WO2022174591A1 - 一种气流调控装置及服务器 - Google Patents

一种气流调控装置及服务器 Download PDF

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Publication number
WO2022174591A1
WO2022174591A1 PCT/CN2021/121212 CN2021121212W WO2022174591A1 WO 2022174591 A1 WO2022174591 A1 WO 2022174591A1 CN 2021121212 W CN2021121212 W CN 2021121212W WO 2022174591 A1 WO2022174591 A1 WO 2022174591A1
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WIPO (PCT)
Prior art keywords
guide rail
airflow
wind deflector
wind
air flow
Prior art date
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PCT/CN2021/121212
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English (en)
French (fr)
Inventor
夏记成
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浪潮电子信息产业股份有限公司
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Application filed by 浪潮电子信息产业股份有限公司 filed Critical 浪潮电子信息产业股份有限公司
Priority to US18/254,503 priority Critical patent/US11959503B2/en
Publication of WO2022174591A1 publication Critical patent/WO2022174591A1/zh

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
    • F15D—FLUID DYNAMICS, i.e. METHODS OR MEANS FOR INFLUENCING THE FLOW OF GASES OR LIQUIDS
    • F15D1/00—Influencing flow of fluids
    • F15D1/002—Influencing flow of fluids by influencing the boundary layer
    • F15D1/0025—Influencing flow of fluids by influencing the boundary layer using passive means, i.e. without external energy supply
    • F15D1/006—Influencing flow of fluids by influencing the boundary layer using passive means, i.e. without external energy supply comprising moving surfaces, wherein the surface, or at least a portion thereof is moved or deformed by the fluid flow
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
    • F15D—FLUID DYNAMICS, i.e. METHODS OR MEANS FOR INFLUENCING THE FLOW OF GASES OR LIQUIDS
    • F15D1/00—Influencing flow of fluids
    • F15D1/0005—Baffle plates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
    • F15D—FLUID DYNAMICS, i.e. METHODS OR MEANS FOR INFLUENCING THE FLOW OF GASES OR LIQUIDS
    • F15D1/00—Influencing flow of fluids
    • F15D1/002—Influencing flow of fluids by influencing the boundary layer
    • F15D1/0025—Influencing flow of fluids by influencing the boundary layer using passive means, i.e. without external energy supply
    • F15D1/003—Influencing flow of fluids by influencing the boundary layer using passive means, i.e. without external energy supply comprising surface features, e.g. indentations or protrusions
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20727—Forced ventilation of a gaseous coolant within server blades for removing heat from heat source
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

Definitions

  • the present application relates to the technical field of heat dissipation, and further relates to an air flow regulating device.
  • the present application also relates to a server.
  • Each device in the server generates a lot of heat during operation, and needs to be dissipated in time to ensure normal operation.
  • the commonly used cooling method is to use air cooling to cool down, and several fans blow the electronic components to achieve the purpose of heat dissipation.
  • the fan in the server changes the speed according to the temperature. The higher the temperature, the higher the speed, and the airflow per unit time is increased to accelerate the cooling.
  • Different electronic components in the whole server have different requirements for heat dissipation. Some electronic components generate a lot of heat and therefore require more air volume to dissipate heat. Some electronic components do not have too high requirements for air volume, but various components
  • the components are located in the same space, and the airflow received is basically the same; when dissipating heat, the airflow is mainly controlled based on the component with the largest heat generation, and the components that require less airflow are blown by the same airflow. The air flow is wasteful and increases the overall heat dissipation energy consumption of the equipment.
  • the present application provides an air flow control device, which can block the air flow, so that the excess air flow can be blown to a structure with a larger calorific value to dissipate heat, and the air flow can be better distributed.
  • the specific scheme is as follows:
  • An air flow control device comprising a wind shield, and an air hole is formed through the wind shield;
  • a guide rail shutter is slidably fitted on the wind deflector, and the guide rail shutter can move vertically relative to the wind deflector;
  • the guide rail shutter is provided with a lift wing, and the lift wing is blown by the airflow to generate an upward lift, which drives the guide rail gate to move upward to block the upper part of the wind deflector, thereby blocking the airflow, so that the airflow can pass through the passageway.
  • the air holes, and the upper and both sides of the board surface formed by the wind deflector and the guide rail shutter flow through.
  • the upper surface of the elevator wing is a curved surface
  • the lower surface is a flat surface
  • two lift wings are provided, which are respectively located on both sides of the guide rail shutter, and the height of the lift wings is lower than the upper edge of the guide rail shutter.
  • the wind deflector is arranged in two layers, and the guide rail shutter is sandwiched between the two layers.
  • two sides of the wind deflector are provided with guide rails protruding upward, and the guide rails can limit the highest position of the guide rail shutter.
  • the width of the air passage is less than one third of the width of the wind deflector, the height of the air passage is less than the height of the wind deflector, and the top of the air passage is connected to the outside world. Connected.
  • a base is provided on the lower surface of the wind deflector, and the thickness of the base is greater than that of the wind deflector.
  • both ends of the base in the length direction respectively extend out of the wind deflector to form connecting ears, and the wind deflector is bolted to the main board through the connecting ears.
  • the present application also provides a server, including the airflow control device described in any one of the above.
  • one side or both sides of the wind deflector is provided with a shroud, and the shroud is used to guide the airflow to blow toward the components that generate more heat.
  • the present application provides an air flow control device.
  • Air passage holes are formed through the wind deflector, and the size of the air passage holes is smaller than the size of the board surface of the wind deflector;
  • the wind deflector moves vertically, and the guide rail ram is powered by the lift wings provided on it to realize the rise.
  • the guide rail ram moves upward, the height can exceed the upper edge of the main body of the wind deflector 1; when the wind force is small, the guide rail ram Under the action of gravity, it is located at the bottom, blocking the air hole; when the wind increases, the lift wing is blown by the airflow to generate upward lift, which drives the guide rail gate to move upward, blocking the upper part of the wind deflector to block the air flow, and part of the air flow passes through the net.
  • the present application reduces the air flow to the rear of the windshield by blocking part of the air flow , so that more air flow can be transferred to other positions, and the air flow can be better distributed, so that the air flow can meet the cooling air demand of each component, so as to achieve the effect of reducing energy consumption.
  • FIG. 1 is a schematic structural diagram of the airflow control device provided by the application being installed on a mainboard;
  • Fig. 2 is the structural representation of the air flow regulating device of the application
  • FIG. 3A is a schematic structural diagram of the airflow regulating device of the present application being blown by an airflow
  • 3B is a schematic view of the elevator wing being blown by the airflow
  • 4A to 4D are schematic diagrams of states of the guide rail shutters transitioning from the lowest position to the highest position, respectively.
  • the figure includes:
  • Wind deflector 1 air passage hole 11 , guide rail 12 , base 13 , guide rail shutter 2 , lift wing 3 .
  • the core of the present application is to provide an air flow regulating device, which can block the air flow, so that the excess air flow can be blown to the structure with higher heat generation to dissipate heat, and the air flow can be better distributed.
  • FIG. 1 the structural representation that the airflow control device provided by the application is installed on the main board, A represents the main board in the figure, B represents the fan, and the arrow represents the airflow;
  • Fig. 2 is the structural representation of the airflow control device of the application;
  • the air flow control device includes a windshield 1, the windshield 1 is fixedly arranged, the windshield 1 is substantially perpendicular to the surface of the main board, and the windshield 1 can play the role of blocking the air flow.
  • the air flow control device of the present application is used to reduce the air flow behind it to realize the redistribution of the air flow, and is especially suitable for components with different calorific values. It is arranged in front of the component with relatively small heat generation to block the air flow to the component. When the heat generation is small, the air flow around the windshield 1 can meet the requirements of the component. For cooling needs, other airflow bypasses wind deflector 1 and is diverted to other locations.
  • the wind deflector 1 is provided with an air passage hole 11 through it.
  • the through direction of the air passage hole 11 is perpendicular to the plate surface of the wind deflector 1.
  • the vertical height of the air passage hole 11 is approximately equal to the height of the wind deflector 1.
  • the width of 11 is smaller than the width of wind deflector 1 .
  • the rail shutter 2 When the air force is small, the rail shutter 2 is kept below under the action of gravity, the rail shutter 2 overlaps with the wind deflector 1, and the rail shutter 2 partially or completely blocks the air hole 11. Normally, the height of the rail shutter 2 is less than The height of the wind deflector 1 is not higher than the wind deflector 1 when the guide rail shutter 2 falls to the bottom.
  • the guide rail ram 2 is slidably fitted on the wind deflector 1, and the guide rail ram 2 can move vertically relative to the wind deflector 1.
  • the guide rail ram 2 is limited by the guide and can only move vertically, and cannot move along the direction perpendicular to the wind deflector. 1 is translated in the direction of the board surface.
  • the guide rail shutter 2 is provided with a lift wing 3, and the lift wing 3 is blown by the airflow to generate an upward lift, and when the wind is strong enough, the guide rail shutter 2 is moved upward to block the top of the wind deflector 1 to block the airflow; as shown in Figure 3A
  • Figure 3B is a schematic diagram of the lift wing 3 being blown by the air flow, which is equivalent to a partial view in the side view direction of Figure 3A, the arrow in the figure Represents airflow; the radian of the upper surface of the longitudinal section of the elevator wing 3 is greater than the radian of the lower surface, so when the airflow blows horizontally, the airflow velocity on the upper surface is faster, and the flow velocity on the lower surface is slower.
  • the wing 3 generates an upward lifting force, so that the elevator wing 3 moves upward.
  • the lift wings 3 are relatively fixed to the guide rail shutter 2, thus driving the guide rail shutter 2 to move upward.
  • the excess airflow flows from the top and both sides of the board surface formed by the windshield 1 and the guide gate 2, blowing to the components with greater heat generation, and supplying the excess airflow to other components with greater heat generation, Redistribute the airflow, and guide the excess airflow to other components that require more airflow while keeping the components behind the wind deflector 1 to achieve sufficient heat dissipation, so as to make the utilization of airflow more reasonable, reduce energy waste, and reduce energy consumption. consumption effect.
  • the lift wings 3 cannot generate enough lifting force, and the guide rail shutter 2 is kept below under the action of gravity, and the wind deflector 1 and the guide rail shutter 2 overlap each other at this time.
  • the height of the integrally formed board surface is low, and the airflow blows over the upper edge to the components behind the windshield 1, which has a cooling effect. Since the components behind the windshield 1 generate little heat, only a small amount of airflow is required. Cooling can be achieved.
  • Fig. 4A to Fig. 4D are schematic diagrams of the state where the rail shutter 2 transitions from the lowest position to the highest position; when the rail shutter 2 moves upward, the air hole 11 It is gradually opened, and finally the air hole 11 is not blocked at all, and the airflow flows through the air hole 11 to ensure the cooling effect of the rear components; other air flows are blocked by the wind shield 1 and cannot be directly blown to the elements behind the wind shield 1
  • the device can only flow from the top and the left and right sides, and the blocked airflow in this part is mainly blown to other components that generate more heat.
  • the present application utilizes the mutual cooperation between the rail shutter 2 that can slide up and down and the air passage hole 11 to realize the redistribution of air flow, reduce the air flow directly blown to the rear part of the wind deflector 1 and increase the air flow obtained by other parts.
  • the elevator wing 3 specifically adopts the shape that the upper surface is a curved surface and the lower surface is a plane shape, the airflow speed on the upper surface is low, and the airflow speed on the lower surface is high. lift.
  • elevator wings 3 there are two elevator wings 3 in the present application, which are located on both sides of the guide rail shutter 2 respectively.
  • the height of the elevator wings 3 is lower than the upper edge of the guide rail shutter 2. Does not occupy vertical space, to ensure the rational use of space.
  • the wind deflector 1 in the present application is provided with two layers, the guide rail shutter 2 is sandwiched between the two layers, and the guide rail shutter 2 can only move up and down due to the limitation on both sides.
  • guide rails 12 are protruded upward on both sides of the wind deflector 1 .
  • the width of the air passage hole 11 is less than one third of the width of the wind deflector 1 .
  • the height of the air hole 11 is less than the height of the wind deflector 1, and the top of the air hole 11 communicates with the outside world, that is, the top of the air hole 11 extends to the edge of the middle of the wind deflector 1 .
  • a base 13 is provided on the lower surface of the windshield 1 , and the thickness of the base 13 is greater than that of the windshield 1 , which increases the stability of the windshield 1 .
  • Both ends of the base 13 in the length direction respectively extend out of the windshield 1 to form connecting ears.
  • the connecting ears are provided with through holes, and the windshield 1 is bolted to the main board through the connecting ears to ensure the stability of the connection.
  • the present application also provides a server, including the above-mentioned airflow control device.
  • a server including the above-mentioned airflow control device.
  • a shroud is arranged inside the server, and the shroud is arranged on one side or both sides of the windshield 1.
  • the shroud is used to guide the air flow to the components that generate more heat, so that the flow direction of the air flow is guided, and the better Ground supply to other components; the shroud can adopt a tapered and tapered cylindrical structure, with smooth transitions everywhere, without sharp corners, reducing resistance to airflow.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Fluid Mechanics (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Air-Flow Control Members (AREA)

Abstract

一种气流调控装置，挡风板（1）上贯通开设过风孔（11），挡风板（1）上滑动配合安装导轨闸板（2），导轨闸板（2）通过其上设置的升降翼（3）提供动力实现上升，导轨闸板（2）向上移动时高度可超过挡风板（1）主体部分的上边沿；当风力较小时，导轨闸板（2）在重力作用下处于下方，遮挡过风孔（11）；当风力增大时，升降翼（3）受到气流吹动产生向上的升力，带动导轨闸板（2）向上移动，遮挡挡风板（1）的上方从而阻挡气流，一部分气流从过风孔（11）中吹向挡风板（1）之后，多余的气流从挡风板（1）和导轨闸板（2）形成的板面整体的上方和两侧流过；通过阻挡部分气流，减小吹向挡风板（1）后方的气流，使更多的气流转移到其他位置，更好地分配气流，气流符合各元器件对冷却气流的需求，达到降低能耗的效果。

Description

一种气流调控装置及服务器 技术领域
本申请涉及散热技术领域，更进一步涉及一种气流调控装置。此外，本申请还涉及一种服务器。
背景技术
服务器内各器件运行时产生大量热量，需要及时散热以保证正常工作，目前常用的冷却方式是采用风冷降温，若干颗风扇对电子元器件吹风以达到散热的目的。服务器内的风扇根据温度的高低改变转速的快慢，温度越高则转速越高，提升单位时间的气流加速冷却。
服务器整机内不同电子元器件对散热的要求是有差异的，有些电子元器件发热量大因而需要较多风量散热，有些电子元器件对风量却没有太高的要求，但各种不同的元器件位于同一空间中，所受到的气流量基本没有差别；散热时主要以发热量最大的元器件为依据控制气流量，对气流量需求较少的元器件则受到同样的气流吹动，过多的气流造成浪费，提高了设备整体的散热能耗。
对于本领域的技术人员来说，如何更好地分配气流，使气流符合需求并降低能耗，是目前需要解决的技术问题。
发明内容
本申请提供一种气流调控装置，能够对气流起到阻挡的作用，使多余的气流向发热量更大的结构吹送散热，更好地分配气流，具体方案如下：
一种气流调控装置，包括挡风板，所述挡风板上贯通开设过风孔；
所述挡风板上滑动配合安装导轨闸板，所述导轨闸板能够相对于所述挡风板竖向移动；
所述导轨闸板上设有升降翼，所述升降翼受到气流吹动产生向上的升力，带动所述导轨闸板向上移动遮挡所述挡风板的上方从而阻挡 气流，使气流从所述过风孔、以及所述挡风板和所述导轨闸板形成的板面的上方和两侧流过。
可选地，所述升降翼的上表面为曲面，下表面为平面。
可选地，所述升降翼设置两个，分别位于所述导轨闸板的两侧，所述升降翼的高度低于所述导轨闸板的上边缘。
可选地，所述挡风板设置为两层，所述导轨闸板夹装在两层之间。
可选地，所述挡风板的两侧向上凸出设置导向轨道，所述导向轨道能够限位所述导轨闸板的最高位置。
可选地，所述过风孔的宽度小于所述挡风板宽度的三分之一，所述过风孔的高度小于所述挡风板的高度，且所述过风孔的顶端与外界连通。
可选地，所述挡风板的下表面设置基座，所述基座的厚度大于所述挡风板的厚度。
可选地，所述基座长度方向的两端分别延伸出所述挡风板形成连接耳，通过所述连接耳将所述挡风板螺栓固定在主板上。
本申请还提供一种服务器，包括上述任一项所述的气流调控装置。
可选地，所述挡风板的一侧或两侧设置导流罩，所述导流罩用于引导气流吹向发热量更大的元器件。
本申请提供一种气流调控装置，挡风板上贯通开设过风孔，过风孔的尺寸小于挡风板的板面尺寸；挡风板上滑动配合安装导轨闸板，导轨闸板能够相对于挡风板竖向移动，导轨闸板通过其上设置的升降翼提供动力实现上升，导轨闸板向上移动时高度可超过挡风板1主体部分的上边沿；当风力较小时，导轨闸板在重力作用下处于下方，遮挡过风孔；当风力增大时，升降翼受到气流吹动产生向上的升力，带动导轨闸板向上移动，遮挡挡风板的上方从而阻挡气流，一部分气流从过网孔中吹向挡风板之后，多余的气流从挡风板和导轨闸板形成的板面整体的上方和两侧流过；本申请通过阻挡部分气流，减小吹向挡风板后方的气流，使更多的气流转移到其他位置，更好地分配气流， 使气流符合各元器件对冷却气流的需求，达到降低能耗的效果。
附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请提供的气流调控装置安装在主板上的结构示意图；
图2为本申请气流调控装置的结构示意图；
图3A为本申请的气流调控装置受气流吹动的结构示意图；
图3B为升降翼受到气流吹动的示意图；
图4A至图4D分别为导轨闸板从最低位置过渡到最高位置的状态示意图。
图中包括：
挡风板1、过风孔11、导向轨道12、基座13、导轨闸板2、升降翼3。
具体实施方式
本申请的核心在于提供一种气流调控装置，能够对气流起到阻挡的作用，使多余的气流向发热量更大的结构吹送散热，更好地分配气流。
为了使本领域的技术人员更好地理解本申请的技术方案，下面将结合附图及具体的实施方式，对本申请的气流调控装置进行详细的介绍说明。
如图1所示，为本申请提供的气流调控装置安装在主板上的结构示意图，图中A表示主板，B表示风扇，箭头表示气流；图2为本申请气流调控装置的结构示意图；本申请的气流调控装置包括挡风板1，挡风板1固定设置，挡风板1大致垂直于主板的表面，挡风板1可起 到阻挡气流的作用。
本申请的气流调控装置用于减小其后方的气流，以实现重新分配气流，特别适用于不同发热量的元器件，本申请主要结合应用在发热量不同的元器件进行说明：该气流调控装置设置在发热量相对较小的元器件的前方，对吹向该元器件的气流起到阻挡的作用，当发热量较小时，仅通过绕过挡风板1的气流就可满足该元器件的散热需求，其他气流绕过挡风板1并转移到其他位置。
挡风板1上贯通开设过风孔11，过风孔11的贯通方向垂直于挡风板1的板面，过风孔11的竖向高度大致与挡风板1的高度相等，过风孔11的宽度小于挡风板1的宽度。
气力较小时导轨闸板2在重力的作用下保持在下方，导轨闸板2与挡风板1重叠，导轨闸板2部分或全部遮挡过风孔11，通常情况下导轨闸板2的高度小于挡风板1的高度，当导轨闸板2下落到最下方时不高于挡风板1。
挡风板1上滑动配合安装导轨闸板2，导轨闸板2能够相对于挡风板1竖向移动，导轨闸板2受到导向限位，只能竖向移动，无法沿垂直于挡风板1的板面方向平移。
导轨闸板2上设有升降翼3，升降翼3受到气流吹动产生向上的升力，当风力足够大时带动导轨闸板2向上移动遮挡挡风板1的上方从而阻挡气流；如图3A所示，为本申请的气流调控装置受气流吹动的结构示意图，图中箭头表示气流；图3B为升降翼3受到气流吹动的示意图，相当于图3A侧视方向的局部视图，图中箭头表示气流；升降翼3的纵截面上表面的弧度大于下表面的弧度，因此气流水平吹动时，上表面的气流流速更快，下表面的流速更慢，空气流速不同产生气压差，对升降翼3产生向上的抬升作用力，使升降翼3向上移动。升降翼3与导轨闸板2相对固定，因此带动导轨闸板2向上移动。
导轨闸板2向上移动时，如图2所示，导轨闸板2与挡风板1的重叠部分缩小，导轨闸板2和挡风板1共同构成一块面积更大的板面，板面整体的高度更高，对气流起到更强的阻挡作用；与此同时，由于 导轨闸板2向上抬升后，不再遮挡过风孔11，气流可经由过风孔11吹到挡风板1后方的位置，从而对其后方的元器件进行冷却，流经过风孔11吹到后方的气流远少于吹到导轨闸板2和挡风板1板面前方的气流。
多余的气流从挡风板1和导轨闸板2形成的板面的上方和两侧流过，吹向发热量更大的元器件，将多余的气流供给到其他发热量更大的元器件，将气流再次分配，在保持挡风板1后方元器件实现充分散热的情况下，将多余的气流引导到其他需要更多气流的元器件，使气流的利用更加合理，减少能量浪费，达到降低能耗的效果。
在使用时，当风扇吹送气流量较小时，升降翼3无法产生足够的抬升力，此时导轨闸板2在重力作用下保持在下方，此时挡风板1和导轨闸板2相互重叠，整体形成的板面高度较低，气流越过上边缘吹到挡风板1后方的元器件上，起到冷却的效果，由于挡风板1后方的元器件发热量不大，仅需少量的气流即可实现冷却散热。
发热量增大时风扇吹送气流量增大，如图4A至图4D所示，分别为导轨闸板2从最低位置过渡到最高位置的状态示意图；当导轨闸板2向上移动时过风孔11逐渐打开，最终过风孔11完全不被遮挡，气流经由过风孔11流通，保证后方元器件的冷却效果；其他的气流被挡风板1遮挡，无法直接吹向挡风板1后方的元器件，只能从上方和左右两侧流动，此部分被遮挡的气流主要吹向其他发热量更大的元器件。
本申请利用可以上下滑动的导轨闸板2与过风孔11之间的相互配合实现气流的重新分配，减少直接吹向挡风板1后方部分的气流，增大其他部分获得的气流。
在上述方案的基础上，升降翼3具体采用上表面为曲面，下表面为平面的外形，上表面气流速度低，下表面气流速度高，气流速度不同产生气压差，对升降翼3产生向上的升力。
本申请中的升降翼3设置两个，分别位于导轨闸板2的两侧，升降翼3的高度低于导轨闸板2的上边缘，当导轨闸板2移动到最上方时，升降翼3不占用竖向空间，保证空间合理利用。
具体地，本申请中的挡风板1设置为两层，导轨闸板2夹装在两层之间，导轨闸板2受到两侧的限位只能上下移动。
优选地，本申请在挡风板1的两侧向上凸出设置导向轨道12，导向轨道12同样为两层结构，上端部封闭，导向轨道12能够限位导轨闸板2的最高位置。
具体地，本申请中过风孔11的宽度小于挡风板1宽度的三分之一，过风孔11最好开设在挡风板1的中间，关于挡风板1的对称轴呈对称开设；过风孔11的高度小于挡风板1的高度，且过风孔11的顶端与外界连通，也即过风孔11的顶部延伸到挡风板1中间的边缘位置。
具体地，本申请在挡风板1的下表面设置基座13，基座13的厚度大于挡风板1的厚度，增加了挡风板1的稳定性。
基座13长度方向的两端分别延伸出挡风板1形成连接耳，连接耳上设置通孔，通过连接耳将挡风板1螺栓固定在主板上，保证连接的稳定性。
本申请还提供一种服务器，包括上述的气流调控装置，该服务器的其他部分结构请参考现有技术，本申请在此不再赘述。
服务器内部设置导流罩，导流罩设置在挡风板1的一侧或两侧，导流罩用于引导气流吹向发热量更大的元器件，使气流的流动方向受到引导，更好地向其他元器件供应；导流罩可采用锥形渐缩的筒形结构，各处均为平滑的过渡，没有尖锐的折角，减少对气流的阻力。
对所公开的实施例的上述说明，使本领域专业技术人员能够实现或使用本申请。对这些实施例的多种修改对本领域的专业技术人员来说将是显而易见的，本文中所定义的一般原理，可以在不脱离本申请的精神或范围的情况下，在其它实施例中实现。因此，本申请将不会被限制于本文所示的这些实施例，而是要符合与本文所公开的原理和新颖特点相一致的最宽的范围。

Claims (10)

  1. 一种气流调控装置，其特征在于，包括挡风板(1)，所述挡风板(1)上贯通开设过风孔(11)；
    所述挡风板(1)上滑动配合安装导轨闸板(2)，所述导轨闸板(2)能够相对于所述挡风板(1)竖向移动；
    所述导轨闸板(2)上设有升降翼(3)，所述升降翼(3)受到气流吹动产生向上的升力，带动所述导轨闸板(2)向上移动遮挡所述挡风板(1)的上方从而阻挡气流，使气流从所述过风孔(11)、以及所述挡风板(1)和所述导轨闸板(2)形成的板面的上方和两侧流过。
  2. 根据权利要求1所述的气流调控装置，其特征在于，所述升降翼(3)的上表面为曲面，下表面为平面。
  3. 根据权利要求1所述的气流调控装置，其特征在于，所述升降翼(3)设置两个，分别位于所述导轨闸板(2)的两侧，所述升降翼(3)的高度低于所述导轨闸板(2)的上边缘。
  4. 根据权利要求1所述的气流调控装置，其特征在于，所述挡风板(1)设置为两层，所述导轨闸板(2)夹装在两层之间。
  5. 根据权利要求1所述的气流调控装置，其特征在于，所述挡风板(1)的两侧向上凸出设置导向轨道(12)，所述导向轨道(12)能够限位所述导轨闸板(2)的最高位置。
  6. 根据权利要求5所述的气流调控装置，其特征在于，所述过风孔(11)的宽度小于所述挡风板(1)宽度的三分之一，所述过风孔(11)的高度小于所述挡风板(1)的高度，且所述过风孔(11)的顶端与外界连通。
  7. 根据权利要求1所述的气流调控装置，其特征在于，所述挡风板(1)的下表面设置基座(13)，所述基座(13)的厚度大于所述挡风板(1)的厚度。
  8. 根据权利要求7所述的气流调控装置，其特征在于，所述基座(13)长度方向的两端分别延伸出所述挡风板(1)形成连接耳，通过所述连接耳将所述挡风板(1)螺栓固定在主板上。
  9. 一种服务器，其特征在于，包括权利要求1至8任一项所述 的气流调控装置。
  10. 根据权利要求9所述的服务器，其特征在于，所述挡风板(1)的一侧或两侧设置导流罩，所述导流罩用于引导气流吹向发热量更大的元器件。
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