WO2022179155A1 - 一种射频传导测试方法及相关装置 - Google Patents

一种射频传导测试方法及相关装置 Download PDF

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Publication number
WO2022179155A1
WO2022179155A1 PCT/CN2021/127365 CN2021127365W WO2022179155A1 WO 2022179155 A1 WO2022179155 A1 WO 2022179155A1 CN 2021127365 W CN2021127365 W CN 2021127365W WO 2022179155 A1 WO2022179155 A1 WO 2022179155A1
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WIPO (PCT)
Prior art keywords
radio frequency
pad
test
end circuit
circuit
Prior art date
Application number
PCT/CN2021/127365
Other languages
English (en)
French (fr)
Inventor
翟巍
江成
Original Assignee
荣耀终端有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 荣耀终端有限公司 filed Critical 荣耀终端有限公司
Priority to US18/012,158 priority Critical patent/US20240036109A1/en
Priority to EP21927579.9A priority patent/EP4163648A4/en
Publication of WO2022179155A1 publication Critical patent/WO2022179155A1/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/309—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of printed or hybrid circuits or circuit substrates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2822—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere of microwave or radiofrequency circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416—Connectors, terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2815—Functional tests, e.g. boundary scans, using the normal I/O contacts
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B17/00—Monitoring; Testing
    • H04B17/0082—Monitoring; Testing using service channels; using auxiliary channels
    • H04B17/0085—Monitoring; Testing using service channels; using auxiliary channels using test signal generators
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B17/00—Monitoring; Testing
    • H04B17/10—Monitoring; Testing of transmitters
    • H04B17/101—Monitoring; Testing of transmitters for measurement of specific parameters of the transmitter or components thereof
    • H04B17/103—Reflected power, e.g. return loss
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B17/00—Monitoring; Testing
    • H04B17/20—Monitoring; Testing of receivers
    • H04B17/27—Monitoring; Testing of receivers for locating or positioning the transmitter

Definitions

  • the present application relates to a radio frequency conduction test technology, and in particular, to a radio frequency conduction test method and a related device.
  • the production process of wireless terminal products is not simple, and various tests need to be carried out on wireless terminal products to ensure that these wireless terminal products are in good condition.
  • the production process of mobile phones includes Surface Mount Technology (SMT) , Single-board functional test (Functional Test, FT), assembly, pre-processing (Assembly), whole machine test (Man-Machine Interface, MMI), etc.
  • SMT Surface Mount Technology
  • FT Single-board functional test
  • Assembly pre-processing
  • MMI Man-Machine Interface
  • RF test pins and RF switch test sockets are usually used to conduct RF conduction tests, but the RF switch test sockets generally have no other function after the test is completed.
  • the layout area of the single board is increased, and the device cost of the product is increased.
  • the embodiment of the present invention discloses a radio frequency conduction test method and a related device, which can use the existing device pads on a single board to carry out radio frequency conduction test, and then repair the series device to be welded on the device after the test is completed. It is no longer necessary to use the RF switch test socket, which saves the layout area of the single board and reduces the cost of the device.
  • the present application provides a radio frequency conduction test method, the method includes: moving a radio frequency test needle to a first pad of a single board, so that a test signal on the first pad is transmitted to the radio frequency
  • the test needle is used for testing;
  • the single board includes a radio frequency front-end circuit, a radio frequency back-end circuit, the first pad, the second pad and the series device to be welded;
  • the series device to be welded is to be welded on the The devices on the first pad and the second pad;
  • the first pad is connected to the RF front-end circuit
  • the second pad is connected to the RF back-end circuit, and the RF front-end circuit is connected to the RF front-end circuit.
  • the radio frequency back-end circuit is in a disconnected state; after the test is completed, the radio frequency test pin is removed, and the series device is repaired and welded to the first pad and the second pad, so that the The radio frequency front-end circuit is in a connected state with the radio frequency back-end circuit.
  • a certain series device in the RF circuit is not soldered before the RF conduction test, and the test signal on the first pad of the series device is transmitted to the RF during the RF conduction test.
  • the test pin (the test signal is not transmitted to the second pad of the series device), and then transmitted to the RF test instrument for testing.
  • the series device is re-soldered to the first pad and the second pad. on the pad. Since the series device and the first pad and the second pad are themselves components and pads required by the radio frequency circuit to complete the radio frequency function, there is no need to add a new device for conducting the radio frequency conduction test in this embodiment of the present application.
  • Devices, such as test points or pads or zero-ohm patches dedicated for testing reduce device cost and eliminate the need to consider the layout of test points or pads or zero-ohm patches used for testing, also saving The layout area of the board.
  • the test signal in the radio frequency test needle is transmitted to the RF test equipment.
  • an impedance transformation device can be added to realize the transformation of the contact impedance between the radio frequency conduction test needle and the first pad into a characteristic impedance, thereby improving the accuracy of the radio frequency conduction test.
  • the test signal in the radio frequency test needle passes through the impedance transformation device and the orientation The coupler transmits to the RF test instrument.
  • a directional coupler device can be added on the basis of adding an impedance transformation device, so as to realize reflected power monitoring and transmission power compensation, and improve the accuracy of the radio frequency conduction test.
  • the straight-through output port of the directional coupler is connected to the first measurement port of the radio frequency test instrument, and the coupling output port of the directional coupler is connected to the first measurement port of the radio frequency test instrument.
  • the second measurement port of the radio frequency test instrument is connected.
  • the test signals are output from the straight-through output port, a small part of the test signal is output from the coupling output port, and the isolated port basically has no signal output.
  • the output power of the impedance path can be measured through the straight-through output port, while the The coupling output port can measure the reflected power, etc., so as to realize the compensation of the transmission power and improve the accuracy of the RF conduction test.
  • the radio frequency test pins and/or the first pads are processed by nickel-gold plating.
  • the RF test needle and/or the first pad can be plated with nickel and gold, so that during the RF conduction test, the RF test needle can well contact the first pad, thereby improving the test performance. precision.
  • the method further includes: the first part of the radio frequency test needle contact with the second part of the first pad; wherein, the first part and/or the second part is processed by nickel-gold plating.
  • the contact part between the RF test needle and the first pad during the RF conduction test is nickel-plated with gold, so that the test signal can be better transmitted from the RF test needle to the first pad, thereby Improve test accuracy.
  • the repairing soldering the series device to the first pad and the second pad includes: using low temperature reflow soldering or Laser welding, repair welding the series device to the first pad and the second pad.
  • welding methods such as low-temperature reflow soldering or laser welding are used to repair the series devices to the single board to obtain the single board after the radio frequency conduction test is completed.
  • the layout area of the board is used to repair the series devices to the single board to obtain the single board after the radio frequency conduction test is completed.
  • the center distance between the first pad and the second pad is not less than 0.254 mm and not more than 2.54 mm.
  • the center distance between the first pad and the second pad is reasonably set, which can prevent the RF test needle from accidentally touching the second pad during the RF conduction test.
  • the present application provides a radio frequency conduction test system, the system includes: a single board, a radio frequency test needle, and a radio frequency test instrument; the single board includes a radio frequency circuit, a first pad and a second pad; the The radio frequency circuit includes a radio frequency front-end circuit and a radio frequency back-end circuit, the first pad is connected to the radio frequency front-end circuit, the second pad is connected to the radio frequency back-end circuit, and the radio frequency front-end circuit is connected to the radio frequency The back-end circuit is in a disconnected state; the first pad and the second pad are pads of a series device to be soldered in the radio frequency circuit; the radio frequency test pin is used to connect the first pad to the The test signal is transmitted to the radio frequency test instrument; the radio frequency test instrument is used to test the test signal.
  • the system further includes an impedance transformation device connected to the radio frequency test needle and the radio frequency test instrument, and the impedance transformation device is used to convert the The test signal on the radio frequency test pin is transmitted to the radio frequency test instrument.
  • the system further includes an impedance transformation device and a directional coupler, the impedance transformation device is connected to the radio frequency test needle and the directional coupler, The directional coupler is also connected to the radio frequency test instrument, and the impedance transformation device is used for transmitting the test signal on the radio frequency test pin to the directional coupler, and the directional coupler is used for converting the test signal to the directional coupler. A test signal is transmitted to the radio frequency test instrument.
  • the straight-through output port of the directional coupler is connected to the first measurement port of the radio frequency test instrument, and the coupling output port of the directional coupler is connected to the first measurement port of the radio frequency test instrument.
  • the second measurement port of the radio frequency test instrument is connected.
  • the RF test pins and/or the first pads are processed by nickel-gold plating.
  • the center distance between the first pad and the second pad is not less than 0.254 mm and not more than 2.54 mm.
  • the present application provides a radio frequency conduction test device, the device is applied to radio frequency conduction test, the device includes a radio frequency circuit, a first pad and a second pad; the radio frequency circuit includes a radio frequency front-end circuit and a radio frequency a back-end circuit, the first pad is connected to the radio frequency front-end circuit, the second pad is connected to the radio-frequency back-end circuit, and the radio-frequency front-end circuit and the radio frequency back-end circuit are in a disconnected state; The first pad and the second pad are pads of series devices to be soldered in the radio frequency circuit.
  • the first pad is processed by nickel-gold plating.
  • the center distance between the first pad and the second pad is not less than 0.254 mm and not more than 2.54 mm.
  • radio frequency conduction test system provided in the second aspect and the radio frequency conduction test device provided in the third aspect are both used for performing the radio frequency conduction test method provided in the first aspect. Therefore, for the beneficial effects that can be achieved, reference may be made to the beneficial effects in the radio frequency conduction test method provided in the first aspect, which will not be repeated here.
  • FIG. 1 is a schematic structural diagram of a radio frequency conduction test system provided by an embodiment of the application.
  • FIG. 2 is a schematic diagram of the principle of a radio frequency conduction test system provided by an embodiment of the present application
  • FIG. 3 is a schematic diagram of the principle of another radio frequency conduction test system provided by an embodiment of the present application.
  • FIG. 4 is a schematic structural diagram of another radio frequency conduction test system provided by an embodiment of the present application.
  • FIG. 5 is a schematic diagram of the principle of another radio frequency conduction test system provided by an embodiment of the present application.
  • FIG. 6 is a schematic structural diagram of another radio frequency conduction test system provided by an embodiment of the present application.
  • FIG. 7 is a schematic structural diagram of a single board after completing a radio frequency conduction test according to an embodiment of the present application.
  • FIG. 8 is a schematic structural diagram of another single board after completing the RF conduction test provided by the embodiment of the present application.
  • FIG. 9 is a schematic diagram of different terminals provided by an embodiment of the present application.
  • FIG. 10 is a schematic structural diagram of a terminal according to an embodiment of the present application.
  • FIG. 11 is a schematic flowchart of a radio frequency conduction test method provided by an embodiment of the present application.
  • Characteristic impedance also known as “characteristic impedance” is not a DC resistance, but belongs to the concept of long-term transmission. In the high frequency range, during the signal transmission process, where the signal edge arrives, an instantaneous current will be generated between the signal line and the reference plane (power or ground plane) due to the establishment of the electric field. If the transmission line is isotropic, then as long as When the signal is transmitted, there is always a current I, and if the output level of the signal is V, in the process of signal transmission, the transmission line will be equivalent to a resistance, the size is V/I, this equivalent resistance is called The characteristic impedance Z of the transmission line.
  • the characteristic impedance of the transmission path changes, the signal will be reflected at the node with discontinuous impedance.
  • Reflow soldering technology is a soldering technology used in the manufacturing field. Components on the boards of many electronic devices can be soldered to circuit boards through this process. There are two types of reflow soldering process: low temperature solder paste and high temperature solder paste. Literally, “high temperature” and “low temperature” refer to the difference between the melting points of these two types of solder paste. Generally speaking, the conventional melting point of reflow soldering is above 217°C; while the melting point of conventional low temperature solder paste is 138°C.
  • High temperature solder paste is suitable for high temperature soldering components and PCBs; while low temperature solder paste is suitable for those components or PCBs that cannot withstand high temperature soldering, such as heat sink module soldering, LED soldering, high frequency soldering, etc.
  • Low temperature reflow soldering technology uses low temperature solder paste, while high temperature reflow soldering technology uses high temperature solder paste.
  • a microstrip line is a microwave transmission line consisting of a single conductor strip supported on a dielectric substrate. Planar structure transmission line suitable for making microwave integrated circuits. Compared with metal waveguides, it is small in size, light in weight, wide in use frequency, high in reliability and low in manufacturing cost; however, the loss is slightly larger and the power capacity is small.
  • a directional coupler is a general microwave/millimeter wave component that can be used for signal isolation, separation and mixing, such as power monitoring, source output power levelling, signal source isolation, and frequency sweep testing for transmission and reflection.
  • the main technical indicators are directivity, standing wave ratio, coupling, and insertion loss.
  • the wireless terminal products include but are not limited to terminals such as mobile phones, tablet computers, speakers, and smart watches.
  • FIG. 1 is a schematic structural diagram of a radio frequency conduction test system provided by an embodiment of the present application, and the radio frequency conduction test system 100 shown in FIG. 1 includes a single board 101.
  • RF test pins 102, RF cables 103, and RF test instruments 104 wherein the single board 101 includes a panel 1011, a RF front-end circuit 1012, a signal transmission line 1013, a RF switch test seat 1014, and a RF back-end circuit 1015.
  • the RF front-end circuit 1012, the signal transmission line 1013, the RF switch test seat 1014 and the RF back-end circuit 1015 are all welded on the panel 1011.
  • the RF front-end circuit 1012 is connected with the RF switch test seat 1014 through the signal transmission line 1013, and the RF switch test seat 1014 is connected with
  • the radio frequency back-end circuit 1015 is also connected through the signal transmission line 1013 .
  • the radio frequency test needle 102 is connected to the radio frequency test instrument 104 through the radio frequency cable 103 .
  • the panel 1011 is a circuit board without any circuit components and chips welded
  • the single board 101 can be a circuit board with components and/or chips welded
  • the circuit board includes but is not limited to ceramic circuits board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, printed circuit board (PCB), aluminum substrate, high frequency board, thick copper board, impedance board, ultra-thin circuit board, ultra-thin Circuit boards, printed (copper etching technology) circuit boards, etc.
  • the signal transmission lines 1013 include but are not limited to microstrip lines.
  • the single board 101 may also include other components and signal transmission lines, the signal transmission lines include but not limited to microstrip.
  • the radio frequency front-end circuit 1012 refers to a part of the circuit between the antenna and the intermediate frequency (or baseband) circuit. In this circuit, signals are transmitted in the form of radio frequency.
  • the radio frequency front end usually includes: : amplifiers, filters, frequency converters and some radio frequency connection and matching circuits; the radio frequency back-end circuit 1015 includes but is not limited to antenna matching circuits.
  • the radio frequency switch test seat 1014 includes two connection springs—a first connection spring 10141 and a second connection
  • the elastic piece 10142, the first connecting elastic piece 10141 is connected to the RF front-end circuit 1012 through the signal transmission line 1013, and the second connecting elastic piece 1042 is connected to the RF back-end circuit 1015 through the signal transmission line 1013.
  • the test signal can be transmitted from the RF front-end circuit to the first connection spring 10141, and then through the second connection spring 10142 to the RF back-end circuit 1015, so as to ensure that the circuit on the single board 101 can be normal work.
  • FIG. 3 which is a schematic diagram of the principle of another radio frequency conduction test system provided by the embodiment of the present application
  • the radio frequency test needle 102 is pressed down to contact the connecting spring 1041 , and the connecting spring 1041 and the connecting spring 1041 are pressed down.
  • the connecting spring 1042 is separated.
  • the first connecting spring 10141 and the second connecting spring 10142 are not in contact, and the test signal cannot be transmitted from the RF front-end circuit 1011 through the first connecting spring 10141 to the second connecting spring 10142, but from the RF front-end circuit.
  • 1012 is transmitted to the RF test pin 102 through the first connecting spring 10141, as shown in FIG.
  • the RF switch test socket 1014 returns to the state shown in FIG. 2 .
  • the main function of the RF switch test socket is to perform RF conduction test during the single board production and processing stage. After the RF conduction test is completed, the RF switch test socket basically has no other uses.
  • the number of RF switch test sockets on a single board is relatively large For a long time, it not only occupies the layout area of the single board, but also increases the device cost of the product.
  • the embodiments of the present application provide a radio frequency conduction test method and related apparatus, which can use device pads to perform radio frequency conduction test without adding a radio frequency switch test seat, which saves the layout area of a single board, and also reduces the device cost.
  • An embodiment of the present application provides a radio frequency conduction test system, the system includes: a single board, a radio frequency test needle, and a radio frequency test instrument; the single board includes a radio frequency circuit, a first pad and a second pad; the radio frequency The circuit includes a radio frequency front-end circuit and a radio frequency back-end circuit, the first pad is connected to the radio frequency front-end circuit, the second pad is connected to the radio frequency back-end circuit, and the radio frequency front-end circuit is connected to the radio frequency back-end circuit.
  • the terminal circuit is in a disconnected state; the first pad and the second pad are the pads of the series device to be soldered in the radio frequency circuit; the radio frequency test pin is used to The test signal is transmitted to the radio frequency test instrument; the radio frequency test instrument is used to test the test signal.
  • FIG. 4 is a schematic structural diagram of another radio frequency conduction test system provided by an embodiment of the present application.
  • the radio frequency conduction test system 400 shown in FIG. 4 includes a single board 401, a radio frequency test pin 402, a radio frequency The cable 403 and the radio frequency test instrument 404, wherein the single board 401 includes a panel 4011, a radio frequency front-end circuit 4012, a signal transmission line 4013, a device pad 4014, a radio frequency back-end circuit 4015 and a series device 4016 to be welded.
  • the radio frequency test instrument 404 has two measurement ports—a first measurement port 4041 and a second measurement port 4042, both of which can be used for radio frequency conduction measurement.
  • the radio frequency test instrument 404 also has a display screen 4043 that displays The screen 4043 can display various parameters detected in the RF conduction test, such as power, voltage, impedance, etc. It can be understood that the radio frequency test instrument 404 may also include other components (eg, other buttons and interfaces), which are not described in detail here.
  • the single board 401 may also include other circuit modules, and these circuit modules may It includes one or more components and signal transmission lines, including but not limited to microstrip lines.
  • the RF front-end circuit 4012 refers to a part of the circuit between the antenna and the intermediate frequency (or baseband) circuit. In this section of the circuit, signals are transmitted in the form of RF.
  • the RF front-end usually includes: : amplifiers, filters, frequency converters and some radio frequency connection and matching circuits; the radio frequency back-end circuit 4015 includes but is not limited to antenna matching circuits. It can be understood that the circuit structures in the RF front-end circuit 4012 and the RF back-end circuit 4015 may have various forms, which are not limited in this application.
  • FIG. 5 is a schematic schematic diagram of another radio frequency conduction test system provided by an embodiment of the present application.
  • the device pad 4014 includes a first pad 40141 and a second pad 40142.
  • the first pad There is no electrical connection between 40141 and the second pad 40142 (for example, the first pad 40141 and the second pad 40142 are not soldered together), so the RF front-end circuit 4012 and the RF back-end circuit 4015 are in a disconnected state .
  • the series device 4016 to be soldered shown in FIG. 4 is a device to be soldered on the first pad 40141 and the second pad 40142 shown in FIG. 5 .
  • the RF test pin 402 is in contact with the first pad 40141, but there is no electrical connection between the first pad 40141 and the second pad 40142, that is, the first pad 40141 and the second pad 40142 is not directly connected, nor is it connected through an intermediate structure or other means.
  • the test signal can be transmitted to the RF test through the RF test pin 402 and the RF cable 403.
  • the radio frequency conduction test is realized.
  • the RF test pin 402 is not electrically connected to the first pad 40141 (for example, the RF test pin 402 leaves the first pad of the device pad 4014) 40141), that is, the RF test pin 402 is not directly connected to the first pad 40141, nor is it connected through an intermediate structure or other means, and the series device 4016 to be soldered is repaired to the first pad 40141 and the second pad 40142 For example, using a process such as low temperature reflow for repair welding, the first pad 40141 and the second pad 40142 are connected through the soldered series device 4016, so that the RF front-end circuit 4012 and the RF back-end circuit 4015 are in a connected state.
  • the RF test pin 402 and/or the first pad 40141 may be plated with nickel and gold, and optionally, it may also be The RF test pins 402 and/or the first pads 40141 are plated with other materials, such as gold, nickel, and the like.
  • the center distance between the first pad 40141 and the second pad 40142 is not less than 0.254 mm (10 mils) and not more than 2.54 mm (100 mils). In other embodiments of the application, the center distance between the first pad and the second pad may also be other values, which are not limited in this application. In addition, the sizes and types of the first pad and the second pad may have various forms, which are not limited in this application.
  • an impedance transformation device and a directional coupler can also be added to improve the accuracy of the radio frequency conduction test, as shown in FIG. 6 , which is another radio frequency conduction test system provided by the embodiment of the application.
  • Schematic diagram of the structure of the RF conduction test system 600 includes a single board 401 , a RF test pin 402 , a RF cable 403 , an impedance transformation device 601 , a directional coupler 602 and a RF test instrument 404 .
  • the RF front-end circuit 4012 is connected to the device pad 4014 through the signal transmission line 4013, and the device pad 4014 is connected to the RF back-end
  • the circuit 4015 is also connected by the signal transmission line 4013 .
  • the RF test pin 402 is connected to the impedance transformation device 601 through the RF cable 403
  • the impedance transformation device 601 is connected to the directional coupler 602 through the RF cable 403
  • the directional coupler 602 is then connected through the RF cable 403 .
  • Connected to the RF test instrument 404 Connected to the RF test instrument 404 .
  • the impedance transformation device 601 includes an impedance transformation circuit, and the impedance transformation circuit can convert the impedance between the RF test needle 402 and the first pad 40141 into a characteristic impedance.
  • the characteristic impedance is 50 ohms. It can be understood that the specific circuit in the impedance transformation device 601 can be changed according to actual needs, for example, the characteristic impedance transformation can be realized by changing the circuit structure in the impedance transformation device 601 .
  • the directional coupler 602 can be used to monitor the reflected power and compensate the transmission power, which is due to the fact that in a general RF conduction test process (for example, using the RF conduction test system 400 shown in FIG. 4 ) When conducting RF conduction test), some transmission power (for example, reflected power, etc.) cannot be measured, resulting in low accuracy of the results obtained when using RF measuring instruments for analysis.
  • the directional coupler 602 can solve this problem to a certain extent. question.
  • the directional coupler 602 has four ports—an input port 6021, an isolation port 6022, a coupling output port 6023, and a pass-through output port 6024.
  • the coupling-out port 6023 is connected to the second measurement port 4042 of the radio frequency test instrument 404, and the pass-through output
  • the port 6024 is connected to the first measurement port 4041 of the radio frequency test instrument 404, the test signal is input from the input port 6021 of the directional coupler 602, most of the test signals are output from the straight-through output port 6024, and a small part of the test signal is output from the coupling output port 6023,
  • the isolation port 6022 basically has no signal output (ideally, the isolation port of the directional coupler has no output, which can achieve ideal isolation; in practice, the isolation port will leak), the output power of the impedance path can be measured through the straight-through output port 6024 , and the reflected power can be measured through the coupling output port 6023, so as to realize the compensation of transmission power.
  • the RF conduction test system 600 shown in FIG. 6 improves the RF conduction test. accuracy.
  • the directional coupler 602 can be a different type of directional coupler (such as a standard directional coupler, a dual directional coupler, etc.), for example, the directional coupler 602 can be a different type of directional coupler capable of measuring reflected power
  • the directional coupler is not limited in this application.
  • the radio frequency test system may not include the impedance transformation device and the directional coupler (as shown in FIG. 4 ), or may include at least one of the impedance transformation device and the directional coupler (as shown in FIG. 6 ), and may also include Other devices or devices (for example, other devices or devices that can improve the accuracy of the radio frequency conduction test) are not limited in this application.
  • the embodiment of the present application also provides a single board applied to a radio frequency conduction test, the single board includes a radio frequency circuit, a first pad and a second pad; the radio frequency circuit includes a radio frequency front-end circuit and a radio frequency back-end circuit, The first pad is connected to the radio frequency front-end circuit, the second pad is connected to the radio frequency back-end circuit, and the radio frequency front-end circuit and the radio frequency back-end circuit are in a disconnected state; the first The pad and the second pad are pads of the series device to be soldered in the radio frequency circuit; the test signal on the first pad is used for the radio frequency test needle to perform the radio frequency conduction test.
  • the radio frequency circuit, the first pad, the second pad and the series device may refer to the relevant descriptions of FIG. 4 , FIG. 5 and FIG. 6 ;
  • the single board may be 5 and 6 include a panel 4011, an RF front-end circuit 4012, a signal transmission line 4013, a device pad 4014 (including a first pad 40141 and a second pad 40142), a RF back-end circuit 4015, and a series connection to be soldered
  • the single board of the device 4016 can also be another single board having the above-mentioned structure and connection relationship, and can be applied to the radio frequency conduction test.
  • the first pad in the single board may be plated with nickel and gold, and optionally, the first pad may be plated with other materials, such as gold, nickel, and the like.
  • the center distance between the first pad and the second pad is not less than 0.254 mm (10 mils) and not greater than 2.54 mm (100 mils). In other embodiments, the center distance between the first pad and the second pad may also be other values, which are not limited in this application. In addition, the sizes and types of the first pad and the second pad may have various forms, which are not limited in this application.
  • the embodiment of the present application also provides a single board after the radio frequency conduction test is completed, the single board includes a radio frequency circuit, a first pad, a second pad and a series device; the radio frequency circuit includes a radio frequency front-end circuit and a radio frequency back-end circuit. terminal circuit, the first pad is connected to the radio frequency front-end circuit, the second pad is connected to the radio frequency back-end circuit, and the series device is welded to the first pad in the radio frequency circuit and the device on the second pad.
  • FIG. 7 is a schematic structural diagram of a single board after a radio frequency conduction test provided by an embodiment of the present application.
  • the single board 700 shown in FIG. 7 includes a panel 701 , a radio frequency front-end circuit 702 , Signal transmission line 703 , series device 704 , device pad 705 , and radio frequency back-end circuit 706 .
  • the RF front-end circuit 702 , the signal transmission line 703 , the device pad 705 and the RF back-end circuit 706 are all welded on the panel 701 , the series device 704 is welded on the device pad 705 , and the RF front-end circuit 702 and the device pad 705 pass through The signal transmission line 703 is connected, and the device pad 705 and the radio frequency back-end circuit 706 are also connected through the signal transmission line 703 .
  • the panel 701 is a circuit board without any circuit components and chips welded
  • the single board 700 can be a circuit board with components and/or chips welded
  • the circuit board includes but is not limited to ceramic circuits board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, printed circuit board (PCB), aluminum substrate, high frequency board, thick copper board, impedance board, ultra-thin circuit board, ultra-thin Circuit boards, printed (copper etching technology) circuit boards, etc.
  • the signal transmission lines 703 include but are not limited to microstrip lines.
  • the single board 700 may also include other circuit modules, and these circuit modules may include one or Multiple components and signal transmission lines.
  • the RF front-end circuit 702 refers to a part of the circuit between the antenna and the intermediate frequency (or baseband) circuit. In this circuit, signals are transmitted in the form of RF.
  • the RF front-end usually includes: : amplifiers, filters, frequency converters and some radio frequency connection and matching circuits; the radio frequency back-end circuit 706 includes but is not limited to antenna matching circuits. It can be understood that the circuit structures in the radio frequency front-end circuit 702 and the radio frequency back-end circuit 706 may have various forms, which are not limited in this application.
  • the device pad 705 is used to connect the panel 701 and the series device 704.
  • the series device 704 is one or more components connected in series with other components.
  • the series device includes but is not limited to resistors, capacitors and inductors and other devices
  • the radio frequency circuit refers to a section of circuit in which the signal on the single board 700 is transmitted in the form of radio frequency.
  • the radio frequency circuit includes but is not limited to the radio frequency front-end circuit 702 and the radio frequency back-end circuit 706.
  • FIG. 8 is a schematic structural diagram of another single board after the radio frequency conduction test provided by an embodiment of the present application.
  • the device pad 705 includes a first pad 7051 and a second pad 7052 , the first pad 7051 is connected to the RF front-end circuit 702 through the signal transmission line 703, the second pad 7052 is connected to the RF back-end circuit 706 through the signal transmission line 703, and the series device 704 is welded to the first pad 7051 and the second pad 7052 superior.
  • the signal on the single board 700 is transmitted from the RF front-end circuit 702 to the first pad 7051 through the signal transmission line 703 , then reaches the second pad 7052 through the series device 704 , and then is transmitted to the RF through the signal transmission line 703 Backend circuit 706 .
  • first pad 7051 in the single board 700 after the RF conduction test can be plated with nickel and gold.
  • the first pad 7051 can also be plated with other materials, such as gold and nickel.
  • the center distance between the first pad 7051 and the second pad 7052 is not less than 0.254 mm (10 mils) and not more than 2.54 mm (100 mils). In other embodiments of the application, the center distance between the first pad and the second pad may also be other values, which are not limited in this application. In addition, the sizes and types of the first pad and the second pad may have various forms, which are not limited in this application.
  • the single board after the radio frequency conduction test may not include the radio frequency test switch seat, and in other embodiments of the present application, the single board after the radio frequency conduction test is completed also It can be any other single board with the above structure and connection relationship and after completing the radio frequency conduction test, which is not limited in this application.
  • the application further provides a terminal, where the terminal includes the single board after the radio frequency conduction test, as shown in FIG. 9 , which is a schematic diagram of different terminals provided in an embodiment of the application, and the terminal may include all The single-board mobile phone, PC, tablet computer, smart watch, smart speaker and other equipment after the above RF conduction test.
  • FIG. 10 is a schematic structural diagram of a terminal provided by the present application, and the terminal includes the single board after the radio frequency conduction test.
  • the terminal 1000 shown in FIG. 10 will be specifically described below:
  • the terminal 1000 may include: a processor 1010, an external memory interface 1020, an internal memory 1021, a universal serial bus (USB) interface 1030, a charging management module 1040, a power management module 1041, a battery 1042, an antenna 1, and an antenna 2 , mobile communication module 1050, wireless communication module 1060, audio module 1070, speaker 1070A, receiver 1070B, microphone 1070C, headphone jack 1070D, sensor module 1080, buttons 1090, motor 1091, indicator 1092, camera 1093, display screen 1094 and user Identity module (subscriber identification module, SIM) card interface 1095 and so on.
  • SIM subscriber identification module
  • the sensor module 1080 may include a pressure sensor 1080A, a gyroscope sensor 1080B, an air pressure sensor 1080C, a magnetic sensor 1080D, an acceleration sensor 1080E, a distance sensor 1080F, a proximity light sensor 1080G, a fingerprint sensor 1080H, a temperature sensor 1080J, a touch sensor 1080K, and ambient light.
  • the structures illustrated in the embodiments of the present application do not constitute a specific limitation on the terminal 1000 .
  • the terminal 1000 may include more or less components than shown, or some components may be combined, or some components may be separated, or different components may be arranged.
  • the illustrated components may be implemented in hardware, software, or a combination of software and hardware.
  • the processor 1010 may include one or more processing units, for example, the processor 1010 may include an application processor (Application Processor, AP), a modem processor, a graphics processor (Graphics Processing unit, GPU), an image signal processor (Image Signal Processor, ISP), controller, memory, video codec, Digital Signal Processor (DSP), baseband processor, and/or Neural-network Processing Unit (NPU) Wait. Wherein, different processing units may be independent devices, or may be integrated in one or more processors.
  • an application processor Application Processor, AP
  • modem processor e.g., GPU
  • ISP image signal processor
  • DSP Digital Signal Processor
  • NPU Neural-network Processing Unit
  • the controller may be the nerve center and command center of the terminal 1000 .
  • the controller can generate an operation control signal according to the instruction operation code and timing signal, and complete the control of fetching and executing instructions.
  • a memory may also be provided in the processor 1010 for storing instructions and data.
  • the memory in processor 1010 is cache memory. This memory may hold instructions or data that have just been used or recycled by the processor 1010 . If the processor 1010 needs to use the instruction or data again, it can be called directly from the memory. Repeated accesses are avoided, and the waiting time of the processor 1010 is reduced, thereby increasing the efficiency of the system.
  • the processor 1010 may include one or more interfaces.
  • the interface may include an integrated circuit (Inter-Integrated Circuit, I2C) interface, an integrated circuit built-in audio (Inter-Integrated Circuit Sound, I2S) interface, a pulse code modulation (Pulse Code Modulation, PCM) interface, Universal Asynchronous Transmitter (Universal Asynchronous Transmitter) Receiver/Transmitter, UART) interface, Mobile Industry Processor Interface (MIPI), General-Purpose Input/output (GPIO) interface, Subscriber Identity Module (SIM) interface, and / or Universal Serial Bus (Universal Serial Bus, USB) interface, etc.
  • I2C Inter-Integrated Circuit
  • I2S integrated circuit built-in audio
  • PCM pulse code modulation
  • PCM Pulse Code Modulation
  • Universal Asynchronous Transmitter Universal Asynchronous Transmitter
  • GPIO General-Purpose Input/output
  • SIM Subscriber Identity Module
  • USB Universal Serial Bus
  • the I2C interface is a bidirectional synchronous serial bus that includes a serial data line (Serial Data Line, SDA) and a serial clock line (Derail Clock Line, SCL).
  • the processor 1010 may contain multiple sets of I2C buses.
  • the processor 1010 can be respectively coupled to the touch sensor 1080K, the charger, the flash, the camera 1093, etc. through different I2C bus interfaces.
  • the processor 1010 can couple the touch sensor 1080K through the I2C interface, so that the processor 1010 communicates with the touch sensor 1080K through the I2C bus interface, so as to realize the touch function of the terminal 1000.
  • the I2S interface can be used for audio communication.
  • the processor 1010 may contain multiple sets of I2S buses.
  • the processor 1010 can be coupled with the audio module 1070 through an I2S bus to implement communication between the processor 1010 and the audio module 1070 .
  • the audio module 1070 can transmit audio signals to the wireless communication module 1060 through the I2S interface, so as to realize the function of answering calls through a Bluetooth headset.
  • the PCM interface can also be used for audio communications, sampling, quantizing and encoding analog signals.
  • the audio module 1070 and the wireless communication module 1060 may be coupled through a PCM bus interface.
  • the audio module 1070 can also transmit audio signals to the wireless communication module 1060 through the PCM interface, so as to realize the function of answering calls through the Bluetooth headset. Both the I2S interface and the PCM interface can be used for audio communication.
  • the UART interface is a universal serial data bus used for asynchronous communication.
  • the bus may be a bidirectional communication bus. It converts the data to be transmitted between serial communication and parallel communication.
  • a UART interface is typically used to connect the processor 1010 with the wireless communication module 1060 .
  • the processor 1010 communicates with the Bluetooth module in the wireless communication module 1060 through the UART interface to implement the Bluetooth function.
  • the audio module 1070 can transmit audio signals to the wireless communication module 1060 through the UART interface, so as to realize the function of playing music through the Bluetooth headset.
  • the MIPI interface can be used to connect the processor 1010 with the display screen 1094, the camera 1093 and other peripheral devices.
  • MIPI interfaces include camera serial interface (Camera Serial Interface, CSI), display serial interface (Display Serial Interface, DSI) and so on.
  • the processor 1010 communicates with the camera 1093 through the CSI interface, so as to realize the shooting function of the terminal 1000 .
  • the processor 1010 communicates with the display screen 1094 through the DSI interface to implement the display function of the terminal 1000 .
  • the GPIO interface can be configured by software.
  • the GPIO interface can be configured as a control signal or as a data signal.
  • the GPIO interface can be used to connect the processor 1010 with the camera 1093, the display screen 1094, the wireless communication module 1060, the audio module 1070, the sensor module 1080, and the like.
  • the GPIO interface can also be configured as I2C interface, I2S interface, UART interface, MIPI interface, etc.
  • the SIM interface can be used to communicate with the SIM card interface 1095 to realize the function of transferring data to the SIM card or reading data in the SIM card.
  • the USB interface 1030 is an interface that conforms to the USB standard specification, and can specifically be a Mini USB interface, a Micro USB interface, a USB Type C interface, and the like.
  • the USB interface 1030 can be used to connect a charger to charge the terminal 1000, and can also be used to transmit data between the terminal 1000 and peripheral devices. It can also be used to connect headphones to play audio through the headphones.
  • the interface can also be used to connect other electronic devices, such as AR devices.
  • the interface connection relationship between the modules illustrated in the embodiments of the present application is only a schematic illustration, and does not constitute a structural limitation of the terminal 1000 .
  • the terminal 1000 may also adopt different interface connection manners in the foregoing embodiments, or a combination of multiple interface connection manners.
  • the charging management module 1040 is used to receive charging input from the charger.
  • the charger may be a wireless charger or a wired charger.
  • the power management module 1041 is used to connect the battery 1042 , the charging management module 1040 and the processor 1010 .
  • the power management module 1041 receives input from the battery 1042 and/or the charging management module 1040, and supplies power to the processor 1010, the internal memory 1021, the external memory, the display screen 1094, the camera 1093, and the wireless communication module 1060.
  • the wireless communication function of the terminal 1000 may be implemented by the antenna 1, the antenna 2, the mobile communication module 1050, the wireless communication module 1060, the modulation and demodulation processor, the baseband processor, and the like.
  • Antenna 1 and Antenna 2 are used to transmit and receive electromagnetic wave signals.
  • Each antenna in terminal 1000 may be used to cover a single or multiple communication frequency bands. Different antennas can also be reused to improve antenna utilization.
  • the antenna 1 can be multiplexed as a diversity antenna of the wireless local area network. In other embodiments, the antenna may be used in conjunction with a tuning switch.
  • the mobile communication module 1050 may provide a wireless communication solution including 2G/3G/4G/5G, etc. applied on the terminal 1000 .
  • the mobile communication module 1050 may include at least one filter, switch, power amplifier, low noise amplifier (LNA), and the like.
  • the mobile communication module 1050 can receive electromagnetic waves from the antenna 1, filter and amplify the received electromagnetic waves, and transmit them to the modulation and demodulation processor for demodulation.
  • the mobile communication module 1050 can also amplify the signal modulated by the modulation and demodulation processor, and then convert it into electromagnetic waves for radiation through the antenna 1 .
  • at least part of the functional modules of the mobile communication module 1050 may be provided in the processor 1010 .
  • at least part of the functional modules of the mobile communication module 1050 may be provided in the same device as at least part of the modules of the processor 1010 .
  • the modem processor may include a modulator and a demodulator.
  • the modulator is used to modulate the low frequency baseband signal to be sent into a medium and high frequency signal.
  • the demodulator is used to demodulate the received electromagnetic wave signal into a low frequency baseband signal.
  • the demodulator then transmits the demodulated low-frequency baseband signal to the baseband processor for processing.
  • the low frequency baseband signal is processed by the baseband processor and passed to the application processor.
  • the application processor outputs sound signals through audio devices (not limited to the speaker 1070A, the receiver 1070B, etc.), or displays images or videos through the display screen 1094 .
  • the modem processor may be a stand-alone device.
  • the modem processor may be independent of the processor 1010, and may be provided in the same device as the mobile communication module 1050 or other functional modules.
  • the wireless communication module 1060 can provide applications on the terminal 1000 including wireless local area networks (Wireless Local Area Networks, WLAN) (such as wireless fidelity (Wireless Fidelity, Wi-Fi) networks), Bluetooth (Bluetooth, BT), global navigation satellite system (Global Navigation Satellite System, GNSS), Frequency Modulation (Frequency Modulation, FM), Near Field Communication (Near Field Communication, NFC), Infrared (Infrared, IR) and other wireless communication solutions.
  • the wireless communication module 1060 may be one or more devices integrating at least one communication processing module.
  • the wireless communication module 1060 receives electromagnetic waves via the antenna 2 , frequency modulates and filters the electromagnetic wave signals, and sends the processed signals to the processor 1010 .
  • the wireless communication module 1060 can also receive the signal to be sent from the processor 1010 , perform frequency modulation on the signal, amplify the signal, and then convert it into electromagnetic waves for radiation through the antenna 2 .
  • the antenna 1 of the terminal 1000 is coupled with the mobile communication module 1050, and the antenna 2 is coupled with the wireless communication module 1060, so that the terminal 1000 can communicate with the network and other devices through wireless communication technology.
  • the wireless communication technology may include Global System for Mobile Communications (GSM), General Packet Radio Service (GPRS), Code Division Multiple Access (CDMA), broadband Code Division Multiple Access (Wideband Code Division Multiple Access, WCDMA), Time Division Code Division Multiple Access (Time-Division Code Division Multiple Access, TD-SCDMA), Long Term Evolution (Long Term Evolution, LTE), BT, GNSS, WLAN, NFC , FM, and/or IR technology, etc.
  • the GNSS may include Global Positioning System (Global Positioning System, GPS), Global Navigation Satellite System (Global Navigation Satellite System, GLONASS), BeiDou Navigation Satellite System (BeiDou Navigation Satellite System, BDS), Quasi-Zenith Satellite System (Quasi - Zenith Satellite System, QZSS) and/or Satellite Based Augmentation Systems (SBAS).
  • Global Positioning System Global Positioning System, GPS
  • Global Navigation Satellite System Global Navigation Satellite System
  • GLONASS Global Navigation Satellite System
  • BeiDou Navigation Satellite System BeiDou Navigation Satellite System
  • BDS BeiDou Navigation Satellite System
  • Quasi-Zenith Satellite System Quasi- Zenith Satellite System
  • QZSS Satellite Based Augmentation Systems
  • the terminal 1000 implements a display function through a GPU, a display screen 1094, an application processor, and the like.
  • the GPU is a microprocessor for image processing, and is connected to the display screen 1094 and the application processor.
  • the GPU is used to perform mathematical and geometric calculations for graphics rendering.
  • Processor 1010 may include one or more GPUs that execute program instructions to generate or alter display information.
  • Display screen 1094 is used to display images, videos, and the like.
  • Display screen 1094 includes a display panel.
  • the display panel can be a Liquid Crystal Display (LCD), an Organic Light-Emitting Diode (OLED), an Active Matrix Organic Light Emitting Diode or an Active Matrix Organic Light Emitting Diode (Active-Matrix Organic Light).
  • Emitting Diode, AMOLED Flexible Light Emitting Diode (Flex Light-Emitting Diode, FLED), Mini LED, Micro LED, Micro-OLED, Quantum Dot Light Emitting Diodes (QLED), etc.
  • the terminal 1000 may include 1 or N display screens 1094, where N is a positive integer greater than 1.
  • the terminal 1000 can realize the shooting function through the ISP, the camera 1093, the video codec, the GPU, the display screen 1094, and the application processor.
  • the ISP is used to process the data fed back by the camera 1093. For example, when taking a photo, the shutter is opened, the light is transmitted to the camera photosensitive element through the lens, the light signal is converted into an electrical signal, and the camera photosensitive element transmits the electrical signal to the ISP for processing, and converts it into an image visible to the naked eye. ISP can also perform algorithm optimization on image noise, brightness, and skin tone. ISP can also optimize the exposure, color temperature and other parameters of the shooting scene. In some embodiments, the ISP may be provided in the camera 1093.
  • Camera 1093 is used to capture still images or video.
  • the object is projected through the lens to generate an optical image onto the photosensitive element.
  • the photosensitive element can be a charge coupled device (Charge Coupled Device, CCD) or a complementary metal-oxide-semiconductor (Complementary Metal-Oxide-Semiconductor, CMOS) phototransistor.
  • CCD Charge Coupled Device
  • CMOS complementary metal-oxide-semiconductor
  • the photosensitive element converts the optical signal into an electrical signal, and then transmits the electrical signal to the ISP to convert it into a digital image signal.
  • the ISP outputs the digital image signal to the DSP for processing.
  • DSP converts digital image signals into standard RGB, YUV and other formats of image signals.
  • the terminal 1000 may include 1 or N cameras 1093 , where N is a positive integer greater than 1.
  • a digital signal processor is used to process digital signals, in addition to processing digital image signals, it can also process other digital signals. For example, when the terminal 1000 selects a frequency point, the digital signal processor is used to perform Fourier transform on the energy of the frequency point, and the like.
  • Video codecs are used to compress or decompress digital video.
  • Terminal 1000 may support one or more video codecs. In this way, the terminal 1000 can play or record videos in various encoding formats, such as: Moving Picture Experts Group (MPEG) 1, MPEG2, MPEG3, MPEG4 and so on.
  • MPEG Moving Picture Experts Group
  • NPU is a neural network (Neural-Network, NN) computing processor.
  • NN neural network
  • Applications such as intelligent cognition of the terminal 1000 can be implemented through the NPU, such as image recognition, face recognition, speech recognition, text understanding, and the like.
  • the external memory interface 1020 can be used to connect an external memory card, such as a Micro SD card, to expand the storage capacity of the terminal 1000.
  • the external memory card communicates with the processor 1010 through the external memory interface 1020 to realize the data storage function. For example to save files like music, video etc in external memory card.
  • Internal memory 1021 may be used to store computer executable program code, which includes instructions.
  • the processor 1010 executes various functional applications and data processing of the terminal 1000 by executing the instructions stored in the internal memory 1021 .
  • the internal memory 1021 may include a storage program area and a storage data area.
  • the storage program area can store an operating system, an application required for at least one function (such as a face recognition function, a fingerprint recognition function, a mobile payment function, etc.) and the like.
  • the storage data area may store data created during the use of the terminal 1000 (such as face information template data, fingerprint information template, etc.) and the like.
  • the internal memory 1021 may include high-speed random access memory, and may also include non-volatile memory, such as at least one magnetic disk storage device, flash memory device, Universal Flash Storage (Universal Flash Storage, UFS), and the like.
  • the terminal 1000 may implement audio functions through an audio module 1070, a speaker 1070A, a receiver 1070B, a microphone 1070C, an earphone interface 1070D, an application processor, and the like. Such as music playback, recording, etc.
  • the audio module 1070 is used for converting digital audio information into analog audio signal output, and also for converting analog audio input into digital audio signal. Audio module 1070 may also be used to encode and decode audio signals. In some embodiments, the audio module 1070 may be provided in the processor 1010 , or some functional modules of the audio module 1070 may be provided in the processor 1010 .
  • Speaker 1070A also referred to as “speaker” is used to convert audio electrical signals into sound signals.
  • the terminal 1000 can listen to music through the speaker 1070A, or listen to a hands-free call.
  • the receiver 1070B also referred to as "earpiece" is used to convert audio electrical signals into sound signals.
  • the voice can be answered by placing the receiver 1070B close to the human ear.
  • the microphone 1070C also called “microphone” or “microphone” is used to convert sound signals into electrical signals.
  • the user can make a sound by approaching the microphone 1070C through the human mouth, and input the sound signal into the microphone 1070C.
  • the terminal 1000 may be provided with at least one microphone 1070C. In other embodiments, the terminal 1000 may be provided with two microphones 1070C, which may implement a noise reduction function in addition to collecting sound signals. In other embodiments, the terminal 1000 may further be provided with three, four or more microphones 1070C to collect sound signals, reduce noise, identify sound sources, and implement directional recording functions.
  • the headphone jack 1070D is used to connect wired headphones.
  • the earphone interface 1070D may be a USB interface 1030, or a 3.5mm Open Mobile Terminal Platform (OMTP) standard interface, a Cellular Telecommunications Industry Association of the USA (CTIA) standard interface.
  • OMTP Open Mobile Terminal Platform
  • CTIA Cellular Telecommunications Industry Association of the USA
  • the pressure sensor 1080A is used to sense pressure signals, and can convert the pressure signals into electrical signals.
  • the pressure sensor 1080A may be provided on the display screen 1094 .
  • the capacitive pressure sensor may be comprised of at least two parallel plates of conductive material. When a force is applied to the pressure sensor 1080A, the capacitance between the electrodes changes. The terminal 1000 determines the intensity of the pressure according to the change in capacitance. When a touch operation acts on the display screen 1094, the terminal 1000 detects the intensity of the touch operation according to the pressure sensor 1080A.
  • the terminal 1000 can also calculate the touched position according to the detection signal of the pressure sensor 1080A.
  • touch operations acting on the same touch position but with different touch operation intensities may correspond to different operation instructions. For example, when a touch operation whose intensity is less than the first pressure threshold acts on the short message application icon, the instruction for viewing the short message is executed. When a touch operation with a touch operation intensity greater than or equal to the first pressure threshold acts on the short message application icon, the instruction to create a new short message is executed.
  • the gyro sensor 1080B may be used to determine the motion attitude of the terminal 1000 .
  • the angular velocity of terminal 1000 about three axes ie, x, y, and z axes
  • the gyro sensor 1080B can be used for image stabilization.
  • the gyroscope sensor 1080B detects the angle at which the terminal 1000 shakes, calculates the distance to be compensated by the lens module according to the angle, and allows the lens to counteract the shake of the terminal 1000 through reverse motion to achieve anti-shake.
  • the gyro sensor 1080B can also be used for navigation and somatosensory game scenarios.
  • Air pressure sensor 1080C is used to measure air pressure.
  • the terminal 1000 calculates the altitude through the air pressure value measured by the air pressure sensor 1080C to assist in positioning and navigation.
  • Magnetic sensor 1080D includes a Hall sensor.
  • the terminal 1000 can detect the opening and closing of the flip holster using the magnetic sensor 1080D.
  • the terminal 1000 can detect the opening and closing of the flip according to the magnetic sensor 1080D. Further, according to the detected opening and closing state of the leather case or the opening and closing state of the flip cover, characteristics such as automatic unlocking of the flip cover are set.
  • the acceleration sensor 1080E can detect the magnitude of the acceleration of the terminal 1000 in various directions (generally three axes). When the terminal 1000 is stationary, the magnitude and direction of gravity can be detected. It can also be used to identify the posture of electronic devices, and can be used in applications such as horizontal and vertical screen switching, pedometers, etc.
  • the terminal 1000 can measure the distance through infrared or laser. In some embodiments, when shooting a scene, the terminal 1000 can use the distance sensor 1080F to measure the distance to achieve fast focusing.
  • Proximity light sensor 1080G may include, for example, light emitting diodes (LEDs) and light detectors, such as photodiodes.
  • the light emitting diodes may be infrared light emitting diodes.
  • the terminal 1000 emits infrared light to the outside through the light emitting diode.
  • Terminal 1000 uses photodiodes to detect infrared reflected light from nearby objects. When sufficient reflected light is detected, it may be determined that there is an object near the terminal 1000 . When insufficient reflected light is detected, the terminal 1000 may determine that there is no object near the terminal 1000 .
  • the terminal 1000 can use the proximity light sensor 1080G to detect that the user holds the terminal 1000 close to the ear to talk, so as to automatically turn off the screen to save power.
  • Proximity light sensor 1080G can also be used in holster mode, pocket mode automatically unlocks and locks the screen.
  • the ambient light sensor 1080L is used to sense ambient light brightness.
  • the terminal 1000 can adaptively adjust the brightness of the display screen 1094 according to the perceived ambient light brightness.
  • the ambient light sensor 1080L can also be used to automatically adjust the white balance when taking pictures.
  • the ambient light sensor 1080L can also cooperate with the proximity light sensor 1080G to detect whether the terminal 1000 is in the pocket, so as to prevent accidental touch.
  • the fingerprint sensor 1080H is used to collect fingerprints.
  • the terminal 1000 can use the collected fingerprint characteristics to unlock the fingerprint, access the application lock, take a picture with the fingerprint, answer the incoming call with the fingerprint, and the like.
  • the temperature sensor 1080J is used to detect the temperature.
  • the terminal 1000 uses the temperature detected by the temperature sensor 1080J to execute a temperature processing strategy. For example, when the temperature reported by the temperature sensor 1080J exceeds a threshold value, the terminal 1000 reduces the performance of the processor located near the temperature sensor 1080J, so as to reduce power consumption and implement thermal protection.
  • the terminal 1000 when the temperature is lower than another threshold, the terminal 1000 heats the battery 1042 to avoid abnormal shutdown of the terminal 1000 due to low temperature.
  • the terminal 1000 boosts the output voltage of the battery 1042 to avoid abnormal shutdown caused by low temperature.
  • Touch sensor 1080K also called “touch panel”.
  • the touch sensor 1080K may be disposed on the display screen 1094, and the touch sensor 1080K and the display screen 1094 form a touch screen, also called “touch screen”.
  • the touch sensor 1080K is used to detect a touch operation on or near it.
  • the touch sensor can pass the detected touch operation to the application processor to determine the type of touch event.
  • Visual output related to touch operations may be provided through display screen 1094 .
  • the touch sensor 1080K may also be disposed on the surface of the terminal 1000, which is different from the position where the display screen 1094 is located.
  • the keys 1090 include a power-on key, a volume key, and the like. Keys 1090 may be mechanical keys. It can also be a touch key.
  • the terminal 1000 may receive key input and generate key signal input related to user settings and function control of the terminal 1000 .
  • Motor 1091 can generate vibrating cues.
  • the motor 1091 can be used for incoming call vibration alerts, and can also be used for touch vibration feedback.
  • touch operations acting on different applications can correspond to different vibration feedback effects.
  • the motor 1091 can also correspond to different vibration feedback effects for touch operations on different areas of the display screen 1094 .
  • Different application scenarios for example: time reminder, receiving information, alarm clock, games, etc.
  • the touch vibration feedback effect can also support customization.
  • the indicator 1092 can be an indicator light, which can be used to indicate the charging state, the change of power, and can also be used to indicate messages, missed calls, notifications, and the like.
  • the SIM card interface 1095 is used to connect a SIM card.
  • the SIM card can be contacted and separated from the terminal 1000 by inserting into the SIM card interface 1095 or pulling out from the SIM card interface 1095 .
  • the terminal 1000 may support 1 or N SIM card interfaces, where N is a positive integer greater than 1.
  • the SIM card interface 1095 can support Nano-SIM card, Micro SIM card, SIM card and so on.
  • the same SIM card interface 1095 can insert multiple cards at the same time.
  • the types of the plurality of cards may be the same or different.
  • the SIM card interface 1095 can also be compatible with different types of SIM cards.
  • the SIM card interface 1095 may also be compatible with external memory cards.
  • the terminal 1000 interacts with the network through the SIM card to realize functions such as call and data communication.
  • the terminal 1000 may have more or fewer components than those shown in the figures, may combine two or more components, or may have different component configurations.
  • the various components shown in the figures may be implemented in hardware, software, or a combination of hardware and software, including one or more signal processing and/or application specific integrated circuits.
  • the terminal includes the board 700 shown in FIG. 7
  • the mobile communication module 1050 and/or the wireless communication module 1060 of the terminal 1000 may include the board 700 .
  • the radio frequency front-end circuit 702 , the conduction unit 704 are connected in series with the device 704 and the radio frequency back-end circuit 706 .
  • FIG. 11 is a radio frequency conduction test method provided by an embodiment of the present application. The method includes but is not limited to the following steps:
  • the single board includes the RF front-end circuit, the RF back-end circuit terminal circuit, the first pad, the second pad and the series device to be welded;
  • the series device to be welded is the device to be welded on the first pad and the second pad;
  • the first pad is connected to the radio frequency front-end circuit
  • the second pad is connected to the radio frequency back-end circuit, and the radio frequency front-end circuit and the radio frequency back-end circuit are in a disconnected state.
  • the RF test pin 402 is moved to the first pad 40141 of the single board, so that the test signal on the first pad 40141 is transmitted to the RF test pin 402 for testing, and the single board can be The single board 401 in FIG. 4 , FIG. 5 and FIG. 6 .
  • the single board includes but is not limited to the single board 401 shown in FIG. 4 , FIG. 5 and FIG. 6 , which is not limited in this application.
  • the RF conduction test can only be performed by setting the board to the working state (at this time, only the test signal is available on the board). In the actual test, the board can also be tested according to the specific requirements of the RF conduction test. Adjusted, the test signal for conducting the RF conduction test has been obtained.
  • the RF front-end circuit of the single board is disconnected from the RF back-end circuit, and the test signal can be transmitted from the first pad. on the pads to the RF test pins.
  • the test signal in the RF test needle can be transmitted to the RF test instrument through an impedance transformation device (as shown in FIG. 4 ), or the test signal in the RF test needle can be transmitted to the RF test instrument through a directional coupler.
  • the instrument, or alternatively, the test signal in the radio frequency test needle is transmitted to the radio frequency test instrument through the impedance transformation device and the directional coupler (as shown in FIG. 6 ).
  • the straight-through output port of the directional coupler is connected to the output port of the radio frequency test instrument.
  • the first measurement port is connected, and the coupling output port of the directional coupler is connected to the second measurement port of the radio frequency test instrument.
  • the RF test pin and/or the first pad can be plated with nickel and gold.
  • the RF test pin can also be plated with gold.
  • the first pad is plated with other materials, such as gold, nickel, and the like.
  • the test signal is The second portion of the first pad is transmitted to the first portion of the RF test pin, wherein the first portion and/or the second portion is treated with nickel-gold plating.
  • the center distance between the first pad and the second pad is not less than 0.254 mm (10 mils) and not greater than 2.54 mm (100 mils). In other embodiments, the center distance between the first pad and the second pad may also be other values, which are not limited in this application. In addition, the sizes and types of the first pad and the second pad may have various forms, which are not limited in this application.
  • the RF test pin is removed, and the series device is repaired to the first pad and the second pad, so that the RF front-end circuit and the The RF back-end circuit is connected, and the single board after the RF conduction test is obtained.
  • repair welding methods include but are not limited to low temperature reflow soldering, laser repair welding, etc.
  • the single board after the RF conduction test is completed includes but is not limited to the single board shown in FIG. 7 and FIG. 8 .
  • radio frequency conduction test method can be performed manually, and can also be completed by an automatic machine or other equipment capable of realizing the function of the above-mentioned method, which is not limited in this application.
  • radio frequency conduction test method can be applied to other modules or devices that need to perform radio frequency conduction test, which is not limited in this application.
  • the size of the sequence numbers of the above-mentioned processes does not mean the sequence of execution, and the execution sequence of each process should be determined by its functions and internal logic, and should not be implemented in the present application.
  • the implementation of the examples constitutes no limitation.
  • the disclosed system, apparatus and method may be implemented in other manners.
  • the apparatus embodiments described above are only illustrative.
  • the division of the units is only a logical function division. In actual implementation, there may be other division methods.
  • multiple units or components may be combined or Can be integrated into another system, or some features can be ignored, or not implemented.
  • the shown or discussed mutual coupling or direct coupling or communication connection may be through some interfaces, indirect coupling or communication connection of devices or units, and may be in electrical, mechanical or other forms.
  • the units described as separate components may or may not be physically separated, and components displayed as units may or may not be physical units, that is, may be located in one place, or may be distributed to multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution in this embodiment.
  • each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically alone, or two or more units may be integrated into one unit.
  • the functions, if implemented in the form of software functional units and sold or used as independent products, may be stored in a computer-readable storage medium.
  • the technical solution of the present application can be embodied in the form of a software product in essence, or the part that contributes to the prior art or the part of the technical solution.
  • the computer software product is stored in a storage medium, including Several instructions are used to cause a computer device (which may be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present application.
  • the aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (Read-Only Memory, ROM), random access memory (Random Access Memory, RAM), magnetic disk or optical disk and other media that can store program codes .
  • the modules in the apparatus of the embodiment of the present application may be combined, divided and deleted according to actual needs.

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Abstract

一种射频传导测试方法及测试系统。测试方法包括：将射频测试针（402）移向单板（401）的第一焊盘（40141），使得第一焊盘上（40141）的测试信号传送到射频测试针（402），从而传送至射频测试仪器（404）进行射频传导测试，射频测试针（402）中的测试信号经过阻抗变换装置（601）和定向耦合器（602）传送到射频测试仪器（404）；定向耦合器（602）的直通输出端口（6024）与射频测试仪器（404）的第一测量端口（4041）相连，定向耦合器（602）的耦合输出端口（6023）与射频测试仪器（404）的第二测量端口（4042）相连；在射频传导测试完成后，移开射频测试针（402），将待焊接的串联器件（704）补焊到单板（401，701）的第一焊盘（40141，7051）与第二焊盘（40142，7052）上，使得单板（401，701）上的射频前端电路（4012，702）和射频后端电路（4015，706）顺利连接。测试方法不用新增更多的器件来进行测试，节省了单板（401，701）的布局面积，并且降低了器件成本。

Description

一种射频传导测试方法及相关装置
本申请要求于2021年02月26日提交中国专利局、申请号为202110215061.X、申请名称为“一种射频传导测试方法及相关装置”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及射频传导测试技术，尤其涉及一种射频传导测试方法及相关装置。
背景技术
众所周知，生产无线终端产品的流程并不简单，需要对无线终端产品进行各种测试，以保证这些无线终端产品功能完好，例如，生产手机的流程包括表面贴装单板(Surface Mount Technology，SMT)、单板功能测试(Functional Test，FT)、组装、预加工(Assembly)、整机测试(Man-Machine Interface，MMI)等。而在对无线终端产品的单板进行加工时，通常需要对单板进行射频指标的传导测试。
现有技术通常利用射频测试针和射频开关测试座来进行射频传导测试，但是射频开关测试座在完成测试后一般就没有其他作用了，当单板上的射频开关测试座数量较多时，既占据了单板的布局面积，又增加了产品的器件成本。
发明内容
本发明实施例公开了一种射频传导测试方法及相关装置，能够利用单板上已有的器件焊盘来进行射频传导测试，等该测试完成后再将待焊接的串联器件补焊在该器件焊盘上，而不再需要使用射频开关测试座，节省了单板的布局面积，也降低了器件成本。
第一方面，本申请提供一种射频传导测试方法，所述方法包括：将射频测试针移向单板的第一焊盘，以使所述第一焊盘上的测试信号传送到所述射频测试针进行测试；所述单板包括射频前端电路、射频后端电路、所述第一焊盘、第二焊盘和待焊接的串联器件；所述待焊接的串联器件为待焊接在所述第一焊盘和所述第二焊盘上的器件；所述第一焊盘与所述射频前端电路相连，所述第二焊盘与所述射频后端电路相连，所述射频前端电路与所述射频后端电路处于断开状态；在测试完成后移开所述射频测试针，将所述串联器件补焊到所述第一焊盘和所述第二焊盘上，以使所述射频前端电路与所述射频后端电路处于连接状态。
在本申请提供的方案中，在进行射频传导测试前，先不焊接射频电路中的某个串联器件，在进行射频传导测试时，将该串联器件的第一焊盘上的测试信号传送至射频测试针(测试信号不传送至该串联器件的第二焊盘上)，再传送至射频测试仪器进行测试，在完成射频传导测试后，再将该串联器件补焊到第一焊盘和第二焊盘上。由于该串联器件以及第一焊盘和第二焊盘，它们本身就是射频电路在完成射频功能时所需的元器件和焊盘，因此本申请实施例无需增加新的用于进行射频传导测试的器件，例如专门用于进行测试的测试点或焊盘或零欧姆贴片等器件，降低了器件成本，无需考虑用于进行测试的测试点或焊盘或零 欧姆贴片的布局，也节省了单板的布局面积。
结合第一方面，在第一方面的一种可能的实现方式中，所述将射频测试针移向单板的第一焊盘之后，所述射频测试针中的测试信号经过阻抗变换装置传送到射频测试仪器。在本申请提供的方案中，可以增加阻抗变换装置，实现将射频传导测试针与第一焊盘之间的接触阻抗变换成特征阻抗，提高了射频传导测试的精度。
结合第一方面，在第一方面的一种可能的实现方式中，所述将射频测试针移向单板的第一焊盘之后，所述射频测试针中的测试信号经过阻抗变换装置和定向耦合器传送到射频测试仪器。
在本申请提供的方案中，可以在增加阻抗变换装置的基础上再增加定向耦合器这一装置，实现反射功率监控和传输功率补偿，提高了射频传导测试的精度。
结合第一方面，在第一方面的一种可能的实现方式中，所述定向耦合器的直通输出端口与所述射频测试仪器的第一测量端口相连，所述定向耦合器的耦合输出端口与所述射频测试仪器的第二测量端口相连。
在本申请提供的方案中，大部分测试信号从直通输出端口输出，小部分测试信号从耦合输出端口输出，而隔离端口基本没有信号输出，通过直通输出端口可以测量阻抗通路的输出功率，而通过耦合输出端口可以测量反射功率等，从而实现传输功率的补偿，提高了射频传导测试的精度。
结合第一方面，在第一方面的一种可能的实现方式中，所述射频测试针和/或所述第一焊盘经过镀镍金处理。
在本申请提供的方案中，可以将射频测试针和/或所述第一焊盘进行镀镍金处理，使得在进行射频传导测试时，射频测试针可以良好接触第一焊盘，从而提高测试精度。
结合第一方面，在第一方面的一种可能的实现方式中，所述将射频测试针移向单板的第一焊盘之后，所述方法还包括：所述射频测试针的第一部位与所述第一焊盘的第二部位相接触；其中，所述第一部位和/或所述第二部位经过镀镍金处理。
在本申请提供的方案中，将射频传导测试过程中射频测试针与第一焊盘的接触部位进行镀镍金处理，使得测试信号可以更好地由射频测试针传送至第一焊盘，从而提高测试精度。
结合第一方面，在第一方面的一种可能的实现方式中，所述将所述串联器件补焊到所述第一焊盘和所述第二焊盘上，包括：采用低温回流焊或激光焊，将所述串联器件补焊到所述第一焊盘和所述第二焊盘上。
在本申请提供的方案中，采用低温回流焊或激光焊等焊接方式，将串联器件补焊到单板上，得到完成射频传导测试后的单板，该单板没有其他无用器件，节省了单板的布局面积。
结合第一方面，在第一方面的一种可能的实现方式中，所述第一焊盘与所述第二焊盘的中心距离不小于0.254毫米且不大于2.54毫米。
在本申请提供的方案中，合理设置了第一焊盘和第二焊盘的中心距离，可以避免在进行射频传导测试时，射频测试针误触第二焊盘。
第二方面，本申请提供一种射频传导测试系统，所述系统包括：单板、射频测试针、射频测试仪器；所述单板包括射频电路、第一焊盘和第二焊盘；所述射频电路包括射频前端电路和射频后端电路，所述第一焊盘与所述射频前端电路相连，所述第二焊盘与所述射频后端电路相连，所述射频前端电路与所述射频后端电路处于断开状态；所述第一焊盘和第二焊盘为待焊接在所述射频电路中的串联器件的焊盘；所述射频测试针用于将所述第一焊盘上的测试信号传送至所述射频测试仪器；所述射频测试仪器用于对所述测试信号进行测试。
结合第二方面，在第二方面的一种可能的实现方式中，所述系统还包括与所述射频测试针和所述射频测试仪器相连的阻抗变换装置，所述阻抗变换装置用于将所述射频测试针上的所述测试信号传送至所述射频测试仪器。
结合第二方面，在第二方面的一种可能的实现方式中，所述系统还包括阻抗变换装置和定向耦合器，所述阻抗变换装置与所述射频测试针和所述定向耦合器相连，所述定向耦合器还与所述射频测试仪器相连，所述阻抗变换装置用于将所述射频测试针上的所述测试信号传送至所述定向耦合器，所述定向耦合器用于将所述测试信号传送至所述射频测试仪器。
结合第二方面，在第二方面的一种可能的实现方式中，所述定向耦合器的直通输出端口与所述射频测试仪器的第一测量端口相连，所述定向耦合器的耦合输出端口与所述射频测试仪器的第二测量端口相连。
结合第二方面，在第二方面的一种可能的实现方式中，所述射频测试针和/或所述第一焊盘经过镀镍金处理。
结合第二方面，在第二方面的一种可能的实现方式中，所述第一焊盘与所述第二焊盘的中心距离不小于0.254毫米且不大于2.54毫米。
第三方面，本申请提供一种射频传导测试装置，所述装置应用于射频传导测试，所述装置包括射频电路、第一焊盘和第二焊盘；所述射频电路包括射频前端电路和射频后端电路，所述第一焊盘与所述射频前端电路相连，所述第二焊盘与所述射频后端电路相连，所述射频前端电路与所述射频后端电路处于断开状态；所述第一焊盘和第二焊盘为待焊接在所述射频电路中的串联器件的焊盘。
结合第三方面，在第三方面的一种可能的实现方式中，所述第一焊盘经过镀镍金处理。
结合第三方面，在第三方面的一种可能的实现方式中，所述第一焊盘与所述第二焊盘的中心距离不小于0.254毫米且不大于2.54毫米。
可理解，上述第二方面提供的一种射频传导测试系统、第三方面提供的一种射频传导测试装置均用于执行第一方面所提供的射频传导测试方法。因此，其所能达到的有益效果可参考第一方面所提供的射频传导测试方法中的有益效果，此处不再赘述。
附图说明
图1为本申请实施例提供的一种射频传导测试系统的结构示意图；
图2为本申请实施例提供的一种射频传导测试系统的原理示意图；
图3为本申请实施例提供的又一种射频传导测试系统的原理示意图；
图4为本申请实施例提供的又一种射频传导测试系统的结构示意图；
图5为本申请实施例提供的又一种射频传导测试系统的原理示意图；
图6为本申请实施例提供的又一种射频传导测试系统的结构示意图；
图7为本申请实施例提供的一种完成射频传导测试后的单板的结构示意图；
图8为本申请实施例提供的又一种完成射频传导测试后的单板的结构示意图；
图9为本申请实施例提供的不同终端的示意图；
图10为本申请实施例提供的一种终端的结构示意图；
图11为本申请实施例提供的一种射频传导测试方法的流程示意图。
具体实施方式
下面结合附图对本申请实施例中的技术方案进行清楚、完整的描述，显然，所描述的实施例仅仅是本申请的一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
首先，对本申请所涉及的部分用语和相关技术进行解释说明，以便于本领域技术人员理解。
特性阻抗，又称“特征阻抗”，它不是直流电阻，属于长线传输中的概念。在高频范围内，信号传输过程中，信号沿到达的地方，信号线和参考平面(电源或地平面)间由于电场的建立，会产生一个瞬间电流，如果传输线是各向同性的，那么只要信号在传输，就始终存在一个电流I，而如果信号的输出电平为V，在信号传输过程中，传输线就会等效成一个电阻，大小为V/I，把这个等效的电阻称为传输线的特性阻抗Z。信号在传输的过程中，如果传输路径上的特性阻抗发生变化，信号就会在阻抗不连续的结点产生反射。无线通信系统射频器件有两种特性阻抗，一种是50Ω用于军用微波、GSM、WCDMA等系统；另一种是75Ω，用于有线电视系统，一般应用较少。
回流焊技术是一种用于制造领域的焊接技术，许多电子设备的板卡上的元件都可以通过这种工艺焊接到线路板上。回流焊工艺中有低温锡膏和高温锡膏两种。从字面意思上来讲，“高温”、“低温”是指这两种类别的锡膏熔点区别。一般来讲，回流焊常规的熔点在217℃以上；而常规的低温锡膏熔点为138℃。高温锡膏适用于高温焊接元件与PCB；而低温锡膏则适用于那些无法承受高温焊接的元件或PCB，如散热器模组焊接，LED焊接，高频焊接等等。低温回流焊技术采用的是低温锡膏，而高温回流焊技术采用的是高温锡膏。
微带线是由支在介质基片上的单一导体带构成的微波传输线。适合制作微波集成电路的平面结构传输线。与金属波导相比，其体积小、重量轻、使用频带宽、可靠性高和制造成本低等；但损耗稍大，功率容量小。
定向耦合器是一种通用的微波/毫米波部件，可用于信号的隔离、分离和混合，如功率的监测、源输出功率稳幅、信号源隔离、传输和反射的扫频测试等。主要技术指标有方向性、驻波比、耦合度、插入损耗。
根据上文所述，在对无线终端产品的单板进行加工时，通常需要对单板进行射频指标的传导测试，以保证所生产的无线终端产品的性能完好，例如，保障所述无线终端产品能顺利入网等。可理解，所述无线终端产品包括但不限于手机、平板电脑、音箱、智能手表等终端。
若使用射频测试开关座来进行射频传导测试，如图1所示，图1为本申请实施例提供的一种射频传导测试系统的结构示意图，图1所示的射频传导测试系统100包括单板101、射频测试针102、射频线缆103以及射频测试仪器104，其中，单板101包括面板1011、射频前端电路1012、信号传输线1013、射频开关测试座1014和射频后端电路1015，可理解，射频前端电路1012、信号传输线1013、射频开关测试座1014和射频后端电路1015均焊接在面板1011上，射频前端电路1012与射频开关测试座1014通过信号传输线1013相连接，射频开关测试座1014与射频后端电路1015也通过信号传输线1013相连接。进行射频传导测试时，射频测试针102通过射频线缆103与射频测试仪器104相连接。
需要说明的是，所述面板1011为未焊接任何电路器件和芯片的电路板，所述单板101可以为已焊接元器件和/或芯片的电路板，所述电路板包括但不限于陶瓷电路板，氧化铝陶瓷电路板，氮化铝陶瓷电路板，线路板，印制电路板(Printed Circuit Board，PCB)，铝基板，高频板，厚铜板，阻抗板，超薄线路板，超薄电路板，印刷(铜刻蚀技术)电路板等，所述信号传输线1013包括但不限于微带线。
可理解，除了面板1011、射频前端电路1012、信号传输线1013、射频开关测试座1014和射频后端电路1015，所述单板101还可以包括其他元器件及信号传输线，所述信号传输线包括但不限于微带线。
还需要说明的是，所述射频前端电路1012是指天线和中频(或基带)电路之间的部分电路，在这一段电路中信号以射频形式传输，对于无线接收机来说，射频前端通常包括：放大器，滤波器，变频器以及一些射频连接和匹配电路；所述射频后端电路1015包括但不限于天线匹配电路。
进一步的，如图2所示，图2为本申请实施例提供的一种射频传导测试系统的原理示意图，射频开关测试座1014中包含两个连接弹片——第一连接弹片10141和第二连接弹片10142，第一连接弹片10141通过信号传输线1013连接至射频前端电路1012，第二连接弹片1042通过信号传输线1013连接至射频后端电路1015，在不受外力作用的状态下，第一连接弹片10141和连接弹片10142相接触，此时，测试信号可以从射频前端电路传送至第一连接弹片10141，再经过第二连接弹片10142，传送至射频后端电路1015，以保证单板101上的电路能正常工作。
而进行射频传导测试时，如图3所示，图3为本申请实施例提供的又一种射频传导测试系统的原理示意图，射频测试针102下压接触连接弹片1041，并使得连接弹片1041与连接弹片1042分离，此时，第一连接弹片10141和第二连接弹片10142不接触，测试信号无法从射频前端电路1011经第一连接弹片10141传送至第二连接弹片10142，而是从射频前端电路1012经第一连接弹片10141传送至射频测试针102，如图1所示，测试信号传送至射频测试针102之后，再通过射频线缆103最终传送至射频测试仪器104，并通过射频 测试仪器104完成射频传导测试。在完成射频测试后，射频开关测试座1014又恢复至图2所示的状态。
然而，射频开关测试座的主要功能是在单板生产加工阶段时进行射频传导测试，在射频传导测试完成后，射频开关测试座基本没有其他用途了，当单板上的射频开关测试座数量较多时，既占用了单板的布局面积，又增加了产品的器件成本。
基于上述内容，本申请实施例提供了一种射频传导测试方法及相关装置，可以使用器件焊盘来进行射频传导测试，无需增加射频开关测试座，节省了单板的布局面积，同时也降低了器件成本。
接下来先对本申请实施例使用的系统进行描述。本申请实施例提供了一种射频传导测试系统，所述系统包括：单板、射频测试针、射频测试仪器；所述单板包括射频电路、第一焊盘和第二焊盘；所述射频电路包括射频前端电路和射频后端电路，所述第一焊盘与所述射频前端电路相连，所述第二焊盘与所述射频后端电路相连，所述射频前端电路与所述射频后端电路处于断开状态；所述第一焊盘和第二焊盘为待焊接在所述射频电路中的串联器件的焊盘；所述射频测试针用于将所述第一焊盘上的测试信号传送至所述射频测试仪器；所述射频测试仪器用于对所述测试信号进行测试。
示例性的，请参阅图4，图4为本申请实施例提供的又一种射频传导测试系统的结构示意图，图4所示的射频传导测试系统400包括单板401、射频测试针402、射频线缆403以及射频测试仪器404，其中，单板401包括面板4011、射频前端电路4012、信号传输线4013、器件焊盘4014、射频后端电路4015和待焊接的串联器件4016。可理解，射频前端电路4012、信号传输线4013、器件焊盘4014和射频后端电路4015均焊接在面板4011上，而待焊接的串联器件4016待焊接在器件焊盘4014上，即待焊接的串联器件4016此时并未焊接在面板4011上，也与焊接在面板4011上的其他器件无连接关系，射频前端电路4012与器件焊盘4014通过信号传输线4013相连接，器件焊盘4014与射频后端电路4015也通过信号传输线4013相连接。进行射频传导测试时，射频测试针402通过射频线缆403与射频测试仪器404相连接。
另外，射频测试仪器404上有两个测量端口——第一测量端口4041和第二测量端口4042，这两个测量端口均可用于射频传导测量，射频测试仪器404上还有显示屏4043，显示屏4043可以显示射频传导测试中所检测的各项参数，如功率、电压、阻抗等。可理解，射频测试仪器404还可以包括其他部件(例如，其他按钮及接口)，在此不作具体说明。
需要说明的是，所述面板4011为未焊接任何电路器件和芯片的电路板，所述单板401可以为已焊接元器件和/或芯片的电路板，所述电路板包括但不限陶瓷电路板，氧化铝陶瓷电路板，氮化铝陶瓷电路板，线路板，印制电路板(Printed Circuit Board，PCB)，铝基板，高频板，厚铜板，阻抗板，超薄线路板，超薄电路板，印刷(铜刻蚀技术)电路板等；所述器件焊盘4014可以包括但不限于贴片PAD，所述信号传输线4013包括但不限于微带线。
可理解，除了面板4011、射频前端电路4012、信号传输线4013、器件焊盘4014、射频后端电路4015和待焊接的串联器件4016，所述单板401还可以包括其他电路模块，这些电路模块可以包括一个或多个元器件及信号传输线，所述信号传输线包括但不限于微带 线。
还需要说明的是，所述射频前端电路4012是指天线和中频(或基带)电路之间的部分电路，在这一段电路中信号以射频形式传输，对于无线接收机来说，射频前端通常包括：放大器，滤波器，变频器以及一些射频连接和匹配电路；所述射频后端电路4015包括但不限于天线匹配电路。可理解，所述射频前端电路4012和所述射频后端电路4015中的电路结构可以有多种形式，本申请对此不作限制。
另外，器件焊盘4014用于连接面板4011和待焊接的串联器件4016，可理解，在进行本申请实施例的射频传导测试时，单板401可以不包括待焊接的串联器件4016。可理解，所述串联器件为串联连接其他元器件的一个或多个元器件，例如，所述串联器件包括但不限于电阻、电容和电感等器件；所述射频电路是指单板101上信号以射频形式传输的一段电路，在本申请的一个实施例中，所述射频电路包括但不限于射频前端电路4012和射频后端电路4015。
进一步的，如图5所示，图5为本申请实施例提供的又一种射频传导测试系统的原理示意图，器件焊盘4014包括第一焊盘40141和第二焊盘40142，第一焊盘40141和第二焊盘40142之间无电性连接(例如，第一焊盘40141和第二焊盘40142没有焊接在一起)，所以射频前端电路4012和射频后端电路4015之间处于断开状态。可理解，图4所示的待焊接的串联器件4016为待焊接在图5所示的第一焊盘40141和第二焊盘40142上的器件。
在进行射频传导测试时，射频测试针402与第一焊盘40141相接触，而第一焊盘40141和第二焊盘40142之间无电性连接，即第一焊盘40141和第二焊盘40142并不直接连接，也不通过中间结构或其他方式相连，第一焊盘40141上有射频传导测试的测试信号，此时，测试信号可以通过射频测试针402经射频线缆403传送至射频测试仪器404中，从而实现射频传导测试。
在完成射频传导测试后，移开射频测试针402，此时，射频测试针402与第一焊盘40141无电性连接(例如，所述射频测试针402离开器件焊盘4014的第一焊盘40141)，即射频测试针402与第一焊盘40141并不直接连接，也不通过中间结构或其他方式相连，将待焊接的串联器件4016补焊到第一焊盘40141和第二焊盘40142上，例如，采用低温回流等工艺进行补焊，第一焊盘40141和第二焊盘40142通过已完成焊接的串联器件4016相连，使得射频前端电路4012与射频后端电路4015处于连接状态。
可理解，为了更好地将第一焊盘40141上的测试信号传送至射频测试针402，可以将射频测试针402和/或第一焊盘40141进行镀镍金处理，可选的，还可以将射频测试针402和/或第一焊盘40141镀上其他材料，比如金、镍等。
需要说明的是，在本申请的一个实施例中，第一焊盘40141与第二焊盘40142的中心距离不小于0.254毫米(10密尔)且不大于2.54毫米(100密尔)，在本申请的其他实施例中，第一焊盘和第二焊盘的中心距离还可以为其他值，本申请对此不作限制。另外，第一焊盘与第二焊盘的尺寸和类型可以有多种形式，本申请对此不作限制。
在本申请的一个实施例中，还可以通过增加阻抗变换装置和定向耦合器来提高射频传导测试的精度，如图6所示，图6为本申请实施例提供的又一种射频传导测试系统的结构 示意图，射频传导测试系统600包括单板401、射频测试针402、射频线缆403、阻抗变换装置601、定向耦合器602以及射频测试仪器404。根据上文所述，单板401包括面板4011、射频前端电路4012、信号传输线4013、器件焊盘4014、射频后端电路4015和待焊接的串联器件4016。可理解，射频前端电路4012、信号传输线4013、器件焊盘4014和射频后端电路4015均焊接在面板4011上，而待焊接的串联器件4016待焊接在器件焊盘4014上，即待焊接的串联器件4016此时并未焊接在面板4011上，也与焊接在面板4011上的其他器件无连接关系，射频前端电路4012与器件焊盘4014通过信号传输线4013相连接，器件焊盘4014与射频后端电路4015也通过信号传输线4013相连接。进行射频传导测试时，射频测试针402通过射频线缆403与阻抗变换装置601相连接，阻抗变换装置601通过射频线缆403与定向耦合器602相连接，定向耦合器602再通过射频线缆403与射频测试仪器404相连接。
可理解，单板401和射频测试仪器404的结构，可参考上文关于图4所示的射频传导测试系统400的相关描述；器件焊盘4014的结构，可参考上文关于图5的相关描述，在此不再赘述。
需要说明的是，所述阻抗变换装置601中包括阻抗变换电路，所述阻抗变换电路可以将射频测试针402和第一焊盘40141之间的阻抗转换成特征阻抗，在本申请的一个实施例中，所述特征阻抗为50欧姆。可理解，可以根据实际需要改变所述阻抗变换装置601中的具体电路，例如，可以通过改变阻抗变换装置601中的电路结构来实现特征阻抗的转换。
还需要说明的是，利用所述定向耦合器602可以实现反射功率的监控和传输功率的补偿，这是由于在一般的射频传导测试过程中(例如，利用图4所示的射频传导测试系统400进行射频传导测试时)，有一部分传输功率(例如，反射功率等)无法测量，导致使用射频测量仪器进行分析时得出的结果准确率不高，而定向耦合器602可以在一定程度上解决这个问题。具体地，定向耦合器602有四个端口——输入端口6021、隔离端口6022、耦合输出端口6023和直通输出端口6024，耦合输出端口6023与射频测试仪器404的第二测量端口4042相连，直通输出端口6024与射频测试仪器404的第一测量端口4041相连，测试信号从定向耦合器602的输入端口6021输入，大部分测试信号从直通输出端口6024输出，小部分测试信号从耦合输出端口6023输出，而隔离端口6022基本没有信号输出(理想情况下，定向耦合器的隔离端口无输出，可达到理想隔离；实际情况下，隔离端口会有泄露)，通过直通输出端口6024可以测量阻抗通路的输出功率，而通过耦合输出端口6023可以测量反射功率等，从而实现传输功率的补偿，相较于图4所示的射频传导测试系统400，图6所示的射频传导测试系统600提高了射频传导测试的准确性。可理解，所述定向耦合器602可以为不同类型的定向耦合器(比如标准定向耦合器、双定向耦合器等)，例如，所述定向耦合器602可以为能实现反射功率测量的不同类型的定向耦合器，本申请对此不作限制。
可选的，射频测试系统可以不包括阻抗变换装置和定向耦合器(如图4所示)，也可以包括阻抗变换装置和定向耦合器中的至少一个(如图6所示)，还可以包括其他装置或器件(例如其他可以提高射频传导测试精度的器件或装置)，本申请对此不作限制。
本申请实施例还提供了一种应用于射频传导测试的单板，所述单板包括射频电路、第 一焊盘和第二焊盘；所述射频电路包括射频前端电路和射频后端电路，所述第一焊盘与所述射频前端电路相连，所述第二焊盘与所述射频后端电路相连，所述射频前端电路与所述射频后端电路处于断开状态；所述第一焊盘和第二焊盘为待焊接在所述射频电路中的串联器件的焊盘；所述第一焊盘上的测试信号用于供射频测试针进行射频传导测试。
可理解，所述射频电路、所述第一焊盘、所述第二焊盘和所述串联器件可参考关于图4、图5和图6的相关描述；所述单板可以为图4、图5、图6所示的包括面板4011、射频前端电路4012、信号传输线4013、器件焊盘4014(包括第一焊盘40141和第二焊盘40142)、射频后端电路4015和待焊接的串联器件4016的单板，还可以为其他具有上述结构、连接关系，且能应用于射频传导测试的单板。
可理解，所述单板中的第一焊盘可以经过镀镍金处理，可选的，还可以将第一焊盘镀上其他材料，比如金、镍等。
需要说明的是，在本申请的一个实施例中，第一焊盘与第二焊盘的中心距离不小于0.254毫米(10密尔)且不大于2.54毫米(100密尔)，在本申请的其他实施例中，第一焊盘和第二焊盘的中心距离还可以为其他值，本申请对此不作限制。另外，第一焊盘与第二焊盘的尺寸和类型可以有多种形式，本申请对此不作限制。
本申请实施例还提供了一种完成射频传导测试后的单板，所述单板包括射频电路、第一焊盘、第二焊盘和串联器件；所述射频电路包括射频前端电路和射频后端电路，所述第一焊盘与所述射频前端电路相连，所述第二焊盘与所述射频后端电路相连，所述串联器件为所述射频电路中焊接在所述第一焊盘和所述第二焊盘上的器件。
示例性的，如图7所示，图7为本申请实施例提供的一种完成射频传导测试后的单板的结构示意图，图7所示的单板700包括面板701，射频前端电路702、信号传输线703、串联器件704、器件焊盘705以及射频后端电路706。可理解，射频前端电路702、信号传输线703、器件焊盘705以及射频后端电路706均焊接在面板701上，串联器件704焊接在器件焊盘705上，射频前端电路702与器件焊盘705通过信号传输线703相连接，器件焊盘705与射频后端电路706也通过信号传输线703相连接。
需要说明的是，所述面板701为未焊接任何电路器件和芯片的电路板，所述单板700可以为已焊接元器件和/或芯片的电路板，所述电路板包括但不限陶瓷电路板，氧化铝陶瓷电路板，氮化铝陶瓷电路板，线路板，印制电路板(Printed Circuit Board，PCB)，铝基板，高频板，厚铜板，阻抗板，超薄线路板，超薄电路板，印刷(铜刻蚀技术)电路板等，所述信号传输线703包括但不限于微带线。
可理解，除了面板701、射频前端电路702、信号传输线703、串联器件704、器件焊盘705以及射频后端电路706，所述单板700还可以包括其他电路模块，这些电路模块可以包括一个或多个元器件及信号传输线。
还需要说明的是，所述射频前端电路702是指天线和中频(或基带)电路之间的部分电路，在这一段电路中信号以射频形式传输，对于无线接收机来说，射频前端通常包括：放大器，滤波器，变频器以及一些射频连接和匹配电路；所述射频后端电路706包括但不限于天线匹配电路。可理解，所述射频前端电路702和所述射频后端电路706中的电路结 构可以有多种形式，本申请对此不作限制。
另外，器件焊盘705用于连接面板701和串联器件704，串联器件704所述串联器件为串联连接其他元器件的一个或多个元器件，例如，所述串联器件包括但不限于电阻、电容和电感等器件，所述射频电路是指单板700上信号以射频形式传输的一段电路，在本申请的一个实施例中，所述射频电路包括但不限于射频前端电路702和射频后端电路706。
示例性的，如图8所示，图8为本申请实施例提供的又一种完成射频传导测试后的单板的结构示意图，器件焊盘705包括第一焊盘7051和第二焊盘7052，第一焊盘7051通过信号传输线703与射频前端电路702相连，第二焊盘7052通过信号传输线703与射频后端电路706相连，串联器件704焊接在第一焊盘7051和第二焊盘7052上。当单板700工作时，单板700上的信号从射频前端电路702经信号传输线703传送至第一焊盘7051，再经过串联器件704到达第二焊盘7052，然后经信号传输线703传送至射频后端电路706。
可理解，完成射频传导测试后的单板700中的第一焊盘7051可以经过镀镍金处理，可选的，还可以将第一焊盘7051镀上其他材料，比如金、镍等。
需要说明的是，在本申请的一个实施例中，第一焊盘7051与第二焊盘7052的中心距离不小于0.254毫米(10密尔)且不大于2.54毫米(100密尔)，在本申请的其他实施例中，第一焊盘和第二焊盘的中心距离还可以为其他值，本申请对此不作限制。另外，第一焊盘与第二焊盘的尺寸和类型可以有多种形式，本申请对此不作限制。可理解，在本申请的一个实施例中，所述完成射频传导测试后的单板可以不包括射频测试开关座，在本申请的其他实施例中，所述完成射频传导测试后的单板还可以为其他具有上述结构、连接关系，且完成射频传导测试后的单板，本申请对此不作限制。
本申请还提供了一种终端，所述终端包括所述射频传导测试后的单板，如图9所示，图9为本申请实施例提供的不同终端的示意图，所述终端可以为包括所述射频传导测试后的单板的手机、PC、平板电脑、智能手表、智能音箱等设备。
示例性的，如图10所示，图10为本申请提供的一种终端的结构示意图，所述终端包括所述射频传导测试后的单板。下面对图10所示的终端1000进行具体说明：
终端1000可以包括：处理器1010，外部存储器接口1020，内部存储器1021，通用串行总线(universal serial bus，USB)接口1030，充电管理模块1040，电源管理模块1041，电池1042，天线1，天线2，移动通信模块1050，无线通信模块1060，音频模块1070，扬声器1070A，受话器1070B，麦克风1070C，耳机接口1070D，传感器模块1080，按键1090，马达1091，指示器1092，摄像头1093，显示屏1094以及用户标识模块(subscriber identification module，SIM)卡接口1095等。其中传感器模块1080可以包括压力传感器1080A，陀螺仪传感器1080B，气压传感器1080C，磁传感器1080D，加速度传感器1080E，距离传感器1080F，接近光传感器1080G，指纹传感器1080H，温度传感器1080J，触摸传感器1080K，环境光传感器1080L，骨传导传感器1080M等。
可理解，本申请实施例示意的结构并不构成对终端1000的具体限定。在本申请另一些实施例中，终端1000可以包括比图示更多或更少的部件，或者组合某些部件，或者拆分某 些部件，或者不同的部件布置。图示的部件可以以硬件，软件或软件和硬件的组合实现。
处理器1010可以包括一个或多个处理单元，例如：处理器1010可以包括应用处理器(Application Processor，AP)，调制解调处理器，图形处理器(Graphics Processing unit，GPU)，图像信号处理器(Image Signal Processor，ISP)，控制器，存储器，视频编解码器，数字信号处理器(Digital Signal Processor，DSP)，基带处理器，和/或神经网络处理器(Neural-network Processing Unit，NPU)等。其中，不同的处理单元可以是独立的器件，也可以集成在一个或多个处理器中。
其中，控制器可以是终端1000的神经中枢和指挥中心。控制器可以根据指令操作码和时序信号，产生操作控制信号，完成取指令和执行指令的控制。
处理器1010中还可以设置存储器，用于存储指令和数据。在一些实施例中，处理器1010中的存储器为高速缓冲存储器。该存储器可以保存处理器1010刚用过或循环使用的指令或数据。如果处理器1010需要再次使用该指令或数据，可从所述存储器中直接调用。避免了重复存取，减少了处理器1010的等待时间，因而提高了系统的效率。
在一些实施例中，处理器1010可以包括一个或多个接口。接口可以包括集成电路(Inter-Integrated Circuit，I2C)接口，集成电路内置音频(Inter-Integrated Circuit Sound，I2S)接口，脉冲编码调制(Pulse Code Modulation，PCM)接口，通用异步收发传输器(Universal Asynchronous Receiver/Transmitter，UART)接口，移动产业处理器接口(Mobile Industry Processor Interface，MIPI)，通用输入输出(General-Purpose Input/output，GPIO)接口，用户标识模块(Subscriber Identity Module，SIM)接口，和/或通用串行总线(Universal Serial Bus，USB)接口等。
I2C接口是一种双向同步串行总线，包括一根串行数据线(Serial Data Line，SDA)和一根串行时钟线(Derail Clock Line，SCL)。在一些实施例中，处理器1010可以包含多组I2C总线。处理器1010可以通过不同的I2C总线接口分别耦合触摸传感器1080K，充电器，闪光灯，摄像头1093等。例如：处理器1010可以通过I2C接口耦合触摸传感器1080K，使处理器1010与触摸传感器1080K通过I2C总线接口通信，实现终端1000的触摸功能。
I2S接口可以用于音频通信。在一些实施例中，处理器1010可以包含多组I2S总线。处理器1010可以通过I2S总线与音频模块1070耦合，实现处理器1010与音频模块1070之间的通信。在一些实施例中，音频模块1070可以通过I2S接口向无线通信模块1060传递音频信号，实现通过蓝牙耳机接听电话的功能。
PCM接口也可以用于音频通信，将模拟信号抽样，量化和编码。在一些实施例中，音频模块1070与无线通信模块1060可以通过PCM总线接口耦合。在一些实施例中，音频模块1070也可以通过PCM接口向无线通信模块1060传递音频信号，实现通过蓝牙耳机接听电话的功能。所述I2S接口和所述PCM接口都可以用于音频通信。
UART接口是一种通用串行数据总线，用于异步通信。该总线可以为双向通信总线。它将要传输的数据在串行通信与并行通信之间转换。在一些实施例中，UART接口通常被用于连接处理器1010与无线通信模块1060。例如：处理器1010通过UART接口与无线通信模块1060中的蓝牙模块通信，实现蓝牙功能。在一些实施例中，音频模块1070可以通过UART接口向无线通信模块1060传递音频信号，实现通过蓝牙耳机播放音乐的功能。
MIPI接口可以被用于连接处理器1010与显示屏1094，摄像头1093等外围器件。MIPI接口包括摄像头串行接口(Camera Serial Interface，CSI)，显示屏串行接口(Display Serial Interface，DSI)等。在一些实施例中，处理器1010和摄像头1093通过CSI接口通信，实现终端1000的拍摄功能。处理器1010和显示屏1094通过DSI接口通信，实现终端1000的显示功能。
GPIO接口可以通过软件配置。GPIO接口可以被配置为控制信号，也可被配置为数据信号。在一些实施例中，GPIO接口可以用于连接处理器1010与摄像头1093，显示屏1094，无线通信模块1060，音频模块1070，传感器模块1080等。GPIO接口还可以被配置为I2C接口，I2S接口，UART接口，MIPI接口等。
SIM接口可以被用于与SIM卡接口1095通信，实现传送数据到SIM卡或读取SIM卡中数据的功能。
USB接口1030是符合USB标准规范的接口，具体可以是Mini USB接口，Micro USB接口，USB Type C接口等。USB接口1030可以用于连接充电器为终端1000充电，也可以用于终端1000与外围设备之间传输数据。也可以用于连接耳机，通过耳机播放音频。该接口还可以用于连接其他电子设备，例如AR设备等。
可以理解的是，本申请实施例示意的各模块间的接口连接关系，只是示意性说明，并不构成对终端1000的结构限定。在本申请另一些实施例中，终端1000也可以采用上述实施例中不同的接口连接方式，或多种接口连接方式的组合。
充电管理模块1040用于从充电器接收充电输入。其中，充电器可以是无线充电器，也可以是有线充电器。
电源管理模块1041用于连接电池1042，充电管理模块1040与处理器1010。电源管理模块1041接收电池1042和/或充电管理模块1040的输入，为处理器1010，内部存储器1021，外部存储器，显示屏1094，摄像头1093，和无线通信模块1060等供电。
终端1000的无线通信功能可以通过天线1，天线2，移动通信模块1050，无线通信模块1060，调制解调处理器以及基带处理器等实现。
天线1和天线2用于发射和接收电磁波信号。终端1000中的每个天线可用于覆盖单个或多个通信频带。不同的天线还可以复用，以提高天线的利用率。例如：可以将天线1复用为无线局域网的分集天线。在另外一些实施例中，天线可以和调谐开关结合使用。
移动通信模块1050可以提供应用在终端1000上的包括2G/3G/4G/5G等无线通信的解决方案。移动通信模块1050可以包括至少一个滤波器，开关，功率放大器，低噪声放大器(low noise amplifier，LNA)等。移动通信模块1050可以由天线1接收电磁波，并对接收的电磁波进行滤波，放大等处理，传送至调制解调处理器进行解调。移动通信模块1050还可以对经调制解调处理器调制后的信号放大，经天线1转为电磁波辐射出去。在一些实施例中，移动通信模块1050的至少部分功能模块可以被设置于处理器1010中。在一些实施例中，移动通信模块1050的至少部分功能模块可以与处理器1010的至少部分模块被设置在同一个器件中。
调制解调处理器可以包括调制器和解调器。其中，调制器用于将待发送的低频基带信号调制成中高频信号。解调器用于将接收的电磁波信号解调为低频基带信号。随后解调器 将解调得到的低频基带信号传送至基带处理器处理。低频基带信号经基带处理器处理后，被传递给应用处理器。应用处理器通过音频设备(不限于扬声器1070A，受话器1070B等)输出声音信号，或通过显示屏1094显示图像或视频。在一些实施例中，调制解调处理器可以是独立的器件。在另一些实施例中，调制解调处理器可以独立于处理器1010，与移动通信模块1050或其他功能模块设置在同一个器件中。
无线通信模块1060可以提供应用在终端1000上的包括无线局域网(Wireless Local Area Networks，WLAN)(如无线保真(Wireless Fidelity，Wi-Fi)网络)，蓝牙(Bluetooth，BT)，全球导航卫星系统(Global Navigation Satellite System，GNSS)，调频(Frequency Modulation，FM)，近距离无线通信技术(Near Field Communication，NFC)，红外技术(Infrared，IR)等无线通信的解决方案。无线通信模块1060可以是集成至少一个通信处理模块的一个或多个器件。无线通信模块1060经由天线2接收电磁波，将电磁波信号调频以及滤波处理，将处理后的信号发送到处理器1010。无线通信模块1060还可以从处理器1010接收待发送的信号，对其进行调频，放大，经天线2转为电磁波辐射出去。
在一些实施例中，终端1000的天线1和移动通信模块1050耦合，天线2和无线通信模块1060耦合，使得终端1000可以通过无线通信技术与网络以及其他设备通信。所述无线通信技术可以包括全球移动通讯系统(Global System for Mobile Communications，GSM)，通用分组无线服务(General Packet Radio Service，GPRS)，码分多址接入(Code Division Multiple Access，CDMA)，宽带码分多址(Wideband Code Division Multiple Access，WCDMA)，时分码分多址(Time-Division Code Division Multiple Access，TD-SCDMA)，长期演进(Long Term Evolution，LTE)，BT，GNSS，WLAN，NFC，FM，和/或IR技术等。所述GNSS可以包括全球卫星定位系统(Global Positioning System，GPS)，全球导航卫星系统(Global Navigation Satellite System，GLONASS)，北斗卫星导航系统(BeiDou Navigation Satellite System，BDS)，准天顶卫星系统(Quasi-Zenith Satellite System，QZSS)和/或星基增强系统(Satellite Based Augmentation Systems，SBAS)。
终端1000通过GPU，显示屏1094，以及应用处理器等实现显示功能。GPU为图像处理的微处理器，连接显示屏1094和应用处理器。GPU用于执行数学和几何计算，用于图形渲染。处理器1010可包括一个或多个GPU，其执行程序指令以生成或改变显示信息。
显示屏1094用于显示图像，视频等。显示屏1094包括显示面板。显示面板可以采用液晶显示屏(Liquid Crystal Display，LCD)，有机发光二极管(Organic Light-Emitting Diode，OLED)，有源矩阵有机发光二极体或主动矩阵有机发光二极体(Active-Matrix Organic Light Emitting Diode，AMOLED)，柔性发光二极管(Flex Light-Emitting Diode，FLED)，Mini LED，Micro LED，Micro-OLED，量子点发光二极管(Quantum Dot Light Emitting Diodes，QLED)等。在一些实施例中，终端1000可以包括1个或N个显示屏1094，N为大于1的正整数。
终端1000可以通过ISP，摄像头1093，视频编解码器，GPU，显示屏1094以及应用处理器等实现拍摄功能。
ISP用于处理摄像头1093反馈的数据。例如，拍照时，打开快门，光线通过镜头被传递到摄像头感光元件上，光信号转换为电信号，摄像头感光元件将所述电信号传递给ISP处理，转化为肉眼可见的图像。ISP还可以对图像的噪点，亮度，肤色进行算法优化。ISP 还可以对拍摄场景的曝光，色温等参数优化。在一些实施例中，ISP可以设置在摄像头1093中。
摄像头1093用于捕获静态图像或视频。物体通过镜头生成光学图像投射到感光元件。感光元件可以是电荷耦合器件(Charge Coupled Device，CCD)或互补金属氧化物半导体(Complementary Metal-Oxide-Semiconductor，CMOS)光电晶体管。感光元件把光信号转换成电信号，之后将电信号传递给ISP转换成数字图像信号。ISP将数字图像信号输出到DSP加工处理。DSP将数字图像信号转换成标准的RGB，YUV等格式的图像信号。在一些实施例中，终端1000可以包括1个或N个摄像头1093，N为大于1的正整数。
数字信号处理器用于处理数字信号，除了可以处理数字图像信号，还可以处理其他数字信号。例如，当终端1000在频点选择时，数字信号处理器用于对频点能量进行傅里叶变换等。
视频编解码器用于对数字视频压缩或解压缩。终端1000可以支持一种或多种视频编解码器。这样，终端1000可以播放或录制多种编码格式的视频，例如：动态图像专家组(Moving Picture Experts Group，MPEG)1，MPEG2，MPEG3，MPEG4等。
NPU为神经网络(Neural-Network，NN)计算处理器，通过借鉴生物神经网络结构，例如借鉴人脑神经元之间传递模式，对输入信息快速处理，还可以不断的自学习。通过NPU可以实现终端1000的智能认知等应用，例如：图像识别，人脸识别，语音识别，文本理解等。
外部存储器接口1020可以用于连接外部存储卡，例如Micro SD卡，实现扩展终端1000的存储能力。外部存储卡通过外部存储器接口1020与处理器1010通信，实现数据存储功能。例如将音乐，视频等文件保存在外部存储卡中。
内部存储器1021可以用于存储计算机可执行程序代码，所述可执行程序代码包括指令。处理器1010通过运行存储在内部存储器1021的指令，从而执行终端1000的各种功能应用以及数据处理。内部存储器1021可以包括存储程序区和存储数据区。其中，存储程序区可存储操作系统，至少一个功能所需的应用(比如人脸识别功能，指纹识别功能、移动支付功能等)等。存储数据区可存储终端1000使用过程中所创建的数据(比如人脸信息模板数据，指纹信息模板等)等。此外，内部存储器1021可以包括高速随机存取存储器，还可以包括非易失性存储器，例如至少一个磁盘存储器件，闪存器件，通用闪存存储器(Universal Flash Storage，UFS)等。
终端1000可以通过音频模块1070，扬声器1070A，受话器1070B，麦克风1070C，耳机接口1070D，以及应用处理器等实现音频功能。例如音乐播放，录音等。
音频模块1070用于将数字音频信息转换成模拟音频信号输出，也用于将模拟音频输入转换为数字音频信号。音频模块1070还可以用于对音频信号编码和解码。在一些实施例中，音频模块1070可以设置于处理器1010中，或将音频模块1070的部分功能模块设置于处理器1010中。
扬声器1070A，也称“喇叭”，用于将音频电信号转换为声音信号。终端1000可以通过扬声器1070A收听音乐，或收听免提通话。
受话器1070B，也称“听筒”，用于将音频电信号转换成声音信号。当终端1000接听 电话或语音信息时，可以通过将受话器1070B靠近人耳接听语音。
麦克风1070C，也称“话筒”，“传声器”，用于将声音信号转换为电信号。当拨打电话或发送语音信息时，用户可以通过人嘴靠近麦克风1070C发声，将声音信号输入到麦克风1070C。终端1000可以设置至少一个麦克风1070C。在另一些实施例中，终端1000可以设置两个麦克风1070C，除了采集声音信号，还可以实现降噪功能。在另一些实施例中，终端1000还可以设置三个，四个或更多麦克风1070C，实现采集声音信号，降噪，还可以识别声音来源，实现定向录音功能等。
耳机接口1070D用于连接有线耳机。耳机接口1070D可以是USB接口1030，也可以是3.5mm的开放移动电子设备平台(Open Mobile Terminal Platform，OMTP)标准接口，美国蜂窝电信工业协会(Cellular Telecommunications Industry Association of the USA，CTIA)标准接口。
压力传感器1080A用于感受压力信号，可以将压力信号转换成电信号。在一些实施例中，压力传感器1080A可以设置于显示屏1094。压力传感器1080A的种类很多，如电阻式压力传感器，电感式压力传感器，电容式压力传感器等。电容式压力传感器可以是包括至少两个具有导电材料的平行板。当有力作用于压力传感器1080A，电极之间的电容改变。终端1000根据电容的变化确定压力的强度。当有触摸操作作用于显示屏1094，终端1000根据压力传感器1080A检测所述触摸操作强度。终端1000也可以根据压力传感器1080A的检测信号计算触摸的位置。在一些实施例中，作用于相同触摸位置，但不同触摸操作强度的触摸操作，可以对应不同的操作指令。例如：当有触摸操作强度小于第一压力阈值的触摸操作作用于短消息应用图标时，执行查看短消息的指令。当有触摸操作强度大于或等于第一压力阈值的触摸操作作用于短消息应用图标时，执行新建短消息的指令。
陀螺仪传感器1080B可以用于确定终端1000的运动姿态。在一些实施例中，可以通过陀螺仪传感器1080B确定终端1000围绕三个轴(即，x，y和z轴)的角速度。陀螺仪传感器1080B可以用于拍摄防抖。示例性的，当按下快门，陀螺仪传感器1080B检测终端1000抖动的角度，根据角度计算出镜头模组需要补偿的距离，让镜头通过反向运动抵消终端1000的抖动，实现防抖。陀螺仪传感器1080B还可以用于导航，体感游戏场景。
气压传感器1080C用于测量气压。在一些实施例中，终端1000通过气压传感器1080C测得的气压值计算海拔高度，辅助定位和导航。
磁传感器1080D包括霍尔传感器。终端1000可以利用磁传感器1080D检测翻盖皮套的开合。在一些实施例中，当终端1000是翻盖机时，终端1000可以根据磁传感器1080D检测翻盖的开合。进而根据检测到的皮套的开合状态或翻盖的开合状态，设置翻盖自动解锁等特性。
加速度传感器1080E可检测终端1000在各个方向上(一般为三轴)加速度的大小。当终端1000静止时可检测出重力的大小及方向。还可以用于识别电子设备姿态，应用于横竖屏切换，计步器等应用。
距离传感器1080F，用于测量距离。终端1000可以通过红外或激光测量距离。在一些实施例中，拍摄场景，终端1000可以利用距离传感器1080F测距以实现快速对焦。
接近光传感器1080G可以包括例如发光二极管(LED)和光检测器，例如光电二极管。 发光二极管可以是红外发光二极管。终端1000通过发光二极管向外发射红外光。终端1000使用光电二极管检测来自附近物体的红外反射光。当检测到充分的反射光时，可以确定终端1000附近有物体。当检测到不充分的反射光时，终端1000可以确定终端1000附近没有物体。终端1000可以利用接近光传感器1080G检测用户手持终端1000贴近耳朵通话，以便自动熄灭屏幕达到省电的目的。接近光传感器1080G也可用于皮套模式，口袋模式自动解锁与锁屏。
环境光传感器1080L用于感知环境光亮度。终端1000可以根据感知的环境光亮度自适应调节显示屏1094亮度。环境光传感器1080L也可用于拍照时自动调节白平衡。环境光传感器1080L还可以与接近光传感器1080G配合，检测终端1000是否在口袋里，以防误触。
指纹传感器1080H用于采集指纹。终端1000可以利用采集的指纹特性实现指纹解锁，访问应用锁，指纹拍照，指纹接听来电等。
温度传感器1080J用于检测温度。在一些实施例中，终端1000利用温度传感器1080J检测的温度，执行温度处理策略。例如，当温度传感器1080J上报的温度超过阈值，终端1000执行降低位于温度传感器1080J附近的处理器的性能，以便降低功耗实施热保护。在另一些实施例中，当温度低于另一阈值时，终端1000对电池1042加热，以避免低温导致终端1000异常关机。在其他一些实施例中，当温度低于又一阈值时，终端1000对电池1042的输出电压执行升压，以避免低温导致的异常关机。
触摸传感器1080K，也称“触控面板”。触摸传感器1080K可以设置于显示屏1094，由触摸传感器1080K与显示屏1094组成触摸屏，也称“触控屏”。触摸传感器1080K用于检测作用于其上或附近的触摸操作。触摸传感器可以将检测到的触摸操作传递给应用处理器，以确定触摸事件类型。可以通过显示屏1094提供与触摸操作相关的视觉输出。在另一些实施例中，触摸传感器1080K也可以设置于终端1000的表面，与显示屏1094所处的位置不同。
按键1090包括开机键，音量键等。按键1090可以是机械按键。也可以是触摸式按键。终端1000可以接收按键输入，产生与终端1000的用户设置以及功能控制有关的键信号输入。
马达1091可以产生振动提示。马达1091可以用于来电振动提示，也可以用于触摸振动反馈。例如，作用于不同应用(例如拍照，音频播放等)的触摸操作，可以对应不同的振动反馈效果。作用于显示屏1094不同区域的触摸操作，马达1091也可对应不同的振动反馈效果。不同的应用场景(例如：时间提醒，接收信息，闹钟，游戏等)也可以对应不同的振动反馈效果。触摸振动反馈效果还可以支持自定义。
指示器1092可以是指示灯，可以用于指示充电状态，电量变化，也可以用于指示消息，未接来电，通知等。
SIM卡接口1095用于连接SIM卡。SIM卡可以通过插入SIM卡接口1095，或从SIM卡接口1095拔出，实现和终端1000的接触和分离。终端1000可以支持1个或N个SIM卡接口，N为大于1的正整数。SIM卡接口1095可以支持Nano-SIM卡，Micro SIM卡，SIM卡等。同一个SIM卡接口1095可以同时插入多张卡。所述多张卡的类型可以相同，也可以不同。SIM卡接口1095也可以兼容不同类型的SIM卡。SIM卡接口1095也可以兼 容外部存储卡。终端1000通过SIM卡和网络交互，实现通话以及数据通信等功能。
可理解，终端1000可以具有比图中所示的更多的或者更少的部件，可以组合两个或多个的部件，或者可以具有不同的部件配置。图中所示出的各种部件可以在包括一个或多个信号处理和/或专用集成电路在内的硬件、软件、或硬件和软件的组合中实现。
需要说明的是，在本申请的一个实施例中，所述终端包括图7所示的单板700，终端1000的移动通信模块1050和/或无线通信模块1060可以包括所述单板700中的射频前端电路702、导通单元704串联器件704以及射频后端电路706。
基于上述内容，本申请实施例提供了一种射频传导测试方法，可以应用于图4、图5及图6所示的射频传导测试系统中。请参阅图11，图11为本申请实施例提供的一种射频传导测试方法，所述方法包括但不限于以下步骤：
S1110：将射频测试针移向单板的第一焊盘。
具体地，将射频测试针移向单板的第一焊盘，以使所述第一焊盘上的测试信号传送到所述射频测试针进行测试；所述单板包括射频前端电路、射频后端电路、所述第一焊盘、第二焊盘和待焊接的串联器件；所述待焊接的串联器件为待焊接在所述第一焊盘和所述第二焊盘上的器件；所述第一焊盘与所述射频前端电路相连，所述第二焊盘与所述射频后端电路相连，所述射频前端电路与所述射频后端电路处于断开状态。
示例性的，将射频测试针402移向单板的第一焊盘40141，以使所述第一焊盘40141上的测试信号传送到所述射频测试针402进行测试，所述单板可以为图4、图5及图6中的单板401。
可理解，所述单板包括但不限于图4、图5以及图6所示的单板401，本申请对此不作限制。需要说明的是，需要将单板设置为工作状态才能进行射频传导测试(此时，单板中才有测试信号)，在实际测试中，还可以根据进行射频传导测试的具体要求对单板进行调整，已获得用于进行射频传导测试的测试信号。
还需要说明的是，在将射频测试针移向单板的第一焊盘后，所述单板的射频前端电路与所述射频后端电路处于断开状态，测试信号可以从所述第一焊盘上传送至射频测试针。可选的，所述射频测试针中的测试信号可以经过阻抗变换装置传送到射频测试仪器(如图4所示)，或者，所述射频测试针中的测试信号经过定向耦合器传送到射频测试仪器，再或者，所述射频测试针中的测试信号经过阻抗变换装置和定向耦合器传送到射频测试仪器(如图6所示)。在本申请的一个实施例中，当所述射频测试针中的测试信号经过阻抗变换装置和定向耦合器传送到射频测试仪器时，所述定向耦合器的直通输出端口与所述射频测试仪器的第一测量端口相连，所述定向耦合器的耦合输出端口与所述射频测试仪器的第二测量端口相连。
可理解，为了更好地将第一焊盘上的测试信号传送至射频测试针，可以将射频测试针和/或第一焊盘进行镀镍金处理，可选的，还可以将射频测试针和/或第一焊盘镀上其他材料，比如金、镍等。示例性的，在本申请的一个实施例中，将射频测试针移向单板的第一焊盘之后，射频测试针的第一部位与第一焊盘的第二部位相接触，测试信号由第一焊盘的第二 部位传送至射频测试针的第一部位，其中，所述第一部位和/或所述第二部位经过镀镍金处理。
需要说明的是，在本申请的一个实施例中，第一焊盘与第二焊盘的中心距离不小于0.254毫米(10密尔)且不大于2.54毫米(100密尔)，在本申请的其他实施例中，第一焊盘和第二焊盘的中心距离还可以为其他值，本申请对此不作限制。另外，第一焊盘与第二焊盘的尺寸和类型可以有多种形式，本申请对此不作限制。
S1120：移开射频测试针并进行补焊。
具体地，在射频传导测试完成后移开所述射频测试针，将所述串联器件补焊到所述第一焊盘和所述第二焊盘上，以使所述射频前端电路与所述射频后端电路处于连接状态，并得到完成射频传导测试后的单板。
可理解，所述补焊的方式包括但不限于低温回流焊、激光补焊等；所述完成射频传导测试后的单板包括但不限于图7和图8所示的单板。
需要说明的是，上述射频传导测试方法可以人为进行，也可以由自动化机器以及其他具有实现上述方法功能的设备完成，本申请对此不作限制。
还需要说明的是，上述射频传导测试方法可以应用于其他需要进行射频传导测试的模块或装置中，本申请对此不作限制。
在上述实施例中，对各个实施例的描述各有侧重，某个实施例中没有详述的部分，可以参见其他实施例的相关描述。
应理解，本文中涉及的第一、第二、第三、第四以及各种数字编号仅为描述方便进行的区分，并不用来限制本申请的范围。
应理解，本文中术语“和/或”，仅仅是一种描述关联对象的关联关系，表示可以存在三种关系，例如，A和/或B，可以表示：单独存在A，同时存在A和B，单独存在B这三种情况。另外，本文中字符“/”，一般表示前后关联对象是一种“或”的关系。
还应理解，在本申请的各种实施例中，上述各过程的序号的大小并不意味着执行顺序的先后，各过程的执行顺序应以其功能和内在逻辑确定，而不应对本申请实施例的实施过程构成任何限定。
本领域普通技术人员可以意识到，结合本文中所公开的实施例描述的各示例的单元及算法步骤，能够以电子硬件、或者计算机软件和电子硬件的结合来实现。这些功能究竟以硬件还是软件方式来执行，取决于技术方案的特定应用和设计约束条件。专业技术人员可以对每个特定的应用来使用不同方法来实现所描述的功能，但是这种实现不应认为超出本申请的范围。
所属领域的技术人员可以清楚地了解到，为描述的方便和简洁，上述描述的系统、装置和单元的具体工作过程，可以参考前述方法实施例中的对应过程，在此不再赘述。
在本申请所提供的几个实施例中，应该理解到，所揭露的系统、装置和方法，可以通过其他的方式实现。例如，以上所描述的装置实施例仅仅是示意性的，例如，所述单元的划分，仅仅为一种逻辑功能划分，实际实现时可以有另外的划分方式，例如多个单元或组件可以结合或者可以集成到另一个系统，或一些特征可以忽略，或不执行。另一点，所显 示或讨论的相互之间的耦合或直接耦合或通信连接可以是通过一些接口，装置或单元的间接耦合或通信连接，可以是电性，机械或其他的形式。
所述作为分离部件说明的单元可以是或者也可以不是物理上分开的，作为单元显示的部件可以是或者也可以不是物理单元，即可以位于一个地方，或者也可以分布到多个网络单元上。可以根据实际的需要选择其中的部分或者全部单元来实现本实施例方案的目的。
另外，在本申请各个实施例中的各功能单元可以集成在一个处理单元中，也可以是各个单元单独物理存在，也可以两个或两个以上单元集成在一个单元中。
所述功能如果以软件功能单元的形式实现并作为独立的产品销售或使用时，可以存储在一个计算机可读取存储介质中。基于这样的理解，本申请的技术方案本质上或者说对现有技术做出贡献的部分或者该技术方案的部分可以以软件产品的形式体现出来，该计算机软件产品存储在一个存储介质中，包括若干指令用以使得一台计算机设备(可以是个人计算机，服务器，或者网络设备等)执行本申请各个实施例所述方法的全部或部分步骤。而前述的存储介质包括：U盘、移动硬盘、只读存储器(Read-Only Memory，ROM)、随机存取存储器(Random Access Memory，RAM)、磁碟或者光盘等各种可以存储程序代码的介质。
本申请实施例方法中的步骤可以根据实际需要进行顺序调整、合并和删减。
本申请实施例装置中的模块可以根据实际需要进行合并、划分和删减。
以上所述，以上实施例仅用以说明本申请的技术方案，而非对其限制；尽管参照前述实施例对本申请进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例技术方案的范围。

Claims (11)

  1. 一种射频传导测试方法，其特征在于，所述方法包括：
    将射频测试针移向单板的第一焊盘，以使所述第一焊盘上的测试信号传送到所述射频测试针进行测试；所述单板包括射频前端电路、射频后端电路、所述第一焊盘、第二焊盘和待焊接的串联器件；所述待焊接的串联器件为待焊接在所述第一焊盘和所述第二焊盘上的器件；所述串联器件为串联连接其他元器件的一个或多个元器件；所述第一焊盘与所述射频前端电路相连，所述第二焊盘与所述射频后端电路相连，所述射频前端电路与所述射频后端电路处于断开状态；
    在测试完成后移开所述射频测试针，将所述串联器件补焊到所述第一焊盘和所述第二焊盘上，以使所述射频前端电路与所述射频后端电路处于连接状态；
    所述将射频测试针移向单板的第一焊盘之后，所述射频测试针中的测试信号经过阻抗变换装置和定向耦合器传送到射频测试仪器；
    所述定向耦合器的直通输出端口与所述射频测试仪器的第一测量端口相连，所述定向耦合器的耦合输出端口与所述射频测试仪器的第二测量端口相连。
  2. 如权利要求1所述的方法，其特征在于，所述射频测试针和/或所述第一焊盘经过镀镍金处理。
  3. 如权利要求2所述的方法，其特征在于，所述将射频测试针移向单板的第一焊盘之后，所述方法还包括：所述射频测试针的第一部位与所述第一焊盘的第二部位相接触；其中，所述第一部位和/或所述第二部位经过镀镍金处理。
  4. 如权利要求1-3任一项所述的方法，其特征在于，所述将所述串联器件补焊到所述第一焊盘和所述第二焊盘上，包括：
    采用低温回流焊或激光焊，将所述串联器件补焊到所述第一焊盘和所述第二焊盘上。
  5. 如权利要求4所述的方法，其特征在于，所述第一焊盘与所述第二焊盘的中心距离不小于0.254毫米且不大于2.54毫米。
  6. 一种射频传导测试系统，其特征在于，所述系统包括：单板、射频测试针、射频测试仪器；
    所述单板包括射频电路、第一焊盘和第二焊盘；所述射频电路包括射频前端电路和射频后端电路，所述第一焊盘与所述射频前端电路相连，所述第二焊盘与所述射频后端电路相连，所述射频前端电路与所述射频后端电路处于断开状态；所述第一焊盘和第二焊盘为待焊接在所述射频电路中的串联器件的焊盘；
    所述射频测试针用于将所述第一焊盘上的测试信号传送至所述射频测试仪器；
    所述射频测试仪器用于对所述测试信号进行测试；
    所述系统还包括阻抗变换装置和定向耦合器，所述阻抗变换装置与所述射频测试针和所述定向耦合器相连，所述定向耦合器还与所述射频测试仪器相连，所述阻抗变换装置用于将所述射频测试针上的所述测试信号传送至所述定向耦合器，所述定向耦合器用于将所述测试信号传送至所述射频测试仪器；
    所述定向耦合器的直通输出端口与所述射频测试仪器的第一测量端口相连，所述定向耦合器的耦合输出端口与所述射频测试仪器的第二测量端口相连。
  7. 如权利要求6所述的系统，其特征在于，所述射频测试针和/或所述第一焊盘经过镀镍金处理。
  8. 如权利要求7所述的系统，其特征在于，所述第一焊盘与所述第二焊盘的中心距离不小于0.254毫米且不大于2.54毫米。
  9. 一种射频传导测试装置，其特征在于，所述装置应用于射频传导测试，所述装置包括射频电路、第一焊盘和第二焊盘；所述射频电路包括射频前端电路和射频后端电路，所述第一焊盘与所述射频前端电路相连，所述第二焊盘与所述射频后端电路相连，所述射频前端电路与所述射频后端电路处于断开状态；所述第一焊盘和第二焊盘为待焊接在所述射频电路中的串联器件的焊盘；
    在进行射频传导测试的过程中，所述第一焊盘用于在射频测试针移向所述第一焊盘后，将测试信号传送到所述射频测试针；其中，所述射频测试针中的测试信号经过阻抗变换装置和定向耦合器传送到射频测试仪器；所述定向耦合器的直通输出端口与所述射频测试仪器的第一测量端口相连，所述定向耦合器的耦合输出端口与所述射频测试仪器的第二测量端口相连。
  10. 如权利要求9所述的装置，其特征在于，所述第一焊盘经过镀镍金处理。
  11. 如权利要求9或10所述的装置，其特征在于，所述第一焊盘与所述第二焊盘的中心距离不小于0.254毫米且不大于2.54毫米。
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