WO2022166319A1 - 一种光处理设备 - Google Patents

一种光处理设备 Download PDF

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Publication number
WO2022166319A1
WO2022166319A1 PCT/CN2021/132374 CN2021132374W WO2022166319A1 WO 2022166319 A1 WO2022166319 A1 WO 2022166319A1 CN 2021132374 W CN2021132374 W CN 2021132374W WO 2022166319 A1 WO2022166319 A1 WO 2022166319A1
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WO
WIPO (PCT)
Prior art keywords
light
tray
mask
light source
substrate
Prior art date
Application number
PCT/CN2021/132374
Other languages
English (en)
French (fr)
Inventor
卢双豪
尹涛
张金权
康远浩
汪海波
Original Assignee
北京梦之墨科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 北京梦之墨科技有限公司 filed Critical 北京梦之墨科技有限公司
Priority to US17/776,628 priority Critical patent/US20230191448A1/en
Publication of WO2022166319A1 publication Critical patent/WO2022166319A1/zh

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Classifications

    • A—HUMAN NECESSITIES
    • A45—HAND OR TRAVELLING ARTICLES
    • A45D—HAIRDRESSING OR SHAVING EQUIPMENT; EQUIPMENT FOR COSMETICS OR COSMETIC TREATMENTS, e.g. FOR MANICURING OR PEDICURING
    • A45D29/00—Manicuring or pedicuring implements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
    • B05D3/061—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using U.V.
    • B05D3/065—After-treatment
    • B05D3/067—Curing or cross-linking the coating
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70283—Mask effects on the imaging process
    • G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/7035—Proximity or contact printers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0888—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using transparant moulds
    • B29C35/0894—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using transparant moulds provided with masks or diaphragms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/264—Arrangements for irradiation
    • B29C64/286—Optical filters, e.g. masks

Definitions

  • the present application belongs to the technical field of light patterning control, and in particular, relates to a light processing device.
  • UV curing machine is a device that uses a UV light source to cure UV coatings, which chemically reacts with the photosensitizer in the UV coating to instantly dry and cure.
  • UV light curing machine also known as UV coating equipment, is suitable for a wide range of applications, such as products that require UV coating for flat or three-dimensional workpieces.
  • PCB board integrated circuit
  • an object of the present application is to propose a light processing device, so as to solve the problem that the prior art cannot meet the needs of individualized and fast light patterning processing.
  • the light processing apparatus includes: a base, a light source fixed on the base, a tray, and a digitizing mask interposed between the light source and the tray; wherein the tray is Used to place the substrate to be processed; the digital mask is used to display the corresponding shading pattern according to the electronic graphics set by the user, so that the light emitted by the light source penetrates the digital mask to the substrate on the tray A light treatment opposite to the light shielding pattern is performed.
  • the distance between the light source and the digitizing mask is 10 mm to 500 mm.
  • the distance between the digitized mask and the substrate is 0 mm to 30 mm.
  • the light processing apparatus further includes: a light shield disposed between the light source and the digitizing mask for preventing light from leaking out.
  • the light processing apparatus further includes: a housing covering the light source, the tray, and the digitizing mask.
  • the light processing apparatus further includes: a moving assembly assembled on the base; the tray is disposed on the moving assembly, so as to facilitate the movement of the moving assembly by the moving assembly The tray is withdrawn for placing/retrieving of the substrate, and the tray is pushed in by the moving assembly to align the substrate with the digitized mask.
  • the moving component is a tray seat for fixing the tray, and the tray seat is mounted on the base via a slide rail.
  • the optical processing apparatus further includes: an approach assembly cooperating with the tray for driving the substrate to approach the digitized mask when the tray is pushed in, and in the When the tray is pulled out, the substrate is driven away from the digitized mask.
  • the digitizing mask is a digitally controlled light-shielding transmissive display panel.
  • each pixel on the digitally controlled light-shielding and transparent display panel may form a corresponding light-shielding pixel or a light-transmitting pixel according to the electronic pattern set by the user; the combination of the light-shielding pixels constitutes a The light-shielding pattern and the combination of the light-transmitting pixel points constitute a light-transmitting pattern, and the combined pattern of the light-shielding pattern and the light-transmitting pattern is consistent with the pattern illuminated by the light source on the substrate.
  • the digitizing mask is an LCD display panel or an OLED display panel.
  • the wavelength of light emitted by the light source is 350 nm to 460 nm.
  • an optical lens is disposed between the light source and the digitizing mask for converting the direction of light emitted by the light source to a direction perpendicular to the digitizing mask.
  • the light processing apparatus further includes: a heat dissipation component disposed on the light source backplane.
  • the light processing device in the embodiment of the present application displays the shading pattern corresponding to the electronic graphic through the digital mask according to the user's requirements, so as to satisfy the shading/light of each area on the plane of the digital mask, so as to realize the patterned pattern required by the user. light.
  • the numerical control advantage of the digitized mask there is no need for plate making, the user's diversified optical patterning requirements can be met, the processing efficiency is improved, the equipment requirements are reduced, and the manufacturing cost is saved.
  • FIG. 1 is a first structural example of a light processing device in an embodiment of the present application
  • FIG. 2 is a second structural example of a light processing device in an embodiment of the present application.
  • 3 is a display example of a digital mask in an embodiment of the present application.
  • FIG. 4 is a third structural example of the light processing device in the embodiment of the present application.
  • FIG. 5 is a fourth structural example of the light processing device in the embodiment of the present application.
  • FIG. 6 is a schematic diagram of the pull-out state of the tray in the fourth structural example in the embodiment of the present application.
  • FIG. 7 is a fifth structural example of the light processing device in the embodiment of the present application.
  • FIG. 8 is a schematic diagram of a state in which the tray is moved up in the fifth structural example in the embodiment of the present application.
  • FIG. 9 is a sixth structural example of the light processing device in the embodiment of the present application.
  • FIG. 10 is a schematic diagram of the tray pushing state of the sixth structural example in the embodiment of the present application.
  • FIG. 11 is a schematic diagram of the structure of the tray in the embodiment of the present application.
  • FIG. 12 is a schematic diagram of the tray structure in the embodiment of the present application in a spring-compressed state
  • FIG. 13 is a schematic structural diagram of a light shield in an embodiment of the present application.
  • FIG. 14 is a schematic structural diagram of a housing in an embodiment of the present application.
  • 15 is a schematic structural diagram of an optical lens in an embodiment of the present application.
  • FIG. 16 is a seventh structural example of the optical processing device in the embodiment of the present application.
  • FIG. 17 is a schematic diagram of a state in which the tray is drawn out in the seventh structural example in the embodiment of the present application.
  • FIG. 1 is the first structural example of the optical processing device in the embodiment of the application
  • FIG. 2 is the optical processing device in the embodiment of the application.
  • FIG. 3 is the third structural example of the optical processing device in the embodiment of the present application
  • mask 30 is the third structural example of the optical processing device in the embodiment of the present application.
  • the light source 10 is used for releasing the light required for light treatment; the tray 20 is used for placing the substrate 200 to be processed; the digital mask 30 is used for displaying the corresponding shading pattern 31 according to the electronic graphics set by the user, so that the light emitted by the light source 10 The light penetrates the digital mask 30 to perform the opposite light treatment to the light shielding pattern 31 on the substrate 200 on the tray 20 .
  • the light processing apparatus further includes: a base 40 for fixing the light source 10 , the tray 20 and the digitizing mask 30 .
  • the digital mask 30 in the embodiment of the present application is an electronic display panel, which can control each pixel on the display panel by the system, and form shading pixels/transmitting pixels according to control requirements, and the combination of these shading pixels That is, a light-shielding pattern 31 is formed, and the combination of opposite light-transmitting pixels constitutes a light-transmitting pattern 32 opposite to the light-shielding pattern;
  • the electronic graphics set by the user can be consistent with the light-shielding pattern 31, and the light-transmitting pattern 32 is opposite to the electronic graphics at this time; in other examples, the electronic graphics set by the user can also be consistent with the light-transmitting pattern 32, and the light-shielding pattern 32 at this time. 31 is the opposite of electronic graphics.
  • the relationship between electronic graphics, light-shielding patterns, and light-transmitting patterns can be set/designed by software according to developers and users.
  • the electronic display panel in the embodiment of the present application may be any digitally controlled light-shielding and transparent display panel on the market that can meet the above requirements.
  • the display panel is, for example, an LCD display panel, an OLED display panel, and the like.
  • the unpowered display panel is black/green screen color, and each pixel can be turned into light-shielding/transmitting according to the display requirements under the condition of power-on, such as traditional LCD liquid crystal display panel, Generally, it includes a first polarizing layer, a first electrode layer, a liquid crystal layer, a second electrode layer, and a second polarizing layer stacked in sequence, and the liquid crystal layer in between is controlled by the first electrode layer and the second electrode layer, so that the corresponding Pixel point light transmission/shading.
  • a display panel suitable for the embodiments of the present application can be obtained by purchasing a display screen on the market, and removing the light-emitting backplane and the reflective layer of the display screen.
  • the light-shielding and light-transmitting in the embodiments of the present application include using a dark color (opaque) to obtain a light-shielding effect, and using a light-colored color (transparent) to obtain a light-transmitting effect.
  • the transparent (light-transmitting) display panels currently on the market can also meet the light-shielding/light-transmitting requirements of each pixel in the embodiments of the present application, that is, the use of displaying dark colors (opaque light) to get the shading effect, and the rest remains transparent.
  • the light processing device in the embodiment of the present application displays the shading pattern corresponding to the electronic graphic through the digital mask according to the user's requirements, so as to satisfy the light blocking/transmitting of each area on the plane of the digital mask, so as to realize the patterning required by the user. of light.
  • the numerical control advantage of the digitized mask there is no need for plate making, the user's diversified optical patterning requirements can be met, the processing efficiency is improved, the equipment requirements are reduced, and the manufacturing cost is saved.
  • the light source 10, the tray 20 (substrate 200) and the digitizing mask 30 in the embodiment of the present application are vertically opposite structures, which may be stacked in the vertical direction as shown in FIG. As shown in FIG. 4 , they are arranged in the horizontal direction, or relative to each other at any other angle.
  • the positions of the light source 10 , the tray 20 (the base material 200 ) and the digital mask 30 may not completely satisfy the vertical relative arrangement, but also achieve a certain degree of effect, or need to configure additional light steering components, increasing equipment cost and equipment complexity.
  • the light processing apparatus may include necessary supporting and fixing structures such as supports, brackets, and frames.
  • the distance between the light source 10 and the digitizing mask 30 may range from 10 mm to 500 mm.
  • the distance between the light source 10 and the digital mask 30 is set to be 100-250 mm. In this range, the influence of the divergent light emitted by the light source 10 (light not perpendicular to the digital mask 30) on the light processing accuracy can be reduced, so that Improve the light accuracy of light processing equipment; on the other hand, within this range, it can ensure that the light source emits and reaches the light intensity of the digital mask, thereby reducing the light processing time, improving the efficiency of light processing, and reducing the energy consumption of the equipment; The range is also conducive to the miniaturization requirements of optical processing equipment, and avoids the problem of excessively large equipment size caused by the long optical path.
  • the distance between the digitized mask 30 and the substrate 200 on the tray 20 may range from 0 mm to 30 mm, and within this range, the influence of the scattered light on the light accuracy can be reduced, so that the digitized mask 30 can penetrate through the digitized mask 30 .
  • the light is irradiated on the target area of the substrate 200 opposite to it as much as possible to avoid the light from being irradiated on the non-target area of the substrate 200 .
  • the distance between the digital mask 30 and the substrate 200 on the tray 20 can be in the range of 0-5 mm, which can well reduce the influence of scattered light, and on the other hand, it is easy to implement the placement/replacement of the substrate , and the alignment of the base material and the digital mask to avoid scratches on the base and the digital mask caused by the contact friction between the base and the digital mask during alignment.
  • the distance between the digital mask 30 and the tray 20 can be designed with reference to the above-mentioned distance between the digital mask 30 and the substrate 200 , so that the distance between the digital mask and the substrate satisfies the above requirements.
  • the positions among the light source 10, the digitizing mask 30, and the tray 20 can be adjusted to meet the needs of designers or users.
  • the positions of the light source 10 , the digitized mask 30 and the tray 20 in the light processing apparatus 100 after leaving the factory are fixed.
  • the positions of the light source 10 , the digitized mask 30 and the tray 20 can be fixed.
  • the placing/taking of the base material 200 on the tray 20 is realized, and the tray 20 can be provided with corresponding chute according to the size of the base material to guide, hold and other alignment and fixing structures for the base material.
  • the optical processing apparatus 100 may further include: a moving component 21 connected/cooperating with the tray 20 to drive the tray 20 to move out of the position relative to the digitized mask 30 and moving in, so that when the tray 20 is moved out, the user can put/take the substrate, and after the substrate is placed, the tray 20 can be moved in to align the substrate 200 with the digitized mask 30 .
  • the moving assembly 21 is not limited to a rotating structure, a sliding rail structure, a telescopic structure, and the like.
  • the moving assembly 21 can adopt a tray seat driven by a slide rail, and the tray base is mounted on the base 40 through the slide rail; the tray 20 is assembled on the tray base, and when the tray base is pulled out through the slide rail, the user can align the base According to the operation of the material, when the tray seat is fully pushed in, the substrate 200 on the tray 20 is aligned with the digitized mask 30 .
  • the fixing method of the substrate 200 on the tray 20 in the embodiment of the present application is not limited to a clamping table, a clamping, a clamp, an adsorption, a sticking, and the like.
  • the tray 20 is provided with a positioning column, the positioning column is used to cooperate with the positioning hole on the base material, and the base material is sleeved on the positioning column through the positioning hole to achieve positional fixation.
  • the optical processing apparatus 100 may further include: an approach assembly 22 connected/cooperated with the tray 20 for connecting the substrate 200 on the tray 20 with the digitized mask 30 During/after alignment, the tray 20 is driven to drive the substrate 200 to approach the digital mask 30, thereby reducing the distance between the substrate 200 and the digital mask 30, and even making the substrate 200 directly attached to the digital mask 30 , to achieve the effect of zero distance between the digital mask 30 and the substrate 200 . At the same time, the design is beneficial to avoid friction between the substrate 200 and the digital mask 30, and reduce the probability of scratches on both.
  • the approach assembly 22 is not limited to lift tables, springs, slide rails, card tables, and the like.
  • the approaching assembly 22 may include: an inclined chute 221 provided on the tray base, the guiding direction of the inclined chute 221 is the same as the moving direction of the tray base, and The tray 20 is inclined downward in the pushing direction of the tray base, the tray 20 is assembled on the tray base through the inclined chute 221, and the tray 20 can move on the tray base along the inclined chute 221; The tray 20 is inclined downward in the pushing direction of the tray base, so when the tray 20 moves to the pushing direction through the inclined chute 221, its position relative to the digitized mask 30 becomes larger in vertical relative distance; When the sliding slot 221 is moved toward the drawing out direction, its position relative to the digitized mask 30 is reduced in vertical relative distance.
  • the assembly 22 also includes: a positioning baffle 222, which is arranged on the moving path of the tray 20 to block the movement of the tray 20, and cooperates with the tray seat and the tilting chute 221 to align and align the substrate 200 on the tray 20. Proximity to the digitized mask 30 .
  • the tray 20 when the tray seat is pushed in from the outside to the inside, the tray 20 is located at the lower end of the inclined chute 221, and when the tray seat is gradually pushed in, the tray 20 contacts the positioning baffle 222, and due to the positioning The blocking by the baffle plate 222 starts to move in the opposite direction relative to the inclined chute 221 , so as to gradually climb along the inclined chute 221 , thereby making the substrate 200 on the tray 20 approach the digitized mask 30 .
  • the substrate 200 on the tray 20 is aligned with the digital mask 30 when the tray 20 is located at the high-end position on the other side of the inclined chute 221 after the tray seat is fully pushed in.
  • the inclined chute 221, the positioning baffle 222, and the pushing of the tray seat are used to realize the approach of the base material 200 to the digitized mask 30, and due to the function of the inclined chute 221, the base material 200 is connected to the digitized mask 30. During the alignment process of the mask plate 30, relative friction is not generated.
  • the approach assembly 22 may further include: a spring mechanism 223 disposed on the back of the tray 20 (the opposite side on which the substrate is placed), which is located in the inclined chute 221 on the tray 20 When it reaches the high-end position, its elasticity is released, and the tray 20 is pushed against the digitized mask 30 , so that the substrate 200 is further approached to the digital mask 30 .
  • the tray 20 is fixed on the bottom plate 224 by the spring mechanism 223, and the bottom plate 224 slides in cooperation with the inclined chute 221 on the tray base.
  • the positioning baffle 222 and the tray 20 may be provided with a magnetic attraction component that cooperates with each other, and the magnetic attraction component is used to apply a driving force to the tray to move to its lower end along the inclined chute 221.
  • the magnetic attraction component is used to assist in enhancing the effect of gravity, so that it can actively approach the inclined chute 221 as much as possible during the sliding process.
  • the light source 10 in the embodiments of the present application is suitable for light in any wavelength band, and when a wavelength band that is harmful to human body is used, a light-blocking external light can be provided between the light source 10 and the digital mask 30 .
  • the light source 10 , the light shield 50 and the digital mask 30 form a closed cavity, and only when the light source and the digital mask work together, the light transmits light from the digital mask of the closed cavity.
  • a pattern of consistent light is emitted from the pattern.
  • the light source and the digitizing mask can be arranged on the opposite side of the light hood, for example, the light source 10 is arranged on the top of the light hood 50, and its irradiation direction is downward, and the digitizing mask is arranged on the bottom of the light hood opposite to the light source .
  • the cavity of the closed cavity formed by the light source, the light shield and the digital mask is a vacuum structure to prevent impurities from affecting the propagation of light.
  • the above-mentioned light shield can also be provided, so as to achieve a closed light processing environment and avoid the influence of external light.
  • the light source generally selects a light source component with a light wavelength of 350 nm to 460 nm, and commonly used light wavelengths such as 365 nm ultraviolet light, 395 nm ultraviolet light, 405 nm blue violet light, etc.
  • the selection of the light source in the embodiments of the present application can be selected according to the specific photosensitive material (such as photosensitive resin material).
  • a light source capable of emitting multiple wavelengths can also be selected, and a light blocking plate that blocks/transmits different light can be used to obtain light of the target wavelength.
  • the light processing apparatus 100 further includes: a housing 60 , which can cooperate with the base 40 to accommodate components/modules such as the light source 10 , the tray 20 , and the digital mask 30 .
  • the casing can be a fully enclosed casing or a semi-closed casing, so as to realize the overall or partial shielding/packaging of the device.
  • the fully enclosed housing structure it can be realized by combination.
  • the user can open the combined structure to replace/adjust the substrate, components, etc. Combined closure.
  • the housing 60 and the base 40 may be an integral structure.
  • the light processing device further includes: a control module, which is respectively connected with the electronic function modules (eg, digital mask, light source, etc.) in the light processing device, so as to realize the system control of each electronic function module.
  • the control module may be an integrated circuit board, a controller, a processor, etc., which directly purchase control modules on the market.
  • the light processing apparatus may further include: a display component, which may be used to display electronic graphic data used for digitizing the mask, and various operating parameter information of the light processing apparatus.
  • the display assembly is connected to the control module.
  • the light processing device may further include: a key assembly, which can satisfy the independent control of the light processing device, including but not limited to device switch buttons, data switching keys, power adjustment keys, and the like.
  • the button assembly is connected with the control module.
  • all/part of the functions in the display assembly and the key assembly can be controlled and displayed by using a touch screen.
  • the optical processing device may further include: a data interface component, which can be used to connect to an external terminal device to implement system control of the optical processing device by the external terminal device; or, the data interface component is directly connected to an external storage device to obtain Electronic pattern data used by the digitized reticle in the storage device.
  • the data interface component is connected with the control module.
  • the light processing device further includes a necessary power supply module, which will not be repeated here.
  • the light processing device may further include a heat dissipation component to reduce the heat of the light processing device and ensure continuous and stable operation of the light processing device.
  • the light source can be selected from a matrix light-emitting component, including: a reflective backplane and light-emitting elements fixed on the reflective backplane.
  • the side of the reflective back plate close to the light-emitting element has a metal emitting surface for concentrating the light on the side of the light-emitting element.
  • the heat dissipation component is mounted on the other side of the reflective backplane away from the light-emitting element, so as to carry the heat generated by the light source.
  • an optical lens 12 is disposed between the light source 10 and the digital mask 30 to convert the divergent light emitted by the light source 10 into a uniform direction perpendicular to the digital mask 30 of light.
  • the optical lens 12 can be made of plastic, quartz glass and other materials.
  • the light processing device in this embodiment includes: a base 40 , which is assembled on the base through a slide rail.
  • the tray seat on the 40 and the tray seat are provided with an inclined chute 221
  • the tray 20 is assembled on the tray seat through the inclined chute 221
  • a positioning baffle 222 is set on the moving path of the tray 20 to cooperate with the inclined chute 221 to
  • the tray 20 is defined at the target position (the position relative to the digitized mask 30 in the horizontal direction, and the target distance in the vertical direction).
  • a light hood 50 is arranged around the light source 10 and the digitizing mask 30.
  • the light source 10, the digitizing mask 30 and the light hood 50 together form a closed cavity, and the closed cavity is located between the light source 10 and the digitizing mask 30.
  • An optical lens 12 is arranged at the light source 10 ; a heat dissipation component 11 is arranged outside the light source 10 .
  • the light processing device 100 further includes: a casing 60, which cooperates with the base 40 to shield the internal components; the casing 60 is provided with a material port in the sliding direction relative to the tray base, and the material port is used for pushing and pulling out the tray base.
  • the outer side of the tray seat is provided with a baffle plate corresponding to the shape of the material port to cooperate with the shell 60 to form a closed structure (similar to a drawer) after the tray seat is pushed in.
  • the outer side of the casing 60 is also provided with a power interface, a data interface component, a display component, a button component, etc., and a control module 70 is also provided inside the casing 60, and the control module 70 is respectively connected with the power interface, data interface component, display component, The key assembly, the light source 10 and the digitizing mask 30 are connected.
  • a compression spring is provided at the bottom of the tray 20 to release elasticity when the tray 20 moves to the high end of the inclined chute 221 to push the tray 20 to approach the digitized mask 30 .
  • the light processing device in the embodiment of the present application is suitable for a photo-patterning curing device, and is especially suitable for realizing the photo-curing treatment of the photosensitive material on the circuit board.
  • the substrate 200 in the embodiment of the present application is suitable for a substrate with a photosensitive dry film attached to the surface, or a substrate with a pre-cured coating on the surface, and the photosensitive material is not limited to solder resist, photosensitive resin, and the like.

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Abstract

一种光处理设备（100）包括基座（40）、固定在基座（40）上的光源（10）、托盘（20）、以及介于光源（10）与托盘（20）之间的数字化掩模板（30）；其中，托盘（20）上用以放置待处理的基材（200）；数字化掩模（30）用以根据用户设置的电子图形显示相应的遮光图案（31），使光源（10）射出的光线穿透数字化掩模板（30）对托盘（20）上的基材（200）进行与遮光图案（31）相反的光处理。该光处理设备（100）通过数字化掩模板（30）根据用户需求显示与电子图形相应的遮光图案（31），以此满足数字化掩模板（30）的平面上各个区域的遮光/透光，实现用户所需的图案化的光线。

Description

一种光处理设备
本申请要求于2021年2月2日提交中国专利局，申请号为2021101437190，申请名称为“一种光处理设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请属于光图案化控制技术领域，尤其涉及一种光处理设备。
背景技术
UV固化机是利用UV光源来固化UV涂料的设备，与UV涂料里的光敏剂起化学反应，瞬间干燥固化的机器。UV光固化机又名UV涂装设备，该设备适用范围广,举凡平面或立体之工件需进行UV涂装之产品均可使用。随着感光材料的不断发展，其应用场景也在不断的扩展，例如集成电路(PCB板)产线中的固化设备、再到3D打印中的固化机、以及美甲用的固化灯等。
虽然上述固化产品的应用已经日趋成熟，但如3D打印中的固化机、美甲用的固化灯是对待光处理的物体进行全方位的光照处理，无法满足图案化的光处理需求，而集成电路(PCB板)产线中的固化设备则需要配合传统掩模的才能实现图案化的光处理，由于掩模存在制版过程，因此无法满足个性化快速的光图案化处理需求。
申请内容
有鉴于此，本申请的一个目的是提出一种光处理设备,以此解决现有技术中无法满足个性化快速的光图案化处理需求的问题。
在一些说明性实施例中，所述光处理设备，包括：基座、固定在所述基座上的光源、托盘、以及介于光源与托盘之间的数字化掩模板；其中，所述托盘上用以放置待处理的基材；所述数字化掩模板用以根据用户设置的电子图形显示相应的遮光图案，使所述光源射出的光线穿透所述数字化掩模板对所述托盘上的基材进行与所述遮光图案相反的光处理。
在一些说明性实施例中，所述光源与所述数字化掩模板之间的距离为10mm～500mm。
在一些说明性实施例中，所述数字化掩模板与所述基材之间的距离为0mm～30mm。
在一些说明性实施例中，所述光处理设备，还包括：设置于所述光源与所述数字化掩模板之间、用以防止光线外泄的遮光罩。
在一些说明性实施例中，所述光处理设备，还包括：遮盖所述光源、托盘、数字化掩模板的壳体。
在一些说明性实施例中，所述光处理设备，还包括：装配在所述基座上的移动组件；所述托盘设置于所述移动组件之上，以便于通过所述移动组件将所述托盘抽出进行基材的放/取，以及通过所述移动组件将托盘推入使所述基材与所述数字化掩模板的对准。
在一些说明性实施例中，所述移动组件为用以固定所述托盘的托盘座，所述托盘座通过滑轨安装在所述基座上。
在一些说明性实施例中，所述光处理设备，还包括：与所述托盘配合的趋近组件，用以在所述托盘推入时，驱使基材逼近所述数字化掩模板，以及在所述托盘抽出时，驱使基材远离所述数字化掩模板。
在一些说明性实施例中，所述数字化掩模板为数控遮透光显示面板。
在一些说明性实施例中，所述数控遮透光显示面板上每一个像素点可根据用户设置的所述电子图形形成相应的遮光像素点或透光像素点；所述遮光像素点的组合构成所述遮光图案，所述透光像素点的组合构成透光图案，所述遮光图案与所述透光图案的组合图案与所述光源照射在所述基材上的图案一致。
在一些说明性实施例中，所述数字化掩模板选用LCD显示面板或OLED显示面板。
在一些说明性实施例中，所述光源发射的光线波长为350nm～460nm。
在一些说明性实施例中，所述光源与所述数字化掩模板之间设置有光学透镜，用以将所述光源射出的光线的方向转换为垂直于所述数字化掩模板的方向。
在一些说明性实施例中，所述光处理设备，还包括：设于所述光源背板上的散热组件。
与现有技术相比，本申请具有如下优势：
本申请实施例中的光处理设备通过数字化掩模板根据用户需求显示与电子图形相应的遮光图案，以此满足数字化掩模板的平面上各个区域的遮/光，从而实现用户所需的图案化的光线。该实施例中由于数字化掩模板的数控优势，因此没有制版需求，即可满足用户多样化的光图案化需求，提升了处理效率，降低了设备要求，节约了制作成本。
附图说明
图1是本申请实施例中的光处理设备的结构示例一；
图2是本申请实施例中的光处理设备的结构示例二；
图3是本申请实施例中的数字化掩模板的显示示例；
图4是本申请实施例中的光处理设备的结构示例三；
图5是本申请实施例中的光处理设备的结构示例四；
图6是本申请实施例中的结构示例四的托盘拉出状态示意图；
图7是本申请实施例中的光处理设备的结构示例五；
图8是本申请实施例中的结构示例五的托盘上移状态示意图；
图9是本申请实施例中的光处理设备的结构示例六；
图10是本申请实施例中的结构示例六的托盘推入状态示意图；
图11是本申请实施例中的托盘结构示意图；
图12是本申请实施例中的托盘结构在弹簧压紧状态示意图；
图13是本申请实施例中的遮光罩的结构示意图；
图14是本申请实施例中的壳体的结构示意图；
图15是本申请实施例中的光学透镜的结构示意图；
图16是本申请实施例中光处理设备的结构示例七；
图17是本申请实施例中结构示例七的托盘抽出状态示意图。
具体实施方式
以下描述和附图充分地示出本申请的具体实施方案，以使本领域的技术人员能够实践它们。其他实施方案可以包括结构的、逻辑的、电气的、过程的以及其他的改变。实施例仅代表可能的变化。除非明确要求，否则单独的部件和功能是可选的，并且操作的顺序可以变化。一些实施方案的部分和特征可以被包括在或替换其他实施方案的部分和特征。本申请的实施方案的范围包括权利要求书的整个范围，以及权利要求书的所有可获得的等同物。在本文中，本申请的这些实施方案可以被单独地或总地用术语“发明”来表示，这仅仅是为了方便，并且如果事实上公开了超过一个的发明，不是要自动地限制该应用的范围为任何单个发明或发明构思。
需要说明的是，在不冲突的情况下本申请实施例中的各技术特征均可以相互结合。
本申请实施例中公开了一种光处理设备，具体地，如图1-3所示，图1为本申请实施例中光处理设备的结构示例一；图2为本申请实施例中的光处理设备的结构示例二；图3为本申请实施例中的光处理设备的结构示例三；该光处理设备100，包括：光源10、托盘20、以及介于光源10与托盘20之间的数字化掩模板30。其中，光源10用以释放光处理所需的光线；托盘20用以放置待处理的基材200；数字化掩模板30用以根据用户设置的电子图形显示相应的遮光图案31，使光源10射出的光线穿透数字化掩模板30对托盘20上的基材200进行与遮光图案31相反的光处理。在一些实施例中，该光处理设备还包括：固定光源10、托盘20和数字化掩模板30的基座40。
本申请实施例中的数字化掩模板30是一种电子显示面板，其可由系统控制显示面板上的每一个像素点，根据控制需求形成遮光像素点/透光像素点，而这些遮光像素点的组合即构成遮光图案31，而相对的透光像素点的组合即构成与遮光图案相反的透光图案32；遮光图案31和透光图案32共同组合成整个显示面板的显示幅面。
其中，用户设置的电子图形可以与遮光图案31一致，此时透光图案32则与电子图形相反；在其他示例中，亦可使用户设置的电子图形与透光图案32一致，此时遮光图案31则与电子图形相反。电子图形、遮光图案、透光图案的关系可根据开发者、用户进行软件设置/设计。
本申请实施例中的电子显示面板可以选用市面上任何可满足上述需求的数控遮透光显示面板。显示面板例如LCD显示面板、OLED显示面板等。针对传统的显示面板而言，在未通电的显示面板呈黑幕色/绿幕色，在通电情况下即可根据显示需求使每一个像素点转变为遮光/透光，例如传统LCD液晶显示面板，一般包括依次层叠的第一偏光层、第一电极层、液晶层、第二电极层、第二偏光层，由第一电极层和第二电极层对其间的液晶层进行控制，从而使相应的像素点透光/遮光。LCD显示面板的显示原理为公知常识，在此不进行赘述。在一些实施例中，可通过采购市面上的显示屏，去除该显示屏的发光背板和反射层，得到适用于本申请实施例的显示面板。
本申请实施例中的遮光和透光，包含利用显示深色颜色(不透光)得到遮光效果，以及利用显示浅色颜色(透光)得到透光效果。
除传统的显示面板而言，目前市面上所出现的透明(透光)显示面板，亦可满足本申请实施例中的各像素点的遮光/透光需求，即利用显示深色颜色(不透光)得到遮光效果，其余部分则仍然为透明状态。
本申请实施例中的光处理设备通过数字化掩模板根据用户需求显示与电子图形相应的遮光图案，以此满足数字化掩模板的平面上各个区域的遮/透光，从而实现用户所 需的图案化的光线。该实施例中由于数字化掩模板的数控优势，因此没有制版需求，即可满足用户多样化的光图案化需求，提升了处理效率，降低了设备要求，节约了制作成本。
在一般情况下，本申请实施例中的光源10、托盘20(基材200)和数字化掩模板30为竖直相对结构，其可如图1所示，沿竖直方向堆叠放置，亦可如图4所示，沿水平方向设置，又或者以其它任意角度进行相对设置。在一些变劣方案中，光源10、托盘20(基材200)和数字化掩模板30三者位置亦可不完全满足竖直相对设置，亦可达到一定程度的效果，又或者需要配置额外的光转向组件，增加设备成本和设备复杂度。
在一些实施例中，光处理设备中为了实现光源、数字化掩模板和托盘(基材)的竖直相对，其可包括必要的支座、支架、框架等支撑固定结构。
在一些实施例中，光源10与数字化掩模板30之间的距离范围可为10mm～500mm。优选地，光源10与数字化掩模板30之间的距离设置为100～250mm，该范围下可以降低光源10射出的发散光(非垂直于数字化掩模板30的光线)对光处理精度的影响，从而提升光处理设备的光线精度；另一方面该范围下可以保证光源射出并达到数字化掩模板的光线强度，从而可降低光处理的时间，提升光处理的效率，降低设备能耗；再有，该范围下也有利于光处理设备的小型化需求，避免光路过长造成设备尺寸过大的问题。
在一些实施例中，数字化掩模板30与托盘20上的基材200之间的距离范围可在0mm～30mm，该范围下可以降低发散光对光精度的影响，从而使穿透数字化掩模板30的光线尽可能的照射在与其相对的基材200的目标区域上，避免光线照射在基材200的非目标区域上。优选地，数字化掩模板30与托盘20上的基材200之间的距离范围可在0～5mm，该范围下可良好的降低发散光的影响，另一方面也易于实施基材的放置/更换、及基材与数字化掩模板的对位对准，避免基材与数字化掩模板在对位时的接触摩擦造成基材与数字化掩模板的划伤。
数字化掩模板30与托盘20之间的距离可参考上述数字化掩模板30与基材200之间的距离进行设计，以此满足数字化掩模板与基材之间的距离满足上述要求。
在一些实施例中，光源10、数字化掩模板30、托盘20之间的位置可进行调节，以此满足设计者或用户的使用需求。
在一些实施例中，出厂后的光处理设备100中光源10、数字化掩模板30、托盘20的位置固定，鉴于数字化掩模板30与托盘20之间的距离较小，可通过侧滑的方式 将实现基材200在托盘20上的放/取，托盘20上可根据基材尺寸设置相应的滑槽对基材进行导向、卡持等对位、固定结构。
如图5-6所示，在另一些实施例中，光处理设备100，还可包括：移动组件21，与托盘20连接/配合，用以带动托盘20自与数字化掩模板30相对位置的移出和移入，从而实现在托盘20移出时，可使用户进行基材的放/取，以及在基材放置后，实现托盘20的移入，使基材200与数字化掩模板30之间的对准。其中，移动组件21不限于转动结构、滑轨结构、伸缩结构等。
优选地，移动组件21可采用滑轨驱动的托盘座，该托盘座通过滑轨安装在基座40上；托盘20装配在托盘座上，当托盘座通过滑轨抽出时，用户可进行对基材的操作，当托盘座完全推入时，托盘20上的基材200实现与数字化掩模板30之间的对准。
本申请实施例中的基材200在托盘20上的固定方式不限于卡台、卡持、夹具、吸附、粘贴等。优选地，托盘20上设置有定位柱，该定位柱用以与基材上的定位孔配合，基材通过定位孔套在定位柱上实现位置固定。
如图7-8所示，在一些实施例中，光处理设备100，还可包括：趋近组件22，与托盘20连接/配合，用以当托盘20上的基材200与数字化掩模板30之间对准时/后，驱使托盘20带动基材200向数字化掩模板30逼近，从而缩小基材200与数字化掩模板30之间的间距，甚至使基材200直接贴附在数字化掩模板30上，达到数字化掩模板30与基材200之间0间距的效果。同时该设计有利于避免基材200与数字化掩模板30之间的摩擦，降低对两者产生划痕的概率。该趋近组件22不限于升降台、弹簧、滑轨、卡台等。
如图9-10所示，在一优选实施例中，趋近组件22可包括：设置在托盘座上的倾斜滑槽221，该倾斜滑槽221的导向方向与托盘座的移动方向相同，以及向托盘座的推入方向向下倾斜，托盘20通过该倾斜滑槽221装配在托盘座上，托盘20可沿该倾斜滑槽221在托盘座上进行移动；其中，由于该倾斜滑槽221的向托盘座的推入方向向下倾斜，因此托盘20通过倾斜滑槽221向推入方向移动时，其位置相对于数字化掩模板30而言，竖直相对距离变大；相反的，当托盘20通过倾斜滑槽221向抽出方向移动时，其位置相对于数字化掩模板30而言，竖直相对距离减小。在一般情况下，托盘20会由于自身重力的原因，产生向倾斜滑槽221的低端移动的作用力，以及在无外力作用下，托盘20会始终处于倾斜滑槽221的低端；该贴近组件22，还包括：定位挡板222，设置在托盘20的移动路径上，用以阻挡托盘20的移动，配合托盘座和倾斜滑槽221的作用，使托盘20上的基材200对准且贴近数字化掩模板30。该实施例 中，当托盘座自外向内推入时，托盘20位于倾斜滑槽221的低端，而当托盘座的逐步推入的过程中，托盘20与定位挡板222接触，并由于定位挡板222的阻挡，开始相对于倾斜滑槽221产生反向移动，从而沿着倾斜滑槽221逐步攀升，进而使托盘20上的基材200逼近数字化掩模板30。其中，在托盘座完全推入后，托盘20位于倾斜滑槽221另一侧的高端位置时，托盘20上的基材200与数字化掩模板30对准。
该实施例中利用倾斜滑槽221、定位挡板222、以及托盘座的推入，实现了基材200向数字化掩模板30的逼近，并且由于倾斜滑槽221的作用，使基材200与数字化掩模板30对位的过程中，不会产生相对摩擦。
如图11-12，在一些实施例中，趋近组件22，还可包括：设置在托盘20背面(放置基材的相对另一侧)的弹簧机构223，其在托盘20位于倾斜滑槽221的高端位置时，释放其弹性，将托盘20顶向数字化掩模板30，使基材200进一步逼近数字化掩模板30。具体地，托盘20通过弹簧机构223固定在底板224上，底板224配合托盘座上的倾斜滑槽221进行滑动。
再有，定位挡板222与托盘20上可设置有相互配合的磁性吸合组件，该磁性吸合组件用以对托盘施加其沿着倾斜滑槽221向其低端移动的驱动力，该实施例用以辅助增强重力作用，使其在滑动的过程中，尽可能主动向倾斜滑槽221趋近。
在一些实施例中，本申请实施例中的光源10适用于任何波段的光线，而当使用对人体有危害的波段的情况下，可通过在光源10与数字化掩模板30之间设置阻光外泄的遮光罩50。
如图13所示，优选地，光源10、遮光罩50和数字化掩模板30形成封闭腔体，只有当光源和数字化掩模板共同启用工作时，光源从该封闭腔体的数字化掩模板的透光图案处射出图案一致的光线。该实施例中，光源和数字化掩模板可设置在遮光罩的相对一侧，例如光源10设置在遮光罩50的顶部，其照射方向向下，数字化掩模板设置在与光源相对的遮光罩的底部。
优选地，由光源、遮光罩和数字化掩模板形成的封闭腔体的腔内为真空结构，用以避免杂质影响光线的传播。
在另一些实施例中，针对光源选用不对人体存在危害的波段的情况下，亦可设置上述遮光罩，以此达到封闭式光处理环境，避免对外界的光线影响。
优选地，针对于光固化处理的情况下，光源一般选用光线波长为350nm～460nm的光源组件，常用的光线波长如365nm的紫外光、395nm的紫外光、405nm的兰紫光等。本申请实施例中的光源的选用可根据具体针对的感光材料(如感光树脂材料)进 行选定。在一些实施例中，亦可选用可发射多波段的光源，配合阻隔/透射不同光线的阻光板获得目标波长的光线。
如图14所示，在一些实施例中，光处理设备100，还包括：壳体60，该壳体60可用以配合基座40容纳光源10、托盘20、数字化掩模板30等组件/模块。该壳体可以为全封闭壳体或半封闭壳体，从而实现对设备的整体或局部的遮挡/包装。针对于全封闭壳体结构而言，可通过组合的方式实现，在一些情况下，用户可通过打开该组合结构，从而进行更换/调整基材、组件等，在操作完成后，在将壳体进行组合封闭。在一些实施例中，壳体60与基座40可为一体化结构。
在一些实施例中，光处理设备，还包括：控制模块，分别与光处理设备中的电子功能模块(例如数字化掩模板、光源等)连接，以此实现对各电子功能模块的系统控制。控制模块可为集成电路板、控制仪、处理器等，其直接采购市面上的控制模块。
在一些实施例中，光处理设备，还可包括：显示组件，可用以显示数字化掩模板所用的电子图形数据，以及光处理设备的各项运行参数信息等。该显示组件与控制模块连接。
在一些实施例中，光处理设备，还可包括：按键组件，可满足光处理设备的独立控制，包括但不限于设备开关按钮、数据切换键、功率调节按键等。该按键组件与控制模块连接。
在一些实施例中，显示组件和按键组件中的全部/部分功能可通过采用触摸屏实现相应的控制与显示。
在一些实施例中，光处理设备，还可包括：数据接口组件，可用于连接外部终端设备，实现外部终端设备对光处理设备的系统控制；又或者，数据接口组件直接连接外部存储设备，获取该存储设备中的数字化掩模板所用的电子图形数据。该数据接口组件与控制模块连接。
在一些实施例中，光处理设备还包括必要电源模块，在此不再赘述。
在一些实施例中，光处理设备中还可包含散热组件，用以降低光处理设备的热量，保证光处理设备的持续稳定的运行。
在一些实施例中，光源可选用矩阵式发光组件，包括：反射背板、固定在反射背板上的发光元件。反射背板靠近发光元件的一侧具有金属发射面，用以将光线集中于发光元件的一侧。优选地，散热组件装配在反射背板远离发光元件的另一侧，用以带着光源所产生的热量。
如图15所示，在一些实施例中，光源10与数字化掩模板30之间设置有光学透镜12，用以将光源10发射出的发散光转变为均匀的、垂直于数字化掩模板30的方向的光线。该光学透镜12可采用塑料、石英玻璃等材质。
本申请中的上述实施例可任意组合，所构成的方案均在本申请的保护范围之内。
如图16-17所示，进一步的，本申请实施例中公开了一种光处理设备的优选实施例，该实施例中的光处理设备，包括：基座40、通过滑轨装配在基座40上的托盘座、托盘座上设置有倾斜滑槽221，托盘20通过倾斜滑槽221装配在托盘座上，托盘20的移动路径上设置有定位挡板222，用以配合倾斜滑槽221将托盘20限定在目标位置(与数字化掩模板30水平方向相对位置，以及竖直方向目标间距)；位于该目标位置的正上方架设有数字化掩模板30，数字化掩模板30的正上方架设有光源10，光源10和数字化掩模板30之间环绕式设置有遮光罩50，光源10、数字化掩模板30和遮光罩50共同构成封闭腔体，该封闭腔体内介于光源10、数字化掩模板30的位置处设置有光学透镜12；光源10的外部设有散热组件11。光处理设备100还包括：壳体60，配合基座40完成对内部组件的遮挡；壳体60相对于托盘座的滑动方向上开设有物料口，该物料口用以托盘座的推入和抽出；其中，托盘座的外侧面设置有与该物料口形状相应的挡板，用以在托盘座推入后配合壳体60形成封闭结构(类似于抽屉)。壳体60的外侧还设置有电源接口、数据接口组件、显示组件、按键组件等，壳体60的内部还设置有控制模块70，该控制模块70分别与电源接口、数据接口组件、显示组件、按键组件、光源10和数字化掩模板30连接。
优选地，托盘20的底部设置有压紧弹簧，用以在托盘20移动至倾斜滑槽221的高端处使释放弹性，推动托盘20逼近数字化掩模板30。
本申请实施例中的光处理设备适用于光图案化固化设备，尤其适于实现电路板上的感光材料的光固化处理。
本申请实施例中的基材200适用于表面贴附有感光干膜的基材，又或者表面具有预固化的涂层的基材，感光材料不限于阻焊剂、感光树脂等。
本领域技术人员还应当理解，结合本文的实施例描述的各种说明性的逻辑框、模块、电路和算法步骤均可以实现成电子硬件、计算机软件或其组合。为了清楚地说明硬件和软件之间的可交换性，上面对各种说明性的部件、框、模块、电路和步骤均围绕其功能进行了一般地描述。至于这种功能是实现成硬件还是实现成软件，取决于特定的应用和对整个系统所施加的设计约束条件。熟练的技术人员可以针对每个特定应 用，以变通的方式实现所描述的功能，但是，这种实现决策不应解释为背离本公开的保护范围。

Claims (14)

  1. 一种光处理设备，其特征在于，包括：基座、固定在所述基座上的光源、托盘、以及介于光源与托盘之间的数字化掩模板；其中，所述托盘上用以放置待处理的基材；所述数字化掩模板用以根据用户设置的电子图形显示相应的遮光图案，使所述光源射出的光线穿透所述数字化掩模板对所述托盘上的基材进行与所述遮光图案相反的光处理。
  2. 根据权利要求1所述的光处理设备，其特征在于，所述光源与所述数字化掩模板之间的距离为10mm～500mm。
  3. 根据权利要求1所述的光处理设备，其特征在于，所述数字化掩模板与所述基材之间的距离为0mm～30mm。
  4. 根据权利要求1所述的光处理设备，其特征在于，还包括：设置于所述光源与所述数字化掩模板之间、用以防止光线外泄的遮光罩。
  5. 根据权利要求1所述的光处理设备，其特征在于，还包括：遮盖所述光源、托盘、数字化掩模板的壳体。
  6. 根据权利要求1所述的光处理设备，其特征在于，还包括：装配在所述基座上的移动组件；所述托盘设置于所述移动组件之上，以便于通过所述移动组件将所述托盘抽出进行基材的放/取，以及通过所述移动组件将托盘推入使所述基材与所述数字化掩模板的对准。
  7. 根据权利要求6所述的光处理设备，其特征在于，所述移动组件为用以固定所述托盘的托盘座，所述托盘座通过滑轨安装在所述基座上。
  8. 根据权利要求6所述的光处理设备，其特征在于，还包括：与所述托盘配合的趋近组件，用以在所述托盘推入时，驱使基材逼近所述数字化掩模板，以及在所述托盘抽出时，驱使基材远离所述数字化掩模板。
  9. 根据权利要求1所述的光处理设备，其特征在于，所述数字化掩模板为数控遮透光显示面板。
  10. 根据权利要求9所述的光处理设备，其特征在于，所述数控遮透光显示面板上每一个像素点可根据用户设置的所述电子图形形成相应的遮光像素点或透光像素点；所述遮光像素点的组合构成所述遮光图案，所述透光像素点的组合构成透光图案，所述遮光图案与所述透光图案的组合图案与所述光源照射在所述基材上的图案一致。
  11. 根据权利要求1所述的光处理设备，其特征在于，所述数字化掩模板选用LCD显示面板或OLED显示面板。
  12. 根据权利要求1所述的光处理设备，其特征在于，所述光源发射的光线波长为350nm～460nm。
  13. 根据权利要求1所述的光处理设备，其特征在于，所述光源与所述数字化掩模板之间设置有光学透镜，用以将所述光源射出的光线的方向转换为垂直于所述数字化掩模板的方向。
  14. 根据权利要求1所述的光处理设备，其特征在于，还包括：设于所述光源背板上的散热组件。
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CN104007620A (zh) * 2014-02-18 2014-08-27 苏州微影光电科技有限公司 一种新型高速数字扫描直写光刻装置
CN204374612U (zh) * 2015-02-04 2015-06-03 四川云盾光电科技有限公司 紫外数字光刻系统
CN105137720A (zh) * 2015-09-18 2015-12-09 中国科学院光电技术研究所 基于数字微镜阵列制作不同深度的多台阶光栅的无掩模光刻机
CN107131838A (zh) * 2017-06-27 2017-09-05 常州瑞丰特科技有限公司 基于可调制lcd掩模的多码道光栅尺的制造方法
CN109061784A (zh) * 2018-11-02 2018-12-21 京东方科技集团股份有限公司 一种光栅结构及其制作方法、显示装置
CN112808549A (zh) * 2021-02-02 2021-05-18 北京梦之墨科技有限公司 一种光处理设备
CN214555029U (zh) * 2021-02-02 2021-11-02 北京梦之墨科技有限公司 一种光处理设备

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