth)acrylic acid compound may be 1 part by mass or more, 5 parts by mass or more, 10 parts by mass or more, 20 parts by mass or more, 30 parts by mass or more, or 40 parts by mass or more. The content of the bisphenol A type (meth)acrylic acid compound is less than 100 parts by mass, 90 parts by mass or less, 80 parts by mass or less, 70 parts by mass or less, 60 parts by mass or less, 50 parts by mass or less, or 40 parts by mass or less. can be From these points of view, the content of the bisphenol A type (meth)acrylic acid compound may be 1 part by mass or more and less than 100 parts by mass.
（Ｂ）成分は、優れた解像性及び密着性を得やすい観点から、ポリオキシアルキレン基（２以上のアルキレン基がエーテル結合で連結した基）を有する（メタ）アクリル酸化合物（ビスフェノールＡ型（メタ）アクリル酸化合物に該当する化合物を除く）を含んでよく、ポリオキシエチレン基及びポリオキシプロピレン基からなる群より選ばれる少なくとも一種を有する（メタ）アクリル酸化合物（ビスフェノールＡ型（メタ）アクリル酸化合物に該当する化合物を除く）を含んでよい。
Component (B) is a (meth)acrylic acid compound (bisphenol A type (Meth)acrylic acid compound (excluding compounds corresponding to acrylic acid compounds) and having at least one selected from the group consisting of polyoxyethylene groups and polyoxypropylene groups (meth)acrylic acid compounds (bisphenol A type (meth) excluding compounds corresponding to acrylic acid compounds).
ポリオキシアルキレン基を有する（メタ）アクリル酸化合物の分子量は、優れた解像性及び密着性を得やすい観点から、下記の範囲であってよい。分子量は、１００以上、２００以上、３００以上、４００以上、５００以上、６００以上、７００以上、８００以上、９００以上、１０００以上、又は、１１００以上であってよい。分子量は、１００００以下、１００００未満、８０００以下、６０００以下、５０００以下、３０００以下、２０００以下、１５００以下、又は、１２００以下であってよい。これらの観点から、分子量は、１００～１００００であってよい。
The molecular weight of the (meth)acrylic acid compound having a polyoxyalkylene group may be within the following range from the viewpoint of easily obtaining excellent resolution and adhesion. The molecular weight may be 100 or greater, 200 or greater, 300 or greater, 400 or greater, 500 or greater, 600 or greater, 700 or greater, 800 or greater, 900 or greater, 1000 or greater, or 1100 or greater. The molecular weight may be 10,000 or less, less than 10,000, 8,000 or less, 6,000 or less, 5,000 or less, 3,000 or less, 2,000 or less, 1,500 or less, or 1,200 or less. From these points of view, the molecular weight may range from 100 to 10,000.
ポリオキシアルキレン基を有する（メタ）アクリル酸化合物の含有量は、優れた解像性及び密着性を得やすい観点から、（Ｂ）成分の全質量を基準として下記の範囲であってよい。ポリオキシアルキレン基を有する（メタ）アクリル酸化合物の含有量は、０質量％を超えてよく、１質量％以上、２質量％以上、３質量％以上、５質量％以上、８質量％以上、又は、９質量％以上であってよい。ポリオキシアルキレン基を有する（メタ）アクリル酸化合物の含有量は、５０質量％以下、５０質量％未満、４０質量％以下、３０質量％以下、２０質量％以下、１５質量％以下、又は、１０質量％以下であってよい。これらの観点から、ポリオキシアルキレン基を有する（メタ）アクリル酸化合物の含有量は、０質量％を超え５０質量％以下であってよい。
From the viewpoint of easily obtaining excellent resolution and adhesion, the content of the (meth)acrylic acid compound having a polyoxyalkylene group may be within the following ranges based on the total mass of component (B). The content of the (meth)acrylic acid compound having a polyoxyalkylene group may exceed 0% by mass, 1% by mass or more, 2% by mass or more, 3% by mass or more, 5% by mass or more, 8% by mass or more, Alternatively, it may be 9% by mass or more. The content of the (meth)acrylic acid compound having a polyoxyalkylene group is 50% by mass or less, less than 50% by mass, 40% by mass or less, 30% by mass or less, 20% by mass or less, 15% by mass or less, or 10 % by mass or less. From these points of view, the content of the (meth)acrylic acid compound having a polyoxyalkylene group may be more than 0% by mass and 50% by mass or less.
ポリオキシアルキレン基を有する（メタ）アクリル酸化合物の含有量は、優れた解像性及び密着性を得やすい観点から、（Ａ）成分及び（Ｂ）成分の総量１００質量部に対して下記の範囲であってよい。ポリオキシアルキレン基を有する（メタ）アクリル酸化合物の含有量は、０．１質量部以上、０．５質量部以上、１質量部以上、２質量部以上、３質量部以上、又は、４質量部以上であってよい。ポリオキシアルキレン基を有する（メタ）アクリル酸化合物の含有量は、５０質量部以下、３０質量部以下、１０質量部以下、８質量部以下、６質量部以下、５質量部以下、５質量部未満、又は、４質量部以下であってよい。これらの観点から、ポリオキシアルキレン基を有する（メタ）アクリル酸化合物の含有量は、０．１～５０質量部であってよい。
From the viewpoint of easily obtaining excellent resolution and adhesion, the content of the (meth)acrylic acid compound having a polyoxyalkylene group is the following per 100 parts by mass of the total amount of components (A) and (B). can be a range. The content of the (meth)acrylic acid compound having a polyoxyalkylene group is 0.1 parts by mass or more, 0.5 parts by mass or more, 1 part by mass or more, 2 parts by mass or more, 3 parts by mass or more, or 4 parts by mass It may be more than part. The content of the (meth)acrylic acid compound having a polyoxyalkylene group is 50 parts by mass or less, 30 parts by mass or less, 10 parts by mass or less, 8 parts by mass or less, 6 parts by mass or less, 5 parts by mass or less, and 5 parts by mass. It may be less than or 4 parts by mass or less. From these viewpoints, the content of the (meth)acrylic acid compound having a polyoxyalkylene group may be 0.1 to 50 parts by mass.
（Ｂ）成分が、ビスフェノールＡ型（メタ）アクリル酸化合物と、ポリオキシアルキレン基を有する（メタ）アクリル酸化合物と、を含む場合、ビスフェノールＡ型（メタ）アクリル酸化合物の含有量は、優れた解像性及び密着性を得やすい観点から、ポリオキシアルキレン基を有する（メタ）アクリル酸化合物１００質量部に対して下記の範囲であってよい。ビスフェノールＡ型（メタ）アクリル酸化合物の含有量は、１質量部以上、２質量部以上、３質量部以上、５質量部以上、８質量部以上、又は、１０質量部以上であってよい。ビスフェノールＡ型（メタ）アクリル酸化合物の含有量は、１００質量部以下、１００質量部未満、８０質量部以下、５０質量部以下、３０質量部以下、２０質量部以下、又は、１０質量部以下であってよい。これらの観点から、ビスフェノールＡ型（メタ）アクリル酸化合物の含有量は、１～１００質量部であってよい。
When the component (B) contains a bisphenol A type (meth)acrylic acid compound and a (meth)acrylic acid compound having a polyoxyalkylene group, the content of the bisphenol A type (meth)acrylic acid compound is excellent. From the viewpoint of easily obtaining good resolution and adhesion, the amount may be in the following range with respect to 100 parts by mass of the (meth)acrylic acid compound having a polyoxyalkylene group. The content of the bisphenol A type (meth)acrylic acid compound may be 1 part by mass or more, 2 parts by mass or more, 3 parts by mass or more, 5 parts by mass or more, 8 parts by mass or more, or 10 parts by mass or more. The content of the bisphenol A type (meth)acrylic acid compound is 100 parts by mass or less, less than 100 parts by mass, 80 parts by mass or less, 50 parts by mass or less, 30 parts by mass or less, 20 parts by mass or less, or 10 parts by mass or less. can be From these points of view, the content of the bisphenol A type (meth)acrylic acid compound may be 1 to 100 parts by mass.
（Ｂ）成分の含有量は、優れた解像性及び密着性を得やすい観点から、感光性フィルムの全量、又は、感光性樹脂組成物の全量（固形分全量）を基準として下記の範囲であってよい。（Ｂ）成分の含有量は、１０質量％以上、１５質量％以上、２０質量％以上、２５質量％以上、３０質量％以上、３５質量％以上、又は、４０質量％以上であってよい。（Ｂ）成分の含有量は、９０質量％以下、８０質量％以下、７０質量％以下、６５質量％以下、６０質量％以下、５５質量％以下、５０質量％以下、又は、４５質量％以下であってよい。これらの観点から、（Ｂ）成分の含有量は、１０～９０質量％であってよい。
From the viewpoint of easily obtaining excellent resolution and adhesion, the content of component (B) is within the following range based on the total amount of the photosensitive film or the total amount of the photosensitive resin composition (total solid content). It's okay. The content of component (B) may be 10% by mass or more, 15% by mass or more, 20% by mass or more, 25% by mass or more, 30% by mass or more, 35% by mass or more, or 40% by mass or more. The content of component (B) is 90% by mass or less, 80% by mass or less, 70% by mass or less, 65% by mass or less, 60% by mass or less, 55% by mass or less, 50% by mass or less, or 45% by mass or less. can be From these viewpoints, the content of component (B) may be 10 to 90% by mass.
（Ｂ）成分の含有量は、優れた解像性及び密着性を得やすい観点から、（Ａ）成分及び（Ｂ）成分の総量１００質量部に対して下記の範囲であってよい。（Ｂ）成分の含有量は、１０質量部以上、２０質量部以上、２５質量部以上、３０質量部以上、３５質量部以上、又は、４０質量部以上であってよい。（Ｂ）成分の含有量は、９０質量部以下、８０質量部以下、７０質量部以下、６０質量部以下、５５質量部以下、５０質量部以下、又は、４５質量部以下であってよい。これらの観点から、（Ｂ）成分の含有量は、１０～９０質量部、又は、３０～６０質量部であってよい。
From the viewpoint of easily obtaining excellent resolution and adhesion, the content of component (B) may be within the following range with respect to the total amount of 100 parts by mass of components (A) and (B). The content of component (B) may be 10 parts by mass or more, 20 parts by mass or more, 25 parts by mass or more, 30 parts by mass or more, 35 parts by mass or more, or 40 parts by mass or more. The content of component (B) may be 90 parts by mass or less, 80 parts by mass or less, 70 parts by mass or less, 60 parts by mass or less, 55 parts by mass or less, 50 parts by mass or less, or 45 parts by mass or less. From these viewpoints, the content of component (B) may be 10 to 90 parts by mass, or 30 to 60 parts by mass.
本実施形態に係る感光性フィルム及び感光性樹脂組成物は、（Ｃ）成分として光重合開始剤（アントラセン化合物、ピラゾリン化合物、ジスチリルベンゼン化合物、又は、ナフタレン化合物に該当する化合物を除く）を含有する。
The photosensitive film and photosensitive resin composition according to the present embodiment contain a photopolymerization initiator (excluding anthracene compound, pyrazoline compound, distyrylbenzene compound, or naphthalene compound) as component (C). do.
（Ｃ）成分としては、ヘキサアリールビイミダゾール化合物；ベンゾフェノン、２－ベンジル－２－ジメチルアミノ－１－（４－モルホリノフェニル）－１－ブタノン、２－（ジメチルアミノ）－２－［（４－メチルフェニル）メチル］－１－［４－（４－モルホリニル）フェニル］－１－ブタノン、４－（２－ヒドロキシエトキシ）フェニル－２－（ヒドロキシ－２－プロピル）ケトン、２－メチル－１－［４－（メチルチオ）フェニル］－２－モルホリノ－プロパノン－１等の芳香族ケトン；アルキルアントラキノン等のキノン化合物；ベンゾインアルキルエーテル等のベンゾインエーテル化合物；ベンゾイン、アルキルベンゾイン等のベンゾイン化合物；ベンジルジメチルケタール等のベンジル誘導体；ビス（２，４，６－トリメチルベンゾイル）－フェニルフォスフィンオキサイド；ビス（２，６－ジメチルベンゾイル）－２，４，４－トリメチル－ペンチルフォスフィンオキサイド；（２，４，６－トリメチルベンゾイル）エトキシフェニルフォスフィンオキサイドなどが挙げられる。
Component (C) includes hexaarylbiimidazole compounds; benzophenone, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-1-butanone, 2-(dimethylamino)-2-[(4- methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone, 4-(2-hydroxyethoxy)phenyl-2-(hydroxy-2-propyl)ketone, 2-methyl-1- Aromatic ketones such as [4-(methylthio)phenyl]-2-morpholino-propanone-1; quinone compounds such as alkylanthraquinone; benzoin ether compounds such as benzoin alkyl ether; benzoin compounds such as benzoin and alkylbenzoin; benzyl derivatives such as; bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide; bis(2,6-dimethylbenzoyl)-2,4,4-trimethyl-pentylphosphine oxide; 6-trimethylbenzoyl)ethoxyphenylphosphine oxide and the like.
（Ｃ）成分は、優れた解像性及び密着性を得やすい観点から、ヘキサアリールビイミダゾール化合物を含んでよい。ヘキサアリールビイミダゾール化合物におけるアリール基は、フェニル基等であってよい。ヘキサアリールビイミダゾール化合物におけるアリール基に結合する水素原子は、ハロゲン原子（塩素原子等）により置換されていてよい。
The (C) component may contain a hexaarylbiimidazole compound from the viewpoint of easily obtaining excellent resolution and adhesion. The aryl group in the hexaarylbiimidazole compound may be a phenyl group or the like. A hydrogen atom bonded to an aryl group in the hexaarylbiimidazole compound may be substituted with a halogen atom (such as a chlorine atom).
ヘキサアリールビイミダゾール化合物は、２，４，５－トリアリールイミダゾール二量体であってよい。２，４，５－トリアリールイミダゾール二量体としては、２－（ｏ－クロロフェニル）－４，５－ジフェニルイミダゾール二量体、２－（ｏ－クロロフェニル）－４，５－ビス－（ｍ－メトキシフェニル）イミダゾール二量体、２－（ｐ－メトキシフェニル）－４，５－ジフェニルイミダゾール二量体等が挙げられる。ヘキサアリールビイミダゾール化合物は、優れた解像性及び密着性を得やすい観点から、２－（ｏ－クロロフェニル）－４，５－ジフェニルイミダゾール二量体を含んでよく、２，２’－ビス（ｏ－クロロフェニル）－４，４’，５，５’－テトラフェニル－１，２’－ビイミダゾールを含んでよい。
The hexaarylbiimidazole compound may be a 2,4,5-triarylimidazole dimer. Examples of the 2,4,5-triarylimidazole dimer include 2-(o-chlorophenyl)-4,5-diphenylimidazole dimer, 2-(o-chlorophenyl)-4,5-bis-(m- methoxyphenyl)imidazole dimer, 2-(p-methoxyphenyl)-4,5-diphenylimidazole dimer, and the like. The hexaarylbiimidazole compound may contain 2-(o-chlorophenyl)-4,5-diphenylimidazole dimer from the viewpoint of easily obtaining excellent resolution and adhesion, and 2,2'-bis( o-Chlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole.
ヘキサアリールビイミダゾール化合物の含有量は、優れた解像性及び密着性を得やすい観点から、（Ｃ）成分の全量を基準として、５０質量％以上、５０質量％超、７０質量％以上、９０質量％以上、９５質量％以上、９８質量％以上、９９質量％以上、又は、実質的に１００質量％（（Ｃ）成分が実質的にヘキサアリールビイミダゾール化合物からなる態様）であってよい。
From the viewpoint of easily obtaining excellent resolution and adhesion, the content of the hexaarylbiimidazole compound is 50% by mass or more, more than 50% by mass, 70% by mass or more, 90% by mass or more, based on the total amount of component (C). % by mass or more, 95% by mass or more, 98% by mass or more, 99% by mass or more, or substantially 100% by mass (an aspect in which component (C) is substantially composed of a hexaarylbiimidazole compound).
（Ｃ）成分の含有量は、優れた解像性及び密着性を得やすい観点から、感光性フィルムの全量、又は、感光性樹脂組成物の全量（固形分全量）を基準として下記の範囲であってよい。（Ｃ）成分の含有量は、０．１質量％以上、０．５質量％以上、１質量％以上、２質量％以上、３質量％以上、４質量％以上、５質量％以上、又は、５．５質量％以上であってよい。（Ｃ）成分の含有量は、２０質量％以下、１５質量％以下、１２質量％以下、１０質量％以下、８質量％以下、７質量％以下、又は、６質量％以下であってよい。これらの観点から、（Ｃ）成分の含有量は、０．１～２０質量％であってよい。
The content of component (C) is in the following range based on the total amount of the photosensitive film or the total amount of the photosensitive resin composition (total solid content) from the viewpoint of easily obtaining excellent resolution and adhesion. It's okay. The content of component (C) is 0.1% by mass or more, 0.5% by mass or more, 1% by mass or more, 2% by mass or more, 3% by mass or more, 4% by mass or more, 5% by mass or more, or It may be 5.5% by mass or more. The content of component (C) may be 20% by mass or less, 15% by mass or less, 12% by mass or less, 10% by mass or less, 8% by mass or less, 7% by mass or less, or 6% by mass or less. From these viewpoints, the content of component (C) may be 0.1 to 20% by mass.
（Ｃ）成分の含有量は、優れた解像性及び密着性を得やすい観点から、（Ａ）成分及び（Ｂ）成分の総量１００質量部に対して下記の範囲であってよい。（Ｃ）成分の含有量は、０．１質量部以上、０．５質量部以上、１質量部以上、２質量部以上、３質量部以上、４質量部以上、５質量部以上、５．５質量部以上、又は、６質量部以上であってよい。（Ｃ）成分の含有量は、２０質量部以下、１５質量部以下、１２質量部以下、１０質量部以下、８質量部以下、７質量部以下、又は、６質量部以下であってよい。これらの観点から、（Ｃ）成分の含有量は、０．１～２０質量部であってよい。
From the viewpoint of easily obtaining excellent resolution and adhesion, the content of component (C) may be within the following range with respect to the total amount of 100 parts by mass of components (A) and (B). The content of component (C) is 0.1 parts by mass or more, 0.5 parts by mass or more, 1 part by mass or more, 2 parts by mass or more, 3 parts by mass or more, 4 parts by mass or more, 5 parts by mass or more. It may be 5 parts by mass or more, or 6 parts by mass or more. The content of component (C) may be 20 parts by mass or less, 15 parts by mass or less, 12 parts by mass or less, 10 parts by mass or less, 8 parts by mass or less, 7 parts by mass or less, or 6 parts by mass or less. From these points of view, the content of component (C) may be 0.1 to 20 parts by mass.
本実施形態に係る感光性フィルム及び感光性樹脂組成物は、（Ｄ）成分として、アントラセン化合物（アントラセン環を有する化合物；ナフタレン化合物に該当する化合物を除く）、ピラゾリン化合物（ピラゾリン環を有する化合物；アントラセン化合物又はナフタレン化合物に該当する化合物を除く）、及び、ジスチリルベンゼン化合物（スチリル基が２つ結合したベンゼン環を有する化合物；アントラセン化合物、ピラゾリン化合物又はナフタレン化合物に該当する化合物を除く）からなる群より選ばれる少なくとも一種を含有する。（Ｄ）成分は、増感剤（光増感剤）として用いることができる。本実施形態に係る感光性フィルム及び感光性樹脂組成物は、アントラセン化合物を含有しない態様であってもよく、ピラゾリン化合物を含有しない態様であってもよく、ジスチリルベンゼン化合物を含有しない態様であってもよい。（Ｄ）成分の分子量は、１００００未満であってよい。
The photosensitive film and photosensitive resin composition according to the present embodiment contain, as the component (D), anthracene compounds (compounds having an anthracene ring; excluding compounds corresponding to naphthalene compounds), pyrazoline compounds (compounds having a pyrazoline ring; excluding compounds corresponding to anthracene compounds or naphthalene compounds) and distyrylbenzene compounds (compounds having a benzene ring with two styryl groups bonded; excluding compounds corresponding to anthracene compounds, pyrazoline compounds or naphthalene compounds) Contains at least one selected from the group. (D) A component can be used as a sensitizer (photosensitizer). The photosensitive film and the photosensitive resin composition according to the present embodiment may be in an aspect that does not contain an anthracene compound, may be in an aspect that does not contain a pyrazoline compound, or does not contain a distyrylbenzene compound. may The molecular weight of component (D) may be less than 10,000.
（Ｄ）成分がアントラセン化合物を含むことにより、特に優れた解像性を得ることができる。アントラセン化合物は、アントラセン環に結合する置換基を有してよく、アントラセン環の９位及び１０位からなる群より選ばれる少なくとも一種に結合する置換基を有してよい。置換基としては、アルキル基（炭素数１～２０のアルキル基（非環状アルキル基）、炭素数５～１２のシクロアルキル基等）、アリール基（フェニル基、アラルキル基（ベンジル基、フェネチル基等）、ベンゾイル基、スチリル基など）、ビニル基、ヒドロキシ基、カルボキシ基、カルボン酸塩基、アルデヒド基、アルコキシ基（無置換のアルコキシ基、又は、置換アルコキシ基（ヒドロキシアルコキシ基等））、カルボニル基、アルコキシカルボニル基、アルカノイル基（炭素数２～１２のアルカノイル基等）、オキシカルボニル基、カルボニルオキシ基、アミノ基、エポキシ基、フリル基、シアノ基、ハロゲノ基（フルオロ基、クロロ基、ブロモ基等）、ニトロ基、アセチル基、スルホニル基、スルホンアミド基などが挙げられる。
Particularly excellent resolution can be obtained by including an anthracene compound in the component (D). The anthracene compound may have a substituent bonded to the anthracene ring and may have a substituent bonded to at least one selected from the group consisting of the 9- and 10-positions of the anthracene ring. Examples of substituents include alkyl groups (alkyl groups having 1 to 20 carbon atoms (acyclic alkyl groups), cycloalkyl groups having 5 to 12 carbon atoms, etc.), aryl groups (phenyl groups, aralkyl groups (benzyl group, phenethyl group, etc. ), benzoyl group, styryl group, etc.), vinyl group, hydroxy group, carboxy group, carboxylic acid group, aldehyde group, alkoxy group (unsubstituted alkoxy group or substituted alkoxy group (hydroxyalkoxy group, etc.)), carbonyl group , alkoxycarbonyl group, alkanoyl group (alkanoyl group having 2 to 12 carbon atoms, etc.), oxycarbonyl group, carbonyloxy group, amino group, epoxy group, furyl group, cyano group, halogeno group (fluoro group, chloro group, bromo group etc.), nitro group, acetyl group, sulfonyl group, sulfonamide group and the like.
（Ｄ）成分は、優れた解像性及び密着性を得やすい観点から、下記一般式（ｄ１）で表される化合物を含んでよい。
The (D) component may contain a compound represented by the following general formula (d1) from the viewpoint of easily obtaining excellent resolution and adhesion.
式（ｄ１）において、アルキル基の炭素数が２以上（例えば２～１２）の場合、アルキル基は、主鎖の炭素原子間に酸素原子を有してよく、ヒドロキシ基で置換されていてもよい。シクロアルキル基は、環の中に酸素原子を有してよく、ヒドロキシ基で置換されていてもよい。フェニル基、ベンジル基及びベンゾイル基のそれぞれは、アルキル基（例えば炭素数１～６のアルキル基）、ヒドロキシ基、ハロゲノ基、シアノ基、カルボキシ基、フェニル基、アルコキシ基（例えば炭素数１～６のアルコキシ基）、フェノキシ基、及び、アルコキシカルボニル基（例えば炭素数２～６のアルコキシカルボニル基）からなる群より選ばれる少なくとも一種で置換されていてもよい。Ｒｄ１２、Ｒｄ１３、Ｒｄ１４、Ｒｄ１５、Ｒｄ１６、Ｒｄ１７、Ｒｄ１８及びＲｄ１９は、優れた解像性及び密着性を得やすい観点から、水素原子であってよい。
In formula (d1), when the alkyl group has 2 or more carbon atoms (eg, 2 to 12), the alkyl group may have an oxygen atom between the carbon atoms of the main chain, and may be substituted with a hydroxy group. good. A cycloalkyl group may have an oxygen atom in the ring and may be substituted with a hydroxy group. Each of the phenyl group, benzyl group and benzoyl group is an alkyl group (eg, an alkyl group having 1 to 6 carbon atoms), a hydroxy group, a halogeno group, a cyano group, a carboxy group, a phenyl group, an alkoxy group (eg, an alkyl group having 1 to 6 carbon atoms). alkoxy group), a phenoxy group, and an alkoxycarbonyl group (for example, an alkoxycarbonyl group having 2 to 6 carbon atoms). R d12 , R d13 , R d14 , R d15 , R d16 , R d17 , R d18 and R d19 may be hydrogen atoms from the viewpoint of easily obtaining excellent resolution and adhesion.
アントラセン化合物は、分子内にヒドロキシ基を有さなくてよく、アントラセン環に結合するヒドロキシアルコキシ基を有さなくてよい。アントラセン化合物は、分子内にＣＯＯ基（Ｃ（＝Ｏ）Ｏ基）を有さなくてよく、アントラセン環に結合するＣＯＯ基（Ｃ（＝Ｏ）Ｏ基を有さなくてよい。アントラセン化合物は、アントラセン環の９位及び１０位以外の位置に置換基を有さなくてよい。
The anthracene compound does not have to have a hydroxy group in the molecule, and it does not have to have a hydroxyalkoxy group bonded to the anthracene ring. The anthracene compound may not have a COO group (C(=O)O group) in the molecule, and may not have a COO group (C(=O)O group) bonded to the anthracene ring. , may have no substituents at positions other than the 9- and 10-positions of the anthracene ring.
（Ｄ）成分は、アントラセン化合物として、分子内にヒドロキシ基を有するアントラセン化合物を含まなくてよく、アントラセン環に結合するヒドロキシアルコキシ基を有するアントラセン化合物を含まなくてよい。（Ｄ）成分は、アントラセン化合物として、分子内にＣＯＯ基（Ｃ（＝Ｏ）Ｏ基）を有するアントラセン化合物を含まなくてよく、アントラセン環に結合するＣＯＯ基（Ｃ（＝Ｏ）Ｏ基）を有するアントラセン化合物を含まなくてよい。（Ｄ）成分は、アントラセン化合物として、アントラセン環の９位及び１０位以外の位置に置換基を有するアントラセン化合物を含まなくてよい。（Ｄ）成分は、アントラセン化合物として、アントラセン環に結合する酸素原子数２以上の置換基を有するアントラセン化合物を含まなくてよい。
Component (D) may not contain, as an anthracene compound, an anthracene compound having a hydroxy group in the molecule, and may not contain an anthracene compound having a hydroxyalkoxy group bonded to an anthracene ring. Component (D) may not contain an anthracene compound having a COO group (C(=O)O group) in the molecule as an anthracene compound, and a COO group (C(=O)O group) bonded to the anthracene ring. may not contain anthracene compounds having Component (D) may not contain, as an anthracene compound, an anthracene compound having substituents at positions other than the 9- and 10-positions of the anthracene ring. Component (D) may not contain, as an anthracene compound, an anthracene compound having a substituent having two or more oxygen atoms bonded to the anthracene ring.
アルコキシ基の炭素数は、優れた解像性及び密着性を得やすい観点から、下記の範囲であってよい。例えば、上記式（ｄ１）において、Ｒｄ１０及びＲｄ１１からなる群より選ばれる少なくとも一種がアルキル基である場合、ＯＲｄ１０又はＯＲｄ１１のアルコキシ基の炭素数は、優れた解像性及び密着性を得やすい観点から、下記の範囲であってよい。アルコキシ基の炭素数は、１以上、２以上、３以上、又は、４以上であってよい。アルコキシ基の炭素数は、１０以下、８以下、６以下、５以下、４以下、又は、３以下であってよい。これらの観点から、アルコキシ基の炭素数は、１～１０であってよい。
The number of carbon atoms in the alkoxy group may be within the following range from the viewpoint of easily obtaining excellent resolution and adhesion. For example, in the above formula (d1), when at least one selected from the group consisting of R d10 and R d11 is an alkyl group, the number of carbon atoms in the alkoxy group of OR d10 or OR d11 provides excellent resolution and adhesion. From the viewpoint of easily obtaining, the following ranges may be used. The number of carbon atoms in the alkoxy group may be 1 or more, 2 or more, 3 or more, or 4 or more. The number of carbon atoms in the alkoxy group may be 10 or less, 8 or less, 6 or less, 5 or less, 4 or less, or 3 or less. From these points of view, the alkoxy group may have 1 to 10 carbon atoms.
アントラセン化合物としては、１－メチルアントラセン、２－メチルアントラセン、９－メチルアントラセン、２－エチルアントラセン、２－ブチルアントラセン、９－ビニルアントラセン、９－フェニルアントラセン、１－アミノアントラセン、２－アミノアントラセン、９－（メチルアミノメチル）アントラセン、９－アセチルアントラセン、９－アントラアルデヒド、９，１０－ジメチルアントラセン、９，１０－ジエトキシアントラセン、９，１０－ジプロポキシアントラセン、９，１０－ジブトキシアントラセン、９，１０－ジ（２－エチルヘキシルオキシ）アントラセン、９，１０－ジフェニルアントラセン、２－ブロモ－９，１０－ジフェニルアントラセン、９－（４－ブロモフェニル）－１０－フェニルアントラセン、１０－メチル－９－アントラアルデヒド、１，４，９，１０－テトラヒドロキシアントラセン等が挙げられる。
Examples of anthracene compounds include 1-methylanthracene, 2-methylanthracene, 9-methylanthracene, 2-ethylanthracene, 2-butylanthracene, 9-vinylanthracene, 9-phenylanthracene, 1-aminoanthracene, 2-aminoanthracene, 9-(methylaminomethyl)anthracene, 9-acetylanthracene, 9-anthraldehyde, 9,10-dimethylanthracene, 9,10-diethoxyanthracene, 9,10-dipropoxyanthracene, 9,10-dibutoxyanthracene, 9,10-di(2-ethylhexyloxy)anthracene, 9,10-diphenylanthracene, 2-bromo-9,10-diphenylanthracene, 9-(4-bromophenyl)-10-phenylanthracene, 10-methyl-9 -anthraldehyde, 1,4,9,10-tetrahydroxyanthracene, and the like.
アントラセン化合物は、優れた解像性及び密着性を得やすい観点から、アントラセン環に結合する無置換のアルコキシ基を有する化合物（例えば、アントラセン環に結合する２つの無置換のアルコキシ基を有するジアルコキシアントラセン化合物）を含んでよく、アントラセン環の９位及び１０位からなる群より選ばれる少なくとも一種に結合する無置換のアルコキシ基を有する化合物を含んでよく、９，１０－ジプロポキシアントラセン及び９，１０－ジブトキシアントラセンからなる群より選ばれる少なくとも一種を含んでよく、９，１０－ジブトキシアントラセンを含んでよい。（Ｄ）成分は、優れた解像性及び密着性を得やすい観点から、アントラセン化合物として、アントラセン環の９位及び１０位に結合する無置換のアルコキシ基を有する化合物以外の化合物を含まなくてよい。すなわち、（Ｄ）成分におけるアントラセン化合物が、アントラセン環の９位及び１０位に結合する無置換のアルコキシ基を有する化合物からなる態様であってよい。
The anthracene compound is a compound having an unsubstituted alkoxy group bonded to an anthracene ring (for example, a dialkoxy anthracene compound), which may include a compound having an unsubstituted alkoxy group bonded to at least one selected from the group consisting of the 9-position and 10-position of the anthracene ring, 9,10-dipropoxyanthracene and 9, It may contain at least one selected from the group consisting of 10-dibutoxyanthracene, and may contain 9,10-dibutoxyanthracene. From the viewpoint of easily obtaining excellent resolution and adhesion, component (D) should not contain compounds other than compounds having unsubstituted alkoxy groups bonded to the 9- and 10-positions of the anthracene ring as anthracene compounds. good. That is, the anthracene compound in component (D) may be a compound having unsubstituted alkoxy groups bonded to the 9- and 10-positions of the anthracene ring.
アントラセン環に結合する無置換のアルコキシ基を有する化合物の含有量、又は、アントラセン環の９位及び１０位に結合する無置換のアルコキシ基を有するアントラセン化合物の含有量は、優れた解像性及び密着性を得やすい観点から、アントラセン化合物の全質量（感光性フィルム又は感光性樹脂組成物に含まれるアントラセン化合物の全質量）を基準として、５０質量％以上、５０質量％超、７０質量％以上、９０質量％以上、９５質量％以上、９８質量％以上、９９質量％以上、又は、実質的に１００質量％（アントラセン化合物が、実質的に、アントラセン環に結合する無置換のアルコキシ基を有する化合物からなる態様）であってよく、５０～１００質量％であってよい。
The content of the compound having an unsubstituted alkoxy group bonded to the anthracene ring or the content of the anthracene compound having an unsubstituted alkoxy group bonded to the 9- and 10-positions of the anthracene ring provides excellent resolution and From the viewpoint of easily obtaining adhesion, based on the total mass of the anthracene compound (the total mass of the anthracene compound contained in the photosensitive film or the photosensitive resin composition), it is 50% by mass or more, more than 50% by mass, or 70% by mass or more. , 90% by mass or more, 95% by mass or more, 98% by mass or more, 99% by mass or more, or substantially 100% by mass (the anthracene compound substantially has an unsubstituted alkoxy group bonded to the anthracene ring compound), and may be 50 to 100% by mass.
（Ｄ）成分がピラゾリン化合物を含むことにより、優れた感度を得やすい。ピラゾリン化合物としては、１－ピラゾリン化合物、２－ピラゾリン化合物、及び、３－ピラゾリン化合物が挙げられる。ピラゾリン化合物は、優れた解像性及び密着性を得やすい観点から、２－ピラゾリン化合物を含んでよい。
By including a pyrazoline compound in the component (D), it is easy to obtain excellent sensitivity. Pyrazoline compounds include 1-pyrazoline compounds, 2-pyrazoline compounds, and 3-pyrazoline compounds. The pyrazoline compound may contain a 2-pyrazoline compound from the viewpoint of easily obtaining excellent resolution and adhesion.
ピラゾリン化合物は、ピラゾリン環に結合する置換基を有してよく、ピラゾリン環の１位、３位及び５位からなる群より選ばれる少なくとも一種に結合する置換基を有する化合物を含んでよい。置換基としては、アルキル基（炭素数１～２０のアルキル基（非環状アルキル基）、炭素数５～１２のシクロアルキル基等）、アリール基（フェニル基、アラルキル基（ベンジル基、フェネチル基等）、ベンゾイル基、スチリル基など）、ビニル基、ヒドロキシ基、カルボキシ基、カルボン酸塩基、アルデヒド基、アルコキシ基（無置換のアルコキシ基、又は、置換アルコキシ基（ヒドロキシアルコキシ基等））、カルボニル基、アルコキシカルボニル基、アルカノイル基（炭素数２～１２のアルカノイル基等）、オキシカルボニル基、カルボニルオキシ基、アミノ基、エポキシ基、フリル基、シアノ基、ハロゲノ基（フルオロ基、クロロ基、ブロモ基等）、ニトロ基、アセチル基、スルホニル基、スルホンアミド基などが挙げられる。アリール基のベンゼン環は、置換基を有してよく、置換基としては、アルキル基、アルコキシ基（メトキシ基、エトキシ基、プロポキシ基等）、ハロゲノ基（フルオロ基、クロロ基、ブロモ基等）、スルホンアミド基などが挙げられる。置換基は、アルキルエステル基（例えば炭素数１～６のアルキルエステル基）、アルキルアミノ基（例えば炭素数１～２０のアルキルアミノ基）等であってもよい。
The pyrazoline compound may have a substituent that binds to the pyrazoline ring, and may include compounds that have a substituent that binds to at least one selected from the group consisting of the 1-, 3- and 5-positions of the pyrazoline ring. Examples of substituents include alkyl groups (alkyl groups having 1 to 20 carbon atoms (acyclic alkyl groups), cycloalkyl groups having 5 to 12 carbon atoms, etc.), aryl groups (phenyl groups, aralkyl groups (benzyl group, phenethyl group, etc. ), benzoyl group, styryl group, etc.), vinyl group, hydroxy group, carboxy group, carboxylic acid group, aldehyde group, alkoxy group (unsubstituted alkoxy group or substituted alkoxy group (hydroxyalkoxy group, etc.)), carbonyl group , alkoxycarbonyl group, alkanoyl group (alkanoyl group having 2 to 12 carbon atoms, etc.), oxycarbonyl group, carbonyloxy group, amino group, epoxy group, furyl group, cyano group, halogeno group (fluoro group, chloro group, bromo group etc.), nitro group, acetyl group, sulfonyl group, sulfonamide group and the like. The benzene ring of the aryl group may have a substituent, such as an alkyl group, an alkoxy group (methoxy group, ethoxy group, propoxy group, etc.), a halogeno group (fluoro group, chloro group, bromo group, etc.). , a sulfonamide group, and the like. The substituent may be an alkylester group (eg, an alkylester group having 1 to 6 carbon atoms), an alkylamino group (eg, an alkylamino group having 1 to 20 carbon atoms), or the like.
（Ｄ）成分は、優れた解像性及び密着性を得やすい観点から、下記一般式（ｄ２１）で表される化合物、及び、下記一般式（ｄ２２）で表される化合物からなる群より選ばれる少なくとも一種を含んでよい。
Component (D) is selected from the group consisting of a compound represented by the following general formula (d21) and a compound represented by the following general formula (d22) from the viewpoint of easily obtaining excellent resolution and adhesion. may contain at least one
式（ｄ２１）において、Ｒｄ２１１、Ｒｄ２１２及びＲｄ２１３の少なくとも一つは、アルコキシ基（例えば炭素数１～１０のアルコキシ基）、又は、アルキル基（例えば炭素数１～３のアルキル基）であってよい。Ｒｄ２１２及びＲｄ２１３からなる群より選ばれる少なくとも一種は、優れた解像性及び密着性を得やすい観点から、アルコキシ基であってよく、メトキシ基、エトキシ基又はプロポキシ基であってよい。ｄ２１１は、優れた解像性及び密着性を得やすい観点から、０であってよい。ｄ２１２及びｄ２１３からなる群より選ばれる少なくとも一種は、優れた解像性及び密着性を得やすい観点から、０、１、２又は３であってよく、１であってよい。ｄ２１１、ｄ２１２及びｄ２１３の総和は、０～６又は１～６であってよい。
In formula (d21), at least one of R d211 , R d212 and R d213 is an alkoxy group (eg, an alkoxy group having 1 to 10 carbon atoms) or an alkyl group (eg, an alkyl group having 1 to 3 carbon atoms). It's okay. At least one selected from the group consisting of R d212 and R d213 may be an alkoxy group, a methoxy group, an ethoxy group or a propoxy group from the viewpoint of easily obtaining excellent resolution and adhesion. d211 may be 0 from the viewpoint of easily obtaining excellent resolution and adhesion. At least one selected from the group consisting of d212 and d213 may be 0, 1, 2 or 3, or 1 from the viewpoint of easily obtaining excellent resolution and adhesion. The sum of d211, d212 and d213 may be 0-6 or 1-6.
式（ｄ２２）において、Ｒｄ２２１は、優れた解像性及び密着性を得やすい観点から、ハロゲノ基であってよく、フルオロ基、クロロ基、又は、ブロモ基であってよい。Ｒｄ２２２は、優れた解像性及び密着性を得やすい観点から、スルホンアミド基であってよい。ｄ２２１及びｄ２２２からなる群より選ばれる少なくとも一種は、優れた解像性及び密着性を得やすい観点から、０、１、２又は３であってよく、１であってよい。
In formula (d22), R d221 may be a halogeno group, a fluoro group, a chloro group, or a bromo group from the viewpoint of easily obtaining excellent resolution and adhesion. R d222 may be a sulfonamide group from the viewpoint of easily obtaining excellent resolution and adhesion. At least one selected from the group consisting of d221 and d222 may be 0, 1, 2 or 3, or 1 from the viewpoint of easily obtaining excellent resolution and adhesion.
ピラゾリン化合物としては、１－フェニル－３－（４－イソプロピルスチリル）－５－（４－イソプロピルフェニル）－ピラゾリン、１－フェニル－３－（４－ｔｅｒｔ－ブチル－スチリル）－５－（４－ｔｅｒｔ－ブチルフェニル）－ピラゾリン、１－フェニル－３－（４－メトキシスチリル）－５－（４－メトキシフェニル）－ピラゾリン、１－フェニル－３－（３，５－ジメトキシスチリル）－５－（３，５－ジメトキシフェニル）－ピラゾリン、１－フェニル－３－（３，４－ジメトキシスチリル）－５－（３，４－ジメトキシフェニル）－ピラゾリン、１－フェニル－３－（２，６－ジメトキシスチリル）－５－（２，６－ジメトキシフェニル）－ピラゾリン、１－フェニル－３－（２，５－ジメトキシスチリル）－５－（２，５－ジメトキシフェニル）－ピラゾリン、１－フェニル－３－（２，３－ジメトキシスチリル）－５－（２，３－ジメトキシフェニル）－ピラゾリン、１－フェニル－３－（２，４－ジメトキシスチリル）－５－（２，４－ジメトキシフェニル）－ピラゾリン、４－［［３－（４－クロロフェニル）－４，５－ジヒドロ－１Ｈ－ピラゾール］－１－イル］ベンゼンスルホンアミド等が挙げられる。
Examples of pyrazoline compounds include 1-phenyl-3-(4-isopropylstyryl)-5-(4-isopropylphenyl)-pyrazoline, 1-phenyl-3-(4-tert-butyl-styryl)-5-(4- tert-butylphenyl)-pyrazoline, 1-phenyl-3-(4-methoxystyryl)-5-(4-methoxyphenyl)-pyrazoline, 1-phenyl-3-(3,5-dimethoxystyryl)-5-( 3,5-dimethoxyphenyl)-pyrazoline, 1-phenyl-3-(3,4-dimethoxystyryl)-5-(3,4-dimethoxyphenyl)-pyrazoline, 1-phenyl-3-(2,6-dimethoxy styryl)-5-(2,6-dimethoxyphenyl)-pyrazoline, 1-phenyl-3-(2,5-dimethoxystyryl)-5-(2,5-dimethoxyphenyl)-pyrazoline, 1-phenyl-3- (2,3-dimethoxystyryl)-5-(2,3-dimethoxyphenyl)-pyrazoline, 1-phenyl-3-(2,4-dimethoxystyryl)-5-(2,4-dimethoxyphenyl)-pyrazoline, 4-[[3-(4-chlorophenyl)-4,5-dihydro-1H-pyrazol]-1-yl]benzenesulfonamide and the like.
ピラゾリン化合物は、優れた解像性及び密着性を得やすい観点から、ピラゾリン環に結合するアリール基を有する化合物（ピラゾリン環に結合する２つ以上（例えば２～３つ）のアリール基を有する化合物等）を含んでよく、ピラゾリン環の１位、３位及び５位からなる群より選ばれる少なくとも一種に結合するアリール基を有する化合物を含んでよく、ピラゾリン環の１位、３位及び５位からなる群より選ばれる少なくとも一種に結合するフェニル基（置換基を有してよいフェニル基）を有する化合物を含んでよく、１－フェニル－３－（４－メトキシスチリル）－５－（４－メトキシフェニル）－ピラゾリン、及び、４－［［３－（４－クロロフェニル）－４，５－ジヒドロ－１Ｈ－ピラゾール］－１－イル］ベンゼンスルホンアミドからなる群より選ばれる少なくとも一種を含んでよい。
The pyrazoline compound is a compound having an aryl group bonded to a pyrazoline ring (a compound having two or more (eg, 2 to 3) aryl groups bonded to a pyrazoline ring) from the viewpoint of easily obtaining excellent resolution and adhesion. etc.), and may contain a compound having an aryl group bonded to at least one selected from the group consisting of 1-position, 3-position and 5-position of the pyrazoline ring, 1-position, 3-position and 5-position of the pyrazoline ring 1-phenyl-3-(4-methoxystyryl)-5-(4- methoxyphenyl)-pyrazoline and 4-[[3-(4-chlorophenyl)-4,5-dihydro-1H-pyrazol]-1-yl]benzenesulfonamide. .
（Ｄ）成分がジスチリルベンゼン化合物を含むことにより、特に優れた感度を得ることができる。ジスチリルベンゼン化合物において、スチリル基のベンゼン環、及び、スチリル基が２つ結合したベンゼン環は、置換基を有してよい。置換基としては、アルキル基（炭素数１～２０のアルキル基（非環状アルキル基）、炭素数５～１２のシクロアルキル基等）、アリール基（フェニル基、アラルキル基（ベンジル基、フェネチル基等）、ベンゾイル基など）、ビニル基、ヒドロキシ基、カルボキシ基、カルボン酸塩基、アルデヒド基、アルコキシ基（無置換のアルコキシ基、又は、置換アルコキシ基（ヒドロキシアルコキシ基等））、カルボニル基、アルコキシカルボニル基、アルカノイル基（炭素数２～１２のアルカノイル基等）、オキシカルボニル基、カルボニルオキシ基、アミノ基、エポキシ基、フリル基、シアノ基、ハロゲノ基（フルオロ基、クロロ基、ブロモ基等）、ニトロ基、アセチル基、スルホニル基、スルホンアミド基などが挙げられる。
Especially excellent sensitivity can be obtained by including the distyrylbenzene compound in the component (D). In the distyrylbenzene compound, the benzene ring of the styryl group and the benzene ring in which two styryl groups are bonded may have a substituent. Examples of substituents include alkyl groups (alkyl groups having 1 to 20 carbon atoms (acyclic alkyl groups), cycloalkyl groups having 5 to 12 carbon atoms, etc.), aryl groups (phenyl groups, aralkyl groups (benzyl group, phenethyl group, etc. ), benzoyl group, etc.), vinyl group, hydroxy group, carboxy group, carboxylic acid group, aldehyde group, alkoxy group (unsubstituted alkoxy group or substituted alkoxy group (hydroxyalkoxy group, etc.)), carbonyl group, alkoxycarbonyl group, alkanoyl group (alkanoyl group having 2 to 12 carbon atoms, etc.), oxycarbonyl group, carbonyloxy group, amino group, epoxy group, furyl group, cyano group, halogeno group (fluoro group, chloro group, bromo group, etc.), nitro group, acetyl group, sulfonyl group, sulfonamide group and the like.
（Ｄ）成分は、優れた解像性及び密着性を得やすい観点から、下記一般式（ｄ３）で表される化合物を含んでよい。
The (D) component may contain a compound represented by the following general formula (d3) from the viewpoint of easily obtaining excellent resolution and adhesion.
式（ｄ３）において、ｄ３１及びｄ３２からなる群より選ばれる少なくとも一種は、優れた解像性及び密着性を得やすい観点から、１、２、３、４又は５であってよく、１であってよい。ｄ３３は、優れた解像性及び密着性を得やすい観点から、０、１、２又は３であってよく、０であってよい。
In formula (d3), at least one selected from the group consisting of d31 and d32 may be 1, 2, 3, 4 or 5 from the viewpoint of easily obtaining excellent resolution and adhesion. you can d33 may be 0, 1, 2 or 3, or may be 0 from the viewpoint of easily obtaining excellent resolution and adhesion.
ジスチリルベンゼン化合物としては、ジスチリルベンゼン、ジシアノジスチリルベンゼン化合物等が挙げられる。ジシアノジスチリルベンゼン化合物としては、４’－（２－シアノスチリル）－２－スチルベンカルボニトリル、４’－（２－シアノスチリル）－３－スチルベンカルボニトリル、４’－（２－シアノスチリル）－４－スチルベンカルボニトリル、１，４－ビス（４－シアノスチリル）ベンゼン等が挙げられる。ジスチリルベンゼン化合物は、優れた解像性及び密着性を得やすい観点から、ジシアノジスチリルベンゼン化合物を含んでよく、４’－（２－シアノスチリル）－３－スチルベンカルボニトリルを含んでよい。
Examples of distyrylbenzene compounds include distyrylbenzene and dicyanodistyrylbenzene compounds. Examples of the dicyanodistyrylbenzene compounds include 4'-(2-cyanostyryl)-2-stilbenecarbonitrile, 4'-(2-cyanostyryl)-3-stilbenecarbonitrile, 4'-(2-cyanostyryl)- 4-stilbenecarbonitrile, 1,4-bis(4-cyanostyryl)benzene and the like. The distyrylbenzene compound may include a dicyanodistyrylbenzene compound and may include 4'-(2-cyanostyryl)-3-stilbenecarbonitrile from the viewpoint of easily obtaining excellent resolution and adhesion.
含有量Ｄ１として、（Ｄ）成分の含有量（アントラセン化合物、ピラゾリン化合物、及び、ジスチリルベンゼン化合物の総量。以下同様）、アントラセン化合物の含有量、ピラゾリン化合物の含有量、又は、ジスチリルベンゼン化合物の含有量は、優れた解像性及び密着性を得やすい観点から、感光性フィルムの全量、又は、感光性樹脂組成物の全量（固形分全量）を基準として下記の範囲であってよい。含有量Ｄ１は、０．０１質量％以上、０．０５質量％以上、０．１質量％以上、０．２質量％以上、０．２５質量％以上、０．３質量％以上、０．４質量％以上、０．５質量％以上、又は、０．６質量％以上であってよい。含有量Ｄ１は、５質量％以下、３質量％以下、１質量％以下、０．８質量％以下、０．７質量％以下、０．６質量％以下、０．５質量％以下、０．４質量％以下、０．３質量％以下、又は、０．２５質量％以下であってよい。これらの観点から、含有量Ｄ１は、０．０１～５質量％、又は、０．１～１質量％であってよい。
The content D1 is the content of component (D) (the total amount of the anthracene compound, the pyrazoline compound, and the distyrylbenzene compound; hereinafter the same), the content of the anthracene compound, the content of the pyrazoline compound, or the distyrylbenzene compound. The content of may be in the following range based on the total amount of the photosensitive film or the total amount of the photosensitive resin composition (total solid content) from the viewpoint of easily obtaining excellent resolution and adhesion. Content D1 is 0.01 mass % or more, 0.05 mass % or more, 0.1 mass % or more, 0.2 mass % or more, 0.25 mass % or more, 0.3 mass % or more, 0.4 % by mass or more, 0.5% by mass or more, or 0.6% by mass or more. The content D1 is 5% by mass or less, 3% by mass or less, 1% by mass or less, 0.8% by mass or less, 0.7% by mass or less, 0.6% by mass or less, 0.5% by mass or less, and 0.5% by mass or less. It may be 4% by mass or less, 0.3% by mass or less, or 0.25% by mass or less. From these points of view, the content D1 may be 0.01 to 5% by mass, or 0.1 to 1% by mass.
含有量Ｄ２として、（Ｄ）成分の含有量、アントラセン化合物の含有量、ピラゾリン化合物の含有量、又は、ジスチリルベンゼン化合物の含有量は、優れた解像性及び密着性を得やすい観点から、（Ａ）成分及び（Ｂ）成分の総量１００質量部に対して下記の範囲であってよい。含有量Ｄ２は、０．０１質量部以上、０．０５質量部以上、０．１質量部以上、０．２質量部以上、０．２５質量部以上、０．３質量部以上、０．４質量部以上、０．５質量部以上、０．６質量部以上、又は、０．６５質量部以上であってよい。含有量Ｄ２は、５質量部以下、３質量部以下、１質量部以下、０．８質量部以下、０．７質量部以下、０．６５質量部以下、０．６質量部以下、０．５質量部以下、０．４質量部以下、０．３質量部以下、又は、０．２５質量部以下であってよい。これらの観点から、含有量Ｄ２は、０．０１～５質量部、又は、０．１～１質量部であってよい。
As the content D2, the content of the component (D), the content of the anthracene compound, the content of the pyrazoline compound, or the content of the distyrylbenzene compound, from the viewpoint of easily obtaining excellent resolution and adhesion, It may be in the following range with respect to 100 parts by mass of the total amount of components (A) and (B). Content D2 is 0.01 parts by mass or more, 0.05 parts by mass or more, 0.1 parts by mass or more, 0.2 parts by mass or more, 0.25 parts by mass or more, 0.3 parts by mass or more, 0.4 It may be at least 0.5 parts by mass, at least 0.6 parts by mass, or at least 0.65 parts by mass. The content D2 is 5 parts by mass or less, 3 parts by mass or less, 1 part by mass or less, 0.8 parts by mass or less, 0.7 parts by mass or less, 0.65 parts by mass or less, 0.6 parts by mass or less, and 0.6 parts by mass or less. It may be 5 parts by mass or less, 0.4 parts by mass or less, 0.3 parts by mass or less, or 0.25 parts by mass or less. From these points of view, the content D2 may be 0.01 to 5 parts by mass, or 0.1 to 1 part by mass.
含有量Ｄ３として、（Ｄ）成分の含有量、アントラセン化合物の含有量、又は、ジスチリルベンゼン化合物の含有量は、優れた解像性及び密着性を得やすい観点から、（Ａ）成分１００質量部に対して下記の範囲であってよい。含有量Ｄ３は、０．１質量部以上、０．３質量部以上、０．４質量部以上、０．５質量部以上、０．８質量部以上、１質量部以上、１質量部超、又は、１．１質量部以上であってよい。含有量Ｄ３は、１０質量部以下、８質量部以下、５質量部以下、３質量部以下、２質量部以下、１．５質量部以下、１．２質量部以下、１．１質量部以下、１質量部以下、１質量部未満、０．８質量部以下、又は、０．５質量部以下、であってよい。これらの観点から、含有量Ｄ３は、０．１～１０質量部、０．５～５質量部、又は、１～３質量部であってよい。
As the content D3, the content of the component (D), the content of the anthracene compound, or the content of the distyrylbenzene compound is 100 masses of the component (A) from the viewpoint of easily obtaining excellent resolution and adhesion. It may be in the following range with respect to the part. The content D3 is 0.1 parts by mass or more, 0.3 parts by mass or more, 0.4 parts by mass or more, 0.5 parts by mass or more, 0.8 parts by mass or more, 1 part by mass or more, more than 1 part by mass, Alternatively, it may be 1.1 parts by mass or more. Content D3 is 10 parts by mass or less, 8 parts by mass or less, 5 parts by mass or less, 3 parts by mass or less, 2 parts by mass or less, 1.5 parts by mass or less, 1.2 parts by mass or less, 1.1 parts by mass or less , 1 part by weight or less, less than 1 part by weight, 0.8 parts by weight or less, or 0.5 parts by weight or less. From these points of view, the content D3 may be 0.1 to 10 parts by mass, 0.5 to 5 parts by mass, or 1 to 3 parts by mass.
本実施形態に係る感光性フィルム及び感光性樹脂組成物は、（Ｅ）成分として、ナフタレン化合物（ナフタレン環を有する化合物）を含有する。（Ｅ）成分は、増感助剤（光増感助剤）として用いることができる。（Ｅ）成分の分子量は、１００００未満であってよい。
The photosensitive film and photosensitive resin composition according to this embodiment contain a naphthalene compound (a compound having a naphthalene ring) as the component (E). The (E) component can be used as a sensitizing aid (photosensitizing aid). The molecular weight of component (E) may be less than 10,000.
ナフタレン化合物は、ナフタレン環に結合する置換基を有してよく、ナフタレン環の１位及び４位からなる群より選ばれる少なくとも一種に結合する置換基を有してよい。置換基としては、アルキル基（炭素数１～２０のアルキル基（非環状アルキル基）、炭素数５～１２のシクロアルキル基等）、アリール基（フェニル基、アラルキル基（ベンジル基、フェネチル基等）、ベンゾイル基、スチリル基など）、ビニル基、ヒドロキシ基、カルボキシ基、カルボン酸塩基、アルデヒド基、アルコキシ基（無置換のアルコキシ基、又は、置換アルコキシ基（ヒドロキシアルコキシ基等））、カルボニル基、アルコキシカルボニル基、アルカノイル基（炭素数２～１２のアルカノイル基等）、オキシカルボニル基、カルボニルオキシ基、アミノ基、エポキシ基、フリル基、シアノ基、ハロゲノ基（フルオロ基、クロロ基、ブロモ基等）、ニトロ基、アセチル基、スルホニル基、スルホンアミド基、アリールオキシ基（フェノキシ基等）などが挙げられる。ナフタレン化合物は、ナフタレン環の１位及び４位以外の位置に置換基を有さなくてよい。
The naphthalene compound may have a substituent that binds to the naphthalene ring, and may have a substituent that binds to at least one selected from the group consisting of the 1- and 4-positions of the naphthalene ring. Examples of substituents include alkyl groups (alkyl groups having 1 to 20 carbon atoms (acyclic alkyl groups), cycloalkyl groups having 5 to 12 carbon atoms, etc.), aryl groups (phenyl groups, aralkyl groups (benzyl group, phenethyl group, etc. ), benzoyl group, styryl group, etc.), vinyl group, hydroxy group, carboxy group, carboxylic acid group, aldehyde group, alkoxy group (unsubstituted alkoxy group or substituted alkoxy group (hydroxyalkoxy group, etc.)), carbonyl group , alkoxycarbonyl group, alkanoyl group (alkanoyl group having 2 to 12 carbon atoms, etc.), oxycarbonyl group, carbonyloxy group, amino group, epoxy group, furyl group, cyano group, halogeno group (fluoro group, chloro group, bromo group etc.), nitro group, acetyl group, sulfonyl group, sulfonamide group, aryloxy group (phenoxy group etc.) and the like. The naphthalene compound may have no substituents at positions other than the 1- and 4-positions of the naphthalene ring.
ナフタレン化合物は、オキサゾール骨格を有しないナフタレン化合物であってよい。ナフタレン化合物は、ビニルナフタレン化合物とは異なる化合物であってよい。ナフタレン化合物は、エチレン性不飽和結合を有しないナフタレン化合物であってよい。ナフタレン化合物は、アントラセン環を有しないナフタレン化合物であってよい。
The naphthalene compound may be a naphthalene compound having no oxazole skeleton. The naphthalene compound may be a compound different from the vinyl naphthalene compound. The naphthalene compound may be a naphthalene compound having no ethylenically unsaturated bonds. The naphthalene compound may be a naphthalene compound having no anthracene ring.
ナフタレン化合物におけるアルコキシ基の炭素数は、優れた解像性及び密着性を得やすい観点から、下記の範囲であってよい。アルコキシ基の炭素数は、１以上、又は、２以上であってよい。アルコキシ基の炭素数は、アルコキシ基の炭素数は、１０以下、８以下、６以下、５以下、４以下、３以下、又は、２以下であってよい。これらの観点から、アルコキシ基の炭素数は、１～１０であってよい。
The number of carbon atoms in the alkoxy group in the naphthalene compound may be within the following range from the viewpoint of easily obtaining excellent resolution and adhesion. The number of carbon atoms in the alkoxy group may be 1 or more, or 2 or more. The number of carbon atoms in the alkoxy group may be 10 or less, 8 or less, 6 or less, 5 or less, 4 or less, 3 or less, or 2 or less. From these points of view, the alkoxy group may have 1 to 10 carbon atoms.
ナフタレン化合物は、優れた解像性及び密着性を得やすい観点から、下記一般式（ｅ）で表される化合物を含んでよい。
From the viewpoint of easily obtaining excellent resolution and adhesion, the naphthalene compound may contain a compound represented by the following general formula (e).
式（ｅ）において、Ｒｅ１、Ｒｅ２、Ｒｅ３及びＲｅ４のアルキル基は、酸素原子が置換していてもよい炭素数１～９のアルキル基であってよい。このようなアルキル基としては、メチル基、エチル基、ｎ－プロピル基、ｉ－プロピル基、ｎ－ブチル基、ｉ－ブチル基、ｎ－ペンチル基、ｎ－ヘキシル基、ｎ－ヘプチル基、ｎ－オクチル基、２－エチルヘキシル基、ｎ－ノニル基、２－ヒドロキシエチル基、３－ヒドロキシエチル基、２－ヒドロキシプロピル基、２－メトキシエトキシ基、２－エトキシエトキシ基、２－フェノキシエトキシ基等が挙げられる。Ｒｅ１及びＲｅ２において、ハロゲノ基としては、フルオロ基、クロロ基、ブロモ基等が挙げられ、アラルキル基としては、ベンジル基、フェネチル基等が挙げられ、アルコキシ基としては、メトキシ基、エトキシ基等が挙げられ、アリールオキシ基としては、フェノキシ基等が挙げられる。
In formula (e), the alkyl groups of R e1 , R e2 , R e3 and R e4 may be C 1-9 alkyl groups optionally substituted with oxygen atoms. Such alkyl groups include methyl, ethyl, n-propyl, i-propyl, n-butyl, i-butyl, n-pentyl, n-hexyl, n-heptyl, n -octyl group, 2-ethylhexyl group, n-nonyl group, 2-hydroxyethyl group, 3-hydroxyethyl group, 2-hydroxypropyl group, 2-methoxyethoxy group, 2-ethoxyethoxy group, 2-phenoxyethoxy group, etc. is mentioned. In R e1 and R e2 , the halogeno group includes a fluoro group, a chloro group, a bromo group and the like, the aralkyl group includes a benzyl group, a phenethyl group and the like, and the alkoxy group includes a methoxy group and an ethoxy group. etc., and the aryloxy group includes a phenoxy group and the like.
ナフタレン化合物としては、１－メトキシナフタレン、１－エトキシナフタレン、１－プロポキシナフタレン、１－ブトキシナフタレン、１，４－ジメトキシナフタレン、１－エトキシ－４－メトキシナフタレン、１，４－ジエトキシナフタレン、１，４－ビス（ｎ－プロポキシ）ナフタレン、１，４－ビス（ｎ－ブトキシ）ナフタレン、１，４－ビス（ｉ－ブトキシ）ナフタレン、１，４－ビス（ｎ－ペンチルオキシ）ナフタレン、１，４－ビス（ｉ－ペンチルオキシ）ナフタレン、１，４－ビス（ｎ－ヘキシルオキシ）ナフタレン、１，４－ビス（ｎ－ヘプチルオキシ）ナフタレン、１，４－ビス（ｎ－オクチルオキシ）ナフタレン、１，４－ビス（２－エチルヘキシルオキシ）ナフタレン、１，４－ビス（ｎ－ノニルオキシ）ナフタレン、１，４－ジベンジルオキシナフタレン、１，４－ジフェネチルオキシナフタレン、１，４－ジグリシジルオキシナフタレン、１，４－ビス（２－メチルグリシジルオキシ）ナフタレン、１－ナフトール、２－ナフトール、１－（２－ヒドロキシエトキシ）ナフタレン、２－（２－ヒドロキシエトキシ）ナフタレン等が挙げられる。
Naphthalene compounds include 1-methoxynaphthalene, 1-ethoxynaphthalene, 1-propoxynaphthalene, 1-butoxynaphthalene, 1,4-dimethoxynaphthalene, 1-ethoxy-4-methoxynaphthalene, 1,4-diethoxynaphthalene, 1 ,4-bis(n-propoxy)naphthalene, 1,4-bis(n-butoxy)naphthalene, 1,4-bis(i-butoxy)naphthalene, 1,4-bis(n-pentyloxy)naphthalene, 1, 4-bis(i-pentyloxy)naphthalene, 1,4-bis(n-hexyloxy)naphthalene, 1,4-bis(n-heptyloxy)naphthalene, 1,4-bis(n-octyloxy)naphthalene, 1,4-bis(2-ethylhexyloxy)naphthalene, 1,4-bis(n-nonyloxy)naphthalene, 1,4-dibenzyloxynaphthalene, 1,4-diphenethyloxynaphthalene, 1,4-diglycidyloxy naphthalene, 1,4-bis(2-methylglycidyloxy)naphthalene, 1-naphthol, 2-naphthol, 1-(2-hydroxyethoxy)naphthalene, 2-(2-hydroxyethoxy)naphthalene and the like.
ナフタレン化合物は、優れた解像性及び密着性を得やすい観点から、ナフタレン環に結合するアルコキシ基を有する化合物（例えば、ナフタレン環に結合する２つのアルコキシ基を有する化合物）を含んでよく、ナフタレン環の１位及び４位からなる群より選ばれる少なくとも一種に結合するアルコキシ基を有する化合物を含んでよく、１，４－ジメトキシナフタレン及び１，４－ジエトキシナフタレンからなる群より選ばれる少なくとも一種を含んでよく、１，４－ジエトキシナフタレンを含んでよい。
The naphthalene compound may contain a compound having an alkoxy group bonded to the naphthalene ring (e.g., a compound having two alkoxy groups bonded to the naphthalene ring) from the viewpoint of easily obtaining excellent resolution and adhesion. At least one selected from the group consisting of 1,4-dimethoxynaphthalene and 1,4-diethoxynaphthalene, which may include a compound having an alkoxy group bonded to at least one selected from the group consisting of the 1- and 4-positions of the ring and may include 1,4-diethoxynaphthalene.
（Ｅ）成分の含有量は、感光性フィルムの全量、又は、感光性樹脂組成物の全量（固形分全量）を基準として下記の範囲であってよい。（Ｅ）成分の含有量は、優れた密着性及び感度を得やすい観点から、０．０１質量％以上、０．０５質量％以上、０．１質量％以上、０．１５質量％以上、０．１９質量％以上、０．２質量％以上、０．４質量％以上、０．５質量％以上、０．８質量％以上、０．９質量％以上、１質量％以上、１．５質量％以上、２質量％以上、又は、２．３質量％以上であってよい。（Ｅ）成分の含有量は、優れた解像性及び密着性を得やすい観点から、１０質量％以下、８質量％以下、５質量％以下、３質量％以下、２．５質量％以下、２．３質量％以下、２質量％以下、１．５質量％以下、１質量％以下、０．９質量％以下、０．８質量％以下、０．５質量％以下、０．４質量％以下、又は、０．２質量％以下であってよい。これらの観点から、（Ｅ）成分の含有量は、０．０１～１０質量％、又は、０．１～５質量％であってよい。
The content of component (E) may be within the following range based on the total amount of the photosensitive film or the total amount of the photosensitive resin composition (total solid content). From the viewpoint of easily obtaining excellent adhesion and sensitivity, the content of component (E) is 0.01% by mass or more, 0.05% by mass or more, 0.1% by mass or more, 0.15% by mass or more, 0 .19% by mass or more, 0.2% by mass or more, 0.4% by mass or more, 0.5% by mass or more, 0.8% by mass or more, 0.9% by mass or more, 1% by mass or more, 1.5% by mass % or more, 2 mass % or more, or 2.3 mass % or more. From the viewpoint of easily obtaining excellent resolution and adhesion, the content of component (E) is 10% by mass or less, 8% by mass or less, 5% by mass or less, 3% by mass or less, 2.5% by mass or less, 2.3% by mass or less, 2% by mass or less, 1.5% by mass or less, 1% by mass or less, 0.9% by mass or less, 0.8% by mass or less, 0.5% by mass or less, 0.4% by mass or less, or 0.2% by mass or less. From these viewpoints, the content of component (E) may be 0.01 to 10% by mass, or 0.1 to 5% by mass.
（Ｅ）成分の含有量は、（Ａ）成分及び（Ｂ）成分の総量１００質量部に対して下記の範囲であってよい。（Ｅ）成分の含有量は、優れた密着性及び感度を得やすい観点から、０．０１質量部以上、０．０５質量部以上、０．１質量部以上、０．１５質量部以上、０．２質量部以上、０．３質量部以上、０．５質量部以上、０．８質量部以上、１質量部以上、１．５質量部以上、２質量部以上、２．５質量部以上、又は、２．６質量部以上であってよい。（Ｅ）成分の含有量は、優れた解像性及び密着性を得やすい観点から、１０質量部以下、５質量部以下、３質量部以下、２．６質量部以下、２．５質量部以下、２質量部以下、１．５質量部以下、１質量部以下、０．８質量部以下、０．５質量部以下、０．３質量部以下、又は、０．２質量部以下であってよい。これらの観点から、（Ｅ）成分の含有量は、０．０１～１０質量部、又は、０．１～５質量部であってよい。
The content of component (E) may be within the following ranges with respect to 100 parts by mass of the total amount of components (A) and (B). From the viewpoint of easily obtaining excellent adhesion and sensitivity, the content of component (E) is 0.01 parts by mass or more, 0.05 parts by mass or more, 0.1 parts by mass or more, 0.15 parts by mass or more, 0 .2 parts by mass or more, 0.3 parts by mass or more, 0.5 parts by mass or more, 0.8 parts by mass or more, 1 part by mass or more, 1.5 parts by mass or more, 2 parts by mass or more, 2.5 parts by mass or more or 2.6 parts by mass or more. The content of component (E) is 10 parts by mass or less, 5 parts by mass or less, 3 parts by mass or less, 2.6 parts by mass or less, and 2.5 parts by mass from the viewpoint of easily obtaining excellent resolution and adhesion. 2 parts by mass or less, 1.5 parts by mass or less, 1 part by mass or less, 0.8 parts by mass or less, 0.5 parts by mass or less, 0.3 parts by mass or less, or 0.2 parts by mass or less you can From these viewpoints, the content of component (E) may be 0.01 to 10 parts by mass, or 0.1 to 5 parts by mass.
（Ｅ）成分の含有量は、（Ｄ）成分１００質量部に対して下記の範囲であってよい。（Ｅ）成分の含有量は、優れた密着性及び感度を得やすい観点から、１質量部以上、５質量部以上、１０質量部以上、３０質量部以上、４０質量部以上、５０質量部以上、７０質量部以上、８０質量部以上、９０質量部以上、１００質量部以上、１５０質量部以上、２００質量部以上、３００質量部以上、又は、４００質量部以上であってよい。（Ｅ）成分の含有量は、優れた解像性及び密着性を得やすい観点から、１０００質量部以下、８００質量部以下、５００質量部以下、４００質量部以下、３００質量部以下、２００質量部以下、１５０質量部以下、１００質量部以下、９０質量部以下、８０質量部以下、７０質量部以下、５０質量部以下、又は、４０質量部以下であってよい。これらの観点から、（Ｅ）成分の含有量は、１～１０００質量部、又は、１０～５００質量部であってよい。
The content of component (E) may be within the following ranges per 100 parts by mass of component (D). The content of component (E) is 1 part by mass or more, 5 parts by mass or more, 10 parts by mass or more, 30 parts by mass or more, 40 parts by mass or more, 50 parts by mass or more from the viewpoint of easily obtaining excellent adhesion and sensitivity. , 70 parts by mass or more, 80 parts by mass or more, 90 parts by mass or more, 100 parts by mass or more, 150 parts by mass or more, 200 parts by mass or more, 300 parts by mass or more, or 400 parts by mass or more. The content of component (E) is 1000 parts by mass or less, 800 parts by mass or less, 500 parts by mass or less, 400 parts by mass or less, 300 parts by mass or less, or 200 parts by mass from the viewpoint of easily obtaining excellent resolution and adhesion. parts or less, 150 parts by mass or less, 100 parts by mass or less, 90 parts by mass or less, 80 parts by mass or less, 70 parts by mass or less, 50 parts by mass or less, or 40 parts by mass or less. From these points of view, the content of component (E) may be 1 to 1000 parts by mass, or 10 to 500 parts by mass.
本実施形態に係る感光性フィルム及び感光性樹脂組成物は、（Ｆ）成分として重合禁止剤（（Ａ）～（Ｅ）成分のいずれかに該当する化合物を除く）を含有してよい。（Ｆ）成分は、レジストパターン形成時の未露光部における重合を抑制し、解像性を向上させやすい。重合禁止剤としては、ｔｅｒｔ－ブチルカテコール（例えば４－ｔｅｒｔ－ブチルカテコール）、ヒンダードアミン（例えば２，２，６，６－テトラメチル－４－ヒドロキシピペリジン－１－オキシル）、４－ヒドロキシ－２，２，６，６－テトラメチルピペリジン－Ｎ－オキシル等が挙げられる。
The photosensitive film and photosensitive resin composition according to the present embodiment may contain a polymerization inhibitor (excluding compounds corresponding to any of components (A) to (E)) as component (F). The component (F) suppresses polymerization in unexposed areas during resist pattern formation, and tends to improve resolution. Polymerization inhibitors include tert-butylcatechol (eg 4-tert-butylcatechol), hindered amines ( eg 2,2,6,6-tetramethyl-4-hydroxypiperidine-1-oxyl), 4-hydroxy-2, 2,6,6-tetramethylpiperidine-N-oxyl and the like.
（Ｆ）成分の含有量は、（Ａ）成分及び（Ｂ）成分の総量１００質量部に対して下記の範囲であってよい。（Ｆ）成分の含有量は、優れた解像性及び密着性を得やすい観点から、０．００１質量部以上、０．００３質量部以上、０．００５質量部以上、０．０１質量部以上、又は、０．０１５質量部以上であってよい。（Ｆ）成分の含有量は、優れた解像性及び密着性を得やすい観点から、０．１質量部以下、０．０５質量部以下、０．０４質量部以下、０．０３質量部以下、又は、０．０２質量部以下であってよい。これらの観点から、（Ｆ）成分の含有量は、０．００１～０．１質量部であってよい。
The content of component (F) may be within the following range with respect to 100 parts by mass of the total amount of components (A) and (B). The content of component (F) is 0.001 parts by mass or more, 0.003 parts by mass or more, 0.005 parts by mass or more, and 0.01 parts by mass or more from the viewpoint of easily obtaining excellent resolution and adhesion. or 0.015 parts by mass or more. The content of component (F) is 0.1 parts by mass or less, 0.05 parts by mass or less, 0.04 parts by mass or less, and 0.03 parts by mass or less from the viewpoint of easily obtaining excellent resolution and adhesion. , or 0.02 parts by mass or less. From these points of view, the content of component (F) may be 0.001 to 0.1 part by mass.
本実施形態に係る感光性樹脂組成物は、有機溶剤を含有してよい。有機溶剤としては、メタノール、エタノール、アセトン、メチルエチルケトン、メチルセロソルブ、エチルセロソルブ、トルエン、Ｎ，Ｎ－ジメチルホルムアミド、プロピレングリコールモノメチルエーテル等が挙げられる。
The photosensitive resin composition according to this embodiment may contain an organic solvent. Organic solvents include methanol, ethanol, acetone, methyl ethyl ketone, methyl cellosolve, ethyl cellosolve, toluene, N,N-dimethylformamide, propylene glycol monomethyl ether and the like.
本実施形態に係る感光性フィルム及び感光性樹脂組成物は、上述した成分以外のその他の成分（（Ａ）～（Ｅ）成分のいずれかに該当する化合物を除く）を含有してよい。その他の成分としては、水素供与体（ビス［４－（ジメチルアミノ）フェニル］メタン、ビス［４－（ジエチルアミノ）フェニル］メタン、ロイコクリスタルバイオレット、Ｎ－フェニルグリシン等）、染料（マラカイトグリーン等）、増感剤、トリブロモフェニルスルホン、光発色剤、熱発色防止剤、可塑剤（ｐ－トルエンスルホンアミド等）、顔料、充填剤、消泡剤、難燃剤、安定剤、密着性付与剤、レベリング剤、剥離促進剤、酸化防止剤、香料、イメージング剤、熱架橋剤などが挙げられる。
The photosensitive film and photosensitive resin composition according to the present embodiment may contain components other than the components described above (excluding compounds corresponding to any of components (A) to (E)). Other components include hydrogen donors (bis[4-(dimethylamino)phenyl]methane, bis[4-(diethylamino)phenyl]methane, leuco crystal violet, N-phenylglycine, etc.) and dyes (malachite green, etc.). , Sensitizer, tribromophenyl sulfone, photocoloring agent, anti-thermocoloring agent, plasticizer (p-toluenesulfonamide, etc.), pigment, filler, antifoaming agent, flame retardant, stabilizer, adhesion imparting agent, Leveling agents, release accelerators, antioxidants, fragrances, imaging agents, thermal cross-linking agents and the like.
本実施形態に係る感光性フィルム及び感光性樹脂組成物において、熱ラジカル重合開始剤の含有量は、感光性フィルムの全量、又は、感光性樹脂組成物の全量（固形分全量）を基準として、０．５質量％以下、０．５質量％未満、０．１質量％以下、０．０１質量％以下、又は、０．００１質量％以下であってよい。本実施形態に係る感光性フィルム及び感光性樹脂組成物は、熱ラジカル重合開始剤を含有しなくてよい（上述の含有量が実質的に０質量％であってよい）。
In the photosensitive film and photosensitive resin composition according to the present embodiment, the content of the thermal radical polymerization initiator is based on the total amount of the photosensitive film or the total amount of the photosensitive resin composition (total solid content), It may be 0.5% by mass or less, less than 0.5% by mass, 0.1% by mass or less, 0.01% by mass or less, or 0.001% by mass or less. The photosensitive film and photosensitive resin composition according to the present embodiment may not contain a thermal radical polymerization initiator (the above content may be substantially 0% by mass).
本実施形態に係る感光性フィルム及び感光性樹脂組成物において、ビニル重合体（例えば、エポキシ基を有する側鎖を含むビニル重合体）、及び、オキセタン化合物（例えば、置換基を有していてもよいオキセタン環を２以上有するオキセタン化合物）からなる群より選ばれる少なくとも一種の含有量は、感光性フィルムの全量、又は、感光性樹脂組成物の全量（固形分全量）を基準として、２０質量％以下、２０質量％未満、１０質量％以下、１質量％以下、０．１質量％以下、０．０１質量％以下、又は、０．００１質量％以下であってよい。本実施形態に係る感光性フィルム及び感光性樹脂組成物は、ビニル重合体（例えば、エポキシ基を有する側鎖を含むビニル重合体）、及び、オキセタン化合物（例えば、置換基を有していてもよいオキセタン環を２以上有するオキセタン化合物）からなる群より選ばれる少なくとも一種を含有しなくてよい（上述の含有量が実質的に０質量％であってよい）。
In the photosensitive film and photosensitive resin composition according to the present embodiment, a vinyl polymer (e.g., a vinyl polymer containing a side chain having an epoxy group) and an oxetane compound (e.g., even if it has a substituent The content of at least one selected from the group consisting of oxetane compounds having two or more good oxetane rings is 20% by mass based on the total amount of the photosensitive film or the total amount of the photosensitive resin composition (total solid content). Below, it may be less than 20% by mass, 10% by mass or less, 1% by mass or less, 0.1% by mass or less, 0.01% by mass or less, or 0.001% by mass or less. The photosensitive film and photosensitive resin composition according to the present embodiment include a vinyl polymer (e.g., a vinyl polymer containing a side chain having an epoxy group) and an oxetane compound (e.g., even if it has a substituent oxetane compounds having two or more good oxetane rings) may not be contained (the above content may be substantially 0% by mass).
本実施形態に係る感光性フィルム及び感光性樹脂組成物において、エポキシ基及びカルボキシル基を有する共重合体の含有量は、感光性フィルムの全量、又は、感光性樹脂組成物の全量（固形分全量）を基準として、２０質量％以下、２０質量％未満、１０質量％以下、１質量％以下、０．１質量％以下、又は、０．０１質量％以下であってよい。本実施形態に係る感光性フィルム及び感光性樹脂組成物は、エポキシ基及びカルボキシル基を有する共重合体を含有しなくてよい（上述の含有量が実質的に０質量％であってよい）。
In the photosensitive film and photosensitive resin composition according to the present embodiment, the content of the copolymer having an epoxy group and a carboxyl group is the total amount of the photosensitive film or the total amount of the photosensitive resin composition (the total solid content ), it may be 20% by mass or less, less than 20% by mass, 10% by mass or less, 1% by mass or less, 0.1% by mass or less, or 0.01% by mass or less. The photosensitive film and photosensitive resin composition according to the present embodiment may not contain a copolymer having an epoxy group and a carboxyl group (the above content may be substantially 0% by mass).
本実施形態に係る感光性フィルム及び感光性樹脂組成物において、芳香族ヨードニウム塩の含有量は、感光性フィルムの全量、又は、感光性樹脂組成物の全量（固形分全量）を基準として、０．５質量％以下、０．５質量％未満、０．１質量％以下、０．０１質量％以下、又は、０．００１質量％以下であってよい。本実施形態に係る感光性フィルム及び感光性樹脂組成物は、芳香族ヨードニウム塩を含有しなくてよい（上述の含有量が実質的に０質量％であってよい）。
In the photosensitive film and photosensitive resin composition according to the present embodiment, the content of the aromatic iodonium salt is 0 based on the total amount of the photosensitive film or the total amount of the photosensitive resin composition (total solid content). 0.5% by mass or less, less than 0.5% by mass, 0.1% by mass or less, 0.01% by mass or less, or 0.001% by mass or less. The photosensitive film and photosensitive resin composition according to this embodiment may not contain an aromatic iodonium salt (the above content may be substantially 0% by mass).
本実施形態に係る感光性フィルム及び感光性樹脂組成物において、フェノール性水酸基を有する樹脂の含有量、又は、フェノール性水酸基を有するノボラック樹脂の含有量は、感光性フィルムの全量、又は、感光性樹脂組成物の全量（固形分全量）を基準として、３０質量％以下、３０質量％未満、１５質量％以下、１５質量％未満、１０質量％以下、１質量％以下、０．１質量％以下、又は、０．０１質量％以下であってよい。本実施形態に係る感光性フィルム及び感光性樹脂組成物は、フェノール性水酸基を有する樹脂を含有しなくてよく（上述の含有量が実質的に０質量％であってよく）、フェノール性水酸基を有するノボラック樹脂を含有しなくてよい（上述の含有量が実質的に０質量％であってよい）。
In the photosensitive film and the photosensitive resin composition according to the present embodiment, the content of the resin having a phenolic hydroxyl group or the content of the novolak resin having a phenolic hydroxyl group is the total amount of the photosensitive film or the photosensitive resin composition. Based on the total amount of the resin composition (total solid content), 30% by mass or less, less than 30% by mass, 15% by mass or less, less than 15% by mass, 10% by mass or less, 1% by mass or less, 0.1% by mass or less , or 0.01% by mass or less. The photosensitive film and the photosensitive resin composition according to the present embodiment may not contain a resin having a phenolic hydroxyl group (the above content may be substantially 0% by mass), and the phenolic hydroxyl group may be (the above content may be substantially 0% by mass).
本実施形態に係る感光性フィルム及び感光性樹脂組成物において、２つ以上のオキシラン環を有するエポキシ化合物の含有量、又は、２つ以上のオキシラン環を有する脂肪族又は脂環式エポキシ化合物の含有量は、（Ａ）成分１００質量部に対して、４０質量部以下、４０質量部未満、２０質量部以下、２０質量部未満、１０質量部以下、１０質量部未満、１質量部以下、０．１質量部以下、又は、０．０１質量部以下であってよい。本実施形態に係る感光性フィルム及び感光性樹脂組成物は、２つ以上のオキシラン環を有するエポキシ化合物を含有しなくてよく（上述の含有量が実質的に０質量部であってよく）、２つ以上のオキシラン環を有する脂肪族又は脂環式エポキシ化合物を含有しなくてよい（上述の含有量が実質的に０質量部であってよい）。
In the photosensitive film and photosensitive resin composition according to the present embodiment, the content of an epoxy compound having two or more oxirane rings, or the content of an aliphatic or alicyclic epoxy compound having two or more oxirane rings The amount is 40 parts by mass or less, less than 40 parts by mass, 20 parts by mass or less, less than 20 parts by mass, 10 parts by mass or less, less than 10 parts by mass, 1 part by mass or less, or 0 .1 parts by mass or less, or 0.01 parts by mass or less. The photosensitive film and photosensitive resin composition according to the present embodiment may not contain an epoxy compound having two or more oxirane rings (the above content may be substantially 0 parts by mass), It may not contain an aliphatic or cycloaliphatic epoxy compound having two or more oxirane rings (the aforementioned content may be substantially 0 parts by mass).
本実施形態に係る感光性フィルム及び感光性樹脂組成物は、環状脂肪族基を有する重合性化合物を含有しなくてよい（当該重合性化合物の含有量が、感光性フィルムの全量、又は、感光性樹脂組成物の全量（固形分全量）を基準として実質的に０質量％であってよい）。
The photosensitive film and the photosensitive resin composition according to the present embodiment may not contain a polymerizable compound having a cycloaliphatic group (the content of the polymerizable compound is the total amount of the photosensitive film, or the photosensitive may be substantially 0% by mass based on the total amount (total solid content) of the resin composition).
本実施形態に係る感光性フィルム及び感光性樹脂組成物において、オニウムボレート塩及びオニウムガレート塩の合計量は、（Ａ）成分１００質量部に対して、０．１質量部以下、０．１質量部未満、０．０１質量部以下、又は、０．００１質量部以下であってよい。本実施形態に係る感光性フィルム及び感光性樹脂組成物は、オニウムボレート塩及びオニウムガレート塩を含有しなくてよい（上述の合計量が実質的に０質量部であってよい）。
In the photosensitive film and photosensitive resin composition according to the present embodiment, the total amount of onium borate salt and onium gallate salt is 0.1 parts by mass or less and 0.1 parts by mass with respect to 100 parts by mass of component (A). It may be less than parts, 0.01 parts by mass or less, or 0.001 parts by mass or less. The photosensitive film and photosensitive resin composition according to this embodiment may not contain an onium borate salt and an onium gallate salt (the above total amount may be substantially 0 parts by mass).
本実施形態に係る感光性フィルム及び感光性樹脂組成物において、多官能エポキシ樹脂の含有量は、感光性フィルムの全量、又は、感光性樹脂組成物の全量（固形分全量）を基準として、７５質量％以下、７５質量％未満、５０質量％以下、１０質量％以下、１質量％以下、０．１質量％以下、又は、０．０１質量％以下であってよい。本実施形態に係る感光性フィルム及び感光性樹脂組成物は、多官能エポキシ樹脂を含有しなくてよい（上述の含有量が実質的に０質量％であってよい）。
In the photosensitive film and photosensitive resin composition according to the present embodiment, the content of the polyfunctional epoxy resin is 75 based on the total amount of the photosensitive film or the total amount of the photosensitive resin composition (total solid content). % by mass or less, less than 75% by mass, 50% by mass or less, 10% by mass or less, 1% by mass or less, 0.1% by mass or less, or 0.01% by mass or less. The photosensitive film and photosensitive resin composition according to the present embodiment may not contain a polyfunctional epoxy resin (the above content may be substantially 0% by mass).
本実施形態に係る感光性フィルム及び感光性樹脂組成物は、カルボキシル基、フェノール性水酸基、スルホン酸基及びチオール基からなる群より選ばれる少なくとも一種を有するポリイミドを含有しなくてよい（当該ポリイミドの含有量が、感光性フィルムの全量、又は、感光性樹脂組成物の全量（固形分全量）を基準として実質的に０質量％であってよい）。
The photosensitive film and photosensitive resin composition according to the present embodiment may not contain a polyimide having at least one selected from the group consisting of carboxyl groups, phenolic hydroxyl groups, sulfonic acid groups and thiol groups (the polyimide The content may be substantially 0% by mass based on the total amount of the photosensitive film or the total amount of the photosensitive resin composition (the total solid content)).
本実施形態に係る感光性フィルム及び感光性樹脂組成物において、メルカプト基を有する化合物の含有量は、（Ａ）成分及び（Ｂ）成分の総量１００質量部に対して、０．００１質量部以下、０．００１質量部未満、０．０００１質量部以下、又は、０．００００１質量部以下であってよい。本実施形態に係る感光性フィルム及び感光性樹脂組成物は、メルカプト基を有する化合物を含有しなくてよい（上述の含有量が実質的に０質量部であってよい）。
In the photosensitive film and photosensitive resin composition according to the present embodiment, the content of the compound having a mercapto group is 0.001 parts by mass or less with respect to 100 parts by mass of the total amount of components (A) and (B). , less than 0.001 parts by weight, 0.0001 parts by weight or less, or 0.00001 parts by weight or less. The photosensitive film and photosensitive resin composition according to the present embodiment may not contain a compound having a mercapto group (the above content may be substantially 0 parts by mass).
本実施形態に係る感光性フィルム及び感光性樹脂組成物において、ビスフェノールＦ型（メタ）アクリル酸化合物（ビスフェノールＦ構造を有する（メタ）アクリル酸化合物）の含有量、又は、ビスフェノールＦ型アクリル酸化合物の含有量は、（Ｂ）成分の全質量を基準として、５質量％以下、５質量％未満、１質量％以下、１質量％未満、０．１質量％以下、０．０１質量％以下、又は、０．００１質量％以下であってよい。本実施形態に係る感光性フィルム及び感光性樹脂組成物において、ビスフェノールＦ型（メタ）アクリル酸化合物の含有量、又は、ビスフェノールＦ型アクリル酸化合物の含有量は、感光性フィルムの全量、又は、感光性樹脂組成物の全量（固形分全量）を基準として、０．２質量％以下、０．１５質量％以下、０．１５質量％未満、０．１質量％以下、又は、０．０１質量％以下であってよい。本実施形態に係る感光性フィルム及び感光性樹脂組成物は、ビスフェノールＦ型（メタ）アクリル酸化合物を含有しなくてよく（上述の各含有量が実質的に０質量％であってよく）、ビスフェノールＦ型アクリル酸化合物を含有しなくてよい（上述の各含有量が実質的に０質量％であってよい）。
In the photosensitive film and photosensitive resin composition according to the present embodiment, the content of the bisphenol F-type (meth)acrylic acid compound ((meth)acrylic acid compound having a bisphenol F structure), or the bisphenol F-type acrylic acid compound The content of is, based on the total mass of component (B), 5% by mass or less, less than 5% by mass, 1% by mass or less, less than 1% by mass, 0.1% by mass or less, 0.01% by mass or less, Alternatively, it may be 0.001% by mass or less. In the photosensitive film and photosensitive resin composition according to the present embodiment, the content of the bisphenol F-type (meth)acrylic acid compound or the content of the bisphenol F-type acrylic acid compound is the total amount of the photosensitive film, or Based on the total amount of the photosensitive resin composition (total solid content), 0.2% by mass or less, 0.15% by mass or less, less than 0.15% by mass, 0.1% by mass or less, or 0.01% by mass % or less. The photosensitive film and the photosensitive resin composition according to the present embodiment may not contain a bisphenol F-type (meth)acrylic acid compound (each content described above may be substantially 0% by mass), It may not contain a bisphenol F-type acrylic acid compound (each content described above may be substantially 0% by mass).
本実施形態に係る感光性フィルム及び感光性樹脂組成物において、（Ａ）成分及び（Ｂ）成分以外の成分の含有量（固形分全量）は、（Ｂ）成分１００質量部に対して、１５質量部以上、１９質量部以上、１９質量部超、２０質量部以上、２１質量部以上、２２質量部以上、又は、２３質量部以上であってよい。
In the photosensitive film and photosensitive resin composition according to the present embodiment, the content of components other than the components (A) and (B) (the total solid content) is 15 parts per 100 parts by mass of the component (B). It may be at least 19 parts by mass, at least 19 parts by mass, at least 20 parts by mass, at least 21 parts by mass, at least 22 parts by mass, or at least 23 parts by mass.
本実施形態に係る感光性フィルム及び感光性樹脂組成物は、含窒素基を有する重合体を含有しなくてよい（含窒素基を有する重合体の含有量が、感光性フィルムの全量、又は、感光性樹脂組成物の全量（固形分全量）を基準として実質的に０質量％であってよい）。
The photosensitive film and photosensitive resin composition according to the present embodiment may not contain a polymer having a nitrogen-containing group (the content of the polymer having a nitrogen-containing group is the total amount of the photosensitive film, or It may be substantially 0% by mass based on the total amount (total solid content) of the photosensitive resin composition).
本実施形態に係る感光性フィルム及び感光性樹脂組成物において、アクリジン化合物（アクリジン環を有する化合物）の含有量は、感光性フィルムの全量、又は、感光性樹脂組成物の全量（固形分全量）を基準として、０．１質量％以下、０．１質量％未満、０．０１質量％以下、又は、０．００１質量％以下であってよい。本実施形態に係る感光性フィルム及び感光性樹脂組成物は、アクリジン化合物を含有しなくてよい（上述の含有量が実質的に０質量％であってよい）。
In the photosensitive film and photosensitive resin composition according to the present embodiment, the content of the acridine compound (compound having an acridine ring) is the total amount of the photosensitive film or the total amount of the photosensitive resin composition (total solid content). may be 0.1% by mass or less, less than 0.1% by mass, 0.01% by mass or less, or 0.001% by mass or less. The photosensitive film and photosensitive resin composition according to the present embodiment may not contain an acridine compound (the above content may be substantially 0% by mass).
＜感光性エレメント＞
本実施形態に係る感光性エレメントは、支持体と、当該支持体上に配置された感光性樹脂層と、を備え、感光性樹脂層が、本実施形態に係る感光性フィルムである。本実施形態に係る感光性エレメントは、感光性樹脂層上に配置された保護層を備えてよい。本実施形態に係る感光性エレメントは、クッション層、接着層、光吸収層、ガスバリア層等を備えてよい。感光性エレメントは、シート状であってよく、巻芯にロール状に巻き取られた感光性エレメントロールの形態であってよい。 <Photosensitive element>
A photosensitive element according to this embodiment includes a support and a photosensitive resin layer disposed on the support, and the photosensitive resin layer is the photosensitive film according to this embodiment. The photosensitive element according to this embodiment may comprise a protective layer disposed on the photosensitive resin layer. The photosensitive element according to this embodiment may comprise a cushion layer, an adhesive layer, a light absorbing layer, a gas barrier layer, and the like. The photosensitive element may be in the form of a sheet, or in the form of a photosensitive element roll wound around a core.
本実施形態に係る感光性エレメントは、支持体と、当該支持体上に配置された感光性樹脂層と、を備え、感光性樹脂層が、本実施形態に係る感光性フィルムである。本実施形態に係る感光性エレメントは、感光性樹脂層上に配置された保護層を備えてよい。本実施形態に係る感光性エレメントは、クッション層、接着層、光吸収層、ガスバリア層等を備えてよい。感光性エレメントは、シート状であってよく、巻芯にロール状に巻き取られた感光性エレメントロールの形態であってよい。 <Photosensitive element>
A photosensitive element according to this embodiment includes a support and a photosensitive resin layer disposed on the support, and the photosensitive resin layer is the photosensitive film according to this embodiment. The photosensitive element according to this embodiment may comprise a protective layer disposed on the photosensitive resin layer. The photosensitive element according to this embodiment may comprise a cushion layer, an adhesive layer, a light absorbing layer, a gas barrier layer, and the like. The photosensitive element may be in the form of a sheet, or in the form of a photosensitive element roll wound around a core.
図１は、感光性エレメントの一例を示す模式断面図である。図１に示すように、感光性エレメント１は、支持体（支持フィルム）２と、支持体２上に配置された感光性樹脂層（感光性フィルム）３と、感光性樹脂層３上に配置された保護層（保護フィルム）４と、を備えている。感光性樹脂層３は、本実施形態に係る感光性樹脂組成物からなる。
FIG. 1 is a schematic cross-sectional view showing an example of a photosensitive element. As shown in FIG. 1, the photosensitive element 1 includes a support (support film) 2, a photosensitive resin layer (photosensitive film) 3 disposed on the support 2, and a photosensitive resin layer 3 disposed on the and a protective layer (protective film) 4. The photosensitive resin layer 3 is made of the photosensitive resin composition according to this embodiment.
感光性エレメント１は、例えば、次の手順で得ることができる。まず、支持体２上に感光性樹脂層３を形成する。感光性樹脂層３は、例えば、有機溶剤を含有する感光性樹脂組成物を塗布して形成された塗布層を乾燥することにより形成できる。次いで、感光性樹脂層３上に保護層４を配置する。
The photosensitive element 1 can be obtained, for example, by the following procedure. First, the photosensitive resin layer 3 is formed on the support 2 . The photosensitive resin layer 3 can be formed, for example, by drying a coating layer formed by applying a photosensitive resin composition containing an organic solvent. Next, a protective layer 4 is arranged on the photosensitive resin layer 3 .
支持体及び保護層のそれぞれは、耐熱性及び耐溶剤性を有するポリマーフィルムであってよく、ポリエステルフィルム（ポリエチレンテレフタレートフィルム等）、ポリオレフィンフィルム（ポリエチレンフィルム、ポリプロピレンフィルム等）、炭化水素系ポリマー（ポリオレフィンフィルムを除く）などであってよい。保護層を構成するフィルムの種類と、支持体を構成するフィルムの種類とは、互いに同一であってよく、互いに異なっていてもよい。
Each of the support and the protective layer may be a polymer film having heat resistance and solvent resistance, such as a polyester film (polyethylene terephthalate film, etc.), a polyolefin film (polyethylene film, polypropylene film, etc.), a hydrocarbon-based polymer (polyolefin film, etc.). excluding film). The type of film forming the protective layer and the type of film forming the support may be the same or different.
支持体の厚さは、支持体を感光性樹脂層から剥離する際の支持体の破損を抑制しやすい観点から、１μｍ以上、５μｍ以上、１０μｍ以上、又は、１５μｍ以上であってよい。支持体の厚さは、支持体を介して露光する場合に好適に露光しやすい観点から、１００μｍ以下、５０μｍ以下、３０μｍ以下、又は、２０μｍ以下であってよい。
The thickness of the support may be 1 µm or more, 5 µm or more, 10 µm or more, or 15 µm or more from the viewpoint of easily suppressing damage to the support when the support is peeled off from the photosensitive resin layer. The thickness of the support may be 100 μm or less, 50 μm or less, 30 μm or less, or 20 μm or less from the viewpoint of favorable exposure when exposed through the support.
保護層の厚さは、保護層を剥がしながら感光性樹脂層及び支持体を基材上にラミネートする際の保護層の破損を抑制しやすい観点から、１μｍ以上、５μｍ以上、１０μｍ以上、又は、１５μｍ以上であってよい。保護層の厚さは、生産性が向上しやすい観点から、１００μｍ以下、５０μｍ以下、又は、３０μｍ以下であってよい。
The thickness of the protective layer is 1 μm or more, 5 μm or more, 10 μm or more, or It may be 15 μm or more. The thickness of the protective layer may be 100 μm or less, 50 μm or less, or 30 μm or less from the viewpoint of easily improving productivity.
＜積層体の製造方法＞
本実施形態に係る積層体の製造方法は、本実施形態に係る感光性エレメント又は感光性樹脂組成物を用いて感光性樹脂層を基材（例えば基板）上に配置する感光性樹脂層配置工程と、感光性樹脂層の一部を光硬化させる（露光する）露光工程と、感光性樹脂層の未硬化部（未露光部）の少なくとも一部を除去して硬化物パターンを形成する現像工程と、基材における硬化物パターンが形成されていない部分の少なくとも一部に金属層を形成する金属層形成工程と、を備える。本実施形態に係る積層体は、本実施形態に係る積層体の製造方法により得られ、配線基板（例えばプリント配線板）であってよい。本実施形態に係る積層体は、基材と、当該基材上に配置された硬化物パターン（本実施形態に係る硬化物）と、基材における硬化物パターンが形成されていない部分の少なくとも一部に配置された金属層と、を備える態様であってもよい。 <Method for manufacturing laminate>
The method for producing a laminate according to the present embodiment includes a photosensitive resin layer placement step of placing a photosensitive resin layer on a substrate (for example, a substrate) using the photosensitive element or the photosensitive resin composition according to the present embodiment. An exposure step of photocuring (exposing) a portion of the photosensitive resin layer, and a developing step of removing at least a portion of the uncured portion (unexposed portion) of the photosensitive resin layer to form a cured product pattern. and a metal layer forming step of forming a metal layer on at least part of a portion of the substrate where the cured product pattern is not formed. The laminate according to this embodiment is obtained by the method for producing a laminate according to this embodiment, and may be a wiring board (for example, a printed wiring board). The laminate according to the present embodiment includes a substrate, a cured product pattern (cured product according to the present embodiment) arranged on the substrate, and at least one part of the substrate where the cured product pattern is not formed. and a metal layer disposed on the part.
本実施形態に係る積層体の製造方法は、本実施形態に係る感光性エレメント又は感光性樹脂組成物を用いて感光性樹脂層を基材（例えば基板）上に配置する感光性樹脂層配置工程と、感光性樹脂層の一部を光硬化させる（露光する）露光工程と、感光性樹脂層の未硬化部（未露光部）の少なくとも一部を除去して硬化物パターンを形成する現像工程と、基材における硬化物パターンが形成されていない部分の少なくとも一部に金属層を形成する金属層形成工程と、を備える。本実施形態に係る積層体は、本実施形態に係る積層体の製造方法により得られ、配線基板（例えばプリント配線板）であってよい。本実施形態に係る積層体は、基材と、当該基材上に配置された硬化物パターン（本実施形態に係る硬化物）と、基材における硬化物パターンが形成されていない部分の少なくとも一部に配置された金属層と、を備える態様であってもよい。 <Method for manufacturing laminate>
The method for producing a laminate according to the present embodiment includes a photosensitive resin layer placement step of placing a photosensitive resin layer on a substrate (for example, a substrate) using the photosensitive element or the photosensitive resin composition according to the present embodiment. An exposure step of photocuring (exposing) a portion of the photosensitive resin layer, and a developing step of removing at least a portion of the uncured portion (unexposed portion) of the photosensitive resin layer to form a cured product pattern. and a metal layer forming step of forming a metal layer on at least part of a portion of the substrate where the cured product pattern is not formed. The laminate according to this embodiment is obtained by the method for producing a laminate according to this embodiment, and may be a wiring board (for example, a printed wiring board). The laminate according to the present embodiment includes a substrate, a cured product pattern (cured product according to the present embodiment) arranged on the substrate, and at least one part of the substrate where the cured product pattern is not formed. and a metal layer disposed on the part.
感光性樹脂層配置工程では、本実施形態に係る感光性樹脂組成物からなる感光性樹脂層を基材上に配置する。例えば、感光性樹脂層は、感光性エレメントから保護層を除去した後、感光性エレメントの感光性樹脂層を加熱しながら基材に圧着することによって形成してよく、感光性樹脂組成物を基材上に塗布及び乾燥することによって形成してよい。
In the photosensitive resin layer placement step, a photosensitive resin layer made of the photosensitive resin composition according to the present embodiment is placed on the substrate. For example, the photosensitive resin layer may be formed by removing the protective layer from the photosensitive element and pressing the photosensitive resin layer of the photosensitive element onto the substrate while heating. It may be formed by coating and drying on the material.
露光工程では、感光性樹脂層上にマスクを配置した状態で活性光線を照射して、感光性樹脂層におけるマスクが配置された領域以外の領域を露光して光硬化させてよく、マスクを用いずに、ＬＤＩ露光法、ＤＬＰ露光法等の直接描画露光法により活性光線を所望のパターンで照射して感光性樹脂層の一部を露光して光硬化させてよい。活性光線の光源としては、紫外光源又は可視光源を用いてよく、カーボンアーク灯、水銀蒸気アーク灯、高圧水銀灯、キセノンランプ、ガスレーザ（アルゴンレーザ等）、固体レーザ（ＹＡＧレーザ等）、半導体レーザなどが挙げられる。
In the exposure step, an actinic ray is irradiated with a mask placed on the photosensitive resin layer, and a region other than the region where the mask is placed in the photosensitive resin layer may be exposed and photocured. Instead, a part of the photosensitive resin layer may be exposed and photocured by irradiating actinic rays in a desired pattern by a direct drawing exposure method such as an LDI exposure method or a DLP exposure method. As a light source for actinic rays, an ultraviolet light source or a visible light source may be used, such as a carbon arc lamp, a mercury vapor arc lamp, a high-pressure mercury lamp, a xenon lamp, a gas laser (such as an argon laser), a solid-state laser (such as a YAG laser), a semiconductor laser, and the like. is mentioned.
現像工程における現像方法は、例えば、ウェット現像又はドライ現像であってよい。ウェット現像は、感光性樹脂組成物に対応した現像液を用いて、例えば、ディップ方式、パドル方式、スプレー方式、ブラッシング、スラッピング、スクラッビング、揺動浸漬等の方法により行うことができる。現像液は、感光性樹脂組成物の構成に応じて適宜選択され、アルカリ現像液又は有機溶剤現像液であってよい。
The development method in the development process may be, for example, wet development or dry development. Wet development can be carried out by using a developer corresponding to the photosensitive resin composition, for example, by dipping, puddle, spraying, brushing, slapping, scrubbing, rocking immersion, and the like. The developer is appropriately selected according to the constitution of the photosensitive resin composition, and may be an alkaline developer or an organic solvent developer.
アルカリ現像液は、リチウム、ナトリウム又はカリウムの水酸化物等の水酸化アルカリ；リチウム、ナトリウム、カリウム若しくはアンモニウムの炭酸塩又は重炭酸塩等の炭酸アルカリ；リン酸カリウム、リン酸ナトリウム等のアルカリ金属リン酸塩；ピロリン酸ナトリウム、ピロリン酸カリウム等のアルカリ金属ピロリン酸塩；ホウ砂；メタケイ酸ナトリウム；水酸化テトラメチルアンモニウム；エタノールアミン；エチレンジアミン；ジエチレントリアミン；２－アミノ－２－ヒドロキシメチル－１，３－プロパンジオール；１，３－ジアミノ－２－プロパノール；モルホリンなどの塩基を含む水溶液であってよい。
Alkaline developers include alkali hydroxides such as lithium, sodium or potassium hydroxide; alkali carbonates such as lithium, sodium, potassium or ammonium carbonates or bicarbonates; alkali metals such as potassium phosphate and sodium phosphate. Phosphates; alkali metal pyrophosphates such as sodium pyrophosphate and potassium pyrophosphate; borax; sodium metasilicate; tetramethylammonium hydroxide; ethanolamine; ethylenediamine; diethylenetriamine; It may be an aqueous solution containing a base such as 3-propanediol; 1,3-diamino-2-propanol; morpholine.
有機溶剤現像液は、１，１，１－トリクロロエタン、Ｎ－メチルピロリドン、Ｎ，Ｎ－ジメチルホルムアミド、シクロヘキサノン、メチルイソブチルケトン、γ－ブチロラクトン等の有機溶剤を含有してよい。
The organic solvent developer may contain organic solvents such as 1,1,1-trichloroethane, N-methylpyrrolidone, N,N-dimethylformamide, cyclohexanone, methylisobutylketone and γ-butyrolactone.
金属層形成工程における金属層は、例えば金属銅層であってよい。金属層は、例えば、めっき処理を施すことにより形成できる。めっき処理は、電解めっき処理及び無電解めっき処理の一方又は両方であってよい。
The metal layer in the metal layer forming step may be, for example, a metal copper layer. The metal layer can be formed by plating, for example. The plating treatment may be one or both of electrolytic plating treatment and electroless plating treatment.
本実施形態に係る積層体の製造方法は、現像工程の後に、６０～２５０℃の加熱、又は、０．２～１０Ｊ／ｃｍ２での露光を行うことによりレジストパターンを更に硬化させる工程を備えてよい。
The method for manufacturing a laminate according to the present embodiment includes a step of further curing the resist pattern by heating at 60 to 250° C. or exposing at 0.2 to 10 J/cm 2 after the developing step. you can
本実施形態に係る積層体の製造方法は、金属層形成工程の後に、硬化物パターンを除去する工程を備えてよい。硬化物パターンは、例えば、強アルカリ性水溶液を用いて、浸漬方式、スプレー方式等の現像を行うことにより除去できる。
The method for manufacturing a laminate according to this embodiment may include a step of removing the cured product pattern after the metal layer forming step. The cured product pattern can be removed by, for example, developing with a strong alkaline aqueous solution by an immersion method, a spray method, or the like.
図２は、積層体の製造方法の一例（配線基板の製造方法）を示す模式図である。積層体の製造方法の一例では、まず、図２（ａ）に示すように、絶縁層１０ａと、絶縁層１０ａ上に配置された導体層１０ｂとを備える基材（例えば回路形成用基板）１０を用意する。導体層１０ｂは、例えば金属銅層であってよい。
FIG. 2 is a schematic diagram showing an example of a method for manufacturing a laminate (method for manufacturing a wiring board). In one example of the method for manufacturing a laminate, first, as shown in FIG. prepare. The conductor layer 10b may be, for example, a metallic copper layer.
次いで、図２（ｂ）に示すように、基材１０の導体層１０ｂ上に感光性樹脂層１２を配置する（感光性樹脂層配置工程）。感光性樹脂層配置工程では、本実施形態に係る感光性エレメント又は感光性樹脂組成物を用いて感光性樹脂層１２を基材１０の導体層１０ｂ上に配置する。
Next, as shown in FIG. 2(b), the photosensitive resin layer 12 is arranged on the conductor layer 10b of the substrate 10 (photosensitive resin layer arrangement step). In the photosensitive resin layer arranging step, the photosensitive resin layer 12 is arranged on the conductor layer 10b of the substrate 10 using the photosensitive element or the photosensitive resin composition according to this embodiment.
次いで、図２（ｃ）に示すように、感光性樹脂層１２上にマスク１４を配置した状態で活性光線Ｌを照射して、感光性樹脂層１２におけるマスク１４が配置された領域以外の領域を露光して光硬化させる。
Next, as shown in FIG. 2(c), actinic rays L are irradiated with the mask 14 placed on the photosensitive resin layer 12, and the area of the photosensitive resin layer 12 other than the area where the mask 14 is placed is exposed. is exposed to photocure.
次いで、マスク１４を除去した後、図２（ｄ）に示すように、感光性樹脂層における光硬化部以外の領域（未硬化部）を現像により基材１０上から除去して、光硬化部（感光性樹脂層の硬化物）からなるレジストパターン１２ａを形成する。
Next, after removing the mask 14, as shown in FIG. A resist pattern 12a made of (a cured product of a photosensitive resin layer) is formed.
次いで、図２（ｅ）に示すように、基材１０の導体層１０ｂにおけるレジストパターン１２ａが形成されていない部分に配線層（金属層）１６を形成する。配線層１６は、導体層１０ｂと同種の材料で形成されていてよく、異種の材料で形成されていてもよい。
Next, as shown in FIG. 2(e), a wiring layer (metal layer) 16 is formed on a portion of the conductor layer 10b of the substrate 10 where the resist pattern 12a is not formed. The wiring layer 16 may be made of the same material as the conductor layer 10b, or may be made of a different material.
次いで、図２（ｆ）に示すように、レジストパターン１２ａを除去すると共に、レジストパターン１２ａに対応する位置に設けられている導体層１０ｂを除去することにより導体層１０ｃを形成する。これにより、絶縁層１０ａ上に配置された導体層１０ｃ及び配線層１６を備える配線基板１８が得られる。導体層１０ｂは、エッチング処理により除去できる。エッチング液は、導体層１０ｂの種類に応じて適宜選択され、例えば、塩化第二銅溶液、塩化第二鉄溶液、アルカリエッチング溶液、過酸化水素エッチング液等であってよい。
Next, as shown in FIG. 2(f), the conductor layer 10c is formed by removing the resist pattern 12a and removing the conductor layer 10b provided at the position corresponding to the resist pattern 12a. Thus, the wiring substrate 18 including the conductor layer 10c and the wiring layer 16 arranged on the insulating layer 10a is obtained. The conductor layer 10b can be removed by an etching process. The etching solution is appropriately selected according to the type of the conductor layer 10b, and may be, for example, a cupric chloride solution, a ferric chloride solution, an alkaline etching solution, a hydrogen peroxide etching solution, or the like.
以下、実施例により本開示を更に具体的に説明するが、本開示はこれらの実施例に限定されるものではない。
The present disclosure will be described in more detail below with reference to examples, but the present disclosure is not limited to these examples.
＜バインダーポリマーの合成＞
メタクリル酸２７質量部、メタクリル酸２－ヒドロキシエチル３質量部、メタクリル酸ベンジル２０質量部、スチレン５０質量部、及び、アゾビスイソブチロニトリル０．９質量部を混合することにより溶液（ａ）を調製した。メチルセロソルブ３０質量部及びトルエン２０質量部の混合液５０質量部にアゾビスイソブチロニトリル０．５質量部を溶解することにより溶液（ｂ）を調製した。撹拌機、還流冷却器、温度計、滴下ロート及び窒素ガス導入管を備えるフラスコに、メチルセロソルブ３０質量部及びトルエン２０質量部の混合液を５００ｇ投入した後、フラスコ内に窒素ガスを吹き込みながら撹拌し、８０℃まで昇温させた。一定の滴下速度で溶液（ａ）を上述のフラスコ内に４時間かけて滴下した後、フラスコ内の溶液を８０℃にて２時間撹拌した。次いで、一定の滴下速度で溶液（ｂ）を上述のフラスコ内に１０分間かけて滴下した後、フラスコ内の溶液を８０℃にて３時間撹拌した。さらに、フラスコ内の溶液を３０分間かけて９０℃まで昇温させ、９０℃にて２時間保温した後、撹拌を止め、室温（２５℃）まで冷却することによりバインダーポリマーの溶液を得た。バインダーポリマーの溶液の不揮発分（固形分）は４９質量％であった。 <Synthesis of binder polymer>
Solution (a) by mixing 27 parts by mass of methacrylic acid, 3 parts by mass of 2-hydroxyethyl methacrylate, 20 parts by mass of benzyl methacrylate, 50 parts by mass of styrene, and 0.9 parts by mass of azobisisobutyronitrile was prepared. A solution (b) was prepared by dissolving 0.5 parts by mass of azobisisobutyronitrile in 50 parts by mass of a mixture of 30 parts by mass of methyl cellosolve and 20 parts by mass of toluene. 500 g of a mixture of 30 parts by mass of methyl cellosolve and 20 parts by mass of toluene was added to a flask equipped with a stirrer, reflux condenser, thermometer, dropping funnel, and nitrogen gas inlet tube, and then stirred while blowing nitrogen gas into the flask. and the temperature was raised to 80°C. After the solution (a) was dropped into the flask over 4 hours at a constant dropping rate, the solution in the flask was stirred at 80° C. for 2 hours. Next, the solution (b) was added dropwise into the flask over 10 minutes at a constant dropping rate, and then the solution in the flask was stirred at 80° C. for 3 hours. Further, the temperature of the solution in the flask was raised to 90°C over 30 minutes, and the temperature was maintained at 90°C for 2 hours, then stirring was stopped and the solution was cooled to room temperature (25°C) to obtain a binder polymer solution. The non-volatile content (solid content) of the binder polymer solution was 49% by mass.
メタクリル酸２７質量部、メタクリル酸２－ヒドロキシエチル３質量部、メタクリル酸ベンジル２０質量部、スチレン５０質量部、及び、アゾビスイソブチロニトリル０．９質量部を混合することにより溶液（ａ）を調製した。メチルセロソルブ３０質量部及びトルエン２０質量部の混合液５０質量部にアゾビスイソブチロニトリル０．５質量部を溶解することにより溶液（ｂ）を調製した。撹拌機、還流冷却器、温度計、滴下ロート及び窒素ガス導入管を備えるフラスコに、メチルセロソルブ３０質量部及びトルエン２０質量部の混合液を５００ｇ投入した後、フラスコ内に窒素ガスを吹き込みながら撹拌し、８０℃まで昇温させた。一定の滴下速度で溶液（ａ）を上述のフラスコ内に４時間かけて滴下した後、フラスコ内の溶液を８０℃にて２時間撹拌した。次いで、一定の滴下速度で溶液（ｂ）を上述のフラスコ内に１０分間かけて滴下した後、フラスコ内の溶液を８０℃にて３時間撹拌した。さらに、フラスコ内の溶液を３０分間かけて９０℃まで昇温させ、９０℃にて２時間保温した後、撹拌を止め、室温（２５℃）まで冷却することによりバインダーポリマーの溶液を得た。バインダーポリマーの溶液の不揮発分（固形分）は４９質量％であった。 <Synthesis of binder polymer>
Solution (a) by mixing 27 parts by mass of methacrylic acid, 3 parts by mass of 2-hydroxyethyl methacrylate, 20 parts by mass of benzyl methacrylate, 50 parts by mass of styrene, and 0.9 parts by mass of azobisisobutyronitrile was prepared. A solution (b) was prepared by dissolving 0.5 parts by mass of azobisisobutyronitrile in 50 parts by mass of a mixture of 30 parts by mass of methyl cellosolve and 20 parts by mass of toluene. 500 g of a mixture of 30 parts by mass of methyl cellosolve and 20 parts by mass of toluene was added to a flask equipped with a stirrer, reflux condenser, thermometer, dropping funnel, and nitrogen gas inlet tube, and then stirred while blowing nitrogen gas into the flask. and the temperature was raised to 80°C. After the solution (a) was dropped into the flask over 4 hours at a constant dropping rate, the solution in the flask was stirred at 80° C. for 2 hours. Next, the solution (b) was added dropwise into the flask over 10 minutes at a constant dropping rate, and then the solution in the flask was stirred at 80° C. for 3 hours. Further, the temperature of the solution in the flask was raised to 90°C over 30 minutes, and the temperature was maintained at 90°C for 2 hours, then stirring was stopped and the solution was cooled to room temperature (25°C) to obtain a binder polymer solution. The non-volatile content (solid content) of the binder polymer solution was 49% by mass.
バインダーポリマーの酸価は１７６ｍｇＫＯＨ／ｇであった。酸価は次の手順で測定した。まず、三角フラスコにバインダーポリマーを秤量した。次いで、混合溶剤（質量比：トルエン／メタノール＝７０／３０）を加えてバインダーポリマーを溶解した後、指示薬としてフェノールフタレイン溶液を添加した。そして、０．１ｍｏｌ／Ｌ（Ｎ／１０）水酸化カリウム溶液（アルコール溶液）を用いて滴定することにより酸価を得た。
The acid value of the binder polymer was 176 mgKOH/g. The acid value was measured by the following procedure. First, a binder polymer was weighed into an Erlenmeyer flask. Next, a mixed solvent (mass ratio: toluene/methanol=70/30) was added to dissolve the binder polymer, and then a phenolphthalein solution was added as an indicator. Then, the acid value was obtained by titration with a 0.1 mol/L (N/10) potassium hydroxide solution (alcohol solution).
バインダーポリマーの重量平均分子量（Ｍｗ）は３５０００であり、数平均分子量（Ｍｎ）は１６０００であった。重量平均分子量及び数平均分子量は、下記条件のゲルパーミエーションクロマトグラフィー法（ＧＰＣ）によって測定し、標準ポリスチレンの検量線を用いて換算することにより導出した。
The binder polymer had a weight average molecular weight (Mw) of 35,000 and a number average molecular weight (Mn) of 16,000. The weight-average molecular weight and number-average molecular weight were measured by gel permeation chromatography (GPC) under the following conditions and derived by conversion using a standard polystyrene calibration curve.
（ＧＰＣ条件）
ポンプ：日立 Ｌ－６０００型（株式会社日立製作所製、商品名）
カラム：以下の計３本（昭和電工マテリアルズ株式会社製、商品名）
Ｇｅｌｐａｃｋ ＧＬ－Ｒ４４０
Ｇｅｌｐａｃｋ ＧＬ－Ｒ４５０
Ｇｅｌｐａｃｋ ＧＬ－Ｒ４００Ｍ
溶離液：テトラヒドロフラン
測定温度：４０℃
注入量：２００μＬ
流量：２．０５ｍＬ／分
検出器：日立 Ｌ－３３００型ＲＩ（株式会社日立製作所製、商品名） (GPC conditions)
Pump: Hitachi L-6000 type (manufactured by Hitachi, Ltd., trade name)
Columns: The following three columns (manufactured by Showa Denko Materials Co., Ltd., trade name)
Gelpack GL-R440
Gelpack GL-R450
Gelpack GL-R400M
Eluent: Tetrahydrofuran Measurement temperature: 40°C
Injection volume: 200 μL
Flow rate: 2.05 mL / min Detector: Hitachi L-3300 type RI (manufactured by Hitachi, Ltd., trade name)
ポンプ：日立 Ｌ－６０００型（株式会社日立製作所製、商品名）
カラム：以下の計３本（昭和電工マテリアルズ株式会社製、商品名）
Ｇｅｌｐａｃｋ ＧＬ－Ｒ４４０
Ｇｅｌｐａｃｋ ＧＬ－Ｒ４５０
Ｇｅｌｐａｃｋ ＧＬ－Ｒ４００Ｍ
溶離液：テトラヒドロフラン
測定温度：４０℃
注入量：２００μＬ
流量：２．０５ｍＬ／分
検出器：日立 Ｌ－３３００型ＲＩ（株式会社日立製作所製、商品名） (GPC conditions)
Pump: Hitachi L-6000 type (manufactured by Hitachi, Ltd., trade name)
Columns: The following three columns (manufactured by Showa Denko Materials Co., Ltd., trade name)
Gelpack GL-R440
Gelpack GL-R450
Gelpack GL-R400M
Eluent: Tetrahydrofuran Measurement temperature: 40°C
Injection volume: 200 μL
Flow rate: 2.05 mL / min Detector: Hitachi L-3300 type RI (manufactured by Hitachi, Ltd., trade name)
＜感光性樹脂組成物の調製＞
（実施例１）
上述のバインダーポリマーの溶液（バインダーポリマー（不揮発分）：５６質量部）と、２，２－ビス（４－（メタクリロキシペンタエトキシ）フェニル）プロパン（ＥＯ平均１０ｍｏｌ付加物、分子量：８０４）のプロピレングリコールモノメチルエーテル（昭和電工マテリアルズ株式会社製、商品名：ＦＡ－３２１Ｍ）３５質量部と、２，２－ビス（４－（メタクリロキシポリエトキシ）フェニル）プロパン（ＥＯ基：２．６（合計値）、分子量：４７８、共栄社化学株式会社製、商品名：ＢＰ－２ＥＭ）５質量部と、（ＰＯ）（ＥＯ）（ＰＯ）変性ジメタクリレート（ＥＯ平均６ｍｏｌ及びＰＯ平均１２ｍｏｌ付加物（合計値）、分子量：１１１４、昭和電工マテリアルズ株式会社製、商品名：ＦＡ－０２４Ｍ）４質量部と、光重合開始剤（２，２’－ビス（ｏ－クロロフェニル）－４，４’，５，５’－テトラフェニル－１，２’－ビイミダゾール、ＢＣＩＭ、Ｈａｍｐｆｏｒｄ社製）６質量部と、増感剤Ａ１（９，１０－ジブトキシアントラセン、ＤＢＡ、川崎化成工業株式会社製）０．６５０質量部と、増感助剤Ａ（１，４－ジエトキシナフタレン、川崎化成工業株式会社製、商品名：ＵＶＳ－２１７１）０．２質量部と、重合禁止剤（４－ｔｅｒｔ－ブチルカテコール、ＤＩＣ株式会社製、商品名：ＤＩＣ－ＴＢＣ）０．０１５質量部と、発色剤（ロイコクリスタルバイオレット、ＬＣＶ、山田化学工業株式会社製）０．５質量部と、染料（マラカイトグリーン、ＭＫＧ、大阪有機化学工業株式会社製）０．０２質量部と、添加剤（カルボキシベンゾトリアゾール、５－アミノ－１Ｈ－テトラゾール、及び、メトキシプロパノールの混合物；サンワ化成株式会社製、商品名：ＳＦ－８０８Ｈ）０．５質量部と、トルエン１６質量部と、メタノール６質量部と、アセトン１０質量部と、を混合することにより感光性樹脂組成物を調製した。 <Preparation of photosensitive resin composition>
(Example 1)
Propylene of 2,2-bis(4-(methacryloxypentaethoxy)phenyl)propane (EO average 10 mol adduct, molecular weight: 804) with a solution of the binder polymer described above (binder polymer (non-volatile content): 56 parts by mass) Glycol monomethyl ether (manufactured by Showa Denko Materials Co., Ltd., trade name: FA-321M) 35 parts by mass, 2,2-bis (4-(methacryloxypolyethoxy) phenyl) propane (EO group: 2.6 (total value), molecular weight: 478, manufactured by Kyoeisha Chemical Co., Ltd., trade name: BP-2EM) 5 parts by mass, (PO) (EO) (PO) modified dimethacrylate (EO average 6 mol and PO average 12 mol adduct (total value ), molecular weight: 1114, manufactured by Showa Denko Materials Co., Ltd., trade name: FA-024M) 4 parts by mass, and a photopolymerization initiator (2,2′-bis(o-chlorophenyl)-4,4′,5, 5'-Tetraphenyl-1,2'-biimidazole, BCIM, manufactured by Hampford) 6 parts by mass, and sensitizer A1 (9,10-dibutoxyanthracene, DBA, manufactured by Kawasaki Chemical Industry Co., Ltd.) 0.650 Parts by mass, 0.2 parts by mass of sensitizing aid A (1,4-diethoxynaphthalene, manufactured by Kawasaki Chemical Industries, Ltd., trade name: UVS-2171), and a polymerization inhibitor (4-tert-butyl catechol, DIC Corporation, product name: DIC-TBC) 0.015 parts by mass, a coloring agent (Leuco Crystal Violet, LCV, manufactured by Yamada Chemical Industry Co., Ltd.) 0.5 parts by mass, and a dye (Malachite Green, MKG, Osaka Organic Chemical Industry Co., Ltd.) 0.02 parts by mass and additives (a mixture of carboxybenzotriazole, 5-amino-1H-tetrazole, and methoxypropanol; manufactured by Sanwa Kasei Co., Ltd., trade name: SF-808H) 0 A photosensitive resin composition was prepared by mixing 5 parts by mass, 16 parts by mass of toluene, 6 parts by mass of methanol, and 10 parts by mass of acetone.
（実施例１）
上述のバインダーポリマーの溶液（バインダーポリマー（不揮発分）：５６質量部）と、２，２－ビス（４－（メタクリロキシペンタエトキシ）フェニル）プロパン（ＥＯ平均１０ｍｏｌ付加物、分子量：８０４）のプロピレングリコールモノメチルエーテル（昭和電工マテリアルズ株式会社製、商品名：ＦＡ－３２１Ｍ）３５質量部と、２，２－ビス（４－（メタクリロキシポリエトキシ）フェニル）プロパン（ＥＯ基：２．６（合計値）、分子量：４７８、共栄社化学株式会社製、商品名：ＢＰ－２ＥＭ）５質量部と、（ＰＯ）（ＥＯ）（ＰＯ）変性ジメタクリレート（ＥＯ平均６ｍｏｌ及びＰＯ平均１２ｍｏｌ付加物（合計値）、分子量：１１１４、昭和電工マテリアルズ株式会社製、商品名：ＦＡ－０２４Ｍ）４質量部と、光重合開始剤（２，２’－ビス（ｏ－クロロフェニル）－４，４’，５，５’－テトラフェニル－１，２’－ビイミダゾール、ＢＣＩＭ、Ｈａｍｐｆｏｒｄ社製）６質量部と、増感剤Ａ１（９，１０－ジブトキシアントラセン、ＤＢＡ、川崎化成工業株式会社製）０．６５０質量部と、増感助剤Ａ（１，４－ジエトキシナフタレン、川崎化成工業株式会社製、商品名：ＵＶＳ－２１７１）０．２質量部と、重合禁止剤（４－ｔｅｒｔ－ブチルカテコール、ＤＩＣ株式会社製、商品名：ＤＩＣ－ＴＢＣ）０．０１５質量部と、発色剤（ロイコクリスタルバイオレット、ＬＣＶ、山田化学工業株式会社製）０．５質量部と、染料（マラカイトグリーン、ＭＫＧ、大阪有機化学工業株式会社製）０．０２質量部と、添加剤（カルボキシベンゾトリアゾール、５－アミノ－１Ｈ－テトラゾール、及び、メトキシプロパノールの混合物；サンワ化成株式会社製、商品名：ＳＦ－８０８Ｈ）０．５質量部と、トルエン１６質量部と、メタノール６質量部と、アセトン１０質量部と、を混合することにより感光性樹脂組成物を調製した。 <Preparation of photosensitive resin composition>
(Example 1)
Propylene of 2,2-bis(4-(methacryloxypentaethoxy)phenyl)propane (EO average 10 mol adduct, molecular weight: 804) with a solution of the binder polymer described above (binder polymer (non-volatile content): 56 parts by mass) Glycol monomethyl ether (manufactured by Showa Denko Materials Co., Ltd., trade name: FA-321M) 35 parts by mass, 2,2-bis (4-(methacryloxypolyethoxy) phenyl) propane (EO group: 2.6 (total value), molecular weight: 478, manufactured by Kyoeisha Chemical Co., Ltd., trade name: BP-2EM) 5 parts by mass, (PO) (EO) (PO) modified dimethacrylate (EO average 6 mol and PO average 12 mol adduct (total value ), molecular weight: 1114, manufactured by Showa Denko Materials Co., Ltd., trade name: FA-024M) 4 parts by mass, and a photopolymerization initiator (2,2′-bis(o-chlorophenyl)-4,4′,5, 5'-Tetraphenyl-1,2'-biimidazole, BCIM, manufactured by Hampford) 6 parts by mass, and sensitizer A1 (9,10-dibutoxyanthracene, DBA, manufactured by Kawasaki Chemical Industry Co., Ltd.) 0.650 Parts by mass, 0.2 parts by mass of sensitizing aid A (1,4-diethoxynaphthalene, manufactured by Kawasaki Chemical Industries, Ltd., trade name: UVS-2171), and a polymerization inhibitor (4-tert-butyl catechol, DIC Corporation, product name: DIC-TBC) 0.015 parts by mass, a coloring agent (Leuco Crystal Violet, LCV, manufactured by Yamada Chemical Industry Co., Ltd.) 0.5 parts by mass, and a dye (Malachite Green, MKG, Osaka Organic Chemical Industry Co., Ltd.) 0.02 parts by mass and additives (a mixture of carboxybenzotriazole, 5-amino-1H-tetrazole, and methoxypropanol; manufactured by Sanwa Kasei Co., Ltd., trade name: SF-808H) 0 A photosensitive resin composition was prepared by mixing 5 parts by mass, 16 parts by mass of toluene, 6 parts by mass of methanol, and 10 parts by mass of acetone.
（実施例２～４）
増感助剤Ａの使用量を表１の使用量に変更したことを除き実施例１と同様に行うことにより感光性樹脂組成物を調製した。 (Examples 2-4)
A photosensitive resin composition was prepared in the same manner as in Example 1, except that the amount of sensitizing aid A used was changed to that shown in Table 1.
増感助剤Ａの使用量を表１の使用量に変更したことを除き実施例１と同様に行うことにより感光性樹脂組成物を調製した。 (Examples 2-4)
A photosensitive resin composition was prepared in the same manner as in Example 1, except that the amount of sensitizing aid A used was changed to that shown in Table 1.
（実施例５）
増感助剤Ａを増感助剤Ｂ（１，４－ジメトキシナフタレン、富士フィルム和光純薬株式会社）に変更したことを除き実施例１と同様に行うことにより感光性樹脂組成物を調製した。 (Example 5)
A photosensitive resin composition was prepared in the same manner as in Example 1 except that sensitizing aid A was changed to sensitizing aid B (1,4-dimethoxynaphthalene, Fujifilm Wako Pure Chemical Industries, Ltd.). .
増感助剤Ａを増感助剤Ｂ（１，４－ジメトキシナフタレン、富士フィルム和光純薬株式会社）に変更したことを除き実施例１と同様に行うことにより感光性樹脂組成物を調製した。 (Example 5)
A photosensitive resin composition was prepared in the same manner as in Example 1 except that sensitizing aid A was changed to sensitizing aid B (1,4-dimethoxynaphthalene, Fujifilm Wako Pure Chemical Industries, Ltd.). .
（実施例６）
増感剤Ａ１を増感剤Ａ２（９，１０－ジプロポキシアントラセン）に変更したことを除き実施例１と同様に行うことにより感光性樹脂組成物を調製した。 (Example 6)
A photosensitive resin composition was prepared in the same manner as in Example 1, except that sensitizer A1 was changed to sensitizer A2 (9,10-dipropoxyanthracene).
増感剤Ａ１を増感剤Ａ２（９，１０－ジプロポキシアントラセン）に変更したことを除き実施例１と同様に行うことにより感光性樹脂組成物を調製した。 (Example 6)
A photosensitive resin composition was prepared in the same manner as in Example 1, except that sensitizer A1 was changed to sensitizer A2 (9,10-dipropoxyanthracene).
（実施例７）
０．６５０質量部の増感剤Ａ１を０．２３４質量部の増感剤Ｂ１（１－フェニル－３－（４－メトキシスチリル）－５－（４－メトキシフェニル）－ピラゾリン、株式会社日本化学工業所製、商品名：ＰＺ－５０１Ｄ）に変更したことを除き実施例１と同様に行うことにより感光性樹脂組成物を調製した。 (Example 7)
0.650 parts by mass of sensitizer A1 and 0.234 parts by mass of sensitizer B1 (1-phenyl-3-(4-methoxystyryl)-5-(4-methoxyphenyl)-pyrazoline, Nippon Kagaku Co., Ltd. A photosensitive resin composition was prepared in the same manner as in Example 1, except that the resin was changed to PZ-501D manufactured by Kogyosho.
０．６５０質量部の増感剤Ａ１を０．２３４質量部の増感剤Ｂ１（１－フェニル－３－（４－メトキシスチリル）－５－（４－メトキシフェニル）－ピラゾリン、株式会社日本化学工業所製、商品名：ＰＺ－５０１Ｄ）に変更したことを除き実施例１と同様に行うことにより感光性樹脂組成物を調製した。 (Example 7)
0.650 parts by mass of sensitizer A1 and 0.234 parts by mass of sensitizer B1 (1-phenyl-3-(4-methoxystyryl)-5-(4-methoxyphenyl)-pyrazoline, Nippon Kagaku Co., Ltd. A photosensitive resin composition was prepared in the same manner as in Example 1, except that the resin was changed to PZ-501D manufactured by Kogyosho.
（実施例８）
増感助剤Ａを増感助剤Ｂに変更したことを除き実施例７と同様に行うことにより感光性樹脂組成物を調製した。 (Example 8)
A photosensitive resin composition was prepared in the same manner as in Example 7, except that sensitizing aid A was changed to sensitizing aid B.
増感助剤Ａを増感助剤Ｂに変更したことを除き実施例７と同様に行うことにより感光性樹脂組成物を調製した。 (Example 8)
A photosensitive resin composition was prepared in the same manner as in Example 7, except that sensitizing aid A was changed to sensitizing aid B.
（実施例９）
０．６５０質量部の増感剤Ａ１を０．４００質量部の増感剤Ｂ２（４－［［３－（４－クロロフェニル）－４，５－ジヒドロ－１Ｈ－ピラゾール］－１－イル］ベンゼンスルホンアミド、タナテックスケミカルズジャパン製、商品名：Ｂｌａｎｋｏｐｈｏｒ ＭＡＮ ０１）に変更したことを除き実施例１と同様に行うことにより感光性樹脂組成物を調製した。 (Example 9)
0.650 parts by weight of sensitizer A1 and 0.400 parts by weight of sensitizer B2 (4-[[3-(4-chlorophenyl)-4,5-dihydro-1H-pyrazol]-1-yl]benzene A photosensitive resin composition was prepared in the same manner as in Example 1, except that the sulfonamide was changed to Blankophor MAN 01) manufactured by Tanatex Chemicals Japan.
０．６５０質量部の増感剤Ａ１を０．４００質量部の増感剤Ｂ２（４－［［３－（４－クロロフェニル）－４，５－ジヒドロ－１Ｈ－ピラゾール］－１－イル］ベンゼンスルホンアミド、タナテックスケミカルズジャパン製、商品名：Ｂｌａｎｋｏｐｈｏｒ ＭＡＮ ０１）に変更したことを除き実施例１と同様に行うことにより感光性樹脂組成物を調製した。 (Example 9)
0.650 parts by weight of sensitizer A1 and 0.400 parts by weight of sensitizer B2 (4-[[3-(4-chlorophenyl)-4,5-dihydro-1H-pyrazol]-1-yl]benzene A photosensitive resin composition was prepared in the same manner as in Example 1, except that the sulfonamide was changed to Blankophor MAN 01) manufactured by Tanatex Chemicals Japan.
（実施例１０）
増感剤Ａ１を増感剤Ｃ（４’－（２－シアノスチリル）－３－スチルベンカルボニトリル、ＢＯＣ Ｓｃｉｅｎｃｅｓ製、商品名：Ｆｌｕｏｒｅｓｃｅｎｔ Ｂｒｉｇｈｔｅｎｅｒ ＥＲ－ＩＩＩ）に変更したことを除き実施例１と同様に行うことにより感光性樹脂組成物を調製した。 (Example 10)
Same as Example 1 except that sensitizer A1 was changed to sensitizer C (4'-(2-cyanostyryl)-3-stilbenecarbonitrile, manufactured by BOC Sciences, trade name: Fluorescent Brightener ER-III) A photosensitive resin composition was prepared by performing the following.
増感剤Ａ１を増感剤Ｃ（４’－（２－シアノスチリル）－３－スチルベンカルボニトリル、ＢＯＣ Ｓｃｉｅｎｃｅｓ製、商品名：Ｆｌｕｏｒｅｓｃｅｎｔ Ｂｒｉｇｈｔｅｎｅｒ ＥＲ－ＩＩＩ）に変更したことを除き実施例１と同様に行うことにより感光性樹脂組成物を調製した。 (Example 10)
Same as Example 1 except that sensitizer A1 was changed to sensitizer C (4'-(2-cyanostyryl)-3-stilbenecarbonitrile, manufactured by BOC Sciences, trade name: Fluorescent Brightener ER-III) A photosensitive resin composition was prepared by performing the following.
（比較例１）
増感助剤Ａを使用しなかったことを除き実施例１と同様に行うことにより感光性樹脂組成物を調製した。 (Comparative example 1)
A photosensitive resin composition was prepared in the same manner as in Example 1, except that the sensitizing aid A was not used.
増感助剤Ａを使用しなかったことを除き実施例１と同様に行うことにより感光性樹脂組成物を調製した。 (Comparative example 1)
A photosensitive resin composition was prepared in the same manner as in Example 1, except that the sensitizing aid A was not used.
（比較例２）
増感助剤Ａを使用しなかったことを除き実施例７と同様に行うことにより感光性樹脂組成物を調製した。 (Comparative example 2)
A photosensitive resin composition was prepared in the same manner as in Example 7, except that the sensitizing aid A was not used.
増感助剤Ａを使用しなかったことを除き実施例７と同様に行うことにより感光性樹脂組成物を調製した。 (Comparative example 2)
A photosensitive resin composition was prepared in the same manner as in Example 7, except that the sensitizing aid A was not used.
（比較例３）
増感助剤Ａを使用しなかったことを除き実施例９と同様に行うことにより感光性樹脂組成物を調製した。 (Comparative Example 3)
A photosensitive resin composition was prepared in the same manner as in Example 9, except that the sensitizing aid A was not used.
増感助剤Ａを使用しなかったことを除き実施例９と同様に行うことにより感光性樹脂組成物を調製した。 (Comparative Example 3)
A photosensitive resin composition was prepared in the same manner as in Example 9, except that the sensitizing aid A was not used.
（比較例４）
増感助剤Ａを使用しなかったことを除き実施例１０と同様に行うことにより感光性樹脂組成物を調製した。 (Comparative Example 4)
A photosensitive resin composition was prepared in the same manner as in Example 10, except that the sensitizing aid A was not used.
増感助剤Ａを使用しなかったことを除き実施例１０と同様に行うことにより感光性樹脂組成物を調製した。 (Comparative Example 4)
A photosensitive resin composition was prepared in the same manner as in Example 10, except that the sensitizing aid A was not used.
＜感光性エレメントの作製＞
支持体として厚さ１６μｍのポリエチレンテレフタレートフィルム（東レ株式会社製、商品名「ＦＢ－４０」）を用意した。厚さが均一になるように上述の感光性樹脂組成物を支持体上に塗布した後、７０℃及び１１０℃の熱風対流式乾燥器で順次乾燥することにより感光性樹脂層（感光性フィルム。乾燥後の厚さ：１９μｍ）を形成した。保護層としてポリエチレンフィルム（タマポリ株式会社製、商品名「ＮＦ－１５」）をこの感光性樹脂層に貼り合わせることにより、支持体、感光性樹脂層及び保護層が順に備える感光性エレメントを得た。 <Preparation of photosensitive element>
A polyethylene terephthalate film (manufactured by Toray Industries, Inc., trade name “FB-40”) having a thickness of 16 μm was prepared as a support. After coating the above-mentioned photosensitive resin composition on the support so that the thickness becomes uniform, the photosensitive resin composition is sequentially dried in a hot air convection dryer at 70° C. and 110° C. to obtain a photosensitive resin layer (photosensitive film. thickness after drying: 19 μm). A polyethylene film (manufactured by Tamapoly Co., Ltd., trade name "NF-15") was laminated as a protective layer to this photosensitive resin layer to obtain a photosensitive element comprising a support, a photosensitive resin layer and a protective layer in this order. .
支持体として厚さ１６μｍのポリエチレンテレフタレートフィルム（東レ株式会社製、商品名「ＦＢ－４０」）を用意した。厚さが均一になるように上述の感光性樹脂組成物を支持体上に塗布した後、７０℃及び１１０℃の熱風対流式乾燥器で順次乾燥することにより感光性樹脂層（感光性フィルム。乾燥後の厚さ：１９μｍ）を形成した。保護層としてポリエチレンフィルム（タマポリ株式会社製、商品名「ＮＦ－１５」）をこの感光性樹脂層に貼り合わせることにより、支持体、感光性樹脂層及び保護層が順に備える感光性エレメントを得た。 <Preparation of photosensitive element>
A polyethylene terephthalate film (manufactured by Toray Industries, Inc., trade name “FB-40”) having a thickness of 16 μm was prepared as a support. After coating the above-mentioned photosensitive resin composition on the support so that the thickness becomes uniform, the photosensitive resin composition is sequentially dried in a hot air convection dryer at 70° C. and 110° C. to obtain a photosensitive resin layer (photosensitive film. thickness after drying: 19 μm). A polyethylene film (manufactured by Tamapoly Co., Ltd., trade name "NF-15") was laminated as a protective layer to this photosensitive resin layer to obtain a photosensitive element comprising a support, a photosensitive resin layer and a protective layer in this order. .
＜評価＞
（吸光度の評価）
紫外可視分光光度計（株式会社日立ハイテクノロジーズ製、商品名：Ｕ－３３１０ Ｓｐｅｃｔｒｏｐｈｏｔｏｍｅｔｅｒ）を用いて、上述の感光性エレメントの感光性樹脂層における波長４０５ｎｍの吸光度（Ａｂｓ）を測定した。リファレンスには、ポリエチレンテレフタレートフィルム及びポリエチレンフィルムを用いた。結果を表１に示す。 <Evaluation>
(Evaluation of absorbance)
Using an ultraviolet-visible spectrophotometer (manufactured by Hitachi High-Technologies Corporation, trade name: U-3310 Spectrophotometer), the absorbance (Abs) at a wavelength of 405 nm in the photosensitive resin layer of the photosensitive element was measured. A polyethylene terephthalate film and a polyethylene film were used as references. Table 1 shows the results.
（吸光度の評価）
紫外可視分光光度計（株式会社日立ハイテクノロジーズ製、商品名：Ｕ－３３１０ Ｓｐｅｃｔｒｏｐｈｏｔｏｍｅｔｅｒ）を用いて、上述の感光性エレメントの感光性樹脂層における波長４０５ｎｍの吸光度（Ａｂｓ）を測定した。リファレンスには、ポリエチレンテレフタレートフィルム及びポリエチレンフィルムを用いた。結果を表１に示す。 <Evaluation>
(Evaluation of absorbance)
Using an ultraviolet-visible spectrophotometer (manufactured by Hitachi High-Technologies Corporation, trade name: U-3310 Spectrophotometer), the absorbance (Abs) at a wavelength of 405 nm in the photosensitive resin layer of the photosensitive element was measured. A polyethylene terephthalate film and a polyethylene film were used as references. Table 1 shows the results.
（積層体の作製）
ガラスエポキシ材の両面に配置された銅箔（厚さ：１８μｍ）を備える銅張積層板（基板、昭和電工マテリアルズ株式会社製、商品名：ＭＣＬ－Ｅ－６７）に対して、酸洗及び水洗後、空気流で乾燥した。次いで、銅張積層板を８０℃に加温した後、保護層を剥離しながら、感光性樹脂層が銅表面に接するように上述の感光性エレメントをラミネートすることにより、銅張積層板、感光性樹脂層、及び、支持体を順に備える積層体を得た。ラミネートは、１１０℃のヒートロールを用いて、０．４ＭＰａの圧着圧力、１．５ｍ／分のロール速度で行った。 (Preparation of laminate)
A copper clad laminate (substrate, manufactured by Showa Denko Materials Co., Ltd., trade name: MCL-E-67) provided with copper foil (thickness: 18 μm) arranged on both sides of a glass epoxy material is subjected to pickling and After washing with water, it was dried in an air stream. Next, after heating the copper-clad laminate to 80 ° C., while peeling off the protective layer, by laminating the above-mentioned photosensitive element so that the photosensitive resin layer is in contact with the copper surface, the copper-clad laminate, the photosensitive A laminate comprising a flexible resin layer and a support in this order was obtained. Lamination was performed using heat rolls at 110° C. at a pressure of 0.4 MPa and a roll speed of 1.5 m/min.
ガラスエポキシ材の両面に配置された銅箔（厚さ：１８μｍ）を備える銅張積層板（基板、昭和電工マテリアルズ株式会社製、商品名：ＭＣＬ－Ｅ－６７）に対して、酸洗及び水洗後、空気流で乾燥した。次いで、銅張積層板を８０℃に加温した後、保護層を剥離しながら、感光性樹脂層が銅表面に接するように上述の感光性エレメントをラミネートすることにより、銅張積層板、感光性樹脂層、及び、支持体を順に備える積層体を得た。ラミネートは、１１０℃のヒートロールを用いて、０．４ＭＰａの圧着圧力、１．５ｍ／分のロール速度で行った。 (Preparation of laminate)
A copper clad laminate (substrate, manufactured by Showa Denko Materials Co., Ltd., trade name: MCL-E-67) provided with copper foil (thickness: 18 μm) arranged on both sides of a glass epoxy material is subjected to pickling and After washing with water, it was dried in an air stream. Next, after heating the copper-clad laminate to 80 ° C., while peeling off the protective layer, by laminating the above-mentioned photosensitive element so that the photosensitive resin layer is in contact with the copper surface, the copper-clad laminate, the photosensitive A laminate comprising a flexible resin layer and a support in this order was obtained. Lamination was performed using heat rolls at 110° C. at a pressure of 0.4 MPa and a roll speed of 1.5 m/min.
（感度の評価）
上述の積層体の支持体上に４１段ステップタブレット（昭和電工マテリアルズ株式会社製）を載置した後、波長４０５ｎｍの青紫色レーザダイオードを光源とする直描露光機（ビアメカニクス株式会社製、商品名：ＤＥ－１ＵＨ）により、４１段ステップタブレットの現像後の残存段数が１５段となる露光量（照射エネルギー量）で、支持体を介して感光性樹脂層を露光した。このときの露光量（単位：ｍＪ／ｃｍ２）により感度（光感度）を評価した。結果を表１に示す。露光量が少ないほど、感度が良好であることを意味する。 (Evaluation of sensitivity)
After placing a 41-stage step tablet (manufactured by Showa Denko Materials Co., Ltd.) on the support of the above laminate, a direct exposure machine (manufactured by Via Mechanics Co., Ltd., (trade name: DE-1UH), the photosensitive resin layer was exposed through the support at an exposure amount (irradiation energy amount) such that the number of steps remaining after development of the 41-step tablet was 15 steps. The sensitivity (photosensitivity) was evaluated based on the amount of exposure (unit: mJ/cm 2 ) at this time. Table 1 shows the results. It means that the lower the exposure amount, the better the sensitivity.
上述の積層体の支持体上に４１段ステップタブレット（昭和電工マテリアルズ株式会社製）を載置した後、波長４０５ｎｍの青紫色レーザダイオードを光源とする直描露光機（ビアメカニクス株式会社製、商品名：ＤＥ－１ＵＨ）により、４１段ステップタブレットの現像後の残存段数が１５段となる露光量（照射エネルギー量）で、支持体を介して感光性樹脂層を露光した。このときの露光量（単位：ｍＪ／ｃｍ２）により感度（光感度）を評価した。結果を表１に示す。露光量が少ないほど、感度が良好であることを意味する。 (Evaluation of sensitivity)
After placing a 41-stage step tablet (manufactured by Showa Denko Materials Co., Ltd.) on the support of the above laminate, a direct exposure machine (manufactured by Via Mechanics Co., Ltd., (trade name: DE-1UH), the photosensitive resin layer was exposed through the support at an exposure amount (irradiation energy amount) such that the number of steps remaining after development of the 41-step tablet was 15 steps. The sensitivity (photosensitivity) was evaluated based on the amount of exposure (unit: mJ/cm 2 ) at this time. Table 1 shows the results. It means that the lower the exposure amount, the better the sensitivity.
（解像性の評価）
上述の積層体の支持体上に４１段ステップタブレット（昭和電工マテリアルズ株式会社製）を載置した後、波長４０５ｎｍの青紫色レーザダイオードを光源とする直描露光機（ビアメカニクス株式会社製、商品名：ＤＥ－１ＵＨ）により、ライン幅（Ｌ）／スペース幅（Ｓ）（以下、「Ｌ／Ｓ」と記す。）が３ｘ／ｘ（ｘ＝１～２０、単位：μｍ、１μｍ間隔）である描画パターンを用いて、４１段ステップタブレットの現像後の残存段数が１５段となる露光量（照射エネルギー量）で、支持体を介して感光性樹脂層に対し、Ｏｆｆｓｅｔをかけずに露光（描画）を行った。露光後３分以内に、加熱オーブンを用いて８０℃３０秒間の条件で露光後加熱（ＰＥＢ：Ｐｏｓｔ－Ｅｘｐｏｓｕｒｅ－Ｂａｋｅ）を行った。 (Evaluation of resolution)
After placing a 41-stage step tablet (manufactured by Showa Denko Materials Co., Ltd.) on the support of the above laminate, a direct exposure machine (manufactured by Via Mechanics Co., Ltd., Product name: DE-1UH), line width (L) / space width (S) (hereinafter referred to as "L / S") is 3x / x (x = 1 to 20, unit: μm, 1 μm interval) Using the drawing pattern, the photosensitive resin layer is exposed through the support without offset at an exposure amount (irradiation energy amount) such that the remaining number of steps after development of the 41-step tablet is 15 steps. (draw). Within 3 minutes after exposure, post-exposure baking (PEB: Post-Exposure-Bake) was performed using a heating oven at 80° C. for 30 seconds.
上述の積層体の支持体上に４１段ステップタブレット（昭和電工マテリアルズ株式会社製）を載置した後、波長４０５ｎｍの青紫色レーザダイオードを光源とする直描露光機（ビアメカニクス株式会社製、商品名：ＤＥ－１ＵＨ）により、ライン幅（Ｌ）／スペース幅（Ｓ）（以下、「Ｌ／Ｓ」と記す。）が３ｘ／ｘ（ｘ＝１～２０、単位：μｍ、１μｍ間隔）である描画パターンを用いて、４１段ステップタブレットの現像後の残存段数が１５段となる露光量（照射エネルギー量）で、支持体を介して感光性樹脂層に対し、Ｏｆｆｓｅｔをかけずに露光（描画）を行った。露光後３分以内に、加熱オーブンを用いて８０℃３０秒間の条件で露光後加熱（ＰＥＢ：Ｐｏｓｔ－Ｅｘｐｏｓｕｒｅ－Ｂａｋｅ）を行った。 (Evaluation of resolution)
After placing a 41-stage step tablet (manufactured by Showa Denko Materials Co., Ltd.) on the support of the above laminate, a direct exposure machine (manufactured by Via Mechanics Co., Ltd., Product name: DE-1UH), line width (L) / space width (S) (hereinafter referred to as "L / S") is 3x / x (x = 1 to 20, unit: μm, 1 μm interval) Using the drawing pattern, the photosensitive resin layer is exposed through the support without offset at an exposure amount (irradiation energy amount) such that the remaining number of steps after development of the 41-step tablet is 15 steps. (draw). Within 3 minutes after exposure, post-exposure baking (PEB: Post-Exposure-Bake) was performed using a heating oven at 80° C. for 30 seconds.
露光後、積層体から支持体を剥離し、感光性樹脂層を露出させ、１質量％炭酸ナトリウム水溶液を３０℃にて最小現像時間の２倍の時間スプレーすることにより、未露光部を除去した。現像後、スペース部分（未露光部）が残渣なく除去され、且つ、ライン部分（露光部）が蛇行及び欠けを生じることなく形成されたレジストパターンにおけるスペース幅のうちの最小値（単位：μｍ）により解像性を評価した。結果を表１に示す。この数値が小さいほど解像性が良好であることを意味する。
After exposure, the support was peeled off from the laminate to expose the photosensitive resin layer, and an unexposed area was removed by spraying a 1% by mass sodium carbonate aqueous solution at 30°C for twice the minimum development time. . After development, the minimum value (unit: μm) of the space widths in the resist pattern in which the space portion (unexposed portion) is removed without residue and the line portion (exposed portion) is formed without meandering or chipping. The resolution was evaluated by Table 1 shows the results. A smaller value means better resolution.
上述の最小現像時間は次の手順で事前に評価した。まず、上述の積層体を正方形状（５ｃｍ×５ｃｍ）に切断した後、支持体を剥離することにより試験片を得た。次に、３０℃の１質量％炭酸ナトリウム水溶液を用いて、試験片における未露光の感光性樹脂層を０．１５ＭＰａの圧力でスプレー現像し、未露光の感光性樹脂層が除去されたことを目視で確認できる最短の時間を最小現像時間（ＭＤ）として得た。ノズルは、フルコーンタイプを使用した。上述の試験片とノズル先端との距離は６ｃｍであり、試験片の中心とノズルの中心とが一致するように配置した。
The above minimum development time was evaluated in advance by the following procedure. First, after cutting the laminate into a square (5 cm×5 cm), the support was peeled off to obtain a test piece. Next, the unexposed photosensitive resin layer of the test piece was spray-developed at a pressure of 0.15 MPa using a 1% by weight aqueous sodium carbonate solution at 30° C. to confirm that the unexposed photosensitive resin layer was removed. The shortest visually identifiable time was taken as the minimum development time (MD). A full cone type nozzle was used. The distance between the test piece and the tip of the nozzle was 6 cm, and the test piece was arranged so that the center of the nozzle coincided with the center of the test piece.
（密着性の評価）
上述の積層体の支持体上に４１段ステップタブレット（昭和電工マテリアルズ株式会社製）を載置した後、波長４０５ｎｍの青紫色レーザダイオードを光源とする直描露光機（ビアメカニクス株式会社製、商品名：ＤＥ－１ＵＨ）により、Ｌ／Ｓがｘ／３ｘ（ｘ＝１～２０、単位：μｍ、１μｍ間隔）である描画パターンを用いて、４１段ステップタブレットの現像後の残存段数が１５段となる露光量（照射エネルギー量）で、支持体を介して感光性樹脂層に対し、Ｏｆｆｓｅｔをかけずに露光（描画）を行った。露光後３分以内に、加熱オーブンを用いて８０℃３０秒間の条件で露光後加熱（ＰＥＢ：Ｐｏｓｔ－Ｅｘｐｏｓｕｒｅ－Ｂａｋｅ）を行った。 (Evaluation of adhesion)
After placing a 41-stage step tablet (manufactured by Showa Denko Materials Co., Ltd.) on the support of the above laminate, a direct exposure machine (manufactured by Via Mechanics Co., Ltd., Product name: DE-1UH), using a drawing pattern with L/S of x/3x (x = 1 to 20, unit: μm, 1 μm interval), the number of remaining steps after development of a 41-step tablet is 15. Exposure (drawing) was performed on the photosensitive resin layer through the support with stepwise exposure amounts (irradiation energy amounts) without applying an offset. Within 3 minutes after exposure, post-exposure baking (PEB: Post-Exposure-Bake) was performed using a heating oven at 80° C. for 30 seconds.
上述の積層体の支持体上に４１段ステップタブレット（昭和電工マテリアルズ株式会社製）を載置した後、波長４０５ｎｍの青紫色レーザダイオードを光源とする直描露光機（ビアメカニクス株式会社製、商品名：ＤＥ－１ＵＨ）により、Ｌ／Ｓがｘ／３ｘ（ｘ＝１～２０、単位：μｍ、１μｍ間隔）である描画パターンを用いて、４１段ステップタブレットの現像後の残存段数が１５段となる露光量（照射エネルギー量）で、支持体を介して感光性樹脂層に対し、Ｏｆｆｓｅｔをかけずに露光（描画）を行った。露光後３分以内に、加熱オーブンを用いて８０℃３０秒間の条件で露光後加熱（ＰＥＢ：Ｐｏｓｔ－Ｅｘｐｏｓｕｒｅ－Ｂａｋｅ）を行った。 (Evaluation of adhesion)
After placing a 41-stage step tablet (manufactured by Showa Denko Materials Co., Ltd.) on the support of the above laminate, a direct exposure machine (manufactured by Via Mechanics Co., Ltd., Product name: DE-1UH), using a drawing pattern with L/S of x/3x (x = 1 to 20, unit: μm, 1 μm interval), the number of remaining steps after development of a 41-step tablet is 15. Exposure (drawing) was performed on the photosensitive resin layer through the support with stepwise exposure amounts (irradiation energy amounts) without applying an offset. Within 3 minutes after exposure, post-exposure baking (PEB: Post-Exposure-Bake) was performed using a heating oven at 80° C. for 30 seconds.
露光後、積層体から支持体を剥離し、感光性樹脂層を露出させ、１質量％炭酸ナトリウム水溶液を３０℃にて最小現像時間の２倍の時間スプレーすることにより、未露光部を除去した。現像後、スペース部分（未露光部）が残渣なく除去され、且つ、ライン部分（露光部）が蛇行及び欠けを生じることなく形成されたレジストパターンにおけるライン幅のうちの最小値（単位：μｍ）により密着性を評価した。結果を表１に示す。この数値が小さいほど密着性が良好であることを意味する。
After exposure, the support was peeled off from the laminate to expose the photosensitive resin layer, and an unexposed area was removed by spraying a 1% by mass sodium carbonate aqueous solution at 30°C for twice the minimum development time. . After development, the minimum value (unit: μm) of the line widths in a resist pattern in which space portions (unexposed portions) are removed without residue, and line portions (exposed portions) are formed without meandering or chipping. The adhesion was evaluated by Table 1 shows the results. A smaller value means better adhesion.
１…感光性エレメント、２…支持体、３，１２…感光性樹脂層、４…保護層、１０…基材、１０ａ…絶縁層、１０ｂ，１０ｃ…導体層、１２ａ…レジストパターン、１４…マスク、１６…配線層、１８…配線基板、Ｌ…活性光線。
DESCRIPTION OF SYMBOLS 1... Photosensitive element 2... Support body 3, 12... Photosensitive resin layer 4... Protective layer 10... Base material 10a... Insulating layer 10b, 10c... Conductor layer 12a... Resist pattern 14... Mask , 16... Wiring layer, 18... Wiring substrate, L... Active ray.
Claims (17)
- （Ａ）バインダーポリマーと、
（Ｂ）光重合性化合物と、
（Ｃ）光重合開始剤と、
（Ｄ）アントラセン化合物、ピラゾリン化合物、及び、ジスチリルベンゼン化合物からなる群より選ばれる少なくとも一種と、
（Ｅ）ナフタレン化合物と、を含有する、感光性フィルム。 (A) a binder polymer;
(B) a photopolymerizable compound;
(C) a photoinitiator;
(D) at least one selected from the group consisting of anthracene compounds, pyrazoline compounds, and distyrylbenzene compounds;
(E) a naphthalene compound, and a photosensitive film. - 前記（Ａ）成分が（メタ）アクリル酸アリール及びスチレン化合物を単量体単位として有する、請求項１に記載の感光性フィルム。 The photosensitive film according to claim 1, wherein the component (A) has an aryl (meth)acrylate and a styrene compound as monomer units.
- 前記（Ａ）成分におけるスチレン化合物の単量体単位の含有量が、前記（Ａ）成分を構成する単量体単位の全量を基準として４０質量％以上である、請求項１又は２に記載の感光性フィルム。 The content of the monomer units of the styrene compound in the component (A) is 40% by mass or more based on the total amount of the monomer units constituting the component (A), according to claim 1 or 2. photosensitive film.
- 前記（Ａ）成分の重量平均分子量が２００００～５００００である、請求項１～３のいずれか一項に記載の感光性フィルム。 The photosensitive film according to any one of claims 1 to 3, wherein the component (A) has a weight average molecular weight of 20,000 to 50,000.
- 前記（Ｂ）成分がビスフェノールＡ型（メタ）アクリル酸化合物を含む、請求項１～４のいずれか一項に記載の感光性フィルム。 The photosensitive film according to any one of claims 1 to 4, wherein the component (B) contains a bisphenol A type (meth)acrylic acid compound.
- 前記（Ｂ）成分が、ポリオキシアルキレン基を有する（メタ）アクリル酸化合物を含む、請求項１～５のいずれか一項に記載の感光性フィルム。 The photosensitive film according to any one of claims 1 to 5, wherein the component (B) contains a (meth)acrylic acid compound having a polyoxyalkylene group.
- 前記（Ｂ）成分の含有量が、前記（Ａ）成分及び前記（Ｂ）成分の総量１００質量部に対して３０～６０質量部である、請求項１～６のいずれか一項に記載の感光性フィルム。 The content of the component (B) is 30 to 60 parts by mass with respect to 100 parts by mass of the total amount of the component (A) and the component (B), according to any one of claims 1 to 6 photosensitive film.
- 前記（Ｄ）成分がアントラセン化合物を含み、
前記アントラセン化合物の全質量を基準として、アントラセン環の９位及び１０位に結合する無置換のアルコキシ基を有するアントラセン化合物の含有量が５０～１００質量％である、請求項１～７のいずれか一項に記載の感光性フィルム。 The component (D) contains an anthracene compound,
8. The content of the anthracene compound having unsubstituted alkoxy groups bonded to the 9- and 10-positions of the anthracene ring is 50 to 100% by mass, based on the total mass of the anthracene compound. 1. The photosensitive film according to item 1. - 前記（Ｄ）成分が、アントラセン環の９位及び１０位に結合する無置換のアルコキシ基を有するアントラセン化合物以外のアントラセン化合物を含まない、請求項８に記載の感光性フィルム。 The photosensitive film according to claim 8, wherein the component (D) does not contain anthracene compounds other than anthracene compounds having unsubstituted alkoxy groups bonded to the 9- and 10-positions of the anthracene ring.
- 前記（Ｄ）成分が、ピラゾリン環に結合する２つ以上のアリール基を有する化合物を含む、請求項１～９のいずれか一項に記載の感光性フィルム。 The photosensitive film according to any one of claims 1 to 9, wherein the component (D) contains a compound having two or more aryl groups bonded to a pyrazoline ring.
- 前記（Ｄ）成分がジシアノジスチリルベンゼン化合物を含む、請求項１～１０のいずれか一項に記載の感光性フィルム。 The photosensitive film according to any one of claims 1 to 10, wherein the component (D) contains a dicyanodistyrylbenzene compound.
- 前記（Ｄ）成分の含有量が、前記（Ａ）成分及び前記（Ｂ）成分の総量１００質量部に対して０．１～１質量部である、請求項１～１１のいずれか一項に記載の感光性フィルム。 The content of the component (D) is 0.1 to 1 part by mass with respect to the total amount of 100 parts by mass of the component (A) and the component (B), according to any one of claims 1 to 11 A photosensitive film as described.
- 前記（Ｅ）成分が、ナフタレン環に結合する２つのアルコキシ基を有する化合物を含む、請求項１～１２のいずれか一項に記載の感光性フィルム。 The photosensitive film according to any one of claims 1 to 12, wherein the component (E) contains a compound having two alkoxy groups bonded to a naphthalene ring.
- 前記（Ｅ）成分の含有量が、前記（Ａ）成分及び前記（Ｂ）成分の総量１００質量部に対して０．１～５質量部である、請求項１～１３のいずれか一項に記載の感光性フィルム。 The content of the component (E) is 0.1 to 5 parts by mass with respect to the total amount of 100 parts by mass of the component (A) and the component (B), according to any one of claims 1 to 13 A photosensitive film as described.
- 前記（Ｅ）成分の含有量が、前記（Ｄ）成分１００質量部に対して１０～５００質量部である、請求項１～１４のいずれか一項に記載の感光性フィルム。 The photosensitive film according to any one of claims 1 to 14, wherein the content of component (E) is 10 to 500 parts by mass with respect to 100 parts by mass of component (D).
- 支持体と、当該支持体上に配置された感光性樹脂層と、を備え、
前記感光性樹脂層が、請求項１～１５のいずれか一項に記載の感光性フィルムである、感光性エレメント。 comprising a support and a photosensitive resin layer disposed on the support;
A photosensitive element, wherein the photosensitive resin layer is the photosensitive film according to any one of claims 1-15. - 請求項１～１５のいずれか一項に記載の感光性フィルムを用いて感光性樹脂層を基材上に配置する工程と、
前記感光性樹脂層の一部を光硬化させる工程と、
前記感光性樹脂層の未硬化部の少なくとも一部を除去して硬化物パターンを形成する工程と、
前記基材における前記硬化物パターンが形成されていない部分の少なくとも一部に金属層を形成する工程と、を備える、積層体の製造方法。 A step of disposing a photosensitive resin layer on a substrate using the photosensitive film according to any one of claims 1 to 15;
a step of photocuring a portion of the photosensitive resin layer;
removing at least part of the uncured portion of the photosensitive resin layer to form a cured product pattern;
and forming a metal layer on at least part of a portion of the substrate where the cured product pattern is not formed.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202280003948.5A CN117063121A (en) | 2021-03-09 | 2022-03-07 | Photosensitive film, photosensitive element, and method for producing laminate |
| JP2022560388A JPWO2022191127A1 (en) | 2021-03-09 | 2022-03-07 | |
| KR1020227035569A KR20230154732A (en) | 2021-03-09 | 2022-03-07 | Method for producing photosensitive films, photosensitive elements, and laminates |
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| PCT/JP2021/009276 WO2022190208A1 (en) | 2021-03-09 | 2021-03-09 | Photosensitive film, photosensitive element and method for producing multilayer body |
| JPPCT/JP2021/009276 | 2021-03-09 |
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| WO2022191127A1 true WO2022191127A1 (en) | 2022-09-15 |
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| PCT/JP2022/009699 WO2022191127A1 (en) | 2021-03-09 | 2022-03-07 | Photosensitive film, photosensitive element, and laminate production method |
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| WO2024142486A1 (en) * | 2022-12-26 | 2024-07-04 | 株式会社レゾナック | Photosensitive element and method for producing circuit board |
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| KR20230154732A (en) | 2023-11-09 |
| TW202246897A (en) | 2022-12-01 |
| CN117063121A (en) | 2023-11-14 |
| WO2022190208A1 (en) | 2022-09-15 |
| JPWO2022191127A1 (en) | 2022-09-15 |
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