WO2022085241A1 - Release film and method for producing molded products - Google Patents

Release film and method for producing molded products Download PDF

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Publication number
WO2022085241A1
WO2022085241A1 PCT/JP2021/025241 JP2021025241W WO2022085241A1 WO 2022085241 A1 WO2022085241 A1 WO 2022085241A1 JP 2021025241 W JP2021025241 W JP 2021025241W WO 2022085241 A1 WO2022085241 A1 WO 2022085241A1
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WIPO (PCT)
Prior art keywords
release film
release
release layer
less
layer
Prior art date
Application number
PCT/JP2021/025241
Other languages
French (fr)
Japanese (ja)
Inventor
陽介 榎本
Original Assignee
住友ベークライト株式会社
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Application filed by 住友ベークライト株式会社 filed Critical 住友ベークライト株式会社
Priority to CN202180002970.3A priority Critical patent/CN114080866B/en
Publication of WO2022085241A1 publication Critical patent/WO2022085241A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Definitions

  • the present invention relates to a method for manufacturing a release film and a molded product.
  • the release film is generally used when manufacturing a molded product or when manufacturing a laminate in which different materials are bonded together.
  • the release film is, for example, a coverlay film (hereinafter also referred to as “CL film”) bonded to a flexible film having an exposed circuit (hereinafter also referred to as “circuit exposed film”) via an adhesive by a heat press.
  • CL film coverlay film
  • circuit exposed film flexible film having an exposed circuit
  • FPC flexible printed circuit board
  • the ten-point average roughness Rz of the surface is 4 ⁇ m or more and 20 ⁇ m or less, and the thickness of the release layer constituting the back surface is 35 ⁇ m or more (however, ten of the surface).
  • a release film (except when the point average roughness Rz is 4 ⁇ m or more and 5 ⁇ m or less and the thickness of the release layer constituting the back surface is 35 ⁇ m or more and 36 ⁇ m or less) is disclosed.
  • the present inventors have made diligent studies from the viewpoint of solving the problems of suppressing the occurrence of wrinkles and improving the yield while maintaining the releasability and embedding property of the release film, and as a result, a specific material is used. It was found that it is effective to control the dynamic friction coefficient measured under predetermined conditions as an index in the mold release layer. In other words, the inventors of the present invention suppress the occurrence of wrinkles and improve the yield while maintaining the releasability and embedding property of the release film even if the release film uses the release layer of the same material. After discovering that there are cases where the problem of releasing the film can be solved and cases where it cannot be solved, and examining the difference between the two, it is possible to identify the difference by using the dynamic friction coefficient measured under predetermined conditions as an index. And completed the present invention.
  • the release layer contains one or more selected from polyester resin, poly 4-methyl-1-pentene resin, polyamide resin, and polypropylene resin.
  • a release film having a dynamic friction coefficient of 0.01 or more and 0.7 or less measured under the following conditions is provided. (conditions) One release film is cut into a size of 6.5 cm in width and 17 cm in length, and the release layer is attached on a horizontal table so that the release layer is on the upper side. Wrap it around a weight of 63 cm square and a weight of 202 g so that the release layer is on the outside.
  • the weight on which the other release film is wound is placed on the one release film, and the weight is placed at a speed of 150 mm / min in an atmosphere of room temperature of 23 ⁇ 1 ° C. and humidity of 50 ⁇ 0.5% RH.
  • the frictional force is measured by moving in the horizontal direction, and the friction coefficient at the point moved by 5 cm is defined as the dynamic friction coefficient.
  • a release film capable of suppressing wrinkle generation while maintaining releasability and embedding property.
  • the MD direction is intended as a film flow direction (MD: Machine Direction)
  • the TD direction is a direction orthogonal to the MD direction and is intended as a vertical direction (TD: Transfer Direction).
  • FIG. 1 is a cross-sectional view schematically showing an example of a release film of the present embodiment.
  • the release film 10 of the present embodiment includes the release layer 1 on at least one surface.
  • the release layer 1 is one that exhibits mold release property with respect to an object after being heated and pressed using the release film 10.
  • the release film 10 of the present embodiment has a dynamic friction coefficient of 0.01 or more and 0.7 or less measured under the following condition a.
  • Condition a One release film 10 is cut into a size of 6.5 cm in width and 17 cm in length, and the release layer 1 is attached on a horizontal table so as to be on the upper side, and the other release film 10 is attached. Wrap it around a weight of 63 cm square and a weight of 202 g so that the release layer 1 is on the outside.
  • the weight on which the other release film 10 is wound is placed on one release film 10, and the weight is placed at a speed of 150 mm / min in an atmosphere of room temperature 23 ⁇ 1 ° C. and humidity 50 ⁇ 0.5% RH.
  • the frictional force is measured by moving in the horizontal direction, and the friction coefficient at the point moved by 5 cm is defined as the dynamic friction coefficient.
  • the number of measurements is 3 times, and the average value is used as the dynamic friction coefficient.
  • the dynamic friction coefficient is 0.01 or more, preferably 0.1 or more, and more preferably 0.2 or more.
  • the dynamic friction coefficient is 0.7 or less, preferably 0.65 or less, and more preferably 0.6 or less.
  • the release film 10 of the present embodiment satisfies the following condition b. (Condition b) 50 when the release film 10 formed into a thickness of 100 ⁇ m, a width of 4 mm, and a length of 20 mm in the MD direction was measured with a dynamic viscoelasticity measuring device in a tensile mode, a frequency of 1 Hz, and a temperature rise rate of 5 ° C./min.
  • the tan ⁇ 50 at ° C. is 0.05 or more and 0.2 or less, and the tan ⁇ 175 at 175 ° C. or lower is 0.15 or more and 0.25 or less.
  • the tan ⁇ 50 is 0.05 or more and 0.2 or less, preferably 0.08 or more and 0.15 or less.
  • the tan ⁇ 50 is 0.05 or more and 0.2 or less, preferably 0.08 or more and 0.15 or less.
  • tan ⁇ 175 By setting the tan ⁇ 175 to the above lower limit value or more, it is possible to maintain appropriate elasticity at the operating temperature of the release film and obtain good releasability. On the other hand, by setting the tan ⁇ 175 to the above upper limit value or less, it becomes easy to effectively suppress the occurrence of wrinkles by giving an appropriate strain when the release film is used.
  • the release film 10 of the present embodiment satisfies the following condition c. (Condition c) 175 when the release film 10 formed into a thickness of 100 ⁇ m, a width of 4 mm, and a length of 20 mm in the MD direction was measured with a dynamic viscoelasticity measuring device in a tensile mode, a frequency of 1 Hz, and a temperature rise rate of 5 ° C./min.
  • the storage elastic modulus at ° C. is 10 MPa or more and 40 MPa or less.
  • the storage elastic modulus is 10 MPa or more and 40 MPa or less, preferably 15 MPa or more and 37 MPa or less.
  • the storage elastic modulus is 10 MPa or more and 40 MPa or less, preferably 15 MPa or more and 37 MPa or less.
  • the release film 10 of the present embodiment satisfies the following condition d.
  • (Condition d) 175 when the release film 10 formed into a thickness of 100 ⁇ m, a width of 4 mm, and a length of 20 mm in the MD direction was measured with a dynamic viscoelasticity measuring device in a tensile mode, a frequency of 1 Hz, and a temperature rise rate of 5 ° C./min.
  • the loss elastic modulus at ° C. is 2.0 MPa or more and 10 MPa or less.
  • the loss elastic modulus is 2.0 MPa or more and 10 MPa or less, preferably 3.0 MPa or more and 5.5 MPa or less.
  • the loss elastic modulus is set to the above lower limit value or more, it is possible to improve the handleability during transportation and suppress the occurrence of wrinkles, improve the heat resistance, and obtain good mold releasability.
  • the loss elastic modulus is set to the above upper limit value or less, the release film is provided with an appropriate strain to suppress the occurrence of wrinkles during transportation, and it becomes easy to improve the yield.
  • the dynamic viscoelasticity measuring device is not particularly limited, but DMA7100 (manufactured by Hitachi High-Tech Science), DMS7100 (manufactured by SSI Nanotechnology), DMS6100 (manufactured by SSI Nanotechnology) and the like can be used. can.
  • the release film 10 satisfying the above conditions a to d is controlled by appropriately combining known techniques, and is obtained by a manufacturing method different from the conventional manufacturing method as described later. It is something that can be done. That is, the release film 10 satisfying the above conditions a to d can be obtained only by combining the following known techniques to make a manufacturing method different from the conventional manufacturing method.
  • (I) Selection of material for release layer 1 (ii) Temperature control in the manufacturing process of release film 10 (release layer 1) (iii) Concavo-convex processing on release film 0 (release layer 1) (i) )-(Iii) Details of each will be described later.
  • the thickness of the entire release film 10 of the present embodiment is preferably 50 ⁇ m or more and 200 ⁇ m or less, more preferably 70 ⁇ m or more and 180 ⁇ m or less, and further preferably 90 ⁇ m or more and 150 ⁇ m or less.
  • the thickness of the entire release film 10 is preferably 50 ⁇ m or more and 200 ⁇ m or less, more preferably 70 ⁇ m or more and 180 ⁇ m or less, and further preferably 90 ⁇ m or more and 150 ⁇ m or less.
  • the thickness of the entire release film 10 is the same as the thickness of the release layer 1 described later.
  • the material of the release layer 1 may be one or more selected from polyester resin, poly 4-methyl-1-pentene resin, polyamide resin, and polypropylene resin. As a result, the release film 10 satisfying the above conditions a to d can be obtained.
  • polyester resin examples include polyethylene terephthalate resin (PET), polybutylene terephthalate resin (PBT), polytrimethylene terephthalate resin (PTT), polyhexamethylene terephthalate resin (PHT), and polyethylene naphthalate resin (PEN).
  • PET polyethylene terephthalate resin
  • PBT polybutylene terephthalate resin
  • PTT polytrimethylene terephthalate resin
  • PHT polyhexamethylene terephthalate resin
  • PEN polyethylene naphthalate resin
  • the polyamide resin include aliphatic polyamides and aromatic polyamides. Specific examples of the aliphatic polyamide include polyamide 6, polyamide 6, 6, polyamide 6-6, 6 copolymer, polyamide 11, polyamide 12, and the like. Specific examples of the aromatic polyamide include polyamide 61, polyamide 66 / 6T, polyamide 6T / 6, polyamide 12 / 6T and the like. Of these, polyethylene terephthalate resin, polybutylene ter
  • a stretched film may be used as the release layer 1, and the stretching can be produced by using known methods such as sequential biaxial stretching, simultaneous biaxial stretching, and tubular stretching.
  • the release layer 1 contains antioxidants, slip agents, antiblocking agents, antistatic agents, colorants such as dyes and pigments, additives such as stabilizers, fluororesins, and silicon rubber. It may contain an impact resistance imparting agent such as, and an inorganic filler such as titanium oxide, calcium carbonate and talc.
  • the surface roughness Rz of the release surface 3 of the release layer 1 in the MD direction is preferably 2 ⁇ m to 20 ⁇ m, more preferably 5 to 20 ⁇ m, and even more preferably 8 to 20 ⁇ m.
  • the surface roughness Rz is preferably 2 ⁇ m to 20 ⁇ m, more preferably 5 to 20 ⁇ m, and even more preferably 8 to 20 ⁇ m.
  • an embossed pattern is transferred to the film using a roll embossed in the manufacturing process of the release film 10 (or the release layer 1), or particles are transferred to the material of the release layer 1.
  • the thickness of the release layer 1 is preferably 5 to 50%, and may be 100%, with respect to the total thickness of the release film 10. By setting the thickness of the release layer 1 to the above lower limit value or more, the rigidity of the release film 10 is increased, and it becomes easy to suppress excessive deformation and wrinkles.
  • the thickness of the release layer 1 is appropriately set according to the purpose, and may be, for example, 3 ⁇ m or more, 5 ⁇ m or more, and 60 ⁇ m or less, 50 ⁇ m or less. May be.
  • the release film 10 in the present embodiment may be one having the release layer 1 on at least one surface, may be composed of only the above-mentioned release layer 1, and may have a layer having another function. It may have a multi-layer structure. Further, the release layer 1 may be a single layer or two or more layers. When the number of release layers is two or more, each release layer may be formed of the same material or may be formed of different materials. Further, the plurality of release layers 1 may have different thicknesses from each other. Specifically, for example, a release film having different release layers on both sides of the release film may be used.
  • the release film When using the release film in this case, the one having a surface in contact with the object is referred to as a release layer, and the other surface may be referred to as a secondary release layer.
  • the release film When hot-pressed by a press machine, the mold release property from the hot plate is improved, and the productivity in the production of a molded body or a laminated body such as an FPC can be improved.
  • the release film may further have a cushion layer in contact with the release layer.
  • the release film may have a three-layer structure in which a release layer, a cushion layer, and a secondary release layer are laminated in this order.
  • examples of the layer having another function include an adhesive layer and a gas barrier layer.
  • the adhesive layer and the gas barrier layer are not particularly limited, and known ones can be used. The details of the cushion layer will be described below.
  • the cushion layer is made of a flexible resin to impart cushioning property to the entire release film. As a result, when the release film is used, the heat and pressure from the press hot plate are easily transferred evenly to the adherend, and the adhesion and embedding property between the release film and the adherend are further improved. can.
  • the resin material forming the cushion layer examples include ⁇ -olefin polymers such as polyethylene and polyproprene, and ⁇ -olefin copolymers containing ethylene, propylene, butene, pentene, hexene, methylpentene and the like as polymer components.
  • ⁇ -olefin polymers such as polyethylene and polyproprene
  • engineering plastics-based resins such as polyether sulfone and polyphenylene sulfide. These may be used alone or in combination of two or more. Of these, ⁇ -olefin-based copolymers are preferable.
  • the ⁇ -olefin copolymer includes a copolymer of ⁇ -olefin such as ethylene and a (meth) acrylic acid ester, a copolymer of ethylene and vinyl acetate, and a copolymer of ethylene and (meth) acrylic acid. Examples thereof include polymers and partially ion-crosslinked products thereof. Further, from the viewpoint of obtaining a good cushioning function, an ⁇ -olefin- (meth) acrylic acid ester copolymer such as ethylene is used alone, or a polybutylene terephthalate and a 1,4 cyclohexanedimethanol copolymer polyethylene terephthalate.
  • a mixture of an ⁇ -olefin polymer and an ⁇ -olefin- (meth) acrylic acid ester copolymer such as ethylene are preferable.
  • EMMA ethylene-methylmethacrylate copolymer
  • PBT polybutylene terephthalate
  • PP polypropylene
  • -A mixture with a methyl methacrylate copolymer (EMMA), etc. is more preferable.
  • the cushion layer may further contain a rubber component.
  • the rubber component include styrene-based thermoplastic elastomers such as styrene-butadiene copolymers and styrene-isoprene copolymers, olefin-based thermoplastic elastomers, amide-based elastomers, and thermoplastic elastomer materials such as polyester-based elastomers, and natural rubber. , Isoprene rubber, chloroprene rubber, rubber materials such as silicon rubber and the like.
  • Antioxidants, slip agents, anti-blocking agents, antistatic agents, colorants such as dyes and pigments, additives such as stabilizers, impact resistance imparting agents such as fluororesin and silicone rubber, and titanium oxide are used for the cushion layer.
  • Calcium carbonate, talc and other inorganic fillers may be contained.
  • Examples of the method for forming the cushion layer include known methods such as an air-cooled or water-cooled inflation extrusion method and a T-die extrusion method.
  • the thickness of the cushion layer is appropriately set according to the purpose, but is preferably 30 to 95%, more preferably 50 to 90%, based on the total thickness of the release film.
  • the thickness of the cushion layer is, for example, preferably 20 ⁇ m or more and 130 ⁇ m or less, more preferably 40 ⁇ m or more and 120 ⁇ m or less, and further preferably 50 ⁇ m or more and 110 ⁇ m or less.
  • the thickness of the cushion layer is at least the above lower limit value, it is possible to suppress the deterioration of the cushioning property of the release film.
  • the thickness of the cushion layer is not more than the above upper limit value, the decrease in releasability can be suppressed.
  • the method for producing the release film of the present embodiment is not particularly limited, and for example, the release layer and the cushion layer, or the release layer and the cushion layer and the secondary release layer are separately produced, and then the laminator.
  • the release film may be obtained by joining with or the like, or may be joined as it is, or may be joined to each other via an adhesive layer.
  • the release layer and the cushion layer, or the release layer and the cushion layer and the sub-release layer are separated by an air-cooled or water-cooled coextrusion inflation method or a coextrusion T-die method. You may obtain a film.
  • the method of forming a film by the coextrusion T-die method is preferable because it is excellent in controlling the thickness of each layer.
  • the release film is composed of only the release layer, a method for producing the release film (release layer) by the T-die extrusion method will be described.
  • FIG. 2 is a cross-sectional view schematically showing an example of the release film manufacturing apparatus of the present embodiment.
  • the melt M obtained by heating and melting the raw material of the release layer passes through the die 510, is formed into a film, is guided to the first roll 530, and is first guided by the touch roll 520. It is immobilized on the roll 530 and cooled by the first roll 530 until it is detached from the first roll 530 to become the release film 200.
  • the release film 200 is fed by the second roll 540 to the downstream side in the film feeding direction (see the arrow in FIG. 1), and is finally wound into a take-up roll (not shown).
  • the temperature of the first roll 530 is 60 to 110 ° C
  • the temperature of the touch roll 520 is 20 to 50 ° C
  • the temperature of the second roll 540 is 60 to 90 ° C.
  • the winding speed is preferably 20 to 60 m / s in order to obtain a stable slow cooling effect.
  • the touch roll 520 whose surface is embossed, unevenness is imparted to the surface of the film that has passed through the die 510.
  • the surface roughness can be reduced by using an air knife without using a touch roll.
  • the release film is composed of only the release layer
  • the release film may have a multilayer structure having a layer other than the release layer. That is, in the process of manufacturing the release layer, the release film satisfying the conditions a to d can be obtained by controlling the temperature of each roll and appropriately performing uneven processing on the release layer.
  • the release film of this embodiment may be used, for example, when manufacturing a flexible printed circuit board.
  • the release film in order to protect the circuit formed on the flexible film, the release film is interposed between the coverlay and the press machine when the coverlay film is heat-pressed and brought into close contact with the circuit.
  • the release film is used, for example, in a coverlay press laminating process, which is one of the manufacturing processes of a flexible printed wiring board. More specifically, the release film is arranged so as to wrap the coverlay film in order to bring the coverlay film into close contact with the uneven portion of the circuit pattern when the coverlay film is adhered to the circuit exposed film. At the same time, it is heated and pressurized by a press machine.
  • paper, rubber, a fluororesin sheet, glass paper, or a combination thereof may be inserted between the release film and the press and then heated and pressed.
  • the press machine sets the sample on a hot plate heated to 175 ° C., starts pressurization, maintains the temperature for 2 minutes, then ends pressurization, and takes out and disassembles the sample.
  • the press pressure at this time is appropriately adjusted at 5 to 15 MPa.
  • the release film of the present embodiment may be used by the following method. First, the release layer surface of the release film according to the present embodiment is arranged on the surface of an object formed of a material containing a thermosetting resin. Then, the object on which the release film is placed is pressed in the mold.
  • the thermosetting resin described above may be in a semi-cured state or a cured state, but in the semi-cured state, the action and effect of the release film becomes more remarkable.
  • the thermosetting resin is a resin composition containing an epoxy resin, it is preferable that the epoxy resin is in the middle stage of the curing reaction, that is, in the B stage state.
  • thermoplastic resin composition As the first thermoplastic resin composition and the second thermoplastic resin composition, those each composed of poly 4-methyl-1-pentene resin I (DX820) were prepared. Further, as the third thermoplastic resin composition, a composition composed of 50 parts by weight of low-density polyethylene (R300A), 30 parts by weight of polypropylene (FH1016), and 20 parts by weight of poly 4-methyl-1-pentene resin I is prepared. bottom. Next, using the first thermoplastic resin composition, the third thermoplastic resin composition, and the second thermoplastic resin composition, they are laminated in the T-die of the extruder to form one molten resin laminate, and then cooled.
  • R300A low-density polyethylene
  • FH1016 polypropylene
  • the solidified first release layer made of the first thermoplastic resin composition, the cushion layer made of the third thermoplastic resin composition, and the second release layer made of the second thermoplastic resin composition are the same.
  • a laminated body laminated in order was formed, and a release film was obtained.
  • a manufacturing apparatus as shown in FIG. 2 is used, the temperature of the embossed touch roll 520 is set to 50 ° C, the temperature of the first roll 530 is set to 110 ° C, and the temperature of the second roll is set to 110 ° C.
  • the temperature of 540 was set to 60 ° C.
  • the winding speed was 20 m / s.
  • the average thickness of the first release layer was 25 ⁇ m
  • the average thickness of the cushion layer was 70 ⁇ m
  • the average thickness of the second release layer was 25 ⁇ m.
  • thermoplastic resin composition As the first thermoplastic resin composition and the second thermoplastic resin composition, those each composed of poly4-methyl-1-pentene resin II (RT18) were prepared.
  • the third thermoplastic resin composition is composed of 40 parts by weight of the ethylene-vinyl acetate copolymer (V5921), 30 parts by weight of polypropylene (FH1016), and 30 parts by weight of the poly 4-methyl-1-pentene resin I. I prepared something.
  • thermoplastic resin composition, the third thermoplastic resin composition, and the second thermoplastic resin composition they are laminated in the T-die of the extruder to form one molten resin laminate, and then.
  • the first release layer made of the first thermoplastic resin composition, the cushion layer made of the third thermoplastic resin composition, and the second release layer made of the second thermoplastic resin composition are formed.
  • a laminated body laminated in this order was formed, and a release film was obtained.
  • a manufacturing apparatus as shown in FIG. 2 is used, the temperature of the touch roll 520 is set to 50 ° C, the temperature of the first roll 530 is set to 90 ° C, and the temperature of the second roll 540 is set to 60 ° C. And said.
  • the winding speed was 22 m / s.
  • the average thickness of the first release layer was 10 ⁇ m
  • the average thickness of the cushion layer was 100 ⁇ m
  • the average thickness of the second release layer was 10 ⁇ m.
  • the first thermoplastic resin composition and the second thermoplastic resin composition are composed of 50 parts by mass of polybutylene terephthalate resin I (1100-630S) and 50 parts by mass of polybutylene terephthalate resin III (5505S), respectively. I prepared something. Further, as the third thermoplastic resin composition, 50 parts by weight of the ethylene-vinyl acetate copolymer (V5921), 30 parts by weight of polypropylene (FH1016), and 20 parts by weight of the polybutylene terephthalate resin I (1100-630S) are used. I prepared what is composed.
  • thermoplastic resin composition the third thermoplastic resin composition, and the second thermoplastic resin composition
  • they are laminated in the T-die of the extruder to form one molten resin laminate, and then.
  • the first release layer made of the first thermoplastic resin composition, the cushion layer made of the third thermoplastic resin composition, and the second release layer made of the second thermoplastic resin composition are formed.
  • a laminated body laminated in this order was formed, and a release film was obtained.
  • a manufacturing apparatus as shown in FIG. 2 is used, the temperature of the touch roll 520 is set to 50 ° C, the temperature of the first roll 530 is set to 90 ° C, and the temperature of the second roll 540 is set to 60 ° C.
  • the winding speed was 25 m / s.
  • the average thickness of the first release layer was 20 ⁇ m
  • the average thickness of the cushion layer was 70 ⁇ m
  • the average thickness of the second release layer was 20 ⁇ m.
  • Example 4 As the first thermoplastic resin composition and the second thermoplastic resin composition, those each composed of poly4-methyl-1-pentene resin II (RT18) were prepared, and the winding speed was 25 m / s.
  • a release film was prepared in the same manner as in Example 1 except for the above. In the obtained release film, the average thickness of the first release layer was 12 ⁇ m, the average thickness of the cushion layer was 46 ⁇ m, and the average thickness of the second release layer was 12 ⁇ m.
  • Example 1 A release film was produced in the same manner as in Example 1 except that the touch roll 520 was not used and the film was fixed to the first roll 530 with an air knife when the film was produced using the manufacturing apparatus shown in FIG.
  • thermoplastic resin composition and the second thermoplastic resin composition were composed of polybutylene terephthalate resin II (1100-211H). bottom.
  • (B) tan ⁇ 50 when the release film molded into a thickness of 100 ⁇ m, a width of 4 mm, and a length of 20 mm in the MD direction was measured with a dynamic viscoelasticity measuring device in a tensile mode, a frequency of 1 Hz, and a temperature rise rate of 5 ° C./min.
  • the tan ⁇ 50 at ° C. and the tan ⁇ 175 at 175 ° C. or lower were obtained, respectively.
  • (C) Storage elastic modulus The release film formed into a thickness of 100 ⁇ m, a width of 4 mm, and a length of 20 mm in the MD direction is subjected to a dynamic viscoelasticity measuring device in a tensile mode, a frequency of 1 Hz, and a temperature rise rate of 5 ° C./min. The storage elastic modulus at 175 ° C. at the time of measurement was determined.
  • (D) Loss elastic modulus The release film formed into a thickness of 100 ⁇ m, a width of 4 mm, and a length of 20 mm in the MD direction is subjected to a dynamic viscoelasticity measuring device in a tensile mode, a frequency of 1 Hz, and a temperature rise rate of 5 ° C./min. The loss elastic modulus at 175 ° C. at the time of measurement was determined.
  • CM type CM type
  • test piece was prepared in which a coverlay having the above-mentioned opening was temporarily fixed so that the surface on the side coated with the adhesive was in contact with the surface of the copper upholstered plate for a flexible wiring board.
  • the release film and the test piece are overlapped so that the first release surface of the first release layer in the release film faces the surface of the test piece on the side having the coverlay.
  • a hot press treatment was performed under vacuum conditions at 175 ° C., 2 MPa, vacuuming for 20 seconds, and 2 minutes to obtain a molded product.
  • the adhesive coated on the surface of the cover tape has a shape (adhesive exudation) that has exuded from the outer edge of the opening in the opening formed in the coverlay.
  • the shape) was observed, and the implantability was evaluated based on the following criteria.
  • ⁇ The difference in unevenness of the exuded shape of the adhesive was less than 70 ⁇ m.
  • ⁇ The difference in unevenness of the exuded shape of the adhesive was 70 ⁇ m or more and less than 100 ⁇ m.
  • X The difference in unevenness of the exuded shape of the adhesive was 100 ⁇ m or more.
  • FPC insulating substrate
  • the release film and the test piece are overlapped so that the first release surface of the first release layer in the release film faces the surface of the test piece on the side having the coverlay.
  • a hot press treatment was performed under vacuum conditions at 175 ° C., 2 MPa, vacuuming for 20 seconds, and 2 minutes to obtain a molded product.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

A release film (10) according to the present invention is provided with a release layer (1) on at least one side. A release layer (1) contains one or two or more types selected from polyester resins, poly-4-methyl-1-pentene resins, polyamide resins, and polypropylene resins, and has a dynamic coefficient of friction, measured under the following condition, of 0.01-0.7. (Condition) A first release film (10) is cut to a size of a width of 6.5 cm and a length of 17 cm and is adhered on a horizontal platform with the release layer (1) being the upper side; a second release film (10) is wound around a 63 cm-square, 202 g weight with the release layer (1) to the outside. The weight wound with the second release film is placed on the first release film (10); the frictional force is measured when the weight is displaced in the horizontal direction at a velocity of 150 mm/min in an atmosphere at room temperature 23 ± 1°C with a humidity of 50 ± 0.5% RH; and the coefficient of friction at the point of a 5 cm displacement is designated as the dynamic coefficient of friction.

Description

離型フィルムおよび成型品の製造方法Manufacturing method of release film and molded product
　本発明は、離型フィルムおよび成型品の製造方法に関する。 The present invention relates to a method for manufacturing a release film and a molded product.
　離型フィルムは、一般的に、成型品を製造する際や異なる材料を貼り合わせた積層体を製造する際に使用される。なかでも、離型フィルムは、例えば、回路が露出したフレキシブルフィルム（以下「回路露出フィルム」とも称する）に接着剤を介してカバーレイフィルム（以下「ＣＬフィルム」とも称する）を加熱プレスにより接着してフレキシブルプリント回路基板（以下「ＦＰＣ」とも称する）を作製する際に好適に用いられる。具体的には、カバーレイフィルムと加熱プレス板との間に離型フィルムを配置することによって、フレキシブルフィルムや得られるフレキシブルプリント回路基板の表面を保護することが期待される。 The release film is generally used when manufacturing a molded product or when manufacturing a laminate in which different materials are bonded together. Among them, the release film is, for example, a coverlay film (hereinafter also referred to as “CL film”) bonded to a flexible film having an exposed circuit (hereinafter also referred to as “circuit exposed film”) via an adhesive by a heat press. It is suitably used when manufacturing a flexible printed circuit board (hereinafter, also referred to as “FPC”). Specifically, it is expected that the surface of the flexible film or the obtained flexible printed circuit board is protected by arranging the release film between the coverlay film and the heat-pressed plate.
　近年、スマートフォン、タブレットＰＣ等の普及に伴い、フレキシブル回路基板は高機能化し、薄膜化が進んでいる。また、ロールツーロール（ＲｔｏＲ）方法等の製造方法の自動化が進んでいる。おり、このような製造方法の自動化に伴って、フレキシブル回路基板の製造工程で離型フィルムに生じたシワがフレキシブル回路基板へ転写する場合があった。 In recent years, with the spread of smartphones, tablet PCs, etc., flexible circuit boards have become more sophisticated and thinner. In addition, automation of manufacturing methods such as roll-to-roll (RtoR) methods is progressing. With the automation of such a manufacturing method, wrinkles generated on the release film in the manufacturing process of the flexible circuit board may be transferred to the flexible circuit board.
　近年の離型フィルムが使用される成形品の小型化、薄膜化に伴い、上記のようなロールツーロール（ＲｔｏＲ）で帯状の離型フィルムが搬送される際に離型フィルムに生じたシワがフレキシブル回路基板へ転写しやすくなるという問題が顕在化している。そこで、例えば、特許文献１には、表面の十点平均粗さＲｚが４μｍ以上２０μｍ以下であり、かつ、前記背面を構成する離型層の厚みが３５μｍ以上である（ただし、前記表面の十点平均粗さＲｚが４μｍ以上５μｍ以下であり、かつ、前記背面を構成する離型層の厚みが３５μｍ以上３６μｍ以下である場合を除く）離型フィルムが開示されている。 With the recent miniaturization and thinning of molded products in which mold release films are used, wrinkles generated on the mold release film when the band-shaped mold release film is conveyed by roll-to-roll (RtoR) as described above. The problem of easy transfer to a flexible circuit board has become apparent. Therefore, for example, in Patent Document 1, the ten-point average roughness Rz of the surface is 4 μm or more and 20 μm or less, and the thickness of the release layer constituting the back surface is 35 μm or more (however, ten of the surface). A release film (except when the point average roughness Rz is 4 μm or more and 5 μm or less and the thickness of the release layer constituting the back surface is 35 μm or more and 36 μm or less) is disclosed.
特開２０１９－２１７７８０号公報Japanese Unexamined Patent Publication No. 2019-217780
　しかしながら、本発明者らが検討した結果、上記特許文献１に記載されるような従来の離型フィルムにおいても、離型性および埋め込み性を保持しつつ、シワ発生を抑制する点において改善の余地があった。 However, as a result of studies by the present inventors, there is room for improvement in suppressing wrinkles while maintaining releasability and embedding property even in the conventional releasable film as described in Patent Document 1. was there.
　本発明者らは、離型フィルムの離型性および埋め込み性を保持しつつ、シワ発生を抑制し、歩留まりを向上するという課題を解決する観点から鋭意検討を進めたところ、特定の材料を用いた離型層において、所定の条件で測定される動摩擦係数を指標とし、これを制御することが有効であることを知見した。言い換えると、本件発明者らは、同じ材料の離型層を用いた離型フィルムであっても、離型フィルムの離型性および埋め込み性を保持しつつ、シワ発生を抑制し、歩留まりを向上するという課題を解決できる場合と、そうでない場合とがあることを知見し、両者の違いについて検討を行ったところ、所定の条件で測定される動摩擦係数を指標とすることでかかる違いを特定できることを見出し、本発明を完成させた。 The present inventors have made diligent studies from the viewpoint of solving the problems of suppressing the occurrence of wrinkles and improving the yield while maintaining the releasability and embedding property of the release film, and as a result, a specific material is used. It was found that it is effective to control the dynamic friction coefficient measured under predetermined conditions as an index in the mold release layer. In other words, the inventors of the present invention suppress the occurrence of wrinkles and improve the yield while maintaining the releasability and embedding property of the release film even if the release film uses the release layer of the same material. After discovering that there are cases where the problem of releasing the film can be solved and cases where it cannot be solved, and examining the difference between the two, it is possible to identify the difference by using the dynamic friction coefficient measured under predetermined conditions as an index. And completed the present invention.
　本発明によれば、
　少なくとも一方の面に離型層を備える離型フィルムであって、
　前記離型層は、ポリエステル樹脂、ポリ４－メチル１－ペンテン樹脂、ポリアミド樹脂、およびポリプロピレン樹脂の中から選ばれる１種または２種以上を含み、
　以下の条件で測定した動摩擦係数が０．０１以上、０．７以下である、離型フィルムが提供される。
（条件）
　一の前記離型フィルムを幅６．５ｃｍ、長さ１７ｃｍの大きさにカットし、前記離型層が上側となるようにして水平な台の上に貼り付け、他の前記離型フィルムを、前記離型層が外側となるようにして６３ｃｍ角、重量２０２ｇのおもりに巻き付ける。前記一の離型フィルム上に前記他の離型フィルムが巻き付いた前記おもりを載せ、室温２３±１℃、湿度５０±０．５％ＲＨの雰囲気下で、１５０ｍｍ／ｍｉｎの速度で当該おもりを水平方向へ移動させて摩擦力を測定し、５ｃｍ移動させた点での摩擦係数を動摩擦係数とする。 According to the present invention
A mold release film having a mold release layer on at least one surface.
The release layer contains one or more selected from polyester resin, poly 4-methyl-1-pentene resin, polyamide resin, and polypropylene resin.
A release film having a dynamic friction coefficient of 0.01 or more and 0.7 or less measured under the following conditions is provided.
(conditions)
One release film is cut into a size of 6.5 cm in width and 17 cm in length, and the release layer is attached on a horizontal table so that the release layer is on the upper side. Wrap it around a weight of 63 cm square and a weight of 202 g so that the release layer is on the outside. The weight on which the other release film is wound is placed on the one release film, and the weight is placed at a speed of 150 mm / min in an atmosphere of room temperature of 23 ± 1 ° C. and humidity of 50 ± 0.5% RH. The frictional force is measured by moving in the horizontal direction, and the friction coefficient at the point moved by 5 cm is defined as the dynamic friction coefficient.
　また、本発明によれば、
　上記の離型フィルムの前記一方の離型面が対象物側になるように、前記対象物上に前記離型フィルムを配置する工程と、
　前記離型フィルムが配置された前記対象物に対し、加熱プレスを行う工程と、
を含み、
　前記離型フィルムを配置する前記工程において、前記対象物の前記離型フィルムが配置される面が、熱硬化性樹脂を含む材料によって形成されている、成型品の製造方法が提供される。 Further, according to the present invention,
A step of arranging the release film on the object so that one of the release surfaces of the release film is on the object side.
A step of performing a heating press on the object on which the release film is arranged, and
Including
Provided is a method for producing a molded product, wherein in the step of arranging the release film, the surface of the object on which the release film is arranged is formed of a material containing a thermosetting resin.
　本発明によれば、離型性および埋め込み性を保持しつつ、シワ発生を抑制できる離型フィルムが提供される。 According to the present invention, there is provided a release film capable of suppressing wrinkle generation while maintaining releasability and embedding property.
本実施形態の離型フィルムの一例を模式的に示す断面図である。It is sectional drawing which shows typically the example of the release film of this embodiment. 本実施形態の離型フィルムの製造装置の一例を模式的に示す断面図である。It is sectional drawing which shows typically an example of the release film manufacturing apparatus of this embodiment.
　以下、本発明の実施形態について、図面を参照しつつ、詳細に説明する。
　すべての図面において、同様な構成要素には同様の符号を付し、適宜説明を省略する。図面中の各部材の形状や寸法比などは、必ずしも現実の物品と対応するものではない。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
In all drawings, similar components are designated by the same reference numerals, and description thereof will be omitted as appropriate. The shape and dimensional ratio of each member in the drawing do not necessarily correspond to the actual article.
　本明細書中、数値範囲の説明における「ａ～ｂ」との表記は、特に断らない限り、ａ以上ｂ以下のことを表す。例えば、「１～５質量％」とは「１質量％以上５質量％以下」を意味する。 In this specification, the notation "a to b" in the description of the numerical range indicates a or more and b or less unless otherwise specified. For example, "1 to 5% by mass" means "1% by mass or more and 5% by mass or less".
　本明細書中、ＭＤ方向とは、フィルムの流れ方向（ＭＤ：Ｍａｃｈｉｎｅ　Ｄｉｒｅｃｔｉｏｎ）を意図し、ＴＤ方向とは、ＭＤ方向に直交する方向であり、垂直方向（ＴＤ：Ｔｒａｎｓｖｅｒｓｅ　Ｄｉｒｅｃｔｉｏｎ）を意図する。 In the present specification, the MD direction is intended as a film flow direction (MD: Machine Direction), and the TD direction is a direction orthogonal to the MD direction and is intended as a vertical direction (TD: Transfer Direction).
＜離型フィルム＞
　図１は、本実施形態の離型フィルムの一例を模式的に示す断面図である。本実施形態の離型フィルム１０は、少なくとも一方の面に離型層１を備えるものである。離型層１とは、離型フィルム１０を使用して加熱加圧したのちに、対象物に対して離型性を発揮するものである。 <Release film>
FIG. 1 is a cross-sectional view schematically showing an example of a release film of the present embodiment. The release film 10 of the present embodiment includes the release layer 1 on at least one surface. The release layer 1 is one that exhibits mold release property with respect to an object after being heated and pressed using the release film 10.
　本実施形態の離型フィルム１０は、以下の条件ａで測定した動摩擦係数が０．０１以上、０．７以下である。
（条件ａ）
　一の離型フィルム１０を幅６．５ｃｍ、長さ１７ｃｍの大きさにカットし、離型層１が上側となるようにして水平な台の上に貼り付け、他の離型フィルム１０を、離型層１が外側となるようにして６３ｃｍ角、重量２０２ｇのおもりに巻き付ける。一の離型フィルム１０上に他の離型フィルム１０が巻き付いた前記おもりを載せ、室温２３±１℃、湿度５０±０．５％ＲＨの雰囲気下で、１５０ｍｍ／ｍｉｎの速度で当該おもりを水平方向へ移動させて摩擦力を測定し、５ｃｍ移動させた点での摩擦係数を動摩擦係数とする。 The release film 10 of the present embodiment has a dynamic friction coefficient of 0.01 or more and 0.7 or less measured under the following condition a.
(Condition a)
One release film 10 is cut into a size of 6.5 cm in width and 17 cm in length, and the release layer 1 is attached on a horizontal table so as to be on the upper side, and the other release film 10 is attached. Wrap it around a weight of 63 cm square and a weight of 202 g so that the release layer 1 is on the outside. The weight on which the other release film 10 is wound is placed on one release film 10, and the weight is placed at a speed of 150 mm / min in an atmosphere of room temperature 23 ± 1 ° C. and humidity 50 ± 0.5% RH. The frictional force is measured by moving in the horizontal direction, and the friction coefficient at the point moved by 5 cm is defined as the dynamic friction coefficient.
　また、測定回数は３回とし、その平均値を動摩擦係数として採用する。 The number of measurements is 3 times, and the average value is used as the dynamic friction coefficient.
　本実施形態の離型フィルム１０において、当該動摩擦係数は０．０１以上であり、０．１以上が好ましく、０．２以上がより好ましい。当該動摩擦係数を上記下限値以上とすることにより、滑りすぎる場合などが発生して、搬送時のずれや、巻き取り、巻きだし時にずれが生じ実用上使用できないなどの問題の発生を抑制できる。
　一方、本実施形態の離型フィルム１０において、当該動摩擦係数は０．７以下であり、０．６５以下が好ましく、０．６以下がより好ましい。当該動摩擦係数を上記上限値以下とすることにより、滑り性を向上して搬送時のシワの発生を抑制し、歩留まりを向上しやすくなる。 In the release film 10 of the present embodiment, the dynamic friction coefficient is 0.01 or more, preferably 0.1 or more, and more preferably 0.2 or more. By setting the dynamic friction coefficient to the above lower limit value or more, it is possible to suppress the occurrence of problems such as excessive slippage, deviation during transportation, deviation during winding and unwinding, and the like, which cannot be used practically.
On the other hand, in the release film 10 of the present embodiment, the dynamic friction coefficient is 0.7 or less, preferably 0.65 or less, and more preferably 0.6 or less. By setting the dynamic friction coefficient to the above upper limit value or less, the slipperiness is improved, the occurrence of wrinkles during transportation is suppressed, and the yield is easily improved.
　また、本実施形態の離型フィルム１０は、以下の条件ｂを満たすことが好ましい。
（条件ｂ）
　ＭＤ方向に厚さ１００μｍ、幅４ｍｍ、長さ２０ｍｍに成形した離型フィルム１０を、動的粘弾性測定装置で、引張りモード、周波数１Ｈｚ、昇温速度５℃／ｍｉｎで測定したときの、５０℃でのｔａｎδ５０が、０．０５以上０．２以下であり、１７５℃以下でのｔａｎδ１７５が、０．１５以上０．２５以下である。 Further, it is preferable that the release film 10 of the present embodiment satisfies the following condition b.
(Condition b)
50 when the release film 10 formed into a thickness of 100 μm, a width of 4 mm, and a length of 20 mm in the MD direction was measured with a dynamic viscoelasticity measuring device in a tensile mode, a frequency of 1 Hz, and a temperature rise rate of 5 ° C./min. The tan δ 50 at ° C. is 0.05 or more and 0.2 or less, and the tan δ 175 at 175 ° C. or lower is 0.15 or more and 0.25 or less.
　本実施形態の離型フィルム１０において、当該ｔａｎδ５０は０．０５以上０．２以下であり、０．０８以上０．１５以下が好ましい。当該ｔａｎδ５０を上記下限値以上とすることにより、搬送時などの取り扱い性を良好にしてシワ発生を抑制できる。一方で、当該ｔａｎδ５０を上記上限値以下とすることにより、離型フィルムに適度なこしを持たせることにより搬送時のシワの発生を抑制し、歩留まりを向上しやすくなる。
　また、本実施形態の離型フィルム１０において、当該ｔａｎδ１７５は０．１５以上０．２５以下であり、０．２０以上０．２５以下が好ましい。当該当該ｔａｎδ１７５を上記下限値以上とすることにより、離型フィルムの使用温度における適度な弾性を保持し、良好な離型性を得ることができる。一方で、当該当該ｔａｎδ１７５を上記上限値以下とすることにより、離型フィルムの使用時に適度なこしを持たせることによりシワの発生を効果的に抑制しやすくなる。 In the release film 10 of the present embodiment, the tan δ 50 is 0.05 or more and 0.2 or less, preferably 0.08 or more and 0.15 or less. By setting the tan δ 50 to the above lower limit value or more, it is possible to improve the handleability during transportation and suppress the occurrence of wrinkles. On the other hand, by setting the tan δ 50 to the above upper limit value or less, the release film is provided with an appropriate strain, so that the occurrence of wrinkles during transportation is suppressed and the yield is easily improved.
Further, in the release film 10 of the present embodiment, the tan δ 175 is 0.15 or more and 0.25 or less, preferably 0.20 or more and 0.25 or less. By setting the tan δ 175 to the above lower limit value or more, it is possible to maintain appropriate elasticity at the operating temperature of the release film and obtain good releasability. On the other hand, by setting the tan δ 175 to the above upper limit value or less, it becomes easy to effectively suppress the occurrence of wrinkles by giving an appropriate strain when the release film is used.
　また、本実施形態の離型フィルム１０は、以下の条件ｃを満たすことが好ましい。
（条件ｃ）
　ＭＤ方向に厚さ１００μｍ、幅４ｍｍ、長さ２０ｍｍに成形した離型フィルム１０を、動的粘弾性測定装置で、引張りモード、周波数１Ｈｚ、昇温速度５℃／ｍｉｎで測定したときの、１７５℃での貯蔵弾性率が、１０ＭＰａ以上４０ＭＰａ以下である。 Further, it is preferable that the release film 10 of the present embodiment satisfies the following condition c.
(Condition c)
175 when the release film 10 formed into a thickness of 100 μm, a width of 4 mm, and a length of 20 mm in the MD direction was measured with a dynamic viscoelasticity measuring device in a tensile mode, a frequency of 1 Hz, and a temperature rise rate of 5 ° C./min. The storage elastic modulus at ° C. is 10 MPa or more and 40 MPa or less.
　本実施形態の離型フィルム１０において、当該貯蔵弾性率は１０ＭＰａ以上４０ＭＰａ以下であり、１５ＭＰａ以上３７ＭＰａ以下が好ましい。当該貯蔵弾性率を上記下限値以上とすることにより、熱プレス成型時の良好な耐熱性が得られ、離型性を向上できる。一方で、当該当該貯蔵弾性率を上記上限値以下とすることにより、離型フィルム１０に適度なこしを持たせることにより搬送時のシワの発生を抑制し、歩留まりを向上しやすくなるとともに、良好な埋め込み性が得られる。 In the release film 10 of the present embodiment, the storage elastic modulus is 10 MPa or more and 40 MPa or less, preferably 15 MPa or more and 37 MPa or less. By setting the storage elastic modulus to the above lower limit value or more, good heat resistance during hot press molding can be obtained, and mold releasability can be improved. On the other hand, by setting the storage elastic modulus to the above upper limit value or less, the release film 10 is provided with an appropriate strain to suppress the occurrence of wrinkles during transportation, which makes it easier to improve the yield and is good. Good embedding property can be obtained.
　また、本実施形態の離型フィルム１０は、以下の条件ｄを満たすことが好ましい。
（条件ｄ）
　ＭＤ方向に厚さ１００μｍ、幅４ｍｍ、長さ２０ｍｍに成形した離型フィルム１０を、動的粘弾性測定装置で、引張りモード、周波数１Ｈｚ、昇温速度５℃／ｍｉｎで測定したときの、１７５℃での損失弾性率が、２．０ＭＰａ以上１０ＭＰａ以下である。 Further, it is preferable that the release film 10 of the present embodiment satisfies the following condition d.
(Condition d)
175 when the release film 10 formed into a thickness of 100 μm, a width of 4 mm, and a length of 20 mm in the MD direction was measured with a dynamic viscoelasticity measuring device in a tensile mode, a frequency of 1 Hz, and a temperature rise rate of 5 ° C./min. The loss elastic modulus at ° C. is 2.0 MPa or more and 10 MPa or less.
　本実施形態の離型フィルム１０において、当該損失弾性率は２．０ＭＰａ以上１０ＭＰａ以下であり、３.０ＭＰａ以上５．５ＭＰａ以下が好ましい。当該損失弾性率を上記下限値以上とすることにより、搬送時などの取り扱い性を良好にしてシワ発生を抑制しつつ、耐熱性を高め、良好な離型性を得ることができる。一方、当該損失弾性率を上記上限値以下とすることにより、離型フィルムに適度なこしを持たせることにより搬送時のシワの発生を抑制し、歩留まりを向上しやすくなる。 In the release film 10 of the present embodiment, the loss elastic modulus is 2.0 MPa or more and 10 MPa or less, preferably 3.0 MPa or more and 5.5 MPa or less. By setting the loss elastic modulus to the above lower limit value or more, it is possible to improve the handleability during transportation and suppress the occurrence of wrinkles, improve the heat resistance, and obtain good mold releasability. On the other hand, by setting the loss elastic modulus to the above upper limit value or less, the release film is provided with an appropriate strain to suppress the occurrence of wrinkles during transportation, and it becomes easy to improve the yield.
　動的粘弾性測定装置としては、特に限定されないが、ＤＭＡ７１００（日立ハイテクサイエンス社製）、ＤＭＳ７１００（エスエスアイ・ナノテクノロジー社製）、ＤＭＳ６１００（エスエスアイ・ナノテクノロジー社製）等を使用することができる。 The dynamic viscoelasticity measuring device is not particularly limited, but DMA7100 (manufactured by Hitachi High-Tech Science), DMS7100 (manufactured by SSI Nanotechnology), DMS6100 (manufactured by SSI Nanotechnology) and the like can be used. can.
　本実施形態において、上記の条件ａ～ｄを満たす離型フィルム１０は、公知の技術を適切に組み合わせて制御することが重要であり、後述するように従来の製造方法とは異なる製造方法によって得られるものである。すなわち、以下のような公知技術を組み合わせて従来の製造方法とは異なる製造方法とすることで初めて、上記の条件ａ～ｄを満たす離型フィルム１０が得られる。
（ｉ）離型層１の材料の選択
（ｉｉ）離型フィルム１０（離型層１）の製造過程の温度管理
（ｉｉｉ）離型フィルム０（離型層１）への凹凸加工
　上記（ｉ）～（ｉｉｉ）それぞれの詳細は、後述する。 In the present embodiment, it is important that the release film 10 satisfying the above conditions a to d is controlled by appropriately combining known techniques, and is obtained by a manufacturing method different from the conventional manufacturing method as described later. It is something that can be done. That is, the release film 10 satisfying the above conditions a to d can be obtained only by combining the following known techniques to make a manufacturing method different from the conventional manufacturing method.
(I) Selection of material for release layer 1 (ii) Temperature control in the manufacturing process of release film 10 (release layer 1) (iii) Concavo-convex processing on release film 0 (release layer 1) (i) )-(Iii) Details of each will be described later.
　また、本実施形態の離型フィルム１０全体の厚みが５０μｍ以上２００μｍ以下であることが好ましく、７０μｍ以上１８０μｍ以下であることがより好ましく、９０μｍ以上１５０μｍ以下であることがさらに好ましい。
　離型フィルム１０全体の厚みを上記下限値以上とすることにより、離型フィルム１０の取り扱い性を良好にし、シワの発生を抑制しやすくなる。
　一方、離型フィルム１０全体の厚みを上記上限値以下とすることにより、離型性、埋め込み性のバランスを保持できる。 Further, the thickness of the entire release film 10 of the present embodiment is preferably 50 μm or more and 200 μm or less, more preferably 70 μm or more and 180 μm or less, and further preferably 90 μm or more and 150 μm or less.
By setting the thickness of the entire release film 10 to the above lower limit value or more, the handleability of the release film 10 is improved and the occurrence of wrinkles is easily suppressed.
On the other hand, by setting the thickness of the entire release film 10 to be equal to or less than the above upper limit value, the balance between releasability and embedding property can be maintained.
　なお、離型フィルム１０全体の厚みは、離型フィルム１０が離型層１のみからなる場合は、後述する離型層１の厚みと同様となる。 When the release film 10 is composed of only the release layer 1, the thickness of the entire release film 10 is the same as the thickness of the release layer 1 described later.
［離型層］
　離型層１の材料は、ポリエステル樹脂、ポリ４－メチル１－ペンテン樹脂、ポリアミド樹脂、およびポリプロピレン樹脂の中から選ばれる１種または２種以上が挙げられる。これにより、上記条件ａ～ｄを満たす離型フィルム１０が得られるようになる。 [Release layer]
The material of the release layer 1 may be one or more selected from polyester resin, poly 4-methyl-1-pentene resin, polyamide resin, and polypropylene resin. As a result, the release film 10 satisfying the above conditions a to d can be obtained.
　上記ポリエステル樹脂としては、例えば、ポリエチレンテレフタレート樹脂（ＰＥＴ）、ポリブチレンテレフタレート樹脂（ＰＢＴ）、ポリトリメチレンテレフタレート樹脂（ＰＴＴ）、ポリヘキサメチレンテレフタレート樹脂（ＰＨＴ）および、ポリエチレンナフタレート樹脂（ＰＥＮ）等が挙げられる。
　上記ポリアミド樹脂としては、例えば、脂肪族ポリアミド、芳香族ポリアミド等が挙げられる。脂肪族ポリアミドの具体例としては、ポリアミド６、ポリアミド６，６、ポリアミド６－６，６共重合体、ポリアミド１１、ポリアミド１２などが挙げられる。芳香族ポリアミドの具体例としては、ポリアミド６１、ポリアミド６６／６Ｔ、ポリアミド６Ｔ／６、ポリアミド１２／６Ｔなどが挙げられる。
　中でも、ポリエチレンテレフタレート樹脂、ポリブチレンテレフタレート樹脂、ポリアミド樹脂が好ましい。 Examples of the polyester resin include polyethylene terephthalate resin (PET), polybutylene terephthalate resin (PBT), polytrimethylene terephthalate resin (PTT), polyhexamethylene terephthalate resin (PHT), and polyethylene naphthalate resin (PEN). Can be mentioned.
Examples of the polyamide resin include aliphatic polyamides and aromatic polyamides. Specific examples of the aliphatic polyamide include polyamide 6, polyamide 6, 6, polyamide 6-6, 6 copolymer, polyamide 11, polyamide 12, and the like. Specific examples of the aromatic polyamide include polyamide 61, polyamide 66 / 6T, polyamide 6T / 6, polyamide 12 / 6T and the like.
Of these, polyethylene terephthalate resin, polybutylene terephthalate resin, and polyamide resin are preferable.
　また、離型層１として、延伸フィルムを使用してもよく、延伸は逐次二軸延伸、同時二軸延伸、およびチューブラー延伸等の公知の方法を用いて製造することができる。 Further, a stretched film may be used as the release layer 1, and the stretching can be produced by using known methods such as sequential biaxial stretching, simultaneous biaxial stretching, and tubular stretching.
　さらに、離型層１には、上記樹脂の他に、酸化防止剤、スリップ剤、アンチブロッキング剤、帯電防止剤、染料および顔料等の着色剤、安定剤等の添加剤、フッ素樹脂、シリコンゴム等の耐衝撃性付与剤、酸化チタン、炭酸カルシウムおよびタルク等の無機充填剤を含有させてもよい。 Further, in addition to the above resin, the release layer 1 contains antioxidants, slip agents, antiblocking agents, antistatic agents, colorants such as dyes and pigments, additives such as stabilizers, fluororesins, and silicon rubber. It may contain an impact resistance imparting agent such as, and an inorganic filler such as titanium oxide, calcium carbonate and talc.
　離型層１のＭＤ方向における離型面３の表面粗さＲｚは２μｍ～２０μｍが好ましく、５～２０μｍがより好ましく、８～２０μｍがさらに好ましい。
　表面粗さＲｚを上記下限値以上とすることにより、搬送時の滑りを良好にしてシワの発生を抑制しやすくなる。一方、表面粗さＲｚを上記上限値以下とすることにより、離型性と埋め込み性のバランスを良好にしつつ、離型フィルムの凹凸形状がＦＰＣに転写することを抑制できる。
　なお、離型層１の離型面３となる面とは、離型フィルムの使用時において対象物と接する面である。 The surface roughness Rz of the release surface 3 of the release layer 1 in the MD direction is preferably 2 μm to 20 μm, more preferably 5 to 20 μm, and even more preferably 8 to 20 μm.
By setting the surface roughness Rz to the above lower limit value or more, it becomes easy to improve the slip during transportation and suppress the occurrence of wrinkles. On the other hand, by setting the surface roughness Rz to the above upper limit value or less, it is possible to suppress the transfer of the uneven shape of the release film to the FPC while improving the balance between the releasability and the embedding property.
The surface of the release layer 1 that becomes the release surface 3 is a surface that comes into contact with the object when the release film is used.
　表面粗さの制御方法は、離型フィルム１０（または離型層１）の製造工程においてエンボス加工が施されたロールを用いてフィルムにエンボス模様を転写したり、離型層１の材料に粒子を配合する等、公知の方法で調整することができる。 As a method for controlling the surface roughness, an embossed pattern is transferred to the film using a roll embossed in the manufacturing process of the release film 10 (or the release layer 1), or particles are transferred to the material of the release layer 1. Can be adjusted by a known method such as blending.
　表面粗さＲｚは、ＪＩＳ　Ｂ０６０１　１９９４に準拠して測定される。 Surface roughness Rz is measured according to JIS B0601 1994.
　離型層１の厚みは、離型フィルム１０全体厚みに対して、５～５０％であることが好ましく、１００％であってもよい。
　離型層１の厚みを上記下限値以上とすることにより、離型フィルム１０の剛性を高め、過度に変形し、シワが発生することを抑制しやすくなる。 The thickness of the release layer 1 is preferably 5 to 50%, and may be 100%, with respect to the total thickness of the release film 10.
By setting the thickness of the release layer 1 to the above lower limit value or more, the rigidity of the release film 10 is increased, and it becomes easy to suppress excessive deformation and wrinkles.
　離型層１の厚みは、目的に応じて適宜設定されるが、例えば、３μｍ以上であってもよく、５μｍ以上であってもよく、一方、６０μｍ以下であってもよく、５０μｍ以下であってもよい。 The thickness of the release layer 1 is appropriately set according to the purpose, and may be, for example, 3 μm or more, 5 μm or more, and 60 μm or less, 50 μm or less. May be.
［多層構造］
　本実施形態における離型フィルム１０は、少なくとも一方の面に離型層１を有するものであればよく、上記の離型層１のみから構成されるものでもよく、他の機能を有する層を備える多層構造であってもよい。また、離型層１は、単層であってもよく、二層以上であってもよい。
　また、離型層が２層以上である場合、各離型層は互いに同じ材料から形成されたものであってもよく、異なる材料から形成されたものであってもよい。また、複数の離型層１は、互いに異なる厚みであってもよい。
　具体的には、例えば、離型フィルムの両面に異なる離型層を有する離型フィルムとしてもよい。この場合の離型フィルムを使用する際に対象物と接する面を有する方を離型層と言い、それ以外の面を副離型層と言うこともある。副離型層を有することにより、プレス機で熱プレスされた際に、熱板からの離型性が向上し、成形体やＦＰＣ等の積層体の製造における生産性を向上させることができる。また、例えば、離型フィルムは、離型層に接するクッション層をさらに有していてもよい。また、離型フィルムは、離型層、クッション層、及び副離型層の順で積層した三層構造としてもよい。
　また、他の機能を有する層として、接着層、ガスバリア層等が挙げられる。接着層、ガスバリア層としては、特に限定されず、公知のものを用いることができる。
　上記のクッション層について、以下、詳細を説明する。 [Multi-layer structure]
The release film 10 in the present embodiment may be one having the release layer 1 on at least one surface, may be composed of only the above-mentioned release layer 1, and may have a layer having another function. It may have a multi-layer structure. Further, the release layer 1 may be a single layer or two or more layers.
When the number of release layers is two or more, each release layer may be formed of the same material or may be formed of different materials. Further, the plurality of release layers 1 may have different thicknesses from each other.
Specifically, for example, a release film having different release layers on both sides of the release film may be used. When using the release film in this case, the one having a surface in contact with the object is referred to as a release layer, and the other surface may be referred to as a secondary release layer. By having the secondary mold release layer, when hot-pressed by a press machine, the mold release property from the hot plate is improved, and the productivity in the production of a molded body or a laminated body such as an FPC can be improved. Further, for example, the release film may further have a cushion layer in contact with the release layer. Further, the release film may have a three-layer structure in which a release layer, a cushion layer, and a secondary release layer are laminated in this order.
Further, examples of the layer having another function include an adhesive layer and a gas barrier layer. The adhesive layer and the gas barrier layer are not particularly limited, and known ones can be used.
The details of the cushion layer will be described below.
［クッション層］
　クッション層は、柔軟性を有する樹脂が用いられることにより、離型フィルム全体にクッション性を付与するものである。これにより、離型フィルム使用時において、被着体に対して、プレス熱板からの熱及び圧力が均等に伝わりやすくなり、離型フィルムと被着体との密着性及び埋め込み性をさらに良好にできる。 [Cushion layer]
The cushion layer is made of a flexible resin to impart cushioning property to the entire release film. As a result, when the release film is used, the heat and pressure from the press hot plate are easily transferred evenly to the adherend, and the adhesion and embedding property between the release film and the adherend are further improved. can.
　クッション層を形成する樹脂材料としては、ポリエチレン、ポリプロプレン等のα－オレフィン系重合体、エチレン、プロピレン、ブテン、ペンテン、ヘキセン、メチルペンテン等を重合体成分として有するα－オレフィン系共重合体、ポリエーテルスルホン、ポリフェニレンスルフィド等のエンジニアリングプラスチックス系樹脂が挙げられる。これらは、単独であるいは複数併用しても構わない。中でも、α－オレフィン系共重合体が好ましい。このα－オレフィン系共重合体としては、エチレン等のα－オレフィンと（メタ）アクリル酸エステルとの共重合体、エチレンと酢酸ビニルとの共重合体、エチレンと（メタ）アクリル酸との共重合体、およびそれらの部分イオン架橋物等が挙げられる。さらに、良好なクッション機能を得る観点から、エチレン等のα－オレフィン－（メタ）アクリル酸エステル共重合体を単独で用いたもの、または、ポリブチレンテレフタレートと１，４シクロヘキサンジメタノール共重合ポリエチレンテレフタレートとの混合物、α－オレフィン系重合体とエチレン等のα－オレフィン－（メタ）アクリル酸エステル共重合体との混合物が好ましい。たとえば、エチレンとエチレン－メチルメタクリレート共重合体（ＥＭＭＡ）との混合物、ポリプロピレン（ＰＰ）とエチレン－メチルメタクリレート共重合体（ＥＭＭＡ）との混合物、ポリブチレンテレフタレート（ＰＢＴ）とポリプロピレン（ＰＰ）とエチレン－メチルメタクリレート共重合体（ＥＭＭＡ）との混合物、などがより好ましい。 Examples of the resin material forming the cushion layer include α-olefin polymers such as polyethylene and polyproprene, and α-olefin copolymers containing ethylene, propylene, butene, pentene, hexene, methylpentene and the like as polymer components. Examples thereof include engineering plastics-based resins such as polyether sulfone and polyphenylene sulfide. These may be used alone or in combination of two or more. Of these, α-olefin-based copolymers are preferable. The α-olefin copolymer includes a copolymer of α-olefin such as ethylene and a (meth) acrylic acid ester, a copolymer of ethylene and vinyl acetate, and a copolymer of ethylene and (meth) acrylic acid. Examples thereof include polymers and partially ion-crosslinked products thereof. Further, from the viewpoint of obtaining a good cushioning function, an α-olefin- (meth) acrylic acid ester copolymer such as ethylene is used alone, or a polybutylene terephthalate and a 1,4 cyclohexanedimethanol copolymer polyethylene terephthalate. , And a mixture of an α-olefin polymer and an α-olefin- (meth) acrylic acid ester copolymer such as ethylene are preferable. For example, a mixture of ethylene and an ethylene-methylmethacrylate copolymer (EMMA), a mixture of polypropylene (PP) and an ethylene-methylmethacrylate copolymer (EMMA), polybutylene terephthalate (PBT), polypropylene (PP) and ethylene. -A mixture with a methyl methacrylate copolymer (EMMA), etc. is more preferable.
　クッション層は、さらにゴム成分を含んでもよい。ゴム成分としては、例えば、スチレン－ブタジエン共重合体、スチレン－イソプレン共重合体等のスチレン系熱可塑性エラストマー、オレフィン系熱可塑性エラストマー、アミド系エラストマー、ポリエステル系エラストマー等の熱可塑性エラストマー材料、天然ゴム、イソプレンゴム、クロロプレンゴム、シリコンゴム等のゴム材料等が挙げられる。 The cushion layer may further contain a rubber component. Examples of the rubber component include styrene-based thermoplastic elastomers such as styrene-butadiene copolymers and styrene-isoprene copolymers, olefin-based thermoplastic elastomers, amide-based elastomers, and thermoplastic elastomer materials such as polyester-based elastomers, and natural rubber. , Isoprene rubber, chloroprene rubber, rubber materials such as silicon rubber and the like.
　クッション層には、酸化防止剤、スリップ剤、アンチブロッキング剤、帯電防止剤、染料および顔料等の着色剤、安定剤等の添加剤、フッ素樹脂、シリコンゴム等の耐衝撃性付与剤、酸化チタン、炭酸カルシウム、タルク等の無機充填剤を含有させてもよい。 Antioxidants, slip agents, anti-blocking agents, antistatic agents, colorants such as dyes and pigments, additives such as stabilizers, impact resistance imparting agents such as fluororesin and silicone rubber, and titanium oxide are used for the cushion layer. , Calcium carbonate, talc and other inorganic fillers may be contained.
　なお、クッション層を形成する方法としては、例えば、空冷または水冷インフレーション押出法、Ｔダイ押出法等の公知の方法が挙げられる。 Examples of the method for forming the cushion layer include known methods such as an air-cooled or water-cooled inflation extrusion method and a T-die extrusion method.
　クッション層の厚さは、目的に応じて適宜設定されるが、離型フィルムの全体厚に対して、３０～９５％が好ましく、５０～９０％がより好ましい。
　また、クッション層の厚みは、例えば、２０μｍ以上１３０μｍ以下が好ましく、４０μｍ以上１２０μｍ以下がより好ましく、５０μｍ以上１１０μｍ以下がさらに好ましい。クッション層の厚さが上記下限値以上である場合には、離型フィルムのクッション性が低下することを抑制できる。クッション層の厚さが上記上限値以下である場合には、離型性の低下を抑制することができる。 The thickness of the cushion layer is appropriately set according to the purpose, but is preferably 30 to 95%, more preferably 50 to 90%, based on the total thickness of the release film.
The thickness of the cushion layer is, for example, preferably 20 μm or more and 130 μm or less, more preferably 40 μm or more and 120 μm or less, and further preferably 50 μm or more and 110 μm or less. When the thickness of the cushion layer is at least the above lower limit value, it is possible to suppress the deterioration of the cushioning property of the release film. When the thickness of the cushion layer is not more than the above upper limit value, the decrease in releasability can be suppressed.
＜離型フィルムの製造方法＞
　本実施形態の離型フィルムの製造方法は、特に限定されず、例えば、離型層とクッション層を、または離型層と、クッション層と副離型層を、別々に製造してから、ラミネーター等により接合して離型フィルムを得てもよく、そのまま接合してもよく、接着層を介して互いに接合してもよい。または、例えば、離型層とクッション層を、または離型層と、クッション層と副離型層を、空冷式または水冷式共押出インフレーション法、共押出Ｔダイ法で製膜する方法で離型フィルムを得てもよい。なかでも共押出Ｔダイ法で製膜する方法が各層の厚さ制御に優れる点で好適である。
　以下、離型フィルムが離型層のみからなる場合について、当該離型フィルム（離型層）をＴダイ押出法により製造する方法について説明する。 <Manufacturing method of release film>
The method for producing the release film of the present embodiment is not particularly limited, and for example, the release layer and the cushion layer, or the release layer and the cushion layer and the secondary release layer are separately produced, and then the laminator. The release film may be obtained by joining with or the like, or may be joined as it is, or may be joined to each other via an adhesive layer. Alternatively, for example, the release layer and the cushion layer, or the release layer and the cushion layer and the sub-release layer are separated by an air-cooled or water-cooled coextrusion inflation method or a coextrusion T-die method. You may obtain a film. Among them, the method of forming a film by the coextrusion T-die method is preferable because it is excellent in controlling the thickness of each layer.
Hereinafter, when the release film is composed of only the release layer, a method for producing the release film (release layer) by the T-die extrusion method will be described.
　図２は、本実施形態の離型フィルムの製造装置の一例を模式的に示す断面図である。
　図２に示すように、離型層の原材料が加熱溶融された溶融物Ｍは、ダイス５１０を通過しフィルム状に成形されたのち、第１ロール５３０に誘導されると共にタッチロール５２０によって第１ロール５３０に固定化され、第１ロール５３０から脱離するまでの間に第１ロール５３０により冷却され、離型フィルム２００となる。その後、離型フィルム２００は、第２ロール５４０によりフィルム送り方向（図１の矢印参照）下流側に送られ、最終的に巻取ロール（図示せず）に巻き取られる。
　このとき、第１ロール５３０の温度は６０～１１０℃、タッチロール５２０の温度は２０～５０℃、第２ロール５４０の温度は６０～９０℃とすることが重要となる。各ロールの温度を上記のような範囲とすることで、フィルム状の溶融物Ｍが徐々に冷却されるようになるため、離型フィルム２００の結晶性を高くすることができる。すなわち、離型層の結晶性が高くなる結果、動摩擦係数を小さくしやすくなり、また耐熱性を高め、弾性率を向上しやすくなる。その結果、適度な弾性が得られ、上記条件ｂ～ｄの貯蔵弾性率、損失弾性率、ｔａｎδを制御できるようになる。また、巻取速度は、安定的に徐冷効果を得るために、２０～６０ｍ／ｓが好ましい。
　さらに、表面にエンボス加工を施したタッチロール５２０を用いることにより、ダイス５１０を通過したフィルム表面に凹凸を付与する。一方、タッチロールを用いずに、エアナイフを用いることで、表面粗さを低くすることができる。
　その結果、最終的に得られる離型フィルムの離型層の表面状態を制御することで、上記条件ａ～dを満たす離型フィルムが得られる。 FIG. 2 is a cross-sectional view schematically showing an example of the release film manufacturing apparatus of the present embodiment.
As shown in FIG. 2, the melt M obtained by heating and melting the raw material of the release layer passes through the die 510, is formed into a film, is guided to the first roll 530, and is first guided by the touch roll 520. It is immobilized on the roll 530 and cooled by the first roll 530 until it is detached from the first roll 530 to become the release film 200. After that, the release film 200 is fed by the second roll 540 to the downstream side in the film feeding direction (see the arrow in FIG. 1), and is finally wound into a take-up roll (not shown).
At this time, it is important that the temperature of the first roll 530 is 60 to 110 ° C, the temperature of the touch roll 520 is 20 to 50 ° C, and the temperature of the second roll 540 is 60 to 90 ° C. By setting the temperature of each roll in the above range, the film-like melt M is gradually cooled, so that the crystallinity of the release film 200 can be increased. That is, as a result of increasing the crystallinity of the release layer, it becomes easy to reduce the dynamic friction coefficient, and it becomes easy to increase the heat resistance and the elastic modulus. As a result, appropriate elasticity is obtained, and the storage elastic modulus, loss elastic modulus, and tan δ under the above conditions b to d can be controlled. The winding speed is preferably 20 to 60 m / s in order to obtain a stable slow cooling effect.
Further, by using the touch roll 520 whose surface is embossed, unevenness is imparted to the surface of the film that has passed through the die 510. On the other hand, the surface roughness can be reduced by using an air knife without using a touch roll.
As a result, by controlling the surface state of the release layer of the finally obtained release film, a release film satisfying the above conditions a to d can be obtained.
　なお、上記では、離型フィルムが離型層のみからなる場合について説明したが、離型フィルムが離型層以外の層を有する多層構造であっても、構わない。すなわち、離型層を製造する過程において、各ロールの温度管理を行い、かつ離型層へ適切な凹凸加工を行うことで条件ａ～ｄを満たす離型フィルムを得ることができる。 In the above, the case where the release film is composed of only the release layer has been described, but the release film may have a multilayer structure having a layer other than the release layer. That is, in the process of manufacturing the release layer, the release film satisfying the conditions a to d can be obtained by controlling the temperature of each roll and appropriately performing uneven processing on the release layer.
＜離型フィルムの使用方法＞
　本実施形態の離型フィルムは、たとえば、フレキシブルプリント回路基板を作製する際に使用してもよい。この場合、離型フィルムは、フレキシブルフィルム上に形成された回路を保護するため、当該回路に対してカバーレイフィルムを加熱プレスして密着させる際に、カバーレイとプレス機との間に介在させて使用する。
　具体的には、離型フィルムは、例えば、フレキシブルプリント配線基板の製造工程の一つであるカバーレイプレスラミネート工程において用いられる。より詳細には、離型フィ
ルムは、回路露出フィルムへのカバーレイフィルム接着時にカバーレイフィルムを回路パターンの凹凸部に密着させるためにカバーレイフィルムを包むように配置され、回路露出フィルム及びカバーレイフィルムと共にプレス機により加熱加圧される。この時、クッション性の向上のために、紙、ゴム、フッ素樹脂シート、ガラスペーパー等、またはこれらを組合せたものを離型フィルムとプレス機の間に挿入した上で加熱加圧することもできる。プレス機は、１７５℃まで昇温した熱板にサンプルをセットした後加圧を開始し、２分間その温度に維持し、その後、加圧を終了し、サンプル取り出し・解体を行う。このときのプレス圧力は、５～１５ＭＰａで適宜調節される。 <How to use the release film>
The release film of this embodiment may be used, for example, when manufacturing a flexible printed circuit board. In this case, in order to protect the circuit formed on the flexible film, the release film is interposed between the coverlay and the press machine when the coverlay film is heat-pressed and brought into close contact with the circuit. To use.
Specifically, the release film is used, for example, in a coverlay press laminating process, which is one of the manufacturing processes of a flexible printed wiring board. More specifically, the release film is arranged so as to wrap the coverlay film in order to bring the coverlay film into close contact with the uneven portion of the circuit pattern when the coverlay film is adhered to the circuit exposed film. At the same time, it is heated and pressurized by a press machine. At this time, in order to improve the cushioning property, paper, rubber, a fluororesin sheet, glass paper, or a combination thereof may be inserted between the release film and the press and then heated and pressed. The press machine sets the sample on a hot plate heated to 175 ° C., starts pressurization, maintains the temperature for 2 minutes, then ends pressurization, and takes out and disassembles the sample. The press pressure at this time is appropriately adjusted at 5 to 15 MPa.
　また、本実施形態の離型フィルムは、以下の方法で使用してもよい。
　まず、熱硬化性樹脂を含む材料によって形成されている対象物の表面に対して、上記本実施形態に係る離型フィルムの離型層表面を配置する。そして、離型フィルムを配置した対象物に対し、金型内でプレス処理を行う。ここで、上述した熱硬化性樹脂は、半硬化状態であっても、硬化状態であってもよいが、半硬化状態であると、当該離型フィルムの作用効果が一層顕著なものとなる。特に、熱硬化性樹脂がエポキシ樹脂を含む樹脂組成物である場合には、当該エポキシ樹脂が、硬化反応の中間の段階にあること、すなわち、Ｂステージ状態にあることが好ましい。 Further, the release film of the present embodiment may be used by the following method.
First, the release layer surface of the release film according to the present embodiment is arranged on the surface of an object formed of a material containing a thermosetting resin. Then, the object on which the release film is placed is pressed in the mold. Here, the thermosetting resin described above may be in a semi-cured state or a cured state, but in the semi-cured state, the action and effect of the release film becomes more remarkable. In particular, when the thermosetting resin is a resin composition containing an epoxy resin, it is preferable that the epoxy resin is in the middle stage of the curing reaction, that is, in the B stage state.
　以上、本発明の実施形態について述べたが、これらは本発明の例示であり、上記以外の様々な構成を採用することもできる。また、本発明は上述の実施形態に限定されるものではなく、本発明の目的を達成できる範囲での変形、改良等は本発明に含まれる。 Although the embodiments of the present invention have been described above, these are examples of the present invention, and various configurations other than the above can be adopted. Further, the present invention is not limited to the above-described embodiment, and modifications, improvements, and the like to the extent that the object of the present invention can be achieved are included in the present invention.
　以下、本発明を実施例および比較例により説明するが、本発明はこれらに限定されるものではない。 Hereinafter, the present invention will be described with reference to Examples and Comparative Examples, but the present invention is not limited thereto.
［原材料の準備］
　離型フィルムを製造するための原材料として、それぞれ、以下のものを用意した。
・熱可塑性樹脂材料
　ポリ４－メチル１－ペンテン樹脂Ｉ（ＴＰＸ、三井化学社製、「ＤＸ８２０」）
　ポリ４－メチル１－ペンテン樹脂ＩＩ（ＴＰＸ、三井化学社製、「ＲＴ１８」）
　ポリブチレンテレフタレート樹脂Ｉ（ＰＢＴ、長春石油化学社製、「１１００－６３０Ｓ」）
　ポリブチレンテレフタレート樹脂ＩＩ（ＰＢＴ、長春石油化学社製、「１１００－２１１Ｈ」）
　ポリブチレンテレフタレート樹脂ＩＩＩ（ＰＢＴ、三菱エンジニアリングプラスチックス社製、「ノバデュラン、５５０５Ｓ」）
　低密度ポリエチレン（ＬＤＰＥ、宇部丸善ポリエチレン社製、「Ｒ３００Ａ」）
　ポリプロピレン（ＰＰ、住友化学社製、「ＦＨ１０１６」）
　エチレン－ビニル酢酸共重合体（ＥＶＡ、三井・ダウ　ポリケミカル社製：「エバフレックス　Ｖ５９６１」） [Preparation of raw materials]
The following materials were prepared as raw materials for producing a release film.
-Thermoplastic resin material Poly 4-methyl 1-pentene resin I (TPX, manufactured by Mitsui Chemicals, Inc., "DX820")
Poly 4-methyl 1-pentene resin II (TPX, manufactured by Mitsui Chemicals, Inc., "RT18")
Polybutylene terephthalate resin I (PBT, manufactured by Changchun Petrochemical Co., Ltd., "1100-630S")
Polybutylene terephthalate resin II (PBT, manufactured by Changchun Petrochemical Co., Ltd., "1100-211H")
Polybutylene terephthalate resin III (PBT, manufactured by Mitsubishi Engineering Plastics, "Novaduran, 5505S")
Low density polyethylene (LDPE, manufactured by Ube Maruzen Polyethylene, "R300A")
Polypropylene (PP, manufactured by Sumitomo Chemical Co., Ltd., "FH1016")
Ethylene-vinyl acetate copolymer (EVA, manufactured by Mitsui Dow Polychemical Co., Ltd .: "Evaflex V5961")
＜実施例１＞
　まず、第１熱可塑性樹脂組成物および第２熱可塑性樹脂組成物として、それぞれ、ポリ４－メチル１－ペンテン樹脂Ｉ（ＤＸ８２０）で構成されるものを用意した。また、第３熱可塑性樹脂組成物として、低密度ポリエチレン（Ｒ３００Ａ）５０重量部と、ポリプロピレン（ＦＨ１０１６）３０重量部と、ポリ４－メチル１－ペンテン樹脂Ｉ２０重量部とで構成されるものを用意した。
　次いで、第１熱可塑性樹脂組成物、第３熱可塑性樹脂組成物および第２熱可塑性樹脂組成物を用いて、押出機のＴダイ内で積層させて１つの溶融樹脂積層体を形成後、冷却固化して、第１熱可塑性樹脂組成物からなる第１離型層と、第３熱可塑性樹脂組成物からなるクッション層と、第２熱可塑性樹脂組成物からなる第２離型層とがこの順で積層された積層体を形成し、離型フィルムを得た。
　また、離型フィルムの作製には、図２に示すような製造装置を用い、エンボス加工が施されたタッチロール５２０の温度を５０℃、第１ロール５３０の温度を１１０℃とし、第２ロール５４０の温度を６０℃とした。巻取速度は、２０ｍ／ｓとした。
　なお、得られた離型フィルムにおいて、第１離型層の平均厚さは２５μｍ、クッション層の平均厚さは７０μｍ、第２離型層の平均厚さは２５μｍであった。 <Example 1>
First, as the first thermoplastic resin composition and the second thermoplastic resin composition, those each composed of poly 4-methyl-1-pentene resin I (DX820) were prepared. Further, as the third thermoplastic resin composition, a composition composed of 50 parts by weight of low-density polyethylene (R300A), 30 parts by weight of polypropylene (FH1016), and 20 parts by weight of poly 4-methyl-1-pentene resin I is prepared. bottom.
Next, using the first thermoplastic resin composition, the third thermoplastic resin composition, and the second thermoplastic resin composition, they are laminated in the T-die of the extruder to form one molten resin laminate, and then cooled. The solidified first release layer made of the first thermoplastic resin composition, the cushion layer made of the third thermoplastic resin composition, and the second release layer made of the second thermoplastic resin composition are the same. A laminated body laminated in order was formed, and a release film was obtained.
Further, in order to produce the release film, a manufacturing apparatus as shown in FIG. 2 is used, the temperature of the embossed touch roll 520 is set to 50 ° C, the temperature of the first roll 530 is set to 110 ° C, and the temperature of the second roll is set to 110 ° C. The temperature of 540 was set to 60 ° C. The winding speed was 20 m / s.
In the obtained release film, the average thickness of the first release layer was 25 μm, the average thickness of the cushion layer was 70 μm, and the average thickness of the second release layer was 25 μm.
＜実施例２＞
　まず、第１熱可塑性樹脂組成物および第２熱可塑性樹脂組成物として、それぞれ、ポリ４－メチル１－ペンテン樹脂ＩＩ（ＲＴ１８）で構成されるものを用意した。また、第３熱可塑性樹脂組成物として、エチレン－ビニル酢酸共重合体（Ｖ５９２１）４０重量部と、ポリプロピレン（ＦＨ１０１６）３０重量部と、ポリ４－メチル１－ペンテン樹脂Ｉ３０重量部とで構成されるものを用意した。
　次いで、第１熱可塑性樹脂組成物、第３熱可塑性樹脂組成物および第２熱可塑性樹脂組成物を用いて、押出機のＴダイ内で積層させて、１つの溶融樹脂積層体を形成後、冷却固化して、第１熱可塑性樹脂組成物からなる第１離型層と、第３熱可塑性樹脂組成物からなるクッション層と、第２熱可塑性樹脂組成物からなる第２離型層とがこの順で積層された積層体を形成し、離型フィルムを得た。
　また、離型フィルムの作製には、図２に示すような製造装置を用い、タッチロール５２０の温度を５０℃、第１ロール５３０の温度を９０℃とし、第２ロール５４０の温度を６０℃とした。巻取速度は、２２ｍ／ｓとした。
　なお、得られた離型フィルムにおいて、第１離型層の平均厚さは１０μｍ、クッション層の平均厚さは１００μｍ、第２離型層の平均厚さは１０μｍであった。 <Example 2>
First, as the first thermoplastic resin composition and the second thermoplastic resin composition, those each composed of poly4-methyl-1-pentene resin II (RT18) were prepared. The third thermoplastic resin composition is composed of 40 parts by weight of the ethylene-vinyl acetate copolymer (V5921), 30 parts by weight of polypropylene (FH1016), and 30 parts by weight of the poly 4-methyl-1-pentene resin I. I prepared something.
Next, using the first thermoplastic resin composition, the third thermoplastic resin composition, and the second thermoplastic resin composition, they are laminated in the T-die of the extruder to form one molten resin laminate, and then. After being cooled and solidified, the first release layer made of the first thermoplastic resin composition, the cushion layer made of the third thermoplastic resin composition, and the second release layer made of the second thermoplastic resin composition are formed. A laminated body laminated in this order was formed, and a release film was obtained.
Further, in order to produce the release film, a manufacturing apparatus as shown in FIG. 2 is used, the temperature of the touch roll 520 is set to 50 ° C, the temperature of the first roll 530 is set to 90 ° C, and the temperature of the second roll 540 is set to 60 ° C. And said. The winding speed was 22 m / s.
In the obtained release film, the average thickness of the first release layer was 10 μm, the average thickness of the cushion layer was 100 μm, and the average thickness of the second release layer was 10 μm.
＜実施例３＞
　まず、第１熱可塑性樹脂組成物および第２熱可塑性樹脂組成物として、それぞれ、ポリブチレンテレフタレート樹脂Ｉ（１１００－６３０Ｓ）５０質量部と、ポリブチレンテレフタレート樹脂ＩＩＩ（５５０５Ｓ）５０質量部で構成されるものを用意した。また、第３熱可塑性樹脂組成物として、エチレン－ビニル酢酸共重合体（Ｖ５９２１）５０重量部と、ポリプロピレン（ＦＨ１０１６）３０重量部と、ポリブチレンテレフタレート樹脂Ｉ（１１００－６３０Ｓ）２０重量部とで構成されるものを用意した。
　次いで、第１熱可塑性樹脂組成物、第３熱可塑性樹脂組成物および第２熱可塑性樹脂組成物を用いて、押出機のＴダイ内で積層させて、１つの溶融樹脂積層体を形成後、冷却固化して、第１熱可塑性樹脂組成物からなる第１離型層と、第３熱可塑性樹脂組成物からなるクッション層と、第２熱可塑性樹脂組成物からなる第２離型層とがこの順で積層された積層体を形成し、離型フィルムを得た。
　また、離型フィルムの作製には、図２に示すような製造装置を用い、タッチロール５２０の温度を５０℃、第１ロール５３０の温度を９０℃とし、第２ロール５４０の温度を６０℃とした。巻取速度は、２５ｍ／ｓとした。
　なお、得られた離型フィルムにおいて、第１離型層の平均厚さは２０μｍ、クッション層の平均厚さは７０μｍ、第２離型層の平均厚さは２０μｍであった。 <Example 3>
First, the first thermoplastic resin composition and the second thermoplastic resin composition are composed of 50 parts by mass of polybutylene terephthalate resin I (1100-630S) and 50 parts by mass of polybutylene terephthalate resin III (5505S), respectively. I prepared something. Further, as the third thermoplastic resin composition, 50 parts by weight of the ethylene-vinyl acetate copolymer (V5921), 30 parts by weight of polypropylene (FH1016), and 20 parts by weight of the polybutylene terephthalate resin I (1100-630S) are used. I prepared what is composed.
Next, using the first thermoplastic resin composition, the third thermoplastic resin composition, and the second thermoplastic resin composition, they are laminated in the T-die of the extruder to form one molten resin laminate, and then. After being cooled and solidified, the first release layer made of the first thermoplastic resin composition, the cushion layer made of the third thermoplastic resin composition, and the second release layer made of the second thermoplastic resin composition are formed. A laminated body laminated in this order was formed, and a release film was obtained.
Further, in order to produce the release film, a manufacturing apparatus as shown in FIG. 2 is used, the temperature of the touch roll 520 is set to 50 ° C, the temperature of the first roll 530 is set to 90 ° C, and the temperature of the second roll 540 is set to 60 ° C. And said. The winding speed was 25 m / s.
In the obtained release film, the average thickness of the first release layer was 20 μm, the average thickness of the cushion layer was 70 μm, and the average thickness of the second release layer was 20 μm.
＜実施例４＞
　第１熱可塑性樹脂組成物および第２熱可塑性樹脂組成物として、それぞれ、ポリ４－メチル１－ペンテン樹脂ＩＩ（ＲＴ１８）で構成されるものを用意し、巻取速度は、２５ｍ／ｓとした以外は実施例１と同様にして離型フィルムを作成した。
　なお、得られた離型フィルムにおいて、第１離型層の平均厚さは１２μｍ、クッション層の平均厚さは４６μｍ、第２離型層の平均厚さは１２μｍであった。 <Example 4>
As the first thermoplastic resin composition and the second thermoplastic resin composition, those each composed of poly4-methyl-1-pentene resin II (RT18) were prepared, and the winding speed was 25 m / s. A release film was prepared in the same manner as in Example 1 except for the above.
In the obtained release film, the average thickness of the first release layer was 12 μm, the average thickness of the cushion layer was 46 μm, and the average thickness of the second release layer was 12 μm.
＜比較例１＞
　図２に示す製造装置を用いてフィルムを作製した際の、タッチロール５２０を用いず、エアナイフで第１ロール５３０に固定した以外は、実施例１と同様にして、離型フィルムを作製した。 <Comparative Example 1>
A release film was produced in the same manner as in Example 1 except that the touch roll 520 was not used and the film was fixed to the first roll 530 with an air knife when the film was produced using the manufacturing apparatus shown in FIG.
＜比較例２＞
　第１熱可塑性樹脂組成物および第２熱可塑性樹脂組成物として、ポリブチレンテレフタレート樹脂ＩＩ（１１００－２１１Ｈ）で構成されるものを用意した以外は、実施例３と同様にして離型フィルムを作製した。 <Comparative Example 2>
A release film was prepared in the same manner as in Example 3 except that the first thermoplastic resin composition and the second thermoplastic resin composition were composed of polybutylene terephthalate resin II (1100-211H). bottom.
　各実施例で得られた離型フィルムについて、以下の測定、および評価を行った。評価結果を表１に示す。
　なお、動的粘弾性測定装置としては、ＤＭＳ６１００（エスアイアイ・ナノテクノロジー社製）を用いた。 The following measurements and evaluations were performed on the release films obtained in each example. The evaluation results are shown in Table 1.
As the dynamic viscoelasticity measuring device, DMS6100 (manufactured by SII Nanotechnology) was used.
［測定］
（ａ）動摩擦係数
　一の前記離型フィルムを幅６．５ｃｍ、長さ１７ｃｍの大きさにカットし、前記離型層が上側となるようにして水平な台の上に貼り付け、他の前記離型フィルムを、前記離型層が外側となるようにして６３ｃｍ角、重量２０２ｇのおもりに巻き付けた。前記一の離型フィルム上に前記他の離型フィルムが巻き付いた前記おもりを載せ、室温２３±１℃、湿度５０±０．５％ＲＨの雰囲気下で、１５０ｍｍ／ｍｉｎの速度で当該おもりを水平方向へ移動させて摩擦力を測定し、５ｃｍ移動させた点での摩擦係数を求めた。これを３回繰り返し、平均値を動摩擦係数とした。 [measurement]
(A) The release film having a dynamic friction coefficient of 1 is cut into a size of 6.5 cm in width and 17 cm in length, and attached on a horizontal table with the release layer on the upper side. The release film was wrapped around a weight of 63 cm square and a weight of 202 g so that the release layer was on the outside. The weight on which the other release film is wound is placed on the one release film, and the weight is placed at a speed of 150 mm / min in an atmosphere of room temperature 23 ± 1 ° C. and humidity 50 ± 0.5% RH. The frictional force was measured by moving in the horizontal direction, and the coefficient of friction at the point moved by 5 cm was obtained. This was repeated 3 times, and the average value was taken as the dynamic friction coefficient.
（ｂ）ｔａｎδ
　ＭＤ方向に厚さ１００μｍ、幅４ｍｍ、長さ２０ｍｍに成形した前記離型フィルムを、動的粘弾性測定装置で、引張りモード、周波数１Ｈｚ、昇温速度５℃／ｍｉｎで測定したときの、５０℃でのｔａｎδ５０、１７５℃以下でのｔａｎδ１７５をそれぞれ求めた。 (B) tanδ
50 when the release film molded into a thickness of 100 μm, a width of 4 mm, and a length of 20 mm in the MD direction was measured with a dynamic viscoelasticity measuring device in a tensile mode, a frequency of 1 Hz, and a temperature rise rate of 5 ° C./min. The tan δ 50 at ° C. and the tan δ 175 at 175 ° C. or lower were obtained, respectively.
（ｃ）貯蔵弾性率
　ＭＤ方向に厚さ１００μｍ、幅４ｍｍ、長さ２０ｍｍに成形した前記離型フィルムを、動的粘弾性測定装置で、引張りモード、周波数１Ｈｚ、昇温速度５℃／ｍｉｎで測定したときの、１７５℃での貯蔵弾性率を求めた。 (C) Storage elastic modulus The release film formed into a thickness of 100 μm, a width of 4 mm, and a length of 20 mm in the MD direction is subjected to a dynamic viscoelasticity measuring device in a tensile mode, a frequency of 1 Hz, and a temperature rise rate of 5 ° C./min. The storage elastic modulus at 175 ° C. at the time of measurement was determined.
（ｄ）損失弾性率
　ＭＤ方向に厚さ１００μｍ、幅４ｍｍ、長さ２０ｍｍに成形した前記離型フィルムを、動的粘弾性測定装置で、引張りモード、周波数１Ｈｚ、昇温速度５℃／ｍｉｎで測定したときの、１７５℃での損失弾性率を求めた。 (D) Loss elastic modulus The release film formed into a thickness of 100 μm, a width of 4 mm, and a length of 20 mm in the MD direction is subjected to a dynamic viscoelasticity measuring device in a tensile mode, a frequency of 1 Hz, and a temperature rise rate of 5 ° C./min. The loss elastic modulus at 175 ° C. at the time of measurement was determined.
（表面粗さＲｚ）
　離型フィルムの離型層側の面のＭＤ方向について、ＪＩＳ　Ｂ０６０１　１９９４に準拠して測定した。 (Surface roughness Rz)
The MD direction of the surface of the release film on the release layer side was measured according to JIS B0601 1994.
［評価］
（外観シワ：追従性））
　Ｌ／Ｓが１００／１００μｍの電気配線が形成された絶縁基板（ＦＰＣ）表面に対し、接着剤がコーティングされている側の面が接触するように開口部を有するカバーレイを仮止めした試験片を作製した。次いで、離型フィルムを試験片に１７５℃、１１ＭＰａ、１２０ｓｅｃの条件でロールツーロールプレス機にて加圧貼付して、加圧直後に２００ｍｍ／ｓで搬送しつつ、前記試験片と当該離型フィルムとを引き剥がした。試験片表面について、ＪＰＣＡ規格の「７．５．７．２項しわ」に準じて測定した。
◎：シワ発生率　１．０％未満
○：シワ発生率　１．０％以上、２．０％未満
×：シワ発生率　２．０％以上 [evaluation]
(Appearance wrinkles: followability))
A test piece in which a coverlay having an opening is temporarily fixed so that the surface on the side coated with the adhesive comes into contact with the surface of an insulating substrate (FPC) on which an electric wiring having an L / S of 100/100 μm is formed. Was produced. Next, the release film was pressure-bonded to the test piece under the conditions of 175 ° C., 11 MPa, and 120 sec with a roll-to-roll press machine, and immediately after the pressure was applied, the test piece and the mold release film were conveyed at 200 mm / s. I peeled off the film. The surface of the test piece was measured according to "7.5.7.2 wrinkles" of the JPCA standard.
⊚: Wrinkle occurrence rate less than 1.0% ○: Wrinkle occurrence rate 1.0% or more, less than 2.0% ×: Wrinkle occurrence rate 2.0% or more
（埋め込み性：接着剤流れ出し）
　まず、有沢製作所製のカバーレイ（ＣＭタイプ）に１ｍｍ角の開口部を作成した。次に、フレキシブル配線板用銅張積板の表面に対して、接着剤がコーティングされている側の面が接触するように上記開口部を有するカバーレイを仮止めした試験片を作製した。次いで、離型フィルムにおける第１の離型層の第１の離型面が、上記試験片のカバーレイを有する側の面と対向するように、上記離型フィルムと、上記試験片とを重ねあわせた後、真空条件下１７５℃、２ＭＰａ、真空引き２０秒、２分間の熱プレス処理を施し、成型品を得た。このようにして得られた成型品について、カバーレイに形成した開口部内に、該カバーテープの表面にコーティングされている接着剤が上記開口部の外縁部からしみ出した形状（接着剤のしみだし形状）を観察し、以下の基準に基づいて埋め込み性を評価した。
◎：接着剤のしみだし形状の凹凸差が、７０μｍ未満であった。
○：接着剤のしみだし形状の凹凸差が、７０μｍ以上、１００μｍ未満であった。
×：接着剤のしみだし形状の凹凸差が、１００μｍ以上であった。 (Embedability: Adhesive flow out)
First, a 1 mm square opening was created in a coverlay (CM type) manufactured by Arisawa Mfg. Co., Ltd. Next, a test piece was prepared in which a coverlay having the above-mentioned opening was temporarily fixed so that the surface on the side coated with the adhesive was in contact with the surface of the copper upholstered plate for a flexible wiring board. Next, the release film and the test piece are overlapped so that the first release surface of the first release layer in the release film faces the surface of the test piece on the side having the coverlay. After the combination, a hot press treatment was performed under vacuum conditions at 175 ° C., 2 MPa, vacuuming for 20 seconds, and 2 minutes to obtain a molded product. With respect to the molded product thus obtained, the adhesive coated on the surface of the cover tape has a shape (adhesive exudation) that has exuded from the outer edge of the opening in the opening formed in the coverlay. The shape) was observed, and the implantability was evaluated based on the following criteria.
⊚: The difference in unevenness of the exuded shape of the adhesive was less than 70 μm.
◯: The difference in unevenness of the exuded shape of the adhesive was 70 μm or more and less than 100 μm.
X: The difference in unevenness of the exuded shape of the adhesive was 100 μm or more.
（離型性）
　Ｌ／Ｓが１００／１００μｍの電気配線が形成された絶縁基板（ＦＰＣ）表面に対し、接着剤がコーティングされている側の面が接触するように開口部を有するカバーレイを仮止めした試験片を作製した。次いで、離型フィルムにおける第１の離型層の第１の離型面が、上記試験片のカバーレイを有する側の面と対向するように、上記離型フィルムと、上記試験片とを重ねあわせた後、真空条件下１７５℃、２ＭＰａ、真空引き２０秒、２分間の熱プレス処理を施し、成型品を得た。
　引っ張り試験機（エーアンドデイ社製Ｆｏｒｃｅ　ｇａｕｇｅ　ＡＤ－４９３２Ａ－５０Ｎ）を用いて、１８０°方向に約１０００ｍｍ／分の速度で、離型面とサンプルの剥離力を測定した。測定はプレス直後に実施し、以下の基準に基づいて離型性を評価した。評価結果を表１に示す。
◎：０．５Ｎ以下
○：０．５Ｎ超１．０Ｎ未満
×：１．０Ｎ以上 (Releasability)
A test piece in which a coverlay having an opening is temporarily fixed so that the surface on the side coated with the adhesive comes into contact with the surface of an insulating substrate (FPC) on which an electric wiring having an L / S of 100/100 μm is formed. Was produced. Next, the release film and the test piece are overlapped so that the first release surface of the first release layer in the release film faces the surface of the test piece on the side having the coverlay. After the combination, a hot press treatment was performed under vacuum conditions at 175 ° C., 2 MPa, vacuuming for 20 seconds, and 2 minutes to obtain a molded product.
Using a tensile tester (Force gauge AD-4932A-50N manufactured by A & D Co., Ltd.), the peeling force between the release surface and the sample was measured at a speed of about 1000 mm / min in the 180 ° direction. The measurement was carried out immediately after pressing, and the releasability was evaluated based on the following criteria. The evaluation results are shown in Table 1.
⊚: 0.5N or less ○: More than 0.5N and less than 1.0N ×: 1.0N or more
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
　この出願は、２０２０年１０月２１日に出願された日本出願特願２０２０－１７６５７７号を基礎とする優先権を主張し、その開示の全てをここに取り込む。 This application claims priority on the basis of Japanese Application Japanese Patent Application No. 2020-176577 filed on October 21, 2020, and incorporates all of its disclosures herein.
１　離型層
３　離型面
１０　離型フィルム
２００　離型フィルム
５１０　ダイス
５２０　タッチロール
５３０　第１ロール
５４０　第２ロール 1 Release layer 3 Release surface 10 Release film 200 Release film 510 Die 520 Touch roll 530 1st roll 540 2nd roll

Claims (9)

  1. 　少なくとも一方の面に離型層を備える離型フィルムであって、
    　前記離型層は、ポリエステル樹脂、ポリ４－メチル１－ペンテン樹脂、ポリアミド樹脂、およびポリプロピレン樹脂の中から選ばれる１種または２種以上を含み、
    　以下の条件で測定した動摩擦係数が０．０１以上、０．７以下である、離型フィルム。
    （条件）
    　一の前記離型フィルムを幅６．５ｃｍ、長さ１７ｃｍの大きさにカットし、前記離型層が上側となるようにして水平な台の上に貼り付け、他の前記離型フィルムを、前記離型層が外側となるようにして６３ｃｍ角、重量２０２ｇのおもりに巻き付ける。前記一の離型フィルム上に前記他の離型フィルムが巻き付いた前記おもりを載せ、室温２３±１℃、湿度５０±０．５％ＲＨの雰囲気下で、１５０ｍｍ／ｍｉｎの速度で当該おもりを水平方向へ移動させて摩擦力を測定し、５ｃｍ移動させた点での摩擦係数を動摩擦係数とする。     A mold release film having a mold release layer on at least one surface.
    The release layer contains one or more selected from polyester resin, poly 4-methyl-1-pentene resin, polyamide resin, and polypropylene resin.
    A release film having a dynamic friction coefficient of 0.01 or more and 0.7 or less measured under the following conditions.
    (conditions)
    One release film is cut into a size of 6.5 cm in width and 17 cm in length, and the release layer is attached on a horizontal table so that the release layer is on the upper side. Wrap it around a weight of 63 cm square and a weight of 202 g so that the release layer is on the outside. The weight on which the other release film is wound is placed on the one release film, and the weight is placed at a speed of 150 mm / min in an atmosphere of room temperature of 23 ± 1 ° C. and humidity of 50 ± 0.5% RH. The frictional force is measured by moving in the horizontal direction, and the friction coefficient at the point moved by 5 cm is defined as the dynamic friction coefficient.
  2. 　前記離型層の表面粗さＲｚが、２μｍ～２０μｍである、請求項１に記載の離型フィルム。 The release film according to claim 1, wherein the surface roughness Rz of the release layer is 2 μm to 20 μm.
  3. 　ＭＤ方向に厚さ１００μｍ、幅４ｍｍ、長さ２０ｍｍに成形した前記離型フィルムを、動的粘弾性測定装置で、引張りモード、周波数１Ｈｚ、昇温速度５℃／ｍｉｎで測定したときの、５０℃でのｔａｎδ５０が、０．０５以上０．２以下であり、１７５℃以下でのｔａｎδ１７５が、０．１５以上０．２５以下である、請求項１または２に記載の離型フィルム。 50 when the release film molded into a thickness of 100 μm, a width of 4 mm, and a length of 20 mm in the MD direction was measured with a dynamic viscoelasticity measuring device in a tensile mode, a frequency of 1 Hz, and a temperature rise rate of 5 ° C./min. The release film according to claim 1 or 2, wherein the tan δ 50 at ° C. is 0.05 or more and 0.2 or less, and the tan δ 175 at 175 ° C. or lower is 0.15 or more and 0.25 or less.
  4. 　ＭＤ方向に厚さ１００μｍ、幅４ｍｍ、長さ２０ｍｍに成形した前記離型フィルムを、動的粘弾性測定装置で、引張りモード、周波数１Ｈｚ、昇温速度５℃／ｍｉｎで測定したときの、１７５℃での貯蔵弾性率が、１０ＭＰａ以上４０ＭＰａ以下である、請求項１乃至３いずれか一項に記載の離型フィルム。 175 when the release film molded into a thickness of 100 μm, a width of 4 mm, and a length of 20 mm in the MD direction was measured with a dynamic viscoelasticity measuring device in a tensile mode, a frequency of 1 Hz, and a temperature rise rate of 5 ° C./min. The release film according to any one of claims 1 to 3, wherein the storage elastic modulus at ° C. is 10 MPa or more and 40 MPa or less.
  5. 　ＭＤ方向に厚さ１００μｍ、幅４ｍｍ、長さ２０ｍｍに成形した前記離型フィルムを、動的粘弾性測定装置で、引張りモード、周波数１Ｈｚ、昇温速度５℃／ｍｉｎで測定したときの、１７５℃での損失弾性率が、２．０ＭＰａ以上１０ＭＰａ以下である、請求項１乃至４いずれか一項に記載の離型フィルム。 175 when the release film molded into a thickness of 100 μm, a width of 4 mm, and a length of 20 mm in the MD direction was measured with a dynamic viscoelasticity measuring device in a tensile mode, a frequency of 1 Hz, and a temperature rise rate of 5 ° C./min. The release film according to any one of claims 1 to 4, wherein the loss elastic modulus at ° C. is 2.0 MPa or more and 10 MPa or less.
  6. 　前記離型フィルム全体の厚みが５０μｍ以上、２００μｍ以下である、請求項１乃至５いずれか一項に記載の離型フィルム。 The release film according to any one of claims 1 to 5, wherein the thickness of the entire release film is 50 μm or more and 200 μm or less.
  7. 　ロールｔｏロール方式によるフレキシブル回路基板の製造に用いられる、請求項１乃至６いずれか一項に記載の離型フィルム。 The release film according to any one of claims 1 to 6, which is used for manufacturing a flexible circuit board by a roll-to-roll method.
  8. 　請求項１乃至７のいずれか一項に記載の離型フィルムの前記一方の離型面が対象物側になるように、前記対象物上に前記離型フィルムを配置する工程と、
    　前記離型フィルムが配置された前記対象物に対し、加熱プレスを行う工程と、
    を含み、
    　前記離型フィルムを配置する前記工程において、前記対象物の前記離型フィルムが配置される面が、熱硬化性樹脂を含む材料によって形成されている、成型品の製造方法。     A step of arranging the release film on the object so that one of the release surfaces of the release film according to any one of claims 1 to 7 is on the object side.
    A step of performing a heating press on the object on which the release film is arranged, and
    Including
    A method for producing a molded product, wherein in the step of arranging the release film, the surface of the object on which the release film is arranged is formed of a material containing a thermosetting resin.
  9. 　前記成型品が、フレキシブル回路基板である、請求項８に記載の成型品の製造方法。 The method for manufacturing a molded product according to claim 8, wherein the molded product is a flexible circuit board.
PCT/JP2021/025241 2020-10-21 2021-07-05 Release film and method for producing molded products WO2022085241A1 (en)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010209208A (en) * 2009-03-10 2010-09-24 Dainippon Printing Co Ltd Release film and manufacturing method of the same
WO2012077571A1 (en) * 2010-12-07 2012-06-14 東洋紡績株式会社 Mold release polyester film for molding process
KR20120099546A (en) * 2011-01-28 2012-09-11 도레이첨단소재 주식회사 Polyester release film for forming green sheet
JP2016002730A (en) * 2014-06-18 2016-01-12 住友ベークライト株式会社 Release film
JP2019217780A (en) * 2013-08-05 2019-12-26 積水化学工業株式会社 Release film
JP2020004896A (en) * 2018-06-29 2020-01-09 株式会社コバヤシ Mould release film for semiconductor production

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010209208A (en) * 2009-03-10 2010-09-24 Dainippon Printing Co Ltd Release film and manufacturing method of the same
WO2012077571A1 (en) * 2010-12-07 2012-06-14 東洋紡績株式会社 Mold release polyester film for molding process
KR20120099546A (en) * 2011-01-28 2012-09-11 도레이첨단소재 주식회사 Polyester release film for forming green sheet
JP2019217780A (en) * 2013-08-05 2019-12-26 積水化学工業株式会社 Release film
JP2016002730A (en) * 2014-06-18 2016-01-12 住友ベークライト株式会社 Release film
JP2020004896A (en) * 2018-06-29 2020-01-09 株式会社コバヤシ Mould release film for semiconductor production

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