WO2022082868A1 - Dispositif électronique - Google Patents

Dispositif électronique Download PDF

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Publication number
WO2022082868A1
WO2022082868A1 PCT/CN2020/126624 CN2020126624W WO2022082868A1 WO 2022082868 A1 WO2022082868 A1 WO 2022082868A1 CN 2020126624 W CN2020126624 W CN 2020126624W WO 2022082868 A1 WO2022082868 A1 WO 2022082868A1
Authority
WO
WIPO (PCT)
Prior art keywords
hole
sound
cavity
electronic device
acoustic resistance
Prior art date
Application number
PCT/CN2020/126624
Other languages
English (en)
Chinese (zh)
Inventor
张哲�
孙舒远
许欣
黄翔
Original Assignee
瑞声声学科技(深圳)有限公司
瑞声科技(新加坡)有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 瑞声声学科技(深圳)有限公司, 瑞声科技(新加坡)有限公司 filed Critical 瑞声声学科技(深圳)有限公司
Publication of WO2022082868A1 publication Critical patent/WO2022082868A1/fr

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers

Definitions

  • the present application relates to the technical field of electronic devices, and in particular, to an electronic device having a speaker module.
  • the speaker module in the existing electronic equipment has poor low frequency performance, which seriously affects the performance of the speaker module and the electronic equipment.
  • the purpose of the present application is to provide an electronic device to solve the technical problem of poor low-frequency performance of existing electronic devices with small volume and large amplitude speaker modules.
  • An electronic device comprising: a casing with an accommodation space and a speaker module accommodated in the accommodation space, the speaker module includes a casing with a cavity and a sound-emitting unit accommodated in the cavity, the The sound-generating unit divides the cavity into a front cavity and a rear cavity, the casing is provided with a sound hole and a through hole, the sound hole and the through hole are arranged at intervals; the sound hole communicates with the front cavity , the receiving space and the rear cavity are communicated through the through hole.
  • the speaker module further includes an acoustic resistance member for adjusting the air flow velocity through the through hole, the acoustic resistance member is attached to the housing and covers the One side of the through hole or the acoustic resistance member is accommodated in the through hole.
  • the acoustic resistance member covers a side of the through hole close to the rear cavity or the acoustic resistance member covers a side of the through hole away from the rear cavity .
  • the acoustic resistance member includes at least one layer of acoustic resistance material, and each of the acoustic resistance material layers is stacked in sequence.
  • the acoustic resistance member is attached to the housing.
  • the acoustic impedance of the acoustic resistance member ranges from 50 Pa ⁇ s/m to 200 Pa ⁇ s/m.
  • the sound-generating unit has a diaphragm
  • the housing includes an upper cover that is opposite to the diaphragm and is spaced apart, and a lower cover that is spaced apart and opposite to the upper cover.
  • a cover and a side wall that is bent and extended from the edge of the upper cover toward the lower cover and fixed with the lower cover, the upper cover, the side wall and the lower cover are surrounded to form the cavity,
  • the front cavity is formed by an interval between the upper cover and the diaphragm.
  • the sound hole is formed through the side wall and surrounded by the side wall and the upper cover.
  • the upper cover extends toward the lower cover to form a blocking wall, the blocking wall, the side wall and the upper cover enclose a sound-absorbing cavity for accommodating sound-absorbing materials,
  • the sound-absorbing cavity is spaced apart from the through hole and the sound-emitting unit, and the sound-absorbing cavity is communicated with the rear cavity.
  • the baffle wall is spaced apart from the lower cover, and an end of the baffle wall away from the upper cover is covered with a ventilating spacer, and the ventilating spacer is connected to the lower cover.
  • the sound-absorbing cavity and the rear cavity are communicated with the air-permeable spacer, the sound-absorbing cavity is located on the side of the through hole away from the sound-emitting unit, and the upper cover is provided with a connection with the sound-absorbing cavity.
  • a connected powder filling hole, a leakage hole communicated with the sound-absorbing cavity is formed through the lower cover, and the diameter of the powder filling hole is larger than that of the leakage hole.
  • the above-mentioned electronic equipment by opening a through hole on the shell of the speaker module, communicates the rear cavity of the speaker module with the accommodation space of the shell of the electronic device, thereby improving the low-frequency amplitude of the speaker module and improving the rated power.
  • the low-frequency performance of the electronic device is improved; and the above-mentioned electronic device only has through-holes on the casing, which improves the performance and reduces the increase in the manufacturing cost.
  • Embodiment 1 is a schematic structural diagram of an electronic device in Embodiment 1 and Embodiment 2 of the application;
  • FIG. 2 is a schematic structural diagram of a speaker module in the electronic device according to Embodiment 1 of the application;
  • FIG. 3 is a schematic structural diagram from another perspective of the speaker module in the electronic device according to Embodiment 1 of the present application;
  • Fig. 4 is A-A sectional view in Fig. 3;
  • Fig. 5 is the exploded structure schematic diagram of the loudspeaker module shown in Fig. 3;
  • FIG. 6 is a schematic structural diagram of a speaker module in the electronic device according to Embodiment 2 of the application;
  • Fig. 7 is B-B in Fig. 6 sectional view
  • FIG. 8 is a schematic diagram of an exploded structure of the speaker module shown in FIG. 6 .
  • the electronic device 1 can be a mobile phone, a notebook computer, a tablet computer, a player, an earphone, a smart watch, or smart glasses.
  • the electronic device 1 includes: a housing 20 having an accommodation space 21 and a speaker module 10 accommodated in the accommodation space 21 .
  • the speaker module 10 is fixed on the casing 20 .
  • the speaker module 10 includes a casing 100 having a cavity and a sound generating unit 200 accommodated in the cavity.
  • the sound-generating unit 200 divides the cavity into a front cavity 101 and a rear cavity 102 .
  • the housing 100 is provided with a sound hole 103 and a through hole 104 , the sound hole 103 and the through hole 104 are spaced apart, the sound hole 103 communicates with the front cavity 101 , and the accommodation space 21 and the rear cavity 102 communicate through the through hole 104 .
  • the above-mentioned electronic device 1 by opening a through hole 104 on the housing 100 of the speaker module 10, connects the rear cavity 102 of the speaker module 10 with the accommodation space 21 of the housing 20 of the electronic device 1, thereby improving the speaker module.
  • the low frequency amplitude of 10 can improve the low frequency performance of the electronic device 1 under the rated power; and the electronic device 1 only has the through hole 104 on the casing 100 , which improves the performance and reduces the increase in the manufacturing cost.
  • the sound-generating unit 200 has a diaphragm
  • the housing 100 includes an upper cover 110 that is opposite to the diaphragm and is spaced apart, a lower cover 120 that is spaced apart and opposite to the upper cover 110 , and a cover 120 that faces downward from the edge of the upper cover 110 .
  • the side wall 130 is bent and extended in the direction and fixed with the lower cover 120 .
  • the upper cover 110 , the side wall 130 and the lower cover 120 are surrounded to form a cavity, and the upper cover 110 and the diaphragm are spaced apart to form a front cavity 101 .
  • the lower cover 120 is detachably connected to the side wall 130 to facilitate the design, replacement or maintenance of the internal structure of the casing 100 and the components accommodated in the casing 100 .
  • the sound hole 103 is located on the side wall 130 , so that the speaker module 10 emits sound from the side. The sound is transmitted outside the electronic device 1 .
  • the upper cover 110 includes a detachable plate 111 corresponding to the sound hole 103 .
  • the sound hole 103 is formed by surrounding the side wall 130 and the upper cover 110. Since the detachable plate 111 and the side wall 130 are detachably connected, it can be understood that in other embodiments, the detachable plate 111 can be removed to further increase the sound The hole 103 area and/or the volume of the front cavity 101 .
  • the speaker module 10 further includes an acoustic resistance member, which is used to adjust the air flow velocity through the through hole 104 , and the acoustic resistance member can adjust the through hole 104 and the accommodating space 21 by adjusting the air flow velocity of the through hole 104 .
  • the acoustic resistance element can directly affect the resonance strength of the rear cavity 102 . In terms of frequency response performance, the greater the acoustic impedance of the acoustic resistance element, the smoother the resonance valley in the frequency response, but the improvement in low frequency performance is small.
  • the range of the acoustic impedance of the acoustic resistance element is 50 Pa ⁇ s/m ⁇ 200 Pa ⁇ s/m, and the acoustic impedance is the acoustic impedance per unit area. It represents the ratio of the sound pressure of the sound wave on the wave front in the medium to the vibration velocity of the particle on the surface.
  • the acoustic impedance ratio of the acoustic resistance element is within the above range, which not only ensures that the resonance valley on the frequency response is relatively flat, and obtains a relatively ideal frequency response performance, but also ensures that the speaker module 10 has better low-frequency performance.
  • the acoustic resistance element also has a great influence on the shell vibration of the casing 20 . Since the acoustic resistance element can reduce the resonance strength of the rear cavity 102 and the through hole 104 , it can reduce the shell vibration of the casing 20 caused by the vibration of the speaker module 10 , thereby directly reducing the strength of the casing vibration of the casing 20 . Ultimately, the selection of the acoustic impedance rate of the acoustic resistance component should be jointly determined by combining the frequency response and the shell vibration.
  • the through hole 104 makes the air inside the casing 100 communicate with the air inside the casing 20, during the vibration of the speaker module 10, the air inside the casing 100 and the casing 20 has air convection, which increases the convective heat dissipation efficiency.
  • the temperature rise of the voice coil of the speaker module 10 is slowed down during operation, and the power bearing capability of the speaker module 10 is improved.
  • the acoustic resistance member is attached to the casing 100 and covers one side of the through hole 104 or is accommodated in the through hole 104 .
  • the acoustic resistance element covers the side of the through hole 104 close to the rear cavity 102 or the acoustic resistance element covers the side of the through hole 104 away from the rear cavity 102 .
  • the shape of the through hole 104 includes, but is not limited to, a circle, a square, a triangle or an ellipse.
  • the length of the through hole 104 is not limited. In this embodiment, the through hole 104 is vertical and runs through the side wall 130 , and its length is the same as the thickness of the side wall 130 .
  • the through hole 104 may also be disposed obliquely relative to the side wall 130 and run through the side wall 130 , and the length of the through hole 104 is greater than the thickness of the side wall 130 .
  • the ventilation area of the through hole 104 and the volume of the acoustic resistance member are not limited, and can be designed according to the performance requirements of the speaker module 10 and the electronic device 1 .
  • the acoustic resistance member includes at least one layer of acoustic resistance material, and the layers of acoustic resistance material are stacked in sequence. Wherein, each layer of acoustic resistance material arranged in layers may be arranged along the axis of the through hole 104 . Further, the acoustic resistance member may be made of acoustic resistance materials such as mesh or sound-absorbing cotton, and is disposed on the casing 100 by means of lamination. In this embodiment, the acoustic resistance member may be attached to the side walls 130 near both sides of the through hole 104 , and the acoustic resistance member may also be attached to the hole wall forming the through hole 104 .
  • the upper cover 110 extends toward the lower cover 120 to form a blocking wall 140 .
  • the blocking wall 140 , the side wall 130 and the upper cover 110 enclose a sound-absorbing cavity 150 for accommodating sound-absorbing materials, the sound-absorbing cavity 150 , the through hole 104 and the sound-emitting unit. 200 are arranged at intervals, and the sound-absorbing cavity 150 communicates with the rear cavity 102 .
  • one end of the blocking wall 140 is fixed on the side of the side wall 130 where the through hole 104 is provided, and a gap is formed between the other end of the blocking wall 140 and the side wall 130 to connect the sound absorbing cavity 150 with the rear cavity 102 .
  • the baffle wall 140 By arranging the baffle wall 140 to form a bass tube in the rear cavity 102 that communicates with the through hole 104, the coupling between the rear cavity of the speaker module and the internal space of the electronic device 1 can be increased, which is equivalent to expanding the rear cavity of the speaker module. It can improve the low frequency sensitivity of the speaker module, thereby improving the overall sound quality, thereby improving the acoustic performance of the product.
  • a sound absorbing member 160 connected to the housing 100 is accommodated in the cavity, and the sound absorbing member 160 is located on the side of the through hole 104 away from the blocking wall 140 .
  • the sound-absorbing member 160 and the housing 100 are integrally constructed, the sound-absorbing member 160 and the sound-emitting unit 200 are located at opposite ends of the cavity, respectively, and a blocking wall 140 is provided between the sound-absorbing member 160 and the sound-emitting unit 200 to communicate with each other.
  • the hole 104 is provided on the side wall 130 between the blocking wall 140 and the sound absorbing member 160 .
  • the electronic device 1 can be a mobile phone, a notebook computer, a tablet computer, a player, an earphone, a smart watch, or smart glasses.
  • the electronic device 1 includes: a housing 20 having an accommodation space 21 and a speaker module 10 accommodated in the accommodation space 21 .
  • the speaker module 10 is fixed on the casing 20 .
  • the speaker module 10 includes a casing 100 having a cavity and a sound generating unit 200 accommodated in the cavity.
  • the sound-generating unit 200 divides the cavity into a front cavity 101 and a rear cavity 102 .
  • the housing 100 is provided with a sound hole 103 and a through hole 104 , the sound hole 103 and the through hole 104 are spaced apart, the sound hole 103 communicates with the front cavity 101 , and the accommodation space 21 and the rear cavity 102 communicate through the through hole 104 .
  • the above-mentioned electronic device 1 by opening a through hole 104 on the housing 100 of the speaker module 10, connects the rear cavity 102 of the speaker module 10 with the accommodation space 21 of the housing 20 of the electronic device 1, thereby improving the speaker module.
  • the low frequency amplitude of 10 can improve the low frequency performance of the electronic device 1 under the rated power; and the electronic device 1 only has the through hole 104 on the casing 100 , which improves the performance and reduces the increase in the manufacturing cost.
  • the sound-generating unit 200 has a diaphragm
  • the housing 100 includes an upper cover 110 that is opposite to the diaphragm and is spaced apart, a lower cover 120 that is spaced apart and opposite to the upper cover 110 , and a cover 120 that faces downward from the edge of the upper cover 110 .
  • the side wall 130 is bent and extended in the direction and fixed with the lower cover 120 .
  • the upper cover 110 , the side wall 130 and the lower cover 120 are surrounded to form a cavity, and the upper cover 110 and the diaphragm are spaced apart to form a front cavity 101 .
  • the lower cover 120 is detachably connected to the side wall 130 to facilitate the design, replacement or maintenance of the internal structure of the casing 100 and the components accommodated in the casing 100 .
  • the sound hole 103 is located on the side wall 130 , so that the speaker module 10 emits sound from the side. The sound is transmitted outside the electronic device 1 .
  • the upper cover 110 includes a detachable plate 111 corresponding to the sound hole 103 .
  • the sound hole 103 is formed by surrounding the side wall 130 and the upper cover 110. Since the detachable plate 111 and the side wall 130 are detachably connected, it can be understood that in other embodiments, the detachable plate 111 can be removed to further increase the sound The hole 103 area and/or the volume of the front cavity 101 .
  • the speaker module 10 further includes an acoustic resistance member, which is used to adjust the air flow velocity through the through hole 104 , and the acoustic resistance member can adjust the through hole 104 and the accommodating space 21 by adjusting the air flow velocity of the through hole 104 .
  • the acoustic resistance element can directly affect the resonance strength of the rear cavity 102 . In terms of frequency response performance, the greater the acoustic impedance of the acoustic resistance element, the smoother the resonance valley in the frequency response, but the improvement in low frequency performance is small.
  • the range of the acoustic impedance of the acoustic resistance element is 50 Pa ⁇ s/m ⁇ 200 Pa ⁇ s/m, and the acoustic impedance is the acoustic impedance per unit area. It represents the ratio of the sound pressure of the sound wave on the wave front in the medium to the vibration velocity of the particle on the surface.
  • the acoustic impedance ratio of the acoustic resistance element is within the above range, which not only ensures that the resonance valley on the frequency response is relatively flat, and obtains a relatively ideal frequency response performance, but also ensures that the speaker module 10 has better low-frequency performance.
  • the acoustic resistance element also has a great influence on the shell vibration of the casing 20 . Since the acoustic resistance element can reduce the resonance strength of the rear cavity 102 and the through hole 104 , it can reduce the shell vibration of the casing 20 caused by the vibration of the speaker module 10 , thereby directly reducing the strength of the casing vibration of the casing 20 . Ultimately, the selection of the acoustic impedance rate of the acoustic resistance component should be jointly determined by combining the frequency response and the shell vibration.
  • the through hole 104 makes the air inside the casing 100 communicate with the air inside the casing 20, during the vibration of the speaker module 10, the air inside the casing 100 and the casing 20 has air convection, which increases the convective heat dissipation efficiency.
  • the temperature rise of the voice coil of the speaker module 10 is slowed down during operation, and the power bearing capability of the speaker module 10 is improved.
  • the acoustic resistance member is attached to the casing 100 and covers one side of the through hole 104 or is accommodated in the through hole 104 .
  • the acoustic resistance element covers the side of the through hole 104 close to the rear cavity 102 or the acoustic resistance element covers the side of the through hole 104 away from the rear cavity 102 .
  • the shape of the through hole 104 includes, but is not limited to, a circle, a square, a triangle or an ellipse.
  • the length of the through hole 104 is not limited. In this embodiment, the through hole 104 is vertical and runs through the side wall 130 , and its length is the same as the thickness of the side wall 130 .
  • the through hole 104 may also be disposed obliquely relative to the side wall 130 and run through the side wall 130 , and the length of the through hole 104 is greater than the thickness of the side wall 130 .
  • the ventilation area of the through hole 104 and the volume of the acoustic resistance member are not limited, and can be designed according to the performance requirements of the speaker module 10 and the electronic device 1 .
  • the acoustic resistance member includes at least one layer of acoustic resistance material, and the layers of acoustic resistance material are stacked in sequence. Wherein, each layer of acoustic resistance material arranged in layers may be arranged along the axis of the through hole 104 . Further, the acoustic resistance member may be made of acoustic resistance materials such as mesh or sound-absorbing cotton, and is disposed on the casing 100 by means of lamination. In this embodiment, the acoustic resistance member may be attached to the side walls 130 near both sides of the through hole 104 , and the acoustic resistance member may also be attached to the hole wall forming the through hole 104 .
  • the upper cover 110 extends toward the lower cover 120 to form a blocking wall 140 .
  • the blocking wall 140 , the side wall 130 and the upper cover 110 enclose a sound-absorbing cavity 150 for accommodating sound-absorbing materials, the sound-absorbing cavity 150 , the through hole 104 and the sound-emitting unit. 200 are arranged at intervals, and the sound-absorbing cavity 150 communicates with the rear cavity 102 .
  • the baffle wall 140 and the lower cover 120 are spaced apart, and one end of the baffle wall 140 away from the upper cover 110 is covered with a ventilating spacer. 150 is located on the side of the through hole 104 away from the sound-emitting unit 200.
  • the upper cover 110 is provided with a powder filling hole 151 that communicates with the sound-absorbing cavity 150.
  • the lower cover 120 is provided with a leakage hole 152 that communicates with the sound-absorbing cavity 150.
  • the powder filling hole 151 The pore size is larger than the pore size of the leakage hole 152 .
  • the leakage hole 152 ensures the circulation of gas, so as to ensure that the gas in the sound absorbing cavity 150 can be discharged through the leakage hole 152 when the sound absorbing material is filled.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)

Abstract

La présente invention concerne le domaine technique des dispositifs électroniques, et elle prévoit un dispositif électronique. Le dispositif électronique comprend : un boîtier muni d'un espace de logement et un module de haut-parleur qui est logé dans l'espace de logement. Le module de haut-parleur comprend un boîtier muni d'une cavité et une unité de génération de son qui est logée dans la cavité, l'unité de génération de son sépare la cavité en une cavité avant et une cavité arrière, un trou de son et un trou traversant sont prévus sur le boîtier, et le trou de son et le trou traversant sont prévus à un intervalle. Le trou sonore communique avec la cavité avant, et l'espace de logement communique avec la cavité arrière au moyen du trou traversant. Le dispositif électronique fait communiquer la cavité arrière du module de haut-parleur avec l'espace de logement prévu dans le boîtier du dispositif électronique en prévoyant un trou traversant sur le boîtier du module de haut-parleur, améliorant ainsi l'amplitude basse fréquence du module de haut-parleur et améliorant les performances basse fréquence du dispositif électronique à la puissance nominale. En outre, un trou traversant n'est prévu que sur le boîtier du dispositif électronique, et les coûts de fabrication sont augmentés d'une quantité relativement faible tout en améliorant les performances.
PCT/CN2020/126624 2020-10-23 2020-11-05 Dispositif électronique WO2022082868A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202022395601.0 2020-10-23
CN202022395601.0U CN213661902U (zh) 2020-10-23 2020-10-23 电子设备

Publications (1)

Publication Number Publication Date
WO2022082868A1 true WO2022082868A1 (fr) 2022-04-28

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ID=76703174

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2020/126624 WO2022082868A1 (fr) 2020-10-23 2020-11-05 Dispositif électronique

Country Status (2)

Country Link
CN (1) CN213661902U (fr)
WO (1) WO2022082868A1 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014023008A1 (fr) * 2012-08-09 2014-02-13 易力声科技(深圳)有限公司 Écouteur
CN107371106A (zh) * 2017-07-04 2017-11-21 瑞声科技(新加坡)有限公司 扬声器箱
CN207869368U (zh) * 2018-01-27 2018-09-14 瑞声科技(新加坡)有限公司 扬声器箱

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014023008A1 (fr) * 2012-08-09 2014-02-13 易力声科技(深圳)有限公司 Écouteur
CN107371106A (zh) * 2017-07-04 2017-11-21 瑞声科技(新加坡)有限公司 扬声器箱
CN207869368U (zh) * 2018-01-27 2018-09-14 瑞声科技(新加坡)有限公司 扬声器箱

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