WO2022088293A1 - Remote phosphor large-angle scattering patch led - Google Patents

Remote phosphor large-angle scattering patch led Download PDF

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Publication number
WO2022088293A1
WO2022088293A1 PCT/CN2020/129426 CN2020129426W WO2022088293A1 WO 2022088293 A1 WO2022088293 A1 WO 2022088293A1 CN 2020129426 W CN2020129426 W CN 2020129426W WO 2022088293 A1 WO2022088293 A1 WO 2022088293A1
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Prior art keywords
circuit board
electronic circuit
thermally conductive
light
conductive electronic
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PCT/CN2020/129426
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French (fr)
Chinese (zh)
Inventor
陈建伟
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深圳市广社照明科技有限公司
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Publication of WO2022088293A1 publication Critical patent/WO2022088293A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Definitions

  • the invention relates to the field of LEDs, in particular to a remote phosphor large-angle scattering patch LED.
  • Healthy lighting including healthy light sources
  • Soft light no glare, no glare, no ghosting.
  • Comfortable light/even soft light can create a warm and comfortable light environment. Based on the general trend of LED lighting development, we can foresee that the market demand for large-angle LED light sources with scattered light is more urgent.
  • US Patent US6350041B1 discloses a high output diffuse light bulb using a solid state light source, which is cited by 167 patents, including one patent cited by Intematix.
  • the patented feature of CREE's remote phosphor powder is to keep the LED chip away from the phosphor light-emitting layer, and the intermediate medium is air.
  • Chinese patent ZL2004100524874 discloses a 360-degree (volume luminescence) high-efficiency photoluminescent diode, which keeps the LED chip away from the phosphor light-emitting layer, and the phosphor light-emitting layer structure is "Lambertian", the intermediate isolation medium is resin material, The method of separating the phosphor powder from the LED chip in space and coating the phosphor powder on the optical components such as the optical film, transparent lampshade or lens away from the LED chip has revolutionized and surpassed the commonly used white LED packaging. craft. It can be seen that “remote phosphor technology” has universal technical value, and the realization of "remote phosphor technology” has diversity.
  • the SMD LED adopts the remote phosphor technology, it adopts the "Lambertian" structure with air as the medium. Therefore, the light in the negative direction of the optical axis cannot be irradiated, and the luminous dead angle is prone to occur, which is still directional luminescence.
  • the engineering plastics and rare earth phosphors used in the prior art LEDs are granulated and injected, and the phosphors are uniform and homogeneous, and the plastics are discolored and blackened.
  • the present invention provides a remote phosphor large-angle scattering patch LED to solve at least one of the above-mentioned technical problems.
  • a remote phosphor large-angle scattering SMD LED which includes: a thermally conductive electronic circuit board, a flip-chip LED chip, and a plastic housing, in which a plastic housing is formed.
  • the installation groove is provided through the plastic casing along the radial direction.
  • the plastic shell is made of PP or PP modified plastic.
  • the thermally conductive electronic circuit board is mounted in the mounting groove by means of bonding.
  • the thermally conductive electronic circuit board is a ceramic circuit board, or an aluminum-based circuit board, or an FPC circuit board, or a glass-based circuit board.
  • the PP modified plastic is metallocene polypropylene plastic.
  • the non-Lambertian dome structure cavity is orthographically projected into a rectangular structure in the direction of the optical axis, and the width of the rectangular structure is smaller than the width of the thermally conductive electronic circuit board, and the width of the installation groove is larger than that of the non-Lambertian dome structure.
  • the width of the Lambertian dome structure cavity is orthographically projected into a rectangular structure in the direction of the optical axis, and the width of the rectangular structure is smaller than the width of the thermally conductive electronic circuit board, and the width of the installation groove is larger than that of the non-Lambertian dome structure.
  • the bottom surface of the thermally conductive electronic circuit board is higher than the bottom surface of the plastic housing.
  • the thermally conductive electronic circuit board is mounted in the mounting groove by a high-temperature-resistant and quick-drying structural adhesive.
  • the non-Lambertian dome structure cavity is a light mixing cavity capable of photoluminescence.
  • the diameter of the plastic shell is larger than the width of the heat-conducting electronic circuit board, so downward light can be obtained, thereby obtaining scattered light with a larger emission angle, which can not only generate safe light, but also avoid blue light damage to human eyes.
  • Soft light is not dazzling, no glare, no ghosting, comfortable light, uniform and soft light can create a warm and comfortable light environment.
  • FIG. 1 schematically shows a schematic structural diagram of a prior art LED patch element
  • Figure 2 schematically shows a three-view schematic diagram of the invention structure
  • FIG. 3 schematically shows a schematic diagram of the projection relationship of the optical cavity of the present invention on the electronic circuit board
  • FIG. 4 schematically shows a schematic diagram of the change of the optical path after the excitation light photoluminescence of the present invention.
  • a remote phosphor large-angle scattering SMD LED comprising: a thermally conductive electronic circuit board 1, one or more flip-chip LED chips 2, and a plastic casing 7, the plastic casing 7 is formed with a non-Lambertian dome structure cavity 5, the bottom of the plastic housing 7 forms a mounting groove 6, the thermally conductive electronic circuit board 1 is installed in the mounting groove 6, the flip-chip LED The chip 2 is mounted on the thermally conductive electronic circuit board 1 and is located in the non-Lambertian dome structure cavity 5 , and both sides of the plastic housing 7 protrude from both sides of the thermally conductive electronic circuit board 1 .
  • the installation groove 6 is provided through the radial direction of the plastic housing 7 .
  • the plastic shell 7 is made of PP or PP modified plastic.
  • the PP modified plastic is metallocene polypropylene plastic, which solves the problems of uniform and homogeneous phosphor powder and plastic discoloration and blackening.
  • the thermally conductive electronic circuit board 1 is mounted in the mounting groove 6 by means of bonding.
  • the thermally conductive electronic circuit board 1 is installed in the installation groove 6 by a high-temperature-resistant and quick-drying structural adhesive.
  • Injection molding of the plastic shell 7, installation and assembly of the thermally conductive electronic circuit board 1 and the mounting groove 6, high-temperature-resistant quick-drying structural adhesive bonding installation, etc. can save the aging process of the SMD LED ⁇ 480 minutes in the prior art,
  • the plastic shell 7 injection molding extends the industrial chain of SMD LED manufacturing, which can greatly simplify the LED component packaging process, improve production efficiency, and be more conducive to standardization, automation, and intelligent production.
  • the thermally conductive electronic circuit board 1 is a ceramic circuit board, or an aluminum-based circuit board, or an FPC circuit board, or a glass-based circuit board.
  • the non-Lambertian dome structure cavity 5 is orthographically projected into a rectangular structure in the direction of the optical axis, and the width of the rectangular structure is smaller than the width of the thermally conductive electronic circuit board 1, and the width of the installation groove 6 is greater than The width of the non-Lambertian dome structure cavity 5 .
  • the bottom surface of the thermally conductive electronic circuit board 1 is higher than the bottom surface of the plastic housing 7 .
  • the non-Lambertian dome structure cavity 5 is a light mixing cavity of a photoluminescence light source.
  • auxiliary agents such as flame retardant, photosensitizer, white oil, and diffusing agent can be added to PP or modified PP plastic 3
  • the phosphor 4 can be rare earth phosphor, silicate phosphor, nitride phosphor, and the like.
  • the blue light emitted by the LED chip is reflected in the light mixing cavity. At this time, the blue light in the light mixing cavity is mainly blue light, and the blue light is only the excitation light source.
  • the area where photoluminescence actually occurs is the phosphor of the plastic shell 7, that is, the blue light into the plastic shell 7, and after being excited with the phosphor 4 therein, it emits light with a wavelength higher than that of the incident light, and this process is photoluminescence.
  • the blue light (also called excitation light) emitted by the flip-chip LED chip 2 is directional light emission according to its structure.
  • the directional light-emitting beam is repeatedly reflected in the non-Lambertian dome structure cavity 5 to form scattered light. Therefore, we call the non-Lambertian dome structure cavity 5 a light mixing cavity again.
  • the excitation light after the light mixing cavity excites the phosphor 4 in the plastic housing 7 to emit a wavelength higher than that of the excitation light, and this process is the process of photoluminescence. Since the physical shape of the phosphor 4 is an irregular particle, the light it emits can be regarded as space luminescence.
  • the transmission of the excitation light in the plastic casing 7 can be divided into at least two states, one is the transmission state of the excitation light, and the other is the photoluminescence state.
  • the excitation light is in the photoluminescence state, a part of the light (or reflected light) changes the light path, which at least changes the light path of the "excitation light” directional light.
  • the light emitting path of the present invention can be summarized as: the light emitted by the flip-chip LED chip 2 reaches the non-Lambertian dome structure cavity 5, and then enters the plastic housing 7, part of it is transmitted, and the other part is connected to the plastic housing.
  • the phosphors 4 in the body 7 interact with each other to generate photoluminescence, and white light is generated through spatial light mixing.
  • the diameter of the plastic casing 7 of the present invention is larger than the width of the thermally conductive electronic circuit board 1, so that a part of the plastic casing 7 is suspended in the width direction of the thermally conductive electronic circuit board 1, which not only can make the plastic excited by the excitation light
  • the direction of the light emitted by the phosphor 4 in the casing 7 can be changed, and the direction of the excitation light transmitted in the plastic casing 7 can also be changed, so that it can be irradiated in the negative direction of the optical axis.
  • the LED flip-chip bonding structure and its mounting method provided in US10,424,706B2 can be used to bond and flip the LED chip 2 on the thermally conductive electronic circuit board 1; in an oven, 155 Cured at ⁇ 160°C for 60 minutes; then, the cured LED circuit board 8 and the plastic housing 7 are assembled and assembled, and then the adhesive glue 9 is used to implement the bonding by scribing evenly. Once cured, it's done.
  • the plastic shell 7 is injection-molded, and the actual size or total height of the injection-molded plastic shell in this embodiment is 7.0 mm.
  • the LED chip 2 can be mounted on the thermally conductive electronic circuit board 1 by using the LED flip-chip die-bonding conductive adhesive structure and its mounting method provided in US10,424,706B2. Then, in an oven, cure at 155 ⁇ 160°C for 60 minutes. Next, on the edge portion of the installation groove 6 of the plastic housing 7, use the adhesive 9 to apply glue evenly by scribing lines. Then, the cured LED circuit board 8 and the plastic housing 7 are bonded, mounted and assembled, and after curing, it can be completed.
  • the invention can realize large-angle scattered light emission of the patch LED, and obtain a healthy light source with scattered light, which not only has simple process, high efficiency, few processes, no aging process, long industrial chain, and high degree of automation.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)

Abstract

A remote phosphor large-angle scattering patch LED, comprising: a thermally conductive electronic circuit board (1), a flip LED chip (2), and a plastic shell (7). A non-Lambertian dome structure cavity (5) is formed in the plastic shell (7); a mounting groove (6) is formed in the bottom of the plastic shell (7); the thermally conductive electronic circuit board (1) is mounted in the mounting groove (6); the flip LED chip (2) is mounted on the thermally conductive electronic circuit board (1) and located in the non-Lambertian dome structure cavity (5); and the two sides of the plastic shell (7) protrude out of the two sides of the thermally conductive electronic circuit board (1). The diameter of the plastic shell (7) is larger than the width of the thermally conductive electronic circuit board (1), such that downward light can be obtained, scattered light having a larger light-emitting angle can be obtained, safe light can be generated, and damage of blue light to human eyes can also be avoided. Soft light is not dazzling, glare or ghosting. Comfortable light is uniform and soft, and can create a warm and comfortable light environment.

Description

远程荧光粉大角度散射贴片LEDRemote Phosphor Large Angle Scattering SMD LED 技术领域technical field
本发明涉及LED领域，特别涉及一种远程荧光粉大角度散射贴片LED。The invention relates to the field of LEDs, in particular to a remote phosphor large-angle scattering patch LED.
背景技术Background technique
LED经过二十多年的发展，现在正从绿色照明向健康照明转移。健康照明（包括健康光源）归纳起来可描述为三大特征，安全的光/避免蓝光对人眼损伤。柔和的光/不刺眼、无眩光、无重影。舒服的光/均匀柔和的光能营造温馨舒适的光环境。基于LED照明发展大趋势我们可以预见市场对具有散射光的大角度LED光源需求更加急迫。After more than two decades of development, LED is now shifting from green lighting to healthy lighting. Healthy lighting (including healthy light sources) can be summarized as three characteristics, safe light/avoid blue light damage to human eyes. Soft light / no glare, no glare, no ghosting. Comfortable light/even soft light can create a warm and comfortable light environment. Based on the general trend of LED lighting development, we can foresee that the market demand for large-angle LED light sources with scattered light is more urgent.
美国专利US6350041B1公开了一种采用固态光源的高输出散光灯泡，其被167个专利引用，其中包括一项专利被Intematix引用。CREE公司远程荧光粉专利特点，是将LED芯片远离荧光粉发光层，中间介质为空气。US Patent US6350041B1 discloses a high output diffuse light bulb using a solid state light source, which is cited by 167 patents, including one patent cited by Intematix. The patented feature of CREE's remote phosphor powder is to keep the LED chip away from the phosphor light-emitting layer, and the intermediate medium is air.
中国专利ZL2004100524874公开了一种360度（体发光）高光效光致发光二极管，其将LED芯片远离荧光粉发光层，且荧光粉发光层结构为“朗伯体”，中间隔离介质为树脂材料，将荧光粉与LED芯片在空间上分离开，将荧光粉涂敷在远离LED芯片的光学膜、透明灯罩或透镜等光学组件上的方式，革命性地突破和超越了现在普遍使用的白光LED封装工艺。可见，“远程荧光粉技术”具有普遍技术价值，实现“远程荧光粉技术”具有多样性。Chinese patent ZL2004100524874 discloses a 360-degree (volume luminescence) high-efficiency photoluminescent diode, which keeps the LED chip away from the phosphor light-emitting layer, and the phosphor light-emitting layer structure is "Lambertian", the intermediate isolation medium is resin material, The method of separating the phosphor powder from the LED chip in space and coating the phosphor powder on the optical components such as the optical film, transparent lampshade or lens away from the LED chip has revolutionized and surpassed the commonly used white LED packaging. craft. It can be seen that "remote phosphor technology" has universal technical value, and the realization of "remote phosphor technology" has diversity.
技术问题technical problem
然而，由于贴片LED采用远程荧光粉技术，其采用以空气为介质的“朗伯体”结构，因此，光轴负极方向的光照射不到，易出现发光死角，仍属于定向发光。此外，现有技术中的LED所使用的工程塑料与稀土荧光粉抽粒注塑存在荧光粉均匀均质、塑料变色发黑的问题。However, since the SMD LED adopts the remote phosphor technology, it adopts the "Lambertian" structure with air as the medium. Therefore, the light in the negative direction of the optical axis cannot be irradiated, and the luminous dead angle is prone to occur, which is still directional luminescence. In addition, the engineering plastics and rare earth phosphors used in the prior art LEDs are granulated and injected, and the phosphors are uniform and homogeneous, and the plastics are discolored and blackened.
技术解决方案technical solutions
本发明提供了一种远程荧光粉大角度散射贴片LED，以解决至少一个上述技术问题。The present invention provides a remote phosphor large-angle scattering patch LED to solve at least one of the above-mentioned technical problems.
为解决上述问题，作为本发明的一个方面，提供了一种远程荧光粉大角度散射贴片LED，包括：导热电子电路板、倒装LED芯片、和塑料壳体，所述塑料壳体内形成有非朗伯体穹顶结构腔体，所述塑料壳体的底部形成安装凹槽，所述导热电子电路板安装在所述安装凹槽中，所述倒装LED芯片安装在所述导热电子电路板上并位于所述非朗伯体穹顶结构腔体中，所述塑料壳体的两侧突出于所述导热电子电路板的两侧。In order to solve the above problems, as an aspect of the present invention, a remote phosphor large-angle scattering SMD LED is provided, which includes: a thermally conductive electronic circuit board, a flip-chip LED chip, and a plastic housing, in which a plastic housing is formed. A non-Lambertian dome structure cavity, a mounting groove is formed on the bottom of the plastic casing, the thermally conductive electronic circuit board is mounted in the mounting groove, and the flip-chip LED chip is mounted on the thermally conductive electronic circuit board and located in the cavity of the non-Lambertian dome structure, the two sides of the plastic shell protrude from the two sides of the thermally conductive electronic circuit board.
优选地，所述安装凹槽沿所述塑料壳体的径向贯通地设置。Preferably, the installation groove is provided through the plastic casing along the radial direction.
优选地，所述塑料壳体采用PP或PP改性塑料制成。Preferably, the plastic shell is made of PP or PP modified plastic.
优选地，所述导热电子电路板通过粘接的方式安装在所述安装凹槽中。Preferably, the thermally conductive electronic circuit board is mounted in the mounting groove by means of bonding.
优选地，所述导热电子电路板采用陶瓷电路板、或铝基电路板、或FPC电路板、或玻璃基电路板。Preferably, the thermally conductive electronic circuit board is a ceramic circuit board, or an aluminum-based circuit board, or an FPC circuit board, or a glass-based circuit board.
优选地，所述PP改性塑料为茂金属聚丙烯塑料。Preferably, the PP modified plastic is metallocene polypropylene plastic.
优选地，所述非朗伯体穹顶结构腔体在光轴方向正投影为一个长方形结构，且长方形结构的宽度小于所述导热电子电路板的宽度，所述安装凹槽的宽度大于所述非朗伯体穹顶结构腔体的宽度。Preferably, the non-Lambertian dome structure cavity is orthographically projected into a rectangular structure in the direction of the optical axis, and the width of the rectangular structure is smaller than the width of the thermally conductive electronic circuit board, and the width of the installation groove is larger than that of the non-Lambertian dome structure. The width of the Lambertian dome structure cavity.
优选地，所述导热电子电路板的底面高于所述塑料壳体的底面。Preferably, the bottom surface of the thermally conductive electronic circuit board is higher than the bottom surface of the plastic housing.
优选地，所述导热电子电路板通过耐高温快干型结构胶安装在所述安装凹槽中。Preferably, the thermally conductive electronic circuit board is mounted in the mounting groove by a high-temperature-resistant and quick-drying structural adhesive.
优选地，所述非朗伯体穹顶结构腔体为可光致发光的混光腔。Preferably, the non-Lambertian dome structure cavity is a light mixing cavity capable of photoluminescence.
有益效果beneficial effect
本发明中塑料壳体的直径大于导热电子电路板的宽度，因此可获得向下的光，从而获得更大发光角度的散射光，不但可产生安全的光，还可避免蓝光对人眼损伤，柔和的光不刺眼、无眩光、无重影，舒服的光均匀柔和的光能营造温馨舒适的光环境。In the present invention, the diameter of the plastic shell is larger than the width of the heat-conducting electronic circuit board, so downward light can be obtained, thereby obtaining scattered light with a larger emission angle, which can not only generate safe light, but also avoid blue light damage to human eyes. Soft light is not dazzling, no glare, no ghosting, comfortable light, uniform and soft light can create a warm and comfortable light environment.
附图说明Description of drawings
图1示意性地示出了现有技术LED贴片元件结构示意图；FIG. 1 schematically shows a schematic structural diagram of a prior art LED patch element;
图2示意性地示出了发明结构三视图示意图；Figure 2 schematically shows a three-view schematic diagram of the invention structure;
图3示意性地示出了本发明光学腔在电子电路板上的投影关系示意图；FIG. 3 schematically shows a schematic diagram of the projection relationship of the optical cavity of the present invention on the electronic circuit board;
图4示意性地示出了本发明受激发光光致发光后光路改变示意图。FIG. 4 schematically shows a schematic diagram of the change of the optical path after the excitation light photoluminescence of the present invention.
图中附图标记：1、导热电子电路板；2、倒装LED芯片；3、改性PP塑料；4、荧光粉；5、非朗伯体穹顶结构腔体；6、安装凹槽；7、塑料壳体；8、LED电路板；9、粘接胶、10、树脂灌封胶。Reference symbols in the figure: 1. Thermally conductive electronic circuit board; 2. Flip-chip LED chip; 3. Modified PP plastic; 4. Phosphor; 5. Non-Lambertian dome structure cavity; 6. Installation groove; 7 , plastic shell; 8, LED circuit board; 9, adhesive glue, 10, resin potting glue.
本发明的实施方式Embodiments of the present invention
以下结合附图对本发明的实施例进行详细说明，但是本发明可以由权利要求限定和覆盖的多种不同方式实施。The embodiments of the present invention are described in detail below with reference to the accompanying drawings, but the present invention can be implemented in many different ways as defined and covered by the claims.
作为本发明的一个方面，提供了一种远程荧光粉大角度散射贴片LED，包括：导热电子电路板1、一个或多个倒装LED芯片2、和塑料壳体7，所述塑料壳体7内形成有非朗伯体穹顶结构腔体5，所述塑料壳体7的底部形成安装凹槽6，所述导热电子电路板1安装在所述安装凹槽6中，所述倒装LED芯片2安装在所述导热电子电路板1上并位于所述非朗伯体穹顶结构腔体5中，所述塑料壳体7的两侧突出于所述导热电子电路板1的两侧。优选地，所述安装凹槽6沿所述塑料壳体7的径向贯通地设置。As an aspect of the present invention, a remote phosphor large-angle scattering SMD LED is provided, comprising: a thermally conductive electronic circuit board 1, one or more flip-chip LED chips 2, and a plastic casing 7, the plastic casing 7 is formed with a non-Lambertian dome structure cavity 5, the bottom of the plastic housing 7 forms a mounting groove 6, the thermally conductive electronic circuit board 1 is installed in the mounting groove 6, the flip-chip LED The chip 2 is mounted on the thermally conductive electronic circuit board 1 and is located in the non-Lambertian dome structure cavity 5 , and both sides of the plastic housing 7 protrude from both sides of the thermally conductive electronic circuit board 1 . Preferably, the installation groove 6 is provided through the radial direction of the plastic housing 7 .
优选地，所述塑料壳体7采用PP或PP改性塑料制成。优选地，所述PP改性塑料为茂金属聚丙烯塑料，解决了荧光粉均匀均质及塑料变色发黑的问题。Preferably, the plastic shell 7 is made of PP or PP modified plastic. Preferably, the PP modified plastic is metallocene polypropylene plastic, which solves the problems of uniform and homogeneous phosphor powder and plastic discoloration and blackening.
优选地，所述导热电子电路板1通过粘接的方式安装在所述安装凹槽6中。优选地，所述导热电子电路板1通过耐高温快干型结构胶安装在所述安装凹槽6中。塑料壳体7注塑成型、导热电子电路板1与安装凹槽6的安装装配、耐高温的快干型结构胶粘接安装等，可省去现有技术中贴片LED≥480分钟老化工序，塑料壳体7注塑成型延伸了贴片LED制造的产业链条，可大大简化LED元件封装工艺，提高生产效率，更有利于实现标准化、自动化、智能化生产。Preferably, the thermally conductive electronic circuit board 1 is mounted in the mounting groove 6 by means of bonding. Preferably, the thermally conductive electronic circuit board 1 is installed in the installation groove 6 by a high-temperature-resistant and quick-drying structural adhesive. Injection molding of the plastic shell 7, installation and assembly of the thermally conductive electronic circuit board 1 and the mounting groove 6, high-temperature-resistant quick-drying structural adhesive bonding installation, etc., can save the aging process of the SMD LED ≥ 480 minutes in the prior art, The plastic shell 7 injection molding extends the industrial chain of SMD LED manufacturing, which can greatly simplify the LED component packaging process, improve production efficiency, and be more conducive to standardization, automation, and intelligent production.
优选地，所述导热电子电路板1采用陶瓷电路板、或铝基电路板、或FPC电路板、或玻璃基电路板。Preferably, the thermally conductive electronic circuit board 1 is a ceramic circuit board, or an aluminum-based circuit board, or an FPC circuit board, or a glass-based circuit board.
优选地，所述非朗伯体穹顶结构腔体5在光轴方向正投影为一个长方形结构，且长方形结构的宽度小于所述导热电子电路板1的宽度，所述安装凹槽6的宽度大于所述非朗伯体穹顶结构腔体5的宽度。Preferably, the non-Lambertian dome structure cavity 5 is orthographically projected into a rectangular structure in the direction of the optical axis, and the width of the rectangular structure is smaller than the width of the thermally conductive electronic circuit board 1, and the width of the installation groove 6 is greater than The width of the non-Lambertian dome structure cavity 5 .
优选地，所述导热电子电路板1的底面高于所述塑料壳体7的底面。Preferably, the bottom surface of the thermally conductive electronic circuit board 1 is higher than the bottom surface of the plastic housing 7 .
优选地，所述非朗伯体穹顶结构腔体5为光致发光光源的混光腔。例如，可在PP或改性PP塑料3中添加阻燃剂、光敏剂、白油、扩散剂等助剂，荧光粉4可为稀土荧光粉、硅酸盐荧光粉、氮化物荧光粉等。LED芯片发出的蓝光在混光腔内发生反射，此时处于混光腔内的主要是蓝光，而蓝光只是激发光源，真正发生光致发光的区域在塑料壳体7的荧光粉，即蓝光射入塑料壳体7内，与其中的荧光粉4激发后 发出高于入射光波长的光，这个过程即是光致发光。Preferably, the non-Lambertian dome structure cavity 5 is a light mixing cavity of a photoluminescence light source. For example, auxiliary agents such as flame retardant, photosensitizer, white oil, and diffusing agent can be added to PP or modified PP plastic 3, and the phosphor 4 can be rare earth phosphor, silicate phosphor, nitride phosphor, and the like. The blue light emitted by the LED chip is reflected in the light mixing cavity. At this time, the blue light in the light mixing cavity is mainly blue light, and the blue light is only the excitation light source. The area where photoluminescence actually occurs is the phosphor of the plastic shell 7, that is, the blue light into the plastic shell 7, and after being excited with the phosphor 4 therein, it emits light with a wavelength higher than that of the incident light, and this process is photoluminescence.
工作时，倒装LED芯片2发出的蓝光（又称激发光），依据其结构，它发出的光为定向发光。该定向发光光束在非朗伯体穹顶结构腔体5内经多次反射形成散射光，因此，我们又把非朗伯体穹顶结构腔体5称为混光腔。经过混光腔后的激发光，激发塑料壳体7内的荧光粉4发出波长高于激发光，这个过程即为光致发光的过程。由于荧光粉4的物理形体为不规则颗粒体，因此它发出的光可视为空间发光。激发光在塑料壳体7内的传输最少分为两种状态，一是激发光的透射状态，另一种是光致发光的状态。激发光处于光致发光状态时，其中一部分光（或反射光）改变光路，如此最少改变了“激发光”定向发光的光路。During operation, the blue light (also called excitation light) emitted by the flip-chip LED chip 2 is directional light emission according to its structure. The directional light-emitting beam is repeatedly reflected in the non-Lambertian dome structure cavity 5 to form scattered light. Therefore, we call the non-Lambertian dome structure cavity 5 a light mixing cavity again. The excitation light after the light mixing cavity excites the phosphor 4 in the plastic housing 7 to emit a wavelength higher than that of the excitation light, and this process is the process of photoluminescence. Since the physical shape of the phosphor 4 is an irregular particle, the light it emits can be regarded as space luminescence. The transmission of the excitation light in the plastic casing 7 can be divided into at least two states, one is the transmission state of the excitation light, and the other is the photoluminescence state. When the excitation light is in the photoluminescence state, a part of the light (or reflected light) changes the light path, which at least changes the light path of the "excitation light" directional light.
综上所述，本发明的发光路径可归纳为：倒装LED芯片2发出的光至非朗伯体穹顶结构腔体5，然后再进入塑料壳体7中，一部分透射，另一部分与塑料壳体7中的荧光粉4相作用，产生光致发光，并经空间混光产生白光。在此过程中，由于塑料壳体7的直径大于导热电子电路板1的宽度，因此可获得向下的光，从而获得更大发光角度的散射光，如此不但可产生安全的光，还可避免蓝光对人眼损伤，柔和的光不刺眼、无眩光、无重影，舒服的光均匀柔和的光能营造温馨舒适的光环境。To sum up, the light emitting path of the present invention can be summarized as: the light emitted by the flip-chip LED chip 2 reaches the non-Lambertian dome structure cavity 5, and then enters the plastic housing 7, part of it is transmitted, and the other part is connected to the plastic housing. The phosphors 4 in the body 7 interact with each other to generate photoluminescence, and white light is generated through spatial light mixing. During this process, since the diameter of the plastic housing 7 is larger than the width of the thermally conductive electronic circuit board 1, downward light can be obtained, thereby obtaining scattered light with a larger emitting angle, which can not only generate safe light, but also avoid Blue light damages human eyes, soft light is not dazzling, no glare, no ghosting, comfortable light, uniform and soft light can create a warm and comfortable light environment.
在上述技术方案中，本发明塑料壳体7的直径大于导热电子电路板1的宽度，使塑料壳体7的一部分悬空于导热电子电路板1的宽度方向，不但可使受激发光激发的塑料壳体7中的荧光粉4发出的光改变方向，还可使在塑料壳体7内传输的激发光改变方向，由此可获得向光轴的负极方向照射。In the above technical solution, the diameter of the plastic casing 7 of the present invention is larger than the width of the thermally conductive electronic circuit board 1, so that a part of the plastic casing 7 is suspended in the width direction of the thermally conductive electronic circuit board 1, which not only can make the plastic excited by the excitation light The direction of the light emitted by the phosphor 4 in the casing 7 can be changed, and the direction of the excitation light transmitted in the plastic casing 7 can also be changed, so that it can be irradiated in the negative direction of the optical axis.
在一个实施例中，可采用US10,424,706B2中提供的LED倒装芯片固晶导电粘接结构及其安装方法，在导热电子电路板1上固晶倒装LED芯片2；在烘箱内，155~160℃固化60分钟；然后，将固化后的LED电路板8与塑料壳体7，实施安装装配，而后再用粘接胶9采用划线均匀施胶的方式实施粘接。固化后，即可完成。In one embodiment, the LED flip-chip bonding structure and its mounting method provided in US10,424,706B2 can be used to bond and flip the LED chip 2 on the thermally conductive electronic circuit board 1; in an oven, 155 Cured at ~160°C for 60 minutes; then, the cured LED circuit board 8 and the plastic housing 7 are assembled and assembled, and then the adhesive glue 9 is used to implement the bonding by scribing evenly. Once cured, it's done.
在另一个实施例中，注塑加工塑料壳体7，本实施例注塑加工塑料壳体高度的实际尺寸或总高为7.0mm。可采用US10,424,706B2中提供的LED倒装芯片固晶导电粘接结构及其安装方法，在导热电子电路板1上固晶倒装LED芯片2。然后，在烘箱内，155~160℃固化60分钟。接着，在塑料壳体7的安装凹槽6的边缘部分，用粘接胶9采用划线均匀施胶的方式布胶。而后，将固化后的LED电路板8与塑料壳体7，实施粘接安装装配，固化后，即可完成。In another embodiment, the plastic shell 7 is injection-molded, and the actual size or total height of the injection-molded plastic shell in this embodiment is 7.0 mm. The LED chip 2 can be mounted on the thermally conductive electronic circuit board 1 by using the LED flip-chip die-bonding conductive adhesive structure and its mounting method provided in US10,424,706B2. Then, in an oven, cure at 155~160°C for 60 minutes. Next, on the edge portion of the installation groove 6 of the plastic housing 7, use the adhesive 9 to apply glue evenly by scribing lines. Then, the cured LED circuit board 8 and the plastic housing 7 are bonded, mounted and assembled, and after curing, it can be completed.
本发明可实现贴片LED大角度散射发光，且获得散射光健康光源，不但工序简单，效率高，工序少，且无需老化工序，产业链拉长，自动化程度高。The invention can realize large-angle scattered light emission of the patch LED, and obtain a healthy light source with scattered light, which not only has simple process, high efficiency, few processes, no aging process, long industrial chain, and high degree of automation.
以上所述仅为本发明的优选实施例而已，并不用于限制本发明，对于本领域的技术人员来说，本发明可以有各种更改和变化。凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims (10)

  1. 一种远程荧光粉大角度散射贴片LED，其特征在于，包括：导热电子电路板（1）、倒装LED芯片（2）、和塑料壳体（7），所述塑料壳体（7）内形成有非朗伯体穹顶结构腔体（5），所述塑料壳体（7）的底部形成安装凹槽（6），所述导热电子电路板（1）安装在所述安装凹槽（6）中，所述倒装LED芯片（2）安装在所述导热电子电路板（1）上并位于所述非朗伯体穹顶结构腔体（5）中，所述塑料壳体（7）的两侧突出于所述导热电子电路板（1）的两侧。A remote phosphor large-angle scattering patch LED, characterized by comprising: a thermally conductive electronic circuit board (1), a flip-chip LED chip (2), and a plastic housing (7), the plastic housing (7) A non-Lambertian dome structure cavity (5) is formed inside, a mounting groove (6) is formed at the bottom of the plastic housing (7), and the thermally conductive electronic circuit board (1) is mounted in the mounting groove ( In 6), the flip-chip LED chip (2) is mounted on the thermally conductive electronic circuit board (1) and is located in the non-Lambertian dome structure cavity (5), the plastic housing (7) Both sides of the thermal conductive electronic circuit board (1) protrude from both sides.
  2. 根据权利要求1所述的远程荧光粉大角度散射贴片LED，其特征在于，所述安装凹槽（6）沿所述塑料壳体（7）的径向贯通地设置。The remote phosphor large-angle scattering SMD LED according to claim 1, characterized in that, the installation groove (6) is provided through and through along the radial direction of the plastic housing (7).
  3. 根据权利要求1所述的远程荧光粉大角度散射贴片LED，其特征在于，所述塑料壳体（7）采用PP或PP改性塑料制成。The remote phosphor large-angle scattering SMD LED according to claim 1, characterized in that, the plastic housing (7) is made of PP or PP modified plastic.
  4. 根据权利要求1所述的远程荧光粉大角度散射贴片LED，其特征在于，所述导热电子电路板（1）通过粘接的方式安装在所述安装凹槽（6）中。The remote phosphor large-angle scattering SMD LED according to claim 1, characterized in that, the thermally conductive electronic circuit board (1) is installed in the installation groove (6) by means of bonding.
  5. 根据权利要求1所述的远程荧光粉大角度散射贴片LED，其特征在于，所述导热电子电路板（1）采用陶瓷电路板、或铝基电路板、或FPC电路板、或玻璃基电路板。The remote phosphor large-angle scattering SMD LED according to claim 1, characterized in that the thermally conductive electronic circuit board (1) is a ceramic circuit board, or an aluminum-based circuit board, or an FPC circuit board, or a glass-based circuit board. plate.
  6. 根据权利要求3所述的远程荧光粉大角度散射贴片LED，其特征在于，所述PP改性塑料为茂金属聚丙烯塑料。The remote phosphor large-angle scattering SMD LED according to claim 3, wherein the PP modified plastic is metallocene polypropylene plastic.
  7. 根据权利要求1所述的远程荧光粉大角度散射贴片LED，其特征在于，所述非朗伯体穹顶结构腔体（5）在光轴方向正投影为一个长方形结构，且长方形结构的宽度小于所述导热电子电路板（1）的宽度，所述安装凹槽（6）的宽度大于所述非朗伯体穹顶结构腔体（5）的宽度。The long-range phosphor large-angle scattering SMD LED according to claim 1, wherein the non-Lambertian dome structure cavity (5) is orthographically projected in the optical axis direction into a rectangular structure, and the width of the rectangular structure is Less than the width of the thermally conductive electronic circuit board (1), the width of the mounting groove (6) is greater than the width of the non-Lambertian dome structure cavity (5).
  8. 根据权利要求4所述的远程荧光粉大角度散射贴片LED，其特征在于，所述导热电子电路板（1）的底面高于所述塑料壳体（7）的底面。The remote phosphor large-angle scattering SMD LED according to claim 4, characterized in that the bottom surface of the thermally conductive electronic circuit board (1) is higher than the bottom surface of the plastic housing (7).
  9. 根据权利要求1所述的远程荧光粉大角度散射贴片LED，其特征在于，所述导热电子电路板（1）通过耐高温快干型结构胶安装在所述安装凹槽（6）中。The remote phosphor large-angle scattering SMD LED according to claim 1, characterized in that the thermally conductive electronic circuit board (1) is installed in the installation groove (6) by a high-temperature-resistant and quick-drying structural adhesive.
  10. 根据权利要求7所述的远程荧光粉大角度散射贴片LED，其特征在于，所述非朗伯体穹顶结构腔体（5）为可光致发光的混光腔。The remote phosphor large-angle scattering SMD LED according to claim 7, wherein the non-Lambertian dome structure cavity (5) is a light mixing cavity capable of photoluminescence.
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CN101707232A (en) * 2009-12-01 2010-05-12 桂林电子科技大学 LED product and manufacture method thereof
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