WO2022089695A1 - Electronic module and method for producing an electronic module of this type - Google Patents

Electronic module and method for producing an electronic module of this type Download PDF

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Publication number
WO2022089695A1
WO2022089695A1 PCT/DE2021/200161 DE2021200161W WO2022089695A1 WO 2022089695 A1 WO2022089695 A1 WO 2022089695A1 DE 2021200161 W DE2021200161 W DE 2021200161W WO 2022089695 A1 WO2022089695 A1 WO 2022089695A1
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WO
WIPO (PCT)
Prior art keywords
electrically conductive
printed
cohesive
electrically
circuit board
Prior art date
Application number
PCT/DE2021/200161
Other languages
German (de)
French (fr)
Inventor
Marius-Andrei Muntean
Original Assignee
Continental Automotive Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Automotive Gmbh filed Critical Continental Automotive Gmbh
Publication of WO2022089695A1 publication Critical patent/WO2022089695A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • H05K9/0033—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids disposed on both PCB faces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09354—Ground conductor along edge of main surface
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]

Definitions

  • the present invention relates to an electronic module and a method for producing such an electronic module.
  • Known electronic modules according to the prior art comprise a printed circuit board, the printed circuit board comprising printed electrically conductive tracks and printed electrically conductive pads and electronic parts which are electrically and mechanically connected to the printed electrically conductive tracks and/or the printed electrically conductive pads.
  • electromagnetic shielding is used to prevent radiation from leaving the electronics module from the inside and entering the electronics module from the outside.
  • shielding boxes made of ferromagnetic sheet iron are used. These shielding boxes are costly and present problems when needed for functional and sustained ferromagnetic shielding.
  • the object of the present invention is to provide an inexpensive and effective electromagnetic shield for an electronic module and the method for producing such an electromagnetic shield. These objects are achieved by an electronic module having the feature according to claim 1 and a method for producing an electronic module according to claim 6.
  • the dependent claims show preferred embodiments of the invention.
  • the cohesive electrically insulating material and the cohesive electrically conductive material can be materials that have a fluid or paste-like form before being applied to the printed circuit board and the electronic parts and which harden after being applied to the printed circuit board.
  • the module is additionally mechanically protected by using a cohesive electrically insulating material covering the electronic parts and the printed electrically conductive tracks and the printed electrically conductive pads.
  • a surrounding printed electrically conductive trace surrounds the electronic parts and the cohesive electrically conductive material is electrically and mechanically connected to the surrounding printed electrically conductive trace at several positions directly or via some of the printed electrically conductive pads, the electromagnetic shielding is further improved.
  • the shielding is further improved since all frequencies are prevented from entering the area between the electrically conductive material and to traverse the surrounding printed electrically conductive track.
  • the cohesive electrically insulating material is an electrically insulating varnish
  • this material is easy to handle and provides good coverage of the electronic parts and the space between parts.
  • the cohesive electrically conductive material is an electrically conductive paint
  • this material is also easy to handle and provides good coverage of the electronics and the space between parts.
  • the cohesive electrically conductive material is electrically connected to a ground potential, the electromagnetic shielding is further improved.
  • the printed circuit board has a first side with printed electrically conductive tracks and printed electrically conductive pads and electronic parts that are electrically and mechanically connected to the printed electrically conductive tracks and/or the printed electrically conductive pads are connected, and the circuit board includes a second side and the cohesive electrically conductive material also covers the second side of the circuit board and is electrically connected to the cohesive electrically conductive material of the first side of the circuit board, then the radiation of electromagnetic Waves from within the electronic module are suppressed in all directions, and the radiation of electromagnetic waves from outside into the electronic module is also suppressed.
  • the electronic module with the electronic parts and the printed electrical tracks and/or the electrical pads is considered with a first template, the cohesive electrically insulated material can easily pass through the template apply to the electronic parts and the space between the electronic parts.
  • the cohesive electrically conductive material is continuously electrically connected to the surrounding printed electrically conductive track and/or printed electrically conductive pads, the electromagnetic shielding is very good.
  • the cohesive electrically conductive material can be electrically connected to a ground potential.
  • FIG. 1 shows a view of a first embodiment of the invention.
  • FIG. 2 shows a sectional view through a second embodiment of the invention.
  • FIG. 1 shows a circuit board 100, a first electronic part 200, a second electronic part 201, a third electronic part 202, an electrically conductive pad 300, a cohesive electrically insulating material 400 and a cohesive electrically conductive material 500 with four bulges 501.
  • the first electronic part 200 can be a microprocessor
  • the second electronic part 201 can be a logic circuit
  • the third electronic part 202 can be e.g. B. be a resistor, a capacitor or a coil.
  • the cohesive electrically insulating material 400 does not completely cover the printed circuit board 100, but only areas of the printed circuit board 100 in which electronic parts, e.g. B.
  • the first, the second and the third electronic part 200, 201, 202 are located, and the areas covered in their vicinity. Areas with electrically conductive pads are not covered with the cohesive electrically insulating material 400 when the respective electrically conductive pad is used to connect to the electrically conductive material 500 .
  • four bulges 501 which are respective parts of the cohesive electrically conductive material 500 , extend over the area covered by the cohesive electrically insulating material 400 to connect the electrically conductive material 500 to the four electrically conductive pads 300 .
  • the cohesive electrically insulating material 400 is not completely covered by the cohesive electrically conductive material 500 in order to save electrically conductive material where it is not needed, but it is possible to completely cover the cohesive electrically insulating material 300 with the cohesive electrically conductive material 500 to cover. Only the parts, traces and pads that are to be shielded need to be covered by the cohesive electrically conductive material 500 .
  • Other electrically conductive tracks and/or other electrically conductive pads are not shown because they are covered by the electronic parts 200, 201, 202 and/or by the electrically insulating material 400 are covered and because they are not electrically connected to the cohesive electrically conductive material 500.
  • FIG. 2 shows a printed circuit board 100, a third electronic part 202, an electrically conductive pad 300, a cohesive electrically insulating material 400 and a cohesive electrically conductive material 500.
  • FIG. These parts mentioned above have the same or similar properties as the module described in FIG.
  • a second layer of electrically conductive material 600 is deposited on the side of circuit board 100 opposite the side on which electronics part 202 is positioned. This second layer of electrically conductive material 600 is connected to the conductive pads 300 and therefore to the (first) cohesive electrically conductive material 500 by means of vias 800 . Very good shielding is achieved in this way.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The invention relates to an electronic module comprising a circuit board (100), wherein the circuit board (100) comprises: - printed electrically conductive tracks; - printed electrically conductive pads (300); and - electronic parts (200, 201, 202), which are electrically and mechanically connected to the printed electrically conductive tracks and/or to the printed electrically conductive pads (300). The electronic parts (200, 201, 202) and a part of the circuit board (100) which contains printed electrically conductive tracks and printed electrically conductive pads are covered with a cohesive electrically insulated material (400), and the cohesive electrically insulated material (400) is covered by a cohesive electrically conductive material (500) and connected thereto, the cohesive electrically conductive material (500) being mechanically and electrically connected to at least one of the printed electrically conductive pads (300) and/or one of the printed electrically conductive tracks.

Description

Beschreibung description
Elektronikmodul und Verfahren zum Herstellen eines solchen Elektronikmoduls Electronic module and method for manufacturing such an electronic module
Die vorliegende Erfindung betrifft ein Elektronikmodul und ein Verfahren zum Herstellen eines solchen Elektronikmoduls. Bekannte Elektronikmodule gemäß dem Stand der Technik umfassen eine Leiterplatte, wobei die Leiterplatte gedruckte elektrisch leitfähige Bahnen und gedruckte elektrisch leitfähige Pads sowie Elektronikteile, die elektrisch und mechanisch mit den gedruckten elektrisch leitfähigen Bahnen und/oder den gedruckten elektrisch leitfähigen Pads verbunden sind, umfasst. Da einige Elektronikmodule sehr hohe Frequenzen im Bereich von bis zu mehr als einem Gigahertz verwenden, erzeugt die Verwendung derartiger Module viele elektromagnetische Störungen, die sich nicht negativ auf die Umgebung in der Nähe des Elektronikmoduls auswirken sollten. Daher wird elektromagnetische Abschirmung verwendet, um zu verhindern, dass Strahlung das Elektronikmodul von innen verlässt und von außen in das Elektronikmodul eintritt. Bei bekannter elektromagnetischer Abschirmung werden Abschirmboxen aus ferromagnetischen Eisenblechen verwendet. Diese Abschirmboxen sind kostspielig und bringen Probleme mit sich, wenn sie für eine funktionierende und anhaltende ferromagnetische Abschirmung benötigt werden. The present invention relates to an electronic module and a method for producing such an electronic module. Known electronic modules according to the prior art comprise a printed circuit board, the printed circuit board comprising printed electrically conductive tracks and printed electrically conductive pads and electronic parts which are electrically and mechanically connected to the printed electrically conductive tracks and/or the printed electrically conductive pads. Because some electronic modules use very high frequencies, in the range up to more than one gigahertz, the use of such modules generates a lot of electromagnetic interference, which should not negatively affect the environment in the vicinity of the electronic module. Therefore, electromagnetic shielding is used to prevent radiation from leaving the electronics module from the inside and entering the electronics module from the outside. With known electromagnetic shielding, shielding boxes made of ferromagnetic sheet iron are used. These shielding boxes are costly and present problems when needed for functional and sustained ferromagnetic shielding.
Die Aufgabe der vorliegenden Erfindung besteht in der Bereitstellung einer kostengünstigen und wirksamen elektromagnetischen Abschirmung für ein Elektronikmodul und des Verfahrens zum Herstellen einer solchen elektromagnetisch Abschirmung. Diese Aufgaben werden durch ein Elektronikmodul mit dem Merkmal nach Anspruch 1 und ein Verfahren zum Herstellen eines Elektronikmoduls nach Anspruch 6 erfüllt. Die abhängigen Ansprüche zeigen bevorzugte Ausführungsformen der Erfindung. The object of the present invention is to provide an inexpensive and effective electromagnetic shield for an electronic module and the method for producing such an electromagnetic shield. These objects are achieved by an electronic module having the feature according to claim 1 and a method for producing an electronic module according to claim 6. The dependent claims show preferred embodiments of the invention.
Bei dem kohäsiven elektrisch isolierten Material und dem kohäsiven elektrisch leitfähigen Material kann es sich um Materialien handeln, die vor dem Aufbringen auf die Leiterplatte und die Elektronikteile eine fluid- oder pastenähnliche Form aufweisen und nach dem Aufbringen auf die Leiterplatte aushärten. Durch Verwendung eines kohäsiven elektrisch isolierten Materials, das die Elektronikteile und die gedruckten elektrisch leitfähigen Bahnen und die gedruckten elektrisch leitfähigen Pads abdeckt, wird das Modul zusätzlich mechanisch geschützt. The cohesive electrically insulating material and the cohesive electrically conductive material can be materials that have a fluid or paste-like form before being applied to the printed circuit board and the electronic parts and which harden after being applied to the printed circuit board. The module is additionally mechanically protected by using a cohesive electrically insulating material covering the electronic parts and the printed electrically conductive tracks and the printed electrically conductive pads.
Wenn eine umgebende gedruckte elektrisch leitfähige Bahn die Elektronikteile umgibt und das kohäsive elektrisch leitfähige Material an mehreren Positionen elektrisch und mechanisch direkt oder über einige der gedruckten elektrisch leitfähigen Pads mit der umgebenden gedruckten elektrisch leitfähigen Bahn verbunden ist, wird die elektromagnetische Abschirmung weiter verbessert. If a surrounding printed electrically conductive trace surrounds the electronic parts and the cohesive electrically conductive material is electrically and mechanically connected to the surrounding printed electrically conductive trace at several positions directly or via some of the printed electrically conductive pads, the electromagnetic shielding is further improved.
Falls das kohäsive elektrisch leitfähige Material ununterbrochen mechanisch und elektrisch direkt oder über einige der gedruckten elektrisch leitfähigen Pads mit der umgebenden gedruckten elektrisch leitfähigen Bahn verbunden ist, wird die Abschirmung weiter verbessert, da sämtliche Frequenzen daran gehindert werden, den Bereich zwischen dem elektrisch leitfähigen Material und der umgebenden gedruckten elektrisch leitfähigen Bahn zu durchqueren. If the cohesive electrically conductive material is continuously mechanically and electrically connected to the surrounding printed electrically conductive path directly or through some of the printed electrically conductive pads, the shielding is further improved since all frequencies are prevented from entering the area between the electrically conductive material and to traverse the surrounding printed electrically conductive track.
Handelt es sich bei dem kohäsiven elektrisch isolierten Material um einen elektrisch isolierenden Lack, so ist dieses Material leicht zu handhaben und liefert eine gute Abdeckung der Elektronikteile und des Raums zwischen den Teilen. When the cohesive electrically insulating material is an electrically insulating varnish, this material is easy to handle and provides good coverage of the electronic parts and the space between parts.
Handelt es sich bei dem kohäsiven elektrisch leitfähigen Material um einen elektrisch leitfähigen Lack, so ist auch dieses Material leicht zu handhaben und liefert eine gute Abdeckung der Elektronikteile und des Raums zwischen den Teilen. When the cohesive electrically conductive material is an electrically conductive paint, this material is also easy to handle and provides good coverage of the electronics and the space between parts.
Ist das kohäsive elektrisch leitfähige Material elektrisch mit einem Massepotenzial verbunden, so wird die elektromagnetische Abschirmung weiter verbessert. If the cohesive electrically conductive material is electrically connected to a ground potential, the electromagnetic shielding is further improved.
Wenn die Leiterplatte eine erste Seite mit gedruckten elektrisch leitfähigen Bahnen und gedruckten elektrisch leitfähigen Pads und Elektronikteilen, die elektrisch und mechanisch mit den gedruckten elektrisch leitfähigen Bahnen und/oder den gedruckten elektrisch leitfähigen Pads verbunden sind, umfasst und die Leiterplatte eine zweite Seite umfasst und das kohäsive elektrisch leitfähige Material auch die zweite Seite der Leiterplatte abdeckt und elektrisch mit dem kohäsiven elektrisch leitfähigen Material der ersten Seite der Leiterplatte verbunden ist, dann wird die Strahlung von elektromagnetischen Wellen von innerhalb des Elektronikmoduls in allen Richtungen unterdrückt, und die Strahlung von elektromagnetischen Wellen von außerhalb in das Elektronikmodul wird ebenfalls unterdrückt. If the printed circuit board has a first side with printed electrically conductive tracks and printed electrically conductive pads and electronic parts that are electrically and mechanically connected to the printed electrically conductive tracks and/or the printed electrically conductive pads are connected, and the circuit board includes a second side and the cohesive electrically conductive material also covers the second side of the circuit board and is electrically connected to the cohesive electrically conductive material of the first side of the circuit board, then the radiation of electromagnetic Waves from within the electronic module are suppressed in all directions, and the radiation of electromagnetic waves from outside into the electronic module is also suppressed.
Wird bei einem Verfahren zum Herstellen eines Elektronikmoduls mit einem oder mehreren der beschriebenen Merkmale das Elektronikmodul mit den Elektronikteilen und den gedruckten elektrischen Bahnen und/oder den elektrischen Pads mit einer ersten Schablone bedenkt, so lässt sich das kohäsive elektrisch isolierte Material leicht durch die Schablone über die Elektronikteile und dem Raum zwischen den Elektronikteilen aufbringen. If, in a method for producing an electronic module with one or more of the features described, the electronic module with the electronic parts and the printed electrical tracks and/or the electrical pads is considered with a first template, the cohesive electrically insulated material can easily pass through the template apply to the electronic parts and the space between the electronic parts.
Wird das kohäsive elektrisch isolierte Material mit einer zweiten Schablone bedeckt und das kohäsive elektrisch leitfähige Material durch die zweite Schablone über das kohäsive elektrisch isolierte Material aufgebracht, sodass das kohäsive elektrisch leitfähige Material die Elektronikteile und den Raum zwischen den Elektronikteilen abdeckt und mit mindestens einem der elektrisch leitfähigen Pads und/oder einer der gedruckten elektrisch leitfähigen Bahnen verbunden ist, so wird die Herstellung weiter verbessert. Covering the cohesive electrically insulating material with a second stencil and applying the cohesive electrically conductive material through the second stencil over the cohesive electrically insulating material such that the cohesive electrically conductive material covers the electronics and the space between the electronics and with at least one of the electrically conductive pads and / or one of the printed electrically conductive tracks is connected, so the production is further improved.
Ist das kohäsive elektrisch leitfähige Material ununterbrochen elektrisch mit der umgebenden gedruckten elektrisch leitfähigen Bahn und/oder den gedruckten elektrisch leitfähigen Pads verbunden, so ist die elektromagnetische Abschirmung sehr gut. If the cohesive electrically conductive material is continuously electrically connected to the surrounding printed electrically conductive track and/or printed electrically conductive pads, the electromagnetic shielding is very good.
Wird das Elektronikmodul stationär oder in einem Fahrzeug montiert verwendet, so kann das kohäsive elektrisch leitfähige Material elektrisch mit einem Massepotenzial verbunden sein. Die Erfindung wird nun mithilfe der Figuren für zwei bevorzugte Ausführungsformen beschrieben. If the electronics module is used stationary or mounted in a vehicle, the cohesive electrically conductive material can be electrically connected to a ground potential. The invention will now be described with the aid of the figures for two preferred embodiments.
Figur 1 zeigt eine Ansicht einer ersten Ausführungsform der Erfindung. FIG. 1 shows a view of a first embodiment of the invention.
Figur 2 zeigt eine Schnittansicht durch eine zweite Ausführungsform der Erfindung. FIG. 2 shows a sectional view through a second embodiment of the invention.
In Figur 1 sind eine Leiterplatte 100, ein erstes Elektronikteil 200, ein zweites Elektronikteil 201 , ein drittes Elektronikteil 202, ein elektrisch leitfähiges Pad 300, ein kohäsives elektrisch isoliertes Material 400 und ein kohäsives elektrisch leitfähiges Material 500 mit vier Ausbauchungen 501 gezeigt. Das erste Elektronikteil 200 kann ein Mikroprozessor sein, das zweite Elektronikteil 201 kann eine Logikschaltung sein und das dritte Elektronikteil 202 kann z. B. ein Widerstand, ein Kondensator oder eine Spule sein. Bei dem vorliegenden Beispiel deckt das kohäsive elektrisch isolierte Material 400 die Leiterplatte 100 nicht vollständig ab, sondern es sind nur Bereiche der Leiterplatte 100, in denen sich Elektronikteile, z. B. das erste, das zweite und das dritte Elektronikteil 200, 201 , 202 befinden, und die Bereiche in deren Nähe abgedeckt. Bereiche mit elektrisch leitfähigen Pads sind nicht mit dem kohäsiven elektrisch isolierten Material 400 abgedeckt, wenn das jeweilige elektrisch leitfähige Pad zur Verbindung mit dem elektrisch leitfähigen Material 500 verwendet wird. Bei dem vorliegenden Beispiel erstrecken sich vier Ausbauchungen 501 , die jeweilige Teile des kohäsiven elektrisch leitfähigen Materials 500 sind, über den durch das kohäsive elektrisch isolierte Material 400 abgedeckten Bereich, um das elektrisch leitfähige Material 500 mit den vier elektrischen leitfähigen Pads 300 zu verbinden. Bei dem vorliegenden Beispiel ist das kohäsive elektrisch isolierte Material 400 nicht vollständig durch das kohäsive elektrisch leitfähige Material 500 abgedeckt, um elektrisch leitfähiges Material zu sparen, wo es nicht benötigt wird, wobei es jedoch möglich ist, das kohäsive elektrisch isolierte Material 300 vollständig mit dem kohäsiven elektrisch leitfähigen Material 500 abzudecken. Lediglich die Teile, Bahnen und Pads, die abgeschirmt werden sollen, müssen durch das kohäsive elektrisch leitfähige Material 500 abgedeckt sein. Andere elektrisch leitfähige Bahnen und/oder andere elektrisch leitfähige Pads sind nicht gezeigt, da sie durch die Elektronikteile 200, 201 , 202 und/oder durch das elektrisch isolierte Material 400 abgedeckt sind und da sie nicht elektrisch mit dem kohäsiven elektrisch leitfähigen Material 500 verbunden sind. Diese nicht dargestellten gedruckten elektrisch leitfähigen Bahnen oder Pads werden zur Verbindung zwischen den Elektronikteilen 200, 201 , 202 und zur Verbindung mit der Umgebung außerhalb des Elektronikmoduls verwendet. Wird das Elektronikmodul stationär oder in einem Fahrzeug montiert verwendet, so kann das kohäsive elektrisch leitfähige Material 500 elektrisch mit einem (nicht gezeigten) Massepotenzial verbunden sein. FIG. 1 shows a circuit board 100, a first electronic part 200, a second electronic part 201, a third electronic part 202, an electrically conductive pad 300, a cohesive electrically insulating material 400 and a cohesive electrically conductive material 500 with four bulges 501. The first electronic part 200 can be a microprocessor, the second electronic part 201 can be a logic circuit and the third electronic part 202 can be e.g. B. be a resistor, a capacitor or a coil. In the present example, the cohesive electrically insulating material 400 does not completely cover the printed circuit board 100, but only areas of the printed circuit board 100 in which electronic parts, e.g. B. the first, the second and the third electronic part 200, 201, 202 are located, and the areas covered in their vicinity. Areas with electrically conductive pads are not covered with the cohesive electrically insulating material 400 when the respective electrically conductive pad is used to connect to the electrically conductive material 500 . In the present example, four bulges 501 , which are respective parts of the cohesive electrically conductive material 500 , extend over the area covered by the cohesive electrically insulating material 400 to connect the electrically conductive material 500 to the four electrically conductive pads 300 . In the present example, the cohesive electrically insulating material 400 is not completely covered by the cohesive electrically conductive material 500 in order to save electrically conductive material where it is not needed, but it is possible to completely cover the cohesive electrically insulating material 300 with the cohesive electrically conductive material 500 to cover. Only the parts, traces and pads that are to be shielded need to be covered by the cohesive electrically conductive material 500 . Other electrically conductive tracks and/or other electrically conductive pads are not shown because they are covered by the electronic parts 200, 201, 202 and/or by the electrically insulating material 400 are covered and because they are not electrically connected to the cohesive electrically conductive material 500. These printed, electrically conductive tracks or pads, which are not shown, are used for the connection between the electronic parts 200, 201, 202 and for the connection to the environment outside the electronic module. If the electronic module is used stationary or mounted in a vehicle, the cohesive electrically conductive material 500 can be electrically connected to a ground potential (not shown).
In Figur 2 sind ähnlich wie in Figur 1 eine Leiterplatte 100, ein drittes Elektronikteil 202, ein elektrisch leitfähiges Pad 300, ein kohäsives elektrisch isoliertes Material 400 und ein kohäsives elektrisch leitfähiges Material 500 gezeigt. Diese oben genannten Teile haben die gleichen oder ähnliche Eigenschaften wie das in Figur 1 beschriebene Modul. Darüber hinaus ist eine zweite Schicht von elektrisch leitfähigem Material 600 auf der Seite der Leiterplatte 100, die der Seite, auf der das Elektronikteil 202 positioniert ist, entgegengesetzt ist, abgeschieden. Diese zweite Schicht aus elektrisch leitfähigem Material 600 ist mittels Durchgangskontakten 800 mit den leitfähigen Pads 300 und daher mit dem (ersten) kohäsiven elektrisch leitfähigen Material 500 verbunden. So wird eine sehr gute Abschirmung erzielt. Similar to FIG. 1, FIG. 2 shows a printed circuit board 100, a third electronic part 202, an electrically conductive pad 300, a cohesive electrically insulating material 400 and a cohesive electrically conductive material 500. FIG. These parts mentioned above have the same or similar properties as the module described in FIG. In addition, a second layer of electrically conductive material 600 is deposited on the side of circuit board 100 opposite the side on which electronics part 202 is positioned. This second layer of electrically conductive material 600 is connected to the conductive pads 300 and therefore to the (first) cohesive electrically conductive material 500 by means of vias 800 . Very good shielding is achieved in this way.
Bezugszeichen: References:
100 Leiterplatte 100 circuit board
200 erstes Elektronikteil 201 zweites Elektronikteil 200 first electronic part 201 second electronic part
203 drittes Elektronikteil 203 third electronic part
300 elektrisch leitfähiges Pad 300 electrically conductive pad
400 kohäsives elektrisch isoliertes Material 400 cohesive electrically insulating material
500 kohäsives elektrisch leitfähiges Material 501 Ausbauchung 500 cohesive electrically conductive material 501 bulge
600 zweite Schicht des elektrisch leitfähigen Materials600 second layer of electrically conductive material
800 Durchgangskontakt 800 through contact

Claims

7 Patentansprüche 7 patent claims
1. Elektronikmodul, umfassend eine Leiterplatte (100), wobei die Leiterplatte (100) gedruckte elektrisch leitfähige Bahnen und gedruckte elektrisch leitfähige Pads (300) sowie Elektronikteile (200, 201 , 202), die elektrisch und mechanisch mit den gedruckten elektrisch leitfähigen Bahnen und/oder den gedruckten elektrisch leitfähigen Pads (300) verbunden sind, umfasst, dadurch gekennzeichnet, dass die Elektronikteile (200, 201 , 202) und ein Teil der Leiterplatte (100), der gedruckte elektrisch leitfähige Bahnen und gedruckte elektrisch leitfähige Pads beinhaltet, mit einem kohäsiven elektrisch isolierten Material (400) abgedeckt sind, dass das kohäsive elektrisch isolierte Material (400) durch ein kohäsives elektrisch leitfähiges Material (500) abgedeckt ist und damit verbunden ist, wobei das kohäsive elektrisch leitfähige Material (500) mechanisch und elektrisch mit mindestens einem der gedruckten elektrisch leitfähigen Pads (300) und/oder einer der gedruckten elektrisch leitfähigen Bahnen verbunden ist. 1. Electronic module comprising a printed circuit board (100), the printed circuit board (100) having printed electrically conductive tracks and printed electrically conductive pads (300) and electronic parts (200, 201, 202) which are electrically and mechanically connected to the printed electrically conductive tracks and / or the printed electrically conductive pads (300) are connected, characterized in that the electronic parts (200, 201, 202) and a part of the circuit board (100) containing the printed electrically conductive tracks and printed electrically conductive pads with a cohesive electrically insulating material (400), that the cohesive electrically insulating material (400) is covered by and connected to a cohesive electrically conductive material (500), the cohesive electrically conductive material (500) being mechanically and electrically connected to at least one of the printed electrically conductive pads (300) and/or one of the printed electrically conductive pads tracks is connected.
2. Elektronikmodul nach Anspruch 1 , dadurch gekennzeichnet, dass eine umgebende gedruckte elektrisch leitfähige Bahn die Elektronikteile (200, 201 , 202) umgibt und das kohäsive elektrisch leitfähige Material (500) an mehreren Positionen elektrisch und mechanisch direkt oder über einige der gedruckten elektrisch leitfähigen Pads (300) mit der umgebenden gedruckten elektrisch leitfähigen Bahn verbunden ist. 2. Electronic module according to claim 1, characterized in that a surrounding printed electrically conductive path surrounds the electronic parts (200, 201, 202) and the cohesive electrically conductive material (500) at several positions electrically and mechanically directly or via some of the printed electrically conductive paths Pads (300) is connected to the surrounding printed electrically conductive track.
3. Elektronikmodul nach Anspruch 2, dadurch gekennzeichnet, dass das kohäsive elektrisch leitfähige Material (500) ununterbrochen mechanisch und elektrisch direkt oder über einige der gedruckten elektrisch leitfähigen Pads (300) mit der umgebenden gedruckten elektrisch leitfähigen Bahn verbunden ist. 3. Electronics module according to claim 2, characterized in that the cohesive electrically conductive material (500) is continuously mechanically and electrically connected to the surrounding printed electrically conductive track directly or via some of the printed electrically conductive pads (300).
4. Elektronikmodul nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das kohäsive elektrisch isolierte Material (400) ein elektrisch isolierender Lack ist. 8 4. Electronic module according to one of the preceding claims, characterized in that the cohesive electrically insulating material (400) is an electrically insulating lacquer. 8th
5. Elektronikmodul nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das kohäsive elektrisch leitfähige Material (500) ein elektrisch leitfähiger Lack ist. 5. Electronics module according to one of the preceding claims, characterized in that the cohesive electrically conductive material (500) is an electrically conductive paint.
6. Elektronikmodul nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das kohäsive elektrisch leitfähige Material (500) elektrisch mit einem Massepotenzial verbunden ist. 6. Electronics module according to one of the preceding claims, characterized in that the cohesive electrically conductive material (500) is electrically connected to a ground potential.
7. Elektronikmodul nach einem der vorhergehenden Ansprüche, wobei die Leiterplatte (100) eine erste Seite mit den Merkmalen eines der vorhergehenden Ansprüche umfasst, dadurch gekennzeichnet, dass die Leiterplatte eine der ersten Seite entgegengesetzte zweite Seite umfasst, dass kohäsives elektrisch leitfähiges Material (600) auch die zweite Seite der Leiterplatte (100) abdeckt und elektrisch mit dem kohäsiven elektrisch leitfähigen Material (500) der ersten Seite der Leiterplatte verbunden ist. 7. Electronic module according to one of the preceding claims, wherein the printed circuit board (100) comprises a first side having the features of one of the preceding claims, characterized in that the printed circuit board comprises a second side opposite the first side, that cohesive electrically conductive material (600) also covering the second side of the circuit board (100) and being electrically connected to the cohesive electrically conductive material (500) of the first side of the circuit board.
8. Verfahren zum Herstellen eines Elektronikmoduls gemäß Beschreibung in einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das Elektronikmodul mit den montierten Elektronikteilen (200, 201 , 202) auf der Leiterplatte (100) mit einer ersten Schablone bedeckt wird und das kohäsive elektrisch isolierte Material (400) durch die Schablone über die Elektronikteile (200, 201 , 202) und den Raum zwischen den Elektronikteilen (200, 201 , 202) aufgebracht wird. 8. A method for producing an electronic module as described in one of the preceding claims, characterized in that the electronic module with the mounted electronic parts (200, 201, 202) on the printed circuit board (100) is covered with a first template and the cohesive electrically insulated material (400) is applied through the template over the electronic parts (200, 201, 202) and the space between the electronic parts (200, 201, 202).
9. Verfahren zum Herstellen eines Elektronikmoduls nach Anspruch 8, dadurch gekennzeichnet, dass das kohäsive elektrisch isolierte Material (400) mit einer zweiten Schablone bedeckt wird und das kohäsive elektrisch leitfähige Material (500) durch die zweite Schablone über das kohäsive elektrisch isolierte Material (400) aufgebracht wird, sodass das kohäsive elektrisch leitfähige Material die Elektronikteile und den Raum zwischen den Elektronikteilen abdeckt und mit mindestens einem der elektrisch leitfähigen Pads (300) und/oder einer der gedruckten elektrisch leitfähigen Bahnen verbunden ist. 9 9. Method for producing an electronic module according to claim 8, characterized in that the cohesive electrically insulating material (400) is covered with a second template and the cohesive electrically conductive material (500) is covered by the second template over the cohesive electrically insulating material (400 ) is applied such that the cohesive electrically conductive material covers the electronics and the space between the electronics and is bonded to at least one of the electrically conductive pads (300) and/or one of the printed electrically conductive tracks. 9
10. Verfahren zum Herstellen eines Elektronikmoduls nach Anspruch 9, dadurch gekennzeichnet, dass das kohäsive elektrisch leitfähige Material (500) ununterbrochen elektrisch mit der umgebenden gedruckten elektrisch leitfähigen Bahn und/oder den gedruckten elektrisch leitfähigen Pads (300) verbunden ist. 10. A method for manufacturing an electronic module according to claim 9, characterized in that the cohesive electrically conductive material (500) is continuously electrically connected to the surrounding printed electrically conductive track and/or the printed electrically conductive pads (300).
11 . Verfahren zum Herstellen eines Elektronikmoduls nach Anspruch 10, dadurch gekennzeichnet, dass das kohäsive elektrisch leitfähige Material (500) ununterbrochen mechanisch und elektrisch mit der umgebenden gedruckten elektrisch leitfähigen Bahn und/oder den gedruckten elektrisch leitfähigen Pads (300) verbunden ist. 11 . A method of manufacturing an electronic module according to claim 10, characterized in that the cohesive electrically conductive material (500) is continuously mechanically and electrically connected to the surrounding printed electrically conductive track and/or printed electrically conductive pads (300).
PCT/DE2021/200161 2020-10-29 2021-10-22 Electronic module and method for producing an electronic module of this type WO2022089695A1 (en)

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