WO2023182706A1 - Module d'antenne et dispositif électronique le comprenant - Google Patents

Module d'antenne et dispositif électronique le comprenant Download PDF

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Publication number
WO2023182706A1
WO2023182706A1 PCT/KR2023/003264 KR2023003264W WO2023182706A1 WO 2023182706 A1 WO2023182706 A1 WO 2023182706A1 KR 2023003264 W KR2023003264 W KR 2023003264W WO 2023182706 A1 WO2023182706 A1 WO 2023182706A1
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WIPO (PCT)
Prior art keywords
antenna
electronic device
antenna array
module
housing
Prior art date
Application number
PCT/KR2023/003264
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English (en)
Korean (ko)
Inventor
정양균
Original Assignee
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020220069659A external-priority patent/KR20230138371A/ko
Application filed by 삼성전자 주식회사 filed Critical 삼성전자 주식회사
Publication of WO2023182706A1 publication Critical patent/WO2023182706A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings

Definitions

  • Various embodiments of the present invention relate to an antenna module and an electronic device including the antenna module.
  • Electronic devices can output stored information as sound or images.
  • a variety of functions can be installed in a single electronic device such as a mobile communication terminal.
  • entertainment functions such as games
  • multimedia functions such as music/video playback
  • communication and security functions such as mobile banking
  • functions such as schedule management and electronic wallet are integrated into one electronic device.
  • next-generation communication system such as a next-generation (e.g., 5th generation) communication system or a pre- Efforts are being made to develop next-generation communication systems.
  • next-generation communication systems are being implemented in ultra-high frequency bands (several tens of GHz bands, for example, bands above 6 GHz and below 300 GHz) such as millimeter wave (mm Wave).
  • ultra-high frequency bands severe tens of GHz bands, for example, bands above 6 GHz and below 300 GHz
  • mm Wave millimeter wave
  • the next-generation communication system uses beamforming, massive multi-input multi-output (massive MIMO), Full dimensional MIMO (FD-MIMO), antenna array, analog beam-forming, and large scale antenna technologies are being developed.
  • Transmission and/or reception of the antenna may be implemented by an external housing of the electronic device, a metal radiator inside the electronic device, or a metal trace on a printed circuit board.
  • the structure of the antenna may be an appropriate method when using wavelengths of low bandwidth or less (e.g., 6 GHz or less), but when using wavelengths of high bandwidth or more (e.g., 6 GHz or more) with strong straight propagation, it is efficient. Transmission and reception cannot be implemented.
  • an antenna structure for using wavelengths of high bandwidth or higher e.g., 6 GHz or higher
  • an antenna module and an antenna housing structure equipped with the antenna module for efficient transmission and reception and transmitting and receiving signals in a direction different from that of the external housing made of metal within an electronic device.
  • RF signal radio frequency signal
  • a housing includes a front cover, a rear cover facing in an opposite direction to the front cover, and a side member surrounding a space between the front cover and the rear cover and at least partially comprising a conductive portion.
  • An antenna assembly positioned thereon, comprising: an antenna circuit board; an antenna array disposed on one surface of the antenna circuit board and configured to transmit and/or receive signals in a first direction toward the rear cover; a wireless communication circuit electrically connected to the antenna array and configured to transmit and/or receive a radio frequency signal (RF signal); an antenna bracket including a first surface opposite to one surface of the antenna array, a second surface in contact with one end of the first surface and perpendicular to the first surface, and supporting the antenna array; and a support member in contact with the second surface of the antenna bracket and corresponding to at least a portion of the side member of the housing.
  • RF signal radio frequency signal
  • a front cover In an electronic device according to various embodiments of the present disclosure, a front cover, a rear cover facing in a direction opposite to the front cover, and a side member surrounding a space between the front cover and the rear cover and at least partially including a conductive portion.
  • a housing containing a;
  • An antenna assembly located within the space and including an antenna array configured to transmit and/or receive a signal in a first direction toward the rear cover, a first surface opposing one surface of the antenna array, and a surface of the first surface.
  • an antenna bracket that is in contact with one end, includes a second surface perpendicular to the first surface, and supports the antenna array; and a support member in contact with the second surface of the antenna bracket and corresponding to at least a portion of the side member of the housing.
  • the support member located in the side direction may include metal. Therefore, by making the housing and the support member the same material, the appearance of the electronic device can be improved. Additionally, manufacturing and assembling electronic devices can be convenient by forming the antenna assembly to be connected to the outside.
  • the electronic device has a ' ⁇ '-shaped structure in which the first portion of the housing where the side member is exposed to the outside includes an opening, but the remaining second, third, and fourth portions are closed. Because of its shape, the area of the housing surrounding the antenna assembly can be improved. Additionally, the rigidity of the housing can be secured.
  • the length of the housing side member surrounding the antenna assembly may be reduced. This affects the mounting length of the battery, and by maintaining or extending the mounting length of the battery, battery performance can be maintained and/or improved.
  • FIG. 1 is a block diagram of an electronic device in a network environment, according to various embodiments of the present disclosure.
  • FIG. 2 is a front perspective view of an electronic device, according to various embodiments of the present disclosure.
  • FIG. 3 is a rear perspective view of an electronic device, according to various embodiments of the present disclosure.
  • FIG. 4 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure.
  • 5A, 5B, 5C, and 5D illustrate an example of the structure of an electronic device according to various embodiments of the present disclosure.
  • FIG. 6A is a perspective view of the third antenna module viewed from one side
  • FIG. 6B is a perspective view of the third antenna module viewed from the other side
  • Figure 6c is a cross-sectional view taken along line B-B' of the third antenna module.
  • Figure 7A is a perspective view showing an assembled antenna assembly according to various embodiments of the present disclosure.
  • Figure 7b is a perspective view showing an assembled antenna assembly according to an embodiment of the present disclosure.
  • FIG. 8 is a front view showing an antenna assembly coupled to an electronic device 101 according to various embodiments of the present disclosure.
  • FIG. 9 is a cross-sectional view taken along line A-A' of the antenna assembly shown in FIG. 8.
  • FIG. 10 is a cross-sectional view taken along line B-B' including the FPCB lead-out portion of the antenna assembly shown in FIG. 8.
  • Figure 11 is a perspective view showing the assembly process of an antenna assembly according to various embodiments of the present disclosure.
  • Figure 12 is a perspective view showing the antenna assembly arranged in the electronic device so as to correspond to the first opening included in the side member of the housing.
  • Figure 13 is a perspective view showing an inner antenna assembly according to another embodiment of the present disclosure.
  • FIG. 14 is a perspective view showing the inner antenna assembly being disposed in an electronic device so as to correspond to the first opening included in the side member on the inside of the housing, according to another embodiment of the present disclosure.
  • FIG. 1 is a block diagram of an electronic device 101 in a network environment 100, according to various embodiments.
  • the electronic device 101 communicates with the electronic device 102 through a first network 198 (e.g., a short-range wireless communication network) or a second network 199. It is possible to communicate with at least one of the electronic device 104 or the server 108 through (e.g., a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108.
  • a first network 198 e.g., a short-range wireless communication network
  • a second network 199 e.g., a long-distance wireless communication network.
  • the electronic device 101 may communicate with the electronic device 104 through the server 108.
  • the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or may include an antenna module 197.
  • at least one of these components eg, the connection terminal 178) may be omitted or one or more other components may be added to the electronic device 101.
  • some of these components e.g., sensor module 176, camera module 180, or antenna module 197) are integrated into one component (e.g., display module 160). It can be.
  • the processor 120 for example, executes software (e.g., program 140) to operate at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and various data processing or calculations can be performed. According to one embodiment, as at least part of data processing or computation, the processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132. The commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134.
  • software e.g., program 140
  • the processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132.
  • the commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134.
  • the processor 120 is a main processor 121 (e.g., a central processing unit or an application processor), or an auxiliary processor 123 (e.g., a graphics processing unit, a neural network processing unit) that can operate independently or together with the main processor 121. (NPU; neural processing unit), image signal processor, sensor hub processor, or communication processor).
  • main processor 121 e.g., a central processing unit or an application processor
  • auxiliary processor 123 e.g., a graphics processing unit, a neural network processing unit
  • the secondary processor 123 may be set to use lower power than the main processor 121 or be specialized for a designated function. You can.
  • the auxiliary processor 123 may be implemented separately from the main processor 121 or as part of it.
  • the auxiliary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or while the main processor 121 is in an active (e.g., application execution) state. ), together with the main processor 121, at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) At least some of the functions or states related to can be controlled.
  • coprocessor 123 e.g., image signal processor or communication processor
  • may be implemented as part of another functionally related component e.g., camera module 180 or communication module 190. there is.
  • the auxiliary processor 123 may include a hardware structure specialized for processing artificial intelligence models.
  • Artificial intelligence models can be created through machine learning. For example, such learning may be performed in the electronic device 101 itself on which the artificial intelligence model is performed, or may be performed through a separate server (e.g., server 108).
  • Learning algorithms may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but It is not limited.
  • An artificial intelligence model may include multiple artificial neural network layers.
  • Artificial neural networks include deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted boltzmann machine (RBM), belief deep network (DBN), bidirectional recurrent deep neural network (BRDNN), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the examples described above.
  • artificial intelligence models may additionally or alternatively include software structures.
  • the memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101. Data may include, for example, input data or output data for software (e.g., program 140) and instructions related thereto.
  • Memory 130 may include volatile memory 132 or non-volatile memory 134.
  • the program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142, middleware 144, or application 146.
  • the input module 150 may receive commands or data to be used in a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user).
  • the input module 150 may include, for example, a microphone, mouse, keyboard, keys (eg, buttons), or digital pen (eg, stylus pen).
  • the sound output module 155 may output sound signals to the outside of the electronic device 101.
  • the sound output module 155 may include, for example, a speaker or a receiver. Speakers can be used for general purposes such as multimedia playback or recording playback.
  • the receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.
  • the display module 160 can visually provide information to the outside of the electronic device 101 (eg, a user).
  • the display module 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device.
  • the display module 160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of force generated by the touch.
  • the audio module 170 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device (e.g. : Sound can be output through the electronic device 102 (e.g., speaker or headphone).
  • an external electronic device e.g. : Sound can be output through the electronic device 102 (e.g., speaker or headphone).
  • the sensor module 176 detects the operating state (e.g., power or temperature) of the electronic device 101 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do.
  • the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.
  • the interface 177 may support one or more designated protocols that can be used to connect the electronic device 101 to an external electronic device (eg, the electronic device 102) directly or wirelessly.
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card
  • connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 can capture still images and moving images.
  • the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 can manage power supplied to the electronic device 101.
  • the power management module 188 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101.
  • the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.
  • the communication module 190 is a direct (e.g., wired) communication channel or wireless communication channel between the electronic device 101 and an external electronic device (e.g., the electronic device 102, the electronic device 104, or the server 108). can support the establishment of and communication through established communication channels.
  • Communication module 190 operates independently of processor 120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication.
  • the communication module 190 is a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., : LAN (local area network) communication module, or power line communication module) may be included.
  • a wireless communication module 192 e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module
  • GNSS global navigation satellite system
  • wired communication module 194 e.g., : LAN (local area network) communication module, or power line communication module
  • the corresponding communication module is a first network 198 (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., legacy It can communicate with external electronic devices through telecommunication networks such as cellular networks, 5G networks, next-generation communication networks, the Internet, or computer networks (e.g., LAN or WAN).
  • telecommunication networks such as cellular networks, 5G networks, next-generation communication networks, the Internet, or computer networks (e.g., LAN or WAN).
  • telecommunication networks such as cellular networks, 5G networks, next-generation communication networks, the Internet, or computer networks (e.g., LAN or WAN).
  • telecommunication networks such as cellular networks, 5G networks, next-generation communication networks, the Internet, or computer networks (e.g., LAN or WAN).
  • LAN or WAN wide area network
  • the wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 to communicate within a communication network such as the first network 198 or the second network 199.
  • subscriber information e.g., International Mobile Subscriber Identifier (IMSI)
  • IMSI International Mobile Subscriber Identifier
  • the wireless communication module 192 may support 5G networks after 4G networks and next-generation communication technologies, for example, NR access technology (new radio access technology).
  • NR access technology provides high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low latency). -latency communications)) can be supported.
  • the wireless communication module 192 may support high frequency bands (eg, mmWave bands), for example, to achieve high data rates.
  • the wireless communication module 192 uses various technologies to secure performance in high frequency bands, for example, beamforming, massive array multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. It can support technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna.
  • the wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., second network 199).
  • the wireless communication module 192 supports Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mmTC, or U-plane latency (e.g., 164 dB or less) for realizing URLLC.
  • Peak data rate e.g., 20 Gbps or more
  • loss coverage e.g., 164 dB or less
  • U-plane latency e.g., 164 dB or less
  • the antenna module 197 may transmit or receive signals or power to or from the outside (eg, an external electronic device).
  • the antenna module may include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (eg, PCB).
  • the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for the communication method used in the communication network, such as the first network 198 or the second network 199, is connected to the plurality of antennas by, for example, the communication module 190. can be selected Signals or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna.
  • other components eg, radio frequency integrated circuit (RFIC) may be additionally formed as part of the antenna module 197.
  • RFIC radio frequency integrated circuit
  • the antenna module 197 may form a mmWave antenna module.
  • a mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band); And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second side (e.g., top or side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band. can do.
  • a mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band); And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second side (e.g., top or side) of the
  • peripheral devices e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • signal e.g. commands or data
  • commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199.
  • Each of the external electronic devices 102 or 104 may be of the same or different type as the electronic device 101.
  • all or part of the operations performed in the electronic device 101 may be executed in one or more of the external electronic devices 102, 104, or 108.
  • the electronic device 101 may perform the function or service instead of executing the function or service on its own.
  • one or more external electronic devices may be requested to perform at least part of the function or service.
  • One or more external electronic devices that have received the request may execute at least part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 101.
  • the electronic device 101 may process the result as is or additionally and provide it as at least part of a response to the request.
  • cloud computing distributed computing, mobile edge computing (MEC), or client-server computing technology can be used.
  • the electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing.
  • the external electronic device 104 may include an Internet of Things (IoT) device.
  • Server 108 may be an intelligent server using machine learning and/or neural networks.
  • the external electronic device 104 or server 108 may be included in the second network 199.
  • the electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.
  • Electronic devices may be of various types.
  • Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances.
  • Electronic devices according to embodiments of this document are not limited to the above-described devices.
  • first, second, or first or second may be used simply to distinguish one element from another, and may be used to distinguish such elements in other respects, such as importance or order) is not limited.
  • One (e.g. first) component is said to be “coupled” or “connected” to another (e.g. second) component, with or without the terms “functionally” or “communicatively”.
  • any of the components can be connected to the other components directly (e.g. wired), wirelessly, or through a third component.
  • module used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as logic, logic block, component, or circuit, for example. can be used
  • a module may be an integrated part or a minimum unit of the parts or a part thereof that performs one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • Various embodiments of the present document are software (e.g., a program) that includes one or more instructions stored in a storage medium (e.g., internal memory or external memory) that can be read by a machine (e.g., an electronic device). It can be implemented as: For example, a processor (eg, processor) of a device (eg, electronic device) may call at least one instruction among one or more instructions stored from a storage medium and execute it. This allows the device to be operated to perform at least one function according to the at least one instruction called.
  • the one or more instructions may include code generated by a compiler or code that can be executed by an interpreter.
  • a storage medium that can be read by a device may be provided in the form of a non-transitory storage medium.
  • 'non-transitory' only means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves). This term refers to cases where data is stored semi-permanently in the storage medium. There is no distinction between temporary storage cases.
  • Computer program products are commodities and can be traded between sellers and buyers.
  • the computer program product may be distributed in the form of a machine-readable storage medium (e.g. compact disc read only memory (CD-ROM)) or via an application store (e.g. Play Store TM ) or on two user devices (e.g. It can be distributed (e.g. downloaded or uploaded) directly between smartphones) or online.
  • a machine-readable storage medium e.g. compact disc read only memory (CD-ROM)
  • an application store e.g. Play Store TM
  • two user devices e.g. It can be distributed (e.g. downloaded or uploaded) directly between smartphones) or online.
  • at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.
  • each component (e.g., module or program) of the above-described components may include a single or plural entity, and some of the plurality of entities may be separately disposed in other components.
  • one or more of the components or operations described above may be omitted, or one or more other components or operations may be added.
  • multiple components eg, modules or programs
  • the integrated component may perform one or more functions of each component of the plurality of components in the same or similar manner as those performed by the corresponding component of the plurality of components prior to the integration. .
  • operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or , or one or more other operations may be added.
  • Figure 2 is a front perspective view of the electronic device 101, according to various embodiments of the present disclosure.
  • 3 is a rear perspective view of the electronic device 101, according to various embodiments of the present disclosure.
  • the electronic device 101 includes a first side (or front) 310A, a second side (or back) 310B, and a first side 310A and It may include a housing 310 including a side 310C surrounding the space between the second surfaces 310B.
  • the housing may refer to a structure that forms some of the first side 310A, second side 310B, and side surface 310C of FIG. 2 .
  • the first surface 310A may be formed at least in part by a substantially transparent front plate 302 (eg, a glass plate including various coating layers, or a polymer plate).
  • the second surface 310B may be formed by a substantially opaque back plate 311.
  • the back plate 311 is formed, for example, by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of these materials. It can be.
  • the side 310C combines with the front plate 302 and the back plate 311 and may be formed by a side bezel structure (or “side member”) 318 comprising metal and/or polymer.
  • the back plate 311 and the side bezel structure 318 may be integrally formed and include the same material (eg, a metallic material such as aluminum).
  • the front plate 302 has two first regions 310D that are curved and extend seamlessly from the first surface 310A toward the rear plate 311. It can be included at both ends of the long edge of (302).
  • the rear plate 311 is curved from the second surface 310B toward the front plate 302 and has two second regions 310E extending seamlessly with long edges. It can be included at both ends.
  • the front plate 302 (or the rear plate 311) may include only one of the first areas 310D (or the second areas 310E). In another embodiment, some of the first areas 310D or the second areas 310E may not be included.
  • the side bezel structure 318 when viewed from the side of the electronic device 101, has a side bezel structure 318 that does not include the first regions 310D or the second regions 310E. It may have a first thickness (or width) and a second thickness that is thinner than the first thickness on the side surface including the first areas 310D or the second areas 310E.
  • the electronic device 101 includes a display 301, an audio module 303, 307, and 314, a sensor module 304, 316, and 319, a camera module 305, 312, and 313, and a key input. It may include at least one of the device 317, the light emitting element 306, and the connector holes 308 and 309. In some embodiments, the electronic device 101 may omit at least one of the components (eg, the key input device 317 or the light emitting device 306) or may additionally include another component.
  • the display 301 may be visually exposed, for example, through a significant portion of the front plate 302.
  • at least a portion of the display 301 may be exposed through the front plate 302 that forms the first area 310D of the first surface 310A and the side surface 310C.
  • the edges of the display 301 may be formed to be substantially the same as the adjacent outer shape of the front plate 302.
  • the distance between the outer edge of the display 301 and the outer edge of the front plate 302 may be formed to be substantially the same.
  • the surface of the housing 310 may include a screen display area formed as the display 301 is visually exposed.
  • the screen display area may include a first surface 310A and first areas 310D.
  • a recess or opening is formed in a portion of the screen display area of the display 301, and an audio module 314 and a sensor are aligned with the recess or opening. It may include at least one of a module 304, a camera module 305, and a light emitting device 306. In another embodiment (not shown), an audio module 314, a sensor module 304, a camera module 305, a fingerprint sensor 316, and a light emitting element 306 are located on the back of the screen display area of the display 301. ) may include at least one of the following.
  • the display 301 is coupled to or adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of touch, and/or a digitizer that detects a magnetic field type stylus pen. can be placed.
  • a touch detection circuit capable of measuring the intensity (pressure) of touch
  • a digitizer that detects a magnetic field type stylus pen.
  • at least a portion of the sensor modules 304, 519, and/or at least a portion of the key input device 317 are located in the first regions 310D and/or the second regions 310E. can be placed in the field.
  • the audio modules 303, 307, and 314 may include a microphone hole 303 and speaker holes 307 and 314.
  • a microphone for acquiring external sound may be placed inside the microphone hole 303, and in some embodiments, a plurality of microphones may be placed to detect the direction of sound.
  • the speaker holes 307 and 314 may include an external speaker hole 307 and a receiver hole 314 for calls.
  • the speaker holes 307 and 314 and the microphone hole 303 may be implemented as one hole, or a speaker may be included without the speaker holes 307 and 314 (e.g., piezo speaker).
  • the sensor modules 304, 316, and 319 may generate electrical signals or data values corresponding to the internal operating state of the electronic device 101 or the external environmental state.
  • Sensor modules 304, 316, 319 may include, for example, a first sensor module 304 (e.g., a proximity sensor) and/or a second sensor module (e.g., a proximity sensor) disposed on the first side 310A of the housing 310. (not shown) (e.g., fingerprint sensor), and/or a third sensor module 319 (e.g., HRM sensor) and/or fourth sensor module 316 disposed on the second side 310B of the housing 310. ) (e.g., a fingerprint sensor) may be included.
  • a first sensor module 304 e.g., a proximity sensor
  • a second sensor module e.g., a proximity sensor
  • a third sensor module 319 e.g., HRM sensor
  • fourth sensor module 316 disposed on the second side 310B of the housing
  • the fingerprint sensor may be disposed on the first side 310A (e.g., the display 301) as well as the second side 310B of the housing 310.
  • the electronic device 101 may include a sensor module, not shown, e.g. For example, at least one of a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor 304. It can be included.
  • the camera modules 305, 312, and 313 include a first camera device 305 disposed on the first side 310A of the electronic device 101, and a second camera device 305 disposed on the second side 310B. It may include a second camera device 312 and/or a flash 313.
  • the camera modules 305 and 312 may include one or more lenses, an image sensor, and/or an image signal processor.
  • the flash 313 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (an infrared camera, a wide-angle and a telephoto lens) and image sensors may be placed on one side of the electronic device 101.
  • the electronic device 101 may include a plurality of camera modules (e.g., a dual camera or a triple camera) each having different properties (e.g., angle of view) or functions.
  • a plurality of camera modules 305 and 312 including lenses with different angles of view may be configured, and the electronic device 101 may perform a camera operation in the electronic device 101 based on the user's selection.
  • the angle of view of the modules 305 and 312 can be controlled to change.
  • at least one of the plurality of camera modules 305 and 312 may be a wide-angle camera, and at least another one may be a telephoto camera.
  • the plurality of camera modules 305 and 312 may be a front camera, and at least another one may be a rear camera. Additionally, the plurality of camera modules 305 and 312 may include at least one of a wide-angle camera, a telephoto camera, or an infrared (IR) camera (eg, a time of flight (TOF) camera or a structured light camera). According to one embodiment, the IR camera may operate as at least part of the sensor module. For example, the TOF camera may operate as at least part of a sensor module (not shown) to detect the distance to the subject.
  • IR infrared
  • TOF time of flight
  • the camera module 305 and/or the sensor module are configured to be in contact with the external environment through a transparent area from the internal space of the electronic device 101 to the front plate 302 of the display 301. can be placed. Additionally, some sensor modules (not shown) may be arranged to perform their functions in the internal space of the electronic device without being visually exposed through the front plate 302.
  • the key input device 317 may be disposed on the side 310C of the housing 310.
  • the electronic device 101 may not include some or all of the key input devices 317 mentioned above and the key input devices 317 not included may be displayed on the display 301, such as soft keys. It can be implemented in different forms.
  • the key input device may include a sensor module 316 disposed on the second side 310B of the housing 310.
  • the light emitting device 306 may be disposed on, for example, the first surface 310A of the housing 310.
  • the light emitting device 306 may provide status information of the electronic device 101 in the form of light.
  • the light emitting device 306 may provide a light source that is linked to the operation of the camera module 305, for example.
  • the light emitting device 306 may include, for example, an LED, an IR LED, and a xenon lamp.
  • the connector holes 308 and 309 are a first connector hole 308 that can accommodate a connector (for example, a USB connector) for transmitting and receiving power and/or data with an external electronic device, and/or an external electronic device. and a second connector hole (eg, earphone jack) 309 that can accommodate a connector for transmitting and receiving audio signals.
  • a connector for example, a USB connector
  • a second connector hole eg, earphone jack
  • Figure 4 is an exploded perspective view of the electronic device 101 according to various embodiments of the present disclosure.
  • the electronic device 101 (e.g., the electronic device 101 of FIGS. 1 to 4) includes a side bezel structure 331, a first support member 332 (e.g., a bracket), and a front plate. (320), display 330, printed circuit board 340, battery 350, second support member 360 (e.g. rear case), antenna 370, and rear plate 380. there is.
  • the electronic device 101 may omit at least one of the components (e.g., the first support member 332 or the second support member 360) or may additionally include other components. .
  • At least one of the components of the electronic device 101 may be the same as or similar to at least one of the components of the electronic device 101 of FIGS. 1 to 3, and overlapping descriptions will be omitted below.
  • the first support member 332 may be disposed inside the electronic device 101 and connected to the side bezel structure 331, or may be formed integrally with the side bezel structure 331.
  • the first support member 332 may be formed of, for example, a metallic material and/or a non-metallic (eg, polymer) material.
  • the first support member 332 may have a display 330 coupled to one side and a printed circuit board 340 to the other side.
  • the printed circuit board 340 may be equipped with a processor, memory, and/or interface.
  • the processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.
  • the printed circuit board 340 may include a flexible printed circuit board type radio frequency cable (FRC).
  • FRC radio frequency cable
  • the printed circuit board 340 may be disposed on at least a portion of the first support member 332, and may be connected to an antenna module (e.g., the antenna module 197 of FIG. 1) and a communication module (e.g., the antenna module 197 of FIG. 1). It may be electrically connected to the communication module 190).
  • FRC flexible printed circuit board type radio frequency cable
  • the memory may include, for example, volatile memory or non-volatile memory.
  • the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • the interface may electrically or physically connect the electronic device 101 to an external electronic device and may include a USB connector, SD card/MMC connector, or audio connector.
  • the battery 350 is a device for supplying power to at least one component of the electronic device 101, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or fuel. It may include a battery. At least a portion of the battery 350 may be disposed, for example, on substantially the same plane as the printed circuit board 340 . The battery 350 may be placed integrally within the electronic device 101, or may be placed to be detachable from the electronic device 101.
  • the second support member 360 (eg, rear case) may be disposed between the printed circuit board 340 and the antenna 370.
  • the second support member 360 may include one surface to which at least one of the printed circuit board 340 or the battery 350 is coupled, and the other surface to which the antenna 370 is coupled.
  • the antenna 370 may be disposed between the rear plate 380 and the battery 350.
  • the antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna.
  • NFC near field communication
  • MST magnetic secure transmission
  • the antenna 370 may perform short-distance communication with an external device or wirelessly transmit and receive power required for charging.
  • an antenna structure may be formed by part or a combination of the side bezel structure 331 and/or the first support member 332.
  • an electronic device may include a plurality of antenna modules 390.
  • some of the plurality of antenna modules 390 may be implemented to transmit and receive radio waves with different characteristics (tentatively referred to as radio waves in A and B frequency bands) to implement MIMO.
  • some of the plurality of antenna modules 390 simultaneously transmit and receive radio waves with the same characteristics (tentatively referred to as radio waves of A1 and A2 frequencies in the A frequency band) to implement diversity. It can be set to do so.
  • some of the plurality of antenna modules 390 are configured to simultaneously transmit and receive radio waves with the same characteristics (tentatively referred to as radio waves of B1 and B2 frequencies in the B frequency band) to implement diversity. can be set.
  • it may include two antenna modules, but in another embodiment of the present invention, the electronic device 101 may include four antenna modules to simultaneously implement MIMO and diversity. .
  • the electronic device 101 may include only one antenna module 390.
  • the other antenna module in consideration of the transmission and reception characteristics of radio waves, when one antenna module is disposed at the first position of the printed circuit board 340, the other antenna module is positioned at the first position of the printed circuit board 340. It may be placed in a second location separated from the location. As another example, one antenna module and another antenna module may be arranged considering the mutual separation distance according to diversity characteristics.
  • At least one antenna module 390 may include a wireless communication circuit that processes radio waves transmitted and received in an ultra-high frequency band (e.g., 6 GHz or higher, 300 GHz or lower).
  • the conductive plate of the at least one antenna module 390 may be, for example, made of a patch-type radiation conductor or a conductive plate of a dipole structure extending in one direction, and a plurality of the conductive plates are arrayed to form an antenna array. can do.
  • a chip e.g., integrated circuit chip
  • a chip on which part of the wireless communication circuit is implemented may be placed on one side of the area where the conductive plate is placed or on a side facing in the opposite direction to the side where the conductive plate is placed, and may be a printed circuit. It can be electrically connected to the conductive plate through a patterned wiring.
  • the electronic device 101 disclosed in this document has a bar-type or plate-type appearance, but the present invention is not limited thereto.
  • the illustrated electronic device 101 may be a rollable electronic device or a foldable electronic device.
  • a rollable electronic device or a foldable electronic device can be used by expanding the screen display area by unfolding the display or exposing a larger area of the display to the outside.
  • the electronic device 101 according to various embodiments disclosed in this document may be interpreted to include not only portable electronic devices such as smart phones, but also various other electronic devices such as laptop computers and cameras. .
  • 5A-5D illustrate one embodiment of the structure of the electronic device 101 shown in FIG. 4, according to various embodiments of the present disclosure.
  • the electronic device 101 includes a first plate 520 (e.g., a front plate), a second plate (e.g., a front plate), and a second plate (e.g., a front plate) spaced apart from the first plate 520 and facing in the opposite direction.
  • a first plate 520 e.g., a front plate
  • a second plate e.g., a front plate
  • a second plate e.g., a front plate spaced apart from the first plate 520 and facing in the opposite direction.
  • 530 e.g., a rear plate or rear glass
  • a housing 310 including a side member 540 surrounding the space between the first plate 520 and the second plate 530.
  • the first plate 520 may include a transparent material including a glass plate.
  • the second plate 530 may include non-conductive and/or conductive materials.
  • the side member 540 may include a conductive material and/or a non-conductive material. In some embodiments, at least a portion of the side member 540 may be formed integrally with the second plate 530.
  • the side member 540 may include first to third insulating portions 541, 543, and 545 and first to third conductive portions 551, 553, and 555. .
  • the electronic device 101 includes a display, a main printed circuit board (PCB) 571, and/or an intermediate plate ( mid-plate (not shown), and may optionally further include various other parts.
  • PCB printed circuit board
  • the electronic device 101 includes a first legacy antenna 551, a second legacy antenna 553, and a third legacy antenna 555 in the space and/or the housing 310. It may be included in a part of (for example, the side member 540).
  • the first to third legacy antennas 551 to 555 are, for example, cellular communication (e.g., second generation (2G), 3G, 4G, or LTE), short-range communication (e.g., WiFi, Bluetooth, or NFC) ), and/or GNSS (global navigation satellite system).
  • 2G second generation
  • 3G, 4G, or LTE long-range communication
  • short-range communication e.g., WiFi, Bluetooth, or NFC
  • GNSS global navigation satellite system
  • the electronic device 101 includes a first antenna module 561, a second antenna module 563, and a third antenna module 565 for forming a directional beam. can do.
  • the antenna modules 561, 563, and 565 may be used for 5G network (e.g., second cellular network 494 in FIG. 5) communication, mmWave communication, 60 GHz communication, or WiGig communication.
  • the antenna modules 561 to 565 are metal members (e.g., housing 310, internal components 573, and/or first to third legacy antennas 551 to 555) of the electronic device 101. ) can be arranged in the space to be spaced apart from a certain distance or more.
  • the first antenna module 561 is located at the top left (-Y axis)
  • the second antenna module 563 is located at the middle of the top (X side)
  • the third antenna module 565 is located at the right. (Y axis) It can be located in the middle.
  • the electronic device 101 includes additional antenna modules at additional locations (e.g., in the middle of the bottom (-X axis)) or some of the first to third antenna modules 561 to 565 are It may be omitted.
  • the first to third antenna modules 561 to 565 are connected to at least one communication processor on the main PCB 571 using a conductive line 581 (e.g., a coaxial cable or FPCB) Example: It may be electrically connected to the processor 120 of FIG. 5.
  • a conductive line 581 e.g., a coaxial cable or FPCB
  • FIG. 5B showing a cross section based on the A-A' axis of FIG. 5A
  • a portion of the antenna array (e.g., patch antenna array) of the first antenna module 561 radiates in the direction of the second plate 530.
  • another part eg., dipole antenna array
  • FIG. 5C which shows a cross section based on the B-B' axis of FIG. 5A
  • a portion of the radiator (e.g., patch antenna array) of the second antenna module 563 radiates in the direction of the second plate 530.
  • another part eg, dipole antenna array
  • the second antenna module 563 may include a plurality of printed circuit boards.
  • part of an antenna array eg, a patch antenna array
  • another part eg, a dipole antenna array
  • the printed circuit boards may be connected through a flexible printed circuit board.
  • the flexible printed circuit board may be placed around the electrical object 573 (e.g., receiver, speaker, sensor, camera, ear jack, or button).
  • the third antenna module 565 may be disposed toward the side member 540 of the housing 310.
  • a part of the antenna array of the third antenna module 565 e.g., dipole antenna array
  • another part e.g., patch antenna array
  • It can be arranged to radiate through.
  • FIGS. 6A to 6C are diagrams illustrating an example of the structure of the third antenna module 565 described with reference to FIG. 5A according to various embodiments of the present disclosure.
  • FIG. 6A is a perspective view of the third antenna module 565 viewed from one side
  • FIG. 6B is a perspective view of the third antenna module 565 viewed from the other side
  • FIG. 6C is a cross-sectional view taken along line B-B' of the third antenna module 565 shown in FIG. 6A.
  • the third antenna module 565 includes a printed circuit board 510, an antenna array 550, a radio frequency integrate circuit (RFIC) 552, and a power MIC (PMIC). may include manage integrate circuit) (554).
  • the third antenna module 565 may further include a shielding member 590.
  • at least one of the above-mentioned parts may be omitted, or at least two of the above parts may be formed integrally.
  • the printed circuit board 510 may include a plurality of conductive layers and a plurality of non-conductive layers alternately stacked with the conductive layers.
  • the printed circuit board 510 may provide electrical connections between the printed circuit board 510 and/or various electronic components disposed externally using wires and conductive vias formed on the conductive layer.
  • the antenna array 550 (e.g., the third antenna module 565 in Figure 5D) includes a plurality of antennas 532, 534, 536, or 538 arranged to form a directional beam. may include.
  • the plurality of antennas may be formed on the first surface of the printed circuit board 510 as shown.
  • the antenna array 530 may be formed inside the printed circuit board 510.
  • the antenna array 530 may include a plurality of antenna arrays (eg, a dipole antenna array and/or a patch antenna array) of the same or different shapes or types.
  • the RFIC 552 may be placed in another area of the printed circuit board 510 (e.g., a second side opposite the first side), spaced apart from the antenna array 550. .
  • the RFIC is configured to process signals in a selected frequency band that are transmitted/received through the antenna array 550.
  • the RFIC 552 may convert a baseband signal obtained from a communication processor (not shown) into an RF signal in a designated band during transmission.
  • the RFIC 552 may convert the RF signal received through the antenna array 550 into a baseband signal and transmit it to the communication processor.
  • the RFIC 552 may up-convert an IF signal (e.g., about 9 GHz to about 15 GHz) obtained from an intermediate frequency integrate circuit (IFIC) into an RF signal of a selected band during transmission.
  • IFIC intermediate frequency integrate circuit
  • the RFIC 552 may down-convert the RF signal acquired through the antenna array 550, convert it into an IF signal, and transmit it to the IFIC.
  • the PMIC 554 may be disposed in another area (eg, the second surface) of the printed circuit board 510, spaced apart from the antenna array 550.
  • the PMIC can receive voltage from the main PCB (not shown) and provide the necessary power to various components (e.g., RFIC 552) on the antenna module.
  • the shielding member 590 is attached to a portion (e.g., the second side) of the printed circuit board 510 to electromagnetically shield at least one of the RFIC 552 or the PMIC 554. can be placed.
  • the shielding member 590 may include a shield can.
  • the third antenna module 565 may be electrically connected to another printed circuit board (eg, a main circuit board) through a module interface.
  • the module interface may include a connection member, for example, a coaxial cable connector, a board to board connector, an interposer, or a flexible printed circuit board (FPCB).
  • FPCB flexible printed circuit board
  • FIG. 7A is a perspective view illustrating an antenna assembly 700 according to various embodiments of the present disclosure.
  • Figure 7b is a perspective view showing the antenna assembly 700 according to an embodiment of the present disclosure.
  • FIG. 8 is a front view showing the antenna assembly 700 coupled to the electronic device 101 according to various embodiments of the present disclosure.
  • FIG. 9 is a cross-sectional view taken along line A-A' of the antenna assembly 700 shown in FIG. 8.
  • FIG. 10 is a cross-sectional view taken along B-B' including the FPCB lead-out portion of the antenna assembly 700 shown in FIG. 8.
  • the electronic device 101 may include a housing 600 and an antenna assembly 700 located in an internal space of the housing 600.
  • the antenna assembly 700 includes an antenna circuit board 701, an antenna array 710 disposed on one side of the antenna circuit board 701, and is electrically connected to the antenna array 710 and configured to transmit and/or receive an RF signal. It may include a wireless communication circuit 702, an antenna bracket 720 supporting the antenna array 710, and a support member 730 corresponding to at least a portion of the housing 600.
  • the configuration of the housing 600 and the antenna assembly 700 of FIGS. 7A to 10 may be partially or entirely the same as the configuration of the housing 310 of FIGS. 2 to 4, and the third antenna module of FIG. 6A Part or all of the composition may be the same as (565).
  • 'X' in the two-axis orthogonal coordinate system may refer to the longitudinal direction of the electronic device 101, and 'Z' may refer to the thickness direction of the electronic device 101. Additionally, in one embodiment of the present invention, 'Z' may mean the first direction (+Z) and the second direction (-Z). Additionally, in one embodiment of the present invention, 'X' may mean the third direction (+X) and the fourth direction (-X).
  • the housing 600 includes a front cover, a rear cover facing in an opposite direction from the front cover, and a side member 630 that surrounds a space between the front cover and the rear cover and includes at least partially a conductive portion. ) may include.
  • the front cover of housing 600 includes at least a portion of a substantially transparent front plate (e.g., front plate 302 of FIG. 2) (e.g., a glass plate or polymer plate including various coating layers). It can be formed by .
  • the back cover may be formed by a substantially opaque back plate (eg, back plate 311 in FIG. 2).
  • the back plate may be formed, for example, by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of these materials.
  • the side member 630 is combined with the front plate and the rear plate and may be formed by a side bezel structure (eg, side bezel structure 318 in FIG. 2) including metal and/or polymer.
  • the back plate and side bezel structures may be integrally formed and include the same material (eg, a metallic material such as aluminum).
  • the antenna array 710 of the antenna assembly 700 may include a plurality of antennas 711, 712, and 713 arranged to form a directional beam.
  • the antenna array 710 may be arranged so that a plurality of antennas 711, 712, and 713 can transmit and/or receive signals in the direction of the rear cover of the housing 600 (first direction (Z+)).
  • the antenna array 710 has a plurality of antennas 711, 712, and 713 to transmit and/or receive signals in the front cover direction (second direction (Z-)) of the housing 600. It can be arranged so that
  • the plurality of antennas 711, 712, and 713 include a first antenna 711 including a first conductive element, a second antenna 712 including a second conductive element, and a third conductive element. It may include a third antenna 713 including an element.
  • the length of the plurality of antennas 711, 712, and 713 in the thickness direction (Z-axis direction) may be the same.
  • the lengths of the plurality of antennas 711, 712, and 713 in the thickness direction (Z-axis direction) may be different from each other.
  • the first antenna may be formed with a first thickness d1
  • the second antenna may be formed with a second thickness d2
  • the third antenna may be formed with a third thickness (not shown).
  • the first thickness d1 and the second thickness d2 may be different.
  • the second thickness d2 and the third thickness (not shown) may be different.
  • the third thickness (not shown) and the first thickness (d1) may be different.
  • the thickness of the plurality of antennas 711, 712, and 713 is not limited to the above embodiment, and may be designed in various ways depending on the size or arrangement relationship of surrounding structures.
  • the separation distance of the plurality of antennas 711, 712, and 713 may be the same.
  • the separation distance between the first antenna 711 and the second antenna 712 and the separation distance between the second antenna 712 and the third antenna 713 may be the same.
  • the separation distance between the plurality of antennas 711, 712, and 713 is not limited to the above embodiment, and the separation distance between the plurality of antennas 711, 712, and 713 may be different from each other.
  • the design can be changed in various ways depending on the size or arrangement relationship of surrounding structures.
  • the antenna bracket 720 of the antenna assembly 700 may be formed to surround at least a portion of the antenna circuit board 701, the antenna array 710, and/or the wireless communication circuit 702. .
  • the antenna bracket 720 may serve as a bracket in which the antenna circuit board 701, the antenna array 710, and/or the wireless communication circuit 702 can be accommodated.
  • the antenna bracket 720 facilitates the antenna circuit board 701, antenna array 710, and/or wireless communication circuit 702 accommodated within the antenna bracket 720 into the internal space of the housing 600. It can be moved.
  • the antenna bracket 720 has a first surface 721 opposite to one surface of the antenna array 710, a first surface 721 in contact with one end of the first surface 721, and a second surface perpendicular to the first surface 721. It may include a second surface 722 and a third surface 723 that is in contact with the other end of the first surface 721 and is perpendicular to the first surface 721.
  • the antenna array 710 may be disposed on the first side 721 of the antenna bracket 720.
  • the antenna bracket 720 supports and protects the antenna array 710 from external stimuli and may serve to fix the antenna array 710.
  • the support member 730 of the antenna assembly 700 is in contact with the second surface 722 or the third surface 723 of the antenna bracket 720, and the side member 630 of the housing 600 It may be formed to correspond to at least part of .
  • one side exposed to the outside of the side member 630 of the housing 600 may correspond to one side exposed to the outside of the support member 730.
  • the support member 730 located in the fourth direction (-X) which is the radiation direction is smooth. It may consist of a non-conductive part for radiation.
  • the support member 730 since the radiation direction of the plurality of antennas 711, 712, and 713 is toward the rear (first direction (+Z)), the support member 730 may include a conductive portion. there is.
  • the support member 730 includes a conductive portion, the material is the same as the side member 630 made of a conductive material, so external differences in aesthetics depending on the material may not occur.
  • the antenna assembly 700 can be formed to be connected to the outside, making manufacturing and assembling electronic devices convenient.
  • the antenna circuit board 701, antenna array 710, wireless communication circuit 702, antenna bracket 720, and support member 730 of the antenna assembly 700 are not spaced apart, Can be formed continuously.
  • it may be tray-shaped.
  • the side member 630 of the housing 600 is disposed adjacent to the first part 631 and the rear cover 620 with at least one side exposed to the outside, and has a third part in the first part 631.
  • a second part 632 extending in the direction (X+), a third part 633 extending from the second part 632 in the second direction (Z-), and a fourth direction from the third part 633 ( It extends to X-) and may include a fourth part 634 in contact with the first part 631.
  • the first portion 631 may include a first opening 6311 (eg, the first opening 6311 in FIG. 12).
  • the antenna assembly 700 can be inserted in the third direction (X+) through the first opening 6311.
  • the second portion 632 may be formed as a closed structure and may not include an opening.
  • the side member 630 of the housing 600 has a first opening 6311 formed in the first part 631, and a second part 632, a third part 633, and a fourth part ( 634) may be formed integrally.
  • the side member 630 of the housing 600 may have a ' ⁇ ' shape.
  • at least one of the second part 632, the third part 633, and the fourth part 634 may include at least one hole for electrical coupling with other components.
  • the antenna module and a support member including one surface facing the side direction are separated, and the side member of the housing may be formed between the antenna module and the support member. Additionally, an opening may be formed in the second part of the housing for assembly of the antenna module. Accordingly, the overall area of the housing side member may be small and rigidity may be weak.
  • the antenna assembly 700 including the support member 730 is formed as one assembly, the area occupied by the antenna assembly 700 may be small.
  • the second part 632 of the housing side member 630 is formed in a closed structure, and the second part 632, third part 633, and fourth part 634 are formed integrally to form an antenna assembly ( The area of the side member 630 surrounding 700 can be improved.
  • the rigidity of the housing 600 can be secured.
  • the rigidity of the housing 600 of the present invention can be improved by approximately 10 to 15%.
  • the rigidity of the housing 600 of the present invention can be improved by approximately 13%.
  • the total length in the longitudinal direction (X-axis direction) of the side members 630 of the housing 600 surrounding the antenna assembly 700 may be reduced.
  • the length of one surface for transmitting and receiving signals of the antenna array 710 e.g., the length in the axial length
  • the length of one side for transmitting and receiving signals of the antenna array 710 e.g., the length in the direction length
  • the length of one surface for transmitting and receiving signals of the antenna array 710 (e.g., the length in the +Z)), the length occupied by the antenna array 710 in the longitudinal direction may increase.
  • the longitudinal direction (e.g., : The length in the X-axis direction of FIG. 9 may be reduced. This may affect the mounting length of the battery located on the side of the antenna assembly 700, and the mounting length of the battery may be maintained or extended, thereby maintaining and/or improving battery performance.
  • the electronic device 101 may further include an attachment member 800.
  • Attachment member 800 may be disposed on second portion 632 of side member 630 of housing 600.
  • the attachment member 800 may be attached between the second portion 632 of the side member 630 of the housing 600 and the rear cover 620 of the housing 600.
  • the second part 632 of the present invention is formed in a closed structure, so that the attachment area of the attachment member 800 can be increased.
  • the length of the attachment member 800 in the longitudinal direction eg, the X-axis direction in FIG. 9) may increase. Therefore, the adhesion between the housings 600 can be strengthened.
  • the electronic device 101 may further include a first waterproof member 810.
  • the first waterproof member 810 may be disposed on the second portion 632 of the side member 630 of the housing 600.
  • the first waterproof member 810 may be attached between the second portion 632 of the side member 630 of the housing 600 and the rear cover 620 of the housing 600.
  • the second part 632 of the present invention is formed in a closed structure, so that the attachment area of the first waterproof member 810 can be increased.
  • the length of the first waterproof member 810 in the longitudinal direction eg, the X-axis direction in FIG. 9) may increase. Therefore, the waterproof performance of electronic devices can be improved.
  • a second waterproof member 820 may be further included on at least one surface in contact with the member 630 and/or the antenna bracket 720.
  • the second waterproof member 820 may be a tape that surrounds the outside of the support member 730 for the purpose of preventing flooding and fixing the position of the support member 730.
  • FIG. 11 is a perspective view showing the assembly process of the antenna assembly 700 according to various embodiments of the present disclosure.
  • FIG. 12 is a perspective view showing the antenna assembly 700 disposed in an electronic device so that it corresponds to the first opening 6311 included in the side member 630 of the housing 600.
  • the electronic device 101 may include a housing 600 and an antenna assembly 700 located in an internal space of the housing 600.
  • the antenna assembly 700 includes an antenna circuit board 701, an antenna array 710 disposed on one side of the antenna circuit board 701, and is electrically connected to the antenna array 710 and configured to transmit and/or receive an RF signal. It may include a wireless communication circuit 702, an antenna bracket 720 supporting the antenna array 710, and a support member 730 corresponding to at least a portion of the housing 600.
  • the configuration of the housing 600 and the antenna assembly 700 of FIGS. 11 and 12 may be partially or entirely the same as the configuration of the housing 310 of FIGS. 2 and 4, and the antenna of FIGS. 7A to 10 Some or all of the configuration of the assembly 700 may be the same.
  • 'X' may refer to the longitudinal direction of the electronic device 101
  • 'Y' may refer to the width direction of the electronic device 101
  • 'Z' may refer to the thickness direction of the electronic device 101.
  • 'Z' may mean the first direction (+Z) and the second direction (-Z).
  • 'X' may mean the third direction (+X) and the fourth direction (-X).
  • 'Y' may mean the fifth direction (+Y) and the sixth direction (-Y).
  • the support member 730 may include a plurality of protrusions 731 protruding in the third direction (+X) on one surface that is not exposed to the outside and faces the third direction (+X). .
  • it may include three protrusions 731 spaced apart at a predetermined interval.
  • the second surface 722 of the antenna bracket 720 that contacts the support member 730 may include a plurality of holes 724.
  • the plurality of holes 724 may correspond to the plurality of protrusions 731. Accordingly, the support member 730 and the antenna bracket 720 can be assembled by assembling the plurality of protrusions 731 of the support member 730 and the plurality of holes 724 of the antenna bracket 720 to correspond.
  • the support member 730 and the antenna bracket 720 of the antenna assembly 700 can be assembled without screws. Therefore, the number of parts used can be reduced.
  • the wireless communication circuit 702 disposed on one side facing the direction (-Z) may be formed as one assembly.
  • the module interface 703 may be placed on one side of the antenna circuit board 701 facing the first direction (+Z).
  • the antenna circuit board 701 may be electrically connected to another printed circuit board (eg, main circuit board) through the module interface 703.
  • the module interface 703 may include a connection member, for example, a coaxial cable connector, a board to board connector, an interposer, or a flexible printed circuit board (FPCB). Through the connection member, the RFIC 552 and/or PMIC 554 of the antenna module may be electrically connected to the printed circuit board.
  • an antenna circuit board 701, an antenna array 710, a wireless communication circuit 702, and a module interface 703 assembly may be disposed on the first side 721 of the antenna bracket 720. You can.
  • the antenna assembly 700 may be assembled to the electronic device 101 through the first opening 6311 formed in the first portion 631 of the housing side member 630.
  • FIG. 13 is a perspective view showing an inner antenna assembly 700b according to another embodiment of the present disclosure.
  • FIG. 14 shows the inner antenna assembly 700b being disposed in an electronic device so as to correspond to the first opening 6311 included in the side member 630 on the inside of the housing 600, according to another embodiment of the present disclosure. This is a perspective view shown.
  • the electronic device 101 may include a housing 600 and an inner antenna assembly 700b located in an inner space of the housing 600.
  • the inner antenna assembly 700b is electrically connected to an antenna circuit board (not shown), an antenna array 710 disposed on one side of the antenna circuit board (not shown), and the antenna array 710, and transmits and/or transmits an RF signal. It may include a wireless communication circuit (not shown) configured to receive, and an inner antenna bracket 740 supporting the antenna array 710.
  • the configuration of the housing 600, the inner antenna assembly 700b, the antenna circuit board (not shown), the antenna array 710, the wireless communication circuit (not shown), and the inner antenna bracket 740 in FIGS. 13 and 14 are shown in FIG.
  • the configuration of the housing 310 of FIGS. 2 to 4 may be partially or entirely the same, and the antenna assembly 700, antenna circuit board 701, antenna array 710, and wireless communication circuit of FIGS. 7A to 10 may be the same. (702), some or all of the configuration may be the same as that of the antenna bracket (720).
  • 'X' may refer to the longitudinal direction of the electronic device 101
  • 'Y' may refer to the width direction of the electronic device 101
  • 'Z' may refer to the thickness direction of the electronic device 101.
  • 'Z' may mean the first direction (+Z) and the second direction (-Z).
  • 'X' may mean the third direction (+X) and the fourth direction (-X).
  • 'Y' may mean the fifth direction (+Y) and the sixth direction (-Y).
  • the inner antenna bracket 740 of the inner antenna assembly 700b is configured to surround at least a portion of the antenna circuit board (not shown), antenna array 710, and/or wireless communication circuitry (not shown). can be formed.
  • the inner antenna bracket 740 may serve as a bracket that can accommodate an antenna circuit board (not shown), an antenna array 710, and/or a wireless communication circuit (not shown).
  • the inner antenna bracket 740 stores an antenna circuit board (not shown), an antenna array 710, and/or a wireless communication circuit (not shown) accommodated within the inner antenna bracket 740 inside the housing 600. It can be easily moved into space.
  • the inner antenna bracket 740 has a first surface 741 opposite to one surface of the antenna array 710, is in contact with one end of the first surface 741, and is perpendicular to the first surface 741. It may include a second surface 742 and a third surface 743 that is in contact with the other end of the first surface 741 and is perpendicular to the first surface 741.
  • the antenna array 710 may be disposed on the first surface 741 of the inner antenna bracket 740.
  • the inner antenna bracket 740 supports and protects the antenna array 710 from external stimuli and may serve to fix the antenna array 710.
  • the inner antenna assembly 700b when assembling the inner antenna bracket 740 to the housing 600 of the electronic device 101, the inner antenna assembly 700b is connected to the first opening 6311. Can be inserted in 4 directions (-X). For example, when assembling the inner antenna bracket 740 to the housing 600 of the electronic device 101, the inner antenna assembly 700b can be inserted into the first opening 6311 from the inside of the housing 600. there is.
  • a front cover 610, a rear cover 620 facing in the opposite direction to the front cover 610, and the front cover 610 and the rear cover (a housing 600 surrounding the space between 620 and including a side member 630 that at least partially includes a conductive portion; It includes an antenna assembly 700 located within the space, wherein the antenna assembly 700 includes: an antenna circuit board 701; an antenna array 710 disposed on one surface of the antenna circuit board 701 and configured to transmit and/or receive signals in a first direction toward the rear cover 620; a wireless communication circuit 702 electrically connected to the antenna array 710 and configured to transmit and/or receive a radio frequency signal (RF signal); It includes a first surface 721 facing one surface of the antenna array 710, and a second surface 722 that is in contact with one end of the first surface 721 and is perpendicular to the first surface 721. , an antenna bracket 720 supporting the antenna array 710; and a support member 730 that contacts the second surface 722
  • the support member 730 may include a conductive portion corresponding to the side member 630.
  • the side member 630 includes a first portion 631 with at least one surface exposed to the outside and a first opening 6311 formed therein; a second part 632 disposed adjacent to the rear cover 620 and extending from the first part 631 in a third direction perpendicular to the first direction; a third part 633 extending from the second part 632 in a second direction opposite to the first direction; and a fourth part 634 extending from the third part 633 in a fourth direction opposite to the third direction and in contact with the first part 631.
  • the support member 730 may include a plurality of protrusions
  • the antenna bracket 720 may include a plurality of holes 724 corresponding to the plurality of protrusions.
  • the first part 631, the second part 632, the third part 633, and the fourth part 634 of the side member 630 are integrally formed.
  • Electronic device (101) According to various embodiments, the side member 630 may have a ' ⁇ ' shape.
  • it may further include an attachment member located between the second portion 632 of the side member 630 and the rear cover 620.
  • it may further include a waterproof member located between the second portion 632 of the side member 630 and the rear cover 620.
  • the antenna array 710 includes a first antenna including a first conductive element and having a first thickness; and a second antenna including a second conductive element and having a second thickness, wherein the first thickness and the second thickness may be different.
  • the antenna bracket 720 may further include a third surface 723 that is in contact with the other end of the first surface 721 and is perpendicular to the first surface 721.
  • the plurality of antennas may transmit and/or receive signals having a designated frequency band ranging from 6 GHz to 300 GHz.
  • An antenna assembly 700 located within a housing 600 includes: an antenna circuit board 701; an antenna array 710 disposed on one surface of the antenna circuit board 701 and configured to transmit and/or receive signals in a first direction toward the rear cover 620; a wireless communication circuit 702 electrically connected to the antenna array 710 and configured to transmit and/or receive a radio frequency signal (RF signal); It includes a first surface 721 facing one surface of the antenna array 710, and a second surface 722 that is in contact with one end of the first surface 721 and is perpendicular to the first surface 721. , an antenna bracket 720 supporting the antenna array 710; and a support member 730 that contacts the second surface 722 of the antenna bracket 720 and corresponds to at least a portion of the side member 630 of the housing 600.
  • RF signal radio frequency signal
  • the support member 730 may include a conductive portion corresponding to the side member 630.
  • the antenna array 710 includes a first antenna including a first conductive element and having a first thickness; and a second antenna including a second conductive element and having a second thickness, wherein the first thickness and the second thickness may be different.
  • the antenna bracket 720 may further include a third surface 723 that is in contact with the other end of the first surface 721 and is perpendicular to the first surface 721.
  • the antenna array 710 may transmit and/or receive signals having a designated frequency band ranging from 6 GHz to 300 GHz.
  • a front cover 610, a rear cover 620 facing in the opposite direction to the front cover 610, and the front cover 610 and the rear cover ( a housing 600 surrounding the space between 620 and including a side member 630 that at least partially includes a conductive portion;
  • An antenna assembly 700 located in the space and including an antenna array 710 configured to transmit and/or receive a signal in a first direction toward the rear cover 620, wherein one surface of the antenna array 710 and It includes an opposing first surface 721 and a second surface 722 that is in contact with one end of the first surface 721 and is perpendicular to the first surface 721, and supports the antenna array 710.
  • antenna bracket (720) and a support member 730 that contacts the second surface 722 of the antenna bracket 720 and corresponds to at least a portion of the side member 630 of the housing 600.
  • the side member 630 includes a first portion 631 with at least one surface exposed to the outside and a first opening 6311 formed therein; a second part 632 disposed adjacent to the rear cover 620 and extending from the first part 631 in a third direction perpendicular to the first direction; a third part 633 extending from the second part 632 in a second direction opposite to the first direction; and a fourth part 634 extending from the third part 633 in a fourth direction opposite to the third direction and in contact with the first part 631.
  • the support member 730 may include a plurality of protrusions
  • the antenna bracket 720 may include a plurality of holes 724 corresponding to the plurality of protrusions.
  • the first part 631, the second part 632, the third part 633, and the fourth part 634 of the side member 630 may be integrally formed. You can.
  • the antenna assembly 700 and the electronic device 101 including the same of various embodiments of the present disclosure described above are not limited to the above-described embodiments and drawings, and various substitutions, modifications, and modifications may be made within the technical scope of the present disclosure. It will be clear to those skilled in the art that changes are possible.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Telephone Set Structure (AREA)

Abstract

Divers modes de réalisation de la présente invention concernent une antenne et un dispositif électronique le comprenant. Le dispositif électronique comprend : un boîtier comprenant un couvercle avant, un couvercle arrière faisant face dans la direction opposée au couvercle avant, et un élément latéral entourant l'espace entre le couvercle avant et le couvercle arrière et comprenant une partie au moins partiellement conductrice ; et un ensemble antenne positionné dans l'espace. L'ensemble antenne comprend en outre : une carte de circuit imprimé d'antenne ; un réseau d'antennes disposé sur une surface de la carte de circuit imprimé d'antenne et formé pour émettre et/ou recevoir des signaux dans une première direction vers le couvercle arrière ; un circuit de communication sans fil connecté électriquement au réseau d'antennes et configuré pour émettre et/ou recevoir des signaux radiofréquence (RF) ; un support d'antenne comprenant une première surface faisant face à une surface du réseau d'antennes et une seconde surface qui vient en butée contre une extrémité de la première surface, et qui est perpendiculaire à la première surface, le support d'antenne supportant le réseau d'antennes ; et un élément de support venant en butée contre la seconde surface du support d'antenne et correspondant à au moins une partie de l'élément latéral du boîtier.
PCT/KR2023/003264 2022-03-23 2023-03-09 Module d'antenne et dispositif électronique le comprenant WO2023182706A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2022-0036301 2022-03-23
KR20220036301 2022-03-23
KR1020220069659A KR20230138371A (ko) 2022-03-23 2022-06-08 안테나 모듈 및 이를 포함하는 전자 장치
KR10-2022-0069659 2022-06-08

Publications (1)

Publication Number Publication Date
WO2023182706A1 true WO2023182706A1 (fr) 2023-09-28

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WO (1) WO2023182706A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200008647A (ko) * 2018-04-09 2020-01-28 엘지전자 주식회사 이동 단말기
KR20200101256A (ko) * 2019-02-19 2020-08-27 삼성전자주식회사 안테나를 포함하는 전자 장치
KR20200108989A (ko) * 2019-03-12 2020-09-22 삼성전자주식회사 안테나 장치를 포함하는 전자 장치
KR102239723B1 (ko) * 2018-08-30 2021-04-13 애플 인크. 모바일 디바이스용 하우징 및 안테나 아키텍처
KR20210093198A (ko) * 2018-08-22 2021-07-27 삼성전자주식회사 안테나 모듈 및 이를 포함하는 전자 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200008647A (ko) * 2018-04-09 2020-01-28 엘지전자 주식회사 이동 단말기
KR20210093198A (ko) * 2018-08-22 2021-07-27 삼성전자주식회사 안테나 모듈 및 이를 포함하는 전자 장치
KR102239723B1 (ko) * 2018-08-30 2021-04-13 애플 인크. 모바일 디바이스용 하우징 및 안테나 아키텍처
KR20200101256A (ko) * 2019-02-19 2020-08-27 삼성전자주식회사 안테나를 포함하는 전자 장치
KR20200108989A (ko) * 2019-03-12 2020-09-22 삼성전자주식회사 안테나 장치를 포함하는 전자 장치

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