CN107785295A - One kind spray moisturizing wafer door gear - Google Patents
One kind spray moisturizing wafer door gear Download PDFInfo
- Publication number
- CN107785295A CN107785295A CN201711223463.4A CN201711223463A CN107785295A CN 107785295 A CN107785295 A CN 107785295A CN 201711223463 A CN201711223463 A CN 201711223463A CN 107785295 A CN107785295 A CN 107785295A
- Authority
- CN
- China
- Prior art keywords
- wafer
- plate
- door
- dodge gate
- spray
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007921 spray Substances 0.000 title claims abstract description 44
- 230000003020 moisturizing effect Effects 0.000 title claims abstract description 20
- 238000007789 sealing Methods 0.000 claims abstract description 11
- 239000011521 glass Substances 0.000 claims description 16
- 239000012780 transparent material Substances 0.000 claims description 2
- 238000009434 installation Methods 0.000 claims 1
- 238000009738 saturating Methods 0.000 claims 1
- 238000000227 grinding Methods 0.000 abstract description 3
- 239000000843 powder Substances 0.000 abstract description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 230000009471 action Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000002360 explosive Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
Abstract
Present invention is disclosed one kind to spray moisturizing wafer door gear, including bottom plate, the wafer gaily decorated basket, spray colunm and hermatic door, the wafer gaily decorated basket is used to place wafer, it can be placed on bottom plate, spray colunm is located on bottom plate, for being sprayed to wafer, hermatic door is located at the side of bottom plate, including sealing door body and dodge gate, there is the window that wafer cassette passes through in sealing door body, dodge gate is used to open or close the window, wafer is sprayed by spray colunm, effectively prevent on wafer because the powder of grinding residual dries hardening, and influence the yield rate of wafer.
Description
Technical field
The present invention relates to one kind to spray moisturizing wafer door gear.
Background technology
In semiconductor or other relevant industries, after the completion of some manufacturing process (such as PVD or CVD techniques), it is necessary to
Wafer surface is done into mechanical lapping (such as chemical mechanical polishing processes), controls wafer surface
Thickness or flatness.After mechanical lapping is finished, after milling apparatus first does surface clean, then wafer is sent to next set
Standby to do depth cleaning, because wafer is in transmitting procedure, the grinding step residual dust on wafer can dry hardening, reduce
The yield rate of wafer, therefore, in the stand-by period of the transmission loading and unloading between two processes, wafer will ensure tide
It is wet.
The content of the invention
The invention provides one kind to spray moisturizing wafer door gear, overcomes the difficulty of prior art, has started one kind and carried
Outside for spray moisture-keeping functions, also meet in wet environment in the detecting function, lot number radio frequency read functions, the gaily decorated basket of the wafer gaily decorated basket
The spray moisturizing wafer door gear of wafer status scan function.
The invention provides one kind to spray moisturizing wafer door gear, including：
Bottom plate；
The wafer gaily decorated basket, the wafer gaily decorated basket is placed on, for placing wafer；
Spray colunm, the spray colunm is located on the bottom plate, for being sprayed to the wafer；
Hermatic door, the hermatic door are located at the side of the bottom plate, including sealing door body and dodge gate, the hermatic door
There is the window that the wafer cassette passes through, the dodge gate is used to open or close the window on body.
Further, in addition to the first support block and the second support block, the wafer gaily decorated basket by first support block and
Second support block is placed on, and tablet is provided with second support block, and the tablet includes the first plate
With the second plate, first plate and second plate are V-shaped, wherein, first plate is sensitive surface, is set on the dodge gate
There is the reflective sensor for sensing first plate.
Further, the reflective sensor is located at the inside of the dodge gate, relative with the bottom plate on the dodge gate
Face on be provided with glass blocks, so that the reflective sensor senses first plate through the glass blocks.
Further, the inside of the dodge gate is additionally provided with scanning sensor, and the scanning sensor is used for described in transmission
Wafer status information described in glass block scan on the wafer gaily decorated basket.
Further, it is provided with wiper on the window.
Further, the hermatic door includes motor, timing belt, lead screw assembly and slide rail, the motor, the timing belt,
The lead screw assembly and the slide rail are separately mounted to inside the hermatic door, the dodge gate respectively with the slide rail and leading screw
Component is connected, and the lead screw assembly connected with the motor by toothed belt transmission, to drive the dodge gate along described close
The length direction movement of closure door.
Further, the hermatic door also includes two sensing chips and two limit sensors, two limit sensors
It is located at the both ends of the slide rail respectively, each limit sensors sense a sensing chip, and the sensing chip is arranged on
On the dodge gate.
Further, in addition to antenna, the antenna is arranged in first support block, for receiving the wafer gaily decorated basket
ID signals.
Further, in addition to baffle plate, the baffle plate is U-shaped, for covering on the bottom plate surrounding, and U-shaped baffle plate
It is open towards the hermatic door.
Further, the baffle plate is baffle plate made of transparent material.
As a result of above-mentioned technology, the present invention has advantages below：
The spray moisturizing wafer door gear of the present invention is sprayed by spray colunm to wafer, is effectively prevented on wafer
Because the powder of grinding residual dries hardening, and influence the yield rate of wafer.Further, antenna can receive what the wafer gaily decorated basket was sent
ID signals, reflective sensor determine the wafer gaily decorated basket whether is placed with bottom plate, to determine whether to notify by coordinating with tablet
Spray colunm sprays work, the wafer status information in the scanning sensor scanning wafer gaily decorated basket, and sends control system to, to carry
The wafer that next step is carried out for mechanical arm picks and places action.
The present invention is further illustrated below in conjunction with drawings and Examples.
Brief description of the drawings
Fig. 1 is the explosive view of spray moisturizing wafer door gear of the present invention；
Fig. 2 is the front view of hermatic door of the present invention；
Fig. 3 is the rearview of hermatic door of the present invention；
Fig. 4 is the explosive view of hermatic door of the present invention；
Fig. 5 is the schematic diagram of tablet of the present invention.
Embodiment
As shown in figure 1, the spray moisturizing wafer door gear include baffle plate 1, bottom plate 2, spray colunm 3, the first support block 4,
Second support block 5, tablet 6, hermatic door 7, the wafer gaily decorated basket 8 and antenna 9, the wafer gaily decorated basket 8 are used to place wafer, and it passes through the
One support block 4 and the second support block 5 position on a base plate 2, and the support block 5 of the first support block 4 and second is L-shaped, and symmetrically
Installed in the centre position of bottom plate 2, the spray colunm 3 sprayed to wafer is installed on a base plate 2, in an embodiment
In, the quantity of spray colunm 3 is two, wherein, by the rotation of spray colunm 3, or the rotation of the upper nozzle of spray colunm 3, realize
The angular adjustment of spray, two spray colunms 3 are located at the same side of bottom plate 2, are located at the both sides of bottom plate 2, gear respectively with hermatic door 7
Plate 1 is U-shaped, covers on the surrounding of bottom plate 2, and the opening of the U-shaped baffle plate 1 is towards hermatic door 7, water during for preventing that spray colunm 3 from spraying
Splashing, the baffle plate 1 can be transparent baffle.Antenna 9 is arranged in the first support block 4, is sent for receiving the wafer gaily decorated basket 8
ID signals, and communicate information to control system.
As shown in Figures 2 to 4, the hermatic door 7 includes sealing door body 710, dodge gate 720, wiper 730, motor
740th, timing belt 750, lead screw assembly 760, slide rail 770, sensing chip 780 and limit sensors 790, sealing door body 710 is by the
One housing 711 and the second housing 712, which fasten, to be formed, and the window 713 that the wafer gaily decorated basket 8 passes through is provided with the sealing door body 710,
Window 713 is extended on the second housing 712 from the first housing 711, motor 740, timing belt 750, lead screw assembly 760, slide rail
770th, sensing chip 780 and limit sensors 790 can be located inside sealing door body 710, wherein, motor 740, lead screw assembly 760,
Slide rail 770 and limit sensors 790 can be arranged on the second housing 712, and specifically, motor 740 is with lead screw assembly 760 by same
Step band 750 is connected, and dodge gate 720 is connected with the nut seat of lead screw assembly 760, the dodge gate 720 also passes through two cunnings
Rail 770 is connected with the second housing 712, and length direction of the dodge gate 720 along sealing door body 710 can be achieved and move, and then beat
Window 713 is closed on or off.In addition, the both ends of slide rail 770 are respectively arranged with limit sensors 790, two are provided with dodge gate 720
Individual sensing chip 780, each sensing chip 780 coordinate with a limit sensors 790, when dodge gate 720 is slided towards one end of slide rail 770
During row, sensing chip 780 should can be sensed positioned at the limit sensors 790 of the one end of slide rail 770, and motor 740 is stopped.This
Art personnel it is understood that the quantity of the sensing chip 780 and limit sensors 790 is respectively two, wherein, when one
When individual limit sensors 790 sense corresponding sensing chip 790, now, dodge gate 720 is to completely close window 713, when
When another limit sensors 790 senses corresponding sensing chip 790, now, dodge gate 720 is complete opening window
713。
As shown in figure 4, dodge gate 720 is fastened and formed by sliding panel 721 and protecting cover 722, wherein, sliding panel 721 is arranged on
On slide rail 770, the dodge gate 720 is internally provided with scanning sensor 725 and reflective sensor 724, because, the wafer gaily decorated basket 8
It is to pass through the second housing 712 from the first housing 711, until placing on a base plate 2, therefore, there is a glass on the sliding panel 721
Glass block 723, in order to the wafer status information in the scanning wafer gaily decorated basket 8 of scanning sensor 725, and reflective sensor 724
Sensitive plate 6, wafer status information include monolithic, there are not the information such as piece, oblique cutting or biplate lamination.Wherein, as shown in figure 5,
The tablet 6 is hinged in the second support block 5, and it includes the first plate 61 and the second plate 62, and the first plate 61 and the second plate 62 are in V
Type, when the wafer gaily decorated basket 8 is placed in the first support block 4 and the second support block 5, the wafer gaily decorated basket 8 depresses the second plate 62, makes first
Plate 61, which erects, to be come, and so that reflective sensor 724 senses the first plate 61 through glass blocks 723, is determined the wafer gaily decorated basket 8 in place, i.e., should
First plate 61 is sensitive surface, and when taking the wafer gaily decorated basket 8 away, first plate 61 declines, now, reflective sensor 724 sense less than
First plate 61, spray colunm 3 can stop spraying.Because the water that spray colunm 3 sprays can be splashed on glass blocks 723, scanning sensing is influenceed
Device 725 and reflective sensor 724 use, therefore the present invention avoids the appearance of above mentioned problem, tool by increasing a wiper 730
Body, wiper 730 is arranged on window 713, should when length direction of the dodge gate 720 along sealing door body 710 moves
Wiper 730 can scrape the water on glass blocks 723 totally, it is ensured that glass blocks 723 is dried.
The operation principle of the present invention is as follows：
The first step, motor 740 drive lead screw assembly 760 to rotate, and then drive dodge gate 720 to move up, and the wiper 730 can
Water on glass blocks 723 is scraped totally, when superposed limit sensors 790 sense corresponding sensing chip 790,
Motor 740 is stopped, and now, window 713 is full open position.
Second step, the wafer gaily decorated basket 8 is placed in the first support block 4 and the second support block 5 by window 713, and simultaneously
Perform dodge gate 720 and move down action, the wiper 730 again can scrape the water on glass blocks 723 once, it is ensured that glass blocks 723
Dry.When the wafer gaily decorated basket 8 is placed in the first support block 4 and the second support block 5, antenna 9 receives the ID that the wafer gaily decorated basket 8 is sent
Signal, and control system is communicated information to, and, the wafer gaily decorated basket 8 depresses the second plate 62, erects the first plate 61 and comes, so as to anti-
Penetrate sensor 724 and sense the first plate 61 through glass blocks 723, and signal output tells the control system wafer gaily decorated basket 8 in place, control
Spray colunm 3 processed sprays, at this moment, the status information of the scanning wafer piece of scanning sensor 725, and and send control system to, to provide
The wafer that robotic arm carries out next step picks and places action.
Embodiment described above is merely to illustrate the technological thought and feature of the present invention, in the art its object is to make
Technical staff can understand present disclosure and implement according to this, it is impossible to only with the present embodiment come limit the present invention patent adopt
With scope, i.e., all equal changes or modification made according to disclosed spirit, still fall in the scope of the claims of the present invention.
Claims (10)
1. one kind spray moisturizing wafer door gear, it is characterised in that including：
Bottom plate；
The wafer gaily decorated basket, the wafer gaily decorated basket is placed on, for placing wafer；
Spray colunm, the spray colunm is located on the bottom plate, for being sprayed to the wafer；
Hermatic door, the hermatic door are located at the side of the bottom plate, including sealing door body and dodge gate, the sealing door body
The upper window passed through with the wafer cassette, the dodge gate are used to open or close the window.
2. spray moisturizing wafer door gear as claimed in claim 1, it is characterised in that also including the first support block and second
Bracer, the wafer gaily decorated basket are placed on by first support block and second support block, second support
Tablet is provided with block, the tablet includes the first plate and the second plate, and first plate and second plate are V-shaped, its
In, first plate is sensitive surface, and the reflective sensor for sensing first plate is provided with the dodge gate.
3. spray moisturizing wafer door gear as claimed in claim 2, it is characterised in that the reflective sensor is located at the work
The inside of dynamic door, glass blocks is provided with the face relative with the bottom plate on the dodge gate, so that the reflective sensor is saturating
Cross the glass blocks and sense first plate.
4. spray moisturizing wafer door gear as claimed in claim 3, it is characterised in that the inside of the dodge gate is additionally provided with
Scanning sensor, the scanning sensor are used for through the wafer state letter on the wafer gaily decorated basket described in the glass block scan
Breath.
5. spray moisturizing wafer door gear as claimed in claim 3, it is characterised in that be provided with wiper on the window.
6. spray moisturizing wafer door gear as claimed in claim 1, it is characterised in that the hermatic door includes motor, synchronization
Band, lead screw assembly and slide rail, the motor, the timing belt, the lead screw assembly and the slide rail are separately mounted to described close
Closure door is internal, and the dodge gate is connected with the slide rail and lead screw assembly respectively, and the lead screw assembly and the motor pass through same
V belt translation connection is walked, to drive length direction of the dodge gate along the hermatic door to move.
7. spray moisturizing wafer door gear as claimed in claim 6, it is characterised in that the hermatic door also includes two sensings
Piece and two limit sensors, two limit sensors are located at the both ends of the slide rail, each spacing sensing respectively
Device senses a sensing chip, and the sensing chip is arranged on the dodge gate.
8. spray moisturizing wafer door gear as claimed in claim 2, it is characterised in that also including antenna, the antenna installation
In first support block, for receiving the ID signals of the wafer gaily decorated basket.
9. spray moisturizing wafer door gear as claimed in claim 1, it is characterised in that also including baffle plate, the baffle plate is in U
Type, for covering on the bottom plate surrounding, and the opening of U-shaped baffle plate is towards the hermatic door.
10. spray moisturizing wafer door gear as claimed in claim 9, it is characterised in that the baffle plate is made up of transparent material
Baffle plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711223463.4A CN107785295A (en) | 2017-11-29 | 2017-11-29 | One kind spray moisturizing wafer door gear |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711223463.4A CN107785295A (en) | 2017-11-29 | 2017-11-29 | One kind spray moisturizing wafer door gear |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107785295A true CN107785295A (en) | 2018-03-09 |
Family
ID=61431040
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711223463.4A Pending CN107785295A (en) | 2017-11-29 | 2017-11-29 | One kind spray moisturizing wafer door gear |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107785295A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110473819A (en) * | 2018-05-11 | 2019-11-19 | 北京北方华创微电子装备有限公司 | A kind of door opener, transmission chamber and semiconductor processing equipment |
| CN112420574A (en) * | 2020-11-25 | 2021-02-26 | 杭州众硅电子科技有限公司 | Wafer processing device capable of isolating and protecting wafer |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08130239A (en) * | 1994-10-28 | 1996-05-21 | Tokyo Electron Ltd | Door apparatus of vacuum chamber |
| US6396072B1 (en) * | 1999-06-21 | 2002-05-28 | Fortrend Engineering Corporation | Load port door assembly with integrated wafer mapper |
| CN1591775A (en) * | 2003-08-15 | 2005-03-09 | 阿斯莫国际公司 | Method and apparatus for mapping of wafers located inside a closed wafer cassette |
| US20130000757A1 (en) * | 2004-06-21 | 2013-01-03 | Right Mfg., Co., Ltd. | Load port |
| CN204481006U (en) * | 2015-03-16 | 2015-07-15 | 北京七星华创电子股份有限公司 | A kind of sealing device for chamber door |
| CN207637756U (en) * | 2017-11-29 | 2018-07-20 | 上海大族富创得科技有限公司 | A kind of spray moisturizing wafer door gear |
-
2017
- 2017-11-29 CN CN201711223463.4A patent/CN107785295A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08130239A (en) * | 1994-10-28 | 1996-05-21 | Tokyo Electron Ltd | Door apparatus of vacuum chamber |
| US6396072B1 (en) * | 1999-06-21 | 2002-05-28 | Fortrend Engineering Corporation | Load port door assembly with integrated wafer mapper |
| CN1591775A (en) * | 2003-08-15 | 2005-03-09 | 阿斯莫国际公司 | Method and apparatus for mapping of wafers located inside a closed wafer cassette |
| US20130000757A1 (en) * | 2004-06-21 | 2013-01-03 | Right Mfg., Co., Ltd. | Load port |
| CN204481006U (en) * | 2015-03-16 | 2015-07-15 | 北京七星华创电子股份有限公司 | A kind of sealing device for chamber door |
| CN207637756U (en) * | 2017-11-29 | 2018-07-20 | 上海大族富创得科技有限公司 | A kind of spray moisturizing wafer door gear |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110473819A (en) * | 2018-05-11 | 2019-11-19 | 北京北方华创微电子装备有限公司 | A kind of door opener, transmission chamber and semiconductor processing equipment |
| CN112420574A (en) * | 2020-11-25 | 2021-02-26 | 杭州众硅电子科技有限公司 | Wafer processing device capable of isolating and protecting wafer |
| WO2022111019A1 (en) * | 2020-11-25 | 2022-06-02 | 杭州众硅电子科技有限公司 | Wafer processing device capable of isolating and protecting wafer |
| TWI823141B (en) * | 2020-11-25 | 2023-11-21 | 大陸商杭州眾硅電子科技有限公司 | Wafer processing device for isolating and protecting wafers |
| CN112420574B (en) * | 2020-11-25 | 2024-02-02 | 杭州众硅电子科技有限公司 | Wafer processing device capable of isolating protection wafer |
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| PB01 | Publication | ||
| PB01 | Publication | ||
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Address after: Room 202, Building 1, 555 Wanfang Road, Minhang District, Shanghai, 201100 Applicant after: Shanghai Han's Fuchuang Technology Co.,Ltd. Address before: Room 202, Building 1, 555 Wanfang Road, Minhang District, Shanghai, 201100 Applicant before: SHANGHAI FORTREND TECHNOLOGY Co.,Ltd. |