WO2022183643A1 - 半导体制程中失控行为的处理方法及处理装置 - Google Patents

半导体制程中失控行为的处理方法及处理装置 Download PDF

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Publication number
WO2022183643A1
WO2022183643A1 PCT/CN2021/103577 CN2021103577W WO2022183643A1 WO 2022183643 A1 WO2022183643 A1 WO 2022183643A1 CN 2021103577 W CN2021103577 W CN 2021103577W WO 2022183643 A1 WO2022183643 A1 WO 2022183643A1
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control behavior
semiconductor process
control
current
wafer
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PCT/CN2021/103577
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English (en)
French (fr)
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王俊
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长鑫存储技术有限公司
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Priority to US17/446,416 priority Critical patent/US20220285187A1/en
Publication of WO2022183643A1 publication Critical patent/WO2022183643A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
    • G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/006—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation at wafer scale level, i.e. wafer scale integration [WSI]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Definitions

  • the present application relates to the technical field of semiconductor manufacturing, and in particular, to a processing method and a processing device for out-of-control behavior in a semiconductor manufacturing process.
  • the measurement data is collected and the statistical process control system (Statistical Process Control, SPC) is used to monitor the current process status and detect out of control. Behavior (Out Of Control, OOC) and feedback to the Manufacturing Execution System (Manufacturing Execution System, MES) to perform corresponding actions on the product or machine.
  • SPC statistical Process Control
  • OOC Out Of Control
  • MES Manufacturing Execution System
  • the engineer controls the production execution system according to the standard operating procedure (SOP) to perform corresponding actions on the products that are out of control.
  • Engineers may miss some important confirmation items when dealing with out-of-control behaviors manually, so the released products may affect the smooth progress of subsequent processes. Moreover, there are too many standard operating procedures, and the standard operating procedures that engineers refer to when dealing with out-of-control behaviors manually may be different from the corresponding process for out-of-control products, resulting in erroneous conclusions. In addition, when engineers manually check and handle out-of-control behaviors according to standard operating procedures, there are no corresponding records to query, which is not conducive to subsequent tracking. The current handling of out-of-control behavior requires operations such as adding volume, sweeping, and releasing the product, which requires engineers and products to shuttle between different machines, which is time-consuming and labor-intensive.
  • the present application provides a processing method and a processing device for out-of-control behavior in a semiconductor process, which are used to solve the problem of low efficiency in handling out-of-control behavior in a semiconductor process, so as to improve the reliability of the processing result of the out-of-control behavior and reduce the process of processing the out-of-control behavior. It reduces the human cost and reduces the influence of human subjective factors on the processing results of out-of-control behaviors.
  • the present application provides a method for processing out-of-control behavior in a semiconductor process, including the following steps:
  • the list includes a variety of out-of-control behavior checks
  • the wafer is inspected according to the current identification content corresponding to the current out-of-control behavior identification code.
  • the present application also provides a processing device for out-of-control behavior in a semiconductor process, including:
  • a storage module for establishing and storing a plurality of out-of-control behavior identification codes corresponding to a plurality of semiconductor process steps respectively, and a plurality of identification contents corresponding to the plurality of out-of-control behavior identification codes one-to-one, and the identification contents are used to establish an out-of-control behavior
  • a check list the out-of-control behavior inspection list includes a variety of out-of-control behavior inspection items
  • the judgment module is used for judging whether the wafer performing the current semiconductor process step has runaway behavior, and if so, automatically obtains the current runaway behavior identification code corresponding to the current semiconductor process step;
  • the detection module is used to detect the wafer according to the current identification content corresponding to the current out-of-control behavior identification code.
  • the processing method and processing device for an out-of-control behavior in a semiconductor process establishes a plurality of out-of-control behavior identification codes corresponding to a plurality of semiconductor process steps respectively, and a plurality of identification contents corresponding to the multiple out-of-control behavior identification codes one-to-one, After the Statistical Process Control System (SPC) confirms that the wafer is out of control, the identification code of the current out-of-control behavior can be obtained, so that the wafer can be quickly inspected according to the identification content, and the production execution system (MES) can be directly connected in series.
  • SPC Statistical Process Control System
  • the wafer performs corresponding actions, which improves the efficiency of handling out-of-control behaviors in the semiconductor process, improves the reliability of the results of out-of-control behaviors, reduces labor costs in the process of handling out-of-control behaviors, and reduces human subjective factors in handling out-of-control behaviors. impact on results.
  • FIG. 1 is a flowchart of a method for processing out-of-control behavior in a semiconductor manufacturing process in a specific embodiment of the present application
  • FIG. 3 is a schematic diagram of the correspondence between the out-of-control behavior check list, the reason summary and the execution action in the specific embodiment of the present application;
  • FIG. 4 is a schematic diagram of an SPC in the semiconductor manufacturing process in the specific embodiment of the present application.
  • FIG. 5 is a structural block diagram of an apparatus for processing out-of-control behavior in a semiconductor process according to a specific embodiment of the present application.
  • FIG. 6 is a relationship diagram of a processing device for runaway behavior in a semiconductor process and MES and SPC in a specific embodiment of the present application.
  • FIG. 1 is a flowchart of the method for processing out-of-control behavior in a semiconductor process in the specific embodiment of the present application. As shown in FIG. 1 , the method for processing out-of-control behavior in the semiconductor manufacturing process includes the following steps:
  • Step S11 establishing a plurality of out-of-control behavior identification codes corresponding to a plurality of semiconductor process steps respectively, and a plurality of identification contents corresponding to the plurality of out-of-control behavior identification codes one-to-one, and establishing an out-of-control behavior check list according to the identification contents, and the The list of out-of-control behavior checks includes a variety of out-of-control behavior check items.
  • a plurality of out-of-control behavior identification codes corresponding to a plurality of semiconductor process steps may be to establish an out-of-control behavior identification code for each of the semiconductor process steps; it may also be to establish a plurality of out-of-control behaviors for each of the semiconductor process steps.
  • the identification code for example, the identification code of the out-of-control behavior is separately established for the hardware device used and the process method used in each of the semiconductor process steps.
  • the specific form of the out-of-control behavior identification code can be set by those skilled in the art according to actual needs, as long as the correspondence between the semiconductor process and the out-of-control behavior identification code can be realized.
  • the multiple mentioned in this specific embodiment refers to two or more.
  • the specific steps of establishing multiple out-of-control behavior identification codes corresponding to multiple semiconductor process steps respectively include:
  • a runaway behavior identification code is established for each process item in each semiconductor process step that needs to be processed using the same standard operating procedure.
  • FIG. 2 is a schematic diagram of establishing out-of-control behavior identification codes in a specific embodiment of the present application. Specifically, in order to further simplify the processing method for the out-of-control behavior, the present embodiment establishes an out-of-control behavior identification code for each process item that needs to be processed by the same standard operating procedure (SOP) in each semiconductor process step. For example, as shown in FIG.
  • SOP standard operating procedure
  • an out-of-control behavior identification code PH-CD is established for the process item related to the feature size (CD).
  • An out-of-control behavior identification code PH-OVL is established for process items related to OVL
  • an out-of-control behavior identification code PH-THK is established for process items related to film thickness (THK).
  • TF film formation
  • a runaway behavior identification code TF-PVD is established for a process item related to PVD (Physical Vapor Deposition). chemical vapor deposition) related process entry to establish a runaway behavior identification code TF-CVD.
  • the process items described in this specific implementation manner may include one or a combination of two or more of the devices, process methods, and semiconductor feature parameters (such as feature size, overlay accuracy, and film thickness) used in the semiconductor process steps. .
  • the out-of-control behavior identification code includes a first part and a second part, the first part is a name of a semiconductor process step, and the second part is a name of a process item that needs to be processed by the same standard operating procedure.
  • the engineer can intuitively and quickly understand the out-of-control behavior identification during work.
  • the meaning represented by the code to avoid mistakes and omissions.
  • the out-of-control behavior inspection list includes a plurality of inspection items arranged in sequence, and a plurality of inspection sub-items corresponding to each of the inspection items;
  • An execution action list corresponding to each of the out-of-control behavior check lists is established, and the execution action list includes a plurality of execution actions corresponding to a plurality of the cause summaries respectively.
  • FIG. 3 is a schematic diagram of the correspondence between the check list of out-of-control behaviors, the reason summary and the execution actions in the specific embodiment of the present application.
  • a corresponding out-of-control behavior check list is established for each of the out-of-control behavior identification codes. If an out-of-control behavior identification code is established for each process item that needs to be processed by the same standard operating procedure in each semiconductor process step, the check list corresponding to the out-of-control behavior identification code may be the standard operation corresponding to the out-of-control behavior identification code Procedure (SOP).
  • SOP out-of-control behavior identification code Procedure
  • the inspection list includes a plurality of inspection items and inspection sub-items corresponding to each of the inspection items.
  • the inspection item 1 is: check whether it is a problem with the measuring machine; the inspection sub-items corresponding to the inspection item 1 include: 1.1 check the raw data of each single-point measurement value; 1.2 check the GOF ( Confidence) value measurement position and alignment; 1.3 Check the measurement image; 1.4 Check for missing data.
  • the inspection sub-items corresponding to the inspection item 1 include: 1.1 check the raw data of each single-point measurement value; 1.2 check the GOF ( Confidence) value measurement position and alignment; 1.3 Check the measurement image; 1.4 Check for missing data.
  • the inspection item is to check whether it is a problem with the measuring machine, the corresponding cause is summarized as a measurement problem, and the corresponding execution actions include repeated measurement, adjustment of the measurement accuracy of the measuring device, etc.; the inspection items are: To check whether the wafer is an experimental product, the corresponding reason is summarized as the engineering test batch problem, and the corresponding execution action includes rework; the inspection item is to check whether it is a pre-process problem, and the corresponding cause is summarized as a pre-process problem. Then the corresponding execution action includes notifying the engineer.
  • Step S12 it is judged whether the wafer performing the current semiconductor process step has runaway behavior, and if so, the current runaway behavior identification code corresponding to the current semiconductor process step is automatically obtained.
  • the specific steps for judging whether the wafer performing the current semiconductor process step has runaway behaviors include:
  • FIG. 4 is a schematic diagram of an SPC in the semiconductor manufacturing process in the specific embodiment of the present application.
  • the process status is monitored in real time through SPC (Statistical Process Control System).
  • SPC Statistical Process Control System
  • Bind out-of-control behavior identification codes corresponding to multiple semiconductor process steps in SPC When out-of-control behavior occurs in the current semiconductor process step, for example, when an abnormal point occurs at the position indicated by the arrow in Figure 4, it can quickly and automatically obtain information about the current semiconductor process.
  • the identification code of the out-of-control behavior corresponding to the process step can effectively avoid errors caused by artificially searching for SOPs related to the current semiconductor process steps.
  • a display panel can display the wafer's out-of-control behavior.
  • the display mode may be text-based display, image-based display, or combined display of text and images.
  • step S13 the wafer is detected according to the current identification content corresponding to the current out-of-control behavior identification code.
  • the specific steps of detecting the wafer according to the current identification content corresponding to the current out-of-control behavior identification code include:
  • the runaway behavior can be checked according to the runaway behavior check list corresponding to the behavior identification code at the current moment.
  • the out-of-control behavior check list has multiple out-of-control behavior inspection items arranged in logical order, for example, first check whether the out-of-control behavior is caused by a problem of the measuring machine, then confirm whether it is an experimental batch product, and then confirm whether it is a process
  • the out-of-control behavior check items in the out-of-control behavior check list are executed sequentially until the inspection item that causes the current out-of-control behavior is confirmed, and the inspection item that causes the current out-of-control behavior is used as the target inspection item.
  • those skilled in the art can also set other sequences according to actual needs to execute each out-of-control behavior check item in the out-of-control behavior check list.
  • the production execution system is controlled to perform corresponding actions on the wafer according to the detection result of the wafer.
  • the automated control production execution system can execute the corresponding actions through the corresponding relationship among the target inspection items, the target reason summary and the target execution actions.
  • the current semiconductor process step, the current out-of-control behavior identification code, the target inspection item, the target reason summary and the execution action are stored.
  • the method for processing out-of-control behavior in the semiconductor process further includes the following steps:
  • the historical data of out-of-control behavior in the semiconductor process steps of the wafer is counted, and the historical data includes the probability that various out-of-control behavior inspection items cause the wafer to have out-of-control behavior in the semiconductor process steps.
  • the historical data of out-of-control behaviors occurring in the semiconductor process steps of the wafer are counted, and the number of out-of-control behaviors caused by each out-of-control behavior inspection item in each of the semiconductor process steps is obtained, so as to calculate various out-of-control behaviors
  • the probability that the inspection item causes the wafer to have runaway behavior in the semiconductor process step provides a reference for the current runaway behavior processing, so that engineers can better improve the process steps.
  • FIG. 5 is a structural block diagram of an apparatus for processing out-of-control behavior in a semiconductor process according to a specific embodiment of the present application.
  • the apparatus for processing out-of-control behavior in a semiconductor process provided by this specific embodiment can use the methods shown in FIG. 1 to FIG. 4 to process the out-of-control behavior in a semiconductor process.
  • the processing device for the out-of-control behavior in the semiconductor process includes:
  • the storage module 50 is used for establishing and storing a plurality of out-of-control behavior identification codes corresponding to a plurality of semiconductor process steps respectively, and a plurality of identification contents corresponding to the plurality of out-of-control behavior identification codes one-to-one, and the identification contents are used to establish the out-of-control behavior identification codes.
  • a behavior check list, the out-of-control behavior inspection list includes a variety of out-of-control behavior inspection items;
  • the judgment module 51 is used for judging whether the wafer performing the current semiconductor process step has out-of-control behavior, and if so, automatically obtains the current out-of-control behavior identification code corresponding to the current semiconductor process step;
  • the detection module 52 is configured to detect the wafer according to the current identification content corresponding to the current out-of-control behavior identification code.
  • the storage module 50 is configured to establish an out-of-control behavior identification code for each process item that needs to be processed by the same standard operating procedure in each semiconductor process step.
  • the out-of-control behavior identification code includes a first part and a second part, the first part is a name of a semiconductor process step, and the second part is a name of a process item that needs to be processed by the same standard operating procedure.
  • the storage module 50 is configured to establish an out-of-control behavior check list according to the standard operating procedure corresponding to the out-of-control behavior identification code, and the out-of-control behavior inspection list includes a plurality of inspection items arranged in sequence, and A plurality of inspection sub-items corresponding to the inspection items are established, and a plurality of reason summaries corresponding to the plurality of inspection items in each of the out-of-control behavior inspection lists are established, and each of the out-of-control behavior inspection lists is established.
  • the execution action list includes a plurality of execution actions corresponding to a plurality of the cause summaries respectively.
  • the judging module 51 is used to judge whether the measurement result of the wafer that has completed the current semiconductor process step is within the threshold range monitored by the statistical process control system; Out of control behavior.
  • the judging module 51 is further configured to display the relevant information of the wafer after confirming that the wafer performing the current semiconductor process steps has an out-of-control behavior, and the relevant information includes the time when the out-of-control behavior is confirmed, the process site, One or a combination of two or more of the measurement site, the current out-of-control behavior identification code corresponding to the current semiconductor process step, and the statistical process control information of the wafer.
  • the detection module 52 is configured to sequentially execute the out-of-control behavior inspection items in the out-of-control behavior inspection list, obtain target inspection items that cause out-of-control behavior on the wafer, and search for the target inspection items corresponding to the target inspection items.
  • the target cause is summarized, and the execution action corresponding to the target cause is executed.
  • the device for processing out-of-control behavior in the semiconductor process further includes:
  • the processing module 54 is configured to control the production execution system to perform corresponding actions on the wafer according to the detection result of the wafer.
  • the storage module 50 is further configured to store the current semiconductor process step, the current out-of-control behavior identification code, the target inspection item, Describe the target cause induction and the execution action.
  • the device for processing out-of-control behavior in the semiconductor process further includes:
  • the statistics module 53 is used to count the historical data of the out-of-control behavior in the semiconductor process steps of the wafer, the historical data includes the probability that various out-of-control behavior inspection items cause the wafer to have out-of-control behavior in the semiconductor process steps .
  • FIG. 6 is a relationship diagram of a processing device for runaway behavior in a semiconductor process and MES and SPC in a specific embodiment of the present application.
  • the process status is monitored in real time through the SPC, and the monitoring information is fed back to the MES.
  • the current runaway behavior code corresponding to the current semiconductor process step is bound in the SPC.
  • the MES confirms that the received SPC feedback information includes out-of-control behavior information, it transmits the out-of-control behavior information to the out-of-control behavior processing device, and the out-of-control behavior processing device displays the relevant information of the current wafer in the MES system, including confirmation of the occurrence of out-of-control behavior.
  • the out-of-control behavior processing device acquires the current identification content corresponding to the current out-of-control behavior code to detect the wafer in which the out-of-control behavior occurs, matches the corresponding target cause according to the detection result, and summarizes and matches the corresponding target according to the target cause perform an action.
  • the out-of-control behavior processing device feeds back the matched target execution action to the MES and the SPC, and the MES executes a corresponding prohibition action or releases the wafer according to the detection result.
  • the out-of-control behavior processing device also writes the current semiconductor process steps, the current out-of-control behavior identification code, the target inspection item, the target reason summary, and the execution action into the MES system and the SPC system, so as to facilitate subsequent inquiries .
  • corresponding specific execution steps are set for each execution action.
  • the operation steps corresponding to the rework action include: rework step 1, rework step 2, and rework step 3.
  • the method and apparatus for processing out-of-control behavior in a semiconductor process establishes a plurality of out-of-control behavior identification codes corresponding to a plurality of semiconductor process steps respectively, and a plurality of identification codes corresponding to a plurality of out-of-control behavior identification codes one-to-one Content, after the wafer appears out of control behavior, by obtaining the current out-of-control behavior identification code, the wafer can be quickly detected according to the identification content, which improves the efficiency of out-of-control behavior processing in the semiconductor process, and improves the processing results of out-of-control behavior.
  • the reliability of the system reduces the labor cost in the process of handling out-of-control behaviors, and reduces the influence of human subjective factors on the results of handling out-of-control behaviors.

Abstract

一种半导体制程中失控行为的处理方法及处理装置。所述半导体制程中失控行为的处理方法包括如下步骤：建立与多个半导体制程步骤分别对应的多个失控行为识别编码、以及与多个失控行为识别编码一一对应的多个识别内容，根据所述识别内容建立失控行为检查列表，所述失控行为检查列表中包括多种失控行为检查项目；判断执行当前半导体制程步骤的晶圆是否出现失控行为，若是，则自动获取与当前半导体制程步骤对应的当前失控行为识别编码；根据与当前失控行为识别编码对应的当前识别内容对所述晶圆进行检测。本申请提高了半导体制程过程中失控行为处理的效率，提高了对失控行为处理结果的可靠性。

Description

半导体制程中失控行为的处理方法及处理装置
相关申请引用说明
本申请要求于2021年3月4日递交的中国专利申请号202110240525.2、申请名为“半导体制程中失控行为的处理方法及处理装置”的优先权，其全部内容以引用的形式附录于此。
技术领域
本申请涉及半导体制造技术领域，尤其涉及一种半导体制程中失控行为的处理方法及处理装置。
背景技术
在半导体制程过程中，不仅工艺步骤复杂、且对工艺的精度要求较高。为了对半导体制程过程进行监控，从而及时发现问题或者进行工艺技术的改进，针对每道制程通过收集量测数据并利用统计过程控制系统(Statistical Process Control，SPC)监控当前的制程状态，侦测失控行为(Out Of Control，OOC)并反馈于生产执行系统(Manufacturing Execution System，MES)来对产品或者机台执行相应的动作。具体来说，工程师根据标准作业程序(Standard Operating Procedure，SOP)控制生产执行系统对失控行为的产品执行相应的动作。
工程师人工在对失控行为进行处理时可能会遗漏一些重要的确认项目，因此放行的产品可能会影响后续工艺的顺利进行。而且，标准作业程序太多，工程师在人工对失控行为进行处理时参照的标准作业程序可能与失控产品对应的制程不同，从而导致错误的结论。另外，工程师人工依据标准作业程序对失控行为进行检查处理时没有对应的记录可查询，不利于后续的追踪。当前对失控行为的处理需要对产品进行加量、加扫、放行等操作，导致需要工程师以及产品在不同的机台之间穿梭，费时费力。
因此，如何提高对半导体制程过程中失控行为处理的效率，提高对失控行为处理的结果的可靠性，降低人力成本，减少人的主观因素导致的错误，是当前亟待解决的技术问题。
发明内容
本申请提供一种半导体制程中失控行为的处理方法及处理装置，用于解决 在处理半导体制程过程中失控行为方面效率低下的问题，以提高对失控行为处理结果的可靠性，降低失控行为处理过程中的人力成本，减少人为主观因素对失控行为处理结果的影响。
为了解决上述问题，本申请提供了一种半导体制程中失控行为的处理方法，包括如下步骤：
建立与多个半导体制程步骤分别对应的多个失控行为识别编码、以及与多个失控行为识别编码一一对应的多个识别内容，根据所述识别内容建立失控行为检查列表，所述失控行为检查列表中包括多种失控行为检查项目；
判断执行当前半导体制程步骤的晶圆是否出现失控行为，若是，则自动获取与当前半导体制程步骤对应的当前失控行为识别编码；
根据与当前失控行为识别编码对应的当前识别内容对所述晶圆进行检测。
为了解决上述问题，本申请还提供了一种半导体制程中失控行为的处理装置，包括：
存储模块，用于建立并存储与多个半导体制程步骤分别对应的多个失控行为识别编码、以及与多个失控行为识别编码一一对应的多个识别内容，所述识别内容用于建立失控行为检查列表，所述失控行为检查列表中包括多种失控行为检查项目；
判断模块，用于判断执行当前半导体制程步骤的晶圆是否出现失控行为，若是，则自动获取与当前半导体制程步骤对应的当前失控行为识别编码；
检测模块，用于根据与当前失控行为识别编码对应的当前识别内容对所述晶圆进行检测。
本申请提供的半导体制程中失控行为的处理方法及处理装置，建立与多个半导体制程步骤分别对应的多个失控行为识别编码、以及与多个失控行为识别编码一一对应的多个识别内容，通过统计过程控制系统(SPC)确认晶圆出现失控行为之后，通过获取当前失控行为识别编码，从而能够快速的对晶圆按照识别内容进行检测，并可直接串联生产执行系统(MES)控制其对晶圆执行相应的动作，提高了半导体制程过程中失控行为处理的效率，提高了对失控行为处理结果的可靠性，降低了失控行为处理过程中的人力成本，减少了人为主观因素对失控行为处理结果的影响。
附图说明
附图1是本申请具体实施方式中半导体制程中失控行为的处理方法流程图；
附图2是本申请具体实施方式建立失控行为识别编码的示意图；
附图3是本申请具体实施方式中失控行为检查列表、原因归纳与执行动作之间的对应关系示意图；
附图4是本申请具体实施方式中半导体制程中的一个SPC示意图；
附图5是本申请具体实施方式中半导体制程中失控行为的处理装置的结构框图。
附图6是本申请具体实施方式中半导体制程中失控行为的处理装置与MES和SPC的关系图。
具体实施方式
下面结合附图对本申请提供的半导体制程中失控行为的处理方法及处理装置的具体实施方式做详细说明。
本具体实施方式提供了一种半导体制程中失控行为的处理方法，附图1是本申请具体实施方式中半导体制程中失控行为的处理方法流程图。如图1所示，所述半导体制程中失控行为的处理方法，包括如下步骤：
步骤S11，建立与多个半导体制程步骤分别对应的多个失控行为识别编码、以及与多个失控行为识别编码一一对应的多个识别内容，根据所述识别内容建立失控行为检查列表，所述失控行为检查列表中包括多种失控行为检查项目。
在半导体产品的制造工艺中，晶圆需要经过多个半导体制程步骤的处理。建立与多个半导体制程步骤分别对应的多个失控行为识别编码，可以是针对每个所述半导体制程步骤建立一个失控行为识别编码；也可以是针对每个所述半导体制程步骤建立多个失控行为识别编码，例如针对每个所述半导体制程步骤所采用的硬件装置和所使用的工艺方法分别建立失控行为识别编码。所述失控行为识别编码的具体形式，本领域技术人员可以根据实际需要进行设置，只要能够实现半导体制程与失控行为识别编码的对应即可。本具体实施方式中所述的多个是指两个及两个以上。
可选的，建立与多个半导体制程步骤分别对应的多个失控行为识别编码的 具体步骤包括：
针对每一半导体制程步骤中需要采用相同标准作业程序处理的工艺条目建立一个失控行为识别编码。
附图2是本申请具体实施方式建立失控行为识别编码的示意图。具体来说，为了进一步简化对失控行为的处理方法，本具体实施方式针对每一半导体制程步骤中需要采用相同标准作业程序(SOP)处理的工艺条目建立一个失控行为识别编码。举例来说，如图2所示，当所述半导体制程步骤为CMP(化学机械研磨)时，由于CMP步骤中的装置1、装置2和装置3均需要采用SOP1进行处理，因此，针对工艺条目装置1、装置2和装置3三者共同建立一个失控行为识别编码(OCAP ID，Out Of Control Action Plan ID)CMP-XXX；由于CMP步骤中的工艺1、工艺2、工艺3和工艺4均需要采用SOP2进行处理，因此，针对工艺条目工艺1、工艺2、工艺3和工艺4这四者共同建立一个失控行为识别编码CMP-YYY。再例如，如图2所示，当所述半导体制程步骤为PH(光刻)时，针对与特征尺寸(CD)有关的工艺条目建立一个失控行为识别编码PH-CD，针对与套刻精度(OVL)有关的工艺条目建立一个失控行为识别编码PH-OVL，针对与膜厚(THK)有关的工艺条目建立一个失控行为识别编码PH-THK。再例如，如图2所示，当所述半导体制程步骤为成膜(TF)步骤时，针对与PVD(物理气相沉积)有关的工艺条目建立一个失控行为识别编码TF-PVD，针对与CVD(化学气相沉积)有关的工艺条目建立一个失控行为识别编码TF-CVD。本具体实施实施方式中所述的工艺条目可以包括半导体制程步骤中所使用的装置、工艺方法、半导体特征参数(例如特征尺寸、套刻精度、膜厚)中的一种或者两种以上的组合。
可选的，所述失控行为识别编码包括第一部分和第二部分，所述第一部分为半导体制程步骤名称，所述第二部分为需要采用相同标准作业程序处理的工艺条目的名称。
具体来说，通过将所述失控行为识别编码设置为包括半导体制程步骤名称和需要采用相同标准作业程序处理的工艺条目的名称，可以使得工程师在工作中能够直观、快速的了解到该失控行为识别编码所代表的意义，避免错漏。
可选的，建立与多个半导体制程步骤分别对应的多个失控行为识别编码、 以及与多个失控行为识别编码一一对应的多个识别内容，根据所述识别内容建立失控行为检查列表，所述失控行为检查列表中包括多种失控行为检查项目的具体步骤包括：
根据所述失控行为识别编码对应的标准作业程序建立失控行为检查列表，所述失控行为检查列表包括顺序排列的多个检查项目、以及与每个所述检查项目对应的多个检查子项目；
建立与每个所述失控行为检查列表中的多个所述检查项目一一对应的多个原因归纳；
建立与每个所述失控行为检查列表对应的执行动作列表，所述执行动作列表中包括与多个所述原因归纳分别对应的多种执行动作。
附图3是本申请具体实施方式中失控行为检查列表、原因归纳与执行动作之间的对应关系示意图。具体来说，如图3所示，针对每一个所述失控行为识别编码都建立一个与之对应的失控行为检查列表。若针对每一半导体制程步骤中需要采用相同标准作业程序处理的工艺条目建立一个失控行为识别编码，则与一个所述失控行为识别编码对应的检查列表可以为该失控行为识别编码所对应的标准作业程序(SOP)。所述检查列表包括多个检查项目、以及与每一所述检查项目对应的检查子项目。举例来说，所述检查项目1为：检查是否是量测机台的问题；所述检查项目1对应的检查子项目包括：1.1检查每个单点量测值的原始数据；1.2检查GOF(可信度)值量测位置以及对准情况；1.3检查量测图像；1.4检查是否存在数据缺失。
建立与每个所述失控行为检查列表中的多个所述检查项目一一对应的多个原因归纳，以便于后续根据确认产生失控行为的检查项目，并控制生产执行系统(MES)执行相应的动作。举例来说，检查项目为检查是否是量测机台的问题，则其对应的原因归纳为量测问题，则其对应的执行动作包括重复测量、量测装置量测精度调整等；检查项目为检查晶圆是否为实验产品，则其对应的原因归纳为工程试验批问题，则其对应的执行动作包括返工；检查项目为检查是否是前制程问题，则其对应的原因归纳为前制程问题，则其对应的执行动作包括通知工程师。
步骤S12，判断执行当前半导体制程步骤的晶圆是否出现失控行为，若是， 则自动获取与当前半导体制程步骤对应的当前失控行为识别编码。
可选的，判断执行当前半导体制程步骤的晶圆是否出现失控行为的具体步骤包括：
判断执行完当前半导体制程步骤的晶圆量测结果是否在统计过程控制系统监控的阈值范围内，若否，则确认执行当前半导体制程步骤的晶圆出现失控行为。
附图4是本申请具体实施方式中半导体制程中的一个SPC示意图。具体来说，在半导体制造过程中，通过SPC(统计过程控制系统)对制程状态进行实时监控。在SPC中绑定与多个半导体制程步骤对应的失控行为识别编码，在当前半导体制程步骤出现失控行为时，例如图4中箭头所指的位置出现异常点时，快速、自动的获取与当前半导体制程步骤对应的失控行为识别编码，从而有效避免了人为寻找与当前半导体制程步骤相关的SOP所导致的错误。
可选的，确认执行当前半导体制程步骤的晶圆出现失控行为之后，还包括如下步骤：
显示所述晶圆的相关信息，所述相关信息包括确认出现失控行为的时间、制程站点、量测站点、与当前半导体制程步骤对应的当前失控行为识别编码、所述晶圆的统计过程控制信息中的一种或者两种以上的组合。
为了便于工程师了解出现失控行为的晶圆的相关情况，为后续进行失控行为处理提供参考，可以在确认执行当前半导体制程步骤的晶圆出现失控行为之后，于一显示面板中显示所述晶圆的相关信息。所述显示方式可以是文字方式显示、图像方式显示、或者文字与图像结合显示。
步骤S13，根据与当前失控行为识别编码对应的当前识别内容对所述晶圆进行检测。
可选的，根据与当前失控行为识别编码对应的当前识别内容对所述晶圆进行检测的具体步骤包括：
顺序执行所述失控行为检查列表中的失控行为检查项目，获得导致所述晶圆出现失控行为的目标检查项目；
查找与所述目标检查项目对应的目标原因归纳，并执行与所述目标原因归纳对应的执行动作。
具体来说，在确认执行当前半导体制程步骤的晶圆出现失控行为、且获取当前失控行为识别编码之后，即可根据当前时刻行为识别编码对应的失控行为检查列表对所述失控行为进行检查。所述失控行为检查列表中具有按逻辑顺序排列的多个失控行为检查项目，例如首先检查是否是量测机台问题导致的失控行为、然后确认是否是实验批次产品、之后再确认是否是制程问题导致的失控行为，顺序执行所述失控行为检查列表种失控行为检查项目，直至确认导致当前失控行为的检查项目，并以导致当前失控行为的检查项目作为目标检查项目。在其他示例中，本领域技术人员也可以根据实际需要设置其他的顺序来执行所述失控行为检查列表中的各失控行为检查项目。
可选的，根据与当前失控行为识别编码对应的当前识别内容对所述晶圆进行检测之后，还包括如下步骤：
根据对所述晶圆的检测结果控制生产执行系统对所述晶圆执行相应的动作。
具体来说，在确认所述目标检查项目之后，就可以通过目标检查项目、目标原因归纳以及目标执行动作之间的对应关系，自动化的控制生产执行系统(MES)执行相应的动作。
为了便于后续查询失控行为处理的相关信息，可选的，执行与所述目标原因归纳对应的执行动作之后，还包括如下步骤：
存储当前半导体制程步骤、当前失控行为识别编码、所述目标检查项目、所述目标原因归纳和所述执行动作。
可选的，所述半导体制程中失控行为的处理方法还包括如下步骤：
统计晶圆所述半导体制程步骤中出现失控行为的历史数据，所述历史数据包括各种失控行为检查项目导致所述晶圆在所述半导体制程步骤中出现失控行为的概率。
具体来说，统计晶圆所述半导体制程步骤中出现失控行为的历史数据，获取在每个所述半导体制程步骤中每种失控行为检查项目导致出现失控行为的次数，从而计算出各种失控行为检查项目导致所述晶圆在所述半导体制程步骤中出现失控行为的概率，为当前次的失控行为处理提供参考，以便于工程师更好的对制程步骤进行改进。
不仅如此，本具体实施方式还提供了一种半导体制程中失控行为的处理装置。附图5是本申请具体实施方式中半导体制程中失控行为的处理装置的结构框图。本具体实施方式提供的半导体制程中失控行为的处理装置可以采用如图1-图4所示的方法对半导体制程中的失控行为进行处理。如图5所示，所述半导体制程中失控行为的处理装置，包括：
存储模块50，用于建立并存储与多个半导体制程步骤分别对应的多个失控行为识别编码、以及与多个失控行为识别编码一一对应的多个识别内容，所述识别内容用于建立失控行为检查列表，所述失控行为检查列表中包括多种失控行为检查项目；
判断模块51，用于判断执行当前半导体制程步骤的晶圆是否出现失控行为，若是，则自动获取与当前半导体制程步骤对应的当前失控行为识别编码；
检测模块52，用于根据与当前失控行为识别编码对应的当前识别内容对所述晶圆进行检测。
可选的，所述存储模块50用于针对每一半导体制程步骤中需要采用相同标准作业程序处理的工艺条目建立一个失控行为识别编码。
可选的，所述失控行为识别编码包括第一部分和第二部分，所述第一部分为半导体制程步骤名称，所述第二部分为需要采用相同标准作业程序处理的工艺条目的名称。
可选的，所述存储模块50用于根据所述失控行为识别编码对应的标准作业程序建立失控行为检查列表，所述失控行为检查列表包括顺序排列的多个检查项目、以及与每个所述检查项目对应的多个检查子项目，并建立与每个所述失控行为检查列表中的多个所述检查项目一一对应的多个原因归纳，以及建立与每个所述失控行为检查列表对应的执行动作列表，所述执行动作列表中包括与多个所述原因归纳分别对应的多种执行动作。
可选的，所述判断模块51用于判断执行完当前半导体制程步骤的晶圆量测结果是否在统计过程控制系统监控的阈值范围内，若否，则确认执行当前半导体制程步骤的晶圆出现失控行为。
可选的，所述判断模块51还用于确认执行当前半导体制程步骤的晶圆出现失控行为之后，显示所述晶圆的相关信息，所述相关信息包括确认出现失控 行为的时间、制程站点、量测站点、与当前半导体制程步骤对应的当前失控行为识别编码、所述晶圆的统计过程控制信息中的一种或者两种以上的组合。
可选的，所述检测模块52用于顺序执行所述失控行为检查列表中的失控行为检查项目，获得导致所述晶圆出现失控行为的目标检查项目，以及查找与所述目标检查项目对应的目标原因归纳，并执行与所述目标原因归纳对应的执行动作。
可选的，所述半导体制程中失控行为的处理装置还包括：
处理模块54，用于根据对所述晶圆的检测结果控制生产执行系统对所述晶圆执行相应的动作。
可选的，所述存储模块50还用于在所述检测模块52执行与所述目标原因归纳对应的执行动作之后，存储当前半导体制程步骤、当前失控行为识别编码、所述目标检查项目、所述目标原因归纳和所述执行动作。
可选的，所述半导体制程中失控行为的处理装置还包括：
统计模块53，用于统计晶圆所述半导体制程步骤中出现失控行为的历史数据，所述历史数据包括各种失控行为检查项目导致所述晶圆在所述半导体制程步骤中出现失控行为的概率。
附图6是本申请具体实施方式中半导体制程中失控行为的处理装置与MES和SPC的关系图。如图6所示，在半导体制程过程中，通过SPC对制程状态进行实时监控，并将监控信息反馈至MES。所述SPC中绑定与当前进行的半导体制程步骤对应的当前失控行为编码。当MES确认接收到的SPC反馈信息中包括失控行为信息时，则将所述失控行为信息传输至失控行为处理装置，失控行为处理装置显示出MES系统中当前晶圆的相关信息，包括确认出现失控行为的时间、制程站点、量测站点、与当前半导体制程步骤对应的当前失控行为识别编码、所述晶圆的统计过程控制表信息中的一种或者两种以上的组合。所述失控行为处理装置获取与该当前失控行为编码对应的当前识别内容对发生失控行为的晶圆进行检测，并根据检测结果匹配对应的目标原因归纳，且根据所述目标原因归纳匹配对应的目标执行动作。所述失控行为处理装置将匹配到的所述目标执行动作反馈至MES和SPC，MES则根据检测结果执行相应的禁令动作或者释放所述晶圆。同时，所述失控行为处理装置还将当前半导 体制程步骤、当前失控行为识别编码、所述目标检查项目、所述目标原因归纳和所述执行动作等内容写入MES系统和SPC系统，便于后续查询。在所述失控行为处理装置中，针对每一个执行动作，都设定有相应的具体执行步骤，例如返工动作对应的操作步骤包括：返工步骤1、返工步骤2、返工步骤3。
本具体实施方式提供的半导体制程中失控行为的处理方法及处理装置，建立与多个半导体制程步骤分别对应的多个失控行为识别编码、以及与多个失控行为识别编码一一对应的多个识别内容，在晶圆出现失控行为之后，通过获取当前失控行为识别编码，从而能够快速的对晶圆按照识别内容进行检测，提高了半导体制程过程中失控行为处理的效率，提高了对失控行为处理结果的可靠性，降低了失控行为处理过程中的人力成本，减少了人为主观因素对失控行为处理结果的影响。
以上所述仅是本申请的优选实施方式，应当指出，对于本技术领域的普通技术人员，在不脱离本申请原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本申请的保护范围。

Claims (20)

  1. 一种半导体制程中失控行为的处理方法，包括如下步骤：
    建立与多个半导体制程步骤分别对应的多个失控行为识别编码、以及与多个失控行为识别编码一一对应的多个识别内容，根据所述识别内容建立失控行为检查列表，所述失控行为检查列表中包括多种失控行为检查项目；
    判断执行当前半导体制程步骤的晶圆是否出现失控行为，若是，则自动获取与当前半导体制程步骤对应的当前失控行为识别编码；
    根据与当前失控行为识别编码对应的当前识别内容对所述晶圆进行检测。
  2. 根据权利要求1所述的半导体制程中失控行为的处理方法，其中，建立与多个半导体制程步骤分别对应的多个失控行为识别编码的具体步骤包括：
    针对每一半导体制程步骤中需要采用相同标准作业程序处理的工艺条目建立一个失控行为识别编码。
  3. 根据权利要求2所述的半导体制程中失控行为的处理方法，其中，所述失控行为识别编码包括第一部分和第二部分，所述第一部分为半导体制程步骤名称，所述第二部分为需要采用相同标准作业程序处理的工艺条目的名称。
  4. 根据权利要求2所述的半导体制程中失控行为的处理方法，其中，建立与多个半导体制程步骤分别对应的多个失控行为识别编码、以及与多个失控行为识别编码一一对应的多个识别内容，根据所述识别内容建立失控行为检查列表，所述失控行为检查列表中包括多种失控行为检查项目的具体步骤包括：
    根据所述失控行为识别编码对应的标准作业程序建立失控行为检查列表，所述失控行为检查列表包括顺序排列的多个检查项目、以及与每个所述检查项目对应的多个检查子项目；
    建立与每个所述失控行为检查列表中的多个所述检查项目一一对应的多个原因归纳；
    建立与每个所述失控行为检查列表对应的执行动作列表，所述执行动作列表中包括与多个所述原因归纳分别对应的多种执行动作。
  5. 根据权利要求1所述的半导体制程中失控行为的处理方法，其中，判断执 行当前半导体制程步骤的晶圆是否出现失控行为的具体步骤包括：
    判断执行完当前半导体制程步骤的晶圆量测结果是否在统计过程控制系统监控的阈值范围内，若否，则确认执行当前半导体制程步骤的晶圆出现失控行为。
  6. 根据权利要求5所述的半导体制程中失控行为的处理方法，其中，确认执行当前半导体制程步骤的晶圆出现失控行为之后，还包括如下步骤：
    显示所述晶圆的相关信息，所述相关信息包括确认出现失控行为的时间、制程站点、量测站点、与当前半导体制程步骤对应的当前失控行为识别编码、所述晶圆的统计过程控制信息中的一种或者两种以上的组合。
  7. 根据权利要求4所述的半导体制程中失控行为的处理方法，其中，根据与当前失控行为识别编码对应的当前识别内容对所述晶圆进行检测的具体步骤包括：
    顺序执行所述失控行为检查列表中的失控行为检查项目，获得导致所述晶圆出现失控行为的目标检查项目；
    查找与所述目标检查项目对应的目标原因归纳，并执行与所述目标原因归纳对应的执行动作。
  8. 根据权利要求1所述的半导体制程中失控行为的处理方法，其中，根据与当前失控行为识别编码对应的当前识别内容对所述晶圆进行检测之后，还包括如下步骤：
    根据对所述晶圆的检测结果控制生产执行系统对所述晶圆执行相应的动作。
  9. 根据权利要求7所述的半导体制程中失控行为的处理方法，其中，执行与所述目标原因归纳对应的执行动作之后，还包括如下步骤：
    存储当前半导体制程步骤、当前失控行为识别编码、所述目标检查项目、所述目标原因归纳和所述执行动作。
  10. 根据权利要求1所述的半导体制程中失控行为的处理方法，还包括如下步骤：
    统计晶圆所述半导体制程步骤中出现失控行为的历史数据，所述历史数据 包括各种失控行为检查项目导致所述晶圆在所述半导体制程步骤中出现失控行为的概率。
  11. 一种半导体制程中失控行为的处理装置，包括：
    存储模块，用于建立并存储与多个半导体制程步骤分别对应的多个失控行为识别编码、以及与多个失控行为识别编码一一对应的多个识别内容，所述识别内容用于建立失控行为检查列表，所述失控行为检查列表中包括多种失控行为检查项目；
    判断模块，用于判断执行当前半导体制程步骤的晶圆是否出现失控行为，若是，则自动获取与当前半导体制程步骤对应的当前失控行为识别编码；
    检测模块，用于根据与当前失控行为识别编码对应的当前识别内容对所述晶圆进行检测。
  12. 根据权利要求11所述的半导体制程中失控行为的处理装置，其中，所述存储模块用于针对每一半导体制程步骤中需要采用相同标准作业程序处理的工艺条目建立一个失控行为识别编码。
  13. 根据权利要求12所述的半导体制程中失控行为的处理装置，其中，所述失控行为识别编码包括第一部分和第二部分，所述第一部分为半导体制程步骤名称，所述第二部分为需要采用相同标准作业程序处理的工艺条目的名称。
  14. 根据权利要求12所述的半导体制程中失控行为的处理装置，其中，所述存储模块用于根据所述失控行为识别编码对应的标准作业程序建立失控行为检查列表，所述失控行为检查列表包括顺序排列的多个检查项目、以及与每个所述检查项目对应的多个检查子项目，并建立与每个所述失控行为检查列表中的多个所述检查项目一一对应的多个原因归纳，以及建立与每个所述失控行为检查列表对应的执行动作列表，所述执行动作列表中包括与多个所述原因归纳分别对应的多种执行动作。
  15. 根据权利要求11所述的半导体制程中失控行为的处理装置，其中，所述判断模块用于判断执行完当前半导体制程步骤的晶圆量测结果是否在统计过程控制系统监控的阈值范围内，若否，则确认执行当前半导体制程步骤 的晶圆出现失控行为。
  16. 根据权利要求15所述的半导体制程中失控行为的处理装置，其中，所述判断模块还用于确认执行当前半导体制程步骤的晶圆出现失控行为之后，显示所述晶圆的相关信息，所述相关信息包括确认出现失控行为的时间、制程站点、量测站点、与当前半导体制程步骤对应的当前失控行为识别编码、所述晶圆的统计过程控制信息中的一种或者两种以上的组合。
  17. 根据权利要求14所述的半导体制程中失控行为的处理装置，其中，所述检测模块用于顺序执行所述失控行为检查列表中的失控行为检查项目，获得导致所述晶圆出现失控行为的目标检查项目，以及查找与所述目标检查项目对应的目标原因归纳，并执行与所述目标原因归纳对应的执行动作。
  18. 根据权利要求1所述的半导体制程中失控行为的处理装置，还包括：处理模块，用于根据对所述晶圆的检测结果控制生产执行系统对所述晶圆执行相应的动作。
  19. 根据权利要求17所述的半导体制程中失控行为的处理装置，其中，所述存储模块还用于在所述检测模块执行与所述目标原因归纳对应的执行动作之后，存储当前半导体制程步骤、当前失控行为识别编码、所述目标检查项目、所述目标原因归纳和所述执行动作。
  20. 根据权利要求11所述的半导体制程中失控行为的处理装置，还包括：
    统计模块，用于统计晶圆所述半导体制程步骤中出现失控行为的历史数据，所述历史数据包括各种失控行为检查项目导致所述晶圆在所述半导体制程步骤中出现失控行为的概率。
PCT/CN2021/103577 2021-03-04 2021-06-30 半导体制程中失控行为的处理方法及处理装置 WO2022183643A1 (zh)

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