WO2022124783A1 - 안테나용 rf 모듈 및 이를 포함하는 안테나 장치 - Google Patents
안테나용 rf 모듈 및 이를 포함하는 안테나 장치 Download PDFInfo
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- WO2022124783A1 WO2022124783A1 PCT/KR2021/018509 KR2021018509W WO2022124783A1 WO 2022124783 A1 WO2022124783 A1 WO 2022124783A1 KR 2021018509 W KR2021018509 W KR 2021018509W WO 2022124783 A1 WO2022124783 A1 WO 2022124783A1
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- Prior art keywords
- filter
- module
- antenna
- main board
- amplifying unit
- Prior art date
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0006—Particular feeding systems
- H01Q21/0025—Modular arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/201—Filters for transverse electromagnetic waves
- H01P1/205—Comb or interdigital filters; Cascaded coaxial cavities
- H01P1/2053—Comb or interdigital filters; Cascaded coaxial cavities the coaxial cavity resonators being disposed parall to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/02—Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/42—Housings not intimately mechanically associated with radiating elements, e.g. radome
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
- H01Q15/14—Reflecting surfaces; Equivalent structures
- H01Q15/141—Apparatus or processes specially adapted for manufacturing reflecting surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/061—Two dimensional planar arrays
- H01Q21/065—Patch antenna array
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/08—Arrays of individually energised antenna units similarly polarised and spaced apart the units being spaced along or adjacent to a rectilinear path
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/24—Combinations of antenna units polarised in different directions for transmitting or receiving circularly and elliptically polarised waves or waves linearly polarised in any direction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
- H03F1/30—Modifications of amplifiers to reduce influence of variations of temperature or supply voltage or other physical parameters
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/189—High frequency amplifiers, e.g. radio frequency amplifiers
- H03F3/19—High frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/189—High frequency amplifiers, e.g. radio frequency amplifiers
- H03F3/19—High frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only
- H03F3/195—High frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only in integrated circuits
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/20—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers
- H03F3/24—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers of transmitter output stages
- H03F3/245—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers of transmitter output stages with semiconductor devices only
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/246—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for base stations
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- H—ELECTRICITY
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- H03F2200/447—Indexing scheme relating to amplifiers the amplifier being protected to temperature influence
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- H—ELECTRICITY
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- H03F2200/00—Indexing scheme relating to amplifiers
- H03F2200/451—Indexing scheme relating to amplifiers the amplifier being a radio frequency amplifier
Definitions
- the present invention relates to an RF module for an antenna and an antenna device including the same (RF MODULE AND ANTENNA APPARATUS INCLUDING THE SAME). In addition to disposing, it relates to an RF module for an antenna capable of resolving difficulties in designing heat dissipation toward the front side provided with a conventional radiating element, and an antenna device including the same.
- a base station antenna including a repeater used in a mobile communication system has various shapes and structures, and has a structure in which a plurality of radiating elements are appropriately disposed on at least one reflecting plate that is usually erected in the longitudinal direction.
- the radiating element made of a dielectric substrate made of plastic or ceramic is usually plated and bonded to a PCB (printed circuit board) through soldering. The method is widely used.
- FIG. 1 is an exploded perspective view showing an example of an antenna device according to the prior art.
- a plurality of radiating elements 35 are output in a desired direction to facilitate beam forming to the front side of the antenna housing body 10 in the beam output direction.
- a radome (radome, 50) is mounted on the front end of the antenna housing body (10) with a plurality of radiating elements (35) interposed therebetween.
- the antenna device 1 is provided in the shape of a thin rectangular parallelepiped body with an open front surface, and a plurality of heat dissipation fins 11 are integrally formed on the rear surface of the antenna housing body 10 and the antenna housing.
- the main board 20 is stacked on the rear of the body 10 and the antenna board 30 is stacked on the front of the antenna housing body 10 .
- a patch-type radiating element or a dipole-type radiating element 35 is mounted, and on the front surface of the antenna housing body 10, the radiating elements ( A radome 50 may be installed so that radiation from the 35) is made smoothly.
- the front part of the antenna housing body 10 is provided to be completely shielded by a single radome 50, so that the radome 50 prevents heat dissipation of the antenna device. become a detrimental factor.
- the radome 50 is removed and the radiating elements 35 are exposed to the outside, the antenna board 30 is inevitably exposed to the outside, so that the protection from the external environment is inevitably insufficient.
- the antenna board 30 is also made of FR-4 material, which is a general PCB material with low thermal conductivity, and is substantially heated in a space where the main board is installed (not shown) in front of the installation space (not shown) like the radome 50 .
- FR-4 material which is a general PCB material with low thermal conductivity
- the present invention has been devised to solve the above technical problem, and by disposing the antenna RF module in the front so that it is exposed to the outside air, it enables distributed heat dissipation to the front and rear of the system, thereby greatly improving the heat dissipation performance. and an antenna device including the same.
- the present invention provides an RF module for an antenna including a plurality of reflector grill pins that perform a ground function of radiating elements and simultaneously perform a reflector function for blocking signal interference with rear electric elements, and an antenna including the same Another purpose is to provide a device.
- the present invention provides an antenna including a plurality of RF modules that are easily module-assembled in a front housing that divides the installation space of the main board and the front outdoor air space by modularly manufacturing a unit RF filter, a unit radiating element module, and a unit radome cover It is another object to provide an RF module and an antenna device including the same.
- the present invention provides an antenna capable of simplifying the design of front and rear components of the main board by providing the amplification unit elements and the surge board mounted on the conventional main board to be completely separated from the installation space where the main board is installed or to be spaced apart from the main board. It is another object to provide an RF module for and an antenna device including the same.
- One embodiment of the RF module for an antenna according to the present invention is disposed between the RF filter arranged on the front side of the main board, the radiating element module arranged on the front side of the RF filter, and the main board and the RF filter, one side in the width direction Or an amplifier body having an open substrate seating space on the other side, which is seated inside the amplifier body, the front end of the edge is signal-connected to the RF filter, and the rear end of the edge is signal-connected to the main board, on one side and the other side and an amplification element module including an amplifying unit substrate on which at least one analog amplifying element is mounted and an amplifying unit cover provided to cover the amplifying unit substrate, wherein the heat generated from the analog amplifying elements of the amplifying unit substrate is One side and the other side of the amplifying device module in the width direction through a plurality of amplification unit heat sink fins integrally formed on the outer surface of the amplification unit body and a plurality of amplification unit cover heat sink fins integral
- any one of PAs implementing 2T2R as the analog amplifying device is mounted and disposed, and on the other side of both surfaces of the amplifying unit substrate, PA implementing 2T2R as the analog amplifying device Another one of them may be mounted.
- the RF filter includes a filter body in which a plurality of cavities are opened to the front and a resonance bar respectively disposed inside the cavities, and the reflector grill pins are upper, lower and left along the front edge of the filter body. and extending in the right direction, may be disposed and formed to have a predetermined separation distance from each other.
- the reflector grill pin may perform a reflector function together with the filter outer panel disposed to shield the front surface of the filter body.
- the reflector grill pin may be set in consideration of the length of the radiating element included in the radiating element module.
- the RF filter and the reflector grill pin may be integrally manufactured by a die-casting mold method using a metal molding material.
- some of the reflector grill fins may be formed to extend to overlap with the reflector grill fins formed in an adjacent RF filter.
- the RF filter includes a filter body in which a plurality of cavities are opened to the front, a resonance bar respectively disposed inside the cavities, and a filter outer panel disposed to shield the front surface of the filter body, and the radiating element module Silver may be seated and coupled to the inside of the filter body so as to cover the front surface of the filter outer panel.
- a plurality of hook coupling portions are formed on the edge portion of the radome cover, and the radome cover may be hook-coupled by an operation in which the hook coupling portion is coupled to the step portion of the filter body.
- the radome cover may be coupled to the filter body while hiding the radiating element module from the outside.
- the amplifying device module may receive a signal from the main board and a signal from the RF filter, respectively, and amplify the signal by a predetermined value and output the amplified signal.
- the amplifier board may be coupled to the RF filter through a feed-through pin via a through-pin terminal, and may be coupled to the main board by a socket pin.
- At least one socket-pin-coupled socket pin to the main board may be provided on the amplifier board.
- the RF filter and the radiating element module may be coupled through a feed through pin through a through pin terminal.
- An antenna device includes a main board on which at least one digital element is mounted on a front or rear surface, a rear housing having an enclosure formed so that the front of an installation space in which the main board is installed is opened, and the rear housing.
- the open front comprising a front housing disposed to partition an installation space and an external space of the rear housing, and a plurality of RF modules disposed in front of the front housing and connected to the main board through electrical signal lines And, each of the plurality of RF modules, an RF filter arranged on the front surface of the main board, a radiating element module arranged on the front surface of the RF filter and disposed between the main board and the RF filter, one side or the other side in the width direction Amplifying unit body having an open substrate seating space, seated inside the amplifying unit body, the front end of the frame is signal-connected to the RF filter, the rear end of the frame is signal-connected to the main board, and at least one on one side and the other side and an amplifying unit module including an amplifying unit substrate on which an analog amplifying element is mounted and an amplifying unit cover provided to cover the amplifying unit substrate, wherein heat generated from the analog amplifying elements of the amplifying unit substrate is generated by the amplifying unit
- any one of PAs implementing 2T2R as the analog amplifying device is mounted and disposed, and on the other side of both surfaces of the amplifying unit substrate, PA implementing 2T2R as the analog amplifying device Another one of them may be mounted.
- the main board disposed to be spaced apart from the rear of the main board in the installation space of the rear housing, and arranged to have the same front surface as the main board in the installation space of the surge substrate portion and the rear housing closely disposed on the front surface of the rear housing
- it may further include a PSU board portion disposed on the upper side of the main board, wherein the surge substrate portion and the PSU board portion and the PSU board portion and the main board may be electrically connected to each other via at least one bus bar.
- a plurality of heat dissipation fins may be integrally formed on the front surface of the front housing.
- At least one female socket portion for coupling the RF filter and the socket pin to the front surface of the main board may be formed.
- the rear housing in the installation space of the rear housing, it is spaced apart from the front of the main board and further includes an RFIC board portion disposed in close contact with the rear surface of the front housing, wherein the RFIC board portion includes an FPGA device mounted on the main board.
- RFIC devices corresponding to may be mounted and disposed.
- heat generated from the RFIC elements may be in thermal contact with the front housing to conduct heat and dissipate heat.
- the front ends of the plurality of RF modules are positioned to be further spaced apart forward from the rim of the front housing, are coupled to the rim of the front housing, and surround the side portions of the plurality of RF modules disposed at the outermost side. It may further include at least one ventilation panel provided.
- a plurality of ventilation holes of a predetermined size may be formed in the ventilation panel.
- the following various effects can be achieved.
- the RF-related amplification elements which have been intensively mounted on the main board in the prior art, are changed to an RF module together with an RF filter, and the outside air space is placed outside the front, thereby greatly improving the overall heat dissipation performance of the antenna device.
- the number of layers of the main board which is a multi-layer board, is greatly reduced, thereby reducing the manufacturing cost of the main board.
- the individual RF-related parts constituting the antenna device are defective or When damage occurs, only the corresponding RF module can be replaced, so maintenance and repair of the antenna device are easy.
- the length and volume of the heat sink (heat dissipation fin) integrally formed in the rear housing can be reduced, so that the overall slim design of the product is easy.
- FIG. 1 is an exploded perspective view showing an example of an antenna device according to the prior art
- FIG. 2 is a perspective view showing an antenna device according to an embodiment of the present invention.
- Figure 3 is an exploded perspective view of Figure 2
- Figure 4 is an exploded perspective view for explaining the attachment and detachment of the RF module assembly to the front housing
- FIG. 5 is an exploded perspective view showing a state in which the front housing and the rear housing are separated;
- FIG. 6 is an exploded perspective view showing the assembly of the front housing with respect to the rear housing
- FIG. 7 is a perspective view showing a state in which the ventilation panel is removed among the configuration of FIG. 2;
- 8A and 8B are exploded perspective views showing the assembly relationship of various boards with respect to the rear housing
- Figure 9 is an exploded perspective view showing a coupling state of the surge board portion of the configuration of Figure 2,
- FIG. 10 is an exploded perspective view showing a coupling position of the RFIC board part in the configuration of FIG. 2;
- FIG. 11 is an exploded perspective view showing a state in which the RFIC board of FIG. 10 is coupled to the rear surface of the front housing;
- FIG. 12 is an exploded perspective view showing an installation state of the front housing of the RF module in the configuration of FIG. 2;
- FIG. 13 is an enlarged perspective view showing the front portion of the front housing from which the RF module is detachable and the rear portion of the RF module;
- FIG. 15 is a perspective view showing a unit RF module in the configuration of FIG. 2;
- FIG. 16 is an exploded perspective view of FIG. 15;
- 17A to 17D are exploded perspective views illustrating the installation of a radiating element module, an RF filter, and an amplifying element module in the configuration of the RF module;
- FIG. 18 is an exploded perspective view showing the installation of the radome among the configuration of the RF module
- 19A and 19B are exploded perspective views illustrating an installation state of an amplifying device module among the configuration of the RF module;
- 20 is a perspective view showing another embodiment of an amplifying device module among the configuration of the RF module;
- FIG. 21 is an exploded perspective view showing the installation of the radiating element module, the RF filter, and the amplifying element module in the configuration of FIG. 20;
- 22A and 22B are exploded perspective views illustrating an installation state of an amplifying device module in the configuration of FIG. 20;
- 24 is an exploded perspective view showing the installation of the radiation director on the radome among the configuration of the radiation element module;
- 25 is a perspective view and a partially enlarged view showing the shape and arrangement of the reflector grill pin among the configuration of the RF module of FIG. 2;
- 26 is a partially enlarged perspective view showing the arrangement relationship of the reflector grill pins
- 27A and 27B are cross-sectional views and partially enlarged views taken along lines A-A and B-B of FIG. 15 .
- antenna device 110 rear housing
- socket penetration 144 foreign matter ingress prevention ring
- module assembly screw 147 face-to-face
- separation supporter 160 thermal separator
- intermediate socket 170 main board
- bus bar 185' bus bar fastening screw
- busbar fastening screw 200 RF module
- radiating element module 211 printed circuit board for radiating element
- antenna patch circuit unit 213 feed line
- radiating director 217a a plurality of coupling holes
- RF filter 221 filter body
- filter tuning cover 228 filter outer panel
- amplification unit body 232 amplification unit heat sink fin
- 235 amplification unit substrate 235a: socket unit
- amplification unit cover 238 joint flange
- screw boss 240 radome cover
- hook coupling portion 247a a plurality of coupling projections
- module assembly screw 300 antenna RF module assembly
- a single radome of a conventional antenna device is provided as a unit radome coupled to each RF module, and RF-related components mounted on the main board inside the antenna housing are configured as an RF module together with an RF filter or separated from the main board.
- FIG. 2 is a perspective view showing an antenna device according to an embodiment of the present invention
- Figure 3 is an exploded perspective view of Figure 2
- Figure 4 is an exploded perspective view for explaining the attachment and detachment of the RF module assembly to the front housing
- Figure 5 is an exploded perspective view showing a state in which the front housing and the rear housing are separated
- FIG. 6 is an exploded perspective view showing the assembly of the front housing with respect to the rear housing
- FIG. 7 is a state in which the ventilation panel is removed during the configuration of FIG. 8A and 8B are exploded perspective views showing the assembly relationship of various boards with respect to the rear housing
- FIG. 9 is an exploded perspective view showing the coupling state of the surge board part in the configuration of FIG. It is an exploded perspective view showing a coupling position of the RFIC board part in the configuration
- FIG. 11 is an exploded perspective view showing a state in which the RFIC board part of FIG. 10 is coupled to the rear surface of the front housing.
- the antenna device 100 according to an embodiment of the present invention, as shown in FIGS. 2 to 7 , a rear housing 110 forming a rear exterior of the antenna device 100 and a part of a front exterior of the antenna device and a front housing 140 forming a
- the antenna device 100 includes the main board 170 installed in close contact with the installation space 115 of the rear housing 110 , the PSU board unit 180 disposed on the upper side of the main board 170 , and the main board
- the surge substrate unit 190 disposed more rearward than 170
- the RFIC substrate unit 150 disposed in close contact with the rear surface of the front housing 140
- 'RF module' radio frequency module
- the rear housing 110 and the front housing 140 are combined with the RF module 200 to form the exterior of the entire antenna device 1 , and, although not shown, provided for installation of the antenna device 100 . It may play a role in mediating binding to poles. However, unless the installation space of the antenna device 100 is limited, the combination of the rear housing 110 and the front housing 140 does not necessarily have to be coupled to the holding pole, and is not necessarily attached to a vertical structure such as an inner wall or an outer wall of a building. It can also be directly installed and fixed as a wall-mounted type.
- the antenna device 100 has a great meaning in that it is designed to have a slim front and rear thickness to a minimum, so that it is easier to install a wall-mounted type. This will be described in more detail later.
- the rear housing 110 and the front housing 140 are provided with a metal material with excellent thermal conductivity so that heat dissipation according to thermal conduction is advantageous as a whole, and are formed in a rectangular parallelepiped housing shape with a thin thickness in the front and rear directions, in particular, the rear housing (
- the main board 170 on which the digital element (eg, Field Programmable Gate Array (FPGA) element 173) is mounted and the PSU (Power Supply Unit) serves to mediate the installation of the PSU board unit 180 on which the elements are mounted and the surge board unit 190 on which the surge component elements are mounted.
- the digital element eg, Field Programmable Gate Array (FPGA) element 173
- PSU Power Supply Unit
- the inner surface of the rear housing 110 is mounted on the rear surface of the digital element (FPGA element 173, etc.) and/or the PSU board unit 180 mounted on the rear surface of the main board 170 .
- the PSU device 183 and the like, and the surge component devices mounted on the rear surface of the surge substrate unit 190 may be formed in a shape to match the protruding shape of the outer shape. This is to maximize heat dissipation performance by maximally increasing the thermal contact area with the rear surfaces of the main board 170 , the PSU board unit 180 , and the surge substrate unit 190 .
- a worker transports the antenna device 100 according to an embodiment of the present invention in the field or grips it for easy manual mounting on a holding pole (not shown) or an inner or outer wall of a building A handle unit 130 that can do this may be further installed.
- various external mounting members 400 for cable connection with a base station device (not shown) and coordination of internal components may be through-assembled.
- the outer mounting member 400 is provided in the form of at least one or more optical cable connection terminals (sockets), and a connection terminal of a coaxial cable (not shown) may be interconnected to each connection terminal.
- a plurality of rear heat dissipation fins 111 may be integrally formed on the rear surface of the rear housing 110 to have a predetermined pattern shape.
- the heat generated from each heating element of the main board 170 , the PSU board 180 and the surge substrate unit 190 installed in the installation space 115 of the rear housing 110 is a plurality of rear heat dissipation fins 111 . It can be directly dissipated to the rear through
- the plurality of rear heat dissipation fins 111 are disposed to be inclined upward toward the left and right ends based on the central portion of the left and right widths, as shown in FIG.
- the heat may be designed to form an updraft in which heat is dispersed in the left and right directions of the rear housing 110 , respectively, so that heat is dispersed more quickly.
- the shape of the rear heat dissipation fin 111 is not necessarily limited thereto.
- blower fan module (not shown) is further provided on the rear side of the rear housing 110 to facilitate the flow of outside air, heat radiated by the blower fan module is more rapidly It may be adopted that the rear heat dissipation fins 111 are formed parallel to the left end and the right end in the blowing fan module disposed in the middle, respectively.
- a mounting portion (not shown) to which a clamping device (not shown) for coupling the antenna device 1 to a holding pole (not shown) is coupled to a part of the plurality of rear heat dissipation fins 111 is integrally can be formed with
- the clamping device by rotating the antenna device 100 according to an embodiment of the present invention installed at the tip portion of the antenna device 100 in the left and right direction or tilting in the vertical direction to adjust the directionality of the antenna device 100 It can be configuration.
- a clamping device for tilting and rotating the antenna device 100 is not necessarily coupled to the mounting portion.
- a clamp panel in the shape of a clasp plate that is easily coupled to the wall-mounted type may be coupled to the mounting portion.
- an embodiment of the antenna device 1 is, as shown in FIGS. 1 to 7 , arranged to be spaced apart from the rear of the main board 170 in the installation space 115 of the rear housing 110 , the rear
- the surge substrate unit 190 disposed in close contact with the front of the housing 110 and the installation space 115 of the rear housing 110 are arranged to have a front surface that matches the front surface of the main board 170 , the main board 170 . It may further include a PSU board unit 180 disposed on the upper side of the.
- the surge substrate unit 190 the front end is supported on the back surface of the main board 170, the rear end is the main board 170 by a plurality of spaced supporters 197 supported on the front surface of the surge substrate unit 190) It may be disposed to be spaced apart from the rear a predetermined distance.
- the surge substrate unit 190, the PSU board unit 180, and the main board 170 and the PSU board unit 180 are electrically connected to each other via at least one bus bar 195 and 185, respectively. can be interconnected.
- the surge board unit 190 is disposed on the lower side of the installation space 115 of the rear housing 110 with the main board 170 interposed therebetween, and on the contrary, the PSU board unit 180 is the main A bar disposed on a relatively upper side of the installation space 115 of the rear housing 110 with the board 170 interposed therebetween may be electrically connected to each other via a long-type bus bar 195 .
- the long-type bus bar 195 may be stably fastened to an end and an intermediate portion thereof by a plurality of bus bar fastening screws 195 ′, respectively.
- the PSU board unit 180 is disposed in a form in direct contact with the upper end of the main board 170 , and may be electrically connected to each other via the short-type bus bar 185 .
- Each of the short-type bus bars 185 may be stably fastened and fixed at an end thereof by a plurality of bus bar fastening screws 185 ′.
- an embodiment of the antenna device 1 is, as shown in FIGS. 10 and 11 , arranged to be spaced apart from the front of the main board 170 in the installation space 115 of the rear housing 110 , the front It may further include an RFIC substrate unit 150 disposed in close contact with the rear surface of the housing 140 .
- RFIC elements (not shown) corresponding to the FPGA element 173 mounted on the main board 170 may be mounted on the RFIC board unit 150 .
- the RFIC substrate unit 150 separates the RFIC elements mounted together with the FPGA elements 173 on the front or rear surface of the existing main board 170 from the main board 170, but is substantially a core component of front heat dissipation. It may be disposed to be in thermal contact with the rear surface of the front housing 140 .
- the RFIC substrate unit 150 is, as shown in FIG. 10 , a front end supported on the rear surface of the front housing 140 , and a rear end supported on the front surface of the main board 170 , a plurality of spaced apart supporters 157 . Accordingly, it may be disposed to be spaced apart from the main board 170 by a predetermined distance forward. In this way, by disposing the RFIC substrate unit 150 forwardly spaced apart from the main board 170 , thermal separation between the RFIC substrate unit 150 and the main board 170 may be achieved.
- the RFIC substrate 150 At the rear of the RFIC substrate 150 , as shown in FIG. 11 , it can be electrically connected to the main board 170 through a thermal separation plate 160 provided for physical and thermal separation from the main board 170 . have.
- a plurality of intermediate female socket portions 155 are formed to be the final female socket portion 171 formed on the front surface of the main board 170 on the rear surface of the RFIC substrate portion 150 and the intermediate socket pin portion for coupling the socket pins. 161 may be formed.
- the intermediate socket part 161 is formed on the rear surface of the RFIC board part 150
- the thermal separator 160 is formed to enable socket pin coupling with the final female socket part 171 of the main board 170 . It may pass through and be exposed to the rear side of the thermal separation plate 160 .
- the intermediate female socket unit 150 formed in the RFIC substrate unit 150 may pass through the socket penetration unit 143 (refer to FIG. 12 to be described later) formed in the front housing 140 and be exposed to the front side. In this way, the socket pin coupling of the socket pin 235a of the amplifier board 235 to the intermediate female socket part 155 exposed forward.
- the thermal separator 160 prevents the heat generated from the RFIC substrate 150 from moving toward the installation space 115 of the rear housing 110, which is a relatively rear space, and directly moves forward through the front housing 140. It is preferable to be provided with a heat-insulating material to induce heat dissipation.
- the front housing 140 is installed and seated in the installation space 115 of the rear housing 110 between the main board 170 , the PSU board 180 , the surge substrate unit 190 and the RF module 200 in the front. plays a role in partitioning In addition, the front housing 140 is partitioned so that the installation space 115 on the rear housing 110 side and the other spaces are divided, so that the heat generated in the installation space 115 on the rear housing 110 side is RF It is possible to perform thermal blocking and separation functions so as not to affect the module 200 side.
- 'thermal blocking' means that heat generated from the RF module 200 located on the front outdoor air (or front space) defined as the front front of the front housing 140 is transferred to the rear space of the front housing 140 ( That is, it is preferable to understand that it blocks the intrusion of heat into the installation space 115 side of the rear housing 110 , and the meaning of 'thermal separation' is initially stacked in the installation space 115 of the rear housing 110 . It is preferable to understand that the thermal configuration is separated and arranged so that not only the rear heat but also the front heat is dissipated by separating some of the plurality of heat generating elements intensively distributed and mounted on the front and rear surfaces of the main board 170 .
- a plurality of heat dissipation fins 141 may be integrally formed on the front surface of the front housing 140 .
- the front housing 140 and the plurality of heat dissipation fins 141 are made of a metal material having excellent thermal conductivity, and heat or RFIC elements in the installation space 115 of the rear housing 110 via the front housing 140 as a medium. Heat generated from the fields can be easily dissipated forward in a heat conduction manner.
- an embodiment of the antenna device 100 according to the present invention may further include at least one ventilation panel (120, 120a ⁇ 120d), as shown in FIG.
- the plurality of RF modules 200 front ends are positioned to be further spaced apart from the front edge of the front housing 140, at least one ventilation panel (120, 120a ⁇ 120d) is coupled to the edge portion of the front housing 140,
- the plurality of RF modules 200 disposed on the outermost side may be coupled in a manner that surrounds the sides.
- each of the first ventilation panel 120a and the second ventilation panel 120b is coupled to the front surface of the front housing 140 .
- a plurality of RF modules 200 coupled to the front of the front housing 140 may be coupled to shield the left and right portions of the RF module 200 positioned on the left and right portions.
- At least one ventilation panel (120, 120a ⁇ 120d) is formed as a whole with a vent hole of a predetermined size, the outside air of the external space flows into the front side of the front housing 140 through the vent hole, or of the front housing 140 Since the heat radiated forward can be smoothly discharged to the outside space, it is possible to increase the ventilation. When the ventilation of the outside air is increased, the heat dissipation performance toward the front side of the front housing 140 may be greatly improved.
- the RF module 200 is exposed to the front outside air defined as the front front of the front housing 140 , and at least one ventilation panel 120 is exposed to the front outside air. ), by being arranged to shield at least the side, it can serve to block external access of external foreign substances as well as unauthorized users who do not have access rights.
- a plurality of fastening screws 125 are sequentially formed at the rear end of at least one ventilation panel 120 of the plurality of ventilation panel fastening grooves 120 ′ and the front housing 140 .
- At least one ventilation panel 120 may be coupled to the edge portion of the front housing 140 by an operation of being fastened to the ventilation panel fastening hole 140 ′ formed to be spaced apart along the edge end.
- At least one ventilation panel 120, the reflector grill pin 224 and the front housing 140 integrally formed in the RF filter 220 of the configuration of the RF module 200 to be described later, as shown in FIG. 7 . ) is provided to be spaced apart, the front end portion may be electrically coupled to the reflector grill pin 224 so that the ground (GND) role, which is a part of the function of the reflector grill pin 224, can be smoothly performed.
- GND ground
- FIG. 12 is an exploded perspective view showing an installation state of the front housing of the RF module in the configuration of FIG. 2, and FIG. 13 is an enlarged perspective view showing the front side of the front housing to which the RF module is detachable and the rear part of the RF module,
- FIG. 15 is a perspective view showing a unit RF module in the configuration of FIG. 2
- FIG. 16 is an exploded perspective view of FIG. 15, and
- FIGS. 17a to 17d are RF modules
- FIG. 18 is an exploded perspective view showing the installation of the radome during the configuration of the RF module
- FIGS. 19a and 19b are during the configuration of the RF module It is an exploded perspective view showing the installation of the amplifier module.
- an embodiment of the RF module 200 for an antenna according to the present invention includes an RF filter 220 arranged on the front surface of the main board 170 and the RF filter 220 on the front surface.
- the radiating element module 210 which is disposed between the RF filter 220 and the radiating element module 210 to ground the radiating element module 210 (GND), and from the front to the rear of the RF filter 220 It includes at least one reflector grill pin 224 for introducing the outside air into the or outflowing the outside air from the rear to the front of the RF filter.
- the RF module 200 is a collection of analog RF components, for example, the amplifier module 230 is an RF component including an amplifier board 235 on which an analog amplifier for amplifying an RF signal is mounted, and an RF filter ( 220 is an RF component for frequency filtering the input RF signal into a desired frequency band, and the radiating element module 210 is an RF component serving to receive and transmit the RF signal.
- the amplifier module 230 is an RF component including an amplifier board 235 on which an analog amplifier for amplifying an RF signal is mounted, and an RF filter ( 220 is an RF component for frequency filtering the input RF signal into a desired frequency band
- the radiating element module 210 is an RF component serving to receive and transmit the RF signal.
- the RF module 200 for an antenna according to the present invention may be defined as another embodiment as follows.
- the RF module 200 for an antenna is an antenna RF module 200 including an analog RF component, and the analog RF component is disposed in front of the RF filter 220 and the RF filter 220 . It may be implemented in an embodiment including a radiating element module 210 and an analog amplifying element (not shown) on the amplifying element module 230 disposed behind the RF filter 220 .
- the amplifying device module 230 may be electrically connected to the main board 170 inside the rear housing 110 via an amplifying unit substrate 235 to be described later.
- the RFIC substrate unit 150 can be interposed between the amplifier unit substrate 235 and the main board 170 for such an electrical connection.
- each RF module 200 or RF module assembly 300 in a state in which a plurality of RF modules 200 are temporarily assembled in the front housing 140 in advance, or in units that can be temporarily assembled it has the advantage of establishing a new market environment as it becomes possible to manufacture and sell RF parts.
- At least one reflector grill pin 224 may be integrally molded with the RF filter 220 . That is, the RF filter 220 may be manufactured by a die-casting mold method using a molding material of a metal component. Here, in that the reflector grill pin 224 is also provided with a metal material for its function, the RF filter 220 and the reflector grill pin 224 are manufactured by using a molding material of the same metal component. It can be integrally manufactured by the same die-casting mold method as the method.
- the material of the RF filter 220 and the reflector grill pin 224 is not necessarily limited to a metal material, and is formed of a dielectric material, but it will be possible to form a film with a conductive material on the outer surface.
- an embodiment of the RF module 200 for an antenna according to the present invention is disposed between the main board 170 and the RF filter 220, and at least one analog amplification element (not shown) is mounted on the amplification.
- a device module 230 may be further included.
- socket pins may be coupled to the main board 170 via the front housing 140 for each unit module.
- a socket penetrating portion 143 is formed to penetrate in the front-rear direction, and a face-attached portion 147 is formed around the socket penetrating portion 143 .
- a ring installation groove 149 into which a foreign material inflow prevention ring 144 to be described later is inserted and interposed may be formed in the face bonding portion 147 .
- the module assembly screw 146 for installing the RF module 200 may be provided to be vertically spaced apart from the inside of the socket penetration part 143 .
- the module assembly screw 146 may be assembled through the front from the rear surface of the front housing 140 to be fastened to the rear side of the RF module 200 .
- a socket portion 235a of an amplifier substrate 235 to be described later is penetrated and exposed to the rear, and the front housing 140 )
- a bonding flange 238 may be formed to be bonded to the face-to-face contact portion 147 .
- a screw boss 239 to which the module assembly screw 146 is fastened may be formed in the joint flange 238 .
- the RF module 200 is provided to be exposed to the front outdoor air corresponding to the front of the front housing 140 , and it is necessary to prevent the inflow of foreign substances including rain or dust.
- the bonding flange 238 of the RF module 200 is in close contact with the faceted portion 147 of the front housing 140 .
- the tightening force is increased by using the module assembly screw 146 in operation, the foreign material inflow prevention ring 144 interposed in the ring installation groove 149 is connected to the joint flange 238 of the RF module 200 and the front housing 140 . It is possible to seal between the face-bonded parts of
- the amplification element module 230 receives the signal from the main board 170 and the signal from the RF filter 220, respectively, serves to amplify and output a predetermined value.
- the amplification element module 230 includes an amplifier body 231 having a substrate seating space 233 having one or the other side open in the width direction, and is seated inside the amplifier body 231, the front end of the rim is RF Signal is connected to the filter 220, and the rear end of the edge is provided with the main board 170 (in the case where the RFIC substrate 150 is provided separately from the main board 170, the RFIC substrate 150 corresponds to this) and a signal It may include an amplifying unit substrate 235 connected thereto, and an amplifying unit cover 236 provided to cover the amplifying unit substrate 235 .
- the amplification element module 230 is easily electrically connected to the RF filter 220 to be described later through a feed-through pin coupling, and the amplification unit body 231 .
- Physical coupling may be made through the module assembly screw 250 fastened through the screw assembly groove 234a of the assembly panel 234 formed in the .
- the amplifier board 235 is feed through-pin coupled with the RF filter 220 via the through pin terminal 226, and the main board 170 (more preferably, the RFIC board part ( 150)) and socket pins can be combined.
- the amplifier board 235, the main board 170 (or, in the embodiment in which the RFIC board 150 is provided separately from the main board 170, the RFIC board 150) to the socket pin coupling At least one or more socket portions 235a may be provided.
- the amplifying unit substrate 235 is closely coupled to the inner surface of the amplifying unit body 231 , and on the outer surface of the amplifying unit body 231 , heat generated from the analog amplifying elements of the amplifying unit substrate 235 is transferred to the external space.
- a plurality of amplification unit heat sink fins 232 for dissipating heat may be integrally formed.
- At least one of a PA device and an LNA device as an analog amplifying device may be mounted on the amplifier substrate 235 .
- Analog amplification elements (PA element and LNA element), which are the main heating elements, were conventionally mounted on the main board 170 provided in the installation space 115 between the rear housing 110 and the front housing 140, but
- the installation space By changing the design to be exposed to the front outside air defined as the front space of the front housing 140, which is a space for easy heat dissipation, manufactured in module units such as the amplification element module 230, the installation space It is possible to create the advantage of dissipating the thermal overload of the (115) phase as well as improving the heat dissipation performance.
- the amplifier board 235 is seated and installed so that one surface is in close contact with the inner surface of the substrate seating space 233 of the amplifier body 231, as shown in FIGS. 19A and 19B , among the analog amplifier elements.
- Two PAs 251,252, which are power amplifiers, are mounted on the other surface to configure 2T2R.
- Heat generated from the two PAs 251,252 may be easily dissipated to the outside through a plurality of amplification unit heat sink fins 232 integrally formed adjacent to the inner surface of the substrate seating space 233 .
- FIG. 20 is a perspective view showing another embodiment of the amplifying device module among the configuration of the RF module
- FIG. 21 is an exploded perspective view showing the installation of the radiating device module, the RF filter, and the amplifying device module in the configuration of FIG. 20
- FIGS. 22a and 22B is an exploded perspective view illustrating an installation state of the amplifying device module in the configuration of FIG. 20 .
- the amplifying unit substrate 235 is disposed in the substrate seating space 233 of one (or the other) side of the amplifying unit body 231 in the width direction. ) is seated, and analog amplification elements (PA elements and LNA elements) are mounted only on the opposite surface (the other surface) opposite to the open one side of the amplifier body 231 among both surfaces of the amplifier board 235 , heat dissipation function It is designed in a structure that radiates heat generated from analog amplification elements through a plurality of amplification unit heat sink fins 232 integrally formed in the amplification unit body 231 to perform
- the two PAs 251,252 do not necessarily have to be concentrated on the other surface of the amplifier board 235, and as shown in FIGS. can be placed. That is, as shown in FIG. 22A , one of the PAs 251,252 implementing 2T2R in one RF module 200a is applied to the other surface of the amplifying unit substrate 235 (that is, the amplifying unit cover 236a to be described later). ) can be mounted and arranged to implement 1T1R on the side opposite to the side). In addition, as shown in FIG. 22B , the other one 252 of the PAs 251,252 implementing 2T2R in one RF module 200a is applied to one surface of the amplifier substrate 235 (that is, the substrate seating space 233). It can be mounted and arranged to implement 1T1R on the side opposite to the inner surface of the Therefore, each side of the amplifier board 235 implements 1T1R and implements 2T2R in one RF module 200a.
- a plurality of amplification unit heat sink fins 232 integrally formed on the side surface and a plurality of amplification unit cover heat sink fins 236b corresponding to each other may be integrally formed.
- two PAs 251,252 implementing 2T2R in one RF module 200a are provided on both sides of the amplifying unit substrate 235 1T1R, respectively.
- the heat dissipation performance can be further maximized.
- the RF filter 220 as shown in FIG. 16, a filter body 221 in which a plurality of cavities 222 are opened to the front, and a resonance bar 223 disposed inside the cavities 222, respectively. and a filter outer panel 228 disposed to shield the front surface of the filter body 221 .
- a filter tuning cover 227 may be coupled between the filter outer panel 228 and the filter body 221 .
- the radiating element module 210 may be seated and coupled to the inside of the filter body 221 so as to cover the front surface of the filter outer panel 228 .
- the RF module 200 may further include a radome cover 240 that is coupled to the front end of the RF filter 220 and protects the radiating element module 210 from the outside.
- a plurality of hook coupling parts 241 are formed on the edge of the radome cover 240 , and the radome cover 240 may be hooked by an operation in which the hook coupling part is coupled to the step portion of the filter body 221 . That is, the material of the radome cover 240 may be made of a resin material that is easy to transmit radio waves, and since the heat generated when the radiating element module 210 is driven is insignificant, even if it is provided with an insulating material irrelevant to heat dissipation Does not matter.
- the material of the radome cover 240 is formed of the same material as that of the existing single radome panel, and may be divided and combined one by one for each RF module 200 .
- the radome cover 240 is coupled to the filter body 221 while hiding the radiating element module 210 from the outside, thereby protecting the radiating element module 210 from an external environment (foreign substances, etc.).
- the radome cover 240 is installed so that the RF module 200 is exposed to the front outdoor air, which is the front space of the front housing 140 , and foreign substances such as rainwater radiating element module 210 . It is preferable to have a sealing structure that completely blocks the inflow into the provided interior.
- the RF filter 220 and the radiating element module 210 are electrically interconnected through a feed through-pin coupling method via a through-pin terminal 226, as shown in FIG. 18 . can be connected
- the RF module 200 may be stacked on the front surface of the main board 170 via the front housing 140 as shown in FIGS. 10 to 14 .
- the RF module 200 is provided in plurality to form one configuration of the RF module assembly 300 for the antenna.
- the RF module 220 as shown in FIGS. 10 and 12 , a total of 8 are arranged adjacently in the left and right direction, and a plurality of RF modules 200 such as this are arranged in a total of 4 columns in the vertical direction, respectively.
- the present invention is not necessarily limited thereto, and it will be understood that the arrangement position and the number of RF modules 200 may be variously designed and modified.
- the RF filter 220 a predetermined cavity 222 is formed on one side, and a DR (Dielectric Resonator) or a resonance bar 223 composed of a metallic resonance rod in the cavity 222.
- a DR Dielectric Resonator
- the RF filter 220 is not limited thereto, and various filters such as a dielectric filter may be employed.
- the plurality of radiating element modules 210 are coupled to correspond to the number of each of the plurality of RF filters 220 , and each of the radiating element modules 210 may implement 2T2R. Accordingly, the antenna device 100 according to an embodiment of the present invention exemplifies a model in which a total of 64T64R is implemented, but is not limited thereto. For example, if the radiating element arrangement area can be secured twice, each radiating element module 210 may be provided to implement 1T1R, and if it is assumed that heat dissipation performance can be further improved, the radiating element module 210 ), it is also possible that each is equipped to implement 4T4R.
- a plurality of radiating element modules 210 are required as an array antenna, and the plurality of radiating element modules 210 generates a narrow directional beam. This can increase the concentration of radio waves in a designated direction.
- a plurality of radiating element modules 210, a dipole-type dipole antenna or a patch-type patch antenna are utilized with the highest frequency, and are designed to be spaced apart to minimize signal interference between them. do.
- FIG. 23A and 23B are exploded perspective views of the radiating element module
- FIG. 24 is an exploded perspective view illustrating the installation of the radiating director to the radome among the radiating element modules.
- the radiating element module 210 is formed elongated vertically, as shown in FIGS. 23A and 23B , and a plurality of RF filters 220 .
- a printed circuit board 211 for a radiating element arranged on the front side, at least one antenna patch circuit unit 212 formed by pattern printing on the front surface of the printed circuit board 211 for a radiating element, and at least one antenna patch circuit unit 212 ) may include a feeding line 213 for feeding and connecting each of the feeding lines.
- the above-described antenna patch circuit unit as a double polarization patch element for generating either a double polarized wave of ⁇ 45 orthogonal polarization or vertical/horizontal polarization. 163 may be print formed.
- Three antenna patch circuit units 212 may be printed to be spaced apart from each other in the vertical direction (length direction), and each antenna patch circuit unit 212 may be interconnected by a feeding line 213 .
- an input-side feeding line and an output-side feeding line for applying or outputting a feed signal branched from the feed line 213 are formed, and the input-side feeding line is formed.
- An input-side through-hole 214a and an output-side through-hole 214b for inserting a through-pin terminal disposed at the rear of the printed circuit board 211 for a radiating element may be formed through the front end of the line and the output-side feeding line.
- a through-pin terminal 226 which is one of the components of the RF filter 220 is inserted into the input-side through-hole 214a and the output-side through-hole 214b, respectively, to conduct electricity with the feed line 213 .
- the radiation director 217 is formed of a thermally conductive or conductive metal material and is electrically connected to the antenna patch circuit unit 212 .
- the radiation director 217 may serve to guide the radiation beam in all directions.
- a total of three radiation directors 217 are disposed in each RF module 200 to secure the maximum gain.
- a plurality of coupling protrusions 247a formed on the rear surface of the radome cover 24 are fitted with a plurality of coupling holes 217a, respectively. can be formed.
- the radiation director 217 is, as shown in FIG. 24 , a plurality of coupling protrusions 247a and a plurality of coupling protrusions 247a and a plurality of coupling protrusions 247a described above on the rear surface of the radome cover 240 together with the printed circuit board 211 for the radiation device.
- the radome cover 240 can be easily assembled by an operation in which the radome cover 240 is coupled to the RF filter 220 through the hook coupling part 241.
- a reflector functions as a reflective surface while providing a ground for an antenna circuit.
- the back radiation of the dual polarization antenna is reflected in the main radiation direction, thereby improving the beam efficiency of the dual polarization antenna.
- the reflector grill pin 224 and the outer panel 228 to be described later may perform a reflector function together.
- FIG. 25 is a perspective view and a partially enlarged view showing the shape and arrangement of the reflector grill pins in the configuration of the RF module of FIG. 2, and FIG. 26 is a partially enlarged perspective view showing the arrangement relationship of the reflector grill pins.
- the reflector grill fins 224 are combined with the reflector grill fins 224 of the adjacent RF filters 220, as shown in FIGS. 25 and 26, to form a mesh shape in which a grill-shaped heat dissipation hole is formed.
- the plurality of heat dissipation holes formed by the plurality of reflector grill pins 224 are provided so that the heat radiated from the front housing 140, which is the rear side of the plurality of RF filters 220 corresponding to the relatively rear, is easily ventilated with the external space.
- it may serve as a heat discharge hole for discharging heat generated inside between the front surface of the front housing 140 and the reflector grill pin 224 to the outside. Accordingly, it is possible to actively use external air for heat dissipation of the antenna device 100 .
- each of the plurality of reflector grill pins 224-1 to 224-4 serves as a sufficient ground (GND) and at the same time maintains a predetermined ventilation performance on one side of the RF filter 220 side
- the formed reflector grill pins 224-1 and 224-3 and the reflector grill pins 224-2 and 224-4 formed on the other side of the RF filter 220 adjacent thereto do not contact each other, but overlap each other on an arbitrary vertical line (that is, , to overlap) may be formed to extend.
- an arbitrary vertical line that is, , to overlap
- the distances d1 and d2 between the reflector grill pins 224 may be appropriately designed by simulating their durability and heat dissipation characteristics, preferably considering the spacing of the radiating elements included in the radiating element module 210 . can be set.
- the distances d1 and d2 between the reflector grill pins 224 may be designed in consideration of the wavelength of the operating frequency, as will be described later. For example, in order to reduce propagation loss, the spacing d between the reflector grill pins 224 may be set to 1/20 ⁇ or less of the operating frequency.
- the interval between the reflector grill pins 224 in one RF module 200 is 1/10 ⁇ or less, and when several RF modules 200 are assembled, the reflector grill pins 224 are staggered and have a size of 1/20 ⁇ or less. hole can be formed.
- the distances d1 and d2 between the reflector grill pins 224 may be set to have a size within the range of 1/10 ⁇ to 1/20 ⁇ of the operating frequency.
- the interval 1/10 ⁇ has a meaning as an upper limit threshold for performing a sufficient ground (GND) role of the radiating element module 210
- the interval 1/20 ⁇ is a heat dissipation hole formed by a plurality of reflector grill pins 224 . It is meaningful as a lower limit threshold to secure the minimum flow of outside air through the
- the distances d1 and d2 between the reflector grill pins 224 are preferably formed to have a range greater than 1/20 ⁇ of the operating frequency and smaller than 1/10 ⁇ of the operating frequency.
- the reflector grill pin 224 is disposed to cover the front surface of the plurality of RF filters 220 together with the filter outer panel 228 described above, and may serve as a ground for the plurality of radiating element modules 210 .
- the filter outer panel 228, the filter body 221 of the RF filter 220, and the reflector grill pin 224 are all made of a metal material.
- the reflector grill pin 224 is, in terms of a ground (GND) function, a common ground between the plurality of RF filters 220 and the plurality of heat dissipation element modules 210 together with the filter outer panel 228 described above. It can be defined as a configuration that performs the function of expanding an area.
- GND ground
- the reflector grill pin 224 does not only serve as a ground of the radiating element module 210 , but also removes the RF filter 220 exposed to the front outside air defined as the front front of the front housing 130 from the outside. It can also play a protective role.
- 27A and 27B are cross-sectional views and partially enlarged views taken along lines A-A and B-B of FIG. 15 .
- a through-pin terminal 229 is provided inside the RF filter 220 and the amplification element module 230 and When connected to the through-pin connection terminal 229c that mediates the electrical connection of Throughpin bonding may be completed.
- each component of the RF module 200 is completed in a simple way by combining each feed-through pin, and at the same time, in connecting the RF module 200 itself to the front surface of the main board 170 , as described above, As a simple operation of socket pin coupling is performed, the overall assembling property can be greatly improved.
- the antenna device 100 is provided with a unit radome cover 240 separated for each RF module 200 with a single conventional radome, so that each radiating element module 210 is provided.
- each radiating element module 210 is provided.
- the present invention provides an RF module for an antenna capable of greatly improving heat dissipation performance by distributing heat to the front and rear of the system by disposing the antenna RF module in the front so as to be exposed to the outside air, and an antenna device including the same.
Abstract
Description
Claims (24)
- 메인 보드의 전면에 배열된 RF 필터;상기 RF 필터 전면에 배치되는 방사소자 모듈; 및상기 메인 보드와 상기 RF 필터 사이에 배치되되, 폭방향 일측 또는 타측이 개구된 기판 안착공간을 가지는 증폭부 바디, 상기 증폭부 바디의 내부에 안착되되, 테두리 전단부는 상기 RF 필터와 신호 연결되고, 테두리 후단부는 상기 메인 보드와 신호 연결되며, 일면 및 타면에 적어도 하나의 아날로그 증폭소자가 실장된 증폭부 기판 및 상기 증폭부 기판을 덮도록 마련된 증폭부 커버, 를 포함하는 증폭소자 모듈; 을 포함하고,상기 증폭부 기판의 상기 아날로그 증폭소자들로부터 생성된 열은 상기 증폭부 바디의 외측면에 일체로 형성된 다수의 증폭부 히트싱크핀 및 상기 증폭부 커버의 외측면에 일체로 형성된 다수의 증폭부커버 히트싱크핀을 통해 상기 증폭소자 모듈의 폭 방향 일측 및 타측의 전방 외기로 분산 방열시키는, 안테나용 RF 모듈.
- 청구항 1에 있어서,상기 증폭부 기판의 양면 중 일면에는, 상기 아날로그 증폭소자로서 2T2R을 구현하는 PA 중 어느 하나가 실장 배치되고,상기 증폭부 기판의 양면 중 타면에는, 상기 아날로그 증폭소자로서 2T2R을 구현하는 PA 중 다른 하나가 실장 배치되는, 안테나용 RF 모듈.
- 청구항 1에 있어서,상기 RF 필터 및 상기 방사소자 모듈 사이에 배치되어 상기 방사소자 모듈을 접지(GND)함과 아울러, 상기 RF 필터의 전방으로부터 후방으로 외기를 유입시키거나 상기 RF 필터의 후방으로부터 전방으로 외기를 유출시키는 적어도 하나의 리플렉터 그릴핀; 및상기 RF 필터의 전면에 결합되고, 상기 방사소자 모듈을 외부로부터 보호하는 레이돔 커버; 를 더 포함하고,상기 적어도 하나의 리플렉터 그릴핀은, 상기 RF 필터에 일체로 성형되는, 안테나용 RF 모듈.
- 청구항 1에 있어서,상기 RF 필터는, 다수의 캐비티가 전방으로 개구되게 형성된 필터 바디 및 상기 캐비티 내부에 각각 배치된 공진 바; 를 포함하고,상기 리플렉터 그릴핀은, 상기 필터 바디의 전단 테두리를 따라 상측, 하측 및 좌측 및 우측 방향으로 연장되되, 각각 소정의 이격 거리를 가지도록 배치 형성된, 안테나용 RF 모듈.
- 청구항 4에 있어서,상기 리플렉터 그릴핀은, 상기 필터 바디의 전면을 차폐하도록 배치된 필터 아우터 패널과 함께 리플렉터 기능을 수행하는, 안테나용 RF 모듈.
- 청구항 4에 있어서,상기 리플렉터 그릴핀은, 상기 방사소자 모듈에 포함된 방사소자의 길이를 고려하여 설정된, 안테나용 RF 모듈.
- 청구항 3에 있어서,상기 RF 필터 및 상기 리플렉터 그릴핀은, 금속재의 몰딩재를 이용하여 다이캐스팅 금형 공법에 의해 일체로 제조되는, 안테나용 RF 모듈.
- 청구항 3에 있어서,상기 리플렉터 그릴핀 중 일부는, 인접하는 RF 필터에 형성된 리플렉터 그릴핀과 상호 오버랩되도록 연장 형성된, 안테나용 RF 모듈.
- 청구항 1에 있어서,상기 RF 필터는,다수의 캐비티가 전방으로 개구되게 형성된 필터 바디;상기 캐비티 내부에 각각 배치된 공진 바; 및상기 필터 바디의 전면을 차폐하도록 배치된 필터 아우터 패널; 을 포함하고,상기 방사소자 모듈은, 상기 필터 아우터 패널 전면을 덮도록 상기 필터 바디의 내측에 안착 결합된, 안테나용 RF 모듈.
- 청구항 9에 있어서,상기 레이돔 커버의 테두리 부위에는 후크 결합부가 다수개 형성되고,상기 레이돔 커버는 상기 필터 바디의 단차 부위에 상기 후크 결합부가 결합되는 동작으로 후크 결합되는, 안테나용 RF 모듈.
- 청구항 10에 있어서,상기 레이돔 커버는, 상기 방사소자 모듈을 외부로부터 은닉시키면서 상기 필터 바디에 결합되는, 안테나용 RF 모듈.
- 청구항 1에 있어서,상기 증폭소자 모듈은, 상기 메인 보드로부터의 신호 및 상기 RF 필터로부터의 신호를 각각 입력받아 소정값만큼 증폭시켜서 출력하는, 안테나용 RF 모듈.
- 청구항 1에 있어서,상기 증폭부 기판은, 상기 RF 필터와는 스루핀 단자를 매개로 피드 스루핀 결합되고, 상기 메인 보드와는 소켓 핀 결합되는, 안테나용 RF 모듈.
- 청구항 13에 있어서,상기 증폭부 기판에는, 상기 메인 보드에 소켓 핀 결합되기 위한 적어도 하나 이상의 수소켓부가 구비된, 안테나용 RF 모듈.
- 청구항 1에 있어서,상기 RF 필터와 상기 방사소자 모듈은, 스루핀 단자를 매개로 피드 스루핀 결합되는, 안테나용 RF 모듈.
- 적어도 하나의 디지털 소자가 전면 또는 후면에 실장된 메인 보드;상기 메인 보드가 설치되는 설치 공간 전방이 개구되게 형성된 함체 형성의 후방 하우징;상기 후방 하우징의 개구된 전방을 차폐하되, 상기 후방 하우징의 설치 공간과 외부 공간을 구획하도록 배치된 전방 하우징; 및상기 전방 하우징의 전방에 배치되되, 상기 메인 보드와 전기적인 신호 라인을 통해 연결된 복수의 RF 모듈; 을 포함하고,상기 복수의 RF 모듈 각각은,상기 메인 보드의 전면에 배열된 RF 필터;상기 RF 필터 전면에 배치되는 방사소자 모듈; 및상기 메인 보드와 상기 RF 필터 사이에 배치되되, 폭방향 일측 또는 타측이 개구된 기판 안착공간을 가지는 증폭부 바디, 상기 증폭부 바디의 내부에 안착되되, 테두리 전단부는 상기 RF 필터와 신호 연결되고, 테두리 후단부는 상기 메인 보드와 신호 연결되며, 일면 및 타면에 적어도 하나의 아날로그 증폭소자가 실장된 증폭부 기판 및 상기 증폭부 기판을 덮도록 마련된 증폭부 커버, 를 포함하는 증폭소자 모듈; 을 포함하고,상기 증폭부 기판의 상기 아날로그 증폭소자들로부터 생성된 열은 상기 증폭부 바디의 외측면에 일체로 형성된 다수의 증폭부 히트싱크핀 및 상기 증폭부 커버의 외측면에 일체로 형성된 다수의 증폭부커버 히트싱크핀을 통해 상기 증폭소자 모듈의 폭 방향 일측 및 타측의 전방 외기로 분산 방열시키는, 안테나 장치.
- 청구항 16에 있어서,상기 증폭부 기판의 양면 중 일면에는, 상기 아날로그 증폭소자로서 2T2R을 구현하는 PA 중 어느 하나가 실장 배치되며,상기 증폭부 기판의 양면 중 타면에는, 상기 아날로그 증폭소자로서 2T2R을 구현하는 PA 중 다른 하나가 실장 배치되는, 안테나 장치.
- 청구항 16에 있어서,상기 후방 하우징의 설치 공간 중 상기 메인 보드의 후방으로 이격되게 배치되되, 상기 후방 하우징의 전면에 밀착 배치되는 서지 기판부; 및상기 후방 하우징의 설치 공간 중 상기 메인 보드와 동일한 전면을 가지도록 배치되되 상기 메인 보드의 상측에 배치된 PSU 보드부; 를 더 포함하고,상기 서지 기판부와 상기 PSU 보드부 및 상기 PSU 보드부와 상기 메인 보드는 각각 적어도 하나의 버스 바를 매개로 전기적으로 연결되는, 안테나 장치.
- 청구항 16에 있어서,상기 전방 하우징의 전면에는 다수의 방열핀이 일체로 형성된, 안테나 장치.
- 청구항 16에 있어서,상기 메인 보드의 전면에는, 상기 RF 필터와 소켓 핀 결합되기 위한 적어도 하나 이상의 암소켓부가 형성된, 안테나 장치.
- 청구항 16에 있어서,상기 후방 하우징의 설치 공간 중 상기 메인 보드의 전방으로 이격되게 배치되되, 상기 전방 하우징의 배면에 밀착 배치되는 RFIC 기판부; 를 더 포함하고,상기 RFIC 기판부에는, 상기 메인 보드에 실장된 FPGA 소자에 대응되는 RFIC 소자들이 실장 배치된, 안테나 장치.
- 청구항 21에 있어서,상기 RFIC 소자들로부터 발생된 열은 상기 전방 하우징에 표면 열접촉되어 열전도 방열되는, 안테나 장치.
- 청구항 16에 있어서,상기 복수의 RF 모듈의 전단부는 상기 전방 하우징의 테두리로부터 전방으로 더 이격되게 위치되고,상기 전방 하우징의 테두리 부위에 결합되되, 최외곽에 배치된 상기 복수의 RF 모듈의 측부를 감싸는 형태로 구비된 적어도 하나의 통기 패널; 을 더 포함하는, 안테나 장치.
- 청구항 23에 있어서,상기 통기 패널에는 소정 크기의 통기공이 다수개 형성된, 안테나 장치.
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CN202180082824.6A CN116897469A (zh) | 2020-12-08 | 2021-12-08 | 天线射频模块及包括其的天线装置 |
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JP2009159430A (ja) * | 2007-12-27 | 2009-07-16 | Mitsubishi Electric Corp | アンテナ装置 |
KR20150127154A (ko) * | 2013-03-15 | 2015-11-16 | 레이데온 컴퍼니 | 개별 또는 통합 사용을 위한 알에프 모듈 |
JP2017533673A (ja) * | 2014-11-03 | 2017-11-09 | ノースロップ グラマン システムズ コーポレーション | ハイブリッド電子/機械走査アレイアンテナ |
KR20190140857A (ko) * | 2018-06-12 | 2019-12-20 | 주식회사 케이엠더블유 | 캐비티 필터 및 이에 포함되는 커넥팅 구조체 |
KR20200132659A (ko) * | 2019-05-15 | 2020-11-25 | 주식회사 케이엠더블유 | 안테나 장치 |
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JP2009159430A (ja) * | 2007-12-27 | 2009-07-16 | Mitsubishi Electric Corp | アンテナ装置 |
KR20150127154A (ko) * | 2013-03-15 | 2015-11-16 | 레이데온 컴퍼니 | 개별 또는 통합 사용을 위한 알에프 모듈 |
JP2017533673A (ja) * | 2014-11-03 | 2017-11-09 | ノースロップ グラマン システムズ コーポレーション | ハイブリッド電子/機械走査アレイアンテナ |
KR20190140857A (ko) * | 2018-06-12 | 2019-12-20 | 주식회사 케이엠더블유 | 캐비티 필터 및 이에 포함되는 커넥팅 구조체 |
KR20200132659A (ko) * | 2019-05-15 | 2020-11-25 | 주식회사 케이엠더블유 | 안테나 장치 |
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