WO2022126659A1

WO2022126659A1 - Anti-shake photosensitive assembly, anti-shake camera module, and electronic device

Info

Publication number: WO2022126659A1
Application number: PCT/CN2020/137785
Authority: WO
Inventors: 罗科
Original assignee: 欧菲光集团股份有限公司; 南昌欧菲光电技术有限公司
Priority date: 2020-12-18
Filing date: 2020-12-18
Publication date: 2022-06-23

Abstract

The present application provides an anti-shake photosensitive assembly, an anti-shake camera module, and an electronic device. The anti-shake photosensitive assembly comprises: a circuit board comprising a configuration surface; a driver, which is disposed on the configuration surface of the circuit board, and comprises a driving portion and a fixing portion which are electrically connected, the fixing portion being provided on one side of the driving portion; a photosensitive element, which is disposed on the side of the driving portion of the driver facing away from the circuit board and is electrically connected to the driving portion; and a base plate, which is disposed on the configuration surface of the circuit board and electrically connected to the circuit board, the base plate being located on the side of the fixing portion facing away from the driving portion, an accommodation recess being formed on the side of the base plate close to the fixing portion, and the fixing portion being at least partially located in the accommodation recess and electrically connected to the base plate. According to the anti-shake photosensitive assembly, the photosensitive element is moved by means of the driving portion of the driver, to achieve an anti-shake function of an anti-shake camera module; because the fixing portion of the driver is at least partially located in the accommodation recess, the anti-shake camera module can effectively protect the fixing portion during falling, and the imaging quality is stable.

Description

Anti-shake photosensitive components, anti-shake camera modules and electronic equipment

technical field

The present application relates to the technical field of optical imaging, and in particular, to an anti-shake photosensitive component, an anti-shake camera module and an electronic device.

Background technique

In recent years, electronic products, smart devices, etc. are increasingly developing towards miniaturization and high performance, and consumers have put forward more stringent requirements for the size and imaging capabilities of the camera modules of such devices. This also causes most of the existing electronic products and smart devices to pursue the compactness and functional integration of the camera module, and the anti-shake function is integrated into the camera module in this wave of development. Realize the anti-shake function of the camera module.

With the emergence of Micro-Electro-Mechanic System (MEMS), the anti-shake function in the prior art is realized by directly attaching the MEMS to the circuit board, and then attaching the photosensitive chip to the MEMS. , to move the photosensitive chip through MEMS to compensate for the offset of the photosensitive chip due to shaking, thereby realizing the anti-shake function of the camera module. In the process of realizing this application, the inventor found that there are at least the following problems in the prior art: the place where the camera module is most impacted when it is dropped is between the circuit board and the MEMS. There is a problem of poor drop, which affects the image quality of the camera module.

SUMMARY OF THE INVENTION

In view of this, it is necessary to provide an anti-shake photosensitive component, an anti-shake camera module and an electronic device to solve the above problems.

An embodiment of the present application provides an anti-shake photosensitive assembly, including:

a circuit board, the circuit board includes a configuration surface;

A driver is arranged on the configuration surface of the circuit board, the driver includes a driving part and a fixing part that are electrically connected, and the fixing part is arranged on one side of the driving part;

a photosensitive element, disposed on a side of the driving part of the driver away from the circuit board and electrically connected to the driving part; and

a base plate, disposed on the configuration surface of the circuit board and electrically connected to the circuit board, the base plate is located on the side of the fixing part away from the driving part, and the base plate is close to the fixing part An accommodating groove is opened on one side, and at least part of the fixing portion is located in the accommodating groove and is electrically connected to the substrate.

The above-mentioned anti-shake photosensitive assembly moves the photosensitive element through the driving part of the driver to compensate for the shift of the photosensitive element due to shaking, thereby realizing the anti-shake function of the anti-shake camera module; and, because at least part of the fixed part of the driver Being located in the accommodating slot, the base plate of the anti-shake camera module can effectively protect the fixed part when it is dropped, which can avoid the problem that the driver is prone to fall badly, and the image quality of the anti-shake camera module is relatively stable.

The embodiment of the present application also provides an anti-shake camera module, including:

The anti-shake photosensitive assembly as above; and

The optical lens is arranged on the photosensitive path of the anti-shake photosensitive component.

The anti-shake photosensitive assembly in the above-mentioned anti-shake camera module moves the photosensitive element through the driving part of the driver to compensate for the shift of the photosensitive element due to shaking, thereby realizing the anti-shake function of the anti-shake camera module; At least part of the fixing part is located in the accommodating groove, and the base plate can effectively protect the fixing part when the anti-shake camera module is dropped, which can avoid the problem that the driver is prone to poor falling, and the image quality of the anti-shake camera module is relatively stable .

The embodiment of the present application also provides an electronic device, including:

ontology; and

In the above-mentioned anti-shake camera module, the anti-shake camera module is arranged on the body.

The above-mentioned electronic equipment includes an anti-shake camera module, and the anti-shake photosensitive component in the anti-shake camera module moves the photosensitive element through the driving part of the driver, so as to compensate the deviation of the photosensitive element due to shaking, thereby realizing the anti-shake camera. The anti-shake function of the module; and, since at least part of the fixed part of the driver is located in the receiving groove, the base plate of the anti-shake camera module can effectively protect the fixed part when it is dropped, which can avoid the problem that the driver is prone to poor falling. , the image quality of the anti-shake camera module is relatively stable.

Description of drawings

FIG. 1 is a schematic cross-sectional view of an anti-shake camera module provided by a first embodiment of the present application.

FIG. 2 is a schematic cross-sectional view of the anti-shake photosensitive component in the anti-shake camera module shown in FIG. 1 .

FIG. 3 is a schematic structural diagram of a driver in the anti-shake camera module shown in FIG. 2 .

FIG. 4 is a schematic cross-sectional view of the anti-shake photosensitive component in the anti-shake camera module provided by the second embodiment of the present application.

FIG. 5 is a schematic three-dimensional structural diagram of an electronic device provided by a third embodiment of the present application.

Description of main component symbols

Electronic equipment 1000

Anti-shake camera module

100, 200

Anti-shake

photosensitive components

10, 210

Circuit board

11, 211

Configuration surface

112, 2112

Containment slot 1122

Drive

12, 212

Drive Department

122, 2122

Moving parts 1221

Carrier 1222

Fixed part

124, 2124

Outer frame 1241

Cross Bracket 1242

Driver 1243

Photosensitive element

13, 213

Substrate

14, 214

Holder slot

141, 2141

The first connection surface 142

inner side 143

Protrusion 144

Second connection surface 145

Conductive part 146

Fill space 147

The first line 15

Second hit 16

Connector 17

Buffer 18

Filler 19

Optical lens

20, 220

Optical axis 22

Ontology 300

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

It should be noted that when a component is said to be "electrically connected" to another component, it may be directly on the other component or there may also be an intervening component. When a component is considered to be "electrically connected" to another component, it can be a contact connection, eg, by means of a wire connection, or a contactless connection, eg, by a contactless coupling.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terms used herein in the specification of the application are for the purpose of describing specific embodiments only, and are not intended to limit the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Some embodiments of the present application will be described in detail below with reference to the accompanying drawings. The following embodiments and features of the embodiments may be combined with each other without conflict.

Referring to FIG. 1 , a first embodiment of the present application provides an anti-shake camera module 100 , which includes an anti-shake photosensitive component 10 and an optical lens 20 .

Please refer to FIG. 2 , the anti-shake photosensitive assembly 10 includes a circuit board 11 , a driver 12 , a photosensitive element 13 and a substrate 14 .

The circuit board 11 includes a configuration surface 112 . The driver 12 is disposed on the arrangement surface 112 of the circuit board 11 . The driver 12 includes a driving part 122 and a fixing part 124 which are electrically connected, and the fixing part 124 is arranged on one side of the driving part 122 . The photosensitive element 13 is disposed on the side of the driving part 122 of the driver 12 away from the circuit board 11 and is electrically connected to the driving part 122 . The base plate 14 is disposed on the configuration surface 112 of the circuit board 11 and is electrically connected to the circuit board 11 . The base plate 14 is located on the side of the fixing portion 124 away from the driving portion 122 , and the side of the base plate 14 close to the fixing portion 124 is provided with a receiving groove 141 . A portion of the fixing portion 124 is located in the accommodating groove 141 and is electrically connected to the substrate 14 .

The anti-shake photosensitive assembly 10 in the first embodiment moves the photosensitive element 13 through the driving part 122 of the driver 12 to compensate the shift of the photosensitive element 13 due to shaking, thereby realizing the anti-shake function of the anti-shake camera module 100 Moreover, since the part of the fixing part 124 of the driver 12 is located in the accommodating groove 141, the substrate 14 can effectively protect the fixing part 124 when the anti-shake camera module 100 is dropped, which can avoid the problem of poor drop of the driver 12, so that the anti-shake camera module 100 can effectively protect the fixed part 124 from falling. The image quality of the camera shake module 100 is relatively stable.

The circuit board 11 may be any one of a flexible circuit board (Flexible Printed Circuit, FPC), a printed circuit board (Printed Circuit Board, PCB), and a flexible-rigid combination circuit board, which can be specifically set according to actual needs. In this embodiment, the configuration surface 112 of the circuit board 11 is the upper surface in the figure, wherein the configuration surface 112 is a plane.

The driver 12 mainly drives the photosensitive element 13 to move.

Referring to FIG. 3 , the fixing portion 124 includes an outer frame 1241 , a cross-shaped bracket 1242 and a driving member 1243 . The fixing portion 124 is fixed on the circuit board 11 . Specifically, the driving member 1243 is fixed on the cross-shaped bracket 1242 , and the outer frame 1241 And the cross-shaped bracket 1242 is fixed on the arrangement surface 112 of the circuit board 11 .

The driving part 122 includes a moving part 1221 and a carrier 1222 . One part of the moving part 1221 is connected to the carrier 1222 , and the other part is connected to the cross-shaped bracket 1242 in the fixed part 124 . The surface of the stage 1222 facing away from the circuit board 11 is used for mounting the photosensitive element 13 .

In this embodiment, by setting the driving member 1243 to drive the moving member 1221 to move, the stage 1222 is driven to move, so that the photosensitive element 13 mounted on the stage 1222 follows and moves, so that the position of the photosensitive element 13 and the optical lens 20 are aligned, achieve anti-shake effect.

It can be understood that when the plane coordinate system XY is established with the configuration surface 112 of the circuit board 11, the driving part 122 of the driver 12 disposed on the configuration surface 112 of the circuit board 11 can translate in the X-axis direction and the Y-axis direction, and in the The XY plane rotates, so that the anti-shake function of translation in the X-axis direction and the Y-axis direction and rotation in the XY plane is realized by the driver 12 .

In this embodiment, the number of drivers 12 is four and they are arranged in a rectangular shape, the corresponding number of photosensitive elements 13 is also four, and the four drivers 12 and the four photosensitive elements 13 are arranged in a one-to-one correspondence. It can be understood that, in other embodiments, the number of the drivers 12 can also be one, two or five, but is not limited thereto.

In this embodiment, the fixing part 124 of the driver 12 and the driving part 122 together constitute a Micro-Electro-Mechanic System (MEMS for short). The micro-electromechanical system can drive the photosensitive element 13 to move to compensate for the shift of the photosensitive element 13 due to shaking, thereby realizing the anti-shake function of the anti-shake camera module 100 .

Wherein, the anti-shake photosensitive assembly 10 further includes a first bonding wire 15 .

One end of the first bonding wire 15 is connected to the driving part 122 of the driver 12 , and the other end is connected to the fixing part 124 of the driver 12 , so as to realize the electrical connection between the driving part 122 and the fixing part 124 . Specifically, both the upper surface of the driving part 122 and the upper surface of the fixing part 124 have a connecting plate, and both ends of the first bonding wire 15 are respectively fixed and connected to the connecting plate of the driving part 122 and the connection of the fixing part 124 by welding. on the plate.

In this way, the first bonding wire 15 can conduct the driving part 122 and the fixing part 124 , and the elastic deformation of the first bonding wire 15 can also be used to prevent the fixing part 124 from affecting the movement of the driving part 122 .

It can be understood that there are multiple first bonding wires 15 , such as four, five, or six, but not limited to this, and can be specifically set according to actual needs. A plurality of first bonding wires 15 are combined together to play the role of suspending the driving part 122 .

It can be understood that the first bonding wire 15 can be made of a conductive material with a certain elasticity, such as copper wire, aluminum wire, gold wire, etc., and the two ends of the first bonding wire 15 are respectively arranged on the fixing part through the wire bonding process 124 and the drive part 122 .

The photosensitive element 13 can be a complementary metal oxide semiconductor (CMOS, Complementary Metal Oxide Semiconductor) image sensor or a charge-coupled device (CCD, Charge-coupled Device).

Wherein, the anti-shake photosensitive assembly 10 further includes a second bonding wire 16 .

One end of the second bonding wire 16 is connected to the photosensitive element 13 , and the other end is connected to the driving part 122 of the driver 12 , so as to realize the electrical connection between the photosensitive element 13 and the driving part 122 . Specifically, the upper surface of the photosensitive element 13 also has a connection pad, and both ends of the second bonding wire 16 are fixedly connected to the connection pad of the driving part 122 and the connection pad of the photosensitive element 13 by welding respectively.

In this way, the second bonding wire 16 can conduct the photosensitive element 13 and the driving part 122 , and the elastic deformation of the second bonding wire 16 can also be used to prevent the driving part 122 from affecting the movement of the photosensitive element 13 .

It can be understood that the second bonding wire 16 can be made of a conductive material with certain elasticity, such as copper wire, aluminum wire, gold wire, etc., and the two ends of the second bonding wire 16 are respectively arranged on the photosensitive element 13 through the wire bonding process. and the drive unit 122 .

In this embodiment, the ends of the first bonding wire 15 and the second bonding wire 16 connected to the driving part 122 are connected together by a connecting member 17, which can be understood as a pad, conductive glue , but not limited to this.

The anti-shake photosensitive assembly 10 further includes a buffer member 18 .

The buffer member 18 is provided between the arrangement surface 112 of the circuit board 11 and the driver 12 .

In this way, the buffer member 18 can buffer the force received by the driver 12 when the anti-shake camera module 100 is dropped.

The arrangement surface 112 is provided with a receiving groove 1122 , and the buffer member 18 is disposed in the receiving groove 1122 .

In this way, the position of the buffer member 18 can be limited to prevent the buffer member 18 from shifting when the anti-shake camera module 100 is dropped, and it can also ensure that the buffer member 18 buffers the force received by the driver 12 .

It can be understood that the buffer member 18 is made of a flexible material and has certain buffering properties, such as rubber.

In some embodiments, there is a gap between one end of the buffer member 18 close to the inner side surface 143 of the substrate 14 and the inner side surface 143 .

In this way, a sufficient installation clearance can be ensured so that the buffer member 18 is installed between the driver 12 and the arrangement surface 112 of the circuit board 11.

The base plate 14 is a rotating body. The base plate 14 has a first connection surface 142 and an inner side surface 143 .

In this embodiment, the first connection surface 142 is the lower bottom surface of the substrate 14 . The first connection surface 142 is disposed close to the circuit board 11 and is fixedly connected to the configuration surface 112 . Specifically, the first connection surface 142 and the configuration surface 112 are fixedly connected by welding. Before welding, an anisotropic conductive film (ACF) needs to be applied to the position of the configuration surface 112 corresponding to the first connection surface 142 .

A portion of the inner side surface 143 extends toward the optical axis to form a protruding portion 144 , the side of the protruding portion 144 close to the circuit board 11 has a second connecting surface 145 , and the accommodating groove 141 is composed of the second connecting surface 145 , the inner side surface 143 and the configuration surface. 112 enclosures are formed.

The substrate 14 also has a conductive portion 146 , one end of the conductive portion 146 penetrates the first connection surface 142 and is electrically connected to the circuit board 11 , and the other end of the conductive portion 146 penetrates the second connection surface 145 and is electrically connected to the fixing portion 124 . In this embodiment, the substrate 14 is made of a ceramic material, the conductive portion 146 is made of a metal material, such as copper and aluminum, and the conductive portion 146 is formed inside the substrate 14 . In this way, the substrate 14 is fixedly connected to the circuit board 11 through the first connection surface 142 , the electrical connection between the fixed part 124 of the driver 12 and the circuit board 11 is realized through the conductive part 146 , and the second connection surface 145 of the protruding part 144 is used for anti-shake. When the camera module 100 is dropped, the driver 12 is effectively protected, and the problem of poor drop of the driver 12 can be avoided.

It can be understood that, in other embodiments, the conductive portion 146 is provided on the surface of the substrate 14 . Specifically, the conductive portion 146 may form a plating layer on the surface of the substrate 14 by electroplating.

It can be understood that, in other embodiments, part of the conductive portion 146 is provided in the substrate 14 , and another part is provided on the surface of the substrate 14 , such as at least one of the second connection surface 145 and the inner side surface 143 .

It can be understood that in other embodiments, the substrate 14 can also be composed of two circuit boards.

In this embodiment, the connection pad on the side of the fixing portion 124 away from the arrangement surface 112 of the circuit board 11 is electrically connected to the conductive portion 146 through solder joints. In this way, electrical connection between the circuit board 11 and the fixing portion 124 can be achieved.

In this embodiment, a filling space 147 is formed between the accommodating groove 141 and the fixing portion 124 of the driver 12 . The filling space 147 is substantially annular and is disposed around the driver 12 .

In some embodiments, the anti-shake photosensitive assembly 10 further includes:

The filling body 19 is filled in the filling space 147 .

In this way, the filler 19 can connect the circuit board 11 , the fixing portion 124 of the driver 12 and the substrate as a whole, thereby increasing the anti-drop performance of the driver 12 .

The optical lens 20 is disposed on the photosensitive path of the photosensitive element 23 to form the anti-shake camera module 100 .

The number of optical lenses 20 may be one or multiple, and each optical lens 20 may include one lens or multiple lenses, which may be set according to actual needs, which is not limited herein.

Referring to FIG. 4 , a second embodiment of the present application provides an anti-shake camera module 200 , which includes an anti-shake photosensitive component 210 and an optical lens 220 , and the anti-shake photosensitive component 110 includes a circuit board 211 , a driver 212 , a photosensitive element 213 and a substrate 214 , the circuit board 211 includes a configuration surface 2112 . The driver 212 is disposed on the configuration surface 2112 of the circuit board 211 . The driver 212 includes a driving part 2122 and a fixing part 2124 which are electrically connected, and the fixing part 2124 is arranged on one side of the driving part 2122 . The photosensitive element 213 is disposed on the side of the driving part 2122 of the driver 212 away from the circuit board 211 and is electrically connected to the driving part 2122 . The base plate 214 is disposed on the configuration surface 2112 of the circuit board 211 and is electrically connected to the circuit board 211 . The structure of the anti-shake camera module 200 of the second embodiment is substantially the same as that of the anti-shake camera module 100 of the first embodiment.

The anti-shake photosensitive assembly 10 in the second embodiment moves the photosensitive element 13 through the driving part 122 of the driver 12 to compensate for the shift of the photosensitive element 13 due to shaking, thereby realizing the anti-shake function of the anti-shake camera module 100; In addition, since all the fixing parts 124 of the driver 12 are located in the accommodating grooves 141 , the substrate 14 can effectively protect the fixing parts 124 when the anti-shake camera module 100 is dropped, which can avoid the problem of poor drop of the driver 12 and make the anti-shake camera module 100 fall. The imaging quality of the camera module 100 is relatively stable.

Referring to FIG. 5, an embodiment of the present application further provides an electronic device 1000, including a main body 300 and the anti-shake camera module 100 in the first embodiment or the anti-shake camera module 200 in the second embodiment. The anti-shake camera module 100 in the example or the anti-shake camera module 200 in the second embodiment is disposed on the main body 300 .

Electronic device 1000 includes, but is not limited to, smart phones, tablet computers, notebook computers, e-book readers, portable multimedia players (PMPs), portable phones, video phones, digital still cameras, mobile medical devices, wearable devices and other electronic devices that support imaging.

The above electronic device 1000 includes an anti-shake camera module 100. The anti-shake photosensitive assembly 10 in the anti-shake camera module 100 moves the photosensitive element 13 through the driving part 122 of the driver 12 to compensate for the shift of the photosensitive element 13 due to shaking. , and then realize the anti-shake function of the anti-shake camera module 100; and, since the part of the fixed portion 124 of the driver 12 is located in the accommodating slot 141, the substrate 14 of the anti-shake camera module 100 can effectively protect the fixed portion 124 when it falls. , the problem of poor drop of the driver 12 can be avoided, so that the image quality of the anti-shake camera module 100 is relatively stable.

The above embodiments are only used to illustrate the technical solutions of the present application and not to limit them. Although the present application has been described in detail with reference to the above preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present application can be modified or equivalently replaced. Neither should depart from the spirit and scope of the technical solutions of the present application. Those skilled in the art can also make other changes within the spirit of the present application, etc. to be used in the design of the present application, as long as they do not deviate from the technical effects of the present application. These changes made in accordance with the spirit of the present application should all be included within the scope of protection claimed in the present application.

Claims

An anti-shake photosensitive assembly, characterized in that it includes:

a circuit board, the circuit board includes a configuration surface;

a driver, which is arranged on the configuration surface of the circuit board, the driver includes a driving part and a fixing part that are electrically connected, and the fixing part is arranged on one side of the driving part;

a photosensitive element, disposed on the side of the driving portion of the driver away from the circuit board, and electrically connected to the driving portion; and

a base plate, disposed on the configuration surface of the circuit board and electrically connected to the circuit board, the base plate is located on the side of the fixing part away from the driving part, and the base plate is close to the side of the fixing part An accommodating groove is opened on one side, and at least part of the fixing portion is located in the accommodating groove and is electrically connected to the substrate.
The anti-shake photosensitive assembly of claim 1, wherein the substrate has a first connection surface and an inner side surface, the first connection surface is disposed close to the circuit board and is fixedly connected to the configuration surface, so A portion of the inner side surface extends toward the optical axis to form a protruding portion, the side of the protruding portion close to the circuit board has a second connecting surface, and the accommodating groove is formed by the second connecting surface, the inner side surface and the configuration surface is surrounded and formed, the substrate further has a conductive portion, one end of the conductive portion is electrically connected to the circuit board, and the other end of the conductive portion is electrically connected to the fixing portion.
The anti-shake photosensitive assembly of claim 2, wherein the conductive portion is disposed in the substrate;

Or, the conductive part is provided on the surface of the substrate;

Alternatively, a part of the conductive part is provided in the substrate, and the other part is provided on the surface of the substrate.
The anti-shake photosensitive assembly according to claim 2, wherein a side of the fixing portion facing away from the arrangement surface of the circuit board is electrically connected to the conductive portion through a solder joint.
The anti-shake photosensitive assembly according to claim 1, wherein a filling space is formed between the accommodating groove and the fixing portion of the driver, and the anti-shake photosensitive assembly further comprises:

The filling body is filled in the filling space.
The anti-shake photosensitive assembly of claim 1, further comprising:

The buffer is arranged between the configuration surface of the circuit board and the driver.
The anti-shake photosensitive assembly according to claim 6, wherein a gap exists between an end of the buffer member close to the inner side surface of the substrate and the inner side surface.
The anti-shake photosensitive assembly according to claim 6 or 7, wherein a receiving groove is formed on the disposition surface, and the buffer member is arranged in the receiving groove.
The anti-shake photosensitive assembly of claim 1, further comprising:

A first bonding wire, one end of the first bonding wire is connected with the driving part of the driver, and the other end is connected with the fixing part of the driver.
The anti-shake photosensitive assembly of claim 1, further comprising:

The second bonding wire, one end of the second bonding wire is connected with the photosensitive element, and the other end is connected with the driving part of the driver.
The anti-shake photosensitive assembly according to claim 1, wherein the driving part and the fixing part together form a micro-electromechanical system.
An anti-shake camera module, comprising:

The anti-shake photosensitive assembly according to any one of claims 1-11; and

The optical lens is arranged on the photosensitive path of the anti-shake photosensitive component.
An electronic device, comprising:

ontology; and

The anti-shake camera module according to claim 12, wherein the anti-shake camera module is arranged on the body.