WO2022135262A1 - 电子设备 - Google Patents

电子设备 Download PDF

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Publication number
WO2022135262A1
WO2022135262A1 PCT/CN2021/138704 CN2021138704W WO2022135262A1 WO 2022135262 A1 WO2022135262 A1 WO 2022135262A1 CN 2021138704 W CN2021138704 W CN 2021138704W WO 2022135262 A1 WO2022135262 A1 WO 2022135262A1
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WO
WIPO (PCT)
Prior art keywords
cover plate
edge
area
plate
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2021/138704
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English (en)
French (fr)
Inventor
姚彦青
李能智
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vivo Mobile Communication Co Ltd
Original Assignee
Vivo Mobile Communication Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vivo Mobile Communication Co Ltd filed Critical Vivo Mobile Communication Co Ltd
Publication of WO2022135262A1 publication Critical patent/WO2022135262A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/61—Types of temperature control
    • H01M10/613—Cooling or keeping cold
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/62—Heating or cooling; Temperature control specially adapted for specific applications
    • H01M10/623—Portable devices, e.g. mobile telephones, cameras or pacemakers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/65—Means for temperature control structurally associated with the cells
    • H01M10/655—Solid structures for heat exchange or heat conduction
    • H01M10/6554—Rods or plates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Definitions

  • the present application belongs to the technical field of communication devices, and in particular relates to an electronic device.
  • the purpose of the embodiments of the present application is to provide a middle frame assembly and an electronic device, which can at least alleviate the problem of poor heat dissipation effect.
  • An embodiment of the present application provides an electronic device, the electronic device includes: a middle frame assembly, the middle frame assembly includes a middle frame body and a heat soaking plate, the middle frame body is provided with a groove, and the heat soaking plate It is arranged in the groove and connected with the middle frame body, the groove has a first area and a second area, the electronic device also includes a main board and a battery, and the first area is opposite to the main board , the second area is disposed opposite to the battery, and the heat soaking plate covers the first area and the second area.
  • the middle frame assembly includes a middle frame body and a heat soaking plate.
  • the heat soaking plate is arranged in the groove of the middle frame body and covers the first area and the second area of the groove.
  • Some of the power devices and batteries are heat source components, and the first area is arranged opposite to the mainboard, and the second area is arranged opposite to the battery. In this way, the vapor chamber can extend from the mainboard area to the battery area.
  • the contact area between the vapor chamber and the power devices on the motherboard and the heat source components such as batteries is increased, thereby greatly improving the heat dissipation efficiency of the heating devices; and, in general, the frame body has a large area to avoid If the heat soaking plate is arranged in the groove and connected with the middle frame body, the overall strength of the middle frame assembly can be improved and space can be saved. Therefore, the electronic device disclosed in the embodiments of the present application has better heat dissipation efficiency and higher strength, so as to meet higher requirements of the electronic device.
  • FIG. 1 is a schematic disassembly diagram of an electronic device disclosed in an embodiment of the present application.
  • FIG. 2 is a schematic disassembly diagram of a middle frame assembly disclosed in an embodiment of the present application
  • FIG. 3 is a schematic diagram of a middle frame body disclosed in an embodiment of the present application.
  • FIG. 4 is a schematic diagram of the first form of the vapor chamber disclosed in the embodiment of the application.
  • Fig. 5 is the sectional view of A-A in Fig. 4;
  • FIG. 6 is a schematic diagram of the second form of the vapor chamber disclosed in the embodiment of the application.
  • Fig. 7 is the sectional view of B-B in Fig. 6;
  • FIG. 8 is a schematic diagram of a vapor chamber of a third form disclosed in an embodiment of the present application.
  • Fig. 9 is the sectional view of C-C in Fig. 8.
  • Figure 10 is a sectional view of one of the forms of D-D in Figure 8.
  • Figure 11 is a cross-sectional view of another form of D-D in Figure 8.
  • FIG. 12 is a schematic diagram of a middle frame assembly using a first connection method disclosed in an embodiment of the application.
  • Figure 13 is a sectional view of one of the forms of E-E in Figure 12;
  • Figure 14 is a sectional view of one of the forms of F-F in Figure 12;
  • Figure 15 is a cross-sectional view of another form of E-E in Figure 12;
  • Fig. 16 is a sectional view of another form of F-F in Fig. 12;
  • FIG. 17 is a schematic diagram of a middle frame assembly using a second connection method disclosed in an embodiment of the application.
  • FIG. 18 is a cross-sectional view along G-G in FIG. 17 .
  • 100 - middle frame assembly 110 - middle frame body; 111 - groove; 1111 - first area; 1112 - second area; 1113 - through hole; 112 - first edge; 120 - soaking plate; 121 - first Cover plate; 1211-first tank body; 122-second cover plate; 1221-second tank body; 1222-third tank body; 123-capillary layer; 124-steam chamber; 125-second edge; 1251-notch ;126-Avoid space;130-PGS heat conduction plate;
  • first, second and the like in the description and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It is to be understood that the data so used are interchangeable under appropriate circumstances so that the embodiments of the present application can be practiced in sequences other than those illustrated or described herein, and distinguish between “first”, “second”, etc.
  • the objects are usually of one type, and the number of objects is not limited.
  • the first object may be one or more than one.
  • “and/or” in the description and claims indicates at least one of the connected objects, and the character “/" generally indicates that the associated objects are in an "or” relationship.
  • an embodiment of the present application discloses an electronic device.
  • the disclosed electronic device includes a middle frame assembly 100 , a main board 200 and a battery 400 , wherein the middle frame assembly 100 includes a middle frame body 110 and a soaking plate 120 .
  • the middle frame body 110 is a basic installation component of the electronic device and can play a supporting role.
  • the middle frame body 110 also provides the installation basis for some electrical components of the electronic device, such as the motherboard 200 , the battery 400 , and the antenna.
  • the middle frame body 110 can be made of metal material, such as aluminum alloy, etc. By using the middle frame body 110 of metal material, the overall strength and stability of the electronic device can be improved.
  • the frame body 110 can also improve the heat dissipation performance of some electrical components of the electronic device.
  • using the metal middle frame body 110 can also have a smaller thickness dimension under the condition of the same strength, which is beneficial to the development of the electronic device in a light and thin direction.
  • middle frame body 110 may also be made of a hard non-metallic material, and the material of the middle frame body 110 is not limited in the embodiment of the present application.
  • a groove 111 is formed on one side of the middle frame body 110, and the soaking plate 120 can be arranged in the groove 111, and the soaking plate 120 is connected with the middle frame body 110. In this way, the middle frame body 110 and the soaking plate 120 are composed together.
  • the soaking plate 120 mainly plays the role of heat dissipation.
  • the integrated middle frame structure composed of the middle frame body 110 and the soaking plate 120 can improve the heat dissipation efficiency of the electronic device and ensure that the electronic device is kept at a reasonable temperature during operation. within the range.
  • the groove 111 is divided into a first area 1111 and a second area 1112.
  • the first area 1111 is arranged opposite to the main board 200
  • the second area 1112 is arranged opposite to the battery 400 .
  • the soaking plate 120 is covered on the first area 1111 and the second area 1112 to make the heat soaking
  • the board 120 is disposed opposite to the main board 200 and the battery 400 at the same time.
  • the main board 200 and the battery 400 are both installed on the middle frame body 110 , there is a certain contact relationship between the heat-spreading plate 120 and the main board 200 and the battery 400 , so that the heat-spreading plate 120 Heat can be transferred between the main board 200 and the battery 400, so as to achieve the effect of heat dissipation on the electrical components of the electronic device.
  • the heat soaking plate 120 is disposed in the groove 111 of the middle frame body 110 and extends from the area of the main board 200 to the area of the battery 400.
  • a heat soaking plate is added virtually.
  • the contact area between the 120 and the electrical components improves the heat dissipation efficiency of the electrical components to a certain extent; and, in general, the middle frame body 110 has a large area to avoid the void, and the soaking plate 120 is arranged in the groove 111. It is connected with the middle frame body 110 so that the soaking plate 120 and the middle frame body 110 together form an integral middle frame structure, which can not only improve the overall strength of the middle frame assembly 100 but also save space. Therefore, the electronic device disclosed in the embodiments of the present application has better heat dissipation efficiency and higher strength, and meets higher requirements of electronic devices.
  • At least part of the inner edge of the groove 111 is formed with a first edge 112 , and the first edge 112 is used to support the soaking plate 120 after the soaking plate 120 is disposed in the groove 111 , and The vapor chamber 120 is connected to the first edge 112 .
  • the surface of the middle frame body 110 and the edge of the groove 111 sink for a certain distance toward the bottom end of the groove 111 , and the end surface formed after sinking is the first edge 112 .
  • the edge region of the soaking plate 120 overlaps the first edge 112 , so as to realize the support for the soaking plate 120 .
  • first edge 112 may be formed on all the edges of the groove 111 , or the first edge 112 may be formed on part of the edge of the groove 111 , and the first edge 112 may not be formed on the remaining part. selected according to the actual situation.
  • the outer edge of the soaking plate 120 is formed with a second edge 125 .
  • the second edge 125 at the edge of the soaking plate 120 is affected by the edge of the groove 111 .
  • the second edge 125 is fixedly connected to the first edge 112 .
  • double-sided tape is used for bonding
  • dispensing is used for bonding
  • hot melt adhesive is used for bonding
  • welding is used.
  • any other method that can be used to connect the second edge 125 and the first edge 112 can also be used, and the embodiment of the present application does not limit the fixed connection between the second edge 125 and the first edge 112. .
  • the second edge 125 may be formed at the entire edge of the heat soaking plate 120 , or the second edge 125 may be formed at a part of the edge of the heat soaking plate 120 , and the second edge 125 may not be formed at the remaining part. Choose according to the actual situation.
  • the second edge 125 at the edge of the vapor chamber 120 is generally matched with the first edge 112 at the edge of the groove 111 to facilitate the fixed connection between the vapor chamber 120 and the middle frame body 110 .
  • the soaking plate 120 includes a first cover plate 121, a second cover plate 122 and a capillary layer 123, the first cover plate 121 and the second cover plate 122 are stacked and disposed, and the capillary layer 123 is sandwiched between A steam chamber 124 is formed between the first cover plate 121 and the second cover plate 122 and between the capillary layer 123 and the first cover plate 121 .
  • the edge of the first cover plate 121 and the edge of the second cover plate 122 are connected by welding to improve the overall strength of the soaking plate 120 and ensure that the components of the soaking plate 120 are not easily separated.
  • the second cover plate 122 is located on the side close to the main board 200 and the battery 400
  • the first cover plate 121 is located on the side away from the main board 200 and the battery 400 .
  • a first groove is provided on the side of the second cover plate 122 facing the first cover plate 121 body 1211, the capillary layer 123 is arranged in the first groove body 1211, and the distance between the main board 200 and the battery 400 and the capillary layer 123 is reduced to a certain extent by the setting of the first groove body 1211, which is beneficial to the transfer of heat .
  • a second groove body 1221 is provided on the surface of the second cover plate 122 opposite to the first cover plate 121, and the opening of the second groove body 1221 faces the capillary layer 123, so, The second tank body 1221 and the capillary layer 123 together form a steam chamber 124.
  • the steam chamber 124 is used to contain the working fluid, and the steam chamber 124 has a certain degree of vacuum to form a low vacuum degree environment.
  • the capillary layer 123 can be a metal woven mesh or micro-grooves, wherein the metal woven mesh includes copper mesh, aluminum mesh or titanium mesh; through the capillary layer 123, the working fluid in liquid form can be returned from the cooling end to the evaporation end to ensure evaporation end with sufficient working fluid. It should be understood that the capillary layer 123 may also be any other structure capable of diverting the working fluid, and the specific form of the capillary layer 123 is not limited in this embodiment of the present application.
  • the working fluid contained in the steam chamber 124 includes water or particle suspension.
  • the specific working principle of the soaking plate 120 is as follows:
  • some heat-generating power devices or batteries 400 on the main board 200 transfer the generated heat to the first cover plate 121.
  • the area of the first cover plate 121 in contact with the power devices or batteries 400 is heated
  • the heat receiving end is the evaporating end; the area on the vapor chamber 120 for transferring heat to other structures is the cooling end.
  • the work at the heat receiving end The fluid will undergo liquid phase vaporization in a low vacuum environment and be converted into a gas, and the working fluid can absorb and carry a large amount of latent heat due to the phase change phenomenon, and it is mentioned that the rapid expansion fills the entire vapor chamber 124; while the gas is condensed at the cooling end when it is cooled.
  • the phenomenon is converted into liquid, a large amount of heat is released during the condensation process, and the liquid working fluid flows back to the evaporation end along the capillary layer 123.
  • the above process is cyclically performed, thereby realizing heat dissipation to the power device or battery 400.
  • each edge of the first cover plate 121 extends outward and protrudes from the corresponding edge of the second cover plate 122 .
  • a second edge 125 is formed at each edge of the plate 121 , that is, each edge of the first cover plate 121 extends outwards with a wing-like structure.
  • the second edge 125 at each edge of the first cover plate 121 is provided with a gap 1251, such as a rectangular gap, an arc gap, a triangular gap, a trapezoidal gap, etc.
  • Protrusions (not shown in the figure) corresponding to the notches 1251 are provided on the side walls of the first edge 112 , so that when the soaking plate 120 is arranged in the groove 111 of the middle frame body 110 , the second edge 125
  • the notch 1251 at the first edge 112 is matched with the protrusion at the first edge 112 , so that the positioning of the vapor chamber 120 in the length direction and the width direction of the electronic device is realized through the mutual cooperation between the notch 1251 and the protrusion.
  • the first edge 112 provided on each edge of the groove 111 can overlap and be fixed to each other to ensure the heat soaking plate.
  • the flatness of the side of the 120 away from the middle frame body 110 is more suitable for electronic devices that require high flatness.
  • the edges of the second cover plate 122 respectively extend outward and protrude from the first cover plate 121 , and the edges of the second cover plate 122 and the first cover plate 122 are respectively extended outwards.
  • the opposite surface of a cover plate 121 is recessed in the direction away from the first cover plate 121 , so that a third groove body 1222 is formed on the surface of the second cover plate 122 opposite to the first cover plate 121 .
  • each edge of the third groove body 1222 is the second edge 125 , that is, each edge of the third groove body 1222 extends outward with a wing-like structure.
  • the second edges 125 of each edge of the third groove body 1222 overlap with the first edge 112 at the edge of the groove 111 correspondingly.
  • the one edge 112 supports the second edge 125 , and through the cooperation of the first edge 112 and the second edge 125 , the positioning of the vapor chamber 120 in the thickness direction of the electronic device is achieved.
  • the second groove body 1221 is opened on the bottom end surface of the third groove body 1222 .
  • a gap 1251 is provided on the second edge 125 at each edge of the third groove body 1222, such as a rectangular gap, an arc gap, a triangular gap, a trapezoidal gap, etc.
  • a protrusion (not shown in the figure) corresponding to the notch 1251 is provided on the upper part.
  • the first edge set on each edge of the groove 111 can be When the 112 is overlapped and fixed to each other, the reliability of pulling the battery 400 is ensured, which is more suitable for electronic equipment using the large-capacity battery 400 .
  • the soaking plate 120 covers the first area 1111 and the second area 1112, so the soaking plate 120 can also be divided into a third area and a fourth area, wherein the third area is opposite to the first area 1111, and the fourth area is opposite to the first area 1111.
  • the two regions 1112 are opposite.
  • each edge of the first cover plate 121 and each edge of the second cover plate 122 are not provided with the second edge 125, so that each edge of the first cover plate 121 and the second cover plate 121 are not provided with second edges 125.
  • the edges of the cover plate 122 are respectively aligned.
  • each edge of the first cover plate 121 extends outward and protrudes from the second cover plate 122, so that at each edge of the first cover plate 121 located in the fourth area
  • a second edge 125 is formed, that is, a wing-like structure extends outward from each edge of the first cover plate 121 located in the fourth region.
  • the second edges 125 of the first cover plate 121 located at the edges of the fourth region correspond to the first cover plates 121 overlapping the first edges of the groove 111 .
  • the part of the heat soaking plate 120 located in the third area is attached to the first area 1111 of the groove 111, so that through the first cover plate 121 located in the fourth area
  • the two edges 125 cooperate with the first edge 112 corresponding to the edge of the groove 111, and the part of the second cover plate 122 located in the third area cooperates with the first area 1111 of the groove 111, so that the heat soaking plate is matched with each other.
  • a gap 1251 is provided on the second edge 125 of the first cover plate 121 at each edge of the fourth area, such as a rectangular gap, an arc gap, a triangular gap, a trapezoidal gap, etc.
  • the first Protrusions (not shown in the figure) corresponding to the notches 1251 are provided on the side walls of the edge 112 .
  • the notch 1251 at the second edge 125 is matched with the protrusion at the first edge 112, so that the gap 1251 and the protrusion are mutually connected.
  • the positioning of the vapor chamber 120 in the length direction and the width direction of the electronic device is realized.
  • the notch 1251 may not be provided on the second edge 125.
  • the part of the second cover plate 122 located in the third area and the first area 1111 of the groove 111 cooperate with each other, so as to achieve uniform alignment. The positioning of the hot plate 120 in the length and width directions of the electronic device.
  • the groove 111 of the middle frame body 110 is divided into a first area 1111 opposite to the main board 200 and a second area opposite to the battery 400
  • the vapor chamber 120 covers the first area 1111 and the second area 1112, so the vapor chamber 120 can also be divided into a third area and a fourth area, wherein the third area is opposite to the first area 1111, and the fourth area The area is opposite to the second area 1112 .
  • each edge of the first cover plate 121 and each edge of the second cover plate 122 are not provided with the second edge 125, so that each edge of the first cover plate 121 and the second cover plate 121 are not provided with second edges 125.
  • the edges of the cover plate 122 are respectively aligned.
  • each edge of the second cover plate 122 extends outward and protrudes from the first cover plate 121, so that at each edge of the second cover plate 122 located in the fourth area A second edge 125 is formed, that is, a wing-like structure extending outward from each edge of the second cover plate 122 in the fourth region.
  • the second edges 125 of the second cover plate 122 located at the edges in the fourth region correspond to the first edges 125 overlapping the edges of the groove 111 .
  • the part of the vapor chamber 120 located in the third area is attached to the first area 1111 of the groove 111 , that is, the part of the second cover plate 122 located in the third area is attached to the groove 111
  • the first area 1111 of the second cover plate 122 at each edge in the fourth area cooperates with the corresponding first edge 112 at the edge of the groove 111, and the second cover plate 122
  • the part located in the third area and the first area 1111 of the groove 111 cooperate with each other to realize the positioning of the vapor chamber 120 in the thickness direction of the electronic device.
  • a gap 1251 is provided on the second edge 125 of the second cover plate 122 at each edge of the fourth region, such as a rectangular gap, an arc gap, a triangular gap, a trapezoidal gap, etc.
  • corresponding to the notches 1251 are provided on the side walls of the edge 112 .
  • the notch 1251 may not be provided on the second edge 125.
  • the part of the second cover plate 122 located in the third area and the first area 1111 of the groove 111 cooperate with each other, so as to achieve uniform alignment. The positioning of the hot plate 120 in the length and width directions of the electronic device.
  • first or second form of the vapor chamber 120 it should be understood that the second edge 125 of each edge of the first cover plate 121 or the second edge 125 of each edge of the second cover plate 122 and the groove 111
  • the first edge 112 of each edge of the two sides can be fixed by double-sided adhesive bonding, dispensing bonding, hot-melt adhesive bonding or welding, etc.
  • the firmness of the fixed connection between the overlapped edges and the overlapped edges further ensures the firmness of the fixed connection between the soaking plate 120 and the middle frame body 110 , and improves the overall strength of the middle frame assembly 100 to a certain extent.
  • the second edge 125 of the first cover plate 121 located at each edge of the fourth region and the first edge 112 of the second region 1112 can be used Double-sided adhesive bonding, dispensing bonding, hot-melt adhesive bonding or welding, etc. are used for fixing, so as to ensure the firmness of the fixed connection between the first edge 112 and the second edge 125;
  • the surface located in the third area is attached to the bottom surface of the groove 111 located in the first area 1111, and is bonded by double-sided adhesive or dispensing, so as to ensure that the third area of the second cover 122 is in contact with the groove 111.
  • the firmness of the fixed connection between the first regions 1111 Therefore, the firmness of the fixed connection between the soaking plate 120 and the middle frame body 110 is ensured, and the overall strength of the middle frame assembly 100 is improved to a certain extent.
  • the second edge 125 of the second cover plate 122 located at each edge of the fourth region and the first edge 112 of the second region 1112 can be used Double-sided adhesive bonding, dispensing bonding, hot-melt adhesive bonding or welding, etc. are used for fixing, so as to ensure the firmness of the fixed connection between the first edge 112 and the second edge 125;
  • the surface located in the third area is attached to the bottom surface of the groove 111 located in the first area 1111, and is bonded by double-sided adhesive or dispensing, so as to ensure that the third area of the second cover 122 is in contact with the groove 111.
  • the firmness of the fixed connection between the first regions 1111 Therefore, the firmness of the fixed connection between the soaking plate 120 and the middle frame body 110 is ensured, and the overall strength of the middle frame assembly 100 is improved to a certain extent.
  • the first cover plate 121 is made of stainless steel or titanium alloy or copper alloy; the second cover plate 122 is made of stainless steel or titanium alloy or copper alloy, so as to ensure the overall strength of the soaking plate 120 and at the same time , so that the soaking plate 120 is not easily corroded.
  • Both the first cover plate 121 and the second cover plate 122 are fabricated by etching or stamping process, which improves fabrication efficiency and ensures machining accuracy.
  • the capillary layer 123 is set between the first cover plate 121 and the second cover plate 122 , and a steam chamber 124 is formed between the capillary layer 123 and the first cover plate 121 .
  • a steam chamber 124 is formed between the capillary layer 123 and the first cover plate 121 .
  • both the inner layer of the first cover plate 121 and the inner layer of the second cover plate 122 are provided
  • the plating layer specifically, may be copper plating, nickel plating or gold plating, so as to ensure that the inner layer of the first cover plate 121 and the inner layer of the second cover plate 122 are not damaged.
  • the vapor chamber 120 is attached to the power device and the battery 400 on the main board 200 , so that a part of the first area 1111 of the groove 111 is partially hollowed out, for example, the concave
  • the position corresponding to the camera module 600 in the first area 1111 of the groove 111 is hollowed out.
  • positions corresponding to other power devices in the first region 1111 of the groove 111 can also be hollowed out, so that the third region of the vapor chamber 120 can be directly attached to the power device.
  • the second area 1112 of the groove 111 is completely hollowed out, so that the fourth area of the vapor chamber 120 can be directly attached to the battery 400 .
  • the heat-spreading plate 120 is arranged in close contact with the power device and the battery 400 on the main board 200 to ensure that the heat-spreading plate 120 can efficiently absorb the heat on the power device and the battery 400 and transfer it to other areas, thus achieving a good heat radiation.
  • the grooves 111 can also be completely penetrated at the first region 1111 , and in this case, as long as the installation of the main board 200 is not affected.
  • a PGS (Pyrolytic Graphite Sheet, PGS) heat-conducting plate 130 is provided on the side of the vapor chamber 120 away from the middle frame body 110, and a central area of the PGS heat-conducting plate 130 is provided. Covered on the soaking plate 120, the edge area is covered on the middle frame body 110, after the heat on the power device and the battery 400 is absorbed by the soaking plate 120, it is transferred to the PGS heat-conducting plate 130, through the PGS heat-conducting plate 130. Therefore, the heat transfer efficiency is improved, and it is ensured that the electronic device has a good heat dissipation effect.
  • the central region of the PGS heat-conducting plate 130 is adhered to the heat-spreading plate 120, and the edge region is adhered to the middle frame body 110, so that the PGS heat-conducting plate 130, the heat-spreading plate 120 and the middle frame
  • the three main bodies 110 are spliced together to form an integrated middle frame assembly 100 .
  • the middle frame assembly 100 can not only realize the installation of structures such as the main board 200 and the battery 400 , but also can dissipate heat from some power devices and the battery 400 .
  • a through hole 1113 is opened in the first area 1111 of the groove 111 for passing through a heat source component
  • the heat source component includes a camera module, a power device, and the like.
  • the heat source component may be a camera module 600
  • a space 126 is provided on the heat soaking plate 120, that is, the area of the heat soaking plate 120 opposite to the camera module 600 is cut off to
  • the camera module 600 can be exposed, so that when the PGS heat conducting plate 130 is bonded on the soaking plate 120 and the middle frame body 110, the PGS heat conducting plate 130 can be directly It is attached to the camera module 600 , so that heat is directly transferred to the camera module 600 through the PGS heat-conducting plate 130 , so as to dissipate heat from the camera module 600 .
  • the heat soaking plate 120 can also be directly covered on the camera module 600, so as to directly transfer heat to the camera module 600 through the heat soaking plate 120, so that the camera module 600 can be heated.
  • the PGS heat-conducting plate 130 is bonded to the side of the vapor chamber 120 away from the middle frame body 110 .
  • the PGS heat-conducting plate 130 may not be provided, and the heat dissipation of the camera module 600 can be realized by the soaking plate 120 .
  • an escape space 126 may be provided on the vapor chamber 120 so that the PGS heat conducting plate 130 directly covers the camera module 600 , thereby realizing heat dissipation of the camera module 600 .
  • the electronic device disclosed in the embodiments of the present application further includes a display module 300 and a battery cover 500.
  • the display module 300 and the battery cover 500 are respectively disposed on both sides of the middle frame assembly 100. Normally, the display module 300 is glued to The battery cover 500 is fixed on the other side of the middle frame assembly 100 by means of snap-fastening.
  • An inner cavity is formed between the battery cover 500 and the middle frame assembly 100 , the main board 200 and the battery 400 are arranged in the inner cavity, and the relative positions of the main board 200 and the battery 400 are not limited. Moreover, the main board 200 and the battery 400 are both connected to the middle frame assembly 100 . In this way, the middle frame assembly 100 not only realizes the fixed installation of the main board 200 and the battery 400, but also can transfer the heat of the power devices on the main board 200 and the battery 400 to other positions, so as to realize the heat generation of the power devices on the main board 200. and heat dissipation of the battery 400 .
  • the electronic devices disclosed in the embodiments of the present application may be electronic devices such as smart phones, tablet computers, e-book readers, wearable devices (such as smart watches, etc.), game consoles, etc.
  • the embodiments of the present application do not limit the specific form of the electronic devices.

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Abstract

本申请公开了一种电子设备，涉及通信设备技术领域。一种电子设备，包括中框组件，所述中框组件包括中框本体和均热板，所述中框本体上设有凹槽，所述均热板设置于所述凹槽内并与所述中框本体连接，所述凹槽具有第一区域和第二区域，所述电子设备还包括主板和电池，所述第一区域与所述主板相对设置，所述第二区域与所述电池相对设置，所述均热板覆盖所述第一区域和所述第二区域。

Description

电子设备
交叉引用
本发明要求在2020年12月21日提交中国专利局、申请号为202011517129.1、发明名称为“电子设备”的中国专利申请的优先权，该申请的全部内容通过引用结合在本发明中。
技术领域
本申请属于通信设备技术领域，具体涉及一种电子设备。
背景技术
随着技术的进步，一些终端设备的发展也越来越好，其中较为突出的表现为：从4G逐渐向5G终端设备发展。然而，随着终端设备的升级，发热功率也随之增大，从而，终端设备的散热性能越来越受到重视。相关技术中，主要采用贴石墨散热片或采用热管等方式进行散热，但散热效果不佳，最终会导致终端设备温度升高而影响正常使用或影响用户体验感的问题。
发明内容
本申请实施例的目的是提供一种中框组件及电子设备，至少能够缓解散热效果不佳的问题。
为了解决上述技术问题，本申请是这样实现的：
本申请实施例提供了一种电子设备，该电子设备包括：中框组件，所述中框组件包括中框本体和均热板，所述中框本体上设有凹槽，所述均热板设置于所述凹槽内并与所述中框本体连接，所述凹槽具有第一区域和第二区域，所述电子设备还包括主板和电池，所述第一区域与所述主板相对设置，所述第二区域与所述电池相对设置，所述均热板覆盖所述第一区域和所述第二区域。
在本申请实施例中，中框组件包括中框本体和均热板，均热板设置在中框本体的凹槽内，并对凹槽的第一区域和第二区域进行覆盖，由于主板上的一些功率器件以及电池均为热源件，且第一区域与主板相对设置，第二区域与电池相对设置，如此，均热板能够从主板区延伸至电池区，相比于相关技术中的散热方式，上述设置方式无形中增加了均热板与主板上的功率器件以及电池等热源件的接触面积，从而大大提升对于发热器件的散热效率；并且，通常情况下中，框本体存在大面积避空，将均热板设置在凹槽内并与中框本体相连接，还能够提高中框组件的整体强度，并节省空间。因此，本申请实施例公开的电子设备具有较佳的散热效率，同时具有较高的强度，以满足电子设备更高的需求。
附图说明
图1为本申请实施例公开的电子设备的拆解示意图；
图2为本申请实施例公开的中框组件的拆解示意图；
图3为本申请实施例公开的中框本体的示意图；
图4为本申请实施例公开的第一种形式的均热板的示意图；
图5为图4中A-A的断面图；
图6为本申请实施例公开的第二种形式的均热板的示意图；
图7为图6中B-B的断面图；
图8为本申请实施例公开的第三种形式的均热板的示意图；
图9为图8中C-C的断面图；
图10为图8中D-D的其中一种形式的断面图；
图11为图8中D-D的另一种形式的断面图；
图12为本申请实施例公开的采用第一种连接方式的中框组件的示意图；
图13为图12中E-E的其中一种形式的断面图；
图14为图12中F-F的其中一种形式的断面图；
图15为图12中E-E的另一种形式的断面图；
图16为图12中F-F的另一种形式的断面图；
图17为本申请实施例公开的采用第二种连接方式的中框组件的示意图；
图18为图17中G-G的断面图。
附图标记说明：
100-中框组件；110-中框本体；111-凹槽；1111-第一区域；1112-第二区域；1113-通孔；112-第一边沿；120-均热板；121-第一盖板；1211-第一槽体；122-第二盖板；1221-第二槽体；1222-第三槽体；123-毛细层；124-蒸汽腔；125-第二边沿；1251-缺口；126-避让空间；130-PGS导热板；
200-主板；
300-显示模组；
400-电池；
500-电池盖；
600-摄像头模组。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请的说明书和权利要求书中的术语“第一”、“第二”等是用于区别类似的对象，而不用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便本申请的实施例能够以除了在这里图示或描述的那些以外的顺序实施，且“第一”、“第二”等所区分的对象通常为一类，并不限定对象的个数，例如第一对象可以是一个，也可以是多个。此外，说明书以及权利要求中“和/或”表示所连接对象的至少其中之一，字符“/”， 一般表示前后关联对象是一种“或”的关系。
下面结合附图，通过具体地实施例及其应用场景对本申请实施例提供的可穿戴设备进行详细地说明。
如图1～图18，本申请实施例公开一种电子设备，所公开的电子设备包括中框组件100、主板200和电池400，其中，中框组件100包括中框本体110和均热板120。
中框本体110为电子设备的基础安装构件，能够起到支撑的作用，中框本体110还为电子设备的一些电气元件提供安装基础，如主板200、电池400、天线等。中框本体110可以为金属材质，如铝合金等，通过采用金属材质的中框本体110，能够提高电子设备整体的强度和稳定性，并且，由于金属材质具有较为良好的导热性，通过金属中框本体110还可以提高电子设备的一些电气元件的散热性能。与此同时，采用金属中框本体110还能够在同等强度的情况下具有更小的厚度尺寸，有利于电子设备向轻薄方向发展。
应当理解，中框本体110还可以为硬质非金属材质，本申请实施例对中框本体110的材质不受限制。
中框本体110的一侧面形成有凹槽111，均热板120可以设置在凹槽111内，且均热板120与中框本体110相连，如此，中框本体110与均热板120共同组成一体式中框结构。均热板120主要起到散热的作用，通过中框本体110和均热板120共同组成的一体式的中框结构，能够提高电子设备的散热效率，保证电子设备在运行时保持在合理的温度范围内。
根据凹槽111与不同电气元件的位置关系，将凹槽111划分为第一区域1111和第二区域1112，当均热板120设置在凹槽111内并与中框本体110连接时，第一区域1111与主板200相对设置，第二区域1112与电池400相对设置。为了实现对电子设备的电气元件(如，主板200上的功率器件、电池400、摄像头模组600等)进行散热，将均热板120覆盖在第一区域1111和第二区域1112，使均热板120同时与主板200及电池400相对设置，由于主 板200及电池400均安装在中框本体110上，均热板120与主板200及电池400之间存在一定的接触关系，使得均热板120能够与主板200及电池400之间发生热量传递，从而达到对电子设备电气元件的散热效果。
本申请实施例中，均热板120设置在中框本体110的凹槽111内，并从主板200区域延伸至电池400区域，相比于相关技术中的散热方式，无形中增加了均热板120与电气元件之间的接触面积，在一定程度上提升了对电气元件的散热效率；并且，通常情况下中框本体110存在较大面积避空，将均热板120设置在凹槽111内并与中框本体110相连，使均热板120与中框本体110共同组成一整体的中框结构，既能够提高中框组件100的整体强度，又能够节省空间。因此，本申请实施例公开的电子设备具有较佳的散热效率和较高的强度，满足电子设更高的需求。
在一些可选地实施例中，凹槽111的至少部分内侧边缘形成有第一边沿112，第一边沿112用于在均热板120设置在凹槽111后对均热板120进行支撑，且均热板120与第一边沿112相连。具体地，在中框本体110的表面并位于凹槽111的边缘处朝向凹槽111的底端方向下沉一定距离，下沉后形成的端面即为第一边沿112。当均热板120设置在凹槽111内时，均热板120的边缘区域搭接在第一边沿112上，以此实现对均热板120的支撑。
应理解为，可以是凹槽111的全部边缘均形成有第一边沿112，还可以是凹槽111的部分边缘形成有第一边沿112，其余部分未形成有第一边沿112，具体方式可根据实际情况而选择。
进一步的，均热板120的至少部分外侧边缘形成有第二边沿125，当均热板120设置在凹槽111内时，均热板120边缘处的第二边沿125受到凹槽111边缘处的第一边沿112的支撑作用。为防止均热板120与中框本体110脱离，将第二边沿125与第一边沿112固定连接。例如，采用双面胶进行粘接，采用点胶的方式粘接，采用热熔胶进行粘接，采用焊接等方式。当然，第二边沿125与第一边沿112之间还可以采用其他能够使两者固定连接的任 何方式，本申请实施例对第二边沿125与第一边沿112之间的固定连接方式不受限制。
应理解为，可以是均热板120的全部边缘处形成有第二边沿125，还可以是均热板120的部分边缘形成第二边沿125，其余部分未形成有第二边沿125，具体方式可根据实际情况而选择。
另外，均热板120边缘处的第二边沿125通常与凹槽111边缘处的第一边沿112相匹配，以方便于均热板120与中框本体110的固定连接。
在一些可选地实施例中，均热板120包括第一盖板121、第二盖板122和毛细层123，第一盖板121与第二盖板122层叠设置，毛细层123夹设于第一盖板121和第二盖板122之间，且毛细层123与第一盖板121之间形成有蒸汽腔124。可选地，第一盖板121的边缘与第二盖板122的边缘通过焊接的方式实现连接，以提高均热板120整体的强度，保证均热板120的组成构件之间不易分离。
第二盖板122位于靠近于主板200和电池400的一侧，第一盖板121位于远离主板200和电池400的一侧。为了提高均热板120与主板200上的功率器件以及电池400之间的热量传递效率而达到更好地散热效果，在第二盖板122的朝向第一盖板121的一侧面设置第一槽体1211，毛细层123设置在第一槽体1211中，通过第一槽体1211的设置，在一定程度上减小了主板200及电池400与毛细层123之间的距离，有利于热量的传递。
为了能够使均热板120具有传热功能，在第二盖板122上的与第一盖板121相对的表面设置第二槽体1221，第二槽体1221的开口朝向毛细层123，如此，第二槽体1221和毛细层123共同围设成蒸汽腔124，蒸汽腔124用于盛装工作流体，且蒸汽腔124内具有一定的真空度，形成低真空度环境。
毛细层123可以是金属编织网或微沟槽，其中，金属编织网包括铜网、铝网或钛网；通过毛细层123能够将液体形式的工作流体从冷却端回流至蒸发端，以保证蒸发端具有足够的工作流体。应该理解为，毛细层123还可以 是其他任何具有疏导工作流体的结构，本申请实施例对于毛细层123的具体形式不作限定。
蒸汽腔124内盛装的工作流体包括水或颗粒悬浮物。
均热板120的具体工作原理为：
在使用过程中，主板200上的一些发热的功率器件或电池400将产生的热量传递给第一盖板121，此时，第一盖板121的与功率器件或电池400相接触的区域为受热端，也即，受热端为蒸发端；均热板120上用于将热量传递给其他结构的区域为冷却端，当热量由功率器件或电池400传递至受热端时，位于受热端处的工作流体会在低真空环境中发生液相汽化现象，转化为气体，而工作流体因相变现象可吸收并携带大量潜热并且提及迅速膨胀充满整个蒸汽腔124；而气体在冷却端遇冷发生凝结现象而转变为液体，凝结过程中会释放大量热量，并且，液态的工作流体则沿着毛细层123回流至蒸发端，上述过程循环进行，从而实现了对功率器件或电池400的散热。
请参见图4和图5，第一种形式的均热板120中，第一盖板121的各边缘分别向外延伸并凸出于第二盖板122对应的边缘，如此，在第一盖板121的各边缘处形成了第二边沿125，也即，第一盖板121的各边缘向外延伸出类似于翅膀的结构。当均热板120设置在中框本体110的凹槽111内时，第一盖板121各边缘的第二边沿125对应搭接在凹槽111边缘处的第一边沿112上，通过第一边沿112实现对第二边沿125的支撑。因此，通过第一边沿112与第二边沿125的相互配合，实现了对均热板120在电子设备的厚度方向上的定位。
基于上述第一种形式的均热板，第一盖板121的各边缘处的第二边沿125上开设有缺口1251，如，矩形缺口、弧形缺口、三角形缺口、梯形缺口等，相应的，在第一边沿112的侧壁上设置与缺口1251分别对应的凸起(图中未示出)，如此，当均热板120设置在中框本体110的凹槽111内时，第二边沿125处的缺口1251与第一边沿112处的凸起相配合，从而，通过缺口1251 与凸起的相互配合，实现了对均热板120在电子设备的长度方向和宽度方向上的定位。
上述形式的均热板120，通过在第一盖板121的各边缘设置第二边沿125，能够在与凹槽111的各边缘设置的第一边沿112相互搭接并相互固定，保证均热板120的背离中框本体110一侧的平整度，此种方式更适用于对平整度要求较高的电子设备。
请参见图6和图7，第二种形式的均热板120中，第二盖板122的各边缘分别向外延伸并凸出于第一盖板121，且第二盖板122的与第一盖板121相对的表面朝向背离第一盖板121的方向凹陷，从而在第二盖板122的与第一盖板121相对的表面形成了第三槽体1222，第一盖板121设置于第三槽体1222中，第三槽体1222的各边缘即为第二边沿125，也即，第三槽体1222的各边缘向外延伸出类似于翅膀的结构。当均热板120设置在中框本体110的凹槽111内时，第三槽体1222各边缘的第二边沿125对应搭接在凹槽111边缘处的第一边沿112上，因此，通过第一边沿112实现对第二边沿125的支撑，并且，通过第一边沿112与第二边沿125的相互配合，实现了对均热板120在电子设备的厚度方向上的定位。此处需要说明的是，第二槽体1221开设于第三槽体1222的底端面上。
进一步的，在第三槽体1222的各边缘处的第二边沿125上开设缺口1251，如，矩形缺口、弧形缺口、三角形缺口、梯形缺口等，相应的，在第一边沿112的侧壁上设置与缺口1251对应的凸起(图中未示出)。当均热板120设置在中框本体110的凹槽111中时，第二边沿125处的缺口1251与第一边沿112处的凸起相配合，从而，通过缺口1251与凸起的相互配合，实现了对均热板120在电子设备的长度方向和宽度方向上的定位。
上述形式的均热板120，通过在第三槽体1222的各边缘(或者，第二盖板122的各边缘)设置第二边沿125，能够在与凹槽111的各边缘设置的第一边沿112相互搭接并相互固定时，保证该电池400拉扯的可靠度，更适用 于采用大容量电池400的电子设备。
请参见图8至图10，第三种形式的均热板120中，由于中框本体110的凹槽111分为与主板200相对的第一区域1111以及与电池400相对的第二区域1112，均热板120覆盖第一区域1111和第二区域1112，从而，均热板120同样可划分为第三区域和第四区域，其中，第三区域与第一区域1111相对，第四区域与第二区域1112相对。
进一步的，均热板120的第三区域内，第一盖板121的各边缘以及第二盖板122的各边缘均未设置第二边沿125，使第一盖板121的各边缘与第二盖板122的各边缘分别对齐。均热板120的第四区域内，第一盖板121的各边缘分别向外延伸并凸出于第二盖板122，如此，在第一盖板121的位于第四区域内的各边缘处形成了第二边沿125，也即，第一盖板121的位于第四区域中的各边缘处向外延伸出类似于翅膀的结构。当均热板120设置在中框本体110的凹槽111内时，第一盖板121的位于第四区域内的各边缘处的第二边沿125对应搭接在凹槽111各边缘处的第一边沿112上，而均热板120的位于第三区域的部分则贴合于凹槽111的第一区域1111，从而，通过第一盖板121的位于第四区域内的各边缘处的第二边沿125与凹槽111边缘处对应的第一边沿112相互配合，以及第二盖板122的位于第三区域中的部分与凹槽111的第一区域1111相互配合，实现了对均热板120在电子设备的厚度方向上的定位。
进一步的，在第一盖板121的位于第四区域的各边缘处的第二边沿125上开设缺口1251，如，矩形缺口、弧形缺口、三角形缺口、梯形缺口等，相应的，在第一边沿112的侧壁上设置与缺口1251分别对应的凸起(图中未示出)。如此，当均热板120设置在中框本体110的凹槽111中时，第二边沿125处的缺口1251与第一边沿112处的凸起相配合，从而，通过缺口1251与凸起的相互配合，实现了对均热板120在电子设备的长度方向和宽度方向上的定位。
在其他实施例中，还可以不在第二边沿125上开设缺口1251，如，通过第二盖板122的位于第三区域的部分与凹槽111的第一区域1111相互配合，还能够实现对均热板120在电子设备的长度方向和宽度方向上的定位。
请参见图8、图9和图11，第四种形式的均热板120中，由于中框本体110的凹槽111分为与主板200相对的第一区域1111以及与电池400相对的第二区域1112，均热板120覆盖第一区域1111和第二区域1112，从而，均热板120同样可划分为第三区域和第四区域，其中，第三区域与第一区域1111相对，第四区域与第二区域1112相对。
进一步的，均热板120的第三区域内，第一盖板121的各边缘以及第二盖板122的各边缘均未设置第二边沿125，使第一盖板121的各边缘与第二盖板122的各边缘分别对齐。均热板120的第四区域内，第二盖板122的各边缘分别向外延伸并凸出于第一盖板121，如此，在第二盖板122的位于第四区域中的各边缘处形成了第二边沿125，也即，第二盖板122的位于第四区域中的各边缘处向外延伸出类似于翅膀的结构。当均热板120设置在中框本体110的凹槽111中时，第二盖板122的位于第四区域中的各边缘处的第二边沿125对应搭接在凹槽111各边缘处的第一边沿112上，均热板120的位于第三区域的部分则贴合于凹槽111的第一区域1111，也即，第二盖板122的位于第三区域的部分贴合于凹槽111的第一区域1111，从而，通过第二盖板122的位于第四区域中的各边缘处的第二边沿125与凹槽111边缘处对应的第一边沿112相互配合，以及第二盖板122的位于第三区域中的部分与凹槽111的第一区域1111相互配合，实现了对均热板120在电子设备的厚度方向上的定位。
进一步的，在第二盖板122的位于第四区域的各边缘处的第二边沿125上开设缺口1251，如，矩形缺口、弧形缺口、三角形缺口、梯形缺口等，相应的，在第一边沿112的侧壁上设置与缺口1251分别对应的凸起(图中未示出)。如此，当均热板120嵌设在中框本体110的凹槽111中时，第二边沿 125处的缺口1251与第一边沿112处的凸起相配合，从而，通过缺口1251与凸起的相互配合，实现了对均热板120在电子设备的长度方向和宽度方向上的定位。
在其他实施例中，还可以不在第二边沿125上开设缺口1251，如，通过第二盖板122的位于第三区域的部分与凹槽111的第一区域1111相互配合，还能够实现对均热板120在电子设备的长度方向和宽度方向上的定位。
针对上述第一种形式或第二种形式的均热板120，应理解为，第一盖板121各边缘的第二边沿125或第二盖板122各边缘的第二边沿125与凹槽111的各边缘的第一边沿112之间可以采用双面胶粘接、点胶粘接、热熔胶粘接或焊接等方式实现固定，从而，能够保证第一搭接边搭接沿与第二搭接边搭接沿之间固定连接的牢固性，进而保证均热板120与中框本体110之间固定连接的牢固性，在一定程度上提高了中框组件100整体的强度。
针对上述第三种形式的均热板120，应理解为，第一盖板121的位于第四区域的各边缘处的第二边沿125与位于第二区域1112的第一边沿112之间可以采用双面胶粘接、点胶粘接、热熔胶粘接或焊接等方式实现固定，从而保证第一边沿112与第二边沿125之间固定连接的牢固性；并且，第二盖板122的位于第三区域的表面与凹槽111的位于第一区域1111的底面贴合，并采用双面胶粘接或点胶粘接，从而保证第二盖板122的第三区域与凹槽111的第一区域1111之间固定连接的牢固性。因此，保证了均热板120与中框本体110之间固定连接的牢固性，在一定程度上提高了中框组件100整体的强度。
针对上述第四种形式的均热板120，应理解为，第二盖板122的位于第四区域的各边缘处的第二边沿125与位于第二区域1112的第一边沿112之间可以采用双面胶粘接、点胶粘接、热熔胶粘接或焊接等方式实现固定，从而保证第一边沿112与第二边沿125之间固定连接的牢固性；并且，第二盖板122的位于第三区域的表面与凹槽111的位于第一区域1111的底面贴合，并 采用双面胶粘接或点胶粘接，从而保证第二盖板122的第三区域与凹槽111的第一区域1111之间固定连接的牢固性。因此，保证了均热板120与中框本体110之间固定连接的牢固性，在一定程度上提高了中框组件100整体的强度。
在一些可选地实施例中，第一盖板121采用不锈钢或钛合金或铜合金；第二盖板122采用不锈钢或钛合金或铜合金，如此，保证了均热板120的整体强度，同时，使均热板120不易受到腐蚀。
第一盖板121和第二盖板122均通过蚀刻或冲压工艺制作而成，提高了制作效率，并保证加工精度。
由于第一盖板121与第二盖板122之间架设有毛细层123，且毛细层123与第一盖板121之间围设成蒸汽腔124。为了保证第一盖板121的内侧及第二盖板122的内侧不受蒸汽腔124内真空环境及工作流体的影响，在第一盖板121内层和第二盖板122的内层均设置镀层，具体可以是，铜镀层、镍镀层或金镀层，以保证第一盖板121的内层和第二盖板122内层不受损坏。
为了提升热量传递效率，可选地，将均热板120与主板200上的功率器件以及电池400相贴合，由此，将凹槽111的第一区域1111的局部掏空，如，将凹槽111第一区域1111中与摄像头模组600对应的位置掏空。当然，还可以将凹槽111第一区域1111中与其他功率器件对应的位置掏空，以便于均热板120的第三区域能够直接贴合于功率器件上。与此同时，将凹槽111的第二区域1112全部掏空，以使均热板120的第四区域能够直接与电池400贴合。因此，通过均热板120与主板200上的功率器件以及电池400贴合设置，保证了均热板120对功率器件及电池400上的热量进行高效吸收，并传递至其他区域，达到了良好的散热效果。
当然，凹槽111在第一区域1111处也可以全部贯通，此时，只要不影响主板200的安装即可。
本申请实施例中，为了进一步提升电子设备的散热效率，在均热板120 的背离中框本体110的一侧设置了PGS(Pyrolytic Graphite Sheet，PGS)导热板130，PGS导热板130的中部区域覆盖在均热板120上，边缘区域覆盖在中框本体110上，功率器件及电池400上的热量被均热板120吸收后，被传递给PGS导热板130，通过PGS导热板130传递至其他构件，从而，提升了热量传递效率，保证了电子设备具有良好的散热效果。
在一种具体地实施例中，PGS导热板130的中部区域粘接在均热板120上，边缘区域粘接在中框本体110上，从而，PGS导热板130、均热板120及中框本体110三者共同拼接组成一体的中框组件100。通过中框组件100既能够实现对主板200及电池400等结构的安装，又能够对一些功率器件及电池400进行散热。
进一步的，在凹槽111的第一区域1111内开设有用于穿设热源件的通孔1113，热源件包括摄像头模组、功率器件等。在一种具体地实施例中，热源件可以是摄像头模组600，在均热板120上设有避让空间126，也即，将均热板120上与摄像头模组600相对的区域切除，以使均热板120安装至中框本体110时，能够将摄像头模组600暴露出，从而，将PGS导热板130粘接在均热板120和中框本体110上时，PGS导热板130可以直接与摄像头模组600相贴合，从而，通过PGS导热板130直接为摄像头模组600传递热量，以对摄像头模组600进行散热。
此处需要说明的是，当空间允许时，还可以直接将均热板120覆盖在摄像头模组600上，以通过均热板120直接为摄像头模组600传递热量，从而对摄像头模组600进行散热，此时，在均热板120的背离中框本体110的侧面粘接PGS导热板130。当然，也可以不设置PGS导热板130，通过均热板120实现对摄像头模组600散热。当空间不允许时，可在均热板120上设置避让空间126，以使PGS导热板130直接覆盖摄像头模组600，从而实现对摄像头模组600散热。
本申请实施例公开的电子设备，还包括显示模组300和电池盖500，显 示模组300和电池盖500分别设置在中框组件100的两侧，通常情况下，显示模组300通过粘接的方式固定在中框组件100的一侧，电池盖500通过卡接固定的方式固定在中框组件100的另一侧。
电池盖500和中框组件100之间围设成内腔，主板200和电池400设置在内腔中，而主板200与电池400的相对位置不受限制。并且，主板200和电池400均连接在中框组件100上。如此，通过中框组件100既实现了对主板200和电池400的固定安装，又能够将主板200上的功率器件和电池400上的热量传递到其他位置，实现了对主板200上发热的功率器件和电池400的散热。
本申请实施例公开的电子设备可以是智能手机、平板电脑、电子书阅读器、可穿戴设备(如智能手表等)、游戏机等电子设备，本申请实施例并不限制电子设备的具体形式。
上面结合附图对本申请的实施例进行了描述，但是本申请并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本申请的启示下，在不脱离本申请宗旨和权利要求所保护的范围情况下，还可做出很多形式，均属于本申请的保护之内。

Claims (12)

  1. 一种电子设备，包括中框组件，所述中框组件包括中框本体和均热板，所述中框本体上设有凹槽，所述均热板设置于所述凹槽内并与所述中框本体连接，所述凹槽具有第一区域和第二区域，所述电子设备还包括主板和电池，所述第一区域与所述主板相对设置，所述第二区域与所述电池相对设置，所述均热板覆盖所述第一区域和所述第二区域。
  2. 根据权利要求1所述的电子设备，其中，所述凹槽的至少部分内侧边缘处形成有第一边沿，所述均热板的至少部分外侧边缘处形成有第二边沿，所述第二边沿能够与所述第一边沿搭接配合并相对固定。
  3. 根据权利要求2所述的电子设备，其中，所述均热板包括第一盖板、第二盖板和毛细层，所述第一盖板与所述第二盖板层叠设置并相连，所述毛细层夹设于第一盖板和第二盖板之间，所述毛细层与所述第一盖板之间形成有蒸汽腔。
  4. 根据权利要求3所述的电子设备，其中，所述第一盖板朝向述第二盖板的一侧面上设有第一槽体，所述第二盖板朝向所述第一盖板的一侧面上设有第二槽体，所述毛细层设置于所述第二槽体中，所述毛细层与所述第一槽体之间围设成所述蒸汽腔。
  5. 根据权利要求3所述的电子设备，其中，所述第一盖板的各边缘分别向外延伸并凸出于所述第二盖板，以形成所述第二边沿。
  6. 根据权利要求5所述的电子设备，其中，所述第一盖板的各所述第二边沿上分别开设有缺口。
  7. 根据权利要求3所述的电子设备，其中，所述第二盖板的一侧面上设有第三槽体，所述第一盖板设置于所述第三槽体中，所述第二盖板的各边缘分别向外延伸并凸出于所述第一盖板，以形成所述第二边沿。
  8. 根据权利要求7所述的电子设备，其中，所述第二盖板的各所述第二边沿上分别开设有缺口。
  9. 根据权利要求3所述的电子设备，其中，所述均热板具有第三区域和第四区域，所述第三区域与所述第一区域相对设置，所述第四区域与所述第二区域相对设置；
    位于所述第三区域内，所述第一盖板的各边缘与所述第二盖板的各边缘分别对齐设置；
    位于所述第四区域内，所述第一盖板的各边缘分别向外延伸并凸出于所述第二盖板，以形成所述第二边沿，或者所述第二盖板的一侧面上设有第三槽体，所述第一盖板设置于所述第三槽体中，所述第二盖板的各边缘分别向外延伸并凸出于所述第一盖板，以形成所述第二边沿。
  10. 根据权利要求9所述的电子设备，其中，位于所述第四区域内，所述第一盖板的各所述第二边沿上分别开设有缺口，或者所述第二盖板的各所述第二搭接上分别开设有缺口。
  11. 根据权利要求1-10中任意一项所述的电子设备，其中，所述电子设备还包括PGS导热板，所述PGS导热板覆盖于所述均热板的背离所述中框本体的一侧，所述PGS导热板与所述均热板及所述中框本体均连接。
  12. 根据权利要求11所述的电子设备，其中，所述电子设备还包括摄像头模组，所述中框本体的第一区域内开设有通孔，所述均热板上设有避让空间，所述摄像头模组穿设于所述通孔和所述避让空间，所述PGS导热板粘接于所述均热板和所述中框本体，且所述PGS导热板与所述摄像头模组贴合设置。
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