WO2022142431A1 - Dual-energy radiation flat panel detector, manufacturing method, and detection system - Google Patents
Dual-energy radiation flat panel detector, manufacturing method, and detection system Download PDFInfo
- Publication number
- WO2022142431A1 WO2022142431A1 PCT/CN2021/115945 CN2021115945W WO2022142431A1 WO 2022142431 A1 WO2022142431 A1 WO 2022142431A1 CN 2021115945 W CN2021115945 W CN 2021115945W WO 2022142431 A1 WO2022142431 A1 WO 2022142431A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- energy
- layer
- dual
- ray
- photosensitive pixels
- Prior art date
Links
- 230000005855 radiation Effects 0.000 title claims abstract description 48
- 238000001514 detection method Methods 0.000 title claims abstract description 22
- 238000004519 manufacturing process Methods 0.000 title abstract description 5
- 238000001914 filtration Methods 0.000 claims abstract description 27
- 238000003384 imaging method Methods 0.000 claims abstract description 22
- 239000000463 material Substances 0.000 claims abstract description 17
- 239000000758 substrate Substances 0.000 claims abstract description 14
- 238000002360 preparation method Methods 0.000 claims description 9
- 239000011521 glass Substances 0.000 claims description 3
- 239000013307 optical fiber Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 abstract description 94
- 238000001228 spectrum Methods 0.000 abstract description 6
- 239000002356 single layer Substances 0.000 abstract description 5
- 238000003745 diagnosis Methods 0.000 abstract 1
- 239000010409 thin film Substances 0.000 description 7
- 230000008859 change Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 238000007689 inspection Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229910052684 Cerium Inorganic materials 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 210000000988 bone and bone Anatomy 0.000 description 2
- 239000000306 component Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000007405 data analysis Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 238000004020 luminiscence type Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000003595 spectral effect Effects 0.000 description 2
- 238000007738 vacuum evaporation Methods 0.000 description 2
- 241001270131 Agaricus moelleri Species 0.000 description 1
- -1 Polyethylene terephthalate Polymers 0.000 description 1
- 229910052777 Praseodymium Inorganic materials 0.000 description 1
- 229910052771 Terbium Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000002059 diagnostic imaging Methods 0.000 description 1
- 201000010099 disease Diseases 0.000 description 1
- 208000037265 diseases, disorders, signs and symptoms Diseases 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 238000002594 fluoroscopy Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000002601 radiography Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 210000004872 soft tissue Anatomy 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000005469 synchrotron radiation Effects 0.000 description 1
- 229910052716 thallium Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
- H01L27/14605—Structural or functional details relating to the position of the pixel elements, e.g. smaller pixel elements in the center of the imager compared to pixel elements at the periphery
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
- H01L27/14621—Colour filter arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14632—Wafer-level processed structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14658—X-ray, gamma-ray or corpuscular radiation imagers
- H01L27/14663—Indirect radiation imagers, e.g. using luminescent members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14685—Process for coatings or optical elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14687—Wafer level processing
Definitions
- the invention relates to the technical field of X-ray detection, in particular to a dual-energy radiation flat panel detector, a preparation method and a detection system.
- a complete radiation image chain mainly includes the following components: radiation source, object to be measured, radiation detector, rack and back-end display system.
- the radiation source and the radiation detector are the two core components in the imaging chain, which play a crucial role in the imaging quality, and also determine whether the imaging system can meet the needs of certain specific scenarios.
- a monochromatic ray source such as the ray generated by the synchrotron radiation source or the characteristic ray of the metal target
- the detector to detect the diffracted ray, and then use the Bragg diffraction principle to analyze the to-be-measured ray.
- the crystal structure of the material In the fields of medical imaging and industrial inspection, the rays emitted by the used ray sources are not monochromatic, but continuous broad-spectrum rays like the solar spectrum.
- the energy spectrum information will change accordingly.
- the material composition of the object to be tested can be analyzed.
- spectrometers are expensive, even higher than commonly used radiation or flat panel detectors.
- dual-energy radiation detectors are widely used in the industry to analyze the density and composition differences of substances in the object to be measured.
- the dual-energy linear array security inspection machine combines X-ray fluoroscopy technology with dual-energy technology to analyze the density and atomic number of substances in luggage, thereby improving the detection rate of dangerous goods.
- the dual-energy subtraction technology can selectively remove the attenuation information of bones or soft tissues in the body, obtain a diagnostic image of "separation of bone and flesh", and improve the detection rate and diagnostic accuracy of diseases.
- This technology is used in Digital Radiography (digital X-ray photography) and Dual Energy CT (dual energy CT).
- the traditional dual-energy radiation detector consists of two sets of detection systems.
- the rays first pass through the scintillator of the first thin layer, and the X photons in the low energy band are absorbed by the first thin layer of scintillator and converted into visible light photons, and the generated visible light photons are subsequently It is detected by the first layer of photoelectric sensing array and gives a low-energy image; after the high-energy radiation passes through the first thin layer of scintillator and the first layer of photoelectric sensor array, it enters the second layer of scintillator and is converted The visible light photons are detected by the second-layer photoelectric sensing array to form a high-energy image.
- the solutions described in the patent applications with publication numbers CN101937095B and CN111198397A.
- This dual-energy radiation detector using two sets of detection systems will undoubtedly greatly increase the cost of the detector system, and cause the detector system to be complicated in structure and bulky.
- the alignment accuracy of the upper and lower sets of detectors will also have a great impact on data analysis, and inaccurate alignment will often lead to measurement deviations, which in turn lead to reduced imaging quality.
- the purpose of the present invention is to provide a dual-energy radiation flat panel detector, a preparation method thereof, and a detection system, which are used to solve the problem that the dual-energy radiation detector in the prior art consists of two It is composed of a set of detection systems, which increases the cost of the detector system, and has problems such as complex structure and large volume, which limit its application scenarios, and the alignment accuracy of the upper and lower sets of detectors will also have a great impact on data analysis. , inaccurate alignment often leads to measurement deviation, which in turn leads to problems such as image quality degradation.
- the present invention provides a dual-energy radiation flat panel detector, which sequentially includes a first scintillator layer, a photoelectric sensor array, and a transparent substrate along the X-ray incident direction. , a ray filter layer and a second scintillator layer; wherein, the photoelectric sensor array layer includes alternately distributed first photosensitive pixels and second photosensitive pixels, and the first photosensitive pixels and the second photosensitive pixels have opposite photosensitive directions to respectively
- the ray filtering layer is used for filtering low-energy X-rays and preventing the luminescence scattering of the second scintillator layer.
- the thickness of the second scintillator layer is greater than the thickness of the first scintillator layer.
- the ray filtering layer includes an optical fiber panel.
- the transparent substrate includes a combination of one or more of PI material layers, ultra-thin glass and PET material layers.
- the first photosensitive pixels and the second photosensitive pixels are arranged in an alternating array of rows and columns.
- the first photosensitive pixel includes a photodiode with a transparent top electrode and an opaque bottom electrode and the second photosensitive pixel includes a photodiode with a transparent bottom electrode and an opaque top electrode, or the second photosensitive pixel includes a transparent top electrode and a transparent top electrode.
- a photodiode with an opaque bottom electrode and a first photosensitive pixel includes a photodiode with a transparent bottom electrode and an opaque top electrode.
- the present invention also provides a preparation method of a dual-energy radiation flat panel detector, comprising the steps of:
- a photosensor array layer and a first scintillator layer are sequentially formed on the upper surface of the transparent substrate.
- the photosensor array layer includes alternately distributed first photosensitive pixels and second photosensitive pixels.
- the first photosensitive pixels and the second photosensitive pixels have Opposite photosensitive directions for low-energy X-ray imaging and high-energy X-ray imaging, respectively;
- a second scintillator layer is integrated on the lower surface of the ray filtering layer
- the upper surface of the radiation filtering layer and the lower surface of the transparent substrate are coupled together.
- the present invention also provides a detection system, which includes the dual-energy radiation flat panel detector as described in any one of the above solutions.
- the dual-energy radiation flat panel detector, preparation method and detection system of the present invention have the following beneficial effects: the improved structural design of the present invention uses a single-layer photoelectric sensor array to simultaneously acquire low-energy and high-energy dual-energy spectrum objects The low-energy rays are filtered through the ray filtering layer and the second scintillator layer is prevented from luminous scattering, thereby helping to improve the material resolution capability of the detector, improve the image quality, and improve the diagnostic accuracy.
- the detection system based on the dual-energy radiation flat panel detector of the present invention greatly simplifies the structure and reduces the volume, which not only helps to reduce the cost of the system, but also increases the mobility and flexibility of the system. The scope of application is wider.
- FIG. 1 shows a schematic structural diagram of a dual-energy radiation flat panel detector provided by the present invention.
- FIG. 2 is a schematic diagram of the cross-sectional structure of FIG. 1 .
- FIG. 3 is a schematic diagram showing the configuration of the photosensitive pixels of the photosensor array layer in the dual-energy radiation flat panel detector provided by the present invention.
- the present invention provides a dual-energy radiation flat panel detector, which sequentially includes a first scintillator layer 11 , a photoelectric sensor array, and a transparent lining along the X-ray incident direction.
- the photosensor array layer 12 includes alternately distributed first photosensitive pixels 121 and second photosensitive pixels 122, first photosensitive pixels 121 and second photosensitive pixels 121
- the pixels 122 have opposite photosensitive directions for realizing low-energy X-ray imaging and high-energy X-ray imaging, respectively, and the ray filtering layer 14 is used for filtering low-energy X-rays and preventing the second scintillator layer 15 from scattering light.
- the first scintillator layer 11 is used to absorb low-energy X-rays and convert the absorbed low-energy X-rays into visible light
- the second scintillator layer 15 is used to absorb high-energy X-rays and convert the absorbed high-energy X-rays into visible light.
- X-rays are converted into visible light
- the first photosensitive pixel 121 and the second photosensitive pixel 122 are used to convert the visible light converted by the corresponding scintillator layer into electric charge and store it.
- Storage the definitions of the first photosensitive pixel 121 and the second photosensitive pixel 122 can also be interchanged, and processed by the image processing device to output a low-energy X-ray image and a high-energy X-ray image at the same time.
- the improved structural design of the present invention uses a single-layer photoelectric sensor array to simultaneously acquire low-energy and high-energy dual-energy spectral object images, and filters low-energy rays through a ray filtering layer and prevents the second scintillator layer from luminous scattering, thereby contributing to Improve the material resolution capability of the detector, improve the image quality, and improve the diagnostic accuracy.
- the detection system based on the dual-energy radiation flat panel detector of the present invention greatly simplifies the structure and reduces the volume, which not only helps to reduce the cost of the system, but also increases the mobility and flexibility of the system. The scope of application is wider.
- the first photosensitive pixel 121 and the second photosensitive pixel 122 both include TFT thin film transistors and photodiodes 128 , and the TFT transistors specifically include gate electrodes 123 and active layers 124 , source electrode 125 and drain electrode 126, the photodiode 128 of each photosensitive pixel can be connected to the drain electrode of the corresponding TFT thin film transistor, and a light shielding layer 127 is arranged above the TFT thin film transistor to block the light emitted by the scintillator Influence on the TFT active layer, the TFT thin film transistor and the light shielding layer 127 are spaced apart by an insulating material layer. Since the structures and principles of the TFT thin film transistor and the photodiode are well known to those skilled in the art, this will not be described in detail. It is important that adjacent photosensitive pixels have different photosensitive directions.
- the first photosensitive pixels 121 and the second photosensitive pixels 122 are arranged in an alternating array of multiple rows and columns and are distributed in a checkerboard structure, and the pixel grayscales missing in the low-energy and high-energy pixels are The value can be replaced by the mean of the surrounding 4 pixels (the part marked by the dotted box) that are co-edged with it, and one image from a single exposure can be transformed into a low-energy image and a high-energy image.
- the materials of the first scintillator layer 11 and the second scintillator layer 15 may be the same or different, and may be selected from, but not limited to, GOS (Gd 2 O 2 S), NaI (Tl), LaCl 3 (Ce) , CsI (Tl, Na), LaBr 3 (Ce), YAlO 3 (Ce), C S I, GOS (Tb, Pr, Ce, F), CaWO 4 , Gd 3 Ga 5 O 12 (Cr, Ce), One or more of Lu 2 Si 2 O 7 (Ce), CdWO 4 , BGO, Lu 2 SiO 5 (Ce), LuAlO 3 (Ce), YTaO 4 (Nb), but preferably the second scintillator
- the thickness of the layer 15 is greater than the thickness of the first scintillator layer 11, that is, the first scintillator layer 11 has a relatively lower thickness to reduce the absorption of high-energy X-rays while absorbing low-energy X-rays,
- the ray filter layer 14 can not only filter out some low-energy rays, but also can reduce the divergence angle of the visible light emitted by the second scintillator layer 15 and improve the resolution of high-energy images. Therefore, the material of the ray filter layer 14 is selected. Very important. Preferably, the material of the ray filtering layer 14 can be an optical fiber panel (Fiber Optic Plates, FOP for short), which has the advantages of high light transmission efficiency, small inter-stage coupling loss, clear and real image transmission, and optically zero thickness. Etc.
- FOP Fiber Optic Plates
- the transparent substrate 13 includes a combination of one or more of a PI (Polyimide, polyimide) material layer, an ultra-thin glass, and a PET (Polyethylene terephthalate, polyester) material layer, and its thickness may be 10 ⁇ m ⁇ 20 ⁇ m.
- PI Polyimide, polyimide
- PET Polyethylene terephthalate, polyester
- the dual-energy radiation flat panel detector provided by the present invention can simultaneously acquire low-energy and high-energy dual-energy spectrum object images only by using a single-layer photoelectric sensor array. Compared with the traditional dual-energy radiation flat panel detector, its structure is greatly simplified. The volume can be greatly reduced, which makes it not only applicable to conventional operating environments, but also to various workplaces that require mobile operations, such as field hospitals, mobile security checkpoints, etc. Therefore, the present invention also provides a detection system, which includes the dual-energy radiation flat panel detector as described in any of the above solutions. For the introduction of the dual-energy radiation flat panel detector, please refer to the foregoing content, for The purpose of brevity is not repeated. Of course, the detection system also includes structures such as an image processing device.
- the system structure can be greatly simplified, the volume can be greatly reduced, the system cost can be effectively reduced, and the applicability of the system can be improved.
- the present invention also provides a preparation method of a dual-energy radiation flat panel detector, and the preparation method of the present invention can be used to prepare the dual-energy radiation flat panel detector as described in any of the above solutions, or in any of the foregoing solutions.
- the dual-energy radiation flat-panel detector can be prepared based on this preparation method (of course, it can also be prepared based on other methods), so the aforementioned introduction to the dual-energy radiation flat-panel detector can be cited here in its entirety, and will not be repeated for the sake of brevity .
- the preparation method comprises the steps:
- a photosensor array layer and a first scintillator layer are sequentially formed on the upper surface of the transparent substrate.
- the photosensor array layer includes alternately distributed first photosensitive pixels and second photosensitive pixels.
- the first photosensitive pixels and the second photosensitive pixels have The opposite photosensitive directions are used to realize low-energy X-ray imaging and high-energy X-ray imaging respectively; for example, corresponding thin film structures can be formed step by step on a transparent substrate based on conventional semiconductor manufacturing processes to form corresponding TFT thin film transistors and photodiodes.
- the first photosensitive pixel and the second photosensitive pixel are formed to form the photosensor array layer, and then the first scintillator layer is formed by vacuum evaporation or direct bonding process, for example, if the first scintillator layer is CS I and other materials can be directly evaporated in a vacuum evaporation furnace. If it is a material such as GOS, the first scintillator layer can be made into a film layer of a certain thickness, and then glued or glued to the film. on the photoelectric sensor array layer;
- Integrate a second scintillator layer on the lower surface of the ray filtering layer for example, use a bonding process to form the second scintillator layer on the lower surface of the ray filtering layer, for example, use glue or glue film to attach the second scintillator layer Fitted to the lower surface of the ray filtering layer;
- the upper surface of the ray filtering layer and the lower surface of the transparent substrate are coupled together, such as through optically transparent glue, which is not specifically limited. Since the high-energy pixels and the low-energy pixels are located in the same layer, there is no need to consider the problem of upper and lower alignment, so the fabrication process can be greatly simplified.
- the present invention provides a dual-energy radiation flat panel detector, a method for manufacturing the same, and a detection system.
- the dual-energy radiation flat panel detector sequentially includes a first scintillator layer, a photoelectric sensor array, a transparent substrate, a ray filtering layer and a second scintillator layer along the X-ray incident direction; wherein, the photoelectric sensor array layer includes The first photosensitive pixels and the second photosensitive pixels are alternately distributed, and the first photosensitive pixels and the second photosensitive pixels have opposite photosensitive directions for realizing low-energy X-ray imaging and high-energy X-ray imaging respectively, and the ray filtering layer is used for Filtering low-energy X-rays and preventing luminescence scattering of the second scintillator layer
- the improved structural design of the present invention uses a single-layer photosensor array to simultaneously acquire images of low-energy and high-energy dual-energy spectral objects, and filters low-energy rays and The second scintillator is prevented from scattering light,
- the detection system based on the dual-energy radiation flat panel detector of the present invention greatly simplifies the structure and reduces the volume, which not only helps to reduce the cost of the system, but also increases the mobility and flexibility of the system. The scope of application is wider. Therefore, the present invention effectively overcomes various shortcomings in the prior art and has high industrial utilization value.
Abstract
The present invention provides a dual-energy radiation flat panel detector, a manufacturing method, and a detection system. The detector sequentially comprises, in an X-ray incident direction, a first scintillator layer, a photoelectric sensor array, a transparent substrate, a ray filtering layer and a second scintillator layer, wherein the photoelectric sensor array layer comprises first photosensitive pixels and second photosensitive pixels which are alternately distributed, the first photosensitive pixels and the second photosensitive pixels have opposite photosensitive directions to respectively achieve low-energy X-ray imaging and high-energy X-ray imaging, and the ray filtering layer is used for filtering low-energy X-rays and preventing light emission and scattering of the second scintillator layer. In the present invention, a single-layer photoelectric sensor array is used for simultaneously acquiring dual-energy, i.e. low-energy and high-energy, spectrum object images, and the ray filtering layer is used for filtering low-energy rays and preventing light emission and scattering of the second scintillator layer, facilitating improvement of the material resolution capability of a detector, improving the image quality, and improving the diagnosis accuracy. Furthermore, the structure is greatly simplified, and the volume can be greatly reduced, facilitating reduction of the system cost.
Description
本发明涉及X射线探测技术领域,特别是涉及一种双能辐射平板探测器、制备方法及一种探测系统。The invention relates to the technical field of X-ray detection, in particular to a dual-energy radiation flat panel detector, a preparation method and a detection system.
平板数字X射线探测器通常应用于医疗辐射成像、工业检测及安检等领域。一条完整的辐射影像链主要包括以下部件:射线源、待测物体、辐射探测器、机架以及后端显示系统。其中,射线源与辐射探测器是影像链中的两大核心部件,对成像品质起着至关重要的作用,同时也决定了成像系统能否满足某些特定场景使用的需求。比如,在晶体结构分析领域,需要使用单色的射线源,如同步辐射光源产生的射线或者金属靶材的特征射线,利用探测器来探测衍射后的射线,而后利用布拉格衍射原理来分析待测材料的晶体结构。而在医学成像及工业检测等领域,所用射线源发出的射线并非是单色的,而是像太阳光谱一样的连续广谱射线。Flat-panel digital X-ray detectors are usually used in medical radiation imaging, industrial inspection and security inspection. A complete radiation image chain mainly includes the following components: radiation source, object to be measured, radiation detector, rack and back-end display system. Among them, the radiation source and the radiation detector are the two core components in the imaging chain, which play a crucial role in the imaging quality, and also determine whether the imaging system can meet the needs of certain specific scenarios. For example, in the field of crystal structure analysis, it is necessary to use a monochromatic ray source, such as the ray generated by the synchrotron radiation source or the characteristic ray of the metal target, use the detector to detect the diffracted ray, and then use the Bragg diffraction principle to analyze the to-be-measured ray. The crystal structure of the material. In the fields of medical imaging and industrial inspection, the rays emitted by the used ray sources are not monochromatic, but continuous broad-spectrum rays like the solar spectrum.
由于不同的物质对射线的衰减能力不一,该射线穿过某一物体之后,其能谱信息会产生相应的变化。通过分析这一变化即可以分析出待测物体的物质成分。受光子计数速率及其计数准确性的限制,测量高光子流密度的射线能谱十分困难。此外,能谱仪的成本很高,甚至会高于常用的辐射或平板探测器。目前,业内广泛使用双能辐射探测器来分析待测物体中物质的密度与组分差异。比如,双能线阵安检机将X射线透视技术与双能量技术结合,可以分析出行李内物质的密度和原子序数,进而可以提高危险品的检出率。双能量减影技术可以选择性地去除骨骼或者身体内软组织的衰减信息,获得“骨肉分离”的诊断图像,提高对疾病的检出率和诊断准确度。这一技术在Digital Radiography(数字化X射线摄影)以及Dual Energy CT(双能CT)中均有应用。Since different substances have different attenuation capabilities to rays, after the rays pass through an object, the energy spectrum information will change accordingly. By analyzing this change, the material composition of the object to be tested can be analyzed. Limited by the photon counting rate and its counting accuracy, it is very difficult to measure the ray energy spectrum of high photon flux density. In addition, spectrometers are expensive, even higher than commonly used radiation or flat panel detectors. At present, dual-energy radiation detectors are widely used in the industry to analyze the density and composition differences of substances in the object to be measured. For example, the dual-energy linear array security inspection machine combines X-ray fluoroscopy technology with dual-energy technology to analyze the density and atomic number of substances in luggage, thereby improving the detection rate of dangerous goods. The dual-energy subtraction technology can selectively remove the attenuation information of bones or soft tissues in the body, obtain a diagnostic image of "separation of bone and flesh", and improve the detection rate and diagnostic accuracy of diseases. This technology is used in Digital Radiography (digital X-ray photography) and Dual Energy CT (dual energy CT).
传统的双能辐射探测器由两套探测系统组成,射线首先穿过第一薄层的闪烁体,其中低能段的X光子被第一薄层闪烁体吸收转化成可见光光子,生成的可见光光子随后被第一层光电传感阵列探测到,并给出一幅低能图像;高能段射线穿过第一薄层闪烁体和第一层光电传感阵列之后,入射到第二层闪烁体,被转化成可见光光子后被第二层光电传感阵列探测到,形成一幅高能图像,具体可以参考公开号为CN101937095B及CN111198397A的专利申请中记载的方案内容。The traditional dual-energy radiation detector consists of two sets of detection systems. The rays first pass through the scintillator of the first thin layer, and the X photons in the low energy band are absorbed by the first thin layer of scintillator and converted into visible light photons, and the generated visible light photons are subsequently It is detected by the first layer of photoelectric sensing array and gives a low-energy image; after the high-energy radiation passes through the first thin layer of scintillator and the first layer of photoelectric sensor array, it enters the second layer of scintillator and is converted The visible light photons are detected by the second-layer photoelectric sensing array to form a high-energy image. For details, please refer to the solutions described in the patent applications with publication numbers CN101937095B and CN111198397A.
这种采用两套探测系统的双能辐射探测器无疑大大增加了探测器系统的成本,且导致探 测器系统结构复杂、体积庞大。此外,上下两套探测器的对位精度也会给数据分析造成很大的影响,对位不准往往会导致测量偏差,进而导致成像质量下降。This dual-energy radiation detector using two sets of detection systems will undoubtedly greatly increase the cost of the detector system, and cause the detector system to be complicated in structure and bulky. In addition, the alignment accuracy of the upper and lower sets of detectors will also have a great impact on data analysis, and inaccurate alignment will often lead to measurement deviations, which in turn lead to reduced imaging quality.
发明内容SUMMARY OF THE INVENTION
鉴于以上所述现有技术的缺点,本发明的目的在于提供一种双能辐射平板探测器及其制备方法,以及一种探测系统,用于解决现有技术中的双能辐射探测器由两套探测系统组成,增加了探测器系统的成本,且存在结构复杂、体积庞大等问题而导致其应用场景受限,且上下两套探测器的对位精度也会给数据分析造成很大的影响,对位不准往往会导致测量偏差,进而导致成像质量下降等问题。In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a dual-energy radiation flat panel detector, a preparation method thereof, and a detection system, which are used to solve the problem that the dual-energy radiation detector in the prior art consists of two It is composed of a set of detection systems, which increases the cost of the detector system, and has problems such as complex structure and large volume, which limit its application scenarios, and the alignment accuracy of the upper and lower sets of detectors will also have a great impact on data analysis. , inaccurate alignment often leads to measurement deviation, which in turn leads to problems such as image quality degradation.
为实现上述目的及其他相关目的,本发明提供一种双能辐射平板探测器,所述双能辐射平板探测器沿X射线入射方向上依次包括第一闪烁体层、光电传感器阵列、透明衬底、射线滤过层及第二闪烁体层;其中,所述光电传感器阵列层包括交替分布的第一感光像素及第二感光像素,第一感光像素和第二感光像素具有相反的感光方向以分别用于实现低能X射线成像和高能X射线成像,所述射线滤过层用于过滤低能X射线和防止第二闪烁体层发光散射。In order to achieve the above object and other related objects, the present invention provides a dual-energy radiation flat panel detector, which sequentially includes a first scintillator layer, a photoelectric sensor array, and a transparent substrate along the X-ray incident direction. , a ray filter layer and a second scintillator layer; wherein, the photoelectric sensor array layer includes alternately distributed first photosensitive pixels and second photosensitive pixels, and the first photosensitive pixels and the second photosensitive pixels have opposite photosensitive directions to respectively For realizing low-energy X-ray imaging and high-energy X-ray imaging, the ray filtering layer is used for filtering low-energy X-rays and preventing the luminescence scattering of the second scintillator layer.
可选地,所述第二闪烁体层的厚度大于所述第一闪烁体层的厚度。Optionally, the thickness of the second scintillator layer is greater than the thickness of the first scintillator layer.
可选地,所述射线滤过层包括光纤面板。Optionally, the ray filtering layer includes an optical fiber panel.
可选地,所述透明衬底包括PI材料层、超薄玻璃和PET材料层中的一种或多种的结合。Optionally, the transparent substrate includes a combination of one or more of PI material layers, ultra-thin glass and PET material layers.
可选地,所述第一感光像素及第二感光像素呈多行多列交替阵列排布。Optionally, the first photosensitive pixels and the second photosensitive pixels are arranged in an alternating array of rows and columns.
可选地,所述第一感光像素包括顶电极透明而底电极不透明的光电二极管而第二感光像素包括底电极透明而顶电极不透明的光电二极管,或所述第二感光像素包括顶电极透明而底电极不透明的光电二极管而第一感光像素包括底电极透明而顶电极不透明的光电二极管。Optionally, the first photosensitive pixel includes a photodiode with a transparent top electrode and an opaque bottom electrode and the second photosensitive pixel includes a photodiode with a transparent bottom electrode and an opaque top electrode, or the second photosensitive pixel includes a transparent top electrode and a transparent top electrode. A photodiode with an opaque bottom electrode and a first photosensitive pixel includes a photodiode with a transparent bottom electrode and an opaque top electrode.
本发明还提供一种双能辐射平板探测器的制备方法,包括步骤:The present invention also provides a preparation method of a dual-energy radiation flat panel detector, comprising the steps of:
在透明衬底的上表面依次形成光电传感器阵列层和第一闪烁体层,所述光电传感器阵列层包括交替分布的第一感光像素及第二感光像素,第一感光像素和第二感光像素具有相反的感光方向以分别用于实现低能X射线成像和高能X射线成像;A photosensor array layer and a first scintillator layer are sequentially formed on the upper surface of the transparent substrate. The photosensor array layer includes alternately distributed first photosensitive pixels and second photosensitive pixels. The first photosensitive pixels and the second photosensitive pixels have Opposite photosensitive directions for low-energy X-ray imaging and high-energy X-ray imaging, respectively;
在射线滤过层下表面集成第二闪烁体层;A second scintillator layer is integrated on the lower surface of the ray filtering layer;
将射线滤过层的上表面与透明衬底的下表面耦合到一起。The upper surface of the radiation filtering layer and the lower surface of the transparent substrate are coupled together.
本发明还提供一种探测系统,所述探测系统包括如上述任一方案中所述的双能辐射平板探测器。The present invention also provides a detection system, which includes the dual-energy radiation flat panel detector as described in any one of the above solutions.
如上所述,本发明的双能辐射平板探测器、制备方法及探测系统,具有以下有益效果:本发明经改善的结构设计,使用单层光电传感器阵列以同时获取低能和高能的双能谱物体图像,并通过射线滤过层过滤低能射线和防止第二闪烁体层发光散射,从而有助于提高探测器的物质分辨能力,改善图像质量,提高诊断准确率。基于本发明的双能辐射平板探测器的探测系统,结构极大简化,体积可以大大减小,不仅有助于降低系统成本,同时增加系统的移动便利性和灵活性,使得本发明的探测系统适用范围更加广泛。As described above, the dual-energy radiation flat panel detector, preparation method and detection system of the present invention have the following beneficial effects: the improved structural design of the present invention uses a single-layer photoelectric sensor array to simultaneously acquire low-energy and high-energy dual-energy spectrum objects The low-energy rays are filtered through the ray filtering layer and the second scintillator layer is prevented from luminous scattering, thereby helping to improve the material resolution capability of the detector, improve the image quality, and improve the diagnostic accuracy. The detection system based on the dual-energy radiation flat panel detector of the present invention greatly simplifies the structure and reduces the volume, which not only helps to reduce the cost of the system, but also increases the mobility and flexibility of the system. The scope of application is wider.
图1显示为本发明提供的双能辐射平板探测器的结构示意图。FIG. 1 shows a schematic structural diagram of a dual-energy radiation flat panel detector provided by the present invention.
图2显示为图1的截面结构示意图。FIG. 2 is a schematic diagram of the cross-sectional structure of FIG. 1 .
图3显示为本发明提供的双能辐射平板探测器中的光电传感器阵列层的感光像素的配置示意图。FIG. 3 is a schematic diagram showing the configuration of the photosensitive pixels of the photosensor array layer in the dual-energy radiation flat panel detector provided by the present invention.
元件标号说明Component label description
11 第一闪烁体层11 The first scintillator layer
12 光电传感器阵列层12 Photoelectric sensor array layer
121 第一感光像素121 The first photosensitive pixel
122 第二感光像素122 The second photosensitive pixel
123 栅极123 grid
124 有源层124 Active layer
125 源极电极125 Source electrode
126 漏极电极126 Drain electrode
127 遮光层127 shading layer
128 光电二极管128 Photodiode
以下由特定的具体实施例说明本发明的实施方式,熟悉此技术的人士可由本说明书所揭露的内容轻易地了解本发明的其他优点及功效。The embodiments of the present invention are described below by specific embodiments, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.
请参阅图1至图3。须知,本说明书所附图式所绘示的结构、比例、大小等,均仅用以配合说明书所揭示的内容,以供熟悉此技术的人士了解与阅读,并非用以限定本发明可实施的限定条件,故不具技术上的实质意义,任何结构的修饰、比例关系的改变或大小的调整,在不影响本发明所能产生的功效及所能达成的目的下,均应仍落在本发明所揭示的技术内容 所能涵盖的范围内。同时,本说明书中所引用的如“上”、“下”、“左”、“右”、“中间”及“一”等的用语,亦仅为便于叙述的明了,而非用以限定本发明可实施的范围,其相对关系的改变或调整,在无实质技术内容的变更下,当亦视为本发明可实施的范畴。See Figures 1 through 3. It should be noted that the structures, proportions, sizes, etc. shown in the drawings in this specification are only used to cooperate with the contents disclosed in the specification, so as to be understood and read by those who are familiar with the technology, and are not used to limit the implementation of the present invention. Restricted conditions, it does not have technical substantive significance, any structural modification, proportional relationship change or size adjustment, without affecting the effect that the present invention can produce and the purpose that can be achieved, should still fall within the present invention. The scope of the disclosed technical content can be covered. At the same time, the terms such as "up", "down", "left", "right", "middle" and "one" quoted in this specification are only for the convenience of description and clarity, and are not used to limit this specification. The applicable scope of the invention, the change or adjustment of its relative relationship, and the change without substantial technical content, shall also be regarded as the applicable scope of the present invention.
如图1至图3所示,本发明提供一种双能辐射平板探测器,所述双能辐射平板探测器沿X射线入射方向上依次包括第一闪烁体层11、光电传感器阵列、透明衬底13、射线滤过层14及第二闪烁体层15;其中,所述光电传感器阵列层12包括交替分布的第一感光像素121及第二感光像素122,第一感光像素121和第二感光像素122具有相反的感光方向以分别用于实现低能X射线成像和高能X射线成像,所述射线滤过层14用于过滤低能X射线和防止第二闪烁体层15发光散射。更具体地,第一闪烁体层11用于吸收低能量的X射线,并将吸收的低能X射线转化为可见光,第二闪烁体层15用于吸收高能量的X射线,并将吸收的高能X射线转化为可见光,第一感光像素121和第二感光像素122用于将对应的闪烁体层转化的可见光转换为电荷并存储,比如第一感光像素121包括顶电极透明而底电极不透明的光电二极管,以将第一闪烁体层11转化的可见光转换为电荷并存储,而另一者包括底电极透明而顶电极不透明的光电二极管,以将第二闪烁体层15转化的可见光转换为电荷并存储(第一感光像素121和第二感光像素122的定义也可以相互交换),经图像处理装置处理后以同时输出低能X射线图像和高能X射线图像。本发明经改善的结构设计,使用单层光电传感器阵列以同时获取低能和高能的双能谱物体图像,并通过射线滤过层过滤低能射线和防止第二闪烁体层发光散射,从而有助于提高探测器的物质分辨能力,改善图像质量,提高诊断准确率。基于本发明的双能辐射平板探测器的探测系统,结构极大简化,体积可以大大减小,不仅有助于降低系统成本,同时增加系统的移动便利性和灵活性,使得本发明的探测系统适用范围更加广泛。As shown in FIG. 1 to FIG. 3 , the present invention provides a dual-energy radiation flat panel detector, which sequentially includes a first scintillator layer 11 , a photoelectric sensor array, and a transparent lining along the X-ray incident direction. The bottom 13, the ray filter layer 14 and the second scintillator layer 15; wherein, the photosensor array layer 12 includes alternately distributed first photosensitive pixels 121 and second photosensitive pixels 122, first photosensitive pixels 121 and second photosensitive pixels 121 The pixels 122 have opposite photosensitive directions for realizing low-energy X-ray imaging and high-energy X-ray imaging, respectively, and the ray filtering layer 14 is used for filtering low-energy X-rays and preventing the second scintillator layer 15 from scattering light. More specifically, the first scintillator layer 11 is used to absorb low-energy X-rays and convert the absorbed low-energy X-rays into visible light, and the second scintillator layer 15 is used to absorb high-energy X-rays and convert the absorbed high-energy X-rays into visible light. X-rays are converted into visible light, and the first photosensitive pixel 121 and the second photosensitive pixel 122 are used to convert the visible light converted by the corresponding scintillator layer into electric charge and store it. A diode to convert the visible light converted by the first scintillator layer 11 into electric charges and store them, while the other includes a photodiode with a transparent bottom electrode and an opaque top electrode to convert the visible light converted by the second scintillator layer 15 into electric charges and store them. Storage (the definitions of the first photosensitive pixel 121 and the second photosensitive pixel 122 can also be interchanged), and processed by the image processing device to output a low-energy X-ray image and a high-energy X-ray image at the same time. The improved structural design of the present invention uses a single-layer photoelectric sensor array to simultaneously acquire low-energy and high-energy dual-energy spectral object images, and filters low-energy rays through a ray filtering layer and prevents the second scintillator layer from luminous scattering, thereby contributing to Improve the material resolution capability of the detector, improve the image quality, and improve the diagnostic accuracy. The detection system based on the dual-energy radiation flat panel detector of the present invention greatly simplifies the structure and reduces the volume, which not only helps to reduce the cost of the system, but also increases the mobility and flexibility of the system. The scope of application is wider.
所述光电传感器阵列层12的具体结构可以参考图2所示,第一感光像素121和第二感光像素122均包括TFT薄膜晶体管和光电二极管128,TFT晶体管具体包括栅极123、有源层124、源极电极125和漏极电极126,每一感光像素的光电二极管128可与对应的TFT薄膜晶体管的漏极相连接,TFT薄膜晶体管上方设置有遮光层127,用于遮挡闪烁体发出的光对TFT活性层的影响,TFT薄膜晶体管和遮光层127之间通过绝缘材料层相间隔。由于TFT薄膜晶体管和光电二极管的结构和原理为本领域技术人员所熟知,对此不做详细展开,重要的是相邻的感光像素具有不同的感光方向。The specific structure of the photosensor array layer 12 can be referred to as shown in FIG. 2 , the first photosensitive pixel 121 and the second photosensitive pixel 122 both include TFT thin film transistors and photodiodes 128 , and the TFT transistors specifically include gate electrodes 123 and active layers 124 , source electrode 125 and drain electrode 126, the photodiode 128 of each photosensitive pixel can be connected to the drain electrode of the corresponding TFT thin film transistor, and a light shielding layer 127 is arranged above the TFT thin film transistor to block the light emitted by the scintillator Influence on the TFT active layer, the TFT thin film transistor and the light shielding layer 127 are spaced apart by an insulating material layer. Since the structures and principles of the TFT thin film transistor and the photodiode are well known to those skilled in the art, this will not be described in detail. It is important that adjacent photosensitive pixels have different photosensitive directions.
为进一步提高成像质量,如图3所示,所述第一感光像素121及第二感光像素122呈多行多列交替阵列排布而呈棋盘结构分布,低能和高能像素中缺失的像素灰度值可以用与其共 边的周围4个像素(由虚线框标记的部分)的均值来代替,由单次曝光所得的一张图可以转化成一张低能图和一张高能图。In order to further improve the imaging quality, as shown in FIG. 3 , the first photosensitive pixels 121 and the second photosensitive pixels 122 are arranged in an alternating array of multiple rows and columns and are distributed in a checkerboard structure, and the pixel grayscales missing in the low-energy and high-energy pixels are The value can be replaced by the mean of the surrounding 4 pixels (the part marked by the dotted box) that are co-edged with it, and one image from a single exposure can be transformed into a low-energy image and a high-energy image.
所述第一闪烁体层11和第二闪烁体层15的材料可以相同或不同,具体均可以选自包括但不限于GOS(Gd
2O
2S)、NaI(Tl)、LaCl
3(Ce)、CsI(Tl、Na)、LaBr
3(Ce)、YAlO
3(Ce)、C
SI、GOS(Tb、Pr、Ce、F)、CaWO
4、Gd
3Ga
5O
12(Cr、Ce)、Lu
2Si
2O
7(Ce)、CdWO
4、BGO、Lu
2SiO
5(Ce)、LuAlO
3(Ce)、YTaO
4(Nb)中的一种或多种,但优选所述第二闪烁体层15的厚度大于所述第一闪烁体层11的厚度,即第一闪烁体层11具有相对较低的厚度,以在吸收低能X射线的同时减少对高能X射线的吸收,而第二闪烁体层15具有相对较大的厚度以充分吸收高能X射线。
The materials of the first scintillator layer 11 and the second scintillator layer 15 may be the same or different, and may be selected from, but not limited to, GOS (Gd 2 O 2 S), NaI (Tl), LaCl 3 (Ce) , CsI (Tl, Na), LaBr 3 (Ce), YAlO 3 (Ce), C S I, GOS (Tb, Pr, Ce, F), CaWO 4 , Gd 3 Ga 5 O 12 (Cr, Ce), One or more of Lu 2 Si 2 O 7 (Ce), CdWO 4 , BGO, Lu 2 SiO 5 (Ce), LuAlO 3 (Ce), YTaO 4 (Nb), but preferably the second scintillator The thickness of the layer 15 is greater than the thickness of the first scintillator layer 11, that is, the first scintillator layer 11 has a relatively lower thickness to reduce the absorption of high-energy X-rays while absorbing low-energy X-rays, while the second scintillator layer 11 has a relatively low thickness. The bulk layer 15 has a relatively large thickness to sufficiently absorb high-energy X-rays.
所述射线滤过层14不仅可以滤除掉部分低能射线,同时可以减小第二闪烁体层15出射可见光的发散角,提高高能图像的分辨率,故而所述射线滤过层14的材料选择很重要。较佳地,所述射线滤过层14的材料可以为光纤面板(Fiber Optic Plates,简称FOP),具有传光效率高、级间耦合损失小、传像清晰、真实、在光学上具有零厚度等优点。The ray filter layer 14 can not only filter out some low-energy rays, but also can reduce the divergence angle of the visible light emitted by the second scintillator layer 15 and improve the resolution of high-energy images. Therefore, the material of the ray filter layer 14 is selected. Very important. Preferably, the material of the ray filtering layer 14 can be an optical fiber panel (Fiber Optic Plates, FOP for short), which has the advantages of high light transmission efficiency, small inter-stage coupling loss, clear and real image transmission, and optically zero thickness. Etc.
作为示例,所述透明衬底13包括PI(Polyimide,聚酰亚胺)材料层、超薄玻璃和PET(Polyethylene terephthalate,聚酯)材料层中的一种或多种的结合,其厚度可以为10μm~20μm。As an example, the transparent substrate 13 includes a combination of one or more of a PI (Polyimide, polyimide) material layer, an ultra-thin glass, and a PET (Polyethylene terephthalate, polyester) material layer, and its thickness may be 10μm~20μm.
本发明提供的双能辐射平板探测器仅使用单层光电传感器阵列便可以以同时获取低能和高能的双能谱物体图像,相较于传统的双能辐射平板探测器,其结构极大简化,体积可以极大减小,这使得其不仅可以应用于常规的作业环境,还可以适用于各类需移动作业的工作场合,比如战地医院,移动安检站等。故而本发明还提供一种探测系统,所述探测系统包括如上述任一方案中所述的双能辐射平板探测器,对所述双能辐射平板探测器的介绍还请参考前述内容,出于简洁的目的不赘述。当然,所述探测系统还包括图像处理装置等结构,由于探测系统的结构及原理为本领域技术人员所熟知,对此不做详细展开。基于本发明的双能辐射平板探测器的探测系统,系统结构可以极大简化、体积可以极大缩小,可以有效降低系统成本,提高系统的适用性。The dual-energy radiation flat panel detector provided by the present invention can simultaneously acquire low-energy and high-energy dual-energy spectrum object images only by using a single-layer photoelectric sensor array. Compared with the traditional dual-energy radiation flat panel detector, its structure is greatly simplified. The volume can be greatly reduced, which makes it not only applicable to conventional operating environments, but also to various workplaces that require mobile operations, such as field hospitals, mobile security checkpoints, etc. Therefore, the present invention also provides a detection system, which includes the dual-energy radiation flat panel detector as described in any of the above solutions. For the introduction of the dual-energy radiation flat panel detector, please refer to the foregoing content, for The purpose of brevity is not repeated. Of course, the detection system also includes structures such as an image processing device. Since the structure and principle of the detection system are well known to those skilled in the art, this will not be described in detail. Based on the detection system of the dual-energy radiation flat panel detector of the present invention, the system structure can be greatly simplified, the volume can be greatly reduced, the system cost can be effectively reduced, and the applicability of the system can be improved.
本发明还提供一种双能辐射平板探测器的制备方法,本发明的制备方法可以用于制备如上述任一方案中所述的双能辐射平板探测器,或者说前述任一方案中所述的双能辐射平板探测器可以基于该制备方法制备而成(当然也可以基于其他方法制备),故前述对所述双能辐射平板探测器的介绍可以全文引用至此,出于简洁的目的不赘述。所述制备方法包括步骤:The present invention also provides a preparation method of a dual-energy radiation flat panel detector, and the preparation method of the present invention can be used to prepare the dual-energy radiation flat panel detector as described in any of the above solutions, or in any of the foregoing solutions. The dual-energy radiation flat-panel detector can be prepared based on this preparation method (of course, it can also be prepared based on other methods), so the aforementioned introduction to the dual-energy radiation flat-panel detector can be cited here in its entirety, and will not be repeated for the sake of brevity . The preparation method comprises the steps:
在透明衬底的上表面依次形成光电传感器阵列层和第一闪烁体层,所述光电传感器阵列 层包括交替分布的第一感光像素及第二感光像素,第一感光像素和第二感光像素具有相反的感光方向以分别用于实现低能X射线成像和高能X射线成像;比如可以基于常规的半导体制造工艺在透明衬底上一步步形成相应的薄膜结构以形成包括相应的TFT薄膜晶体管和光电二极管的第一感光像素和第二感光像素以形成所述光电传感器阵列层,之后经真空蒸镀或直接贴合工艺形成所述第一闪烁体层,比如如果所述第一闪烁体层为C
SI等材质,则可以在真空蒸镀炉内直接蒸镀而成,如果是GOS等材质,则可以先把第一闪烁体层做成一定厚度的膜层,之后用胶水或者胶膜贴合到所述光电传感器阵列层上;
A photosensor array layer and a first scintillator layer are sequentially formed on the upper surface of the transparent substrate. The photosensor array layer includes alternately distributed first photosensitive pixels and second photosensitive pixels. The first photosensitive pixels and the second photosensitive pixels have The opposite photosensitive directions are used to realize low-energy X-ray imaging and high-energy X-ray imaging respectively; for example, corresponding thin film structures can be formed step by step on a transparent substrate based on conventional semiconductor manufacturing processes to form corresponding TFT thin film transistors and photodiodes. The first photosensitive pixel and the second photosensitive pixel are formed to form the photosensor array layer, and then the first scintillator layer is formed by vacuum evaporation or direct bonding process, for example, if the first scintillator layer is CS I and other materials can be directly evaporated in a vacuum evaporation furnace. If it is a material such as GOS, the first scintillator layer can be made into a film layer of a certain thickness, and then glued or glued to the film. on the photoelectric sensor array layer;
在射线滤过层下表面集成第二闪烁体层,比如采用贴合工艺于射线滤过层的下表面形成所述第二闪烁体层,比如利用胶水或者胶膜将所述第二闪烁体层贴合到射线滤过层的下表面;Integrate a second scintillator layer on the lower surface of the ray filtering layer, for example, use a bonding process to form the second scintillator layer on the lower surface of the ray filtering layer, for example, use glue or glue film to attach the second scintillator layer Fitted to the lower surface of the ray filtering layer;
将射线滤过层的上表面与透明衬底的下表面耦合到一起,比如通过光学透明胶耦合,具体不做限制。由于高能像素和低能像素位于同一层,而无需考虑上下对位问题,因而制备工艺可以极大简化。The upper surface of the ray filtering layer and the lower surface of the transparent substrate are coupled together, such as through optically transparent glue, which is not specifically limited. Since the high-energy pixels and the low-energy pixels are located in the same layer, there is no need to consider the problem of upper and lower alignment, so the fabrication process can be greatly simplified.
综上所述,本发明提供一种双能辐射平板探测器及其制备方法,以及一种探测系统。所述双能辐射平板探测器沿X射线入射方向上依次包括第一闪烁体层、光电传感器阵列、透明衬底、射线滤过层及第二闪烁体层;其中,所述光电传感器阵列层包括交替分布的第一感光像素及第二感光像素,第一感光像素和第二感光像素具有相反的感光方向以分别用于实现低能X射线成像和高能X射线成像,所述射线滤过层用于过滤低能X射线和防止第二闪烁体层发光散射本发明经改善的结构设计,使用单层光电传感器阵列以同时获取低能和高能的双能谱物体图像,并通过射线滤过层过滤低能射线和防止第二闪烁体发光散射,从而有助于提高探测器的物质分辨能力,改善图像质量,提高诊断准确率。基于本发明的双能辐射平板探测器的探测系统,结构极大简化,体积可以大大减小,不仅有助于降低系统成本,同时增加系统的移动便利性和灵活性,使得本发明的探测系统适用范围更加广泛。所以,本发明有效克服了现有技术中的种种缺点而具高度产业利用价值。In summary, the present invention provides a dual-energy radiation flat panel detector, a method for manufacturing the same, and a detection system. The dual-energy radiation flat panel detector sequentially includes a first scintillator layer, a photoelectric sensor array, a transparent substrate, a ray filtering layer and a second scintillator layer along the X-ray incident direction; wherein, the photoelectric sensor array layer includes The first photosensitive pixels and the second photosensitive pixels are alternately distributed, and the first photosensitive pixels and the second photosensitive pixels have opposite photosensitive directions for realizing low-energy X-ray imaging and high-energy X-ray imaging respectively, and the ray filtering layer is used for Filtering low-energy X-rays and preventing luminescence scattering of the second scintillator layer The improved structural design of the present invention uses a single-layer photosensor array to simultaneously acquire images of low-energy and high-energy dual-energy spectral objects, and filters low-energy rays and The second scintillator is prevented from scattering light, thereby helping to improve the material resolution capability of the detector, improving the image quality and improving the diagnostic accuracy. The detection system based on the dual-energy radiation flat panel detector of the present invention greatly simplifies the structure and reduces the volume, which not only helps to reduce the cost of the system, but also increases the mobility and flexibility of the system. The scope of application is wider. Therefore, the present invention effectively overcomes various shortcomings in the prior art and has high industrial utilization value.
上述实施例仅例示性说明本发明的原理及其功效,而非用于限制本发明。任何熟悉此技术的人士皆可在不违背本发明的精神及范畴下,对上述实施例进行修饰或改变。因此,举凡所属技术领域中具有通常知识者在未脱离本发明所揭示的精神与技术思想下所完成的一切等效修饰或改变,仍应由本发明的权利要求所涵盖。The above-mentioned embodiments merely illustrate the principles and effects of the present invention, but are not intended to limit the present invention. Anyone skilled in the art can modify or change the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field without departing from the spirit and technical idea disclosed in the present invention should still be covered by the claims of the present invention.
Claims (8)
- 一种双能辐射平板探测器,其特征在于,所述双能辐射平板探测器沿X射线入射方向上依次包括第一闪烁体层、光电传感器阵列层、透明衬底、射线滤过层及第二闪烁体层;A dual-energy radiation flat-panel detector, characterized in that the dual-energy radiation flat-panel detector sequentially includes a first scintillator layer, a photoelectric sensor array layer, a transparent substrate, a ray filtering layer, and a first scintillator layer along the X-ray incident direction. Two scintillator layers;其中,所述光电传感器阵列层包括交替分布的第一感光像素及第二感光像素,第一感光像素和第二感光像素具有相反的感光方向以分别用于实现低能X射线成像和高能X射线成像,所述射线滤过层用于过滤低能X射线和防止第二闪烁体层发光散射。Wherein, the photosensor array layer includes alternately distributed first photosensitive pixels and second photosensitive pixels, the first photosensitive pixels and the second photosensitive pixels have opposite photosensitive directions for realizing low-energy X-ray imaging and high-energy X-ray imaging respectively , the ray filtering layer is used to filter low-energy X-rays and prevent the second scintillator layer from scattering light.
- 根据权利要求1所述的双能辐射平板探测器,其特征在于,所述第二闪烁体层的厚度大于所述第一闪烁体层的厚度。The dual-energy radiation flat panel detector according to claim 1, wherein the thickness of the second scintillator layer is greater than the thickness of the first scintillator layer.
- 根据权利要求1所述的双能辐射平板探测器,其特征在于,所述射线滤过层包括光纤面板。The dual-energy radiation flat panel detector according to claim 1, wherein the ray filtering layer comprises an optical fiber panel.
- 根据权利要求1所述的双能辐射平板探测器,其特征在于,所述透明衬底包括PI材料层、超薄玻璃和PET材料层中的一种或多种的结合。The dual-energy radiation flat panel detector according to claim 1, wherein the transparent substrate comprises a combination of one or more of a PI material layer, an ultra-thin glass and a PET material layer.
- 根据权利要求1所述的双能辐射平板探测器,其特征在于,所述第一感光像素及第二感光像素呈多行多列交替阵列排布。The dual-energy radiation flat panel detector according to claim 1, wherein the first photosensitive pixels and the second photosensitive pixels are arranged in an alternating array of multiple rows and multiple columns.
- 根据权利要求1-5任一项所述的双能辐射平板探测器,其特征在于,所述第一感光像素包括顶电极透明而底电极不透明的光电二极管而第二感光像素包括底电极透明而顶电极不透明的光电二极管。The dual-energy radiation flat panel detector according to any one of claims 1 to 5, wherein the first photosensitive pixel includes a photodiode with a transparent top electrode and an opaque bottom electrode, and the second photosensitive pixel includes a transparent bottom electrode and a photodiode. Opaque photodiode with top electrode.
- 一种双能辐射平板探测器的制备方法,其特征在于,包括步骤:A preparation method of a dual-energy radiation flat panel detector, characterized in that it comprises the steps of:在透明衬底的上表面依次形成光电传感器阵列层和第一闪烁体层,所述光电传感器阵列层包括交替分布的第一感光像素及第二感光像素,第一感光像素和第二感光像素具有相反的感光方向以分别用于实现低能X射线成像和高能X射线成像;A photosensor array layer and a first scintillator layer are sequentially formed on the upper surface of the transparent substrate. The photosensor array layer includes alternately distributed first photosensitive pixels and second photosensitive pixels. The first photosensitive pixels and the second photosensitive pixels have Opposite photosensitive directions for low-energy X-ray imaging and high-energy X-ray imaging, respectively;在射线滤过层下表面集成第二闪烁体层;A second scintillator layer is integrated on the lower surface of the ray filtering layer;将射线滤过层的上表面与透明衬底的下表面耦合到一起。The upper surface of the radiation filtering layer and the lower surface of the transparent substrate are coupled together.
- 一种探测系统,其特征在于,所述探测系统包括如权利要求1-6任一项所述的双能辐射平板探测器。A detection system, characterized in that the detection system comprises the dual-energy radiation flat panel detector according to any one of claims 1-6.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011611657.3 | 2020-12-30 | ||
CN202011611657.3A CN112713163A (en) | 2020-12-30 | 2020-12-30 | Dual-energy radiation flat panel detector, preparation method and detection system |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2022142431A1 true WO2022142431A1 (en) | 2022-07-07 |
Family
ID=75547296
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2021/115945 WO2022142431A1 (en) | 2020-12-30 | 2021-09-01 | Dual-energy radiation flat panel detector, manufacturing method, and detection system |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN112713163A (en) |
WO (1) | WO2022142431A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111433864A (en) | 2017-08-03 | 2020-07-17 | 纽约州州立大学研究基金会 | Dual screen digital radiography with asymmetric reflective screens |
CN112713163A (en) * | 2020-12-30 | 2021-04-27 | 上海奕瑞光电子科技股份有限公司 | Dual-energy radiation flat panel detector, preparation method and detection system |
CN113376677A (en) * | 2021-05-24 | 2021-09-10 | 信利半导体有限公司 | Collimating device of optical sensor and x-ray flat panel detector |
CN115683937B (en) * | 2023-01-04 | 2023-10-03 | 浙江双元科技股份有限公司 | Lithium battery pole piece surface density detection system and method based on linear array photoelectric sensor |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103026261A (en) * | 2010-07-27 | 2013-04-03 | 富士胶片株式会社 | Radiation detector and manufacturing method for same |
CN109841637A (en) * | 2019-01-30 | 2019-06-04 | 北京京东方传感技术有限公司 | A kind of flexible flat detector and preparation method thereof |
CN111356938A (en) * | 2017-09-14 | 2020-06-30 | 佳能株式会社 | Radiation detector and radiation detection system |
CN112068178A (en) * | 2019-06-10 | 2020-12-11 | 群创光电股份有限公司 | Radiation sensing device |
CN112117290A (en) * | 2020-09-24 | 2020-12-22 | 京东方科技集团股份有限公司 | Ray detector substrate and ray detector |
CN112713163A (en) * | 2020-12-30 | 2021-04-27 | 上海奕瑞光电子科技股份有限公司 | Dual-energy radiation flat panel detector, preparation method and detection system |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107799539A (en) * | 2016-08-31 | 2018-03-13 | 上海奕瑞光电子科技股份有限公司 | A kind of photodetection structure and preparation method thereof |
JP2020503518A (en) * | 2017-01-02 | 2020-01-30 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | X-ray detector and X-ray imaging device |
US20190361133A1 (en) * | 2018-05-28 | 2019-11-28 | Iray Technology Company Limited | Photoelectric detection structure and preparation method thereof |
CN109524428B (en) * | 2018-11-13 | 2020-09-25 | 上海奕瑞光电子科技股份有限公司 | X-ray detection unit, detector and detection system |
CN112002718A (en) * | 2020-08-14 | 2020-11-27 | 上海奕瑞光电子科技股份有限公司 | X-ray detector and preparation method thereof |
CN112098441A (en) * | 2020-08-26 | 2020-12-18 | 上海奕瑞光电子科技股份有限公司 | Three-energy-level linear array detector for single-source multi-energy imaging system |
-
2020
- 2020-12-30 CN CN202011611657.3A patent/CN112713163A/en active Pending
-
2021
- 2021-09-01 WO PCT/CN2021/115945 patent/WO2022142431A1/en unknown
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103026261A (en) * | 2010-07-27 | 2013-04-03 | 富士胶片株式会社 | Radiation detector and manufacturing method for same |
CN111356938A (en) * | 2017-09-14 | 2020-06-30 | 佳能株式会社 | Radiation detector and radiation detection system |
CN109841637A (en) * | 2019-01-30 | 2019-06-04 | 北京京东方传感技术有限公司 | A kind of flexible flat detector and preparation method thereof |
CN112068178A (en) * | 2019-06-10 | 2020-12-11 | 群创光电股份有限公司 | Radiation sensing device |
CN112117290A (en) * | 2020-09-24 | 2020-12-22 | 京东方科技集团股份有限公司 | Ray detector substrate and ray detector |
CN112713163A (en) * | 2020-12-30 | 2021-04-27 | 上海奕瑞光电子科技股份有限公司 | Dual-energy radiation flat panel detector, preparation method and detection system |
Also Published As
Publication number | Publication date |
---|---|
CN112713163A (en) | 2021-04-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2022142431A1 (en) | Dual-energy radiation flat panel detector, manufacturing method, and detection system | |
US10371830B2 (en) | Radiation detector for combined detection of low-energy radiation quanta and high-energy radiation quanta | |
Kataoka et al. | Handy Compton camera using 3D position-sensitive scintillators coupled with large-area monolithic MPPC arrays | |
US20180252825A1 (en) | Gamma-Ray Compton TOF Camera System | |
US20100127279A1 (en) | Dual-phosphor flat panel radiation detector | |
WO2013105519A1 (en) | Radioactive substance detection device, radiation source location visibility system, and radioactive substance detection method | |
Morishita et al. | Development of a Si-PM based alpha camera for plutonium detection in nuclear fuel facilities | |
Taggart et al. | Investigation into the potential of GAGG: Ce as a neutron detector | |
US20130320221A1 (en) | Detectors and systems and methods of using them in imaging and dosimetry | |
Fujita et al. | Two-dimensional diced scintillator array for innovative, fine-resolution gamma camera | |
Yoshihara et al. | Evaluation of double photon coincidence Compton imaging method with GEANT4 simulation | |
JP2011257339A (en) | Radiation image detection device | |
JP2008051626A (en) | Line sensor, line sensor unit and radiation nondestructive inspection system | |
WO2017209059A1 (en) | Gamma-ray image acquisition device and gamma-ray image acquisition method | |
Lipovetzky et al. | Multi-spectral x-ray transmission imaging using a bsi cmos image sensor | |
US10156640B2 (en) | Radiation detection apparatus and radiation detection sheet | |
Lu et al. | Monte Carlo simulation for performance evaluation of detector model with a monolithic LaBr3 (Ce) crystal and SiPM array for γ radiation imaging | |
US8588370B2 (en) | Article inspection device and inspection method | |
Sueoka et al. | Development of a new pinhole camera for imaging in high dose-rate environments | |
JP2004317300A (en) | Plane radiation detector and its manufacturing method | |
JP2006329905A (en) | Line sensor, line sensor unit, and radiation nondestructive inspection system | |
Miller et al. | LiF/CsI: Tl scintillator for high-resolution neutron imaging | |
WO2021164281A1 (en) | Dual energy spectrum dual resolution x-ray probes, probe system, and imaging method | |
Pani et al. | Investigation of radiation detection properties of CRY-018 and CRY-019 scintillators for medical imaging | |
WO2013047011A1 (en) | Radiographic image detector, method of manufacturing same, and radiography system employing radiographic image detector |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 21913178 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
32PN | Ep: public notification in the ep bulletin as address of the adressee cannot be established |
Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 28.11.2023) |