WO2022095259A1 - 显示面板及显示装置 - Google Patents

显示面板及显示装置 Download PDF

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Publication number
WO2022095259A1
WO2022095259A1 PCT/CN2020/140400 CN2020140400W WO2022095259A1 WO 2022095259 A1 WO2022095259 A1 WO 2022095259A1 CN 2020140400 W CN2020140400 W CN 2020140400W WO 2022095259 A1 WO2022095259 A1 WO 2022095259A1
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WIPO (PCT)
Prior art keywords
sub
electrode
layer
electrode layer
wiring
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Ceased
Application number
PCT/CN2020/140400
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English (en)
French (fr)
Inventor
陈涛
谢炎
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Application filed by Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority to US17/284,451 priority Critical patent/US12063840B2/en
Publication of WO2022095259A1 publication Critical patent/WO2022095259A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/81—Anodes
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H10K59/351—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels comprising more than three subpixels, e.g. red-green-blue-white [RGBW]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H10K59/353—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels characterised by the geometrical arrangement of the RGB subpixels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
    • H10K59/65—OLEDs integrated with inorganic image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H10K59/8051—Anodes
    • H10K59/80515—Anodes characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements

Definitions

  • the present application relates to the field of display technology, and in particular, to a display panel and a display device.
  • an off-screen camera is used in the display panel.
  • CUP Camera Under Panel
  • the pixel density of the CUP area is smaller than the pixel density of the display area, so as to improve the light transmittance of the display panel in the CUP area, but the process accuracy will affect each pixel in the CUP area, resulting in the CUP area. There is an uneven display problem.
  • Embodiments of the present application provide a display panel and a display device, which can achieve uniform display in the display light-transmitting area while improving the light transmittance of the display light-transmitting area.
  • An embodiment of the present application provides a display panel, including a display light-transmitting area and a main display area, the display light-transmitting area includes a plurality of pixel units, and each of the pixel units includes: a first electrode layer; on the first electrode layer and electrically connected to the first electrode layer, the electrode part and the first electrode layer constitute the first electrode of the pixel unit; wherein, the electrode part is in the first electrode layer.
  • the orthographic projection on an electrode layer is located within the boundary of the first electrode layer.
  • the first electrode includes a plurality of sub-electrodes; the first electrode layer includes a plurality of first sub-electrode layers; the electrode portion includes a one-to-one correspondence with the plurality of first sub-electrode layers A plurality of first sub-electrode parts, each of the first sub-electrode layers is electrically connected with the corresponding first sub-electrode part to form the sub-electrode, and the first sub-electrode part is in the first sub-electrode The orthographic projection on the layer lies within the boundary of the first sub-electrode layer.
  • the first electrode layer further includes a plurality of wiring parts located between the first sub-electrode layers, and each of the wiring parts is connected to at least two of the sub-electrodes.
  • the pixel unit includes a plurality of sub-pixels, and each of the sub-pixels includes the sub-electrode; wherein, the plurality of sub-electrodes connected by the same wiring portion are located in the same pixel unit Inside, a plurality of the sub-pixels connected by the same wiring portion have the same emission color.
  • the orthographic projection of the first sub-electrode portion on the first sub-electrode layer has a second boundary, and the distance between the second boundary and the boundary of the first sub-electrode layer is greater than or equal to 0.5 microns.
  • the distance between the second boundary and the boundary of the first sub-electrode layer is equal to 0.8 microns.
  • the first sub-electrode part includes a reflective layer on the first sub-electrode layer and a transparent layer on the reflective layer, wherein the transparent layer is on the first sub-electrode
  • the orthographic projection on the layer is located within the boundary of the first sub-electrode layer
  • the orthographic projection of the reflective layer on the transparent layer is located within the boundary of the transparent layer.
  • the first electrode layer is made of the same material as the transparent layer, the first electrode layer is made of transparent conductive oxide, and the reflective layer is made of Al, Ag, Ca , one or more of Au and Cu.
  • the display panel further includes a transition display area located between the display light-transmitting area and the main display area and an auxiliary pixel driving circuit located in the transition display area, the first electrode The layer is electrically connected to the auxiliary pixel driving circuit.
  • it further includes: a first wiring layer, located under the first electrode layer, the first wiring layer is electrically connected to the wiring portion; a second wiring layer, located on the Below the first wiring layer, the second wiring layer is electrically connected between the first wiring layer and the auxiliary pixel driving circuit.
  • the main display area includes a plurality of second pixel units, and each of the second pixel units includes: a first main electrode, a main pixel driving circuit, and is electrically connected to the first main electrode and the third wiring layer of the main pixel driving circuit; wherein, the first main electrode includes the first sub-electrode layer and the electrode part, the third wiring layer and the first wiring
  • the preparation materials of the layer and the second wiring layer are different.
  • the preparation material of the third wiring layer includes a metal material
  • the preparation material of the first wiring layer and the second wiring layer includes a transparent conductive oxide
  • the light transmittance of the third wiring layer is less than or equal to the light transmittance of the first wiring layer and the second wiring layer
  • An embodiment of the present application further provides a display device, including any of the above-mentioned display panels and a sensor, wherein the sensor is facing the display light-transmitting area.
  • the display panel includes a display light-transmitting area and a main display area
  • the display light-transmitting area includes a plurality of pixel units, each of which is a pixel unit.
  • the unit includes: a first electrode layer; an electrode part is located on the first electrode layer and is electrically connected to the first electrode layer, and the electrode part and the first electrode layer constitute the first part of the pixel unit an electrode; wherein, the orthographic projection of the electrode portion on the first electrode layer is located within the boundary of the first electrode layer, so as to improve the light transmittance of the display light-transmitting area and simultaneously realize the display light-transmitting area.
  • Uniform display is a display light-transmitting area and a main display area
  • the display light-transmitting area includes a plurality of pixel units, each of which is a pixel unit.
  • the unit includes: a first electrode layer; an electrode part is located on the first electrode layer and is electrically connected to the first electrode layer, and the electrode part and the first electrode layer constitute
  • FIG. 1A is a schematic structural diagram of a display panel provided by an embodiment of the present application.
  • Fig. 1B is a partial enlarged view at A in Fig. 1A;
  • FIG. 1C to FIG. 1D are schematic structural diagrams of the display panel sectioned along B-B' in FIG. 1A;
  • FIGS. 2A to 2C are schematic structural diagrams of sub-pixels provided by embodiments of the present application.
  • 3A to 3C are flowcharts of manufacturing a display panel according to an embodiment of the present application.
  • 4A to 4G are schematic diagrams of a process of manufacturing a display panel according to an embodiment of the present application.
  • FIG. 1A is a schematic structural diagram of a display panel provided by an embodiment of the present application; as shown in FIG. 1B , which is a partial enlarged view of A in FIG. 1A ; as shown in FIGS. 1C to 1D , It is a schematic structural diagram of a display panel cut along BB' in FIG. 1A ; as shown in FIGS. 2A to 2C , which are schematic structural diagrams of sub-pixels provided by embodiments of the present application.
  • An embodiment of the present application provides a display panel 100 including a display light-transmitting area 100a, a main display area 100b located at the periphery of the display light-transmitting area 100a, and between the display light-transmitting area 100a and the main display area 100b The transition display area 100c.
  • the display panel 100 includes: a plurality of pixel units located in the display light-transmitting area 100a, each of the pixel units includes a plurality of sub-pixels 101; transition area sub-pixels located in the transition display area 100c and driving the sub-pixels The pixel 101, the sub-pixel driving circuit 1021 for the sub-pixels in the transition area to emit light; and the main sub-pixel 107 located in the main display area 100b and the main pixel driving circuit 1022 for driving the main sub-pixel 107 to emit light.
  • each of the pixel units includes: a first electrode layer 103 electrically connected to the auxiliary pixel driving circuit 1021; an electrode portion 200 located on the first electrode layer 103 and electrically connected to the first electrode layer 103
  • An electrode layer 103, the electrode part 200 and the first electrode layer 103 constitute the first electrode of the pixel unit; the orthographic projection of the electrode part 200 on the first electrode layer 103 is located in the first electrode within the boundary of the electrode layer 103 to improve the light transmittance of the display light-transmitting area 100a, and to ensure the structural integrity of the first electrode through the first electrode layer 103, so that the display panel 100 is The uniform display of the display light-transmitting area 100a is described.
  • the first electrode includes a plurality of sub-electrodes; the first electrode layer 103 includes a plurality of first sub-electrode layers 1031; the electrode part 200 includes a one-to-one correspondence with the plurality of first sub-electrode layers 1031 Each of the first sub-electrode layers 1031 is electrically connected to the corresponding first sub-electrode portion to form the sub-electrode, and the first sub-electrode The orthographic projection on the sub-electrode layer 1031 is located within the boundary of the first sub-electrode layer 1031 .
  • the plurality of sub-pixels 101 include a first sub-pixel 1011 and a second sub-pixel 1012
  • the plurality of sub-electrodes include a first sub-electrode 1061 and a second sub-pixel 1012 .
  • the second sub-electrode 1062 The first sub-pixel 1011 includes the first sub-electrode 1061
  • the second sub-pixel 1012 includes the second sub-electrode 1062 .
  • the plurality of first sub-electrode parts include a first part 104 and a second part 105 spaced from the first part 104 , the first part 104 and the second part 105 are respectively located in the first sub-electrode on the electrode layer 1031 and electrically connected to the first sub-electrode layer 1031 respectively, the first part 104 and the first sub-electrode layer 1031 constitute the first sub-electrode of the first sub-pixel 1011 1061, the second part 105 and the first sub-electrode layer 103 constitute the second sub-electrode 1062 of the second sub-pixel 1012, and the first part 104 and the second part 105 are in the
  • the orthographic projections of the first sub-electrode layer 1031 are respectively located within the boundary of the first sub-electrode layer 1031, so as to improve the light transmittance of the display light-transmitting area 100a, and the first sub-electrode layer 1031 ensures the The structural integrity of the first sub-
  • the first electrode layer 103 further includes a plurality of wiring portions 1032 located between the first sub-electrode layers 1031 , each of the wiring portions 1032 is connected to at least two of the first sub-electrode layers 1031, so that each of the wiring portions 1032 is connected to at least two of the sub-electrodes.
  • the first part 104 and the second part 105 are located on the first sub-electrode layer 1031 and are respectively connected with the first sub-electrode
  • the layer 1031 is electrically connected.
  • the first portion 104 and the second portion 105 are respectively located in the corresponding first sub-electrode layer 1031, and the wiring portion 1032 is electrically connected to the corresponding first sub-electrode layer 1031.
  • the first part 104 and the second part 105 are connected, so that the wiring part 1032 is connected to the first sub-electrode 1061 and the second sub-electrode 1062 .
  • the sub-pixel driving circuit 1021 is electrically connected to the first part 104 and the second part 105 through the wiring part 1032 and the first sub-electrode layer 1031 at the same time to drive the first sub-pixel 1011 and the driving current of the second sub-pixel 1012 to emit light are transmitted to the first sub-electrode 1061 and the second sub-electrode 1062 through the wiring part 1032, so that the sub-pixel driving circuit 1021 can pass the
  • the first electrode layer 103 drives at least two of the sub-pixels 101 to emit light, thereby reducing the number of the sub-pixel driving circuits 1021, increasing the area of the display light-transmitting region 100a, and helping to improve the display light-transmitting area The transmittance and display quality of the region 100a.
  • At least two of the sub-pixels 101 driven by the sub-pixel driving circuit 1021 have the same emission color. That is, the plurality of sub-pixels 101 connected through the same wiring portion 1032 have the same light emission color, so that at least two sub-pixels 101 with the same light emission color are driven by one sub-pixel driving circuit 1021 to emit light, thereby reducing the need for light emission.
  • the number of wirings in the wiring portion 1032 is described.
  • the first sub-pixel 1011 and the second sub-pixel 1012 have the same emission color, and the first sub-pixel 1011 and the second sub-pixel 1012 pass through the
  • the first electrode layer 103 is electrically connected to the same auxiliary pixel driving circuit 1021 .
  • a plurality of the sub-pixels 101 located in the display light-transmitting area 100a can use the same method as the first sub-pixel 1011 and the second sub-pixel 1012 and the sub-pixel driving circuit 1021 is electrically connected to reduce the influence on the light transmittance of the display light-transmitting area 100a; that is, at least two sub-pixels of the plurality of sub-pixels 101 located in the display light-transmitting area 100a can pass through the An electrode layer 103 is electrically connected to the sub-pixel driving circuit 1021 , and at least two of the sub-pixels 101 connected to the same sub-pixel driving circuit 1021 have the same emission color.
  • a plurality of the sub-electrodes connected through the same wiring portion 1032 are located in the same pixel unit, so that the sub-pixels 101 in the same pixel unit are driven by the sub-pixel driving circuit The driving of 1021 emits light at the same time.
  • the plurality of sub-pixels 101 further include a third sub-pixel 1013 and a fourth sub-pixel 1014, and each of the pixel units includes the first sub-pixel 1011, the The second sub-pixel 1012, the third sub-pixel 1013, the fourth sub-pixel 1014, if the first sub-pixel 1011 and the second sub-pixel 1012 have the same light emission color, the first sub-pixel 1011 Different from the emission colors of the third sub-pixel 1013 and the fourth sub-pixel 1014, the first sub-pixel 1011 and the second sub-pixel 1012 are electrically connected to the same sub-pixel driving circuit 1021 , at least two of the third sub-pixels 1013 are electrically connected to the same sub-pixel driving circuit 1021 , and at least two of the fourth sub-pixels 1014 are electrically connected to the same sub-pixel driving circuit 1021 .
  • first sub-pixel 1011 and the second sub-pixel 1012 are different, at least two of the first sub-pixels 1011 are electrically connected to the same sub-pixel driving circuit 1021, and at least two of the second sub-pixels are electrically connected to the same sub-pixel driving circuit 1021.
  • 1012 is electrically connected to the same auxiliary pixel driving circuit 1021 .
  • the shape of the sub-pixels 101 in the present application is not limited to a rectangle, and can also be one of a circle, a diamond, a polygon, an ellipse, etc., and a combination thereof; the display panel 100 may include multiple The display light-transmitting area 100a will not be repeated here.
  • the orthographic projection of the first sub-electrode portion on the first sub-electrode layer 1031 has a second boundary 101 a , the second boundary 101 a and the first sub-electrode layer 1031
  • the distance between the boundaries 103a is greater than or equal to 0.5 microns.
  • each of the first sub-electrode layers 1031 has a first boundary 103a
  • the first portion 104 and/or the second portion 105 has a second boundary 101a
  • each of the first boundaries 103a corresponds to The distance between the second boundaries 101a is greater than or equal to 0.5 ⁇ m, so that the first part 104 and the second part 105 are located in the first sub-electrode layer 1031 in a top view, and the The structural integrity of the first sub-electrode 1061 and the second sub-electrode 1062 .
  • the distance between the first boundary 103a and the second boundary 101a is equal to 0.8 micrometers, which can reduce the overall structural integrity of the first sub-electrode 1061 and the second sub-electrode 1062 while ensuring the structural integrity of the first sub-electrode 1061 and the second sub-electrode 1062.
  • the distance between the first boundary 103a and the second boundary 101a is determined according to the size of the opening of the sub-pixel (ie, the effective area of the light-emitting layer 1063) 101b; specifically, please refer to FIG. 2A,
  • the first sub-electrode layer 1031 has a first side 1031a, a second side 1031b, a third side 1031c and a fourth side 1031d;
  • the orthographic projection of the first sub-electrode portion on the first sub-electrode layer 1031 has The fifth side 200a, the sixth side 200b, the seventh side 200c, and the eighth side 200d;
  • the orthographic projection of the opening 101b of the sub-pixel 101 on the first sub-electrode layer 1031 has a ninth side 201a, a tenth side 201b, eleventh side 201c, twelfth side 201d.
  • the first side 1031a is adjacent to the second side 1031b and the fourth side 1031d, the first side 1031a is opposite to the third side 1031c, and the fifth side 200a is the first side 1031a.
  • a side of a sub-electrode portion close to the first side 1031a, the sixth side 200b is a side of the first sub-electrode portion close to the second side 1031b, the seventh side 200c and the fifth side 200a is opposite, the eighth side 200d is opposite to the sixth side 200b;
  • the ninth side 201a is the side of the opening 101b close to the first side 1031a, and the tenth side 201b is the opening 101b
  • the eleventh side 201c is opposite to the first side 1031a, and the twelfth side 201d is opposite to the second side 1031b.
  • the distance between the first side 1031a and the fifth side 200a may be less than or equal to 1/2 times the distance between the eleventh side 201c and the ninth side 201a; further, the The distance between the second side 1031b and the sixth side 200b may be less than or equal to 1/2 times the distance between the tenth side 201b and the twelfth side 201d to avoid the first sub
  • the size of the electrode layer 1031 is too large and occupies the wiring space of the wiring portion 1032 .
  • the distance between the first side 1031a and the fifth side 200a may be equal to the distance between the second side 1031b and the sixth side 200b, and the second side 1031b and the The distance between the sixth side 200b may not be equal to the distance between the third side 1031c and the seventh side 200c, which will not be repeated here.
  • the first sub-electrode part includes a reflective layer on the first sub-electrode layer 1031 and a transparent layer on the reflective layer, wherein the transparent
  • the orthographic projection of the layer on the first sub-electrode layer 1031 is located within the boundary of the first sub-electrode layer 1031
  • the orthographic projection of the reflective layer on the transparent layer is located within the boundary of the transparent layer.
  • the orthographic projection of the reflective layer on the transparent layer may overlap with the transparent layer, which will not be repeated here.
  • the first portion 104 includes a first reflective layer 1041 on the first sub-electrode layer 1031 and a first reflective layer 1041 on the first sub-electrode layer 1031
  • the second part 105 includes a second reflective layer 1051 on the first sub-electrode layer 1031 and a second transparent layer 1052 on the second reflective layer 1051, wherein, The first reflective layer 1041, the first transparent layer 1042 and the first sub-electrode layer 1031 constitute the first sub-electrode 1061 of the first sub-pixel 1011, the second reflective layer 1051 and the The second transparent layer 1052 and the first sub-electrode layer 1031 constitute the second sub-electrode 1062 of the second sub-pixel 1012.
  • the first reflective layer 1041 and the first transparent layer layer 1042, and the second reflective layer 1051 and the second transparent layer 1052 are all located in the first sub-electrode layer 103, and the orthographic projection of the first reflective layer 1041 on the first transparent layer 1042 Located within the boundary of the first transparent layer 1042 , the orthographic projection of the second reflective layer 1051 on the second transparent layer 1052 is located within the boundary of the second transparent layer 1052 .
  • the preparation material of the first electrode layer 103 is the same as the preparation material of the transparent layer. Specifically, the preparation material of the first electrode layer 103 is the same as the preparation material of the first transparent layer 1042 and the second transparent layer 1052 .
  • the preparation material of the first electrode layer 103 includes transparent conductive oxide; wherein, the transparent conductive oxide includes indium tin oxide, zinc indium oxide, zinc gallium oxide, zinc gallium indium oxide, and the like.
  • the preparation materials of the first reflection layer 1041 and the second reflection layer 1051 include one of Al, Ag, Ca, Au, and Cu, so as to improve the optical performance of the display light-transmitting area 100a and improve the display The light transmittance of the light-transmitting region 100a.
  • the distribution density of the plurality of main sub-pixels 107 is the same as the distribution density of the plurality of sub-pixels 101, and the opening area of each main sub-pixel 107 is larger than that of the corresponding main sub-pixel 107.
  • the area of the opening 101b of the sub-pixel 101 is used to reduce the display difference between the display light-transmitting region 100a and the main display region 100b while taking into account both light transmittance and display function.
  • each of the pixel units includes a plurality of first pixels, and each of the first pixels includes a plurality of the sub-pixels 101 .
  • the display panel 100 further includes a plurality of second pixel units located in the main display area 100b, each of the second pixel units includes a plurality of second pixels, and each of the second pixels includes a plurality of the second pixel units.
  • Main sub-pixel 107 The number and arrangement of the main sub-pixels 107 included in the second pixel are the same as the number and arrangement of the sub-pixels 101 included in the first pixel.
  • the display panel 100 further includes a plurality of third pixel units located in the transition display area 100c, each of the third pixel units includes a plurality of third pixels, and each of the third pixels includes a plurality of third pixels.
  • a plurality of the transition sub-pixels are included.
  • the number and arrangement of the transition region sub-pixels included in the third pixel are the same as the number and arrangement of the sub-pixels 101 included in the first pixel.
  • the number and arrangement of sub-pixels with the same emission color in the first pixel, the second pixel and the third pixel are the same. Specifically, the difference between the main sub-pixel that emits red light in the second pixel, the transition region sub-pixel that emits red light in the third pixel, and the sub-pixel that emits red light in the first pixel The number and arrangement are the same. Similarly, the arrangement of the sub-pixels emitting light of other colors in the corresponding pixels can be obtained, which will not be repeated here.
  • the emission colors of the plurality of sub-pixels 101 , the plurality of transition sub-pixels and the plurality of main sub-pixels 107 include red, green, blue, white, and the like.
  • the display panel 100 further includes: a first wiring layer 1081 located under the first electrode layer 103 , and the first wiring layer 1081 is electrically connected to the first wiring layer 1081 .
  • the plurality of sub-pixels 101 and the sub-pixel driving circuit 1021 are electrically connected through the first wiring layer 1081 and the second wiring layer 1082 arranged in layers, so that the The light transmission area of the display light transmission area 100a is displayed, and the light transmittance of the display light transmission area 100a is improved.
  • the first wiring layer 1081 can be electrically connected to the first sub-electrode layer 1031 through the first sub-electrode layer 1031 and the wiring between the first sub-electrode layers 1031
  • the portion 1032 realizes the electrical connection between the plurality of the first sub-electrode layers 1031 and the first wiring layer 1081 .
  • the first wiring layer 1081 can also be electrically connected to the wiring portion 1032 , so as to realize a plurality of the first sub-electrode layers 1031 and the first wiring layer through the wiring portion 1032 1081 electrical connection.
  • the display panel 100 can only set the first wiring layer 1081 to electrically connect the sub-pixel driving circuit 1021 and the sub-pixels 101, as shown in FIG. 1C .
  • the display panel 100 may include a plurality of wirings 108 , and the wirings 108 include the first wiring layer 1081 and the second wiring layer 1082 for electrically connecting all wirings.
  • the sub-pixel 101 and the sub-pixel driving circuit 1021 are not limited to the wiring space.
  • the second pixel unit and the third pixel unit may also include the first sub-electrode layer 1031 and the electrode portion 200, which are located between the main display area 100b and the transition display area 100c.
  • the structures of the first sub-electrode layer 1031 and the electrode portion 200 can be designed with reference to the structure of the display light-transmitting region 100a, that is, each of the main pixels 107 includes a first main electrode, and the first main electrode includes all the The first sub-electrode layer 1031 and the electrode portion 200 located on the first sub-electrode layer 1031 and electrically connected to the first sub-electrode layer 1031 .
  • each of the transition sub-pixels includes a first transition electrode
  • the first transition electrode includes the first sub-electrode layer 1031 and the first sub-electrode layer 1031 and the first sub-electrode layer 1031 and the first transition electrode.
  • a sub-electrode layer 1031 is electrically connected to the electrode portion 200 .
  • the main display area 100b further includes a third wiring layer 1083 , and the third wiring layer 1083 is electrically connected to the main sub-pixel 107 and the main pixel driving circuit 1022 .
  • the preparation material of the third wiring layer 1083 can be the same as that of the first wiring layer 1081 and all the The materials for preparing the second wiring layer 1082 are different. That is, the light transmittance of the third wiring layer 1083 may be less than or equal to the light transmittance of the first wiring layer 1081 and the second wiring layer 1082 .
  • the preparation materials of the third wiring layer 1083 may include metal materials (such as Ag, Cu, etc.), transparent conductive oxides (such as ITO, etc.), the first wiring layer 1081 and the second wiring layer 1081
  • the preparation material of the wire layer 1082 includes transparent conductive oxide.
  • the display panel further includes a substrate 110, and the substrate 110 includes a rigid substrate and a flexible substrate; further, the preparation material of the substrate 110 includes glass, quartz, ceramic, plastic or polymer resin etc.; polymer resins include polyethersulfone, polyacrylate, polyarylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyolefin At least one of propyl ester, polyimide, polycarbonate, cellulose triacetate, and cellulose acetate propionate.
  • the auxiliary pixel driving circuit 1021 and the main pixel driving circuit 1022 are located on the substrate 110 , and the auxiliary pixel driving circuit 1021 and the main pixel driving circuit 1022 include a plurality of transistors. Further, the plurality of transistors include field effect transistors; specifically, the plurality of transistors include thin film transistors. The plurality of transistors include at least one of oxide transistors and silicon transistors.
  • the display panel 100 further includes: a pixel definition layer 109 located on the electrode part 200 and the wiring part 1032; a light emitting layer 1063 located in the pixel definition area of the pixel definition layer 109; a second electrode 1064, on the light emitting layer 1063 and the pixel definition layer 109 .
  • each of the sub-pixels 101 includes the first electrode, the light-emitting layer 1063 and the second electrode 1064 .
  • the pixel definition layer 109 is located on the first part 104 , the second part 105 and the wiring part 1032 ;
  • the first sub-pixel 1011 includes the first sub-electrode 1061 , the The light-emitting layer 1063 and the second electrode 1064,
  • the second sub-pixel 1012 includes the second sub-electrode 1062, the light-emitting layer 1063 and the second electrode 1064.
  • the light-emitting layer 1063 further includes at least one of fluorescent materials, quantum dot materials, perovskite materials, and the like.
  • the sub-pixels 101 include at least one of organic light emitting diodes, micro light emitting diodes and sub-millimeter light emitting diodes.
  • the display panel 100 further includes an insulating layer 111, and the insulating layer 111 is located between the first wiring layer 1081 and the second wiring layer 1082 and between the first wiring layer 1081 and the second wiring layer 1082. Between an electrode layer 103 , the first electrode layer 103 , the first wiring layer 1081 and the second wiring layer 1082 are spaced apart.
  • the display panel 100 further includes parts that are not shown, such as an encapsulation layer, a buffer layer, and a color filter layer.
  • FIGS. 3A to 3C are flowcharts of manufacturing a display panel according to an embodiment of the present application
  • FIGS. 4A to 4G are schematic diagrams of a process of manufacturing a display panel provided by an embodiment of the present application.
  • An embodiment of the present application further provides a method for manufacturing a display panel, the display panel includes a display light-transmitting area 100a and a main display area located at the periphery of the display light-transmitting area 100a, and the display light-transmitting area 100a includes a plurality of pixels unit, the preparation method comprises the following steps:
  • Step S10 providing a substrate 300, the substrate 300 including the auxiliary pixel driving circuit 1021, as shown in FIG. 4A ;
  • Step S20 preparing the first electrode layer 103 and the electrode portion 200 in the display light-transmitting area 100a;
  • the electrode part 200 is located on the first electrode layer 103 , the electrode part 200 is electrically connected to the first electrode layer 103 , and the electrode part 200 and the first electrode layer 103 constitute the For the first electrode of the pixel unit, the orthographic projection of the electrode portion 200 on the first electrode layer 103 is located within the boundary of the first electrode layer 103 .
  • the first electrode includes a plurality of sub-electrodes; the first electrode layer 103 includes a plurality of first sub-electrode layers 1031 and a plurality of wiring parts 1032 located between the first sub-electrode layers 1031;
  • the electrode portion 200 includes a plurality of first sub-electrode portions corresponding to the plurality of first sub-electrode layers 1031 one-to-one.
  • the step S20 further includes:
  • Step S21 preparing a first conductive layer 301 on the surface of the substrate 300 and a second conductive layer 302 on the first conductive layer 301;
  • Step S22 providing a first mask 303, patterning the second conductive layer 302 and the first conductive layer 301 to obtain the wiring portion 1032;
  • Step S23 providing a second mask 304 , patterning the second conductive layer 302 to prepare the first sub-electrode portion and the first sub-electrode layer 1031 ; wherein, each of the wiring portions 1032 is connected to at least two of the sub-electrodes, each of the first sub-electrode layers 1031 is electrically connected to the corresponding first sub-electrode portion to form the sub-electrode, and the first sub-electrode portion is in the first sub-electrode.
  • the orthographic projection on a sub-electrode layer 1031 is located within the boundary of the first sub-electrode layer 1031 .
  • each of the pixel units includes a plurality of sub-pixels 101, the plurality of the sub-pixels 101 includes a first sub-pixel 1011 and a second sub-pixel 1012, and the plurality of the sub-electrodes include The first sub-electrode and the second sub-electrode, the plurality of first sub-electrode parts include a first part 104 and a second part 105 .
  • the first sub-pixel 1011 includes the first sub-electrode
  • the second sub-pixel includes the second sub-electrode.
  • the first sub-electrode of the first sub-pixel 1011 is electrically connected to the first sub-electrode layer 1031 of the sub-pixel driving circuit 1021, located on the first sub-electrode layer 1031 and connected to the first sub-electrode
  • the first part 104 electrically connected to the layer 1031 is formed;
  • the second sub-electrode of the second sub-pixel 1012 is formed by the first sub-electrode layer 1031, located on the first sub-electrode layer 1031 and connected to the first sub-electrode layer 1031.
  • the second part 105 to which the sub-electrode layer 1031 is electrically connected is formed, the first part 104 and the second part 105 are arranged at intervals, and in a top view, the first part 104 and the second part 105 are respectively located at inside the first sub-electrode layer 1031 .
  • the step S20 further includes:
  • Step S21 preparing a first conductive layer 301 and a second conductive layer 302 on the first conductive layer 301 on the substrate 300;
  • Step S22 providing a first mask 303 , patterning the second conductive layer 302 and the first conductive layer 301 to obtain the wiring portion 1032 , as shown in FIGS. 4B to 4C ;
  • Step S23 providing a second mask 304 , patterning the second conductive layer 302 to prepare the first part 104 , the second part 105 and the first sub-electrode layer 1031 , as shown in FIG. 4D 4F; wherein, the first part 104 and the second part 105 are located on the two first sub-electrode layers 1031, in the top view, the first part 104 and the The second portions 105 are respectively located in the corresponding first sub-electrode layers 1031 .
  • the patterning of the second conductive layer 302 and the first conductive layer 301 adopts a yellow light process, that is, a first photoresist layer is formed on the second conductive layer 302, and then the first photomask 303 is used to After the second conductive layer 302 and the first conductive layer 301 are exposed and developed, the second conductive layer 302 and the first conductive layer 301 are etched to form the wiring portion 1032; After the second conductive layer 302 and the first conductive layer 301 are exposed and developed by the second mask 304, the second conductive layer 302 and the first conductive layer 201 are etched A plurality of the first sub-electrode parts (eg, the first part 104, the second part 105) and a plurality of the first sub-electrode layers 1031 corresponding to the plurality of the first sub-electrode parts are formed.
  • the first sub-electrode portion and the first sub-electrode layer 103 are prepared by using two masks, two exposures, and two-
  • step S20 further includes:
  • Step S21 preparing a first conductive layer 301 on the surface of the substrate 300 and a second conductive layer 302 on the first conductive layer 301;
  • Step S22 providing a first mask 303, patterning the second conductive layer 302 to obtain the first sub-electrode portion;
  • Step S23 providing a second mask 304 , patterning the first conductive layer 301 to prepare the wiring portion 1032 and the first sub-electrode layer 1031 ; wherein, each wiring portion 1032 At least two of the sub-electrodes are connected, and each of the first sub-electrode layers 1031 is electrically connected to the corresponding first sub-electrode portion to form the sub-electrode, and the first sub-electrode portion is in the first sub-electrode.
  • the orthographic projection on the sub-electrode layer 1031 is located within the boundary of the first sub-electrode layer 1031 .
  • the step S20 further includes:
  • Step S21 preparing a first conductive layer 301 on the surface of the substrate 300 and a second conductive layer 302 on the first conductive layer 301;
  • Step S22 providing a first mask 303 , as shown in FIG. 4B , patterning the second conductive layer 302 to prepare the first part 104 and the second part 105 ;
  • Step S23 providing a second mask 304, patterning the first conductive layer 301, and preparing the first sub-electrode layer 1031 and the wiring portion 1032, as shown in FIGS. 4E and 4F, wherein, The first part 104 and the second part 105 are located on the first sub-electrode layer 1031 , and in the top view, the first part 104 and the second part 105 are located at the corresponding positions respectively. inside the first sub-electrode layer 1031.
  • the first sub-electrode portion includes a reflective layer on the first sub-electrode layer 1031 and a transparent layer on the reflective layer, wherein the first electrode layer 103 and the transparent layer are The preparation materials are the same.
  • the first part 104 includes a first reflective layer 1041 on the first sub-electrode layer 1031 and a first transparent layer 1042 on the first reflective layer 1041;
  • the second part 105 includes a second reflective layer 1051 located on the first sub-electrode layer 1031 and a second transparent layer 1052 located on the second reflective layer 1051; wherein the first electrode layer 103 and the The materials for preparing the first transparent layer 1042 and the second transparent layer 1042 are the same.
  • the preparation material of the first electrode layer 103 includes transparent conductive oxide; the preparation material of the reflective layer includes one or more of Al, Ag, Ca, Au, and Cu.
  • the preparation materials of the first sub-electrode layer 1031 and the wiring portion 1032 include transparent conductive oxide; the preparation materials of the first reflection layer 1041 and the second reflection layer 1051 include Al, Ag, One or more of Ca, Au, and Cu.
  • a pixel definition layer 109 , a light emitting layer 1063 and a cathode layer 1064 are prepared on the first part 104 , the second part 105 and the first electrode layer 103 , and the light emitting layer 1063 is located in the pixel definition
  • the first sub-pixel 1011 includes the first sub-electrode
  • the second sub-pixel 1012 includes the second sub-electrode, the light emitting layer 1063 and the cathode layer 1064.
  • the substrate 300 includes a substrate 110 , and the auxiliary pixel driving circuit 1021 is located on the substrate 110 .
  • the display panel further includes a first wiring layer 1081 and a second wiring layer 1082 prepared between the first electrode layer 103 and the sub-pixel driving circuit 1021 .
  • the second wiring layer 1082 is used to electrically connect the sub-pixel driving circuit 1021 and the sub-pixel 101 .
  • the display panel further includes a structure formed between the first wiring layer 1081 and the second wiring layer 1082 and between the first wiring layer 1081 and the first electrode layer 103
  • the insulating layer 111 is disposed between, and the first wiring layer 1081 is electrically connected to the second wiring layer 1082 and the first electrode layer 103 through via holes on the insulating layer 111 .
  • the display panel further includes a transition display area 100c located between the display light-transmitting area 100a and the main display area 100b, and the auxiliary pixel driving circuit 1021 The light transmittance of the display light-transmitting region 100a is affected.
  • An embodiment of the present application further provides a display device, including any of the above-mentioned display panels and sensors, wherein the sensor is facing the display light-transmitting area, so that the display device can realize fingerprint recognition, imaging, light sensing, Distance sensing and other functions.
  • the senor includes a fingerprint recognition sensor, a camera, a structured light sensor, a time-of-flight sensor, a distance sensor, a light sensor, etc., so that the sensor can collect signals through the display light-transmitting area, thereby enabling the display device Realize off-screen sensing solutions such as off-screen fingerprint recognition, off-screen camera, off-screen face recognition, and off-screen distance perception.
  • the display device further includes a touch panel, and the touch panel is combined with the display panel in a built-in or externally mounted manner, so that the display device has a touch function.
  • the display device includes fixed terminals such as televisions and desktop computers, mobile terminals such as mobile phones and notebook computers, and wearable devices such as wristbands, VR (virtual display) devices, and AR (augmented display) devices.
  • fixed terminals such as televisions and desktop computers
  • mobile terminals such as mobile phones and notebook computers
  • wearable devices such as wristbands, VR (virtual display) devices, and AR (augmented display) devices.

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Abstract

一种显示面板(100)及显示装置，显示面板(100)包括显示透光区(100a)，显示透光区(100a)包括多个像素单元，每一像素单元包括第一电极层(103)及与第一电极层(103)电性连接的电极部(200)，电极部(200)与第一电极层(103)构成像素单元的第一电极，电极部(200)在第一电极层(103)上的正投影位于第一电极层(103)的边界内，以在提高显示透光区(100a)透光率的同时，实现显示透光区(100a)的均一显示。

Description

显示面板及显示装置 技术领域
本申请涉及显示技术领域，特别涉及一种显示面板及一种显示装置。
 背景技术
为兼顾摄像头的成像效果及全面屏显示设计，在显示面板中采用屏下摄像头 (Camera Under Panel, CUP) 技术，使CUP区的像素密度小于显示区的像素密度，以提高显示面板在CUP区的透光率，但工艺精度会对CUP区内各像素产生影响，导致CUP区出现显示不均等问题。
 技术问题
本申请实施例提供一种显示面板及一种显示装置，可以在提高显示透光区透光率的同时，实现显示透光区的均一显示。
 技术解决方案
本申请实施例提供一种显示面板，包括显示透光区和主显示区，所述显示透光区包括多个像素单元，每一所述像素单元包括：第一电极层；电极部，位于所述第一电极层上，并电性连接于所述第一电极层，所述电极部与所述第一电极层构成所述像素单元的第一电极；其中，所述电极部在所述第一电极层上的正投影位于所述第一电极层的边界内。
在一些实施例中，所述第一电极包括多个子电极；所述第一电极层包括多个第一子电极层；所述电极部包括与多个所述第一子电极层一一对应的多个第一子电极部，每一所述第一子电极层与对应的所述第一子电极部电性连接构成所述子电极，所述第一子电极部在所述第一子电极层上的正投影位于所述第一子电极层的边界内。
在一些实施例中，所述第一电极层还包括位于所述第一子电极层之间的多个走线部，每一所述走线部连接至少两个所述子电极。
在一些实施例中，所述像素单元包括多个子像素，每一所述子像素包括所述子电极；其中，通过同一所述走线部连接的多个所述子电极位于同一所述像素单元内，通过同一所述走线部连接的多个所述子像素的发光颜色相同。
在一些实施例中，所述第一子电极部在所述第一子电极层上的正投影具有第二边界，所述第二边界与所述第一子电极层的边界之间的距离大于或等于0.5微米。
在一些实施例中，所述第二边界与所述第一子电极层的边界之间的距离等于0.8微米。
在一些实施例中，所述第一子电极部包括位于所述第一子电极层上的反射层和位于所述反射层上的透明层，其中，所述透明层在所述第一子电极层上的正投影位于所述的第一子电极层的边界内，所述反射层在所述透明层上的正投影位于所述透明层的边界内。
在一些实施例中，所述第一电极层与所述透明层的制备材料相同，所述第一电极层的制备材料包括透明导电氧化物；所述反射层的制备材料包括Al、Ag、Ca、Au、Cu中的一种或多种。
在一些实施例中，所述显示面板还包括位于所述显示透光区与所述主显示区之间的过渡显示区及位于所述过渡显示区内的辅像素驱动电路，所述第一电极层电性连接于所述辅像素驱动电路。
在一些实施例中，还包括：第一走线层，位于所述第一电极层下方，所述第一走线层电性连接于所述走线部；第二走线层，位于所述第一走线层下方，所述第二走线层电性连接于所述第一走线层和所述辅像素驱动电路之间。
在一些实施例中，所述主显示区包括多个第二像素单元，每一所述第二像素单元包括：第一主电极，主像素驱动电路，以及电性连接于所述第一主电极与所述主像素驱动电路的第三走线层；其中，所述第一主电极包括所述第一子电极层及所述电极部，所述第三走线层与所述第一走线层、所述第二走线层的制备材料不同。
在一些实施例中，所述第三走线层的制备材料包括金属材料，所述第一走线层、所述第二走线层的制备材料包括透明导电氧化物。
在一些实施例中，所述第三走线层的透光率小于或等于所述第一走线层、所述第二走线层的透光率
本申请实施例还提供一种显示装置，包括上述的任一显示面板及传感器，所述传感器正对所述显示透光区。
 有益效果
相较于现有技术，本申请实施例提供的显示面板及显示装置，所述显示面板包括显示透光区和主显示区，所述显示透光区包括多个像素单元，每一所述像素单元包括：第一电极层；电极部，位于所述第一电极层上，并电性连接于所述第一电极层，所述电极部与所述第一电极层构成所述像素单元的第一电极；其中，所述电极部在所述第一电极层上的正投影位于所述第一电极层的边界内，以在提高显示透光区透光率的同时，实现显示透光区的均一显示。
 附图说明
图1A为本申请的实施例提供的显示面板的结构示意图；
图1B为图1A中A处的局部放大图；
图1C~图1D为图1A中沿B-B’剖切的显示面板的结构示意图；
图2A~图2C为本申请的实施例提供的子像素的结构示意图；
图3A~图3C为本申请的实施例提供的显示面板的制备流程图；
图4A~图4G为本申请的实施例提供的制备显示面板的过程示意图。
 本发明的实施方式
为使本申请的目的、技术方案及效果更加清楚、明确，以下参照附图并举实施例对本申请进一步详细说明。应当理解，此处所描述的具体实施例仅用以解释本申请，并不用于限定本申请。
具体地，请参阅图1A，其为本申请的实施例提供的显示面板的结构示意图；如图1B所示，其为图1A中A处的局部放大图；如图1C~图1D所示，其为图1A中沿B-B’剖切的显示面板的结构示意图；如图2A~图2C所示，其为本申请的实施例提供的子像素的结构示意图。
本申请实施例提供一种显示面板100，包括显示透光区100a和位于所述显示透光区100a外围的主显示区100b以及位于所述显示透光区100a及所述主显示区100b之间的过渡显示区100c。
所述显示面板100包括：位于所述显示透光区100a的多个像素单元，每一所述像素单元包括多个子像素101；位于所述过渡显示区100c的过渡区子像素和驱动所述子像素101、所述过渡区子像素发光的辅像素驱动电路1021；以及位于所述主显示区100b的主子像素107和驱动所述主子像素107发光的主像素驱动电路1022。
其中，每一所述像素单元包括：第一电极层103，电性连接于所述辅像素驱动电路1021；电极部200，位于所述第一电极层103上，并电性连接于所述第一电极层103，所述电极部200与所述第一电极层103构成所述像素单元的第一电极；所述电极部200在所述第一电极层103上的正投影位于所述第一电极层103的边界内，以提高所述显示透光区100a的透光率，并通过所述第一电极层103保证所述第一电极的结构的完整性，实现所述显示面板100在所述显示透光区100a的均一显示。
进一步地，所述第一电极包括多个子电极；所述第一电极层103包括多个第一子电极层1031；所述电极部200包括与多个所述第一子电极层1031一一对应的多个第一子电极部，每一所述第一子电极层1031与对应的所述第一子电极部电性连接构成所述子电极，所述第一子电极部在所述第一子电极层1031上的正投影位于所述第一子电极层1031的边界内。
具体地，请参阅图1C~图1D及图2A~图2C，多个所述子像素101包括第一子像素1011和第二子像素1012，多个所述子电极包括第一子电极1061和第二子电极1062。其中，所述第一子像素1011包括所述第一子电极1061，所述第二子像素1012包括所述第二子电极1062。多个所述第一子电极部包括第一部104和与所述第一部104间隔设置的第二部105，所述第一部104与所述第二部105分别位于所述第一子电极层1031上，并分别电性连接于所述第一子电极层1031，所述第一部104与所述第一子电极层1031构成所述第一子像素1011的所述第一子电极1061，所述第二部105与所述第一子电极层103构成所述第二子像素1012的所述第二子电极1062，所述第一部104和所述第二部105在所述第一子电极层1031的正投影分别位于所述第一子电极层1031的边界内，以提高所述显示透光区100a的透光率，并通过所述第一子电极层1031保证所述第一子像素1011的所述第一子电极1061及所述第二子像素1012的所述第二子电极1062的结构的完整性，实现所述显示面板100在所述显示透光区100a的均一显示。
进一步地，所述第一电极层103还包括位于所述第一子电极层1031之间的多个走线部1032，每一所述走线部1032连接至少两个所述第一子电极层1031，从而使所述每一所述走线部1032连接于至少两个所述子电极。
具体地，请继续参阅图1C~图1D及图2A~图2C，所述第一部104和所述第二部105位于所述第一子电极层1031上且分别与所述第一子电极层1031电性连接，在所述俯视视角下，所述第一部104和所述第二部105分别位于对应的所述第一子电极层1031内，所述走线部1032电性连接所述第一部104和所述第二部105，从而使所述走线部1032连接于所述第一子电极1061和所述第二子电极1062。
进一步地，所述辅像素驱动电路1021通过所述走线部1032及所述第一子电极层1031同时与第一部104和所述第二部105电性连接，驱动所述第一子像素1011和所述第二子像素1012发光的驱动电流经所述走线部1032传输至所述第一子电极1061和所述第二子电极1062，使得所述辅像素驱动电路1021可通过所述第一电极层103驱动至少两个所述子像素101发光，从而降低了所述辅像素驱动电路1021的数量，增大了所述显示透光区100a的面积，有利于提高所述显示透光区100a的透光率及显示质量。
进一步地，所述辅像素驱动电路1021驱动的至少两个所述子像素101的发光颜色相同。即通过同一所述走线部1032连接的多个所述子像素101的发光颜色相同，以利用一所述辅像素驱动电路1021驱动至少两个发光颜色相同的所述子像素101发光，降低所述走线部1032的布线数量。
具体地，请继续参阅图2A~图2C，所述第一子像素1011和所述第二子像素1012的发光颜色相同，所述第一子像素1011与所述第二子像素1012通过所述第一电极层103与同一所述辅像素驱动电路1021电性连接。
可以理解的，位于所述显示透光区100a内的多个所述子像素101均可采用与所述第一子像素1011、所述第二子像素1012相同的方式与所述辅像素驱动电路1021电性连接，以降低对所述显示透光区100a透光率的影响；即位于所述显示透光区100a内的多个所述子像素101中的至少两个子像素可通过所述第一电极层103与所述辅像素驱动电路1021电性连接，且连接同一所述辅像素驱动电路1021的至少两所述子像素101的发光颜色相同。
进一步地，通过同一所述走线部1032连接的多个所述子电极位于同一所述像素单元内，以使同一所述像素单元内的多个所述子像素101受所述辅像素驱动电路1021的驱动同时发光。
具体地，如图2A~图2C所示，多个所述子像素101还包括第三子像素1013和第四子像素1014，每一所述像素单元包括所述第一子像素1011、所述第二子像素1012、所述第三子像素1013，所述第四子像素1014，若所述第一子像素1011与所述第二子像素1012的发光颜色相同，所述第一子像素1011与所述第三子像素1013、所述第四子像素1014的发光颜色相异，则所述第一子像素1011和所述第二子像素1012电性连接于同一所述辅像素驱动电路1021，至少两所述第三子像素1013电性连接于同一所述辅像素驱动电路1021，至少两所述第四子像素1014电性连接于同一所述辅像素驱动电路1021。若所述第一子像素1011与所述第二子像素1012相异，则至少两所述第一子像素1011电性连接于同一所述辅像素驱动电路1021，至少两所述第二子像素1012电性连接于同一所述辅像素驱动电路1021。
可以理解的，本申请中的所述子像素101的形状不限于矩形、还可以为圆形、菱形、多边形、椭圆形等中的一种及其组合；所述显示面板100中可包括多个所述显示透光区100a，在此不再进行赘述。
请继续参阅图2A~图2C，所述第一子电极部在所述第一子电极层1031上的正投影具有第二边界101a，所述第二边界101a与所述第一子电极层1031的边界103a之间的距离大于或等于0.5微米。
具体地，每一所述第一子电极层1031具有第一边界103a，所述第一部104和/或所述第二部105具有第二边界101a，每一所述第一边界103a与对应的所述第二边界101a之间的距离大于或等于0.5微米，以在俯视视角下使所述第一部104、所述第二部105位于所述第一子电极层1031内，保证所述第一子电极1061及所述第二子电极1062的结构的完整性。
进一步地，所述第一边界103a与所述第二边界101a之间的距离等于0.8微米，可在保证所述第一子电极1061及所述第二子电极1062结构完整性的同时，降低所述第一子电极层1031对所述显示透光区100a的影响。
更进一步地，所述第一边界103a与所述第二边界101a之间的距离根据所述子像素的开口(即发光层1063的有效面积)101b的尺寸确定；具体地，请参阅图2A，所述第一子电极层1031具有第一边1031a、第二边1031b、第三边1031c及第四边1031d；所述第一子电极部在所述第一子电极层1031上的正投影具有第五边200a、第六边200b、第七边200c、第八边200d；所述子像素101的开口101b在所述第一子电极层1031上的正投影具有第九边201a、第十边201b、第十一边201c、第十二边201d。其中，所述第一边1031a与所述第二边1031b、所述第四边1031d相邻，所述第一边1031a与所述第三边1031c相对；所述第五边200a为所述第一子电极部靠近所述第一边1031a的边，所述第六边200b为所述第一子电极部靠近所述第二边1031b的边，所述第七边200c与所述第五边200a相对，所述第八边200d与所述第六边200b相对；所述第九边201a为所述开口101b靠近所述第一边1031a的边，所述第十边201b为所述开口101b靠近所述第二边1031b的边，所述第十一边201c与所述第一边1031a相对，所述第十二边201d与所述第二边1031b相对。
所述第一边1031a与所述第五边200a之间的距离可小于或等于所述第十一边201c与所述第九边201a之间的距离的1/2倍；进一步地，所述第二边1031b与所述第六边200b之间的距离可小于或等于所述第十边201b与所述第十二边201d之间的距离的1/2倍，以避免所述第一子电极层1031的尺寸过大，占用所述走线部1032的布线空间。
可以理解的，所述第一边1031a与所述第五边200a之间的距离可以等于所述第二边1031b与所述第六边200b之间的距离，所述第二边1031b与所述第六边200b之间的距离可以不等于所述第三边1031c与所述第七边200c之间的距离，在此不再进行赘述。
为改善所述第一电极的电学和光学性能，所述第一子电极部包括位于所述第一子电极层1031上的反射层和位于所述反射层上的透明层，其中，所述透明层在所述第一子电极层1031上的正投影位于所述的第一子电极层1031的边界内，所述反射层在所述透明层上的正投影位于所述透明层的边界内。此外，所述反射层在所述透明层上的正投影可以与所述透明层重合，在此不再进行赘述。
具体地，请继续参阅图1C~图1D及图2A~图2C，所述第一部104包括位于所述第一子电极层1031上的第一反射层1041和位于所述第一反射层1041上的第一透明层1042；所述第二部105包括位于所述第一子电极层1031上的第二反射层1051和位于所述第二反射层1051上的第二透明层1052，其中，所述第一反射层1041和所述第一透明层1042与所述第一子电极层1031构成所述第一子像素1011的所述第一子电极1061，所述第二反射层1051和所述第二透明层1052与所述第一子电极层1031构成所述第二子像素1012的所述第二子电极1062，在俯视视角下，所述第一反射层1041和所述第一透明层1042，以及所述第二反射层1051和所述第二透明层1052均位于所述第一子电极层103内，所述第一反射层1041在所述第一透明层1042上的正投影位于所述第一透明层1042的边界内，所述第二反射层1051在所述第二透明层1052上的正投影位于所述第二透明层1052的边界内。
进一步地，所述第一电极层103的制备材料与所述透明层的制备材料相同。具体地，所述第一电极层103的制备材料与所述第一透明层1042、所述第二透明层1052的制备材料相同。所述第一电极层103的制备材料包括透明导电氧化物；其中，所述透明导电氧化物包括氧化铟锡、氧化锌铟、氧化锌镓、氧化锌镓铟等。所述第一反射层1041和所述第二反射层1051的制备材料包括Al、Ag、Ca、Au、Cu中的一种，以改善所述显示透光区100a的光学性能，提高所述显示透光区100a的透光率。
请继续参阅图1A~图1D和图2A~图2C，多个所述主子像素107的分布密度与多个子像素101的分布密度相同，每一所述主子像素107的开口面积大于对应的所述子像素101的开口101b的面积，以使所述显示透光区100a兼顾透光率及显示功能的同时，降低所述显示透光区100a与所述主显示区100b的显示差异。
进一步地，每一所述像素单元包括多个第一像素，每一所述第一像素包括多个所述子像素101。所述显示面板100还包括位于所述主显示区100b的多个第二像素单元，每一所述第二像素单元包括多个第二像素，每一所述第二像素内包括多个所述主子像素107。其中，所述第二像素内包括的所述主子像素107的个数及排列方式与所述第一像素内包括的所述子像素101的个数及排列方式相同。
与之相似的，所述显示面板100还包括位于所述过渡显示区100c的多个第三像素单元，每一所述第三像素单元包括多个第三像素，每一所述第三像素内包括多个所述过渡区子像素。其中，所述第三像素内包括的所述过渡区子像素的个数及排列方式与所述第一像素内包括的所述子像素101的个数及排列方式相同。
进一步地，所述第一像素、所述第二像素及所述第三像素中发光颜色相同的子像素的个数、排列形式相同。具体地，所述第二像素中发出红光的所述主子像素、所述第三像素中发出红光的所述过渡区子像素与所述第一像素中发出红光的所述子像素的个数、排列形式相同。与之相同的，可得到发出其他颜色的光的子像素在对应像素中的设置，在此不再进行赘述。其中，多个所述子像素101、多个所述过渡区子像素及多个所述主子像素107的发光颜色包括红色、绿色、蓝色、白色等。
请继续参阅图1B~图1D，所述显示面板100还包括：第一走线层1081，位于所述第一电极层103下方，所述第一走线层1081电性连接于所述第一电极层103；第二走线层1082，位于所述第一走线层1081下方，所述第二走线层1082电性连接于所述第一走线层1082和所述辅像素驱动电路1021之间，通过分层设置的所述第一走线层1081和所述第二走线层1082将多个所述子像素101与所述辅像素驱动电路1021电性连接，可以增大所述显示透光区100a的透光面积，提高所述显示透光区100a的透光率。其中，所述第一走线层1081可与所述第一子电极层1031电性连接，通过所述第一子电极层1031及位于所述第一子电极层1031之间的所述走线部1032实现多个所述第一子电极层1031与所述第一走线层1081的电性连接。此外，所述第一走线层1081也可与所述走线部1032电性连接，以通过所述走线部1032实现多个所述第一子电极层1031与所述第一走线层1081的电性连接。
可以理解的，在布线空间允许的情况下，所述显示面板100可仅设置所述第一走线层1081电性连接所述辅像素驱动电路1021和所述子像素101，如图1C所示。请继续参阅图1B，所述显示面板100可以包括多条走线108，所述走线108包括所述第一走线层1081和所述第二走线层1082，以用于电性连接所述子像素101与所述辅像素驱动电路1021。
可以理解的，所述第二像素单元及所述第三像素单元也可以包括所述第一子电极层1031及所述电极部200，位于所述主显示区100b及所述过渡显示区100c的所述第一子电极层1031和所述电极部200的结构可参照显示透光区100a的结构进行设计，即每一所述主像素107包括第一主电极，所述第一主电极包括所述第一子电极层1031和位于所述第一子电极层1031上且与所述第一子电极层1031电性连接的所述电极部200。与之相似地，每一所述过渡区子像素包括第一过渡电极，所述第一过渡电极包括所述第一子电极层1031和位于所述第一子电极层1031上且与所述第一子电极层1031电性连接的所述电极部200。
进一步地，所述主显示区100b还包括第三走线层1083，所述第三走线层1083电性连接于所述主子像素107及所述主像素驱动电路1022。由于所述主显示区100b相对于所述显示透光区100a具有较低的透光率要求，因此，所述第三走线层1083的制备材料可与所述第一走线层1081和所述第二走线层1082的制备材料不同。即所述第三走线层1083的透光率可小于或等于所述第一走线层1081、所述第二走线层1082的透光率。具体地，所述第三走线层1083的制备材料可包括金属材料(如Ag、Cu等)、透明导电氧化物(如ITO等)，所述第一走线层1081和所述第二走线层1082的制备材料包括透明导电氧化物。
进一步地，所述显示面板还包括衬底110，所述衬底110包括刚性衬底和柔性衬底；进一步地，所述衬底110的制备材料包括玻璃、石英、陶瓷、塑料或聚合物树脂等；聚合物树脂包括聚醚砜、聚丙烯酸酯、聚芳酯、聚醚酰亚胺、聚萘二甲酸乙二醇酯、聚对苯二甲酸乙二醇酯、聚苯硫醚、聚烯丙基酯、聚酰亚胺、聚碳酸酯、三乙酸纤维素、醋酸丙酸纤维素中的至少一种。
所述辅像素驱动电路1021及所述主像素驱动电路1022位于所述衬底110上，所述辅像素驱动电路1021及所述主像素驱动电路1022包括多个晶体管。进一步地，多个所述晶体管包括场效应晶体管；具体地，多个所述晶体管包括薄膜晶体管。多个所述晶体管包括氧化物晶体管、硅晶体管中的至少一种。
所述显示面板100还包括：像素定义层109，位于所述电极部200及所述走线部1032上；发光层1063，位于所述像素定义层109的像素定义区内；第二电极1064，位于所述发光层1063及所述像素定义层109上。其中，每一所述子像素101包括所述第一电极、所述发光层1063及所述第二电极1064。具体地，所述像素定义层109位于所述第一部104、所述第二部105及所述走线部1032上；所述第一子像素1011包括所述第一子电极1061、所述发光层1063和所述第二电极1064，所述第二子像素1012包括所述第二子电极1062、所述发光层1063和所述第二电极1064。
进一步地，所述发光层1063还包括荧光材料、量子点材料、钙钛矿材料等中的至少一种。所述子像素101包括有机发光二极管、微型发光二极管及次毫米发光二极管中的至少一种。
进一步地，所述显示面板100还包括绝缘层111，所述绝缘层111位于所述第一走线层1081与所述第二走线层1082之间以及所述第一走线层1081与第一电极层103之间，以间隔所述第一电极层103、所述第一走线层1081和所述第二走线层1082。
此外，所述显示面板100还包括封装层、缓冲层、彩膜层等未示出部分。
请继续参阅图3A~图3C，其为本申请的实施例提供的显示面板的制备流程图；如图4A~图4G，其为本申请的实施例提供的制备显示面板的过程示意图。
本申请实施例还提供一种显示面板的制备方法，所述显示面板包括显示透光区100a和位于所述显示透光区100a外围的主显示区，所述显示透光区100a包括多个像素单元，所述制备方法包括以下步骤：
步骤S10：提供基板300，所述基板300包括辅像素驱动电路1021，如图4A所示；
步骤S20：在所述显示透光区100a制备第一电极层103及电极部200；
其中，所述电极部200位于所述第一电极层103上，所述电极部200电性连接于所述第一电极层103，所述电极部200与所述第一电极层103构成所述像素单元的第一电极，所述电极部200在所述第一电极层103上的正投影位于所述第一电极层103的边界内。
进一步地，所述第一电极包括多个子电极；所述第一电极层103包括多个第一子电极层1031及位于所述第一子电极层1031之间的多个走线部1032；所述电极部200包括与多个所述第一子电极层1031一一对应的多个第一子电极部。所述步骤S20还包括：
步骤S21：在所述基板300表面制备第一导电层301和位于所述第一导电层301上的第二导电层302；
步骤S22：提供第一光罩303，对所述第二导电层302和所述第一导电层301进行图案化，得到所述走线部1032；
步骤S23：提供第二光罩304，对所述第二导电层302进行图案化，制备得到所述第一子电极部及所述第一子电极层1031；其中，每一所述走线部1032连接至少两个所述子电极，每一所述第一子电极层1031与对应的所述第一子电极部电性连接构成所述子电极，所述第一子电极部在所述第一子电极层1031上的正投影位于所述第一子电极层1031的边界内。
具体地，请参阅图4A~图4G，每一所述像素单元包括多个子像素101，多个所述子像素101包括第一子像素1011和第二子像素1012，多个所述子电极包括第一子电极和第二子电极，多个所述第一子电极部包括第一部104和第二部105。其中，所述第一子像素1011包括所述第一子电极，所述第二子像素包括所述第二子电极。所述第一子像素1011的第一子电极由电性连接于所述辅像素驱动电路1021的第一子电极层1031、位于所述第一子电极层1031上且与所述第一子电极层1031电性连接的第一部104形成；所述第二子像素1012的第二子电极由所述第一子电极层1031、位于所述第一子电极层1031上且与所述第一子电极层1031电性连接的第二部105形成，所述第一部104和所述第二部105间隔设置，在俯视视角下，所述第一部104和所述第二部105分别位于所述第一子电极层1031内。请继续参阅图4B~图4D和图4F，所述步骤S20还包括：
步骤S21：在所述基板300上制备第一导电层301和位于所述第一导电层301上的第二导电层302；
步骤S22：提供第一光罩303，对所述第二导电层302和所述第一导电层301进行图案化，得到所述走线部1032，如图4B~图4C所示；
步骤S23：提供第二光罩304，对所述第二导电层302进行图案化，制备得到所述第一部104、所述第二部105及所述第一子电极层1031，如图4D和图4F所示；其中，所述第一部104和所述第二部105位于两个所述第一子电极层1031上，在所述俯视视角下，所述第一部104和所述第二部105分别位于对应的所述第一子电极层1031内。
所述第二导电层302和所述第一导电层301的图案化采用黄光工艺，即在所述第二导电层302上形成第一光阻层，然后利用所述第一光罩303对所述第二导电层302及所述第一导电层301进行曝光显影处理后，对所述第二导电层302和所述第一导电层301进行刻蚀处理形成所述走线部1032；之后利用所述第二光罩304对所述第二导电层302及所述第一导电层301进行曝光显影处理后，对所述第二导电层302和所述第一导电层201进行刻蚀处理形成多个所述第一子电极部(如所述第一部104、所述第二部105)和与多个所述第一子电极部对应的多个所述第一子电极层1031。通过采用两张光罩、两次曝光、两步刻蚀制备得到所述第一子电极部及所述第一子电极层103，节省了制程工序。
与之相似的，所述步骤S20还包括：
步骤S21：在所述基板300表面制备第一导电层301和位于所述第一导电层301上的第二导电层302；
步骤S22：提供第一光罩303，对所述第二导电层302进行图案化，得到所述第一子电极部；
步骤S23：提供第二光罩304，对所述第一导电层301进行图案化，制备得到所述走线部1032及所述第一子电极层1031；其中，每一所述走线部1032连接至少两个所述子电极，每一所述第一子电极层1031与对应的所述第一子电极部电性连接构成所述子电极，所述第一子电极部在所述第一子电极层1031上的正投影位于所述第一子电极层1031的边界内。
具体地，请继续参阅图4B和图4E~图4F，所述步骤S20还包括：
步骤S21：在所述基板300表面制备第一导电层301和位于所述第一导电层301上的第二导电层302；
步骤S22：提供第一光罩303，如图4B所示，对所述第二导电层302进行图案化，制备得到所述第一部104和所述第二部105；
步骤S23：提供第二光罩304，对所述第一导电层301进行图案化，制备得到所述第一子电极层1031和所述走线部1032，如图4E和4F所示，其中，所述第一部104和所述第二部105位于所述第一子电极层1031上，在所述俯视视角下，所述第一部104和所述第二部105位于分别位于对应的所述第一子电极层1031内。
进一步地，所述第一子电极部包括位于所述第一子电极层1031上的反射层和位于所述反射层上的透明层，其中，所述第一电极层103与所述透明层的制备材料相同。具体地，请继续参阅图4G，所述第一部104包括位于所述第一子电极层1031上的第一反射层1041和位于所述第一反射层1041上的第一透明层1042；所述第二部105包括位于所述第一子电极层1031上的第二反射层1051和位于所述第二反射层1051上的第二透明层1052；其中，所述第一电极层103与所述第一透明层1042、所述第二透明层1042的制备材料相同。
其中，所述第一电极层103的制备材料包括透明导电氧化物；所述反射层的制备材料包括Al、Ag、Ca、Au、Cu中的一种或多种。具体地，所述第一子电极层1031和所述走线部1032的制备材料包括透明导电氧化物；所述第一反射层1041和所述第二反射层1051的制备材料包括Al、Ag、Ca、Au、Cu中的一种或多种。
进一步地，在所述第一部104、所述第二部105及所述第一电极层103上制备像素定义层109、发光层1063及阴极层1064，所述发光层1063位于所述像素定义层109的像素定义区内，所述第一子像素1011包括所述第一子电极、所述发光层1063及所述阴极层1064，所述第二子像素1012包括所述第二子电极、所述发光层1063及所述阴极层1064。
请继续参阅图4A~图4G，所述基板300包括衬底110，所述辅像素驱动电路1021位于所述衬底110上。所述显示面板还包括制备于所述第一电极层103与所述辅像素驱动电路1021之间的第一走线层1081及第二走线层1082，所述第一走线层1081及所述第二走线层1082用于电性连接所述辅像素驱动电路1021及所述子像素101。
进一步地，所述显示面板还包括制备于所述第一走线层1081与所述第二走线层1082之间、制备于所述第一走线层1081与所述第一电极层103之间的绝缘层111，所述第一走线层1081通过所述绝缘层111上的过孔与所述第二走线层1082及所述第一电极层103电性连接。
所述显示面板还包括位于所述显示透光区100a与所述主显示区100b之间的过渡显示区100c，所述辅像素驱动电路1021位于所述过渡显示区100c内，以避免对所述显示透光区100a的透光率造成影响。
本申请实施例还提供一种显示装置，包括上述的任一种显示面板及传感器，所述传感器正对所述显示透光区，以使所述显示装置实现指纹识别、摄像、光线感测、距离感测等功能。
具体地，所述传感器包括指纹识别传感器、摄像头、结构光传感器、飞行时间传感器、距离传感器、光线传感器等，以使所述传感器可以通过所述显示透光区采集信号，从而使所述显示装置实现屏下指纹识别、屏下摄像头、屏下面部识别、屏下距离感知等屏下传感方案。
进一步地，所述显示装置还包括触控面板，所述触控面板以内置式或外挂式的方式与所述显示面板结合，以使所述显示装置具有触控功能。
所述显示装置包括固定终端如电视、台式电脑，移动终端如手机、笔记本电脑，以及可穿戴设备如手环、VR（虚拟显示）设备、AR（增强显示）设备。
在上述实施例中，对各个实施例的描述都各有侧重，某个实施例中没有详述的部分，可以参见其他实施例的相关描述。以上实施例的说明只是用于帮助理解本申请的技术方案及其核心思想；本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例的技术方案的范围。

Claims (19)

  1. 一种显示面板，包括显示透光区和主显示区，其中，所述显示透光区包括多个像素单元，每一所述像素单元包括：
    第一电极层；
    电极部，位于所述第一电极层上，并电性连接于所述第一电极层，所述电极部与所述第一电极层构成所述像素单元的第一电极；
    其中，所述电极部在所述第一电极层上的正投影位于所述第一电极层的边界内。
  2. 根据权利要求1所述的显示面板，其中，所述第一电极包括多个子电极；所述第一电极层包括多个第一子电极层；所述电极部包括与多个所述第一子电极层一一对应的多个第一子电极部，每一所述第一子电极层与对应的所述第一子电极部电性连接构成所述子电极，所述第一子电极部在所述第一子电极层上的正投影位于所述第一子电极层的边界内。
  3. 根据权利要求2所述的显示面板，其中，所述第一电极层还包括位于所述第一子电极层之间的多个走线部，每一所述走线部连接至少两个所述子电极。
  4. 根据权利要求3所述的显示面板，其中，所述像素单元包括多个子像素，每一所述子像素包括所述子电极；其中，通过同一所述走线部连接的多个所述子电极位于同一所述像素单元内，通过同一所述走线部连接的多个所述子像素的发光颜色相同。
  5. 根据权利要求2所述的显示面板，其中，所述第一子电极部在所述第一子电极层上的正投影具有第二边界，所述第二边界与所述第一子电极层的边界之间的距离大于或等于0.5微米。
  6. 根据权利要求5所述的显示面板，其中，所述第二边界与所述第一子电极层的边界之间的距离等于0.8微米。
  7. 根据权利要求2所述的显示面板，其中，所述第一子电极部包括位于所述第一子电极层上的反射层和位于所述反射层上的透明层，其中，所述透明层在所述第一子电极层上的正投影位于所述的第一子电极层的边界内，所述反射层在所述透明层上的正投影位于所述透明层的边界内。
  8. 根据权利要求7所述的显示面板，其中，所述第一电极层与所述透明层的制备材料相同，所述第一电极层的制备材料包括透明导电氧化物；所述反射层的制备材料包括Al、Ag、Ca、Au、Cu中的一种或多种。
  9. 根据权利要求3所述的显示面板，其中，所述显示面板还包括位于所述显示透光区与所述主显示区之间的过渡显示区及位于所述过渡显示区内的辅像素驱动电路，所述第一电极层电性连接于所述辅像素驱动电路。
  10. 根据权利要求9所述的显示面板，其中，还包括：
    第一走线层，位于所述第一电极层下方，所述第一走线层电性连接于所述走线部；
    第二走线层，位于所述第一走线层下方，所述第二走线层电性连接于所述第一走线层和所述辅像素驱动电路之间。
  11. 根据权利要求10所述的显示面板，其中，所述主显示区包括多个第二像素单元，每一所述第二像素单元包括：第一主电极，主像素驱动电路，以及电性连接于所述第一主电极与所述主像素驱动电路的第三走线层；其中，所述第一主电极包括所述第一子电极层及所述电极部，所述第三走线层与所述第一走线层、所述第二走线层的制备材料不同。
  12. 根据权利要求11所述的显示面板，其中，所述第三走线层的制备材料包括金属材料，所述第一走线层、所述第二走线层的制备材料包括透明导电氧化物。
  13. 根据权利要求11所述的显示面板，其中，所述第三走线层的透光率小于或等于所述第一走线层、所述第二走线层的透光率。
  14. 一种显示装置，其中，包括显示面板及传感器，所述显示面板包括显示透光区和主显示区，所述传感器正对所述显示透光区；所述显示透光区包括多个像素单元，每一所述像素单元包括第一电极层及电极部，所述电极部位于所述第一电极层上，并电性连接于所述第一电极层，所述电极部与所述第一电极层构成所述像素单元的第一电极；其中，所述电极部在所述第一电极层上的正投影位于所述第一电极层的边界内。
  15. 根据权利要求14所述的显示装置，其中，所述第一电极包括多个子电极；所述第一电极层包括多个第一子电极层；所述电极部包括与多个所述第一子电极层一一对应的多个第一子电极部，每一所述第一子电极层与对应的所述第一子电极部电性连接构成所述子电极，所述第一子电极部在所述第一子电极层上的正投影位于所述第一子电极层的边界内。
  16. 根据权利要求15所述的显示装置，其中，所述第一电极层还包括位于所述第一子电极层之间的多个走线部，每一所述走线部连接至少两个所述子电极。
  17. 根据权利要求16所述的显示装置，其中，所述像素单元包括多个子像素，每一所述子像素包括所述子电极；其中，通过同一所述走线部连接的多个所述子电极位于同一所述像素单元内，通过同一所述走线部连接的多个所述子像素的发光颜色相同。
  18. 根据权利要求15所述的显示装置，其中，所述第一子电极部在所述第一子电极层上的正投影具有第二边界，所述第二边界与所述第一子电极层的边界之间的距离大于或等于0.5微米。
  19. 根据权利要求14所述的显示装置，其中，所述传感器包括指纹识别传感器、摄像头、结构光传感器、飞行时间传感器、距离传感器、光线传感器。
PCT/CN2020/140400 2020-11-05 2020-12-28 显示面板及显示装置 Ceased WO2022095259A1 (zh)

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Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112909068A (zh) * 2021-03-25 2021-06-04 京东方科技集团股份有限公司 像素排布结构、显示面板及其制备方法
KR20220154313A (ko) * 2021-05-12 2022-11-22 삼성디스플레이 주식회사 표시장치 및 이의 제조방법
KR20230023869A (ko) * 2021-08-10 2023-02-20 삼성디스플레이 주식회사 디스플레이 장치
US20240090294A1 (en) * 2021-08-23 2024-03-14 Chengdu Boe Optoelectronics Technology Co., Ltd. Display substrate and display device
CN114281206A (zh) 2021-12-14 2022-04-05 武汉华星光电半导体显示技术有限公司 显示面板与移动终端
WO2023184163A1 (zh) * 2022-03-29 2023-10-05 京东方科技集团股份有限公司 显示基板及显示装置
JPWO2024147178A1 (zh) * 2023-01-05 2024-07-11

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110215330A1 (en) * 2005-11-02 2011-09-08 Hyun-Eok Shin Organic light-emitting display device and method of fabricating the same
CN108232028A (zh) * 2017-12-29 2018-06-29 信利（惠州）智能显示有限公司 有机发光显示装置及其制备方法
CN110288945A (zh) * 2019-06-28 2019-09-27 武汉天马微电子有限公司 显示面板及显示装置
CN110491918A (zh) * 2019-08-09 2019-11-22 武汉华星光电半导体显示技术有限公司 显示面板及显示装置
CN110534660A (zh) * 2019-08-30 2019-12-03 合肥鑫晟光电科技有限公司 一种显示基板及制备方法、显示装置
CN111146362A (zh) * 2019-12-31 2020-05-12 武汉天马微电子有限公司 一种显示面板及显示装置
CN111312755A (zh) * 2019-11-29 2020-06-19 昆山国显光电有限公司 显示面板及显示装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110767720B (zh) * 2019-06-05 2020-09-08 昆山国显光电有限公司 显示基板、显示面板及显示装置
CN110189639B (zh) * 2019-06-28 2020-12-04 昆山国显光电有限公司 显示基板、显示面板及显示装置
CN210129515U (zh) * 2019-08-30 2020-03-06 昆山国显光电有限公司 显示面板及显示装置
CN110783386B (zh) * 2019-10-29 2020-12-25 昆山国显光电有限公司 显示面板及显示装置
CN214043706U (zh) * 2020-11-05 2021-08-24 武汉华星光电半导体显示技术有限公司 显示面板及显示装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110215330A1 (en) * 2005-11-02 2011-09-08 Hyun-Eok Shin Organic light-emitting display device and method of fabricating the same
CN108232028A (zh) * 2017-12-29 2018-06-29 信利（惠州）智能显示有限公司 有机发光显示装置及其制备方法
CN110288945A (zh) * 2019-06-28 2019-09-27 武汉天马微电子有限公司 显示面板及显示装置
CN110491918A (zh) * 2019-08-09 2019-11-22 武汉华星光电半导体显示技术有限公司 显示面板及显示装置
CN110534660A (zh) * 2019-08-30 2019-12-03 合肥鑫晟光电科技有限公司 一种显示基板及制备方法、显示装置
CN111312755A (zh) * 2019-11-29 2020-06-19 昆山国显光电有限公司 显示面板及显示装置
CN111146362A (zh) * 2019-12-31 2020-05-12 武汉天马微电子有限公司 一种显示面板及显示装置

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