WO2022170814A1 - 显示装置及其光机组件 - Google Patents

显示装置及其光机组件 Download PDF

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Publication number
WO2022170814A1
WO2022170814A1 PCT/CN2021/132722 CN2021132722W WO2022170814A1 WO 2022170814 A1 WO2022170814 A1 WO 2022170814A1 CN 2021132722 W CN2021132722 W CN 2021132722W WO 2022170814 A1 WO2022170814 A1 WO 2022170814A1
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WO
WIPO (PCT)
Prior art keywords
contacts
contact
conductive elastic
dmd chip
adapter board
Prior art date
Application number
PCT/CN2021/132722
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English (en)
French (fr)
Inventor
于卫勇
任国扬
张明龙
胡海石
叶阳
郭松涛
陈许
刘晨
Original Assignee
海信视像科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 海信视像科技股份有限公司 filed Critical 海信视像科技股份有限公司
Priority to CN202180092676.6A priority Critical patent/CN117561477A/zh
Publication of WO2022170814A1 publication Critical patent/WO2022170814A1/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00—Projectors or projection-type viewers; Accessories therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00—Projectors or projection-type viewers; Accessories therefor
    • G03B21/14—Details

Definitions

  • the present application relates to the field of projection technology, and in particular, to a display device and an opto-mechanical assembly thereof.
  • DLP Digital Light Procession, digital light processing
  • DLP projectors use digital micro Mirror device (Digital Micromirror Device, DMD) chip is used as an imaging device, a projection technology that realizes the projected image by adjusting the reflected light.
  • DMD chip is the core component of the projector. The light beam emitted by the laser passes through a series of optical lenses to reach the DMD chip. The DMD chip processes the optical signal and finally forms an image.
  • the DMD chip is generally connected to an adapter board (PCB board) through a socket, and the adapter board receives a corresponding signal, and transmits the signal to the DMD chip through the socket.
  • Corresponding spring pins are arranged on the socket, and a large-area pad structure is usually used on the adapter board to form contacts on the adapter board.
  • the connection board and the DMD chip are connected.
  • the adapter board is generally a multi-layer printing structure, and the outer layer of the adapter board is provided with via holes or blind holes to connect the outer layer and the inner layer of the adapter board. Through holes or blind holes are arranged at the contact points of the adapter board to connect the inner and outer layers of the adapter board. However, there are vias or blind holes at the contacts.
  • Some embodiments of the present application provide a display device and an opto-mechanical assembly thereof, wherein the opto-mechanical assembly includes a DMD chip, a socket, and an adapter board; one side of the socket is connected to the DMD chip, and the other side is protruded with positioning posts and conductive elastics
  • the adapter plate is provided with a positioning hole adapted to the positioning column and a contact abutting with the conductive elastic needle; the positioning hole and the positioning column are clearance fit, so that the conductive elastic
  • the needle is offset on the contact to form a movable circumference, and the movable circumference is located within the enclosing range of the contact; the side of the adapter plate provided with the contact is also provided with a blind corresponding to the contact.
  • the blind hole is located in the enclosing range of the contact in whole or in part, so as to connect the outer layer and the inner layer of the adapter board, the blind hole is located in the movable pin of the conductive pin outside the circumference.
  • the contact is a square structure, and the blind hole is located within the enclosed range of the contact.
  • the hole diameter of the blind hole is circular, and the center of the blind hole is located on the diagonal line of the contact.
  • the edge of the blind hole is tangent to the edge of the movable circumference of the conductive pin.
  • a plurality of blind holes are correspondingly provided within the enclosed range of each of the contacts.
  • the movable circumference of the conductive elastic needle and the blind hole are both located within the enclosed range of the contact.
  • the socket further includes a housing, the positioning post and the conductive elastic pin are both disposed on the housing, the two ends of the conductive elastic pin respectively extend beyond the two sides of the housing, so the Both ends of the conductive elastic pins are respectively abutted against the contacts on the adapter board and the DMD chip.
  • the conductive elastic needle includes a limiting portion provided in the housing and two abutting portions bent and connected to both ends of the limiting portion, and the abutting portions are bent and connected to the On the limiting part, the conductive elastic needle has elasticity; the abutting part protrudes from the casing.
  • the optomechanical assembly further includes a lens unit, the lens unit is electrically connected to the DMD chip, and configured to receive the digital optical signal transmitted by the DMD chip, and amplify the digital optical signal to the outside projection.
  • Some embodiments of the present application provide a display device, including a display screen, and the above-mentioned opto-mechanical assembly.
  • Some embodiments of the present application provide an opto-mechanical assembly, including a DMD chip, a socket, and an adapter board; one side of the socket is connected to the DMD chip, and the other side is protruded with positioning posts and conductive spring pins; a positioning hole adapted to the positioning post, and a plurality of contacts abutting against the conductive elastic needle; there is a gap between the contacts; the positioning hole and the positioning post are gap-fitted, so that the conductive
  • the elastic needle is offset on the contact to form an active circle, and the active circle is located within the enclosing range of the contact; the side of the adapter plate provided with the contact is provided with a connection corresponding to the contact.
  • a hole is used for connecting the outer layer and the inner layer of the interposer, and the connection hole is located in the gap between the contacts.
  • the contact point is a regular polygon structure, and the number of sides of the contact point is greater than four.
  • a plurality of the contacts are distributed in a rectangular array; the connection holes are via holes and are located in the gaps between the diagonally arranged contacts.
  • the diameter of the via hole is circular, and the center of the via hole is located on a line connecting the centers of the contacts disposed diagonally or an extension line of the center line.
  • the via is tangent to an edge of at least one of the contacts.
  • the contact has a regular octagonal structure, the diameter of the inscribed circle of the contact is 0.75 mm, and the diameter of the via hole is greater than or equal to 0.2 mm.
  • the socket further includes a housing, the positioning post and the conductive elastic pin are both disposed on the housing, the two ends of the conductive elastic pin respectively extend beyond the two sides of the housing, so the Both ends of the conductive elastic pins are respectively abutted against the contacts on the adapter board and the DMD chip.
  • the conductive elastic needle includes a limiting portion provided in the housing and two abutting portions bent and connected to both ends of the limiting portion, and the abutting portions are bent and connected to the On the limiting part, the conductive elastic needle has elasticity; the abutting part protrudes from the casing.
  • the opto-mechanical assembly further includes a heat sink, and the heat sink is disposed on a side of the adapter board facing away from the DMD chip.
  • the optomechanical assembly further includes a lens unit, the lens unit is electrically connected to the DMD chip, and configured to receive the digital optical signal transmitted by the DMD chip, and amplify the digital optical signal to the outside projection.
  • an opto-mechanical assembly including a DMD chip, a socket, and an adapter board; one side of the socket is connected to the DMD chip, and the other side is protruded with positioning posts and conductive spring pins; the adapter board is provided with A positioning hole adapted to the positioning post, and a contact point abutting against the conductive elastic needle; the positioning hole and the positioning post are gap-fitted, so that the conductive elastic needle is offset on the contact point A movable circumference is formed, and the movable circumference is located within the enclosing range of the contacts; the side of the adapter plate with the contacts is provided with connecting holes corresponding to the contacts for connecting the adapters For the outer and inner layers of the board, the connection holes are located outside the active circumference.
  • the contact is circular, and the diameter of the contact is greater than or equal to the diameter of the active circumference of the conductive pin.
  • a plurality of said contacts are distributed in a rectangular array; so that the connection holes are all or partially located in the gaps between the diagonally disposed contacts.
  • the diameter of the connection hole is circular, and the center of the connection hole is located on a line connecting the centers of the contacts disposed diagonally or an extension line of the center line.
  • connection hole is a via hole, and the via hole is located outside the contact.
  • connection hole is a blind hole
  • edge of the blind hole is tangent to the edge of the movable circumference of the conductive elastic pin.
  • the edges of the contacts coincide with the edges of the active circumference.
  • the socket further includes a housing, the positioning post and the conductive elastic pin are both disposed on the housing, the two ends of the conductive elastic pin respectively extend beyond the two sides of the housing, so the Both ends of the conductive elastic pins are respectively abutted against the contacts on the adapter board and the DMD chip.
  • the conductive elastic needle includes a limiting portion provided in the housing and two abutting portions bent and connected to both ends of the limiting portion, and the abutting portions are bent and connected to the On the limiting part, the conductive elastic needle has elasticity; the abutting part protrudes from the casing.
  • the optomechanical assembly further includes a lens unit, the lens unit is electrically connected to the DMD chip, and configured to receive the digital optical signal transmitted by the DMD chip, and amplify the digital optical signal to the outside projection.
  • FIG. 1 is a schematic structural diagram of a display device according to some embodiments of the present application.
  • FIG. 2 is a schematic structural diagram of a display device according to other embodiments of the present application.
  • FIG. 3 is a connection block diagram of an opto-mechanical assembly according to some embodiments of the present application.
  • FIG. 4 is a schematic structural diagram of a DMD chip according to some embodiments of the present application.
  • FIG. 5 is a schematic structural diagram of a socket according to some embodiments of the present application.
  • FIG. 6 is a partial schematic diagram of a cross-sectional structure of a socket according to some embodiments of the present application.
  • FIG. 7-9 are schematic structural diagrams of an adapter board according to some embodiments of the present application.
  • a display screen
  • b opto-mechanical assembly
  • 100 DMD chip
  • 110 contact point
  • 200 adapter board
  • 210 positioning hole
  • 220 contact point
  • 230 connection hole
  • 300 socket
  • 310 shell
  • 320 positioning column
  • 330 conductive bullet
  • 390 movable circle
  • 400 radiator.
  • the DMD chip is generally connected to an adapter board (PCB board) through a socket, and the adapter board receives a corresponding signal, and transmits the signal to the DMD chip through the socket.
  • Corresponding spring pins are arranged on the socket, and a large-area pad structure is usually used on the adapter board to form contacts on the adapter board.
  • the connection board and the DMD chip are connected.
  • the adapter board is generally a multi-layer printing structure, and the outer layer of the adapter board is provided with via holes or blind holes to connect the outer layer and the inner layer of the adapter board. Through holes or blind holes are arranged at the contact points of the adapter board to connect the inner and outer layers of the adapter board. However, there are vias or blind holes at the contacts.
  • FIG. 1 is a schematic structural diagram of a display device according to some embodiments of the present application.
  • this embodiment provides a display device including a display screen a and an optomechanical assembly b.
  • the opto-mechanical assembly b is a structure capable of projecting an image to the outside, so that the display device can directly display the image information, and can also project the image information to the outside.
  • the optomechanical component b is embedded in the display screen a; in some embodiments, the optomechanical component b is mounted on the display screen a and extends beyond the display screen a, so that the optomechanical component b is projected to display a. In some embodiments, the opto-mechanical assembly b is installed below the display screen, in the left and right directions, etc. The application does not limit the installation position of the opto-mechanical assembly.
  • the display screen may be a component with a display function, such as a television set.
  • the display screen is a projection screen, which is a curtain structure, and the display screen is projected to display images.
  • FIG. 2 is a schematic structural diagram of a display device according to other embodiments of the present application.
  • the display screen and the opto-mechanical assembly may be integrated, or may be a separate structure of a split type.
  • the present application does not limit the combination of the display screen and the opto-mechanical assembly.
  • the optomechanical assembly can be installed on the display screen a or used alone.
  • FIG. 3 is a connection block diagram of an opto-mechanical assembly according to some embodiments of the present application.
  • this embodiment provides an opto-mechanical assembly b, which includes a DMD unit, a display driving unit, an audio and video unit, a light source unit, and a lens unit.
  • the display driving unit outputs video electrical signals and video timing control electrical signals
  • the light source unit outputs optical signals.
  • the DMD chip receives the electrical signals output by the display driving unit and the optical signals sent by the light source unit, and outputs digital optical signals.
  • the lens unit is electrically connected to the DMD chip, and is used for receiving the digital light signal output by the DMD chip, amplifying the digital light signal and then projecting it outward to display image information on the projection screen.
  • the audio and video unit is electrically connected to the display driving unit, and is used for sending a video VB1 signal to the display driving unit, and can transmit audio information to the outside.
  • the audio and video unit includes an audio and video module and a storage module.
  • the audio and video module is used to receive and decode various video format signals such as RF input, HDMI, USB, RJ45, etc., and output it to the display drive unit in VB1 signal format.
  • the audio and video module can also process various external input audio signals and video signals, such as touch key input, infrared remote control and light sensing input, far-field pickup signal input, U disk signal input, etc.
  • the audio and video unit also includes a power amplifier module, the audio and video module outputs audio signals and audio control signals to the power amplifier module, and the power amplifier module drives the speaker to output sound.
  • the light source unit includes a light source driving module and a light source module connected to the light source driving module; the light source driving module receives the light source driving signal sent by the display driving unit, drives the laser in the light source unit, and adjusts the brightness of the laser in the light source unit to turn on and off, so as to A white light source is emitted on the light source unit.
  • a solid-state laser with three primary colors of red, green, and blue is used as the light source module, or a solid-state laser is used to excite fluorescent substances as the light source module, or a solid-state laser combined with an LED (Light-Emitting Diode, light-emitting diode) light source is used as the light source module Wait.
  • the display driving unit includes a display driving module, an MCU control module and a storage module; the display driving module is connected to the MCU control module and the storage module, and the display driving module receives the VB1 signal output by the audio and video module, and converts it into a corresponding video video
  • the signal and video timing control the electrical signal, and control the MCU control module to send out the audio control signal and the light source driving signal.
  • the video electrical signal and the video timing control electrical signal are sent to the DMD unit and converted into digital optical signals in the DMD unit.
  • the audio control signal is sent to the audio and video module to control the audio signal to be sent by the video module to the power amplifier module.
  • the optomechanical assembly b further includes an eye guard unit, and the eye guard unit captures the thermal infrared signal emitted by the moving person, and converts the thermal infrared signal into an analog electrical signal.
  • the interior is composed of amplifying circuit, comparison circuit and flip-flop circuit.
  • the light source unit emits light beams of three primary colors, and the light beams of the three primary colors are integrated and processed by the lenses in the light source unit, and then irradiated to the surface of the DMD chip, and then the integrated light beams are reflected by the DMD chip.
  • the lens unit To the lens unit, it is diffused by the lens unit and then emitted to the outside curtain or curtain wall, so as to realize the display of colorful pictures on the curtain or curtain wall.
  • the DMD unit includes a DMD chip 100 , a riser board 200 , and a socket 300 connecting the DMD chip 100 and the riser board 200 .
  • the adapter board 200 receives video electrical signals, video timing control electrical signals, and optical signals, and transmits the corresponding electrical signals and optical signals to the DMD chip 100 through the socket 300 .
  • the DMD chip 100 converts the input optical signal and electrical signal into a digital electrical signal, and outputs the digital electrical signal to the lens unit.
  • the lens unit amplifies the digital electrical signal and projects it outward.
  • FIG. 4 is a schematic structural diagram of a DMD chip according to some embodiments of the present application.
  • the DMD chip 100 is a plate-like structure, and a plurality of contacts 110 for connecting with the socket 300 are disposed on the DMD chip 100 at intervals.
  • a plurality of contacts 110 are arranged at intervals. In this embodiment, the plurality of contacts 110 are distributed in a rectangular array.
  • FIG. 5 is a schematic structural diagram of a socket according to some embodiments of the present application.
  • 6 is a partial schematic diagram of a cross-sectional structure of a socket according to some embodiments of the present application.
  • the socket 300 further includes a housing 310 , a positioning post 320 and a conductive elastic pin 330 disposed on the housing 310 .
  • the casing 310 is a plate-like structure, and two ends of the conductive elastic pin 330 respectively extend beyond the two sides of the casing 310 .
  • One end of the conductive spring pin 330 is connected to the contact 110 on the DMD chip 100, so that one side of the socket 300 is connected to the DMD chip 100, and the other end of the conductive spring pin 330 is connected to the corresponding structure on the adapter board 200, so as to conduct the adapter board 200 and the DMD chip 100.
  • DMD chip 100 One end of the conductive spring pin 330 is connected to the contact 110 on the DMD chip 100, so that one side of the socket 300 is connected to the DMD chip 100, and the other end of the conductive spring pin 330 is connected to the corresponding structure on the adapter board 200, so as to conduct the adapter board 200 and the DMD chip 100.
  • DMD chip 100 One end of the conductive spring pin 330 is connected to the contact 110 on the DMD chip 100, so that one side of the socket 300 is connected to the DMD chip 100, and the other end of the conductive spring pin 330 is connected to the corresponding structure on the adapter board 200, so as to conduct the adapter board 200 and the D
  • the positioning post 320 is protruded from the side of the housing 310 facing the adapter board 200 .
  • the conductive elastic pin 330 includes a limiting portion 331 disposed in the housing 310 and two abutting portions 332 bent and connected to both ends of the limiting portion 331 , and the abutting portions 332 are bent and connected to the limiting portion 331 , so that the conductive pin 330 has elasticity, and can be elastically pressed on the adapter board 200 and the DMD chip 100 .
  • the socket 300 is clamped between the adapter board 200 and the DMD chip 100 , and the abutting portion 332 protrudes from the housing 310 , so that both ends of the conductive spring pins 330 abut on the adapter board 200 and the DMD, respectively.
  • the conductive bullet 330 is made of metal material, so that the conductive bullet 330 can transmit electrical signals.
  • the conductive elastic pin 330 is integrally formed.
  • the two abutting portions 332 of the conductive elastic needle 330 can slide relative to the limiting portion 331 , and an elastic member is disposed between the abutting portions 332 and the limiting portion 331 , so that the abutting portion 332 can press Combined on the adapter board 200 and the DMD chip 100 .
  • FIGS. 7 and 8 are schematic structural diagrams of an adapter board according to some embodiments of the present application.
  • the adapter plate 200 is provided with positioning holes 210 adapted to the positioning posts 320 of the socket 300 and contacts 220 abutting against the conductive elastic pins 330 .
  • the positioning hole 210 and the positioning post 320 are gap-fitted, so that the conductive elastic pin 330 is offset on the contact 220 to form a movable circle 390, and the movable circle 390 is located within the enclosed range of the contact 220, so as to ensure that the conductive elastic pin 330 can always be connected with the contact point 220.
  • the contacts 220 are in contact, thereby ensuring the connection between the socket 300 and the adapter board 200 .
  • the diameter of the positioning post 320 is 1.92 ⁇ 0.03mm
  • the diameter of the positioning hole 210 is 2.00 ⁇ 0.05mm
  • the outer circumference of the conductive bullet needle 330 is offset by 0.16m in all directions, which is the active circumference 390 of the conductive bullet needle 330 .
  • the radius of the conductive bullet needle 330 is D, and the maximum offset of the conductive bullet needle 330 is D, so that the active circumference 390 of the conductive bullet needle 330 is 2(D+H).
  • the movable circumference of the conductive pin 330 is 0.6 mm, the contact point 220 is a square, and the side length is 0.75 mm.
  • the adapter board 200 is a multi-layer printed structure.
  • the side of the adapter board 200 with the contacts 220 is provided with connection holes 230 corresponding to the contacts 220 for connecting the outer layer and the inner layer of the adapter board 200.
  • the connection holes 230 The conductive elastic pin 330 is located outside the movable circle 390 of the contact 220, which prevents the contact 220 from being deformed within the movable range of the conductive elastic pin 330, thereby effectively ensuring the effective contact between the conductive elastic pin 330 and the contact 220, and effectively to ensure the quality of the signal transmission between the DMD chip 100 and the adapter board 200 and the reliability of the opto-mechanical assembly.
  • connection hole 230 is a blind hole
  • the blind hole is located outside the movable circumference 390 of the conductive elastic pin 330
  • all or part of the blind hole is located within the enclosed range of the contact 220 to ensure the contact between the blind hole and the contact 220 and connection to ensure the connection between the contacts 220 on the outer layer of the interposer board 200 and the inner layer.
  • the movable circumference 390 and the blind hole of the conductive elastic pin 330 are both located within the enclosed range of the contact 220 .
  • the contact 220 has a square structure, and the blind holes are all located within the enclosed range of the contact 220 to avoid mutual interference between corresponding blind holes of adjacent contacts 220 .
  • the contact 220 When the contact 220 has a square structure, there is a larger gap between the edge of the contact 220 in the direction of the diagonal and the movable circumference 390 .
  • the hole diameter of the blind hole is circular, and the center of the blind hole is located on the diagonal line of the contact 220, so that the blind hole is located on the contact 220 and outside the movable circle 390, and can be set larger to ensure greater current flow through .
  • the edge of the blind hole is tangent to the edge of the movable circumference 390 of the conductive pin 330 .
  • the blind holes are arranged to be larger.
  • the blind holes between adjacent contacts 220 are set larger.
  • a plurality of blind holes are correspondingly disposed within the enclosed range of each contact 220 to ensure that the current that can be transmitted between the blind holes is larger.
  • Four blind holes are provided corresponding to each contact 220 , and are provided corresponding to each diagonal corner of the contact 220 .
  • contacts 220 are provided every 1 mm in one direction.
  • the contact 220 has a square structure, the side length of the contact 220 is 0.75 mm, and the edge of the contact 220 is tangent to the movable circumference 390 .
  • the blind holes are located inside the contact 220 and outside the movable circle 390 , the center of the blind hole is located on the diagonal line of the contact 220 , and the number of blind holes is four, and the blind holes are arranged corresponding to each diagonal corner of the contact 220 .
  • FIG. 9 is a partial structural schematic diagram of another embodiment of the adapter board 200 shown in FIG. 7 .
  • the connection hole 230 is a blind hole
  • the blind hole is located outside the movable circumference 390 of the conductive elastic pin 330
  • the blind hole is partially located within the enclosed range of the contact 220 to connect the contact 220 , so as to ensure the contact and connection between the blind hole and the contact 220 , so as to ensure the connection between the contact 220 on the outer layer of the adapter board 200 and the inner layer.
  • the part of the blind hole is located outside the enclosed range of the contacts 220 , so that blind holes with larger diameters can be arranged between the plurality of contacts 220 .
  • blind holes When the diameter of the blind hole is set larger, fewer blind holes can be set, which can satisfy the connection between the inner and outer layers of the adapter plate.
  • the blind holes when part of the blind holes is located within the enclosed range of the contact 220 and part of the blind hole is located outside the enclosed range of the contact 220 , there are two blind holes.
  • blind holes may be provided in one, three or other numbers.
  • the shape of the contact can be various shapes, such as a square, a circle, and a polygon.
  • FIGS. 10-11 are schematic structural diagrams of adapter boards according to other embodiments of the present application.
  • the adapter plate 200 is provided with positioning holes 210 adapted to the positioning posts 320 of the socket 300 , and a plurality of contacts 220 abutting against the conductive elastic pins 330 . There are gaps between adjacent contacts 220 .
  • the positioning hole 210 and the positioning post 320 are gap-fitted, so that the conductive elastic pin 330 is offset on the contact 220 to form a movable circle 390, and the movable circle 390 is located within the enclosed range of the contact 220, so as to ensure that the conductive elastic pin 330 can always be connected with the contact point 220.
  • the contacts 220 are in contact, thereby ensuring the connection between the socket 300 and the adapter board 200 .
  • the adapter board 200 is a multi-layer printed structure.
  • the side of the adapter board 200 with the contacts 220 is provided with connection holes 230 corresponding to the contacts 220 for connecting the outer layer and the inner layer of the adapter board 200.
  • the connection holes 230 The conductive elastic pin 330 is located outside the movable circle 390 of the contact 220, which prevents the contact 220 from being deformed within the movable range of the conductive elastic pin 330, thereby effectively ensuring the effective contact between the conductive elastic pin 330 and the contact 220, and effectively to ensure the quality of the signal transmission between the DMD chip 100 and the adapter board 200 and the reliability of the opto-mechanical assembly.
  • connection holes 230 are located in the gaps between the contacts 220 , so that the connection holes 230 are located outside the movable circumference 390 of the conductive elastic pins 330 , so as to prevent the contacts 220 from being located within the movable circles 390 of the conductive elastic pins 330 . deformed.
  • the contact 220 is a regular polygon structure, and the number of sides of the contact 220 is greater than four; so that there is a larger gap between the contacts 220, and the connection hole 230 in the gap between the contacts 220 can be set larger, so as to facilitate greater current flows.
  • the plurality of contacts 220 are distributed in a rectangular array; the connection holes 230 are via holes, and are located in the gaps between the diagonally arranged contacts 220, and the diagonally arranged contacts 220 have larger diameters. gap, so that the setting of the via hole is more convenient, and the via hole can be set larger.
  • the hole diameter of the via hole is circular, and the center of the via hole is located on the line connecting the centers of the diagonally disposed contacts 220 or the extension line of the center line.
  • the via hole is tangent to the edge of at least one contact 220 , so that the via hole and the contact 220 are connected, and the via hole can be set larger in the gap between adjacent contacts 220 .
  • the vias and contacts 220 are connected by wires, solder lines, and other connecting structures.
  • the edge of the contact 220 is tangent to the active circumference 390 of the conductive pin 330 .
  • the contact 220 has a regular octagonal structure, and the diameter of the via hole is greater than or equal to 0.2 mm. Specifically, the diameter of the via hole is 0.4mm-0.47mm.
  • the adapter plate 200 is provided with positioning holes 210 adapted to the positioning posts 320 of the socket 300 , and a plurality of contacts 220 abutting against the conductive elastic pins 330 .
  • the adjacent contacts 220 with a gap between them.
  • the positioning hole 210 and the positioning post 320 are gap-fitted, so that the conductive elastic pin 330 is offset on the contact 220 to form a movable circle 390, and the movable circle 390 is located within the enclosed range of the contact 220, so as to ensure that the conductive elastic pin 330 can always be connected with the contact point 220.
  • the contacts 220 are in contact, thereby ensuring the connection between the socket 300 and the adapter board 200 .
  • the adapter board 200 is a multi-layer printed structure.
  • the side of the adapter board 200 with the contacts 220 is provided with connection holes 230 corresponding to the contacts 220 for connecting the outer layer and the inner layer of the adapter board 200.
  • the connection holes 230 The conductive elastic pin 330 is located outside the movable circle 390 of the contact 220, which prevents the contact 220 from being deformed within the movable range of the conductive elastic pin 330, thereby effectively ensuring the effective contact between the conductive elastic pin 330 and the contact 220, and effectively to ensure the quality of the signal transmission between the DMD chip 100 and the adapter board 200 and the reliability of the opto-mechanical assembly.
  • the contact 220 is circular, and the diameter of the contact 220 is greater than or equal to the diameter of the movable circumference 390 of the conductive elastic pin 330 , so that the movable circumference 390 is located within the enclosed range of the contact 220 .
  • the plurality of contacts 220 are distributed in a rectangular array; all or part of the connection holes 230 are located in the gaps between the contacts 220 arranged diagonally.
  • the connecting hole 230 is a blind hole, and the edge of the blind hole is tangent to the edge of the movable circumference 390 .
  • the diameter of the contact 220 is equal to the diameter of the movable circumference 390 , that is, when the edge of the contact 220 and the edge of the movable circumference 390 are coincident, the edge of the blind hole is tangent to the edge of the movable circumference 390 and the edge of the contact 220 at the same time.
  • the edge of the blind hole is tangent to the edge of the movable circumference 390 , and the blind hole is wholly or partially located within the enclosed range of the contact 220 .
  • connection holes 230 are blind holes, there are four blind holes corresponding to each contact 220 . And the center of the blind hole is located on the line connecting the centers of the diagonally disposed contacts 220 or the extension line of the center line.
  • connection hole 230 is a via hole, and the via hole is located outside the contact 220 .
  • the center of the blind hole is located on the line connecting the centers of the diagonally arranged contacts 220 or the extension line of the center line.
  • the DMD unit further includes a heat sink 400 , and the heat sink 400 is disposed on the side of the interposer board 200 facing away from the DMD chip 100 to dissipate heat from the interposer board 200 .
  • the movable circumference 290 is located within the enclosed range of the contacts 220 to ensure the connection between the contacts 220 on the outer layer of the adapter board 200 and the inner layer.
  • the connection hole 230 is located outside the movable circle 390, which prevents the contact 220 from being deformed within the movable range of the conductive elastic pin 330, and ensures the flatness of the contact 220, thereby effectively ensuring the effective contact between the conductive elastic pin 330 and the contact 220. , effectively ensuring the quality of signal transmission between the DMD chip 100 and the adapter board 200 and the reliability of the opto-mechanical assembly.
  • connection holes 230 are arranged on the diagonal lines of the contacts 220, or on the diagonal connection lines or the extension lines of the connection lines of the contacts 220 arranged diagonally, the adapter board 200 is formed on the movable circumference 390 with Sufficient clearance to set connection holes.
  • connection holes 230 are arranged in a polygonal or circular shape, there is sufficient clearance between the contacts 220 arranged diagonally, so as to be used for arrangement of via holes.
  • the current-carrying capacity of the via hole is large, which ensures the connection between the outer layer and the inner layer of the adapter plate 200 .

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Abstract

一种显示装置及其光机组件（b），光机组件（b）包括DMD芯片（100）、插座（300）以及转接板（200）；插座（300）一面连接DMD芯片（100），另一面凸设有定位柱（320）和导电弹针（330）；转接板（200）上设置有与定位柱（320）相适配的定位孔（210）、以及与导电弹针（330）相抵接的触点（220）；定位孔（210）和定位柱（320）间隙配合，使得导电弹针（330）在触点（220）上偏移而形成活动圆周（390），活动圆周（390）位于触点（220）的围合范围内；转接板（200）的设置有触点（220）的一面对应触点（220）还设置有盲孔，盲孔全部或部分位于触点（220）的围合范围内，以保证转接板（200）外层的触点（220）和内层之间的连接；盲孔位于导电弹针（330）的活动圆周（390）外，避免了触点（220）于导电弹针（330）的活动范围内发生变形，从而有效的保证了导电弹针（330）和触点（220）的有效接触。

Description

显示装置及其光机组件
本申请要求于2021年2月9日提交的、申请号为202120367083.3；于2021年2月9日提交的、申请号为202120368614.0；于2021年2月9日提交的、申请号为202120368735.5；于2021年2月19日提交的、申请号为202120380307.4；于2021年2月19日提交的、申请号为202120380310.6；于2021年2月19日提交的、申请号为202120379729.X的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及投影技术领域，具体而言，涉及一种显示装置及其光机组件。
背景技术
由于DLP(Digtal Light Procession，数字光处理)投影机具有原生对比度高、机器小型化、光路采用封闭式等特点，使其越来越受到用户的青睐，其中，DLP投影仪采用的是以数字微镜器件(Digital Micromirror Device，DMD)芯片作为成像器件，通过调节反射光实现投影图像的一种投影技术。在投影设备技术领域，DMD芯片是投影机中的核心部件，由激光器发出后通过一系列光学镜片的光束到达DMD芯片，DMD芯片对光信号进行处理，最终形成图像。
相关技术中，DMD芯片一般通过插座连接转接板(PCB板)，转接板接收相应的信号，并通过插座将信号传递给DMD芯片。插座上设置有相应的弹针，转接板上通常使用大面积的焊盘结构而在转接板上形成触点，插座上的弹针压接在转接板的触点上，从而使得转接板和DMD芯片导通。转接板一般为多层印刷结构，转接板的外层上设置有过孔或盲孔以连接转接板的外层和内层。通孔或盲孔设置于转接板的触点处，以连接转接板的内外层。但是，在触点处开设过孔或盲孔。触点在受到弹针的压力作用时，触点容易下凹，而导致插座上的弹针和触点接触不良，从而影响DMD芯片和转接板之间的信号传递的质量以及投影仪的可靠性。
发明内容
本申请一些实施例提供一种显示装置及其光机组件，其中，光机组件，包括DMD芯片、插座以及转接板；插座一面连接所述DMD芯片，另一面凸设有定位柱和导电弹针；转接板上设置有与所述定位柱相适配的定位孔、以及与所述导电弹针相抵接的触点；所述定位孔和所述定位柱间隙配合，使得所述导电弹针在所述触点上偏移而形成活动圆周，所述活动圆周位于所述触点的围合范围内；所述转接板的设置有触点的一面对应所述触点还设置有盲孔，所述盲孔全部或部分位于所述触点的围合范围内，以用于连接所述转接板的外层和内层，所述盲孔位于所述导电弹针的所述活动圆周外。
在一些实施例中，所述触点为方形结构，所述盲孔位于所述触点的围合范围内。
在一些实施例中，所述盲孔的孔径为圆形，所述盲孔的圆心位于所述触点的对角线上。
在一些实施例中，所述盲孔的边缘和所述导电弹针的所述活动圆周的边缘相切。
在一些实施例中，每个所述触点的围合范围内对应设置有多个盲孔。
在一些实施例中，所述盲孔对应每个所述触点设置为四个，并对应所述触点的每个对角设置。
在一些实施例中，所述导电弹针的所述活动圆周以及所述盲孔均位于所述触点的围合范围内。
在一些实施例中，所述插座还包括壳体，所述定位柱和所述导电弹针均设置于所壳体上，所述导电弹针的两端分别超出所述壳体的两面，所述导电弹针的两端分别抵接于所述转接板上的触点和所述DMD芯片。
在一些实施例中，所述导电弹针包括设置在所述壳体内的限位部以及弯折连接在所述限位部两端的两个抵接部，所述抵接部弯折连接在所述限位部上，使得所述导电弹针具有弹性；所述抵接部突出所述壳体。
在一些实施例中，所述光机组件还包括镜头单元，所述镜头单元电连接于所述DMD芯片，用于接收所述DMD芯片输送的数字光信号，并对数字光信号放大后向外投射。
本申请一些实施例提供一种显示装置，包括显示屏、以及上述的光机组件。
本申请一些实施例提供一种光机组件，包括DMD芯片、插座以及转接板；插座一面连接所述DMD芯片，另一面凸设有定位柱和导电弹针；转接板上设置有与所述定位柱相适配的定位孔、以及与所述导电弹针相抵接的多个触点；所述触点之间具有间隙；所述定位孔和所述定位柱间隙配合，使得所述导电弹针在所述触点上偏移而形成活动圆周，所述活动圆周位于所述触点的围合范围内；所述转接板的设置有触点的一面对应所述触点设置有连接孔，以用于连接所述转接板的外层和内层，所述连接孔位于所述触点之间的间隙内。
在一些实施例中，所述触点为正多边形结构，所述触点的边长数量大于四条。
在一些实施例中，多个所述触点呈矩形阵列分布；所述连接孔为过孔，且位于对角设置的触点之间的间隙内。
在一些实施例中，所述过孔的孔径为圆形，所述过孔的圆心位于对角设置的所述触点的中心的连线或中心连线的延长线上。
在一些实施例中，所述过孔与至少一个所述触点的边缘相切。
在一些实施例中，所述触点为正八边形结构，所述触点的内切圆的直径为0.75mm，所述过孔的直径大于或等于0.2mm。
在一些实施例中，所述插座还包括壳体，所述定位柱和所述导电弹针均设置于所壳体上，所述导电弹针的两端分别超出所述壳体的两面，所述导电弹针的两端分别抵接于所述转接板上的触点和所述DMD芯片。
在一些实施例中，所述导电弹针包括设置在所述壳体内的限位部以及弯折连接在所述限位部两端的两个抵接部，所述抵接部弯折连接在所述限位部上，使得所述导电弹针具有弹性；所述抵接部突出所述壳体。
在一些实施例中，所述光机组件还包括散热器，所述散热器设置于所述转接板的背向所述DMD芯片的一面。
在一些实施例中，所述光机组件还包括镜头单元，所述镜头单元电连接于所述DMD芯片，用于接收所述DMD芯片输送的数字光信号，并对数字光信号放大后向外 投射。
本申请一些实施例提供一种光机组件，包括DMD芯片、插座、以及转接板；插座一面连接所述DMD芯片，另一面凸设有定位柱和导电弹针；转接板上设置有与所述定位柱相适配的定位孔、以及与所述导电弹针相抵接的触点；所述定位孔和所述定位柱间隙配合，使得所述导电弹针在所述触点上偏移而形成活动圆周，所述活动圆周位于所述触点的围合范围内；所述转接板的设置有触点的一面对应所述触点设置有连接孔，以用于连接所述转接板的外层和内层，所述连接孔位于所述活动圆周外。
在一些实施例中，所述触点为圆形，所述触点的直径大于或等于所述导电弹针的所述活动圆周的直径。
在一些实施例中，多个所述触点呈矩形阵列分布；所以连接孔全部或部分位于对角设置的触点之间的间隙内。
在一些实施例中，所述连接孔的孔径为圆形，所述连接孔的圆心位于对角设置的所述触点的中心的连线或中心连线的延长线上。
在一些实施例中，所述连接孔为过孔，所述过孔位于所述触点外。
在一些实施例中，所述连接孔为盲孔，所述盲孔的边缘和所述导电弹针的所述活动圆周的边缘相切。
在一些实施例中，所述触点的边缘和所述活动圆周的边缘重合。
在一些实施例中，所述插座还包括壳体，所述定位柱和所述导电弹针均设置于所壳体上，所述导电弹针的两端分别超出所述壳体的两面，所述导电弹针的两端分别抵接于所述转接板上的触点和所述DMD芯片。
在一些实施例中，所述导电弹针包括设置在所述壳体内的限位部以及弯折连接在所述限位部两端的两个抵接部，所述抵接部弯折连接在所述限位部上，使得所述导电弹针具有弹性；所述抵接部突出所述壳体。
在一些实施例中，所述光机组件还包括镜头单元，所述镜头单元电连接于所述DMD芯片，用于接收所述DMD芯片输送的数字光信号，并对数字光信号放大后向外投射。
附图说明
图1为根据本申请一些实施例的显示装置的结构示意图；
图2为根据本申请另一些实施例的显示装置的结构示意图；
图3为根据本申请一些实施例的光机组件的连接框图；
图4为根据本申请一些实施例的DMD芯片结构示意图；
图5为根据本申请一些实施例的插座的结构示意图；
图6为根据本申请一些实施例插座的剖面结构的部分示意图；
图7-图9为根据本申请一些实施例的转接板的结构示意图；
图10-图11为根据本申请另一些实施例的转接板的结构示意图；
图12-图14为根据本申请另一些实施例的转接板的结构示意图。
附图标记说明如下：
a、显示屏；b、光机组件；100、DMD芯片；110、接点；200、转接板；210、定位孔；220、触点；230、连接孔；300、插座；310、壳体；320、定位柱；330、导电弹针； 331、限位部；332、抵接部；390、活动圆周；400、散热器。
具体实施方式
为使本申请的目的、实施方式和优点更加清楚，下面将结合本申请示例性实施例中的附图，对本申请示例性实施方式进行清楚、完整地描述，显然，所描述的示例性实施例仅是本申请一部分实施例，而不是全部的实施例。
相关技术中，DMD芯片一般通过插座连接转接板(PCB板)，转接板接收相应的信号，并通过插座将信号传递给DMD芯片。插座上设置有相应的弹针，转接板上通常使用大面积的焊盘结构而在转接板上形成触点，插座上的弹针压接在转接板的触点上，从而使得转接板和DMD芯片导通。转接板一般为多层印刷结构，转接板的外层上设置有过孔或盲孔以连接转接板的外层和内层。通孔或盲孔设置于转接板的触点处，以连接转接板的内外层。但是，在触点处开设过孔或盲孔。触点在受到弹针的压力作用时，触点容易下凹，而导致插座上的弹针和触点接触不良，从而影响DMD芯片和转接板之间的信号传递的质量以及投影仪的可靠性。
图1为根据本申请一些实施例的显示装置的结构示意图。参阅图1，本实施例提供了一种显示装置，包括显示屏a、以及光机组件b。本实施例中，光机组件b为能够向外投影图像的结构，以使得显示装置能够直接显示图像信息，也能够将向外投影图像信息。
在一些实施例中，光机组件b嵌装于显示屏a内；在一些实施例中，光机组件b安装于显示屏a上，并向外超出显示屏a，以使得光机组件b投影到显示屏a上。在一些实施例中，光机组件b安装于显示屏的下方、左右方向等，本申请对光机组件的安装位置不做限定。
在一些实施例中，显示屏可以为电视机等具有显示功能的组件。在另一些实施例中，显示屏为投影屏幕，其为幕布结构，显示屏是接受投影用来显示画面的。
图2为根据本申请另一些实施例的显示装置的结构示意图。参阅图1和图2，在一些实施例中，显示屏和光机组件可以装设为一体，也可以为分体式的单独的结构，本申请对显示屏和光机组件的组合方式不做限定。光机组件可以装设在显示屏a上，也可以单独使用。
图3为根据本申请一些实施例的光机组件的连接框图。参阅图3，本实施例提供了一种光机组件b，包括DMD单元、显示驱动单元、音视频单元、光源单元以及镜头单元。显示驱动单元输出视频电信号和视频时序控制电信号、光源单元输出光信号，DMD芯片接收显示驱动单元输出的电信号以及光源单元输送的光信号，并输出数字光信号。镜头单元电连接于DMD芯片，用于接收DMD芯片输出的数字光信号，并对数字光信号放大后向外投射，以在投影屏幕上显示图像信息。音视频单元电连接于显示驱动单元，用于向显示驱动单元发出视频VB1信号，并能够向外传递音频信息。
音视频单元包括音视频模块、以及存储模块。音视频模块用于接收对射频输入、HDMI、USB、RJ45等各种视频格式信号进行解码并以VB1信号格式输出至显示驱动单元。音视频模块还能够处理各种外部输入的音频信号和视频信号，如触控按键输入、红外遥控和光感输入、远场拾音信号输入、U盘信号输入等。
音视频单元还包括功放模块，音视频模块输出音频信号和音频控制信号给功放模块，功放模块驱动扬声器输出声音。
光源单元包括光源驱动模块以及连接于光源驱动模块的光源模块；光源驱动模块接收显示驱动单元发出的光源驱动信号，驱动光源单元中的激光器、并调整光源单元中的激光器的亮度打开、关闭，以在光源单元上发出白光光源。在一个实施例中，使用红、绿、蓝三基色固态激光器作为光源模块，或者使用固态激光器激发荧光物质作为光源模块，或者使用固态激光器结合LED(Light-Emitting Diode，发光二极管)光源作为光源模块等。
本实施例中，显示驱动单元包括显示驱动模块、MCU控制模块以及存储模块；显示驱动模块连接MCU控制模块以及存储模块，显示驱动模块接收音视频模块输出的VB1信号，并转换成相应的视频电信号和视频时序控制电信号，并控制MCU控制模块发出音频控制信号以及光源驱动信号。
视频电信号和视频时序控制电信号输送至DMD单元，并在DMD单元中转换成数字光信号。音频控制信号输送至音视频模块，以控制因视频模块向功放模块发出音频信号。
本实施例中，光机组件b还包括护眼板单元，护眼板单元捕获移动的人发出的热红外信号，将热红外信号转化为模拟电信号。内部由放大电路、比较电路、触发器电路组成。通过检测移动的人，从而控制光机组件的工作。
光机组件b的使用过程中，光源单元发出三基色光束，且该三基色光束通过光源单元中的镜片进行整合处理后，照射至DMD芯片表面，再通过DMD芯片将整合处理后的光束旋转反射至镜头单元，以经过镜头单元扩散后出射至外界的幕布或幕墙上，实现在幕布或幕墙上多彩画面的显示。
在一些实施例中，DMD单元包括DMD芯片100、转接板200以及连接DMD芯片100和转接板200的插座300。转接板200接收视频电信号、视频时序控制电信号、光信号，并将相应的电信号和光信号经过插座300的传递输送至DMD芯片100。DMD芯片100接收光信号和电信号后，将输入的光信号和电信号转化成数字电信号，并将数字电信号输出至镜头单元，镜头单元对数字电信号放大后向外投影。
图4为根据本申请一些实施例的DMD芯片结构示意图。参阅图4，DMD芯片100为板状结构，DMD芯片100上间隔设置有多个用于与插座300连接的接点110。多个接点110间隔设置。本实施例中，多个接点110呈矩形阵列分布。
图5为根据本申请一些实施例的插座的结构示意图。图6为根据本申请一些实施例插座的剖面结构的部分示意图。参阅图3至图6，本实施例中，插座300还包括壳体310、设置于壳体310上的定位柱320和导电弹针330。壳体310为板状结构，导电弹针330的两端分别超出壳体310的两面。导电弹针330的一端连接DMD芯片100上的接点110，使得插座300的一面连接DMD芯片100，导电弹针330的另一端连接转接板200上的相应结构，以导通转接板200和DMD芯片100。
定位柱320凸设于壳体310的朝向转接板200的一面，定位柱320和转接板200上的相应的结构相适配，以将插座300限位于转接板200上。
本实施例中，导电弹针330包括设置在壳体310内的限位部331以及弯折连接在限位部331两端的两个抵接部332，抵接部332弯折连接在限位部331上，使得导电弹针330具有弹性，而能够弹性压合在转接板200和DMD芯片100上。插座300夹持在转接板200和DMD芯片100之间，且抵接部332突出壳体310，使得导电弹针330的两端分别抵接于转接板200和DMD上。导电弹针330由金属材料制成，使得导电弹针330的能够进行电信号的传递。
本实施例中，导电弹针330一体成型。在一些实施例中，导电弹针330的两个抵接部332能够相对限位部331滑动，且抵接部332和限位部331之间设置有弹性件，以使得抵接部332能够压合在转接板200和DMD芯片100上。
图7-图9为根据本申请一些实施例的转接板的结构示意图。参阅图7和图8，本实施例中，转接板200上设置有与插座300的定位柱320相适配的定位孔210、以及与导电弹针330相抵接的触点220。
定位孔210和定位柱320间隙配合，使得导电弹针330在触点220上偏移而形成活动圆周390，活动圆周390位于触点220的围合范围内，以保证导电弹针330始终能够和触点220接触，从而保证插座300和转接板200的连接。
在一些实施例中，定位柱320的直径为1.92±0.03mm，定位孔210的直径为2.00±0.05mm，导电弹针330在触点220上的最大偏移量为(2-1.92)+0.03+0.05＝0.16mm。导电弹针330的外周向着各个方向偏移0.16m，即为导电弹针330的活动圆周390。
导电弹针330的半径为D，导电弹针330的最大偏移量为D，得出导电弹针330的活动圆周390为2(D+H)。例如，导电弹针330的活动圆周为0.6mm，触点220为正方形，边长为0.75mm。
转接板200为多层印刷结构，转接板200的设置有触点220的一面对应触点220设置有连接孔230，以用于连接转接板200的外层和内层，连接孔230位于导电弹针330在触点220的活动圆周390外，避免了触点220于导电弹针330的活动范围内发生变形，从而有效的保证了导电弹针330和触点220的有效接触，有效的保证DMD芯片100和转接板200之间的信号传递的质量以及光机组件的可靠性。
本实施例中，连接孔230为盲孔，盲孔位于导电弹针330的活动圆周390外，盲孔全部或部分位于触点220的围合范围内，以保证盲孔和触点220的接触与连接，以保证转接板200外层的触点220和内层之间的连接。
本实施例中，导电弹针330的活动圆周390以及盲孔均位于触点220的围合范围内。
触点220为方形结构，盲孔全部位于触点220的围合范围内，以能够避免相邻触点220的对应盲孔之间的相互干涉。
触点220为方形结构时，触点220的对角线的方向上的边缘和活动圆周390之间具有更大的间隙。盲孔的孔径为圆形，盲孔的圆心位于触点220的对角线上，使得盲孔在触点220上且位于活动圆周390外，能够设置的更大，以保证更大的电流通过。
本实施例中，盲孔的边缘和导电弹针330的活动圆周390的边缘相切。当盲孔设置于方形触点220的围合范围内时，盲孔设置的更大。当盲孔部分位于方形触点220的围合范围外时，相邻触点220之间的盲孔设置的更大。
每个触点220的围合范围内对应设置有多个盲孔，以保证盲孔之间能够传输的电流更大。盲孔对应每个触点220设置为四个，并对应触点220的每个对角设置。
在一些实施例中，在一个方向上每1mm设置一个触点220。触点220为正方形结构，触点220的边长为0.75mm，触点220的边缘和活动圆周390相切。盲孔位于触点220内，且位于活动圆周390外，盲孔的圆心位于触点220的对角线上，盲孔设置为四个，并对应触点220的每个对角设置，盲孔的直径为0.1mm，经过计算0.1mm孔径10um壁厚的盲孔，可通过最大电流为180.7毫安。采用4个，180.7*4＝722.8毫安。而常用孔径0.2-0.3mm的一个过孔，可通过最大电流为710.4毫安，比较接近。因此，利用盲孔连接的稳定性和可 靠性都有保证。
图9是图7所述转接板200另一个实施例的部分结构示意图。参阅图7和图9，本实施例中，连接孔230为盲孔，盲孔位于导电弹针330的活动圆周390外，盲孔部分位于触点220的围合范围内，以连接触点220，以保证盲孔和触点220的接触与连接，以保证转接板200外层的触点220和内层之间的连接。且盲孔部分位于触点220的围合范围外，以使得在多个触点220之间能够设置更大孔径的盲孔。
盲孔的孔径设置的更大时，可以设置更少盲孔，即可满足转接板内外层之间的连接。本实施例中，盲孔部分位于触点220围合范围内，且部分位于触点220围合范围外时，盲孔设置为两个。在一些实施例中，盲孔可以设置为一个、三个或者其它的数量。
盲孔部分位于触点220围合范围内，且部分位于触点220围合范围外时，触点的形状可以为各种形状，如方形、圆形，多边形等结构。
图10-图11为根据本申请另一些实施例的转接板的结构示意图。参阅图10和图11，本实施例中，转接板200上设置有与插座300的定位柱320相适配的定位孔210、以及与导电弹针330相抵接的多个触点220，相邻触点220之间具有间隙。
定位孔210和定位柱320间隙配合，使得导电弹针330在触点220上偏移而形成活动圆周390，活动圆周390位于触点220的围合范围内，以保证导电弹针330始终能够和触点220接触，从而保证插座300和转接板200的连接。
转接板200为多层印刷结构，转接板200的设置有触点220的一面对应触点220设置有连接孔230，以用于连接转接板200的外层和内层，连接孔230位于导电弹针330在触点220的活动圆周390外，避免了触点220于导电弹针330的活动范围内发生变形，从而有效的保证了导电弹针330和触点220的有效接触，有效的保证DMD芯片100和转接板200之间的信号传递的质量以及光机组件的可靠性。
本实施例中，连接孔230位于触点220之间的间隙内，以使得连接孔230位于导电弹针330的活动圆周390外，避免了触点220于导电弹针330的活动圆周390内发生变形。
触点220为正多边形结构，触点220的边长数量大于四条；使得触点220之间具有更大的间隙，触点220之间的间隙内的连接孔230能够设置的更大，以便于更大的电流通过。
本实施例中，多个触点220呈矩形阵列分布；连接孔230为过孔，且位于对角设置的触点220之间的间隙内，对角设置的触点220之间具有更大的间隙，以使得过孔的设置更加的方便，且能够将过孔设置的更大。
过孔的孔径为圆形，过孔的圆心位于对角设置的触点220的中心的连线或中心连线的延长线上。
本实施例中，过孔与至少一个触点220的边缘相切，从而使得过孔和触点220连接，并保证过孔在相邻触点220之间的间隙内能够设置的更大。
在一些实施例中，过孔和触点220通过导线、焊路以及其它的连接结构连接。
在一些实施例中，触点220的边缘与导电弹针330的活动圆周390相切。触点220为正八边形结构，过孔的直径大于或等于0.2mm。具体地，过孔的直径为0.4mm-0.47mm。
图12-图14为根据本申请另一些实施例的转接板的结构示意图。参阅图12，本实施例中，转接板200上设置有与插座300的定位柱320相适配的定位孔210、以及与导电弹针330相抵接的多个触点220，相邻触点220之间具有间隙。
定位孔210和定位柱320间隙配合，使得导电弹针330在触点220上偏移而形成活动 圆周390，活动圆周390位于触点220的围合范围内，以保证导电弹针330始终能够和触点220接触，从而保证插座300和转接板200的连接。
转接板200为多层印刷结构，转接板200的设置有触点220的一面对应触点220设置有连接孔230，以用于连接转接板200的外层和内层，连接孔230位于导电弹针330在触点220的活动圆周390外，避免了触点220于导电弹针330的活动范围内发生变形，从而有效的保证了导电弹针330和触点220的有效接触，有效的保证DMD芯片100和转接板200之间的信号传递的质量以及光机组件的可靠性。
本实施例中，触点220为圆形，触点220的直径大于或等于导电弹针330的活动圆周390的直径，以使得活动圆周390位于触点220的围合范围内。
本实施例中，多个触点220呈矩形阵列分布；连接孔230全部或部分位于对角设置的触点220之间的间隙内。
参阅图12和图13，本实施例中，连接孔230为盲孔，盲孔的边缘和活动圆周390的边缘相切。在触点220的直径等于活动圆周390的直径时，即，触点220的边缘和活动圆周390的边缘重合时，盲孔的边缘同时和活动圆周390的边缘以及触点220的边缘相切。触点220的直径大于活动圆周390的直径时，盲孔的边缘和活动圆周390的边缘相切，且盲孔全部或部分位于触点220的围合范围内。
当连接孔230为盲孔时，盲孔对应每个触点220设置为四个。且盲孔的圆心位于对角设置的触点220的中心的连线或中心连线的延长线上。
参阅图12和图14，本实施例中，连接孔230为过孔，过孔位于触点220外。盲孔的圆心位于对角设置的触点220的中心的连线或中心连线的延长线上。
在一些实施例中，DMD单元还包括散热器400，散热器400设置于转接板200的背向DMD芯片100的一面，以对转接板200散热。
本申请中，活动圆周290位于触点220的围合范围内，以保证转接板200外层的触点220和内层之间的连接。连接孔230位于活动圆周390外，避免了触点220于导电弹针330的活动范围内发生变形，保证触点220的平整性，从而有效的保证了导电弹针330和触点220的有效接触，有效的保证DMD芯片100和转接板200之间的信号传递的质量以及光机组件的可靠性。
连接孔230设置于触点220的对角线上，或对角设置的触点220的对角线的连线或连线的延长线上时，使得转接板200上于活动圆周390为具有足够的间隙来设置连接孔。
连接孔230设置为多边形或圆形时，对角设置的触点220之间具有足够的间隙，以用于设置过孔。过孔的载流量大，保证转接板200的外层和内层之间的连接。间隙越大，过孔能够设置的越大，以保证转接板200的外层和内层之间能够流过足够大的电流。
虽然已参照几个典型实施方式描述了本申请，但应当理解，所用的术语是说明和示例性、而非限制性的术语。由于本申请能够以多种形式具体实施而不脱离申请的精神或实质，所以应当理解，上述实施方式不限于任何前述的细节，而应在随附权利要求所限定的精神和范围内广泛地解释，因此落入权利要求或其等效范围内的全部变化和改型都应为随附权利要求所涵盖。
为了方便解释，已经结合具体的实施方式进行了上述说明。但是，上述在一些实施例中讨论不是意图穷尽或者将实施方式限定到上述公开的具体形式。根据上述的教导，可以得到多种修改和变形。上述实施方式的选择和描述是为了更好的解释原理以及实际的应用， 从而使得本领域技术人员更好的使用实施方式以及适于具体使用考虑的各种不同的变形的实施方式。

Claims (11)

  1. 一种光机组件，包括：
    DMD芯片；
    插座，其一面连接所述DMD芯片，另一面凸设有定位柱和导电弹针；
    转接板，其上设置有与所述定位柱相适配的定位孔、以及与所述导电弹针相抵接的多个触点；所述触点之间具有间隙；所述定位孔和所述定位柱间隙配合，使得所述导电弹针在所述触点上偏移而形成活动圆周，所述活动圆周位于所述触点的围合范围内；所述转接板的设置有触点的一面对应所述触点设置有连接孔，以用于连接所述转接板的外层和内层，所述连接孔位于所述触点之间的间隙内。
  2. 根据权利要求1所述的光机组件，所述触点为正多边形结构，所述触点的边长数量大于四条。
  3. 根据权利要求2所述的光机组件，多个所述触点呈矩形阵列分布；所述连接孔为过孔，且位于对角设置的触点之间的间隙内。
  4. 根据权利要求3所述的光机组件，所述过孔的孔径为圆形，所述过孔的圆心位于对角设置的所述触点的中心的连线或中心连线的延长线上。
  5. 根据权利要求3所述的光机组件，所述过孔与至少一个所述触点的边缘相切。
  6. 根据权利要求3所述的光机组件，所述触点为正八边形结构，所述触点的内切圆的直径为0.75mm，所述过孔的直径大于或等于0.2mm。
  7. 根据权利要求1所述的光机组件，所述插座还包括壳体，所述定位柱和所述导电弹针均设置于所壳体上，所述导电弹针的两端分别超出所述壳体的两面，所述导电弹针的两端分别抵接于所述转接板上的触点和所述DMD芯片。
  8. 根据权利要求7所述的光机组件，所述导电弹针包括设置在所述壳体内的限位部以及弯折连接在所述限位部两端的两个抵接部，所述抵接部弯折连接在所述限位部上，使得所述导电弹针具有弹性；所述抵接部突出所述壳体。
  9. 根据权利要求1所述的光机组件，所述光机组件还包括散热器，所述散热器设置于所述转接板的背向所述DMD芯片的一面。
  10. 根据权利要求1所述的光机组件，所述光机组件还包括镜头单元，所述镜头单元电连接于所述DMD芯片，用于接收所述DMD芯片输送的数字光信号，并对数字光信号放大后向外投射。
  11. 一种显示装置，包括显示屏、以及权利要求1-10中任一项所述的光机组件。
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Publication number Priority date Publication date Assignee Title
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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1913747A (zh) * 2005-08-10 2007-02-14 阿尔卡特公司 利用微通孔的行/列在bga互连栅格上建立pcb布线通道(微通孔通道)
CN102809879A (zh) * 2011-05-31 2012-12-05 中强光电股份有限公司 投影装置
JP2013117629A (ja) * 2011-12-02 2013-06-13 Sanyo Electric Co Ltd 投写型映像表示装置
CN106569376A (zh) * 2016-10-31 2017-04-19 海信集团有限公司 Dmd组件、dlp光机及dlp投影装置
CN107329232A (zh) * 2017-08-11 2017-11-07 青岛海信电器股份有限公司 一种投影机中数字微镜元件的固定结构及投影机
CN110099265A (zh) * 2019-04-18 2019-08-06 青岛海信激光显示股份有限公司 一种数字光处理投影机
CN214067558U (zh) * 2021-02-09 2021-08-27 海信视像科技股份有限公司 显示装置及其光机组件

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1913747A (zh) * 2005-08-10 2007-02-14 阿尔卡特公司 利用微通孔的行/列在bga互连栅格上建立pcb布线通道(微通孔通道)
CN102809879A (zh) * 2011-05-31 2012-12-05 中强光电股份有限公司 投影装置
JP2013117629A (ja) * 2011-12-02 2013-06-13 Sanyo Electric Co Ltd 投写型映像表示装置
CN106569376A (zh) * 2016-10-31 2017-04-19 海信集团有限公司 Dmd组件、dlp光机及dlp投影装置
CN107329232A (zh) * 2017-08-11 2017-11-07 青岛海信电器股份有限公司 一种投影机中数字微镜元件的固定结构及投影机
CN110099265A (zh) * 2019-04-18 2019-08-06 青岛海信激光显示股份有限公司 一种数字光处理投影机
CN214067558U (zh) * 2021-02-09 2021-08-27 海信视像科技股份有限公司 显示装置及其光机组件
CN214174810U (zh) * 2021-02-09 2021-09-10 海信视像科技股份有限公司 显示装置及其光机组件
CN214278597U (zh) * 2021-02-09 2021-09-24 海信视像科技股份有限公司 显示装置及其光机组件

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