WO2022149950A1 - 안테나 모듈 - Google Patents
안테나 모듈 Download PDFInfo
- Publication number
- WO2022149950A1 WO2022149950A1 PCT/KR2022/000461 KR2022000461W WO2022149950A1 WO 2022149950 A1 WO2022149950 A1 WO 2022149950A1 KR 2022000461 W KR2022000461 W KR 2022000461W WO 2022149950 A1 WO2022149950 A1 WO 2022149950A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- circuit board
- printed circuit
- antenna
- dielectric layer
- disposed
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 claims abstract description 35
- 238000000034 method Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000004891 communication Methods 0.000 description 7
- 230000005855 radiation Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920001690 polydopamine Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000006855 networking Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
- H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2291—Supports; Mounting means by structural association with other equipment or articles used in bluetooth or WI-FI devices of Wireless Local Area Networks [WLAN]
Definitions
- This embodiment relates to an antenna module.
- an electronic device having an antenna such as a smart phone and a wearable device
- Such an electronic device may wirelessly transmit/receive data (eg, a message, a photo, a video, a music file, a game, etc.) through an antenna.
- data eg, a message, a photo, a video, a music file, a game, etc.
- Bluetooth technology is a communication means that can replace a mechanically weak and inconvenient wired cable between communication devices through one wireless connection within a short distance. It enables instant networking and voice communication including data communication with small mobile devices such as cell phones and PDAs and laptops, while its scope of application is not only cell phones, wireless headsets, LAN access points, but also printers, desktops, fax machines, and keyboards. , digital cameras, digital camcorders, joysticks, PDAs, etc. are expanding to virtually all digital devices.
- This Bluetooth module is configured in the form of a small printed circuit board (PCB) provided with an RF processing module, a baseband processor, a flash memory, and peripheral circuits and antennas thereof so that it can be easily mounted on the main board.
- PCB printed circuit board
- the Bluetooth module includes an antenna in the Bluetooth module in order to transmit a signal processed by the RF processing module in the module, a PIFA (Print Inver-F Antenna) type in which the antenna is provided in the PCB, or a chip antenna. There is a form that is applied on the PCB.
- PIFA Print Inver-F Antenna
- An object of the present embodiment is to provide an antenna module that can be miniaturized and has improved radiation efficiency.
- An antenna module a first printed circuit board including a circuit pattern; an IC chip disposed on the first printed circuit board; a solder portion disposed on the first printed circuit board; a dielectric layer disposed on the first printed circuit board and surrounding the IC chip and the solder part; and an antenna patterned on the upper surface of the dielectric layer and connected to the solder portion, wherein at least a portion of the solder portion protrudes upward from the upper surface of the dielectric layer.
- a vertical height of the solder portion may be greater than a thickness of the dielectric layer.
- the material of the dielectric layer may include a resin.
- It may include an RF element disposed in the dielectric layer and soldered on the first printed circuit board to generate a frequency.
- At least one electronic component may be disposed on the first printed circuit board, and the antenna may be disposed so as not to overlap the electronic component in a vertical direction.
- the antenna may have an area bent at least once.
- the antenna may have regions that are perpendicular to each other between adjacent regions.
- a second printed circuit board disposed under the first printed circuit board, wherein a sub antenna is disposed on the second printed circuit board adjacent to the first printed circuit board, and the sub antenna is electrically connected to the solder part can be connected to
- the sub-antenna may be electrically connected to the solder part.
- a thickness of the sub-antenna may correspond to a sum of thicknesses of the dielectric layer and the first printed circuit board.
- FIG. 1 is a cross-sectional view of an antenna module according to an embodiment of the present invention.
- FIGS. 2 and 3 are cross-sectional views illustrating a manufacturing process of an antenna module according to an embodiment of the present invention.
- FIG. 4 is a plan view illustrating an arrangement structure of an antenna on a printed circuit board according to an embodiment of the present invention
- FIG. 5 is a cross-sectional view showing an antenna module according to an embodiment of the present invention from another angle;
- FIG. 6 and 7 are views showing a modified example of the antenna module according to an embodiment of the present invention.
- the singular form may also include the plural form unless otherwise specified in the phrase, and when it is described as "at least one (or one or more) of A and (and) B, C", it is combined with A, B, C It may include one or more of all possible combinations.
- a component when it is described that a component is 'connected', 'coupled', or 'connected' to another component, the component is directly 'connected', 'coupled', or 'connected' to the other component. In addition to the case, it may include a case of 'connected', 'coupled', or 'connected' by another element between the element and the other element.
- FIGS. 2 and 3 are cross-sectional views illustrating a manufacturing process of the antenna module according to an embodiment of the present invention.
- the antenna module 100 includes a printed circuit board 110 , an IC chip 120 , an RF device 130 , a solder unit 140 , and a dielectric layer 150 . ) and an antenna 160 .
- the printed circuit board 110 is formed in a plate shape, and the IC chip 120 , the RF element 130 , the solder unit 140 , and the dielectric layer 150 may be disposed on the upper surface of the printed circuit board 110 . ), a circuitly patterned wiring 112 and a ground (not shown) are disposed, and electrically with the IC chip 120 , the RF element 130 and the antenna 160 through the wiring 112 and the ground. It can be connected to process communication signals.
- the IC chip 120 and the RF device 130 may be mounted on the printed circuit board 110 to process a communication signal.
- the antenna module 100 may communicate through the IC chip 120 in a Bluetooth manner.
- the RF element 130 may include a crystal to generate a frequency for communication.
- the IC chip 120 may be soldered on the printed circuit board 110 .
- the IC chip 120 may include at least one leg portion 122 .
- the leg portion 122 may protrude lower than other regions, and a lower surface thereof may be soldered onto the printed circuit board 110 .
- the RF device 130 may be disposed on the printed circuit board 110 spaced apart from the IC chip 120 .
- the RF element 130 may also be soldered through the leg part 132 on the upper surface of the printed circuit board 110 to be electrically connected to the printed circuit board 110 .
- the solder unit 140 may have a lower end disposed on the upper surface of the printed circuit board 110 , and an upper end coupled to the antenna 160 .
- the solder unit 140 may electrically connect the antenna 160 to the printed circuit board 110 .
- the solder portion 140 may be a soldered region on the printed circuit board 110 .
- the dielectric layer 150 may be disposed on the printed circuit board 110 .
- the dielectric layer 150 may have a predetermined thickness and may be disposed to surround the IC chip 120 , the RF device 130 , and the solder unit 140 .
- the IC chip 120 , the RF device 130 , and the solder unit 140 may be firmly fixed on the printed circuit board 110 through the dielectric layer 150 .
- the dielectric layer 150 may be called a molding part in that it is molded on the printed circuit board 110 .
- the material of the dielectric layer 150 may include a resin.
- the antenna 160 may be disposed on the upper surface of the dielectric layer 150 .
- the antenna 160 may have a metal plate shape.
- the antenna 160 may be patterned with a conductive material on the upper surface of the dielectric layer 150 .
- the antenna 160 may be designed to have a resonance length corresponding to each frequency band according to a frequency band signal processed by the printed circuit board 110 .
- the antenna 160 may be electrically connected to the printed circuit board 110 through the solder unit 140 .
- the vertical height of the solder unit 140 defined from the top to the bottom of the solder unit 140 may be formed to be longer than the thickness of the dielectric layer 150 .
- At least a portion of the solder portion 140 may be disposed to protrude upward from the top surface of the dielectric layer 150 .
- An upper portion of the solder portion 140 may protrude upward from the dielectric 150 .
- the solder unit 140 may be electrically connected to the antenna 160
- the antenna 160 and the printed circuit board 110 may be electrically connected to each other through the solder unit 140 .
- radiation efficiency can be increased by disposing the antenna 160 on the outside of the dielectric layer 150 , and the printed circuit board 100 is not directly disposed on the antenna 160 so that the printed circuit board 100 is not directly disposed on the printed circuit board.
- the manufacturing process of the antenna module 100 will be described. As shown in FIG. 2 , the IC chip 120 , the RF element 130 , and the solder unit 140 are mounted on the printed circuit board 110 . Thereafter, the dielectric layer 150 is formed as shown in FIG. 3 . As described above, the dielectric layer 150 may be formed on the printed circuit board 110 by molding. In addition, the antenna 160 may be electrically connected to the region of the solder portion 140 protruding upward of the dielectric layer 150 , and the antenna 160 may be disposed on the upper surface of the dielectric layer 150 . .
- FIG. 4 is a plan view illustrating an arrangement structure of an antenna on a dielectric layer according to an embodiment of the present invention
- FIG. 5 is a cross-sectional view showing an antenna module according to an embodiment of the present invention from another angle.
- At least one electronic component 113 for driving the antenna module 100 may be disposed on the printed circuit board 110 .
- the antenna 160 may be disposed so as not to overlap in the vertical direction in order to secure a maximum separation distance from the electronic component 113 .
- the antenna 160 may have an area bent at least once.
- the antenna 160 may have regions that are perpendicular to each other between adjacent regions. Accordingly, since the separation distance between the antenna 160 and the electronic component 113 can be increased to a maximum, there is an advantage in that the electrical characteristics of the electronic component 113 can be prevented from being deteriorated or changed.
- 6 and 7 are diagrams illustrating a modified example of an antenna module according to an embodiment of the present invention.
- the antenna module 100 may further include another printed circuit board 200 .
- the printed circuit board 110 may be referred to as a first printed circuit board
- the other printed circuit board 200 may be referred to as a second printed circuit board.
- the second printed circuit board 200 is disposed under the first printed circuit board 110 , and the lower surface of the first printed circuit board 110 is soldered to the upper surface of the second printed circuit board 200 .
- the second printed circuit board 200 has a cross-sectional area larger than that of the first printed circuit board 110 , and a plurality of electronic components may be disposed on an upper surface of the second printed circuit board 200 .
- the sub-antenna 210 may be disposed outside the first printed circuit board 110 among the upper surfaces of the second printed circuit board 200 .
- the sub-antenna 210 is electrically connected to the wiring 112 in the first printed circuit board 110 and may have a predetermined thickness.
- the sub-antenna 210 may be electrically connected to the solder unit 140 . Accordingly, a current path of the antenna module 100 may be extended through the sub-antenna 210 .
- the antenna module 100 may be designed to transmit and receive a signal in the 2.4 GHz band through the sub-antenna 210 after adjusting the frequency of the 2.7 GHz to 3 GHz band through the antenna 160 . .
- the sub-antenna 210 may have an area bent more than once.
- the thickness of the sub-antenna 210 may correspond to the thickness of the dielectric layer 150 or may correspond to the sum of the thicknesses of the dielectric layer 150 and the first printed circuit board 110 .
- the antenna module 100 has the advantage that radiation can be made upward through the antenna 160 as well as downward through the sub-antenna 210 .
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Networks & Wireless Communication (AREA)
- Support Of Aerials (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Details Of Aerials (AREA)
Abstract
Description
Claims (10)
- 회로 패턴을 포함하는 제1인쇄회로기판;상기 제1인쇄회로기판 상에 배치되는 IC 칩;상기 제1인쇄회로기판 상에 배치되는 솔더부;상기 제1인쇄회로기판 상에 배치되며, 상기 IC 칩과 상기 솔더부를 감싸는 유전체층; 및상기 유전체층의 상면에 패터닝되며, 상기 솔더부와 연결되는 안테나를 포함하고,상기 솔더부의 적어도 일부는 상기 유전체층의 상면 보다 상방으로 돌출되는 안테나 모듈.
- 제 1 항에 있어서,상기 솔더부의 상하 방향 높이는 상기 유전체층의 두께 보다 긴 안테나 모듈.
- 제1항에 있어서,상기 유전체층의 재질은 수지를 포함하는 안테나 모듈.
- 제 1 항에 있어서,상기 유전체층 내 배치되며, 상기 제1인쇄회로기판 상에 솔더링되어 주파수를 발생시키는 RF 소자를 포함하는 안테나 모듈.
- 제 1 항에 있어서,상기 제1인쇄회로기판 상에는 적어도 하나 이상의 전자부품이 배치되고,상기 안테나는 상기 전자부품과 상하 방향으로 오버랩되지 않게 배치되는 안테나 모듈.
- 제 5 항에 있어서,상기 안테나는 적어도 1회 이상 절곡된 영역을 가지는 안테나 모듈.
- 제 5 항에 있어서,상기 안테나는 인접한 영역 간 서로 수직하게 배치되는 영역을 가지는 안테나 모듈.
- 제 1 항에 있어서,상기 제1인쇄회로기판의 하부에 배치되는 제2인쇄회로기판을 포함하고,상기 제1인쇄회로기판에 인접한 상기 제2인쇄회로기판 상에는 서브 안테나가 배치되고,상기 서브 안테나는 상기 솔더부와 전기적으로 연결되는 안테나 모듈.
- 제 8 항에 있어서,상기 서브 안테나는 상기 솔더부와 전기적으로 연결되는 안테나 모듈.
- 제 8 항에 있어서,상기 서브 안테나의 두께는 상기 유전체층과 상기 제1인쇄회로기판의 두께의 합에 대응되는 안테나 모듈.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2023532223A JP2024502700A (ja) | 2021-01-11 | 2022-01-11 | アンテナモジュール |
US18/255,239 US20240097312A1 (en) | 2021-01-11 | 2022-01-11 | Antenna module |
EP22736927.9A EP4277029A1 (en) | 2021-01-11 | 2022-01-11 | Antenna module |
CN202280008101.6A CN116584004A (zh) | 2021-01-11 | 2022-01-11 | 天线模块 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2021-0003067 | 2021-01-11 | ||
KR1020210003067A KR20220101249A (ko) | 2021-01-11 | 2021-01-11 | 안테나 모듈 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2022149950A1 true WO2022149950A1 (ko) | 2022-07-14 |
Family
ID=82357402
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2022/000461 WO2022149950A1 (ko) | 2021-01-11 | 2022-01-11 | 안테나 모듈 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20240097312A1 (ko) |
EP (1) | EP4277029A1 (ko) |
JP (1) | JP2024502700A (ko) |
KR (1) | KR20220101249A (ko) |
CN (1) | CN116584004A (ko) |
WO (1) | WO2022149950A1 (ko) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20050043701A (ko) * | 2003-11-06 | 2005-05-11 | 가부시키가이샤 요코오 | 다중 주파수 안테나 |
JP2008259250A (ja) * | 2008-07-31 | 2008-10-23 | Fractus Sa | 微小アンテナを含む集積回路パッケージ |
KR20160067961A (ko) * | 2013-12-09 | 2016-06-14 | 인텔 코포레이션 | 패키징된 다이용 세라믹 상의 안테나 |
KR20160087747A (ko) * | 2014-12-09 | 2016-07-22 | 인텔 코포레이션 | 몰드 화합물 내의 3차원 구조체 |
KR20180128067A (ko) * | 2016-04-19 | 2018-11-30 | 스카이워크스 솔루션즈, 인코포레이티드 | 무선 주파수 모듈의 선택적 차폐 |
-
2021
- 2021-01-11 KR KR1020210003067A patent/KR20220101249A/ko unknown
-
2022
- 2022-01-11 WO PCT/KR2022/000461 patent/WO2022149950A1/ko active Application Filing
- 2022-01-11 US US18/255,239 patent/US20240097312A1/en active Pending
- 2022-01-11 EP EP22736927.9A patent/EP4277029A1/en active Pending
- 2022-01-11 JP JP2023532223A patent/JP2024502700A/ja active Pending
- 2022-01-11 CN CN202280008101.6A patent/CN116584004A/zh active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20050043701A (ko) * | 2003-11-06 | 2005-05-11 | 가부시키가이샤 요코오 | 다중 주파수 안테나 |
JP2008259250A (ja) * | 2008-07-31 | 2008-10-23 | Fractus Sa | 微小アンテナを含む集積回路パッケージ |
KR20160067961A (ko) * | 2013-12-09 | 2016-06-14 | 인텔 코포레이션 | 패키징된 다이용 세라믹 상의 안테나 |
KR20160087747A (ko) * | 2014-12-09 | 2016-07-22 | 인텔 코포레이션 | 몰드 화합물 내의 3차원 구조체 |
KR20180128067A (ko) * | 2016-04-19 | 2018-11-30 | 스카이워크스 솔루션즈, 인코포레이티드 | 무선 주파수 모듈의 선택적 차폐 |
Also Published As
Publication number | Publication date |
---|---|
CN116584004A (zh) | 2023-08-11 |
EP4277029A1 (en) | 2023-11-15 |
US20240097312A1 (en) | 2024-03-21 |
JP2024502700A (ja) | 2024-01-23 |
KR20220101249A (ko) | 2022-07-19 |
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