WO2022085980A1 - Structure de fixation d'antenne et dispositif électronique la comprenant - Google Patents

Structure de fixation d'antenne et dispositif électronique la comprenant Download PDF

Info

Publication number
WO2022085980A1
WO2022085980A1 PCT/KR2021/013436 KR2021013436W WO2022085980A1 WO 2022085980 A1 WO2022085980 A1 WO 2022085980A1 KR 2021013436 W KR2021013436 W KR 2021013436W WO 2022085980 A1 WO2022085980 A1 WO 2022085980A1
Authority
WO
WIPO (PCT)
Prior art keywords
antenna module
electronic device
housing
antenna
module
Prior art date
Application number
PCT/KR2021/013436
Other languages
English (en)
Korean (ko)
Inventor
김영진
허재영
김보람
권오혁
이현우
Original Assignee
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자 주식회사 filed Critical 삼성전자 주식회사
Publication of WO2022085980A1 publication Critical patent/WO2022085980A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/02—Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/44—Details of, or arrangements associated with, antennas using equipment having another main function to serve additionally as an antenna, e.g. means for giving an antenna an aesthetic aspect
    • H01Q1/46—Electric supply lines or communication lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna

Definitions

  • Various embodiments of the present disclosure relate to an antenna fixing structure and an electronic device including the same.
  • a portable electronic device such as a portable communication device, a mobile terminal, a mobile communication terminal, or a smart phone, may communicate with an external electronic device using a communication circuit and an antenna, or may be connected to an external device disposed in a short distance nearby using a predetermined network. there is.
  • Efforts are being made to develop an improved 5th generation (5G) communication system or a pre-5G communication system in order to meet the increasing demand for wireless data traffic after commercialization of the 4G (4th generation) communication system.
  • 5G communication system In order to achieve a high data rate, the 5G communication system is being considered for implementation in a very high frequency (mmWave) band (eg, 20 GHz to about 300 GHz).
  • mmWave very high frequency
  • the antenna module is attached to the structure inside the electronic device by using a metal bracket including screws, tape, or the like.
  • a manufacturing process including screw assembly may increase, and a manufacturing price may increase due to the metal bracket and screws.
  • the antenna performance may deteriorate because the antenna module is not stably connected to the ground.
  • heat generation performance may be deteriorated due to a gap between the antenna module and the device.
  • an electronic device includes a housing including at least one groove, an antenna module disposed inside the at least one groove, and at least one rubber fixing the antenna module to the groove of the housing ( rubber) member, a wireless communication circuit disposed in the housing and electrically connected to the antenna module, and a PCB on which the wireless communication circuit is disposed.
  • An electronic device includes a housing including at least one groove, an antenna module disposed in the at least one groove, a fixing member disposed between the housing and the antenna module, and the antenna module disposed in the housing. and a wireless communication circuit electrically connected to and a PBA on which the wireless communication circuit is disposed, wherein the antenna module may be electrically connected to the PBA through a conductive connecting member.
  • TIM gal type thermal interface material
  • FIG. 1 is a perspective view of a front surface of a mobile electronic device according to an exemplary embodiment.
  • FIG. 2 is a perspective view of a rear surface of the electronic device of FIG. 1 .
  • FIG. 3 is an exploded perspective view of the electronic device of FIG. 1 .
  • Figure 4a shows an antenna module mounting structure including a fixing member according to an embodiment.
  • FIG. 4B illustrates an antenna module mounting structure including a fixing member according to another embodiment.
  • FIG. 5 illustrates an antenna module mounting structure including an additional space for arranging a fixing member according to an embodiment.
  • FIG. 6A illustrates an antenna mounting structure including a rear protrusion according to an exemplary embodiment.
  • FIG. 6B illustrates an antenna mounting structure including a front protrusion according to an exemplary embodiment.
  • 6C illustrates an antenna mounting structure including a rear protrusion and a front protrusion according to an exemplary embodiment.
  • FIG. 7 is a cross-sectional view illustrating an antenna mounting structure including a conductive connecting member and a part of the antenna mounting structure according to an exemplary embodiment.
  • FIG. 8 is a cross-sectional view illustrating an antenna mounting structure including a heat dissipation member and a part of the antenna mounting structure according to an embodiment.
  • FIG. 9 is a graph illustrating heat dissipation performance according to various embodiments of the present disclosure.
  • FIG. 10 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.
  • 11 is a block diagram of an electronic device for supporting legacy network communication and 5G network communication according to various embodiments of the present disclosure
  • FIG. 12 shows, for example, an embodiment of the structure of the third antenna module described with reference to FIG. 11 .
  • an electronic device 100 includes a first surface (or front surface) 110A, a second surface (or rear surface) 110B, and a first surface 110A. and a housing 110 including a side surface 110C surrounding the space between the second surfaces 110B.
  • the housing may refer to a structure that forms part of the first surface 110A, the second surface 110B, and the side surface 110C of FIG. 1 .
  • the first surface 110A may be formed by the front plate 102 (eg, a glass plate including various coating layers or a polymer plate) at least a portion of which is substantially transparent.
  • the second surface 110B may be formed by the substantially opaque back plate 111 .
  • the back plate 111 is formed by, for example, coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials.
  • the side surface 110C is coupled to the front plate 102 and the rear plate 111 and may be formed by a side bezel structure (or "side member") 118 including a metal and/or a polymer.
  • the back plate 111 and the side bezel structure 118 are integrally formed and may include the same material (eg, a metal material such as aluminum).
  • the front plate 102 includes two first regions 110D that extend seamlessly from the first surface 110A toward the rear plate 111 by bending the front plate. It may include both ends of the long edge of (102).
  • the rear plate 111 has two second regions 110E that extend seamlessly by bending from the second surface 110B toward the front plate 102 with long edges. It can be included at both ends.
  • the front plate 102 (or the rear plate 111 ) may include only one of the first regions 110D (or the second regions 110E). In another embodiment, some of the first regions 110D or the second regions 110E may not be included.
  • the side bezel structure 118 when viewed from the side of the electronic device 100 , is the first side bezel structure 118 on the side that does not include the first regions 110D or the second regions 110E as described above. It may have a thickness (or width) of 1, and a second thickness that is thinner than the first thickness on the side surface including the first regions 110D or the second regions 110E.
  • the electronic device 100 includes a display 101 , an audio module 103 , 107 , 114 , a sensor module 104 , 116 , 119 , a camera module 105 , 112 , 113 , and a key input. It may include at least one of the device 117 , the light emitting device 106 , the pen input device 120 , and the connector holes 108 and 109 . In some embodiments, the electronic device 100 may omit at least one of the components (eg, the key input device 117 or the light emitting device 106 ) or additionally include other components.
  • the display 101 may be exposed through a substantial portion of the front plate 102 , for example. In some embodiments, at least a portion of the display 101 may be exposed through the front plate 102 forming the first areas 110D of the first surface 110A and the side surface 110C. In some embodiments, the edge of the display 101 may be formed to be substantially the same as an adjacent outer shape of the front plate 102 . In another embodiment (not shown), in order to expand the area to which the display 101 is exposed, the distance between the periphery of the display 101 and the periphery of the front plate 102 may be substantially the same.
  • a recess or opening is formed in a part of the screen display area of the display 101, and the audio module 114 and the sensor module are aligned with the recess or opening. It may include at least one of 104 , a camera module 105 , and a light emitting device 106 .
  • an audio module 114 , a sensor module 104 , a camera module 105 , a fingerprint sensor 116 , and a light emitting element 106 on the rear surface of the screen display area of the display 101 . ) may include at least one or more of.
  • the display 101 is coupled to or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer detecting a magnetic field type stylus pen. can be placed.
  • a pressure sensor capable of measuring the intensity (pressure) of a touch
  • a digitizer detecting a magnetic field type stylus pen.
  • at least a portion of the sensor module 104 , 119 , and/or at least a portion of the key input device 117 , the first region 110D, and/or the second region 110E can be placed in
  • the audio modules 103 , 107 , and 114 may include a microphone hole 103 and speaker holes 107 and 114 .
  • a microphone for acquiring an external sound may be disposed therein, and in some embodiments, a plurality of microphones may be disposed to detect the direction of the sound.
  • the speaker holes 107 and 114 may include an external speaker hole 107 and a receiver hole 114 for a call.
  • the speaker holes 107 and 114 and the microphone hole 103 may be implemented as a single hole, or a speaker may be included without the speaker holes 107 and 114 (eg, a piezo speaker).
  • the sensor modules 104 , 116 , and 119 may generate electrical signals or data values corresponding to an internal operating state of the electronic device 100 or an external environmental state.
  • the sensor modules 104 , 116 , 119 include, for example, a first sensor module 104 (eg, a proximity sensor) and/or a second sensor module ( (not shown) (eg, a fingerprint sensor), and/or a third sensor module 119 (eg, HRM sensor) and/or a fourth sensor module 116 disposed on the second side 110B of the housing 110 . ) (eg fingerprint sensor).
  • the fingerprint sensor may be disposed on the first surface 110A (eg, the display 101) as well as on the second surface 110B of the housing 110.
  • the electronic device 100 may include a sensor module not shown, for example, at least one of a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor 104, may include
  • the camera modules 105 , 112 , and 113 include a first camera device 105 disposed on the first surface 110A of the electronic device 100 , and a second camera device 112 disposed on the second surface 110B of the electronic device 100 . ), and/or a flash 113 .
  • the camera devices 105 , 112 may include one or more lenses, an image sensor, and/or an image signal processor.
  • the flash 113 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared cameras, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 100 .
  • the key input device 117 may be disposed on the side surface 110C of the housing 110 .
  • the electronic device 100 may not include some or all of the above-mentioned key input devices 117 , and the not included key input devices 117 may be displayed on the display 101 as soft keys, etc. It can be implemented in the form
  • the key input device may include a sensor module 116 disposed on the second surface 110B of the housing 110 .
  • the light emitting device 106 may be disposed, for example, on the first surface 110A of the housing 110 .
  • the light emitting device 106 may provide, for example, state information of the electronic device 100 in the form of light.
  • the light emitting device 106 may provide, for example, a light source that is interlocked with the operation of the camera module 105 .
  • the light emitting element 106 may include, for example, an LED, an IR LED, and a xenon lamp.
  • the connector holes 108 and 109 include a first connector hole 108 capable of receiving a connector (eg, a USB connector) for transmitting and receiving power and/or data to and from an external electronic device, and/or an external electronic device. and a second connector hole (eg, earphone jack) 109 for accommodating a connector for transmitting and receiving audio signals.
  • a connector eg, a USB connector
  • a second connector hole eg, earphone jack
  • the pen input device 120 (eg, a stylus pen) is guided into the inside of the housing 110 through a hole 121 formed in a side surface of the housing 110 and can be inserted or detached, and can be easily detached. It may include a button to do so.
  • a separate resonance circuit is built in the pen input device 120 to be interlocked with the electromagnetic induction panel 390 (eg, a digitizer) included in the electronic device 100 .
  • the pen input device 120 may include an electro-magnetic resonance (EMR) method, an active electrical stylus (AES) method, and an electric coupled resonance (ECR) method.
  • the electronic device 300 includes a side bezel structure 310 , a first support member 311 (eg, a bracket), a front plate 320 , a display 330 , and an electromagnetic induction panel 390 . , a printed circuit board 340 , a battery 350 , a second support member 360 (eg, a rear case), an antenna 370 , a pen input device 120 , and a rear plate 380 .
  • the electronic device 300 may omit at least one of the components (eg, the first support member 311 or the second support member 360 ) or additionally include other components. .
  • At least one of the components of the electronic device 300 may be the same as or similar to at least one of the components of the electronic device 100 of FIG. 1 or 2 , and overlapping descriptions will be omitted below.
  • the electromagnetic induction panel 390 may be a panel for detecting an input of the pen input device 120 .
  • the electromagnetic induction panel 390 may include a printed circuit board (PCB) (eg, flexible printed circuit board (FPCB)) and a shielding sheet.
  • the shielding sheet may prevent interference between the components by an electromagnetic field generated from components (eg, a display module, a printed circuit board, an electromagnetic induction panel, etc.) included in the electronic device 100 .
  • the shielding sheet blocks electromagnetic fields generated from the components, so that an input from the pen input device 120 can be accurately transmitted to a coil included in the electromagnetic induction panel 240 .
  • the electromagnetic induction panel 240 according to various embodiments may include an opening formed in at least a partial area corresponding to the biometric sensor mounted on the electronic device 100 .
  • the first support member 311 may be disposed inside the electronic device 300 and connected to the side bezel structure 310 , or may be integrally formed with the side bezel structure 310 .
  • the first support member 311 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material.
  • the first support member 311 may have a display 330 coupled to one surface and a printed circuit board 340 coupled to the other surface.
  • the printed circuit board 340 may be equipped with a processor, memory, and/or an interface.
  • the processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.
  • Memory may include, for example, volatile memory or non-volatile memory.
  • the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • the interface may, for example, electrically or physically connect the electronic device 300 to an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector.
  • the battery 350 is a device for supplying power to at least one component of the electronic device 300 and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. . At least a portion of the battery 350 may be disposed substantially on the same plane as the printed circuit board 340 . The battery 350 may be integrally disposed inside the electronic device 300 , or may be disposed detachably from the electronic device 300 .
  • the antenna 370 may be disposed between the rear plate 380 and the battery 350 .
  • the antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna.
  • the antenna 370 may, for example, perform short-range communication with an external device or wirelessly transmit/receive power required for charging.
  • the antenna structure may be formed by a part of the side bezel structure 310 and/or the first support member 311 or a combination thereof.
  • Figure 4a shows an antenna module mounting structure including a fixing member according to an embodiment.
  • 4B illustrates an antenna module mounting structure including a fixing member according to another embodiment.
  • the antenna mounting structure 400 includes a housing 470, an antenna module 410, and a heat dissipation member disposed between the antenna module 410 and the housing 470 ( 420 ) and at least one fixing member 430 .
  • the antenna module 410 includes a printed circuit board 411 and a shielding member 412 coupled to the printed circuit board 411 and a radio frequency integrated circuit (RFIC) disposed inside the shielding member.
  • the shielding member 412 may include a shield can or a conformal shield.
  • the printed circuit board 411 may include a patch antenna or a dipole antenna.
  • the RFIC may be disposed on one surface of the printed circuit board 411 .
  • the RFIC may be electrically connected to the printed circuit board 411 .
  • the RFIC may control an antenna disposed on the printed circuit board 411 to transmit/receive a signal of a specified frequency band (eg, mmWave band).
  • a specified frequency band eg, mmWave band
  • the housing 470 may include a conductive portion and a non-conductive portion 475 .
  • the non-conductive portion 475 of the housing 470 may be disposed to face the antenna module 410 .
  • the housing 470 may include at least one groove 490 .
  • the antenna module 410 may be disposed in at least one groove 490 inside the housing 470 .
  • the side surface of the antenna module 410 is a first surface, a second surface perpendicular to the first surface, a third surface perpendicular to the second surface and parallel to the first surface, a first surface, and a third surface It may include a fourth surface perpendicular to the surface.
  • the at least one fixing member 430 may be disposed in the at least one groove 490 . According to an embodiment, the at least one fixing member 430 may be disposed between the antenna module 410 and the housing 470 . According to an embodiment, the at least one fixing member 430 may be disposed between one surface of the antenna module 410 and the housing 470 . According to an embodiment, the at least one fixing member 430 may include a first fixing member 431 and a second fixing member 432 . For example, the first fixing member 431 is disposed between the first surface of the antenna module 410 and the housing 470 , and the second fixing member 432 is disposed between the third surface of the antenna module 410 and the housing. 470 may be disposed.
  • the at least one fixing member 430 may have a shape in contact with one or more surfaces of the antenna module 410 .
  • at least one fixing member 430 may contact two or more surfaces of the antenna module 410 for stable fixing of the antenna module 410 .
  • the at least one fixing member 430 may have an L shape, a U shape, or a C shape.
  • the first fixing member 431 may be disposed in the at least one groove 490 to contact some of the first and second surfaces of the antenna module 410 .
  • the second fixing member 432 may be disposed in the at least one groove 490 to contact at least a portion of the second surface, and at least a portion of the third surface and the fourth surface of the antenna module 410 . .
  • the second fixing member 432 may be disposed to contact some of the third and fourth surfaces of the antenna module 410 .
  • the first fixing member 431 and the second fixing member 432 may be integrally formed.
  • the arrangement and shape of the first fixing member 431 and the second fixing member 432 are not limited to the above description, and may include various arrangements and shapes.
  • the at least one fixing member 430 may be formed of a rubber material. According to an embodiment, the at least one fixing member 430 may fix the antenna module 410 to the housing 470 . According to an embodiment, the at least one fixing member 430 has elasticity and may fix the antenna module 410 to the at least one groove 490 of the housing 470 . According to an embodiment, the at least one fixing member 430 is disposed between the antenna module 410 and the housing 470 to fix the antenna module 410 to the at least one groove 490 of the housing 470 . can do.
  • the at least one fixing member 430 may not include a metal fixing structure (eg, a metal bracket).
  • the heat dissipation member 420 may be disposed between the antenna module 410 and the housing 470 .
  • the heat dissipation member 420 may include a gel type thermal interface material (TIM), but is not limited thereto. A detailed description thereof will be given later.
  • TIM gel type thermal interface material
  • FIG. 5 illustrates an antenna module mounting structure including an additional space for arranging a fixing member according to an embodiment.
  • the antenna mounting structure 400 may include an antenna module 410 , a housing 470 , and a heat dissipation member 420 .
  • the same or substantially the same components as the above-described components have the same reference numerals, and overlapping contents are omitted.
  • the housing 470 includes at least one groove 490 , and the at least one groove 490 defines at least one additional space 520 in which the at least one fixing member 430 is disposed.
  • the at least one groove 490 may include an additional space 520 in an area adjacent to the first surface and/or the third surface of the antenna module 410 , respectively.
  • At least one fixing member 430 may be disposed in the additional space 520 of the at least one groove 490 . According to an embodiment, the at least one fixing member 430 may be disposed to contact the antenna module 410 in the additional space 520 . For example, the at least one fixing member 430 may be disposed in the additional space 520 adjacent to the first surface and the third surface of the antenna module 410 . According to an embodiment, the at least one fixing member 430 may have a shape corresponding to the additional space 520 , but is not limited thereto.
  • 6A illustrates an antenna mounting structure including a rear protrusion according to an exemplary embodiment.
  • 6B illustrates an antenna mounting structure including a front protrusion according to an exemplary embodiment.
  • 6C illustrates an antenna mounting structure including a rear protrusion and a front protrusion according to an exemplary embodiment.
  • the antenna mounting structure 400 may include a housing 470 , a heat dissipation member 420 , and an antenna module 410 .
  • the same or substantially the same components as the above-described components have the same reference numerals, and overlapping contents are omitted.
  • the housing 470 may include a first housing 471 and a second housing 472 .
  • the first housing 471 may form at least a portion of the rear surface (eg, the second surface 110B of FIG. 1 ) of the electronic device.
  • the second housing 472 may form at least a portion of the front surface (eg, the first surface 110A of FIG. 1 ) of the electronic device.
  • the first housing 471 may include at least one first protrusion 610 .
  • the at least one first protrusion 610 may be formed of a material (eg, metal) having high solidity, but is not limited thereto.
  • the first protrusion 610 may be disposed between the housing 470 and the antenna module 410 . According to an embodiment, the first protrusion 610 may be disposed to contact the housing 470 and the antenna module 410 . According to an embodiment, the first protrusion 610 may be inserted into a space formed by the antenna module 410 , the second housing 472 , and the heat dissipation member 420 . The first protrusion 610 according to an embodiment may be inserted into the groove to fix the antenna module 410 to at least one groove (eg, at least one groove 490 in FIG. 4A ).
  • the second housing 472 may include at least one second protrusion 620 .
  • the second protrusion 620 may be disposed between the housing 470 and the antenna module 410 .
  • the second protrusion 620 may be disposed to contact the heat dissipation member 420 and the antenna module 410 .
  • the second protrusion 620 may be disposed to contact the antenna module 410 to fix the antenna module 410 to the housing 470 .
  • the housing 470 may include a first protrusion 610 and a second protrusion 620 .
  • the first housing 471 may include a first protrusion 610
  • the second housing 472 may include a second protrusion 620 .
  • the first protrusion 610 and the second protrusion 620 may be disposed to contact the antenna module 410 , thereby fixing the antenna module 410 to the housing 470 .
  • the antenna mounting structure 400 may include a conductive connection member.
  • the conductive connecting member may include a conductive double-sided tape 710 .
  • the antenna module 410 may be electrically connected to the conductive region of the housing 470 through the conductive double-sided tape 710 .
  • the antenna module 410 may be coupled to the housing 470 through the conductive double-sided tape 710 .
  • FIG. 7 is a cross-sectional view illustrating an antenna mounting structure including a conductive connecting member and a part of the antenna mounting structure according to an exemplary embodiment.
  • the antenna mounting structure 400 is a printed board assembly (PBA) 730 including an antenna module 410 , a housing 470 , a display 750 , and a ground. , conductive connection members 710 and 720 and a heat dissipation member 420 may be included.
  • PBA printed board assembly
  • the same or substantially the same components as the above-described components have the same reference numerals, and overlapping contents are omitted.
  • the conductive connecting member 710 or 720 may include a conductive tape 710 and/or a clip 720 .
  • the antenna module 410 may be electrically connected to the PBA 730 .
  • the antenna module 410 may be connected to the PBA 730 through the conductive tape 710 and/or the clip 720 .
  • the antenna module 410 may be electrically connected to the ground of the PBA 730 through the conductive tape 710 and/or the clip 720 .
  • the antenna module 410 is connected to the housing 470 through the conductive tape 710 , and the housing 470 is connected to the ground of the PBA 730 , so that the antenna module 410 is connected to the PBA 730 .
  • the antenna module 410 may be electrically connected to the ground of the PBA 730 .
  • the clip 720 may be disposed inside the PBA 730 or on the PBA 730, but is not limited thereto.
  • the antenna module 410 may be electrically connected to at least one electronic component (not shown) disposed on the PBA 730 . According to an embodiment, the antenna module 410 may be electrically connected to at least one electronic component disposed on the PBA 730 through the conductive connecting member 710 or 720 . For example, the antenna module 410 may be electrically connected to at least one electronic component disposed on the PBA 730 and transmit and receive a signal in a specified frequency band by controlling at least one electrically connected electronic component. .
  • the display 750 may include a plurality of layers. According to an embodiment, the display 750 may include a display panel. According to an embodiment, the display 750 may include a touch panel on which electrodes for receiving a touch input, fingerprint recognition, or pen input are disposed. According to an embodiment, the display 750 may include one or more adhesive layers, a polarizer, and a transparent plate exposed to the outside of the electronic device (eg, the electronic device 100 of FIG. 1 ), but is limited thereto. it is not going to be
  • FIG. 8 is a cross-sectional view illustrating an antenna mounting structure including a heat dissipation member and a part of the antenna mounting structure according to an embodiment.
  • the antenna mounting structure 400 includes an antenna module 410 , a housing 470 , a display 750 , a heat dissipation member 420 , and a heat dissipation structure 810 , 820 or 840 .
  • the heat dissipation member 420 may be disposed to contact one surface of the antenna module 410 . According to an embodiment, the heat dissipation member 420 may be disposed to contact the antenna module 410 and the housing 470 . According to an embodiment, the heat dissipation member 420 may include a gel type thermal interface material (TIM), but is not limited thereto. According to an embodiment, heat generated in the antenna module 410 may be transferred to the housing 470 through the heat dissipation member 420 .
  • TIM gel type thermal interface material
  • the heat dissipation structure 810 , 820 or 840 may include a heat dissipation sheet 810 , a heat transfer path 820 , and/or a heat dissipation tape 840 .
  • the heat dissipation sheet 810 may be disposed to contact the housing 470 .
  • the heat dissipation sheet 810 may include at least one of a vapor chamber (VC), a graphene sheet, and a graphite sheet, but is not limited thereto.
  • the antenna mounting structure 400 may include a heat transfer path 820 connected to the antenna module 410 , the heat dissipation member 420 , the housing 470 , and the heat dissipation sheet 810 .
  • heat generated by the antenna module 410 may be transferred to the heat dissipation sheet 810 through the heat transfer path 820 .
  • the heat transfer path 820 may be formed to pass through the heat dissipation member 420 , but is not limited thereto.
  • the antenna module 410 may be attached to the housing 470 through the heat dissipation tape 840 .
  • the heat dissipation tape 840 may include a double-sided tape that adheres to the antenna module 410 and the first housing 471 .
  • the heat dissipation tape 840 may transfer heat generated in the antenna module 410 to the first housing 471 .
  • the antenna mounting structure 400 may include various heat dissipation structures according to positions.
  • the heat dissipation structure may transfer heat generated in an adjacent portion of the antenna module 410 to the housing 470 or the heat dissipation sheet 810 .
  • the first end surface A1 may include a heat transfer path 820 connected to the antenna module 410 , the heat dissipation member 420 , the housing 470 and the heat dissipation sheet 810 , and the second
  • the end surface A2 may include a heat dissipation member 420 and a heat dissipation tape 840 .
  • the first end surface A1 and the second end surface A2 may have substantially the same configuration, but is not limited thereto.
  • FIG. 9 is a graph illustrating heat dissipation performance according to various embodiments of the present disclosure.
  • the metal bracket eg, the first support member 311 of FIG. 3
  • the heat dissipation member By applying (eg, the heat dissipation member 420 of FIG. 4A ), various heat dissipation performance may be obtained.
  • heat dissipation performance may be deteriorated.
  • heat dissipation performance may be improved.
  • the antenna mounting structure when the antenna module (eg, the antenna module 410 of FIG. 4A is mounted) through the metal bracket, the antenna mounting structure (eg, the antenna mounting structure 400 of FIG. 4A ) has a first heat quantity 901 )
  • the antenna mounting structure when the metal bracket is removed, the antenna mounting structure may have a second heating value 902 that is increased compared to the first heating value 901 .
  • the antenna mounting structure when a heat dissipation member is added after removing the metal bracket, the antenna mounting structure may have a third heat amount 903 similar to the first heat amount 901 . According to an embodiment, the antenna mounting structure may have substantially similar heat dissipation performance to a case in which the antenna module is mounted through the metal bracket by removing the metal bracket and adding a heat dissipation member.
  • FIG. 10 is a block diagram of an electronic device 1001 in a network environment 1000 according to various embodiments of the present disclosure.
  • the electronic device 1001 communicates with the electronic device 1002 through a first network 1098 (eg, a short-range wireless communication network) or a second network 1099 . It may communicate with the electronic device 1004 or the server 1008 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 1001 may communicate with the electronic device 1004 through the server 1008 .
  • a first network 1098 eg, a short-range wireless communication network
  • a second network 1099 e.g., a second network 1099
  • the electronic device 1004 or the server 1008 eg, a long-distance wireless communication network
  • the electronic device 1001 may communicate with the electronic device 1004 through the server 1008 .
  • the electronic device 1001 includes a processor 1020 , a memory 1030 , an input module 1050 , a sound output module 1055 , a display module 1060 , an audio module 1070 , and a sensor module ( 1076), interface 1077, connection terminal 1078, haptic module 1079, camera module 1080, power management module 1088, battery 1089, communication module 1090, subscriber identification module 1096 , or an antenna module 1097 .
  • at least one of these components eg, the connection terminal 1078
  • some of these components are integrated into one component (eg, display module 1060 ). can be
  • the processor 1020 executes software (eg, a program 1040) to execute at least one other component (eg, a hardware or software component) of the electronic device 1001 connected to the processor 1020. It can control and perform various data processing or operations. According to an embodiment, as at least part of data processing or operation, the processor 1020 stores a command or data received from another component (eg, the sensor module 1076 or the communication module 1090 ) into the volatile memory 1032 . may be stored in , process commands or data stored in the volatile memory 1032 , and store the result data in the non-volatile memory 1034 .
  • software eg, a program 1040
  • the processor 1020 stores a command or data received from another component (eg, the sensor module 1076 or the communication module 1090 ) into the volatile memory 1032 .
  • the processor 1020 stores a command or data received from another component (eg, the sensor module 1076 or the communication module 1090 ) into the volatile memory 1032 .
  • the processor 1020 stores a command or
  • the processor 1020 is the main processor 1021 (eg, a central processing unit or an application processor) or a secondary processor 1023 (eg, a graphic processing unit, a neural network processing unit (eg, a graphic processing unit, a neural network processing unit) a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor).
  • the main processor 1021 e.g, a central processing unit or an application processor
  • a secondary processor 1023 eg, a graphic processing unit, a neural network processing unit (eg, a graphic processing unit, a neural network processing unit) a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor.
  • the main processor 1021 e.g, a central processing unit or an application processor
  • a secondary processor 1023 eg, a graphic processing unit, a neural network processing unit (eg, a graphic processing unit, a neural network processing unit) a neural processing unit (NPU), an image signal processor,
  • the coprocessor 1023 may, for example, act on behalf of the main processor 1021 while the main processor 1021 is in an inactive (eg, sleep) state, or when the main processor 1021 is active (eg, executing an application). ), together with the main processor 1021, at least one of the components of the electronic device 1001 (eg, the display module 1060, the sensor module 1076, or the communication module 1090) It is possible to control at least some of the related functions or states.
  • the coprocessor 1023 eg, an image signal processor or a communication processor
  • may be implemented as part of another functionally related component eg, the camera module 1080 or the communication module 1090). there is.
  • the auxiliary processor 1023 may include a hardware structure specialized for processing an artificial intelligence model.
  • Artificial intelligence models can be created through machine learning. Such learning may be performed, for example, in the electronic device 1001 itself on which artificial intelligence is performed, or may be performed through a separate server (eg, server 1008).
  • the learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but in the above example not limited
  • the artificial intelligence model may include a plurality of artificial neural network layers.
  • Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the above example.
  • the artificial intelligence model may include, in addition to, or alternatively, a software structure in addition to the hardware structure.
  • the memory 1030 may store various data used by at least one component of the electronic device 1001 (eg, the processor 1020 or the sensor module 1076 ).
  • the data may include, for example, input data or output data for software (eg, the program 1040 ) and instructions related thereto.
  • the memory 1030 may include a volatile memory 1032 or a non-volatile memory 1034 .
  • the program 1040 may be stored as software in the memory 1030 , and may include, for example, an operating system 1042 , middleware 1044 , or an application 1046 .
  • the input module 1050 may receive a command or data to be used in a component (eg, the processor 1020 ) of the electronic device 1001 from the outside (eg, a user) of the electronic device 1001 .
  • the input module 1050 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).
  • the sound output module 1055 may output a sound signal to the outside of the electronic device 1001 .
  • the sound output module 1055 may include, for example, a speaker or a receiver.
  • the speaker can be used for general purposes such as multimedia playback or recording playback.
  • the receiver may be used to receive an incoming call. According to an embodiment, the receiver may be implemented separately from or as a part of the speaker.
  • the display module 1060 may visually provide information to the outside (eg, a user) of the electronic device 1001 .
  • the display module 1060 may include, for example, a control circuit for controlling a display, a hologram device, or a projector and a corresponding device.
  • the display module 1060 may include a touch sensor configured to sense a touch or a pressure sensor configured to measure the intensity of a force generated by the touch.
  • the audio module 1070 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 1070 acquires a sound through the input module 1050 or an external electronic device (eg, a sound output module 1055 ) directly or wirelessly connected to the electronic device 1001 .
  • the electronic device 1002) eg, a speaker or headphones
  • the sensor module 1076 detects an operating state (eg, power or temperature) of the electronic device 1001 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the sensed state. can do.
  • the sensor module 1076 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.
  • the interface 1077 may support one or more specified protocols that may be used for the electronic device 1001 to directly or wirelessly connect with an external electronic device (eg, the electronic device 1002 ).
  • the interface 1077 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card
  • connection terminal 1078 may include a connector through which the electronic device 1001 can be physically connected to an external electronic device (eg, the electronic device 1002 ).
  • the connection terminal 1078 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 1079 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense.
  • the haptic module 1079 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 1080 may capture still images and moving images. According to an embodiment, the camera module 1080 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 1088 may manage power supplied to the electronic device 1001 .
  • the power management module 1088 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 1089 may supply power to at least one component of the electronic device 1001 .
  • the battery 1089 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.
  • the communication module 1090 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 1001 and an external electronic device (eg, the electronic device 1002, the electronic device 1004, or the server 1008). It can support establishment and communication performance through the established communication channel.
  • the communication module 1090 may include one or more communication processors that operate independently of the processor 1020 (eg, an application processor) and support direct (eg, wired) communication or wireless communication.
  • the communication module 1090 is a wireless communication module 1092 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 1094 (eg, : It may include a LAN (local area network) communication module, or a power line communication module).
  • the corresponding communication module is a first network 1098 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 1099 (eg, legacy).
  • the wireless communication module 1092 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 1096 within a communication network, such as the first network 1098 or the second network 1099 .
  • the electronic device 1001 may be identified or authenticated.
  • the wireless communication module 1092 may support a 5G network after a 4G network and a next-generation communication technology, for example, a new radio access technology (NR).
  • NR access technology includes high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency) -latency communications)).
  • eMBB enhanced mobile broadband
  • mMTC massive machine type communications
  • URLLC ultra-reliable and low-latency
  • the wireless communication module 1092 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example.
  • a high frequency band eg, mmWave band
  • the wireless communication module 1092 uses various technologies for securing performance in a high-frequency band, for example, beamforming, massive multiple-input and multiple-output (MIMO), all-dimensional multiplexing. It may support technologies such as full dimensional MIMO (FD-MIMO), an array antenna, analog beam-forming, or a large scale antenna.
  • the wireless communication module 1092 may support various requirements specified in the electronic device 1001 , an external electronic device (eg, the electronic device 1004 ), or a network system (eg, the second network 1099 ).
  • the wireless communication module 1092 includes a peak data rate (eg, 20 Gbps or more) for realizing eMBB, loss coverage (eg, 164 dB or less) for realizing mMTC, or U-plane latency for realizing URLLC ( Example: downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less).
  • a peak data rate eg, 20 Gbps or more
  • loss coverage eg, 164 dB or less
  • U-plane latency for realizing URLLC
  • the antenna module 1097 may transmit or receive a signal or power to the outside (eg, an external electronic device).
  • the antenna module 1097 may include an antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern.
  • the antenna module 1097 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 1098 or the second network 1099 is connected from the plurality of antennas by, for example, the communication module 1090 . can be selected. A signal or power may be transmitted or received between the communication module 1090 and an external electronic device through the selected at least one antenna.
  • other components eg, a radio frequency integrated circuit (RFIC)
  • RFIC radio frequency integrated circuit
  • the antenna module 1097 may form a mmWave antenna module.
  • the mmWave antenna module comprises a printed circuit board, an RFIC disposed on or adjacent to a first side (eg, bottom side) of the printed circuit board and capable of supporting a specified high frequency band (eg, mmWave band); and a plurality of antennas (eg, an array antenna) disposed on or adjacent to a second side (eg, top or side) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.
  • peripheral devices eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • GPIO general purpose input and output
  • SPI serial peripheral interface
  • MIPI mobile industry processor interface
  • a command or data may be transmitted or received between the electronic device 1001 and the external electronic device 1004 through the server 1008 connected to the second network 1099 .
  • Each of the external electronic devices 1002 and 1004 may be the same as or different from the electronic device 1001 .
  • all or a part of operations executed by the electronic device 1001 may be executed by one or more external electronic devices 1002 , 1004 , or 1008 .
  • the electronic device 1001 when the electronic device 1001 needs to perform a function or service automatically or in response to a request from a user or other device, the electronic device 1001 performs the function or service by itself instead of executing the function or service itself.
  • one or more external electronic devices may be requested to perform at least a part of the function or the service.
  • One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 1001 .
  • the electronic device 1001 may process the result as it is or additionally and provide it as at least a part of a response to the request.
  • cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used.
  • the electronic device 1001 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing.
  • the external electronic device 1004 may include an Internet of things (IoT) device.
  • IoT Internet of things
  • Server 1008 may be an intelligent server using machine learning and/or neural networks.
  • the external electronic device 1004 or the server 1008 may be included in the second network 1099 .
  • the electronic device 1001 may be applied to an intelligent service (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.
  • the electronic device may be a device of various types.
  • the electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device.
  • a portable communication device eg, a smart phone
  • a computer device e.g., a laptop, a desktop, a tablet, or a portable multimedia device
  • portable medical device e.g., a portable medical device
  • camera e.g., a camera
  • a wearable device e.g., a smart watch
  • a home appliance device e.g., a smart bracelet
  • first, second, or first or second may be used simply to distinguish the element from other elements in question, and may refer to elements in other aspects (e.g., importance or order) is not limited. It is said that one (eg, first) component is “coupled” or “connected” to another (eg, second) component, with or without the terms “functionally” or “communicatively”. When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.
  • module used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, for example, and interchangeably with terms such as logic, logic block, component, or circuit.
  • a module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • one or more instructions stored in a storage medium may be implemented as software (eg, the program 1040) including
  • a processor eg, processor 1020
  • a device eg, electronic device 1001
  • the one or more instructions may include code generated by a compiler or code executable by an interpreter.
  • the device-readable storage medium may be provided in the form of a non-transitory storage medium.
  • 'non-transitory' only means that the storage medium is a tangible device and does not include a signal (eg, electromagnetic wave), and this term is used in cases where data is semi-permanently stored in the storage medium and It does not distinguish between temporary storage cases.
  • a signal eg, electromagnetic wave
  • the methods according to various embodiments disclosed in this document may be provided by being included in a computer program product.
  • Computer program products may be traded between sellers and buyers as commodities.
  • the computer program product is distributed in the form of a machine-readable storage medium (eg compact disc read only memory (CD-ROM)), or via an application store (eg Play Store TM ) or on two user devices ( It can be distributed online (eg download or upload), directly between smartphones (eg smartphones).
  • a part of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a relay server.
  • each component eg, a module or a program of the above-described components may include a singular or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. .
  • one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added.
  • a plurality of components eg, a module or a program
  • the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. .
  • operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, omitted, or , or one or more other operations may be added.
  • the electronic device 1001 includes a first communication processor 1112 , a second communication processor 1114 , a first radio frequency integrated circuit (RFIC) 1122 , a second RFIC 1124 , and a third RFIC 1126 , a fourth RFIC 1128 , a first radio frequency front end (RFFE) 1132 , a second RFFE 1134 , a first antenna module 1142 , a second antenna module 1144 , and an antenna (1148) may be included.
  • the electronic device 1001 may further include a processor 1020 and a memory 1030 .
  • the network 1099 may include a first network 1192 and a second network 1194 .
  • the electronic device 1001 may further include at least one component among the components illustrated in FIG. 10 , and the network 1099 may further include at least one other network.
  • a first communication processor 1112 , a second communication processor 1114 , a first RFIC 1122 , a second RFIC 1124 , a fourth RFIC 1128 , a first RFFE 1132 , and the second RFFE 1134 may form at least a portion of the wireless communication module 1092 .
  • the fourth RFIC 1128 may be omitted or may be included as a part of the third RFIC 1126 .
  • the first communication processor 1112 may support establishment of a communication channel of a band to be used for wireless communication with the first network 1192 and legacy network communication through the established communication channel.
  • the first network may be a legacy network including a second generation (2G), 3G, 4G, or long term evolution (LTE) network.
  • the second communication processor 1114 establishes a communication channel corresponding to a designated band (eg, about 6 GHz to about 60 GHz) among bands to be used for wireless communication with the second network 1194, and 5G network communication through the established communication channel can support
  • the second network 1194 may be a 5G network defined by 3GPP.
  • the first communication processor 1112 or the second communication processor 1114 may correspond to another designated band (eg, about 6 GHz or less) among bands to be used for wireless communication with the second network 1194 . It is possible to support the establishment of a communication channel, and 5G network communication through the established communication channel.
  • the first communication processor 1112 and the second communication processor 1114 may be implemented in a single chip or a single package.
  • the first communication processor 1112 or the second communication processor 1114 may be formed in a single chip or a single package with the processor 1020 , the coprocessor 1023 , or the communication module 1090 . there is.
  • the first RFIC 1122 when transmitting, transmits a baseband signal generated by the first communication processor 1112 to about 700 MHz to about 3 GHz used for the first network 1192 (eg, a legacy network). can be converted to a radio frequency (RF) signal of Upon reception, an RF signal is obtained from a first network 1192 (eg, a legacy network) via an antenna (eg, a first antenna module 1142 ), and via an RFFE (eg, a first RFFE 1132 ). It may be preprocessed. The first RFIC 1122 may convert the preprocessed RF signal into a baseband signal to be processed by the first communication processor 1112 .
  • RF radio frequency
  • the second RFIC 1124 when transmitting, transmits the baseband signal generated by the first communication processor 1112 or the second communication processor 1114 to the second network 1194 (eg, a 5G network). It can be converted into an RF signal (hereinafter, 5G Sub6 RF signal) of the Sub6 band (eg, about 6 GHz or less).
  • 5G Sub6 RF signal RF signal
  • a 5G Sub6 RF signal is obtained from the second network 1194 (eg, 5G network) via an antenna (eg, second antenna module 1144), and RFFE (eg, second RFFE 1134) can be pre-processed.
  • the second RFIC 1124 may convert the preprocessed 5G Sub6 RF signal into a baseband signal to be processed by a corresponding one of the first communication processor 1112 or the second communication processor 1114 .
  • the third RFIC 1126 transmits the baseband signal generated by the second communication processor 1114 to the RF of the 5G Above6 band (eg, about 6 GHz to about 60 GHz) to be used in the second network 1194 (eg, 5G network). It can be converted into a signal (hereinafter referred to as 5G Above6 RF signal).
  • a 5G Above6 RF signal may be obtained from the second network 1194 (eg, 5G network) via an antenna (eg, antenna 1148 ) and pre-processed via a third RFFE 1136 .
  • the third RFIC 1126 may convert the preprocessed 5G Above6 RF signal into a baseband signal to be processed by the second communication processor 1114 .
  • the third RFFE 1136 may be formed as part of the third RFIC 1126 .
  • the electronic device 1001 may include the fourth RFIC 1128 separately from or as at least a part of the third RFIC 1126 .
  • the fourth RFIC 1128 converts the baseband signal generated by the second communication processor 1114 into an RF signal (hereinafter, IF signal) of an intermediate frequency band (eg, about 9 GHz to about 11 GHz). After conversion, the IF signal may be transmitted to the third RFIC 1126 .
  • the third RFIC 1126 may convert the IF signal into a 5G Above6 RF signal.
  • a 5G Above6 RF signal may be received from a second network 1194 (eg, 5G network) via an antenna (eg, antenna 1148 ) and converted to an IF signal by a third RFIC 1126 .
  • the fourth RFIC 1128 may convert the IF signal into a baseband signal for processing by the second communication processor 1114 .
  • the first RFIC 1122 and the second RFIC 1124 may be implemented as at least a part of a single chip or a single package.
  • the first RFFE 1132 and the second RFFE 1134 may be implemented as at least a part of a single chip or a single package.
  • at least one antenna module of the first antenna module 1142 or the second antenna module 1144 may be omitted or may be combined with another antenna module to process RF signals of a plurality of corresponding bands.
  • the third RFIC 1126 and the antenna 1148 may be disposed on the same substrate to form the third antenna module 1146 .
  • the wireless communication module 1092 or the processor 1020 may be disposed on the first substrate (eg, main PCB).
  • the third RFIC 1126 is located in a partial area (eg, the bottom surface) of the second substrate (eg, sub PCB) separate from the first substrate, and the antenna 1148 is located in another partial region (eg, the top surface). is disposed, the third antenna module 1146 may be formed.
  • the electronic device 1001 may improve the quality or speed of communication with the second network 1194 (eg, a 5G network).
  • the second network 1194 eg, a 5G network
  • the antenna 1148 may be formed as an antenna array including a plurality of antenna elements that can be used for beamforming.
  • the third RFIC 1126 may include, for example, as a part of the third RFFE 1136 , a plurality of phase shifters 1138 corresponding to a plurality of antenna elements.
  • each of the plurality of phase shifters 1138 may transform the phase of a 5G Above6 RF signal to be transmitted to the outside of the electronic device 1001 (eg, a base station of a 5G network) through a corresponding antenna element. .
  • each of the plurality of phase shifters 1138 may convert the phase of the 5G Above6 RF signal received from the outside through a corresponding antenna element into the same or substantially the same phase. This enables transmission or reception through beamforming between the electronic device 1001 and the outside.
  • the second network 1194 may be operated independently (eg, Stand-Alone (SA)) or connected to the first network 1192 (eg, legacy network) (eg: Non-Stand Alone (NSA)).
  • SA Stand-Alone
  • legacy network eg: Non-Stand Alone
  • the 5G network may have only an access network (eg, a 5G radio access network (RAN) or a next generation RAN (NG RAN)), and may not have a core network (eg, a next generation core (NGC)).
  • the electronic device 1001 may access an external network (eg, the Internet) under the control of a core network (eg, evolved packed core (EPC)) of the legacy network.
  • EPC evolved packed core
  • Protocol information for communication with a legacy network eg, LTE protocol information
  • protocol information for communication with a 5G network eg, New Radio (NR) protocol information
  • NR New Radio
  • FIG. 12 shows, for example, one embodiment of the structure of the third antenna module 1146 described with reference to FIG. 11 .
  • 12A is a perspective view of the third antenna module 1146 viewed from one side
  • FIG. 12B is a perspective view of the third antenna module 1146 viewed from the other side
  • 12C is a cross-sectional view taken along line A-A' of the third antenna module 1146 .
  • the third antenna module 1146 includes a printed circuit board 1210 , an antenna array 1230 , a radio frequency integrate circuit (RFIC) 1252 , and a power manage integrate circuit (PMIC). 1254 , and a module interface 1270 .
  • the third antenna module 1146 may further include a shielding member 1290 .
  • at least one of the above-mentioned components may be omitted, or at least two of the above-mentioned components may be integrally formed.
  • the printed circuit board 1210 may include a plurality of conductive layers and a plurality of non-conductive layers alternately stacked with the conductive layers.
  • the printed circuit board 1210 may provide an electrical connection between the printed circuit board 1210 and/or various electronic components disposed outside by using wires and conductive vias formed on the conductive layer.
  • the antenna array 1230 may include a plurality of antenna elements 1232 , 1234 , 1236 , or 1238 disposed to form a directional beam.
  • the antenna elements may be formed on the first surface of the printed circuit board 1210 as shown.
  • the antenna array 1230 may be formed inside the printed circuit board 1210 .
  • the antenna array 1230 may include a plurality of antenna arrays (eg, a dipole antenna array and/or a patch antenna array) of the same or different shape or type.
  • the RFIC 1252 may be disposed in another area of the printed circuit board 1210 (eg, a second side opposite to the first side) spaced apart from the antenna array. there is.
  • the RFIC is configured to process a signal of a selected frequency band, which is transmitted/received through the antenna array 1230 .
  • the RFIC 1252 may convert a baseband signal obtained from a communication processor (not shown) into an RF signal of a designated band during transmission. Upon reception, the RFIC 1252 may convert an RF signal received through the antenna array 1252 into a baseband signal and transmit it to a communication processor.
  • the RFIC 1252 at the time of transmission, an IF signal (eg, about 9 GHz to about 11 GHz) obtained from an intermediate frequency integrate circuit (IFIC) (eg, 1128 in FIG. 11 ) in a selected band can be up-converted to an RF signal of Upon reception, the RFIC 1252 may down-convert an RF signal obtained through the antenna array 1252 , convert it into an IF signal, and transmit it to the IFIC.
  • IFIC intermediate frequency integrate circuit
  • the PMIC 1254 may be disposed in another partial area (eg, the second surface) of the printed circuit board 1210 that is spaced apart from the antenna array.
  • the PMIC may receive a voltage from a main PCB (not shown) to provide power required for various components (eg, the RFIC 1252 ) on the antenna module.
  • the shielding member 1290 may be disposed on a portion (eg, the second surface) of the printed circuit board 1210 to electromagnetically shield at least one of the RFIC 1252 and the PMIC 1254 .
  • the shielding member 1290 may include a shield can.
  • the third antenna module 1146 may be electrically connected to another printed circuit board (eg, a main circuit board) through a module interface.
  • the module interface may include a connection member, for example, a coaxial cable connector, a board to board connector, an interposer, or a flexible printed circuit board (FPCB).
  • FPCB flexible printed circuit board
  • An electronic device includes a housing including at least one groove, an antenna module disposed inside the at least one groove, at least one rubber member for fixing the antenna module to the groove of the housing; It may include a wireless communication circuit disposed in the housing and electrically connected to the antenna module, and a PCB on which the wireless communication circuit is disposed.
  • the antenna module is electrically connected to the ground of the PCB through a conductive connection member
  • the conductive connection member may include at least one of a conductive adhesive film and a metal clip.
  • the antenna module may be fixed to the housing through the conductive adhesive film.
  • the electronic device may include a heat dissipation member disposed between the antenna module and the housing.
  • the heat dissipation member may include a gel type thermal interface material (TIM).
  • TIM gel type thermal interface material
  • the heat dissipation member may be connected to a heat dissipation sheet disposed on the housing.
  • the heat dissipation sheet may include at least one of a vapor chamber (VC) and a graphite sheet.
  • the conductive connection member may pass through the heat dissipation member to be connected to the ground and the antenna module.
  • the wireless communication circuit may include a communication processor (CP) and an intermediate frequency integrated circuit (IFIC).
  • CP communication processor
  • IFIC intermediate frequency integrated circuit
  • the antenna module may include a radio frequency integrated circuit (RFIC) that supplies power to the plurality of conductive patches.
  • RFIC radio frequency integrated circuit
  • the antenna module may transmit and/or receive an mmWave band signal by feeding power to the plurality of conductive patches.
  • the mmWave band may include a frequency band of 20 GHz to 300 GHz.
  • the antenna module includes a first surface facing the front surface of the electronic device, a second surface perpendicular to the first surface (facing the inside of the electronic device), and parallel to the first surface and the second surface It may include a third surface perpendicular to the second surface, and the antenna module may radiate a signal in a direction perpendicular to the first surface and the third surface and opposite to the second surface.
  • the ground of the PCB may be electrically connected to the housing, and the antenna module may be electrically connected to the housing through the conductive connecting member.
  • the at least one rubber member may be disposed between the antenna module and the housing.
  • An electronic device includes a housing including at least one groove, an antenna module disposed in the at least one groove, a fixing member disposed between the housing and the antenna module, and the antenna module disposed in the housing. and a PBA in which the wireless communication circuit is disposed and a wireless communication circuit electrically connected to the antenna module, wherein the antenna module may be electrically connected to the PBA through a conductive connecting member.
  • the fixing member may include at least one protrusion integrally formed with the housing, and the protrusion may be disposed to contact the antenna module.
  • the conductive connecting member may include at least one of a conductive adhesive film and a metal clip.
  • the electronic device may include a heat dissipation member, and the heat dissipation member may be disposed between the antenna module and the housing.
  • the heat dissipation member may include a gel type thermal interface material (TIM).
  • TIM gel type thermal interface material

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Telephone Set Structure (AREA)

Abstract

Un dispositif électronique selon divers modes de réalisation de la présente invention peut comprendre : un boîtier comprenant au moins une rainure ; un module d'antenne disposé à l'intérieur de la ou des rainures ; au moins un élément en caoutchouc pour fixer le module d'antenne dans la rainure du boîtier ; un circuit de communication sans fil agencé dans le boîtier et connecté électriquement au module d'antenne ; et une PCB ayant le circuit de communication sans fil disposé à l'intérieur.
PCT/KR2021/013436 2020-10-23 2021-09-30 Structure de fixation d'antenne et dispositif électronique la comprenant WO2022085980A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020200138404A KR20220053993A (ko) 2020-10-23 2020-10-23 안테나 고정 구조 및 이를 포함하는 전자 장치
KR10-2020-0138404 2020-10-23

Publications (1)

Publication Number Publication Date
WO2022085980A1 true WO2022085980A1 (fr) 2022-04-28

Family

ID=81290725

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2021/013436 WO2022085980A1 (fr) 2020-10-23 2021-09-30 Structure de fixation d'antenne et dispositif électronique la comprenant

Country Status (2)

Country Link
KR (1) KR20220053993A (fr)
WO (1) WO2022085980A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100138642A (ko) * 2009-06-25 2010-12-31 엘지전자 주식회사 이동 단말기
JP2015070307A (ja) * 2013-09-26 2015-04-13 株式会社東芝 電子機器
KR20200054826A (ko) * 2018-11-12 2020-05-20 삼성전자주식회사 방열 구조를 포함하는 전자 장치
KR20200099912A (ko) * 2019-02-15 2020-08-25 삼성전자주식회사 방열 시트 및 이를 포함하는 전자 장치
KR20200101172A (ko) * 2019-02-19 2020-08-27 삼성전자주식회사 안테나 구조체의 신호 방사를 지원하는 전자 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100138642A (ko) * 2009-06-25 2010-12-31 엘지전자 주식회사 이동 단말기
JP2015070307A (ja) * 2013-09-26 2015-04-13 株式会社東芝 電子機器
KR20200054826A (ko) * 2018-11-12 2020-05-20 삼성전자주식회사 방열 구조를 포함하는 전자 장치
KR20200099912A (ko) * 2019-02-15 2020-08-25 삼성전자주식회사 방열 시트 및 이를 포함하는 전자 장치
KR20200101172A (ko) * 2019-02-19 2020-08-27 삼성전자주식회사 안테나 구조체의 신호 방사를 지원하는 전자 장치

Also Published As

Publication number Publication date
KR20220053993A (ko) 2022-05-02

Similar Documents

Publication Publication Date Title
WO2020166812A1 (fr) Antenne et dispositif électronique comprenant des éléments conducteurs disposés autour d'une antenne
WO2022059964A1 (fr) Dispositif électronique comprenant une antenne à plaque et une antenne à bobine
WO2020251186A1 (fr) Antenne et dispositif électronique comprenant celle-ci
WO2022139302A1 (fr) Structure d'antenne et dispositif électronique la comprenant
WO2022154643A1 (fr) Antenne et dispositif électronique la comprenant
WO2022075639A1 (fr) Dispositif électronique comprenant une antenne
WO2022050591A1 (fr) Dispositif électronique comprenant un module d'antenne et câble coaxial
WO2022215964A1 (fr) Module d'antenne et dispositif électronique le comprenant
WO2022191535A1 (fr) Appareil électronique comprenant antenne
WO2021091264A1 (fr) Procédé de détection préhension et dispositif électronique le prenant en charge
WO2022119392A1 (fr) Appareil électronique comprenant un module d'antenne
WO2022030927A1 (fr) Antenne et dispositif électronique comprenant cette dernière
WO2022075632A1 (fr) Dispositif électronique comprenant une antenne
WO2022014880A1 (fr) Module d'antenne et dispositif électronique le comprenant
WO2021010722A1 (fr) Dispositif électronique comprenant une antenne
WO2022085980A1 (fr) Structure de fixation d'antenne et dispositif électronique la comprenant
WO2024025213A1 (fr) Dispositif électronique comprenant un ensemble de touches
WO2022145819A1 (fr) Module d'antenne et dispositif électronique le comprenant
WO2022075770A1 (fr) Dispositif d'antenne et dispositif électronique comprenant ce dernier
WO2022145780A1 (fr) Module d'antenne et dispositif électronique comprenant un module d'antenne
WO2023182706A1 (fr) Module d'antenne et dispositif électronique le comprenant
WO2024048931A1 (fr) Écran et dispositif électronique le comprenant
WO2023101243A1 (fr) Dispositif électronique comprenant un élément rayonnant
WO2023140698A1 (fr) Dispositif électronique comprenant une antenne
WO2021230467A1 (fr) Module d'antenne et dispositif électronique le comprenant

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21883052

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21883052

Country of ref document: EP

Kind code of ref document: A1