WO2022111019A1

WO2022111019A1 - Wafer processing device capable of isolating and protecting wafer

Info

Publication number: WO2022111019A1
Application number: PCT/CN2021/120293
Authority: WO
Inventors: 徐枭宇; 朱政挺
Original assignee: 杭州众硅电子科技有限公司
Priority date: 2020-11-25
Filing date: 2021-10-20
Publication date: 2022-06-02
Also published as: TWI823141B; CN112420574B; TW202221835A; CN112420574A

Abstract

A wafer processing device capable of isolating and protecting a wafer, comprising a processing device used for processing a wafer (4) and a lifting/lowering device (2) used for driving the wafer (4) to be lowered to enter a working place of the processing device, and comprising a baffle device (1). A portion of the baffle device (1) corresponding to the working place of the processing device is provided with an opening penetrating through in the up and down direction, such that the lifting/lowering device (2) can drive the wafer (4) to be conveyed back and forth between the upper side of the baffle device (1) and the working place of the processing device on the lower side of the baffle device (1) by means of the opening; a sealing door (3) is provided at the opening. Upper and lower isolation is performed by means of the baffle device (1), to effectively prevent, during a working process, a liquid falling from the wafer (4) from falling onto the processing device or other wafers on the lower side of the baffle device (1), thereby improving the cleanliness of a processing environment, thus increasing the yield of wafers. When the sealing door (3) is opened, the lifting/lowering device (2) can convey the wafer (4) up and down. Therefore, the cleanliness of a wafer processing environment can be effectively improved, thus increasing the yield of the wafers.

Description

A wafer processing device capable of isolating and protecting wafers

technical field

The present invention relates to the technical field of chip processing, and more particularly, to a wafer processing device capable of isolating and protecting wafers.

Background technique

At present, most chemical mechanical planarization (CMP) equipments use wet processes. During the transmission process, various residual liquids will drip from the wafer surface into other process environments, and this situation will It affects the entire product processing process, and affects the work efficiency of the machine and the yield of the wafer. In order to overcome this deficiency, in the prior art, each module will be provided with an independent protective device, but this will lead to high cost, unprotected loading and unloading areas, and it is not easy for residues dripping on the protective isolation devices in each area. Centralized processing, etc.

To sum up, how to effectively improve the cleanliness of the processing environment, thereby improving the yield of wafers, is an urgent problem to be solved by those skilled in the art at present.

SUMMARY OF THE INVENTION

In view of this, the object of the present invention is to provide a wafer processing apparatus capable of isolating and protecting wafers, which can effectively improve the cleanliness of the processing environment, thereby improving the yield of wafers .

In order to achieve the above object, the present invention provides the following technical solutions:

A wafer processing device capable of isolating and protecting wafers, comprising a processing device for processing wafers and a lifting device for driving the wafer to descend to enter the working place of the processing device, including a blocking device and the position of the barrier device corresponding to the working place of the processing device is provided with an opening that penetrates up and down, so that the lifting device can drive the wafer to pass through the opening to connect with the barrier device on the upper side of the barrier device. It is transported back and forth between the working places of the processing device on the lower side of the blocking device, and the opening is provided with a closed door.

In the wafer processing device capable of isolating and protecting wafers, during application, when the wafer fixed by the lifting device moves above the blocking device, the closing door is closed at this time, and the wafer and the processing device begin to move laterally relative to each other. . During the lateral relative movement, when the liquid remaining on the wafer falls, because the closing door is closed, it will fall on the closing door, and will not fall between the processing devices on the underside of the closing door, nor will it fall on the body of the processing unit. When the wafer needs to interact with the processing device on the lower side, the closed door is opened, and the lifting device can drive the wafer through the opening to enter the working place of the processing device for wafer processing. In the wafer processing device capable of isolating and protecting the wafer, the upper and lower isolation is performed by the barrier device, so as to effectively prevent the liquid dropped on the wafer from falling on the processing device or other processing devices on the lower side of the barrier device during the working process. On the wafer, an opening is provided, and when the closed door is opened, the lifting device can transport the wafer up and down. To sum up, the wafer processing apparatus capable of isolating and protecting wafers can effectively improve the cleanliness of the processing environment, thereby improving the yield of wafers.

Preferably, the closing door can be opened when the lifting device drives the wafer to descend, and the closing door can be closed when the wafer is driven to ascend to reset.

Preferably, the closing door and the blocking device are slidably connected in a horizontal direction to realize opening and closing.

Preferably, one side edge of the closing door is rotatably connected with the corresponding side port edge of the opening so that opening and closing can be realized by rotation.

Preferably, it includes a plurality of the processing devices, and also includes a transport device that drives the lifting device to move along the arrangement direction of the plurality of processing devices, and the blocking device is provided with a plurality of openings corresponding to each of the processing devices.

Preferably, at least one group of the processing devices is a cleaning module for cleaning the wafers.

Preferably, at least one group of the processing devices is a polishing device, and the polishing device includes a loading and unloading stage for carrying wafers, and the polishing part can move to avoid the opening corresponding to the loading and unloading stage.

Preferably, the polishing device further comprises a swing arm or a robot for transferring wafers that can be rotated around a vertical axis, and the polishing part is mounted on the swing arm or the robot.

Preferably, it includes a polishing work area, a wafer transition area and a wafer transfer area that are arranged in sequence, and at least one group of the processing devices is a polishing processing device, and the polishing processing device can be used to Wafer polishing process, the wafer transition area is provided with a transfer device, the wafer transfer area is provided with the opening and the closed door, and the transfer device can transfer the wafers in the polishing work area to the The wafer transfer area corresponds to below the opening.

Preferably, the blocking device is in the form of a long strip, and a plurality of the openings are arranged in sequence.

Preferably, the blocking device is a disc device, and a plurality of the openings are distributed circumferentially.

Preferably, a wetting device for spraying liquid to wet the wafer on the upper side of the blocking device is further included, and the wetting device is mounted on the blocking device.

Description of drawings

In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can also be obtained according to these drawings without creative efforts.

FIG. 1 is a schematic partial structure diagram of a wafer processing apparatus capable of isolating and protecting wafers according to an embodiment of the present invention;

2 is a schematic diagram of a sliding opening of a closed door provided by an embodiment of the present invention;

FIG. 3 is a schematic diagram of a rotary opening of a closed door provided by an embodiment of the present invention;

4 is a schematic structural diagram of a cleaning module of a wafer processing apparatus capable of isolating and protecting wafers according to an embodiment of the present invention;

5 is a schematic structural diagram of a polishing module of a wafer processing apparatus capable of isolating and protecting wafers according to an embodiment of the present invention;

6 is a schematic top view of the wafer processing apparatus capable of isolating the guard wafer in FIG. 5;

7 is a schematic structural diagram of a wafer processing device capable of isolating and protecting wafers during rotation and transportation according to an embodiment of the present invention;

8 is a schematic diagram of an installation structure of a wetting device provided by an embodiment of the present invention;

9 is a schematic structural diagram of a wafer processing apparatus when a polishing processing apparatus and a wafer transfer area are separated by a transition area according to an embodiment of the present invention.

The figures are marked as follows:

Blocking device 1, lifting device 2, closing door 3, wafer 4, cleaning module 5, polishing part 6, loading and unloading table 7, swing arm 8, transport device 9, wetting device 10, polishing work area 11, wafer Transition area 12 , wafer transfer area 13 , transition area robot 14 , opening 15 .

Detailed ways

The embodiment of the present invention discloses a wafer processing device capable of isolating and protecting wafers, so as to effectively solve the problem that the residual liquid of the wafer is difficult to clean.

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

Please refer to FIG. 1-FIG. 8. FIG. 1 is a schematic diagram of a partial structure of a wafer processing apparatus capable of isolating and protecting wafers according to an embodiment of the present invention; FIG. 2 is a schematic diagram of a sliding opening of a closed door provided by an embodiment of the present invention; FIG. 3 FIG. 4 is a schematic structural diagram of a cleaning module of a wafer processing device capable of isolating and protecting wafers according to an embodiment of the present invention; FIG. 5 is a schematic diagram of a cleaning module provided by an embodiment of the present invention. Schematic diagram of a polishing module structure of a wafer processing device for isolating and protecting wafers; FIG. 6 is a schematic top view of a wafer processing device capable of isolating and protecting wafers in FIG. 5 ; FIG. 7 is an embodiment of the present invention. A schematic structural diagram of a circular wafer processing device during rotation and transportation; FIG. 8 is a schematic diagram of an installation structure of a wetting device provided by an embodiment of the present invention.

In a specific embodiment, this embodiment provides a wafer processing device capable of isolating and protecting wafers, specifically, including a processing device, a lifting device 2 and a blocking device 1 . The processing device is used to process the wafer 4, and the processing methods are cleaning, polishing, etc. The specific processing device can be correspondingly set according to actual production needs.

The lifting device 2 is used to drive the wafer 4 to descend to enter the working place of the processing device, so that the processing device can process the wafer 4 . The processed wafer 4 may be driven up by the lifting device 2 to enter the next processing device to continue the processing. It should be noted that, in actual production, a transportation device 9 will be installed, and the transportation device 9 will drive the lifting device 2 to move laterally relative to the processing device, which can be realized by directly driving the lifting device 2 to move, or directly driving the processing device. .

The lifting device 2 can be a manipulator, the driving end has a fixing mechanism to fix the wafer 4, and the lifting and lowering of the driving end can be realized by rotational driving, such as a swing arm, or it can be realized by linear up and down driving, such as an up and down telescopic electric cylinder , telescopic pneumatic cylinder, telescopic hydraulic cylinder, etc. Specifically, it can be set as required, subject to the opening that can drive the wafer 4 to pass through the blocking device 1 .

The part of the blocking device 1 corresponding to the working place of the processing device is provided with an opening that penetrates up and down, so that the lifting device 2 drives the wafer 4 to penetrate from the upper side of the blocking device 1 to the lower side of the blocking device 1 through the opening. The processing unit work place. Therefore, the opening should be slightly larger than the wafer 4, and when the lifting device 2 needs to pass through the opening together, according to the structural characteristics of the lifting device 2, the opening should be avoided to ensure that the lifting device 2 can drive the wafer 4 down to the working place of the processing device. . The opening is generally a rectangular opening, of course, it can also be a circular opening or other polygonal openings, which can be set as required. It should be noted that the openings may also be borderless openings, groove-type openings, etc. The groove-type openings, that is, one side edge of the opening is missing.

The opening is provided with a closed door 3, so that when the closed door 3 is closed, the falling liquid droplets on the upper side of the closed door 3 will not enter the lower side of the closed door 3, so as to play a blocking effect. When the closing door 3 is opened, the wafer 4 can pass through the opening, from bottom to top, or from top to bottom. The movable connection between the closing door 3 and the blocking device 1 may be, for example, a sliding connection or a rotating connection as the current door body, and of course it may also be a foldable connection. Specifically, it can be set as required.

In the wafer processing device capable of isolating and protecting wafers, during application, when the wafer 4 fixed by the lifting device 2 moves relatively laterally with the processing device, the closing door 3 is closed at this time. When the liquid remaining on the wafer 4 falls, because the closing door 3 is closed, it will fall on the closing door 3, and will not fall between the two processing devices on the lower side of the closing door 3, and will not fall on the lower side of the closing door 3. on the body of the processing unit. When the wafer 4 needs to interact with the processing device on the lower side, the closing door 3 is opened at this time, and the lifting device 2 can drive the wafer 4 through the opening to enter the working place of the processing device for processing. In the wafer processing device capable of isolating and protecting the wafer, the upper and lower isolation is performed by the barrier device 1 to effectively prevent the liquid dropped from the wafer 4 from falling on the lower side of the barrier device during transportation. On the device or other wafers, an opening is provided. When the closing door is opened, the lifting device can transfer the wafers up and down. To sum up, the wafer processing apparatus capable of isolating and protecting wafers can effectively improve the cleanliness of the processing environment, thereby improving the wafer yield.

Further, considering that the opening and closing of the closed door 3 is related to the elevating drive of the lifting device 2, in order to avoid driving the closing door 3 to open and close independently each time, it is preferable here that the opening and closing of the closed door 3 is linked with the elevating drive of the lifting device 2, So that when the lifting device 2 drives the wafer 4 to descend, the closing door 3 is opened, and when the wafer 4 is driven to ascend to reset, the closing door 3 is closed. Specifically, a controller can be set to send a corresponding control signal to the closed door 3 when the controller sends a control signal to the lifting device 2, such as when sending a descending signal of the lifting device 2, and simultaneously send an opening signal to the closed door 3, such as When sending the lifting signal of the lifting device 2, the interval is predetermined time, so as to ensure that the lifting device 2 is completely raised, and the signal is closed. Door 3 sends a close signal. Of course, the communication can also be achieved through a mechanical structure, or the lifting signal of the lifting device 2 can be obtained through a detector such as a touch switch, and the closed door 3 can be controlled to open and close accordingly.

As mentioned above, wherein the closing door 3 is opened, it may be sliding open, and specifically the closing door 3 is slidably connected with the blocking device 1 in the horizontal direction to realize opening and closing. In order to ensure the shielding effect of the closing door 3 , the closing door 3 is preferably located on the upper side of the body of the blocking device 1 here. It is also possible to rotate one side edge of the closed door 3 and the corresponding side edge of the opening so as to be able to be opened by rotation, specifically, it can be rotated downward to open, or it can be rotated upward to open.

Further, if a plurality of processing devices are provided, and at least one group of the processing devices is a polishing device, a corresponding transportation device 9 is provided to drive the transportation device 9 to move the lifting device 2 along the arrangement direction of the plurality of processing devices, Wherein the blocking device 1 is preferably provided with a plurality of openings corresponding to each processing device, wherein the blocking device 1 can be relatively fixed with each lifting device 2 in the transporting direction of the transporting device 9 to move synchronously in the transporting direction, It may also be relatively fixed with the corresponding processing device. By setting a plurality of openings, it is ensured that each processing device can complete the corresponding processing work. It should be noted that, the plurality of processing devices may be sequentially distributed along a straight line, or may be sequentially distributed along a curve, and specifically, may be set as required. Specifically, for example, the baffle device 1 can be formed in a long shape, and a plurality of openings can be arranged in sequence; the baffle device 1 can also be made into a disc device, and the plurality of the openings are distributed in the circumferential direction, and of course, it can be not in the shape of a circle. Shape distribution, the distribution form can be set as required.

For example, at least one group of the processing devices can be a cleaning module 5 for cleaning the wafers 4 . In order to ensure the cleaning effect, for example, a plurality of cleaning modules 5 can be uniformly arranged in sequence along the transportation direction of the transport device 9 to form a plurality of cleaning stations. and unloading the wafer 4 station.

Specifically, at least one group of the processing devices may be polishing devices, and the polishing device includes a loading and unloading table 7 for carrying the wafers 4 and a polishing part 6 for polishing the wafers 4 on the loading and unloading table 7 , wherein The polishing part 6 is movably connected to the loading and unloading platform 7 so as to be movable to avoid the opening corresponding to the loading and unloading platform 7 , so that when the opening is avoided, the residual liquid falling from the opening can be effectively avoided from falling. into the polishing part 6 . The sliding connection between the polishing part 6 and the loading and unloading table 7 may be a direct or indirect sliding connection. In order to facilitate driving, it is preferable to further include a swing arm 8 that can rotate around a vertical axis, and the polishing part 6 is installed on the swing arm 8 on. The swing arm 8 is rotated so that both the polishing part 6 and the swing arm 8 can avoid the opening, so that after the wafer 4 is loaded, it is rotated back so that the polishing part 6 The wafer 4 can be processed. Of course, the swing arm 8 can also be of other structures. For example, the polishing device is provided with a robot arm specially used to transport the wafer 4 in and out, and the polishing part 6 does not need to be swing out.

For the setting of the polishing apparatus, other setting solutions are also possible, as shown in FIG. 9 , which is the structure of the wafer processing apparatus when the polishing processing apparatus and the wafer transfer area are separated by a transition area according to an embodiment of the present invention. Schematic diagram, specifically, the wafer processing device includes a polishing work area 11, a wafer transition area 12 and a wafer transfer area 13 that are arranged in parallel. It is the transverse direction along the transportation direction, specifically, it can be set as required. When the barrier device 1 is present, it is preferred that the barrier device 1 is located above the wafer transfer area. As above, at least one group of the processing apparatuses are polishing processing apparatuses. In this case, the polishing processing apparatuses can be used to polish the wafers 4 located in the polishing work area 11 . The specific polishing processing apparatuses may be directly installed in the polishing work area 11 . The wafer transition area 12 is provided with a transmission device, and the specific transmission device may be a transition area robot 14. The transition area robot 14 is installed in the wafer transition area 12, and the wafer transmission area 13 is provided with the above-mentioned opening 15 and In the above-mentioned closed door 3, the transition area robot 14 can transfer the wafer 4 in the polishing work area 11 to the corresponding opening 15 in the wafer transfer area 13, so as to facilitate further taking out the wafer 4 from the opening 15 to the barrier device 1. In other words, the wafer 4 processed by the polishing processing device is moved from the polishing work area 11 through the wafer transition area 12 to the wafer transfer area 13 by the transition area robot 14 for picking and unloading. Of course, the manipulator 14 in the transition area can preferably also transfer the wafer 4 at the corresponding opening 15 to the polishing work area 11 , so that the polishing process device can perform polishing processing in the polishing work area 11 . The transition zone manipulator 14 may be the above-mentioned swing arm 8 or other specially used transmission mechanisms.

On the basis of the above embodiments, a wetting device 10 is further preferably provided. The function of the wetting device 10 is to wet the transmission space on the upper side of the barrier device 1, specifically, to wet the crystals in the space of the transportation channel. In circle 4, liquid is sprayed to wet the wafer 4 to create a moist environment to prevent the surface of the wafer 4 from crystallizing. For the convenience of installation, the specific wetting device 10 can be installed on the blocking device 1, and the specific installation position and installation quantity on the blocking device 1 can be set as required. For example, it can be installed at the corners of the blocking device 1, specifically, the wetting device 10 can be installed at both of the corners. The specific structure of the wetting device 10 can also be set according to the configuration, and specifically may include a nozzle mounting seat and a nozzle on the mounting seat for spraying liquid on the wafer 4 . The wetting device 10 may spray liquid (such as ultrapure water) all the time when the device is running, or it may spray liquid intermittently only when the wafer 4 is transported, and the specific settings are determined according to requirements.

The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments, and the same and similar parts between the various embodiments can be referred to each other.

The above description of the disclosed embodiments enables any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

A wafer processing device capable of isolating and protecting wafers, comprising a processing device for processing the wafer and a lifting device for driving the wafer to descend to enter the working place of the processing device, characterized in that: A blocking device is included, and the position corresponding to the working place of the processing device is provided with an opening that penetrates up and down, so that the lifting device can drive the wafer to pass through the opening on the upper side of the blocking device It is transported back and forth with the working place of the processing device on the lower side of the blocking device, and the opening is provided with a closed door.
The wafer processing apparatus capable of isolating and protecting wafers according to claim 1, wherein when the lifting device drives the wafer to descend, the closing door can be opened, and when the lifting device drives the wafer to ascend to the The closing door can be closed during reset.
The wafer processing device capable of isolating and protecting wafers according to claim 2, wherein the closing door and the blocking device are slidably connected in a horizontal direction to realize opening and closing.
The wafer processing apparatus capable of isolating and protecting wafers according to claim 2, wherein one side edge of the closed door is rotatably connected with the corresponding side port edge of the opening so as to be able to be opened and closed by rotation.
The wafer processing device capable of isolating and protecting wafers according to any one of claims 1 to 4, characterized by comprising a plurality of the processing devices, and further comprising driving a lifting device to move along the arrangement direction of the plurality of processing devices The transport device is provided with a plurality of openings corresponding to each of the processing devices.
The wafer processing device capable of isolating and protecting wafers according to claim 5, wherein at least one group of the processing devices is a cleaning module for cleaning the wafers.
The wafer processing device capable of isolating and protecting wafers according to claim 5, wherein at least one group of the processing devices is a polishing device, the polishing device includes a loading and unloading table for carrying the wafer, and the polishing part can Move to avoid the opening corresponding to the loading dock.
The wafer processing device capable of isolating and protecting wafers according to claim 7, wherein the polishing device further comprises a swing arm or a manipulator for transferring wafers that can rotate around a vertical axis, and the polishing part is mounted on the on the swing arm or manipulator.
The wafer processing device capable of isolating and protecting wafers according to claim 5, characterized in that it comprises a polishing work area, a wafer transition area and a wafer transfer area which are arranged in parallel in sequence, and at least one group of the processing devices is for polishing processing device, the polishing processing device can be used for the polishing work located in the The wafer transition area is provided with a transfer device, the wafer transfer area is provided with the opening and the closed door, and the transfer device can transfer the wafers in the polishing work area. to the wafer transfer area corresponding to the opening.
The wafer processing device capable of isolating and protecting wafers according to claim 5, wherein the blocking device is in the form of a long strip, and a plurality of the openings are arranged in sequence; or, the blocking device is circular In the disk device, a plurality of the openings are circumferentially distributed.
The wafer processing device capable of isolating and protecting wafers according to claim 5, further comprising a wetting device for spraying liquid to wet the wafers on the upper side of the blocking device, the wetting device A device is mounted on the baffle.