WO2022176566A1 - Dispositif électronique - Google Patents

Dispositif électronique Download PDF

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Publication number
WO2022176566A1
WO2022176566A1 PCT/JP2022/003267 JP2022003267W WO2022176566A1 WO 2022176566 A1 WO2022176566 A1 WO 2022176566A1 JP 2022003267 W JP2022003267 W JP 2022003267W WO 2022176566 A1 WO2022176566 A1 WO 2022176566A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
insulating plate
electronic device
plate portion
conductive housing
Prior art date
Application number
PCT/JP2022/003267
Other languages
English (en)
Japanese (ja)
Inventor
芸 鄭
淳史 細川
祥平 東谷
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to JP2023500685A priority Critical patent/JP7566122B2/ja
Priority to DE112022001101.7T priority patent/DE112022001101T5/de
Publication of WO2022176566A1 publication Critical patent/WO2022176566A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H05K7/142—Spacers not being card guides

Definitions

  • This disclosure relates to electronic equipment.
  • the insulating plate ensures insulation between the circuit board and the conductive housing.
  • the theoretical starting voltage of creeping discharge drops significantly. Therefore, if a voltage higher than the creeping discharge initiation voltage is applied, there is concern that creeping discharge may occur due to defects in the insulating plate (dirt, etc., as described above), eventually leading to dielectric breakdown. .
  • defects with low dielectric breakdown strength voids and gaps
  • dielectric breakdown occurs over a long period of time. Therefore, conventional electronic devices have room for improvement in terms of dielectric strength.
  • the present disclosure has been made to solve the above problems, and an object of the present disclosure is to provide an electronic device with improved dielectric strength.
  • An electronic device includes a conductive housing, a circuit board, and a connecting member.
  • the circuit board is spaced apart from the conductive housing.
  • the connection member connects the conductive housing and the circuit board.
  • the connecting member includes a first insulating plate portion, a first connecting portion, and a second connecting portion.
  • a first insulating plate portion is disposed between the conductive housing and the circuit board.
  • the first insulating plate portion extends along the circuit board.
  • the first insulating plate portion is spaced from both the conductive housing and the circuit board.
  • the first connecting portion is connected to the surface of the first insulating plate portion on the circuit board side in order to position the first insulating plate portion apart from the circuit board.
  • the second connecting portion is connected to the conductive housing-side surface of the first insulating plate portion in order to position the first insulating plate portion apart from the conductive housing.
  • the first connection portion and the second connection portion are arranged at different positions in a plan view viewed from the circuit board side.
  • FIG. 1 is a schematic cross-sectional view of an electronic device according to Embodiment 1;
  • FIG. 2 is a schematic perspective view of the electronic device shown in FIG. 1;
  • FIG. 2 is a schematic plan view of a circuit board that constitutes the electronic device shown in FIG. 1;
  • FIG. 2 is a schematic plan view of a first insulating plate portion constituting the electronic device shown in FIG. 1;
  • FIG. 2 is a schematic plan view of a second insulating plate portion constituting the electronic device shown in FIG. 1.
  • FIG. FIG. 2 is a schematic plan view of a conductive housing that constitutes the electronic device shown in FIG. 1;
  • 2 is a schematic cross-sectional view for explaining an insulation distance in the electronic device shown in FIG. 1;
  • FIG. 1 is a schematic cross-sectional view of an electronic device according to Embodiment 1;
  • FIG. 2 is a schematic perspective view of the electronic device shown in FIG. 1;
  • FIG. 2 is a schematic plan view of a circuit
  • FIG. 10 is a schematic cross-sectional view of an electronic device according to Embodiment 2;
  • FIG. 10 is a schematic perspective view of the electronic device shown in FIG. 9;
  • 10 is a schematic plan view of an insulating structure that constitutes the electronic device shown in FIG. 9.
  • FIG. FIG. 12 is a schematic side view of the insulating structure shown in FIG. 11;
  • FIG. 11 is a schematic cross-sectional view of an electronic device according to Embodiment 3;
  • 14 is a schematic perspective view of the electronic device shown in FIG. 13;
  • FIG. 14 is a schematic plan view of a first insulating structure that constitutes the electronic device shown in FIG. 13;
  • FIG. 16 is a schematic side view of the first insulating structure shown in FIG. 15;
  • FIG. 14 is a schematic side view of a second insulating structure that constitutes the electronic device shown in FIG. 13;
  • FIG. 12 is a schematic cross-sectional view of an electronic device according to Embodiment 4;
  • 19 is a schematic perspective view of the electronic device shown in FIG. 18;
  • FIG. FIG. 19 is a schematic plan view of a first insulating plate portion that constitutes the electronic device shown in FIG. 18;
  • 19 is a schematic plan view of a second insulating plate portion that constitutes the electronic device shown in FIG. 18.
  • FIG. FIG. 11 is a schematic cross-sectional view of an electronic device according to Embodiment 5;
  • 23 is a schematic perspective view of the electronic device shown in FIG.
  • FIG. 22 FIG. 23 is a schematic plan view of a first insulating plate portion constituting the electronic device shown in FIG. 22;
  • FIG. FIG. 23 is a schematic plan view of a conductive housing that constitutes the electronic device shown in FIG. 22;
  • FIG. 12 is a schematic perspective view of an electronic device according to Embodiment 6;
  • FIG. 27 is a schematic diagram for explaining a method of manufacturing the electronic device shown in FIG. 26;
  • FIG. 27 is a schematic diagram for explaining a method of manufacturing the electronic device shown in FIG. 26;
  • FIG. 12 is a schematic perspective view of an electronic device according to Embodiment 7;
  • 30 is a schematic diagram for explaining the configuration of the electronic device shown in FIG. 29;
  • FIG. 29 FIG.
  • FIG. 1 is a schematic cross-sectional view of an electronic device according to Embodiment 1.
  • FIG. 2 is a schematic perspective view of the electronic device shown in FIG. 1.
  • FIG. 3 is a schematic plan view of a circuit board that constitutes the electronic device shown in FIG.
  • FIG. 4 is a schematic plan view of a first insulating plate portion that constitutes the electronic device shown in FIG.
  • FIG. 5 is a schematic plan view of a second insulating plate portion that constitutes the electronic device shown in FIG.
  • FIG. 6 is a schematic plan view of a conductive housing that constitutes the electronic device shown in FIG.
  • the electronic equipment shown in FIGS. 1 to 6 mainly includes a conductive housing 5, a circuit board 1, and a connection member 50.
  • the circuit board 1 is spaced apart from the conductive housing 5 .
  • An electric/electronic component 6 is mounted on the circuit board 1 .
  • the connection member 50 connects the conductive housing 5 and the circuit board 1 .
  • the connecting member 50 includes an insulating plate 11 as a first insulating plate portion 51, spacers 21, 22, 23, and 24 as a first connecting portion 53, and a second connecting portion. It mainly includes spacers 31 , 32 , 33 , 34 as 54 , insulating plate 12 as second insulating plate portion 52 , and spacers 41 , 42 , 43 , 44 as third connecting portion 55 .
  • the insulating plate 11 as the first insulating plate portion 51 is arranged between the conductive housing 5 and the circuit board 1 .
  • the insulating plate 11 as the first insulating plate portion 51 extends along the circuit board 1 .
  • the insulating plate 11 as the first insulating plate portion 51 is spaced apart from both the conductive housing 5 and the circuit board 1 .
  • the spacers 21 , 22 , 23 , 24 connect the surface of the insulating plate 11 on the circuit board 1 side and the circuit board 1 in order to position the insulating plate 11 apart from the circuit board 1 .
  • Spacers 21, 22, 23, and 24 are connected to corners of circuit board 1, respectively. From a different point of view, the spacers 21 , 22 , 23 , 24 are connected to the outer periphery of the rectangular circuit board 1 .
  • the spacers 31 , 32 , 33 , 34 connect the surface of the insulating plate 11 on the side of the conductive housing 5 and the insulating plate 12 in order to position the insulating plate 11 apart from the conductive housing 5 .
  • the spacers 31 , 32 , 33 , and 34 are arranged at positions overlapping the circuit board 1 in plan view from the circuit board 1 side. Specifically, the spacers 31 , 32 , 33 , 34 are arranged so as to overlap an intermediate portion including the central portion 101 of the circuit board 1 in plan view.
  • the insulating plate 12 is spaced apart from the conductive housing 5 and the insulating plate 11 .
  • the spacers 41 , 42 , 43 , 44 are, for example, male-female spacers and position the insulating plate 12 away from the conductive housing 5 . and the housing 5 are connected.
  • the spacers 41 , 42 , 43 , 44 and the spacers 31 , 32 , 33 , 34 are arranged at different positions in plan view from the circuit board 1 side.
  • the spacers 21 , 22 , 23 , 24 and the spacers 31 , 32 , 33 , 34 are arranged at different positions in a plan view viewed from the circuit board 1 side. As shown in FIGS.
  • the spacers 21, 22, 23, 24 overlap the spacers 41, 42, 43, 44 in plan view from the circuit board 1 side.
  • the spacers 21, 22, 23, 24 and the spacers 41, 42, 43, 44 may be arranged so as not to overlap each other in plan view.
  • the spacers 21, 22, 23, 24, the spacers 31, 32, 33, 34, and the spacers 41, 42, 43, 44 are composed of resin members such as polyoxymethylene and nylon.
  • the shape of these spacers may be, for example, hexagonal or cylindrical.
  • the conductive housing 5 may be made of metal members such as iron and steel represented by iron and iron-based alloys, nonferrous metals such as aluminum and copper, and alloys containing these.
  • metal members such as iron and steel represented by iron and iron-based alloys, nonferrous metals such as aluminum and copper, and alloys containing these.
  • FIG. 6 in order to fix the spacers 41, 42, 43, 44 (see FIG. 2) at appropriate positions of the conductive housing 5, a suitable size for inserting fixing members such as rivets in advance. Pilot holes 241, 242, 243, 244 are formed.
  • Fixing members 761 , 762 , 763 , 764 for fixing spacers 41 , 42 , 43 , 44 are inserted into prepared holes 241 , 242 , 243 , 244 .
  • the fixing members 761, 762, 763 and 764 are crimped with a tool such as a riveter.
  • the fixing members 761, 762, 763, and 764 may be made of
  • the insulating plate 12 may be composed of a resin material such as epoxy resin, insulating paper, and a resin film.
  • screw holes 231 , 231 , 233 , 234 insertion holes through which screws 751 , 752 , 753 , 754 as fixtures can be inserted are formed at the four corners of the insulating plate 12 .
  • the screw holes 321, 232, 233, 324 through which the screws 741, 742, 743, 744 (fixtures) can be inserted are formed inside the insulating plate 12 apart from the screw holes 231, 232, 233, 234 described above.
  • the screw holes 321, 322, 323, and 324 are arranged on the inner peripheral side of the insulating plate 12 when viewed from the screw holes 231, 232, 233, and 234, respectively.
  • the linear distance to the screw through hole 234 is substantially the same.
  • the insulating plate 11 may be made of a resin material such as epoxy resin, insulating paper, a resin film, or the like, similar to the insulating plate 12 described above.
  • screw through holes 221, 222, 223, and 224 insertion holes
  • screws 721, 722, 723, and 724 see FIG. 2 as fixtures can be inserted are formed at the four corners of the insulating plate 11.
  • the screw through holes 311, 312, 313, 314 through which the screws 731, 732, 733, 734 (see FIG. 2) as fixtures can be inserted are provided in an insulating plate away from the screw through holes 221, 222, 223, 224 described above. 11 inside.
  • the screw holes 311, 312, 313 and 314 are arranged on the inner peripheral side of the insulating plate 11 when viewed from the screw holes 221, 222, 223 and 224, respectively.
  • the linear distance to the screw through hole 224 is substantially the same.
  • the circuit board 1 is made of printed board materials such as paper phenol and glass epoxy. As shown in FIG. 3, an electric/electronic component 6 is mounted on the circuit board 1 .
  • the outer peripheral portion of the circuit board 1 is formed with screw holes 211, 212, 213, and 214 (insertion holes) through which screws 711, 712, 713, and 714 (see FIG. 2) as fixtures can be inserted.
  • the planar shape of the circuit board 1 is rectangular.
  • the screw holes 211 , 212 , 213 and 214 are arranged at the four corners of the circuit board 1 .
  • the thickness of the circuit board 1 can be, for example, 0.4 mm or more and 3.2 mm or less.
  • the size of the circuit board 1 may be, for example, 10 mm or more and 550 mm or less in the vertical direction and 10 mm or more and 550 mm or less in the horizontal direction.
  • the male sides of the spacers 41, 42, 43 and 44 which are male and female spacers, are attached to portions of the conductive housing 5 where pilot holes 241, 242, 243 and 244 are formed by fixing members 761, 762, 763 and 764, respectively. Fixed.
  • the female sides of the spacers 41, 42, 43, 44 are fixed by screws 751, 752, 753, 754 to the four corners of the insulating plate 12 where the screw holes 231, 232, 233, 234 are formed.
  • One ends of the spacers 31, 32, 33, 34 are fixed by screws 741, 742, 743, 744 to regions of the insulating plate 12 where the screw holes 321, 322, 323, 324 are formed.
  • the other ends of the spacers 31, 32, 33, 34 are fixed by screws 731, 732, 733, 734 to regions of the insulating plate 11 where the screw holes 311, 312, 313, 314 are formed, respectively.
  • One ends of the spacers 21, 22, 23, 24 are fixed by screws 721, 722, 723, 724 to the four corners of the insulating plate 11, which are areas in which the screw holes 221, 222, 223, 224 are formed.
  • the other ends of the spacers 21, 22, 23, 24 are fixed by screws 711, 712, 713, 714 to the four corners of the circuit board 1 where the screw holes 211, 212, 213, 214 are formed. .
  • screws of any configuration can be used, but for example, they may be pan head machine screws.
  • the material constituting the screw described above may be metal such as iron, stainless steel, or brass, or may be resin.
  • the screws 751, 752, 753, 754 passed through the screw holes 231, 232, 233, 234 formed in the insulating plate 12 are inserted into the female sides of the spacers 41, 42, 43, 44, which are male and female spacers. conclude. As a result, the insulating plate 12 is fixed to the conductive housing 5 via the spacers 41, 42, 43, 44. As shown in FIG.
  • one ends of the spacers 21 , 22 , 23 and 24 are fixed to the insulating plate 11 by screws 721 , 722 , 723 and 724 passed through screw holes 221 , 222 , 223 and 224 formed in the insulating plate 11 .
  • Screws 731, 732, 733, 734 passed through screw holes 311, 312, 313, 314 formed in the insulating plate 11 are inserted into the other ends of the spacers 31, 32, 33, 34 fixed to the insulating plate 12.
  • the insulating plate 11 is fixed to the insulating plate 12 via the spacers 31, 32, 33 and 34. As shown in FIG.
  • the electronic device includes a conductive housing 5, a circuit board 1, and a connecting member 50.
  • the circuit board 1 is spaced apart from the conductive housing 5 .
  • the connection member 50 connects the conductive housing 5 and the circuit board 1 .
  • the connecting member 50 includes the insulating plate 11 as the first insulating plate portion 51, the spacers 21, 22, 23, and 24 as the first connecting portion 53, and the spacers 31, 32, 33, and 34 as the second connecting portion . including.
  • the insulating plate 11 as the first insulating plate portion 51 is arranged between the conductive housing 5 and the circuit board 1 .
  • the insulating plate 11 as the first insulating plate portion 51 extends along the circuit board 1 .
  • the insulating plate 11 as the first insulating plate portion 51 is spaced apart from both the conductive housing 5 and the circuit board 1 .
  • the spacers 21 , 22 , 23 , 24 as the first connecting portions 53 position the insulating plate 11 as the first insulating plate portion 51 with a gap from the circuit board 1 .
  • connected to the surface of The spacers 31, 32, 33, and 34 as the second connection portions 54 position the insulating plate 11 as the first insulating plate portion 51 with a gap from the conductive housing 5, so that the first insulating plate portion 51 is connected to the surface of the insulating plate 11 as the conductive housing 5 side.
  • the spacers 21 , 22 , 23 , 24 and the spacers 31 , 32 , 33 , 34 are arranged at different positions in a plan view viewed from the circuit board 1 side.
  • the connecting member 50 has the insulating plate 11, the spacers 21, 22, 23, 24 and the spacers 31, 32, 33, 34, and the spacers 21, 22, 23, 24 and the spacers 31, 32, 33 and 34 are arranged at different positions in plan view seen from the circuit board 1 side.
  • the creepage distance between the body 5 and the circuit board 1 can be increased. Therefore, a sufficient withstand voltage value can be obtained without increasing the size of the electronic device more than necessary. As a result, an electronic device with improved dielectric strength can be obtained.
  • the connecting member 50 includes the insulating plate 12 as the second insulating plate portion 52 and the spacers 41 , 42 , 43 and 44 as the third connecting portion 55 .
  • the insulating plate 12 as the second insulating plate portion 52 is arranged between the conductive housing 5 and the insulating plate 11 .
  • the insulating plate 12 is spaced apart from the conductive housing 5 and the insulating plate 11 .
  • the spacers 41 , 42 , 43 , and 44 as the third connecting portions 55 position the insulating plate 12 away from the conductive housing 5 , so that the surface of the insulating plate 12 on the side of the conductive housing 5 and the conductive housing 5 are electrically conductive. and the housing 5 are connected.
  • Spacers 21 , 22 , 23 and 24 connect the surface of insulating plate 11 on the circuit board 1 side and circuit board 1 .
  • the spacers 41 , 42 , 43 , 44 connect the surface of the insulating plate 11 on the side of the conductive housing 5 and the insulating plate 12 .
  • the spacers 41 , 42 , 43 , 44 and the spacers 31 , 32 , 33 , 34 are arranged at different positions in plan view from the circuit board 1 side.
  • connection member 50 further includes the insulating plate 12 and the spacers 41, 42, 43, 44, so that the creepage distance between the conductive housing 5 and the circuit board 1 can be further increased.
  • the spacers 31, 32, 33, and 34 as the second connecting portion 54 are the spacers 21, 22, 23, and 24 as the first connecting portion 53, and the spacers 21, 22, 23, and 24 as the first 3 located on the central portion 101 side of the circuit board 1 when viewed from the spacers 41 , 42 , 43 , 44 as the connecting portions 55 .
  • the spacers 31, 32, 33, and 34 are arranged on the side opposite to the central portion 101 side of the circuit board 1 when viewed from the spacers 21, 22, 23, and 24 and the spacers 41, 42, 43, and 44 Further, the area occupied by the electronic device can be reduced. In other words, it is possible to suppress an increase in the area occupied by the electronic device.
  • the spacers 21, 22, 23, and 24 as the first connecting portion 53 and the spacers 41, 42, 43, and 44 as the third connecting portion 55 overlap in a plan view viewed from the circuit board 1 side. ing.
  • the occupied area of the electronic device can be made smaller than when the spacers 21, 22, 23, 24 and the spacers 41, 42, 43, 44 are arranged at different positions in plan view.
  • the spacers 31, 32, 33, and 34 as the second connection portions 54 are arranged at positions overlapping the circuit board 1 in a plan view viewed from the circuit board 1 side.
  • the area under the circuit board 1 can be used as a space for arranging the spacers 31, 32, 33, 34, the size of the electronic device can be reduced.
  • a plurality of insulating plates 11 and 12 are interposed between the circuit board 1 and the conductive housing 5 to secure the creepage distance. can reduce the extra spatial distance of Therefore, it is possible to reduce the size of the electronic device. Further, the positions of the spacers 31, 32, 33 and 34 which are the second spacers in a plan view are changed to the positions of the spacers 21, 22, 23 and 24 which are the first spacers and the spacers 41, 42, 43 and 43 which are the third spacers. By shifting from the position of 44, the vibration resistance of the electronic device is improved.
  • the circuit board 1 and the insulating plates 11 and 12 are mechanically fixed with a gap between them via spacers. Therefore, since an air layer is interposed between the insulating plates 11 and 12 and the circuit board 1, the possibility of occurrence of void discharge or creeping discharge in the connection member 50 can be reduced.
  • FIG. 7 is a schematic cross-sectional view for explaining insulation distances in the electronic device shown in FIG.
  • FIG. 8 is a schematic cross-sectional view of an electronic device as a reference example.
  • a circuit board 1001 on which electric/electronic components 1006 are mounted is fixed to a conductive housing 1005 via spacers 1020 that are rod-shaped insulating spacers.
  • the insulating distance between the circuit board 1001 and the conductive housing 1005 is maintained by the length L of the spacer 1020 .
  • the insulation distance includes the clearance distance and the creepage distance along the surface of the insulator.
  • JEM1103 which is a standard for insulation distances for control equipment, requires a clearance distance of 60 mm and a creepage distance of 90 mm or more when the voltage applied to the circuit board is 3.6 kV to 7.2 kV. Therefore, in the electronic device as a reference example shown in FIG. However, it is necessary to set the length L of the spacer 1020 to at least 90 mm. If the spatial distance is 60 mm or more, a sufficient insulation distance can be ensured. had become
  • a configuration can be adopted in which the circuit board 1001 and the conductive housing 1005 are fixed via an insulator.
  • the creepage distance between the circuit board 1001 and the conductive housing 1005 can be ensured by the uneven structure of the insulator surface. Therefore, the creepage distance can be secured with an insulator shorter in length than a general spacer.
  • the larger the creepage distance is to be secured the larger the size of the insulator must be.
  • the size of the insulator is large, the mounting area of the circuit board 1001 will be reduced. In order to secure the mounting area of the circuit board 1001, the size of the circuit board 1001 is further increased. Due to this vicious cycle, there is also a problem that the size of the electrical equipment increases.
  • the resonance frequency of the circuit board 1001 may be low. Therefore, there is a high possibility that the resonance frequency of the circuit board 1001 will fall within the vibration frequency band of the structure of the electronic device.
  • the amplitude of heavy objects such as electronic components mounted on the circuit board 1001 may be amplified. As a result, the circuit board 1001 vibrates violently, and the circuit board 1001 may be destroyed by the vibration.
  • vibration of the circuit board 1001 can occur in three directions.
  • Breakage due to vibration of the circuit board 1001 on which a heavy object is mounted as described above is, for example, breakage of a connecting portion between a terminal of a heavy electronic component such as a transformer, a capacitor, or a reactor and the circuit board 1001. and breakage of terminals.
  • a heavy electronic component such as a transformer, a capacitor, or a reactor
  • Patent Document 1 In order to solve the above problems, in the structure of Patent Document 1, by inserting a solid insulating material such as an insulating plate between the circuit board 1001 and the conductive housing 1005, the circuit board 1001 and the conductive case 1005 are electrically conductive.
  • the housing 1005 is insulated.
  • Imperfections (voids or voids) in the solid insulating material can result in small gaps between the solid insulating material and the circuit board 1001 .
  • a high voltage is applied to the circuit board 1001
  • partial discharge can occur if there are minute defects such as voids in the solid insulating material. This can result in degradation of the solid insulating material and eventual destruction of the solid insulating material.
  • the solid insulating material itself contains impurities, the theoretical starting voltage of creeping discharge may be remarkably lowered. In this case, if a voltage higher than the creeping discharge initiation voltage is applied to the circuit board 1001, a creeping discharge occurs due to defects in the solid insulating material, which may eventually lead to dielectric breakdown in the electronic device.
  • the circuit board 1 and the Spatial distance and creepage distance with the conductive housing 5 are ensured.
  • an air layer is interposed between the insulating plates 11 and 12 and the circuit board 1, the risk of void discharge and creeping discharge as in the electronic device disclosed in Patent Document 1 is reduced.
  • the distance between the electrical/electronic component 6 (or the metal wiring pattern to which the electrical/electronic component 6 is connected) on the circuit board 1 and the screw 713 is defined as the shortest distance.
  • the length be f.
  • the distance between the circuit board 1 and the insulating plate 11, that is, the length of the spacer 23 is defined as length a.
  • Let b be the distance between the screw 723 and the spacer 33 .
  • the distance between the insulating plate 11 and the insulating plate 12, that is, the length of the spacer 33 is defined as length c.
  • d be the distance between the spacer 33 and the screw 753 (see FIG. 2).
  • the distance between the insulating plate 12 and the conductive housing 5, that is, the length of the spacer 43 is defined as length e.
  • the shortest creepage distance from the metal wiring pattern of the circuit board 1 to the conductive housing 5 via the spacer 23, the insulating plate 11, the spacer 33, the insulating plate 12, and the spacer 43 is length (f+a+b+c+d+e). becomes.
  • the configuration of the electronic device of the present disclosure can be determined so that the shortest creepage distance is greater than or equal to the creepage distance required by the standard.
  • the insulation performance (withstand voltage value) of the electronic device shown in FIG. 7 is proportional to the shortest creepage distance described above. That is, by increasing the shortest creepage distance, the withstand voltage value of the electronic device can be increased.
  • the long spacer 1020 for ensuring the creepage distance as shown in FIG. 8 is divided.
  • a plurality of insulating plates 11 and 12 are arranged between the circuit board 1 and the conductive housing 5 via a plurality of spacers so as to be spaced apart from each other.
  • the spacers 31, 32, 33, 34 for fixing the insulating plate 11 and the insulating plate 12 are arranged inside the circuit board 1 ( (region side including the central portion 101). Therefore, the natural frequency of the circuit board 1 is increased, and the vibration resistance of the circuit board 1 is improved.
  • the wiring pattern area of the circuit board 1 and the component area where the electric/electronic component 6 is mounted have a structure in which outside air flows.
  • the electronic device is excellent in heat dissipation of the electric/electronic component 6 .
  • FIG. 9 is a schematic cross-sectional view of an electronic device according to Embodiment 2.
  • FIG. 10 is a schematic perspective view of the electronic device shown in FIG. 9.
  • FIG. 11 is a schematic plan view of an insulating structure that constitutes the electronic device shown in FIG. 9.
  • FIG. 12 is a schematic side view of the insulating structure shown in FIG. 11.
  • FIG. 10 is a schematic cross-sectional view of an electronic device according to Embodiment 2.
  • FIG. 10 is a schematic perspective view of the electronic device shown in FIG. 9.
  • FIG. 11 is a schematic plan view of an insulating structure that constitutes the electronic device shown in FIG. 9.
  • FIG. 12 is a schematic side view of the insulating structure shown in FIG. 11.
  • the electronic devices shown in FIGS. 9 to 12 basically have the same configuration as the electronic devices shown in FIGS. 1 and 2 and can obtain similar effects. configuration is different from the electronic device shown in FIGS. 9 to 12, the connection member 50 includes a first flat plate portion 161, a second flat plate portion 162, upper convex portions 16a, 16b, 16c, and 16d, a central portion 16i, and a lower convex portion.
  • An insulating structure 16 in which 16e, 16f, 16g and 16h are integrated is used.
  • any material can be used as long as it has insulating properties.
  • a resin material can be used.
  • the resin material for example, ABS (acrylonitrile-butadiene-styrene) resin, photocurable acrylic resin, or the like can be used.
  • the insulating structure 16 can be manufactured using a mold, for example.
  • the first flat plate portion 161 and the second flat plate portion 162 are arranged to face each other.
  • the first flat plate portion 161 and the second flat plate portion 162 are arranged so as to extend parallel to each other.
  • the first flat plate portion 161 and the second flat plate portion 162 are arranged so as to extend along the surface of the circuit board 1 .
  • a central portion 16 i is arranged to connect the central portion of the first flat plate portion 161 and the central portion of the second flat plate portion 162 .
  • the planar shape of the first flat plate portion 161 is quadrilateral.
  • Upper convex portions 16 a , 16 b , 16 c and 16 d are formed at the four corners of the first flat plate portion 161 .
  • the upper protrusions 16a, 16b, 16c, and 16d are formed to extend from the surface of the first flat plate portion 161 toward the circuit board 1, respectively.
  • the planar shape of the second flat plate portion 162 is rectangular.
  • Lower protrusions 16 e , 16 f , 16 g , and 16 h are formed at the four corners of the second flat plate portion 162 .
  • the lower protrusions 16e, 16f, 16g, and 16h are formed to extend from the surface of the second flat plate portion 162 toward the conductive housing 5, respectively.
  • the upper protrusions 16a, 16b, 16c, 16d and the lower protrusions 16e, 16f, 16g, 16h may have any shape, but may be, for example, a quadrangular prism.
  • the shape of the upper protrusions 16a, 16b, 16c, 16d and the lower protrusions 16e, 16f, 16g, 16h may be polygonal columnar or columnar.
  • the first flat plate portion 161 includes a region connected to the central portion 16i and extension portions 161a and 161b extending outward from the region.
  • the upper projections 16a and 16c are formed at the ends of the extending portion 161a opposite to the central portion 16i side.
  • the upper protrusions 16b and 16d are formed at the ends of the extending portion 161b opposite to the central portion 16i side.
  • the second flat plate portion 162 includes a region connected to the central portion 16i and extension portions 162a and 162b extending outward from the region.
  • the lower projections 16e and 16g are formed at the ends of the extending portion 162a opposite to the central portion 16i side.
  • the lower protrusions 16f and 16h are formed at the ends of the extending portion 162b opposite to the central portion 16i side.
  • the width of the central portion 16i and the widths of the first flat plate portion 161 and the second flat plate portion 162 in the direction crossing the direction from the extension portion 161a to the extension portion 161b are substantially equal.
  • the width of the central portion 16i may be narrower or wider than the widths of the first flat plate portion 161 and the second flat plate portion 162. As shown in FIG.
  • the upper protrusions 16a, 16b, 16c, and 16d have screw through holes 16aa, 16bb, through which screws 711, 712, 713, and 714 (see FIG. 10) can be inserted.
  • 16cc and 16dd are formed.
  • Screw holes (insertion holes) through which fixing members 761, 762, 763 and 764 (see FIG. 2), which are screws, can be inserted are formed in the lower projections 16e, 16f, 16g and 16h.
  • the distance between the electrical/electronic component 6 (or the metal wiring pattern to which the electrical/electronic component 6 is connected) and the screw 713 on the circuit board 1 is the shortest distance, and this distance is the length f and
  • the distance between the circuit board 1 and the first flat plate portion 161, that is, the length of the upper convex portion 16c is defined as length a.
  • c be the distance between the first flat plate portion 161 and the second flat plate portion 162, that is, the length of the side surface of the central portion 16i.
  • the distance between the central portion 16i and the lower convex portion 16g be the length d.
  • the distance between the second flat plate portion 162 and the conductive housing 5, that is, the length of the lower convex portion 16g is defined as length e.
  • the shortest creepage distance is length (f+a+b+c+d+e).
  • the configuration of the electronic device of the present disclosure can be determined so that the shortest creepage distance is greater than or equal to the creepage distance required by the standard.
  • the insulation performance (withstand voltage value) of the electronic device shown in FIG. 9 is proportional to the shortest creepage distance described above. That is, by increasing the shortest creepage distance, the withstand voltage value of the electronic device can be increased.
  • An electronic device includes a conductive housing 5 , a circuit board 1 , and an insulating structure 16 as a connection member 50 .
  • the circuit board 1 is spaced apart from the conductive housing 5 .
  • the insulating structure 16 connects the conductive housing 5 and the circuit board 1 .
  • the insulating structure 16 includes a first flat plate portion 161 as a first insulating plate portion 51, upper convex portions 16a, 16b, 16c, and 16d as first connecting portions 53, and a central portion 16i as a second connecting portion 54. including.
  • the first flat plate portion 161 is arranged between the conductive housing 5 and the circuit board 1 .
  • the first flat plate portion 161 extends along the circuit board 1 .
  • the first flat plate portion 161 is spaced apart from both the conductive housing 5 and the circuit board 1 .
  • the upper projections 16a, 16b, 16c, and 16d as the first connection portions 53 position the first flat plate portion 161 with a gap from the circuit board 1, so that the surface of the first flat plate portion 161 on the circuit board 1 side connected to
  • the central portion 16i as the second connection portion 54 is connected to the surface of the first flat plate portion 161 on the side of the conductive housing 5 in order to position the first flat plate portion 161 apart from the conductive housing 5.
  • the upper convex portions 16a, 16b, 16c, 16d and the central portion 16i are arranged at different positions in a plan view viewed from the circuit board 1 side.
  • the connection member 50 includes the second flat plate portion 162 as the second insulating plate portion 52 and the lower protrusions 16 e , 16 f , 16 g and 16 h as the third connection portion 55 .
  • the second flat plate portion 162 is arranged between the conductive housing 5 and the first flat plate portion 161 .
  • the second flat plate portion 162 is spaced apart from the conductive housing 5 and the first flat plate portion 161 . Since the lower projections 16e, 16f, 16g, and 16h position the second flat plate portion 162 with a gap from the conductive housing 5, the surface of the second flat plate portion 162 on the side of the conductive housing 5 is electrically conductive. It connects with the housing 5 .
  • the upper protrusions 16 a , 16 b , 16 c , and 16 d serving as the first connecting portions 53 connect the surface of the first flat plate portion 161 on the circuit board 1 side and the circuit board 1 .
  • the center portion 16 i connects the surface of the first flat plate portion 161 on the side of the conductive housing 5 and the second flat plate portion 162 .
  • the lower convex portions 16e, 16f, 16g, 16h and the central portion 16i are arranged at different positions in a plan view viewed from the circuit board 1 side.
  • the central portion 16i as the second connection portion 54 includes the upper convex portions 16a, 16b, 16c and 16d as the first connection portion 53 and the third connection portion. It is positioned on the central portion 101 side of the circuit board 1 when viewed from the lower projections 16 e , 16 f , 16 g and 16 h as 55 .
  • the central portion 16i as the second connection portion 54 is arranged at a position overlapping the circuit board 1 in a plan view viewed from the circuit board 1 side.
  • the connecting member 50 includes the first flat plate portion 161, the second flat plate portion 162, the upper convex portions 16a, 16b, 16c, and 16d, the central portion 16i, and the lower convex portions 16e, 16f, 16g, and 16h.
  • a configured insulating structure 16 is configured to cover the first flat plate portion 161, the second flat plate portion 162, the upper convex portions 16a, 16b, 16c, and 16d, the central portion 16i, and the lower convex portions 16e, 16f, 16g, and 16h.
  • the same effect as the electronic device according to the first embodiment can be obtained.
  • the same function as the connection member 50 made up of a plurality of members in the first embodiment can be achieved. Since the structure having the structure can be realized, the manufacturing process of the electronic device can be simplified. That is, the manufacturing cost can be reduced by reducing the number of manufacturing steps of the electronic device.
  • the connection member 50 is a single member, the rigidity of the connection member 50 can be increased. Therefore, the natural frequency of the circuit board 1 in the electronic device can be increased, and as a result, the vibration resistance of the circuit board 1 can be improved.
  • Embodiment 3. ⁇ Configuration of electronic device> 13 is a schematic cross-sectional view of an electronic device according to Embodiment 3.
  • FIG. 14 is a schematic perspective view of the electronic device shown in FIG. 13.
  • FIG. 15 is a schematic plan view of a first insulating structure constituting the electronic device shown in FIG. 13.
  • FIG. 16 is a schematic side view of the first insulating structure shown in FIG. 15.
  • FIG. 17 is a schematic side view of a second insulating structure that constitutes the electronic device shown in FIG. 13.
  • FIG. 13 is a schematic cross-sectional view of an electronic device according to Embodiment 3.
  • FIG. 14 is a schematic perspective view of the electronic device shown in FIG. 13.
  • FIG. 15 is a schematic plan view of a first insulating structure constituting the electronic device shown in FIG. 13.
  • FIG. 16 is a schematic side view of the first insulating structure shown in FIG. 15.
  • FIG. 17 is a schematic side view of a second insulating structure that constitute
  • the electronic equipment shown in FIGS. 13 to 17 basically has the same configuration as the electronic equipment shown in FIGS. configuration is different from the electronic equipment shown in FIGS. 13 to 17, the connection member 50 mainly has the first insulating structure 17, the second insulating structure 18, and the spacers 31, 32, 33, 34.
  • the first insulating structure 17 is an insulating structure in which the first flat plate portion 161 and the upper protrusions 16a, 16b, 16c, and 16d of the second embodiment are integrally formed.
  • the second insulating structure 18 is an insulating structure in which the second flat plate portion 162 and the downward protrusions 16e, 16f, 16g, and 16h of the second embodiment are integrally formed.
  • the spacers 31, 32, 33, 34 correspond to the central portion 16i (see FIG. 10) of the second embodiment.
  • the configurations of the spacers 31, 32, 33, 34 are the same as the configurations of the spacers 31, 32, 33, 34 of the electronic device according to the first embodiment.
  • the connection portions between spacers 31, 32, 33, and 34 and first insulating structure 17 and second insulating structure 18 are configured in the same manner as spacers 31, 32, 33, and 34 and insulating plates 11 and 12 in the first embodiment. It is the same as the configuration of the connecting part.
  • the first insulating structure 17 includes a first insulating plate portion 51 and convex portions 17a, 17b, 17c and 17d.
  • the planar shape of the first insulating plate portion 51 in the first insulating structure 17 is rectangular.
  • Protrusions 17 a , 17 b , 17 c , and 17 d are formed at the four corners of the first insulating plate portion 51 .
  • the protrusions 17a, 17b, 17c, and 17d extend from the surface of the first insulating plate portion 51 so as to protrude toward the circuit board 1 side.
  • the shape of the projections 17a, 17b, 17c, and 17d can be any shape, but is, for example, a quadrangular prism shape.
  • the shape of the protrusions 17a, 17b, 17c, and 17d may be polygonal columnar or columnar.
  • any material can be used as long as it has insulating properties.
  • a resin material can be used.
  • the resin material for example, ABS resin, photocurable acrylic resin, or the like can be used.
  • the first insulating structure 17 and the second insulating structure 18 can be produced using a mold, for example.
  • the protrusions 17a, 17b, 17c, and 17d of the first insulating structure 17 have screw through holes 17aa and 17bb through which screws 711, 712, 713, and 714 as fixtures can be inserted. , 17cc and 17dd are formed.
  • screws 731, 732, 733, and 734 can be inserted as fasteners in the central region inside the projections 17a, 17b, 17c, and 17d. Screw holes 311, 312, 313 and 314 are formed.
  • Each screw through hole 311, 312, 313, 314 is formed inside each projection 17a, 17b, 17c, 17d.
  • a straight line distance from the screw hole 311 to the projection 17a, a straight line distance from the screw hole 312 to the projection 17b, a straight line distance from the screw hole 313 to the projection 17c, and a screw hole 314 to the projection 17d. is the same as the straight-line distance to
  • the second insulating structure 18 has the same configuration as the first insulating structure 17, and is the first insulating structure 17 inverted 180 degrees.
  • projections 18a, 18b, 18c, and 18d are formed at the four corners of the second insulating plate portion 52.
  • Screw holes through which fixing members 761, 762, 763, and 764 (see FIGS. 2 and 13) can be inserted are formed in the projections 18a, 18b, 18c, and 18d.
  • screws 741, 742, 743, and 744 can be inserted as fasteners in the central region inside the projections 18a, 18b, 18c, and 18d.
  • Four screw holes are formed.
  • the positional relationship between the screw holes and the protrusions 18a, 18b, 18c, and 18d is the relationship between the screw holes 311, 312, 313, and 314 in the first insulating structure 17 and the protrusions 17a, 17b, 17c, and 17d. is similar to
  • the shortest distance between the electrical/electronic component 6 (or the metal wiring pattern to which the electrical/electronic component 6 is connected) and the screw 713 on the circuit board 1 is defined as the length f. .
  • the distance between the circuit board 1 and the first insulating plate portion 51, that is, the length of the projection 17c is defined as length a.
  • the distance between the first insulating plate portion 51 and the second insulating plate portion 52, that is, the length of the spacer 33 is defined as length c.
  • the distance between the spacer 33 and the convex portion 18c be the length d.
  • the distance between the second insulating plate portion 52 and the conductive housing 5, that is, the length of the projection 18c is defined as length e.
  • the shortest distance from the metal wiring pattern of the circuit board 1 to the conductive housing 5 via the convex portion 17c, the first insulating plate portion 51, the spacer 33, the second insulating plate portion 52, and the convex portion 18c The creepage distance is length (f+a+b+c+d+e).
  • the configuration of the electronic device of the present disclosure can be determined so that the shortest creepage distance is greater than or equal to the creepage distance required by the standard.
  • the insulation performance (withstand voltage value) of the electronic device shown in FIG. 13 is proportional to the shortest creepage distance described above. That is, by increasing the shortest creepage distance, the withstand voltage value of the electronic device can be increased.
  • the electronic device includes a conductive housing 5, a circuit board 1, and a connecting member 50.
  • the circuit board 1 is spaced apart from the conductive housing 5 .
  • the connection member 50 connects the conductive housing 5 and the circuit board 1 .
  • the connection member 50 includes a first insulating plate portion 51 , projections 17 a , 17 b , 17 c and 17 d as first connection portions 53 and spacers 31 , 32 , 33 and 34 as second connection portions 54 .
  • the first insulating plate portion 51 is arranged between the conductive housing 5 and the circuit board 1 .
  • the first insulating plate portion 51 extends along the circuit board 1 .
  • the first insulating plate portion 51 is spaced apart from both the conductive housing 5 and the circuit board 1 .
  • the convex portions 17a, 17b, 17c, and 17d as the first connecting portions 53 are connected to the surface of the insulating plate 11 on the circuit board 1 side in order to position the first insulating plate portion 51 apart from the circuit board 1. be done.
  • the spacers 31 , 32 , 33 , 34 as the second connecting portions 54 position the first insulating plate portion 51 apart from the conductive housing 5 , so that the conductive housing of the first insulating plate portion 51 5 side surface.
  • the projections 17a, 17b, 17c, 17d and the spacers 31, 32, 33, 34 are arranged at different positions in plan view from the circuit board 1 side.
  • the connection member 50 includes the second insulating plate portion 52 and the projections 18 a, 18 b, 18 c, and 18 d as the third connection portion 55 .
  • the second insulating plate portion 52 is arranged between the conductive housing 5 and the first insulating plate portion 51 .
  • the second insulating plate portion 52 is spaced apart from the conductive housing 5 and the first insulating plate portion 51 .
  • the protrusions 18 a , 18 b , 18 c , and 18 d as the third connecting portions 55 position the second insulating plate portion 52 apart from the conductive housing 5 , so that the conductive housing of the second insulating plate portion 52 The surface on the body 5 side and the conductive housing 5 are connected.
  • the convex portions 17 a , 17 b , 17 c , and 17 d as the first connecting portions 53 connect the surface of the first insulating plate portion 51 on the circuit board 1 side and the circuit board 1 .
  • the spacers 31 , 32 , 33 , 34 as the second connecting portions 54 connect the surface of the first insulating plate portion 51 on the side of the conductive housing 5 and the second insulating plate portion 52 .
  • the protrusions 18a, 18b, 18c, and 18d as the third connection portions 55 and the spacers 31, 32, 33, and 34 as the second connection portions 54 are arranged at different positions in a plan view viewed from the circuit board 1 side. be.
  • the spacers 31, 32, 33, and 34 as the second connection portions 54 have the protrusions 17a, 17b, 17c, and 17d as the first connection portions 53 and It is positioned on the central portion 101 side of the circuit board 1 when viewed from the projections 18 a , 18 b , 18 c , and 18 d as the third connection portion 55 .
  • the projections 17a, 17b, 17c, and 17d as the first connection portion 53 and the projections 18a, 18b, 18c, and 18d as the third connection portion 55 are overlapping.
  • the spacers 31, 32, 33, and 34 as the second connection portions 54 are arranged at positions overlapping the circuit board 1 in a plan view viewed from the circuit board 1 side.
  • the first insulating plate portion 51 and the convex portions 17a, 17b, 17c, and 17d as the first connection portions 53 are the first insulating structure 17 integrally formed.
  • the second insulating plate portion 52 and the projections 18a, 18b, 18c, and 18d as the third connecting portions 55 are integrally formed with the second insulating structure 18.
  • the shape of the first insulating structure 17 and the shape of the second insulating structure 18 may be the same.
  • the same effect as the electronic device according to the first embodiment can be obtained. Further, by arranging the first insulating structure 17 and the second insulating structure having the same configuration and the spacers 31, 32, 33, 34 between the circuit board 1 and the conductive housing 5, the Since a structure having the same function as the connection member 50 made up of a plurality of members in Embodiment 1 can be realized, the manufacturing process of the electronic device can be simplified. That is, by reducing the number of manufacturing processes compared to the manufacturing process of the electronic device according to the first embodiment, the manufacturing cost of the electronic device can be reduced.
  • the rigidity of the connection member 50 can be increased as compared with the electronic device of the first embodiment. Therefore, the natural frequency of the circuit board 1 in the electronic device can be increased, and as a result, the vibration resistance of the circuit board 1 can be improved.
  • the first insulating structure 17 and the second insulating structure 18 described above have the same configuration, they can be manufactured using the same mold. Therefore, the manufacturing cost of the electronic device can be reduced as compared with the case where a plurality of members having different shapes are used as the connection member 50 .
  • the configurations of the first insulating structure 17 and the second insulating structure 18 are simpler in shape than the configuration of the insulating structure 16 in the second embodiment, it is possible to reduce the manufacturing cost of the mold used for manufacturing.
  • Embodiment 4. ⁇ Configuration of electronic device> 18 is a schematic cross-sectional view of an electronic device according to Embodiment 4.
  • FIG. 19 is a schematic perspective view of the electronic device shown in FIG. 18.
  • FIG. 20 is a schematic plan view of a first insulating plate portion that constitutes the electronic device shown in FIG.
  • FIG. 21 is a schematic plan view of a second insulating plate portion that constitutes the electronic device shown in FIG.
  • the electronic devices shown in FIGS. 18 to 21 basically have the same configuration as the electronic devices shown in FIGS. 1 and 2 and can obtain similar effects. configuration is different from the electronic device shown in FIGS. 18 to 21, the size of the insulating plates 11 and 12 is larger than the size of the circuit board 1 in plan view. 18 and 19, supports 91, 92, 93, 94, 81, 82, 83, 84, 71, 72, 73, 74 are used in place of the spacers shown in FIG. there is Furthermore, as shown in FIG. 19, the positions of the supports 91, 92, 93, 94 and the positions of the supports 71, 72, 73, 74 in plan view are different.
  • the materials and shapes of the supports 91, 92, 93, 94, 81, 82, 83, 84, 71, 72, 73, and 74 may be the same as the materials and shapes of the spacers of the electronic device in the first embodiment. good.
  • the lengths of the supports 91, 92, 93, 94, 81, 82, 83, 84, 71, 72, 73, 74 may be shorter than the spacers in the first embodiment.
  • the insulating plate 12 has screw holes 231, 231, 233, and 234 (insertion holes) through which screws 751, 752, 753, and 754 (see FIGS. 2 and 19) can be inserted. formed at the four corners.
  • the screw through holes 321, 232, 233, 324 through which the screws 741, 742, 743, 744 (see FIG. 2) as fixtures can be inserted are provided in an insulating plate away from the screw through holes 231, 232, 233, 234 described above. 12 is formed inside.
  • the screw holes 321, 322, 323, and 324 are arranged on the inner peripheral side of the insulating plate 12 when viewed from the screw holes 231, 232, 233, and 234, respectively.
  • the linear distance to the screw through hole 234 is substantially the same. 21 is longer than the corresponding linear distance in the insulating plate 12 shown in FIG.
  • screw holes 221, 222, 223, and 224 (insertion holes) through which screws 721, 722, 723, and 724 (see FIG. 19) as fixtures can be inserted are separated from the four corners of the insulating plate 11. It is formed in a region closer to the central part.
  • the screw through holes 311, 312, 313, 314 through which the screws 731, 732, 733, 734 (see FIG. 2) as fixtures can be inserted are provided in an insulating plate away from the screw through holes 221, 222, 223, 224 described above. 11 is formed further inside.
  • the screw holes 311, 312, 313, 314 are arranged on the inner peripheral side of the insulating plate 11 when viewed from the screw holes 221, 222, 223, 224, respectively.
  • the linear distance to the screw through hole 224 is substantially the same.
  • the shortest distance between the electrical/electronic component 6 (or the metal wiring pattern to which the electrical/electronic component 6 is connected) and the screw 713 on the circuit board 1 is defined as the length f. .
  • the distance between the circuit board 1 and the insulating plate 11, that is, the length of the support 93 is defined as length a.
  • the distance between the support 83 and the screw 753 be length d.
  • the distance between the insulating plate 12 and the conductive housing 5, that is, the length of the support 73 is defined as length e.
  • the shortest creepage distance from the metal wiring pattern of the circuit board 1 to the conductive housing 5 via the support 93, the insulating plate 11, the support 83, the insulating plate 12, and the support 73 is length (f+a+b+c+d+e).
  • the configuration of the electronic device of the present disclosure can be determined so that the shortest creepage distance is greater than or equal to the creepage distance required by the standard.
  • the insulation performance (withstand voltage value) of the electronic device shown in FIG. 18 is proportional to the shortest creepage distance described above. That is, by increasing the shortest creepage distance, the withstand voltage value of the electronic device can be increased.
  • the connection member 50 includes an insulating plate 11 as a first insulating plate portion 51 , an insulating plate 12 as a second insulating plate portion 52 , and supports 91 , 92 , and 93 as a first connecting portion 53 . , 94 , supports 81 , 82 , 83 , 84 as second connections 54 and supports 71 , 72 , 73 , 74 as third connections 55 .
  • the insulating plate 12 as the second insulating plate portion 52 is arranged between the conductive housing 5 and the insulating plate 11 as the first insulating plate portion 51 .
  • the insulating plate 12 as the second insulating plate portion 52 is spaced apart from the conductive housing 5 and the insulating plate 11 as the first insulating plate portion 51 .
  • the supports 71 , 72 , 73 , 74 as the third connecting portions 55 position the insulating plate 12 as the second insulating plate portion 52 apart from the conductive housing 5 , so that the second insulating plate portion
  • the conductive housing 5 side surface of the insulating plate 12 as 52 and the conductive housing 5 are connected.
  • Supports 91 , 92 , 93 , and 94 as first connecting portions 53 connect the circuit board 1 side surface of insulating plate 11 as first insulating plate portion 51 to circuit board 1 .
  • Supports 81 , 82 , 83 , and 84 as the second connection portions 54 are connected to the surface of the insulating plate 11 as the first insulating plate portion 51 on the side of the conductive housing 5 and the insulating plate 12 as the second insulating plate portion 52 . to connect.
  • the supports 71, 72, 73, 74 as the third connection portion 55 and the supports 81, 82, 83, 84 as the second connection portion 54 are arranged at different positions in a plan view as seen from the circuit board 1 side. be done.
  • the supports 81, 82, 83, and 84 as the second connection portion 54 are the supports 91, 92, 93, and 94 as the first connection portion 53. and the support members 71 , 72 , 73 , 74 as the third connection portions 55 are located on the central portion 101 side of the circuit board 1 .
  • the area of the insulating plate 11 as the first insulating plate portion 51 and the insulating plate 12 as the second insulating plate portion 52 is larger than the area of the circuit board 1 in a plan view viewed from the circuit board 1 side.
  • the supports 71 , 72 , 73 , and 74 as the third connecting portions 55 are arranged at positions that do not overlap the circuit board 1 in plan view from the circuit board 1 side.
  • the supports 81 , 82 , 83 , 84 as the second connecting portions 54 are arranged at positions overlapping the circuit board 1 in plan view from the circuit board 1 side.
  • the same effect as the electronic device according to the first embodiment can be obtained. Furthermore, in the electronic device described above, by making the area of insulating plate 11 and insulating plate 12 larger than the area of circuit board 1, as shown in FIG. can be longer than the length d (see FIG. 7), which is the distance from the spacer 33 to the spacer 43 in the first embodiment. Also, the length b, which is the distance from the support 93 to the support 83, can be made longer than the length b, which is the distance from the spacer 23 to the spacer 33 in the first embodiment (see FIG. 7).
  • the spacers 21, 22, 23, 24, 31, 32, 33, 34, 41, 42, 43, 44 used in the first embodiment are replaced with supports 91, 92, 92, 92, 92, 92, 92, 92, 92, 92, 92, 92, 92, 92, 92, 92, 92, 91, 91, 91, 91, 91, 91, 92, 91, 92, 92, and 92, respectively.
  • 93, 94, 81, 82, 83, 84, 71, 72, 73, 74 see FIGS. 18 and 19).
  • a nut or a washer, for example, can be used as the support.
  • the spatial distance and creepage distance between the circuit board 1 and the conductive housing 5 can be ensured.
  • Air layers are interposed between the insulating plate 11 and the circuit board 1, between the insulating plate 11 and the insulating plate 12, and between the insulating plate 12 and the conductive housing 5, respectively. Therefore, it is possible to reduce the risk of occurrence of void discharge or creeping discharge, which is a problem in the configuration of Patent Document 1. Furthermore, it is also possible to reduce extra spatial distances for securing creepage distances. As a result, it is possible to reduce the size of the electronic device.
  • the positions of the supports 71, 72, 73, and 74 for securing the creepage distance, the positions of the supports 81, 82, 83, and 84, and the positions of the supports 91, 92, 93, and 94 and are different from each other. Therefore, the natural frequency of the circuit board 1 in the electronic device can be increased. As a result, the vibration resistance of the circuit board 1 can be improved.
  • Embodiment 5 is a schematic cross-sectional view of an electronic device according to Embodiment 5.
  • FIG. 23 is a schematic perspective view of the electronic device shown in FIG. 22.
  • FIG. 24 is a schematic plan view of a first insulating plate portion that constitutes the electronic device shown in FIG.
  • FIG. 25 is a schematic plan view of a conductive housing that constitutes the electronic device shown in FIG. 22.
  • the electronic equipment shown in FIGS. 22 to 25 basically has the same configuration as the electronic equipment shown in FIGS. configuration is different from the electronic equipment shown in FIGS. 22 to 25, the connection member 50 includes the insulating plate 11 and the supports 91, 92, 93, 94, 81, 82, 83, 84, 85, 86, and FIG. does not have the insulating plate 12 shown in FIG. 22 to 25, the insulating plate 11 is connected to the conductive housing 5 via supports 81, 82, 83, 84, 85 and 86.
  • the supports 81 and 82 are arranged closer to the central portion 101 of the circuit board 1 than the supports 91, 92, 93 and 94 in plan view from the circuit board 1 side. ing. Supports 81 and 82 are fixed to conductive housing 5 by fixing members 765 and 766, respectively. Supports 81 and 82 are fixed to insulating plate 11 by screws 755 and 756, respectively. Supports 83 , 84 , 85 , 86 are arranged on the opposite side of the central portion 101 of the circuit board 1 from the supports 91 , 92 , 93 , 94 in the plan view.
  • screw holes 231, 232, 233, and 234 through which screws 751, 752, 753, and 754 as fixtures can be inserted are formed in the insulating plate 11. formed at the four corners.
  • the screw holes 235 and 236 which are insertion holes, are separated from the screw holes 231, 232, 233, and 234 and are located inwardly of the insulating plate 11 (for example, when viewed from above, the circuit board). 1).
  • Screw through holes 251 , 252 , 253 , 254 through which screws 721 , 722 , 723 , 724 (see FIG. 2) connected to supports 91 , 92 , 93 , 94 can be inserted are screw through holes 231 in insulating plate 11 . , 232 , 233 , 234 and screw holes 235 , 236 .
  • the shortest distance between the screw 753 and the screw 723 (the shortest distance between the screw 753 and the support 93) be length b.
  • the shortest distance between the screw 723 and the screw 756 (the shortest distance between the support 93 and the support 82) is defined as length e. At this time, the length e is longer than the length b.
  • the distance between the electrical/electronic component 6 (or the metal wiring pattern to which the electrical/electronic component 6 is connected) on the circuit board 1 and the screw 713 is the shortest distance, and this distance is defined as the length d. .
  • the distance between the circuit board 1 and the insulating plate 11, that is, the length of the support 93 is defined as length a.
  • the shortest creepage distance from the metal wiring pattern of circuit board 1 to conductive housing 5 via support 93, insulating plate 11, and support 85 is length (d+a+b+c).
  • the configuration of the electronic device of the present disclosure can be determined so that the shortest creepage distance is greater than or equal to the creepage distance required by the standard.
  • the insulation performance (withstand voltage value) of the electronic device shown in FIG. 22 is proportional to the shortest creepage distance described above. That is, by increasing the shortest creepage distance, the withstand voltage value of the electronic device can be increased.
  • the electronic device includes a conductive housing 5, a circuit board 1, and a connecting member 50.
  • the circuit board 1 is spaced apart from the conductive housing 5 .
  • the connection member 50 connects the conductive housing 5 and the circuit board 1 .
  • the connecting member 50 includes an insulating plate 11 as a first insulating plate portion 51, supports 91, 92, 93, and 94 as a first connection portion 53, and supports 81 and 82 as a second connection portion . include.
  • the insulating plate 11 as the first insulating plate portion 51 is arranged between the conductive housing 5 and the circuit board 1 .
  • the insulating plate 11 as the first insulating plate portion 51 extends along the circuit board 1 .
  • the insulating plate 11 as the first insulating plate portion 51 is spaced apart from both the conductive housing 5 and the circuit board 1 .
  • Supports 91 , 92 , 93 , and 94 as the first connecting portions 53 position the insulating plate 11 as the first insulating plate portion 51 from the circuit board 1 with a gap therebetween. attached to the side surface.
  • the supports 81 and 82 as the second connection portions 54 position the insulating plate 11 as the first insulating plate portion 51 with a gap from the conductive housing 5 , so that the insulating plate as the first insulating plate portion 51 is positioned. It is connected to the surface of the plate 11 on the side of the conductive housing 5 .
  • the supports 91 , 92 , 93 , 94 as the first connection portions 53 and the supports 81 , 82 as the second connection portions 54 are arranged at different positions in a plan view viewed from the circuit board 1 side.
  • connection member 50 may include supports 83 , 84 , 85 , 86 as the third connection portion 55 .
  • the supports 83 , 84 , 85 , 86 as the third connecting portions 55 connect the conductive housing 5 side surface of the insulating plate 11 as the first insulating plate portion 51 to the conductive housing 5 .
  • Supports 91 , 92 , 93 , and 94 as first connecting portions 53 connect the circuit board 1 side surface of insulating plate 11 as first insulating plate portion 51 to circuit board 1 .
  • the supports 81 and 82 as the second connecting portions 54 connect the conductive housing 5 side surface of the insulating plate 11 as the first insulating plate portion 51 to the conductive housing 5 .
  • the area of the insulating plate 11 as the first insulating plate portion 51 is larger than the area of the circuit board 1 .
  • the supports 83 , 84 , 85 , 86 as the third connecting portion 55 are arranged at positions not overlapping the circuit board 1 in plan view from the circuit board 1 side.
  • the supports 81 and 82 as the second connection portion 54 are connected to the supports 91, 92, 93 and 94 as the first connection portion 53 and the third connection. It is positioned on the central portion 101 side of the circuit board 1 when viewed from the supports 83 , 84 , 85 , 86 as the portion 55 .
  • the supports 81 and 82 as the second connection portions 54 are arranged at positions overlapping the circuit board 1 in a plan view viewed from the circuit board 1 side.
  • the same effects as those of the electronic device according to the fourth embodiment can be obtained. Furthermore, in the electronic device described above, by making the area of the insulating plate 11 larger than the area of the circuit board 1, the length b, which is the distance from the support 93 to the support 85 as shown in FIG. It can be sufficiently longer than the length b (see FIG. 7), which is the distance from the spacer 23 to the spacer 33 in the first form.
  • the spacers 21, 22, 23, 24, 31, 32, 33, 34, 41, 42, 43, 44 used in the first embodiment are replaced with supports 91, 92, 92, 92, 92, 92, 92, 92, 92, 92, 92, 92, 92, 92, 92, 92, 92, 91, 91, 91, 91, 91, 91, 92, 91, 92, 92, and 92, respectively.
  • 93, 94, 81, 82, 83, 84, 85, 86 see FIGS. 22 and 23.
  • the positions of the supports 81, 82, 83, 84, 85, 86 for securing the creepage distance and the positions of the supports 91, 92, 93, 94 are different from each other. Therefore, the natural frequency of the circuit board 1 in the electronic device can be increased. As a result, the vibration resistance of the circuit board 1 can be improved.
  • Embodiment 6 is a schematic perspective view of an electronic device according to Embodiment 6.
  • FIG. The electronic equipment shown in FIG. 26 basically has the same configuration as the electronic equipment shown in FIGS. It differs from the electronic device shown in FIG. That is, in the electronic device shown in FIG. 26, the through hole 801 is formed in the area of the circuit board 1 overlapping with the spacers 31, 32, 33, and 34 as the second connecting portions 54 in a plan view viewed from the circuit board 1 side. is formed. Screws 731, 732, 733, and 734 for connecting the insulating plate 11 to the spacers 31, 32, 33, and 34 can be easily operated through the through holes 801, as will be described later.
  • the size of the through hole 801 can be arbitrarily set as long as a tool (for example, a screwdriver) for manipulating the screws 731, 732, 733, 734 can be inserted into the through hole 801.
  • FIG. 27 and 28 are schematic diagrams for explaining the method of manufacturing the electronic device shown in FIG.
  • a step of preparing a plurality of assemblies in which components constituting the electronic device are connected in advance is performed. Specifically, as shown in FIG. 27, a first assembly in which the circuit board 1 and the insulating plate 11 are connected via spacers 21, 22, 23 and 24 is prepared. Also, as shown in FIG. 28, a second assembly in which the conductive housing 5 and the insulating plate 12 are connected via spacers 41, 42, 43 and 44 is also prepared. In the second assembly, spacers 31 , 32 , 33 and 34 are fixed to insulating plate 12 .
  • the method of connecting the spacers 21, 22, 23, 24 to the circuit board 1 and the insulating plate is the same as that in the electronic equipment shown in FIGS. Also, the method of connecting the spacers 41, 42, 43, 44 to the conductive housing 5 and the insulating plate 12 is the same as that in the electronic equipment shown in FIGS. A method of connecting one ends of the spacers 31, 32, 33, and 34 to the insulating plate 12 is also the same as the method of connection in the electronic device shown in FIGS.
  • a step of connecting the first assembly and the second assembly is performed. Specifically, the insulating plate 11 of the first assembly and the spacers 31, 32, 33, and 34 of the second assembly are connected by screws 731, 732, 733, and 734, respectively. At this time, a tool such as a screwdriver can be inserted into the through hole 801 of the circuit board 1 to easily operate the screws 731, 732, 733, and 734 with the tool. Thus, the first assembly and the second assembly are joined together. As a result, the electronic device shown in FIG. 26 is obtained.
  • the insulating plate 12 is fixed on the conductive housing 5 via the spacers 41, 42, 43 and 44, and the insulating plate 12 is further provided with A step of fixing the insulating plate 11 via the spacers 31, 32, 33 and 34 and further fixing the circuit board 1 on the insulating plate 11 via the spacers 21, 22, 23 and 24 is carried out.
  • the manufacturing process of electronic devices it is required to shorten the working time from the viewpoint of manufacturing cost reduction. In the method of manufacturing the electronic device shown in FIGS. 1 and 2, there is a limit to shortening the working time because it is necessary to sequentially perform each step.
  • the first assembly and the second assembly in which a plurality of members are connected can be prepared in parallel. Further, by connecting the first assembly and the second assembly via spacers 31, 32, 33, 34, electronic equipment can be manufactured. In this way, since a plurality of assemblies constituting an electronic device can be prepared in advance, it is possible to shorten the work time required for manufacturing the electronic device.
  • through holes 801 are formed in regions overlapping spacers 31 , 32 , 33 , and 34 as the second connecting portions 54 of the circuit board 1 in a plan view viewed from the circuit board 1 side.
  • the insulating plate 11 and the insulating plate 12, which is another member are assembled.
  • the connecting screws 731, 732, 733, 734 can be operated with a tool such as a screwdriver. Therefore, the working time required for the manufacturing process of the electronic device can be shortened.
  • the first assembly in which the circuit board 1 and the insulating plate 11 are connected in advance, and the second assembly in which the conductive housing 5 and the insulating plate 12 to which the spacers 31, 32, 33, and 34 are fixed are connected.
  • the insulating plate 11 of the first assembly and the spacers 31, 32, 33, 34 of the second assembly are connected by screws 731, 732, 733, 734.
  • the electronic device can be manufactured in a shorter working time than a manufacturing process in which each part is connected in order.
  • Embodiment 7. ⁇ Configuration of electronic device> 29 is a schematic perspective view of an electronic device according to Embodiment 7.
  • FIG. 30 is a schematic diagram for explaining the configuration of the electronic device shown in FIG. 29.
  • FIG. 30 is a schematic plan view of the insulating plate 11 in the electronic device shown in FIG. 29.
  • FIG. 30 is a schematic plan view of the insulating plate 11 in the electronic device shown in FIG. 29.
  • the electronic equipment shown in FIGS. 29 and 30 basically has the same configuration as the electronic equipment shown in FIGS. Different from shown electronics. 29 and 30, slits 802 and 803 are formed in insulating plates 11 and 12, respectively.
  • slits 802 are formed in the insulating plate 11 so as to surround the central screw holes 311, 312, 313, and 314. As shown in FIG. Two slits 802 are formed so as to face each other with the screw holes 311 , 312 , 313 , 314 of the insulating plate 11 interposed therebetween.
  • the planar shape of the slit 802 is U-shaped.
  • the first slit 802 is formed between the central screw holes 311 and 313 and the screw holes 221 and 223 formed in the outer periphery of the insulating plate 11 .
  • the second slit 802 is formed between the central screw holes 312 and 314 and the screw holes 222 and 224 formed in the outer periphery of the insulating plate 11 .
  • Spacers 21 , 22 , 23 and 24 as the first connecting portion 53 are connected to the screw holes 221 , 222 , 223 and 224 respectively.
  • Spacers 31 , 32 , 33 , 34 as second connecting portions 54 are connected to the screw holes 311 , 312 , 313 , 314 , respectively.
  • the position and configuration of the slit 803 in the insulating plate 12 of the electronic device shown in FIG. 29 are basically the same as the position and configuration of the slit 802 in the insulating plate 11 shown in FIG. That is, in the insulating plate 12, slits 803 are formed so as to surround the central screw holes 321, 322, 323, and 324 (see FIG. 5). Two slits 803 are formed so as to face each other with the screw holes 321 , 322 , 323 , 324 of the insulating plate 12 interposed therebetween.
  • the planar shape of the slit 803 is U-shaped.
  • the first slit 803 is formed between the central screw holes 321 and 323 and the screw holes 231 and 233 (see FIG.
  • the second slit 803 is formed between the central screw holes 322 and 324 (see FIG. 5) and the screw holes 232 and 234 formed in the outer periphery of the insulating plate 12 .
  • Spacers 41 , 42 , 43 and 44 as the third connecting portion 55 are connected to the screw holes 231 , 232 , 233 and 234 , respectively.
  • Spacers 31 , 32 , 33 , 34 as second connection portions 54 are connected to the screw holes 321 , 322 , 323 , 324 , respectively.
  • the slits 802 and 803 are U-shaped in plan view, any other shape may be adopted.
  • the planar shape of the slits 802 and 803 an arbitrary shape such as an arc shape or a linear shape can be adopted.
  • a plurality of slits arranged in the direction from the central portion to the outer peripheral portion of the insulating plates 11 and 12 may be used.
  • the slits 802 and 803 are formed in the insulating plates 11 and 12, respectively, but the slit 802 may be formed only in the insulating plate 11 or only the insulating plate 12.
  • a slit 803 may be formed in the .
  • through holes 801 may be formed in the circuit board 1 in the same manner as in the electronic device shown in FIG.
  • the insulating plate 11 as the first insulating plate portion 51 has the slit 802 formed in the region between the position where the first connection portion is connected and the position where the second connection portion is connected. ing. Further, in the insulating plate 12 as the second insulating plate portion 52, the position where the spacers 31, 32, 33, and 34 as the second connecting portion 54 are connected and the spacers 41, 42, and 43 as the third connecting portion 55 are connected. , 44 are connected, a slit 803 is formed in the region.
  • the formation of the slit 802 defines the creepage distance from the position where the spacers 21, 22, 23 and 24 are connected on the insulating plate 11 to the position where the spacers 31, 32, 33 and 34 are connected.
  • the route to be taken bypasses the slit 802 . Therefore, the creepage distance in the insulating plate 11 can be made longer than when the slit 802 is not provided.
  • the slits 803 are formed in the insulating plate 12 as well, from the positions where the spacers 31, 32, 33, and 34 are connected to the positions where the spacers 41, 42, 43, and 44 are connected in the insulating plate 12, , bypasses the slit 803 . Therefore, the creeping distance in the insulating plate 12 can be made longer than when the slit 803 is not provided.
  • the insulation resistance of the electronic device can be improved without increasing the size of the electronic device.
  • the distance between the two slits 802 may be reduced. That is, in the insulating plate 11 shown in FIG. 30, the ends of the slits 802 are preferably arranged closer to the central portion of the insulating plate 11 than the screw holes 311, 312, 313, and 314 are. For example, by sufficiently increasing the length of the slit 802 in the direction from the screw hole 311 toward the screw hole 211 (horizontal direction in FIG. 30), the ends of the slit 802 are formed into the screw holes 311, 312, 313, It is arranged closer to the center of the insulating plate 11 than 314 .
  • the screw hole 311 and the screw hole 221 sandwiching the slit 802 need only be arranged away from the end of the slit 802.
  • the distance itself between screw hole 311 and screw hole 221 may be rather small.
  • the central screw hole 311 may be arranged so as to be close to the screw hole 221 located at the edge of the insulating plate 11 . In this case, the creepage distance from the screw hole 221 (the position where the spacer 21 is connected) to the screw hole 311 (the position where the spacer 31 is connected) can be further increased.
  • the positions of the spacers 31, 32, 33, and 34 that fix the insulating plate 11 to the insulating plate 12 can be brought closer to the outer peripheral side of the insulating plate 11, so that the rigidity of the electronic device can be improved.
  • the configuration of the slits 802 described above can also be applied to the slits 803 of the insulating plate 12 .
  • the distance between the two slits 802 is the side of the insulating plate 11 (the side along the direction in which the two slits 802 are arranged, and the distance in the horizontal direction in FIG. 30). It is preferable to set it to 1/6 or more of the length of the extended side). Also, the width of the slits 802 and 803 depends on the voltage applied to the circuit board 1 and the size and thickness of the insulating plates 11 and 12 to be used, but can be, for example, 0.5 mm or more and 5 mm or less.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

La présente invention concerne un dispositif électronique dans lequel la résistance d'isolation est améliorée. Le dispositif électronique comprend un boîtier électriquement conducteur (5), une carte de circuit imprimé (1) et un élément de connexion (50). La carte de circuit imprimé (1) est espacée du boîtier électriquement conducteur (5). L'élément de connexion (50) connecte le boîtier électriquement conducteur (5) et la carte de circuit imprimé (1) l'un à l'autre. L'élément de connexion (50) comprend une première partie de plaque d'isolation (51), des premières parties de connexion (53) et des secondes parties de connexion (54). La première partie de plaque d'isolation (51) est espacée à la fois du boîtier électriquement conducteur (5) et de la carte de circuit imprimé (1). Les premières parties de connexion (53) sont reliées à la surface sur le côté carte de circuit imprimé (1) de la plaque d'isolation (11). Les secondes parties de connexion (54) sont reliées à la surface sur le côté boîtier électriquement conducteur (5) de la première partie de plaque d'isolation (51) de telle sorte que la première partie de plaque d'isolation (51) est espacée du boîtier électriquement conducteur (5). Les premières parties de connexion (53) et les secondes parties de connexion (54) sont disposées à des positions différentes les unes des autres dans une vue en plan telle que vue depuis le côté de la carte de circuit imprimé (1).
PCT/JP2022/003267 2021-02-16 2022-01-28 Dispositif électronique WO2022176566A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2023500685A JP7566122B2 (ja) 2021-02-16 2022-01-28 電子機器
DE112022001101.7T DE112022001101T5 (de) 2021-02-16 2022-01-28 Elektronische Vorrichtung

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JP2021022397 2021-02-16
JP2021-022397 2021-02-16

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WO2022176566A1 true WO2022176566A1 (fr) 2022-08-25

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63112384U (fr) * 1987-01-14 1988-07-19
JPH0613771A (ja) * 1992-06-25 1994-01-21 Matsushita Electric Ind Co Ltd 電気機器の絶縁装置
JPH0652182U (ja) * 1992-12-15 1994-07-15 松下電工株式会社 電気部品の取付構造
JP2006005200A (ja) * 2004-06-18 2006-01-05 Nitsupo Denko Kk プリント基板用絶縁フィルム
US20170250010A1 (en) * 2016-02-26 2017-08-31 Delta Electronics, Inc. Power supply

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6620506B2 (ja) 2015-10-20 2019-12-18 富士電機株式会社 電子機器のプリント基板絶縁構造

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63112384U (fr) * 1987-01-14 1988-07-19
JPH0613771A (ja) * 1992-06-25 1994-01-21 Matsushita Electric Ind Co Ltd 電気機器の絶縁装置
JPH0652182U (ja) * 1992-12-15 1994-07-15 松下電工株式会社 電気部品の取付構造
JP2006005200A (ja) * 2004-06-18 2006-01-05 Nitsupo Denko Kk プリント基板用絶縁フィルム
US20170250010A1 (en) * 2016-02-26 2017-08-31 Delta Electronics, Inc. Power supply

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JP7566122B2 (ja) 2024-10-11
JPWO2022176566A1 (fr) 2022-08-25

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