WO2022143279A1 - Écouteur - Google Patents

Écouteur Download PDF

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Publication number
WO2022143279A1
WO2022143279A1 PCT/CN2021/139887 CN2021139887W WO2022143279A1 WO 2022143279 A1 WO2022143279 A1 WO 2022143279A1 CN 2021139887 W CN2021139887 W CN 2021139887W WO 2022143279 A1 WO2022143279 A1 WO 2022143279A1
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WO
WIPO (PCT)
Prior art keywords
bracket
earphone
circuit board
area
hole
Prior art date
Application number
PCT/CN2021/139887
Other languages
English (en)
Chinese (zh)
Inventor
任二贝
徐灏文
单海波
胡世艳
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2022143279A1 publication Critical patent/WO2022143279A1/fr

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1058—Manufacture or assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones

Definitions

  • the present application relates to the field of communication technologies, and in particular, to an earphone.
  • ANC active noise control
  • the ANC algorithm is closely related to the structure of the back cavity of the earphone.
  • Traditional earphones usually use the space between the speaker and the mainboard of the earphone to form a back cavity. It is difficult to guarantee the consistency of the volume of the back cavity with such a design, which will affect the consistency of the audio frequency response of the earphones and the consistency between individual earphones.
  • earphones with a non-independent rear cavity design often need to achieve board-level protection through a single-board coating process, which is not only complicated, but also requires high costs.
  • the present application provides an earphone, so as to improve the consistency of the volume of the back cavity of the earphone, and in addition, the manufacturing process of the earphone can be simplified.
  • the present application provides an earphone
  • the earphone may include a shell, a speaker, a bracket, a circuit board and a sealing member, wherein the speaker, the bracket, the circuit board and the sealing member are all arranged in the outer shell.
  • the casing may be provided with a sound outlet, and the sound outlet may communicate with the inside and the outside of the casing, so as to output the audio signal played by the earphone to the outside.
  • One side of the speaker is disposed toward the sound outlet, and a front cavity of the earphone can be formed between the side of the speaker and the inner wall of the casing.
  • the bracket is located on the side of the speaker facing away from the sound outlet, the outer periphery of the bracket is connected with the inner wall of the shell, and the bracket, the speaker and the inner wall of the shell can form the back cavity of the earphone.
  • the bracket is also provided with a through hole, and the through hole can penetrate from the side of the bracket facing the speaker to the side of the bracket facing away from the speaker.
  • the circuit board is located on the side of the bracket facing away from the speaker, the circuit board has a first surface disposed toward the bracket, and the first surface can be provided with a plurality of components.
  • the first surface of the circuit board may include a first area and a second area, the first area is opposite to the aforementioned through hole, and among the plurality of components arranged on the first surface, at least one of the components located in the first area is located in the first area.
  • One component can extend into the through hole, and the component in the second area is located between the bracket and the circuit board.
  • the sealing member is arranged around the components in the first area, and the sealing member can be sealed and connected with the bracket and the first surface of the circuit board respectively.
  • the bracket, the speaker and the inner wall of the shell can be surrounded to form an independent rear cavity, which can not only achieve a stable rear cavity volume, improve the consistency between individual headphones, but also avoid the circuit board being completely exposed to the rear cavity. Therefore, board-level protection such as single-board coating on the circuit board can be omitted, thereby reducing the complexity of the manufacturing process of the headset and saving the manufacturing cost of the headset.
  • the components in the first area can extend into the through holes, the distance between the bracket and the circuit board can be compressed, which not only saves the stacking space between the bracket and the circuit board, but also can be arranged closer to the circuit board because the bracket can be placed closer to the circuit board. Therefore, the height of the rear cavity can also be increased, that is, the volume of the rear cavity can be increased, which is beneficial to obtain a better low-frequency effect of the earphone.
  • the inside of the housing may include an accommodating space formed by the side of the bracket facing the circuit board and the inner wall of the housing, except for the first area and the components located in the first area on the circuit board , and the rest are located in the accommodating space.
  • the accommodating space and the rear cavity can be sealed and isolated by a sealing member, so that at least part of the circuit board located in the accommodating space can be sealed, thereby eliminating protective measures such as single-board coating on the circuit board.
  • a bass tube can also be arranged in the rear cavity.
  • the bass tube can be arranged on the side of the bracket facing the speaker. The sound hole is connected.
  • the bass tube and the bracket may adopt a separate design, and in this case, the bass tube may be made of all-metal material, which is beneficial to reduce the wall thickness of the bass tube, thereby reducing the occupation of the bass tube in the back cavity Space, that is, the actual volume of the rear cavity is increased, so it is beneficial to improve the low frequency effect of the earphone.
  • the cross-sectional area of the inner cavity of the bass tube can be kept unchanged, so as to meet the requirement of a uniform cross-section of the bass tube, thereby helping to improve the low-frequency effect of the earphone.
  • all-metal bass tube can be integrally formed by rolling or casting to simplify the manufacturing process of the earphones.
  • the bass tube may also be formed on the bracket.
  • the side of the bracket facing the speaker is provided with a first blocking wall and a second blocking wall, and the first blocking wall and the second blocking wall are arranged at intervals.
  • the earphone may also include a cover plate, and the cover plate is fixed on the side of the first barrier wall and the second barrier wall away from the bracket. At this time, the first barrier wall, the second barrier wall, the cover plate and the bracket can be surrounded to form a bass tube. .
  • the bracket can also be used as the pipe wall of the bass tube, so that the structure of the bass tube and the bracket can be shared, thereby reducing the space occupied by the bass tube in the rear cavity and increasing the actual volume of the rear cavity, which is beneficial to the earphone.
  • the low frequency effect is improved.
  • the distance between the first blocking wall and the second blocking wall can remain unchanged, so that the requirement for a uniform cross-section of the bass tube can be achieved, which is conducive to improving the performance of the earphone. low frequency effect.
  • the cover plate can be fixedly connected to the first blocking wall and the second blocking wall by means of heat fusion. In another specific embodiment, the cover plate can also be fixedly connected with the first blocking wall and the second blocking wall by means of adhesive.
  • the side of the bracket facing the speaker may also be provided with a raised structure, the raised structure is opposite to the sound leakage hole, and the raised structure is provided with a first through hole.
  • One end is communicated with the bass tube, and the other end is communicated with the sound vent. After the sound of the rear cavity enters the bass tube, it is transmitted to the outside of the second stage through the first through hole and the sound leakage hole in turn, so as to realize the low-frequency acoustic performance of the earphone.
  • the bass pipe When the bass pipe is specifically arranged, the bass pipe can be arranged at the edge area of the bracket, so as to make the bass pipe communicate with the sound leakage hole.
  • the bass tube may be an arcuate configuration that matches the edge of the stand.
  • the second area may be disposed around the first area; or, the first area and the second area may also be disposed adjacent to each other.
  • the sealing member may be sealed with the inner wall of the through hole and the first surface of the circuit board, respectively, so as to isolate the rear cavity from the accommodating space.
  • the sealing member may also be sealedly connected to the side of the bracket facing the circuit board and the first surface of the circuit board, respectively, so that isolation and sealing between the back cavity and the accommodating space can also be achieved.
  • the sealing member may be a filler, and the filler is respectively bonded to the bracket and the first surface of the circuit board, so as to isolate the back cavity and the accommodating space.
  • the sealing member may also be a sealing rubber strip, and the sealing rubber strips are respectively arranged in abutment with the bracket and the first surface of the circuit board, so as to isolate the back cavity and the accommodating space.
  • the bracket and the inner wall of the shell can be bonded by means of dispensing, so that on the one hand, the bracket can be positioned in the shell to improve the installation firmness of the bracket, and on the other hand, it can also improve the sealing of the back cavity Effect.
  • FIG. 1 is a schematic structural diagram of an earphone provided by an embodiment of the present application.
  • FIG. 2 is a partial exploded schematic diagram of an earphone provided by an embodiment of the present application.
  • FIG. 3 is a partial cross-sectional view of the earphone shown in FIG. 1 in the direction A-A;
  • Fig. 4 is a partial cross-sectional view of the earphone shown in Fig. 1 in the B-B direction;
  • FIG. 5 is a schematic structural diagram of a circuit board provided by an embodiment of the present application.
  • FIG. 6 is a schematic structural diagram of a bracket provided in an embodiment of the present application.
  • FIG. 7 is a schematic partial structure diagram of an earphone provided by an embodiment of the present application.
  • Figure 8 is an exploded schematic view of the bracket shown in Figure 6;
  • Fig. 9 is the sectional view of the bracket shown in Fig. 6 in the C-C direction;
  • FIG. 10 is a schematic structural diagram of another stent provided by the application.
  • Figure 11 is an exploded schematic view of the stent shown in Figure 10;
  • FIG. 12 is a cross-sectional view of the bracket shown in FIG. 10 in the D-D direction.
  • the headset provided by the embodiment of the present application can communicate with an electronic device, so that the electronic device transmits audio to the headset for playback.
  • the electronic devices here include, but are not limited to, terminal products such as mobile phones, tablet computers, notebook computers, and in-vehicle equipment, as well as wearable products such as smart watches and smart bracelets.
  • the connection between the headset and the electronic device may be wired or wireless.
  • the earphones provided in the embodiments of the present application may be wired earphones, or ordinary Bluetooth earphones, or true wireless stereo (true wireless stereo, TWS) earphones, or the like.
  • the earphones involved in the embodiments of the present application may be headphones, ear-hook earphones, neck-hung earphones, or earplug earphones, or the like.
  • earphones can be further classified into in-ear earphones (or referred to as ear canal earphones) or semi-in-ear earphones.
  • the earphone includes two pronunciation units that can be worn on both ears of the user, wherein the pronunciation unit adapted to the user's left ear may be called the left earphone, and the pronunciation unit adapted to the user's right ear may be called the right earphone.
  • earphone The left earphone and the right earphone can cooperate with each other for users to use, for example, the left earphone outputs the left channel, and the right earphone outputs the right channel; in some scenarios, only the right earphone has sound, or only the left earphone has sound, or the right earphone has sound.
  • the volume of the earphone is smaller than that of the left earphone to achieve a stereo effect; the left earphone and the right earphone can also be used by the user separately, for example, the user only wears one earphone to listen to the audio. Therefore, the earphone involved in the embodiments of the present application may refer to the left earphone or the right earphone in a pair of earphones, which is not specifically limited.
  • FIG. 1 is a schematic structural diagram of an earphone 100 provided by an embodiment of the present application
  • FIG. 2 is a partial exploded schematic diagram of the earphone 100 provided by an embodiment of the present application.
  • the x direction is defined as the length direction of the earphone
  • the y direction is the width direction of the earphone
  • the z direction is the thickness direction of the earphone.
  • the earphone 100 may include a casing 10 , a circuit board 20 accommodated in the casing 10 , a battery 30 and a speaker 40 .
  • the circuit board 20 is provided with a plurality of electronic components 21 , the battery 30 is electrically connected to the circuit board 20 to supply power to the related components on the circuit board 20 ; the speaker 40 is electrically connected to the circuit board 20 to process the circuit board 20 .
  • the latter audio signal is played through the speaker 40 to realize the sound playing function of the earphone 100 .
  • the housing 10 may include an ear stem housing 11 and an earbud housing 12 connected to one end of the ear stem housing 11 .
  • the battery 30 can be accommodated in the ear stem housing 11
  • the circuit board 20 and the speaker 40 can be accommodated in the earbud housing 12 .
  • the earplug housing 12 may include a first part 121 and a second part 122 covering the first part 121, the first part 121 is fixedly connected to the ear stem housing 11, and the second part 122 is detachably connected to the first part 121, so as to facilitate the earphones 100 Installation of internal structures.
  • the first part 121 and the ear stem housing 11 may be integrally formed, and the two may be integrally formed by an injection molding process, which simplifies the assembly difficulty of the earphone 100 and improves the appearance quality of the earphone 100 .
  • the second part 122 is provided with a sound outlet hole 13 , and the sound outlet hole 13 can communicate with the inside and the outside of the earphone 100 . It can be understood that when the user wears the earphone 100 , the earplug shell 12 of the earphone 100 can be clamped at the user's ear canal opening, and the sound outlet 13 opened in the second part 122 is disposed toward the user's ear canal.
  • the ear stem housing 11 may include a tube body 111 and a bottom cover 112 , and the bottom cover 112 covers an end of the tube body 111 away from the earplug housing 12 .
  • the bottom cover 112 and the tube body 111 are detachably connected to facilitate the installation of the internal structure of the earphone 100 .
  • the detachable connection between the bottom cover 112 and the tube body 111 may be snap-fit or glued with glue.
  • the bottom cover 112 can also be integrally formed with the tube body 111 .
  • the earphone 100 may further include a flexible circuit board 50 , one end of the flexible circuit board 50 is located in the ear stem casing 11 , and the other end extends into the earplug casing 12 .
  • the circuit board 20 and the battery 30 are respectively electrically connected to the flexible circuit board 50 , that is, the circuit board 20 and the battery 30 can be electrically connected through the flexible circuit board 50 .
  • the flexible circuit board 50 and the circuit board 20 may be electrically connected in a detachable manner, so as to facilitate the assembly between the flexible circuit board 50 and the circuit board 20 and facilitate subsequent maintenance operations of the earphone 100 .
  • the flexible circuit board 50 and the circuit board 20 may be connected through a board-to-board (BTB) connector.
  • the flexible circuit board 50 and the circuit board 20 may also be electrically connected by welding or the like.
  • the battery 30 and the flexible circuit board 50 may also be electrically connected by means of BTB connectors or welding, which is not limited in this application.
  • the battery 30 may be fixedly disposed on one side of the flexible circuit board 50 .
  • the headset 100 may further include a microphone (not shown in the figure), and the microphone may be used to collect the user's voice.
  • the microphone may collect The user's call sound.
  • the microphone can be disposed at one end of the ear stem housing 11 close to the bottom cover 112 , and is electrically connected to the circuit board 20 through the flexible circuit board 50 .
  • the bottom cover 112 is provided with a first sound pickup hole (not shown in the figure), the user's voice can be transmitted to the microphone through the first sound pickup hole, and the microphone converts the received sound signal into an electrical signal, and then passes through the flexible circuit.
  • the board 50 is transmitted to the circuit board 20, processed by the circuit board 20, and sent to the electronic device through the Bluetooth module. It is understandable that in order to prevent external dust, impurities and other contamination from entering the earphone through the first sound pickup hole, a dust-proof net can also be provided at the first sound pickup hole to block the dirt on the outside of the earphone and ensure the safety of the earphone. Internal components work fine.
  • the earphone 100 provided in this embodiment of the present application may also have a noise reduction function.
  • the earphone may further include two other microphones. They are a feed forward microphone (FF Mic) and a feed back microphone (FB Mic), respectively.
  • the feed-forward microphone (not shown in the figure) may be used to collect the sound of the external environment, and the feed-back microphone (not shown in the figure) may be used to collect the sound between the earphone 100 and the user's ear.
  • the feed-forward microphone can be accommodated in the ear stem housing 11 and electrically connected to the circuit board 20 through the flexible circuit board 50 .
  • One end of the ear stem shell 11 close to the earplug shell 12 is provided with a second sound pickup hole 15 , and the second sound pickup hole 15 is disposed toward the outside of the earphone 100 , that is, the second sound pickup hole 15 can be specifically opened in the ear stem shell 11 The side facing away from the earbud housing 12 .
  • the feedforward microphone is disposed at the second sound pickup hole 15 , so that the sound of the external environment can be transmitted to the feedforward microphone through the second sound pickup hole 15 .
  • the feed-back microphone is accommodated in the earplug housing 12 , and can also be electrically connected to the circuit board 20 through the flexible circuit board 50 .
  • the second part 122 of the earplug housing 12 is provided with a third sound pickup hole 16 , and the third sound pickup hole 16 is disposed toward the inner side of the earphone 100 , that is, when the user is wearing the earphone 100 , the third sound pickup hole 16 faces the user. ear canal setup.
  • the feed-back microphone is disposed at the third sound pickup hole 16, so that the sound between the earphone 100 and the user's ear can be detected.
  • the second sound pickup hole 15 and the third sound pickup hole 16 may also be provided with dust-proof nets, respectively, so as to prevent external contamination.
  • the related components on the circuit board 20 may perform active noise cancelling (automatic noise canceller, ANC) processing according to the signals collected by the feed-forward microphone and the feed-back microphone, so that the earphone can realize the noise reduction function.
  • ANC processing may, but is not limited to, include: performing noise suppression by using the inverted signal of the first signal collected by the feed-forward microphone and the inverted signal of the second signal collected by the feed-back microphone. It should be noted that the phase difference between the first signal and the inverted signal of the first signal is 180°, and the phase difference between the second signal and the inverted signal of the second signal is also 180°.
  • the speaker 40 can output a signal in which the inverted signal of the first signal and the inverted signal of the second signal are superimposed, so that the sound of the current external environment played by the speaker 40 cancels out the sound of the external environment actually heard by the user's ears, so as to achieve
  • the effect of active denoising can reduce the user's perception of the sound of the current environment and the sound in the user's ear canal, thereby improving the user's experience.
  • FIG. 3 is a partial cross-sectional view of the earphone 100 shown in FIG. 1 in the direction A-A
  • FIG. 4 is a partial cross-sectional view of the earphone 100 shown in FIG. 1 in the direction B-B.
  • the speaker 40 is located on the side of the circuit board 20 facing the second part 122 , and the outer periphery of the speaker 40 is arranged in contact with the inner wall of the earplug shell 12 , so that the The earplug housing 12 is divided into front and rear spaces.
  • the speaker 40 may be a moving coil type speaker, and its structure may include a diaphragm 41 and a magnetic circuit assembly 42 for driving the diaphragm 41 to vibrate.
  • the magnetic circuit assembly 42 can be disposed toward one side of the ear stem housing 11 , and the magnetic circuit assembly 41 is electrically connected to the circuit board 20 .
  • the space formed between the diaphragm 41 of the speaker 40 and the second part 122 is the front cavity 17 of the earphone 100 .
  • the magnetic circuit assembly 42 drives the diaphragm 41 to vibrate, and the diaphragm 41 can vibrate when it vibrates.
  • the air in the front cavity 17 is pushed to disturb and resonates with the air in the front cavity 17 to produce sound.
  • the sound can be transmitted to the user's ear canal through the aforementioned sound outlet 13 , and finally the sound of the earphone 100 is realized.
  • orientation terms such as "front” and “rear” used in the earphones in the embodiments of the present application are mainly explained according to the setting orientation of the speaker 40, and the side of the speaker 40 facing the sound outlet 13 is defined as the "front” side, The side of the speaker 40 that faces away from the sound outlet 13 is the "rear” side, and it should be understood that these azimuth terms do not limit the azimuth of the earphone in practical application scenarios.
  • FIG. 5 is a schematic structural diagram of a circuit board 20 according to an embodiment of the present application.
  • the circuit board 20 is located in the rear space of the speaker 40.
  • the circuit board 20 includes a first surface 201 and a second surface 202 arranged opposite to each other, and the first surface 201 is arranged toward the speaker 40.
  • the second face 202 is disposed toward the ear stem housing 11 .
  • the first surface 201 of the circuit board 20 is provided with a number of components 21 , and these components include but are not limited to a main chip 211 , a Bluetooth module, a noise reduction processing unit, and the like.
  • the main chip 211 may be a central processing unit (central processing unit, CPU), a system on chip (system on chip, SoC), a digital signal processor (digital signal processing, DSP) or a microcontroller unit (micro controller unit, MCU), etc.; the noise reduction processing unit may be a codec (coder-decoder, CODEC) chip or a high-fidelity (high-fidelity, HiFi) chip, or the like.
  • the second surface 202 of the circuit board 20 may also be provided with components, which will not be repeated here.
  • the components 21 provided on the circuit board are usually of different sizes, and there is often a certain height difference between the components 21 .
  • the height of the main chip 211 is greater than that of the other components 21 . If these components 21 are classified according to the height, these components 21 can be divided into a first part of the components whose height is greater than the first height, and a second part of the components whose height is smaller than the first height.
  • the components 21 with height differences may be arranged in different regions, so that the components 21 are distributed regularly on the first surface 201 of the circuit board 20 .
  • the first surface 201 of the circuit board 20 can be divided into a first area 2011 and a second area (not shown in the figure). within a region 2011.
  • a relatively large distribution gap may sometimes be formed between the components 21 , as shown in the area A in FIG. 5 .
  • some components 21 with relatively small cross-sectional areas ie, the area of the xy plane
  • the components 21 in the sub-gap can be higher than
  • the first part of the components at the first height may also belong to the second part of the components lower than the first height, which is not limited in this application. That is, the second partial components may be arranged in the first area 2011 or in the second area.
  • the second area may be disposed around the first area 2011, the second area is substantially annular, and the first area 2011 may be rectangular, circular, or some other regular or irregular polygonal shapes, which are the subject of this application.
  • the components 21 on the first surface 201 are approximately distributed in a manner of "high in the middle and low in the circumference".
  • the first area 2011 and the second area may also be disposed adjacent to each other.
  • the first area 2011 and the second area may be located on the left and right sides of the first surface 201, or on the left and right sides of the first surface 201, respectively.
  • the upper and lower sides of the first surface 201 so that the components 21 of the first surface 201 are distributed in the manner of "left high and right low” or “top high and bottom low”.
  • orientation terms such as “left”, “right”, “up” and “down” adopted by the circuit board 20 in the embodiment of the present application are mainly described based on the display orientation of the circuit board 20 in FIG. A limitation is formed on the orientation of the circuit board 20 in practical application scenarios.
  • the earphone 100 may further include a bracket 70 accommodated in the earplug shell 12 , for example, the bracket 70 may be specifically set Between the speaker 40 and the circuit board 20 , the outer periphery of the bracket 70 is disposed in contact with the inner wall of the earplug housing 12 , thereby sealing the rear space of the speaker 40 . At this time, the closed space formed between the magnetic circuit assembly 42 of the speaker 40 and the bracket 70 is the back cavity 18 of the earphone 100 .
  • the front cavity 17 of the earphone 100 mainly affects the mid-high frequency effect of the output sound pressure of the earphone 100
  • the rear cavity 18 of the earphone 100 mainly affects the low frequency effect of the output sound pressure of the earphone 100
  • the earplug housing 12 may further be provided with a sound leakage hole 19 communicating with the rear cavity 18 .
  • FIG. 6 is a schematic structural diagram of a bracket 70 according to an embodiment of the present application. 4 and 6 , in the embodiment of the present application, the outer peripheral contour of the bracket 70 is substantially the same as the cross-sectional shape of the earplug shell 12 in the xy plane. Exemplarily, the outer peripheral contour of the bracket 70 is approximately a circular structure. When the bracket 70 is installed in the earplug housing 12, the outer circumference of the bracket 70 is in contact with the inner wall of the first part 121.
  • the outer circumference of the bracket 70 and the inner wall of the first part 121 can be bonded by dispensing glue, so that a
  • the bracket 70 can be positioned in the earplug housing 12 to improve the installation firmness of the bracket 70 , and on the other hand, the sealing effect of the rear cavity 18 can also be improved.
  • a through hole 71 is provided on the bracket 70 at a position corresponding to the first area 2011 of the circuit board 20 , and the through hole 71 can penetrate through the bracket 70 toward the speaker 40 to the bracket 70 faces the side of the circuit board 20 , the components 21 in the first area 2011 can be exposed in the through holes 71 , and the components in the second area are located below the side of the bracket 70 facing the circuit board 20 .
  • the components 21 in the first area 2011 can extend into the above-mentioned through holes 71 to compress the bracket 70 and the
  • the spacing between the circuit boards 20 can not only save the stacking space between the bracket 70 and the circuit board 20, but also can increase the height of the rear cavity 18 because the bracket 70 can be arranged closer to the circuit board 20, that is, increasing the rear cavity 18.
  • the volume of the cavity 18 is favorable for the earphone 100 to obtain a better low frequency effect.
  • the distance between the bracket 70 and the circuit board 20 can be designed according to the aforementioned first height.
  • the distance between the bracket 70 and the circuit board 20 can be equal to the first height, so as to ensure that the bracket 70 faces the circuit
  • the distance between the bracket 70 and the circuit board 20 is compressed as much as possible to increase the volume of the rear cavity 18 .
  • the earphone 100 of the present embodiment can be formed in the back space of the speaker 40 by using the bracket 70 .
  • the ANC algorithm is closely related to the structure of the rear cavity 18.
  • the solution of this embodiment can also improve the consistency between individual earphones.
  • FIG. 7 is a schematic partial structural diagram of an earphone 100 according to an embodiment of the present application. 4 to 7 together, there is an assembly gap (not shown in the figure) between the inner wall of the through hole 71 and the components 21 in the first area 2011.
  • the assembly gap extends along the inner wall of the through hole 71 and is arranged in a ring shape around the components 21 in the first area 2011 .
  • a sealing member 711 may be provided in the assembly gap, and the sealing member 711 is sealed with the bracket 70 and the first surface 201 of the circuit board 20 respectively.
  • the first area 2011 is isolated from the second area, and the rear cavity 18 can also be isolated from the accommodating space 22 on the rear side of the bracket 70 . Since the circuit board 20 is located in the accommodating space 22 except for the first area 2011 and the components 21 located in the first area 2011 , the rear cavity 18 can be isolated from the accommodating space 22 . The sealing of the portion of the circuit board 20 located in the accommodating space 22 is achieved, so that protective measures such as single-board coating on the circuit board 20 can be omitted.
  • the above-mentioned sealing member 711 may specifically be a filler, and the filler is respectively connected with the inner wall of the through hole 71 , the first surface 201 of the circuit board 20 , and the components disposed in the first region 2011 near the inner wall of the through hole 71 .
  • 21 is bonded to isolate the rear cavity 18 from the accommodating space 22 on the rear side of the bracket 70 .
  • the filler can also be respectively bonded to the side of the bracket 70 facing the circuit board 20, the first side 201 of the circuit board 20, and the components 21 disposed in the first region 2011 close to the inner wall of the through hole 71.
  • the cavity 18 is isolated from the accommodating space 22 .
  • the filling glue can be specifically formed by a glue dispensing process.
  • the above-mentioned sealing member 711 may also be a sealing rubber strip.
  • the peripheral sides of the sealing rubber strip are respectively abutted with the inner wall of the through hole 71 and the first surface 201 of the circuit board 20, so that the rear Cavity 18 is isolated from the space behind bracket 70 .
  • the sealant strip may also abut with the side of the bracket 70 facing the circuit board 20 and the first surface 201 of the circuit board 20 respectively to isolate the rear cavity 18 from the space behind the bracket 70 .
  • the sealant strip may be, but not limited to, a rubber sealant strip, a silicone sealant strip, or a sponge sealant strip.
  • the bracket 70 can The circuit board 20 is sealed in the accommodating space 22 on the rear side of the rear cavity 18, so board-level protection such as single-board coating can be eliminated, and only a small number of components 21 in the first area 2011 can be individually protected, thereby reducing the complexity of the process. degree, and save the production cost of earphones.
  • the edge of the bracket 70 can also be provided with a gap 72, and the inner wall of the first part 121 is provided with a bump 1211 at a position corresponding to the gap 72.
  • the gap is used. The cooperation between the bracket 72 and the bump 1211 can quickly locate the bracket 70 , so that the assembly precision and assembly efficiency of the earphone 100 can be improved.
  • FIG. 8 is an exploded schematic view of the bracket 70 shown in FIG. 6 .
  • a bass tube 80 may also be provided in the rear cavity 18 , one end of the bass tube 80 is communicated with the rear cavity 18 , and the other One end communicates with the aforementioned sound leakage hole, so as to transmit the sound in the rear cavity 18 to the outside of the earphone 100 .
  • the side of the bracket 70 facing the speaker 40 is provided with a first blocking wall 73 and a second blocking wall 74, and the first blocking wall 73 and the second blocking wall 74 are arranged at intervals.
  • the baffle wall 74 and the side of the bracket 70 facing the speaker 40 can enclose a groove-shaped structure 75 .
  • the side of the first blocking wall 73 and the second blocking wall 74 away from the bracket 70 is also provided with a cover plate 76, and the cover plate 76 is respectively connected with the first blocking wall 73 and the second blocking wall 74, so as to connect the grooves of the groove structure 75.
  • the mouth is closed, and the closed groove structure 75 forms the bass tube 80 in this embodiment.
  • FIG. 9 is a cross-sectional view of the bracket 70 shown in FIG. 6 along the C-C direction.
  • the first blocking wall 73 may be disposed along the edge of the bracket 70
  • the second blocking wall 74 is located inside the first blocking wall 73 , that is, the second blocking wall 74 is located on the side of the first blocking wall 73 close to the through hole 71 , so that the bass tube 80 is formed on the edge area of the bracket 70 to avoid interference with the area of the through hole 71 .
  • the first blocking wall 73 may be an arc-shaped structure matching the edge of the bracket 70, and at this time, the second blocking wall 74 may be an arc-shaped structure having the same curvature as the first blocking wall 73, and the second blocking wall 74
  • the blocking wall 74 is disposed coaxially with the first blocking wall 73 . In this way, along the extending direction of the first baffle wall 73, the distance between the first baffle wall 73 and the second baffle wall 74 can be kept unchanged, so that the consistency of the cross-sectional area of the bass tube 80 can be improved, and thus the earphone 100 can be improved. low frequency effect.
  • the side of the bracket 70 facing the speaker 40 is further provided with a first protruding structure 77 and a second protruding structure 78 , wherein one end of the first blocking wall 73 and the second blocking wall 74 are respectively connected with the A protruding structure 77 is connected, and the other ends of the first blocking wall 73 and the second blocking wall 74 are respectively connected with the second protruding structure 78 .
  • both ends of the bass tube 80 may be sealed by the first protruding structure 77 and the second protruding structure 78, respectively.
  • the first protruding structure 77 When the bracket 70 is installed in the earplug housing 12 , the first protruding structure 77 may be positioned opposite to the sound leakage hole on the earplug housing 12 .
  • the first protruding structure 77 is provided with a first through hole 771 , one end of the first through hole 771 communicates with the bass tube 80 and the other end communicates with the sound leakage hole, so as to realize the communication between the bass tube 80 and the outside of the earphone 100 .
  • One end of the second blocking wall 74 close to the second protruding structure 78 has a second through hole 741 , one end of the second through hole 741 is communicated with the bass tube 80 , and the other end is communicated with the back cavity of the earphone 100 , so that the bass tube 80 is connected to the bass tube 80 . Communication of the back cavity. The sound in the back cavity can enter the bass tube 80 through the second through hole 741, and then transmit to the outside of the earphone through the first through hole 771 and the sound leakage hole in turn, so as to realize the low-frequency acoustic performance of the earphone.
  • the first protruding structure 77 can also be provided with a third through hole 772, one end of the third through hole 772 is communicated with the back cavity of the earphone, and the other end is communicated with the sound leakage hole, so as to realize the connection between the rear cavity and the outside of the earphone 100. Direct communication, balancing the pressure between the rear cavity and the outside of the headset.
  • the third through hole 772 can also be provided with a tuning net for adjusting the sound quality.
  • the tuning net can be covered on the side of the first protruding structure 77 facing the rear cavity, which can reduce the installation of the tuning net difficulty.
  • the mesh number of the tuning net can be selected according to the acoustic simulation result and the experimental test result, which is not limited in this application.
  • both ends of the cover plate 76 may extend to the first protruding structure 77 and the second protruding structure 78 respectively.
  • the first protruding structure 77 may be provided with a positioning post 773
  • one end of the cover plate 76 is provided with a positioning hole 761 corresponding to the positioning post 773 .
  • the cooperation between 773 and the positioning hole 761 can quickly position the cover plate 76 , thereby improving the assembly precision and assembly efficiency of the bracket 70 .
  • a positioning block 781 for positioning the cover plate 76 may also be provided on the second protruding structure 78 , and the other end of the cover plate 76 is provided with a positioning block 781 corresponding to the positioning block 781 . In this way, the positioning posts 773 and the positioning holes 761 , the positioning blocks 781 and the positioning grooves 762 can respectively form two sets of positioning structures, so that the positioning accuracy of the cover plate 76 can be further improved.
  • the material of the bracket 70 , the first blocking wall 73 , the second blocking wall 74 , the first protruding structure 77 and the second protruding structure 78 may be the same, for example, all of them may be plastic materials.
  • the bracket 70 , the first blocking wall 73 , the second blocking wall 74 , the first protruding structure 77 and the second protruding structure 78 can be integrally formed by an injection molding process to simplify the overall manufacturing process of the earphone.
  • the cover plate 76 can also be made of plastic material.
  • the cover plate 76 can be fixed to the notch of the trough structure 75 by hot-melting; in other embodiments, the cover plate 76 can also be fixed by adhesive bonding in the notch of the trough structure 75 .
  • the present application does not limit the specific fixing method of the cover plate 76 , as long as the groove of the groove-shaped structure 75 can be sealed.
  • a baffle wall is provided on the bracket 70, and the cover plate 76 is used for sealing, so that the first baffle wall 73, the second baffle wall 74, the cover plate 76 and the bracket 70 together form the bass tube 80.
  • the bracket 70 can also be used as the duct wall of the bass tube 80, so that the structure of the bass tube 80 and the bracket 70 can be shared. Since there is no need to consider the thickness of the duct wall such as the traditional independent plastic bass tube, it can be reduced. The space occupied by the bass tube 80 in the rear cavity, that is, the actual volume of the rear cavity is increased, so it is beneficial to improve the low frequency effect of the earphone 100 .
  • FIG. 10 is a schematic structural diagram of another bracket 70 provided by the present application
  • FIG. 11 is an exploded schematic view of the bracket 70 shown in FIG. 10
  • the bass tube 80 and the bracket 70 may also adopt a separate design, that is, the bass tube 80 and the bracket 70 may be independently formed.
  • the bass tube 80 and the bracket 70 can be made of different materials.
  • the bass tube 80 can be made of metal
  • the bracket 70 can be made of plastic.
  • the metal bass tube 80 may be integrally formed by a rolling or casting process
  • the bracket 70 may be integrally formed by an injection molding process.
  • the bass tube 80 may be arranged on the side of the bracket 70 facing the speaker.
  • the side of the bracket 70 facing the speaker can also be provided with a first protruding structure 77.
  • the first protruding structure 77 is provided with a first through hole 771 that communicates with the sound leakage hole, and one end of the bass tube 80 can extend into In the first through hole 771, the other end communicates with the rear cavity.
  • the sound in the back cavity can enter the bass tube 80 through the end of the bass tube 80, and then transmit to the outside of the earphone through the first through hole 771 and the sound leakage hole in turn, so as to realize the low-frequency acoustic performance of the earphone.
  • the first protruding structure 77 can also be provided with a third through hole 772, one end of the third through hole 772 is communicated with the back cavity of the earphone, and the other end is communicated with the sound leakage hole, so as to realize the rear cavity and the earphone.
  • the external direct communication balances the pressure between the rear cavity and the outside world.
  • the end of the bass tube 80 extending into the first through hole 771 can be bonded and connected to the inner wall of the first through hole 771, so that on the one hand, the tightness of the connection between the bass tube 80 and the first through hole 771 can be ensured.
  • the bass tube 80 can also be fixed.
  • the bass tube 80 may be disposed at the edge area of the bracket 70 .
  • the bass tube 80 may be an arc-shaped tube structure that matches the edge of the bracket 70 .
  • the side of the bracket 70 facing the speaker can also be provided with a pair of limiting protrusions 79 , and the bass tube 80 can be clamped between the two limiting protrusions 79 , thereby improving the fixing reliability of the bass tube 80 on the bracket 70 .
  • FIG. 12 is a cross-sectional view of the bracket 70 shown in FIG. 10 in the D-D direction.
  • the bass tube 80 in this embodiment is made of metal material, which can not only meet the requirement for the consistency of the cross-sectional area of the inner cavity of the bass tube 80, but also reduce the wall thickness of the bass tube 80. Therefore, the space occupied by the bass tube 80 in the rear cavity is reduced, that is, the actual volume of the rear cavity is increased, which is beneficial to the improvement of the low frequency effect of the earphone.
  • the earphone provided by the embodiment of the present application adopts an independent rear cavity design, which can not only achieve a stable rear cavity volume, improve the consistency between individual earphones, but also omit board-level protection such as circuit board veneer coating, thereby reducing the cost of The production process of the earphone is complicated, and the production cost of the earphone is saved.
  • the bass tube of the earphone in this embodiment occupies a small space in the back cavity, it is beneficial to obtain a relatively large volume of the back cavity of the earphone, thereby improving the low frequency effect of the earphone.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Headphones And Earphones (AREA)

Abstract

Un écouteur comprenant une coque, un haut-parleur, un support, une carte de circuit imprimé et un élément d'étanchéité, la coque étant pourvue d'un trou de sortie sonore, un côté du haut-parleur est disposé vers le trou de sortie sonore, et une cavité avant de l'écouteur est formée par le côté du haut-parleur et une paroi interne de la coque ; le support est situé du côté du haut-parleur à l'opposé du trou de sortie sonore, une cavité arrière de l'écouteur est formée par le support, le haut-parleur et la paroi interne de la coque, et le support est pourvu d'un trou traversant ; la carte de circuit imprimé est située sur le côté du support à distance du haut-parleur, une première surface de la carte de circuit imprimé faisant face au support est pourvue d'une première zone et d'une seconde zone, et la première zone est opposée à la position du trou traversant ; la première zone et la seconde zone sont respectivement pourvues d'une pluralité de composants, au moins un composant dans la première zone peut s'étendre dans le trou traversant, et les composants dans la seconde zone sont situés entre le support et la carte de circuit imprimé ; et l'élément d'étanchéité est disposé autour des composants dans la première zone, et l'élément d'étanchéité est respectivement relié au support et à la première surface de la carte de circuit imprimé.
PCT/CN2021/139887 2020-12-31 2021-12-21 Écouteur WO2022143279A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202011619757.0A CN114697792B (zh) 2020-12-31 2020-12-31 一种耳机
CN202011619757.0 2020-12-31

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WO2022143279A1 true WO2022143279A1 (fr) 2022-07-07

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