WO2022082849A1 - 芯片散热结构及液晶显示装置 - Google Patents

芯片散热结构及液晶显示装置 Download PDF

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Publication number
WO2022082849A1
WO2022082849A1 PCT/CN2020/125292 CN2020125292W WO2022082849A1 WO 2022082849 A1 WO2022082849 A1 WO 2022082849A1 CN 2020125292 W CN2020125292 W CN 2020125292W WO 2022082849 A1 WO2022082849 A1 WO 2022082849A1
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WO
WIPO (PCT)
Prior art keywords
chip
heat dissipation
liquid crystal
dissipation structure
display device
Prior art date
Application number
PCT/CN2020/125292
Other languages
English (en)
French (fr)
Inventor
周政
宋岁忙
Original Assignee
武汉华星光电技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 武汉华星光电技术有限公司 filed Critical 武汉华星光电技术有限公司
Priority to US16/972,622 priority Critical patent/US11789199B2/en
Publication of WO2022082849A1 publication Critical patent/WO2022082849A1/zh

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133382—Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell
    • G02F1/133385—Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell with cooling means, e.g. fans
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0085—Means for removing heat created by the light source from the package
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
    • H05K7/20963—Heat transfer by conduction from internal heat source to heat radiating structure
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G02F1/133314—Back frames
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133382—Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133628—Illuminating devices with cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0086—Positioning aspects
    • G02B6/0088—Positioning aspects of the light guide or other optical sheets in the package

Definitions

  • the present application relates to the field of display technology, and in particular, to a chip heat dissipation structure and a liquid crystal display device.
  • Liquid crystal display devices have many advantages such as thin body, power saving and no radiation, and are widely used in various scenarios, such as indoor display, outdoor display or vehicle display, etc.
  • Most of the liquid crystal display devices on the market are backlit type. , which includes a liquid crystal panel and a backlight module (Backlight Module).
  • the working principle of the liquid crystal panel is to place liquid crystal molecules in two parallel glass substrates, and apply a driving voltage on the two glass substrates to control the rotation direction of the liquid crystal molecules, so as to refract the light from the backlight module to produce a picture.
  • FIG. 1 is a schematic structural diagram of a conventional liquid crystal display device 10 .
  • the conventional liquid crystal display device 10 includes a display panel 11 , a backlight module 16 , at least one chip (IC) 12 , a double-sided tape 13 and a frame 14 .
  • the backlight module 16 includes: a backplane 166 located at the bottom of the backlight module 16 , and a reflective sheet 165 , a light guide plate 164 , an optical film 163 , a reflective sheet 165 , a light guide plate 164 , an optical film 163 , and a side panel located at the side of the backlight module 16 .
  • a light bar 161 and a thermally conductive tape 162, and the chip 12 uses a printed circuit board (Flexible Printed Circuit (FPC) 15 is disposed above the display panel 11 .
  • FPC Flexible Printed Circuit
  • the heat source of the liquid crystal display device usually has three parts, the light bar 161, the chip 12 and some components; the heat inside the liquid crystal display device is gradually transferred to the surface of the screen after being accumulated, causing the screen to become hot.
  • the heat dissipation technology of the existing liquid crystal display device usually only heats the light bar 161 part.
  • the conventional heat dissipation method of the light bar 161 has been difficult to solve the problem of heat dissipation, especially for vehicle-mounted display devices.
  • the power consumption of the chip 12 is increased, so that the heat generation of the chip 12 is greatly increased, and the heat on the screen surface near the chip 12 will be particularly obvious.
  • Embodiments of the present application provide a chip heat dissipation structure and a liquid crystal display device, which aim to solve the problem that the chip heat dissipation effect is poor in the existing liquid crystal display device.
  • the application provides a chip heat dissipation structure, the chip heat dissipation structure includes a chip contact end and a backplane contact end, the chip heat dissipation structure is made of thermally conductive material, wherein the backplane is a display in a liquid crystal display device. A backplane at the bottom of a backlight module below the panel.
  • the chip heat dissipation structure includes:
  • the first surface as a chip contact end, is located above the backlight module and the display panel, covers the chip, and is in contact with the chip surface;
  • the second surface serving as a backplane contact end, is located below the backlight module and the display panel, is arranged in parallel with the first surface, and is in contact with the backplane surface;
  • the third surface connects the opposite sides of the first surface and the third surface.
  • the first surface is located on an upper end of a printed circuit board in the liquid crystal display device.
  • the second side is located between a printed circuit board and a backplane in the liquid crystal display device.
  • the second face is provided with a fracture that divides the second face into two parts.
  • the third surface has a hollow area, and a portion of a printed circuit board in the liquid crystal display device is located within the hollow area.
  • the thermally conductive material is a material with a thermal conductivity of 100 W/m ⁇ K or more.
  • the thermally conductive material is selected from graphite or copper foil.
  • the thickness of the chip heat dissipation structure is 0.03-0.2 mm.
  • the application also provides a chip heat dissipation structure, the chip heat dissipation structure includes a chip contact end and a backplane contact end, the chip heat dissipation structure is made of a thermally conductive material, wherein the backplane is a liquid crystal display device.
  • the backplane is a liquid crystal display device.
  • the chip heat dissipation structure includes:
  • the first surface as a chip contact end, is located above the backlight module and the display panel, covers the chip, and is in contact with the chip surface;
  • the second surface serving as a backplane contact end, is located below the backlight module and the display panel, is arranged in parallel with the first surface, and is in contact with the backplane surface;
  • the first surface is located at the upper end of a printed circuit board in the liquid crystal display device, and the second surface is located between a printed circuit board and a backplane in the liquid crystal display device.
  • the second face is provided with a fracture that divides the second face into two parts.
  • the present application also provides a liquid crystal display device, comprising:
  • a display panel disposed above the backlight module
  • At least one chip heat dissipation structure one end is a chip contact end in contact with the chip, and the other end is a backplane contact end in contact with a backplane at the bottom of the backlight module, the chip heat dissipation structure is made of thermally conductive material, so that The heat of the chip is conducted to the backplane.
  • the chip heat dissipation structure includes:
  • the first surface as a chip contact end, is located above the backlight module and the display panel, covers the chip, and is in contact with the chip surface;
  • the second surface serving as a backplane contact end, is located below the backlight module and the display panel, is arranged in parallel with the first surface, and is in contact with the backplane surface;
  • the third surface connects the opposite sides of the first surface and the third surface.
  • the first surface is located on an upper end of a printed circuit board in the liquid crystal display device.
  • the second side is located between a printed circuit board and a backplane in the liquid crystal display device.
  • the second face is provided with a fracture that divides the second face into two parts.
  • the third surface has a hollow area, and a portion of a printed circuit board in the liquid crystal display device is located within the hollow area.
  • the thermally conductive material is a material with a thermal conductivity of 100 W/m ⁇ K or more.
  • the thermally conductive material is selected from graphite or copper foil.
  • the thickness of the chip heat dissipation structure is 0.03-0.2 mm.
  • the present application provides a chip heat dissipation structure and a liquid crystal display device.
  • the chip heat dissipation structure has one end being a chip contact end in contact with the chip, and the other end being a backplane contact end in contact with a backplane at the bottom of the backlight module,
  • the chip heat dissipation structure is made of thermally conductive material, and by conducting the heat generated by the chip to the backplane, the temperature generated by the chip is reduced, and the problem of surface heating of liquid crystal display devices, especially vehicle-mounted display devices, is solved.
  • FIG. 1 is a schematic structural diagram of a conventional liquid crystal display device
  • FIG. 2 is a schematic structural diagram of the chip heat dissipation structure of the embodiment of the present application after unfolding;
  • FIG. 3 is a schematic structural diagram of a liquid crystal display device provided by an embodiment of the present application.
  • FIG. 4 is a schematic structural diagram of another liquid crystal display device provided by an embodiment of the present application.
  • FIG. 5 is a schematic three-dimensional structure diagram of a conventional liquid crystal display device
  • FIGS. 6 and 7 are schematic diagrams of a three-dimensional structure of a liquid crystal display device provided by an embodiment of the present application.
  • FIG. 8 is a schematic three-dimensional structural diagram of a liquid crystal display device provided by an embodiment of the present application without the printed circuit board.
  • first and second are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, features defined as “first”, “second” may expressly or implicitly include one or more of said features. In the description of the present application, “plurality” means two or more, unless otherwise expressly and specifically defined.
  • an embodiment of the present application provides a chip heat dissipation structure 27 .
  • the chip heat dissipation structure 27 is disposed in a liquid crystal display device 20 .
  • One end of the chip heat dissipation structure 27 is connected to at least one chip 22 .
  • Contact, as a chip contact end 271, the other end is in contact with a backplane 266 at the bottom of the one backlight module 26, as a backplane contact end 272, the chip heat dissipation structure 27 is made of thermally conductive material, wherein the backplane 266 It is a backplane 266 at the bottom of a backlight module 26 below a display panel 21 in a liquid crystal display device.
  • the chip heat dissipation structure 27 is U-shaped, including:
  • the first surface 1, as the chip contact end 271, is located above the backlight module 26 and the display panel 21, covers the chip 22, and is in surface contact with the chip 22;
  • the second surface 2 as the backplane contact end 272, is located below the backlight module 26 and the display panel 21, is disposed opposite to the first surface 1, and is in surface contact with the backplane 266;
  • the third surface 3 connects the opposite sides of the first surface 1 and the third surface 3 .
  • the first surface 1 is located on the upper end of a printed circuit board 25 in the liquid crystal display device 20 .
  • the second surface 2 is located between a printed circuit board 25 and a backplane in the liquid crystal display device 20 .
  • the second surface 2 is provided with an opening 211 to divide the second surface 2 into two parts, so that the chip heat dissipation structure 27 can bypass the printed circuit board 25 and be reversely attached to the backplane In 266 , the second side 2 is located between the printed circuit board 25 and the backplane 266 . Therefore, the heat dissipation material can be fully contacted with the back plate 266 to achieve the effect of heat dissipation.
  • FIG. 2 it is a schematic diagram of the structure after the chip heat dissipation structure 27 is unfolded. It can be seen in FIG. 2 that the third surface 3 has a hollow area, which is used for a printed circuit in the liquid crystal display device 20 . The board 25 is partially located within the hollow area, in order to avoid the heat transfer of the printed circuit board 25 and prevent the heat dissipation of the chip 22 from being affected.
  • the thermally conductive material is a material with a thermal conductivity of 100 W/m ⁇ K or more.
  • the material is selected from graphite or copper foil.
  • the thickness of the chip heat dissipation structure 27 is 0.02-2 mm. It should be noted that the thickness refers to the thickness of the chip heat dissipation structure 27 after the expansion. Preferably, it is 0.03-0.2 mm. Under such conditions, the thermal conductivity is the best without affecting the thickness of the liquid crystal display device 20 .
  • the chip heat dissipation structure provided in the embodiment of the present application can reduce the temperature generated by the chip 22 by conducting the heat generated by the chip 22 to the back plate 266, thereby solving the problem of surface heating of the liquid crystal display device 20, especially the vehicle-mounted liquid crystal display device.
  • the present application also provides a liquid crystal display device 20, the liquid crystal display device 20 includes: a backlight module 26, a display panel 21, at least one chip 22 and at least one chip heat dissipation structure 27, one end of the chip heat dissipation structure 27 is connected to the The chip 22 is in contact with the chip contact end 271 , and the other end is in contact with the backplane 266 at the bottom of the backlight module 26 as the backplane contact end 272 .
  • the chip heat dissipation structure 27 is made of thermally conductive material.
  • the backlight module 26 is located below the display panel 21 , and includes a backplane 266 , a reflective sheet 265 , a light guide plate 264 , an optical film 263 , a backplane 266 , a reflective sheet 265 , an optical film 263 , and an optical film 263 , which are stacked in order from bottom to top.
  • the display panel 21 mainly includes a polarizer, a color filter substrate, and an array substrate. It can be understood that, in addition to the above structures, the display panel 21 in the embodiment of the present application may also include any other necessary structures as required, such as substrates, glass cover plates, etc., which are not specifically limited here.
  • the display panel 21 can be divided into a display area and a non-display area.
  • the chip 22 is located in the non-display area and is electrically connected to the display panel 21 for driving the liquid crystal panel to display images.
  • the display device 20 further includes a printed circuit board 25 electrically connected to the chip 22 for carrying and transmitting signals to the chip 22 .
  • the printed circuit board 25 has flexibility.
  • the printed circuit board 25 can bypass the display panel 21 and the side surface of the backlight module 26 from the front of the display panel 21 in sequence to the side of the display panel 21 . the bottom surface of the backlight module 26.
  • FIG. 3 is a schematic structural diagram of a liquid crystal display device 20 in an embodiment of the present application, wherein the chip 22 is located above the non-display area of the display panel 21 , and the The chip heat dissipation structure 27 is U-shaped and includes:
  • the first surface 1, as the chip contact end 271, is located above the backlight module 26 and the display panel 21, covers the chip 22, and is in surface contact with the chip 22;
  • the second surface 2 as the backplane contact end 272, is located below the backlight module 26 and the display panel 21, is disposed opposite to the first surface 1, and is in surface contact with the backplane 266;
  • the third surface 3 connects the opposite sides of the first surface 1 and the third surface 3 .
  • the chip heat dissipation structure 27 is provided on the liquid crystal display device 20, and the heat generated by the chip 22 is conducted to the back plate 266, thereby reducing the temperature generated by the chip 22, The problem that the surface of the liquid crystal display device 20, especially the vehicle-mounted liquid crystal display device, heats up is solved.
  • the chip 32 is located on the side of the display panel 31 through the printed circuit board 35, as shown in FIG.
  • the chip heat dissipation structure 37 in 30 is L-shaped and includes:
  • the first surface is located at the side of the backlight module and the display panel 31, and covers the chip 32 and is in surface contact with the chip 32;
  • the second surface is located below the backlight module and the display panel 31 , and is connected to and perpendicular to the first surface.
  • FIG. 5 is a schematic three-dimensional structure diagram of a liquid crystal display device 20 in the prior art.
  • the chip 22 is located above the non-display area of the display panel 21 , so
  • the printed circuit board 25 is electrically connected to the chip 22, and is located above the non-display area of the display panel 21, the side surfaces of the display panel 21 and the backlight module 26, and the bottom surface of the backlight module 26; Fig. 6 and FIG.
  • FIG. 7 are schematic diagrams of the three-dimensional structure of the liquid crystal display device 20 in the embodiment of the application, wherein the chip heat dissipation structure 27 covers the chip 22 and bypasses the display panel 21 and the side surfaces of the backlight module 26, to the bottom surface of the backlight module 26 .
  • the chip heat dissipation structure 27 has a hollow area at the side of the display panel 21 and the backlight module 26 , and the printed circuit board 25 is partially located within the hollow area.
  • the printed circuit board 25 Since the printed circuit board 25 is sensitive to bending stress, the bending stress will affect the optical effect of the display panel 21 .
  • the hollow area is provided on the second side 2 to avoid the printed circuit board 25 , so as to prevent the bending stress of the printed circuit board 25 from being caused by the bending part of the chip heat dissipation structure 27 , thereby preventing the optical effect of the display panel 21 from being affected.
  • the printed circuit board 25 itself has heating elements, it will also generate heat, so it is necessary to avoid the heat transfer of the printed circuit board 25 to prevent the heat dissipation of the chip 22 from being affected.
  • the printed circuit board 25 itself already has channels for heat dissipation, such as heat dissipation through heat radiation from external connections. If the chip heat dissipation structure 27 is not avoided, the heat dissipation effect of the printed circuit board 25 itself will also be reduced.
  • FIG. 8 is a schematic three-dimensional structural diagram of the liquid crystal display device 20 in the embodiment of the present application with the printed circuit board 25 removed.
  • the chip heat dissipation structure 27 As can be seen from FIG. 7 , the second surface 2 is provided with an opening 211, so that the chip heat dissipation structure 27 can bypass the printed circuit board 25 and be reversely attached to the backplane 266. The second surface 2 is located on the printed circuit board 266. Between circuit board 25 and backplane 266 . Therefore, the heat dissipation material can be fully contacted with the back plate 266 to achieve the effect of heat dissipation.
  • the material of the chip heat dissipation structure 27 is a thermally conductive material, such as a material with a thermal conductivity of 100 W/m ⁇ K or more.
  • the thermal conductivity of the thermally conductive material is 120-380 W/m ⁇ K K.
  • the thermally conductive material is graphite and/or copper foil.
  • the thermal conductivity in this application has the meaning known in the art, which means that under stable heat transfer conditions, a material with a thickness of 1 m has a temperature difference of 1 degree (K, °C) on both sides of the material, and within a certain period of time, the material passes through 1 square meter. Heat transferred by area in watts/meter-degree W/(m-K).
  • the thermal conductivity of the materials in this application may be the thermal conductivity of known materials recognized in the art, or according to ASTM D5470 or ISO22007-2:2015 and other methods, as long as the thermal conductivity measured by any method is within the range defined in this application, it can be used to achieve the purpose of this application.
  • the above units or structures can be implemented as independent entities, or can be arbitrarily combined to be implemented as the same or several entities.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

一种芯片散热结构（27）及液晶显示装置（20），芯片散热结构（27）包括：一芯片接触端（271）和一背板接触端（272），芯片散热结构（27）由导热材料制成，其中背板（266）为液晶显示装置（20）中的背光模块（26）底部的一背板（266），通过将芯片（22）产生的热传导至背板（266），从而降低芯片（22）产生的温度，解决液晶显示装置（20）表面发热的问题。

Description

芯片散热结构及液晶显示装置 技术领域
本申请涉及显示技术领域，具体涉及一种芯片散热结构及液晶显示装置。
 背景技术
液晶显示装置具有机身薄、省电和无辐射等众多优点，被广泛应用在各大场景中，如室内显示、户外显示或车载显示等，现有市场上的液晶显示装置大部分为背光型，其包括液晶面板及背光模组(Backlight Module)。液晶面板的工作原理是在两片平行的玻璃基板当中放置液晶分子，并在两片玻璃基板上施加驱动电压来控制液晶分子的旋转方向，以将背光模组的光线折射出来产生画面。请参阅图1，图1为现有液晶显示装置10的结构示意图。现有液晶显示装置10包含有一显示面板11、一背光模块16、至少一芯片（IC）12、一双面胶13及一胶框(frame)14。其中，背光模块16包括：位于背光模块16的底部的一背板166，和由下至上依次堆叠的一反射片165、一导光板164、一光学膜片163、以及位于背光模块16侧方的一灯条161和一导热胶带162，而芯片12则利用一印刷电路板(Flexible Printed Circuit，FPC)15设置于显示面板11的上方。
 技术问题
液晶显示装置的热源通常有三个部分，灯条161，芯片12以及部分元器件；液晶显示装置内部热量聚集后逐渐传导至屏幕表面导致屏幕发烫。现有液晶显示装置的散热技术常常仅对灯条161部分进行散热。然而随着大屏幕和高亮度显示装置的需求的增加，常规灯条161的散热的方式已经很难解决散热问题，尤其是车载显示装置，随着内嵌(in-cell)技术在车载显示上的应用，芯片12的功耗加大，从而芯片12的发热大幅增加，芯片12附近的屏幕表面发热会尤为明显。
 技术解决方案
本申请实施例提供一种芯片散热结构及液晶显示装置，旨在解决现有的液晶显示装置中的芯片散热效果较差的问题。
本申请提供一种芯片散热结构，所述芯片散热结构包括一芯片接触端和一背板接触端，所述芯片散热结构由导热材料制成，其中所述背板为一液晶显示装置中一显示面板下方的一背光模块底部的一背板。
在一些实施方式中，所述芯片散热结构包括：
第一面，作为芯片接触端，位于所述背光模块和所述显示面板的上方，盖住所述芯片，并与所述芯片面接触；
第二面，作为背板接触端，位于所述背光模块和所述显示面板的下方，与所述第一面相对平行设置，并与所述背板面接触；以及
第三面，连接所述第一面和第三面相对的侧边。
在一些实施方式中，所述第一面位于所述液晶显示装置中一印刷电路板的上端。
在一些实施方式中，所述第二面位于所述液晶显示装置中一印刷电路板和背板之间。
在一些实施方式中，所述第二面设置有一断口，将所述第二面分成两个部分。
在一些实施方式中，所述第三面具有一镂空区，所述液晶显示装置中一印刷电路板部分位于所述镂空区的范围内。
在一些实施方式中，所述导热材料是导热系数为100W/m·K以上的材料。
在一些实施方式中，所述导热材料选自石墨或铜箔。
在一些实施方式中，所述芯片散热结构的厚度为0.03~0.2mm。
本申请还提供一种芯片散热结构，所述芯片散热结构包括一芯片接触端和一背板接触端，所述芯片散热结构由导热材料制成，其中所述背板为一液晶显示装置中的一显示面板下方的一背光模块底部的一背板，
所述芯片散热结构包括：
第一面，作为芯片接触端，位于所述背光模块和所述显示面板的上方，盖住所述芯片，并与所述芯片面接触；
第二面，作为背板接触端，位于所述背光模块和所述显示面板的下方，与所述第一面相对平行设置，并与所述背板面接触；以及
第三面，连接所述第一面和第三面相对的侧边，
所述第一面位于所述液晶显示装置中一印刷电路板的上端，所述第二面位于所述液晶显示装置中一印刷电路板和背板之间。
在一些实施方式中，所述第二面设置有一断口，将所述第二面分成两个部分。
本申请还提供一种液晶显示装置，包括：
一背光模块；
一显示面板，设置于所述背光模块上方；
至少一芯片，与所述显示面板电连接；及
至少一芯片散热结构，一端为与所述芯片接触的芯片接触端，另一端为与所述背光模块底部的一背板接触的背板接触端，所述芯片散热结构由导热材料制成，从而将所述芯片的热传导至所述背板。
在一些实施方式中，所述芯片散热结构包括：
第一面，作为芯片接触端，位于所述背光模块和所述显示面板的上方，盖住所述芯片，并与所述芯片面接触；
第二面，作为背板接触端，位于所述背光模块和所述显示面板的下方，与所述第一面相对平行设置，并与所述背板面接触；以及
第三面，连接所述第一面和第三面相对的侧边。
在一些实施方式中，所述第一面位于所述液晶显示装置中一印刷电路板的上端。
在一些实施方式中，所述第二面位于所述液晶显示装置中一印刷电路板和背板之间。
在一些实施方式中，所述第二面设置有一断口，将所述第二面分成两个部分。
在一些实施方式中，所述第三面具有一镂空区，所述液晶显示装置中一印刷电路板部分位于所述镂空区的范围内。
在一些实施方式中，所述导热材料是导热系数为100W/m·K以上的材料。
在一些实施方式中，所述导热材料选自石墨或铜箔。
在一些实施方式中，所述芯片散热结构的厚度为0.03~0.2mm。
 有益效果
本申请提供一种芯片散热结构及液晶显示装置，所述芯片散热结构，一端为与所述芯片接触的芯片接触端，另一端为与所述背光模块底部的背板接触的背板接触端，所述芯片散热结构由导热材料制成，通过将芯片产生的热传导至所述背板，从而降低芯片的产生的温度，解决液晶显示装置尤其是车载显示装置的表面发热的问题。
 附图说明
图1是现有的液晶显示装置的结构示意图；
图2是本申请实施例芯片散热结构展开之后结构示意图；
图3是本申请实施例提供一种液晶显示装置的结构示意图；
图4是本申请实施例提供另一种液晶显示装置的结构示意图；
图5是现有的液晶显示装置的立体结构示意图；
图6和图7是本申请实施例提供一种液晶显示装置的立体结构示意图；
图8是本申请实施例提供一种液晶显示装置中去除了所述印刷电路板的立体结构示意图。
其中附图标记说明：
（10，20，30）-显示装置；（11，21）-显示面板；（12，22）-芯片；（13，23）-双面胶；（14，24）-胶框；（15，25）-印刷电路板；（16，26）-背光模块；（161，261）-灯条；（162，262）-导热胶带；（163，263）-光学膜片；（164，264）-导光板；（165，265）-反射片；（166，266）-背板；27-芯片散热结构；1-第一面；2-第二面；3-第三面；211-断口。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
在本申请的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本申请的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
首先，请参阅图2-图8，本申请实施例中提供一种芯片散热结构27，所述芯片散热结构27设置于一液晶显示装置20中，所述芯片散热结构27一端与至少一芯片22接触，作为芯片接触端271，另一端与所述一背光模块26底部的一背板266接触，作为背板接触端272，所述芯片散热结构27由导热材料制成，其中所述背板266为一液晶显示装置中的一显示面板21下方的一背光模块26底部的一背板266。
当所述所述芯片散热结构27为立体结构时，所述芯片散热结构27形状呈U字形，包括：
第一面1，作为芯片接触端271，位于所述背光模块26和所述显示面板21的上方，并覆盖所述芯片22，与所述芯片22面接触；
第二面2，作为背板接触端272，位于所述背光模块26和所述显示面板21的下方，与所述第一面1相对平行设置，并与所述背板266面接触；以及
第三面3，连接所述第一面1和第三面3相对的侧边。
具体的，所述第一面1位于所述液晶显示装置20中一印刷电路板25的上端。
在一实施例中，所述第二面2位于所述液晶显示装置20中一印刷电路板25和背板之间。
在一些实施方式中，所述第二面2设置有一断口211，将所述第二面2分为两个部分，方便所述芯片散热结构27绕过所述印刷电路板25反贴至背板266中，所述第二面2位于印刷电路板25和背板266之间。从而使所述散热材料与背板266能够充分的接触，达到散热的效果。
如图2所示，为所述芯片散热结构27展开之后结构示意图，在图2中可以看出，所述第三面3具有一镂空区，用于使所述液晶显示装置20中一印刷电路板25部分位于所述镂空区的范围内，目的是避开印刷电路板25的热量传递，防止芯片22的散热会受到影响。
在一些实施例中，所述导热材料是导热系数为100W/m·K以上的材料。在一具体实施例中，所述材料选自石墨或铜箔。
具体的，所述芯片散热结构27厚度为0.02-2mm，需要说明的是，所述厚度指的是芯片散热结构27展开之后的厚度。优选的，为0.03~0.2mm，在这样的条件下，在不影响所述液晶显示装置20的厚度的情况下，导热效果最好。
本申请实施例中提供的芯片散热结构，通过将芯片22产生的热传导至所述背板266，从而降低芯片22的产生的温度，解决液晶显示装置20尤其是车载液晶显示装置表面发热的问题。
本申请还提供一种液晶显示装置20，所述液晶显示装置20包括：一背光模块26、一显示面板21、至少一芯片22以及至少一芯片散热结构27，所述芯片散热结构27一端与所述芯片22接触，作为芯片接触端271，另一端与所述背光模块26底部的背板266接触，作为背板接触端272，所述芯片散热结构27由导热材料制成。
具体的，所述背光模块26位于所述显示面板21的下方，包括由下至上依次堆叠的：一背板266、一反射片265、一导光板264、一光学膜片263、以及位于背光模块26侧方的一灯条261和一导热胶带262。
具体的，所述背光模块26和所述显示面板21之间还包括双面胶23和胶框24。所述显示面板21主要包括：偏光片、彩膜基板、阵列基板。可以理解的是，除了上述结构之外，本申请实施例显示面板21中，还可以根据需要包括任何其他的必要结构，例如基板，玻璃盖板等，具体此处不作限定。
所述显示面板21可分为显示区和非显示区，所述芯片22位于非显示区，并与所述显示面板21电连接，用于驱动所述液晶面板进行画面显示。
在一实施例中，所述显示装置20还包括印刷电路板25，与所述芯片22电连接，用于承载并传输信号至所述芯片22。所述印刷电路板25具有柔性，在一实施例中，所述印刷电路板25可从所述显示面板21的正面，依次绕过所述显示面板21和所述背光模块26的侧面，至所述背光模块26的底面。
在本申请一个实施例中，请参阅图3，图3为本申请实施例中液晶显示装置20的结构示意图，其中，所述芯片22位于所述显示面板21的非显示区的上方，所述芯片散热结构27形状呈U字形，包括：
第一面1，作为芯片接触端271，位于所述背光模块26和所述显示面板21的上方，并覆盖所述芯片22，与所述芯片22面接触；
第二面2，作为背板接触端272，位于所述背光模块26和所述显示面板21的下方，与所述第一面1相对平行设置，并与所述背板266面接触；以及
第三面3，连接所述第一面1和第三面3相对的侧边。
本申请实施例中提供的液晶显示装置20，在所述液晶显示装置20设置所述芯片散热结构27，通过将芯片22产生的热传导至所述背板266，从而降低芯片22的产生的温度，解决液晶显示装置20尤其是车载液晶显示装置表面发热的问题。
在本申请另一个实施例中，与上述实施例不同的是，所述芯片32通过所述印刷电路板35位于所述显示面板31的侧面，如图4所示，其中所述液晶显示装置中30中的芯片散热结构37形状呈L字形，包括：
第一面，位于所述背光模块和所述显示面板31的侧方，并覆盖所述芯片32，与所述芯片32面接触；
第二面，位于所述背光模块和所述显示面板31的下方，与所述第一面相连且垂直。
在本申请另一个具体实施例中，请参阅图5-图7，图5为现有技术中液晶显示装置20的立体结构示意图，芯片22位于所述显示面板21的非显示区的上方，所述印刷电路板25与所述芯片22电连接，位于所述显示面板21的非显示区的上方、所述显示面板21和所述背光模块26的侧面、以及所述背光模块26的底面；图6和图7为本申请实施例中液晶显示装置20的立体结构示意图，其中，所述芯片散热结构27覆盖所述芯片22，并绕过所述显示面板21和所述背光模块26的侧面、至所述背光模块26的底面。所述芯片散热结构27在所述显示面板21和所述背光模块26的侧面的位置具有一镂空区，所述印刷电路板25部分位于所述镂空区的范围内。
由于印刷电路板25对弯折应力敏感，而弯折应力会影响显示面板21的光学效果。本申请实施例中通过在第二面2设置镂空区避开印刷电路板25，防止芯片散热结构27的弯曲部位会对印刷电路板25产生弯折应力，从而防止显示面板21的光学效果受影响；另一方面，由于印刷电路板25本身就具有发热元件，同样会产生热量，因此需要避开印刷电路板25的热量传递，防止芯片22的散热会受到影响。且印刷电路板25本身就已经具有散热的渠道，例如与外部连接通过热辐射的方式散热，如果芯片散热结构27不避开，也会降低印刷电路板25自身的散热效果。
在本申请的另一个具体实施例中，图8为本申请实施例中液晶显示装置20中去除了所述印刷电路板25的立体结构示意图，为方便看到所述印刷电路板25遮挡部位的所述芯片散热结构27。从图7中可以看到，所述第二面2设置有一断口211，方便所述芯片散热结构27绕过所述印刷电路板25反贴至背板266中，所述第二面2位于印刷电路板25和背板266之间。从而使所述散热材料与背板266能够充分的接触，达到散热的效果。
一般说来，所述芯片散热结构27的材料为导热材料，例如导热系数为100W/m·K以上的材料，在一些具体实施例中，所述导热材料的导热系数为120-380W/m·K。在一些具体实施例中，所述导热材料为石墨和/或铜箔。
本申请中导热系数具有本领域已知的含义，是指在稳定传热条件下，1m厚的材料，两侧表面的温差为1度（K，℃），在一定时间内，通过1平方米面积传递的热量，单位为瓦/米·度 W/(m·K)。本申请中材料的导热系数可以是本领域公认的已知材料的导热系数，或者根据ASTM D5470或ISO22007-2:2015等方法进行测定，只要任一方法测定的导热系数在本申请所限定的范围内，均可用于实现本申请的目的。
在上述实施例中，对各个实施例的描述都各有侧重，某个实施例中没有详述的部分，可以参见上文其他实施例中的详细描述，此处不再赘述。
具体实施时，以上各个单元或结构可以作为独立的实体来实现，也可以进行任意组合，作为同一或若干个实体来实现，以上各个单元或结构的具体实施可参见前面的方法实施例，在此不再赘述。
以上对本申请实施例所提供的一种液晶显示装置20及芯片散热结构27进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的方法及其核心思想；同时，对于本领域的技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本申请的限制。

Claims (20)

  1. 一种芯片散热结构，其中，所述芯片散热结构包括一芯片接触端和一背板接触端，所述芯片散热结构由导热材料制成，其中所述背板为一液晶显示装置中的一显示面板下方的一背光模块底部的一背板。
  2. 根据权利要求1所述的芯片散热结构，其中，所述芯片散热结构包括：
    第一面，作为芯片接触端，位于所述背光模块和所述显示面板的上方，盖住所述芯片，并与所述芯片面接触；
    第二面，作为背板接触端，位于所述背光模块和所述显示面板的下方，与所述第一面相对平行设置，并与所述背板面接触；以及
    第三面，连接所述第一面和第三面相对的侧边。
  3. 根据权利要求2所述的芯片散热结构，其中，所述第一面位于所述液晶显示装置中一印刷电路板的上端。
  4. 根据权利要求2所述的芯片散热结构，其中，所述第二面位于所述液晶显示装置中一印刷电路板和背板之间。
  5. 根据权利要求2所述的芯片散热结构，其中，所述第二面设置有一断口，将所述第二面分成两个部分。
  6. 根据权利要求2所述的芯片散热结构，其中，所述第三面具有一镂空区，所述液晶显示装置中一印刷电路板部分位于所述镂空区的范围内。
  7. 根据权利要求1所述的芯片散热结构，其中，所述导热材料是导热系数为100W/m·K以上的材料。
  8. 根据权利要求7所述的芯片散热结构，其中，所述导热材料选自石墨或铜箔。
  9. 根据权利要求1所述的芯片散热结构，其中，所述芯片散热结构的厚度为0.03~0.2mm。
  10. 一种芯片散热结构，其中，所述芯片散热结构包括一芯片接触端和一背板接触端，所述芯片散热结构由导热材料制成，其中所述背板为一液晶显示装置中的一显示面板下方的一背光模块底部的一背板，
    所述芯片散热结构包括：
    第一面，作为芯片接触端，位于所述背光模块和所述显示面板的上方，盖住所述芯片，并与所述芯片面接触；
    第二面，作为背板接触端，位于所述背光模块和所述显示面板的下方，与所述第一面相对平行设置，并与所述背板面接触；以及
    第三面，连接所述第一面和第三面相对的侧边，
    所述第一面位于所述液晶显示装置中一印刷电路板的上端，所述第二面位于所述液晶显示装置中一印刷电路板和背板之间。
  11. 根据权利要求10所述的芯片散热结构，其中，所述第二面设置有一断口，将所述第二面分成两个部分。
  12. 一种液晶显示装置，其中，包括：
    一背光模块；
    一显示面板，设置于所述背光模块上方；
    至少一芯片，与所述显示面板电连接；及
    至少一芯片散热结构，一端为与所述芯片接触的芯片接触端，另一端为与所述背光模块底部的一背板接触的背板接触端，所述芯片散热结构由导热材料制成。
  13. 根据权利要求12所述的液晶显示装置，其中，所述芯片散热结构包括：
    第一面，作为芯片接触端，位于所述背光模块和所述显示面板的上方，盖住所述芯片，并与所述芯片面接触；
    第二面，作为背板接触端，位于所述背光模块和所述显示面板的下方，与所述第一面相对平行设置，并与所述背板面接触；以及
    第三面，连接所述第一面和第三面相对的侧边。
  14. 根据权利要求13所述的液晶显示装置，其中，所述第一面位于所述液晶显示装置中一印刷电路板的上端。
  15. 根据权利要求13所述的液晶显示装置，其中，所述第二面位于所述液晶显示装置中一印刷电路板和背板之间。
  16. 根据权利要求13所述的液晶显示装置，其中，所述第二面设置有一断口，将所述第二面分成两个部分。
  17. 根据权利要求13所述的液晶显示装置，其中，所述第三面具有一镂空区，所述液晶显示装置中一印刷电路板部分位于所述镂空区的范围内。
  18. 根据权利要求12所述的液晶显示装置，其中，所述导热材料是导热系数为100W/m·K以上的材料。
  19. 根据权利要求18所述的液晶显示装置，其中，所述导热材料选自石墨或铜箔。
  20. 根据权利要求12所述的液晶显示装置，其中，所述芯片散热结构的厚度为0.03~0.2mm。
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