WO2022135176A1 - Casque à suppression de bruit sans fil - Google Patents

Casque à suppression de bruit sans fil Download PDF

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Publication number
WO2022135176A1
WO2022135176A1 PCT/CN2021/137036 CN2021137036W WO2022135176A1 WO 2022135176 A1 WO2022135176 A1 WO 2022135176A1 CN 2021137036 W CN2021137036 W CN 2021137036W WO 2022135176 A1 WO2022135176 A1 WO 2022135176A1
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WO
WIPO (PCT)
Prior art keywords
sound
ear
cavity
microphone
feed
Prior art date
Application number
PCT/CN2021/137036
Other languages
English (en)
Chinese (zh)
Inventor
鹿麟
许超
隋彦滨
卜键
Original Assignee
华为技术有限公司
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Publication date
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Publication of WO2022135176A1 publication Critical patent/WO2022135176A1/fr

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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/10Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1016Earpieces of the intra-aural type
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/08Mouthpieces; Microphones; Attachments therefor
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/10Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/10Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1058Manufacture or assembly
    • H04R1/1075Mountings of transducers in earphones or headphones
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/10Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1083Reduction of ambient noise
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • H04R19/005Electrostatic transducers using semiconductor materials
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • H04R19/02Loudspeakers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02Details
    • H04R9/04Construction, mounting, or centering of coil
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02Details
    • H04R9/04Construction, mounting, or centering of coil
    • H04R9/045Mounting
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06Loudspeakers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003Mems transducers or their use
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/10Details of earpieces, attachments therefor, earphones or monophonic headphones covered by H04R1/10 but not provided for in any of its subgroups
    • H04R2201/109Arrangements to adapt hands free headphones for use on both ears
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D30/00Reducing energy consumption in communication networks
    • Y02D30/70Reducing energy consumption in communication networks in wireless communication networks

Definitions

  • the present application relates to the technical field of earphones, and in particular, to a wireless noise-cancelling earphone.
  • TWS headphones are popular among consumers for their wireless, small size, and easy portability.
  • Active noise reduction has become a standard feature of high-end TWS earphone products, and at the same time, users' pursuit of the sound quality of TWS earphones is also increasing day by day. Active noise reduction is divided into single feed-forward microphone noise reduction, single feed-back microphone noise reduction and hybrid noise reduction.
  • the noise reduction method of the single feed-back microphone is clean, but the processing speed is slow; the noise reduction method of the single feed-forward microphone is fast, but difficult to clean; the hybrid noise reduction method combining the feed-forward microphone and the feed-back microphone combines the former two.
  • the hybrid noise reduction solution usually occupies a large amount of the internal space of the TWS earphone.
  • the TWS earphone which is very small in size, other hardware features may be sacrificed; or the ear bag of the TWS earphone may be enlarged, but This will reduce the wearing comfort of the headset.
  • An embodiment of the present application provides a wireless noise-cancelling earphone, including:
  • the ear enclosure has an accommodating cavity, and a moving coil is fixedly arranged in the accommodating cavity, and the moving coil divides the accommodating cavity into a front cavity and a rear cavity, and the ear cladding is provided with
  • a sound outlet communicated with the front cavity, a back-feed microphone and a high-frequency sounding unit are fixedly arranged in the front cavity, and the high-frequency sounding unit is a moving iron, a plane diaphragm or a MEMS horn;
  • An earmuff is connected to the earmuff, the earmuff has a cavity with two ends open, and a part of the earmuff extends into the cavity and is clamped with the earmuff, and the back feed a microphone and the high-frequency sound generating unit are located in the cavity of the earmuff;
  • the ear bar is connected to the back cavity of the ear enclosure, and a feed-forward microphone is arranged in the ear bar.
  • the volume of the ear pack is not increased, and the setting of other components in the ear pack is not affected. , thereby ensuring the small size of the wireless noise-cancelling earphone, and at the same time not affecting the contour of the ear shell, thereby ensuring the wearing comfort of the wireless noise-cancelling earphone.
  • the cooperation of the circle ensures the sound quality effect, and the mixed noise reduction of the feed-forward microphone and the feed-back microphone ensures the noise reduction effect.
  • a step is protruded on the inner wall of the accommodating cavity, the edge of the moving coil is arranged on the step, and an adhesive is arranged between the moving coil and the step to make the The moving coil is fixed on the step.
  • the moving coil is fixedly arranged in the accommodating cavity of the ear case, and the moving coil divides the inner space of the ear case into a front cavity and a back cavity isolated from each other, so as to ensure the audio frequency of the earphone. Effect.
  • the inner wall of the front cavity of the ear shell includes a first slope and a second slope, the first slope and the first slope
  • the two inclined surfaces are opposite to each other and are spaced from each other through the sound outlet, the first inclined surface and the second inclined surface form an included angle, and the first inclined surface and the second inclined surface form an angle along the sound outlet to the direction of the moving coil.
  • the distance between the slope and the second slope gradually increases, the high-frequency sounding unit is arranged on the first slope and is fixed on the first slope by an adhesive, and the back-feed microphone is arranged on the first slope.
  • the second inclined surface is fixed on the second inclined surface by an adhesive.
  • the moving iron/planar diaphragm and the feed-back microphone respectively by arranging the first inclined plane and the second inclined plane in the shape of "eight" in the limited inner space of the ear shell, it not only does not increase the The volume of the large ear bag does not affect the setting of other components in the ear bag, thereby ensuring the small size of the wireless noise-cancelling earphone, and at the same time, it does not affect the outline of the ear bag, thereby ensuring the wireless noise-cancelling earphone. Wearing comfort.
  • the high-frequency sound generating unit and the feed-back microphone are relatively spaced apart and arranged in a "eight" shape.
  • the second inclined surface is provided with a sound pickup hole penetrating the ear enclosure.
  • the feed-back microphone is arranged on the second inclined surface, a sound pickup hole needs to be opened on the second inclined surface to facilitate the pickup of sound by the feed-back microphone.
  • the outer surface of the ear cover is provided with two oppositely arranged snap grooves
  • the cavity of the ear cover is provided with a pair of snap buttons matched with the two snap grooves
  • the The clip is held in the clip slot, so that the ear case and the earmuff are held together.
  • the material of the buckle can be different from the material of the earmuff, and it can be formed on the earmuff by an integral molding process, and the buckle is set In the cavity of the earmuff, the earmuff will not be affected, and thus the wearing comfort of the earphone will not be affected.
  • the sound outlet includes a first part located between the first inclined surface and the second inclined surface and a second part that crosses and communicates with the first part, and the first part is used for the high
  • the second part is used for the sound of the moving coil.
  • the design of the sound outlet takes into account the sound output of the high-frequency sound-emitting unit (moving iron or plane diaphragm) and the moving coil, so that the earphone has a good sound quality effect.
  • the high-frequency sounding unit is a MEMS speaker
  • a circuit board is fixedly arranged in the front cavity, and the circuit board has a first surface close to the sound outlet and a first surface away from the sound outlet.
  • the second surface of the mouth, the MEMS horn is arranged on the first surface, and the feed-back microphone is arranged on the second surface.
  • the volume of the ear pack is not increased, and the arrangement of other components in the ear pack is not affected. , so as to ensure the small size of the wireless noise-cancelling earphone, and at the same time, the outline of the ear case is not affected, thereby ensuring the wearing comfort of the wireless noise-cancelling earphone.
  • the first surface of the circuit board is provided with a vent groove and a sound pickup groove spaced apart from each other, and the MEMS speaker partially covers the vent groove and the sound pickup groove; the vent groove and the sound pickup groove are partially covered.
  • the sound pickup grooves run through opposite sides of the circuit board.
  • the MEMS horn Being covered by the MEMS horn will not affect the communication between the air vent groove and the sound pickup groove and the outside, and the air vent groove is used to ensure the pressure balance between the two opposite surfaces of the circuit board.
  • the bottom wall of the sound pickup groove is further provided with a sound pickup hole penetrating the circuit board.
  • the back-feed microphone is disposed on the second surface of the circuit board, sound pickup holes are provided on the circuit board to facilitate sound pickup by the back-feed microphone.
  • the second surface is further provided with a pad adjacent to the back-feed microphone, and the pad is connected to the flexible circuit board.
  • Signal transmission is achieved by connecting the raised board to the flexible circuit board, and the flexible circuit board is then connected to other components, such as a main chip, a battery, and the like.
  • limit steps are protruded on the inner wall of the front cavity, the limit steps limit and support opposite ends of the circuit board, and there is a gap between the limit steps and the circuit board.
  • Adhesive is provided to fix the circuit board on the limiting step.
  • the circuit board is fixedly arranged in the front cavity through a limit step and an adhesive, so that the MEMS speaker and the feed-back microphone are conveniently arranged through the circuit board.
  • the sound outlet includes a first part and a second part that is in cross communication with the first part, the MEMS horn is located in the first part and is exposed relative to the ear enclosure, the first part The second part is used for the sound of the MEMS speaker, and the second part is used for the sound of the moving coil.
  • the design of the sound outlet takes into account the sound of the MEMS speaker and the moving coil, so that the earphone has a good sound quality effect.
  • the ear enclosure includes a main body and a sound outlet connected to one side of the main body, the sound outlet is a hollow cylindrical shape, and a sound outlet is formed inside the sound outlet,
  • the sound outlet channel is at least a part of the front cavity, the sound outlet port is opened on the side of the sound outlet mouth away from the main body part and is connected to the sound outlet channel, and the sound outlet mouth is accommodated in the sound outlet.
  • the MEMS speaker, the circuit board and the back-feed microphone are stacked in sequence in the sound output channel.
  • the MEMS speaker, the circuit board and the feed-back microphone are sequentially stacked in the sound outlet channel of the sound outlet, and the sound outlet is accommodated in the sound outlet.
  • the settings of other components in the ear case are not affected, thereby ensuring the compact size and wearing comfort of the wireless noise-cancelling earphones.
  • a snap ring surrounding the sound mouth is protruded from the outside of the sound outlet, and a snap groove matched with the snap ring is arranged in the cavity of the earmuff.
  • the ring is clamped in the clamping slot, so that the sound outlet and the earmuff are clamped.
  • the high-frequency sounding unit when the high-frequency sounding unit is a moving iron or a flat diaphragm, the high-frequency sounding unit and the back-feed microphone are respectively fixed on the inner wall of the front cavity by an adhesive;
  • the high-frequency sound-generating unit and the back-feed microphone are arranged in parallel and spaced apart, and each of the high-frequency sound-generating unit and the back-feed microphone has opposite ends along the respective long axis directions, one of which is far away from the sound outlet , one end of which is close to the sound outlet.
  • the high-frequency sound-generating unit moving iron or plane diaphragm
  • the back-feed microphone in the limited inner space of the ear case, not only does the volume of the ear case not increase, but also does not affect other parts of the ear case.
  • the arrangement of the components ensures that the wireless noise-cancelling earphone is small in size, and at the same time does not affect the contour of the ear shell, thereby ensuring the wearing comfort of the wireless noise-cancelling earphone.
  • FIG. 1 is a schematic perspective view of a wireless noise-cancelling earphone of the present application.
  • FIG. 2 is a partial exploded view of the wireless noise-cancelling earphone according to the first embodiment of the present application.
  • FIG. 3 is a schematic cross-sectional structural diagram of the wireless noise-cancelling earphone according to the first embodiment of the present application.
  • FIG. 4 is a schematic cross-sectional structural diagram of an earmuff and an ear case of the wireless noise-cancelling earphone according to the first embodiment of the present application.
  • FIG. 5 is a schematic cross-sectional structural diagram of the ear enclosure of the wireless noise-cancelling earphone according to the first embodiment of the present application.
  • FIG. 6 is a schematic three-dimensional view of an ear enclosure of the wireless noise-cancelling earphone according to the first embodiment of the present application.
  • FIG. 7 is a schematic perspective view of an earmuff of a wireless noise-cancelling earphone according to a first embodiment of the present application.
  • FIG. 8 is a schematic cross-sectional view of a wireless noise-cancelling earphone according to a modified embodiment of the first embodiment.
  • FIG. 9 is a partial exploded view of the wireless noise-cancelling earphone according to the second embodiment of the present application.
  • FIG. 10 is an exploded view from another angle of the wireless noise-cancelling earphone according to the second embodiment of the present application.
  • FIG. 11 is a schematic cross-sectional structural diagram of a wireless noise-cancelling earphone according to a second embodiment of the present application.
  • FIG. 12 is a schematic perspective view of an ear enclosure of a wireless noise-cancelling earphone according to a second embodiment of the present application.
  • FIG. 13 is an exploded view of a Micro-Electro-Mechanical Systems (MEMS) speaker and a feed-back microphone of the wireless noise-cancelling earphone according to the second embodiment of the present application.
  • MEMS Micro-Electro-Mechanical Systems
  • FIG. 14 is a schematic diagram 1 of the processing/assembly process of the MEMS speaker and the feed-back microphone of the wireless noise-cancelling earphone according to the second embodiment of the present application.
  • FIG. 15 is a second schematic diagram of the process/assembly process of the MEMS speaker and the feed-back microphone of the wireless noise-cancelling earphone according to the second embodiment of the present application.
  • Wireless Noise Cancelling Headphones 100a, 100b ear bag 10 earmuffs 50 ear bar 70 Feed forward microphone 71 through hole 73 ear shell 11 accommodating cavity 101 feed back mic 30 moving coil 20 moving iron 40 anterior cavity 102 sound outlet 103 back cavity 104 cavity 51 steps 13 first slope 12
  • the wireless noise-cancelling earphone 100 a includes an ear bag 10 , an earmuff 50 and an ear bar 70 connected to the ear bag 10 .
  • the earmuffs 50 and the ear bars 70 are generally located on opposite sides of the earbag 10 .
  • the earmuff 50 extends into the user's ear and directly contacts the user's ear.
  • Various components are provided in the ear bag 10 , for example, a high-frequency and/or low-frequency sounding unit, a feed-back microphone, a battery, a flexible circuit board, and the like.
  • Wireless earphones are usually very small. It is the focus of research and development of high-end wireless earphone products to ensure the active noise reduction function while improving the sound quality in a limited volume.
  • the wireless noise-cancelling earphone of the present application is mainly improved for the ear bag 10 , and the sound quality and noise reduction effect of the earphone are ensured without increasing the volume of the ear bag 10 .
  • the ear bar 70 is provided with a feed-forward microphone 71 and a main board (not shown), etc.
  • the feed-forward microphone 71 can be arranged on the main board.
  • the ear bar 70 is exposed outside the user's ear, and the feedforward microphone 71 is used to reduce noise outside the ear.
  • the ear bar 70 is generally in the shape of a rectangular block, and at least one through hole 73 is opened on the ear bar 70 to communicate with the inside of the ear bar 70 , and the through hole 73 can be used for the pickup of the feedforward microphone 71 . sound hole.
  • the number of the through holes 73 is multiple, and the multiple through holes 73 are arranged at intervals and arranged in a row along the extending direction of the long axis of the ear bar 70 . It can be understood that the ear bar 70 is also provided with another row of through holes 73 (not shown), and the two rows of through holes 73 are located on opposite sides of the ear bar 70; the two rows of through holes 73 can be used for Reduce wind noise.
  • the ear bag 10 includes an ear bag shell 11 having a accommodating cavity 101 , and FIG. 2 only shows a part of the ear bag shell 11 and does not show the ear rod 70 .
  • the accommodating cavity 101 is provided with at least a high-frequency sounding unit, a low-frequency sounding unit and a feed-back microphone 30 .
  • the low-frequency sounding unit is a moving coil 20
  • the high-frequency sounding unit is a moving iron 40 .
  • the moving coil 20 is fixedly disposed in the accommodating cavity 101 and divides the accommodating cavity 101 into a front cavity 102 and a rear cavity 104 .
  • the ear bar 70 is connected to the rear cavity 104 of the ear enclosure 11 .
  • the ear enclosure 11 is provided with a sound outlet 103 that communicates with the front cavity 102 , and the feed-back microphone 30 and the moving iron 40 are fixedly arranged in the front cavity 102 .
  • the earmuff 50 is generally hat-shaped and has a cavity 51 with two ends open. A part of the ear case 11 extends into the cavity 51 and is clamped with the earmuff 50.
  • the earmuff The front cavity 102 of the shell 11 is located at least partially in the cavity 51 of the earmuff 50 . Both the feed-back microphone 30 and the moving iron 40 are located in the cavity 51 of the earmuff 50 . In one embodiment, the outer diameter of the earmuff 50 gradually increases in the direction of gradually approaching the ear shell 11 .
  • the rear cavity 104 is provided with a battery (not shown) and the like.
  • the sound quality of the earphone usually depends on the sound unit in the earphone.
  • the low frequency sound of the moving coil 20 is better, but the high frequency is average; the low frequency sound of the moving iron 40 is average, but the high frequency sound is outstanding.
  • the wireless noise reduction earphone 100a ensures good sound quality through the combination of a high-frequency sounding unit and a low-frequency sounding unit.
  • the working principle of the moving iron 40 is that a connecting rod (not shown in the figure) with a built-in precise structure is conducted to the center point of the micro-diaphragm (not shown), so that the micro-diaphragm vibrates and makes sound.
  • the feed-back microphone 30 is generally located in the user's ear, so as to reduce the noise in the ear.
  • the back-feed microphone 30 in the ear enclosure 11 and the feed-forward microphone 71 in the ear bar 70 cooperate to reduce noise, which ensures the noise reduction effect of the wireless noise reduction earphone 100a.
  • a step 13 is protruded on the inner wall of the accommodating cavity 101 , the edge of the moving coil 20 is set on the step 13 , and the moving coil 20 is connected to the step 13 .
  • Adhesive (not shown) is arranged therebetween to fix the moving coil 20 on the step 13 .
  • the step 13 extends in a circle along the inner wall of the accommodating cavity 101 .
  • the moving ring 20 is limited on the step 13, and an adhesive needs to be arranged between the inner wall of the ear shell 11 and the moving ring 20 to achieve a sealing effect, so as to ensure that the front cavity 102 and the moving ring 20 are sealed.
  • the back chambers 104 are completely isolated/disconnected from each other.
  • the inner wall of the front cavity 102 of the ear shell 11 includes a first inclined surface 12 and a second inclined surface 14 extending toward the earmuff 50 .
  • the two inclined surfaces 14 are opposed to each other and are spaced apart from each other by the sound outlet 103 , and between the first inclined surface 12 and the second inclined surface 14 along the direction of the sound outlet 103 toward the moving coil 20 The distance gradually increases; the first inclined surface 12 and the second inclined surface 14 form an included angle (less than 180 degrees). That is, the first inclined surface 12 and the second inclined surface 14 are arranged in an "eight" shape.
  • the moving iron 40 is arranged on the first inclined surface 12 and fixed on the first inclined surface 12 by an adhesive (not shown in the figure).
  • the peripheral edge for example, the moving iron 40 is firstly bonded to the first inclined surface 12 by adhesive, and then fixed and sealed around it by dispensing.
  • the back-feed microphone 30 is disposed on the second inclined surface 14 and fixed on the second inclined surface 14 by an adhesive (not shown in the figure). The location of the adhesive can be on the second inclined surface 14 and the back-feed microphone
  • the peripheral edge of 30, for example, the back-feed microphone 30 is firstly bonded to the second inclined surface 14 by adhesive, and then fixed and sealed around it by dispensing. In this way, the moving iron 40 and the feed-back microphone 30 are relatively spaced apart and arranged in an "eight" shape.
  • the second inclined surface 14 on which the feed-back microphone 30 is provided is provided with a sound-picking hole 15 penetrating the ear enclosure 11, so as to facilitate the pickup of the feed-back microphone 30.
  • the sound outlet 103 includes a first part 103a located between the first inclined surface 12 and the second inclined surface 14 and a first part 103a that communicates with the first part 103a and intersects the first part 103a Two parts 103b.
  • the sound outlet 103 is roughly in the shape of an "I", and there are two second portions 103b, and the two second portions 103b are connected to opposite sides of the first portion 103a.
  • the first part 103 a is mainly used for the sound of the moving iron 40
  • the second part 103 b is mainly used for the sound of the moving coil 20 .
  • the ear case 11 includes a main body 111 and a sound outlet 113 connected to one side of the main body 111 .
  • the sound outlet 113 is a hollow cylinder, and the outlet The sound port 103 is opened on the side of the sound outlet 113 away from the main body portion 111 .
  • the inner cavity of the mouthpiece 113 is at least a part of the front cavity 102 .
  • the sound outlet 113 is completely accommodated in the cavity 51 of the earmuff 50
  • the main body 111 is partially accommodated in the cavity 51 of the earmuff 50 .
  • the outer surface of the ear shell 11 is provided with two oppositely arranged card slots 115 , specifically, the main body portion 111 is provided with two card slots 115 at the position close to the sound outlet 113 ; Due to the angle, only one card slot 115 is shown in FIG. 6 .
  • the two clamping grooves 115 are arranged opposite to each other and avoid the positions of the first inclined surface 12 and the second inclined surface 14. This semi-enclosed clamping method can ensure the overall strength of the ear shell 11, and will not The opening of the slot 115 causes the partial thickness of the ear shell 11 to be too thin.
  • the cavity 51 of the earmuff 50 is provided with a pair of buckles 53 arranged opposite to each other.
  • the buckles 53 are matched with the two card slots 115 and are held in the card slots. 115 , so that the ear case 11 and the earmuff 50 are clamped.
  • a vent hole 116 extending through the ear shell 11 is also formed on the groove wall of the card slot 115 , which is used to maintain the pressure balance between the front cavity 102 and the outside. When the clip 53 is held in the slot 115 , the vent hole 116 is not blocked by the clip 53 .
  • the earmuffs 50 are made of elastic/flexible materials, generally elastic rubber materials such as silicone.
  • the material of the buckle 53 may be different from the material of the earmuff 50 , and may be a general non-elastic/inflexible plastic, which may be formed on the earmuff 50 by an integral molding process. Since the buckle 53 is arranged in the cavity 51 of the earmuff 50, the earmuff 50 will not be affected, and thus the wearing comfort will not be affected.
  • the second inclined surface 14 is further connected with a blocking wall 16 extending toward the moving coil 20 , and the second inclined surface 14 cooperates with the blocking wall 16 to better limit the position
  • the back-feed microphone 30 prevents the back-feed microphone 30 from slipping off the second inclined surface 14 .
  • the first inclined surface 12 is not connected with a blocking wall to avoid blocking the moving iron 40 and affecting the sound of the moving iron 40, so that the sound region of the moving iron 40 is exposed relative to the sound outlet 103, It is convenient for the moving iron 40 to make a sound.
  • the movable iron 40 and the back-feed microphone are respectively arranged by setting the first inclined surface 12 and the second inclined surface 14 in the shape of "eight" in the limited inner space of the ear shell 11 , respectively.
  • 30, not only does not increase the volume of the ear bag 10, but also does not affect the setting of other components in the ear bag shell 11, thereby ensuring the small size of the wireless noise reduction earphone 100a, and at the same time does not affect the contour of the ear bag shell 11, thereby
  • the wearing comfort of the wireless noise reduction earphone 100a is ensured, and the sound quality effect is ensured by the cooperation of the moving iron 40 and the moving coil 20, and the noise reduction effect is ensured by the mixed noise reduction of the feed-forward microphone 71 and the feed-back microphone 30.
  • the moving iron 40 and the feed-back microphone 30 are not limited to be limited and fixed by the first inclined surface 12 and the second inclined surface 14 .
  • the inner wall of the front cavity 102 is not provided with the first inclined surface 12 and the second inclined surface 14 , but the long axis direction of the moving iron 40 and the back-feed microphone 30 is arranged along the Set parallel to the central axis of the earmuff 50 (place horizontally), at this time, the moving iron 40 and the back-feed microphone 30 are parallel and spaced apart; the moving iron 40 and the back-feed microphone 30
  • Each of the two ends has opposite ends along the respective long axis directions, one of which is far away from the sound outlet 103, and one of which is close to the sound outlet 103; and the moving iron 40 and the back-feed microphone 30 pass through respectively.
  • Adhesive (not shown) is fixed on the inner wall of the front cavity 102 .
  • the length of the sound outlet 113 extending toward the earmuff 50 in the embodiment shown in FIG. 8 is greater than FIG. 2 shows the extension length of the mouthpiece 113 of the first embodiment.
  • the moving iron 40 in the wireless noise-cancelling earphone 100a of the first embodiment and the earphone of the modified embodiment of FIG. 8 can be replaced with a plane diaphragm as a high-frequency sounding unit.
  • the flat diaphragm is driven by magnetic force like the moving coil, but its voice coil is not rolled into a circle like a moving coil, but spread on a flat diaphragm.
  • FIGS. 9 to 12 Please refer to the wireless noise-cancelling earphone 100b according to Embodiment 2 of the present application shown in FIGS. 9 to 12 . Only a part of the ear enclosure 11 is shown in FIGS. 9 to 10 .
  • the wireless noise-cancelling earphone 100b of the second embodiment is basically the same as the wireless noise-cancelling earphone 100a of the first embodiment.
  • it also includes an ear bag 10, an earmuff 50 and an ear bar 70 connected to the ear bag 10, and the The ear bar 70 is also provided with a feed-forward microphone 71; in addition, a moving coil 20 as a low-frequency sounding unit is also fixed in the accommodating cavity 101 of the ear shell 11 (the fixing method is the same as that of the first embodiment).
  • the 20 also divides the accommodating cavity 101 into a front cavity 102 and a rear cavity 104 that are not communicated with each other; the part of the ear envelope 11 extends into the cavity 51 of the earmuff 50 and is in contact with the earmuff 50.
  • the front cavity 102 is fixedly provided with a feed-back microphone 30 and a high-frequency sound generating unit; the feed-back microphone 30 and the high-frequency sound generating unit are located in the cavity 51 of the earmuff 50 .
  • the difference between the wireless noise-cancelling earphone 100b of the second embodiment and the wireless noise-cancelling earphone 100a of the first embodiment is that the setting methods of the back-feed microphone 30 and the high-frequency sounding unit of the wireless noise-cancelling earphone 100b of the second embodiment are different, and the The high-frequency sounding unit is a MEMS speaker 80 .
  • a circuit board 60 is fixed in the front cavity 102 , the circuit board 60 is placed vertically, and the opposite ends along the long axis of the circuit board 60 are respectively connected with the front cavity 102 .
  • the circuit board 60 has a first surface 601 close to the sound outlet 103 and a second surface 603 away from the sound outlet 103 .
  • the MEMS speaker 80 is disposed on the first surface 601 , and the feed-back The microphone 30 is arranged on the second surface 603 .
  • the MEMS speaker 80 , the circuit board 60 and the feed-back microphone 30 are vertically disposed in the front cavity 102 in a direction gradually away from the earmuff 50 .
  • the wireless noise reduction earphone 100b uses a combination of a high-frequency sounding unit (MEMS speaker 80 ) and a low-frequency sounding unit (moving coil 20 ) to ensure good sound quality;
  • the microphone 30 and the feedforward microphone 71 in the ear bar 70 cooperate with each other to reduce noise, which ensures the noise reduction effect of the wireless noise reduction earphone 100b.
  • limiting steps 17 are protruded on the inner wall of the front cavity 102 . Due to the angle, only one limiting step 17 can be seen in FIG. 10 .
  • the limiting steps 17 limit and support both ends of the circuit board 60 , and an adhesive (not shown) is also provided between the limiting steps 17 and the circuit board 60 to fix the circuit board 60 on the limiting step 17 .
  • the first surface 601 of the circuit board 60 is provided with a vent groove 602 and a sound pickup groove 604 spaced apart from each other, and the MEMS horn 80 partially covers the vent groove 602 and the sound pickup groove 604 .
  • Both the air vent groove 602 and the sound pickup groove 604 run through opposite sides of the circuit board 60 , so even if the MEMS speaker 80 is covered, the air vent groove 602 and the sound pickup groove 604 will not be affected communication with the outside.
  • the air vent groove 602 is used to ensure the pressure balance between the opposite first surface 601 and the second surface 603 of the circuit board 60 .
  • the bottom wall of the sound pickup slot 604 is also provided with a pickup hole 15 penetrating the circuit board 60 .
  • the second surface 603 is also provided with a pad 62 adjacent to the back-feed microphone 30 , the pad 62 is connected to the flexible circuit board 64 , and the pad 62 communicates with the flexible circuit board through the pad 62 . 64 connected to achieve the transmission of the signal.
  • the flexible circuit board 64 can be respectively electrically connected to the MEMS speaker 80 , the feed-back microphone 30 , and the moving coil 20 , and then extends into the back cavity 104 to be connected to a main chip, a battery, and the like.
  • the flexible circuit board 64 can enter the rear cavity 104 by passing between the moving coil 20 and the inner wall of the ear shell 11 , so as not to affect the disconnection between the front cavity 102 and the rear cavity 104 .
  • Both the first surface 601 and the second surface 603 are pre-configured with solder fillets 65 to connect with the MEMS speaker 80 and the feed-back microphone 30 respectively.
  • the ear enclosure 11 includes a main body portion 111 and a sound outlet 113 connected to one side of the main body portion 111 , the sound outlet 113 is a hollow cylinder, and the sound outlet 103 It is opened on the side of the mouthpiece 113 away from the main body 111 .
  • the sound outlet 113 is completely accommodated in the cavity 51 of the earmuff 50 .
  • a sound outlet channel is formed inside the sound outlet mouth 113 and communicated with the sound outlet port 103 , and the sound outlet channel is at least a part of the front cavity 102 .
  • the MEMS speaker 80 , the circuit board 60 and the feed-back microphone 30 are vertically arranged in the sound output channel in sequence.
  • the limiting step 17 is arranged in the sound outlet channel of the sound outlet mouth 113 .
  • a snap ring 114 is protruded from the outside of the sound outlet 113 , and the snap ring 114 surrounds the sound outlet 113 ; as shown in FIG. 10 , the cavity 51 of the earmuff 50 There is a card slot 115 matched with the snap ring 114 , and the snap ring 114 is locked in the card slot 115 , so that the sound outlet 113 and the earmuff 50 are locked.
  • the sound outlet 103 includes a first portion 103a and a second portion 103b that communicates with the first portion 103a and intersects with the first portion 103a, and the MEMS horn 80 is located in the first portion 103a and The first part 103 a is used for the sound output of the MEMS speaker 80 , and the second part 103 b is used for the sound output of the moving coil 20 .
  • the MEMS horn 80 includes a plurality of cantilevers (not shown) made of piezoelectric materials, a piston (not shown) and a vibrating membrane (not shown); the working principle of the MEMS horn 80 is that the cantilever is generated when power is applied Extending and contracting, this pushes the piston up and down, and the piston pushes the diaphragm to vibrate, producing sound.
  • the diaphragm of the MEMS speaker 80 is exposed from the sound outlet 103 .
  • the processing method includes:
  • a vent groove 602 and a sound pickup groove 604 are provided on a surface of the initial circuit board at intervals, and the way of opening the groove can be controlled by a computer numerical control machine tool (Computer numerical control, CNC);
  • a sound pickup hole 15 is formed on the bottom wall of the sound pickup groove 604, which penetrates the initial circuit board. At this time, the processing of the circuit board 60 is completed, and the initial circuit board forms the circuit board 60;
  • the MEMS speaker 80 is mounted on the surface of the circuit board 60 on which the air vent groove 602 and the sound pickup groove 604 are formed, and the air vent groove 602 and the sound pickup groove 604 are partially covered;
  • a portion of the riser board 62 is attached to the flexible circuit board 64 .
  • the outer dimensions of the initial circuit board 60 are matched with the inner wall of the front cavity 102, so that both ends of the circuit board 60 can overlap on the two limiting steps 17; the initial circuit board 60 has internal wiring, and the front and back are reserved for solder feet 65.
  • the diameter of the sound pickup hole 15 is preferably 0.85mm.
  • the flexible circuit board 64 is used to connect other components, such as a main chip, a battery, and the like.
  • the MEMS speaker 80 and the feed-back microphone 30 are arranged on the opposite sides of the circuit board 60 and in the sound outlet 113 in the limited inner space of the ear enclosure 11 , not only does Increasing the volume of the ear bag 10 does not affect the setting of other components in the ear bag shell 11, thereby ensuring that the wireless noise reduction earphone 100b is small in size and does not affect the outline of the ear bag 10, thereby ensuring the wireless noise reduction.
  • the wearing comfort of the noise earphone 100a is improved.
  • the sound quality effect is ensured by the cooperation of the MEMS speaker 80 and the moving coil 20, and the noise reduction effect is ensured by the mixed noise reduction of the feed-forward microphone 71 and the feed-back microphone 30.
  • a dust filter (not shown in the figure) may also be provided in the earmuff 50 to prevent external dust and other impurities from entering the earmuff 10 through the earmuff 50 .

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Headphones And Earphones (AREA)

Abstract

L'invention concerne un casque à suppression de bruit sans fil, comprenant : un boîtier de protection d'oreille, le boîtier de protection d'oreille étant pourvu d'une cavité de réception, un dispositif d'entraînement dynamique est disposé de manière fixe dans la cavité de réception, et divise la cavité de réception en une cavité avant et une cavité arrière, le boîtier de protection d'oreille est pourvu d'une sortie sonore en communication avec la cavité avant, un microphone de rétroaction et une unité de production sonore haute fréquence sont agencés de manière fixe dans la cavité avant, et l'unité de production sonore haute fréquence est un haut-parleur à armature équilibrée, un haut-parleur magnétique planaire, ou un haut-parleur MEMS ; un protège-oreilles, qui est relié au boîtier de protection de l'oreille et qui est pourvu d'une cavité ayant des ouvertures à deux extrémités, une partie du boîtier de protection d'oreille s'étendant dans la cavité et étant en prise avec la protection d'oreille, et le microphone de rétroaction et l'unité de production sonore haute fréquence sont situés dans la cavité de la protection d'oreille ; et une tige d'oreille, qui est reliée à la cavité arrière du boîtier de protection d'oreille, un microphone à action directe étant disposé dans la tige d'oreille. Le casque à suppression de bruit sans fil a une petite taille, est confortable à porter, et a une bonne qualité tonale et un bon effet d'annulation de bruit.
PCT/CN2021/137036 2020-12-23 2021-12-10 Casque à suppression de bruit sans fil WO2022135176A1 (fr)

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CN202011546013.0A CN114666696B (zh) 2020-12-23 2020-12-23 无线降噪耳机
CN202011546013.0 2020-12-23

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US20220167100A1 (en) * 2020-08-11 2022-05-26 Bose Corporation Earpieces

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