WO2022130624A1 - Component mounting device - Google Patents

Component mounting device Download PDF

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Publication number
WO2022130624A1
WO2022130624A1 PCT/JP2020/047476 JP2020047476W WO2022130624A1 WO 2022130624 A1 WO2022130624 A1 WO 2022130624A1 JP 2020047476 W JP2020047476 W JP 2020047476W WO 2022130624 A1 WO2022130624 A1 WO 2022130624A1
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WO
WIPO (PCT)
Prior art keywords
supply unit
parts
component
same
unit
Prior art date
Application number
PCT/JP2020/047476
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French (fr)
Japanese (ja)
Inventor
喜之 辻本
Original Assignee
ヤマハ発動機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ヤマハ発動機株式会社 filed Critical ヤマハ発動機株式会社
Priority to PCT/JP2020/047476 priority Critical patent/WO2022130624A1/en
Priority to JP2022569668A priority patent/JP7423821B2/en
Publication of WO2022130624A1 publication Critical patent/WO2022130624A1/en

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02Feeding of components

Definitions

  • the present invention relates to a component mounting device, and more particularly to a component mounting device including a head to which a plurality of nozzles are attached.
  • a component mounting device including a head to which a plurality of nozzles are attached is known.
  • Such a component mounting device is disclosed in, for example, Japanese Patent Application Laid-Open No. 2004-282102.
  • the Japanese Patent Application Laid-Open No. 2004-282102 discloses a unit electronic component mounting device (component mounting device) including a head portion (head) to which a plurality of nozzles are attached. A plurality of unit electronic component mounting devices are arranged in a row. As a result, the mounting line is configured.
  • the unit electronic component mounting device includes a plurality of tape feeders arranged in the supply section of the electronic component.
  • the unit electronic component mounting device includes a control unit and a storage unit.
  • the control unit is configured to control the unit electronic component mounting device.
  • the control unit of JP-A-2004-282102 describes a plurality of unit electronic component mounting devices based on the overall mounting data when a component breakage occurs in one unit electronic component mounting device of the plurality of unit electronic component mounting devices.
  • the other unit of the electronic component mounting device is configured to control the mounting of electronic components on behalf of the device.
  • the substrate in the unit electronic component mounting device of JP-A-2004-282102, the substrate must be placed not at the board working position of one unit electronic component mounting device but at the board working position of another unit electronic component mounting device. , There is a problem that it is not possible to substitute the mounting of electronic components.
  • the present invention has been made to solve the above-mentioned problems, and one object of the present invention is that it is possible to substitute the mounting of parts without arranging the boards at different board working positions. It is to provide a flexible component mounting device.
  • the component mounting apparatus attracts a plurality of the same component supply units that supply the same component among the components mounted on the board and components supplied from the plurality of the same component supply sections to the substrate. It is equipped with a head to which a plurality of nozzles produced by mounting a component are attached, and a control unit that controls the mounting of components on a board by sucking components from a plurality of the same component supply units by the nozzles.
  • a control unit that controls the mounting of components on a board by sucking components from a plurality of the same component supply units by the nozzles.
  • the supply of parts by one same parts supply unit is stopped, and the parts supplied from one same parts supply unit are replaced by other same parts. It is configured to switch from the supply unit to the control to supply.
  • the same component refers to a component having the same shape and the same function supplied from the same component supply unit.
  • the control unit is a component supplied from each of the same component supply unit and the other identical component supply unit among a plurality of identical component supply units. Is supplied by the same component supply unit based on the fact that the remaining number of components in the same component supply section is less than the threshold value when mounting the components on the boards arranged in the same board work position. Is stopped, and the parts supplied from one same parts supply unit are switched to the control supplied from the other same parts supply unit. As a result, by switching the parts supplied from one same component supply unit to the mounting of electronic components in another same component supply unit on the component mounting device, the components supplied from one same component supply unit are supplied.
  • parts can be supplied from other same parts supply parts to the boards arranged at the same board work position, parts supplied from one same parts supply part can be reliably supplied from other same parts supply parts. be able to. As a result, it is possible to substitute the mounting of components without arranging the boards at different board working positions. Further, when the remaining number of parts in the same parts supply unit becomes less than the threshold value, it is not necessary to newly supply the reel on which the tape on which the electronic parts are arranged is wound to the same parts supply unit. Therefore, it is possible to prevent the new reel from being used. As a result, the number of used reels can be reduced. Further, since it is not necessary to newly supply the reel around which the tape on which the electronic component is arranged is wound to one same component supply unit, the reel replacement work by the operator can be reduced, so that the operator's workload is burdened. Can be reduced.
  • the control unit acquires the remaining number of components of each of a plurality of the same component supply units, and at a predetermined timing, the components acquired by the same component supply unit. It is configured to control whether or not the remaining number of is less than the threshold value. With this configuration, it is possible to confirm whether or not the remaining number of acquired parts is less than the threshold value at a predetermined timing after acquiring the remaining number of each part of a plurality of the same parts supply unit. Therefore, it is possible to surely confirm whether or not the remaining number of parts in one and the same parts supply unit is less than the threshold value.
  • a storage unit that stores association information in which the arrangement location information of a plurality of the same component supply units is associated with each other is further provided, and the control unit is a component of one identical component supply unit.
  • the control unit is a component of one identical component supply unit.
  • the placement location information of other same parts supply parts is acquired based on the association information.
  • the control unit is provided with a display unit for displaying and, when there are a plurality of other identical component supply units acquired based on the association information, each of the plurality of other identical component supply units displayed on the display unit. Based on the selection of one other identical parts supply unit, the control for supplying parts from one of the same parts supply units is switched to the control of supplying parts from the selected other same parts supply unit. It is configured in.
  • the operator can select another same parts supply unit by referring to the remaining number of parts in the other same parts supply unit displayed by the display unit, so that the parts can be selected from the other same parts supply unit. Since the other same component supply unit can be selected in consideration of the number of switching of the control for supplying the parts, it is possible to suppress an increase in the number of switching of the control for supplying the component from the other same component supply unit. Further, since the operator can select another same component supply unit by referring to the mounting completion time displayed by the display unit, another same component supply unit having a short board production time can be selected. It is possible to suppress an increase in the production time of the substrate after switching to mounting parts from the same parts supply unit.
  • the storage unit is a head used for sucking the remaining number of each component of a plurality of the same component supply section and each component of the plurality of the same component supply section.
  • the type of is stored, and the control unit stores the remaining number of parts of each of the plurality of other identical component supply units among the plurality of identical component supply units stored in the storage unit, or a plurality of other identical components.
  • another same parts supply unit is selected, and parts are supplied from the other same parts supply unit that selects parts to be supplied from one same parts supply unit. It is configured to switch to control. With this configuration, other identical component supply units can be automatically selected by the control unit, so that the work load on the operator can be reduced.
  • the control unit has the remaining number of parts in the same component supply unit that is less than the threshold value, and the remaining number of components in the same component supply unit exceeds the threshold value by replenishing the components.
  • the control of supplying parts from one same parts supply unit to the parts supplied from another same parts supply unit is switched to the control of supplying parts from one same parts supply unit to the board. It is configured to continue mounting components on. With this configuration, if the path for sucking parts from one and the same component supply unit is acquired in advance as the optimum movement path, it is possible to return to the optimum nozzle movement path and mount the component. , It is possible to efficiently mount components on the board.
  • the head includes an inline head in which a plurality of nozzles are arranged in a straight line
  • the control unit is a plurality of identical component supply units by the plurality of nozzles of the inline head.
  • the parts are sucked from each of them at the same time, they are sucked from the same parts supply part of one of a plurality of nozzles based on the fact that the remaining number of parts in one same parts supply part becomes less than the threshold value.
  • the head includes a plurality of rotary heads in which a plurality of nozzles are arranged in a ring shape in a plan view, and the control unit is a plurality of nozzles of each of the plurality of rotary heads.
  • the control unit is a plurality of nozzles of each of the plurality of rotary heads.
  • the parts are sequentially sucked from the same parts supply unit by a plurality of nozzles of the rotary head. It is possible to suppress an increase in time for adsorbing a component to each of a plurality of nozzles.
  • the reel on which the tape on which the parts are arranged is wound is wound. Since it is not necessary to newly supply to one and the same parts supply unit, it is possible to prevent a new reel from being used. As a result, it is possible to suppress an increase in the mounting time required for mounting the component on the substrate, and it is possible to more reliably suppress an increase in the number of used reels.
  • a plurality of identical component supply units have an alternative supply unit preset to supply components when the components are exhausted in the same component supply unit.
  • the control unit switches to control of supplying parts from the alternative supply unit based on the fact that the parts are less than the threshold value in one and the same parts supply unit until the end of board production.
  • the control unit is based on the fact that when the production of the board is finished, the remaining number of parts in one and the same component supply unit becomes less than the threshold value. Instead, it is configured to switch the control to supply the parts supplied from one same parts supply unit from the other same parts supply unit.
  • parts can be supplied by one identical component supply unit or alternative supply unit and another same component supply unit until the end of board production, so that other identical component supply units can be supplied. It is possible to suppress a decrease in the production efficiency of the substrate as compared with the case of the final stage in which the parts are supplied only from the part.
  • the same parts supply unit and alternatives are made at the end of board production. The supply of parts from the supply unit can be stopped. As a result, the increase in used reels is more reliably suppressed compared to the case where both the same component supply unit or alternative supply unit and the other identical component supply unit are used at the end of board production. can do.
  • FIG. 1 A schematic showing a state in which the supply of parts from the first identical parts supply unit at the first location is switched to the supply of parts from the second identical parts supply unit at the fifth location in the table of the component mounting apparatus of the first embodiment. It is a figure.
  • the components are mounted when the supply of components from the first identical component supply unit at the first location is switched to the supply of components from the second identical component supply unit at the fifth location.
  • the components are mounted when the supply of components from the first identical component supply section at the first location is switched to the supply of components from the fourth identical component supply section at the fourth location. It is a schematic diagram which showed the state which is being broken.
  • the components are mounted when the supply of components from the first identical component supply unit at the first location is switched to the supply of components from the second identical component supply unit at the second location. It is a schematic diagram which showed the state which is being broken.
  • the component mounting device 100 is configured to mount an electronic component E such as an IC, a transistor, a capacitor, and a resistor on a substrate B such as a printed circuit board arranged at a substrate working position W.
  • the electronic component E is an example of a "component" in the claims.
  • the transport direction for transporting the substrate B is the X1 direction
  • the direction opposite to the transport direction for transporting the substrate B is the X2 direction
  • the combined direction of the X1 direction and the X2 direction is the X direction.
  • the direction orthogonal to the X direction in the horizontal direction is the Y direction
  • one of the Y directions is the Y1 direction
  • the other of the Y directions is the Y2 direction.
  • the vertical direction orthogonal to the X direction and the Y direction is the Z direction (vertical direction)
  • one of the Z directions is the Z1 direction (upward direction)
  • the other of the Z directions is the Z2 direction (downward direction).
  • the component mounting device 100 includes a base 1, a feeder arrangement unit 2, a display unit 3, a board transport unit 4, a plurality of support units (not shown), and a plurality of pair of rail units (not shown).
  • a first head 5, a second head 6, a component recognition camera 7, a board recognition camera 8, and a control unit 9 are provided.
  • Each of the first head 5 and the second head 6 is an example of the "head" in the claims.
  • the base 1 is a base on which each component is arranged in the component mounting device 100.
  • a board transport section 4, a plurality of rail sections, and a component recognition camera 7 are provided on the base 1 as components.
  • a control unit 9 is provided in the base 1.
  • the base 1 is provided with feeder arranging portions 2 capable of arranging a plurality of tape feeders 2a on both sides in the Y direction (Y1 direction side and Y2 direction side).
  • the tape feeder 2a is a component supply unit that supplies the electronic component E mounted on the substrate B.
  • the tape feeder 2a is an autoloading feeder.
  • the tape feeder 2a holds a reel (not shown) around which a tape that holds a plurality of electronic components E at predetermined intervals is wound. Further, the tape feeder 2a is configured to rotate the reel by feeding out the tape in response to the component holding operation for taking out the electronic component E by the first head 5 and the second head 6.
  • the tape feeder 2a is configured to supply the electronic component E from the tip end portion on the substrate work position W side by feeding out the tape.
  • the tape feeder 2a is configured to calculate the number of electronic components E attracted by the first head 5 and the second head 6 based on the number of times the tape is sent out.
  • the electronic component E is distributed from a plurality of locations and supplied.
  • the plurality of tape feeders 2a include a plurality of identical component supply units 20.
  • the plurality of identical component supply units 20 are configured to supply the same electronic component E among the electronic components E mounted on the substrate B.
  • the plurality of identical component supply units 20 include a first identical component supply section 20a, a second identical component supply section 20b, a third identical component supply section 20c, and a fourth identical component supply section 20d.
  • the first identical parts supply unit 20a is an example of "one identical parts supply unit” in the claims.
  • the second same parts supply unit 20b is an example of “another same parts supply unit” in the claims.
  • the third identical parts supply unit 20c is an example of "another same parts supply unit” in the claims.
  • the fourth identical parts supply unit 20d is an example of the "alternative supply unit" in the claims.
  • the first identical component supply unit 20a is normally configured to supply the electronic component E to the first head 5.
  • the first identical component supply unit 20a is arranged on the Y1 direction side of the substrate transport unit 4 of the base 1.
  • the second identical component supply unit 20b is normally configured to supply the electronic component E to the second head 6.
  • the second identical component supply unit 20b is arranged on the Y2 direction side of the substrate transport unit 4 of the base 1.
  • the third identical component supply unit 20c is normally configured to supply the electronic component E to the second head 6.
  • the third identical component supply unit 20c is arranged on the Y2 direction side of the substrate transport unit 4 of the base 1.
  • the fourth identical component supply unit 20d is preset to supply the electronic component E instead when the electronic component E disappears in the first identical component supply unit 20a.
  • the fourth identical component supply unit 20d is arranged on the X1 direction side of the first identical component supply unit 20a.
  • the plurality of tape feeders 2a include a plurality of different component supply units 21.
  • the plurality of different component supply units 21 supply electronic components E different from the first identical component supply unit 20a, the second identical component supply unit 20b, the third identical component supply unit 20c, and the fourth identical component supply unit 20d. It is configured in.
  • the plurality of different parts supply units 21 have a first different parts supply unit 21a and a second different parts supply unit 21b.
  • the display unit 3 is composed of a liquid crystal display or the like.
  • the display unit 3 is configured to display the information transmitted from the control unit 9 on the screen. That is, the display unit 3 is configured to notify the operator of the remaining number of parts of each of the plurality of identical parts supply units 20, information regarding the mounting completion time, and the like.
  • the board transport unit 4 is configured to carry the board B from the outside of the component mounting device 100 and transport the board B in the transport direction (X1 direction).
  • the substrate transport unit 4 includes a pair of conveyors 41 and a drive motor (not shown) for rotationally driving the pair of conveyors 41.
  • Each of the pair of conveyors 41 has a pulley (not shown) and a ring-shaped conveyor belt hung around the pulley.
  • the control unit 9 is configured to control the transport speed of the substrate B mounted on the pair of conveyors 41 by controlling the drive motor.
  • the plurality of support portions are configured to support the first head 5 and the second head 6 so as to be movable in the X direction, respectively.
  • Each of the plurality of pairs of rail portions is configured to movably support the plurality of support portions in the Y direction.
  • each of the first head 5 and the second head 6 is configured to be movable on the base 1 in the horizontal plane (in the X direction and the Y direction).
  • Each of the first head 5 and the second head 6 has the same configuration.
  • Each of the first head 5 and the second head 6 is a component mounting unit, and is configured to mount the electronic component E on the substrate B fixed at the substrate working position W.
  • Each of the first head 5 and the second head 6 is a rotary head in which a plurality of nozzles N are arranged in a ring shape in a plan view.
  • the component recognition camera 7 is a camera for component imaging that captures an image of the electronic component E held (sucked) by the nozzle N prior to mounting the electronic component E on the substrate B.
  • the component recognition camera 7 is fixed on the base 1 and is configured to take an image of the electronic component E held (sucked) by the nozzle N from below the electronic component E (in the Z2 direction).
  • the substrate recognition camera 8 is attached to each of the first head 5 and the second head 6, and is attached to the upper surface of the substrate B prior to mounting the electronic component E on the substrate B.
  • Shall mark A camera for mark imaging that captures images (not shown).
  • the FI mark is a mark for confirming the position of the substrate B.
  • the control unit 9 is configured to control the electronic component E to be sucked from the tape feeder 2a by the nozzle N and mounted on the substrate B.
  • the control unit 9 is a control circuit that includes a CPU (Central Processing Unit), a storage unit, and the like, and controls the operation of the component mounting device 100.
  • the control unit 9 is electrically connected to the tape feeder 2a, the substrate transport unit 4, the first head 5, the second head 6, the component recognition camera 7, the board recognition camera 8, the support unit, and the rail unit.
  • the storage unit is a storage device having a memory such as a ROM (Read Only Memory) and a RAM (Random Access Memory).
  • the component mounting program and the association information 9a are stored in the storage unit.
  • the component mounting program is a program for mounting the electronic component E mounted on the substrate B.
  • the association information 9a is a table in which the arrangement location information of a plurality of the same parts supply units 20 are associated with each other. That is, the association information 9a is information in which the parts supply unit information and the same parts supply unit information corresponding to the parts supply unit information are associated with each other.
  • the component supply unit information includes, for example, information such as the arrangement location of each of the plurality of identical component supply units 20, the component name, the head type, the nozzle N type, and the remaining number of electronic components E. Further, the component supply unit information includes, for example, information such as the arrangement location of each of the plurality of different component supply units 21, the component name, the head type, the nozzle N type, and the remaining number of electronic components E. ..
  • the same parts supply unit information includes, for example, information such as an arrangement location and a part name.
  • information such as an arrangement location and a part name.
  • the control unit 9 of the first embodiment mounts the electronic component E on the substrate B for production, and in order to suppress the generation of used reels, the remaining number of the electronic components E of the first identical component supply unit 20a. Is configured to switch to the control of supplying the electronic component E only from the second identical component supply unit 20b based on the fact that is less than the threshold value. Specifically, the control unit 9 places the electronic component E supplied from each of the first identical component supply unit 20a and the second identical component supply unit 20b of the plurality of identical component supply units 20 at the same board work position W.
  • the electronic component E by the first identical component supply unit 20a is based on the fact that the remaining number of the electronic component E of the first identical component supply unit 20a is less than the threshold value.
  • the supply is stopped, and the electronic component E supplied from the first identical component supply unit 20a is switched to the control supplied from the second identical component supply unit 20b.
  • the first identical component supply unit 20a is arranged at the first location P1.
  • the first component C1 is arranged in the first identical component supply unit 20a.
  • the type of head that attracts the first component C1 of the first identical component supply unit 20a is, for example, the first head 5 (described as H1 in FIGS. 2, 4, and 6).
  • the type of the nozzle N that adsorbs the first component C1 of the first identical component supply unit 20a is, for example, the first nozzle N1.
  • the same component supply unit information of the first location P1 for example, the first component C1 arranged at the fifth location P5 is set.
  • the same component supply unit information of the first location P1 for example, the first component C1 arranged at the sixth location P6 is set.
  • the fourth identical parts supply unit 20d is arranged at the second location P2.
  • the first component C1 is arranged in the fourth identical component supply unit 20d.
  • the type of head that attracts the first component C1 of the fourth identical component supply unit 20d is, for example, the first head 5 (described as H1 in FIGS. 2, 4, and 6).
  • the type of the nozzle N that adsorbs the first component C1 of the fourth identical component supply unit 20d is, for example, the second nozzle N2. For example, it is not set as the same component supply unit information of the second location P2.
  • the first different parts supply unit 21a is arranged at the third location P3.
  • a second component C2 is arranged in the first different component supply unit 21a.
  • the type of head that attracts the second component C2 of the first different component supply unit 21a is, for example, the first head 5 (described as H1 in FIGS. 2, 4, and 6).
  • the type of the nozzle N that adsorbs the second component C2 of the first different component supply unit 21a is, for example, the third nozzle N3.
  • the second different parts supply unit 21b is arranged at the fourth location P4.
  • a third component C3 is arranged in the second different component supply unit 21b.
  • the type of head that attracts the third component C3 of the second different component supply unit 21b is, for example, the second head 6 (described as H2 in FIGS. 2, 4 and 6).
  • the type of the nozzle N that adsorbs the third component C3 of the second different component supply unit 21b is, for example, the first nozzle N1. For example, it is not set as the same component supply unit information of the third location P3.
  • the second identical parts supply unit 20b is arranged at the fifth location P5.
  • the first component C1 is arranged in the second identical component supply unit 20b.
  • the type of head that attracts the first component C1 of the second identical component supply unit 20b is, for example, the second head 6 (described as H2 in FIGS. 2, 4, and 6).
  • the type of the nozzle N that adsorbs the first component C1 of the second identical component supply unit 20b is, for example, the second nozzle N2.
  • the same component supply unit information of the fifth location P5 for example, the first component C1 arranged at the first location P1 is set.
  • the same component supply unit information of the fifth location P5 for example, the first component C1 arranged at the sixth location P6 is set.
  • the third identical parts supply unit 20c is arranged at the sixth location P6.
  • the first component C1 is arranged in the third identical component supply unit 20c.
  • the type of head that attracts the first component C1 of the third identical component supply unit 20c is, for example, the second head 6 (described as H2 in FIGS. 2, 4, and 6).
  • the type of the nozzle N that adsorbs the first component C1 of the third identical component supply unit 20c is, for example, the third nozzle N3.
  • the same component supply unit information of the sixth location P6 for example, the first component C1 arranged at the first location P1 is set.
  • the same component supply unit information of the sixth location P6, for example, the first component C1 arranged at the fifth location P5 is set.
  • the control unit 9 usually has the first identical component supply unit 20a at the first location P1, the second identical component supply unit 20b at the fifth location P5, and the sixth location P6. It is configured to control the supply of electronic components E from all of the third identical component supply units 20c. Further, the control unit 9 normally controls to supply the electronic component E from both the first different component supply unit 21a of the third location P3 and the second different component supply unit 21b of the fourth location P4. It is configured.
  • the control unit 9 has the remaining number of electronic components E in the first identical component supply unit 20a of the first location P1 until the production of the substrate B ends. It is configured to switch from the fourth identical component supply unit 20d of the second location P2 to the control of supplying the electronic component E based on the fact that the value is less than the threshold value. Specifically, the control unit 9 is based on the fact that the remaining number of electronic components E in the first identical component supply unit 20a of the first location P1 becomes 0 until the production of the substrate B ends. , The electronic component E is replenished from the fourth identical component supply unit 20d of the second location P2 set in advance.
  • the remaining number of the electronic components E in the first same component supply unit 20a becomes less than the threshold value. Based on this, the electronic component E supplied from the first identical component supply section 20a instead of the fourth identical component supply section 20d at the second location P2 is supplied from the second identical component supply section 20b at the fifth location P5. It is configured to switch to supply control.
  • control unit 9 is based on the fact that when the remaining production number of the substrate B becomes equal to or less than a predetermined value, the remaining number of electronic components E of the first same component supply unit 20a becomes 0.
  • the control is switched so that the electronic component E supplied from the first identical component supply unit 20a is supplied from the second identical component supply unit 20b at the fifth location P5 instead of the fourth identical component supply unit 20d at the second location P2. It is configured in.
  • the control unit 9 is electron not only from the plurality of tape feeders 2a arranged from the feeder arrangement unit 2 on the Y1 direction side, but also from the plurality of tape feeders 2a arranged from the feeder arrangement unit 2 on the Y2 direction side.
  • control unit 9 It is configured to control the movement of the first head 5 so as to attract the component E. Further, the control unit 9 does not replenish the electronic component E in the tape feeder 2a based on the fact that the remaining number of the electronic component E in the first identical component supply unit 20a is less than the threshold value. 1 It is configured to stop the supply of the electronic component E by the same component supply unit 20a and switch to the control of supplying the electronic component E supplied from the first identical component supply unit 20a from the second identical component supply unit 20b. ing.
  • the control unit 9 mounts the electronic component E on the substrate B in order to switch the control of supplying the electronic component E supplied from the first identical component supply unit 20a from the second identical component supply unit 20b of the fifth location P5. It is configured to control to update the remaining number of the electronic components E of each of the plurality of identical component supply units 20 stored in the storage unit for each control to be performed. That is, the control unit 9 is configured to control to acquire the remaining number of each electronic component E of the first identical component supply unit 20a, the second identical component supply unit 20b, and the third identical component supply unit 20c. There is.
  • control unit 9 is configured to perform control to confirm whether or not the remaining number of the electronic components E acquired by the first identical component supply unit 20a is less than the threshold value at a predetermined timing. .. Then, when the remaining number of electronic components E in the first identical component supply unit 20a becomes less than the threshold value, the control unit 9 stops the supply of the electronic component E by the first identical component supply unit 20a, and also stops the supply of the electronic component E. It is configured to switch the electronic component E supplied from the first identical component supply unit 20a to the control supplied from the other identical component supply unit 20.
  • control unit 9 controls to confirm whether or not the remaining number of the electronic components E acquired by the first identical component supply unit 20a has become 0 for each control of mounting the electronic component E on the substrate B. Is configured to do. Then, when the remaining number of electronic components E in the first identical component supply unit 20a becomes 0, the control unit 9 stops the supply of the electronic component E by the first identical component supply unit 20a, and at the same time, the first identical component unit 9. It is configured to switch the electronic component E supplied from the component supply unit 20a to the control supplied from another same component supply unit 20.
  • the control unit 9 determines the placement location information of the second identical component supply unit 20b based on the association information 9a. Is configured to control the acquisition of. Specifically, when the remaining number of electronic components E in the first identical component supply unit 20a becomes 0, the control unit 9 uses the same component supply unit information associated with the component supply unit information of the first location P1. Based on this, it is configured to control the acquisition of the arrangement location information of the second identical component supply unit 20b. The control unit 9 is configured to switch the electronic component E supplied from the first identical component supply unit 20a to the control supplied from the second identical component supply unit 20b.
  • the components are sequentially sucked from the first same component supply unit 20a by the plurality of nozzles N of the first head 5 (rotary head), and the components are sequentially sucked by the plurality of nozzles N of the second head 6 (rotary head).
  • This is performed when the parts are sequentially sucked from the second same part supply unit 20b. That is, the control unit 9 is based on the fact that the remaining number of electronic components E in the first identical component supply unit 20a becomes less than the threshold value when the components are sequentially sucked by the first head 5 and the second head 6.
  • the control is switched to supply the electronic component E from the second identical component supply unit 20b shared by the first head 5 and the second head 6, and the mounting of the electronic component E on the substrate B is continued. Has been done.
  • control unit 9 is based on the fact that the remaining number of electronic components E in the first identical component supply unit 20a becomes 0 when the components are sequentially sucked by the first head 5 and the second head 6.
  • the first head 5 and the second head 6 are configured to share the second identical component supply unit 20b to control the supply of the electronic component E.
  • the component mounting process is a process of switching control so that the first head 5 and the second head 6 share the same component supply unit 20 based on the remaining number of electronic components E of the plurality of identical component supply units 20. Is.
  • step S1 the control unit 9 updates the remaining number of parts of the plurality of identical parts supply units 20.
  • step S2 the control unit 9 determines whether or not the same component supply unit 20 having a threshold value or less exists based on the updated number of remaining components. If the same component supply unit 20 below the threshold value exists, the process proceeds to step S3, and if the same component supply unit 20 below the threshold value does not exist, the component mounting process ends.
  • step S3 the control unit 9 determines whether or not the same component supply unit 20 that can be shared exists based on the association information 9a (see FIG. 6). If the same component supply unit 20 that can be shared exists, the process proceeds to step S4, and if the same component supply unit 20 that can be shared does not exist, the component mounting process ends. In step S4, the control unit 9 switches the suction location based on the shareable location information of the same component supply unit 20, and the mounting is continued. After step S4, the component mounting process ends.
  • the control unit 9 is the electronic component E supplied from each of the first identical component supply unit 20a and the second identical component supply unit 20b among the plurality of identical component supply units 20. Is mounted on the board B arranged at the same board work position W, and the first same component supply is based on the fact that the remaining number of the electronic components E of the first same component supply unit 20a is less than the threshold value. The supply of the electronic component E by the unit 20a is stopped, and the electronic component E supplied from the first identical component supply unit 20a is switched to the control supplied from the second identical component supply unit 20b.
  • the electronic component E can be supplied from the second identical component supply unit 20b to the substrate B arranged at the same substrate work position W as when the electronic component E was supplied from the first identical component supply unit 20a.
  • the electronic component E supplied from the same component supply unit 20a can be reliably supplied from the second identical component supply unit 20b.
  • the mounting of the electronic component E can be performed on behalf of the board B without arranging the board B at different board work positions W.
  • the reel on which the tape on which the electronic component E is arranged is wound is newly transferred to the first identical component supply section 20a. Since there is no need to supply, new reels can be prevented from being used.
  • the control unit 9 acquires the remaining number of the electronic components E of each of the plurality of identical component supply units 20, and at a predetermined timing, the first identical component supply unit It is configured to control whether or not the remaining number of the electronic components E acquired in 20a is less than the threshold value. As a result, it is confirmed whether or not the remaining number of acquired electronic components E is less than the threshold value at a predetermined timing after acquiring the remaining number of electronic components E of each of the plurality of identical component supply units 20. Therefore, it is possible to surely confirm whether or not the remaining number of the electronic components E of the first identical component supply unit 20a is less than the threshold value.
  • the component mounting device 100 includes a storage unit that stores the association information 9a in which the arrangement location information of the plurality of identical component supply units 20 is associated with each other.
  • the control unit 9 acquires the placement location information of the second identical component supply unit 20b based on the association information 9a. It is configured as follows. As a result, the placement location information of the second identical component supply unit 20b can be easily acquired by the association information 9a, so that the placement location information of the second identical component supply section 20b and the second identical component supply section 20b can be obtained.
  • the electronic component E supplied from the first identical component supply unit 20a is supplied as the second identical component. It is possible to efficiently switch to the control supplied from the unit 20b.
  • each of the first head 5 and the second head 6 includes a plurality of rotary heads in which a plurality of nozzles N are arranged in a ring shape in a plan view.
  • the control unit 9 sequentially sucks the electronic component E from the first identical component supply unit 20a by the plurality of nozzles N of each of the plurality of rotary heads, the remaining number of the electronic component E of the first identical component supply unit 20a is reduced. Based on the fact that the value is less than the threshold value, the rotary head sucked from the first identical component supply unit 20a among the plurality of rotary heads and the second identical component supply unit 20b among the plurality of rotary heads are attracted.
  • It is configured to switch to the control of supplying the electronic component E from the second identical component supply unit 20b shared by the rotary head, and continue the mounting of the electronic component E on the substrate B.
  • the electronic components E are sequentially sucked from the first identical component supply section 20a by the plurality of nozzles N of the rotary head. Thereby, it is possible to suppress an increase in time for adsorbing the electronic component E on each of the plurality of nozzles N.
  • the electronic parts E of the first same parts supply unit 20a becomes less than the threshold value and the supply of the electronic parts E from the first same parts supply unit 20a is stopped. Since it is not necessary to newly supply the reel around which the tape is wound to the first identical component supply unit 20a, it is possible to prevent the new reel from being used. As a result, it is possible to suppress an increase in the mounting time required for mounting the electronic component E on the substrate B, and it is possible to more reliably suppress an increase in the number of used reels.
  • the plurality of identical component supply units 20 are preset so as to supply the electronic component E instead when the electronic component E is exhausted in the first identical component supply unit 20a. It has the fourth identical component supply unit 20d.
  • the control unit 9 receives electrons from the fourth identical component supply unit 20d based on the fact that the electronic component E becomes less than the threshold value in the first identical component supply unit 20a until the production of the substrate B ends. It is configured to switch to the control supplied by the component E.
  • the control unit 9 has a fourth identical component supply unit based on the fact that the remaining number of electronic components E in the first identical component supply unit 20a becomes less than the threshold value when the production of the substrate B ends.
  • the electronic component E supplied from the first identical component supply unit 20a is switched to the control supplied from the second identical component supply unit 20b.
  • parts can be supplied by the first identical component supply unit 20a or the fourth identical component supply unit 20d and the second identical component supply unit 20b until the end of the production of the substrate B, so that the second component can be supplied. It is possible to suppress a decrease in the production efficiency of the substrate B as compared with the case of the final stage in which the electronic component E is supplied only from the same component supply unit 20b.
  • the first operation is performed at the final stage of the production of the substrate B.
  • the supply of the electronic component E from the same component supply unit 20a and the fourth identical component supply unit 20d can be stopped.
  • the used reel Can be suppressed more reliably.
  • the component mounting device 100 includes a base 1, a feeder arrangement unit 2, a display unit 3, a substrate transport unit 4, a plurality of support units (not shown), and a plurality of pairs. It includes a rail unit (not shown), a first head 5, a second head 6, a component recognition camera 7, a board recognition camera 8, and a control unit 9.
  • the first head 5 and the second head 6 are examples of "heads" in the claims.
  • the display unit 3 displays the remaining number of electronic components E of each of the second identical component supply unit 20b and the third identical component supply unit 20c. As shown in FIG. 9, the display unit 3 has switched to control in which the electronic component E supplied from the first identical component supply unit 20a is supplied from the second identical component supply unit 20b or the third identical component supply unit 20c. The case mounting completion time t1 (mounting completion time t2) is displayed.
  • the control unit 9 of the second embodiment mounts the electronic component E on the substrate B for production, and in order to suppress the generation of used reels, the remaining number of the electronic components E of the first identical component supply unit 20a. Is configured to switch from only the second identical component supply unit 20b selected by the operator to the control of supplying the electronic component E based on the fact that is less than the threshold value.
  • the operator selects an appropriate same component supply unit 20 (for example, the second identical component supply unit 20b) by referring to the remaining number of the electronic components E displayed on the display unit 3 and the mounting completion time. ..
  • the control unit 9 displays the second identical component supply unit 20b displayed on the display unit 3. Based on the fact that one second identical component supply unit 20b is selected from each of the third identical component supply unit 20c, the electronic component E to be supplied from the first identical component supply unit 20a is selected. It is configured to switch to the control of supplying the electronic component E from the second identical component supply unit 20b.
  • the selected third identical component supply unit 20c may be used. Further, the other configurations of the second embodiment are the same as the configurations of the first embodiment.
  • the component mounting process is a process of switching control so as to share the same component supply unit 20 selected by the operator.
  • step S201 the control unit 9 displays a list of switchable same component supply units 20.
  • step S202 the control unit 9 accepts the same component supply unit 20 selected by the operator from the list displayed on the display unit 3.
  • the control unit 9 is supplied from each of the first identical component supply unit 20a and the second identical component supply unit 20b among the plurality of identical component supply units 20.
  • the number of remaining electronic components E in the first same component supply unit 20a is less than the threshold value. 1 It is configured to stop the supply of the electronic component E by the same component supply unit 20a and switch to the control of supplying the electronic component E supplied from the first identical component supply unit 20a from the second identical component supply unit 20b. ing.
  • the mounting of the electronic component E can be performed on behalf of the board B without arranging the board B at different board work positions W.
  • the component mounting device 100 includes a display unit 3 that displays the remaining number of electronic components E of the second identical component supply unit 20b.
  • the display unit 3 displays the mounting completion time when the electronic component E supplied from the first identical component supply unit 20a is switched to the control supplied from the second identical component supply unit 20b.
  • the control unit 9 has a plurality of second identical component supply units 20b acquired based on the association information 9a, the control unit 9 is one of the plurality of second identical component supply units 20b displayed on the display unit 3. 2
  • the electronic component E supplied from the first identical component supply unit 20a is controlled to supply the electronic component E from the selected second identical component supply unit 20b. It is configured to switch.
  • the operator selects the second identical component supply unit 20b by referring to the remaining number of electronic components E of the second identical component supply unit 20b displayed by the display unit 3, so that the second identical component supply unit 20b is selected. Since the second identical component supply unit 20b can be selected in consideration of the number of switching of the control for supplying the electronic component E from the above, the number of switching of the control for supplying the electronic component E from the second identical component supply unit 20b is increased. Can be suppressed. Further, the operator can select the second identical component supply unit 20b with reference to the mounting completion time displayed by the display unit 3, thereby selecting the second identical component supply unit 20b having a short production time of the substrate B. Therefore, it is possible to suppress an increase in the production time of the substrate B after switching to the mounting of the electronic component E from the second identical component supply unit 20b.
  • the other effects of the second embodiment are the same as the effects of the first embodiment.
  • the component mounting device 100 includes a base 1, a feeder arrangement unit 2, a display unit 3, a substrate transport unit 4, a plurality of support units (not shown), and a plurality of pairs. It includes a rail unit (not shown), a first head 5, a second head 6, a component recognition camera 7, a board recognition camera 8, and a control unit 9.
  • the first head 5 and the second head 6 are examples of "heads" in the claims.
  • control unit 9 of the third embodiment when the components are mounted on the substrate B and produced, the remaining number of the electronic components E of the first identical component supply unit 20a is increased in order to suppress the generation of used reels. It is configured to switch to the control of supplying the electronic component E from the second identical component supply unit 20b automatically selected based on the fact that the value becomes less than the threshold value.
  • the control unit 9 is configured to control to select an appropriate same component supply unit 20 (for example, the second identical component supply unit 20b) based on a preset priority.
  • the control unit 9 has the second identical component supply unit 20b based on the remaining number of the electronic components E of the second identical component supply unit 20b and the third identical component supply unit 20c stored in the storage unit. Is selected, and the electronic component E supplied from the first identical component supply unit 20a is switched to the control for supplying the electronic component E from the selected second identical component supply unit 20b.
  • the control unit 9 preferentially selects the one having the larger remaining number of electronic parts E among the remaining number of electronic parts E of each of the second identical component supply unit 20b and the third identical component supply unit 20c. Is configured to do.
  • the other configurations of the third embodiment are the same as the configurations of the second embodiment.
  • the component mounting process is a process of switching the control so as to share the same component supply unit 20 automatically selected based on the priority.
  • step S301 the control unit 9 selects the same component supply unit 20 having a large number of remaining electronic components E.
  • the control unit 9 may select the same component supply unit 20 having a small remaining number of electronic components E, or the same component supply unit 20 having the same head to be adsorbed.
  • the control unit 9 is supplied from each of the first identical component supply unit 20a and the second identical component supply unit 20b among the plurality of identical component supply units 20.
  • the number of remaining electronic components E in the first same component supply unit 20a is less than the threshold value. 1 It is configured to stop the supply of the electronic component E by the same component supply unit 20a and switch to the control of supplying the electronic component E supplied from the first identical component supply unit 20a from the second identical component supply unit 20b. ing.
  • the mounting of the electronic component E can be performed on behalf of the board B without arranging the board B at different board work positions W.
  • the remaining number of the electronic components E of each of the plurality of identical component supply units 20 and the electronic components E of each of the plurality of identical component supply units 20 are stored in the storage unit.
  • the type of head used for adsorption is stored.
  • the control unit 9 is the remaining number of electronic components E of each of the plurality of second identical component supply units 20b among the plurality of identical component supply units 20 stored in the storage unit, or the plurality of second identical component supply units.
  • the second identical component supply unit 20b is selected, and the electronic component E to be supplied from the first identical component supply unit 20a is selected from the second identical component supply unit 20b. It is configured to switch to control to supply component E.
  • the second identical component supply unit 20b can be automatically selected by the control unit 9, so that the work load on the operator can be reduced.
  • the other effects of the third embodiment are the same as the effects of the second embodiment.
  • the component mounting device 100 includes a base 1, a feeder arrangement unit 2, a display unit 3, a substrate transport unit 4, a plurality of support units (not shown), and a plurality of pairs. It includes a rail unit (not shown), a first head 5, a second head 6, a component recognition camera 7, a board recognition camera 8, and a control unit 9.
  • the first head 5 and the second head 6 are examples of "heads" in the claims.
  • the control unit 9 of the fourth embodiment mounts the electronic component E on the substrate B for production, and in order to suppress the generation of used reels, the remaining number of the electronic components E of the first identical component supply unit 20a. Is configured to switch to the control of supplying the electronic component E only from the second identical component supply unit 20b based on the fact that is less than the threshold value. Then, the control unit 9 controls to supply the electronic component E only from the second identical component supply unit 20b based on the fact that the electronic component E is replenished to the first identical component supply unit 20a. It is configured to switch to the control of supplying the electronic component E from both the unit 20a and the second identical component supply unit 20b.
  • the remaining number of the electronic parts E of the first same component supply unit 20a in which the remaining number of the electronic parts E is less than the threshold value becomes equal to or higher than the threshold value by replenishing the electronic parts E.
  • the control of supplying the electronic component E from the second identical component supply unit 20b to the electronic component E supplied from the first identical component supply unit 20a is controlled by the first identical component supply unit 20a. It is configured to switch to the control to supply E and continue the mounting of the electronic component E on the substrate B.
  • the other configurations of the fourth embodiment are the same as the configurations of the first embodiment.
  • the component mounting process is a process of canceling the sharing of the shared same component supply unit 20 and returning to the supply of the electronic component E from the original same component supply unit 20.
  • step S401 in the control unit 9, from the state in which the electronic component E is supplied only by the second identical component supply unit 20b, the electronic component E is supplied by both the first identical electronic component E supply unit and the second identical component supply unit 20b. It can be switched to the supplied state.
  • the control unit 9 is supplied from each of the first identical component supply unit 20a and the second identical component supply unit 20b among the plurality of identical component supply units 20.
  • the number of remaining electronic components E in the first same component supply unit 20a is less than the threshold value. 1 It is configured to stop the supply of the electronic component E by the same component supply unit 20a and switch to the control of supplying the electronic component E supplied from the first identical component supply unit 20a from the second identical component supply unit 20b. ing.
  • the mounting of the electronic component E can be performed on behalf of the board B without arranging the board B at different board work positions W.
  • the remaining number of the electronic components E of the first same component supply unit 20a in which the remaining number of the electronic components E is less than the threshold value is the electronic component E.
  • the control of supplying the electronic component E from the second identical component supply unit 20b to the amount supplied from the first identical component supply unit 20a based on the return to the threshold value or more by the replenishment of the first is performed. It is configured to switch to the control of supplying the electronic component E from the same component supply unit 20a and continue the mounting of the electronic component E on the substrate B.
  • the electronic component E can be mounted by returning to the optimum moving path of the nozzle N. Therefore, the electronic component E can be efficiently mounted on the substrate B.
  • the other effects of the fourth embodiment are the same as the effects of the first embodiment.
  • the configuration of the component mounting device 500 according to the fifth embodiment will be described with reference to FIGS. 13 to 19.
  • the component mounting device 500 has an in-line head.
  • reference numerals are used for the parts that overlap with the configuration of the first embodiment, and detailed description thereof will be omitted.
  • the component mounting device 500 includes a base 1, a feeder arrangement unit 2, a display unit 3, a substrate transport unit 4, a plurality of support units (not shown), and a plurality of pairs. It includes a rail unit (not shown), a head 505, a component recognition camera 7, a board recognition camera 8, and a control unit 509.
  • the head 505 is a component mounting unit, and is configured to mount the electronic component E on the substrate B fixed at the working position.
  • the head 505 is an in-line head in which a plurality of nozzles N are arranged on a straight line.
  • the control unit 509 of the fifth embodiment places the electronic component E supplied from each of the first identical component supply unit 20a and the second identical component supply unit 20b of the plurality of identical component supply units 20 at the same board work position W. Based on the fact that the remaining number of electronic components E of the first identical component supply unit 20a is less than the threshold value when mounted on the board B arranged in the first identical component supply unit 20a, the electronic component E by the first identical component supply unit 20a Is configured to be stopped and the electronic component E supplied from the first identical component supply unit 20a is switched to the control to be supplied from the second identical component supply unit 20b.
  • the first identical component supply unit 20a is arranged at the first location P1.
  • the first component C1 is arranged in the first identical component supply unit 20a.
  • the type of head that attracts the first component C1 of the first identical component supply unit 20a is, for example, the head 505 (described as H1 in FIGS. 14, 16 and 18).
  • the type of the nozzle N that adsorbs the first component C1 of the first identical component supply unit 20a is, for example, the first nozzle N1.
  • the same component supply unit information of the first location P1 for example, the first component C1 arranged at the second location P2 is set.
  • the same component supply unit information of the first location P1 for example, the first component C1 arranged at the third location P3 is set.
  • the second identical parts supply unit 20b is arranged at the second location P2.
  • the first component C1 is arranged in the second identical component supply unit 20b.
  • the type of head that attracts the first component C1 of the second identical component supply unit 20b is, for example, the head 505 (described as H1 in FIGS. 14, 16 and 18).
  • the type of the nozzle N that adsorbs the first component C1 of the second identical component supply unit 20b is, for example, the second nozzle N2.
  • the same component supply unit information of the second location P2 for example, the first component C1 arranged at the first location P1 is set.
  • the same component supply unit information of the second location P2 for example, the first component C1 arranged at the third location P3 is set.
  • the third identical parts supply unit 20c is arranged at the third location P3.
  • the first component C1 is arranged in the third identical component supply unit 20c.
  • the type of head that attracts the first component C1 of the third identical component supply unit 20c is, for example, the head 505 (described as H1 in FIGS. 14, 16 and 18).
  • the type of the nozzle N that adsorbs the first component C1 of the third identical component supply unit 20c is, for example, the third nozzle N3.
  • the same component supply unit information of the third location P3 for example, the first component C1 arranged at the first location P1 is set.
  • the same component supply unit information of the third location P3, for example, the first component C1 arranged at the second location P2 is set.
  • the fourth identical parts supply unit 20d is arranged at the fourth location P4.
  • the first component C1 is arranged in the fourth identical component supply unit 20d.
  • the type of head that attracts the first component C1 of the fourth identical component supply unit 20d is, for example, the first head.
  • the type of the nozzle N that adsorbs the first component C1 of the fourth identical component supply unit 20d is, for example, the first nozzle N1.
  • control unit 509 usually has the first identical component supply unit 20a of the first location P1, the second identical component supply unit 20b of the second location P2, and the third location P3. It is configured to control the supply of electronic components E from all of the third identical component supply units 20c.
  • the electronic component E is the threshold value in the first identical component supply unit 20a of the first location P1 until the production of the substrate B is in the final stage. It is configured to switch to the control of supplying the electronic component E from the fourth identical component supply unit 20d of the fourth location P4 based on the fact that the value is less than the limit. Specifically, the control unit 509 is based on the fact that the remaining number of electronic components E in the first identical component supply unit 20a of the first location P1 becomes 0 until the production of the substrate B ends. , The electronic component E is replenished from the fourth identical component supply unit 20d of the fourth location P4 set in advance.
  • the remaining number of the electronic components E in the first same component supply unit 20a becomes less than the threshold value.
  • the electronic component E supplied from the first identical component supply unit 20a instead of the fourth identical component supply section 20d at the fourth location P4 is supplied from the second identical component supply section 20b at the second location P2. It is configured to switch to supply control.
  • the other configurations of the fifth embodiment are the same as the configurations of the first embodiment.
  • the control unit 509 is supplied from each of the first identical component supply unit 20a and the second identical component supply unit 20b among the plurality of identical component supply units 20.
  • the number of remaining electronic components E in the first same component supply unit 20a is less than the threshold value. 1 It is configured to stop the supply of the electronic component E by the same component supply unit 20a and switch to the control of supplying the electronic component E supplied from the first identical component supply unit 20a from the second identical component supply unit 20b. ing.
  • the mounting of the electronic component E can be performed on behalf of the board B without arranging the board B at different board work positions W.
  • the head 507 includes an in-line head in which a plurality of nozzles N are arranged on a straight line.
  • the control unit 509 simultaneously causes the electronic component E to be sucked from each of the plurality of identical component supply units 20 by the plurality of nozzles N of the inline head, the remaining number of the electronic component E of the first identical component supply unit 20a is reduced. Based on the fact that the value is less than the threshold value, the nozzle N that has been sucked from the first identical component supply unit 20a among the plurality of nozzles N and the nozzle N that has been sucked from the second same component supply unit 20b among the plurality of nozzles N are sucked.
  • It is configured to switch to the control of supplying the electronic component E from the second identical component supply unit 20b shared by the nozzle N, and continue the mounting of the electronic component E on the substrate B.
  • the electronic components E are simultaneously supplied from each of the plurality of identical component supply units 20 by the plurality of nozzles N of the inline head. By causing the suction operation, the electronic component E can be efficiently sucked to each of the plurality of nozzles N.
  • the electronic parts E of the first same parts supply unit 20a are arranged. Since it is not necessary to newly supply the reel around which the tape is wound to the first identical component supply unit 20a, it is possible to prevent the new reel from being used. As a result, the efficiency of mounting the electronic component E on the substrate B can be improved, and the increase in the number of used reels can be suppressed more reliably.
  • the other effects of the fifth embodiment are the same as the effects of the first embodiment.
  • the threshold value of the remaining number of electronic components E in the first identical component supply unit 20a is 1, but the present invention has been shown. Is not limited to this.
  • the threshold value of the remaining number of parts in one and the same parts supply unit may be a numerical value other than 1.
  • the control unit 9 includes a first identical component supply unit 20a, a second identical component supply unit 20b, and a third identical component supply unit 20c (a plurality of identical component supply units). Whether or not the remaining number of parts acquired in the first same part supply unit 20a (one same part supply unit) has become less than the threshold value at a predetermined timing while acquiring the remaining number of each electronic component E of the above. Although an example configured to perform control for confirming the above is shown, the present invention is not limited to this. In the present invention, after the control unit acquires the remaining number of electronic parts of each of a plurality of the same parts supply units, whether or not the remaining number of parts acquired in one same parts supply unit is less than the threshold value. It may be configured to perform control to confirm.
  • the association information 9a shows an example of a table, but the present invention is not limited to this.
  • the association information may be information represented by a database such as a map other than the table.
  • the control unit 9 has a second identical component supply unit 20b and a third identical component supply unit 20c (a plurality of identical components) among a plurality of identical component supply units 20 stored in the storage unit.
  • An example is shown in which control is performed to select a second identical component supply unit 20b (another identical component supply unit) based on the remaining number of each component of the supply unit).
  • the control unit is based on the type of each head of a plurality of other identical component supply units stored in the storage unit of the substrate in order to suppress an increase in the mounting time of the component on the substrate. , It may be configured to control the selection of other same component supply units of the same head type. Further, the control unit controls to select another same component supply unit having a different nozzle type based on the nozzle type of each of the plurality of other identical component supply units stored in the storage unit of the substrate. It may be configured as follows.
  • the first identical component supply unit 20a is an example of the "one identical component supply unit" in the claims, but the present invention is not limited to this.
  • the second identical component supply unit or the third identical component supply unit may be the "one identical component supply unit" in the claims.
  • control processing of the control unit 9 may be performed by an event-driven type (event-driven type) process in which the process is executed in event units. In this case, it may be completely event-driven, or it may be a combination of event-driven and flow-driven.
  • event-driven type event-driven type

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Abstract

A control unit (9) of a component mounting device (100) is configured, when components (E) fed from one identical component feeding part (20a) and other identical component feeding parts (20b, 20c) are to be mounted on a substrate (B) disposed at the same substrate work position (W), to stop feeding of components (E) by the one identical component feeding part (20a) in the case where the remaining number of components (E) of the one identical component feeding part (20a) reaches less than a threshold value, and to switch control such that components (E), which are supposed to be fed from the one identical component feeding part (20a), is fed from one of the other identical component feeding parts (20b).

Description

部品実装装置Component mounting device
 この発明は、部品実装装置に関し、特に、複数のノズルが取り付けられたヘッドを備える部品実装装置に関する。 The present invention relates to a component mounting device, and more particularly to a component mounting device including a head to which a plurality of nozzles are attached.
 従来、複数のノズルが取り付けられたヘッドを備える部品実装装置が知られている。このような部品実装装置は、たとえば、特開2004-282102号公報に開示されている。 Conventionally, a component mounting device including a head to which a plurality of nozzles are attached is known. Such a component mounting device is disclosed in, for example, Japanese Patent Application Laid-Open No. 2004-282102.
 上記特開2004-282102号公報には、複数のノズルが取り付けられたヘッド部(ヘッド)を備える単位電子部品実装装置(部品実装装置)が開示されている。単位電子部品実装装置は、一列に複数配置されている。これにより、実装ラインが構成されている。単位電子部品実装装置は、電子部品の供給部に配置された複数のテープフィーダを備えている。単位電子部品実装装置は、制御部と、記憶部とを備えている。制御部は、単位電子部品実装装置を制御するように構成されている。記憶部には、単位電子部品実装装置自身において実装される電子部品に関連する単位実装データ、および、実装ラインを構成する複数の単位電子部品実装装置全体において実装される電子部品に関連する全体実装データが記憶されている。 The Japanese Patent Application Laid-Open No. 2004-282102 discloses a unit electronic component mounting device (component mounting device) including a head portion (head) to which a plurality of nozzles are attached. A plurality of unit electronic component mounting devices are arranged in a row. As a result, the mounting line is configured. The unit electronic component mounting device includes a plurality of tape feeders arranged in the supply section of the electronic component. The unit electronic component mounting device includes a control unit and a storage unit. The control unit is configured to control the unit electronic component mounting device. In the storage unit, the unit mounting data related to the electronic components mounted by the unit electronic component mounting device itself, and the entire mounting related to the electronic components mounted in the entire plurality of unit electronic component mounting devices constituting the mounting line. The data is stored.
 上記特開2004-282102号公報の制御部は、複数の単位電子部品実装装置の一の単位電子部品実装装置において部品切れが発生した場合、全体実装データに基づいて、複数の単位電子部品実装装置のうちの他の単位電子部品実装装置において電子部品の実装を代行させる制御を行うように構成されている。 The control unit of JP-A-2004-282102 describes a plurality of unit electronic component mounting devices based on the overall mounting data when a component breakage occurs in one unit electronic component mounting device of the plurality of unit electronic component mounting devices. The other unit of the electronic component mounting device is configured to control the mounting of electronic components on behalf of the device.
特開2004-282102号公報Japanese Unexamined Patent Publication No. 2004-282102
 しかしながら、上記特開2004-282102号公報の単位電子部品実装装置では、一の単位電子部品実装装置の基板作業位置ではなく、他の単位電子部品実装装置の基板作業位置に基板を配置しなければ、電子部品の実装を代行させることができないという問題点がある。 However, in the unit electronic component mounting device of JP-A-2004-282102, the substrate must be placed not at the board working position of one unit electronic component mounting device but at the board working position of another unit electronic component mounting device. , There is a problem that it is not possible to substitute the mounting of electronic components.
 この発明は、上記のような課題を解決するためになされたものであり、この発明の1つの目的は、異なる基板作業位置に基板を配置しなくても、部品の実装を代行させることが可能な部品実装装置を提供することである。 The present invention has been made to solve the above-mentioned problems, and one object of the present invention is that it is possible to substitute the mounting of parts without arranging the boards at different board working positions. It is to provide a flexible component mounting device.
 この発明の一の局面による部品実装装置は、基板に実装される部品のうち同一の部品を供給する複数の同一部品供給部と、複数の同一部品供給部から供給される部品を吸着し基板に部品を実装することにより生産する複数のノズルが取り付けられたヘッドと、ノズルにより複数の同一部品供給部から部品を吸着して基板に実装する制御を行う制御部とを備え、制御部は、複数の同一部品供給部のうちの一の同一部品供給部および他の同一部品供給部の各々から供給された部品を同じ基板作業位置に配置された基板に実装する場合に、一の同一部品供給部の部品の残数がしきい値未満になったことに基づいて、一の同一部品供給部による部品の供給を停止するとともに、一の同一部品供給部から供給する分の部品を他の同一部品供給部から供給する制御に切り替えるように構成されている。なお、同一の部品とは、同一部品供給部から供給される同じ形状および同じ機能を有する部品を示す。 The component mounting apparatus according to one aspect of the present invention attracts a plurality of the same component supply units that supply the same component among the components mounted on the board and components supplied from the plurality of the same component supply sections to the substrate. It is equipped with a head to which a plurality of nozzles produced by mounting a component are attached, and a control unit that controls the mounting of components on a board by sucking components from a plurality of the same component supply units by the nozzles. When the parts supplied from each of the same parts supply unit and the other same parts supply unit of the same parts supply unit are mounted on a board arranged at the same board work position, one same component supply unit is used. Based on the fact that the remaining number of parts in is less than the threshold value, the supply of parts by one same parts supply unit is stopped, and the parts supplied from one same parts supply unit are replaced by other same parts. It is configured to switch from the supply unit to the control to supply. The same component refers to a component having the same shape and the same function supplied from the same component supply unit.
 この発明の一の局面による部品実装装置では、上記のように、制御部を、複数の同一部品供給部のうちの一の同一部品供給部および他の同一部品供給部の各々から供給された部品を同じ基板作業位置に配置された基板に実装する場合に、一の同一部品供給部の部品の残数がしきい値未満になったことに基づいて、一の同一部品供給部による部品の供給を停止するとともに、一の同一部品供給部から供給する分の部品を他の同一部品供給部から供給する制御に切り替えるように構成する。これにより、一の同一部品供給部から供給する分の部品を部品実装装置上の他の同一部品供給部における電子部品の実装に切り替えることにより、一の同一部品供給部から供給していた際と同じ基板作業位置に配置された基板に他の同一部品供給部から部品を供給することができるので、一の同一部品供給部から供給する分の部品を他の同一部品供給部から確実に供給することができる。その結果、異なる基板作業位置に基板を配置しなくても、部品の実装を代行させることができる。また、一の同一部品供給部において部品の残数がしきい値未満になった際、電子部品が配置されたテープが巻き回したリールを新たに一の同一部品供給部に供給する必要がないので、新たなリールが使われないようにすることができる。その結果、使いかけのリールを減少させることができる。また、電子部品が配置されたテープが巻き回したリールを新たに一の同一部品供給部に供給する必要がないことにより、オペレータによるリールの交換作業を減少させることができるので、オペレータの作業負担を軽減させることができる。 In the component mounting device according to one aspect of the present invention, as described above, the control unit is a component supplied from each of the same component supply unit and the other identical component supply unit among a plurality of identical component supply units. Is supplied by the same component supply unit based on the fact that the remaining number of components in the same component supply section is less than the threshold value when mounting the components on the boards arranged in the same board work position. Is stopped, and the parts supplied from one same parts supply unit are switched to the control supplied from the other same parts supply unit. As a result, by switching the parts supplied from one same component supply unit to the mounting of electronic components in another same component supply unit on the component mounting device, the components supplied from one same component supply unit are supplied. Since parts can be supplied from other same parts supply parts to the boards arranged at the same board work position, parts supplied from one same parts supply part can be reliably supplied from other same parts supply parts. be able to. As a result, it is possible to substitute the mounting of components without arranging the boards at different board working positions. Further, when the remaining number of parts in the same parts supply unit becomes less than the threshold value, it is not necessary to newly supply the reel on which the tape on which the electronic parts are arranged is wound to the same parts supply unit. Therefore, it is possible to prevent the new reel from being used. As a result, the number of used reels can be reduced. Further, since it is not necessary to newly supply the reel around which the tape on which the electronic component is arranged is wound to one same component supply unit, the reel replacement work by the operator can be reduced, so that the operator's workload is burdened. Can be reduced.
 上記一の局面による部品実装装置において、好ましくは、制御部は、複数の同一部品供給部の各々の部品の残数を取得するとともに、所定のタイミングで、一の同一部品供給部において取得した部品の残数がしきい値未満になったか否かを確認する制御を行うように構成されている。このように構成すれば、複数の同一部品供給部の各々の部品の残数を取得した後の所定のタイミングで、取得した部品の残数がしきい値未満になったか否かを確認することができるので、一の同一部品供給部の部品の残数がしきい値未満になったか否かを確実に確認することができる。 In the component mounting device according to the above one aspect, preferably, the control unit acquires the remaining number of components of each of a plurality of the same component supply units, and at a predetermined timing, the components acquired by the same component supply unit. It is configured to control whether or not the remaining number of is less than the threshold value. With this configuration, it is possible to confirm whether or not the remaining number of acquired parts is less than the threshold value at a predetermined timing after acquiring the remaining number of each part of a plurality of the same parts supply unit. Therefore, it is possible to surely confirm whether or not the remaining number of parts in one and the same parts supply unit is less than the threshold value.
 上記一の局面による部品実装装置において、好ましくは、複数の同一部品供給部の配置場所情報を互いに関連付けた関連付け情報を記憶した記憶部をさらに備え、制御部は、一の同一部品供給部の部品の残数がしきい値未満になった際、関連付け情報に基づいて、他の同一部品供給部の配置場所情報を取得するように構成されている。このように構成すれば、関連付け情報により他の同一部品供給部の配置場所情報を容易に取得することができるので、他の同一部品供給部と、他の同一部品供給部の配置場所情報とが関連付けられておらず、他の同一部品供給部の配置場所を総当り的に検索する場合と比較して、一の同一部品供給部から供給する分の部品を他の同一部品供給部から供給する制御への切り替えを効率良く行うことができる。 In the component mounting device according to the above one aspect, preferably, a storage unit that stores association information in which the arrangement location information of a plurality of the same component supply units is associated with each other is further provided, and the control unit is a component of one identical component supply unit. When the remaining number of parts is less than the threshold value, the placement location information of other same parts supply parts is acquired based on the association information. With this configuration, the placement location information of other identical parts supply units can be easily obtained from the association information, so that the placement location information of the other same parts supply unit and the other same parts supply unit can be obtained. Compared to the case of brute force searching for the location of other same parts supply parts that are not related, parts supplied from one same parts supply part are supplied from other same parts supply parts. Switching to control can be performed efficiently.
 この場合、好ましくは、他の同一部品供給部の部品の残数と、一の同一部品供給部から供給する分の部品を他の同一部品供給部から供給する制御に切り替えた場合の実装完了時間とを表示する表示部をさらに備え、制御部は、関連付け情報に基づいて取得された他の同一部品供給部が複数ある場合、表示部に表示された複数の他の同一部品供給部の各々のうちから1つの他の同一部品供給部が選択されたことに基づいて、一の同一部品供給部から供給する分の部品を選択された他の同一部品供給部から部品を供給する制御に切り替えるように構成されている。このように構成すれば、オペレータが表示部により表示された他の同一部品供給部の部品の残数を参照して他の同一部品供給部を選択することにより、他の同一部品供給部から部品を供給する制御の切り替え回数を考慮して他の同一部品供給部を選択することができるので、他の同一部品供給部から部品を供給する制御の切り替え回数の増加を抑制することができる。また、オペレータが表示部により表示された実装完了時間を参照して他の同一部品供給部を選択することにより、基板の生産時間が短い他の同一部品供給部を選択することができるので、他の同一部品供給部からの部品の実装に切り替えた後の基板の生産時間の増加を抑制することができる。 In this case, preferably, the remaining number of parts in the other same parts supply unit and the mounting completion time when the control is switched to supply the parts supplied from one same parts supply unit from the other same parts supply unit. Further, the control unit is provided with a display unit for displaying and, when there are a plurality of other identical component supply units acquired based on the association information, each of the plurality of other identical component supply units displayed on the display unit. Based on the selection of one other identical parts supply unit, the control for supplying parts from one of the same parts supply units is switched to the control of supplying parts from the selected other same parts supply unit. It is configured in. With this configuration, the operator can select another same parts supply unit by referring to the remaining number of parts in the other same parts supply unit displayed by the display unit, so that the parts can be selected from the other same parts supply unit. Since the other same component supply unit can be selected in consideration of the number of switching of the control for supplying the parts, it is possible to suppress an increase in the number of switching of the control for supplying the component from the other same component supply unit. Further, since the operator can select another same component supply unit by referring to the mounting completion time displayed by the display unit, another same component supply unit having a short board production time can be selected. It is possible to suppress an increase in the production time of the substrate after switching to mounting parts from the same parts supply unit.
 上記記憶部を備える部品実装装置において、好ましくは、記憶部には、複数の同一部品供給部の各々の部品の残数、および、複数の同一部品供給部の各々の部品の吸着に用いられるヘッドの種類が記憶されており、制御部は、記憶部に記憶された複数の同一部品供給部のうちの複数の他の同一部品供給部の各々の部品の残数、または、複数の他の同一部品供給部の各々のヘッドの種類に基づいて、他の同一部品供給部を選択するとともに、一の同一部品供給部から供給する分の部品を選択した他の同一部品供給部から部品を供給する制御に切り替えるように構成されている。このように構成すれば、他の同一部品供給部を制御部により自動で選択することができるので、オペレータの作業負担を軽減させることができる。 In the component mounting device including the storage unit, preferably, the storage unit is a head used for sucking the remaining number of each component of a plurality of the same component supply section and each component of the plurality of the same component supply section. The type of is stored, and the control unit stores the remaining number of parts of each of the plurality of other identical component supply units among the plurality of identical component supply units stored in the storage unit, or a plurality of other identical components. Based on the type of each head of the parts supply unit, another same parts supply unit is selected, and parts are supplied from the other same parts supply unit that selects parts to be supplied from one same parts supply unit. It is configured to switch to control. With this configuration, other identical component supply units can be automatically selected by the control unit, so that the work load on the operator can be reduced.
 上記一の局面による部品実装装置において、好ましくは、制御部は、部品の残数がしきい値未満になった一の同一部品供給部の部品の残数が部品の補充によりしきい値以上に戻ったことに基づいて、一の同一部品供給部から供給する分の部品を他の同一部品供給部から部品を供給する制御を、一の同一部品供給部から部品を供給する制御に切り替えて基板への部品の実装を継続させるように構成されている。このように構成すれば、一の同一部品供給部から部品を吸着する経路が予め最適な移動経路として取得されている場合、最適なノズルの移動経路に戻して部品の実装を行うことができるので、基板への部品の実装を効率良く行うことができる。 In the component mounting device according to the above one aspect, preferably, the control unit has the remaining number of parts in the same component supply unit that is less than the threshold value, and the remaining number of components in the same component supply unit exceeds the threshold value by replenishing the components. Based on the return, the control of supplying parts from one same parts supply unit to the parts supplied from another same parts supply unit is switched to the control of supplying parts from one same parts supply unit to the board. It is configured to continue mounting components on. With this configuration, if the path for sucking parts from one and the same component supply unit is acquired in advance as the optimum movement path, it is possible to return to the optimum nozzle movement path and mount the component. , It is possible to efficiently mount components on the board.
 上記一の局面による部品実装装置において、好ましくは、ヘッドは、複数のノズルが直線上に複数配置されたインラインヘッドを含み、制御部は、インラインヘッドの複数のノズルにより複数の同一部品供給部の各々から同時に部品の吸着動作をさせる場合に、一の同一部品供給部の部品の残数がしきい値未満になったことに基づいて、複数のノズルのうち一の同一部品供給部から吸着していたノズルと、複数のノズルのうち他の同一部品供給部から吸着していたノズルとにより共有された他の同一部品供給部から部品を供給する制御に切り替えて基板への部品の実装を継続させるように構成されている。このように構成すれば、一の同一部品供給部の部品の残数がしきい値未満になる前において、インラインヘッドの複数のノズルにより複数の同一部品供給部の各々から同時に部品の吸着動作をさせることにより、複数のノズルの各々への部品の吸着を効率良く行うことができる。また、一の同一部品供給部の部品の残数がしきい値未満になり一の同一部品供給部からの部品の供給が停止された後において、部品が配置されたテープが巻き回されたリールを新たに一の同一部品供給部に供給する必要がないので、新たなリールが使われないようにすることができる。これらの結果、部品を基板に実装する効率を向上させることができるとともに、使いかけのリールが増加することを抑制することができる。 In the component mounting device according to the above one aspect, preferably, the head includes an inline head in which a plurality of nozzles are arranged in a straight line, and the control unit is a plurality of identical component supply units by the plurality of nozzles of the inline head. When the parts are sucked from each of them at the same time, they are sucked from the same parts supply part of one of a plurality of nozzles based on the fact that the remaining number of parts in one same parts supply part becomes less than the threshold value. Switch to the control of supplying parts from the other same parts supply unit shared by the nozzle that was being used and the nozzle that was adsorbed from the other same parts supply unit among multiple nozzles, and continue mounting the parts on the board. It is configured to let you. With this configuration, before the remaining number of parts in one and the same parts supply unit becomes less than the threshold value, multiple nozzles of the in-line head can simultaneously suck parts from each of the multiple same parts supply units. By doing so, it is possible to efficiently adsorb the parts to each of the plurality of nozzles. Further, after the remaining number of parts in the same parts supply unit becomes less than the threshold value and the supply of parts from the same parts supply unit is stopped, the reel on which the tape on which the parts are arranged is wound is wound. Since it is not necessary to newly supply the same parts to one and the same parts supply unit, it is possible to prevent the new reel from being used. As a result, it is possible to improve the efficiency of mounting the components on the substrate and suppress the increase in the number of used reels.
 上記一の局面による部品実装装置において、好ましくは、ヘッドは、複数のノズルが平面視において環状に複数配置された複数のロータリーヘッドを含み、制御部は、複数のロータリーヘッドの各々の複数のノズルにより一の同一部品供給部から順次部品を吸着する場合に、一の同一部品供給部の部品の残数がしきい値未満になったことに基づいて、複数のロータリーヘッドのうち一の同一部品供給部から吸着していたロータリーヘッドと、複数のロータリーヘッドのうち他の同一部品供給部から吸着していたロータリーヘッドとにより共有された他の同一部品供給部から部品を供給する制御に切り替えて基板への部品の実装を継続させるように構成されている。このように構成すれば、一の同一部品供給部の部品の残数がしきい値未満になる前において、ロータリーヘッドの複数のノズルにより一の同一部品供給部から順次部品を吸着することにより、複数のノズルの各々に部品を吸着させるための時間の増大を抑制することができる。また、一の同一部品供給部の部品の残数がしきい値未満になり一の同一部品供給部からの部品の供給を停止した後において、部品が配置されたテープが巻き回されたリールを新たに一の同一部品供給部に供給する必要がないので、新たなリールが使われないようにすることができる。これらの結果、部品を基板に実装する際に必要な実装時間の増大を抑制することができるとともに、使いかけのリールが増加することをより確実に抑制することができる。 In the component mounting device according to the above aspect, preferably, the head includes a plurality of rotary heads in which a plurality of nozzles are arranged in a ring shape in a plan view, and the control unit is a plurality of nozzles of each of the plurality of rotary heads. When the parts are sequentially sucked from one and the same parts supply part, one of the plurality of rotary heads is the same part based on the fact that the remaining number of parts in one and the same parts supply part becomes less than the threshold value. Switch to control to supply parts from the same component supply section shared by the rotary head sucked from the supply section and the rotary head sucked from the other same component supply section among multiple rotary heads. It is configured to continue mounting components on the board. With this configuration, before the remaining number of parts in the same parts supply unit becomes less than the threshold value, the parts are sequentially sucked from the same parts supply unit by a plurality of nozzles of the rotary head. It is possible to suppress an increase in time for adsorbing a component to each of a plurality of nozzles. In addition, after the remaining number of parts in the same parts supply unit becomes less than the threshold value and the supply of parts from the same parts supply unit is stopped, the reel on which the tape on which the parts are arranged is wound is wound. Since it is not necessary to newly supply to one and the same parts supply unit, it is possible to prevent a new reel from being used. As a result, it is possible to suppress an increase in the mounting time required for mounting the component on the substrate, and it is possible to more reliably suppress an increase in the number of used reels.
 上記一の局面による部品実装装置において、好ましくは、複数の同一部品供給部は、一の同一部品供給部において部品が無くなった際に代わりに部品を供給するように予め設定された代替供給部を有し、制御部は、基板の生産が終盤になるまでの間、一の同一部品供給部において部品がしきい値未満になったことに基づいて、代替供給部から部品の供給する制御に切り替えるように構成されており、制御部は、基板の生産が終盤になった場合に、一の同一部品供給部の部品の残数がしきい値未満になったことに基づいて、代替供給部ではなく、一の同一部品供給部から供給する分の部品を他の同一部品供給部から供給する制御に切り替えるように構成されている。このように構成すれば、基板の生産の終盤までの間において一の同一部品供給部または代替供給部と、他の同一部品供給部とにより部品を供給することができるので、他の同一部品供給部のみから部品を供給する終盤の場合と比較して、基板の生産の効率が低下することを抑制することができる。また、基板の生産の終盤において一の同一部品供給部から供給する分の部品を他の同一部品供給部から供給する制御に切り替えることにより、基板の生産の終盤において一の同一部品供給部および代替供給部からの部品の供給を停止させることができる。その結果、基板の生産の終盤において一の同一部品供給部または代替供給部と、他の同一部品供給部との両方を使用する場合と比較して、使いかけのリールの増加をより確実に抑制することができる。 In the component mounting device according to the above one aspect, preferably, a plurality of identical component supply units have an alternative supply unit preset to supply components when the components are exhausted in the same component supply unit. The control unit switches to control of supplying parts from the alternative supply unit based on the fact that the parts are less than the threshold value in one and the same parts supply unit until the end of board production. In the alternative supply unit, the control unit is based on the fact that when the production of the board is finished, the remaining number of parts in one and the same component supply unit becomes less than the threshold value. Instead, it is configured to switch the control to supply the parts supplied from one same parts supply unit from the other same parts supply unit. With this configuration, parts can be supplied by one identical component supply unit or alternative supply unit and another same component supply unit until the end of board production, so that other identical component supply units can be supplied. It is possible to suppress a decrease in the production efficiency of the substrate as compared with the case of the final stage in which the parts are supplied only from the part. In addition, by switching the control to supply the parts supplied from one same parts supply unit at the end of board production to the control supplied from another same parts supply unit, the same parts supply unit and alternatives are made at the end of board production. The supply of parts from the supply unit can be stopped. As a result, the increase in used reels is more reliably suppressed compared to the case where both the same component supply unit or alternative supply unit and the other identical component supply unit are used at the end of board production. can do.
 本発明によれば、上記のように、異なる基板作業位置に基板を配置しなくても、部品の実装を代行させることができる。 According to the present invention, as described above, it is possible to substitute the mounting of components without arranging the boards at different board working positions.
第1実施形態の部品実装装置を示した模式図である。It is a schematic diagram which showed the component mounting apparatus of 1st Embodiment. 第1実施形態の部品実装装置のテーブルを示した模式図である。It is a schematic diagram which showed the table of the component mounting apparatus of 1st Embodiment. 第1実施形態の部品実装装置において通常の部品の実装が行われている状態を示した模式図である。It is a schematic diagram which showed the state which the normal component is mounted in the component mounting apparatus of 1st Embodiment. 第1実施形態の部品実装装置のテーブルにおいて第1箇所の第1同一部品供給部からの部品の供給を第2箇所の第4同一部品供給部からの部品の供給に切り替えた状態を示した模式図である。A schematic showing a state in which the supply of parts from the first identical parts supply unit at the first location is switched to the supply of parts from the fourth identical parts supply unit at the second location in the table of the component mounting apparatus of the first embodiment. It is a figure. 第1実施形態の部品実装装置において第1箇所の第1同一部品供給部からの部品の供給を第2箇所の第4同一部品供給部からの部品の供給に切り替えた際の部品の実装が行われている状態を示した模式図である。In the component mounting device of the first embodiment, the components are mounted when the supply of components from the first identical component supply unit at the first location is switched to the supply of components from the fourth identical component supply unit at the second location. It is a schematic diagram which showed the state which is being broken. 第1実施形態の部品実装装置のテーブルにおいて第1箇所の第1同一部品供給部からの部品の供給を第5箇所の第2同一部品供給部からの部品の供給に切り替えた状態を示した模式図である。A schematic showing a state in which the supply of parts from the first identical parts supply unit at the first location is switched to the supply of parts from the second identical parts supply unit at the fifth location in the table of the component mounting apparatus of the first embodiment. It is a figure. 第1実施形態の部品実装装置において第1箇所の第1同一部品供給部からの部品の供給を第5箇所の第2同一部品供給部からの部品の供給に切り替えた際の部品の実装が行われている状態を示した模式図である。In the component mounting device of the first embodiment, the components are mounted when the supply of components from the first identical component supply unit at the first location is switched to the supply of components from the second identical component supply unit at the fifth location. It is a schematic diagram which showed the state which is being broken. 第1実施形態の部品実装装置の部品実装処理を示したフローチャートである。It is a flowchart which showed the component mounting process of the component mounting apparatus of 1st Embodiment. 第2実施形態の部品実装装置の表示部の画面の一例を示した模式図である。It is a schematic diagram which showed an example of the screen of the display part of the component mounting apparatus of 2nd Embodiment. 第2実施形態の部品実装装置の部品実装処理を示したフローチャートである。It is a flowchart which showed the component mounting process of the component mounting apparatus of the 2nd Embodiment. 第3実施形態の部品実装装置の部品実装処理を示したフローチャートである。It is a flowchart which showed the component mounting process of the component mounting apparatus of the 3rd Embodiment. 第4実施形態の部品実装装置の部品実装処理を示したフローチャートである。It is a flowchart which showed the component mounting process of the component mounting apparatus of 4th Embodiment. 第5実施形態の部品実装装置を示した模式図である。It is a schematic diagram which showed the component mounting apparatus of 5th Embodiment. 第5実施形態の部品実装装置のテーブルを示した模式図である。It is a schematic diagram which showed the table of the component mounting apparatus of 5th Embodiment. 第5実施形態の部品実装装置において通常の部品の実装が行われている状態を示した模式図である。It is a schematic diagram which showed the state which the normal component is mounted in the component mounting apparatus of 5th Embodiment. 第5実施形態の部品実装装置のテーブルにおいて第1箇所の第1同一部品供給部からの部品の供給を第4箇所の第4同一部品供給部からの部品の供給に切り替えた状態を示した模式図である。A schematic showing a state in which the supply of parts from the first identical parts supply unit at the first location is switched to the supply of parts from the fourth identical parts supply unit at the fourth location in the table of the component mounting apparatus of the fifth embodiment. It is a figure. 第5実施形態の部品実装装置において第1箇所の第1同一部品供給部からの部品の供給を第4箇所の第4同一部品供給部からの部品の供給に切り替えた際の部品の実装が行われている状態を示した模式図である。In the component mounting device of the fifth embodiment, the components are mounted when the supply of components from the first identical component supply section at the first location is switched to the supply of components from the fourth identical component supply section at the fourth location. It is a schematic diagram which showed the state which is being broken. 第5実施形態の部品実装装置のテーブルにおいて第1箇所の第1同一部品供給部からの部品の供給を第2箇所の第2同一部品供給部からの部品の供給に切り替えた状態を示した模式図である。A schematic showing a state in which the supply of parts from the first identical parts supply unit at the first location is switched to the supply of parts from the second identical parts supply unit at the second location in the table of the component mounting apparatus of the fifth embodiment. It is a figure. 第5実施形態の部品実装装置において第1箇所の第1同一部品供給部からの部品の供給を第2箇所の第2同一部品供給部からの部品の供給に切り替えた際の部品の実装が行われている状態を示した模式図である。In the component mounting device of the fifth embodiment, the components are mounted when the supply of components from the first identical component supply unit at the first location is switched to the supply of components from the second identical component supply unit at the second location. It is a schematic diagram which showed the state which is being broken.
 以下、本発明を具体化した実施形態を図面に基づいて説明する。 Hereinafter, embodiments embodying the present invention will be described with reference to the drawings.
[第1実施形態]
 図1~図7を参照して、本発明の第1実施形態による部品実装装置100の構成について説明する。
[First Embodiment]
The configuration of the component mounting device 100 according to the first embodiment of the present invention will be described with reference to FIGS. 1 to 7.
 図1に示すように、部品実装装置100は、IC、トランジスタ、コンデンサおよび抵抗などの電子部品Eを基板作業位置Wに配置されたプリント基板などの基板Bに実装するように構成されている。なお、電子部品Eは、請求の範囲の「部品」の一例である。 As shown in FIG. 1, the component mounting device 100 is configured to mount an electronic component E such as an IC, a transistor, a capacitor, and a resistor on a substrate B such as a printed circuit board arranged at a substrate working position W. The electronic component E is an example of a "component" in the claims.
 ここで、部品実装装置100において、基板Bを搬送する搬送方向をX1方向とし、基板Bを搬送する搬送方向の逆方向をX2方向とし、X1方向およびX2方向を合わせた方向をX方向とする。また、水平方向のうちのX方向に直交する方向をY方向とし、Y方向の一方をY1方向とし、Y方向の他方をY2方向とする。また、X方向およびY方向に直交する上下方向をZ方向(上下方向)とし、Z方向の一方をZ1方向(上方向)とし、Z方向の他方をZ2方向(下方向)とする。 Here, in the component mounting device 100, the transport direction for transporting the substrate B is the X1 direction, the direction opposite to the transport direction for transporting the substrate B is the X2 direction, and the combined direction of the X1 direction and the X2 direction is the X direction. .. Further, the direction orthogonal to the X direction in the horizontal direction is the Y direction, one of the Y directions is the Y1 direction, and the other of the Y directions is the Y2 direction. Further, the vertical direction orthogonal to the X direction and the Y direction is the Z direction (vertical direction), one of the Z directions is the Z1 direction (upward direction), and the other of the Z directions is the Z2 direction (downward direction).
 部品実装装置100は、基台1と、フィーダ配置部2と、表示部3と、基板搬送部4と、複数の支持部(図示せず)と、複数の一対のレール部(図示せず)と、第1ヘッド5と、第2ヘッド6と、部品認識カメラ7と、基板認識カメラ8と、制御部9とを備えている。なお、第1ヘッド5および第2ヘッド6の各々は、請求の範囲の「ヘッド」の一例である。 The component mounting device 100 includes a base 1, a feeder arrangement unit 2, a display unit 3, a board transport unit 4, a plurality of support units (not shown), and a plurality of pair of rail units (not shown). A first head 5, a second head 6, a component recognition camera 7, a board recognition camera 8, and a control unit 9 are provided. Each of the first head 5 and the second head 6 is an example of the "head" in the claims.
(基台)
 基台1は、部品実装装置100において各構成要素を配置する基礎となる台である。基台1上には、構成要素として、基板搬送部4、複数のレール部、および、部品認識カメラ7が設けられている。また、基台1内には、制御部9が設けられている。また、基台1には、Y方向の両側(Y1方向側およびY2方向側)に、複数のテープフィーダ2aを配置可能なフィーダ配置部2が設けられている。
(Base)
The base 1 is a base on which each component is arranged in the component mounting device 100. A board transport section 4, a plurality of rail sections, and a component recognition camera 7 are provided on the base 1 as components. Further, a control unit 9 is provided in the base 1. Further, the base 1 is provided with feeder arranging portions 2 capable of arranging a plurality of tape feeders 2a on both sides in the Y direction (Y1 direction side and Y2 direction side).
(テープフィーダ)
 テープフィーダ2aは、基板Bに実装される電子部品Eを供給する部品供給部である。テープフィーダ2aは、オートローディングフィーダである。テープフィーダ2aは、複数の電子部品Eを所定の間隔を隔てて保持したテープを巻き回したリール(図示せず)を保持している。また、テープフィーダ2aは、第1ヘッド5および第2ヘッド6による電子部品Eの取り出しのための部品保持動作に応じて、テープを送り出すことによりリールを回転させるように構成されている。テープフィーダ2aは、テープを送り出すことにより、基板作業位置W側の先端部から電子部品Eを供給するように構成されている。テープフィーダ2aは、テープを送り出した回数に基づいて、第1ヘッド5および第2ヘッド6により吸着されて電子部品Eの個数を算出するように構成されている。
(Tape feeder)
The tape feeder 2a is a component supply unit that supplies the electronic component E mounted on the substrate B. The tape feeder 2a is an autoloading feeder. The tape feeder 2a holds a reel (not shown) around which a tape that holds a plurality of electronic components E at predetermined intervals is wound. Further, the tape feeder 2a is configured to rotate the reel by feeding out the tape in response to the component holding operation for taking out the electronic component E by the first head 5 and the second head 6. The tape feeder 2a is configured to supply the electronic component E from the tip end portion on the substrate work position W side by feeding out the tape. The tape feeder 2a is configured to calculate the number of electronic components E attracted by the first head 5 and the second head 6 based on the number of times the tape is sent out.
 ここで、部品実装装置100では、基板Bへの実装点数が多い電子部品Eに関して、テープフィーダ2aを複数用意(部品分割)することにより、複数箇所から分散して電子部品Eが供給される。これにより、第1ヘッド5および第2ヘッド6によるテープフィーダ2aと基板Bとの間の往復動作の増加に起因する生産性の低下を回避することが可能である。すなわち、複数のテープフィーダ2aは、複数の同一部品供給部20を含んでいる。複数の同一部品供給部20は、基板Bに実装される電子部品Eのうち同一の電子部品Eを供給するように構成されている。 Here, in the component mounting device 100, by preparing a plurality of tape feeders 2a (component division) for the electronic component E having a large number of mounting points on the substrate B, the electronic component E is distributed from a plurality of locations and supplied. This makes it possible to avoid a decrease in productivity due to an increase in the reciprocating operation between the tape feeder 2a and the substrate B by the first head 5 and the second head 6. That is, the plurality of tape feeders 2a include a plurality of identical component supply units 20. The plurality of identical component supply units 20 are configured to supply the same electronic component E among the electronic components E mounted on the substrate B.
 ここで、複数の同一部品供給部20は、第1同一部品供給部20aと、第2同一部品供給部20bと、第3同一部品供給部20cと、第4同一部品供給部20dとを有している。なお、第1同一部品供給部20aは、請求の範囲の「一の同一部品供給部」の一例である。また、第2同一部品供給部20bは、請求の範囲の「他の同一部品供給部」の一例である。また、第3同一部品供給部20cは、請求の範囲の「他の同一部品供給部」の一例である。また、第4同一部品供給部20dは、請求の範囲の「代替供給部」の一例である。 Here, the plurality of identical component supply units 20 include a first identical component supply section 20a, a second identical component supply section 20b, a third identical component supply section 20c, and a fourth identical component supply section 20d. ing. The first identical parts supply unit 20a is an example of "one identical parts supply unit" in the claims. Further, the second same parts supply unit 20b is an example of "another same parts supply unit" in the claims. Further, the third identical parts supply unit 20c is an example of "another same parts supply unit" in the claims. Further, the fourth identical parts supply unit 20d is an example of the "alternative supply unit" in the claims.
 第1同一部品供給部20aは、通常、第1ヘッド5に電子部品Eを供給するように構成されている。第1同一部品供給部20aは、基台1の基板搬送部4よりもY1方向側に配置されている。第2同一部品供給部20bは、通常、第2ヘッド6に電子部品Eを供給するように構成されている。第2同一部品供給部20bは、基台1の基板搬送部4のY2方向側に配置されている。第3同一部品供給部20cは、通常、第2ヘッド6に電子部品Eを供給するように構成されている。第3同一部品供給部20cは、基台1の基板搬送部4のY2方向側に配置されている。第4同一部品供給部20dは、第1同一部品供給部20aにおいて電子部品Eが無くなった際に代わりに電子部品Eを供給するように予め設定されている。第4同一部品供給部20dは、第1同一部品供給部20aのX1方向側に配置されている。 The first identical component supply unit 20a is normally configured to supply the electronic component E to the first head 5. The first identical component supply unit 20a is arranged on the Y1 direction side of the substrate transport unit 4 of the base 1. The second identical component supply unit 20b is normally configured to supply the electronic component E to the second head 6. The second identical component supply unit 20b is arranged on the Y2 direction side of the substrate transport unit 4 of the base 1. The third identical component supply unit 20c is normally configured to supply the electronic component E to the second head 6. The third identical component supply unit 20c is arranged on the Y2 direction side of the substrate transport unit 4 of the base 1. The fourth identical component supply unit 20d is preset to supply the electronic component E instead when the electronic component E disappears in the first identical component supply unit 20a. The fourth identical component supply unit 20d is arranged on the X1 direction side of the first identical component supply unit 20a.
 複数のテープフィーダ2aは、複数の異部品供給部21を含んでいる。複数の異部品供給部21は、第1同一部品供給部20a、第2同一部品供給部20b、第3同一部品供給部20cおよび第4同一部品供給部20dとは異なる電子部品Eを供給するように構成されている。複数の異部品供給部21は、第1異部品供給部21aおよび第2異部品供給部21bを有している。 The plurality of tape feeders 2a include a plurality of different component supply units 21. The plurality of different component supply units 21 supply electronic components E different from the first identical component supply unit 20a, the second identical component supply unit 20b, the third identical component supply unit 20c, and the fourth identical component supply unit 20d. It is configured in. The plurality of different parts supply units 21 have a first different parts supply unit 21a and a second different parts supply unit 21b.
(表示部)
 表示部3は、液晶ディスプレイなどから構成されている。表示部3は、制御部9から送信された情報を画面に表示するように構成されている。すなわち、表示部3は、複数の同一部品供給部20の各々の部品の残数、および、実装完了時間に関する情報などを、オペレータに報知するように構成されている。
(Display part)
The display unit 3 is composed of a liquid crystal display or the like. The display unit 3 is configured to display the information transmitted from the control unit 9 on the screen. That is, the display unit 3 is configured to notify the operator of the remaining number of parts of each of the plurality of identical parts supply units 20, information regarding the mounting completion time, and the like.
(基板搬送部)
 基板搬送部4は、部品実装装置100の外部から基板Bを搬入し、基板Bを搬送方向(X1方向)に搬送するように構成されている。基板搬送部4は、一対のコンベア41と、一対のコンベア41を回転駆動させるための駆動モータ(図示せず)とを含んでいる。一対のコンベア41の各々は、プーリ(図示せず)と、プーリに掛け回された輪状の搬送ベルトとを有している。制御部9は、駆動モータを制御することにより、一対のコンベア41上に載置された基板Bの搬送速度を制御するように構成されている。
(Board transfer board)
The board transport unit 4 is configured to carry the board B from the outside of the component mounting device 100 and transport the board B in the transport direction (X1 direction). The substrate transport unit 4 includes a pair of conveyors 41 and a drive motor (not shown) for rotationally driving the pair of conveyors 41. Each of the pair of conveyors 41 has a pulley (not shown) and a ring-shaped conveyor belt hung around the pulley. The control unit 9 is configured to control the transport speed of the substrate B mounted on the pair of conveyors 41 by controlling the drive motor.
(支持部およびレール部)
 複数の支持部は、それぞれ、第1ヘッド5および第2ヘッド6をX方向に移動可能に支持するように構成されている。複数の一対のレール部は、それぞれ、複数の支持部をY方向に移動可能に支持するように構成されている。
(Support and rail)
The plurality of support portions are configured to support the first head 5 and the second head 6 so as to be movable in the X direction, respectively. Each of the plurality of pairs of rail portions is configured to movably support the plurality of support portions in the Y direction.
 このような構成により、第1ヘッド5および第2ヘッド6の各々は、基台1上を水平面内で(X方向およびY方向に)移動可能に構成されている。 With such a configuration, each of the first head 5 and the second head 6 is configured to be movable on the base 1 in the horizontal plane (in the X direction and the Y direction).
(第1ヘッドおよび第2ヘッド)
 第1ヘッド5および第2ヘッド6の各々は、同じ構成を有している。第1ヘッド5および第2ヘッド6の各々は、部品実装用のユニットであり、基板作業位置Wにおいて固定された基板Bに電子部品Eを実装するように構成されている。第1ヘッド5および第2ヘッド6の各々は、複数のノズルNが平面視において環状に複数配置されたロータリーヘッドである。
(1st head and 2nd head)
Each of the first head 5 and the second head 6 has the same configuration. Each of the first head 5 and the second head 6 is a component mounting unit, and is configured to mount the electronic component E on the substrate B fixed at the substrate working position W. Each of the first head 5 and the second head 6 is a rotary head in which a plurality of nozzles N are arranged in a ring shape in a plan view.
(部品認識カメラ)
 部品認識カメラ7は、図1に示すように、基板Bへの電子部品Eの実装に先立ってノズルNに保持(吸着)された電子部品Eを撮像する部品撮像用のカメラである。部品認識カメラ7は、基台1上に固定されており、電子部品Eの下方(Z2方向)から、ノズルNに保持(吸着)された電子部品Eを撮像するように構成されている。
(Parts recognition camera)
As shown in FIG. 1, the component recognition camera 7 is a camera for component imaging that captures an image of the electronic component E held (sucked) by the nozzle N prior to mounting the electronic component E on the substrate B. The component recognition camera 7 is fixed on the base 1 and is configured to take an image of the electronic component E held (sucked) by the nozzle N from below the electronic component E (in the Z2 direction).
(基板認識カメラ)
 基板認識カメラ8は、第1ヘッド5および第2ヘッド6の各々に取り付けられ、基板Bへの電子部品Eの実装に先立って、基板Bの上面に付されたFIマーク(Fiducial Mark(フィデューシャルマーク):図示せず)を撮像するマーク撮像用のカメラである。FIマークは、基板Bの位置を確認するためのマークである。
(Board recognition camera)
The substrate recognition camera 8 is attached to each of the first head 5 and the second head 6, and is attached to the upper surface of the substrate B prior to mounting the electronic component E on the substrate B. Shall mark): A camera for mark imaging that captures images (not shown). The FI mark is a mark for confirming the position of the substrate B.
(制御部)
 制御部9は、ノズルNによりテープフィーダ2aから電子部品Eを吸着して基板Bに実装する制御を行うように構成されている。具体的には、制御部9は、CPU(Central Processing Unit)および記憶部などを含み、部品実装装置100の動作を制御する制御回路である。制御部9は、テープフィーダ2a、基板搬送部4、第1ヘッド5、第2ヘッド6、部品認識カメラ7、基板認識カメラ8、支持部およびレール部に電気的に接続されている。
(Control unit)
The control unit 9 is configured to control the electronic component E to be sucked from the tape feeder 2a by the nozzle N and mounted on the substrate B. Specifically, the control unit 9 is a control circuit that includes a CPU (Central Processing Unit), a storage unit, and the like, and controls the operation of the component mounting device 100. The control unit 9 is electrically connected to the tape feeder 2a, the substrate transport unit 4, the first head 5, the second head 6, the component recognition camera 7, the board recognition camera 8, the support unit, and the rail unit.
 記憶部は、ROM(Read Only Memory)およびRAM(Random Access Memory)などのメモリを有する記憶装置である。記憶部には、部品実装プログラムと、関連付け情報9a(図2参照)とが記憶されている。部品実装プログラムは、基板B上に実装される電子部品Eの実装処理を行うためのプログラムである。 The storage unit is a storage device having a memory such as a ROM (Read Only Memory) and a RAM (Random Access Memory). The component mounting program and the association information 9a (see FIG. 2) are stored in the storage unit. The component mounting program is a program for mounting the electronic component E mounted on the substrate B.
 図2に示すように、関連付け情報9aは、複数の同一部品供給部20の配置場所情報を互いに関連付けさせたテーブルである。すなわち、関連付け情報9aは、部品供給部情報と、部品供給部情報に対応する同一部品供給部情報とを関連付けさせた情報である。 As shown in FIG. 2, the association information 9a is a table in which the arrangement location information of a plurality of the same parts supply units 20 are associated with each other. That is, the association information 9a is information in which the parts supply unit information and the same parts supply unit information corresponding to the parts supply unit information are associated with each other.
 部品供給部情報は、たとえば、複数の同一部品供給部20の各々の配置箇所、部品名、ヘッドの種類、ノズルNの種類、および、電子部品Eの残数などの情報を含んでいる。また、部品供給部情報は、たとえば、複数の異部品供給部21の各々の配置箇所、部品名、ヘッドの種類、ノズルNの種類、および、電子部品Eの残数などの情報を含んでいる。 The component supply unit information includes, for example, information such as the arrangement location of each of the plurality of identical component supply units 20, the component name, the head type, the nozzle N type, and the remaining number of electronic components E. Further, the component supply unit information includes, for example, information such as the arrangement location of each of the plurality of different component supply units 21, the component name, the head type, the nozzle N type, and the remaining number of electronic components E. ..
 同一部品供給部情報は、たとえば、配置箇所、および、部品名などの情報を含んでいる。このように、記憶部には、複数の同一部品供給部20の各々の電子部品Eの残数、および、複数の同一部品供給部20の各々の電子部品Eの吸着に用いられるヘッドの種類が記憶されている。 The same parts supply unit information includes, for example, information such as an arrangement location and a part name. As described above, in the storage unit, the remaining number of each electronic component E of the plurality of identical component supply units 20 and the type of head used for sucking each electronic component E of the plurality of identical component supply units 20 are stored. It is remembered.
〈部品実装処理〉
 第1実施形態の制御部9は、基板Bに電子部品Eを実装して生産する際、使いかけのリールの発生を抑制するために、第1同一部品供給部20aの電子部品Eの残数がしきい値未満になったことに基づいて、第2同一部品供給部20bのみから電子部品Eを供給する制御に切り替えるように構成されている。詳細には、制御部9は、複数の同一部品供給部20のうちの第1同一部品供給部20aおよび第2同一部品供給部20bの各々から供給された電子部品Eを同じ基板作業位置Wに配置された基板Bに実装する場合に、第1同一部品供給部20aの電子部品Eの残数がしきい値未満になったことに基づいて、第1同一部品供給部20aによる電子部品Eの供給を停止するとともに、第1同一部品供給部20aから供給する分の電子部品Eを第2同一部品供給部20bから供給する制御に切り替えるように構成されている。
<Parts mounting process>
The control unit 9 of the first embodiment mounts the electronic component E on the substrate B for production, and in order to suppress the generation of used reels, the remaining number of the electronic components E of the first identical component supply unit 20a. Is configured to switch to the control of supplying the electronic component E only from the second identical component supply unit 20b based on the fact that is less than the threshold value. Specifically, the control unit 9 places the electronic component E supplied from each of the first identical component supply unit 20a and the second identical component supply unit 20b of the plurality of identical component supply units 20 at the same board work position W. When mounting on the arranged substrate B, the electronic component E by the first identical component supply unit 20a is based on the fact that the remaining number of the electronic component E of the first identical component supply unit 20a is less than the threshold value. The supply is stopped, and the electronic component E supplied from the first identical component supply unit 20a is switched to the control supplied from the second identical component supply unit 20b.
 図2~図7を参照して、以下に、第1同一部品供給部20aから供給する分の電子部品Eを第2同一部品供給部20bから供給する制御に切り替える制御の一例について説明する。まず、関連付け情報9aの一例について説明する。 With reference to FIGS. 2 to 7, an example of control for switching the electronic component E supplied from the first identical component supply unit 20a to the control supplied from the second identical component supply unit 20b will be described below. First, an example of the association information 9a will be described.
 図2および図3に示すように、第1箇所P1には、たとえば、第1同一部品供給部20aが配置されている。第1同一部品供給部20aには、たとえば、第1部品C1が配置されている。第1同一部品供給部20aの第1部品C1を吸着するヘッドの種類は、たとえば、第1ヘッド5(図2、図4および図6ではH1と記載)である。さらに、第1同一部品供給部20aの第1部品C1を吸着するノズルNの種類は、たとえば、第1ノズルN1である。第1箇所P1の同一部品供給部情報としては、たとえば、第5箇所P5に配置された第1部品C1が設定されている。第1箇所P1の同一部品供給部情報としては、たとえば、第6箇所P6に配置された第1部品C1が設定されている。 As shown in FIGS. 2 and 3, for example, the first identical component supply unit 20a is arranged at the first location P1. For example, the first component C1 is arranged in the first identical component supply unit 20a. The type of head that attracts the first component C1 of the first identical component supply unit 20a is, for example, the first head 5 (described as H1 in FIGS. 2, 4, and 6). Further, the type of the nozzle N that adsorbs the first component C1 of the first identical component supply unit 20a is, for example, the first nozzle N1. As the same component supply unit information of the first location P1, for example, the first component C1 arranged at the fifth location P5 is set. As the same component supply unit information of the first location P1, for example, the first component C1 arranged at the sixth location P6 is set.
 第2箇所P2には、たとえば、第4同一部品供給部20dが配置されている。第4同一部品供給部20dには、たとえば、第1部品C1が配置されている。第4同一部品供給部20dの第1部品C1を吸着するヘッドの種類は、たとえば、第1ヘッド5(図2、図4および図6ではH1と記載)である。さらに、第4同一部品供給部20dの第1部品C1を吸着するノズルNの種類は、たとえば、第2ノズルN2である。第2箇所P2の同一部品供給部情報としては、たとえば、設定されていない。 For example, the fourth identical parts supply unit 20d is arranged at the second location P2. For example, the first component C1 is arranged in the fourth identical component supply unit 20d. The type of head that attracts the first component C1 of the fourth identical component supply unit 20d is, for example, the first head 5 (described as H1 in FIGS. 2, 4, and 6). Further, the type of the nozzle N that adsorbs the first component C1 of the fourth identical component supply unit 20d is, for example, the second nozzle N2. For example, it is not set as the same component supply unit information of the second location P2.
 第3箇所P3には、たとえば、第1異部品供給部21aが配置されている。第1異部品供給部21aには、たとえば、第2部品C2が配置されている。第1異部品供給部21aの第2部品C2を吸着するヘッドの種類は、たとえば、第1ヘッド5(図2、図4および図6ではH1と記載)である。さらに、第1異部品供給部21aの第2部品C2を吸着するノズルNの種類は、たとえば、第3ノズルN3である。第3箇所P3の同一部品供給部情報としては、たとえば、設定されていない。 For example, the first different parts supply unit 21a is arranged at the third location P3. For example, a second component C2 is arranged in the first different component supply unit 21a. The type of head that attracts the second component C2 of the first different component supply unit 21a is, for example, the first head 5 (described as H1 in FIGS. 2, 4, and 6). Further, the type of the nozzle N that adsorbs the second component C2 of the first different component supply unit 21a is, for example, the third nozzle N3. For example, it is not set as the same component supply unit information of the third location P3.
 第4箇所P4には、たとえば、第2異部品供給部21bが配置されている。第2異部品供給部21bには、たとえば、第3部品C3が配置されている。第2異部品供給部21bの第3部品C3を吸着するヘッドの種類は、たとえば、第2ヘッド6(図2、図4および図6ではH2と記載)である。さらに、第2異部品供給部21bの第3部品C3を吸着するノズルNの種類は、たとえば、第1ノズルN1である。第3箇所P3の同一部品供給部情報としては、たとえば、設定されていない。 For example, the second different parts supply unit 21b is arranged at the fourth location P4. For example, a third component C3 is arranged in the second different component supply unit 21b. The type of head that attracts the third component C3 of the second different component supply unit 21b is, for example, the second head 6 (described as H2 in FIGS. 2, 4 and 6). Further, the type of the nozzle N that adsorbs the third component C3 of the second different component supply unit 21b is, for example, the first nozzle N1. For example, it is not set as the same component supply unit information of the third location P3.
 第5箇所P5には、たとえば、第2同一部品供給部20bが配置されている。第2同一部品供給部20bには、たとえば、第1部品C1が配置されている。第2同一部品供給部20bの第1部品C1を吸着するヘッドの種類は、たとえば、第2ヘッド6(図2、図4および図6ではH2と記載)である。さらに、第2同一部品供給部20bの第1部品C1を吸着するノズルNの種類は、たとえば、第2ノズルN2である。第5箇所P5の同一部品供給部情報としては、たとえば、第1箇所P1に配置された第1部品C1が設定されている。第5箇所P5の同一部品供給部情報としては、たとえば、第6箇所P6に配置された第1部品C1が設定されている。 For example, the second identical parts supply unit 20b is arranged at the fifth location P5. For example, the first component C1 is arranged in the second identical component supply unit 20b. The type of head that attracts the first component C1 of the second identical component supply unit 20b is, for example, the second head 6 (described as H2 in FIGS. 2, 4, and 6). Further, the type of the nozzle N that adsorbs the first component C1 of the second identical component supply unit 20b is, for example, the second nozzle N2. As the same component supply unit information of the fifth location P5, for example, the first component C1 arranged at the first location P1 is set. As the same component supply unit information of the fifth location P5, for example, the first component C1 arranged at the sixth location P6 is set.
 第6箇所P6には、たとえば、第3同一部品供給部20cが配置されている。第3同一部品供給部20cには、たとえば、第1部品C1が配置されている。第3同一部品供給部20cの第1部品C1を吸着するヘッドの種類は、たとえば、第2ヘッド6(図2、図4および図6ではH2と記載)である。さらに、第3同一部品供給部20cの第1部品C1を吸着するノズルNの種類は、たとえば、第3ノズルN3である。第6箇所P6の同一部品供給部情報としては、たとえば、第1箇所P1に配置された第1部品C1が設定されている。第6箇所P6の同一部品供給部情報としては、たとえば、第5箇所P5に配置された第1部品C1が設定されている。 For example, the third identical parts supply unit 20c is arranged at the sixth location P6. For example, the first component C1 is arranged in the third identical component supply unit 20c. The type of head that attracts the first component C1 of the third identical component supply unit 20c is, for example, the second head 6 (described as H2 in FIGS. 2, 4, and 6). Further, the type of the nozzle N that adsorbs the first component C1 of the third identical component supply unit 20c is, for example, the third nozzle N3. As the same component supply unit information of the sixth location P6, for example, the first component C1 arranged at the first location P1 is set. As the same component supply unit information of the sixth location P6, for example, the first component C1 arranged at the fifth location P5 is set.
 図2および図3に示すように、制御部9は、通常、第1箇所P1の第1同一部品供給部20a、第5箇所P5の第2同一部品供給部20b、および、第6箇所P6の第3同一部品供給部20cの全てから電子部品Eを供給する制御を行うように構成されている。また、制御部9は、通常、第3箇所P3の第1異部品供給部21a、および、第4箇所P4の第2異部品供給部21bの両方から電子部品Eを供給する制御を行うように構成されている。 As shown in FIGS. 2 and 3, the control unit 9 usually has the first identical component supply unit 20a at the first location P1, the second identical component supply unit 20b at the fifth location P5, and the sixth location P6. It is configured to control the supply of electronic components E from all of the third identical component supply units 20c. Further, the control unit 9 normally controls to supply the electronic component E from both the first different component supply unit 21a of the third location P3 and the second different component supply unit 21b of the fourth location P4. It is configured.
 ここで、図4および図5に示すように、制御部9は、基板Bの生産が終盤になるまでの間、第1箇所P1の第1同一部品供給部20aの電子部品Eの残数がしきい値未満になったことに基づいて、第2箇所P2の第4同一部品供給部20dから電子部品Eの供給する制御に切り替えるように構成されている。具体的には、制御部9は、基板Bの生産が終盤になるまでの間、第1箇所P1の第1同一部品供給部20aにおいて電子部品Eの残数が0になったことに基づいて、予め設定された第2箇所P2の第4同一部品供給部20dから電子部品Eを補給するように構成されている。 Here, as shown in FIGS. 4 and 5, the control unit 9 has the remaining number of electronic components E in the first identical component supply unit 20a of the first location P1 until the production of the substrate B ends. It is configured to switch from the fourth identical component supply unit 20d of the second location P2 to the control of supplying the electronic component E based on the fact that the value is less than the threshold value. Specifically, the control unit 9 is based on the fact that the remaining number of electronic components E in the first identical component supply unit 20a of the first location P1 becomes 0 until the production of the substrate B ends. , The electronic component E is replenished from the fourth identical component supply unit 20d of the second location P2 set in advance.
 また、図6および図7に示すように、制御部9は、基板Bの生産が終盤になった場合に、第1同一部品供給部20aの電子部品Eの残数がしきい値未満になったことに基づいて、第2箇所P2の第4同一部品供給部20dではなく、第1同一部品供給部20aから供給する分の電子部品Eを第5箇所P5の第2同一部品供給部20bから供給する制御に切り替えるように構成されている。 Further, as shown in FIGS. 6 and 7, when the production of the substrate B ends in the control unit 9, the remaining number of the electronic components E in the first same component supply unit 20a becomes less than the threshold value. Based on this, the electronic component E supplied from the first identical component supply section 20a instead of the fourth identical component supply section 20d at the second location P2 is supplied from the second identical component supply section 20b at the fifth location P5. It is configured to switch to supply control.
 具体的には、制御部9は、基板Bの残り生産枚数が所定値以下になった場合に、第1同一部品供給部20aの電子部品Eの残数が0になったことに基づいて、第2箇所P2の第4同一部品供給部20dではなく、第1同一部品供給部20aから供給する分の電子部品Eを第5箇所P5の第2同一部品供給部20bから供給する制御に切り替えるように構成されている。この際、制御部9は、Y1方向側のフィーダ配置部2からに配置された複数のテープフィーダ2aだけでなく、Y2方向側のフィーダ配置部2に配置された複数のテープフィーダ2aからも電子部品Eを吸着するように、第1ヘッド5を移動させる制御を行うように構成されている。また、制御部9は、第1同一部品供給部20aにおいて電子部品Eの残数がしきい値未満になったことに基づいて、テープフィーダ2aでの電子部品Eの補充を行うことなく、第1同一部品供給部20aによる電子部品Eの供給を停止するとともに、第1同一部品供給部20aから供給する分の電子部品Eを第2同一部品供給部20bから供給する制御に切り替えるように構成されている。 Specifically, the control unit 9 is based on the fact that when the remaining production number of the substrate B becomes equal to or less than a predetermined value, the remaining number of electronic components E of the first same component supply unit 20a becomes 0. The control is switched so that the electronic component E supplied from the first identical component supply unit 20a is supplied from the second identical component supply unit 20b at the fifth location P5 instead of the fourth identical component supply unit 20d at the second location P2. It is configured in. At this time, the control unit 9 is electron not only from the plurality of tape feeders 2a arranged from the feeder arrangement unit 2 on the Y1 direction side, but also from the plurality of tape feeders 2a arranged from the feeder arrangement unit 2 on the Y2 direction side. It is configured to control the movement of the first head 5 so as to attract the component E. Further, the control unit 9 does not replenish the electronic component E in the tape feeder 2a based on the fact that the remaining number of the electronic component E in the first identical component supply unit 20a is less than the threshold value. 1 It is configured to stop the supply of the electronic component E by the same component supply unit 20a and switch to the control of supplying the electronic component E supplied from the first identical component supply unit 20a from the second identical component supply unit 20b. ing.
 制御部9は、第1同一部品供給部20aから供給する分の電子部品Eを第5箇所P5の第2同一部品供給部20bから供給する制御に切り替えるために、基板Bに電子部品Eを実装させる制御ごとに、記憶部に記憶された複数の同一部品供給部20の各々の電子部品Eの残数を更新する制御を行うように構成されている。すなわち、制御部9は、第1同一部品供給部20a、第2同一部品供給部20bおよび第3同一部品供給部20cの各々の電子部品Eの残数を取得する制御を行うように構成されている。 The control unit 9 mounts the electronic component E on the substrate B in order to switch the control of supplying the electronic component E supplied from the first identical component supply unit 20a from the second identical component supply unit 20b of the fifth location P5. It is configured to control to update the remaining number of the electronic components E of each of the plurality of identical component supply units 20 stored in the storage unit for each control to be performed. That is, the control unit 9 is configured to control to acquire the remaining number of each electronic component E of the first identical component supply unit 20a, the second identical component supply unit 20b, and the third identical component supply unit 20c. There is.
 そして、制御部9は、所定のタイミングで、第1同一部品供給部20aにおいて取得した電子部品Eの残数がしきい値未満になったか否かを確認する制御を行うように構成されている。そして、制御部9は、第1同一部品供給部20aにおいて電子部品Eの残数がしきい値未満になった場合に、第1同一部品供給部20aによる電子部品Eの供給を停止するとともに、第1同一部品供給部20aから供給する分の電子部品Eを他の同一部品供給部20から供給する制御に切り替えるように構成されている。 Then, the control unit 9 is configured to perform control to confirm whether or not the remaining number of the electronic components E acquired by the first identical component supply unit 20a is less than the threshold value at a predetermined timing. .. Then, when the remaining number of electronic components E in the first identical component supply unit 20a becomes less than the threshold value, the control unit 9 stops the supply of the electronic component E by the first identical component supply unit 20a, and also stops the supply of the electronic component E. It is configured to switch the electronic component E supplied from the first identical component supply unit 20a to the control supplied from the other identical component supply unit 20.
 具体的には、制御部9は、基板Bに電子部品Eを実装させる制御ごとに、第1同一部品供給部20aにおいて取得した電子部品Eの残数が0になったか否かを確認する制御を行うように構成されている。そして、制御部9は、第1同一部品供給部20aにおいて電子部品Eの残数が0になった場合に、第1同一部品供給部20aによる電子部品Eの供給を停止するとともに、第1同一部品供給部20aから供給する分の電子部品Eを他の同一部品供給部20から供給する制御に切り替えるように構成されている。 Specifically, the control unit 9 controls to confirm whether or not the remaining number of the electronic components E acquired by the first identical component supply unit 20a has become 0 for each control of mounting the electronic component E on the substrate B. Is configured to do. Then, when the remaining number of electronic components E in the first identical component supply unit 20a becomes 0, the control unit 9 stops the supply of the electronic component E by the first identical component supply unit 20a, and at the same time, the first identical component unit 9. It is configured to switch the electronic component E supplied from the component supply unit 20a to the control supplied from another same component supply unit 20.
 ここで、制御部9は、第1同一部品供給部20aにおいて電子部品Eの残数がしきい値未満になった際、関連付け情報9aに基づいて、第2同一部品供給部20bの配置場所情報を取得する制御を行うように構成されている。具体的には、制御部9は、第1同一部品供給部20aにおいて電子部品Eの残数が0になった際、第1箇所P1の部品供給部情報に関連付けられた同一部品供給部情報に基づいて、第2同一部品供給部20bの配置場所情報を取得する制御を行うように構成されている。そして、制御部9は、第1同一部品供給部20aから供給する分の電子部品Eを第2同一部品供給部20bから供給する制御に切り替えるように構成されている。 Here, when the remaining number of electronic components E in the first identical component supply unit 20a becomes less than the threshold value, the control unit 9 determines the placement location information of the second identical component supply unit 20b based on the association information 9a. Is configured to control the acquisition of. Specifically, when the remaining number of electronic components E in the first identical component supply unit 20a becomes 0, the control unit 9 uses the same component supply unit information associated with the component supply unit information of the first location P1. Based on this, it is configured to control the acquisition of the arrangement location information of the second identical component supply unit 20b. The control unit 9 is configured to switch the electronic component E supplied from the first identical component supply unit 20a to the control supplied from the second identical component supply unit 20b.
 上記した制御の切り替えは、第1ヘッド5(ロータリーヘッド)の複数のノズルNにより第1同一部品供給部20aから順次部品を吸着するとともに、第2ヘッド6(ロータリーヘッド)の複数のノズルNにより第2同一部品供給部20bから順次部品を吸着する際に行われる。すなわち、制御部9は、第1ヘッド5および第2ヘッド6により順次部品を吸着する場合に、第1同一部品供給部20aの電子部品Eの残数がしきい値未満になったことに基づいて、第1ヘッド5と、第2ヘッド6とにより共有された第2同一部品供給部20bから電子部品Eを供給する制御に切り替えて基板Bへの電子部品Eの実装を継続させるように構成されている。 In the above-mentioned control switching, the components are sequentially sucked from the first same component supply unit 20a by the plurality of nozzles N of the first head 5 (rotary head), and the components are sequentially sucked by the plurality of nozzles N of the second head 6 (rotary head). This is performed when the parts are sequentially sucked from the second same part supply unit 20b. That is, the control unit 9 is based on the fact that the remaining number of electronic components E in the first identical component supply unit 20a becomes less than the threshold value when the components are sequentially sucked by the first head 5 and the second head 6. Then, the control is switched to supply the electronic component E from the second identical component supply unit 20b shared by the first head 5 and the second head 6, and the mounting of the electronic component E on the substrate B is continued. Has been done.
 具体的には、制御部9は、第1ヘッド5および第2ヘッド6により順次部品を吸着する場合に、第1同一部品供給部20aの電子部品Eの残数が0になったことに基づいて、第1ヘッド5と、第2ヘッド6とにより、第2同一部品供給部20bを共有して電子部品Eを供給する制御を行うように構成されている。 Specifically, the control unit 9 is based on the fact that the remaining number of electronic components E in the first identical component supply unit 20a becomes 0 when the components are sequentially sucked by the first head 5 and the second head 6. The first head 5 and the second head 6 are configured to share the second identical component supply unit 20b to control the supply of the electronic component E.
(部品実装処理のフローチャート)
 以下に、図8を参照して、制御部9による部品実装処理について説明する。部品実装処理は、複数の同一部品供給部20の電子部品Eの残数に基づいて、第1ヘッド5と、第2ヘッド6とにより、同一部品供給部20を共有するように制御を切り替える処理である。
(Flow chart of component mounting process)
Hereinafter, the component mounting process by the control unit 9 will be described with reference to FIG. The component mounting process is a process of switching control so that the first head 5 and the second head 6 share the same component supply unit 20 based on the remaining number of electronic components E of the plurality of identical component supply units 20. Is.
 ステップS1において、制御部9では、複数の同一部品供給部20の部品残数が更新される。ステップS2において、制御部9では、更新された部品残数に基づいて、しきい値未満の同一部品供給部20が存在するか否かが判断される。しきい値未満の同一部品供給部20が存在する場合にはステップS3に進み、しきい値未満の同一部品供給部20が存在しない場合には部品実装処理を終了する。 In step S1, the control unit 9 updates the remaining number of parts of the plurality of identical parts supply units 20. In step S2, the control unit 9 determines whether or not the same component supply unit 20 having a threshold value or less exists based on the updated number of remaining components. If the same component supply unit 20 below the threshold value exists, the process proceeds to step S3, and if the same component supply unit 20 below the threshold value does not exist, the component mounting process ends.
 ステップS3において、制御部9では、関連付け情報9aに基づいて、共有可能な同一部品供給部20が存在するか否かが判断される(図6参照)。共有可能な同一部品供給部20が存在するならばステップS4に進み、共有可能な同一部品供給部20が存在しないならば部品実装処理を終了する。ステップS4において、制御部9では、共有可能な同一部品供給部20の配置場所情報に基づいて、吸着場所を切り替えて実装が継続される。ステップS4の後、部品実装処理は終了する。 In step S3, the control unit 9 determines whether or not the same component supply unit 20 that can be shared exists based on the association information 9a (see FIG. 6). If the same component supply unit 20 that can be shared exists, the process proceeds to step S4, and if the same component supply unit 20 that can be shared does not exist, the component mounting process ends. In step S4, the control unit 9 switches the suction location based on the shareable location information of the same component supply unit 20, and the mounting is continued. After step S4, the component mounting process ends.
(第1実施形態の効果)
 第1実施形態では、以下のような効果を得ることができる。
(Effect of the first embodiment)
In the first embodiment, the following effects can be obtained.
 第1実施形態では、上記のように、制御部9は、複数の同一部品供給部20のうちの第1同一部品供給部20aおよび第2同一部品供給部20bの各々から供給された電子部品Eを同じ基板作業位置Wに配置された基板Bに実装する場合に、第1同一部品供給部20aの電子部品Eの残数がしきい値未満になったことに基づいて、第1同一部品供給部20aによる電子部品Eの供給を停止するとともに、第1同一部品供給部20aから供給する分の電子部品Eを第2同一部品供給部20bから供給する制御に切り替えるように構成されている。これにより、第1同一部品供給部20aから供給していた際と同じ基板作業位置Wに配置された基板Bに第2同一部品供給部20bから電子部品Eを供給することができるので、第1同一部品供給部20aから供給する分の電子部品Eを第2同一部品供給部20bから確実に供給することができる。この結果、異なる基板作業位置Wに基板Bを配置しなくても、電子部品Eの実装を代行させることができる。また、第1同一部品供給部20aにおいて電子部品Eの残数がしきい値未満になった際、電子部品Eが配置されたテープが巻き回したリールを新たに第1同一部品供給部20aに供給する必要がないので、新たなリールが使われないようにすることができる。この結果、使いかけのリールの増加をより確実に抑制することができる。また、電子部品Eが配置されたテープが巻き回したリールを新たに第1同一部品供給部20aに供給する必要がないことにより、オペレータによるリールの交換作業を減少させることができるので、オペレータの作業負担を軽減させることができる。 In the first embodiment, as described above, the control unit 9 is the electronic component E supplied from each of the first identical component supply unit 20a and the second identical component supply unit 20b among the plurality of identical component supply units 20. Is mounted on the board B arranged at the same board work position W, and the first same component supply is based on the fact that the remaining number of the electronic components E of the first same component supply unit 20a is less than the threshold value. The supply of the electronic component E by the unit 20a is stopped, and the electronic component E supplied from the first identical component supply unit 20a is switched to the control supplied from the second identical component supply unit 20b. As a result, the electronic component E can be supplied from the second identical component supply unit 20b to the substrate B arranged at the same substrate work position W as when the electronic component E was supplied from the first identical component supply unit 20a. The electronic component E supplied from the same component supply unit 20a can be reliably supplied from the second identical component supply unit 20b. As a result, the mounting of the electronic component E can be performed on behalf of the board B without arranging the board B at different board work positions W. Further, when the remaining number of electronic components E in the first identical component supply section 20a becomes less than the threshold value, the reel on which the tape on which the electronic component E is arranged is wound is newly transferred to the first identical component supply section 20a. Since there is no need to supply, new reels can be prevented from being used. As a result, it is possible to more reliably suppress the increase in the number of used reels. Further, since it is not necessary to newly supply the reel around which the tape on which the electronic component E is arranged is wound to the first same component supply unit 20a, the reel replacement work by the operator can be reduced, so that the operator can reduce the reel replacement work. The work load can be reduced.
 また、第1実施形態では、上記のように、制御部9は、複数の同一部品供給部20の各々の電子部品Eの残数を取得するとともに、所定のタイミングで、第1同一部品供給部20aにおいて取得した電子部品Eの残数がしきい値未満になったか否かを確認する制御を行うように構成されている。これにより、複数の同一部品供給部20の各々の電子部品Eの残数を取得した後の所定のタイミングで、取得した電子部品Eの残数がしきい値未満になったか否かを確認することができるので、第1同一部品供給部20aの電子部品Eの残数がしきい値未満になったか否かを確実に確認することができる。 Further, in the first embodiment, as described above, the control unit 9 acquires the remaining number of the electronic components E of each of the plurality of identical component supply units 20, and at a predetermined timing, the first identical component supply unit It is configured to control whether or not the remaining number of the electronic components E acquired in 20a is less than the threshold value. As a result, it is confirmed whether or not the remaining number of acquired electronic components E is less than the threshold value at a predetermined timing after acquiring the remaining number of electronic components E of each of the plurality of identical component supply units 20. Therefore, it is possible to surely confirm whether or not the remaining number of the electronic components E of the first identical component supply unit 20a is less than the threshold value.
 また、第1実施形態では、上記のように、部品実装装置100は、複数の同一部品供給部20の配置場所情報を互いに関連付けた関連付け情報9aを記憶した記憶部を備えている。制御部9は、第1同一部品供給部20aにおいて電子部品Eの残数がしきい値未満になった際、関連付け情報9aに基づいて、第2同一部品供給部20bの配置場所情報を取得するように構成されている。これにより、関連付け情報9aにより第2同一部品供給部20bの配置場所情報を容易に取得することができるので、第2同一部品供給部20bと、第2同一部品供給部20bの配置場所情報とが関連付けられておらず、第2同一部品供給部20bの配置場所を総当り的に検索する場合と比較して、第1同一部品供給部20aから供給する分の電子部品Eを第2同一部品供給部20bから供給する制御への切り替えを効率良く行うことができる。 Further, in the first embodiment, as described above, the component mounting device 100 includes a storage unit that stores the association information 9a in which the arrangement location information of the plurality of identical component supply units 20 is associated with each other. When the remaining number of electronic components E in the first identical component supply unit 20a becomes less than the threshold value, the control unit 9 acquires the placement location information of the second identical component supply unit 20b based on the association information 9a. It is configured as follows. As a result, the placement location information of the second identical component supply unit 20b can be easily acquired by the association information 9a, so that the placement location information of the second identical component supply section 20b and the second identical component supply section 20b can be obtained. Compared to the case where the location of the second identical component supply unit 20b is not related and is brute-forced, the electronic component E supplied from the first identical component supply unit 20a is supplied as the second identical component. It is possible to efficiently switch to the control supplied from the unit 20b.
 また、第1実施形態では、上記のように、第1ヘッド5および第2ヘッド6の各々は、複数のノズルNが平面視において環状に複数配置された複数のロータリーヘッドを含んでいる。制御部9は、複数のロータリーヘッドの各々の複数のノズルNにより第1同一部品供給部20aから順次電子部品Eを吸着する場合に、第1同一部品供給部20aの電子部品Eの残数がしきい値未満になったことに基づいて、複数のロータリーヘッドのうち第1同一部品供給部20aから吸着していたロータリーヘッドと、複数のロータリーヘッドのうち第2同一部品供給部20bから吸着していたロータリーヘッドとにより共有された第2同一部品供給部20bから電子部品Eを供給する制御に切り替えて基板Bへの電子部品Eの実装を継続させるように構成されている。これにより、第1同一部品供給部20aの電子部品Eの残数がしきい値未満になる前において、ロータリーヘッドの複数のノズルNにより第1同一部品供給部20aから順次電子部品Eを吸着することにより、複数のノズルNの各々に電子部品Eを吸着させるための時間の増大を抑制することができる。また、第1同一部品供給部20aの電子部品Eの残数がしきい値未満になり第1同一部品供給部20aからの電子部品Eの供給を停止した後において、電子部品Eが配置されたテープが巻き回されたリールを新たに第1同一部品供給部20aに供給する必要がないので、新たなリールが使われないようにすることができる。これらの結果、電子部品Eを基板Bに実装する際に必要な実装時間の増大を抑制することができるとともに、使いかけのリールが増加することをより確実に抑制することができる。 Further, in the first embodiment, as described above, each of the first head 5 and the second head 6 includes a plurality of rotary heads in which a plurality of nozzles N are arranged in a ring shape in a plan view. When the control unit 9 sequentially sucks the electronic component E from the first identical component supply unit 20a by the plurality of nozzles N of each of the plurality of rotary heads, the remaining number of the electronic component E of the first identical component supply unit 20a is reduced. Based on the fact that the value is less than the threshold value, the rotary head sucked from the first identical component supply unit 20a among the plurality of rotary heads and the second identical component supply unit 20b among the plurality of rotary heads are attracted. It is configured to switch to the control of supplying the electronic component E from the second identical component supply unit 20b shared by the rotary head, and continue the mounting of the electronic component E on the substrate B. As a result, before the remaining number of the electronic components E of the first identical component supply section 20a becomes less than the threshold value, the electronic components E are sequentially sucked from the first identical component supply section 20a by the plurality of nozzles N of the rotary head. Thereby, it is possible to suppress an increase in time for adsorbing the electronic component E on each of the plurality of nozzles N. Further, after the remaining number of the electronic parts E of the first same parts supply unit 20a becomes less than the threshold value and the supply of the electronic parts E from the first same parts supply unit 20a is stopped, the electronic parts E are arranged. Since it is not necessary to newly supply the reel around which the tape is wound to the first identical component supply unit 20a, it is possible to prevent the new reel from being used. As a result, it is possible to suppress an increase in the mounting time required for mounting the electronic component E on the substrate B, and it is possible to more reliably suppress an increase in the number of used reels.
 また、第1実施形態では、上記のように、複数の同一部品供給部20は、第1同一部品供給部20aにおいて電子部品Eが無くなった際に代わりに電子部品Eを供給するように予め設定された第4同一部品供給部20dを有している。制御部9は、基板Bの生産が終盤になるまでの間、第1同一部品供給部20aにおいて電子部品Eがしきい値未満になったことに基づいて、第4同一部品供給部20dから電子部品Eの供給する制御に切り替えるように構成されている。制御部9は、基板Bの生産が終盤になった場合に、第1同一部品供給部20aの電子部品Eの残数がしきい値未満になったことに基づいて、第4同一部品供給部20dではなく、第1同一部品供給部20aから供給する分の電子部品Eを第2同一部品供給部20bから供給する制御に切り替えるように構成されている。これにより、基板Bの生産の終盤までの間において第1同一部品供給部20aまたは第4同一部品供給部20dと、第2同一部品供給部20bとにより部品を供給することができるので、第2同一部品供給部20bのみから電子部品Eを供給する終盤の場合と比較して、基板Bの生産の効率が低下することを抑制することができる。また、基板Bの生産の終盤において第1同一部品供給部20aから供給する分の電子部品Eを第2同一部品供給部20bから供給する制御に切り替えることにより、基板Bの生産の終盤において第1同一部品供給部20aおよび第4同一部品供給部20dからの電子部品Eの供給を停止させることができる。この結果、基板Bの生産の終盤において第1同一部品供給部20aまたは第4同一部品供給部20dと、第2同一部品供給部20bとの両方を使用する場合と比較して、使いかけのリールの増加をより確実に抑制することができる。 Further, in the first embodiment, as described above, the plurality of identical component supply units 20 are preset so as to supply the electronic component E instead when the electronic component E is exhausted in the first identical component supply unit 20a. It has the fourth identical component supply unit 20d. The control unit 9 receives electrons from the fourth identical component supply unit 20d based on the fact that the electronic component E becomes less than the threshold value in the first identical component supply unit 20a until the production of the substrate B ends. It is configured to switch to the control supplied by the component E. The control unit 9 has a fourth identical component supply unit based on the fact that the remaining number of electronic components E in the first identical component supply unit 20a becomes less than the threshold value when the production of the substrate B ends. Instead of 20d, the electronic component E supplied from the first identical component supply unit 20a is switched to the control supplied from the second identical component supply unit 20b. As a result, parts can be supplied by the first identical component supply unit 20a or the fourth identical component supply unit 20d and the second identical component supply unit 20b until the end of the production of the substrate B, so that the second component can be supplied. It is possible to suppress a decrease in the production efficiency of the substrate B as compared with the case of the final stage in which the electronic component E is supplied only from the same component supply unit 20b. Further, by switching the control to supply the electronic component E supplied from the first identical component supply unit 20a from the second identical component supply unit 20b at the final stage of the production of the substrate B, the first operation is performed at the final stage of the production of the substrate B. The supply of the electronic component E from the same component supply unit 20a and the fourth identical component supply unit 20d can be stopped. As a result, as compared with the case where both the first identical component supply section 20a or the fourth identical component supply section 20d and the second identical component supply section 20b are used at the end of the production of the substrate B, the used reel Can be suppressed more reliably.
[第2実施形態]
 図1、図9および図10を参照して、第2実施形態による部品実装装置100の構成について説明する。第2実施形態では、第1実施形態とは異なり、オペレータにより共有する同一部品供給部20が選択される。なお、第2実施形態では、第1実施形態の構成と重複する部分については、符号を流用するとともに詳細な説明を省略する。
[Second Embodiment]
The configuration of the component mounting device 100 according to the second embodiment will be described with reference to FIGS. 1, 9 and 10. In the second embodiment, unlike the first embodiment, the same component supply unit 20 shared by the operator is selected. In the second embodiment, the reference numerals are used and detailed description thereof will be omitted for the parts that overlap with the configurations of the first embodiment.
 図1に示すように、部品実装装置100は、基台1と、フィーダ配置部2と、表示部3と、基板搬送部4と、複数の支持部(図示せず)と、複数の一対のレール部(図示せず)と、第1ヘッド5と、第2ヘッド6と、部品認識カメラ7と、基板認識カメラ8と、制御部9とを備えている。なお、第1ヘッド5および第2ヘッド6は、請求の範囲の「ヘッド」の一例である。 As shown in FIG. 1, the component mounting device 100 includes a base 1, a feeder arrangement unit 2, a display unit 3, a substrate transport unit 4, a plurality of support units (not shown), and a plurality of pairs. It includes a rail unit (not shown), a first head 5, a second head 6, a component recognition camera 7, a board recognition camera 8, and a control unit 9. The first head 5 and the second head 6 are examples of "heads" in the claims.
 表示部3は、第2同一部品供給部20bおよび第3同一部品供給部20cの各々の電子部品Eの残数を表示する。表示部3は、図9に示すように、第1同一部品供給部20aから供給する分の電子部品Eを第2同一部品供給部20bまたは第3同一部品供給部20cから供給する制御に切り替えた場合の実装完了時間t1(実装完了時間t2)とを表示する。 The display unit 3 displays the remaining number of electronic components E of each of the second identical component supply unit 20b and the third identical component supply unit 20c. As shown in FIG. 9, the display unit 3 has switched to control in which the electronic component E supplied from the first identical component supply unit 20a is supplied from the second identical component supply unit 20b or the third identical component supply unit 20c. The case mounting completion time t1 (mounting completion time t2) is displayed.
(部品実装処理)
 第2実施形態の制御部9は、基板Bに電子部品Eを実装して生産する際、使いかけのリールの発生を抑制するために、第1同一部品供給部20aの電子部品Eの残数がしきい値未満になったことに基づいて、オペレータにより選択された第2同一部品供給部20bのみから電子部品Eを供給する制御に切り替えるように構成されている。ここで、オペレータは、表示部3に表示された上記電子部品Eの残数および上記実装完了時間を参照して適切な同一部品供給部20(たとえば、第2同一部品供給部20b)を選択する。
(Parts mounting process)
The control unit 9 of the second embodiment mounts the electronic component E on the substrate B for production, and in order to suppress the generation of used reels, the remaining number of the electronic components E of the first identical component supply unit 20a. Is configured to switch from only the second identical component supply unit 20b selected by the operator to the control of supplying the electronic component E based on the fact that is less than the threshold value. Here, the operator selects an appropriate same component supply unit 20 (for example, the second identical component supply unit 20b) by referring to the remaining number of the electronic components E displayed on the display unit 3 and the mounting completion time. ..
 このように、制御部9は、関連付け情報9aに基づいて第2同一部品供給部20bおよび第3同一部品供給部20cが取得された場合、表示部3に表示された第2同一部品供給部20bおよび第3同一部品供給部20cの各々のうちから1つの第2同一部品供給部20bが選択されたことに基づいて、第1同一部品供給部20aから供給する分の電子部品Eを選択された第2同一部品供給部20bから電子部品Eを供給する制御に切り替えるように構成されている。なお、選択された第3同一部品供給部20cであってもよい。また、第2実施形態のその他の構成は、第1実施形態の構成と同様である。 As described above, when the second identical component supply unit 20b and the third identical component supply unit 20c are acquired based on the association information 9a, the control unit 9 displays the second identical component supply unit 20b displayed on the display unit 3. Based on the fact that one second identical component supply unit 20b is selected from each of the third identical component supply unit 20c, the electronic component E to be supplied from the first identical component supply unit 20a is selected. It is configured to switch to the control of supplying the electronic component E from the second identical component supply unit 20b. The selected third identical component supply unit 20c may be used. Further, the other configurations of the second embodiment are the same as the configurations of the first embodiment.
(部品実装処理のフローチャート)
 以下に、図10を参照して、制御部9による部品実装処理について説明する。部品実装処理は、オペレータにより選択された同一部品供給部20を共有するように制御を切り替える処理である。
(Flow chart of component mounting process)
Hereinafter, the component mounting process by the control unit 9 will be described with reference to FIG. 10. The component mounting process is a process of switching control so as to share the same component supply unit 20 selected by the operator.
 ステップS1~S4は、第1実施形態の部品実装処理のステップS1~S4と同じ処理であるので説明を省略する。ステップS201において、制御部9では、切り替え可能な同一部品供給部20のリストが表示される。ステップS202において、制御部9では、表示部3に表示されたリストからオペレータにより選択された同一部品供給部20が受け付けられる。 Since steps S1 to S4 are the same processes as steps S1 to S4 of the component mounting process of the first embodiment, the description thereof will be omitted. In step S201, the control unit 9 displays a list of switchable same component supply units 20. In step S202, the control unit 9 accepts the same component supply unit 20 selected by the operator from the list displayed on the display unit 3.
(第2実施形態の効果)
 第2実施形態では、上記第1実施形態と同様に、制御部9は、複数の同一部品供給部20のうちの第1同一部品供給部20aおよび第2同一部品供給部20bの各々から供給された電子部品Eを同じ基板作業位置Wに配置された基板Bに実装する場合に、第1同一部品供給部20aの電子部品Eの残数がしきい値未満になったことに基づいて、第1同一部品供給部20aによる電子部品Eの供給を停止するとともに、第1同一部品供給部20aから供給する分の電子部品Eを第2同一部品供給部20bから供給する制御に切り替えるように構成されている。これにより、異なる基板作業位置Wに基板Bを配置しなくても、電子部品Eの実装を代行させることができる。
(Effect of the second embodiment)
In the second embodiment, similarly to the first embodiment, the control unit 9 is supplied from each of the first identical component supply unit 20a and the second identical component supply unit 20b among the plurality of identical component supply units 20. When the electronic component E is mounted on the board B arranged at the same board working position W, the number of remaining electronic components E in the first same component supply unit 20a is less than the threshold value. 1 It is configured to stop the supply of the electronic component E by the same component supply unit 20a and switch to the control of supplying the electronic component E supplied from the first identical component supply unit 20a from the second identical component supply unit 20b. ing. As a result, the mounting of the electronic component E can be performed on behalf of the board B without arranging the board B at different board work positions W.
 また、第2実施形態では、上記のように、部品実装装置100は、第2同一部品供給部20bの電子部品Eの残数を表示する表示部3を備えている。表示部3は、第1同一部品供給部20aから供給する分の電子部品Eを第2同一部品供給部20bから供給する制御に切り替えた場合の実装完了時間とを表示する。制御部9は、関連付け情報9aに基づいて取得された第2同一部品供給部20bが複数ある場合、表示部3に表示された複数の第2同一部品供給部20bの各々のうちから1つの第2同一部品供給部20bが選択されたことに基づいて、第1同一部品供給部20aから供給する分の電子部品Eを選択された第2同一部品供給部20bから電子部品Eを供給する制御に切り替えるように構成されている。これにより、オペレータが表示部3により表示された第2同一部品供給部20bの電子部品Eの残数を参照して第2同一部品供給部20bを選択することにより、第2同一部品供給部20bから電子部品Eを供給する制御の切り替え回数を考慮して第2同一部品供給部20bを選択することができるので、第2同一部品供給部20bから電子部品Eを供給する制御の切り替え回数の増加を抑制することができる。また、オペレータが表示部3により表示された実装完了時間を参照して第2同一部品供給部20bを選択することにより、基板Bの生産時間が短い第2同一部品供給部20bを選択することができるので、第2同一部品供給部20bからの電子部品Eの実装に切り替えた後の基板Bの生産時間の増加を抑制することができる。なお、第2実施形態のその他の効果は、上記第1実施形態の効果と同様である。 Further, in the second embodiment, as described above, the component mounting device 100 includes a display unit 3 that displays the remaining number of electronic components E of the second identical component supply unit 20b. The display unit 3 displays the mounting completion time when the electronic component E supplied from the first identical component supply unit 20a is switched to the control supplied from the second identical component supply unit 20b. When the control unit 9 has a plurality of second identical component supply units 20b acquired based on the association information 9a, the control unit 9 is one of the plurality of second identical component supply units 20b displayed on the display unit 3. 2 Based on the selection of the same component supply unit 20b, the electronic component E supplied from the first identical component supply unit 20a is controlled to supply the electronic component E from the selected second identical component supply unit 20b. It is configured to switch. As a result, the operator selects the second identical component supply unit 20b by referring to the remaining number of electronic components E of the second identical component supply unit 20b displayed by the display unit 3, so that the second identical component supply unit 20b is selected. Since the second identical component supply unit 20b can be selected in consideration of the number of switching of the control for supplying the electronic component E from the above, the number of switching of the control for supplying the electronic component E from the second identical component supply unit 20b is increased. Can be suppressed. Further, the operator can select the second identical component supply unit 20b with reference to the mounting completion time displayed by the display unit 3, thereby selecting the second identical component supply unit 20b having a short production time of the substrate B. Therefore, it is possible to suppress an increase in the production time of the substrate B after switching to the mounting of the electronic component E from the second identical component supply unit 20b. The other effects of the second embodiment are the same as the effects of the first embodiment.
[第3実施形態]
 図1、図6、図7および図11を参照して、第3実施形態による部品実装装置100の構成について説明する。第3実施形態では、第2実施形態とは異なり、制御部9により自動で第1ヘッド5と第2ヘッド6とで共有する同一部品供給部20が選択される。なお、第3実施形態では、第2実施形態の構成と重複する部分については、符号を流用するとともに詳細な説明を省略する。
[Third Embodiment]
The configuration of the component mounting device 100 according to the third embodiment will be described with reference to FIGS. 1, 6, 7, and 11. In the third embodiment, unlike the second embodiment, the control unit 9 automatically selects the same component supply unit 20 shared by the first head 5 and the second head 6. In the third embodiment, the reference numerals are used and detailed description thereof will be omitted for the parts that overlap with the configurations of the second embodiment.
 図1に示すように、部品実装装置100は、基台1と、フィーダ配置部2と、表示部3と、基板搬送部4と、複数の支持部(図示せず)と、複数の一対のレール部(図示せず)と、第1ヘッド5と、第2ヘッド6と、部品認識カメラ7と、基板認識カメラ8と、制御部9とを備えている。なお、第1ヘッド5および第2ヘッド6は、請求の範囲の「ヘッド」の一例である。 As shown in FIG. 1, the component mounting device 100 includes a base 1, a feeder arrangement unit 2, a display unit 3, a substrate transport unit 4, a plurality of support units (not shown), and a plurality of pairs. It includes a rail unit (not shown), a first head 5, a second head 6, a component recognition camera 7, a board recognition camera 8, and a control unit 9. The first head 5 and the second head 6 are examples of "heads" in the claims.
(部品実装処理)
 第3実施形態の制御部9は、基板Bに部品を実装して生産する際、使いかけのリールの発生を抑制するために、第1同一部品供給部20aの電子部品Eの残数がしきい値未満になったことに基づいて、自動で選択された第2同一部品供給部20bから電子部品Eを供給する制御に切り替えるように構成されている。ここで、制御部9は、予め設定された優先度に基づいて、適切な同一部品供給部20(たとえば、第2同一部品供給部20b)を選択する制御を行うように構成されている。
(Parts mounting process)
In the control unit 9 of the third embodiment, when the components are mounted on the substrate B and produced, the remaining number of the electronic components E of the first identical component supply unit 20a is increased in order to suppress the generation of used reels. It is configured to switch to the control of supplying the electronic component E from the second identical component supply unit 20b automatically selected based on the fact that the value becomes less than the threshold value. Here, the control unit 9 is configured to control to select an appropriate same component supply unit 20 (for example, the second identical component supply unit 20b) based on a preset priority.
 このように、制御部9は、記憶部に記憶された第2同一部品供給部20bおよび第3同一部品供給部20cの各々の電子部品Eの残数に基づいて、第2同一部品供給部20bを選択するとともに、第1同一部品供給部20aから供給する分の電子部品Eを選択した第2同一部品供給部20bから電子部品Eを供給する制御に切り替えるように構成されている。ここで、制御部9は、第2同一部品供給部20bおよび第3同一部品供給部20cの各々の電子部品Eの残数のうち電子部品Eの残数が多い方を優先的に選択する制御を行うように構成されている。なお、第3実施形態のその他の構成は、第2実施形態の構成と同様である。 As described above, the control unit 9 has the second identical component supply unit 20b based on the remaining number of the electronic components E of the second identical component supply unit 20b and the third identical component supply unit 20c stored in the storage unit. Is selected, and the electronic component E supplied from the first identical component supply unit 20a is switched to the control for supplying the electronic component E from the selected second identical component supply unit 20b. Here, the control unit 9 preferentially selects the one having the larger remaining number of electronic parts E among the remaining number of electronic parts E of each of the second identical component supply unit 20b and the third identical component supply unit 20c. Is configured to do. The other configurations of the third embodiment are the same as the configurations of the second embodiment.
(部品実装処理のフローチャート)
 以下に、図11を参照して、制御部9による部品実装処理について説明する。部品実装処理は、優先度に基づいて自動で選択された同一部品供給部20を共有するように制御を切り替える処理である。
(Flow chart of component mounting process)
Hereinafter, the component mounting process by the control unit 9 will be described with reference to FIG. The component mounting process is a process of switching the control so as to share the same component supply unit 20 automatically selected based on the priority.
 ステップS1~S4は、第1実施形態の部品実装処理のステップS1~S4と同じ処理であるので説明を省略する。ステップS301において、制御部9では、電子部品Eの残数が多い同一部品供給部20が選択される。なお、制御部9では、電子部品Eの残数が少ない同一部品供給部20、または、吸着されるヘッドが同じヘッドである同一部品供給部20が選択されてもよい。 Since steps S1 to S4 are the same processes as steps S1 to S4 of the component mounting process of the first embodiment, the description thereof will be omitted. In step S301, the control unit 9 selects the same component supply unit 20 having a large number of remaining electronic components E. The control unit 9 may select the same component supply unit 20 having a small remaining number of electronic components E, or the same component supply unit 20 having the same head to be adsorbed.
(第3実施形態の効果)
 第3実施形態では、以下のような効果を得ることができる。
(Effect of the third embodiment)
In the third embodiment, the following effects can be obtained.
 第3実施形態では、上記第1実施形態と同様に、制御部9は、複数の同一部品供給部20のうちの第1同一部品供給部20aおよび第2同一部品供給部20bの各々から供給された電子部品Eを同じ基板作業位置Wに配置された基板Bに実装する場合に、第1同一部品供給部20aの電子部品Eの残数がしきい値未満になったことに基づいて、第1同一部品供給部20aによる電子部品Eの供給を停止するとともに、第1同一部品供給部20aから供給する分の電子部品Eを第2同一部品供給部20bから供給する制御に切り替えるように構成されている。これにより、異なる基板作業位置Wに基板Bを配置しなくても、電子部品Eの実装を代行させることができる。 In the third embodiment, similarly to the first embodiment, the control unit 9 is supplied from each of the first identical component supply unit 20a and the second identical component supply unit 20b among the plurality of identical component supply units 20. When the electronic component E is mounted on the board B arranged at the same board working position W, the number of remaining electronic components E in the first same component supply unit 20a is less than the threshold value. 1 It is configured to stop the supply of the electronic component E by the same component supply unit 20a and switch to the control of supplying the electronic component E supplied from the first identical component supply unit 20a from the second identical component supply unit 20b. ing. As a result, the mounting of the electronic component E can be performed on behalf of the board B without arranging the board B at different board work positions W.
 また、第3実施形態では、上記のように、記憶部には、複数の同一部品供給部20の各々の電子部品Eの残数、および、複数の同一部品供給部20の各々の電子部品Eの吸着に用いられるヘッドの種類が記憶されている。制御部9は、記憶部に記憶された複数の同一部品供給部20のうちの複数の第2同一部品供給部20bの各々の電子部品Eの残数、または、複数の第2同一部品供給部20bの各々のヘッドの種類に基づいて、第2同一部品供給部20bを選択するとともに、第1同一部品供給部20aから供給する分の電子部品Eを選択した第2同一部品供給部20bから電子部品Eを供給する制御に切り替えるように構成されている。これにより、第2同一部品供給部20bを制御部9により自動で選択することができるので、オペレータの作業負担を軽減させることができる。なお、第3実施形態のその他の効果は、上記第2実施形態の効果と同様である。 Further, in the third embodiment, as described above, in the storage unit, the remaining number of the electronic components E of each of the plurality of identical component supply units 20 and the electronic components E of each of the plurality of identical component supply units 20 are stored in the storage unit. The type of head used for adsorption is stored. The control unit 9 is the remaining number of electronic components E of each of the plurality of second identical component supply units 20b among the plurality of identical component supply units 20 stored in the storage unit, or the plurality of second identical component supply units. Based on the type of each head of 20b, the second identical component supply unit 20b is selected, and the electronic component E to be supplied from the first identical component supply unit 20a is selected from the second identical component supply unit 20b. It is configured to switch to control to supply component E. As a result, the second identical component supply unit 20b can be automatically selected by the control unit 9, so that the work load on the operator can be reduced. The other effects of the third embodiment are the same as the effects of the second embodiment.
[第4実施形態]
 図1および図12を参照して、第4実施形態による部品実装装置100の構成について説明する。第4実施形態では、第1実施形態とは異なり、第1ヘッド5および第2ヘッド6により共有された同一部品供給部20が選択された後、共有が解除される。なお、第4実施形態では、第1実施形態の構成と重複する部分については、符号を流用するとともに詳細な説明を省略する。
[Fourth Embodiment]
The configuration of the component mounting device 100 according to the fourth embodiment will be described with reference to FIGS. 1 and 12. In the fourth embodiment, unlike the first embodiment, the sharing is released after the same component supply unit 20 shared by the first head 5 and the second head 6 is selected. In the fourth embodiment, reference numerals are used for the parts that overlap with the configuration of the first embodiment, and detailed description thereof will be omitted.
 図1に示すように、部品実装装置100は、基台1と、フィーダ配置部2と、表示部3と、基板搬送部4と、複数の支持部(図示せず)と、複数の一対のレール部(図示せず)と、第1ヘッド5と、第2ヘッド6と、部品認識カメラ7と、基板認識カメラ8と、制御部9とを備えている。なお、第1ヘッド5および第2ヘッド6は、請求の範囲の「ヘッド」の一例である。 As shown in FIG. 1, the component mounting device 100 includes a base 1, a feeder arrangement unit 2, a display unit 3, a substrate transport unit 4, a plurality of support units (not shown), and a plurality of pairs. It includes a rail unit (not shown), a first head 5, a second head 6, a component recognition camera 7, a board recognition camera 8, and a control unit 9. The first head 5 and the second head 6 are examples of "heads" in the claims.
(部品実装処理)
 第4実施形態の制御部9は、基板Bに電子部品Eを実装して生産する際、使いかけのリールの発生を抑制するために、第1同一部品供給部20aの電子部品Eの残数がしきい値未満になったことに基づいて、第2同一部品供給部20bのみから電子部品Eを供給する制御に切り替えるように構成されている。そして、制御部9は、第1同一部品供給部20aに電子部品Eが補充されたことに基づいて、第2同一部品供給部20bのみから電子部品Eを供給する制御を、第1同一部品供給部20aおよび第2同一部品供給部20bの両方から電子部品Eを供給する制御に切り替えるように構成されている。
(Parts mounting process)
The control unit 9 of the fourth embodiment mounts the electronic component E on the substrate B for production, and in order to suppress the generation of used reels, the remaining number of the electronic components E of the first identical component supply unit 20a. Is configured to switch to the control of supplying the electronic component E only from the second identical component supply unit 20b based on the fact that is less than the threshold value. Then, the control unit 9 controls to supply the electronic component E only from the second identical component supply unit 20b based on the fact that the electronic component E is replenished to the first identical component supply unit 20a. It is configured to switch to the control of supplying the electronic component E from both the unit 20a and the second identical component supply unit 20b.
 具体的には、制御部9は、電子部品Eの残数がしきい値未満になった第1同一部品供給部20aの電子部品Eの残数が電子部品Eの補充によりしきい値以上に戻ったことに基づいて、第1同一部品供給部20aから供給する分の電子部品Eを第2同一部品供給部20bから電子部品Eを供給する制御を、第1同一部品供給部20aから電子部品Eを供給する制御に切り替えて基板Bへの電子部品Eの実装を継続させるように構成されている。なお、第4実施形態のその他の構成は、第1実施形態の構成と同様である。 Specifically, in the control unit 9, the remaining number of the electronic parts E of the first same component supply unit 20a in which the remaining number of the electronic parts E is less than the threshold value becomes equal to or higher than the threshold value by replenishing the electronic parts E. Based on the return, the control of supplying the electronic component E from the second identical component supply unit 20b to the electronic component E supplied from the first identical component supply unit 20a is controlled by the first identical component supply unit 20a. It is configured to switch to the control to supply E and continue the mounting of the electronic component E on the substrate B. The other configurations of the fourth embodiment are the same as the configurations of the first embodiment.
(部品実装処理のフローチャート)
 以下に、図12を参照して、制御部9による部品実装処理について説明する。部品実装処理は、共有された同一部品供給部20の共有を解除して元の同一部品供給部20からの電子部品Eの供給に復帰する処理である。
(Flow chart of component mounting process)
Hereinafter, the component mounting process by the control unit 9 will be described with reference to FIG. 12. The component mounting process is a process of canceling the sharing of the shared same component supply unit 20 and returning to the supply of the electronic component E from the original same component supply unit 20.
 ステップS1~S3は、第1実施形態の部品実装処理のステップS1~S3と同じ処理であるので説明を省略する。ステップS401において、制御部9では、第2同一部品供給部20bのみで電子部品Eを供給する状態から、第1同一電子部品E供給部および第2同一部品供給部20bの両方で電子部品Eが供給される状態に切り替えられる。 Since steps S1 to S3 are the same processes as steps S1 to S3 of the component mounting process of the first embodiment, the description thereof will be omitted. In step S401, in the control unit 9, from the state in which the electronic component E is supplied only by the second identical component supply unit 20b, the electronic component E is supplied by both the first identical electronic component E supply unit and the second identical component supply unit 20b. It can be switched to the supplied state.
(第4実施形態の効果)
 第4実施形態では、上記第1実施形態と同様に、制御部9は、複数の同一部品供給部20のうちの第1同一部品供給部20aおよび第2同一部品供給部20bの各々から供給された電子部品Eを同じ基板作業位置Wに配置された基板Bに実装する場合に、第1同一部品供給部20aの電子部品Eの残数がしきい値未満になったことに基づいて、第1同一部品供給部20aによる電子部品Eの供給を停止するとともに、第1同一部品供給部20aから供給する分の電子部品Eを第2同一部品供給部20bから供給する制御に切り替えるように構成されている。これにより、異なる基板作業位置Wに基板Bを配置しなくても、電子部品Eの実装を代行させることができる。
(Effect of Fourth Embodiment)
In the fourth embodiment, similarly to the first embodiment, the control unit 9 is supplied from each of the first identical component supply unit 20a and the second identical component supply unit 20b among the plurality of identical component supply units 20. When the electronic component E is mounted on the board B arranged at the same board working position W, the number of remaining electronic components E in the first same component supply unit 20a is less than the threshold value. 1 It is configured to stop the supply of the electronic component E by the same component supply unit 20a and switch to the control of supplying the electronic component E supplied from the first identical component supply unit 20a from the second identical component supply unit 20b. ing. As a result, the mounting of the electronic component E can be performed on behalf of the board B without arranging the board B at different board work positions W.
 また、第4実施形態では、上記のように、制御部9は、電子部品Eの残数がしきい値未満になった第1同一部品供給部20aの電子部品Eの残数が電子部品Eの補充によりしきい値以上に戻ったことに基づいて、第1同一部品供給部20aから供給する分の電子部品Eを第2同一部品供給部20bから電子部品Eを供給する制御を、第1同一部品供給部20aから電子部品Eを供給する制御に切り替えて基板Bへの電子部品Eの実装を継続させるように構成されている。これにより、第1同一部品供給部20aから電子部品Eを吸着する経路が予め最適な移動経路として取得されている場合、最適なノズルNの移動経路に戻して電子部品Eの実装を行うことができるので、基板Bへの電子部品Eの実装を効率良く行うことができる。なお、第4実施形態のその他の効果は、上記第1実施形態の効果と同様である。 Further, in the fourth embodiment, as described above, in the control unit 9, the remaining number of the electronic components E of the first same component supply unit 20a in which the remaining number of the electronic components E is less than the threshold value is the electronic component E. The control of supplying the electronic component E from the second identical component supply unit 20b to the amount supplied from the first identical component supply unit 20a based on the return to the threshold value or more by the replenishment of the first is performed. It is configured to switch to the control of supplying the electronic component E from the same component supply unit 20a and continue the mounting of the electronic component E on the substrate B. As a result, when the path for sucking the electronic component E from the first identical component supply unit 20a is acquired in advance as the optimum moving path, the electronic component E can be mounted by returning to the optimum moving path of the nozzle N. Therefore, the electronic component E can be efficiently mounted on the substrate B. The other effects of the fourth embodiment are the same as the effects of the first embodiment.
[第5実施形態]
 図13~図19を参照して、第5実施形態による部品実装装置500の構成について説明する。第2実施形態では、第1実施形態とは異なり、部品実装装置500は、インラインヘッドを有している。なお、第5実施形態では、第1実施形態の構成と重複する部分については、符号を流用するとともに詳細な説明を省略する。
[Fifth Embodiment]
The configuration of the component mounting device 500 according to the fifth embodiment will be described with reference to FIGS. 13 to 19. In the second embodiment, unlike the first embodiment, the component mounting device 500 has an in-line head. In the fifth embodiment, reference numerals are used for the parts that overlap with the configuration of the first embodiment, and detailed description thereof will be omitted.
 図13に示すように、部品実装装置500は、基台1と、フィーダ配置部2と、表示部3と、基板搬送部4と、複数の支持部(図示せず)と、複数の一対のレール部(図示せず)と、ヘッド505と、部品認識カメラ7と、基板認識カメラ8と、制御部509とを備えている。 As shown in FIG. 13, the component mounting device 500 includes a base 1, a feeder arrangement unit 2, a display unit 3, a substrate transport unit 4, a plurality of support units (not shown), and a plurality of pairs. It includes a rail unit (not shown), a head 505, a component recognition camera 7, a board recognition camera 8, and a control unit 509.
(ヘッド)
 ヘッド505は、部品実装用のユニットであり、作業位置において固定された基板Bに電子部品Eを実装するように構成されている。ヘッド505は、複数のノズルNが直線上に複数配置されたインラインヘッドである。
(head)
The head 505 is a component mounting unit, and is configured to mount the electronic component E on the substrate B fixed at the working position. The head 505 is an in-line head in which a plurality of nozzles N are arranged on a straight line.
(部品実装処理)
 第5実施形態の制御部509は、複数の同一部品供給部20のうちの第1同一部品供給部20aおよび第2同一部品供給部20bの各々から供給された電子部品Eを同じ基板作業位置Wに配置された基板Bに実装する場合に、第1同一部品供給部20aの電子部品Eの残数がしきい値未満になったことに基づいて、第1同一部品供給部20aによる電子部品Eの供給を停止するとともに、第1同一部品供給部20aから供給する分の電子部品Eを第2同一部品供給部20bから供給する制御に切り替えるように構成されている。
(Parts mounting process)
The control unit 509 of the fifth embodiment places the electronic component E supplied from each of the first identical component supply unit 20a and the second identical component supply unit 20b of the plurality of identical component supply units 20 at the same board work position W. Based on the fact that the remaining number of electronic components E of the first identical component supply unit 20a is less than the threshold value when mounted on the board B arranged in the first identical component supply unit 20a, the electronic component E by the first identical component supply unit 20a Is configured to be stopped and the electronic component E supplied from the first identical component supply unit 20a is switched to the control to be supplied from the second identical component supply unit 20b.
 図14~図19を参照して、以下に、第1同一部品供給部20aから供給する分の電子部品Eを第2同一部品供給部20bから供給する制御に切り替える制御の一例について説明する。まず、関連付け情報9aの一例について説明する。 With reference to FIGS. 14 to 19, an example of control for switching the electronic component E supplied from the first identical component supply unit 20a to the control supplied from the second identical component supply unit 20b will be described below. First, an example of the association information 9a will be described.
 図14に示すように、第1箇所P1には、たとえば、第1同一部品供給部20aが配置されている。第1同一部品供給部20aには、たとえば、第1部品C1が配置されている。第1同一部品供給部20aの第1部品C1を吸着するヘッドの種類は、たとえば、ヘッド505(図14、図16および図18ではH1と記載)である。さらに、第1同一部品供給部20aの第1部品C1を吸着するノズルNの種類は、たとえば、第1ノズルN1である。第1箇所P1の同一部品供給部情報としては、たとえば、第2箇所P2に配置された第1部品C1が設定されている。第1箇所P1の同一部品供給部情報としては、たとえば、第3箇所P3に配置された第1部品C1が設定されている。 As shown in FIG. 14, for example, the first identical component supply unit 20a is arranged at the first location P1. For example, the first component C1 is arranged in the first identical component supply unit 20a. The type of head that attracts the first component C1 of the first identical component supply unit 20a is, for example, the head 505 (described as H1 in FIGS. 14, 16 and 18). Further, the type of the nozzle N that adsorbs the first component C1 of the first identical component supply unit 20a is, for example, the first nozzle N1. As the same component supply unit information of the first location P1, for example, the first component C1 arranged at the second location P2 is set. As the same component supply unit information of the first location P1, for example, the first component C1 arranged at the third location P3 is set.
 第2箇所P2には、たとえば、第2同一部品供給部20bが配置されている。第2同一部品供給部20bには、たとえば、第1部品C1が配置されている。第2同一部品供給部20bの第1部品C1を吸着するヘッドの種類は、たとえば、ヘッド505(図14、図16および図18ではH1と記載)である。さらに、第2同一部品供給部20bの第1部品C1を吸着するノズルNの種類は、たとえば、第2ノズルN2である。第2箇所P2の同一部品供給部情報としては、たとえば、第1箇所P1に配置された第1部品C1が設定されている。第2箇所P2の同一部品供給部情報としては、たとえば、第3箇所P3に配置された第1部品C1が設定されている。 For example, the second identical parts supply unit 20b is arranged at the second location P2. For example, the first component C1 is arranged in the second identical component supply unit 20b. The type of head that attracts the first component C1 of the second identical component supply unit 20b is, for example, the head 505 (described as H1 in FIGS. 14, 16 and 18). Further, the type of the nozzle N that adsorbs the first component C1 of the second identical component supply unit 20b is, for example, the second nozzle N2. As the same component supply unit information of the second location P2, for example, the first component C1 arranged at the first location P1 is set. As the same component supply unit information of the second location P2, for example, the first component C1 arranged at the third location P3 is set.
 第3箇所P3には、たとえば、第3同一部品供給部20cが配置されている。第3同一部品供給部20cには、たとえば、第1部品C1が配置されている。第3同一部品供給部20cの第1部品C1を吸着するヘッドの種類は、たとえば、ヘッド505(図14、図16および図18ではH1と記載)である。さらに、第3同一部品供給部20cの第1部品C1を吸着するノズルNの種類は、たとえば、第3ノズルN3である。第3箇所P3の同一部品供給部情報としては、たとえば、第1箇所P1に配置された第1部品C1が設定されている。第3箇所P3の同一部品供給部情報としては、たとえば、第2箇所P2に配置された第1部品C1が設定されている。 For example, the third identical parts supply unit 20c is arranged at the third location P3. For example, the first component C1 is arranged in the third identical component supply unit 20c. The type of head that attracts the first component C1 of the third identical component supply unit 20c is, for example, the head 505 (described as H1 in FIGS. 14, 16 and 18). Further, the type of the nozzle N that adsorbs the first component C1 of the third identical component supply unit 20c is, for example, the third nozzle N3. As the same component supply unit information of the third location P3, for example, the first component C1 arranged at the first location P1 is set. As the same component supply unit information of the third location P3, for example, the first component C1 arranged at the second location P2 is set.
 第4箇所P4には、たとえば、第4同一部品供給部20dが配置されている。第4同一部品供給部20dには、たとえば、第1部品C1が配置されている。第4同一部品供給部20dの第1部品C1を吸着するヘッドの種類は、たとえば、第1ヘッドである。さらに、第4同一部品供給部20dの第1部品C1を吸着するノズルNの種類は、たとえば、第1ノズルN1である。第4箇所P4の同一部品供給部情報としては、たとえば、設定されていない。 For example, the fourth identical parts supply unit 20d is arranged at the fourth location P4. For example, the first component C1 is arranged in the fourth identical component supply unit 20d. The type of head that attracts the first component C1 of the fourth identical component supply unit 20d is, for example, the first head. Further, the type of the nozzle N that adsorbs the first component C1 of the fourth identical component supply unit 20d is, for example, the first nozzle N1. For example, it is not set as the same component supply unit information of the fourth location P4.
 図14および図15に示すように、制御部509は、通常、第1箇所P1の第1同一部品供給部20a、第2箇所P2の第2同一部品供給部20b、および、第3箇所P3の第3同一部品供給部20cの全てから電子部品Eを供給する制御を行うように構成されている。 As shown in FIGS. 14 and 15, the control unit 509 usually has the first identical component supply unit 20a of the first location P1, the second identical component supply unit 20b of the second location P2, and the third location P3. It is configured to control the supply of electronic components E from all of the third identical component supply units 20c.
 ここで、図16および図17に示すように、制御部509は、基板Bの生産が終盤になるまでの間、第1箇所P1の第1同一部品供給部20aにおいて電子部品Eがしきい値未満になったことに基づいて、第4箇所P4の第4同一部品供給部20dから電子部品Eの供給する制御に切り替えるように構成されている。具体的には、制御部509は、基板Bの生産が終盤になるまでの間、第1箇所P1の第1同一部品供給部20aにおいて電子部品Eの残数が0になったことに基づいて、予め設定された第4箇所P4の第4同一部品供給部20dから電子部品Eを補給するように構成されている。 Here, as shown in FIGS. 16 and 17, in the control unit 509, the electronic component E is the threshold value in the first identical component supply unit 20a of the first location P1 until the production of the substrate B is in the final stage. It is configured to switch to the control of supplying the electronic component E from the fourth identical component supply unit 20d of the fourth location P4 based on the fact that the value is less than the limit. Specifically, the control unit 509 is based on the fact that the remaining number of electronic components E in the first identical component supply unit 20a of the first location P1 becomes 0 until the production of the substrate B ends. , The electronic component E is replenished from the fourth identical component supply unit 20d of the fourth location P4 set in advance.
 また、図18および図19に示すように、制御部509は、基板Bの生産が終盤になった場合に、第1同一部品供給部20aの電子部品Eの残数がしきい値未満になったことに基づいて、第4箇所P4の第4同一部品供給部20dではなく、第1同一部品供給部20aから供給する分の電子部品Eを第2箇所P2の第2同一部品供給部20bから供給する制御に切り替えるように構成されている。なお、第5実施形態のその他の構成は、第1実施形態の構成と同様である。 Further, as shown in FIGS. 18 and 19, when the production of the substrate B ends in the control unit 509, the remaining number of the electronic components E in the first same component supply unit 20a becomes less than the threshold value. Based on this, the electronic component E supplied from the first identical component supply unit 20a instead of the fourth identical component supply section 20d at the fourth location P4 is supplied from the second identical component supply section 20b at the second location P2. It is configured to switch to supply control. The other configurations of the fifth embodiment are the same as the configurations of the first embodiment.
(第5実施形態の効果)
 第5実施形態では、以下のような効果を得ることができる。
(Effect of the fifth embodiment)
In the fifth embodiment, the following effects can be obtained.
 第5実施形態では、上記第1実施形態と同様に、制御部509は、複数の同一部品供給部20のうちの第1同一部品供給部20aおよび第2同一部品供給部20bの各々から供給された電子部品Eを同じ基板作業位置Wに配置された基板Bに実装する場合に、第1同一部品供給部20aの電子部品Eの残数がしきい値未満になったことに基づいて、第1同一部品供給部20aによる電子部品Eの供給を停止するとともに、第1同一部品供給部20aから供給する分の電子部品Eを第2同一部品供給部20bから供給する制御に切り替えるように構成されている。これにより、異なる基板作業位置Wに基板Bを配置しなくても、電子部品Eの実装を代行させることができる。 In the fifth embodiment, similarly to the first embodiment, the control unit 509 is supplied from each of the first identical component supply unit 20a and the second identical component supply unit 20b among the plurality of identical component supply units 20. When the electronic component E is mounted on the board B arranged at the same board working position W, the number of remaining electronic components E in the first same component supply unit 20a is less than the threshold value. 1 It is configured to stop the supply of the electronic component E by the same component supply unit 20a and switch to the control of supplying the electronic component E supplied from the first identical component supply unit 20a from the second identical component supply unit 20b. ing. As a result, the mounting of the electronic component E can be performed on behalf of the board B without arranging the board B at different board work positions W.
 また、第5実施形態では、上記のように、ヘッド507は、複数のノズルNが直線上に複数配置されたインラインヘッドを含んでいる。制御部509は、インラインヘッドの複数のノズルNにより複数の同一部品供給部20の各々から同時に電子部品Eの吸着動作をさせる場合に、第1同一部品供給部20aの電子部品Eの残数がしきい値未満になったことに基づいて、複数のノズルNのうち第1同一部品供給部20aから吸着していたノズルNと、複数のノズルNのうち第2同一部品供給部20bから吸着していたノズルNとにより共有された第2同一部品供給部20bから電子部品Eを供給する制御に切り替えて基板Bへの電子部品Eの実装を継続させるように構成されている。これにより、第1同一部品供給部20aの電子部品Eの残数がしきい値未満になる前において、インラインヘッドの複数のノズルNにより複数の同一部品供給部20の各々から同時に電子部品Eの吸着動作をさせることにより、複数のノズルNの各々への電子部品Eの吸着を効率良く行うことができる。また、第1同一部品供給部20aの電子部品Eの残数がしきい値未満にり第1同一部品供給部20aからの電子部品Eの供給を停止した後において、電子部品Eが配置されたテープが巻き回されたリールを新たに第1同一部品供給部20aに供給する必要がないので、新たなリールが使われないようにすることができる。これらの結果、電子部品Eを基板Bに実装する効率を向上させることができるとともに、使いかけのリールが増加することをより確実に抑制することができる。なお、第5実施形態のその他の効果は、上記第1実施形態の効果と同様である。 Further, in the fifth embodiment, as described above, the head 507 includes an in-line head in which a plurality of nozzles N are arranged on a straight line. When the control unit 509 simultaneously causes the electronic component E to be sucked from each of the plurality of identical component supply units 20 by the plurality of nozzles N of the inline head, the remaining number of the electronic component E of the first identical component supply unit 20a is reduced. Based on the fact that the value is less than the threshold value, the nozzle N that has been sucked from the first identical component supply unit 20a among the plurality of nozzles N and the nozzle N that has been sucked from the second same component supply unit 20b among the plurality of nozzles N are sucked. It is configured to switch to the control of supplying the electronic component E from the second identical component supply unit 20b shared by the nozzle N, and continue the mounting of the electronic component E on the substrate B. As a result, before the remaining number of the electronic components E of the first identical component supply unit 20a becomes less than the threshold value, the electronic components E are simultaneously supplied from each of the plurality of identical component supply units 20 by the plurality of nozzles N of the inline head. By causing the suction operation, the electronic component E can be efficiently sucked to each of the plurality of nozzles N. Further, after the remaining number of the electronic parts E of the first same parts supply unit 20a is less than the threshold value and the supply of the electronic parts E from the first same parts supply unit 20a is stopped, the electronic parts E are arranged. Since it is not necessary to newly supply the reel around which the tape is wound to the first identical component supply unit 20a, it is possible to prevent the new reel from being used. As a result, the efficiency of mounting the electronic component E on the substrate B can be improved, and the increase in the number of used reels can be suppressed more reliably. The other effects of the fifth embodiment are the same as the effects of the first embodiment.
[変形例]
 なお、今回開示された実施形態は、すべての点で例示であって制限的なものではないと考えられるべきである。本発明の範囲は、上記した実施形態の説明ではなく請求の範囲によって示され、さらに請求の範囲と均等の意味および範囲内でのすべての変更(変形例)が含まれる。
[Modification example]
It should be noted that the embodiments disclosed this time are exemplary in all respects and are not considered to be restrictive. The scope of the present invention is shown by the scope of claims rather than the description of the above-described embodiment, and further includes all modifications (modifications) within the meaning and scope equivalent to the scope of claims.
 たとえば、上記第1~第5実施形態では、第1同一部品供給部20a(一の同一部品供給部)における電子部品Eの残数のしきい値が1である例を示したが、本発明はこれに限られにない。本発明では、一の同一部品供給部における部品の残数のしきい値が1以外の数値であってもよい。 For example, in the first to fifth embodiments, the threshold value of the remaining number of electronic components E in the first identical component supply unit 20a (one identical component supply unit) is 1, but the present invention has been shown. Is not limited to this. In the present invention, the threshold value of the remaining number of parts in one and the same parts supply unit may be a numerical value other than 1.
 また、第1~第5実施形態では、制御部9(509)は、第1同一部品供給部20a、第2同一部品供給部20bおよび第3同一部品供給部20c(複数の同一部品供給部)の各々の電子部品Eの残数を取得するとともに、所定のタイミングで、第1同一部品供給部20a(一の同一部品供給部)において取得した部品の残数がしきい値未満になったか否かを確認する制御を行うように構成されている例を示したが、本発明はこれに限られない。本発明では、制御部は、複数の同一部品供給部の各々の電子部品の残数を取得した後、一の同一部品供給部において取得した部品の残数がしきい値未満になったか否かを確認する制御を行うように構成されていてもよい。 Further, in the first to fifth embodiments, the control unit 9 (509) includes a first identical component supply unit 20a, a second identical component supply unit 20b, and a third identical component supply unit 20c (a plurality of identical component supply units). Whether or not the remaining number of parts acquired in the first same part supply unit 20a (one same part supply unit) has become less than the threshold value at a predetermined timing while acquiring the remaining number of each electronic component E of the above. Although an example configured to perform control for confirming the above is shown, the present invention is not limited to this. In the present invention, after the control unit acquires the remaining number of electronic parts of each of a plurality of the same parts supply units, whether or not the remaining number of parts acquired in one same parts supply unit is less than the threshold value. It may be configured to perform control to confirm.
 また、上記第1~第5実施形態では、関連付け情報9aは、テーブルである例を示したが本発明はこれに限られない。本発明では、関連付け情報は、テーブル以外のマップなどのデータベースにより表された情報であってもよい。 Further, in the first to fifth embodiments, the association information 9a shows an example of a table, but the present invention is not limited to this. In the present invention, the association information may be information represented by a database such as a map other than the table.
 また、上記第3実施形態では、制御部9は、記憶部に記憶された複数の同一部品供給部20のうちの第2同一部品供給部20bおよび第3同一部品供給部20c(複数の同一部品供給部)の各々の部品の残数に基づいて、第2同一部品供給部20b(他の同一部品供給部)を選択する制御を行うように構成されている例を示したが、本発明はこれに限られない。本発明では、制御部は、部品の基板への実装時間が増大することを抑制するために、基板の記憶部に記憶された複数の他の同一部品供給部の各々のヘッドの種類に基づいて、同じヘッドの種類である他の同一部品供給部を選択する制御を行うように構成されていてもよい。また、制御部は、基板の記憶部に記憶された複数の他の同一部品供給部の各々のノズルの種類に基づいて、異なるノズルの種類である他の同一部品供給部を選択する制御を行うように構成されていてもよい。 Further, in the third embodiment, the control unit 9 has a second identical component supply unit 20b and a third identical component supply unit 20c (a plurality of identical components) among a plurality of identical component supply units 20 stored in the storage unit. An example is shown in which control is performed to select a second identical component supply unit 20b (another identical component supply unit) based on the remaining number of each component of the supply unit). Not limited to this. In the present invention, the control unit is based on the type of each head of a plurality of other identical component supply units stored in the storage unit of the substrate in order to suppress an increase in the mounting time of the component on the substrate. , It may be configured to control the selection of other same component supply units of the same head type. Further, the control unit controls to select another same component supply unit having a different nozzle type based on the nozzle type of each of the plurality of other identical component supply units stored in the storage unit of the substrate. It may be configured as follows.
 上記第1~第5実施形態では、第1同一部品供給部20aが、請求の範囲の「一の同一部品供給部」である例を示したが、本発明はこれに限られない。本発明では、第2同一部品供給部または第3同一部品供給部が、請求の範囲の「一の同一部品供給部」であってもよい。 In the first to fifth embodiments, the first identical component supply unit 20a is an example of the "one identical component supply unit" in the claims, but the present invention is not limited to this. In the present invention, the second identical component supply unit or the third identical component supply unit may be the "one identical component supply unit" in the claims.
 また、上記第1~第5実施形態では、説明の便宜上、制御部9(509)の制御処理を、処理フローに沿って順番に処理を行うフロー駆動型のフローチャートを用いて説明した例について示したが、本発明はこれに限られない。本発明では、制御部の制御処理を、イベント単位で処理を実行するイベント駆動型(イベントドリブン型)の処理により行ってもよい。この場合、完全なイベント駆動型で行ってもよいし、イベント駆動およびフロー駆動を組み合わせて行ってもよい。 Further, in the first to fifth embodiments, for convenience of explanation, an example in which the control processing of the control unit 9 (509) is described by using a flow-driven flowchart in which the processing is sequentially performed along the processing flow is shown. However, the present invention is not limited to this. In the present invention, the control process of the control unit may be performed by an event-driven type (event-driven type) process in which the process is executed in event units. In this case, it may be completely event-driven, or it may be a combination of event-driven and flow-driven.
 3 表示部
 5 第1ヘッド(ヘッド)
 6 第2ヘッド(ヘッド)
 9、509 制御部
 11a 関連付け情報
 20 同一部品供給部
 20a 第1同一部品供給部(一の同一部品供給部)
 20b 第2同一部品供給部(他の同一部品供給部)
 20c 第3同一部品供給部(他の同一部品供給部)
 20d 第4同一部品供給部(代替供給部)
 100、500 部品実装装置
 505 ヘッド
 B 基板
 E 電子部品(部品)
 N ノズル
 W 基板作業位置
3 Display 5 1st head (head)
6 2nd head (head)
9,509 Control unit 11a Association information 20 Same parts supply unit 20a First same parts supply unit (one same parts supply unit)
20b 2nd same parts supply part (other same parts supply part)
20c 3rd same parts supply part (other same parts supply part)
20d 4th same parts supply unit (alternative supply unit)
100, 500 Parts mounting device 505 Head B Board E Electronic parts (parts)
N Nozzle W Board work position

Claims (9)

  1.  基板に実装される部品のうち同一の部品を供給する複数の同一部品供給部と、
     前記複数の同一部品供給部から供給される部品を吸着し基板に部品を実装することにより基板を生産する複数のノズルが取り付けられたヘッドと、
     前記ノズルにより前記複数の同一部品供給部から部品を吸着して基板に実装する制御を行う制御部とを備え、
     前記制御部は、前記複数の同一部品供給部のうちの一の前記同一部品供給部および他の前記同一部品供給部の各々から供給された部品を同じ基板作業位置に配置された基板に実装する場合に、前記一の同一部品供給部の部品の残数がしきい値未満になったことに基づいて、前記一の同一部品供給部による部品の供給を停止するとともに、前記一の同一部品供給部から供給する分の部品を前記他の同一部品供給部から供給する制御に切り替えるように構成されている、部品実装装置。
    Multiple identical component supply units that supply the same component among the components mounted on the board,
    A head equipped with a plurality of nozzles for producing a board by adsorbing the parts supplied from the plurality of the same parts supply unit and mounting the parts on the board.
    It is provided with a control unit that controls the suction of components from the same component supply unit by the nozzle and mounting the components on the substrate.
    The control unit mounts components supplied from each of the same component supply unit and the other identical component supply unit of one of the plurality of identical component supply units on a board arranged at the same board work position. In this case, based on the fact that the remaining number of parts in the same parts supply unit is less than the threshold value, the supply of parts by the same parts supply unit is stopped and the same parts supply in the first unit is stopped. A component mounting device configured to switch the components supplied from the unit to the control supplied from the other same component supply unit.
  2.  前記制御部は、前記複数の同一部品供給部の各々の部品の残数を取得するとともに、所定のタイミングで、前記一の同一部品供給部において取得した部品の残数がしきい値未満になったか否かを確認する制御を行うように構成されている、請求項1に記載の部品実装装置。 The control unit acquires the remaining number of parts of each of the plurality of identical parts supply units, and at a predetermined timing, the remaining number of parts acquired by the same parts supply unit becomes less than the threshold value. The component mounting device according to claim 1, which is configured to perform control for confirming whether or not the device has been used.
  3.  前記複数の同一部品供給部の配置場所情報を互いに関連付けた関連付け情報を記憶した記憶部をさらに備え、
     前記制御部は、前記一の同一部品供給部の部品の残数がしきい値未満になった際、前記関連付け情報に基づいて、前記他の同一部品供給部の前記配置場所情報を取得するように構成されている、請求項1または2に記載の部品実装装置。
    Further, a storage unit for storing the association information in which the arrangement location information of the plurality of same component supply units is associated with each other is further provided.
    When the remaining number of parts of the same parts supply unit becomes less than the threshold value, the control unit acquires the arrangement location information of the other same parts supply unit based on the association information. The component mounting apparatus according to claim 1 or 2, which is configured in the above.
  4.  前記他の同一部品供給部の部品の残数と、前記一の同一部品供給部から供給する分の部品を前記他の同一部品供給部から供給する制御に切り替えた場合の実装完了時間とを表示する表示部をさらに備え、
     前記制御部は、前記関連付け情報に基づいて取得された前記他の同一部品供給部が複数ある場合、前記表示部に表示された複数の前記他の同一部品供給部の各々のうちから1つの前記他の同一部品供給部が選択されたことに基づいて、前記一の同一部品供給部から供給する分の部品を選択された前記他の同一部品供給部から部品を供給する制御に切り替えるように構成されている、請求項3に記載の部品実装装置。
    Displays the remaining number of parts of the other same parts supply unit and the mounting completion time when the control of supplying the parts supplied from the same parts supply unit is switched to the control of supplying from the other same parts supply unit. Further equipped with a display unit
    When the control unit has a plurality of other identical component supply units acquired based on the association information, the control unit is one of the plurality of other identical component supply units displayed on the display unit. Based on the selection of another same parts supply unit, the control is configured to switch the parts supplied from the same parts supply unit to the control of supplying parts from the selected other same parts supply unit. The component mounting apparatus according to claim 3.
  5.  前記記憶部には、前記複数の同一部品供給部の各々の部品の残数、および、前記複数の同一部品供給部の各々の部品の吸着に用いられる前記ヘッドの種類が記憶されており、
     前記制御部は、前記記憶部に記憶された前記複数の同一部品供給部のうちの複数の前記他の同一部品供給部の各々の部品の残数、または、複数の前記他の同一部品供給部の各々の前記ヘッドの種類に基づいて、前記他の同一部品供給部を選択するとともに、前記一の同一部品供給部から供給する分の部品を選択した前記他の同一部品供給部から部品を供給する制御に切り替えるように構成されている、請求項3に記載の部品実装装置。
    The storage unit stores the remaining number of parts of each of the plurality of identical component supply units and the type of the head used for suctioning each component of the plurality of identical component supply units.
    The control unit is the remaining number of parts of each of a plurality of the other same parts supply units among the plurality of the same parts supply units stored in the storage unit, or a plurality of the other same parts supply units. The other same parts supply unit is selected based on the type of each head, and the parts to be supplied from the same parts supply unit are selected to supply the parts from the other same parts supply unit. The component mounting apparatus according to claim 3, which is configured to switch to the control to be performed.
  6.  前記制御部は、部品の残数がしきい値未満になった前記一の同一部品供給部の部品の残数が部品の補充によりしきい値以上に戻ったことに基づいて、前記一の同一部品供給部から供給する分の部品を前記他の同一部品供給部から部品を供給する制御を、前記一の同一部品供給部から部品を供給する制御に切り替えて基板への部品の実装を継続させるように構成されている、請求項1~5のいずれか1項に記載の部品実装装置。 The control unit is the same as the one based on the fact that the remaining number of parts of the same one parts supply unit has returned to the threshold value or more by replenishing the parts. The control of supplying the parts supplied from the parts supply unit from the other same parts supply unit is switched to the control of supplying the parts from the same parts supply unit, and the mounting of the parts on the board is continued. The component mounting device according to any one of claims 1 to 5, which is configured as described above.
  7.  前記ヘッドは、前記複数のノズルが直線上に複数配置されたインラインヘッドを含み、
     前記制御部は、前記インラインヘッドの前記複数のノズルにより前記複数の同一部品供給部の各々から同時に部品の吸着動作をさせる場合に、前記一の同一部品供給部の部品の残数がしきい値未満になったことに基づいて、前記複数のノズルのうち前記一の同一部品供給部から吸着していたノズルと、前記複数のノズルのうち前記他の同一部品供給部から吸着していたノズルとにより共有された前記他の同一部品供給部から部品を供給する制御に切り替えて基板への部品の実装を継続させるように構成されている、請求項1~6のいずれか1項に記載の部品実装装置。
    The head includes an in-line head in which the plurality of nozzles are arranged in a straight line.
    When the control unit simultaneously sucks parts from each of the plurality of identical component supply units by the plurality of nozzles of the inline head, the remaining number of components in the same component supply unit is a threshold value. Based on the fact that the number is less than, the nozzle sucked from the same component supply unit of the plurality of nozzles and the nozzle sucked from the other same component supply section of the plurality of nozzles. The component according to any one of claims 1 to 6, which is configured to switch to the control of supplying the component from the other same component supply unit shared by the user and continue the mounting of the component on the board. Mounting device.
  8.  前記ヘッドは、前記複数のノズルが平面視において環状に複数配置された複数のロータリーヘッドを含み、
     前記制御部は、前記複数のロータリーヘッドの各々の前記複数のノズルにより前記一の同一部品供給部の各々から順次部品を吸着する場合に、前記一の同一部品供給部の部品の残数がしきい値未満になったことに基づいて、前記複数のロータリーヘッドのうち前記一の同一部品供給部から吸着していたロータリーヘッドと、前記複数のロータリーヘッドのうち前記他の同一部品供給部から吸着していたロータリーヘッドとにより共有された前記他の同一部品供給部から部品を供給する制御に切り替えて基板への部品の実装を継続させるように構成されている、請求項1~7のいずれか1項に記載の部品実装装置。
    The head includes a plurality of rotary heads in which the plurality of nozzles are arranged in a ring shape in a plan view.
    When the control unit sequentially sucks parts from each of the same parts supply units by the plurality of nozzles of each of the plurality of rotary heads, the remaining number of parts in the same parts supply unit is increased. Based on the fact that the value is less than the threshold value, the rotary head sucked from the same component supply section of the plurality of rotary heads and the other rotary head sucked from the same component supply section of the plurality of rotary heads. One of claims 1 to 7, which is configured to switch to the control of supplying parts from the other same parts supply unit shared by the rotary head, and continue mounting the parts on the board. The component mounting device according to item 1.
  9.  前記複数の同一部品供給部は、前記一の同一部品供給部において部品が無くなった際に代わりに部品を供給するように予め設定された代替供給部を有し、
     前記制御部は、基板の生産が終盤になるまでの間、前記一の同一部品供給部において部品がしきい値未満になったことに基づいて、前記代替供給部から部品の供給する制御に切り替えるように構成されており、
     前記制御部は、基板の生産が終盤になった場合に、前記一の同一部品供給部の部品の残数がしきい値未満になったことに基づいて、前記代替供給部ではなく、前記一の同一部品供給部から供給する分の部品を前記他の同一部品供給部から供給する制御に切り替えるように構成されている、請求項1~8のいずれか1項に記載の部品実装装置。
    The plurality of identical parts supply units have an alternative supply unit preset to supply parts in place of the parts when the parts are exhausted in the same parts supply unit.
    The control unit switches to control for supplying parts from the alternative supply unit based on the fact that the parts are less than the threshold value in the same component supply unit until the end of board production. Is configured to
    The control unit is not the alternative supply unit, but the one, based on the fact that the remaining number of parts in the same component supply unit is less than the threshold value when the production of the substrate is finished. The component mounting device according to any one of claims 1 to 8, wherein the components supplied from the same component supply unit are switched to the control supplied from the other same component supply unit.
PCT/JP2020/047476 2020-12-18 2020-12-18 Component mounting device WO2022130624A1 (en)

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JP2009049440A (en) * 2008-12-01 2009-03-05 Fuji Mach Mfg Co Ltd Electronic circuit component mounting system
JP2009182160A (en) * 2008-01-31 2009-08-13 Yamaha Motor Co Ltd Parts supply management system of surface mounting machine, and surface mounting machine
JP2011054711A (en) * 2009-09-01 2011-03-17 Panasonic Corp Electronic component-packaging device
JP2018056583A (en) * 2017-11-29 2018-04-05 富士機械製造株式会社 Electronic part mounting device

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JP5279666B2 (en) 2009-09-04 2013-09-04 ヤマハ発動機株式会社 Component mounter
JP6883702B2 (en) 2018-03-02 2021-06-09 ヤマハ発動機株式会社 Surface mounter

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Publication number Priority date Publication date Assignee Title
JP2009182160A (en) * 2008-01-31 2009-08-13 Yamaha Motor Co Ltd Parts supply management system of surface mounting machine, and surface mounting machine
JP2009049440A (en) * 2008-12-01 2009-03-05 Fuji Mach Mfg Co Ltd Electronic circuit component mounting system
JP2011054711A (en) * 2009-09-01 2011-03-17 Panasonic Corp Electronic component-packaging device
JP2018056583A (en) * 2017-11-29 2018-04-05 富士機械製造株式会社 Electronic part mounting device

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