WO2022094915A1 - Watertight sealed electronic-circuit apparatus and related electronic device and mobile platform - Google Patents

Watertight sealed electronic-circuit apparatus and related electronic device and mobile platform Download PDF

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Publication number
WO2022094915A1
WO2022094915A1 PCT/CN2020/127055 CN2020127055W WO2022094915A1 WO 2022094915 A1 WO2022094915 A1 WO 2022094915A1 CN 2020127055 W CN2020127055 W CN 2020127055W WO 2022094915 A1 WO2022094915 A1 WO 2022094915A1
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WO
WIPO (PCT)
Prior art keywords
base
waterproof
sealed electronic
electronic circuit
circuit device
Prior art date
Application number
PCT/CN2020/127055
Other languages
French (fr)
Chinese (zh)
Inventor
张文康
孟祥�
张攀
杨飞虎
张皓渊
Original Assignee
深圳市大疆创新科技有限公司
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Application filed by 深圳市大疆创新科技有限公司 filed Critical 深圳市大疆创新科技有限公司
Priority to PCT/CN2020/127055 priority Critical patent/WO2022094915A1/en
Publication of WO2022094915A1 publication Critical patent/WO2022094915A1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B64AIRCRAFT; AVIATION; COSMONAUTICS
    • B64CAEROPLANES; HELICOPTERS
    • B64C1/00Fuselages; Constructional features common to fuselages, wings, stabilising surfaces or the like
    • B64C1/16Fuselages; Constructional features common to fuselages, wings, stabilising surfaces or the like specially adapted for mounting power plant
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/06Hermetically-sealed casings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present disclosure relates to the field of electronic products, and more particularly, to a waterproof and sealed electronic device that can be used in harsh working environments, as well as electronic equipment and mobile platforms including the waterproof and sealed electronic device.
  • drones have been used in all walks of life. However, for the application of industry-level drones, especially unmanned agricultural plant protection, they may be contaminated with a large number of corrosive pesticide water mist and fertilizer dust particles during work. The protection capabilities of existing agricultural plant protection drones cannot stop pesticides and fertilizers. The corrosion and aging of the electronic system have put forward IP68 waterproof and dustproof requirements for this industry drone.
  • the existing UAV dustproof and waterproof method mainly adopts the shell structure for waterproof and dustproof, and all avionics system circuits are placed in a sealed cavity. This makes the mold design of the product and various sealing plugs the main points of the design.
  • the joints of the upper and lower shells of the drone are designed as concave and convex matching structures, and a waterproof rubber ring is set between the upper and lower shells, and then locked to achieve the sealing effect.
  • External port connectors are usually in the form of SR joint structure encapsulation. Tighten the screws through each joint, and the waterproof rubber ring deforms and expands to seal the gap between the connector and the shell. Each joint is directly connected to the inner cavity, and if the seal of one joint fails, the seal of the entire module will fail. In addition, each connector needs to occupy a lot of space for locking screws in the waterproof SR connector, resulting in a heavy structure and requiring disassembly and assembly of screws for assembly and maintenance, which is time-consuming and labor-intensive.
  • a first aspect of the present disclosure provides a watertight sealed electronic circuit device comprising: a base; and at least two control modules sealingly disposed on a first side of the base ; wherein, the base includes an internal interface and an external interface, the internal interface is used for electrical connection with the at least two control modules, so as to realize the connection between any two or more of the at least two control modules the electrical connection, the external interface is used for electrical connection with external equipment.
  • a second aspect of the present disclosure relates to a mobile platform comprising any of the watertight sealed electronic circuit arrangements as described above.
  • a third aspect of the present disclosure also relates to an electronic device comprising any of the above-mentioned waterproof sealed electronic circuit devices.
  • the waterproof and sealed electronic circuit device realizes each control module through the base by modularizing the control system so that each control module of the control system is relatively independent, and sealingly connecting each control module to the base. Therefore, the overall waterproof sealing can be achieved through only one sealing process, which reduces the probability of sealing failure, and can also improve the efficiency of disassembly, maintenance and installation of the control module.
  • the signal communication and power supply connection between the various control modules are realized through the base, so that there is no need to use too many cables for connection, thereby saving materials and space, and at the same time improving the connection efficiency of each control module.
  • FIG. 1 shows a perspective view of a watertight sealed electronic circuit device according to the present disclosure from a first side.
  • FIG. 2 shows a perspective view of a watertight sealed electronic circuit device according to the present disclosure from a second side opposite the first side.
  • FIG. 3 shows an exploded perspective view of a watertight sealed electronic circuit device according to the present disclosure.
  • FIG. 4 shows a perspective view of a control module of a watertight sealed electronic circuit device according to the present disclosure.
  • FIG. 5 shows an exploded perspective view of a control module of a watertight sealed electronic circuit device according to the present disclosure.
  • 10 waterproof sealed electronic circuit device; 12: base; 121: screw hole; 122: internal interface; 1222: internal interface of flight control; 1224: internal interface of radio frequency; 1226: internal interface of power supply; 124: external interface; 1242: power interface ;126: Base housing; 1262: Bottom plate; 1263: Interface opening; 1264: Bottom plate flange; 128: Base circuit board; ;14: Control module; 1402: Main circuit board; 1404: First shell; 1405: Heat dissipation structure; 1406: Second shell; 1407: Shell opening; 1408: Screw; 142: flight control module; 144: radio frequency module; 146: power control module; 148: guide hole; 16: sealing gasket.
  • first and second are only used for description purposes, and cannot be interpreted as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, features defined as “first”, “second” may expressly or implicitly include one or more of said features.
  • “plurality” means two or more, unless expressly and specifically defined otherwise.
  • the terms “installed”, “connected” and “connected” should be understood in a broad sense, unless otherwise expressly specified and limited, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; it can be mechanical connection, electrical connection or can communicate with each other; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal communication of two elements or the interaction of two elements relation.
  • installed should be understood in a broad sense, unless otherwise expressly specified and limited, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; it can be mechanical connection, electrical connection or can communicate with each other; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal communication of two elements or the interaction of two elements relation.
  • the present disclosure relates to a waterproof and sealed electronic circuit device, which can be applied to industry-level UAV systems for firefighting, agriculture, exploration, rescue, reconnaissance, surveying and mapping, etc.
  • industry-level UAV systems for firefighting, agriculture, exploration, rescue, reconnaissance, surveying and mapping, etc.
  • On consumer-grade UAV systems operating in dusty areas The above application scenarios all require a high level of waterproof and dustproof, all-weather environmental adaptability, and the ability to withstand the contamination and corrosion of common organic compounds such as pesticides and fertilizers, and require on-site maintenance and replacement.
  • the present disclosure mainly designs a modular system scheme based on substrate interconnection applied to UAVs, and utilizes the related potting, structural sealing, connector waterproofing, inter-board interconnection and intra-board outlet, and overall shock absorption. technology. It solves the problem of poor reliability that has long plagued the application of UAVs in heavy rain environment, high dust environment, and high salt spray chemical corrosion environment. At the same time, it meets the stringent requirements for lightweight and high heat dissipation efficiency of the UAV system, and also improves the maintainability of the UAV on-site replacement and maintenance.
  • the modular design scheme based on the substrate provides the basis for the smooth iterative upgrade of the product in the future, making the platform-based expansion application possible.
  • a first perspective view from the upper side and a second perspective view from the lower side are shown of a waterproof sealed electronic circuit device 10 according to the present disclosure
  • the waterproof sealed electronic circuit device 10 . 10 includes a base 12 and at least two control modules 14 sealingly disposed on a first side of the base 12 .
  • the first side surface of the base 12 can be defined as the upper side
  • the second side surface opposite to the first side surface can be defined as the lower side.
  • the waterproof and sealed electronic circuit device 10 according to the present disclosure can be applied to the avionics system of the UAV, and the avionics system of the UAV can be divided into at least two control modules 14. In the embodiment shown in FIG.
  • the two control modules 14 may include, for example, a flight control module 142 , a radio frequency module 144 and a power control module 146 .
  • the above-mentioned three modules can also be integrated into two modules, or the above-mentioned modules can be further subdivided, or other modules other than the above-mentioned three modules can also be included, for example, a load module can also be included.
  • Each of the at least two control modules 14 can be independently sealed on the first side of the base 12, thereby enabling the at least two control modules 14 to be spatially isolated from each other so that one of the control modules In the event that the seal of 14 fails, the seals of other control modules 14 are not affected.
  • the electrical connection here refers to the electrical connection between different control modules 14
  • the base 12 of the watertight sealed electronic circuit assembly 10 may include an internal interface 122 (shown in FIG. 3 ) and an external interface 124 (shown in FIG. 2 ) shown), wherein the internal interface 122 is used for electrical connection with at least two control modules 14, and the external interface 124 is used for electrical connection with external devices.
  • the internal interface 122 is used for electrical connection with at least two control modules 14
  • the external interface 124 is used for electrical connection with external devices.
  • the internal interface 122 is provided on a first side of the base 12 and the external interface 124 is provided on a second side of the base 12 opposite the first side.
  • the external interface 124 may also be disposed on the first side surface, and it is only necessary to reserve a certain space for the external interface 124 on the first side surface during the design process.
  • the at least two control modules 14 may be electrically connected to the base 12 through the internal interface 122, and any two or more of the at least two control modules 14 electrically connected to the base 12 may be electrically connected through circuitry in the base 12, such as,
  • the flight control module 142 can be electrically connected to the base 12 through its corresponding flight control internal interface 1222, and the flight control module 142 is electrically connected to the radio frequency module 144 and/or the power control module 146 through the internal circuit in the base 12, so as to realize the flight control Signal connections and/or power connections between module 142 and radio frequency module 144 and/or power control module 146 .
  • the external interface 124 is used for electrical connection with external devices, for example, the external interface 124 can electrically connect the flight control module 142 to the ESC of the drone, so as to control the ESC.
  • the base 12 is used to provide support for the at least two control modules 14 and is capable of providing a watertight seal for the interior cavities of the at least two control modules 14, while providing a watertight seal for the base 12 itself.
  • the base 12 may be configured to include a base housing 126 , a base circuit board 128 positioned within the base housing 126 , and a waterproof seal 130 sealingly positioning the base circuit board 128 within the base housing 126 .
  • the waterproof sealing layer 130 is formed by filling the potting glue, and the waterproof sealing layer 130 jointly seals the base circuit board 128 and at least part of the external interface 124 , that is, the potting glue covers the entire surface of the base circuit board 128 and also covers the base The connection of the circuit board 128 to the external interface 124 thereby enables the base circuit board 128 and at least part of the external interface 124 to be sealed together to provide a good sealing condition. Since the waterproof sealing layer 130 is formed by potting the base circuit board 128 and the base housing 126 with transparent potting glue, the waterproof sealing layer 130 is in a transparent state, so there are no specific lines in the embodiment shown in FIG. 2 . shape.
  • the base housing 126 may be provided to be made of metal, thereby ensuring the support strength of the base 12 to prevent deformation thereof, for example, the base housing 126 may be made of aluminum.
  • the base housing 126 may be configured to include a backplane 1262 and a backplane flange 1264 extending from the second side of the base 12 .
  • a space for accommodating the potting glue is formed on the second side, so that the second side of the base 12 can be sealed.
  • each control module 14 is electrically connected to the base circuit board 128 through a corresponding internal interface 122 , eg, in an example such as In the embodiment shown in FIGS. 1-3 , the flight control module 142 is electrically connected to the base circuit board 128 through the flight control internal interface 1222 , the radio frequency module 144 is electrically connected to the base circuit board 128 through the radio frequency internal interface 1224 , and the power control module 146 is electrically connected to the base circuit board 128 through the radio frequency internal interface 1224 .
  • the power supply internal interface 1226 is electrically connected to the base circuit board 128 .
  • the flight control module 142 , the radio frequency module 144 and the power control module 146 electrically connected to the base circuit board 128 can realize electrical connection between any two or three modules, so that the base circuit board 128 can realize the connection between the various modules. Electrical connection, thus eliminating the need for connecting cables between the various modules.
  • an interface opening 1263 is provided in the bottom plate 1262 of the base housing 126, and the internal interface 122 It can extend through the interface opening 1263 for interfacing with the various control modules 14 .
  • one interface opening 1263 is provided for each internal interface 122.
  • three interface openings 1263 may be provided in the bottom plate 1262, corresponding to the flight control internal interface 1222 and the radio frequency internal interface respectively.
  • 1224 and the power supply internal interface 1226, the flight control internal interface 1222, the radio frequency internal interface 1224 and the power supply internal interface 1226 respectively extend from the base circuit board 128 through the interface opening 1263 toward the side opposite to the base circuit board 128 of the base plate 1262.
  • a flange protruding toward the base circuit board 128 or toward the control module 14 is provided on the peripheral edge of the interface opening 1263 .
  • a flexible filling material is arranged between the upper surface of the base circuit board 128 and the lower surface of the bottom plate 1262 of the base case 126, Filling material is arranged in the gap between the board 128 and the base case 126 , so that the base circuit board 128 can be more firmly fixed in the base case 126 .
  • a waterproof dividing portion (not shown in the figure) may also be provided between the base circuit boards 128 corresponding to each of the at least two control modules 14 adjacent to each other, and the waterproof dividing portion can be used for phase separation.
  • the adjacent control modules 14 provide space isolation, so that after the waterproof seal of one of the control modules 14 is damaged and fails, the waterproof seal of the other adjacent control modules 14 will not be affected.
  • a waterproof and ventilating valve (not shown in the figure) can be provided on the base shell 126, which can ensure the base shell 126.
  • the airtightness of the inner space of the body 126 can also ensure a pressure difference within a certain range between the inner space of the base case 126 and the outer space.
  • the external interface 124 provided on the second side of the base 12 may include an interface for each control module 14 to an external device, such as a power interface 1242 that may include a power control module 146 , which is used to connect the power supply to the power supply control module 146 .
  • all the external interfaces 124 are provided as waterproof connectors, whereby the sealing performance of the base circuit board 128 can be ensured.
  • the connection position of the external interface 124 and the base circuit board 128 can be set to a height lower than the potting height of the potting glue.
  • the external interface 124 can be welded to the second side of the base circuit board 128 by welding.
  • the glue When the glue is potted on the second side of the base circuit board 128 , it can completely cover the welding seam between the external interface 124 and the base circuit board 128 . That is, the height of the bottom plate flange 1264 of the base housing 126 is greater than the thickness of the base circuit board 128, and also greater than the height of the welding seam between the external interface 124 and the base circuit board 128, thereby ensuring the application of the base circuit
  • the potting glue on the surface of the board 128 can cover the welding seam between the external interface 124 and the base circuit board 128, and at the same time, it will not overflow from the edge of the base case 126 in a liquid state.
  • the base circuit board 128 may include a first circuit layer close to the first side and a second circuit layer close to the second side, that is, the base circuit board 128 may be provided in a multi-layer structure , circuits with different functions are arranged in each layer, and only two layers are provided for illustration here. It should be understood that the base circuit board 128 may be arranged in a single-layer or three-layer structure or more.
  • the circuits in the first circuit layer can realize the electrical connection between any two or more modules in the at least two control modules 14, such as the signal connection between the flight control module 142 and the radio frequency module 144, the second circuit
  • the layer may implement the power connection between the power control module 146 and the flight control module 142 and/or the radio frequency module 144 for supplying power to the flight control module 142 and/or the radio frequency module 144 .
  • the first circuit layer can be set as a low-voltage signal layer, and a circuit for circulating low-voltage signals is arranged in the first circuit layer.
  • the second circuit layer can be set as a high-voltage signal layer, in the second circuit layer
  • the circuit arranged in the middle is a circuit that circulates high-voltage signals, such as the power circuit of each module, and the circuit between the power control module 146 and the power interface 1242 is arranged in the second circuit layer.
  • a ground layer can also be provided between the first circuit layer and the second circuit layer, and the electromagnetic interference between the first circuit layer and the second circuit layer can be better isolated by the ground layer, thereby making the first circuit layer The signal or current in the circuit layer and the second circuit layer is more stable.
  • a current bar can be set in the second circuit layer, for example, in the circuit where the flight control module 142 is connected to the ESC of the drone, due to the flight A large current is required in the process, thereby increasing the current load of the circuit connected to the external interface in the second circuit layer.
  • the conduction of the second circuit layer can be improved. flow capability.
  • the first circuit layer and the second circuit layer can also be set as a mixed-current layer, that is, both low-voltage signals and high-voltage signals can be passed through them, and one circuit layer can also be set.
  • Each of the control modules 14 may include a main circuit board 1402, a first housing 1404 for receiving the main circuit board 1402, and a second housing 1406 for enclosing the main circuit board 1402 within the first housing 1404, wherein,
  • the control module 14 is sealingly disposed on the base 12 by a first housing 1404 .
  • the second housing 1406 may be secured to the first housing 1404 by screws 1408, thereby enabling the main circuit board 1402 to be secured within the cavity formed by the first housing 1404 and the second housing 1406 to form a separate control module 14 so as to For the overall installation and removal of the control module 14 .
  • both the first casing 1404 and the second casing 1406 are made of metal materials, which can not only provide high stability, but also facilitate the heat dissipation of the control module 14 .
  • the three control modules of the flight control module 142 , the radio frequency module 144 and the power control module 146 all have the above structures.
  • a sealing structure is provided between each control module 14 and the base 12 .
  • the sealing structure includes a gasket 16 disposed between the control modules 14 and the first side surface of the base 12.
  • Each control module 14 can be fixed on the base 12 by a fixing mechanism.
  • each control module 14 can be set by Screws 1410 on the periphery and screw holes 121 provided in the base 12 are fixed on the base 12, and the gasket 16 provided between the control module 14 and the base 12 can provide a sealing effect for the connection between the two.
  • the sealing structure may further include a first gasket accommodating groove 1412 provided on the side edge of the control module 14 in contact with the base 12 , and/or a second seal provided on the base 12 at a position corresponding to the control module 14 . Pad receiving slot (not shown).
  • the first sealing gasket accommodating groove 1412 and/or the second sealing gasket accommodating groove can limit the sealing gasket 16 between the control module 14 and the base 12 to prevent the sealing gasket 16 from occurring between the control module 14 and the base 12 shift.
  • the electrical connection between the first shell 1404 of the control module 14, the base shell 126 and the ground layer of the base circuit board 128 can also be realized by fixing the screws 1410 and the screw holes 121 of the control module 14 and the base 12, so that the three A Faraday electromagnetic cage is formed therebetween, thereby preventing electromagnetic interference between the inside and the outside of the watertightly sealed electronic circuit device 10 .
  • the second housing 1406 is provided with a housing opening 1407 through which the internal interface 122 provided on the base 12 can pass through, that is to say, the housing opening 1407 enables the main circuit board provided on the control module 14
  • the interface on 1402 is exposed for interfacing with the internal interface 122.
  • at least one protruding portion 1409 may also be provided on the second housing 1406 .
  • the corresponding protrusions 1409 may not be provided on the second housing 1406 .
  • a heat dissipation structure 1405 may be provided on the side of the first housing 1404 that is away from the base 12, and the heat dissipation structure 1405 may include heat dissipation fins.
  • the direction of drainage is the same, which can ensure the best heat dissipation efficiency and the lightest heat dissipation weight.
  • the heat dissipation structure 1405 is beneficial to dissipate the heat emitted by the main circuit board 1402, so as to keep the temperature of the control module 14 within a certain range.
  • a pre-positioning mechanism is provided between the control module 14 and the base 12, and the pre-positioning mechanism may include a guide pin 132 provided on the base 12 and a guide pin 132 provided on the base 12.
  • the guide holes 148 in the control module 14 are shown in FIGS. 3 and 4 .
  • the guide pins can also be arranged on the control module 14, while the guide holes can be arranged on the base plate, or other alignment and positioning mechanisms, such as teeth and grooves, can also be used.
  • Convenient installation and pre-positioning of the control module 14 with the base 12 can be accomplished by a pre-positioning mechanism, and then the control module 14 is fastened to the base 12 via screws 1410 .
  • a shock absorbing member 134 is provided at the position where the base 12 of the electronic circuit device 10 is mounted to the drone, such as a shock absorbing pad, as shown in FIG. 2 .
  • a mounting boss 136 can also be provided on the base 12, and the damping member 134 can be set on the mounting boss 136, so that when the waterproof and sealed electronic circuit device 10 is mounted on the drone, the mounting boss 134 can be installed on the mounting boss 136.
  • the shock absorbing component 134 between the stage 136 and the UAV slows down the vibration transmitted by the UAV to the waterproof and sealed electronic circuit device 10 , so as to ensure the stability of the operation of the waterproof and sealed electronic circuit device 10 .
  • the waterproof and sealed electronic circuit device 10 adopts the solution that the modules are connected by a substrate, and there is only one waterproof sealing point between the module and the substrate, thus greatly reducing the probability of waterproof failure.
  • the modules are interconnected through the base plate, avoiding the use of a large number of cables, and solving the contradiction between modularization and reducing interconnection cables.
  • the external connectors are all arranged on the other side of the substrate, and waterproof connectors are used, thereby ensuring the waterproof sealing performance on the substrate side.
  • the technical solution of the present disclosure can also ensure complete cavity isolation between the connector and the module, between the connector and the connector, and between the module and the module, and avoid the failure of the entire circuit device caused by the waterproof failure of a single connector or a single module. .
  • the waterproof connector is small in size, which can reduce the volume of the substrate, thereby reducing the overall weight and cost.
  • the first side of the base 12 is made of metal, such as aluminum, and the other side is treated with potting glue, the density of the potting glue is only 1/3 of that of aluminum, so the weight of the base 12 can be reduced.
  • at least two control modules are directly fixed on the base by screws, when a specific control module fails, only the failed control module needs to be disassembled, and other normal modules do not need to be disassembled and replaced, thereby saving man-hours.
  • potting glue treatment on the second side of the base, the connection strength of the external interface can be enhanced and the reliability thereof can be improved.
  • the present disclosure also relates to a mobile platform comprising the waterproof sealed electronic circuit device 10 as described above, the mobile platform may include but not limited to objects movable on land, water or air, for example, the mobile platform may It is unmanned aerial vehicle, unmanned ship, unmanned vehicle, robot, etc.
  • the mobile platform in this embodiment may be an unmanned aerial vehicle.
  • the present disclosure also relates to an electronic device, which includes the above-mentioned waterproof and sealed electronic circuit device 10 .
  • the electronic device can be applied to application scenarios with harsh environments, and has good sealing performance and corrosion resistance.

Abstract

The present disclosure relates to a watertight sealed electronic-circuit apparatus, the watertight sealed electronic-circuit apparatus comprising: a base; and at least two control modules, said at least two control modules being sealingly arranged on the first side of said base; said base comprising an internal interface and an external interface, said internal interface being used for electrically connecting to said at least two control modules to achieve an electrical connection between any two or more of the at least two control modules, said external interface being used for electrical connection to an external device. In the present disclosure, by means of the modularized design of the control system, each control module of the control system is independent with respect to the others, and each control module is connected to the base in a sealed manner, thus independent sealing of each control module is achieved by means of the base. The signal communication and power supply connections between the control modules are achieved by means of the base, eliminating the need for excessive cables for connections, thus saving material and space.

Description

防水密封电子电路装置及相关电子设备和移动平台Waterproof and sealed electronic circuit devices and related electronic equipment and mobile platforms 技术领域technical field
本公开涉及电子产品领域,更具体地,涉及一种可用于恶劣工作环境的防水密封电子装置,以及包括该防水密封电子装置的电子设备和移动平台。The present disclosure relates to the field of electronic products, and more particularly, to a waterproof and sealed electronic device that can be used in harsh working environments, as well as electronic equipment and mobile platforms including the waterproof and sealed electronic device.
背景技术Background technique
目前无人机已应用于各行各业。但对于行业级无人机的应用,尤其是农业植保无人,其工作时有可能沾染大量带腐蚀性的农药水雾和化肥粉尘颗粒,现有农业植保无人机的防护能力无法阻挡农药化肥对电子系统的腐蚀和老化,由此提出了对这种行业无人机进行IP68等级的防水防尘要求。At present, drones have been used in all walks of life. However, for the application of industry-level drones, especially unmanned agricultural plant protection, they may be contaminated with a large number of corrosive pesticide water mist and fertilizer dust particles during work. The protection capabilities of existing agricultural plant protection drones cannot stop pesticides and fertilizers. The corrosion and aging of the electronic system have put forward IP68 waterproof and dustproof requirements for this industry drone.
现有无人机防尘防水方式主要采用外壳结构进行防水防尘,所有航电系统电路均放置于一个密封腔体内,主题思想是疏水、导流,使外部封装与内部电气部分有效隔离,由此使得产品的模具设计以及各种密封封堵称为设计的要点。通常将无人机的上下壳体的接缝处设计成凹型和凸型的配合结构,上下壳体之间设置防水胶圈,然后锁紧以达到密封的效果。The existing UAV dustproof and waterproof method mainly adopts the shell structure for waterproof and dustproof, and all avionics system circuits are placed in a sealed cavity. This makes the mold design of the product and various sealing plugs the main points of the design. Usually, the joints of the upper and lower shells of the drone are designed as concave and convex matching structures, and a waterproof rubber ring is set between the upper and lower shells, and then locked to achieve the sealing effect.
对外端口连接器通常采用SR接头结构包胶的形式,通过每个接头拧紧螺钉,防水胶圈变形膨胀,密封住连接器与壳体之间的缝隙。每个接头均与内腔直接相连,如果一个接头的密封失效,将导致整个模块的密封失效。另外,SR接头防水还存在每个连接器需要占用大量的锁紧螺钉的空间,导致结构重量较大,组装维修需要拆装螺钉,费时费力。External port connectors are usually in the form of SR joint structure encapsulation. Tighten the screws through each joint, and the waterproof rubber ring deforms and expands to seal the gap between the connector and the shell. Each joint is directly connected to the inner cavity, and if the seal of one joint fails, the seal of the entire module will fail. In addition, each connector needs to occupy a lot of space for locking screws in the waterproof SR connector, resulting in a heavy structure and requiring disassembly and assembly of screws for assembly and maintenance, which is time-consuming and labor-intensive.
发明内容SUMMARY OF THE INVENTION
本公开旨在至少解决现有技术中存在的技术问题之一。本公开的第一方面提供一种防水密封电子电路装置,防水密封电子电路装置包括:基部;以及至少两个控制模块,所述至少两个控制模块密封地设置在所述基部的第一侧面上;其中,所述基部包括内部接口和外部接口,所述内部接口用于与所述至少两个控制模块电连接,以实现所述至少两个控制模块中的任意两个或更多个之间的电连接,所述外部接口用于与外部设备电连接。The present disclosure aims to solve at least one of the technical problems existing in the prior art. A first aspect of the present disclosure provides a watertight sealed electronic circuit device comprising: a base; and at least two control modules sealingly disposed on a first side of the base ; wherein, the base includes an internal interface and an external interface, the internal interface is used for electrical connection with the at least two control modules, so as to realize the connection between any two or more of the at least two control modules the electrical connection, the external interface is used for electrical connection with external equipment.
本公开的第二方面涉及一种移动平台,该移动平台包括如上所述的任一种防水密封电子电路装置。A second aspect of the present disclosure relates to a mobile platform comprising any of the watertight sealed electronic circuit arrangements as described above.
本公开的第三方面还涉及一种电子设备,该电子设备包括如上所述的任一种防水密封电子电路装置。A third aspect of the present disclosure also relates to an electronic device comprising any of the above-mentioned waterproof sealed electronic circuit devices.
根据本公开的防水密封电子电路装置通过将控制系统进行模块化设计,以使控制系统的各个控制模块相对独立,并将每个控制模块密封地连接至基部上,从而通过基部实现每个控制模块的独立密封,由此仅通过一道密封工序即可实现整体的防水密封,降低了密封失效的概率,还能够提高对控制模块进行拆卸、维护和安装的效率。此外,通过基部实现了各个控制模块之间的信号通信和电源连接,由此无需采用过多的线缆进行连接,由此节省材料和空间,同时还提高各个控制模块连接的效率。The waterproof and sealed electronic circuit device according to the present disclosure realizes each control module through the base by modularizing the control system so that each control module of the control system is relatively independent, and sealingly connecting each control module to the base. Therefore, the overall waterproof sealing can be achieved through only one sealing process, which reduces the probability of sealing failure, and can also improve the efficiency of disassembly, maintenance and installation of the control module. In addition, the signal communication and power supply connection between the various control modules are realized through the base, so that there is no need to use too many cables for connection, thereby saving materials and space, and at the same time improving the connection efficiency of each control module.
附图说明Description of drawings
图1示出根据本公开的防水密封电子电路装置从第一侧观察的立体视图。FIG. 1 shows a perspective view of a watertight sealed electronic circuit device according to the present disclosure from a first side.
图2示出根据本公开的防水密封电子电路装置从与第一侧相反的第二侧观察的立体视图。FIG. 2 shows a perspective view of a watertight sealed electronic circuit device according to the present disclosure from a second side opposite the first side.
图3示出根据本公开的防水密封电子电路装置的分解立体视图。3 shows an exploded perspective view of a watertight sealed electronic circuit device according to the present disclosure.
图4示出根据本公开的防水密封电子电路装置的控制模块的立体视图。4 shows a perspective view of a control module of a watertight sealed electronic circuit device according to the present disclosure.
图5示出根据本公开的防水密封电子电路装置的控制模块的分解立体视图。5 shows an exploded perspective view of a control module of a watertight sealed electronic circuit device according to the present disclosure.
附图标记说明:Description of reference numbers:
10:防水密封电子电路装置;12:基部;121:螺孔;122:内部接口;1222:飞控内部接口;1224:射频内部接口;1226:电源内部接口;124:外部接口;1242:电源接口;126:基部壳体;1262:底板;1263:接口开口;1264:底板凸缘;128:基部电路板;130:防水密封层;132:导向销;134:减震部件;136:安装凸台;14:控制模块;1402:主电路板;1404:第一外壳;1405:散热结构;1406:第二外壳;1407:外壳开口;1408:螺钉;1409:凸起部;1410:螺钉;1412:第一密封垫容置槽;142:飞控模块;144:射频模块;146:电源控制模块;148:导向孔;16:密封垫。10: waterproof sealed electronic circuit device; 12: base; 121: screw hole; 122: internal interface; 1222: internal interface of flight control; 1224: internal interface of radio frequency; 1226: internal interface of power supply; 124: external interface; 1242: power interface ;126: Base housing; 1262: Bottom plate; 1263: Interface opening; 1264: Bottom plate flange; 128: Base circuit board; ;14: Control module; 1402: Main circuit board; 1404: First shell; 1405: Heat dissipation structure; 1406: Second shell; 1407: Shell opening; 1408: Screw; 142: flight control module; 144: radio frequency module; 146: power control module; 148: guide hole; 16: sealing gasket.
具体实施方式Detailed ways
下面详细描述本公开的实施方式,所述实施方式的示例在附图中示出,其中自始 至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施方式是示例性的,仅用于解释本公开,而不能理解为对本公开的限制。Embodiments of the present disclosure are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present disclosure, but should not be construed as a limitation of the present disclosure.
在本公开的描述中,需要理解的是,术语“第一”、“第二”仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本公开的描述中,“多个”的含义是两个或两个以上,除非另有明确具体的限定。In the description of the present disclosure, it should be understood that the terms "first" and "second" are only used for description purposes, and cannot be interpreted as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, features defined as "first", "second" may expressly or implicitly include one or more of said features. In the description of the present disclosure, "plurality" means two or more, unless expressly and specifically defined otherwise.
在本公开的描述中,需要说明的是,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接;可以是机械连接,也可以是电连接或可以相互通信;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言,可以根据具体情况理解上述术语在本公开中的具体含义。In the description of the present disclosure, it should be noted that the terms "installed", "connected" and "connected" should be understood in a broad sense, unless otherwise expressly specified and limited, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; it can be mechanical connection, electrical connection or can communicate with each other; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal communication of two elements or the interaction of two elements relation. For those of ordinary skill in the art, the specific meanings of the above terms in the present disclosure can be understood according to specific situations.
下文的公开提供了许多不同的实施方式或例子用来实现本公开的不同结构。为了简化本公开的公开,下文中对特定例子的部件和设置进行描述。当然,它们仅仅为示例,并且目的不在于限制本公开。此外,本公开可以在不同例子中重复参考数字和/或参考字母,这种重复是为了简化和清楚的目的,其本身不指示所讨论各种实施方式和/或设置之间的关系。此外,本公开提供了的各种特定的工艺和材料的例子,但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。The following disclosure provides many different embodiments or examples for implementing different structures of the present disclosure. In order to simplify the disclosure of the present disclosure, the components and arrangements of specific examples are described below. Of course, they are only examples and are not intended to limit the present disclosure. Furthermore, the present disclosure may repeat reference numerals and/or reference letters in different instances for the purpose of simplicity and clarity and not in itself indicative of a relationship between the various embodiments and/or arrangements discussed. In addition, the present disclosure provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.
下面详细描述本公开的实施方式,所述实施方式的示例在附图中示出,其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施方式是示例性的,仅用于解释本公开,而不能理解为对本公开的限制。Embodiments of the present disclosure are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present disclosure, but should not be construed as a limitation of the present disclosure.
本公开涉及一种防水密封电子电路装置,其可以应用于消防、农业、勘探、救援、侦查、测绘等的行业级无人机系统上,也可应用于需要水中起降,长期在海边或高尘土区域作业的消费级无人机系统上。以上应用场景均需要较高的防水防尘等级、全天候的环境适应能力以及耐受常见的农药化肥等有机物的沾染腐蚀的能力,并且具有现场进行检修更换的需求。The present disclosure relates to a waterproof and sealed electronic circuit device, which can be applied to industry-level UAV systems for firefighting, agriculture, exploration, rescue, reconnaissance, surveying and mapping, etc. On consumer-grade UAV systems operating in dusty areas. The above application scenarios all require a high level of waterproof and dustproof, all-weather environmental adaptability, and the ability to withstand the contamination and corrosion of common organic compounds such as pesticides and fertilizers, and require on-site maintenance and replacement.
本公开主要设计了应用在无人机上的基于基板互联的模块化系统方案,并利用了与其相关的灌封、结构密封、连接器防水、板间互联与板内出线、以及整体减震等相 关技术。解决了长期困扰无人机在大雨环境、高粉尘环境、高盐雾化学腐蚀环境下应用的可靠性差的问题。同时,满足了无人机系统严苛的轻量化和高散热效率的需求,还提升了无人机现场更换检修的可维护性。此外,基于基板的模块化设计方案提供了产品未来的平滑迭代升级的基础,使得平台化的扩展应用成为可能。The present disclosure mainly designs a modular system scheme based on substrate interconnection applied to UAVs, and utilizes the related potting, structural sealing, connector waterproofing, inter-board interconnection and intra-board outlet, and overall shock absorption. technology. It solves the problem of poor reliability that has long plagued the application of UAVs in heavy rain environment, high dust environment, and high salt spray chemical corrosion environment. At the same time, it meets the stringent requirements for lightweight and high heat dissipation efficiency of the UAV system, and also improves the maintainability of the UAV on-site replacement and maintenance. In addition, the modular design scheme based on the substrate provides the basis for the smooth iterative upgrade of the product in the future, making the platform-based expansion application possible.
如附图1和附图2所示,示出根据本公开的防水密封电子电路装置10的从上侧观察的第一立体视图和从下侧观察的第二立体视图,该防水密封电子电路装置10包括基部12和至少两个控制模块14,至少两个控制模块14密封地设置在基部12的第一侧面上。在此,可以将基部12的第一侧面定义为上侧,相应地,将与第一侧面相反的第二侧面定义为下侧。根据本公开的防水密封电子电路装置10可以应用于无人机的航电系统,可以将无人机的航电系统分成至少两个控制模块14,在附图1所示的实施例中,至少两个控制模块14例如可以包括飞控模块142、射频模块144和电源控制模块146。当然,在此也可以将上述三个模块集成为两个模块,或者也可以将上述模块进行进一步细分,或者还可以包括上述三个模块之外的其他模块,比如还可以包括负载模块。至少两个控制模块14中的每一个均能够独立地密封在基部12的第一侧面上,由此能够使得至少两个控制模块14彼此之间实现空间上的隔离,从而可以在其中一个控制模块14的密封失效的情况下,其他控制模块14的密封不受影响。As shown in FIGS. 1 and 2 , a first perspective view from the upper side and a second perspective view from the lower side are shown of a waterproof sealed electronic circuit device 10 according to the present disclosure, the waterproof sealed electronic circuit device 10 . 10 includes a base 12 and at least two control modules 14 sealingly disposed on a first side of the base 12 . Here, the first side surface of the base 12 can be defined as the upper side, and correspondingly, the second side surface opposite to the first side surface can be defined as the lower side. The waterproof and sealed electronic circuit device 10 according to the present disclosure can be applied to the avionics system of the UAV, and the avionics system of the UAV can be divided into at least two control modules 14. In the embodiment shown in FIG. 1, at least The two control modules 14 may include, for example, a flight control module 142 , a radio frequency module 144 and a power control module 146 . Of course, the above-mentioned three modules can also be integrated into two modules, or the above-mentioned modules can be further subdivided, or other modules other than the above-mentioned three modules can also be included, for example, a load module can also be included. Each of the at least two control modules 14 can be independently sealed on the first side of the base 12, thereby enabling the at least two control modules 14 to be spatially isolated from each other so that one of the control modules In the event that the seal of 14 fails, the seals of other control modules 14 are not affected.
为了实现至少两个控制模块14中的任意两个或更多个模块彼此之间的电连接以及控制模块14与外部设备的电连接,这里的电连接指的是不同的控制模块14之间的信号连接和/或各个控制模块14之间或其与电源之间的电源连接,该防水密封电子电路装置10的基部12可以包括内部接口122(如图3所示)和外部接口124(如图2所示),其中,内部接口122用于与至少两个控制模块14电连接,外部接口124用于与外部设备电连接。在附图2和附图3所示的实施例中,内部接口122设置在基部12的第一侧面上,外部接口124设置在基部12的与第一侧面相反的第二侧面上。在此,外部接口124也可以设置在第一侧面上,只需要在设计过程中在第一侧面上为外部接口124预留一定空间即可。至少两个控制模块14可以通过内部接口122电连接至基部12,电连接至基部12的至少两个控制模块14中的任意两个或更多个可以通过基部12中的电路电连接,比如,飞控模块142可以通过与其相对应的飞控内部接口1222电连接至基部12,飞控模块142通过基部12中的内部电路与射频模块144和/或电源控制模块146电连接,从而实现飞控模块142与射频模块144和/或电源控制模块146之间的信号连接和/或电源连接。外部接口124用于与外部设备电连接,比如外部接口124可以 将飞控模块142电连接至无人机的电调,从而对电调进行相关控制。In order to realize the electrical connection between any two or more modules in the at least two control modules 14 and the electrical connection between the control module 14 and external devices, the electrical connection here refers to the electrical connection between different control modules 14 Signal connections and/or power connections between the various control modules 14 or to a power source, the base 12 of the watertight sealed electronic circuit assembly 10 may include an internal interface 122 (shown in FIG. 3 ) and an external interface 124 (shown in FIG. 2 ) shown), wherein the internal interface 122 is used for electrical connection with at least two control modules 14, and the external interface 124 is used for electrical connection with external devices. In the embodiment shown in FIGS. 2 and 3 , the internal interface 122 is provided on a first side of the base 12 and the external interface 124 is provided on a second side of the base 12 opposite the first side. Here, the external interface 124 may also be disposed on the first side surface, and it is only necessary to reserve a certain space for the external interface 124 on the first side surface during the design process. The at least two control modules 14 may be electrically connected to the base 12 through the internal interface 122, and any two or more of the at least two control modules 14 electrically connected to the base 12 may be electrically connected through circuitry in the base 12, such as, The flight control module 142 can be electrically connected to the base 12 through its corresponding flight control internal interface 1222, and the flight control module 142 is electrically connected to the radio frequency module 144 and/or the power control module 146 through the internal circuit in the base 12, so as to realize the flight control Signal connections and/or power connections between module 142 and radio frequency module 144 and/or power control module 146 . The external interface 124 is used for electrical connection with external devices, for example, the external interface 124 can electrically connect the flight control module 142 to the ESC of the drone, so as to control the ESC.
进一步地,以下对根据本公开的防水密封电子电路装置10的基部12的结构进行说明。基部12用于为至少两个控制模块14提供支撑,而且能够为至少两个控制模块14的内腔提供防水密封,同时为基部12自身提供防水密封。基部12可以设置成包括基部壳体126、设置在基部壳体126内的基部电路板128以及将基部电路板128密封地设置在基部壳体126内的防水密封层130。防水密封层130通过填充灌封胶形成,防水密封层130将基部电路板128和至少部分外部接口124共同密封,也就是说,灌封胶既覆盖基部电路板128的整个表面,同时还覆盖基部电路板128与外部接口124的连接处,由此能够将基部电路板128和至少部分外部接口124密封在一起,以便提供良好的密封条件。由于防水密封层130利用透明灌封胶灌封基部电路板128和基部壳体126而形成,因此,该防水密封层130为透明状态,因此在附图2所示的实施例中没有具体的线条形状。基部壳体126可以设置成由金属制成,由此可以确保基部12的支撑强度,防止其发生变形,比如基部壳体126可以由铝制成。基部壳体126可以设置成包括底板1262和从基部12的第二侧面延伸的底板凸缘1264,底板凸缘1264的高度可以设置成高于基部电路板128的厚度,由此能够在基部12的第二侧面上形成用于容纳灌封胶的空间,以便对基部12的第二侧面进行密封处理。Further, the structure of the base portion 12 of the waterproof sealed electronic circuit device 10 according to the present disclosure will be described below. The base 12 is used to provide support for the at least two control modules 14 and is capable of providing a watertight seal for the interior cavities of the at least two control modules 14, while providing a watertight seal for the base 12 itself. The base 12 may be configured to include a base housing 126 , a base circuit board 128 positioned within the base housing 126 , and a waterproof seal 130 sealingly positioning the base circuit board 128 within the base housing 126 . The waterproof sealing layer 130 is formed by filling the potting glue, and the waterproof sealing layer 130 jointly seals the base circuit board 128 and at least part of the external interface 124 , that is, the potting glue covers the entire surface of the base circuit board 128 and also covers the base The connection of the circuit board 128 to the external interface 124 thereby enables the base circuit board 128 and at least part of the external interface 124 to be sealed together to provide a good sealing condition. Since the waterproof sealing layer 130 is formed by potting the base circuit board 128 and the base housing 126 with transparent potting glue, the waterproof sealing layer 130 is in a transparent state, so there are no specific lines in the embodiment shown in FIG. 2 . shape. The base housing 126 may be provided to be made of metal, thereby ensuring the support strength of the base 12 to prevent deformation thereof, for example, the base housing 126 may be made of aluminum. The base housing 126 may be configured to include a backplane 1262 and a backplane flange 1264 extending from the second side of the base 12 . A space for accommodating the potting glue is formed on the second side, so that the second side of the base 12 can be sealed.
为了实现至少两个控制模块14中的每一个与另外一个或多个控制模块之间的电连接,每个控制模块14均通过对应的内部接口122电连接至基部电路板128,比如,在如图1-3所示的实施例中,飞控模块142通过飞控内部接口1222电连接至基部电路板128,射频模块144通过射频内部接口1224电连接至基部电路板128,电源控制模块146通过电源内部接口1226电连接至基部电路板128。电连接至基部电路板128的飞控模块142、射频模块144和电源控制模块146可以实现任意两个或三个模块之间的电连接,由此可以通过基部电路板128实现各个模块之间的电连接,从而省去了各个模块之间的连接线缆。进一步地,为了使设置在基部壳体126内的基部电路板128能够通过内部接口122与至少两个模块14实现电连接,在基部壳体126的底板1262中设置有接口开口1263,内部接口122可以通过接口开口1263伸出,以便与各个控制模块14对接。在此,为每个内部接口122设置一个接口开口1263,比如,在根据本公开的实施例中,可以在底板1262中设置三个接口开口1263,分别对应于飞控内部接口1222、射频内部接口1224和电源内部接口1226,飞控内部接口1222、射频内部接口1224和电源内部接口1226分别从基部电路板128穿过接口开口1263朝向底板 1262的与基部电路板128相反的一侧延伸。为了加强接口开口1263的附近的材料强度,在接口开口1263的周缘上设置有朝向基部电路板128或朝向控制模块14突出的凸缘。通过在接口开口1263的周缘上设置凸缘,不仅能够提高接口开口1263处的结构强度,而且能够增强基部壳体126的散热性能。In order to enable electrical connection between each of the at least two control modules 14 and one or more other control modules, each control module 14 is electrically connected to the base circuit board 128 through a corresponding internal interface 122 , eg, in an example such as In the embodiment shown in FIGS. 1-3 , the flight control module 142 is electrically connected to the base circuit board 128 through the flight control internal interface 1222 , the radio frequency module 144 is electrically connected to the base circuit board 128 through the radio frequency internal interface 1224 , and the power control module 146 is electrically connected to the base circuit board 128 through the radio frequency internal interface 1224 . The power supply internal interface 1226 is electrically connected to the base circuit board 128 . The flight control module 142 , the radio frequency module 144 and the power control module 146 electrically connected to the base circuit board 128 can realize electrical connection between any two or three modules, so that the base circuit board 128 can realize the connection between the various modules. Electrical connection, thus eliminating the need for connecting cables between the various modules. Further, in order to enable the base circuit board 128 disposed in the base housing 126 to be electrically connected to the at least two modules 14 through the internal interface 122, an interface opening 1263 is provided in the bottom plate 1262 of the base housing 126, and the internal interface 122 It can extend through the interface opening 1263 for interfacing with the various control modules 14 . Here, one interface opening 1263 is provided for each internal interface 122. For example, in the embodiment according to the present disclosure, three interface openings 1263 may be provided in the bottom plate 1262, corresponding to the flight control internal interface 1222 and the radio frequency internal interface respectively. 1224 and the power supply internal interface 1226, the flight control internal interface 1222, the radio frequency internal interface 1224 and the power supply internal interface 1226 respectively extend from the base circuit board 128 through the interface opening 1263 toward the side opposite to the base circuit board 128 of the base plate 1262. In order to strengthen the material strength in the vicinity of the interface opening 1263 , a flange protruding toward the base circuit board 128 or toward the control module 14 is provided on the peripheral edge of the interface opening 1263 . By disposing the flange on the peripheral edge of the interface opening 1263 , not only the structural strength at the interface opening 1263 can be improved, but also the heat dissipation performance of the base housing 126 can be enhanced.
进一步地,为了提高基部电路板128在基部壳体126内的固定稳定性,在基部电路板128的上表面与基部壳体126的底板1262的下表面之间设置柔性填充材料,通过在基部电路板128与基部壳体126之间的空隙内设置填充材料,能够使基部电路板128更加牢固地固定在基部壳体126内。此外,还可以在至少两个控制模块14中的每相邻的两个控制模块所对应的基部电路板128之间设置防水分割部(图中未示出),通过该防水分割部能够为相邻的控制模块14提供空间隔离作用,以便在其中一个控制模块14的防水密封受到破坏而失效后,不会影响相邻的其他控制模块14的防水密封。为了使防水密封电子电路装置10的内腔保持与外界空间之间的一定压力差,可以在基部壳体126上设置防水透气阀(图中未示出),该防水透气阀即能够确保基部壳体126的内部空间的密封性,也能够确保基部壳体126的内部空间与外界空间之间的一定范围内的压力差。Further, in order to improve the fixing stability of the base circuit board 128 in the base case 126, a flexible filling material is arranged between the upper surface of the base circuit board 128 and the lower surface of the bottom plate 1262 of the base case 126, Filling material is arranged in the gap between the board 128 and the base case 126 , so that the base circuit board 128 can be more firmly fixed in the base case 126 . In addition, a waterproof dividing portion (not shown in the figure) may also be provided between the base circuit boards 128 corresponding to each of the at least two control modules 14 adjacent to each other, and the waterproof dividing portion can be used for phase separation. The adjacent control modules 14 provide space isolation, so that after the waterproof seal of one of the control modules 14 is damaged and fails, the waterproof seal of the other adjacent control modules 14 will not be affected. In order to maintain a certain pressure difference between the inner cavity of the waterproof and sealed electronic circuit device 10 and the external space, a waterproof and ventilating valve (not shown in the figure) can be provided on the base shell 126, which can ensure the base shell 126. The airtightness of the inner space of the body 126 can also ensure a pressure difference within a certain range between the inner space of the base case 126 and the outer space.
在根据本公开的防水密封电子电路装置10中,设置在基部12的第二侧面上的外部接口124可以包括每一个控制模块14与外部设备的接口,比如可以包括电源控制模块146的电源接口1242,用于将电源连接至电源控制模块146。在此,外部接口124全部设置为防水连接器,由此能够确保基部电路板128的密封性能。外部接口124与基部电路板128的连接位置可以设置成高度低于灌封胶的灌封高度,比如,外部接口124可以通过焊接方式焊接到基部电路板128的第二侧面上,在利用灌封胶对基部电路板128的第二侧面进行灌封时,能够完全地覆盖外部接口124与基部电路板128之间的焊缝。也就是说,基部壳体126的底板凸缘1264的高度大于基部电路板128的厚度,同时也大于外部接口124与基部电路板128之间的焊缝的高度,由此能够确保施加在基部电路板128的表面上的灌封胶能够覆盖外部接口124与基部电路板128的焊缝,同时在液态状态下不会从基部壳体126的边缘溢出。In the watertight sealed electronic circuit device 10 according to the present disclosure, the external interface 124 provided on the second side of the base 12 may include an interface for each control module 14 to an external device, such as a power interface 1242 that may include a power control module 146 , which is used to connect the power supply to the power supply control module 146 . Here, all the external interfaces 124 are provided as waterproof connectors, whereby the sealing performance of the base circuit board 128 can be ensured. The connection position of the external interface 124 and the base circuit board 128 can be set to a height lower than the potting height of the potting glue. For example, the external interface 124 can be welded to the second side of the base circuit board 128 by welding. When the glue is potted on the second side of the base circuit board 128 , it can completely cover the welding seam between the external interface 124 and the base circuit board 128 . That is, the height of the bottom plate flange 1264 of the base housing 126 is greater than the thickness of the base circuit board 128, and also greater than the height of the welding seam between the external interface 124 and the base circuit board 128, thereby ensuring the application of the base circuit The potting glue on the surface of the board 128 can cover the welding seam between the external interface 124 and the base circuit board 128, and at the same time, it will not overflow from the edge of the base case 126 in a liquid state.
以下说明基部电路板128的结构,基部电路板128可以包括靠近第一侧面的第一电路层和靠近第二侧面的第二电路层,也就是说,可以将基部电路板128设置成多层结构,每一层内设置不同功能的电路,在此仅以设置两层为例进行说明,应该理解的是,基部电路板128可以设置成单层或三层及以上的结构。第一电路层中的电路可以 实现至少两个控制模块14中的任意两个或更多个模块之间的电连接,比如为飞控模块142与射频模块144之间的信号连接,第二电路层可以实现电源控制模块146与飞控模块142和/或射频模块144之间的电源连接,用于为飞控模块142和/或射频模块144供电。在此,可以将第一电路层设置为低压信号层,在该第一电路层中布设的是流通低压信号的电路,相应地,第二电路层可以设置为高压信号层,在第二电路层中布设的是流通高压信号的电路,比如可以为各个模块的电源电路,电源控制模块146与电源接口1242之间的电路即布设在第二电路层内。由此,能够尽可能地减小低压信号与高压信号之间的电磁干扰。进一步地,还可以在第一电路层和第二电路层之间设置有接地层,通过接地层能够更好地隔离第一电路层与第二电路层之间的电磁干扰,由此使得第一电路层与第二电路层内的信号或电流更加稳定。另外,为了提高第二电路层中的通流能力,可以在第二电路层中设置通流条,比如在飞控模块142连接至无人机的电调的电路中,由于无人机的飞行过程中需要较大电流,由此增加了第二电路层中的与外部接口连接的电路的通流负担,在此通过在第二电路层中增加通流条,能够提高第二电路层的通流能力。当然,也可以将第一电路层和第二电路层设置成混流层,即其中即流通低压信号,也流通高压信号,也可以进设置一层电路层。The structure of the base circuit board 128 will be described below. The base circuit board 128 may include a first circuit layer close to the first side and a second circuit layer close to the second side, that is, the base circuit board 128 may be provided in a multi-layer structure , circuits with different functions are arranged in each layer, and only two layers are provided for illustration here. It should be understood that the base circuit board 128 may be arranged in a single-layer or three-layer structure or more. The circuits in the first circuit layer can realize the electrical connection between any two or more modules in the at least two control modules 14, such as the signal connection between the flight control module 142 and the radio frequency module 144, the second circuit The layer may implement the power connection between the power control module 146 and the flight control module 142 and/or the radio frequency module 144 for supplying power to the flight control module 142 and/or the radio frequency module 144 . Here, the first circuit layer can be set as a low-voltage signal layer, and a circuit for circulating low-voltage signals is arranged in the first circuit layer. Correspondingly, the second circuit layer can be set as a high-voltage signal layer, in the second circuit layer The circuit arranged in the middle is a circuit that circulates high-voltage signals, such as the power circuit of each module, and the circuit between the power control module 146 and the power interface 1242 is arranged in the second circuit layer. Thereby, electromagnetic interference between the low-voltage signal and the high-voltage signal can be reduced as much as possible. Further, a ground layer can also be provided between the first circuit layer and the second circuit layer, and the electromagnetic interference between the first circuit layer and the second circuit layer can be better isolated by the ground layer, thereby making the first circuit layer The signal or current in the circuit layer and the second circuit layer is more stable. In addition, in order to improve the current capacity in the second circuit layer, a current bar can be set in the second circuit layer, for example, in the circuit where the flight control module 142 is connected to the ESC of the drone, due to the flight A large current is required in the process, thereby increasing the current load of the circuit connected to the external interface in the second circuit layer. Here, by adding a current bar in the second circuit layer, the conduction of the second circuit layer can be improved. flow capability. Of course, the first circuit layer and the second circuit layer can also be set as a mixed-current layer, that is, both low-voltage signals and high-voltage signals can be passed through them, and one circuit layer can also be set.
以下参照附图4和5对根据本公开的防水密封电子电路装置10的至少两个控制模块14进行说明。控制模块14中的每一个均可包括主电路板1402、用于容纳主电路板1402的第一外壳1404以及用于将主电路板1402封闭在第一外壳1404内的第二外壳1406,其中,控制模块14通过第一外壳1404密封地设置在基部12上。第二外壳1406可以通过螺钉1408固定到第一外壳1404上,从而能够将主电路板1402固定在由第一外壳1404和第二外壳1406形成的空腔内,从而形成独立的控制模块14,以便于对控制模块14进行整体安装和拆卸。在此,第一外壳1404和第二外壳1406均由金属材料制成,这不仅能够提供较高的稳固性,而且便于控制模块14的散热。在如图4和5所示的实施例中,飞控模块142、射频模块144和电源控制模块146三个控制模块均具有上述结构。各个控制模块14与基部12之间均设置有密封结构。该密封结构包括设置在控制模块14与基部12的第一侧面之间的密封垫16,每一个控制模块14均可以通过固定机构固定在基部12上,在此,每一个控制模块14可以通过设置在周缘上的螺钉1410和设置在基部12中的螺孔121固定在基部12上,设置在控制模块14与基部12之间的密封垫16能够为两者之间的连接处提供密封作用。该密封结构还可以包括设置在控制模块14与基部12接触的侧缘上的第一密封垫容置槽1412,和/ 或设置在基部12的与控制模块14相对应的位置上的第二密封垫容置槽(未示出)。通过第一密封垫容置槽1412和/或第二密封垫容置槽可以将密封垫16限位在控制模块14与基部12之间,防止密封垫16在控制模块14与基部12之间发生移位。另外,还可以通过固定控制模块14与基部12的螺钉1410和螺孔121实现控制模块14的第一外壳1404、基部壳体126与基部电路板128的接地层的电连接,由此在三者之间形成法拉第电磁笼,从而防止了防水密封电子电路装置10的内部与外部之间的电磁干扰。The at least two control modules 14 of the watertight sealed electronic circuit device 10 according to the present disclosure will be described below with reference to FIGS. 4 and 5 . Each of the control modules 14 may include a main circuit board 1402, a first housing 1404 for receiving the main circuit board 1402, and a second housing 1406 for enclosing the main circuit board 1402 within the first housing 1404, wherein, The control module 14 is sealingly disposed on the base 12 by a first housing 1404 . The second housing 1406 may be secured to the first housing 1404 by screws 1408, thereby enabling the main circuit board 1402 to be secured within the cavity formed by the first housing 1404 and the second housing 1406 to form a separate control module 14 so as to For the overall installation and removal of the control module 14 . Here, both the first casing 1404 and the second casing 1406 are made of metal materials, which can not only provide high stability, but also facilitate the heat dissipation of the control module 14 . In the embodiments shown in FIGS. 4 and 5 , the three control modules of the flight control module 142 , the radio frequency module 144 and the power control module 146 all have the above structures. A sealing structure is provided between each control module 14 and the base 12 . The sealing structure includes a gasket 16 disposed between the control modules 14 and the first side surface of the base 12. Each control module 14 can be fixed on the base 12 by a fixing mechanism. Here, each control module 14 can be set by Screws 1410 on the periphery and screw holes 121 provided in the base 12 are fixed on the base 12, and the gasket 16 provided between the control module 14 and the base 12 can provide a sealing effect for the connection between the two. The sealing structure may further include a first gasket accommodating groove 1412 provided on the side edge of the control module 14 in contact with the base 12 , and/or a second seal provided on the base 12 at a position corresponding to the control module 14 . Pad receiving slot (not shown). The first sealing gasket accommodating groove 1412 and/or the second sealing gasket accommodating groove can limit the sealing gasket 16 between the control module 14 and the base 12 to prevent the sealing gasket 16 from occurring between the control module 14 and the base 12 shift. In addition, the electrical connection between the first shell 1404 of the control module 14, the base shell 126 and the ground layer of the base circuit board 128 can also be realized by fixing the screws 1410 and the screw holes 121 of the control module 14 and the base 12, so that the three A Faraday electromagnetic cage is formed therebetween, thereby preventing electromagnetic interference between the inside and the outside of the watertightly sealed electronic circuit device 10 .
如图5所示,在第二外壳1406中设置有能够使设置在基部12上的内部接口122穿过的外壳开口1407,也就是说,外壳开口1407能够将设置在控制模块14的主电路板1402上的接口暴露出来,以便与内部接口122进行对接。另外,为了便于对主电路板1402进行散热,还可以在第二外壳1406上设置至少一个凸起部1409。当然,也可以不在第二外壳1406上设置相应的凸起部1409。可以在第一外壳1404的与基部12相背离的一侧上设置散热结构1405,散热结构1405可以包括散热鳍片,散热鳍片的设置方向可以与无人机风场到机头罩内的气流引流方向一致,由此可以保证最佳散热效率和最轻散热重量。散热结构1405有利于将由主电路板1402发出的热量散发出去,从而保持控制模块14的温度在一定范围内。As shown in FIG. 5 , the second housing 1406 is provided with a housing opening 1407 through which the internal interface 122 provided on the base 12 can pass through, that is to say, the housing opening 1407 enables the main circuit board provided on the control module 14 The interface on 1402 is exposed for interfacing with the internal interface 122. In addition, in order to facilitate heat dissipation of the main circuit board 1402 , at least one protruding portion 1409 may also be provided on the second housing 1406 . Of course, the corresponding protrusions 1409 may not be provided on the second housing 1406 . A heat dissipation structure 1405 may be provided on the side of the first housing 1404 that is away from the base 12, and the heat dissipation structure 1405 may include heat dissipation fins. The direction of drainage is the same, which can ensure the best heat dissipation efficiency and the lightest heat dissipation weight. The heat dissipation structure 1405 is beneficial to dissipate the heat emitted by the main circuit board 1402, so as to keep the temperature of the control module 14 within a certain range.
为了便于将组装好的控制模块14准确地安装到基部12上,在控制模块14与基部12之间设置有预定位机构,该预定位机构可以包括设置在基部12上的导向销132和设置在控制模块14中的导向孔148,如图3和图4所示。当然,也可以将导向销设置在控制模块14上,同时将导向孔设置在基板上,或者还可以采用其他对准定位机构,比如齿和槽。可以通过预定位机构实现控制模块14与基部12的便利安装和预定位,然后通过螺钉1410将控制模块14紧固到基部12上。In order to facilitate the accurate installation of the assembled control module 14 on the base 12, a pre-positioning mechanism is provided between the control module 14 and the base 12, and the pre-positioning mechanism may include a guide pin 132 provided on the base 12 and a guide pin 132 provided on the base 12. The guide holes 148 in the control module 14 are shown in FIGS. 3 and 4 . Of course, the guide pins can also be arranged on the control module 14, while the guide holes can be arranged on the base plate, or other alignment and positioning mechanisms, such as teeth and grooves, can also be used. Convenient installation and pre-positioning of the control module 14 with the base 12 can be accomplished by a pre-positioning mechanism, and then the control module 14 is fastened to the base 12 via screws 1410 .
在将根据本公开的防水密封电子电路装置10安装到无人机上时,还需要尽可能地减轻无人机飞行过程中对电子电路装置10的震动,为此,在对电子电路装置10进行安装的位置上设置减震部件134,比如在将电子电路装置10的基部12安装到无人机的位置上设置有减震部件134,比如为减震垫,如图2所示。进一步地,还可以在基部12上设置安装凸台136,并将减震部件134设置在安装凸台136上,从而在将防水密封电子电路装置10安装到无人机上时,通过设置在安装凸台136与无人机之间的减震部件134对无人机传递给防水密封电子电路装置10的震动进行减缓,以确保防水密封电子电路装置10运行的稳定性。When installing the waterproof and sealed electronic circuit device 10 according to the present disclosure to the drone, it is also necessary to reduce the vibration of the electronic circuit device 10 during the flight of the drone as much as possible. A shock absorbing member 134 is provided at the position where the base 12 of the electronic circuit device 10 is mounted to the drone, such as a shock absorbing pad, as shown in FIG. 2 . Further, a mounting boss 136 can also be provided on the base 12, and the damping member 134 can be set on the mounting boss 136, so that when the waterproof and sealed electronic circuit device 10 is mounted on the drone, the mounting boss 134 can be installed on the mounting boss 136. The shock absorbing component 134 between the stage 136 and the UAV slows down the vibration transmitted by the UAV to the waterproof and sealed electronic circuit device 10 , so as to ensure the stability of the operation of the waterproof and sealed electronic circuit device 10 .
根据本公开的防水密封电子电路装置10采用了模块间用基板相连的方案,模块 与基板之间只有一道防水密封点,因此大大减小了防水失效的概率。模块与模块之间通过基板互连,避免使用大量线缆,解决了模块化和减少互连线缆的矛盾关系。对外连接器均设置在基板的另一侧面,并采用防水连接器,由此确保了基板侧的防水密封性能。本公开的技术方案还能够保证连接器与模块之间、连接器与连接器之间以及模块与模块之间的完全分腔隔离,避免单个连接器或单个模块的防水失效导致整个电路装置的故障。此外,防水连接器体积较小,可以减小基板的体积,从而减轻整体重量,降低成本。由于基部12的采用了第一侧面为金属材质,比如为铝,另一侧面为灌封胶处理,灌封胶的密度仅为铝密度的1/3,因此能够减小基部12的重量。另外,由于至少两个控制模块直接通过螺钉固定在基部上,因此在特定控制模块发生故障时,仅需对发生故障的控制模块进行拆卸,无需拆卸和更换其他正常模块,从而节省了人力工时。通过在基部的第二侧面进行灌封胶处理,可以增强外部接口的连接强度,提高其可靠性。The waterproof and sealed electronic circuit device 10 according to the present disclosure adopts the solution that the modules are connected by a substrate, and there is only one waterproof sealing point between the module and the substrate, thus greatly reducing the probability of waterproof failure. The modules are interconnected through the base plate, avoiding the use of a large number of cables, and solving the contradiction between modularization and reducing interconnection cables. The external connectors are all arranged on the other side of the substrate, and waterproof connectors are used, thereby ensuring the waterproof sealing performance on the substrate side. The technical solution of the present disclosure can also ensure complete cavity isolation between the connector and the module, between the connector and the connector, and between the module and the module, and avoid the failure of the entire circuit device caused by the waterproof failure of a single connector or a single module. . In addition, the waterproof connector is small in size, which can reduce the volume of the substrate, thereby reducing the overall weight and cost. Since the first side of the base 12 is made of metal, such as aluminum, and the other side is treated with potting glue, the density of the potting glue is only 1/3 of that of aluminum, so the weight of the base 12 can be reduced. In addition, since at least two control modules are directly fixed on the base by screws, when a specific control module fails, only the failed control module needs to be disassembled, and other normal modules do not need to be disassembled and replaced, thereby saving man-hours. By performing potting glue treatment on the second side of the base, the connection strength of the external interface can be enhanced and the reliability thereof can be improved.
本公开还涉及一种移动平台,该移动平台包括如上所述的防水密封电子电路装置10,该移动平台可以包括但不限于在陆地上、水上或空中可移动的物体,例如,该移动平台可以是无人飞行器、无人船、无人车、机器人等。可选的,本实施例中的移动平台可以为无人飞行器。The present disclosure also relates to a mobile platform comprising the waterproof sealed electronic circuit device 10 as described above, the mobile platform may include but not limited to objects movable on land, water or air, for example, the mobile platform may It is unmanned aerial vehicle, unmanned ship, unmanned vehicle, robot, etc. Optionally, the mobile platform in this embodiment may be an unmanned aerial vehicle.
另外,本公开还涉及一种电子设备,该电子设备包括如上所述的防水密封电子电路装置10,该电子设备可以应用于环境恶劣的应用场景下,其具有良好的密封性能和耐腐蚀性能。In addition, the present disclosure also relates to an electronic device, which includes the above-mentioned waterproof and sealed electronic circuit device 10 . The electronic device can be applied to application scenarios with harsh environments, and has good sealing performance and corrosion resistance.
以上所述仅为本公开的优选实施例而已,并不用于限制本公开,对于本领域的技术人员来说,本公开可以有各种更改和变化。凡在本公开的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本公开的保护范围之内。The above descriptions are only preferred embodiments of the present disclosure, and are not intended to limit the present disclosure. For those skilled in the art, the present disclosure may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present disclosure shall be included within the protection scope of the present disclosure.

Claims (23)

  1. 一种防水密封电子电路装置,其特征在于,包括:A waterproof and sealed electronic circuit device is characterized in that, comprising:
    基部;base;
    至少两个控制模块,所述至少两个控制模块密封地设置在所述基部的第一侧面上;at least two control modules sealingly disposed on the first side of the base;
    其中,所述基部包括内部接口和外部接口,所述内部接口用于与所述至少两个控制模块电连接,以实现所述至少两个控制模块中的任意两个或更多个之间的电连接,所述外部接口用于与外部设备电连接。Wherein, the base includes an internal interface and an external interface, and the internal interface is used for electrical connection with the at least two control modules, so as to realize the communication between any two or more of the at least two control modules. Electrical connection, the external interface is used for electrical connection with external equipment.
  2. 根据权利要求1所述的防水密封电子电路装置,其特征在于,The waterproof and sealed electronic circuit device according to claim 1, wherein:
    所述基部的所述外部接口设置在所述基部的与所述第一侧面相反的第二侧面上。The external interface of the base is provided on a second side of the base opposite the first side.
  3. 根据权利要求1所述的防水密封电子电路装置,其特征在于,The waterproof and sealed electronic circuit device according to claim 1, wherein:
    所述基部包括基部壳体、设置在所述基部壳体内的基部电路板以及将所述基部电路板密封地设置在所述基部壳体上的防水密封层。The base includes a base case, a base circuit board disposed in the base case, and a waterproof sealing layer sealingly disposing the base circuit board on the base case.
  4. 根据权利要求3所述的防水密封电子电路装置,其特征在于,The waterproof and sealed electronic circuit device according to claim 3, wherein,
    所述基部壳体上设置有接口开口,所述内部接口通过所述接口开口伸出,以便与所述控制模块对接。An interface opening is provided on the base housing, and the internal interface protrudes through the interface opening so as to be connected with the control module.
  5. 根据权利要求4所述的防水密封电子电路装置,其特征在于,The waterproof and sealed electronic circuit device according to claim 4, wherein,
    所述接口开口的周缘上设置有朝向所述基部电路板或朝向所述控制模块突出的凸缘。A flange protruding toward the base circuit board or toward the control module is provided on the periphery of the interface opening.
  6. 根据权利要求3所述的防水密封电子电路装置,其特征在于,The waterproof and sealed electronic circuit device according to claim 3, wherein,
    所述基部电路板的上表面与所述基部壳体的底板的下表面之间设置有柔性填充材料。A flexible filling material is provided between the upper surface of the base circuit board and the lower surface of the bottom plate of the base housing.
  7. 根据权利要求3所述的防水密封电子电路装置,其特征在于,The waterproof and sealed electronic circuit device according to claim 3, wherein,
    所述至少两个控制模块中的每相邻的两个控制模块所对应的基部电路板之间设 置有防水分割部。A waterproof dividing portion is provided between the base circuit boards corresponding to each of the two adjacent control modules in the at least two control modules.
  8. 根据权利要求3所述的防水密封电子电路装置,其特征在于,The waterproof and sealed electronic circuit device according to claim 3, wherein,
    所述基部壳体上设置防水透气阀,以使所述基部壳体的内部空间与外界空间保持一定的压力差。A waterproof and breathable valve is arranged on the base shell to keep a certain pressure difference between the inner space of the base shell and the outside space.
  9. 根据权利要求3所述的防水密封电子电路装置,其特征在于,The waterproof and sealed electronic circuit device according to claim 3, wherein,
    所述基部电路板包括第一电路层和第二电路层,所述第一电路层靠近所述第一侧面,所述第二电路层靠近与所述第一侧面相反的第二侧面,所述第一电路层中的电路实现所述至少两个控制模块之间的电连接。The base circuit board includes a first circuit layer and a second circuit layer, the first circuit layer is adjacent to the first side, the second circuit layer is adjacent to a second side opposite the first side, the Circuits in the first circuit layer enable electrical connection between the at least two control modules.
  10. 根据权利要求9所述的防水密封电子电路装置,其特征在于,The waterproof and sealed electronic circuit device according to claim 9, wherein,
    所述第一电路层内设置有低压信号电路,所述第二电路层内设置有高压信号电路和/或电源电路。The first circuit layer is provided with a low-voltage signal circuit, and the second circuit layer is provided with a high-voltage signal circuit and/or a power supply circuit.
  11. 根据权利要求9或10所述的防水密封电子电路装置,其特征在于,The waterproof and sealed electronic circuit device according to claim 9 or 10, characterized in that:
    所述第一电路层和所述第二电路层之间设置有接地层。A ground layer is provided between the first circuit layer and the second circuit layer.
  12. 根据权利要求10所述的防水密封电子电路装置,其特征在于,The waterproof and sealed electronic circuit device according to claim 10, wherein:
    所述第二电路层中设置有通流层。A current flow layer is provided in the second circuit layer.
  13. 根据权利要求3所述的防水密封电子电路装置,其特征在于,The waterproof and sealed electronic circuit device according to claim 3, wherein,
    所述防水密封层通过填充灌封胶形成,所述防水密封层将所述基部电路板和至少部分所述外部接口共同密封。The waterproof sealing layer is formed by filling potting glue, and the waterproof sealing layer jointly seals the base circuit board and at least part of the external interface.
  14. 根据权利要求1所述的防水密封电子电路装置,其特征在于,The waterproof and sealed electronic circuit device according to claim 1, wherein:
    所述控制模块包括主电路板、用于容纳所述主电路板的第一外壳以及用于将所述主电路板封闭在所述第一外壳内的第二外壳,其中,所述控制模块通过所述第一外壳密封地设置在所述基部上。The control module includes a main circuit board, a first housing for accommodating the main circuit board, and a second housing for enclosing the main circuit board in the first housing, wherein the control module passes through the The first housing is sealingly disposed on the base.
  15. 根据权利要求14所述的防水密封电子电路装置,其特征在于,The waterproof and sealed electronic circuit device according to claim 14, wherein:
    所述第二外壳中设置有能够使设置在所述基板上的所述内部接口穿过的外壳开口。The second housing is provided with a housing opening through which the internal interface provided on the base plate can pass.
  16. 根据权利要求14所述的防水密封电子电路装置,其特征在于,The waterproof and sealed electronic circuit device according to claim 14, wherein:
    所述第二外壳上设置有至少一个凸起部。At least one raised portion is provided on the second shell.
  17. 根据权利要求14所述的防水密封电子电路装置,其特征在于,The waterproof and sealed electronic circuit device according to claim 14, wherein:
    所述第一外壳的与所述基板相背离的一侧上设置有散热结构。A heat dissipation structure is provided on the side of the first casing away from the substrate.
  18. 根据权利要求1所述的防水密封电子电路装置,其特征在于,The waterproof and sealed electronic circuit device according to claim 1, wherein:
    所述控制模块与所述基部之间设置有密封结构,所述密封结构包括设置在所述控制模块与所述基部的第一侧面之间的密封垫。A sealing structure is provided between the control module and the base, and the sealing structure includes a sealing gasket provided between the control module and the first side of the base.
  19. 根据权利要求18所述的防水密封电子电路装置,其特征在于,The waterproof and sealed electronic circuit device according to claim 18, wherein:
    所述密封结构还包括设置在所述控制模块的与所述基部接触的侧缘上的第一密封垫容置槽,和/或设置在所述基部的与所述控制模块相对应的位置上的第二密封垫容置槽。The sealing structure further includes a first sealing gasket accommodating groove provided on the side edge of the control module in contact with the base, and/or provided at a position of the base corresponding to the control module the second gasket accommodating groove.
  20. 根据权利要求1所述的防水密封电子电路装置,其特征在于,The waterproof and sealed electronic circuit device according to claim 1, wherein:
    所述控制模块与所述基部之间设置有预定位机构,A pre-positioning mechanism is arranged between the control module and the base,
    其中,所述预定位机构包括设置在所述基部上的导向销和设置在所述控制模块中的导向孔,或者Wherein, the pre-positioning mechanism includes a guide pin arranged on the base and a guide hole arranged in the control module, or
    所述预定位机构包括设置在所述控制模块上的导向销和设置在所述基部中的导向孔。The pre-positioning mechanism includes a guide pin provided on the control module and a guide hole provided in the base.
  21. 根据权利要求1所述的防水密封电子电路装置,其特征在于,The waterproof and sealed electronic circuit device according to claim 1, wherein:
    在对所述电子电路装置进行安装的位置上设置有减震部件。A shock absorbing member is provided at a position where the electronic circuit device is mounted.
  22. 一种移动平台,其特征在于,包括根据权利要求1-21中任一项所述的防水 密封电子电路装置。A mobile platform, characterized by comprising the waterproof and sealed electronic circuit device according to any one of claims 1-21.
  23. 一种电子设备,其特征在于,包括根据权利要求1-21中任一项所述的防水密封电子电路装置。An electronic device, characterized by comprising the waterproof and sealed electronic circuit device according to any one of claims 1-21.
PCT/CN2020/127055 2020-11-06 2020-11-06 Watertight sealed electronic-circuit apparatus and related electronic device and mobile platform WO2022094915A1 (en)

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CN115175504A (en) * 2022-07-29 2022-10-11 苏州浪潮智能科技有限公司 Waterproof device and equipment to be waterproofed

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CN208549096U (en) * 2018-08-08 2019-02-26 广州极飞科技有限公司 Electric-regulating device and aircraft
CN209693273U (en) * 2018-11-29 2019-11-26 广州极飞科技有限公司 Sealing structure, electronic device and unmanned plane
CN209881971U (en) * 2019-06-11 2019-12-31 珠海云洲智能科技有限公司 Exchange control module

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US20110051383A1 (en) * 2009-08-31 2011-03-03 Shenzhen Futaihong Precision Industry Co., Ltd. Waterproof structure for portable electronic device
CN208549096U (en) * 2018-08-08 2019-02-26 广州极飞科技有限公司 Electric-regulating device and aircraft
CN209693273U (en) * 2018-11-29 2019-11-26 广州极飞科技有限公司 Sealing structure, electronic device and unmanned plane
CN209881971U (en) * 2019-06-11 2019-12-31 珠海云洲智能科技有限公司 Exchange control module

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115175504A (en) * 2022-07-29 2022-10-11 苏州浪潮智能科技有限公司 Waterproof device and equipment to be waterproofed
CN115175504B (en) * 2022-07-29 2023-08-25 苏州浪潮智能科技有限公司 Waterproof device and equipment to be waterproof

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