WO2022081453A1 - Procédé de fixation d'un connecteur à un substrat de verre et produit de verre - Google Patents

Procédé de fixation d'un connecteur à un substrat de verre et produit de verre Download PDF

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Publication number
WO2022081453A1
WO2022081453A1 PCT/US2021/054366 US2021054366W WO2022081453A1 WO 2022081453 A1 WO2022081453 A1 WO 2022081453A1 US 2021054366 W US2021054366 W US 2021054366W WO 2022081453 A1 WO2022081453 A1 WO 2022081453A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
connectable
glass
conductive material
connector
Prior art date
Application number
PCT/US2021/054366
Other languages
English (en)
Inventor
Olivier FARREYROL
Jacob Daniel RIGELMAN
Original Assignee
Carlex Glass America, Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Carlex Glass America, Llc filed Critical Carlex Glass America, Llc
Publication of WO2022081453A1 publication Critical patent/WO2022081453A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
    • C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
    • C03C17/40—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal all coatings being metal coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
    • B32B17/10036—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising two outer glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
    • B32B17/10128—Treatment of at least one glass sheet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10165—Functional features of the laminated safety glass or glazing
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
    • C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
    • C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
    • C03C17/3602—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
    • C03C17/3639—Multilayers containing at least two functional metal layers
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
    • C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
    • C03C17/3602—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
    • C03C17/3644—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer the metal being silver
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
    • C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
    • C03C17/3602—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
    • C03C17/3647—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer in combination with other metals, silver being more than 50%
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
    • C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
    • C03C17/3602—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
    • C03C17/3668—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer the multilayer coating having electrical properties
    • C03C17/3673—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer the multilayer coating having electrical properties specially adapted for use in heating devices for rear window of vehicles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals

Definitions

  • the present disclosure general ly relates to a method of attaching a connector to a glass substrate, and a glass product.
  • a method of attaching a connector to a glass substrate including: thermally treating a laminate including a glass substrate, a connectable material layer or a connectable material precursor layer on the glass substrate, a conductive material precursor layer containing glass particles on the connectable material layer or the connectable material precursor layer, and a connector on the conductive material precursor layer, wherein the conductive material precursor layer bonds to the connector, and either the connectable material layer or the connectable material precursor layer during thermally treating the laminate.
  • a glass product including a glass substrate, a connectable material layer on the glass substrate, a conductive material layer on the connectable material layer, and a connector on the conductive material layer, wherein the conductive material layer includes a glass material, the conductive material layer bonds to the connectable material layer with the glass material, and the conductive material layer also bonds to the connector.
  • the method may further include: applying a conductive material to either the connectable material layer or the connectable material precursor layer to obtain the conductive material precursor layer: and positioning the connector over the conductive material precursor layer to obtain the laminate.
  • Applying the conducti ve material to either the connectable material layer or the connectable material precursor layer may include screen printing the conductive material on either the connectable material layer or the connectable material precursor layer.
  • the method may further include: applying the conductive material on a bottom surface of the connector; and positioning the connector over either the connectable material layer or the connectable material precursor layer to obtain the laminate.
  • metal particles in the conductive material precursor layer may fuse and contact the connector, and either the connectable material layer or the connectable material precursor layer during thermally treating the laminate.
  • a metal-containing material in the conductive material layer may contact a connectable material layer and the connector.
  • the conductive material precursor layer may also bond to the glass substrate or a ceramic paste layer on the glass substrate during thermally treating the laminate.
  • the connectable material layer or the connectable material precursor layer may include voids, wherein the conductive material precursor layer may contact the glass substrate or the ceramic paste layer on the glass substrate through the voids.
  • the conductive material layer may also bond to the glass substrate or a ceramic paste layer on the glass substrate.
  • the connectable material layer may include voids, wherein the conductive material layer may contact the glass substrate or the ceramic layer printed on the glass substrate through the voids.
  • the connector may be attached to the conductive material precursor layer or either the connectable material precursor layer or connectable material layer with an adhesive prior to thermally treating the laminate.
  • the method may further include drying the conductive material precursor layer prior to thermally treating the laminate.
  • the connectable material layer may include an electrically connectable coating.
  • the connectable material layer may include a printed electrically connectable material which may be a part of a wiper park heating system.
  • the conductive material precursor layer may further contain silver particles.
  • the conductive material layer may further include silver
  • the glass particles may include glass pellet particles.
  • the glass particles or the glass material may be the same material as the glass substrate.
  • the laminate may further include a metal precursor layer between the connector and the conductive material precursor layer, and the metal precursor layer may contain particles of metal or metal compound.
  • the glass product may further include a metal layer between the connector and the conductive material layer, wherein the metal layer may contain sintered metal particles.
  • the connectable material precursor layer and the conductive material precursor layer may include metal particles and glass particles.
  • a content of the glass particles in the conductive material precursor layer may be lower than that in the connectable material precursor layer.
  • the connectable material layer may include a metal-containing material and a glass material
  • the conductive material precursor layer may include metal particles and glass particles.
  • a content of the glass particles in the conductive material precursor layer may be lower than a content of the glass material in the connectable material layer.
  • both of the connectable material layer and the conductive material layer may contain a metal-containing material and a glass material.
  • a content of the glass material in the conductive material layer may be lower than that in the connectable material layer.
  • thermally treating the laminate may include heating the laminate and bendin g the glass substrate at a temperature of at least 530°C,
  • the glass particles in the laminate may fuse during thermally treating the laminate.
  • a difference of coefficient of thermal expansion between the connector and the glass substrate may be at most
  • a surface of the connector may have at least one metal plating layer.
  • the conductive material layer may not contain organic materials.
  • FIG. 1 illustrates a cross section of a connector applied to a glass substrate, according to an exemplary' aspect of the present disclosure
  • FIGs, 2A, 2B, 2C and 2D illustrate steps of attaching a connector to a glass substrate, according to an exemplary aspect of the present disclosure
  • FIGs. 3 A, 3B, and 3C illustrate steps of ataching a connector to a glass substrate, according to an exemplary aspect of the present disclosure
  • F IG. 4 illustrates a cross section of a connector applied to a glass substrate, according to an exemplary aspect of the present disclosure
  • FIG. 5 illustrates a cross section of a connector applied to a glass substrate, according to an exemplary aspect of the present disclosure
  • FIG. 6 illustrates a cross section of a connector applied to a glass substrate, according to an exemplary' aspect of the present disclosure
  • FIG. 7 illustrates a cross section of a connector applied to a glass substrate, according to an exemplary aspect of the present disclosure
  • FIG. 8 illustrates a cross section of a connector applied to a glass substrate, according to an exemplary aspect of the present disclosure
  • FIG. 9 illustrates a cross section of a connector applied to a glass substrate, according to an exemplary aspect of the present disclosure.
  • This disclosure relates generally to a method of attaching a connector to a glass substrate, including: thermally treating a laminate including a glass substrate, a connectable material layer or a connectable material precursor layer on the glass substrate, a conductive materia! precursor layer containing glass particles on the connectable material layer or connectable material precursor layer, and a connector on the conductive material precursor layer, wherein the conductive material precursor layer bonds to the connector and the connectable material layer or connectable material precursor layer during thermal treatment.
  • This disclosure also relates generally to a glass product including a glass substrate, a connectable materia) layer on the glass substrate, a conductive material layer on the connectable materia! layer, and a connector on the conductive material layer, wherein the conductive material layer contains a glass material, the conductive material layer bonds to the connectable material layer with the glass material, and the conductive material layer also bonds to the connector.
  • Glass products may include glazings and connectors where power is to be supplied to the glazing or an element of the glazing or where an antenna is connected to a signal receiver.
  • a coating or print may be powered, for example, to be heated.
  • Printed silver for example, may be located across a glazing, such as heating lines across a rear window, or in a localized area, such as wiper park heating lines.
  • Coatings or printings may require a connector to provide power from an electrical source to heat the coating or print.
  • Antennas may require a connector to reach a signa) receiver.
  • a connectable material may be provided on a glazing interior surface and connected prior to lamination.
  • Some further glazings having an electrical connection may be non-laminated glazings.
  • a method of attaching a connector as disclosed herein, may advantageously work for both laminated and non-laminated glazings.
  • a glass product 1 may include a glass substrate 40 as shown in FIG. 1.
  • the thickness of the glass substrate 40 is not particularly limited, but is preferably from 0.5 mm to 5 mm, more preferably from 1 mm to 2.5 mm.
  • the glass substrate 40 may include, without limitation, sodalime silicate glass, aluminosilicate glass, borosilicate glass, fused quarts glass, alkali-free glass, physically tempered glass, or chemically tempered glass.
  • the glass substrate 40 may include soda-lime silicate glass described by ISO 16293-1 :2008.
  • the glass product 1 may include a connectable material layer 30 which may be an electrically connectable coating or a printed electrically connectable material on a glass substrate 40 as shown in FIG. 1.
  • the connectable material layer 30 may include at least one metal or metal compound selected from the group consisting of silver, copper, nickel, indium, tin, alloys thereof, and compounds thereof, preferably including silver, copper, nickel, alloys thereof, or silver oxide, and more preferably including silver or silver alloy.
  • the connectable material layer 30 may be prepared by heating a connectable material precursor layer including a connectable material.
  • the connectable material layer 30 may be prepared before application of a conductive material or positioning of the connector 10 with a conductive material precursor layer.
  • Some connectable material may contain the metal or metal compound described above, glass particles, a carrier, and optional additives. Particles of metal or metal compound may be used and the size thereof may be 0.1 to 10 pm, preferably 0.2 to 7 ⁇ m in terms of D50.
  • the connectable material may also include glass particles.
  • the glass particles may be of any suitable chemical composition such as soda-lime silicate glass, borosilicate glass, bismuth-oxidc containing glass, or borate glass including zinc oxide borate glass.
  • the size of the glass particles may be 0.1 to 10 ⁇ m, preferably 0.5 to 5 ⁇ m, and more preferably 1 to 4 ⁇ m in terms of D50.
  • the carrier may contain a dispersion medium and a binder.
  • the dispersion medium may have a low volatility at ambient temperature, but preferably be volatile at a temperature lower than the temperature at which the glass particles fuse.
  • the dispersion medium may have a boiling point of about 50 to 250°C.
  • the dispersion medium include: aliphatic alcohols such as C6-C30 saturated or unsaturated aliphatic alcohols including 2-ethyl-l -hexanol, octanol, and decanol; cellosolves such as C1-C4 alkyl cellosolves including methyl cellosolve, ethyl cellosolve, and butyl cellosolve; cellosolve acetates such as C I-C4 alkyl cellosolve acetates including ethyl cellosolve acetate, and butyl cellosolve acetate; carbitols such as C1-C4 alkyl carbitols including methyl carbitol, ethyl carbito
  • the binder may be a material which can give a proper viscosity to the connectable material and decompose at about 200 to 550°C, preferably about 220 to 400°C.
  • the binder may include: thermoplastic resins such as olefin resins, vinyl resins, acrylic resins, styrene resins, polyester resins, polyamide resins, and cellulose derivatives; thermosetting resins such as thermosetting acrylic resins, epoxy resins, phenol resins, unsaturated polyester resins, and polyurethane resins; and mixtures thereof.
  • Content of the carrier in the connectable material may be 10 to 50 mass%, and preferably 15 to 45 mass%.
  • the connectable material precursor layer may, for example, be provided by bar coating the connectable material.
  • the connectable material layer may be printed onto the glass substrate 40, including by screen printing.
  • a connectable material containing silver, or silver alloy, material may be screen printed onto the glass substrate 40, in lines across a rear window for heating and melting snow and ice on the window.
  • a printed connectable material layer may further be provided in an area of a windshield or rear window where a wiper may sit in an off position.
  • Such a “wiper park'’ may include a printed silver which is heatable by connection to a power supply.
  • the coated or printed connectable material precursor layer or the connectable material layer 30 obtained therefrom may be any suitable pattern to provide adequate heating or power to a desired area or areas and may include an area printed for connecting to a connector 10.
  • the printed connectable material layer 30 may include a connecting surface which is io be connected to a connector 10.
  • the glass product I may include an opaque print at a periphery and/or around an accessory, such as a camera or sensor, and the connectable material layer 30 may be printed on the glass substrate 40 and/or an opaque print.
  • the opaque print may include, for example, a printed frit composition, or ceramic paste.
  • Glass particles in the connectable material precursor layer may fuse with each other by heating and provide a glass material in the resulting connectable material layer 30. Content of a glass material in the connectable material layer 30 may be 1 to 20 mass%, and preferably 1 to 15 mass%.
  • the connectable material layer 30 may have a thickness of I to 50 ⁇ m, preferably 1 to 40 ⁇ m, and more preferably 2 to 30 ⁇ m, and still more preferably 3 to 10 ⁇ m.
  • a conductive material layer 20 may be used to attach a connector 10 to a glass substrate 40, as shown in FIG. 1 .
  • the conductive material layer 20 may be provided by heating a conductive material precursor layer including a conductive material during a thermal treatment.
  • the conductive material may include any suitable material for electrically connecting a connector 10 to a glazing.
  • the conductive material may contain a metal or metal compound selected from the group consisting of silver, copper, nickel, indium, tin, alloys including such metals, or compounds thereof, preferably including silver, copper, nickel, alloys thereof, or silver oxide, and more preferably including silver or silver alloy.
  • the metal or the metal alloy may be present as metal particles such as silver particles.
  • the conductive material may preferably not include lead.
  • the conductive material may further include glass particles.
  • the glass particles may be provided in any suitable form, such as pellet particles granule form), flakes (i.e., scalelike form), or glass fibers (i.e., threadlike form). Any suitable chemical compositions of the glass particles may be used such as, but not limited to, soda- lime silicate glass, borosilicate glass, bismuth-oxide containing glass, borate glass including zinc oxide borate glass.
  • Both of the conductive material precursor layer and the connectable material precursor layer may contain metal particles and glass particles. Heating these layers may provide the conductive material layer 20 and the connectable material layer 30, both of which contain a metal-containing material and a glass material.
  • Heating of the connectable material precursor layer may be carried out earlier than the heating of the conductive material precursor layer in order to obtain the connectable material layer 30 which contains a metal-containing material and a glass material.
  • the metal-containing material and the glass material in the conductive material layer 20 and the connectable material layer 30 may be the same metal-containing material and glass material, respectively.
  • the glass particles in the conductive material precursor layer and the glass material in the conductive material layer 20 may be the same glass material as a glass substrate 40 to be connected to.
  • the content of the glass particles in the conductive material precursor layer may be lower than that in the connectable material precursor layer or the content of the glass material in the connectable material layer.
  • the glass particles in the conductive material precursor layer may provide a mechanical connection to the connectable material layer 30 and/or the glass substrate 40 by fusing.
  • the glass particles in the laminate may fuse.
  • the glass particles within the conductive material precursor layer may fuse with each other, descend and fuse with a glass component within the underlying connectable material precursor layer or connectable material layer 30, and optionally the glass substrate 40, which may include a ceramic paste layer applied to the glass substrate 40.
  • Metal particles within the conductive material precursor layer may fuse in parallel with the fused glass particles. Consequently, between and above the fused glass particles, fused metal particles or a resulting metal-containing material may be in contact with the connector 10 and the connectable material layer 30.
  • the conductive material precursor layer may sinter to the connector 10 and the connectable material precursor layer or the connectable material layer 30.
  • the conductive material precursor layer may also bond to the glass substrate 40 during the thermal treatment.
  • High temperatures may soften or melt the conductive material such that it bonds to the connector 10 and either the connectable material precursor layer or the connectable material layer 30.
  • the conductive material precursor layer may then be cooled and hardened to provide the conductive material layer 20 in the glass product 1 as shown in FIG. I .
  • Content of the metal-containing material may be relatively higher in an upper part of the conductive material layer 20 than in a lower part.
  • Content of the glass material, i.e., the fused glass particles may be relatively higher in the lower part of the conductive material layer 20 than in upper part.
  • the glass material in a lower part of the conductive material layer 20 may achieve bonding to the connectable material layer 30, the glass substrate 40, and/or the ceramic layer applied to the glass substrate 40, Content of the glass material in the conducti ve material layer 20 may be lower than that in the connectable material layer 30, and may be 1 to 20 mass%, and preferably 1 to 15 mass%.
  • the metal-containing material in an upper part of the conductive material layer 20 may bond to the connector 10, which may contain a metal-containing material.
  • the conductive material layer 20 may contain at most 5 mass% of organic materials, preferably 1 mass% of organic materials, more preferably contain no organic materials. Examples of the organic materials include a dispersion medium and binder.
  • the conductive material layer 20 may have a thickness of 1 to 50 ⁇ m, preferably 1 to 40 pm, and more preferably 2 to 30 ⁇ m, and still more preferably 3 to 10 ⁇ m.
  • FIG. 4 illustrates a glass product 2 produced by a method according to an exemplary aspect of the present disclosure.
  • the connectable material layer 31 may include voids 60 particularly in an area for attachment to a connector 10, as shown in FIG . 4.
  • Voids 60 may be in the form of lines, circles, ovals, squares, or any other shape.
  • voids 60 may be round with a diameter of 0.1 mm to 5 mm, more preferably 0.5 mm to 2 mm, still more preferably 0,8 mm to 1,2 mm.
  • the voids 60 may be formed continuous with each other.
  • a printed connectable material layer 31 may have an attachment area printed in a dot patern, wherein the areas around the dots of material provide voids 60 for the connector attachment.
  • the voids 60 may be formed by deleting a portion or portions of the coating.
  • the printed pattern may include voids 60.
  • the voids 60 may provide an opening for exposing the underlying glass substrate 40 or a ceramic paste layer on the glass substrate 40.
  • the conductive material precursor layer on the connectable material precursor layer or the connectable material layer 31 contacts the glass substrate 40 or a ceramic paste layer on the glass substrate 40 through the voids 60
  • the conductive material precursor layer may contact the glass substrate through the voids 60
  • the voids 60 in the connectable material layer 31 may be large enough to provide a suitable connection area for the glass particles in the conductive material layer 20 to fuse to the underlying glass or printed surface, but with enough connectable material layer 31 remaining in the connector area to provide a suitable electrical connection to the connector 10.
  • FIGs. 5 and 6 illustrates a glass product 3 or 4 produced by a method according to an exemplary aspect of the present disclosure.
  • a connector 10 may include a pretreatment to improve the connection process during thermal treatment.
  • a metal precursor layer which may include a metal material applied to the bottom surface of the connector 10 which may be positioned against the conductive material precursor layer, so that the metal precursor layer is between the connector and the conductive material precursor layer. Heating of the metal precursor layer during thermal treatment of the laminate may provide the metal layer 70 containing sintered metal particles between the connector 10 and the conductive material layer 20 as shown in FIGs. 5 and 6.
  • a metal material may contain particles of at least one metal or metal compound selected from the group consisting of silver, copper, nickel, alloys thereof, and compounds thereof, preferably including silver, copper, nickel, alloys thereof, or silver oxide, and more preferably including silver or silver alloy.
  • the particles may include particles having an average size of preferably 0.05 ⁇ m to 100 ⁇ m, more preferably 0.2 ⁇ m to 20 ⁇ m, and still more preferably 0.3 ⁇ m to 5 ⁇ m.
  • the particles may cause sintering during the thermal treatment.
  • the metal precursor layer may be preferably provided on a bottom surface of the connector 10 to provide the metal layer 70 for attachment to conductive material 20 by screen printing or bar coating a metal material.
  • the metal material may include a base material such as a dispersion medium or a binder having particles of a metal or metal compound dispersed therein.
  • the dispersion medium and the binder described above with regard to the connectable material may be used.
  • the metal particles of the metal material may be relatively smaller in average diameter than metal particles of the conductive material.
  • the sintering via particles of a metal or metal compound, preferably silver, may provide a strong electrical connection between the connector 10 and the conductive material layer 20.
  • the metal layer 70 may further be provided on a surface of the connectable material layer 30, 31 , either with or without the voids 60, on the glass substrate 40 for sintering to the conductive material layer 20.
  • the metal layer 70 may be provided, for example, over a coating or print in an area tor attachment to a connector 10.
  • the metal layer 70 may have a thickness of 100 nm to 100 ⁇ m, preferably I to 50 ⁇ m, and more preferably 5 to 20 ⁇ m.
  • FIG. 7 illustrates a glass product 5 produced by a method, according to an exemplary aspect of the present disclosure.
  • the conductive material layer 20, which bonds to the connector 10, may contact a ceramic layer 80, i.e., a frit printed on the glass substrate 40 through voids 60 in the connectable material layer 31.
  • the ceramic layer 80 may be provided by heating a ceramic precursor layer including a ceramic paste.
  • the ceramic precursor layer may be on the peripheral edge of the glass substrate 40, and may be provided by, for example, screen printing a ceramic which contains glass particles.
  • the ceramic may contain glass particles, a heat-resistant pigment. a carrier, and optional additives.
  • the size of the glass particles may be appropriately determined in consideration of the coatability of the ceramic, and may be, for example, 0.
  • the content of glass particles can be appropriately adjusted in consideration of the bindability of the ceramic layer 80 to the glass substrate 40 and the color tone of the ceramic layer 80.
  • the glass particles in the conductive material precursor layer and the connectable material precursor layer may. in some further embodiments, fuse with the ceramic precursor layer during the thermal treatment.
  • the ceramic layer 80 may be exposed through voids 60 and/or may be in contact with the conductive material layer 20 in an area next to the connectable material layer 31 .
  • the ceramic layer 80 may be black- colored. Content of a glass material, i.e., fused glass particles, in the ceramic layer 80 may be preferably 50 to 95 mass%.
  • the ceramic layer 80 may have a thickness of 1 ⁇ m to 50 ⁇ m, preferably 5 ⁇ m to 30 ⁇ m, more preferably 10 ⁇ m to 20 ⁇ m.
  • a connector 10 used in the methods disclosed herein may include metal connectors.
  • Some connectors 10 may include silver, iron, nickel, chromium, cobalt, iron-nickel alloy such as Invar® 48, or combinations thereof, such as an iron-nickel connector, an iron-chromium connector, or an iron-nickel-cobalt connector.
  • a surface of the connector 10 may have at least one metal plating layer, which may contain at least one metal selected from the group consisting of nickel, copper, and silver.
  • the connector 10 has a thermal expansion profile similar to that of an underlying glass substrate 40, which may be a soda-lime silicate glass.
  • the soda-lime sil icate glass may have coefficient of thermal expansion (CTE) in a range of 80 to measured as an averaged value in a range of temperature from 30 °C to 500 °C), depending on a chemical composition of the soda-lime silicate glass.
  • CTE of the soda-lime glass may be in a range of 85
  • a difference of CTE between the connector 10 and the glass substrate 40 may be at most 10 x 10 -7 /°C, preferably at most 5 x 10 -7 /°C, and more preferably at most 3 x 10 -7 /°C.
  • Materials having a similar heating profile may heat and cool at similar rates. If the materials cool and harden at different rates, the materials experience stress and may form cracks. Selections of materials having similar heating profiles may allow for the connector 10 and the glass substrate 40 to cool and contract at similar rates. The similar cooling and contraction may avoid cracks where the connector 10 is bonded to the glass.
  • the connector 10 may include iron and nickel.
  • FIGs. 2A, 2B, 2C and 2D illustrate steps of attaching a connector 10 to a glass substrate 40, according to an exemplary aspect of the present disclosure.
  • FIGs. 3 A, 3B, and 3C illustrate steps of attaching a connector 10 to a glass substrate 40, according to another exemplary aspect of the present disclosure.
  • the conductive material layer 20 may be applied in any suitable way.
  • the conductive material precursor layer 25 may be applied at least to the connectable material precursor layer 35 on the glass substrate 40 shown in FIG, 2A, followed by positioning the connector 10 over the conductive material precursor layer 25, optionally with an adhesive 50, as shown in FIGs. 2G and 2D.
  • Adhesive 50 may be applied to either the conductive material precursor layer 25 or the connector 10. Applying the conductive material precursor layer 25 may include screen printing. The conductive material precursor layer 25 may be screen printed onto a glass substrate 40 and/or the connectable material precursor layer 35 as well. The conductive material precursor layer 25 may be dried after application to the desired surface. The conductive material precursor layer 25 may be positioned on the glass substrate 40 and/or the connectable material precursor layer 35 in a position for attachment of the connector 10, Alternatively, as shown in FIG. 3B, the conductive material precursor layer 25 may be applied on a bottom surface of the connector 10 shown in FIG. 3A, followed by positioning the connector 10 over the connectable material precursor layer 35 on the glass substrate 40, optionally with an adhesive 50, as shown in FIG. 3C.
  • Adhesive 50 may be applied to the connector 10 and or the conductive material precursor layer 25 or the connectable material precursor layer 35. In either case, the connectable material layer 30 may be prepared by heating the connectable material precursor layer 35 before applying the conductive material precursor layer 25 or positioning the connector 10 with the conductive material precursor layer 25.
  • An adhesive 50 may be in any suitable form, such as a paste or a tape, and may be any suitable material, such as a ceramic adhesive or an organic adhesive such as an acrylic or methacrylic adhesive. The adhesive 50 may, in certain embodiments, evaporate or otherwise burn off during the thermal treatment, and may not remain in the glass product.
  • the adhesive 50 may preferably be positioned in an area to contact an outer portion of the bottom surface of the connector 10 so as to allow contact between the conductive material precursor layer 25 and the connector 10 or the connectable material precursor layer 35.
  • the conductive material layer 20 may be positioned in a periphery of the glass substrate 40, such that the conductive material layer 20 may not be visible from a vehicle exterior when the glazing is installed. Some glass substrates 40 may include an opaque print in a periphery which may overlap with the placement of the conductive material layer 20.
  • the conductive material layer 20 may be positioned over the connectable material layer 30.
  • the connectable material layer 30 may include an electrically connectable coating or a printed electrically connectable material. A printed electrically connectable material may include an area printed for the connector attachment.
  • a printed electrically connectable material may be a part of a wiper park heating system.
  • a busbar may be formed on the connectable material layer 30 to which a connector 10 may be attached according to the methods disclosed herein.
  • the conductive material layer 20 may serve as a busbar for the connectable material layer 30 and bond to the connector 10.
  • FIG. 8 illustrates a glass product 6 produced by a method according to an exemplary aspect of the present disclosure.
  • the glass product 6 may have the conductive material layer 20, connectable material layer 31 with the voids 60, and a glass substrate 40 as described above.
  • the connector 11 may include at least one vent 90 which may allow for the release of gases which may be released during the thermal treatment and connection process, as shown in FIG. 8.
  • vent 90 may be in any suitable form, such as a hole, a chimney, or a slot.
  • the vents 90 may be the same or different in form, size, and shape.
  • the vents 90 may be evenly distributed on the connector 1 1.
  • FIG. 9 illustrates a glass product 7 produced by a method according to an exemplary aspect of the present disclosure.
  • a laminate which can provide the glass product 6 shown in FIG. 8 may also provide the glass product 7 shown in FIG. 9, depending on the conditions.
  • the conductive material may soften, ascend through the vents 90 to the top of the connector 1 1, and flow over the top and side surfaces of the connector 11, so that part connector surface is covered by the conductive material.
  • the conductive material may then be cooled and hardened to provide the conductive material layer 20 which may achieve both the electrical and mechanical connections with the connector 11 and the connectable material layer 31 with the voids 60 on the glass substrate 40 as shown in FIG, 9,
  • Thermal treatment may include a glass bending process.
  • the glass substrate may be bent using the thermal treatment to provide a desired glazing shape.
  • Thermal treatment may be carried out at a temperature of 400°C to 750°C, preferably 450°C to 700°C, more preferably 500°C to 650°C.
  • the laminate may be heated and the glass substrate may be bent at a temperature of at least 530°C.
  • a stack of materials including a flat glass substrate may be heated to a temperature of at least 530°C, and more preferably at least about 580°C.
  • the laminate may be positioned on a frame during the heating which may help to shape the glass substrate.
  • a flat glass substrate may be paired with another glass substrate.
  • the paired glass substrates may be laminated together after such thermal treatment.
  • gravity may be implemented to form a desired glass shape.
  • a mold may be pressed into the laminate to form a desired shape in the glass.
  • a glass substrate may be bent without pairing.
  • Such a glass substrate may be laminated io another glass substrate or remain a single glass substrate.
  • a single glass substrate may be tempered or heat strengthened.
  • the thermal treatment may not include bending the glass substrate.
  • a connector 10, 11 may be positioned on a glass substrate 40 prior to thermal treatment with a conductive material precursor layer 25 between the connector 10, 11 and the glass substrate 40.
  • the connector 10, 1 1 may be held in place prior to thermal treatment with an adhesive 50.
  • the adhesive 50 may be applied where a connector 10, 11 meets the glass substrate 40.
  • the conductive material precursor layer 25 may have an adhesive quality such that the connector 10, 1 1 may be held in place through the thermal treatment.
  • the conductive material layer 20 may include silver in some preferable embodiments.
  • the conductive material precursor layer 25 may be positioned between the connector 10, 11 and either the connectable material precursor layer 35 or the connectable material layer 30, 31, and dried prior to thermal treatment of the laminate.
  • the conductive material precursor layer 25 may bond to the connector 10, 11 and either the connectable material precursor layer 35 or the connectable material layer 30, 31 , and glass particles within the conductive material precursor layer 25 may fuse to each other and the underlying glass substrate 40, including the ceramic paste layer applied to the glass substrate 40,
  • the conductive material precursor layer 25 and the conductive material layer 20 may have a metal content such that a suitable electrical connection may be made between an underlying connectable material layer 30. 31 and a connector 10, 11.
  • a higher metal content in the conductive material precursor layer 25 or the conductive material layer 20 may correlate to a stronger electrical connection between the materials.
  • the laminate may then be cooled,
  • a connector 10, 1 1 mmy be electrically and mechanically connected to a glass substrate 40.
  • the electrical and mechanical connection may be made with a conductive material layer 20 which bonds to the connector 10, 11 and the underlying glass substrate 40, including the connectable material layer 30, 31 on the glass substrate 40,
  • a glass substrate 40 having such a connector 10, 1 1 may remain a single glass substrate or be laminated with another glass substrate.
  • a glass product 1 , 2, 3, 4, 5, 6, 7, whether laminated or not may include one or more than one connector 10, 1 1 . W here there is more than one connector 10, 1 1 on the glass substrate 40, the connectors 10, 1 1 may be attached to the connectable material layer 30, 31 in the same or different ways.

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  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)

Abstract

Procédé de fixation d'un connecteur à un substrat de verre consistant à : thermiquement traiter un stratifié comprenant un substrat de verre, une couche de matériau pouvant être connectée ou une couche de précurseur de matériau pouvant être connectée sur le substrat de verre, une couche de précurseur de matériau conducteur contenant des particules de verre sur la couche de matériau pouvant être connectée ou la couche de précurseur de matériau pouvant être connectée, et un connecteur sur la couche de précurseur de matériau conducteur. La couche de précurseur de matériau conducteur se lie au connecteur, et soit à la couche de matériau pouvant être connectée, soit à la couche de précurseur de matériau pouvant être connectée lors du traitement thermique du stratifié.
PCT/US2021/054366 2020-10-12 2021-10-11 Procédé de fixation d'un connecteur à un substrat de verre et produit de verre WO2022081453A1 (fr)

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US202063090466P 2020-10-12 2020-10-12
US63/090,466 2020-10-12

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007110610A1 (fr) * 2006-03-24 2007-10-04 Pilkington Group Limited connecteur électrique
WO2015040417A1 (fr) * 2013-09-20 2015-03-26 Pilkington Group Limited Connecteur électrique
US9520665B2 (en) 2012-08-10 2016-12-13 Asahi Glass Company, Limited Electrically connecting structure, glass plate with terminal having the same, and method of manufacturing glass plate with terminal
EP3379899A1 (fr) * 2017-03-22 2018-09-26 Central Glass Co., Ltd. Vitre de véhicule comportant un connecteur électrique soudé par brasure sans plomb
WO2021003267A1 (fr) * 2019-07-03 2021-01-07 Carlex Glass America, Llc Vitrage muni d'un connecteur électrique

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007110610A1 (fr) * 2006-03-24 2007-10-04 Pilkington Group Limited connecteur électrique
US9520665B2 (en) 2012-08-10 2016-12-13 Asahi Glass Company, Limited Electrically connecting structure, glass plate with terminal having the same, and method of manufacturing glass plate with terminal
WO2015040417A1 (fr) * 2013-09-20 2015-03-26 Pilkington Group Limited Connecteur électrique
EP3379899A1 (fr) * 2017-03-22 2018-09-26 Central Glass Co., Ltd. Vitre de véhicule comportant un connecteur électrique soudé par brasure sans plomb
WO2021003267A1 (fr) * 2019-07-03 2021-01-07 Carlex Glass America, Llc Vitrage muni d'un connecteur électrique

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