WO2022185901A1 - アンテナモジュール - Google Patents

アンテナモジュール Download PDF

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Publication number
WO2022185901A1
WO2022185901A1 PCT/JP2022/005884 JP2022005884W WO2022185901A1 WO 2022185901 A1 WO2022185901 A1 WO 2022185901A1 JP 2022005884 W JP2022005884 W JP 2022005884W WO 2022185901 A1 WO2022185901 A1 WO 2022185901A1
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WO
WIPO (PCT)
Prior art keywords
antenna module
radiation electrode
mounting substrate
lens
dielectric
Prior art date
Application number
PCT/JP2022/005884
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
隼人 中村
薫 須藤
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to CN202280017454.2A priority Critical patent/CN116918182A/zh
Publication of WO2022185901A1 publication Critical patent/WO2022185901A1/ja
Priority to US18/460,693 priority patent/US20230411862A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
    • H01Q15/02—Refracting or diffracting devices, e.g. lens, prism
    • H01Q15/08—Refracting or diffracting devices, e.g. lens, prism formed of solid dielectric material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q19/00—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic
    • H01Q19/06—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using refracting or diffracting devices, e.g. lens
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q19/00—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic
    • H01Q19/06—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using refracting or diffracting devices, e.g. lens
    • H01Q19/062—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using refracting or diffracting devices, e.g. lens for focusing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/061—Two dimensional planar arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
    • H01Q15/02—Refracting or diffracting devices, e.g. lens, prism
    • H01Q15/10—Refracting or diffracting devices, e.g. lens, prism comprising three-dimensional array of impedance discontinuities, e.g. holes in conductive surfaces or conductive discs forming artificial dielectric
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q25/00—Antennas or antenna systems providing at least two radiating patterns
    • H01Q25/007—Antennas or antenna systems providing at least two radiating patterns using two or more primary active elements in the focal region of a focusing device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q3/00—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system
    • H01Q3/26—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture
    • H01Q3/2658—Phased-array fed focussing structure

Definitions

  • the present disclosure relates to an antenna module having a lens, and to technology for improving antenna characteristics.
  • Patent Document 1 discloses a configuration of a wireless communication device equipped with a dielectric lens.
  • an antenna-integrated module having a patch antenna is housed in a housing.
  • a dielectric lens is arranged outside the housing in the direction in which the patch antenna radiates radio waves.
  • an air layer is formed between the patch antenna and the dielectric lens.
  • an impedance mismatch occurs due to the difference in dielectric constant, and radio waves may be reflected. This can reduce the gain of the antenna.
  • the present disclosure has been made to solve such problems, and the object thereof is to suppress the impedance mismatch caused by the lens in an antenna module having a lens, thereby improving the characteristics of the antenna. be.
  • An antenna module includes a mounting substrate, a feeding circuit for supplying a high frequency signal, a radiation electrode, and a dielectric.
  • the mounting board has a flat plate shape having a first surface and a second surface and includes a conductor.
  • the power supply circuit is arranged on the first surface side of the mounting substrate and has a third surface facing the first surface.
  • a radiation electrode is arranged on the third surface of the feeding circuit.
  • An opening is formed in the mounting substrate at a position overlapping the radiation electrode when the mounting substrate is viewed from above.
  • a dielectric is filled around the radiation electrode, including the inside of the opening.
  • a lens portion is formed in the dielectric on the second surface side of the mounting substrate at a position overlapping the radiation electrode when the mounting substrate is viewed in plan.
  • An antenna module includes a mounting substrate, a feeding circuit for supplying a high frequency signal, a radiation electrode, a first dielectric, and a second dielectric.
  • the mounting board has a flat plate shape having a first surface and a second surface and includes a conductor.
  • the power supply circuit is arranged on the first surface side of the mounting substrate and has a third surface facing the first surface.
  • the radiation electrode is arranged on the third surface of the feeding circuit at a position not overlapping the conductor when the mounting substrate is viewed from above.
  • the first dielectric is filled on the first surface side so as to be in contact with the radiation electrode and the first surface.
  • the second dielectric is filled on the second surface side so as to be in contact with the second surface.
  • a lens portion is formed in the second dielectric on the second surface side of the mounting substrate at a position overlapping the radiation electrode when the mounting substrate is viewed from above.
  • a dielectric integrated with a lens portion is arranged on the second surface side opposite to the first surface side of the mounting substrate on which the radiation electrode is arranged.
  • a space between the lens portion and the radiation electrode is filled with a dielectric and/or a mounting substrate, and no air layer is formed.
  • FIG. 1 is an example of a block diagram of a communication device according to Embodiment 1.
  • FIG. FIG. 2A is a cross-sectional view of the antenna module according to Embodiment 1, and a plan view of the mounting substrate, RFIC, and radiation electrode in FIG. 2A is shown in FIG. 2B.
  • FIG. 3A is a cross-sectional view of the antenna module according to Embodiment 2, and a plan view of the mounting substrate, RFIC, and radiation electrode in FIG. 3A is shown in FIG.
  • FIG. 11 is a cross-sectional view of an antenna module in Embodiment 3;
  • FIG. 5A is a cross-sectional view of the antenna module according to Embodiment 4, and a plan view of the mounting substrate, RFIC, and radiation electrode in FIG.
  • FIG. 11 is a cross-sectional view of an antenna module in Embodiment 5;
  • FIG. 11 is a cross-sectional view of an antenna module in Embodiment 6;
  • FIG. 14 is a cross-sectional view of an antenna module in Embodiment 7;
  • FIG. 9A is a cross-sectional view of the antenna module in Embodiment 8 (FIG. 9A), and a plan view of the RFIC and the radiation electrode in FIG. 9A (FIG. 9B).
  • FIG. 1 is an example of a block diagram of a communication device 10 according to Embodiment 1.
  • the communication device 10 is, for example, a mobile terminal such as a mobile phone, a smart phone or a tablet, a personal computer having a communication function, a base station, smart glasses, or the like.
  • An example of the frequency band of the radio waves used in the antenna module 100 in Embodiment 1 is, for example, millimeter-wave radio waves with center frequencies of 28 GHz, 39 GHz, and 60 GHz. It is possible.
  • communication device 10 includes antenna module 100 and BBIC 200 that configures a baseband signal processing circuit.
  • the antenna module 100 comprises an RFIC 110 for supplying radio frequency signals.
  • the communication device 10 up-converts the signal transmitted from the BBIC 200 to the antenna module 100 into a high-frequency signal in the RFIC 110 and radiates it from the radiation electrode 121 . Further, the communication device 10 transmits the high-frequency signal received by the radiation electrode 121 to the RFIC 110 , down-converts the signal, and then processes the signal in the BBIC 200 .
  • FIG. 1 shows an example in which a plurality of radiation electrodes 121 are arranged in a two-dimensional array, the number of radiation electrodes 121 is not necessarily plural, and the antenna module 100 has one radiation electrode 121. It may be a case of having A one-dimensional array in which a plurality of radiation electrodes 121 are arranged in a line may also be used.
  • the radiation electrode 121 is a patch antenna having a substantially square flat plate shape, but the shape of the radiation electrode 121 may be circular, elliptical, or other polygonal shape such as a hexagon. may be
  • RFIC 110 includes switches 111A to 111D, 113A to 113D, 117, power amplifiers 112AT to 112DT, low noise amplifiers 112AR to 112DR, attenuators 114A to 114D, phase shifters 115A to 115D, and signal combiner/demultiplexer. 116 , a mixer 118 and an amplifier circuit 119 .
  • switches 111A to 111D and 113A to 113D are switched to the power amplifiers 112AT to 112DT, and the switch 117 is connected to the amplifier circuit 119 on the transmission side.
  • switches 111A to 111D and 113A to 113D are switched to low noise amplifiers 112AR to 112DR, and switch 117 is connected to the receiving amplifier of amplifier circuit 119.
  • a signal transmitted from the BBIC 200 is amplified by the amplifier circuit 119 and up-converted by the mixer 118 .
  • a transmission signal which is an up-converted high-frequency signal, is divided into four waves by the signal combiner/demultiplexer 116, passes through four signal paths, and is fed to different radiation electrodes 121, respectively.
  • the directivity of the radiation electrode 121 can be adjusted by individually adjusting the degree of phase shift of the phase shifters 115A to 115D arranged in each signal path. Attenuators 114A-114D also adjust the strength of the transmitted signal.
  • the received signals which are high-frequency signals received by each radiation electrode 121 , pass through four different signal paths and are multiplexed by the signal combiner/demultiplexer 116 .
  • the multiplexed received signal is down-converted by mixer 118 , amplified by amplifier circuit 119 , and transmitted to BBIC 200 .
  • the RFIC 110 is formed, for example, as a one-chip integrated circuit component including the circuit configuration described above.
  • devices switching, power amplifiers, low-noise amplifiers, attenuators, phase shifters
  • corresponding to each radiation electrode 121 in the RFIC 110 may be formed as one-chip integrated circuit components for each corresponding radiation electrode 121. .
  • FIG. 2 is a cross-sectional view (FIG. 2A) of the antenna module 100 according to Embodiment 1, and a plan view (FIG. 2B) of the mounting substrate 120, the RFIC 110, and the radiation electrode 121 in FIG. 2A. is.
  • the antenna module 100 is a lens antenna having a lens Ln.
  • the antenna module 100 includes a flat mounting board 120 , an RFIC 110 and a mold resin 130 .
  • Mold resin 130 is filled around radiation electrode 121 and mounting substrate 120 .
  • a convex lens Ln is formed on the mold resin 130 .
  • Lens Ln has a hemispherical shape arranged to protrude from mold resin 130 . Note that the shape of the lens Ln may be concave rather than convex.
  • the thickness direction of the mounting board 120 is defined as the Z-axis direction, and the planes perpendicular to the Z-axis direction are defined as the X-axis and the Y-axis.
  • the positive direction of the Z-axis in each drawing may be referred to as the upper surface side, and the negative direction thereof as the lower surface side.
  • the mold resin 130 corresponds to the "dielectric” in this disclosure
  • the RFIC 110 corresponds to the "feeder circuit" in this disclosure.
  • the mounting board 120 is, for example, a board using a dielectric as a base material.
  • the base material of mounting substrate 120 is, for example, resin such as epoxy or polyimide.
  • the base material of the mounting substrate 120 is a liquid crystal polymer (LCP) having a lower dielectric constant, a fluororesin, a PET (polyethylene terephthalate) material, or a low temperature co-fired ceramic (LTCC). Ceramics) and other resins may also be used.
  • LCP liquid crystal polymer
  • the mounting substrate 120 shown in FIG. 2 is a single layer, but may be a multilayer resin substrate formed by laminating a plurality of layers made of these resins, as described later.
  • the base material forming the mounting board 120 may be a base material other than resin.
  • the mounting substrate 120 is a substrate that includes a conductor 120G inside.
  • the conductor 120G is a conductor arranged over substantially the entire surface of the flat plate of the mounting substrate 120 in the XY plane, and serves as a ground potential.
  • the RFIC 110 is mounted on the surface Sf1 of the mounting substrate 120 on the negative direction side of the Z axis.
  • Electronic component 150A and electronic component 150B are mounted on surface Sf2 of mounting substrate 120 on the positive side of the Z axis.
  • the RFIC 110 is electrically connected to the mounting board 120 via the connection member 160 .
  • the RFIC 110 includes a semiconductor substrate such as silicon, a conductor layer, a dielectric layer, a protective film, and the like. As shown in FIG. 2 , RFIC 110 has surface Sf ⁇ b>3 facing surface Sf ⁇ b>1 of mounting substrate 120 .
  • connecting member 160 is formed from a plurality of solder bumps. Connecting member 160 is connected to terminals (not shown) arranged on surface Sf1 of mounting substrate 120 and surface Sf3 of RFIC 110 . The mounting board 120 is thereby electrically connected to the RFIC 110 .
  • Connection terminals 170A and 170B are formed on the Z-axis surface Sf1 of the mounting board 120, and the mounting board 120 is connected to an external board or the like by the connection terminals 170A and 170B.
  • the surface Sf1 corresponds to the "first surface” in the present disclosure
  • the surface Sf2 corresponds to the “second surface” in the present disclosure
  • the surface Sf3 corresponds to the "third surface” in the present disclosure.
  • any one of the plurality of solder bumps included in the connection member 160 transmits high frequency signals to the radiation electrode 121 .
  • a solder bump that transmits a high frequency signal may be capacitively coupled with a wiring pattern (not shown) arranged in a layer inside the RFIC 110 .
  • the wiring pattern transmits the high-frequency signal to the radiation electrode 121 .
  • the wiring pattern and the radiation electrode 121 may be capacitively coupled.
  • the method of supplying power to the radiation electrode 121 is not limited to the form shown in FIG.
  • the radiation electrode 121 may be powered using a through-silicon via (TSV). That is, the radiation electrode 121 may be connected to the mounting substrate 120 using a through electrode penetrating the RFIC 110 .
  • TSV through-silicon via
  • the radiation electrode 121 is arranged on the surface Sf3 of the RFIC 110.
  • FIG. Radiation electrode 121 is formed from a single radiation element.
  • An opening Op is formed in the mounting substrate 120 between the radiation electrode 121 and the lens Ln.
  • FIG. 2B when the mounting board 120 is viewed from above in the positive direction of the Z axis, the radiation electrode 121 is arranged within the opening Op.
  • the mold resin 130 is filled in the surface Sf1 side, the surface Sf2 side, and the opening Op of the mounting substrate 120, and is in contact with the radiation electrode 121.
  • FIG. 1 the mold resin 130 is filled in the surface Sf1 side, the surface Sf2 side, and the opening Op of the mounting substrate 120, and is in contact with the radiation electrode 121.
  • the base material forming mold resin 130 is, for example, thermosetting resin such as epoxy resin. Note that the base material forming the mold resin 130 may be made of other materials.
  • the mold resin 130 is covered with a sputter shield 140 .
  • Sputter shield 140 is formed by depositing a metal material containing Cu on the surface of mold resin 130 by sputtering.
  • the metal material for forming the sputter shield may be a metal material containing Au or Ag.
  • Sputter shield 140 is formed in mold resin 130 so as to cover region R2 where lens Ln is not formed.
  • region R2 where lens Ln is not formed.
  • FIG. 2 for convenience of explanation, only the XY plane and the YZ plane of the mold resin 130 are shown for the region R2, but the region R2 is formed by the XZ plane of the mold resin 130 and each plane. Includes corners and edges. That is, the region R2 is a region other than the region R1 in which the lens Ln is formed on the surface of the mold resin 130. As shown in FIG.
  • a sputter shield 140 is formed on the region R2. Also, the sputter shield 140 does not cover the region R1 in the mold resin 130 where the lens Ln is formed. In other words, lens Ln is not covered by sputter shield 140 .
  • the sputter shield 140 is arranged at a position overlapping the electronic components 150A and 150B when the mounting substrate 120 is viewed from above. In other words, the electronic components 150A and 150B are covered with the sputter shield 140. FIG. Thereby, in the antenna module 100, it is possible to suppress the radio waves emitted from the electronic components 150A and 150B from being radiated to the outside of the antenna module 100.
  • the lens Ln has a circular shape when the mounting board 120 is viewed from above.
  • end P1 and end P2 are illustrated at the edge of the lens Ln, which is the peripheral end of the lens Ln where the convex lens Ln and the sputter shield 140 are in contact. Since the lens Ln has a circular shape when the mounting substrate 120 is viewed in plan, the end P2 is located farthest from the end P1.
  • the angle Ag1 is an angle between the direction from the radiation electrode 121 to the end P1 and the direction from the radiation electrode 121 to the end P2.
  • the radiation angle of the radiation electrode 121 which is a patch antenna, is generally 120 degrees or less. Therefore, when the lens Ln is arranged so that the angle Ag1 exceeds 120 degrees, the lens Ln has a region through which radio waves do not pass. Therefore, in the antenna module 100, the angle Ag1 between the direction from the radiation electrode 121 to the end P1 and the direction from the radiation electrode 121 to the end P2 is 120 degrees or less. to place. Further, the opening Op formed in the mounting substrate 120 is formed so as not to overlap the straight line connecting the radiation electrode 121 and the end P1 and the straight line connecting the radiation electrode 121 and the end P2.
  • the mold resin 130 is formed with a convex lens Ln at a position overlapping the radiation electrode 121 when the mounting substrate 120 is viewed from above.
  • Mold resin 130 having lenses Ln is formed using a mold.
  • the mold has a shape corresponding to the lens Ln, and by pouring resin into the mold and solidifying the resin, the mold resin 130 having the lens Ln is formed.
  • the lens Ln improves the convergence of the high-frequency signal emitted by the radiation electrode 121 .
  • the lens Ln changes the beam shape of the high-frequency signal emitted by the radiation electrode 121 to improve the gain. That is, when the mold resin 130 has the lens Ln, the gain of the antenna module 100 is improved compared to when the mold resin 130 does not have the lens Ln. In addition, when the lens Ln has a concave shape, the width of the beam is widened.
  • the mold resin 130 is formed so that the space between the lens Ln and the radiation electrode 121 is solid. Further, in the example of FIG. 2, the mold resin 130 is formed of a single-layer resin having a uniform dielectric constant. As a result, the dielectric constant between the lens Ln including the inside of the opening Op and the radiation electrode 121 does not change significantly. Emitted radio waves are generally reflected as they pass through regions with large variations in dielectric constant. The greater the change in dielectric constant, the easier it is for radiated radio waves to be reflected. That is, the gain of the antenna is reduced. In the example of FIG.
  • the mold resin 130 between the lens Ln and the radiation electrode 121 is formed of a single-layer resin with a uniform dielectric constant, radio waves emitted by the radiation electrode 121 are less likely to be reflected. . That is, there is no interface between the lens Ln and the radiation electrode 121 with an object having a greatly different dielectric constant.
  • the interface is, for example, a boundary between the mold resin 130 with a high dielectric constant and an air layer with a low dielectric constant, and is a surface where impedance mismatch occurs.
  • the antenna module 100 since there is no interface where the permittivity changes significantly, it is possible to suppress the impedance mismatch and the reflection of radio waves.
  • the mold resin 130 is solid between the radiation electrode 121 and the lens Ln, and there is no interface between an object having a greatly different dielectric constant. Compared to the case where an air layer is formed between the electrode 121 and the lens Ln, radio waves emitted from the radiation electrode 121 are less likely to be reflected. That is, in the antenna module 100, a decrease in antenna gain is suppressed. Therefore, in the antenna module 100, the antenna characteristics are improved.
  • the radiation electrode 121 and the lens Ln are arranged with a distance D1 in the Z-axis direction.
  • the distance D1 is 1 ⁇ or more.
  • the distance over which radio waves are radiated from the lens Ln becomes longer. That is, in the antenna module 100, the function of the lens Ln is improved.
  • the RFIC 110 is arranged on the surface Sf1 side of the mounting substrate 120.
  • the distance D1 is secured between the lens Ln and the radiation electrode 121 .
  • the RFIC 110 is arranged on the surface Sf1 side of the mounting substrate 120, it is not necessary to move the arrangement of the lens Ln in order to secure the distance D1. Therefore, it is possible to secure the distance D1 while realizing a reduction in the height of the antenna module 100 .
  • the distance D1 between the lens Ln and the radiation electrode 121 is preferably 1 ⁇ or more and 10 ⁇ or less. Thereby, in the antenna module 100, it is possible to suppress the occurrence of unnecessary resonance while improving the function of the lens Ln.
  • the mold resin 130 in FIG. 2 does not necessarily have to be formed from a uniform base material.
  • the mold resin 130 may be formed of a plurality of base materials in stepwise layers.
  • the base material of each layer forming the mold resin 130 is selected so that the dielectric constant difference between adjacent base materials is within a predetermined range between the base materials formed in layers. Thereby, the reflection of radio waves between the base materials can be suppressed.
  • the layer on the most negative side of the Z-axis and in contact with the radiation electrode 121 is formed of a first base material with a relatively high dielectric constant.
  • a layer of a second base material having a lower dielectric constant than that of the first base material is arranged on the positive direction side of the Z-axis of the layer of the first base material.
  • the difference between the permittivity of the first base material and the permittivity of the second base material is such that the interface does not increase the reflection of radio waves.
  • a layer of a third base material having a lower dielectric constant than that of the second base material is arranged on the positive direction side of the Z-axis of the layer of the second base material. The difference between the permittivity of the second base material and the permittivity of the third base material is such that the interface does not cause a large reflection of radio waves.
  • the mold resin 130 has a stepwise layer in which the dielectric constant gradually decreases, thereby preventing the occurrence of an interface between the radiation electrode 121 and the lens Ln where the amount of reflected radio waves increases. can be suppressed.
  • the mold resin 130 may include a plurality of base materials, and may be formed such that the dielectric constants of the plurality of base materials gradually change as gradation.
  • Embodiment 2 In the antenna module 100 of Embodiment 1, the configuration in which the opening Op is formed in the mounting board 120 between the lens Ln and the radiation electrode 121 has been described. In Embodiment 2, a configuration that does not reduce the gain of the antenna without forming an opening in mounting substrate 120 between lens Ln and radiation electrode 121 will be described. In addition, in antenna module 100A of the second embodiment, the description of the configuration overlapping with that of antenna module 100 of the first embodiment will not be repeated.
  • FIG. 3A and 3B are a cross-sectional view (FIG. 3A) of the antenna module 100A and a plan view (FIG. 3B) of the mounting substrate 120 in FIG. 3A.
  • the mounting board 120 in the antenna module 100A does not have an opening as shown in FIG. Therefore, as shown in FIG. 3B, the radiation electrode 121 is covered with the mounting board 120 when the mounting board 120 is viewed from the positive direction side of the Z axis.
  • a mounting board 120 is arranged between the radiation electrode 121 and the lens Ln.
  • the conductor 120G included inside the mounting substrate 120 is not arranged between the radiation electrode 121 and the lens Ln.
  • the mounting board 120 that does not include the conductor 120G is arranged in the region where the opening Op in FIG. 2 is formed.
  • the radiation electrode 121 is arranged at a position that does not overlap the conductor 120G when the mounting substrate 120 is viewed from above. Moreover, the radiation electrode 121 is arranged at a position that does not overlap with the electronic components 150A and 150B when the mounting substrate 120 is viewed from above. As a result, radio waves emitted from radiation electrode 121 toward lens Ln are not blocked by conductor 120G and electronic components 150A and 150B.
  • the mounting board 120 since the mounting board 120 does not have an opening, the mounting board 120 separates the space on the surface Sf1 side of the mounting board 120 from the space on the side of the surface Sf2 of the mounting board 120. Therefore, in the antenna module 100A, the space on the side of the surface Sf1 and the space on the side of the surface Sf2 covered with the sputter shield 140 are filled with the mold resin 130A and the mold resin 130B, respectively.
  • the filled mold resin 130A is arranged so as to be in contact with the radiation electrode 121 and the surface Sf1.
  • Filled mold resin 130B is arranged so as to be in contact with surface Sf2.
  • the space between the lens Ln and the surface Sf2 of the mounting board 120 is solid.
  • the space between the radiation electrode 121 and the surface Sf1 of the mounting substrate 120 is solid.
  • the mold resin 130A, the mounting substrate 120 not including the conductor 120G, and the mold resin 130B are arranged in this order from the negative direction side of the Z axis.
  • the mounting board 120 is made of resin such as epoxy or polyimide. That is, the difference in permittivity between the mounting substrate 120 and the mold resins 130A and 130B is smaller than the difference in permittivity between the air and the mold resins 130A and 130B.
  • the dielectric constant between the lens Ln and the radiation electrode 121 does not change significantly in the antenna module 100A. That is, in the antenna module 100A, there is no interface where the dielectric constant changes greatly, such as the interface between the air layer and the mold resin, so that impedance mismatch is suppressed and radio wave reflection is suppressed. can be done.
  • the conductor 120G and the electronic components 150A and 150B are arranged at positions that do not overlap the radiation electrode 121 when the mounting board 120 is viewed from above. Further, the space between the lens Ln and the surface Sf2 and between the radiation electrode 121 and the surface Sf1 are filled with the mounting board 120 and the mold resins 130A and 130B. As a result, without forming an opening in the mounting substrate 120, it is possible to suppress the reflection of radio waves emitted from the radiation electrode 121, thereby suppressing a decrease in the gain of the antenna. Therefore, in the antenna module 100A, the antenna characteristics are improved.
  • the mold resin 130A corresponds to the "first dielectric" in the present disclosure
  • the mold resin 130B corresponds to the "second dielectric" in the present disclosure.
  • antenna module 100 of Embodiment 1 the configuration in which only mold resin 130 is filled between RFIC 110 and electronic component 150A or electronic component 150B has been described.
  • a configuration for suppressing unwanted resonance using conductive shields 180A and 180B will be described.
  • description of the configuration overlapping with that of the antenna module 100 of Embodiment 1 will not be repeated.
  • FIG. 4 is a cross-sectional view of the antenna module 100B according to the third embodiment.
  • a conductive shield 180A is arranged between a region R3 of the mold resin 130 that overlaps with the lens Ln when the mounting substrate 120 is viewed from above and the electronic component 150A.
  • a conductive shield 180B is arranged between the region R3 and the electronic component 150B.
  • Conductive shields 180A and 180B are formed from a member having conductivity. Conductive shields 180A and 180B are connected to ground potential.
  • a region R3 in the mold resin 130 that overlaps with the lens Ln when the mounting substrate 120 is viewed from above corresponds to the “third region” in the present disclosure.
  • the conductive shields 180A and 180B have wall shapes. That is, the conductive shields 180A and 180B have lengths in the Y-axis direction, and divide the region filled with the mold resin 130 into three. Conductive shields 180A and 180B block radio waves generated from electronic components 150A and 150B and suppress noise generation. RFIC 110 and electronic components 150A and 150B are each arranged in an independent space isolated by conductive shields 180A and 180B. As shown in FIG. 4, the conductive shields 180A, 180B are preferably positioned between the sputter shield 140 and the mounting substrate 120 to form an isolated and independent space. An opening may be formed in the portion.
  • the conductive shields 180A and 180B may have a shape other than the wall shape as long as they can block electromagnetic waves.
  • the conductive shields 180A, 180B may have a post shape, wire shape, or mesh shape.
  • a columnar shape means at least one rod-like shape arranged between the mounting substrate 120 and the sputter shield 140 .
  • the conductive shields 180A and 180B have a pillar shape, compared with the case where the conductive shields 180A and 180B have a wall shape, the regions where the RFIC 110 and the electronic components 150A and 150B are arranged are not isolated, thereby suppressing the generation of noise and enabling manufacturing. Cost can be reduced. If the conductive shields 180A, 180B are post-shaped, multiple posts may be positioned between the RFIC 110 and the electronic components 150A, 150B.
  • a wire shape is a shape consisting of at least one conductive wire that is thinner than a column shape.
  • the conductive shields 180A, 180B may be formed from a plurality of wires extending in the Y-axis direction.
  • the conductive shields 180A, 180B correspond to "conductive members" in the present disclosure.
  • the conductive shield 180A is arranged on the radiation electrode 121 side. That is, the distance D3 between the conductive shield 180A and the radiation electrode 121 is shorter than the distance D2 between the conductive shield 180A and the electronic component 150A. In other words, distance D2 is longer than distance D3. Since the distance D2 is longer than the distance D3, in the antenna module 100B, the distance from the radiation electrode 121 to the conductive shield 180A is shortened, and the frequency band of the radio wave that resonates with the radio wave radiated from the radiation electrode 121 is reduced. can be narrowed. That is, the antenna module 100B can suppress the occurrence of unnecessary resonance.
  • the conductive shield 180B is arranged in the vicinity of the electronic component 150B. That is, the distance D5 between the conductive shield 180B and the electronic component 150B is shorter than the distance D4 between the conductive shield 180B and the radiation electrode 121. In other words, distance D4 is longer than distance D5. Since the distance D4 is longer than the distance D5 in this manner, the antenna module 100A can improve the heat radiation efficiency of the heat generated by the electronic component 150B.
  • the conductive shields 180A and 180B are not limited to having a shape having a length in the Y-axis direction, and may have a shape having a length in the X-axis direction.
  • the conductive shield may be formed to surround the opening Op. This makes it possible to suppress the occurrence of unnecessary resonance more reliably.
  • Embodiment 4 In the antenna module 100 of Embodiment 1, the configuration in which the radiation electrode 121 is a single patch antenna has been described. In Embodiment 4, the configuration of an antenna module 100C having a plurality of radiating elements will be described. In addition, in the antenna module 100C of Embodiment 4, description of the configuration overlapping with that of the antenna module 100 of Embodiment 1 will not be repeated.
  • FIG. 5 is a cross-sectional view (FIG. 5A) of the antenna module 100C according to Embodiment 4, and a plan view of the mounting board 120, the RFIC 110, and the radiation electrode 121C in FIG. 5A (FIG. 5B). is.
  • a radiation electrode 121C is arranged on a surface Sf3 of the RFIC 110 on the positive direction side of the Z axis.
  • the radiation electrode 121C includes a plurality of radiation elements 122A-122H arranged two-dimensionally. That is, the radiation electrode 121C forms an array antenna.
  • the angle Ag2 is the angle between the direction from the radiation element 122A toward the end P1 and the positive direction of the Z-axis.
  • Angle Ag3 is the angle between the direction from radiation element 122D toward end P2 and the positive direction of the Z-axis.
  • patch antennas typically radiate at angles less than or equal to 120 degrees. Therefore, in the antenna module 100C, the radiation electrode 121C and the lens Ln are arranged so that the angle obtained by adding the angle Ag3 to the angle Ag2 is 120 degrees or less. Further, the opening Op formed in the mounting substrate 120 is formed so as not to overlap the straight line connecting the radiating element 122A and the end P1 and the straight line connecting the radiating element 122D and the end P2.
  • the mold resin 130 is solid between the radiation electrode 121C and the lens Ln, and there is no interface between objects with greatly different dielectric constants. Therefore, compared to the case where an air layer is formed between the radiation electrode 121C and the lens Ln, the radio waves emitted from the radiation electrode 121C are less likely to be reflected. Therefore, since there is no region where the degree of change in dielectric constant is large, it is possible to suppress the reflection of radio waves and improve the characteristics of the antenna while performing beam forming using a plurality of radiating elements.
  • Embodiment 5 In the antenna module 100 of Embodiment 1, the configuration in which the convex lenses Ln are formed in the mold resin 130 has been described. In Embodiment 5, a configuration in which a lens LnC, which is a plane lens, is formed in mold resin 130 will be described. In addition, in antenna module 100D of the fifth embodiment, the description of the configuration overlapping with that of antenna module 100 of the first embodiment will not be repeated.
  • FIG. 6 is a cross-sectional view of the antenna module 100D according to the fifth embodiment. As shown in FIG. 6, in antenna module 100D, lens LnC formed in mold resin 130 is a planar lens.
  • a planar lens is a lens that has a planar lens effect and is formed by a metamaterial or the like.
  • a metamaterial is an artificial substance that has electromagnetic or optical properties that are not possessed by substances existing in the natural world. Metamaterials have the property of negative permeability ( ⁇ 0), negative permittivity ( ⁇ 0), or negative refractive index (when both the permeability and the permittivity are negative). This makes it possible to change the path of radio waves emitted from the radiation electrode 121 even in a planar shape.
  • the lens LnC in the example of the antenna module 100D is formed by FSS (Frequency-Selective Surface), but it may be a planar lens formed by other manufacturing methods and materials.
  • the mold resin 130 is solid between the radiation electrode 121 and the lens LnC, and there is no interface between objects with greatly different dielectric constants. Therefore, compared to the case where an air layer is formed between the radiation electrode 121 and the lens LnC, the radio waves emitted from the radiation electrode 121 are less likely to be reflected. Since the dielectric constant between the lens LnC and the radiation electrode 121 does not change significantly, there is no region where the dielectric constant changes greatly, so that the reflection of radio waves is suppressed and the characteristics of the antenna are improved. can be used to achieve a lower profile.
  • antenna module 100 of Embodiment 1 the configuration in which the connection member 160 that connects the RFIC 110 and the mounting substrate 120 is arranged between the mounting substrate 120 and the RFIC 110 has been described.
  • an antenna module 100E having a configuration in which an intermediate member 190 is added to the configuration of the antenna module 100 will be described.
  • antenna module 100E of the sixth embodiment the description of the configuration overlapping with that of antenna module 100 of the first embodiment will not be repeated.
  • FIG. 7 is a cross-sectional view of the antenna module 100E according to the sixth embodiment.
  • RFIC 110 is electrically connected to intermediate member 190 via connecting member 160Ea.
  • the intermediate member 190 has an opening Op2 in a region overlapping the opening Op when the mounting substrate 120 is viewed from above.
  • the area of the opening Op2 when the mounting substrate 120 is viewed in plan may be a smaller area than the area of the opening Op when the mounting substrate 120 is viewed in plan.
  • the intermediate member 190 is, for example, a printed board, a ceramic board, an interposer board made of silicon or glass, or a flexible board.
  • connection member 160Ea is arranged between the surface of the RFIC 110 on the positive side of the Z axis and the surface of the intermediate member 190 on the negative side of the Z axis.
  • the intermediate member 190 is electrically connected to the mounting board 120 via the connection member 160Eb.
  • the connection member 160Eb is arranged between the surface of the intermediate member 190 on the positive side of the Z axis and the surface of the mounting board 120 on the negative side of the Z axis.
  • Each of connection members 160Ea and 160Eb includes six solder bumps. Connection members 160Ea and 160Eb may be connection members other than solder bumps.
  • the mold resin 130 is filled between the lens Ln and the radiation electrode 121 as well.
  • the dielectric constant between the lens Ln and the radiation electrode 121 does not change significantly. Therefore, there is no region where the degree of change in dielectric constant is large, and in the antenna module 100E, the intermediate member 190 can be mounted while suppressing the reflection of radio waves and improving the characteristics of the antenna.
  • Embodiment 7 In the antenna module 100 of Embodiment 1, the configuration in which the lens Ln is formed so as to protrude from the mold resin 130 has been described. In Embodiment 7, by adjusting the position where the lens LnF is formed, the lens LnF is prevented from physically interfering with an object such as an external device, and the overall height of the antenna module 100F is reduced. A configuration for realizing the above will be described. In addition, in the antenna module 100F of the seventh embodiment, the description of the configuration overlapping with that of the antenna module 100 of the first embodiment will not be repeated.
  • FIG. 8 is a cross-sectional view of the antenna module 100F according to the seventh embodiment.
  • lens LnF of antenna module 100F is formed inside mold resin 130, unlike lens Ln of the first embodiment. That is, the hemispherical vertex T1 of the lens LnF is arranged on the negative side of the Z-axis with respect to the surface of the sputter shield 140 on the positive side of the Z-axis. In other words, in the Z-axis direction, the vertex T1 and the surface of the sputter shield 140 on the positive side of the Z-axis are separated by a distance D6. As a result, it is possible to prevent the lens LnF from physically interfering with an object such as an external device, and further reduce the height of the antenna module 100F as a whole.
  • the antenna module 100F in which such a lens LnF is arranged on the negative direction side of the Z-axis with respect to the spatter shield 140 since the mold resin 130 is filled between the lens LnF and the radiation electrode 121, the lens LnF and the radiation electrode 121, and there is no region where the degree of change in the dielectric constant is large. Therefore, in the antenna module 100E, the reflection of radio waves is suppressed, the characteristics of the antenna are improved, the lens LnF is prevented from physically interfering with an object such as an external device, and the antenna module 100F as a whole has a low profile. can be realized.
  • Embodiment 8 In the antenna module 100 of Embodiment 1, the configuration in which the radiation electrode 121 forms a patch antenna has been described. In Embodiment 8, a configuration in which radiation electrode 121G forms a dipole antenna will be described. In addition, in the antenna module 100G of the eighth embodiment, the description of the configuration overlapping with that of the antenna module 100 of the first embodiment will not be repeated.
  • FIG. 9 is a cross-sectional view (FIG. 9(A)) of the antenna module 100G in Embodiment 8, and a plan view (FIG. 9(B)) of the RFIC 110 and the radiation electrode 121G in FIG. 9(A).
  • the radiation electrode 121G forms a dipole antenna.
  • the radiation electrode 121G may be formed as an antenna other than the patch antenna and the dipole antenna.
  • the radiation electrode 121G can be formed as a slot antenna.
  • the antenna module 100G having an antenna other than such a patch antenna since there is no region where the degree of change in dielectric constant is large between the lens Ln and the radiation electrode 121G, the reflection of radio waves is suppressed, and the antenna is improved.
  • Various antennas can be implemented while improving the characteristics.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Aerials With Secondary Devices (AREA)
PCT/JP2022/005884 2021-03-05 2022-02-15 アンテナモジュール WO2022185901A1 (ja)

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US18/460,693 US20230411862A1 (en) 2021-03-05 2023-09-05 Antenna module

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH114118A (ja) * 1997-06-13 1999-01-06 Fujitsu Ltd アンテナ素子を内蔵する半導体モジュール
JP2003315438A (ja) * 2002-04-26 2003-11-06 Hitachi Ltd レーダセンサ
JP2008072659A (ja) * 2006-09-15 2008-03-27 Sharp Corp 無線通信装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH114118A (ja) * 1997-06-13 1999-01-06 Fujitsu Ltd アンテナ素子を内蔵する半導体モジュール
JP2003315438A (ja) * 2002-04-26 2003-11-06 Hitachi Ltd レーダセンサ
JP2008072659A (ja) * 2006-09-15 2008-03-27 Sharp Corp 無線通信装置

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