WO2022158579A1 - Ｒｆｉｄモジュールを備えた容器 - Google Patents

Ｒｆｉｄモジュールを備えた容器 Download PDF

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Publication number
WO2022158579A1
WO2022158579A1 PCT/JP2022/002261 JP2022002261W WO2022158579A1 WO 2022158579 A1 WO2022158579 A1 WO 2022158579A1 JP 2022002261 W JP2022002261 W JP 2022002261W WO 2022158579 A1 WO2022158579 A1 WO 2022158579A1
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WO
WIPO (PCT)
Prior art keywords
metal film
flap
container
rfid module
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/002261
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English (en)
French (fr)
Japanese (ja)
Inventor
登 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP2022548065A priority Critical patent/JP7197065B2/ja
Publication of WO2022158579A1 publication Critical patent/WO2022158579A1/ja
Priority to US18/355,868 priority patent/US20230359847A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
    • G06K19/025—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine the material being flexible or adapted for folding, e.g. paper or paper-like materials used in luggage labels, identification tags, forms or identification documents carrying RFIDs
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/06—Details
    • H01Q9/065—Microstrip dipole antennas

Definitions

  • the present invention relates to a container equipped with an RFID module, particularly a container equipped with an RFID module using RFID (Radio Frequency Identification) technology for non-contact data communication using an induced electromagnetic field or radio waves.
  • RFID Radio Frequency Identification
  • RFID tags which are wireless communication devices
  • An RFID tag together with RFIC (Radio-Frequency Integrated Circuit)
  • RFIC Radio-Frequency Integrated Circuit
  • a metal material such as an antenna pattern formed on an insulating substrate such as paper or resin.
  • the RFID tag is affected and communication becomes impossible.
  • Patent Document 1 proposes a configuration in which an RFID tag that is compatible with metal formed on a part of the container is provided so as not to impair the design.
  • the RFID tag disclosed in Patent Document 1 has an RFIC chip and an antenna pattern, and a metal film cannot be formed on the container in these areas. Therefore, there is a demand for a container having an RFID module that suppresses a reduction in the degree of design freedom.
  • the purpose of the present invention is to provide a container having an RFID module that suppresses deterioration in design in a container on which a metal film is formed.
  • a container according to one aspect of the present invention is a prefabricated box-shaped container equipped with an RFID module, comprising: an insulating base material forming the outer shape of the container; a metal film formed on the base material; and a first slit formed in the metal film.
  • the base material has a first surface and a second surface which are one of the side surface, the top surface and the bottom surface of the container, and the first flap which is continuous with the first surface.
  • a first slit is formed to separate the metal film of the first flap into a first metal region and a second metal region.
  • the RFID module includes an RFIC element, a filter circuit for transmitting a current due to electromagnetic waves having a unique resonance frequency, which is a communication frequency, to the RFIC element, and first and second electrodes connected to the filter circuit.
  • a first electrode of the RFID module and a first metal region of the metal film of the first flap are electrically connected.
  • a second electrode of the RFID module and a second metal region of the metal film of the first flap are electrically connected.
  • a first metal region of the metal film of the first flap is continuous with the metal film of the first surface. In the assembled state, the second metal region of the metal film of the first flap is electrically connected to the metal film of the second surface by capacitive coupling.
  • the present invention it is possible to provide a container having an RFID module that suppresses deterioration in design in a container on which a metal film is formed.
  • FIG. 1 is an overall perspective view of a container having an RFID module according to Embodiment 1;
  • FIG. Sectional view of arrow II in FIG. An exploded view of the container in FIG. Perspective plan view of RFID module
  • FIG. 6A is a plan view of a conductor pattern formed on the substrate of the RFID module;
  • FIG. 6B is a plan view of the conductor pattern formed on the bottom surface of the substrate;
  • Schematic of RFID module Graph showing the communication characteristics of the RFID module The perspective view which piled up and arranged the container of Embodiment 1.
  • FIG. 4 is a development view of a container in a modified example of Embodiment 1.
  • FIG. 4 is a development view of a container in a modified example of Embodiment 1.
  • FIG. Front view of the sixth surface of the assembled container 1 in the modified example of the first embodiment is a development view of a container in a modified example of Embodiment 1.
  • FIG. Front view of the sixth surface of the assembled container 1 in the modified example of the first embodiment is a development view of a container in a modified example of Embodiment 1.
  • a container according to one aspect of the present invention is a prefabricated box-shaped container equipped with an RFID module, comprising an insulating base material forming the outer shape of the container, and a metal film formed on the base material. , and a first slit formed in the metal film.
  • the base material has a first surface and a second surface which are one of the side surface, the top surface and the bottom surface of the container, and the first flap which is continuous with the first surface.
  • a first slit is formed to separate the metal film of the first flap into a first metal region and a second metal region.
  • the RFID module includes an RFIC element, a filter circuit for transmitting a current due to electromagnetic waves having a unique resonance frequency, which is a communication frequency, to the RFIC element, and first and second electrodes connected to the filter circuit.
  • a first electrode of the RFID module and a first metal region of the metal film of the first flap are electrically connected.
  • a second electrode of the RFID module and a second metal region of the metal film of the first flap are electrically connected.
  • a first metal region of the metal film of the first flap is continuous with the metal film of the first surface. In the assembled state, the second metal region of the metal film of the first flap is electrically connected to the metal film of the second surface by capacitive coupling.
  • the container of this aspect is electrically connected to the first metal region and the second metal region of the metal film formed on the first flap of the container, and the metal film and the second metal region on the first surface that are continuous with the first metal region.
  • the metal film on the second surface connected to the terminal is used as an antenna.
  • a second slit may be provided for separating the metal film on the first surface and the metal film on the second surface.
  • the base material may have a third surface continuous with the first surface and the second surface, and the second slit may be formed between the metal film on the second surface and the metal film on the third surface. good.
  • the substrate has a first tuck flap continuous with the second surface on the side opposite to the third surface, and a third slit formed between the metal film of the second surface and the metal film of the first tuck flap. You may prepare.
  • the metal film may be formed on the entire surface of the substrate except for the first, second and third slits.
  • a design in which a metal film is formed on substantially the entire first main surface of the container can also be realized, and the degree of freedom in the design of the container can be improved.
  • the metal film may not be formed in the region of the second surface that overlaps the first metal region of the metal film of the first flap.
  • the substrate has a fourth surface continuous with the third surface on the side opposite to the second surface, the substrate has a second tuck flap continuous with the fourth surface on the side opposite to the third surface, and a third surface a fourth slit formed between the metal film on the fourth surface and the metal film on the fourth surface; and a fifth slit formed between the metal film on the fourth surface and the metal film on the second tuck flap.
  • the substrate has a third surface continuous with the first surface and a fourth surface located between the second surface and the third surface on the side opposite to the first flap and continuous with the second surface and the third surface. and a joining flap opposite the fourth side and continuous with the second side.
  • a second slit is formed between the metal film on the second surface and the metal film on the fourth surface, and a third slit separates the respective metal films between the metal film on the fourth surface and the metal film on the joining flap. may be formed.
  • the second surface and the third surface face each other, and the metal film may not be formed in the region of the second surface that overlaps the first metal region of the metal film of the first flap.
  • the substrate has a third surface continuous with the first surface and a fourth surface located between the second surface and the third surface on the side opposite to the first flap and continuous with the second surface and the third surface.
  • a surface may be provided.
  • the second surface and the third surface face each other, and the metal film may not be formed in the region of the second surface that overlaps the second metal region of the metal film of the first flap.
  • the first flap may be a tuck flap.
  • the RFID module arranged on the tack flap that is continuous with the first surface is arranged between the tack flap and the side surface, so that it does not appear on the outer surface of the container. Therefore, it is possible to prevent deterioration of the design of the container.
  • the first flap has a body flap connecting with the first surface and an extension flap extending from the body flap, the first metal region being disposed on the body flap and the second metal region being disposed on the extension flap. may be placed. Thereby, even when the size of the container is small, it is possible to suppress the reduction of the communication distance.
  • the metal film when the electromagnetic wave of the communication frequency is irradiated to the metal film, the current may flow in the direction intersecting the slit. In this way, the metal film functions as a dipole antenna, so communication characteristics of a dipole antenna can be obtained.
  • the filter circuit may be an LC parallel resonant circuit. As a result, a current with a frequency that matches the RFIC can be passed through the RFIC.
  • the sheet resistance of the metal film may be 0.5 ⁇ / ⁇ or more. Even with this configuration, since the RFID module has a filter circuit, the eddy current generated in the metal film can be utilized to flow to the RFIC.
  • the electrical lengths of the antenna pattern and the conductor pattern are longer than their physical lengths.
  • the electrical length is a length that takes into account wavelength shortening or extension due to relative permittivity and parasitic reactance components.
  • FIG. 1 is an overall perspective view of a container 1 having an RFID module 5 according to Embodiment 1 of the present invention.
  • 2 is a cross-sectional view taken along line II in FIG. 1
  • FIG. 3 is a developed view of the container 1 in FIG.
  • the container 1 of Embodiment 1 includes the base material 3, the RFID module 5 attached to the base material 3, the metal film 7 formed on the first main surface 3s of the base material 3, and the metal film 7.
  • the container 1 is formed into a three-dimensional shape by, for example, assembling flat substrates 3 as shown in FIG.
  • the container 1 has, for example, a cuboid shape, and the substrate 3 is made from, for example, paper, resin, or plastic.
  • the base material 3 includes a first surface 3a, a second surface 3b, a third surface 3c, a fourth surface 3d, a fifth surface 3e, a sixth surface 3f, a joining flap 3g, a first tack flap 3h, a second tack. It has a flap 3k, a first dust flap 3m, a second dust flap 3n, a third dust flap 3p and a fourth dust flap 3q.
  • the first side 3a, the third side 3c, the fifth side 3e and the sixth side 3f are the sides of the container 1 when assembled.
  • the fourth surface 3d becomes the upper surface (top surface) of the container 1 when assembled, and the second surface 3b becomes the lower surface (bottom surface) of the container 1 when assembled.
  • the first main surface 3 s of the base material 3 is mainly the outer surface (front surface) of the container 1
  • the second main surface 3 t of the base material 3 is mainly the inner surface (back surface) of the container 1 .
  • the first main surface 3s of the joining flap 3g is, for example, attached to the second main surface 3t of the first surface 3a via an adhesive layer when assembled.
  • the first major surface 3s of the first tuck flap 3h contacts the second major surface 3t of the sixth surface 3f when assembled.
  • the first major surface 3s of the second tuck flap 3k contacts the second major surface 3t of the sixth surface 3f when assembled.
  • the first dust flap 3m and the second dust flap 3n are configured to prevent dust and the like from entering the container 1 through gaps between the second surface 3b, which is the lower surface, and the first surface 3a and the fifth surface 3e, which are the side surfaces. prevent entry.
  • the third dust flap 3p and the fourth dust flap 3q each remove dust from the container 1 through gaps between the fourth surface 3d that is the upper surface and the first surface 3a and the fifth surface 3e that are side surfaces. prevent entry into the interior.
  • the first surface 3a is connected to the first dust flap 3m via the lower side 41, and is connected to the fourth dust flap 3q via the upper side 51.
  • the first slit 71 extends from the end along the lower side 41 that is the boundary between the first surface 3a and the first dust flap 3m, and when approaching the center of the lower side 41, the first dust flap 3m extends in a direction away from the lower side 41. It bends in an S shape toward the side, further extends in a direction parallel to the lower side 41 , passes through the center of the lower side 41 , bends in an S shape toward the lower side 41 , and extends along the lower side 41 again.
  • the first surface 3 a and the third surface 3 c are connected via the side edge 61 .
  • the third surface 3c is connected to the second surface 3b via the lower side 42, and is connected to the fourth surface 3d via the upper side 52.
  • a second slit 72 is formed in the metal film 7 along the lower edge 42 to separate the metal film 7 on the second surface 3b from the metal film 7 on the third surface 3c.
  • a fourth slit 74 is formed in the metal film 7 along the upper edge 52 to separate the metal film 7 on the third surface 3c from the metal film 7 on the fourth surface 3d.
  • the second slit 72 is located on the extension of the first slit 71 .
  • the second surface 3b is connected to the first tuck flap 3h on the side opposite to the third surface 3c.
  • a third slit 73 is formed in the metal film 7 between the second surface 3b and the first tuck flap 3h to divide the metal film 7 of the second surface 3b and the metal film 7 of the first tuck flap 3h.
  • the fourth surface 3d is connected to the second tack flap 3k on the side opposite to the third surface 3c.
  • a fifth slit 75 is formed in the metal film 7 between the fourth surface 3d and the second tuck flap 3k to divide the metal film 7 of the fourth surface 3d and the metal film 7 of the second tuck flap 3k.
  • the third surface 3c is connected to the fifth surface 3e on the side opposite to the first surface 3a.
  • the fifth surface 3e is connected to the second dust flap 3n via the lower side 43 and connected to the third dust flap 3p via the upper side 53.
  • the fifth surface 3e is connected to the sixth surface 3f on the side opposite to the third surface 3c.
  • the sixth surface 3f is connected to the joining flap 3g on the side opposite to the fifth surface 3e.
  • the metal film 7 is formed on the entire surface of the first main surface 3s of the base material 3 except for the first to fifth slits 71 to 75.
  • the first to fifth slits 71 to 75 are grooves that divide the metal film 7, respectively.
  • the metal film 7 is made of a film body made of a conductive material such as a metal foil such as an aluminum foil or a copper foil, and is formed, for example, by attaching a metal sheet.
  • a communication distance can be increased by using a metal having a low resistance value, such as aluminum or copper, as the metal film 7 .
  • the thickness of the metal film 7 is, for example, greater than 5 ⁇ m and equal to or less than 40 ⁇ m.
  • the metal film 7 of the first dust flap 3m is physically divided into two regions by the first slit 71.
  • the metal film 7 of the first dust flap 3m is divided into two regions, the first metal region 7a and the second metal region 7b, and the first metal region 7a and the second metal region 7b are divided into the first metal region 7a and the second metal region 7b. It is electrically insulated by the slit 71 .
  • the metal film 7 may not be formed on the entire surface of the base material 3, and may be formed partially on the first dust flap 3m and other surfaces, for example.
  • the metal film 7 has a first metal region 7a extending along the outside of the container 1 in a direction crossing the first slit 71 and a metal film 7 extending along the outside of the container 1 in a direction crossing the first slit 71 and extending in a direction opposite to the first metal region 7a.
  • the second metal region 7b extending along the outside functions as a dipole antenna.
  • the first slit 71 is a groove that divides the metal film 7 of the first dust flap 3m.
  • the first slit 71 also separates the metal film 7 on the second metal region 7b of the first dust flap 3m from the metal film 7 on the first surface 3a.
  • a width W of the first slit 71 is, for example, 1 mm.
  • the first slit 71 may be formed by forming the metal film 7 on the entire first main surface 3 s of the base material 3 and then cutting the metal film 7 , or by cutting two metal sheets so as to form the width of the first slit 71 . It may be formed by attaching to the first main surface 3S of the base material 3 with W left.
  • the RFID module 5 of Embodiment 1 is a wireless communication device configured to wirelessly communicate (transmit and receive) using high-frequency signals having a communication frequency (carrier frequency).
  • the RFID module 5 is configured, for example, to wirelessly communicate with a high-frequency signal having a frequency for UHF band communication.
  • the UHF band is a frequency band from 860 MHz to 960 MHz.
  • FIG. 4 is a perspective plan view of the RFID module
  • FIG. 5 is a cross-sectional view taken along arrow V in FIG. 6 shows a plan view of the conductor pattern formed on the substrate of the RFID module
  • FIG. 6a is a plan view of the conductor pattern formed on the upper surface of the substrate of the RFID module
  • FIG. 6b is a plan view of the conductor pattern formed on the lower surface of the substrate.
  • 1 is a perspective plan view of a conductor pattern seen from above
  • FIG. 7 is a cross-sectional view taken along line VII in FIG. 4.
  • the XYZ coordinate system is intended to facilitate understanding of the invention and is not intended to limit the invention.
  • the X-axis direction indicates the longitudinal direction of the RFID module 5
  • the Y-axis direction indicates the depth (width) direction
  • the Z-axis direction indicates the thickness direction.
  • the X, Y and Z directions are orthogonal to each other.
  • the RFID module 5 is attached to the upper surfaces of the first metal region 7a and the second metal region 7b of the metal film 7 via an adhesive layer 15 such as double-sided tape or synthetic resin.
  • the RFID module 5 includes a substrate 21 and an RFIC 23 mounted on the substrate 21.
  • the substrate 21 is, for example, a flexible substrate such as polyimide.
  • a protective film 25 is formed on the upper surface of the substrate 21 on which the RFIC 23 is mounted.
  • the protective film 25 is, for example, an elastomer such as polyurethane or a hot melt agent such as ethylene vinyl acetate (EVA).
  • a protective film 27 is also attached to the lower surface of the substrate 21 .
  • the protective film 27 is, for example, a coverlay film such as a polyimide film (Kapton tape).
  • a third electrode 33, a fourth electrode 35, a conductor pattern L1a of the main portion of the first inductance element L1, and a conductor pattern L2a of the main portion of the second inductance element L2 are formed on the upper surface of the substrate 21.
  • FIG. The third electrode 33 is connected to one end of the conductor pattern L1a
  • the fourth electrode 35 is connected to one end of the conductor pattern L2a.
  • a first electrode 29 and a second electrode 31 that are capacitively coupled to the first metal region 7a and the second metal region 7b of the metal film 7 are formed on the lower surface of the substrate 21, respectively. Further, on the lower surface of the substrate 21, a conductor pattern L1b, which is a part of the first inductance element L1, and conductor patterns L3a, L3b (a conductor pattern surrounded by a two-dot chain line), and L3c of the third inductance element L3 are formed. These conductor patterns are also obtained by patterning copper foil by photolithography, for example.
  • the first electrode 29 is connected to one end of the conductor pattern L1b of the first inductance element L1 and one end of the conductor pattern L3a of the third inductance element L3.
  • one end of the conductor pattern L2b of the second inductance element L2 and one end of the conductor pattern L3c of the third inductance element L3 are connected to the second electrode 31 .
  • a conductor pattern L3b is connected between the other end of the conductor pattern L3a of the third inductance element L3 and the other end of the conductor pattern L3c.
  • the other end of the conductor pattern L1b of the first inductance element L1 and the other end of the conductor pattern L1a of the first inductance element L1 are connected via a via conductor V1.
  • the other end of the conductor pattern L2b of the second inductance element L2 and the other end of the conductor pattern L2a of the second inductance element L2 are connected via a via conductor V2.
  • the RFIC 23 is mounted on the third electrode 33 and the fourth electrode 35 formed on the upper surface of the substrate 21 . That is, the terminal 23 a of the RFIC 23 is connected to the third electrode 33 and the terminal 23 b of the RFIC 23 is connected to the fourth electrode 35 .
  • the conductor patterns L3a of the first inductance element L1 and the third inductance element L3 are formed in different layers of the substrate 21, respectively, and arranged so that their coil openings overlap.
  • the conductor patterns L3c of the second inductance element L2 and the third inductance element L3 are formed in different layers of the substrate 21, respectively, and arranged such that their coil openings overlap.
  • the RFIC 23 is positioned between the conductor pattern L3c of the second inductance element L2 and the third inductance element L3 and the conductor pattern L3a of the first inductance element L1 and the third inductance element L3 on the surface of the substrate 21. do.
  • FIG. 8 is a circuit diagram of the RFID module 5. As shown in FIG.
  • a first current path CP1 passing through the top and bottom surfaces of the substrate 21 and a second current path CP2 passing through the bottom surface of the substrate 21 are formed.
  • the first current path CP1 extends from the first electrode 29 to the second electrode 31 through the branch point N1, the conductor pattern L1b, the conductor pattern L1a, the RFIC 23, the conductor pattern L2a, the conductor pattern L2b, and the branch point N2.
  • the second current path CP2 extends from the first electrode 29 to the second electrode 31 through the branch point N1, the conductor pattern L3a, the conductor pattern L3b, the conductor pattern L3c, and the branch point N2.
  • the first inductance element L1 is composed of the conductor pattern L1b connected to the conductor pattern L1a via the via conductor V1
  • the conductor pattern L2b is composed of the conductor pattern L2a connected to the conductor pattern L2a via the via conductor V2.
  • the winding direction of the current flowing through the second inductance element L2 is reversed, and the magnetic field generated by the first inductance element L1 and the magnetic field generated by the second inductance element L2 cancel each other.
  • the first current path CP1 and the second current path CP2 are formed in parallel with each other between the first electrode 29 and the second electrode 31, respectively.
  • the first current path CP1 is part of the parallel resonant circuit RC1, which is an LC parallel resonant circuit, and is matched with the radio waves of the communication frequency. is received, a current flows through the RFIC 23 .
  • a parallel resonant circuit RC1 is formed in the RFID module 5.
  • the parallel resonant circuit RC1 is a loop circuit composed of a first inductance element L1, RFIC 23, a second inductance element L2, and a third inductance element L3.
  • the capacitor C1 is composed of the first metal region 7a, the first electrode 29, the adhesive layer 15, and the protective film 27.
  • Capacitor C2 is composed of second metal region 7b, second electrode 31, adhesive layer 15, and protective film 27.
  • the fourth inductance element L4 is an inductance component of the metal film 7 on the first surface 3a and the metal film 7 on the third surface electrically connected to the first metal region 7a and the first metal region 7a of the first dust flap 3m.
  • the fifth inductance element L5 is an inductance component of the metal film 7 on the second surface 3b capacitively coupled with the second metal region 7b of the first dust flap 3m and the second metal region 7b.
  • the parallel resonant circuit RC1 is designed to perform LC parallel resonance with impedance matching for radio waves at communication frequencies. Thereby, the communication frequency is matched with the RFIC, and the communication distance of the RFID module 5 at the communication frequency can be secured.
  • FIG. 9 is a graph showing the communication characteristics of the container 1 having the RFID module 5 according to the first embodiment.
  • the communication characteristics of the container 1 equipped with the RFID module 5 are good, with a communication distance of about 70 cm or more even in the UHF band from 860 MHz to 960 MHz, and a communication distance of 250 cm or more in the vicinity of 920 MHz in particular.
  • a fourth slit 74 is formed between the fourth surface 3d and the third surface 3c, and a fifth slit 75 is formed between the fourth surface 3d and the second tuck flap 3k. . Therefore, the metal film 7 on the fourth surface 3d is not directly electrically connected to the third surface 3c and the second tack flap 3k. Accordingly, when a plurality of containers 1 are arranged vertically as shown in FIG.
  • the fourth surface 3d of the lower container 1 and the second surface 3b of the upper container 1 are capacitively coupled, Even if the fourth surface 3d of the container 1 and the second surface 3b of the upper container 1 are at the same potential, the potentials of the first surface 3a and the third surface 3c of the upper container 1 are reduced. can do. Therefore, since the first metal region 7a and the second metal region 7b of the metal film 7 of each container 1 are kept in an insulated state without passing through the RFID module 5, communication with a plurality of containers 1 is possible. can be done at once.
  • the container 1 of Embodiment 1 is a prefabricated box-shaped container 1 equipped with an RFID module 5, and includes an insulating base material 3 that forms the outer shape of the container 1, and a base material 3 A metal film 7 formed thereon and a first slit 71 formed in the metal film 7 are provided.
  • the base material 3 has a first surface 3a serving as a side surface of the container 1, a second surface 3b serving as a lower surface, and a first dust flap 3m continuous with the first surface 3a.
  • the first slit 71 is formed to separate the metal film 7 of the first dust flap 3m into a first metal region 7a and a second metal region 7b.
  • the RFID module 5 includes an RFIC 23, a parallel resonance circuit RC1 as a filter circuit for transmitting a current due to electromagnetic waves having a unique resonance frequency, which is a communication frequency, to the RFIC 23, first and second electrodes 29 connected to the parallel resonance circuit RC1, 31 and.
  • the first electrode 29 of the RFID module 5 and the first metal region 7a of the metal film 7 of the first dust flap 3m are electrically connected, and the second electrode 31 of the RFID module 5 and the metal film 7 of the first dust flap 3m are electrically connected. is electrically connected to the second metal region 7b.
  • the first metal region 7a of the metal film 7 of the first dust flap 3m is continuous with the metal film 7 of the first surface 3a, and in the assembled state, the second metal region 7b of the metal film 7 of the first dust flap 3m. is electrically connected to the metal film 7 on the second surface 3b by capacitive coupling.
  • the RFID module 5 is arranged across the first slit 71 that divides the metal film 7 formed on the first dust flap 3m of the container 1 into the first metal region 7a and the second metal region 7b.
  • the first metal region 7a of the first dust flap 3m is continuous with the metal film 7 on the first surface 3a, and the second metal region 7b is capacitively coupled with the metal film 7 on the second surface. Therefore, the first and second metal regions 7a and 7b can be used as antenna electrodes, respectively, and a current can flow through the RFIC 23 by series resonance.
  • the container 1 has the metal film 7 formed thereon, it is possible to perform wireless communication, and it is possible to provide the container 1 having the RFID module 5 that suppresses deterioration in design.
  • the RFID module 5 arranged on the first dust flap 3m continuous with the first surface 3a is located inside the second surface 3b when the container 1 is assembled. does not appear in Therefore, it is possible to prevent the design of the container 1 from deteriorating.
  • the container 1 of Embodiment 1 can be provided at a lower cost than a conventional container fitted with a metal-compatible RFID module.
  • the conventional flag-type RFID module pops out of the container and breaks, the communication characteristics deteriorate.
  • the RFID module since the RFID module must protrude from the container, the degree of freedom in design is reduced.
  • the RFID module does not need to protrude from the container, so the degree of freedom in design is reduced. can be suppressed.
  • the container 1 includes a second slit 72 that separates the metal film 7 on the third surface 3c and the metal film 7 on the second surface 3b that are continuous with the metal film 7 on the first surface 3a. Therefore, the second slit 72 electrically separates the metal film 7 on the first surface 3a and the metal film 7 on the second surface 3b. Thereby, communication characteristics can be improved.
  • the base material 3 has a third surface 3c that is continuous with the first surface 3a and the second surface 3b.
  • the second slit 72 is formed between the metal film 7 on the second surface 3b and the metal film 7 on the third surface 3c. Thereby, the metal film 7 on the third surface 3c can be connected to the first metal region 7a, and the communication distance can be extended.
  • the base material 3 includes a first tack flap 3h continuous with the second surface 3b on the side opposite to the third surface 3c with respect to the second surface 3b, and the metal film 7 on the second surface 3b and the first tuck flap 3h a third slit 73 formed between the metal film 7 of the As a result, the metal film 7 on the second surface 3b can be prevented from being electrically connected to the metal film 7 on the sixth surface 3f, which capacitively couples with the metal film 7 on the first tack flap 3h. can be suppressed. 2, the metal film 7 on the second metal region 7b of the first dust flap 3m overlaps the metal film 7 on the second surface 3b with the substrate 3 interposed therebetween. so capacitive coupling.
  • the metal film 7 on the second surface 3b acts as a booster electrode for the first dust flap 3m, improving the reading distance.
  • the first dust flap 3m and the second surface 3b may be adhered with an adhesive layer.
  • the metal of the second metal region 7b of the first dust flap surface 3m can be maintained. Since the capacitive coupling between the film 7 and the metal film 7 on the second surface 3b can be maintained, deterioration of communication characteristics can be suppressed.
  • the metal film 7 may be formed on the entire surface of the base material 3 except for the first slit 71 , the second slit 72 and the third slit 73 . In this way, it is possible to realize a design in which the metal film 7 is formed on almost the entire surface of the first main surface 3s of the container 1 .
  • the metal film 7 When the metal film 7 is irradiated with an electromagnetic wave of a communication frequency, a current flows in the direction intersecting the first slit 71 . Since the metal film 7 functions as a dipole antenna in this way, it is possible to obtain the communication characteristics of a dipole antenna.
  • FIG. 11 is a developed view of the container 1A in Modification 1 of Embodiment 1.
  • FIG. A container 1A in Modification 1 of Embodiment 1 has a configuration in which the first slit 71 of the container 1 of Embodiment 1 is shifted toward the tip of the first dust flap 3m. This point and the configuration other than the points described below are substantially the same as the container 1 of the first embodiment.
  • the first slit 71A is formed, for example, so as to cross the central portion of the first dust flap 3m. Therefore, since the area of the first metal region 7a in the first dust flap 3m is increased, the container 1A is assembled to prevent capacitive coupling of the first metal region 7a with the metal film 7 on the second surface 3b. In this state, a non-metallic region 81 is formed in a region overlapping with the first metal region 7a on the second surface 3b. In the non-metallic region 81, the surface of the substrate 3 may be exposed, or the substrate 3 may be coated with a non-metallic material. As a result, the container 1A in Modification 1 can communicate with the container 1 in the first embodiment.
  • a non-metallic region 82 may be formed symmetrically with the non-metallic region 81 on the second surface 3b. Further, on the fourth surface 3d, a non-metallic region 83 may be formed at a position facing the non-metallic region 81, and a non-metallic region 84 may be formed at a position facing the non-metallic region 82 in the assembled state. .
  • the design is improved, and when the containers 1A are stacked vertically, even if the containers 1A are rotated 180 degrees, the non-metallic regions overlap each other, so that current is prevented from flowing between the upper and lower containers 1A. It is possible to perform wireless communication collectively.
  • FIG. 12 is a developed view of the container 1B in Modification 2 of Embodiment 1.
  • FIG. 13 is a front view of the sixth surface 3f of the assembled container 1B.
  • a container 1B in Modification Example 2 of Embodiment 1 has a configuration in which the RFID module 5 and the first slit 71 are arranged in the first tack flap 3h instead of the first dust flap 3m in the container 1 of the first embodiment.
  • This point and the configuration other than the points described below are substantially the same as the container 1 of the first embodiment.
  • a third slit 73B formed between the metal film 7 of the second surface 3b and the metal film 7 of the first tuck flap 3h is bent toward the tip of the first tuck flap 3h. Therefore, the metal film 7 of the first tack flap 3h is divided into the first metal region 7a2 and the second metal region 7b2 by the third slit 73B.
  • the first metal region 7a2 is continuous with the metal film 7 on the second surface 3b.
  • the second metal region 7b2 is capacitively coupled with the metal film 7 on the sixth surface 3f in the assembled state.
  • a sixth slit 76 is formed along the side between the metal film 7 on the fifth surface 3e and the metal film 7 on the sixth surface 3f.
  • a seventh slit 77 is formed along the side between the metal film 7 on the sixth surface 3f and the metal film 7 on the joining flap 3g.
  • the first metal region 7a2 of the sixth face 3f is kept in the assembled state of the container 1B.
  • a non-metallic region 85 is formed in a region overlapping with .
  • the non-metallic region 85 is connected with the seventh slit 77 .
  • the surface of the substrate 3 may be exposed, or the substrate 3 may be coated with a nonmetallic material.
  • the base material 3 has a third surface 3c continuous with the second surface 3b as the first surface and a sixth surface as the second surface on the opposite side of the first tuck flap 3h as the first flap.
  • a fifth surface 3e as a fourth surface located between the sixth surface 3f and the third surface 3c and continuous with the sixth surface 3f and the third surface 3c, respectively, and a sixth surface 3f on the opposite side of the fifth surface 3e. and a joining flap 3f continuous with.
  • a sixth slit 76 as a second slit is formed between the metal film 7 on the sixth surface 3f and the metal film 7 on the fifth surface 3e.
  • a seventh slit 77 is formed between the metal film 7 on the sixth surface 3f and the metal film 7 on the joint flap 3g as a third slit for separating the metal films 7 from each other.
  • the sixth surface 3f and the third surface 3c face each other, and the metal film 7 is formed on the nonmetallic region 85 of the sixth surface 3f overlapping the first metal region 7a2 of the metal film 7 of the first tuck flap 3h. is not formed.
  • the RFID module 5 is arranged on the first tack flap 3h, it is located inside the sixth surface 3f in the assembled state, so that it does not appear on the outer surface of the container 1. FIG. Therefore, it is possible to prevent the design of the container 1 from deteriorating.
  • FIG. 14 is a developed view of the container 1C in Modification 3 of Embodiment 1.
  • FIG. 15 is a front view of the sixth surface 3f of the assembled container 1C.
  • a container 1C according to Modification 3 of Embodiment 1 has a configuration in which the first metal region 7a2 is capacitively coupled with the sixth surface 3f in the container 1B according to Modification 2 of Embodiment 1. This point and the configuration other than the points described below are substantially the same as those of the container 1B of the second modification of the first embodiment.
  • the metal film 7 of the first tack flap 3h is divided into a first metal region 7a3 and a second metal region 7b3 by a slit 73C.
  • the first metal region 7a3 is continuous with the metal film 7 on the second surface 3b.
  • the first metal region 7a3 is capacitively coupled with the metal film 7 on the sixth surface 3f in the assembled state.
  • a non-metallic region 86 is formed in a region overlapping with .
  • the surface of the substrate 3 may be exposed, or the substrate 3 may be coated with a nonmetallic material.
  • the base material 3 has a third surface 3c continuous with the second surface 3b as the first surface and a sixth surface as the second surface on the opposite side of the first tuck flap 3h as the first flap.
  • a fifth surface 3e as a fourth surface located between 3f and the third surface 3c and continuous with the sixth surface 3f and the third surface 3c.
  • the sixth surface 3f and the third surface 3c face each other, and the metal film 7 is formed on the nonmetallic region 86 of the sixth surface 3f overlapping the second metal region 7b3 of the metal film 7 of the first tuck flap 3h. is not formed.
  • the RFID module 5 is arranged on the first tack flap 3h, it is positioned inside the sixth surface 3f in the assembled state of the container 1C, so that it does not appear on the outer surface of the container 1. FIG. Therefore, it is possible to prevent the design of the container 1 from deteriorating.
  • FIG. 16 is a developed view of the container 1D in Modification 3 of Embodiment 1.
  • FIG. 16 is a developed view of the container 1D in Modification 3 of Embodiment 1.
  • the RFID module 5 extends from the body flap 3gda of the joining flap 3gd. It is arranged in the flap 3gdb. This point and the configuration other than the points described below are substantially the same as the container 1 of the first embodiment.
  • the joining flap 3gd of the container 1D includes a body flap 3gda and an extension flap 3gdb extending from the body flap 3gda.
  • the body flap 3gda corresponds to the joining flap 3g of the first embodiment.
  • a first metal region 7a4 is arranged on the body flap 3gda.
  • the stretched flap 3gdb is folded along the connecting line with the joining flap 3ga and arranged so as to overlap the inner side of the fourth surface 3d.
  • a metal film 7 is formed on the extending flap 3gdb, and a second metal region 7b4 is arranged.
  • the extension flap 3gdb has a first slit 71 formed on the joining flap 3ga side.
  • the metal film 7 is not formed on the first main surface 3s of the first tuck flap 3h, the second tuck flap 3k, the first dust flap 3m to the fourth dust flap 3q, respectively. Since these flaps are not exposed to the outside when the container 1D is assembled, the design is not impaired even if the metal film 7 is not formed. Moreover, the cost can be reduced by not forming the metal film 7 on these flaps.
  • the metal surfaces 7 formed on the first surface 3a, the third surface 3c, the fifth surface 3e, the sixth surface 3f, and the main body flap 3g of the joining flap 3g are continuous and conductive.
  • a second slit 72 is formed between the second surface 3b and the third surface 3c, and a fourth slit 74 is formed between the fourth surface 3d and the third surface 3c. Therefore, the metal films 7 formed on the second surface 3b and the third surface 3c are separated and are not electrically connected to each other. In addition, the metal films 7 formed on the fourth surface 3d and the third surface 3c are also separated and not connected to each other.
  • the height La of the side between the second dust flap 3n and the fourth dust flap 3q on the fifth surface 3e is, for example, 5 cm, and the lateral height of each of the fifth surface 3e and the sixth surface 3f
  • the lengths Lb and Lc are, for example, 6 cm
  • the height of the container 1D is low, so the length of the metal film 7 on the side surface of the container 1D shortens the communication distance.
  • the height of the flap can only be increased to half the length and width of each of the sides, so in this case, the flap can only be stretched to a maximum of 3 cm.
  • the length Le of the metal film 7 can be made the same as the length Lc of the fourth surface 3d and the sixth surface 3f, so the antenna electrode can be extended up to 6 cm. be able to.
  • the maximum length Lc of about 11 cm can be secured together with the metal film 7 of the joining flap 3ga, and the communication distance can be improved.
  • the base material 3 includes the sixth surface 3f as the first surface and the fourth surface 3d as the second surface, which are any of the side surface, the top surface, and the bottom surface of the container 1D, and is continuous with the sixth surface 3f. and a joining flap 3gd as a first flap.
  • the first slit 71 is formed to separate the metal film 7 of the joining flap 3gd into a first metal region 7a4 and a second metal region 7b4.
  • the first electrode 29 of the RFID module 5 and the first metal region 7a4 of the metal film 7 of the joining flap 3gd are electrically connected, and the second electrode 31 of the RFID module 5 and the second metal of the metal film 7 of the joining flap 3gd are electrically connected. It is electrically connected to region 7b4.
  • the first metal region 7a4 of the metal film 7 of the joining flap 3gd is continuous with the metal film 7 of the sixth surface 3f, and in the assembled state the second metal region 7b4 on the extension flap 3gdb of the joining flap 3gd is the second It is electrically connected to the metal film 7 on the 4th surface 3d by capacitive coupling. Even with such a configuration, communication can be performed in the same manner as the container 1 of the first embodiment.
  • an adhesive layer is applied to the back side of the first surface 3a of the joint flap 3gd facing the body flap 3gda, and the body flap 3gda is attached to the back side of the first surface 3a, thereby extending from the body flap 3gda. Even if there are stretched flaps 3gdb that are not glued together, they can be easily glued to form the container 1. Further, the RFID module 5 is attached to the extension flap 3gdb, and its position overlaps with the fourth dust flap 3q. 3gdb and the fourth dust flap 3q. For this reason, the fourth dust flap 3q is arranged to protect the RFID module 5.
  • Embodiment 2 A container 1 according to Embodiment 2 of the present invention will be described below.
  • the difference between the container 1 of Embodiment 2 and the container 1 of Embodiment 1 is the difference in sheet resistance of the metal film 7 . This difference will be mainly described below. In the description of the second embodiment, descriptions of elements having the same configurations, actions, and functions as those of the first embodiment may be omitted in order to avoid overlapping descriptions.
  • the container 1 of Embodiment 2 has the same configuration as the RFID module 5 of Embodiment 1 except for the points described below.
  • the sheet resistance of the metal film 7 of the container 1 of the second embodiment is greater than the sheet resistance of the metal film 7 of the container 1 of the first embodiment.
  • the sheet resistance of the metal film 7 is large, the following problem occurs, which did not occur in the container 1 of the first embodiment.
  • the entire metal film 7 as the antenna electrode causes a resonance phenomenon and radiates electromagnetic waves.
  • the thickness of the metal film 7 in Embodiment 1 is, for example, greater than 5 ⁇ m and 40 ⁇ m or less, and the sheet resistance of the metal film 7 is 0.05 ⁇ / ⁇ or less.
  • the metal film of the container is usually formed to prevent oxidation of the food and improve the design. Furthermore, if the design is printed by gravure printing, offset printing, or the like, the printing thickness will be about 1 ⁇ m. In this case, a step occurs in the printed matter due to the thickness of the metal film as the antenna foil, which causes printing misalignment (blurring or bleeding). For these reasons, it has not been possible to directly print a design on a container to which a conventional antenna foil is attached.
  • the resistance value of the matching circuit section between the RFIC and the antenna is the same thickness as the metal film, the resistance value of the matching circuit section increases, the matching loss increases, and the RFID module does not work.
  • an antenna electrode made of a thin metal film cannot emit electromagnetic waves due to a (series) resonance phenomenon. to shield.
  • This current is also called eddy current.
  • the eddy current flows, the current component flowing in the metal film is not due to the resonance phenomenon of the antenna electrode, so it can handle all frequency components regardless of the electrode pattern shape.
  • This eddy current is known as an effect of metal shielding, but it is not commonly used as an antenna.
  • the RFID module 5 Since the RFID module 5 has a parallel resonance circuit RC1 as a filter circuit that transmits only the current of the unique resonance frequency to the RFIC 23, the eddy current is frequency-selected, current flows through the RFIC 23, and energy is transmitted. Only a specific frequency is selected between the metal film 7 as the antenna electrode and the RFID module 5, impedance matching is achieved, and energy transmission between the RFIC 23 and the metal film 7 becomes possible. In this way, it is considered that communication with the RFIC 23 becomes possible.
  • the high surface resistance value of the metal film 7 is caused not only by the thickness of the metal film 7 but also by the manufacturing method of the metal film 7 .
  • the sheet resistance may be 0.5 ⁇ or more. Even in such a case, wireless communication can be performed with the container 1 of the second embodiment.
  • the present invention is not limited to the above embodiments, and can be modified as follows.
  • the joining flap 3g is adhered to the first surface 3a, but the present invention is not limited to this. Any of the first tuck flap 3h, the second tuck flap 3k, the first dust flap 3m to the fourth dust flap 3q may be adhered to the overlapping surface. Also, the joining flap 3g does not have to be adhered to the first surface 3a.
  • the container 1 is of an assembly type, but is not limited to this.
  • the container 1 may be a bottle or a plastic bottle.
  • the communication frequency band is the UHF band, but it is not limited to this. It may be configured to perform wireless communication using a high-frequency signal having a frequency (carrier frequency) for communication in the HF band.
  • the entire length of the metal film 7 perpendicular to the first slit 71 is designed to receive high frequency signals in the HF band.
  • the HF band is a frequency band from 13 MHz to 15 MHz.
  • the RFID module 5 is attached to the metal film 7, but the present invention is not limited to this.
  • RFIC 23 may be electrically connected to metal film 7 via an inductor.
  • the inductor is formed on the side of the metal film 7 functioning as an antenna pattern.
  • the metal film 7 may have a lower sheet resistance by attaching a metal foil as in the first embodiment.
  • the design of the container 1 may be enhanced by applying paint to the area of the metal film 7 other than the area where the RFID module 5 is attached to form a pattern.
  • the metal film 7 and the slots 9 may be formed on the second main surface 3t, which is the inner surface of the substrate 3, instead of the first main surface 3S, which is the outer surface.

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  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
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  • Details Of Rigid Or Semi-Rigid Containers (AREA)
  • Waveguide Aerials (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
PCT/JP2022/002261 2021-01-22 2022-01-21 Ｒｆｉｄモジュールを備えた容器 Ceased WO2022158579A1 (ja)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009004827A1 (ja) * 2007-07-04 2009-01-08 Murata Manufacturing Co., Ltd. 無線ｉｃデバイス
JP2009031893A (ja) * 2007-07-25 2009-02-12 Hitachi Ltd Ｒｆｉｄタグ実装パッケージおよびその製造方法
CN102372120A (zh) * 2010-08-16 2012-03-14 姜文波 兼作rfid标签的金属箔纸及其制造方法和包装盒

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7581743B2 (ja) * 2020-09-29 2024-11-13 大日本印刷株式会社 Ｒｆタグ付き包装容器
WO2022097422A1 (ja) 2020-11-09 2022-05-12 株式会社村田製作所 Ｒｆｉｄモジュールを備えた容器

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009004827A1 (ja) * 2007-07-04 2009-01-08 Murata Manufacturing Co., Ltd. 無線ｉｃデバイス
JP2009031893A (ja) * 2007-07-25 2009-02-12 Hitachi Ltd Ｒｆｉｄタグ実装パッケージおよびその製造方法
CN102372120A (zh) * 2010-08-16 2012-03-14 姜文波 兼作rfid标签的金属箔纸及其制造方法和包装盒

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