WO2022068535A1 - 电路板组件和电子设备 - Google Patents

电路板组件和电子设备 Download PDF

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Publication number
WO2022068535A1
WO2022068535A1 PCT/CN2021/116854 CN2021116854W WO2022068535A1 WO 2022068535 A1 WO2022068535 A1 WO 2022068535A1 CN 2021116854 W CN2021116854 W CN 2021116854W WO 2022068535 A1 WO2022068535 A1 WO 2022068535A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
cover
conductive
printed circuit
conductive member
Prior art date
Application number
PCT/CN2021/116854
Other languages
English (en)
French (fr)
Inventor
史洪宾
郭鑫
王利湘
涂海生
郑本银
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to EP21874196.5A priority Critical patent/EP4207953A4/en
Priority to US18/246,036 priority patent/US20230363087A1/en
Publication of WO2022068535A1 publication Critical patent/WO2022068535A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/03—Covers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09027—Non-rectangular flat PCB, e.g. circular
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit

Definitions

  • the embodiments of the present application relate to the technical field of electronic devices, and more particularly, to a circuit board assembly and an electronic device.
  • PCB also known as printed circuit board, printed circuit board
  • PCB is one of the important components of the electronics industry. Printed circuit boards are used in most electronic devices as a support for electronic components and as a carrier for electrical connection of electronic components.
  • the shape of the printed circuit board can be adaptively designed according to the internal space of the electronic device and the arrangement of the electronic components, so the printed circuit board usually includes parts with different widths. Where the width of the printed circuit board is narrow, there are often impedance bottlenecks and the risk of board breakage, which affects the electrical performance and mechanical reliability of the printed circuit board.
  • the present application provides a circuit board assembly and electronic equipment, which can reduce the impedance of the circuit board, improve the utilization rate of current, and also improve the mechanical reliability of the circuit board.
  • a circuit board assembly comprising: a printed circuit board, the printed circuit board includes a functional network, the functional network is used to provide electrical functions; a conductive member, the conductive member and the printed circuit board connected, wherein the conductive element and the functional network are electrically connected in parallel; a cover-like structure covers the conductive element and is connected to the printed circuit board, the cover-like structure It is used to prevent the conductive member located in the cover-like structure from contacting the conductor outside the cover-like structure.
  • a printed circuit board can include functional networks and non-functional networks, wherein functional networks can provide a certain electrical function, such as charging, radio frequency, antenna, multimedia, data storage, sensors, etc.; non-functional networks can not provide electrical functions, Mainly for the purpose of mechanical connection, the non-functional network is usually grounded (ground, GND) or suspended (not connected to any functional network or GND network), which is used to isolate the structural components carried on the printed circuit board from the functional network to avoid misuse. Electric shock or equipment damage due to contact.
  • the conductive sheet is electrically connected to the functional network, and the conductive sheet can transmit the current in the functional network.
  • the circuit board assembly provided by the embodiment of the present application includes a conductive member electrically connected in parallel with the functional network, and the conductive member can transmit current, so that the conductive member provides a path for the current in the functional network, which can reduce the impedance of the circuit board.
  • the impedance of the circuit board is reduced, the heat generated is correspondingly reduced, and the utilization rate of the current can be improved.
  • the heat generated by the circuit board is reduced, and the temperature of the circuit board is reduced, so that the temperature of other components that conduct heat of the circuit board, such as the housing of the electronic device, can also be improved, and the heat dissipation of the electronic device can also be improved, and user experience can be improved.
  • the circuit board assembly provided by the embodiment of the present application includes a cover-like structure, and the cover-like structure can isolate the conductive member from the surrounding metal structural members, and prevent the conductive member from contacting the surrounding metal members and causing a short circuit.
  • the design of the conductive member and the cover-like structure can enhance the mechanical reliability of the circuit board and reduce the risk of board breakage.
  • the cover-like structure is made of a metal material, and a gap is provided between the cover-like structure and the conductive member.
  • the cover-like structure is designed to prevent short circuit.
  • the cover-like structure is made of metal material, the gap between the cover-like structure and the conductive member can prevent the short-circuit of the conductive member.
  • an insulating filler may be provided in the gap between the conductive member and the cover-like structure.
  • the printed circuit board further includes a grounding network, wherein the cover-like structure is electrically connected to the grounding network; or, the cover-like structure is not connected to the grounding network.
  • the functional network is electrically connected and not electrically connected to the ground network.
  • the cover-like structure is grounded or suspended, which can prevent the conductive parts from contacting the surrounding metal parts and cause a short circuit.
  • the printed circuit board further includes a non-functional network, the non-functional network is grounded or suspended, and the cover-like structure is connected to the non-functional network.
  • connection between the cover-like structure and the non-functional network includes the following situations: firstly, if the non-functional network is grounded, the cover-like structure is grounded; secondly, when the non-functional network is suspended, the cover-like structure is suspended, that is, the cover-like structure is not electrically connected to the functional network and is not connected to the functional network. Not electrically connected to the ground network.
  • non-functional network included in the printed circuit board is usually grounded or suspended, and is used to isolate the structural components carried on the printed circuit board from the functional network to avoid electric shock or equipment damage caused by wrong contact.
  • the cover-like structure is an insulating material.
  • the gap between the cover-shaped structure and the conductive member is greater than or equal to zero.
  • a gap may or may not be set between the cover-like structure and the conductive member.
  • the insulating material includes insulating glue, fiber products, insulating rubber, insulating plastics and their products, glass, insulating ceramics, and the like.
  • the conductive member is a conductive sheet.
  • the conductive sheet is a preformed sheet-like structure.
  • preform can be understood as not being formed directly on the printed circuit board, but additionally formed away from the printed circuit board.
  • the conductive sheet is a preformed sheet-like structure
  • the conductive sheet and the printed circuit board are connected by solder or conductive glue.
  • the conductive sheet is a sheet-like structure formed after solder is cured, or a sheet-like structure formed after conductive glue is cured.
  • the conductive sheet is a sheet-like structure formed by solidifying the solder liquid
  • the conductive sheet can be directly formed on the printed circuit board.
  • the conductive sheet is a sheet-like structure formed by curing the conductive adhesive
  • the conductive sheet can be directly formed on the printed circuit board.
  • the process flow can be simplified, the cost of additional sheet-like structures can be saved, and the current process flow can be used to complete the conductive sheet setting.
  • the thickness of the conductive member can be made very small, for example, less than 0.2 mm, so that the overall height of the conductive member and the cover-like structure can be reduced, and a smaller internal space can be occupied.
  • the material of the conductive member is any one of the following: a single-component metal material, an alloy material, and a conductive composite material.
  • the single-component metal includes copper, aluminum, silver, and the like.
  • the alloys include copper alloys (also called white copper alloys), aluminum alloys, and the like.
  • the conductive composite material includes conductive plastic, conductive rubber, conductive fiber fabric, conductive paint, conductive adhesive, and the like.
  • the conductive member is fixedly connected to the printed circuit board.
  • the cover-like structure is fixedly connected to the printed circuit board.
  • the printed circuit board includes a separable first circuit board part and a second circuit board part, wherein the first circuit board part includes a first connection area, a second connection area arranged around the first connection area and an extension area extending outward from the second connection area; the first connection area is connected with the conductive member; the second connection area and the The extension area is connected with the cover-like structure; the extension area and the second circuit board are partially staggered.
  • the extension area of the first circuit board part can increase the contact area between the cover-shaped structure and the printed circuit board, further enhance the mechanical strength of the circuit board, and improve the mechanical reliability of the circuit board.
  • the extension area of the first circuit board part is staggered with the second circuit board part, and correspondingly, the cover-like structure is staggered with the second circuit board part, which can further improve the mechanical reliability of the circuit board.
  • the printed circuit board includes a lateral broad area and a longitudinally extending narrow strip area, and the width of the narrow strip area is smaller than the width of the broad area, The conductive member and the cap-like structure are disposed on the narrow strip area.
  • the circuit board may be an L-shaped circuit board.
  • the conductive member and the cover-like structure are arranged in the narrow strip area, which can reduce the impedance of the narrow strip area, improve the heat dissipation of the narrow strip area, enhance the mechanical strength of the narrow strip area, and improve the reliability.
  • the functional network includes a charging line and/or a power supply line.
  • the charging line is a voltage bus (VBUS) line.
  • VBUS voltage bus
  • the power supply line is a network for supplying power to a display screen of the electronic device, a network for supplying power to an audio module of the electronic device, and the like.
  • the printed circuit board is a circuit board with a charging function.
  • the contact area of the conductive member and the printed circuit board is greater than the first threshold.
  • the selection of the first threshold value here can be determined according to actual needs, that is, the contact area between the conductive member and the printed circuit board can meet the requirement of enhancing the mechanical strength of the circuit board so that no wire breakage or even board breakage occurs.
  • a circuit board assembly comprising: a printed circuit board, the printed circuit board includes a functional network, the functional network is used to provide electrical functions; a conductive member, the conductive member is connected to the printed circuit board connected, wherein the conductive member is electrically connected to the functional network in parallel; the exposed surface of the conductive member is covered with an insulating layer.
  • the circuit board assembly provided by the embodiment of the present application includes a conductive member electrically connected in parallel with the functional network, and the conductive member can transmit current, so that the conductive member provides a path for the current in the functional network, which can reduce the impedance of the circuit board.
  • the impedance of the circuit board is reduced, the heat generated is correspondingly reduced, and the utilization rate of the current can be improved.
  • the heat generated by the circuit board is reduced, and the temperature of the circuit board is reduced, so that the temperature of other components that conduct heat of the circuit board, such as the housing of the electronic device, can also be improved, and the heat dissipation of the electronic device can also be improved.
  • the insulating layer is coated on the conductive member, which can isolate the conductive member from the surrounding metal structural members, and prevent the conductive member from contacting the surrounding metal members and causing a short circuit.
  • the design of the conductive parts can enhance the mechanical reliability of the circuit board and reduce the risk of board breakage.
  • the insulating layer is coated on the conductive parts, there is no need to provide a special short-circuit proof structure separated from the conductive parts on the circuit board, which can reduce the thickness of the circuit board and save the cost of the special short-circuit proof design separated from the conductive parts. Soldering short-circuit problems between conductive parts and short-circuit proof structures are avoided.
  • the conductive member may be a sheet-like structure or a cap-like structure.
  • the non-connecting surface of the sheet-like structure is covered with an insulating layer, wherein the non-connecting surface is the surface of the sheet-like structure other than the surface connected to the printed circuit board .
  • the conductive member is a cover-like structure
  • the exposed surface of the cover-like structure is covered with an insulating layer.
  • the conductive member is a conductive sheet or a cap-like structure.
  • the conductive sheet is a preformed sheet-like structure.
  • the conductive sheet is a preformed sheet-like structure
  • the conductive sheet and the printed circuit board are connected by solder or conductive glue.
  • the conductive sheet is a sheet-like structure formed after solder is cured, or a sheet-like structure formed after conductive glue is cured.
  • the material of the conductive member is any one of the following: a single-component metal material, an alloy material, and a conductive composite material.
  • the conductive member is fixedly connected to the printed circuit board.
  • the printed circuit board includes a lateral broad area and a longitudinally extending narrow strip area, the width of the narrow strip area is smaller than the width of the broad area, The conductive member is disposed on the narrow strip area.
  • the functional network includes a charging line and/or a power supply line.
  • the printed circuit board is a circuit board with a charging function.
  • an electronic device including the first aspect or the second aspect and the circuit board assembly described in any possible implementation manner of the first aspect or the second aspect.
  • the electronic device includes a mobile phone, a watch, a wristband, a tablet computer, and the like.
  • 1 is a schematic structural diagram of an electronic device
  • Figure 2 is a schematic exploded view of the electronic device in Figure 1;
  • FIG. 3 is a schematic cross-sectional view of the electronic device in FIG. 1 taken along line B-B;
  • Fig. 4 is a schematic top view of the internal structure of the electronic device in Fig. 1;
  • FIG. 6 is a schematic structural diagram of a reinforcing structure provided by an embodiment of the present application.
  • FIG. 7 is a schematic structural diagram of another reinforcing structure provided by an embodiment of the present application.
  • FIG. 8 is a schematic structural diagram of another reinforcing structure provided by an embodiment of the present application.
  • FIG. 9 is a schematic structural diagram of another reinforcing structure provided by an embodiment of the present application.
  • FIG. 10 is a schematic diagram of strain simulation of the reinforcement structure provided by the embodiment of the present application and the existing reinforcement structure.
  • first”, “second”, etc. are only used for description purposes, and should not be understood as indicating or implying relative importance or implying the number of indicated technical features.
  • a feature defined as “first”, “second”, etc. may expressly or implicitly include one or more of that feature.
  • orientations or positional relationships indicated by the terms “upper”, “lower”, “inner”, “outer”, etc. are defined relative to the orientations or positions in which the components in the drawings are schematically placed, and should be It is understood that these directional terms are relative concepts, and they are used for relative description and clarification, rather than indicating or implying the particular orientation that the referred device or component must have, or be constructed and operated in a particular orientation, It can be changed correspondingly according to the change of the orientation of the components in the drawings, so it should not be construed as a limitation on the present application.
  • FIG. 1 shows a schematic structural diagram of an electronic device 100 .
  • FIG. 2 shows an exploded schematic view of the electronic device 100 in FIG. 1 .
  • FIG. 3 shows a schematic cross-sectional view of the electronic device 100 in FIG. 1 taken along the line G-G.
  • FIGS. 1 to 3 only schematically illustrate some components included in the electronic device 100 , and the shapes, sizes and configurations of these components are not limited by FIGS. 1 to 3 .
  • the electronic device 100 may further include more or less components than those shown in the drawings, which are not limited in the embodiments of the present application.
  • the types of the electronic device 100 are different, and the components included in the electronic device 100 are different, and the structure of the electronic device provided in the embodiments of the present application is only an exemplary description.
  • the electronic device 100 in this embodiment of the present application may be a handheld device, a vehicle-mounted device, a wearable device, a computing device, or other processing device connected to a wireless modem.
  • the electronic device 100 includes, but is not limited to, a cellular phone, a smart phone, a personal digital assistant (PDA) computer, a tablet computer, a laptop computer, a laptop computer, a smart Watch (smart watch), smart bracelet (smart wristband), car computer and other electronic equipment.
  • PDA personal digital assistant
  • the specific form of the electronic device 100 is not particularly limited in the embodiments of the present application.
  • the following description takes the electronic device 100 as a terminal device such as a mobile phone as an example.
  • the electronic device 100 may include a housing 10 , a display panel (DP) 20 , a printed circuit board (PCB) 30 , and a circuit board support 40 .
  • DP display panel
  • PCB printed circuit board
  • the housing 10 is formed with an accommodating space for accommodating the components of the electronic device 100 .
  • the casing 10 can also play a role of protecting the electronic device 100 and supporting the whole machine.
  • the display screen 20 , the printed circuit board 30 and the circuit board support 40 are disposed in the accommodating space of the casing 10 and connected with the casing 10 .
  • the housing 10 may include a frame 11 , a middle frame 12 and a rear cover 13 .
  • the middle frame 12 is a support frame located inside the electronic device 100 , and is generally formed of a metal material, and can be used as a ground (ground, GND) of the electronic device 100 .
  • the display screen 20 and the back cover 13 are disposed on both sides of the middle frame 12 .
  • the middle frame 12 includes a first surface 101 and a second surface 102 disposed opposite to each other.
  • the first surface 101 is close to the back cover 13 and the second surface 102 is close to the back of the display screen 20 .
  • a first cavity 103 may be formed between the back cover 13 and the middle frame 12
  • a second cavity 104 may be formed between the display screen 20 and the middle frame 12
  • the first cavity 103 and the second cavity 104 are formed as described above.
  • the first cavity 103 can be used to install internal components such as batteries, printed circuit boards, functional modules, cameras, antennas, etc.
  • the second cavity 104 can be used to arrange vibration elements for screen sound or other need to be arranged in the middle frame 12 and the display screen. elements between 20, etc.
  • the display screen 20 has a light-emitting surface capable of displaying images
  • the back of the display screen 20 involved in the embodiments of the present application refers to the side surface of the display screen 20 that is opposite to the above-mentioned light-emitting surface, that is, the display
  • the screen 20 is close to one side surface of the middle frame 12 , that is, the surface of the display screen 20 opposite to the second surface 102 of the middle frame 12 .
  • the frame 11 is a structure surrounding the outer periphery of the electronic device 100 .
  • the frame 11 may extend around the periphery of the electronic device 100 and the display screen 20 , and may specifically surround four sides of the display screen 20 to help fix the display screen 20 .
  • the frame 11 may be a metal frame, and the metal frame is made of metal materials such as copper, magnesium alloy, stainless steel and the like.
  • the frame 11 may also be a non-metal frame (ie, an insulating frame), and the non-metal frame includes a plastic frame, a glass frame, a ceramic frame, and the like.
  • the rear cover 13 is a structure opposite to the display screen 20 on the electronic device 100, and is connected to the frame 11. It is used to seal the components of the electronic device 100 inside the electronic device, and can also prevent dust, collision, and hardware scratches. hurt.
  • the back cover 13 can be a back cover made of a metal material (ie, a metal back cover), or a back cover made of a non-conductive material (ie, a non-metal back cover), such as a glass back cover, a plastic back cover, and the like.
  • the middle frame 11 and the frame 12 may be a separate structure, or may be an integrated structure, which is not limited in the embodiment of the present application.
  • the middle frame 11 and the frame 12 are separated structures, the middle frame 11 and the frame 12 are two different parts of the casing 10, and the two can be assembled together by means of clipping, snap-fitting, etc. can be separated.
  • the middle frame 11 and the frame 12 are integrally constructed, the connection between the middle frame 11 and the frame 12 cannot be divided.
  • the middle frame 11 and the frame 12 are processed by integral molding, or permanent connection methods such as welding are used. Assembled, etc.
  • the integrated middle frame and frame can be considered as the outer periphery of the middle frame serving as the frame of the electronic device 100 .
  • the frame 12 and the back cover 13 may be a separate structure, or may be an integrated structure, which is not limited in the embodiment of the present application.
  • the frame 12 and the back cover 13 are separated structures, the frame 12 and the back cover 13 are two different parts of the casing 10, and the two can be assembled together by means of snap connection, buckle, etc. can be separated.
  • the frame 12 and the back cover 13 are integrally formed, the connection between the frame 12 and the back cover 13 cannot be divided.
  • the frame 12 and the back cover 13 are processed by integral molding, or permanent connection methods such as welding are used. Assembled, etc.
  • the integrated frame and back cover can be considered as the periphery of the back cover 13 serving as the frame of the electronic device 100 .
  • the display screen 20 and the back cover 13 are respectively disposed on two sides of the middle frame 12 and connected to the middle frame 12 respectively.
  • the printed circuit board 30 and the circuit board support 40 are disposed between the middle frame 12 and the back cover 13 , the printed circuit board 30 is close to the middle frame 12 , and the circuit board support 40 is close to the back cover 13 .
  • the circuit board support 40 is connected with the middle frame 12 , and the printed circuit board 30 located between the circuit board support 40 and the middle frame 12 can be fixed.
  • the display screen 20 is used to display images.
  • the display screen 20 may be a liquid crystal display (LCD) screen, an organic light emitting diode (organic light emitting diode, OLED) display screen, etc., wherein the OLED display screen may be a flexible display screen or a rigid display screen.
  • the display screen 20 can be an ordinary regular screen, a special-shaped screen, a foldable screen, etc.
  • the display screen 20 can be relatively freely rotated or folded to form an arc, a polygonal prism, and the like.
  • the printed circuit board 30 is a support body for electronic components, and also serves as a carrier for electrical connection of electronic components.
  • the printed circuit board 30 has a function of supporting circuit elements and interconnecting the circuit elements.
  • the electronic components include but are not limited to capacitors, inductors, resistors, processors, memories, cameras, flashlights, microphones, batteries, antennas, and the like.
  • PCBA printed circuit board assembly
  • the printed circuit board 30 may employ a FR-4 dielectric board, a rogers dielectric board, a mixed media board of rogers and FR-4, and the like.
  • FR-4 is the code name for a flame-resistant material grade
  • the rogers dielectric board is a high-frequency board.
  • the printed circuit board 30 may be a single-sided board, a double-sided board, a multi-layer circuit board, or the like.
  • the printed circuit board 30 may be a ceramic circuit board, an alumina ceramic circuit board, an aluminum nitride ceramic circuit board, an aluminum substrate, a high-frequency board, a thick copper board, an impedance board, or the like.
  • the printed circuit board 30 may also be referred to as a motherboard in some embodiments.
  • the printed circuit board 30 is provided with conductive patterns, and the electronic components can be electrically connected by wiring between different conductive patterns.
  • the routed printed circuit board 30 may include functional nets and non-functional nets, wherein the functional nets may provide an electrical function, such as charging, radio frequency, antenna, multimedia, data storage, sensors, etc.; the non-functional nets may not provide electrical functions , mainly to achieve the purpose of mechanical connection between the welded structure and the PCB, the non-functional network is usually grounded (ground, GND) or suspended (not connected to any functional network or GND network), used to connect the printed circuit board 30
  • the bearing structure is isolated from the functional network to avoid electric shock or equipment damage caused by wrong contact.
  • the PCB pad corresponding to the metal cover on the side of the printed circuit board 30 close to the housing 10 can be set as a GND metal layer, and the metal layer can be formed by etching metal on the surface of the printed circuit board 30 .
  • This metal layer is part of the non-functional network.
  • the circuit board bracket 40 is disposed between the printed circuit board 30 and the casing 10 (specifically, the rear cover 13 ), and is mainly used to fix the printed circuit board 30 on the casing 10 (specifically, the middle frame 12 ).
  • the circuit board support 40 may be made of metal, serving as a conductive GND.
  • the circuit board support 40 may also be an insulating support, on which metal parts may be arranged.
  • the electronic components carried on the printed circuit board 30 can form a plurality of functional modules to realize corresponding functions, such as a charging management module for receiving charging input from a charger, a power management module for supplying power to a display screen, etc., a wireless communication module and a mobile
  • the communication module is used to realize the communication function of the electronic device
  • the audio module is used to realize the audio function and so on.
  • the shape of the printed circuit board 30 can be correspondingly designed according to the shape of the electronic device and the positions and shapes of the functional modules to be arranged inside the electronic device.
  • FIG. 2 exemplarily shows a battery 51 and a charge management module 52 , as well as a schematic structure of a printed circuit board 30 .
  • a schematic diagram of the installation positions of the printed circuit board 30 , the battery 51 , and the charging management module 52 is shown in FIG. 4 .
  • the structure of the printed circuit board can be designed to be L-shaped, such as the L-shaped circuit board 31 .
  • the L-shaped circuit board 31 includes a lateral body region 301 and a narrow strip region 302 extending longitudinally from the body region 301 .
  • the body region 301 and the strip region 302 are provided around the battery 51 .
  • the main body area 301 belongs to the wide area compared to the narrow strip area 302 , that is, the width of the main body area 301 is larger than the width of the narrow strip area 302 .
  • the main body area 301 of the L-shaped circuit board 31 is provided with a charging management module 52 connected to the circuit board.
  • the L-shaped circuit board 31 is provided with a charging interface board-to-board connector (BTB) (referred to as charging interface BTB) 63 and a battery board-to-board connector (referred to as battery BTB) 64, wherein the charging interface
  • BTB charging interface board-to-board connector
  • battery BTB battery board-to-board connector
  • the charging interface 61 is disposed at the edge of the electronic device, and the charging interface 61 and the charging interface BTB 63 can be connected through a flexible printed circuit (FPC) 62 .
  • the charging interface 61 can be a mini (mini) universal serial bus (universal serial bus, USB) interface, a micro (micro) USB interface, a type-A (type-A) USB interface, a type-B (type-B) USB interface, Type-C (type-C) USB interface, etc. It should be understood that the specific type of the charging interface 61 can be selected according to different types of electronic devices, which is not limited herein.
  • the charging path on the circuit board is also schematically shown in FIG. 4 .
  • the charging interface 61 can be connected to an external power supply, for example, the charging interface 61 is connected to an external 220V power socket through a charging cable and a charging adapter.
  • the charging interface 61 can obtain the voltage/current for charging the battery 51 from an external power source.
  • the voltage/current is sequentially transmitted to the charging management module 52 through the flexible circuit board 62, the charging interface BTB 63, and the circuit board 31.
  • the charging management module 52 can convert the voltage obtained from the outside into the voltage of the battery 51, and simultaneously charge the battery 51 through the battery BTB 64 in a precise and controllable manner according to the required charging current.
  • the battery 51 can supply power to the electronic components mounted on the circuit board 31 through the battery BTB 64 under the condition of storing power.
  • the battery 51 can supply power to the display screen to maintain the brightness and refresh rate of the display screen, can supply power to the audio module to emit sound, and can also supply power to the communication module to transmit radio frequency signals.
  • the charging current of the battery 51 needs to be transmitted through the charging circuit on the circuit board.
  • the power supply current of the battery 51 needs to be transmitted through the power supply line on the circuit board.
  • printed circuit boards are installed in most electronic devices to realize the electrical interconnection of electronic components. Since the internal structure of electronic equipment is relatively complex, the shape of the printed circuit board used to carry electronic components also needs to be designed according to actual needs. When the shape of the printed circuit board is irregularly designed, there will generally be a portion with a narrow width, such as the narrow strip area 302 of the L-shaped circuit board 31 shown in FIG. Wait.
  • Fig. 5 shows a schematic structural diagram of a conventional reinforcement structure.
  • a stainless steel sheet 305 can be welded on the area 303 to strengthen the strength of the circuit board and reduce the breakage of the circuit board. board risk.
  • the reinforcing structure stainless steel sheet 305 is usually grounded (GND).
  • the embodiment of the present application provides a reinforcement structure, which can not only improve the mechanical reliability of the circuit board, but also reduce the impedance of the circuit board and improve the utilization rate of the current.
  • FIG. 6 shows a schematic structural diagram of a reinforcing structure provided by an embodiment of the present application.
  • the following embodiments refer to the area on the printed circuit board where the reinforcement structure needs to be arranged as the reinforcement area.
  • the reinforced area may be an area on the printed circuit board with high impedance, such as a narrow area on the printed circuit board or an area with a long path through which current flows on the printed circuit board, the reinforced area It may also be an area on a printed circuit board that needs to pass a large current.
  • the reinforcing structure in the embodiment of the present application includes a conductive sheet 311 and a cover-shaped structure 312 .
  • the conductive sheet 311 is a preformed sheet-like structure for providing a path for current.
  • the cover-shaped structure 312 is a hollow cover-shaped, and a receiving space is formed thereon, and the receiving space is used for receiving the conductive sheet 311 .
  • the cover-like structure 312 is used to isolate the conductive sheet 311 from the surrounding metal structures to prevent short circuit.
  • the printed circuit board 32 includes a reinforcement region 304 .
  • the reinforcement area 304 includes a first connection area 304a and a second connection area 304b, and the second connection area 304b is arranged around the first connection area 304a.
  • the first connection area 304a is used for connecting the conductive sheet 311, wherein the conductive sheet 311 is disposed in parallel with (eg, attached to) the first connection area 304a.
  • the structure after the conductive sheet 311 is provided in the reinforcement area 304 is shown as the reinforcement area 306 in FIG. 6 .
  • the first connection area 304a is connected to the functional network on the printed circuit board 32, the conductive sheet 311 is electrically connected to the first connection area 304a, and the conductive sheet 311 and the functional network of the printed circuit board 32 are connected in parallel electrical connection.
  • the conductive sheet 311 can reduce the impedance of the reinforcement region 304 .
  • the impedance of the reinforcement area 304 is reduced, and the heat generated in the reinforcement area 304 is reduced, which can reduce the temperature of the circuit board 32, thereby reducing the temperature of other components that conduct heat of the circuit board, such as the housing of the electronic equipment, which can improve the heat dissipation of the electronic equipment.
  • Improve user experience The heat generated by the circuit board is reduced, and the utilization rate of the current is correspondingly improved.
  • the second connection area 304b is used to connect the cap-like structure 312 .
  • the cover-like structure 312 covers the conductive sheet 311, that is, when the cover-like structure 312 is disposed in the second connection area 304b, a receiving space is formed between the cover-like structure 312 and the printed circuit board 32, for example, a closed receiving space is provided.
  • the conductive sheet 311 in the first connection area 304a is accommodated in the accommodating space.
  • the structure after the cap-like structure 312 is disposed on the reinforcement area 306 is shown as the reinforcement area 308 in the figure.
  • the cover-like structure 312 in the embodiment of the present application can isolate the conductive sheet 311 from surrounding metal structures, preventing the conductive sheet 311 from contacting the surrounding metal parts and causing a short circuit.
  • the cover-like structure 312 is a short-circuit proof structure.
  • the conductive sheet 311 and the cover-like structure 312 provided in the reinforcement area 304 can enhance the mechanical reliability of the circuit board and reduce the risk of board breakage.
  • the hollow hood-shaped structure 312 has stronger deformation resistance. Therefore, the method of using the hood-shaped structure for reinforcement in the embodiment of the present application is compared with that in the prior art. The way of reinforcing the stainless steel sheet can significantly improve the mechanical reliability of the circuit board.
  • the conductive sheet 311 is a high-conductivity sheet-like structure.
  • the material of the conductive sheet 311 can be a single-component metal (such as copper, aluminum, silver), an alloy (such as copper alloy (also called white copper), aluminum alloy), or a conductive composite material (such as conductive plastic, conductive rubber, conductive fiber fabric, conductive paint, conductive adhesive).
  • the conductive sheet 311 is fixedly connected to the printed circuit board 32 .
  • the fixed connection method may include, but is not limited to, welding, gluing, screw connection, etc., as long as the conductive sheet 311 and the printed circuit board 32 can be fixed together.
  • the conductive sheet 311 and the printed circuit board 32 may be connected by solder (eg, alloy solder) or conductive glue.
  • the first connection area 304 a of the reinforcement area 304 includes a first pad for connecting the conductive sheet 311 , and the first pad is connected to a functional network on the printed circuit board 32 .
  • the conductive sheet 311 can be connected to the printed circuit board 32 by soldering, and is electrically connected in parallel with the functional network on the printed circuit board 32 through the first pad.
  • the thickness of the conductive sheet 311 can be determined according to actual needs such as the internal space of the electronic device, the risk of breakage that can be tolerated, and the electrical performance indicators that need to be met (such as impedance indicators, housing temperature, current utilization efficiency, etc.).
  • the application examples are not specifically limited herein.
  • the thickness of the conductive sheet 311 may be uniform or non-uniform, which is not limited in this embodiment of the present application.
  • the material of the cap-shaped structure 312 may be a conductive material
  • the conductive material includes but is not limited to single-component metals (such as copper, aluminum, silver), alloys (such as copper alloys (also called white copper), aluminum alloys ), conductive composite materials (such as conductive plastics, conductive rubber, conductive fiber fabrics, conductive coatings, conductive adhesives).
  • the material of the cap structure 312 and the material of the conductive sheet 311 may be the same.
  • the material of the cover-like structure 312 may also be an insulating material, and the insulating material includes, but is not limited to, insulating glue, fiber products, insulating rubber, insulating plastics and their products, glass, insulating ceramics, and the like.
  • the cover-like structure 312 is fixedly connected to the printed circuit board 32 .
  • the way of fixing connection may include, but not limited to, welding, gluing, screw connection, etc., as long as the cover-shaped structure 312 and the printed circuit board 32 can be fixed together.
  • the cover-like structure 312 and the printed circuit board 32 may be connected by solder (eg, alloy solder), conductive glue or insulating glue. It should be understood that the cap structure 312 and the printed circuit board 32 include a solder layer or a glue layer, which is not shown in FIG. 6 .
  • the second connection region 304b of the reinforcing region 304 includes a second pad for connecting the cap-shaped structure 312.
  • the cap-shaped structure 312 may be connected to the second pad by soldering.
  • the cover-like structure 312 may be made of a metal material capable of welding.
  • the cover-like structure 312 when the cover-like structure 312 is made of a metal material, the cover-like structure 312 may be connected to the ground network of the printed circuit board 32 through the second pad, or may be in a floating state, that is, not connected to any ground network on the printed circuit board 32 . network connection.
  • the cover-shaped structure when the cover-shaped structure is in a suspended state, it is neither electrically connected to the functional network nor electrically connected to the GND network.
  • the second connection region 304b of the reinforcing region 304 may be provided with conductive glue, and the cover-shaped structure 312 is connected to the printed circuit board 32 through the conductive glue.
  • the cover-like structure 312 may be a metal material or an insulating material.
  • the cover-like structure 312 when the cover-like structure 312 is made of metal material, the cover-like structure 312 may be connected to the ground network of the printed circuit board 32 through conductive glue, or may be in a suspended state, that is, not connected to any network on the printed circuit board 32 . connect.
  • the second connection region 304b of the reinforcing region 304 may be provided with insulating glue, and the cover-shaped structure 312 is connected to the printed circuit board 32 through the insulating glue.
  • a gap may or may not be set between the cover-shaped structure 312 and the conductive sheet 311 , which needs to be determined according to the material of the cover-shaped structure 312 .
  • the cover-like structure 312 when the cover-like structure 312 is made of a metal material, a gap needs to be provided between the cover-like structure 312 and the conductive sheet 311 .
  • the cover-shaped structure 312 is not in contact with the conductive sheet 311 .
  • the gap between the cover-like structure 312 and the conductive sheet 311 can be designed according to actual needs, for example, the gap can be larger than 0.2 mm.
  • an insulating filler may be provided in the gap between the cap-shaped structure 312 and the conductive sheet 311 .
  • a gap may be provided between the cover-like structure 312 and the conductive sheet 311 .
  • the size of the gap can be designed according to the size of the space inside the electronic device, for example, the gap is greater than 0.
  • the cover-shaped structure 312 and the conductive sheet 311 may not be provided with a gap.
  • the cover-shaped structure 312 can be directly in contact with the conductive sheet 311 .
  • the thickness of the cover-like structure 312 can be determined according to actual needs such as the internal space of the electronic device, the tolerable risk of breaking the board, and the electrical performance indicators that need to be satisfied (such as heat dissipation effect, etc.) limited.
  • the thickness of the cover-shaped structure 312 may be uniform or non-uniform, which is not limited in this embodiment of the present application.
  • FIG. 7 shows a schematic structural diagram of another reinforcing structure provided by an embodiment of the present application.
  • the reinforcement structure in FIG. 7 does not require additional soldering of high-conductivity sheet-like structures, but directly prints solder (eg, alloy solder) on the reinforcement area 304 of the printed circuit board 32 . Or dispense conductive glue and cure the solder or conductive glue by heat or optical curing. The cured solder or conductive glue acts directly as a conductive sheet.
  • the conductive sheet shown in FIG. 6 is a preformed sheet-like structure
  • the conductive sheet shown in FIG. 7 may be a sheet-like structure formed by curing solder or conductive glue.
  • the pre-molding can be understood as not being directly molded on the printed circuit board, but being separately molded from the printed circuit board.
  • the conductive sheet is a sheet-like structure formed by curing solder or conductive adhesive
  • the conductive sheet can be a sheet-like structure formed after the solder printed on the printed circuit board is cured, or the conductive adhesive that is dispensed on the printed circuit board is cured flaky structure formed later.
  • the reinforcement area 304 includes a first connection area 304a and a second connection area 304b, and the second connection area 304b is arranged around the first connection area 304a.
  • a conductive sheet 311 is disposed at the first connection region 304a, wherein the conductive sheet 311 is a cured alloy solder or conductive glue. The conductive sheet 311 is electrically connected to the functional network in the printed circuit board 32 .
  • the second connection area 304b is used for connection with the cover-like structure 312 .
  • the structure after the cap-shaped structure 312 is disposed on the reinforcement area 304 is shown as the reinforcement area 308 in the figure.
  • the cover-shaped structure 312 may adopt the structure, material and connection method as shown in FIG. 6 , and the specific reference may be made to the above description, which will not be repeated here.
  • the conductive sheet 311 provides a path for the current in the functional network, increases the cross-sectional area through which the current flows, and can reduce the impedance of the reinforcement region 304 .
  • the impedance of the reinforced area 304 is reduced, the heat generated by the printed circuit board 32 is reduced, the temperature of the circuit board is reduced, and the temperature of other components used to conduct the heat of the circuit board, such as the housing of the electronic equipment, is reduced, and the heat dissipation of the electronic equipment is improved.
  • the utilization of current is improved.
  • the conductive sheet 311 and the cover-like structure 312 can enhance the mechanical reliability of the circuit board and reduce the risk of board breakage.
  • the conductive sheet 311 is a solidified solder (eg, alloy solder), it can be realized by processes such as printing, spot coating, and spraying.
  • a solidified solder eg, alloy solder
  • the alloy solder may be solder paste.
  • the conductive sheet 311 When the conductive sheet 311 is prepared by using solder, the conductive sheet 311 is actually equivalent to a pad. Therefore, the conductive sheet 311 can be simultaneously prepared in the process flow of preparing the pads on the printed circuit board. Since the pad is directly used as the conductive sheet, there is no need for additional welding of sheet-like structures, the process flow is simplified, the cost of additional sheet-like structures is saved, and the setting of the conductive sheet can be completed by using the existing technological process.
  • the conductive sheet 311 is a cured conductive adhesive
  • the conductive adhesive can be firstly applied on the printed circuit board, and the solid conductive sheet 311 can be obtained by heating or optical curing.
  • the conductive adhesive is directly used as the conductive sheet, and there is no need to connect additional sheet-like structural parts, which can simplify the process flow and save costs.
  • a gap may or may not be set between the cover-shaped structure 312 and the conductive sheet 311 , and the specific need is determined according to the material of the cover-shaped structure 312 .
  • FIG. 7 shows a schematic cross-sectional view of the reinforcing region taken along the C-C line, wherein the cap-like structure 312 is separated from the conductive sheet 311 .
  • the thickness of the conductive sheet 311 (that is, the thickness of the solder or conductive glue) can be determined according to the internal space of the electronic device, the risk of breakage that can be tolerated, and the electrical performance indicators (such as impedance indicators, case temperature, current utilization efficiency) that need to be met. etc.) and other actual needs are determined accordingly, and the embodiments of the present application are not specifically limited here.
  • the thickness of the conductive sheet 311 (that is, the thickness of the solder or the conductive adhesive) may be uniform or non-uniform, which is not limited in this embodiment of the present application.
  • the thickness of the conductive sheet can be made very small, for example, less than 0.2 mm, so that the overall height of the reinforcing structure is reduced, and a smaller internal space can be occupied.
  • FIG. 8 shows a schematic structural diagram of another reinforcement structure provided by an embodiment of the present application.
  • the reinforcing structure in Fig. 8 does not require an additional connection to the hood-like structure, but directly sprays an insulating layer on the conductive sheet, and uses the insulating layer as an anti-short-circuit structure. Structural parts are separated.
  • the reinforcing area 304 includes a first connection 304 a, and the first connection 304 a is used for connecting with the conductive sheet 311 .
  • the conductive sheet 311 is connected in parallel with the functional network in the printed circuit board 32 .
  • the conductive sheet 311 may adopt the structure, material and connection method as shown in FIG. 6 , and the details can be referred to the above description, which will not be repeated here.
  • the structure after the conductive sheet 311 is provided in the reinforcement area 304 is shown as the reinforcement area 308 in FIG. 8 .
  • the conductive sheet 311 is covered with an insulating layer 313 , and the insulating layer 313 covers all exposed surfaces of the conductive sheet 311 .
  • All exposed surfaces of the conductive sheet 311 include the surface other than the surface of the conductive sheet 311 that is connected to the printed circuit board 32 (that is, the surface other than the soldering surface, which can also be referred to as a non-connecting surface), that is, including the top and side wall.
  • the thickness of the insulating layer 313 may be 0.01mm-0.2mm, or smaller than 0.01mm, or larger than 0.2mm. It should be understood that the thickness of the insulating layer 313 may be determined according to actual needs such as the internal space of the electronic device, which is not specifically limited in this embodiment of the present application.
  • the insulating layer 313 may be sprayed on the conductive sheet 311 after the conductive sheet 311 is formed or before leaving the factory, or may be sprayed on the conductive sheet 311 after the conductive sheet 311 is connected to the printed circuit board 32, which is not limited in the embodiment of the present application.
  • the conductive sheet 311 provides a path for the current in the functional network, increases the cross-sectional area through which the current flows, and can reduce the impedance of the reinforcement region 304 .
  • the impedance of the reinforced area 304 is reduced, the heat generated by the printed circuit board is reduced, the temperature of the circuit board is reduced, and the temperature of other components used to conduct the heat of the circuit board, such as the housing of the electronic equipment, is reduced, the heat dissipation of the electronic equipment is improved, and the current Utilization is improved.
  • the conductive sheet 311 can enhance the mechanical reliability of the circuit board and reduce the risk of board breakage.
  • the thickness of the conductive sheet 311 can be determined according to actual needs such as the internal space of the electronic device, the risk of breakage that can be tolerated, and the electrical performance indicators that need to be met (such as impedance indicators, housing temperature, current utilization efficiency, etc.).
  • the application examples are not specifically limited herein.
  • the thickness of the conductive sheet 311 may be uniform or non-uniform, which is not limited in this embodiment of the present application.
  • the conductive sheet 311 can also be cured solder or conductive glue or the like. That is, on the basis of the structure shown in FIG. 7 , the cover-shaped structure 312 is omitted, and an insulating layer is directly sprayed on the conductive sheet 311 .
  • the insulating layer may serve the same function as the cap structure 312 .
  • the conductive sheet 311 in FIG. 8 can also be replaced with conductive members of other shapes, such as a cap-like structure, etc.
  • the exposed surfaces of these conductive members are covered with an insulating layer, which can achieve the same performance as the conductive sheet 311 Effect.
  • the reinforcement area does not need to be provided with a special cover-shaped anti-short-circuit structure separated from the conductive sheet 311, and the insulating layer 313 is coated on the conductive sheet 311, which can reduce the thickness of the circuit board and save special and conductive
  • the cost of the shield-shaped short-circuit proof design with the chip separation avoids the problem of welding short circuit between the conductive sheet and the short-circuit proof structure.
  • FIG. 9 shows a schematic structural diagram of another reinforcing structure provided by an embodiment of the present application.
  • the reinforcing structure in FIG. 9 has been structurally optimized according to the actual shape of the circuit board.
  • the reinforcement area 304 includes a first connection area 304a, a second connection area 304b and an extension area 304c, the second connection area 304b is arranged around the first connection area 304a, and the extension area 304c is connected to the extension area 304c.
  • the second connection regions 304b are connected and extend outward from the second connection regions 304b.
  • the first connection area 304 a is used for connecting the conductive sheet 311
  • the second connection area 304 b and the extension area 304 c are used for connecting the cap-shaped structure 312 .
  • the position of the extension region 304c may be determined according to the specific shape of the printed circuit board 32, which is not limited in the embodiment of the present application.
  • the first connection area 304a is connected to the functional network on the printed circuit board 32, the conductive sheet 311 is electrically connected to the first connection area 304a, and the conductive sheet 311 is electrically connected to the functional network of the circuit board in parallel.
  • the structure after the conductive sheet 311 is provided in the reinforcement area 304 is shown as the reinforcement area 306 in FIG. 9 .
  • the second connection area 304b and the extension area 304c are used to connect with the cap-like structure 312 .
  • the structure after the cap-like structure 312 is disposed on the reinforcement area 306 is shown as the reinforcement area 308 in FIG. 9 .
  • the cover-shaped structure 312 is formed with an accommodation space for accommodating the conductive sheet 311 , and the cover-shaped structure 312 includes an extension surface connected to the extension area 304c.
  • the cover-like structure 312 may adopt the materials and connection methods as shown in FIG. 6 , and the details can be referred to the above description, which will not be repeated here.
  • the conductive sheet 311 provides a path for the current in the functional network, increases the cross-sectional area through which the current flows, and can reduce the impedance of the reinforcement region 304 .
  • the impedance of the reinforced area 304 is reduced, the heat generated by the printed circuit board is reduced, the temperature of the circuit board is reduced, and the temperature of other components used to conduct the heat of the circuit board, such as the housing of the electronic equipment, is reduced, and the heat dissipation of the electronic equipment is improved. Improve user experience.
  • the conductive sheet 311 and the cover-like structure 312 can enhance the mechanical reliability of the circuit board and reduce the risk of board breakage.
  • the cover structure 312 is structurally optimized, and the design of the extension surface can increase the contact area between the cover structure 312 and the printed circuit board 32, further enhance the mechanical strength of the circuit board, and improve the mechanical reliability of the circuit board.
  • the printed circuit board 32 includes a first circuit board portion 321 and a second circuit board portion 322 , which are separable.
  • the reinforcement area is located on the first circuit board portion 321 , and the reinforcement structure is disposed on the first circuit board portion 321 .
  • the extending area 304c of the reinforcing area 304 is staggered with the second circuit board portion 322 , and correspondingly, the extending surface of the cover-like structure 312 is staggered with the second circuit board portion 322 .
  • the cover-shaped structure 312 and the second circuit board portion 322 in the reinforcing structure are arranged alternately, which can further improve the mechanical reliability of the circuit board.
  • the embodiments of the present application are only described by taking the conductive sheet as an example.
  • the conductive sheet 311 can be replaced with a conductive member of other shapes or structures, which can also achieve the same effect as the conductive sheet.
  • the reinforcing structure includes a conductive member and a cover-like structure, wherein the conductive member is electrically connected in parallel with the functional network on the printed circuit board, the cover-shaped structure covers the conductive member, and the printed circuit board is connected.
  • the reinforcing structure includes a conductive member, the conductive member is electrically connected in parallel with the functional network on the printed circuit board, and the exposed surface of the conductive member is covered with an insulating layer.
  • a specific example of the conductive member may be the conductive sheet 311 described above.
  • the embodiment of the present application further provides a circuit board, on which the reinforcing structure provided by the embodiment of the present application is disposed.
  • the conductive member in the reinforcing structure can be electrically connected in parallel with the functional network in the circuit board by adopting a high-conductivity sheet-like structure, a cap-like structure, solder (eg, alloy solder) or a conductive adhesive layer.
  • the conductive member can provide a path for the current, increase the cross-sectional area through which the current flows, and can play the role of reducing impedance, improving heat dissipation, and improving current utilization efficiency.
  • adding an insulating cover-like structure, an insulating coating or a cover-like structure connected to the ground network of the circuit board on the non-soldering surface of conductive parts such as high-conductivity sheet-like structures, solder or conductive adhesive layers can avoid conductive Components such as high-conductivity sheet structures, solder or conductive adhesive layers, etc., and surrounding metal components such as middle frames, circuit board brackets, and other grounding structures are short-circuited.
  • the reinforcement structure provided on the circuit board can also enhance the mechanical reliability of the circuit board and reduce the risk of board breakage.
  • the reinforcement structure provided by the embodiments of the present application may be arranged at any position on the circuit board.
  • the reinforcement structure can be located on the circuit board where there is an impedance bottleneck, where the current path is longer on the circuit board, where the width of the circuit board is narrow, or where the circuit board generates heat Serious location.
  • the functional network to which the conductive sheet is connected in the embodiment of the present application includes, but is not limited to, a charging network (such as a voltage bus (VBUS) line), a network for powering a display screen, a network for powering an audio module, and others.
  • a charging network such as a voltage bus (VBUS) line
  • VBUS voltage bus
  • FIG. 10 shows a schematic diagram of strain simulation of the reinforcement structure provided by the embodiment of the present application and the existing reinforcement structure.
  • FIG. 10 is a strain simulation performed by applying the reinforcement structure to the narrow strip area of the L-shaped circuit board.
  • Figure 10 (a) shows a schematic diagram of strain simulation using stainless steel sheets for reinforcement in the prior art
  • Figure 10 (b) shows the reinforcement structure shown in Figure 9 (conductive sheet and Schematic diagram of strain simulation for reinforcement with hood-like structure).
  • the reinforcing structure used in (a) in Figure 10 is a stainless steel sheet with a thickness of 0.3 mm
  • the conductive sheet used in (b) in Figure 10 is a white copper sheet with a thickness of 0.2 mm
  • the cover-shaped structure is 0.2 mm mm thick stainless steel. It can be seen from Fig. 10 that when the stainless steel sheet is used for reinforcement, the veneer assembly strain is 5494 microstrain (microstrain unit: ue), and the nickel white copper sheet and the stainless steel cover structure provided in the application examples are used for reinforcement , the veneer assembly strain is 5102ue.
  • the reinforcement structure provided by the embodiments of the present application can improve the deformation resistance of the circuit board, the risk of breaking the board is acceptable, and it is lower than the conventional reinforcement steel sheet design.
  • Table 1 shows the improvement effect of the reinforcement structure simulated in Fig. 10(b) on the electrical properties.
  • the examples of the present application take the application of the reinforcement structure to the charging network (such as VBUS line) as an example, and test and compare the electrical properties of the circuit board without a conductive sheet (for example, a white copper sheet) and with a conductive sheet.
  • the charging network such as VBUS line
  • the impedance of the circuit board is measured to be 14.3 milliohms (m ⁇ ) without the copper-nickel alloy sheet, and the maximum case temperature in the extreme charging mode is 37.3 °C.
  • the efficiency is 84.8%.
  • the impedance of the circuit board is measured as 13.7m ⁇ , and the maximum case temperature in the extreme charging mode is 36.8 °C.
  • the charging efficiency is 86.3%.
  • setting the copper-nickel alloy sheet can reduce the impedance by 0.6m ⁇ , reduce the maximum case temperature in the extreme charging mode by 0.5°C, and increase the charging efficiency in the extreme charging mode by 1.5%.
  • the reinforcement structure provided by the embodiment of the present application can reduce impedance, improve heat dissipation, improve charging efficiency, and increase the reliability of a single board.
  • the extreme charging mode involved in the embodiments of the present application may be understood as a mode requiring a large current and a large voltage for charging, such as a fast charging mode.

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Abstract

本申请提供了一种电路板组件和电子设备。该电路板组件包括：印刷电路板，该印刷电路板包括功能网络，该功能网络用于提供电气功能；导电件，该导电件与该印刷电路板相连接，其中，该导电件与该功能网络以并联方式电连接；罩状结构，该罩状结构罩住该导电件，且与该印刷电路板相连接，该罩状结构用于防止位于罩状结构中的导电件与罩状结构外的导体相接触。上述技术方案能够降低电路板的阻抗，提高电流的利用率，还可以提高电路板的机械可靠性。

Description

电路板组件和电子设备
本申请要求于2020年09月30日提交中国专利局、申请号为202022224031.9、申请名称为“电路板组件和电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请实施例涉及电子设备技术领域，并且更具体地，涉及一种电路板组件和电子设备。
背景技术
印制电路板(printed circuit board，PCB)，又称印刷线路板、印刷电路板，是电子工业的重要部件之一。多数电子设备内都采用了印刷电路板作为电子元器件的支撑体和电子元器件电气连接的载体。
一般地，印刷电路板的形状可以根据电子设备的内部空间以及电子元器件的布置方式做适应性设计，因此印刷电路板上通常会包括宽窄不一的部分。而在印刷电路板宽度较窄的位置，往往存在阻抗瓶颈和断板风险，影响了印刷电路板的电学性能和机械可靠性。
发明内容
本申请提供一种电路板组件和电子设备，能够降低电路板的阻抗，提高电流的利用率，还可以提高电路板的机械可靠性。
第一方面，提供了一种电路板组件，包括：印刷电路板，所述印刷电路板包括功能网络，所述功能网络用于提供电气功能；导电件，所述导电件与所述印刷电路板相连接，其中，所述导电件与所述功能网络以并联方式电连接；罩状结构，所述罩状结构罩住所述导电件，且与所述印刷电路板相连接，所述罩状结构用于防止位于所述罩状结构中的所述导电件与所述罩状结构外的导体相接触。
应理解，印刷电路板可以包括功能网络和非功能网络，其中功能网络可以提供某一电气功能，如充电、射频、天线、多媒体、数据存储、传感器等；而非功能网络不可以提供电气功能，主要为了实现机械连接等目的，非功能网络通常接地(ground，GND)或悬浮(不与任何功能网络或GND网络相连)，用于将印刷电路板上承载的结构件与功能网络隔离，避免误接触导致的触电或设备损坏。本申请实施例中，导电片与功能网络电连接，则导电片可以传输功能网络中的电流。本申请实施例提供的电路板组件包括与功能网络并联电连接的导电件，导电件可以传输电流，这样导电件为功能网络中的电流提供了通路，能够降低电路板的阻抗。相应地，电路板的阻抗降低，产生的热量相应减少，能够提高电流的利用率。进一步地，电路板产生的热量减少，电路板的温度降低，这样传导电路板热量的其他部件例如电子设备壳体的温度降低，还能够改善电子设备的散热，提高用户体验。
本申请实施例提供的电路板组件包括罩状结构，该罩状结构可以隔离导电件与周围的金属结构件，防止导电件与周围金属件相接触而导致短路。
另外，导电件和罩状结构的设计，能够增强电路板的机械可靠性，降低断板风险。
结合第一方面，在一种可能的实现方式中，所述罩状结构为金属材料，所述罩状结构与所述导电件之间设置有间隙。
罩状结构为防短路设计，当罩状结构为金属材料时，罩状结构与导电件之间的间隙可以避免导电件短路。
可选地，所述导电件与所述罩状结构之间的间隙中可以设置绝缘填充物。
结合第一方面，在一种可能的实现方式中，所述印刷电路板还包括接地网络，其中，所述罩状结构与所述接地网络电连接；或者，所述罩状结构不与所述功能网络电连接，且不与所述接地网络电连接。
罩状结构接地或者悬浮，可以防止导电件与周围金属件相接触而导致短路。
结合第一方面，在一种可能的实现方式中，所述印刷电路板还包括非功能网络，所述非功能网络接地或悬浮，所述罩状结构与所述非功能网络相连。
这里，罩状结构与非功能网络相连包括以下情况：一是非功能网络接地，则罩状结构接地；二是非功能网络悬浮，则罩状结构悬浮，即罩状结构即不与功能网络电连接且不与接地网络电连接。
应理解，印刷电路板所包括的非功能网络通常接地或悬浮，用于将印刷电路板上承载的结构件与功能网络隔离，避免误接触导致的触电或设备损坏。
结合第一方面，在一种可能的实现方式中，所述罩状结构为绝缘材料。
可选地，所述罩状结构与所述导电件之间的间隙大于或等于0。
罩状结构为绝缘材料时，罩状结构与导电件之间可以设置间隙，也可以不设置间隙。
可选地，绝缘材料包括绝缘胶、纤维制品、绝缘橡胶、绝缘塑料及其制品、玻璃、绝缘陶瓷等。
结合第一方面，在一种可能的实现方式中，所述导电件为导电片。
结合第一方面，在一种可能的实现方式中，所述导电片为预成型的片状结构。
应理解，预成型可以理解为不是直接在印刷电路板上形成的，而是脱离印刷电路板额外形成的。
结合第一方面，在一种可能的实现方式中，所述导电片为预成型的片状结构时，所述导电片与所述印刷电路板通过焊料或导电胶相连接。
结合第一方面，在一种可能的实现方式中，所述导电片为焊料固化后形成的片状结构，或者为导电胶固化后形成的片状结构。
导电片为焊液固化形成的片状结构时，该导电片可以直接在印刷电路板上形成。
导电片为导电胶固化形成的片状结构时，该导电片可以直接在印刷电路板上形成。
当导电片采用焊料或导电胶固化形成的片状结构时，便无需额外焊接片状结构件，可以简化工艺流程，节省额外的片状结构的成本，并且能够利用现有的工艺流程完成导电片的设置。
另外，当采用焊料或导电胶作为导电件时，导电件的厚度可以做到很小，例如小于0.2mm，这样导电件和罩状结构的整体高度降低，可以占用更小的内部空间。
结合第一方面，在一种可能的实现方式中，所述导电件的材料为以下任意一种：单一成分的金属材料，合金材料，导电复合材料。
可选地，单一成分的金属包括铜、铝、银等。
可选地，合金包括铜合金(也称洋白铜)、铝合金等。
可选地，导电复合材料包括导电塑料、导电橡胶、导电纤维织物、导电涂料、导电胶粘剂等。
结合第一方面，在一种可能的实现方式中，所述导电件与所述印刷电路板固定连接。
结合第一方面，在一种可能的实现方式中，所述罩状结构与所述印刷电路板固定连接。
结合第一方面，在一种可能的实现方式中，所述印刷电路板包括可分离的第一电路板部分和第二电路板部分，其中，所述第一电路板部分包括第一连接区、围绕所述第一连接区设置的第二连接区和从所述第二连接区向外延伸的延伸区；所述第一连接区与所述导电件相连接；所述第二连接区和所述延伸区与所述罩状结构相连接；所述延伸区与所述第二电路板部分交错设置。
本申请实施例中，第一电路板部分的延伸区能够增加罩状结构与印刷电路板的接触面积，进一步增强电路板的机械强度，提高电路板的机械可靠性。
另外，第一电路板部分的延伸区与第二电路板部分交错设置，相应地，罩状结构则与第二电路板部分交错设置，可以进一步提高电路板的机械可靠性。
结合第一方面，在一种可能的实现方式中，所述印刷电路板包括横向的宽面区域和沿纵向延伸的窄条区域，所述窄条区域的宽度小于所述宽面区域的宽度，所述导电件和所述罩状结构设置于所述窄条区域上。
本申请实施例中，电路板可以为L型电路板。导电件和罩状结构设置于窄条区域，可以降低窄条区域的阻抗，改善窄条区域的散热，增强窄条区域的机械强度，提高可靠性。
结合第一方面，在一种可能的实现方式中，所述功能网络包括充电线路和/或供电线路。
可选地，充电线路为总线电压(voltage bus，VBUS)线路。
可选地，供电线路为电子设备的显示屏供电的网络、为电子设备的音频模块供电的网络等。
结合第一方面，在一种可能的实现方式中，所述印刷电路板为具有充电功能的电路板。
可选地，导电件与印刷电路板的接触面积大于第一阈值。这里第一阈值的选择可以根据实际需要确定，即导电件与印刷电路板的接触面积能够满足增强电路板的机械强度到不会发生断线甚至断板的要求。
第二方面，提供了一种电路板组件，包括：印刷电路板，所述印刷电路板包括功能网络，所述功能网络用于提供电气功能；导电件，所述导电件与所述印刷电路板相连接，其中，所述导电件，与所述功能网络以并联方式电连接；所述导电件的裸露在外的表面上包覆有绝缘层。
本申请实施例提供的电路板组件包括与功能网络并联电连接的导电件，导电件可以传输电流，这样导电件为功能网络中的电流提供了通路，能够降低电路板的阻抗。相应地，电路板的阻抗降低，产生的热量相应减少，能够提高电流的利用率。进一步地，电路板产生的热量减少，电路板的温度降低，这样传导电路板热量的其他部件例如电子设备壳体的 温度降低，还能够改善电子设备的散热，提高用户体验。
导电件上包覆绝缘层，可以隔离导电件与周围的金属结构件，防止导电件与周围金属件相接触而导致短路。
另外，导电件的设计，能够增强电路板的机械可靠性，降低断板风险。
进一步地，在导电件上涂绝缘层，则电路板上不需要设置专门的和导电件分离的防短路结构，可以降低电路板的厚度，节省专门的和导电件分离的防短路设计的成本，避免了导电件和防短路结构之间的焊接短路问题。
可选地，导电件可以是片状结构，也可以是罩状结构。
导电件为片状结构时，片状结构的非连接面上包覆有绝缘层，其中所述非连接面为所述片状结构上除了与所述印刷电路板相连接的面之外的面。
导电件为罩状结构时，罩状结构裸露在外的面包覆有绝缘层。
结合第二方面，在一种可能的实现方式中，所述导电件为导电片或罩状结构。
结合第二方面，在一种可能的实现方式中，所述导电片为预成型的片状结构。
结合第二方面，在一种可能的实现方式中，所述导电片为预成型的片状结构时，所述导电片与所述印刷电路板通过焊料或导电胶相连接。
结合第二方面，在一种可能的实现方式中，所述导电片为焊料固化后形成的片状结构，或者为导电胶固化后形成的片状结构。
结合第二方面，在一种可能的实现方式中，所述导电件的材料为以下任意一种：单一成分的金属材料，合金材料，导电复合材料。
结合第二方面，在一种可能的实现方式中，所述导电件与所述印刷电路板固定连接。
结合第二方面，在一种可能的实现方式中，所述印刷电路板包括横向的宽面区域和沿纵向延伸的窄条区域，所述窄条区域的宽度小于所述宽面区域的宽度，所述导电件设置于所述窄条区域上。
结合第二方面，在一种可能的实现方式中，所述功能网络包括充电线路和/或供电线路。
结合第二方面，在一种可能的实现方式中，所述印刷电路板为具有充电功能的电路板。
第三方面，提供了一种电子设备，包括上述第一方面或第二方面以及第一方面或第二方面的任一种可能的实现方式所述的电路板组件。
可选地，电子设备包括手机、手表、手环、平板电脑等。
附图说明
图1是一种电子设备的示意性结构图；
图2是图1中的电子设备的示意性分解图；
图3是图1中的电子设备沿B-B线剖开的截面示意图；
图4是图1中的电子设备内部结构的示意性俯视图；
图5是现有一种补强结构的示意性结构图；
图6是本申请实施例提供的一种补强结构的示意性结构图；
图7是本申请实施例提供的另一种补强结构的示意性结构图；
图8是本申请实施例提供的又一种补强结构的示意性结构图；
图9是本申请实施例提供的还一种补强结构的示意性结构图；
图10是本申请实施例提供的补强结构和现有补强结构的应变仿真示意图。
附图标记：
10-壳体；11-边框；12-中框；13-后盖；101-第一表面；102-第二表面；103-第一空腔；104-第二空腔；20-显示屏；30-印刷电路板；31-L型电路板；301-主体区域；302-窄条区域；303-窄条区域上宽度最小的部分；304-未设置补强结构的补强区；304a-第一连接区；304b-第二连接区；304c-延伸区；305-不锈钢片；306-设置导电片的补强区；308-设置补强结构的补强区；311-导电片；312-罩状结构；313-绝缘层；32-印刷电路板；321-第一电路板部分；322-第二电路板部分；40-电路板支架；51-电池；52-充电管理模块；61-充电接口；62-柔性电路板；63-充电接口板对板连接器；64-电池板对板连接器。
具体实施方式
下面将结合附图，对本申请中的技术方案进行描述。
本申请实施例中，术语“第一”、“第二”等仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”等的特征可以明示或者隐含地包括一个或者更多个该特征。
本申请实施例的描述中，术语“上”、“下”、“内”、“外”等指示的方位或位置关系为相对于附图中的部件示意放置的方位或位置来定义的，应当理解到，这些方向性术语是相对的概念，它们用于相对于的描述和澄清，而不是指示或暗示所指的装置或元器件必须具有的特定的方位、或以特定的方位构造和操作，其可以根据附图中部件所放置的方位的变化而相应地发生变化，因此不能理解为对本申请的限定。
图1示出了一种电子设备100的示意性结构图。图2示出了图1中的电子设备100的分解示意图。图3示出了图1中的电子设备100沿G-G线剖开的截面示意图。
应理解，图1至图3仅示意性的示出了电子设备100包括的一些部件，这些部件的形状、大小和构造不受图1至图3限定。在其他一些实施例中，电子设备100还可以包括比图示更多或更少的部件，本申请实施例不作限定。在另一些实施例中，电子设备100的类型不同，电子设备100所包括的部件不同，本申请实施例提供的电子设备结构仅为示例性说明。
本申请实施例中的电子设备100可以为手持设备、车载设备、可穿戴设备、计算设备或连接到无线调制解调器的其它处理设备。电子设备100包括但不限于蜂窝电话(cellular phone)、智能手机(smart phone)、个人数字助理(personal digital assistant，PDA)电脑、平板型电脑、手提电脑、膝上型电脑(laptop computer)、智能手表(smart watch)、智能手环(smart wristband)、车载电脑以及其他电子设备等。本申请实施例对电子设备100的具体形式不作特殊限制，以下为了方便说明和理解，是以电子设备100为终端设备例如手机为例进行的说明。
参考图1和图2，电子设备100可以包括壳体10、显示屏(display panel，DP)20、印刷电路板(printed circuit board，PCB)30、电路板支架40。
壳体10形成有容纳空间，用于收容电子设备100的元器件。壳体10还可以起到保护电子设备100和支撑整机的作用。显示屏20、印刷电路板30和电路板支架40设置于壳 体10的容纳空间中，并与壳体10相连接。
具体地，参考图2和图3，壳体10可以包括边框11、中框12和后盖13。
中框12为位于电子设备100内部的支撑框架，一般由金属材料形成，可以用作电子设备100的接地端(ground，GND)。显示屏20与后盖13设置于中框12的两侧。
如图3所示，中框12包括相对设置的第一表面101和第二表面102，第一表面101靠近后盖13，第二表面102靠近显示屏20的背面。后盖13与中框12之间可以形成第一空腔103，显示屏20与中框12之间可以形成第二空腔104，第一空腔103和第二空腔104形成上文所述的容纳空间。第一空腔103可以用于安装电池、印刷电路板、功能模块、摄像头、天线等内部元件，第二空腔104可以布置用于屏幕发声的振动元件或其他需要设置在中框12与显示屏20之间的元件等。
需要说明的是，显示屏20具有能够显示画面的出光面，本申请实施例中所涉及的显示屏20的背面是指该显示屏20上与上述出光面相对设置的一侧表面，也即显示屏20靠近中框12的一侧表面，也即显示屏20上与中框12的第二表面102相对的面。
边框11为环绕电子设备100外周的结构。参考图2，边框11可以绕电子设备100和显示屏20的外围延伸，具体可以包围显示屏20的四个侧边，以帮助固定显示屏20。在一些实施例中，边框11可以是金属边框，该金属边框采用金属材料例如铜、镁合金、不锈钢等金属制成。在另一些实施例中，边框11还可以为非金属边框(即绝缘边框)，该非金属边框包括塑料边框、玻璃边框、陶瓷边框等。
后盖13是电子设备100上与显示屏20相对设置的结构，与边框11相连接，用于将电子设备100的元器件封于电子设备内部，同时还能够防灰尘、防碰撞、防硬件划伤。后盖13可以是金属材料制成的后盖(即金属后盖)，也可以是非导电材料制成的后盖(即非金属后盖)，如玻璃后盖、塑料后盖等。
中框11和边框12可以为分离式结构，也可以是一体式结构，本申请实施例不作限定。中框11与边框12为分离式结构时，中框11和边框12是壳体10的两个不同的部件，二者可以通过卡接、扣合等方式组装在一起，在需要拆卸的时候二者可被分离。中框11与边框12为一体式结构时，中框11与边框12之间的连接关系无法被分割，例如中框11与边框12采用一体成型方式加工制成，或者采用焊接等永久性连接方式组装制成等。一体式的中框和边框，可以认为是中框外周充当了电子设备100的边框。
边框12与后盖13可以为分离式结构，也可以为一体式结构，本申请实施例不作限定。边框12与后盖13为分离式结构时，边框12与后盖13为壳体10的两个不同的部件，二者可以通过卡接、扣合等方式组装在一起，在需要拆卸的时候二者可被分离。边框12与后盖13为一体式结构时，边框12与后盖13之间的连接关系无法被分割，例如边框12与后盖13采用一体成型方式加工制成，或者采用焊接等永久性连接方式组装制成等。一体式的边框和后盖，可以认为是后盖13外周充当了电子设备100的边框。
参考图2，显示屏20和后盖13分别设置于中框12的两侧，且分别与中框12相连接。印刷电路板30和电路板支架40设置于中框12与后盖13之间，印刷电路板30靠近中框12，电路板支架40靠近后盖13。电路板支架40与中框12相连接，可以将位于电路板支架40与中框12之间的印刷电路板30固定。
显示屏20用于显示图像。显示屏20可以为液晶显示(liquid crystal display，LCD) 屏、有机发光二极管(organic light emitting diode，OLED)显示屏等，其中OLED显示屏可以为柔性显示屏或硬质显示屏。显示屏20可以是普通的规则屏幕，也可以为异形屏幕、折叠屏幕等，例如显示屏20可相对自由转动或折叠形成弧形、多棱柱等等。
印刷电路板30是电子元件的支撑体，也作为电子元件电气连接的载体。印刷电路板30具有支撑电路元件和互连电路元件的功能。其中电子元件包括但不限于电容、电感、电阻、处理器、存储器、摄像头、闪光灯、麦克风、电池、天线等。
一般地，没有焊接电子元件的印刷电路板可以称为PCB单板。焊接了电子元件的印刷电路板可以称为印刷电路板组件(printed circuit board assembly，PCBA)。
印刷电路板30可以采用FR-4介质板、罗杰斯(rogers)介质板、rogers和FR-4的混合介质板等等。这里，FR-4是一种耐燃材料等级的代号，rogers介质板是一种高频板。印刷电路板30可以为单面板、双面板、多层线路板等。印刷电路板30可以为陶瓷电路板、氧化铝陶瓷电路板、氮化铝陶瓷电路板、铝基板、高频板、厚铜板、阻抗板等。在一些实施例中印刷电路板30也可以称为主板。
印刷电路板30上设置有导电图形，通过在不同的导电图形之间布线可以将电子元件进行电气连接。布线后的印刷电路板30可以包括功能网络和非功能网络，其中功能网络可以提供某一电气功能，如充电、射频、天线、多媒体、数据存储、传感器等；而非功能网络不可以提供电气功能，主要为了实现被焊接结构件和PCB之间的机械连接等目的，非功能网络通常接地(ground，GND)或悬浮(不与任何功能网络或GND网络相连)，用于将印刷电路板30上承载的结构件与功能网络隔离，避免误接触导致的触电或设备损坏。例如，印刷电路板30靠近壳体10的一侧的金属罩对应的PCB焊盘可以设置为GND金属层，该金属层可以通过在印刷电路板30的表面蚀刻金属形成。该金属层即为非功能网络的一部分。
电路板支架40设置于印刷电路板30和壳体10(具体为后盖13)之间，主要用于将印刷电路板30固定于壳体10(具体为中框12)上。电路板支架40可以是金属制成，作为导电的GND。电路板支架40也可以是绝缘支架，在该绝缘支架上可以设置金属件。
印刷电路板30上承载的电子元件可以形成多个功能模块以实现相应的功能，例如充电管理模块用于从充电器接收充电输入，电源管理模块用于为显示屏等供电，无线通信模块和移动通信模块用于实现电子设备的通信功能，音频模块用于实现音频功能等。印刷电路板30的形状可以根据电子设备的形状以及电子设备内部要布置的功能模块的位置、形状等相应设计。
图2中示例性示出了电池51和充电管理模块52，以及一种印刷电路板30的示意性结构。印刷电路板30、电池51、充电管理模块52的安装位置示意图如图4所示。
参考图4，为了安装电池51，印刷电路板的结构可以设计为L型，如L型电路板31。如图所示，L型电路板31包括横向的主体区域301和从主体区域301上纵向延伸的窄条区域302。主体区域301和窄条区域302围绕电池51设置。这里，主体区域301相对窄条区域302来说，属于宽面区域，即主体区域301的宽度大于窄条区域302的宽度。
L型电路板31的主体区域301设置有与电路板相连接的充电管理模块52。L型电路板31上设置有充电接口板对板连接器(board-to-board，connector，BTB)(简称充电接口BTB)63和电池板对板连接器(简称电池BTB)64，其中，充电接口BTB 63用于将 充电接口61与电路板31相连接，电池BTB 64用于将电池51与电路板31相连接。
充电接口61设置于电子设备的边缘处，充电接口61与充电接口BTB 63可通过柔性电路板(flexible printed circuit，FPC)62相连接。该充电接口61可以为迷你(mini)通用串行总线(universal serial bus，USB)接口、微型(micro)USB接口、A型(type-A)USB接口、B型(type-B)USB接口、C型(type-C)USB接口等。应理解，充电接口61的具体类型可以根据电子设备类型不同而相应选择，在此不作限定。
图4中还示意性示出了电路板上的充电路径。充电接口61可以与外部的供电电源相连接，例如充电接口61通过充电线和充电适配器与外部的220V电源插座相连。充电接口61可以从外部电源获得为电池51充电的电压/电流。电压/电流依次通过柔性电路板62、充电接口BTB 63、电路板31传送到充电管理模块52。充电管理模块52可以将从外部获得的电压转换成电池51的电压，同时按照需要的充电电流精确可控地通过电池BTB 64向电池51进行充电。
另外，电池51在存储电量的情况下，能够通过电池BTB 64为电路板31上安装的电子元件供电。例如电池51可以为显示屏供电以维持显示屏亮度、刷新率等，可以为音频模块供电以发声，还可以为通信模块供电以发射射频信号等。
在充电过程中，电池51的充电电流需要通过电路板上的充电线路传送。在放电过程中，电池51的供电电流需要通过电路板上的供电线路传送。
目前，大多数电子设备内均设置印刷电路板来实现电子元件的电气互联。由于电子设备内部结构比较复杂，用来承载电子元件的印刷电路板的形状也需要根据实际需求相应设计。印刷电路板的形状为不规则设计时，其上一般都会存在宽度较窄的部分，例如图4所示的L型电路板31的窄条区域302，或窄条区域302上宽度最小的部分303等。
在这些宽度较窄的部分，电路板机械强度不够，容易发生断裂，存在机械可靠性问题。
此外，在这些宽度较窄的部分，电流流过的横截面积较小，根据电阻的计算公式R＝ρL/S(其中ρ表示电阻的电阻率，L表示电阻的长度，S表示电阻的横截面积)可知，这些位置的阻抗往往比较大，存在阻抗瓶颈。当有较大电流通过时，该部分的电路板发热量大，大部分能量以热量形式消耗，导致电流利用效率低、电子设备壳体温度过高等。
图5示出了现有一种补强结构的示意性结构图。如图5所示，电路板上存在宽度较窄的区域303，为了解决电路板的机械可靠性问题，可以在区域303上焊接不锈钢片305，以此加强电路板的强度，降低电路板的断板风险。另外，为了避免不锈钢片305与导电的电路板支架或中框接触或接近进而导致电学功能或性能异常，补强结构不锈钢片305通常是接地(ground，GND)的。
但这种焊接不锈钢片的方案只能起到改善电路板机械可靠性的作用，并不能提升电路板的电学性能。因此，本申请实施例提供了一种补强结构，既能够提高电路板的机械可靠性，还可以降低电路板阻抗，提高电流的利用率。
图6示出了本申请实施例提供的一种补强结构的示意性结构图。
为方便描述，以下实施例将印刷电路板上需要设置补强结构的区域称为补强区。本申请实施例中，补强区可以为印刷电路板上阻抗较高的区域，例如印刷电路板上宽度较窄的区域或印刷电路板上电流所流过的通路较长的区域，补强区也可以为印刷电路板上需要通过大电流的区域等。
如图6所示，本申请实施例中的补强结构包括导电片311和罩状结构312。
导电片311为预成型的片状结构，用于为电流提供通路。
罩状结构312为中空罩状，其上形成有容纳空间，容纳空间用于收容导电片311。罩状结构312用于隔离导电片311与周围的金属结构件，防止发生短路。
印刷电路板32包括补强区304。参考图6所示的放大示意图，补强区304包括第一连接区304a和第二连接区304b，第二连接区304b围绕第一连接区304a设置。
第一连接区304a用于连接导电片311，其中导电片311平行设置于(例如贴附于)第一连接区304a。补强区304设置了导电片311后的结构如图6中的补强区306所示。本申请实施例中，第一连接区304a与印刷电路板32上的功能网络相连接，导电片311与第一连接区304a电连接，并且导电片311与印刷电路板32的功能网络以并联方式电连接。
因此，当与导电片311电连接的电路网路中有电流通过时，电流也将流经导电片311。导电片311为功能网络中的电流提供了通路，相当于增大了电流流过的横截面积，根据上述电阻的计算公式可以知道，导电片311可以降低补强区304的阻抗。补强区304的阻抗降低，在补强区304产生的热量减少，可以降低电路板32的温度，进而降低传导电路板热量的其他部件例如电子设备壳体的温度，能够改善电子设备的散热，提高用户体验。电路板产生的热量减少，相应地电流的利用率提高。
第二连接区304b用于连接罩状结构312。该罩状结构312罩住该导电片311,，即当罩状结构312设置于第二连接区304b时，罩状结构312与印刷电路板32之间形成容纳空间，例如封闭的容纳空间，设置于第一连接区304a的导电片311收容于该容纳空间中。补强区306上设置了罩状结构312后的结构如图中的补强区308所示。由于导电片311与印刷电路板32的功能网络连接，本申请实施例中的罩状结构312可以隔离导电片311与周围的金属结构件，防止导电片311与周围金属件相接触而导致短路。换句话说，罩状结构312为一种防短路结构。
补强区304设置的导电片311和罩状结构312，能够增强电路板的机械可靠性，降低断板风险。此外，中空的罩状结构312相比现有技术中的不锈钢片而言，具有更强的抗变形能力，因此，本申请实施例采用罩状结构进行补强的方式相比现有技术中采用不锈钢片进行补强的方式，能够显著提升电路板的机械可靠性。
本申请实施例中，导电片311为高电导率片状结构。导电片311的材料可以是单一成分的金属(例如铜、铝、银)，可以是合金(例如铜合金(也称洋白铜)、铝合金)，还可以是导电复合材料(例如导电塑料、导电橡胶、导电纤维织物、导电涂料、导电胶粘剂)。
可选地，该导电片311与印刷电路板32固定连接。固定连接的方式可以包括但不限于焊接、胶接、螺丝连接等，只要能够将导电片311与印刷电路板32固定在一起即可。
示例性的，导电片311与印刷电路板32之间可以通过焊料(例如合金焊料)或导电胶相连接。例如，补强区304的第一连接区304a包括用于连接导电片311的第一焊盘，该第一焊盘与印刷电路板32上的功能网络相连接。导电片311可以通过焊接方式与印刷电路板32相连接，通过第一焊盘与印刷电路板32上的功能网络并联电连接。
应理解，导电片311的厚度可以根据电子设备的内部空间、可以容忍的断板风险以及需要满足的电学性能指标(例如阻抗指标、壳体温度、电流利用效率等)等实际需要相应确定，本申请实施例在此不作具体限定。
导电片311的厚度可以是均匀的，也可以是不均匀的，本申请实施例对此不作限定。
本申请实施例中，罩状结构312的材料可以为导电材料，导电材料包括但不限于单一成分的金属(例如铜、铝、银)、合金(例如铜合金(也称洋白铜)、铝合金)、导电复合材料(例如导电塑料、导电橡胶、导电纤维织物、导电涂料、导电胶粘剂)。在一些实施例中，罩状结构312的材料和导电片311的材料可以是相同的。罩状结构312的材料也可以是绝缘材料，绝缘材料包括但不限于绝缘胶、纤维制品、绝缘橡胶、绝缘塑料及其制品、玻璃、绝缘陶瓷等。
可选地，该罩状结构312与印刷电路板32固定连接。固定连接的方式可以包括但不限于焊接、胶接、螺丝连接等，只要能够将罩状结构312与印刷电路板32固定在一起即可。
示例性的，罩状结构312与印刷电路板32之间可以通过焊料(例如合金焊料)、导电胶或绝缘胶相连接。应理解，罩状结构312与印刷电路板32包括焊料层或胶层，图6中未予以示出。
作为一个示例，补强区304的第二连接区304b包括用于连接罩状结构312的第二焊盘，参考图6，罩状结构312可以通过焊接方式连接在第二焊盘上。这种情况下，罩状结构312可以采用能够进行焊接工艺的金属材料制成。
可选地，当罩状结构312为金属材料时，罩状结构312可以通过第二焊盘与印刷电路板32的地网络相连接，也可以为悬浮态，即不与印刷电路板32上任何网络相连接。本申请实施例中，罩状结构为悬浮状态时，即不与功能网络电连接，也不与GND网络电连接。
作为另一个示例，补强区304的第二连接区304b可以设置导电胶，罩状结构312通过导电胶与印刷电路板32相连接。这种情况下，罩状结构312可以为金属材料，也可以为绝缘材料。
可选地，当罩状结构312为金属材料时，罩状结构312可以通过导电胶与印刷电路板32的地网络相连接，也可以为悬浮态，即不与印刷电路板32上任何网络相连接。
作为另一个示例，补强区304的第二连接区304b可以设置绝缘胶，罩状结构312通过绝缘胶与印刷电路板32相连接。
本申请实施例中，罩状结构312与导电片311之间可以设置间隙，可以不设置间隙，具体需要根据罩状结构312的材料相应确定。
例如，当罩状结构312为金属材料时，罩状结构312与导电片311之间需要设置间隙。参考图6中的补强区沿B-B线剖开的截面(设置间隙)示意图，罩状结构312与导电片311不接触。罩状结构312与导电片311之间的间隙可以根据实际需要设计，例如该间隙可以大于0.2mm。
可选地，罩状结构312与导电片311之间的间隙中可以设置绝缘填充物。
又如，当罩状结构312为绝缘材料时，罩状结构312与导电片311之间可以设置间隙。参考图6中的补强区沿B-B线剖开的截面(设置间隙)示意图，该间隙大小可以根据电子设备内部的空间大小设计，例如该间隙大于0。当然，罩状结构312与导电片311也可以不设置间隙，参考图6中的补强区沿B-B线剖开的截面(不设置间隙)示意图，罩状结构312可以直接与导电片311相接触。
应理解，罩状结构312的厚度可以根据电子设备的内部空间、可以容忍的断板风险以 及需要满足的电学性能指标(例如散热效果等)等实际需要相应确定，本申请实施例在此不作具体限定。
罩状结构312的厚度可以是均匀的，也可以是不均匀的，本申请实施例对此不作限定。
图7示出了本申请实施例提供的另一种补强结构的示意性结构图。
与图6所示的结构不同的是，图7中的补强结构不需要额外焊接高电导率的片状结构件，而直接在印刷电路板32的补强区304印刷焊料(例如合金焊料)或点涂导电胶，然后通过加热或光学固化使焊料或导电胶固化。固化的焊料或导电胶直接作为导电片。换句话说，图6所示的导电片为预成型的片状结构，图7所示的导电片可以为通过固化焊料或导电胶而形成的片状结构。
应理解，本申请实施例中预成型可以理解为不直接在印刷电路板上成型，而是脱离印刷电路板单独成型的。导电片为通过固化焊料或导电胶而形成的片状结构时，导电片可以是在印刷电路板上印刷的焊料固化后形成的片状结构，或者为在印刷电路板上点涂的导电胶固化后形成的片状结构。
具体的，参考图7所示的放大示意图，补强区304包括第一连接区304a和第二连接区304b，第二连接区304b围绕第一连接区304a设置。第一连接区304a处设置导电片311，其中导电片311为固化的合金焊接或导电胶。导电片311与印刷电路板32中的功能网络电连接。
第二连接区304b用于与罩状结构312相连接。补强区304上设置罩状结构312后的结构如图中的补强区308所示。罩状结构312可以采用如图6中所述的结构、材料和连接方式，具体可参考上文描述，在此不再赘述。
本申请实施例中，导电片311为功能网络中的电流提供了通路，增大了电流流过的横截面积，能够降低补强区304的阻抗。补强区304的阻抗降低，印刷电路板32产生的热量减少，电路板的温度降低，进而用于传导电路板热量的其他部件例如电子设备壳体的温度降低，电子设备的散热情况得以改善，电流的利用率得以提高。
另一方面，导电片311和罩状结构312能够增强电路板的机械可靠性，降低断板风险。
可选地，导电片311为固化的焊料(例如合金焊料)时，可以通过印刷、点涂、喷射等工艺实现。
可选地，合金焊料可以为锡膏。
当采用焊料制备导电片311时，导电片311实际相当于焊盘。因此导电片311可以在制备印刷电路板上的焊盘的工艺流程中同时制备出来。由于直接采用焊盘作为导电片，便无需额外焊接片状结构件，简化了工艺流程，节省了额外的片状结构的成本，并且能够利用现有的工艺流程完成导电片的设置。
可选地，导电片311为固化的导电胶时，可以在印刷电路板上先点涂导电胶，通过加热或光学固化得到固态的导电片311。直接采用导电胶作为导电片，无需额外连接片状结构件，能够简化工艺流程、节约成本。
本申请实施例中，罩状结构312与导电片311之间可以设置间隙，也可以不设置间隙，具体需要根据罩状结构312的材料相应确定。具体情况可以参考图6中的相关描述，为简洁，在此不再赘述。示例性地，图7示出了补强区沿C-C线剖开的一种截面示意图，其中罩状结构312与导电片311相隔。
应理解，导电片311的厚度(即焊料或导电胶的厚度)可以根据电子设备的内部空间、可以容忍的断板风险以及需要满足的电学性能指标(例如阻抗指标、壳体温度、电流利用效率等)等实际需要相应确定，本申请实施例在此不作具体限定。
导电片311的厚度(即焊料或导电胶的厚度)可以是均匀的，也可以是不均匀的，本申请实施例对此不作限定。
当采用焊料或导电胶作为导电片时，导电片的厚度可以做到很小，例如小于0.2mm，这样补强结构的整体高度降低，可以占用更小的内部空间。
图8示出了本申请实施例提供的另一种补强结构的示意性结构图。
与图6所示的结构不同的是，图8中的补强结构不需要额外连接罩状结构，而采用直接在导电片上喷涂绝缘层，以绝缘层作为防短路结构，将导电片与周围金属结构件相隔开。
具体的，参考图8所示的放大示意图，补强区304包括第一连接304a，该第一连接304a用于与导电片311相连接。导电片311与印刷电路板32中的功能网络并联连接。导电片311可以采用如图6中所述的结构、材料和连接方式，具体可参考上文描述，在此不再赘述。补强区304设置了导电片311后的结构如图8中的补强区308所示。
参考图8示出的补强区沿D-D线剖开的截面示意图，导电片311上包覆有绝缘层313，绝缘层313覆盖导电片311裸露在外的所有表面。导电片311裸露在外的所有表面包括导电片311上与印刷电路板32相连接的表面以外的表面(即焊接面以外的面，也可以称为非连接面)，即包括导电片311的顶部和侧壁。
可选地，绝缘层313的厚度可以为0.01mm-0.2mm，或者比0.01mm更小，或者比0.2mm更大。应理解，绝缘层313的厚度可以根据电子设备的内部空间等实际需要相应确定，本申请实施例在此不作特殊限定。
绝缘层313可以是在导电片311成型后或出厂前喷涂于导电片311上，也可以是在将导电片311与印刷电路板32连接之后喷涂于导电片311上，本申请实施例不作限定。
本申请实施例中，导电片311为功能网络中的电流提供了通路，增大了电流流过的横截面积，能够降低补强区304的阻抗。补强区304的阻抗降低，印刷电路板产生的热量减少，电路板的温度降低，进而用于传导电路板热量的其他部件例如电子设备壳体的温度降低，电子设备的散热情况得以改善，电流利用率得以提升。
另外，导电片311能够增强电路板的机械可靠性，降低断板风险。
应理解，导电片311的厚度可以根据电子设备的内部空间、可以容忍的断板风险以及需要满足的电学性能指标(例如阻抗指标、壳体温度、电流利用效率等)等实际需要相应确定，本申请实施例在此不作具体限定。
导电片311的厚度可以是均匀的，也可以是不均匀的，本申请实施例对此不作限定。
在其他一些实施例中，导电片311也可以为固化的焊料或导电胶等。即在图7所示的结构基础上，省略罩状结构312，直接在导电片311上喷涂绝缘层。绝缘层可以起到与罩状结构312相同的作用。
在一些实施例中，图8中的导电片311也可以替换为其他形状的导电件，例如罩状结构等，在这些导电件裸露在外的表面上包覆绝缘层，可以实现与导电片311同样的效果。
本申请实施例中，补强区不需要设置专门的和导电片311分离的罩状防短路结构，而采用在导电片311上涂绝缘层313，可以降低电路板的厚度，节省专门的和导电片分离的 罩状防短路设计的成本，避免了导电片和防短路结构之间的焊接短路问题。
图9示出了本申请实施例提供的又一种补强结构的示意性结构图。
与图6所示的结构不同的是，图9中的补强结构根据电路板的实际形状做了结构优化。
具体的，参考图9所示的放大示意图，补强区304包括第一连接区304a、第二连接区304b和延伸区304c，第二连接区304b围绕第一连接区304a设置，延伸区304c与第二连接区304b相连，且从第二连接区304b向外延伸。第一连接区304a用于连接导电片311，第二连接区304b和延伸区304c用于连接罩状结构312。应理解，延伸区304c的位置可以根据印刷电路板32的具体形状确定，本申请实施例不作限定。
第一连接区304a与印刷电路板32上的功能网络相连接，导电片311与第一连接区304a电连接，且导电片311与电路板的功能网络以并联方式电连接。补强区304设置了导电片311后的结构如图9中的补强区306所示。
第二连接区304b和延伸区304c用于与罩状结构312相连接。补强区306上设置了罩状结构312后的结构如图9中的补强区308所示。参考图9中补强区沿E-E线剖开的截面示意图，罩状结构312形成有容纳空间，用于收容导电片311，罩状结构312包括与延伸区304c相连接的延伸面。罩状结构312可以采用如图6中所述的材料和连接方式，具体可参考上文描述，在此不再赘述。
本申请实施例中，导电片311为功能网络中的电流提供了通路，增大了电流流过的横截面积，能够降低补强区304的阻抗。补强区304的阻抗降低，印刷电路板产生的热量减少，电路板的温度降低，进而用于传导电路板热量的其他部件例如电子设备壳体的温度降低，电子设备的散热情况得以改善，可以提高用户体验。
另外，导电片311和罩状结构312能够增强电路板的机械可靠性，降低断板风险。本申请实施例对罩状结构312做了结构优化设计，延伸面的设计能够增加罩状结构312与印刷电路板32的接触面积，进一步增强电路板的机械强度，提高电路板的机械可靠性。
在一些实施例中，如图9所示，印刷电路板32包括第一电路板部分321和第二电路板部分322，第一电路板部分321和第二电路板部分322可分离。补强区位于第一电路板部分321上，则补强结构设置于第一电路板部分321上。如图中所示，补强区304的延伸区304c与第二电路板部分322交错设置，相应地，罩状结构312的延伸面与第二电路板部分322交错设置。
本申请实施例中，补强结构中的罩状结构312与第二电路板部分322交错设置，可以进一步提高电路板的机械可靠性。
应理解，本领域技术人员根据电路板的形状还可以做其他形式的结构优化设计，本申请实施例对此不作限定。
还应理解，本申请实施例仅以导电片为例进行的说明，在一些其他实施例中，导电片311可以替换为其他形状或结构的导电件，同样可以实现与导电片相同的效果，本申请实施例对此不作限定。也就是说，补强结构中包括导电件和罩状结构，其中导电件与印刷电路板上的功能网络并联电连接，罩状结构罩住导电件，并且印刷电路板相连。或者补强结构中包括导电件，该导电件与印刷电路板上的功能网络并联电连接，导电件裸露在外的表面包覆有绝缘层。导电件的一个具体的示例可以为上文所述的导电片311。
本申请实施例还提供一种电路板，该电路板上设置了本申请实施例提供的补强结构。 补强结构中的导电件可以采用高电导率片状结构、罩状结构、焊料(例如合金焊料)或导电胶层等与电路板中的功能网络并联电连接。导电件可以为电流提供通路，增大了电流流过的横截面积，能够起到降低阻抗、改善散热、提升电流利用效率的作用。
另一方面，在导电件例如高电导率片状结构、焊料或导电胶层的非焊接面增加绝缘罩状结构、绝缘涂层或与电路板的地网络相连接的罩状结构，可以避免导电件例如高电导率片状结构、焊料或导电胶层等和周围金属元件例如中框、电路板支架等接地结构件发生短路。
电路板上设置的补强结构还可以增强电路板的机械可靠性，降低断板风险。
应理解，本申请实施例提供的补强结构可以设置于电路板上的任意位置。例如，补强结构可以设置在电路板上存在阻抗瓶颈的位置，可以设置在电路板上电流通路较长的位置，可以设置在电路板上宽度较窄的位置，还可以设置在电路板上发热严重的位置。
还应理解，本申请实施例中导电片所连接的功能网络包括但不限于充电网络(例如总线电压(voltage bus，VBUS)线路)、为显示屏供电的网络、为音频模块供电的网络以及其他有降低阻抗、改善散热、提升效率、增加电路板机械可靠性的场景。
图10示出了本申请实施例提供的补强结构和现有补强结构的应变仿真示意图。
这里，图10是将补强结构应用于L型电路板的窄条区域所进行的应变仿真。图10中的(a)示出的是现有技术中采用不锈钢片进行补强的应变仿真示意图，图10中的(b)示出的是采用图9所示的补强结构(导电片和罩状结构)进行补强的应变仿真示意图。
示例性的，图10中的(a)所采用的补强结构为0.3mm厚度的不锈钢片，图10中(b)所采用的导电片为0.2mm厚的洋白铜片，罩状结构为0.2mm厚的不锈钢。从图10中可以看出，采用不锈钢片进行补强时，单板组装应变为5494微应变(微应变单位：ue)，而采用申请实施例提供的洋白铜片和不锈钢罩状结构进行补强时，单板组装应变为5102ue。
因此，本申请实施例提供的补强结构能够提高电路板的抗变形能力，断板风险可接受，且低于常规的补强钢片设计。
表1示出了图10中(b)所仿真的补强结构对电学性能的改善效果。
本申请实施例以补强结构应用于充电网络(例如VBUS线路)为例，对无导电片(示例为洋白铜片)和有导电片两种情况下的电路板的电学性能进行了测试对比。
表1
Figure PCTCN2021116854-appb-000001
从表1中可以看出，在不设置洋白铜片的情况下，电路板的阻抗实测为14.3毫欧姆(mΩ)，极限充电模式在的最高壳体温度为37.3℃，极限充电模式下的充电效率为84.8％。 在设置洋白铜片的情况下(即将洋白铜片与电路板的充电线路电连接)，电路板的阻抗实测为13.7mΩ，极限充电模式在的最高壳体温度为36.8℃，极限充电模式下的充电效率为86.3％。相应地，设置洋白铜片能够将阻抗降低0.6mΩ，将极限充电模式在的最高壳体温度降低0.5℃，将极限充电模式下的充电效率提升1.5％。
因此，本申请实施例提供的补强结构能够降低阻抗，改善散热，提升充电效率，以及增加单板可靠性。
应理解，本申请实施例所涉及的极限充电模式可以理解为需要大电流、大电压进行充电的模式，例如快充模式。
还应理解，针对不同的应用场景，本领域技术人员可以对本申请实施例提供的补强结构在材质、结构和厚度上进行优化设计，以满足电学性性能指标和机械强度。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以所述权利要求的保护范围为准。

Claims (22)

  1. 一种电路板组件，其特征在于，包括：
    印刷电路板，所述印刷电路板包括功能网络，所述功能网络用于提供电气功能；
    导电件，所述导电件与所述印刷电路板相连接，其中，所述导电件与所述功能网络以并联方式电连接；
    罩状结构，所述罩状结构罩住所述导电件，且与所述印刷电路板相连接，所述罩状结构用于防止位于所述罩状结构中的所述导电件与所述罩状结构外的导体相接触。
  2. 根据权利要求1所述的电路板组件，其特征在于，所述罩状结构为金属材料，所述罩状结构与所述导电件之间设置有间隙。
  3. 根据权利要求2所述的电路板组件，其特征在于，所述印刷电路板还包括接地网络，其中，
    所述罩状结构与所述接地网络电连接；或者，
    所述罩状结构不与所述功能网络电连接，且不与所述接地网络电连接。
  4. 根据权利要求1所述的电路板组件，其特征在于，所述罩状结构为绝缘材料。
  5. 根据权利要求1所述的电路板组件，其特征在于，所述导电件为导电片。
  6. 根据权利要求5所述的电路板组件，其特征在于，所述导电片为预成型的片状结构。
  7. 根据权利要求5所述的电路板组件，其特征在于，所述导电片为焊料固化后形成的片状结构，或者为导电胶固化后形成的片状结构。
  8. 根据权利要求1至7中任一项所述的电路板组件，其特征在于，所述导电件的材料为以下任意一种：
    单一成分的金属材料，合金材料，导电复合材料。
  9. 根据权利要求1至7中任一项所述的电路板组件，其特征在于，所述导电件与所述印刷电路板固定连接。
  10. 根据权利要求1至7中任一项所述的电路板组件，其特征在于，所述罩状结构与所述印刷电路板固定连接。
  11. 根据权利要求1至7中任一项所述的电路板组件，其特征在于，所述印刷电路板包括可分离的第一电路板部分和第二电路板部分，其中，
    所述第一电路板部分包括第一连接区、围绕所述第一连接区设置的第二连接区和从所述第二连接区向外延伸的延伸区；
    所述第一连接区与所述导电件相连接；
    所述第二连接区和所述延伸区与所述罩状结构相连接；
    所述延伸区与所述第二电路板部分交错设置。
  12. 根据权利要求1至7中任一项所述的电路板组件，其特征在于，所述印刷电路板包括横向的宽面区域和沿纵向延伸的窄条区域，所述窄条区域的宽度小于所述宽面区域的宽度，所述导电件和所述罩状结构设置于所述窄条区域上。
  13. 根据权利要求1至7中任一项所述的电路板组件，其特征在于，所述功能网络包 括充电线路和/或供电线路。
  14. 一种电路板组件，其特征在于，包括：
    印刷电路板，所述印刷电路板包括功能网络，所述功能网络用于提供电气功能；
    导电件，所述导电件与所述印刷电路板相连接，其中，所述导电件与所述功能网络以并联方式电连接；
    所述导电件的裸露在外的表面上包覆有绝缘层。
  15. 根据权利要求14所述的电路板组件，其特征在于，所述导电件为导电片或罩状结构。
  16. 根据权利要求15所述的电路板组件，其特征在于，所述导电片为预成型的片状结构。
  17. 根据权利要求15所述的电路板组件，其特征在于，所述导电片为焊料固化后形成的片状结构，或者为导电胶固化后形成的片状结构。
  18. 根据权利要求14至17中任一项所述的电路板组件，其特征在于，所述导电件的材料为以下任意一种：
    单一成分的金属材料，合金材料，导电复合材料。
  19. 根据权利要求14至17中任一项所述的电路板组件，其特征在于，所述导电件与所述印刷电路板固定连接。
  20. 根据权利要求14至17中任一项所述的电路板组件，其特征在于，所述印刷电路板包括横向的宽面区域和沿纵向延伸的窄条区域，所述窄条区域的宽度小于所述宽面区域的宽度，所述导电件设置于所述窄条区域上。
  21. 根据权利要求14至17中任一项所述的电路板组件，其特征在于，所述功能网络包括充电线路和/或供电线路。
  22. 一种电子设备，其特征在于，包括如权利要求1至21中任一项所述的电路板组件。
PCT/CN2021/116854 2020-09-30 2021-09-07 电路板组件和电子设备 WO2022068535A1 (zh)

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