DE102007007657A1 - Electromagnetic interference shield for electrical component, has lacquer or lacquer-like coating applied on electrical component, where coating is completely or partially applied with respect to electrical component - Google Patents

Electromagnetic interference shield for electrical component, has lacquer or lacquer-like coating applied on electrical component, where coating is completely or partially applied with respect to electrical component Download PDF

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Publication number
DE102007007657A1
DE102007007657A1 DE200710007657 DE102007007657A DE102007007657A1 DE 102007007657 A1 DE102007007657 A1 DE 102007007657A1 DE 200710007657 DE200710007657 DE 200710007657 DE 102007007657 A DE102007007657 A DE 102007007657A DE 102007007657 A1 DE102007007657 A1 DE 102007007657A1
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DE
Germany
Prior art keywords
electrical component
lacquer
coating
completely
respect
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE200710007657
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German (de)
Inventor
Mathias Kaiser
Herbert Schoepfer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schopfer Herbert Dipl-Ing(fh)
Original Assignee
Schopfer Herbert Dipl-Ing(fh)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schopfer Herbert Dipl-Ing(fh) filed Critical Schopfer Herbert Dipl-Ing(fh)
Priority to DE200710007657 priority Critical patent/DE102007007657A1/en
Publication of DE102007007657A1 publication Critical patent/DE102007007657A1/en
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09872—Insulating conformal coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

The shield has a lacquer or lacquer-like coating applied on an electrical component. The lacquer or lacquer-like coating is completely or partially applied with respect the electrical component. The lacquer or lacquer-like coating has different characteristics, and is applied as a multilayer coating on the electrical component. A base layer provides a sufficient electrical isolation of the component from the (EMI) lacquer coating.

Description

ProblembeschreibungProblem Description

Bei elektrischen Baugruppen im Hochfrequenzbereich ist eine Abschirmung der elektromagnetischen Strahlung (EMI) unumgänglich.at electrical components in the high frequency range is a shield Electromagnetic radiation (EMI) inevitable.

Dies gilt auch und vor allem in dem Konsumerbereich der Mobilfunkfrequenzen zwischen 0.9 GHz bis 1.9 GHz.This applies also and especially in the consumer area of mobile radio frequencies between 0.9 GHz to 1.9 GHz.

Bisherige Lösungen:Previous solutions:

Die meistverwendeten Lösungen zur EMI Schirmung basieren auf einer Kapselung des zu schirmenden Baugruppensegments mittels metallischen Käfigen (Cans) oder metallisch beschichteter Abdeckung aus Kunststoff.The most used solutions for EMI shielding based on an encapsulation of the shielding Subassembly segments by means of metallic cages or metallic coated plastic cover.

Diese Abschirmungen sind je nach Ausführung auf Bauteileebene, Baugruppensegmentebene und kompletter Baugruppenebene wirksam.These Shielding depends on the version at the component level, module segment level and complete module level effective.

Die jeweiligen Ausführungsvariationen beziehen sich in der Hauptsache auf die Art der Abschirmung (Material) und deren Befestigung.The respective execution variations refer in the main to the type of shielding (material) and their attachment.

Ein weiterer, derzeit in Entwicklung befindender Lösungsansatz besteht darin, die elektromagnetische Strahlung bereits durch entsprechende Schaltungsanordnung zu vermeiden (Kompensation und Absorption erzeugter Strahlung).One another approach currently being developed is to the electromagnetic radiation already by appropriate circuitry to avoid (compensation and absorption of generated radiation).

Zu patentierende Lösung:Patented solution:

Die zu patentierende Lösung besteht aus einer, die elektrischen Bauteile isolierenden Lackschicht (Basisbeschichtung – Base coating) und einer darüber aufgebrachten EMI abschirmenden Lackschicht (Shield – coating).The to be patented solution consists of one, the electrical components insulating paint layer (Base coat - Base coating) and one above applied EMI shielding paint layer (Shield - coating).

Die Basisschicht sorgt für eine ausreichende elektrische Trennung der Bauteile auch von der EMI Lackschicht.The Base layer provides for a sufficient electrical separation of the components also from the EMI paint layer.

Die EMI Lackschicht für eine EMI gerechte Kapselung der Bauteile oder des Schaltungsteiles gegenüber umliegenden Schaltungsteilen.The EMI paint coating for an EMI equitable encapsulation of the components or the circuit part with respect to surrounding Circuit parts.

Bei der EMI abschirmenden Lackschicht sind je nach Anforderung Pigmente, in der Regel Metallpigmente, dem Lack beigemischt.at the EMI shielding paint layer are pigments, depending on requirements usually metal pigments, added to the paint.

Technische Ausführung:Technical design:

Die beiden Beschichtungen können sowohl im Sprühverfahren mit entsprechenden Abdeckschablonen, als auch mit Dispenser aufgebracht werden.The both coatings can both in the spray process applied with appropriate Abdeckschablonen, as well as with dispenser become.

Die Masseanbindung der Schirmung erfolgt über die im Layout vorgesehenen Massestreifen (siehe Skizze). Die Dichte der EMI-Schirmung ist durch die flächige Kontaktierung auf dem Massestreifen sehr sicher.The Ground connection of the shielding takes place via the layout provided for Mass strip (see sketch). The density of the EMI shield is due to the area Contacting on the ground strip very safe.

Zum Zweck der besseren Wärmeableitung kann partiell eine spezielle Pigmentbeimischung erfolgen.To the Purpose of better heat dissipation can partially carried out a special pigment addition.

Vorteile:Advantages:

  • • Kostengünstige Abschirmung• Cost-effective shielding
  • • Auch kleinpartielle Schaltungsteile ohne großen Aufwand abschirmbar• Also small part circuit parts shielded without much effort
  • • Keine Beschränkungen bei Baugruppenlayout und dadurch wesentlich höhere Schaltungsintegration• None restrictions for assembly layout and thus considerably higher circuit integration
  • • Hohes Ratiopotential in der Fertigung• High Ratio potential in production
  • • Frequenzabgestimmte Mischung der Lackschicht durch entsprechende Pigmentierungen möglich.• Frequency-matched Mixture of the lacquer layer by appropriate pigmentations possible.
  • • Flächige Masseanbindung• Flat ground connection
  • • Beidseitige Beschichtung möglich• Two-sided Coating possible
  • • Sehr geringe Aufbauhöhe• Very low construction height
  • • Hervorragende EMV-Dichtheit der Kapselung• Excellent EMC tightness of the encapsulation

Stand der Technik:State of the art:

Eine Anwendung der zu patentierenden Lösung ist uns derzeit nicht bekannt.A We are currently not applying the patented solution known.

Eine Abfrage von Firmen die sich mit technischen Lackierungen von Bauteilen und Baugruppen beschäftigen, ergab keine konkrete Anfragen oder Anwendungen.A Consultation of companies dealing with technical coatings of components and assemblies, did not result in specific requests or applications.

Mit entsprechenden Firmen müsste daher eine Vereinbarung zur Entwicklung solch einer EMI abschirmenden Lackschicht abgeschlossen werden.With corresponding companies would have Therefore, an agreement to develop such an EMI shielding Lacquer layer to be completed.

Grundsatzuntersuchungen und Qualifizierung notwendig.Basic investigations and qualification necessary.

Klärungen und eventuelle Probleme und Möglichkeiten:clarifications and possible problems and possibilities:

  • • Qualifizierung und Langzeitversuche notwendig• Qualification and long-term tests necessary
  • • Verhalten bei Erwärmung• Behavior when heated
  • • Differenzierte Lacke für bestimmte Frequenz• Differentiated Paints for certain frequency
  • • Wärmeableitung bei Bauteilen/Einfluss auf Wärmemanagement• heat dissipation for components / influence on thermal management
  • • Vorgehensweise und Verhalten bei Reparatur• Method and behavior during repair

Claims (1)

Die Erfindung ist dadurch gekennzeichnet, dass eine auf der elektrischen Baugruppe aufgebrachten Lackschicht die Funktion einer EMI (elektromagnetischer Strahlung) Abschirmung übernimmt. Diese Beschichtungen können sowohl partiell, als auch die komplette Baugruppe betreffend aufgebracht sein. Die Beschichtungen können wie beschrieben mehrlagig, und mit unterschiedlichen Eigenschaften versehen sein (Isolierende Schicht und leitende Lackschicht als Schirmung). 1. Unteranspruch zu 1.) Die Beschichtung kann auch aus einer Schicht ausgeführt sein, die in sich, oder deren Aufbau beide Eigenschaften beinhaltet. 2. Unteranspruch zu 1.) Die Beschichtung kann auch aus lackähnlichen Schichten bestehenThe invention is characterized in that a coating layer applied to the electrical assembly assumes the function of EMI (electromagnetic radiation) shielding. These coatings can be applied both partially, as well as the complete assembly concerning. The coatings can be multi-layered as described and provided with different properties (insulating layer and conductive lacquer layer as shielding). 1. subclaim to 1.) The coating may also be made of a layer which contains in itself, or whose structure includes both properties. 2. Subclaim to 1.) The coating may also consist of paint-like layers
DE200710007657 2007-02-13 2007-02-13 Electromagnetic interference shield for electrical component, has lacquer or lacquer-like coating applied on electrical component, where coating is completely or partially applied with respect to electrical component Withdrawn DE102007007657A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE200710007657 DE102007007657A1 (en) 2007-02-13 2007-02-13 Electromagnetic interference shield for electrical component, has lacquer or lacquer-like coating applied on electrical component, where coating is completely or partially applied with respect to electrical component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE200710007657 DE102007007657A1 (en) 2007-02-13 2007-02-13 Electromagnetic interference shield for electrical component, has lacquer or lacquer-like coating applied on electrical component, where coating is completely or partially applied with respect to electrical component

Publications (1)

Publication Number Publication Date
DE102007007657A1 true DE102007007657A1 (en) 2008-10-16

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DE200710007657 Withdrawn DE102007007657A1 (en) 2007-02-13 2007-02-13 Electromagnetic interference shield for electrical component, has lacquer or lacquer-like coating applied on electrical component, where coating is completely or partially applied with respect to electrical component

Country Status (1)

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DE (1) DE102007007657A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102020213787A1 (en) 2020-10-29 2022-05-05 Continental Automotive Gmbh Electronic module and method for manufacturing such an electronic module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102020213787A1 (en) 2020-10-29 2022-05-05 Continental Automotive Gmbh Electronic module and method for manufacturing such an electronic module

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R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee

Effective date: 20110901