WO2022068495A1

WO2022068495A1 - Panelized circuit board, depanelization method, and depanelization device

Info

Publication number: WO2022068495A1
Application number: PCT/CN2021/115276
Authority: WO
Inventors: 郭健强; 罗文君; 鄢邦松; 叶连杰; 李志海
Original assignee: 荣耀终端有限公司
Priority date: 2020-09-29
Filing date: 2021-08-30
Publication date: 2022-04-07
Also published as: CN114340136B; CN114340136A

Abstract

A panelized circuit board, a depanelization method, and a depanelization device. The panelized circuit board comprises: an auxiliary panelizing structure and N circuit board single boards panelized to each other, wherein N is a positive integer and N≥2, and at least part of the auxiliary panelizing structure is used for connecting two adjacent circuit board single boards; each circuit board single board comprises a functional trace and an outline edge to be cut, the auxiliary panelizing structure is connected to said outline edge, and the functional trace is adjacent to said outline edge; each circuit board single board comprises at least one early-warning line, and the extension direction of the at least one early-warning line is the same as that of said outline edge; the distance from the at least one early-warning line to said outline edge is d1, the distance from the functional trace to said outline edge is d2, and d1≤d2. According the present application, depanelization precision can be improved, burrs generated during depanelization can be reduced, a misjudgment rate can be reduced, manpower of manual detection can be released, and the generation of waste boards can further be avoided.

Description

A circuit board splicing, board dividing method and board dividing device

This application claims the priority of the Chinese patent application filed on September 29, 2020, with the application number 202011052818.X, and the application name is "A circuit board splicing, board splitting method and board splitting device", which The entire contents of this application are incorporated by reference.

technical field

The present application belongs to the technical field of circuit boards, and more particularly relates to a circuit board assembling method, a board dividing method and a board dividing device.

Background technique

Generally, circuit boards are produced by panel assembly, and then cut into veneers after the circuit board assembly operation is completed. The use of panel assembly can increase the production efficiency of the production line, and at the same time, it can ensure the utilization rate of the plates during processing and reduce the cost. However, when the circuit board panel is split by the current splitting method, the splitting burr is long due to the limitation of the splitting process conditions, which affects the accuracy of the splitting. If the process parameters are adjusted to reduce the burr of the sub-board, it will increase the risk of copper leakage from the sub-board. In the subsequent inspection stage, the copper-exposed veneer will be scrapped through the appearance judgment. In addition, in the subsequent detection stage, the pass is all manual detection, that is, it is judged by the human eye whether the circuit is cut to cause copper leakage. Manual inspection is prone to misjudgment, and the judgment accuracy will decrease after the inspectors are fatigued. Once there is a situation where defective products are not detected, the defective products are used in the subsequent module assembly process, resulting in the module being scrapped, which will cause more damage. large economic losses. It can be seen that improving the accuracy of sub-boards, reducing the misjudgment rate and releasing the manpower for manual detection are technical problems that need to be solved urgently at present.

SUMMARY OF THE INVENTION

In view of this, the present application provides a circuit board assembling method, a board dividing method, and a board dividing device, which solve the technical problems of improving the precision of the board dividing, reducing the misjudgment rate and releasing the manpower for manual detection.

In a first aspect, an embodiment of the present application provides a circuit board assembly, the circuit board assembly includes: an auxiliary splicing structure and N circuit boards spliced to each other, N is a positive integer, and N≥2, wherein at least part of The auxiliary splicing structure is used to connect two adjacent circuit boards; the circuit board veneer includes functional wiring and the edge of the shape to be cut, the auxiliary splicing structure is connected to the edge of the shape to be cut, and the functional line is connected to the edge of the shape to be cut. adjacent; wherein, the circuit board veneer includes at least one warning line, and the extension direction of at least one warning line is the same as the extending direction of the edge of the shape to be cut; the distance between the at least one warning line and the edge of the shape to be cut is d1, and the distance of the function line to be cut is d1. The distance between the edges of the cutting shape is d2, and d1≤d2. A warning line is added to the circuit board veneer to give an early warning to the cutting state during sub-board cutting, and to adjust the cutting method of the auxiliary splicing structure when it is judged to be an early warning state. Among them, the early warning line is cut off and the early warning line is cut but not cut off respectively correspond to the early warning states in different sub-board methods. When it is judged that the warning line is cut off, the control stops cutting the auxiliary splicing structure currently being cut, so as to avoid waste of man-hours for dividing the board and wear of the milling cutter head, and at the same time, it can also judge that the circuit board veneer connected to the auxiliary splicing structure is waste. The board can accurately detect the waste board. There is basically no misjudgment in this detection method, which ensures the detection accuracy. In addition, there is no need for additional manual inspection of the circuit board after the sub-board in the follow-up, which releases manpower and saves labor costs. When it is judged that the warning line is cut but not cut, the cutting position can be adjusted and the auxiliary splicing structure can be cut, so as to ensure that the cutting process will not cut the functional wiring in the circuit board, and achieve high-precision board separation. In addition, the generation of waste boards is avoided, and the yield rate of board separation is significantly improved.

In some embodiments, the extension direction of the edge of the shape to be cut is the first direction, the length of the edge of the shape to be cut is L1, the length of the functional wiring in the first direction is L2, L2≥L1; wherein, the warning line is in the first direction. The length of the direction is L3, L3>L1. When the length of the functional wiring is greater than or equal to the length of the shape edge to be cut, the length of the warning line is set to be greater than the length of the shape edge to be cut, so that when the auxiliary imposition structure is cut along the edge of the shape to be cut, the cutting edge of the shape to be cut can be cut by the warning line. status for warning.

In some embodiments, the extension direction of the edge of the shape to be cut is the first direction, the length of the edge of the shape to be cut is L1, the length of the functional wiring in the first direction is L2, L2<L1; wherein, the warning line is in the first direction The length of the direction is L3, L3>L2. When the length of the functional line is less than the length of the edge of the shape to be cut, the length of the warning line is set greater than the length of the function line, that is, the cutting warning can be realized when the auxiliary imposition structure is cut along the edge of the shape to be cut.

In some embodiments, the warning line is located on the side of the functional line that is close to the edge of the shape to be cut. That is to say, if the distance between the warning line and the edge of the shape to be cut is set to be less than the distance between the function line and the edge of the outer cutting shape, when cutting the auxiliary splicing structure, the warning line will be cut first, and the function may be cut after a period of time. Traces. Therefore, the cutting process can be warned through the warning line. When the warning state is detected, the functional wiring has not been cut, and the single board of the circuit board is still intact, ensuring the yield of the sub-board.

Further, set 0.02mm≤d2-d1≤0.5mm. Set the distance between the function wiring and the warning line to meet a certain range, so as to avoid the short circuit between the function wiring and the warning line from affecting the performance of the function wiring. At the same time, it is avoided that the distance between the function trace and the warning line is too large, which will affect the size of the circuit board.

In one embodiment, the width of the warning line is D, where D≧0.02mm. The pre-warning line is set to have a certain width, and when the milling cutter cuts to the pre-warning line during the cutting process, it can ensure that the pre-warning line is not cut off. Then, when the pre-warning line is determined according to the pre-warning, the cutting position can be adjusted and the sub-board can be continued. During the subsequent sub-board cutting process, the pre-warning line can still give an early warning of the cutting state until the auxiliary splicing structure is cut. The structure cooperates with the board separation method to realize high-precision board separation and avoid the generation of waste boards.

Specifically, D≤1mm is set. Avoid the width of the warning line is too large, resulting in a waste of space and affecting the size of the circuit board.

In one embodiment, the circuit board includes a first insulating layer and a second insulating layer, the warning wires and the functional wires are both located on the first insulating layer, and the second insulating layer covers the warning wires and the functional wires. The pre-warning line and the functional wiring can be produced in the same process, and the setting of the pre-warning line does not increase the extra process, and the production is simple.

In some embodiments, at least one insulating layer is spaced between the functional wiring and the warning line. This setting method can realize that in the direction of the plane of the circuit board, the distance between the warning line and the function line is small enough, or, the function line and the warning line can be made to overlap in the thickness direction of the circuit board. The distance between the function wiring and the warning line can be set according to specific needs.

In some embodiments, one functional trace corresponds to at least two early warning traces, and in the thickness direction of the circuit board, one pre-warning trace, the functional trace, and the other pre-warning trace are stacked and arranged. It can reduce the influence of layer deviation in the manufacturing process on the yield of the sub-board. Even in the case of layer deviation, it can be ensured that at least one of the two pre-warning lines is located on the side of the functional trace close to the edge of the shape to be cut, or the distance between at least one pre-warning line and the edge of the shape to be cut and the function of the edge The lines are equidistant from the edge of the shape to be cut.

Specifically, the single board of the circuit board includes an early warning port, and at least one end of the early warning line is electrically connected to the early warning port. By setting the pre-warning port, the pre-warning line is connected to the detection power supply when the circuit board is divided. In order to realize the early warning of the cutting state of the sub-board.

In one embodiment, the early warning line is an inductive coil. In the application, when the circuit board is divided, the inductive coil is connected to the detection power supply to form a conductive loop. When the milling cutter cuts off the inductive coil, the conductive loop becomes an open circuit, so that the early warning of the cutting process can be realized.

In an embodiment, the single board of the circuit board further includes a connecting wire, and the warning wire and the connecting wire are connected end to end in sequence to form a closed wiring. In the circuit board assembly provided by this embodiment, an induction circuit is set when the circuit board is divided. After the induction circuit is energized, an induction current can be generated on the closed trace, so the monitoring module may not be connected to the closed early warning line. An induction module is set in the middle, and the induction module can sense the change of the induction current on the warning line to generate a corresponding induction signal. Then, the cutting state of the warning line can be judged by detecting the change of the induction signal. When the board is divided in this way, the monitoring module does not need to be electrically connected to the pre-warning line, and the pre-warning line does not need to be connected to the power supply, which can ensure the safety of the circuit board.

In the embodiment of the present application, the circuit board panel includes at least one process edge, and some of the auxiliary splicing structures are used to connect the process edge and the adjacent circuit board veneer. In practice, the number of process edges in the circuit board assembly can be set according to the requirements of the specific manufacturing process.

In the second aspect, the embodiments of the present application also provide a method for dividing a board, which is used for dividing a circuit board assembly. The circuit board assembly includes: an auxiliary splicing structure and N circuit boards spliced to each other, where N is a positive Integer, and N ≥ 2, wherein at least part of the auxiliary splicing structure is used to connect two adjacent circuit boards; the circuit board includes functional wiring and the outline edge to be cut, and the auxiliary splice structure is the same as the outline edge to be cut. connection, the functional wiring is adjacent to the edge of the shape to be cut; wherein, the circuit board veneer includes at least one warning line, and the extension direction of at least one warning line is the same as the extension direction of the edge of the shape to be cut; at least one warning line is away from the shape to be cut. The distance between the edges is d1, and the distance between the functional trace and the edge of the shape to be cut is d2, and d1≤d2; the method of dividing the board includes: cutting an auxiliary splicing structure connected to the single board of the circuit board, and detecting the electrical performance of the early warning circuit at the same time The detection value is obtained, wherein the pre-warning line is located in the pre-warning circuit; according to the detection value, it is determined that the cutting state is the pre-warning state, and the cutting mode of the auxiliary splicing structure of the current cutting is adjusted.

The cutting state is pre-warned by detecting the electrical performance in the pre-warning circuit when the board is divided, and the cutting method of the auxiliary splicing structure is adjusted when the pre-warning state is judged. Among them, the early warning line is cut off and the early warning line is cut but not cut off respectively correspond to the early warning states in different sub-board methods. When it is judged that the warning line is cut off, the control stops cutting the auxiliary splicing structure currently being cut, so as to avoid waste of man-hours for dividing the board and wear of the milling cutter head, and at the same time, it can also judge that the circuit board veneer connected to the auxiliary splicing structure is waste. The board can accurately detect the waste board. There is basically no misjudgment in this detection method, which ensures the detection accuracy. In addition, there is no need for additional manual inspection of the circuit board after the sub-board in the follow-up, which releases manpower and saves labor costs. When it is judged that the warning line is cut but not cut, the cutting position can be adjusted and the auxiliary splicing structure can be cut, so as to ensure that the cutting process will not cut the functional wiring in the circuit board, and achieve high-precision board separation. In addition, the generation of waste boards is avoided, and the yield rate of board separation is significantly improved.

Specifically, determining that the cutting state is an early warning state according to the detected value includes: comparing the detected value with a calibration value, and the calibration value is a detection threshold that is determined to be an early warning state; when the detected value is different from the calibration value, it is determined to be an early warning state. The pre-warning state is judged by setting a detection threshold, which can be set according to the pre-warning circuit.

In some embodiments, the pre-warning line is cut off in the pre-warning state; adjusting the cutting mode of the auxiliary splicing structure currently being cut includes: controlling the milling cutter to stop cutting the auxiliary splicing structure currently being cut. This embodiment can be applied to the embodiment where the pre-warning line is a line that can be easily cut off and the pre-warning line is relatively close to the functional wiring. This kind of board separation method can avoid waste of board separation time and milling cutter head wear, and can also judge the circuit board veneer connected with the auxiliary splicing structure to be a waste board at the same time, and accurately detect the waste board.

In some embodiments, the method for dividing the board further includes: before cutting the auxiliary splicing structure, obtaining an initial value according to the electrical performance of the early warning circuit; and using the initial value as a calibration value. Before the auxiliary splicing structure is cut, the pre-warning line is complete. When the pre-warning line is cut during cutting, it will lead to changes in the electrical performance of the early-warning circuit. By taking the initial value of the electrical performance of the early-warning circuit as the calibration value, it can be accurately judged. Whether the electrical performance of the early warning circuit has changed, so as to detect whether it is in the early warning state.

Further, before cutting an auxiliary splicing structure connected to the single board of the circuit board, the method for dividing the board includes at least one of the following: connecting the two ends of the pre-warning line to the positive and negative electrodes of the detection power supply, respectively, where the pre-warning line and the detection power supply are located. The circuit is an early warning circuit; it controls the milling cutter to be electrified, and one of the milling cutter and the warning line is electrically connected to the positive pole of the detection power supply, and the other is electrically connected to the negative pole of the detection power supply. The circuit is an early warning circuit; the early warning line is an inductive coil, and the two ends of the inductive coil are respectively connected to the positive and negative poles of the detection power supply, and the circuit where the early warning line and the detection power supply are located is an early warning circuit; , After the induction circuit is energized, an induced current can be generated on the pre-warning line, and the circuit where the pre-warning line is located is an early-warning circuit. The plate-splitting method provided by the embodiment of the present invention can be applied to various early-warning circuits for early-warning of the cutting state.

In some embodiments, the width of the warning line is D, D≥0.02mm; in the warning state, the warning line is cut by the milling cutter but not cut off; adjusting the cutting method of the auxiliary splicing structure for the current cutting, including: adjusting Cut the position, and then continue to cut the auxiliary splicing structure of the current cut. It is ensured that the cutting process will not cut the functional traces in the single board of the circuit board, realize high-precision board separation, and avoid the generation of waste boards, and the yield rate of board separation is significantly improved.

Specifically, the method for dividing the board further includes: before cutting the auxiliary splicing structure, obtaining an initial value according to the electrical performance of the early warning circuit; and using the initial value as a calibration value. Before the auxiliary splicing structure is cut, the pre-warning line is complete. When the pre-warning line is cut during cutting, it will lead to changes in the electrical performance of the early-warning circuit. By taking the initial value of the electrical performance of the early-warning circuit as the calibration value, it can be accurately judged. Whether the electrical performance of the early warning circuit has changed, so as to detect whether it is in the early warning state.

Specifically, before cutting an auxiliary splicing structure connected to the single board of the circuit board, the method for dividing the board further includes: controlling the milling cutter to be electrified, and electrically connecting one of the milling cutter and the warning line to the positive pole of the detection power supply, and the other It is electrically connected to the negative pole of the detection power supply, and the circuit where the milling cutter, the early warning line and the detection power supply are located is the early warning circuit. During the cutting process, when the milling cutter touches the pre-warning line, the pre-warning circuit changes from an open circuit to a passage, and there is a certain current value in the pre-warning circuit. When the change of the current value is detected, it can be judged that the milling cutter has cut the warning line, and the cutting state of the warning line can be judged correspondingly as the warning state. Then, according to the warning state, the milling cutter is controlled to adjust the cutting position. When the milling cutter is not in contact with the warning line, the warning circuit turns back to an open circuit again; when the warning circuit becomes an open circuit again during the cutting process, it is judged that the milling cutter cuts to the warning line; The above process is repeated until the cutting of the currently cut auxiliary splice structure is completed.

Specifically, using the initial value as the calibration value includes: when the cutting state is determined to be the early warning state for the first time, using the initial value as the calibration value; the method of dividing the plate further includes: determining the cutting state after the first determination as the warning state When it is in the pre-warning state, the process value is used as the calibration value, wherein the process value is the detection value used when the cutting state of the pre-warning line was determined as the pre-warning state last time. That is to say, every time the warning line is cut once, a part of the warning line will be cut off, and the resistance size of the warning line will change once. When judging whether the warning state is the next time, the detection value detected when the warning line was cut by the milling cutter last time is used as the calibration value. By adopting the above-mentioned plate separation method, high-precision plate separation can be realized, and generation of waste plates can be avoided, thereby saving production costs.

Specifically, before cutting an auxiliary splicing structure connected to the single board of the circuit board, the method for dividing the board further includes at least one of the following: connecting the two ends of the pre-warning line to the positive and negative electrodes of the detection power supply, respectively, the pre-warning line and the detection power supply. The circuit in which it is located is an early warning circuit; the external induction circuit of the circuit board is energized, wherein, after the induction circuit is energized, an induced current can be generated on the early warning line, and the circuit where the early warning line is located is an early warning circuit. The plate-splitting method provided in this embodiment can be applied to various early-warning circuits to give early warning of the cutting state.

Specifically, adjusting the cutting position includes: adjusting the relative position of the milling cutter and the auxiliary splicing structure currently being cut according to the position adjustment signal. After adjusting the cutting position, the milling cutter is controlled to stay away from the warning line, so that the auxiliary splicing structure can be continuously cut, and the warning line can continue to warn the cutting state in the subsequent cutting process.

Further, the method for dividing the plate also includes: while adjusting the cutting position, reducing the cutting speed and the rotational speed of the milling cutter according to the control of the first cutting parameter adjustment signal; The position includes: according to the control adjustment of the position adjustment signal, the distance between the milling cutter and the warning line adjacent to the auxiliary splicing structure of the current cutting is increased, wherein the change of the distance after adjustment is a preset value; the milling cutter is controlled to continue to cut the current cutting The auxiliary splicing structure is cut, including: when the distance change reaches a preset value, according to the control of the second cutting parameter adjustment signal, the cutting speed and the rotation speed of the milling cutter are increased, and the auxiliary splicing structure currently being cut is continued to be cut. In this embodiment, the cutting speed and the rotating speed of the milling cutter are reduced while the cutting position is adjusted, so as to prevent the occurrence of uncontrollable cutting and cause the warning line to lose the warning function for cutting.

In a third aspect, an embodiment of the present application also provides a depaneling device, which is applied to depaneling a circuit board assembly, and the depaneling device includes: a depaneling tool, a loading table, a milling cutter, a monitoring module and a main control system; in,

Sub-board tooling, used to fix the circuit board panel;

The stage, used to carry the sub-board tooling;

The milling cutter is used to cut the auxiliary splicing structure connected with the circuit board veneer;

The main control system monitoring module, the monitoring module is used to detect the electrical performance of the early warning circuit to obtain the detection value during sub-board, and send the detection value to the main control system, wherein the early warning line in the circuit board assembly is located in the early warning circuit;

The main control system includes: a judgment unit and a cutting control unit; wherein,

The judgment unit is used for receiving the detection value, and when it is determined that the cutting state is an early warning state according to the detection value, sending an adjustment instruction to the cutting control unit;

The cutting control unit is used for adjusting the cutting mode of the auxiliary splicing structure currently being cut in response to the adjustment instruction.

By applying the plate separating device provided in the present application, it is possible to give an early warning to the cutting state of the separating plate and adjust the cutting method when the plate is separated. The feedback control of the cutting method is realized by detecting the cutting state, so as to improve the precision of the plate separation.

Specifically, the judging unit is used to compare the detection value with the calibration value, the calibration value is a detection threshold value determined as an early warning state, and when the detection value is different from the calibration value, it is determined as an early warning state. The pre-warning state is judged by setting the detection threshold, which can be set according to the pre-warning circuit.

In some embodiments, the warning line is cut off in the warning state; the cutting control unit is further configured to control the milling cutter to stop cutting the currently cutting auxiliary splicing structure in response to the adjustment instruction. It can avoid the waste of board dividing man-hours and milling cutter head wear, and can simultaneously determine that the circuit board veneer connected with the auxiliary splicing structure is a waste board, and accurately detect the waste board. In addition, there is no need for additional manual inspection of the circuit board after the sub-board in the follow-up, which releases manpower and saves labor costs.

In some embodiments, the width of the warning line is D, D≥0.02mm; in the warning state, the warning line is cut by the milling cutter but not cut off; the cutting control unit is further configured to adjust the cutting position in response to the adjustment instruction The back control continues to cut the currently cut auxiliary splice structure. It can continue to cut the auxiliary splicing structure after adjusting the cutting position, so as to ensure that the cutting process will not cut the functional wiring in the single board of the circuit board, realize high-precision board separation, and avoid the generation of waste boards, and the yield rate of board separation is significantly improved. .

Further, the monitoring module is also used to obtain the initial value according to the electrical performance of the early warning circuit before cutting the auxiliary splicing structure, and send the initial value to the judgment unit; value as the calibration value. Before the auxiliary splicing structure is cut, the pre-warning line is complete. When the pre-warning line is cut during cutting, it will lead to changes in the electrical performance of the early-warning circuit. By taking the initial value of the electrical performance of the early-warning circuit as the calibration value, it can be accurately judged. Whether the electrical performance of the early warning circuit has changed, so as to detect whether it is in the early warning state.

Further, the judging unit is also used to use the initial value as the calibration value when the cutting state is determined to be an early warning state for the first time; it is also used to determine that the cutting state is an early warning state after the first determination as the early warning state, using The process value is used as the calibration value, wherein the process value is the detection value adopted when the cutting state of the warning line was determined as the warning state last time. When the warning line has a certain width, when the milling cutter cuts to the warning line, the warning line will not be cut off immediately, and the state where the warning line is cut but not cut off is set as the warning state. Then a part of the warning line will be cut off, and the resistance size of the warning line will change once. When judging whether the warning state is the next time, the detection value detected when the warning line was cut by the milling cutter last time is used as the calibration value. By adopting the above-mentioned plate separation method, high-precision plate separation can be realized, and generation of waste plates can be avoided, thereby saving production costs.

Further, the cutting control unit includes a first subunit and a second subunit; the first subunit is used to generate a position adjustment signal in response to the adjustment instruction, and the position adjustment signal is used to control and adjust the auxiliary splicing structure of the milling cutter and the current cutting. The second sub-unit is used to generate a cutting control signal after adjusting the relative position, and the cutting control signal is used to control the continuous cutting of the auxiliary splicing structure currently being cut. After adjusting the cutting position, the milling cutter is controlled to stay away from the warning line, so that the auxiliary splicing structure can be continuously cut, and the warning line can continue to warn the cutting state in the subsequent cutting process.

Specifically, the position adjustment signal is specifically used to control and increase the distance of the milling cutter from the warning line adjacent to the auxiliary splicing structure of the current cutting, wherein the adjusted distance change is a preset value; the cutting control signal includes the first cutting The parameter adjustment signal and the second cutting parameter adjustment signal; the second subunit is also used to generate the first cutting parameter adjustment signal when adjusting the cutting position, and the first cutting parameter control signal is used to control the reduction of the cutting speed and the rotation speed of the milling cutter ; is also used to generate a second cutting parameter adjustment signal when the distance change reaches a preset value, and the second cutting parameter adjustment signal is used to control the increase of the cutting speed and the rotation speed of the milling cutter, and continue to cut the auxiliary splicing structure of the current cutting. . In this embodiment, the cutting speed and the rotating speed of the milling cutter are reduced while the cutting position is adjusted, so as to prevent the occurrence of uncontrollable cutting and cause the warning line to lose the warning function for cutting.

In some embodiments, the sub-panel device further includes an auxiliary pre-warning module, and the auxiliary pre-warning module includes an induction circuit, and the induction circuit is used to generate an induction current on the pre-warning circuit during the de-paneling process after power-on. The circuit board panel in which the warning line and the conductive line in the circuit board form a closed line can use this sub-board device to divide the board. After the induction circuit is energized, an induced current can be generated on the closed line, and the monitoring module can not be used. It is connected with the closed pre-warning line, and by arranging an inductive module in the monitoring module, the inductive module can sense the change of the inductive current on the pre-warning line to generate a corresponding inductive signal. Then, the cutting state of the warning line can be judged by detecting the change of the induction signal. When the board is divided in this way, the monitoring module does not need to be electrically connected to the pre-warning line, and the pre-warning line does not need to be connected to the power supply, which can ensure the safety of the circuit board.

The circuit board assembling, splitting method and splitting device provided by the present application have the following beneficial effects: an early warning line is added to a single board of a circuit board, and an early warning circuit is used to give an early warning to the cutting process when the splitting is cut. While cutting the auxiliary splicing structure connected with the single board of the circuit board, the change of the electrical performance of the early warning circuit is monitored by the monitoring module in the sub-board device. The main control system in the sub-panel device can judge the cutting state of the warning line according to the change of the electrical performance of the warning circuit, and adjust the cutting method of the auxiliary splicing structure when it is judged that the cutting state of the warning line is the warning state. Among them, the early warning line is cut off and the early warning line is cut but not cut off respectively correspond to the early warning states in different sub-board methods. When it is judged that the warning line is cut off, the control stops cutting the auxiliary splicing structure currently being cut, so as to avoid waste of man-hours for dividing the board and wear of the milling cutter head, and at the same time, it can also judge that the circuit board veneer connected to the auxiliary splicing structure is waste. The board can accurately detect the waste board. There is basically no misjudgment in this detection method, which ensures the detection accuracy. In addition, there is no need for additional manual inspection of the circuit board after the sub-board in the follow-up, which releases manpower and saves labor costs. When it is judged that the warning line is cut but not cut, the cutting position can be adjusted and the auxiliary splicing structure can be cut, so as to ensure that the cutting process will not cut the functional wiring in the circuit board, and achieve high-precision board separation. In addition, the generation of waste boards is avoided, and the yield rate of board separation is significantly improved.

Description of drawings

Fig. 1 is a partial schematic diagram of a circuit board splicing in the related art;

FIG. 2 is a schematic diagram of a circuit board assembly provided by an embodiment of the present application;

Fig. 3 is a kind of flow chart of the splitting method provided by the embodiment of the present application;

FIG. 4 is a schematic diagram of a plate splitting device provided by an embodiment of the present application;

FIG. 5 is another schematic diagram of the plate splitting device provided by the embodiment of the present application;

6A is a simplified schematic diagram of a cross-section at the position of the tangent line A-A' in FIG. 2;

6B is a simplified schematic diagram of a cross-section at the position of the tangent line A-A' in FIG. 2;

FIG. 7 is another partial schematic diagram of the circuit board panel provided by the embodiment of the present application;

Fig. 8A is a schematic cross-sectional view at the position of tangent line B-B' in Fig. 7;

Fig. 8B is another schematic cross-sectional view at the position of tangent line B-B' in Fig. 7;

FIG. 9 is a partial top schematic view of a circuit board panel provided by an embodiment of the present application;

FIG. 10 is another partial top view schematic diagram of the circuit board panel provided by the embodiment of the application;

FIG. 11 is another partial top schematic view of the circuit board panel provided by the embodiment of the application;

Figure 12 is a schematic cross-sectional view at the position of the tangent line C-C' in Figure 10;

FIG. 13 is another partial top schematic view of the circuit board panel provided by the embodiment of the application;

FIG. 14 is a partial top-view schematic diagram of a circuit board assembly provided by an embodiment of the application;

FIG. 15 is another partial top-view schematic diagram of the circuit board panel provided by the embodiment of the application;

FIG. 16 is another flowchart of the method for splitting a board provided by an embodiment of the present application;

17 is a block diagram of a main control system in a sub-board device provided by an embodiment of the present invention;

FIG. 18 is another flowchart of the method for splitting a board provided by an embodiment of the present application;

Fig. 19 is a circuit diagram of the sub-board device and the early warning circuit in the sub-board process;

FIG. 20 is a working flow diagram of the plate splitting device provided by the embodiment of the application;

FIG. 21 is another flowchart of a method for splitting a board provided by an embodiment of the present application;

FIG. 22 is another flowchart of the method for splitting a board provided by an embodiment of the present application;

Figure 23 is another circuit diagram of the sub-board device and the early warning circuit in the sub-board process;

FIG. 24 is another working flow chart of the plate-splitting device provided by the embodiment of the application;

Figure 25 is a schematic diagram of a cutting trajectory of a milling cutter in the process of splitting cutting;

FIG. 26 is another flowchart of the method for splitting a board provided by an embodiment of the present application;

Figure 27 is another circuit diagram of the sub-board device and the early warning circuit in the sub-board process;

FIG. 28 is another working flow chart of the depaneling device provided by the embodiment of the application;

FIG. 29 is another flow chart of the method for splitting a board provided by an embodiment of the present application;

Figure 30 is another circuit diagram of the sub-board device and the early warning circuit in the sub-board process;

FIG. 31 is a working flow diagram of the plate splitting device provided by the embodiment of the application;

Figure 32 is another circuit diagram of the sub-board device and the early warning circuit in the sub-board process

FIG. 33 is another flowchart of the method for splitting a board provided by an embodiment of the present application;

FIG. 34 is another block diagram of the main control system in the sub-board device provided by the embodiment of the application.

Detailed ways

FIG. 1 is a partial schematic diagram of a circuit board assembly in the related art. As shown in FIG. 1 , two adjacent circuit boards 00 are connected by connecting bars 01 , and function lines 02 are usually provided at positions close to the connecting bars 01 in the circuit boards 00 . Wherein, the function line 02 can be a wire, which is used to connect the components in the circuit of the circuit board veneer 00; the function line 02 can also be a ground wire, which is used as a potential reference point in the circuit in the circuit board veneer 00; function The line 02 can also be copper plated, and the copper plated is used to connect with the ground wire to reduce the resistance of the ground wire. Between the function line 02 and the connection bar 01, a sub-board identification line 03 with a certain width is arranged, and the connection bar 01 is cut along the sub-board identification line 03 during sub-board. There are three positional relationships between the sub-board identification line 03 and the preset outline line 04 of the circuit board veneer 00 . The preset outline line 04 is understood as the design outline edge of the circuit board veneer. However, since the circuit board is made by splicing in the production process, after the splicing is divided, the final shape edge of the circuit board may be different from the design shape edge. The three positional relationships are: the first, the sub-board identification line is located on the side of the preset outline of the circuit board that is far from the function line; the second, the sub-board identification line is located in the preset outline of the circuit board. The inner side of the line close to the function line, that is, the sub-board identification line is located in the circuit board veneer; in the third type, the sub-board identification line coincides with the preset outline of the circuit board veneer. Corresponding to these three different positional relationships, the distance between the functional line inside the circuit board and the preset outline line will also be adjusted accordingly to reduce the risk of copper exposure during the process of cutting the connection strip and improve the quality of the sub-board. Rate. As an example of the third positional relationship shown in FIG. 1 , the distance d ₀ between the function line 02 and the preset outline line 04 of the circuit board veneer 00 is at least a safety distance of 0.2 mm.

In the related art, the waste boards of the sub-boards are manually detected, and the third positional relationship shown in FIG. 1 is taken as an example. As shown in FIG. 1 , the sub-board identification line 03 has a first boundary line 031 on the side close to the circuit board veneer 00 and a second boundary line 032 on the side away from the circuit board veneer 00 . During manual inspection after cutting the connecting strip, it is checked whether the first boundary line 031 is intact and not cut, and the second boundary line 032 is completely cut off. Only the veneer that meets this condition is a qualified veneer. The rest of the cases are discarded. In manual inspection, human eye recognition is used to detect waste boards, but human eye recognition is not accurate enough, which is prone to misjudgment, such as detecting a good board as a waste board, or judging a waste board as a good board. For example, if there is a misjudgment of a defective product, the defective product is not detected, and the use of the defective product in the subsequent module assembly process will lead to the scrapping of the module, which will cause greater economic losses. Moreover, when inspectors continue to inspect for a long time, fatigue will inevitably occur, which will lead to a decrease in the accuracy of inspection. Therefore, there is a risk of misjudgment in manually detecting the circuit board after the board is divided, and it is easy to cause waste of good boards or economic losses caused by the module application of waste boards.

In addition, in the related art, after the sub-board cutting logic is formulated, the sub-board machine will use the same cutting logic to sub-board the same type of circuit board panel. Due to the inevitable systematic error of the sub-board machine, the burr of the circuit board after the sub-board is too long, which affects the sub-board accuracy. If the sub-board logic is adjusted to reduce the sub-board burr, it may increase the risk of copper exposure on the sub-board. The exposed copper in the sub-board is manually detected and discarded in the subsequent inspection stage, which affects the yield of the sub-board. . It can be seen that in the related art, a balance point needs to be found between the precision of the sub-board and the yield of the sub-board.

Based on the problems in the related art, the embodiments of the present application provide a circuit board assembly, a method for dividing a board, and a device for dividing a board. A warning line is added to the single board of the circuit board, and the cutting process is carried out by the warning circuit during the cutting of the board. Warning. While cutting the auxiliary splicing structure connected with the single board of the circuit board, the change of the electrical performance of the early warning circuit is monitored by the monitoring module in the sub-board device. The main control system in the sub-panel device can judge the cutting state of the warning line according to the change of the electrical performance of the warning circuit, and adjust the cutting method of the auxiliary splicing structure when it is judged that the cutting state of the warning line is the warning state. Among them, the cutting state of the warning line includes: the warning line is not cut, the warning line is cut off, the warning line is cut but not cut off, and the like. Among them, the pre-warning line being cut off and the pre-warning line being cut but not being cut off respectively correspond to different pre-warning states in the sub-board method. When it is judged as an early warning state, adjust the cutting method. Among them, when the warning line is cut off, the control stops the cutting of the auxiliary splicing structure currently being cut, so as to avoid the waste of man-hours for dividing the board and the wear of the milling cutter head, and it can also judge at the same time that the circuit board connected to the auxiliary splicing structure is Waste board, accurate detection of waste board, there is basically no misjudgment in this detection method, which ensures the detection accuracy. In addition, there is no need for additional manual inspection of the circuit board after the sub-board in the follow-up, which releases manpower and saves labor costs. When the warning line is cut but not cut, the auxiliary splicing structure can be cut after adjusting the cutting position, so as to ensure that the cutting process will not cut the functional wiring in the single board of the circuit board, realize high-precision board separation, and The generation of waste boards is avoided, and the yield rate of board separation is significantly improved.

The above is the main idea of the embodiments of the present application, and the technical solutions of the present application will be described below with specific embodiments.

FIG. 2 is a schematic diagram of a circuit board assembling provided by an embodiment of the present application, and FIG. 3 is a flowchart of a board splitting method provided by an embodiment of the present application.

The embodiment of the present application provides a circuit board assembly, the circuit board assembly includes: an auxiliary splicing structure and N circuit boards spliced with each other, N is a positive integer, and N≥2, wherein at least part of the auxiliary splicing structure is used for It is used to connect two adjacent circuit boards. The number of circuit boards in a circuit board assembly can be set according to specific process capabilities and product requirements. FIG. 2 is illustrated with N=4.

As shown in FIG. 2 , the four circuit boards 10 that are spliced to each other, the adjacent two circuit boards 10 are connected by the auxiliary splicing structure 20 , and the auxiliary splicing between the two adjacent circuit boards 10 The structures 20 may be one, two or more. In addition, the shape of the auxiliary splicing structure 20 between two adjacent circuit boards 10 may be a bar shape as shown in the figure, or may also be a cross row, or other shapes. The present application does not limit the specific shape of the auxiliary splicing structure.

FIG. 2 also illustrates that the circuit board assembly 10 includes two process edges 30 arranged opposite to each other, and the circuit board veneer 10 and the process edge 30 are connected by the auxiliary splicing structure 20 . That is, part of the auxiliary splicing structure 20 is used for connecting the process edge 30 and the circuit board 10 adjacent thereto. Wherein, the process edges in the circuit board assembly may be one, two, three, or four process edges arranged around the N circuit boards. In some optional embodiments, the circuit board panel may also not include process edges, which are not illustrated in the drawings herein.

The circuit board 10 includes functional traces 11 and an outline edge 12 to be cut, the auxiliary splicing structure 20 is connected to the outline edge 12 to be cut, and the functional trace 11 is adjacent to the outline edge 12 to be cut. The functional wiring 11 is a wire used to connect components in the circuit, and the functional wiring 11 may also be a ground wire or a copper layer. In the figure, the outline edge 12 to be cut is indicated by a dotted line. Wherein, before the auxiliary splicing structure 20 is cut, the outline edge 12 to be cut is equivalent to the virtual boundary between the auxiliary splicing structure 20 and the circuit board veneer 10, and the outline edge 12 to be cut can also be understood as the edge of the circuit board splicing For the design edge, the final outline edge of the circuit board panel can be formed only after the auxiliary splicing structure 20 is cut. In this application, the functional wiring 11 is adjacent to the outline edge 12 to be cut means that the extending direction of the functional wiring 11 is approximately the same as the extending direction of the outline edge 12 to be cut, and the functional wiring 11 is adjacent to the outline edge to be cut. 12 with a certain interval distance. As shown in the top view in FIG. 2 , the distance between the functional wiring 11 and the edge 12 of the shape to be cut is d2 . The size of d2 is related to the specific sub-board process requirements. In general, the cutting is performed along the edge 12 of the shape to be cut when the board is divided, and the size of d2 needs to meet the requirements of the specific cutting process, so as to ensure that the functional wiring 11 is not damaged during the cutting process.

In the embodiment of the present application, the circuit board 10 further includes at least one warning line 13, and the extension direction of the at least one warning line 13 is the same as the extending direction of the outline edge 12 to be cut; the distance between the at least one warning line 13 and the outline edge 12 to be cut is d1, where d1≤d2. FIG. 2 shows the case where d1 is smaller than d2 , that is, in the embodiment of FIG. 2 , the warning line 13 is located on the side of the functional wiring 11 close to the edge 12 of the shape to be cut. Further, d1≤d2-0.1mm. Wherein, one circuit board veneer 10 may be connected with multiple auxiliary splicing structures 20 , and an early warning line 13 may be provided in the circuit board veneer 10 corresponding to each auxiliary splicing structure 20 . Alternatively, only part of the auxiliary splicing structure 20 may be correspondingly provided with the warning line 13 . In the present application, functional traces are provided near the outline edge of the circuit board 10 , and some functional traces are relatively close to the auxiliary splicing structure 20 , such as the functional traces 11 defined in this application. Then, an early warning line 13 is set in the circuit board veneer 10 for monitoring and early warning when the auxiliary splicing structure is cut, and the cutting state of the early warning line is judged according to the electrical performance change of the early warning circuit where the early warning line is located, so as to judge the cutting. When dividing the board, check whether the functional wiring that is closer to the auxiliary splicing structure is in good condition, and then it can be judged whether the circuit board is scrapped.

It should be noted that FIG. 2 only shows the functional wirings 11 adjacent to some of the outline edges 12 to be cut, and the warning lines 13 corresponding to these functional wirings 11 . FIG. 2 is only for illustrating the positional relationship among the warning line 13 , the functional wiring 11 , the outline edge 12 to be cut, and the auxiliary splicing structure 20 . In addition, in FIG. 2, only the circuit board veneer including the 2*2 array is used for illustration. The actual circuit board assembly may include the circuit board veneer with multiple rows and columns. The specific circuit board veneer array The arrangement can be set according to the specific process and product requirements.

In the application, the circuit board splicing needs to be divided, that is, all the auxiliary splicing structures connected with the circuit board veneer are cut off to form each independent circuit board veneer. The circuit board assembly provided by the embodiment of FIG. 2 can be divided by the method of dividing the board provided by the embodiment of FIG. 3 . As shown in Figure 3, the sub-board method includes the following steps:

Step S101 : cutting an auxiliary splicing structure 20 connected to the circuit board veneer 10 , and simultaneously detecting the electrical performance of the early warning circuit to obtain a detection value, wherein the early warning line 13 is located in the early warning circuit. That is to say, when the auxiliary splicing structure 20 is cut, the electrical performance of the early warning circuit is detected in real time.

The pre-warning circuit is not marked in FIG. 2. In some detection methods, the pre-warning line 13 in the circuit board 10 needs to be connected with the detection power supply (which can be a battery installed in the sub-board device, or an external power supply) when dividing the board. ) is turned on to form an early warning circuit.

The electrical properties of the early warning circuit may be electrical properties such as current, voltage, and resistance. The detection value may be a detection value obtained by detecting an electrical signal, an optical signal, a thermal signal, or a magnetic signal, or the like. For example, the monitoring module can be connected to the early warning circuit, and the monitoring module can directly detect the electrical performance in the early warning circuit to obtain an electrical signal; or the monitoring module can be connected to the early warning circuit, and the monitoring module is provided with an optical signal generating module (or a Thermal signal generation module or magnetic signal generation module), through the electrical performance signal in the early warning circuit, the optical signal generation module generates an optical signal (correspondingly, it can also be a thermal signal or a magnetic signal), and then detects the optical signal to obtain a detection value. In another detection method, the monitoring module is not connected to the pre-warning circuit, and the pre-warning wire 13 and the connecting wires in the circuit board 10 are connected end to end to form a closed wire. In the production process of the circuit board veneer, a closed trace formed by an early warning line and a connecting wire is made. The closed trace is an early warning circuit. In the process of dividing the board, there is no need to connect the early warning line to the detection power supply, but in the circuit board single The outside of the board is provided with an induction circuit. After the induction circuit is energized, an induction current can be generated on the warning line. Then, by setting an induction module in the monitoring module, the induction module senses the electrical properties of the warning line to obtain an induction signal, wherein the induction signal can be an optical signal, a thermal signal or a magnetic signal. The type of the specific detection signal is not intended to be limited by application. In the following embodiments, the detection signal is used as an electrical signal for schematic illustration.

Step S102: Determine whether the cutting state of the warning line 13 is an early warning state according to the detection value.

Before starting to cut the auxiliary splicing structure 20, the electrical properties of the early warning circuit correspond to initial values. In one embodiment, the initial value is used as a calibration value, and the calibration value is a detection threshold for judging whether it is an early warning state. Specifically, in a sub-board method, the early warning line is connected to the detection power supply to form a circuit loop as the early warning circuit, and the current change in the early warning circuit is detected to determine the cutting state of the early warning line, and the initial value of the electrical performance of the early warning circuit is The voltage value of the detection power supply is divided by the total resistance of the circuit elements in the warning circuit. The initial value has a certain size. Among them, the initial value can be determined according to the design parameters of the early warning circuit (including the material and length of the early warning line, and the length and material of the wire connecting the early warning line and the detection power supply, etc.) calculation; or before starting to cut the auxiliary splicing structure, the current value at the initial moment in the early warning circuit is detected as the initial value by the monitoring module set in the sub-board device. The initial value is the calibration value. When the auxiliary splicing structure 20 is cut and divided, when the pre-warning line 13 is cut off, the pre-warning circuit is changed from the passage to the open circuit, and a current loop cannot be formed, and the current value in the pre-warning circuit is 0. The monitoring module detects the current value in the early warning circuit in real time. When the detection value is 0 and the detection value is different from the calibration value, it is judged that the early warning line 13 is cut off, and the cutting state of the early warning line 13 is an early warning state.

In some optional embodiments, the milling cutter in the sub-board device is electrified, and when the milling cutter approaches the warning line or the milling cutter cuts to the warning line, the current in the warning circuit will change, and the monitoring module detects the status of the warning circuit. Changes in electrical properties, so that whether the cutting state is an early warning state can be judged according to the changes in electrical properties. This implementation will be described in detail in the following specific plate-splitting method examples. In addition, the above-mentioned warning state is at least one of the warning line being cut off, and the warning line being cut but not cut off.

Step S103 : when it is determined to be an early warning state, adjust the cutting method of the auxiliary splicing structure 20 currently being cut.

When the state where the warning line 13 is cut is the warning state, the milling cutter can be controlled to stop cutting the auxiliary splicing structure 20 currently being cut. In the circuit board 10, when d1=d2, or there is little difference between d1 and d2 , that is, when the distance between the pre-warning line 13 and the functional wiring 11 is relatively close, when it is judged that the cutting process cuts to the pre-warning line 13, because the distance between the pre-warning line 13 and the functional wiring 11 is relatively short, then the function will go with a high probability. If the wire 11 is also cut, the circuit board 10 where the functional trace 11 is located is defective, and it can be judged that the single board is a waste board, and the cutting of the circuit board 10 is stopped, so as to avoid the time and cost of dividing the board. Waste of milling cutter head wear.

When the pre-warning line 13 is cut but not cut by the milling cutter, it is the pre-warning state, the cutting position can be adjusted, and then the auxiliary splicing structure 20 currently being cut can continue to be cut, so as to ensure that the cutting process will not cut the circuit board single The functional wiring 11 in the board 10 realizes high-precision board separation, avoids the generation of waste boards, and significantly improves the yield of board separation.

In addition, in the process of cutting the auxiliary splicing structure, when the warning line is not cut, the non-warning state will be judged according to the detected detection value. In a non-warning state, there is no need to adjust the cutting method of the currently cut auxiliary splicing structure.

In the embodiment of the present application, an early warning line is set in the single board of the circuit board, and the cutting state of the early warning line is judged according to the change of the electrical performance of the early warning circuit where the early warning line is located. When the cutting state of the early warning line is the early warning state, then Adjust the cutting method of the auxiliary splicing structure of the current cutting. That is to say, the present application can adjust the cutting method in real time according to the cutting state, instead of using a fixed cutting method to cut all the auxiliary splicing structures. The present application can improve the precision of plate separation and reduce the burr of plate separation. In the embodiment of the present application: the warning line in the circuit board veneer can be a line with a narrow width and is easy to be cut off during cutting; the warning line can also be a line with a certain width, which will be partially cut off during cutting but not cut off. The distance between the function trace and the shape to be cut is greater than the distance between the warning line and the edge of the shape to be cut, or the distance between the function trace and the edge of the shape to be cut is roughly equal to the distance between the warning line and the edge of the shape to be cut. Different warning lines in the embodiments of the present application correspond to different cutting warning states.

When the pre-warning line is easily cut, the cutting state in the sub-board includes: the pre-warning line is not cut, the pre-warning line is cut but the functional wiring is not cut, the pre-warning line is cut and the functional wiring is cut. Among them, the safe state is when the pre-warning line is not cut, the pre-warning line is cut off but the functional wiring is not cut off, the pre-warning line is cut off and the functional wiring is cut off, respectively, corresponding to the pre-warning state during the sub-board process.

When the warning line is not cut, the warning line is safe, and the function wiring is safe. In the initial state of the sub-board, that is, before starting to cut the auxiliary splicing structure, the pre-warning circuit where the pre-warning line is located has an initial value of electrical properties, which may be an initial value of current or an initial value of voltage. The initial value of the electrical performance can be used as the calibration value, and the calibration value can be used as the detection threshold for detecting whether it is an early warning state. The settings of the sub-board program continue to sub-board.

When the warning line is cut off but the function wiring is not cut off, the function wiring is safe. If there is a certain distance between the functional trace and the warning wire in the circuit board, the cutting state in which the pre-warning wire is cut but the function wire is not cut will exist in the sub-board cutting. Set the state where the pre-warning line is cut off but the function wiring is not cut off as the pre-alarm state. Before starting to cut the auxiliary splicing structure, the early warning line is complete, and the electrical performance in the early warning circuit is the initial value; when the early warning line is cut off, the early warning circuit is open, and the electrical performance in the early warning circuit changes, the warning When the wire is cut, the detection value detected by the monitoring module is different from the initial value. Therefore, it can be judged whether the cutting state of the warning line is the warning state by comparing the size of the initial value and the detection value. In the initial state, there is a certain current value I0 in the pre-warning circuit as an example, when the pre-warning line is cut off, the pre-warning circuit is open, the current value in the pre-warning circuit is 0, and the detection value is 0. In the pre-warning state that the pre-warning line is cut off but the functional wiring is not cut off, the functional wiring is not cut off, the circuit board is still in good condition. The relative position of the veneer and the circuit board can continue to cut the auxiliary splicing structure.

When the warning line is cut off and the functional wiring is cut off, the functional wiring has been cut off, and the circuit board is already a waste board. When the distance between the functional trace and the pre-warning trace on the circuit board is close, or the distance between the functional trace and the edge of the shape to be cut and the distance between the pre-warning trace and the edge of the shape to be cut are approximately equal, there will be a The cutting state in which the warning line is cut off and the function wiring is cut off. Set the state where the warning line is cut off and the function wiring is cut off as the warning state. Before starting to cut the auxiliary splicing structure, the early warning line is complete, and the electrical performance in the early warning circuit is the initial value; when the early warning line is cut off, the early warning circuit is open, and the electrical performance in the early warning circuit changes, the warning When the wire is cut, the detection value detected by the monitoring module is different from the initial value. Therefore, it can be judged whether the cutting state of the warning line is the warning state by comparing the size of the initial value and the detection value. For the magnitude relationship between the initial value and the detected value, reference may be made to the above description, which will not be repeated here. In the pre-warning state that the pre-warning line is cut off and the functional wiring is cut off, the functional wiring has been cut off, and the circuit board is already a waste board. The cutter stops cutting the current auxiliary splicing structure, which can detect the waste plate in time, and at the same time avoid the wear of the milling cutter head and reduce waste.

When the warning line is a line with a certain width, the cutting state in the sub-board includes: the warning line is not cut, the warning line is cut but not cut, the warning line is cut but the function wiring is not cut, the warning line is cut cut off and the functional wiring is cut. in,

When the warning line is not cut, the warning line is safe, and the function wiring is safe. In the initial state of the sub-board, that is, before starting to cut the auxiliary splicing structure, the pre-warning circuit where the pre-warning line is located has an initial value of electrical properties, which may be an initial value of current or an initial value of voltage. The initial value of the electrical performance can be used as the calibration value, and the calibration value can be used as the detection threshold to detect whether it is an early warning state. The board program settings continue to divide the board.

When the warning line is cut but not cut, the function wiring is safe. The state where the pre-warning line is cut but not cut is set as the pre-alarm state. Since the pre-warning line has a certain width, when the pre-warning line is cut, and part of the pre-warning line is cut off, the resistance of the pre-warning line will change, which will correspondingly change the electrical performance of the pre-warning circuit. Then the detection value detected when the pre-warning line is cut for the first time will be different from the initial value. By comparing the size of the initial value and the detection value, it can be judged whether the cutting state of the pre-warning line is an early-warning state. Taking the detection current value as the detection electrical performance as an example, in an application, in the initial state, the pre-warning circuit is a loop, and the current in the pre-warning circuit has the initial value I0; when the milling cutter cuts to the pre-warning line for the first time, the pre-warning line is It has a certain width and is not cut off, but the pre-warning line is cut off, resulting in a smaller resistance of the pre-warning line, then the total resistance in the pre-warning circuit becomes smaller, and correspondingly, when the detection power supply voltage is constant, the current in the pre-warning circuit becomes smaller. , at this time the detection value is I', and I'<I0. That is to say, when the detected value is smaller than the initial value, it is judged that the warning line is cut by the milling cutter but not cut off, and the cutting state is judged to be the warning state. In another application, if the pre-warning circuit is open in the initial state, the current in the pre-warning circuit has an initial value of 0; in the sub-board, the milling cutter is controlled to be electrified. When the milling cutter cuts to the pre-warning line for the first time, the pre-warning line has A certain width is not cut off, and because the milling cutter is conductive, the milling cutter, the warning line and the detection power supply form a current loop, and there will be a certain current value on the warning line. At this time, the detection value is I″, and I″≠0. Here The detection value I″ detected in this cutting state is greater than the initial value. That is to say, when the detection value is greater than the initial value, it is judged that the warning line is cut by the milling cutter but not cut off, and the cutting state is judged to be a warning state. In the warning state that the wire is cut but not cut off, and the functional wiring is not cut off, the circuit board is still in good condition. The relative position of the plate can continue to cut the auxiliary splicing structure.

When the warning line has a certain width, when there is a certain distance between the function wiring and the warning line, there may be a state in which the warning line is cut but the function wiring is not cut off during the sub-board cutting. In the process of the pre-warning line from not being cut, to being cut but not being cut, and then to being cut off, the electrical performance in the pre-warning circuit also has a certain variation law. In the initial state, the pre-warning circuit is the loop, and the current in the pre-warning circuit has the initial value I0 as an example. When the pre-warning wire is not cut, the detection value of the current in the pre-warning circuit is equal to the initial value; when the pre-warning wire is cut but not cut off, the resistance of the pre-warning wire becomes smaller, and the current in the pre-warning circuit becomes larger, the The detection value of the current is greater than the initial value, and as the part of the pre-warning wire is cut off, the current in the pre-warning circuit is larger; and when the pre-warning wire is cut off, the pre-warning circuit becomes an open circuit, and the current value in the circuit is 0. Then the detection value is 0, that is to say, when the detection value is 0, it can be judged that the warning line is cut off. When the distance between the function line and the warning line is large, it can be roughly judged that the function line is not cut when the warning line is just cut off; and when the function line is closer to the warning line, the warning line is just cut off. At the moment, it is not completely sure whether the milling cutter cuts to the functional trace. Therefore, once the warning line is cut off, the feedback control of the cutting state cannot be continued through the warning line. In practical application, the state where the pre-warning line is cut but not cut off is mainly used as the pre-warning state in this application to control the sub-board process.

When the warning line has a certain width, when the distance between the function line and the warning line is close, or when the function line and the warning line with a certain width overlap, the warning line may be cut and the function line may be cut during the sub-board cutting. The state where the trace is cut off. It can be understood from the description of the state that the pre-warning line is cut off but the functional wiring is not cut off, the electrical performance of the pre-warning circuit in the process from not being cut, to being cut but not being cut off, and then being cut off, the pre-warning line can be understood. There is a certain change law, and the state of the pre-warning line being cut can be judged by detecting the electrical performance. When the pre-warning line is cut off and the functional wiring is cut off, the circuit board veneer is classified as a waste board, and the current auxiliary splicing structure is stopped. cutting.

The above only briefly describes the different cutting states of the pre-warning line and the relationship between the detection value of the pre-warning circuit and the initial value under different cutting states, and can be understood by reference in the following specific plate-splitting method embodiments.

The present application further provides a plate separation device, and FIG. 4 is a schematic diagram of the plate separation device provided in an embodiment of the present application. FIG. 5 is another schematic diagram of the plate splitting device provided by the embodiment of the present application. The board splitting device can use the board splitting method provided by the embodiment of the present application to split the circuit board panel.

As shown in FIG. 4 , the sub-board device includes: a sub-board tool 100, a stage 200, a milling cutter 300, a main control system 400 and a monitoring module 800; wherein,

The sub-board tooling 100 is used to fix the circuit board assembly.

The stage 200 is used for carrying the sub-board tooling 100 . When the board is divided, the circuit board assembly is fixed on the board separation tool 100 , and then the board separation tool 100 is fixed on the stage 200 .

The milling cutter 300 is used to cut the auxiliary splicing structure connected to the single board of the circuit board; specifically, the work of the milling cutter 300 needs to be controlled by electrical signals. Complete the cutting action.

The monitoring module 800 is used for detecting the electrical performance of the pre-warning circuit to obtain a detection value during sub-board, and sending the detection value to the main control system 400; wherein, the pre-warning line is located in the pre-warning circuit. In one embodiment, the monitoring module 800 is electrically connected to the pre-warning line during sub-board, so as to detect the electrical performance change of the pre-warning circuit. In another embodiment, the monitoring module 800 does not need to be electrically connected to the pre-warning line during sub-board, but detects changes in optical signals, thermal signals or magnetic signals caused by changes in electrical properties of the pre-warning circuit. The specific detection method will be described in the following embodiment of the sub-plate method.

The main control system 400 includes: a judgment unit 421 and a cutting control unit 422;

The judgment unit 421 is used to receive the detection value, and judge whether the cutting state is an early warning state according to the detection value, and when it is judged to be an early warning state, send the judgment result of the early warning state to the cutting control unit 422;

The cutting control unit 422 is configured to adjust the cutting method of the auxiliary splicing structure currently cut according to the judgment result of the warning state.

In addition, the sub-board device also includes a power supply system. In some embodiments, the power supply system includes a detection power supply, and when the circuit board panel is divided, an early warning line is connected to the detection power supply to form an early warning circuit. The detection power supply may be a battery installed on the sub-board tooling, an external DC power supply, or a DC power supply connected to the sub-board tooling as a detection power supply.

When the plate splitting device is applied, one way is to fix the milling cutter 300 and move the stage 200 to realize the cutting of the auxiliary splicing structure; another way is to fix the stage 200 and move the milling cutter 300 to realize the To assist the cutting of the splice structure; another way is that both the milling cutter 300 and the stage 200 are moved. The movement mentioned in the above three methods refers to the movement in the x, y, and z directions in space.

FIG. 4 illustrates a situation where a motor 500 is provided in the plate separation device. The motor 500 is electrically connected to the main control system 400 and the milling cutter 300 respectively. The main control system 400 controls the milling cutter 300 to move through the motor 500 to realize cutting. FIG. 5 shows that the motor 500 is electrically connected to the main control system 400 and the stage 200 respectively, then the milling cutter 210 is fixed, and the main control system 400 controls the movement of the stage 200 through the motor 500 to realize cutting. The position of the milling cutter is fixed, but during the cutting process, the rotational speed of the milling cutter still needs to be controlled by the electrical signal provided by the main control system 400 .

The plate-splitting device provided in the embodiment of the present application can implement the plate-splitting method provided by the above-mentioned embodiment in FIG. 3 . While cutting the auxiliary splicing structure connected with the single board of the circuit board, the change of the electrical performance of the early warning circuit is monitored by the monitoring module in the sub-board device. The control module in the sub-panel device can judge the cutting state of the warning line according to the change of the electrical performance of the warning circuit. When it is judged that the cutting state of the warning line is the warning state, the cutting method of the auxiliary splicing structure for the current cutting is adjusted. That is, the cutting method can be adjusted in real time according to the cutting state, instead of using a fixed cutting method to cut all the auxiliary splicing structures. The present application can improve the precision of plate separation and reduce the burr of plate separation.

In the circuit board assembly provided by the embodiment of the present application, the early warning line and the functional wiring may be located on the same functional layer, or the early warning line may be arranged on a functional layer adjacent to the functional wiring. For a function line, one warning line or two warning lines can be set correspondingly. The material for making the warning line includes conductive material, which can be metal or alloy. The material for making the warning line includes any one or more of copper, gold, silver, platinum, zinc, aluminum and tin. In one embodiment, the warning line can also be set to have a certain width to meet the requirements of the detection method. The optional setting manner of the early warning line will be illustrated below with a specific embodiment.

In one embodiment, FIG. 6A is a simplified schematic diagram of a cross-section at the position of the tangent line A-A′ in FIG. 2 . As shown in FIG. 6A , only a partial circuit board veneer 10 and a partial auxiliary splicing structure 20 are simplified and illustrated. The circuit board 10 includes a first insulating layer 101 and a second insulating layer 102 , the warning wire 13 and the functional wire 11 are both located on the first insulating layer 101 , and the second insulating layer 102 covers the warning wire 13 and the functional wire 11. The early warning line 13 is located on the side of the functional wiring 11 close to the edge 12 of the shape to be cut. In this embodiment, the early warning line 13 and the functional wiring 11 are located on the same layer, and the early warning line 13 and the functional wiring 11 can be in the same process. make. The setting of the warning line does not increase the extra process, and the production is simple. When cutting the auxiliary splicing structure 20, the warning line 13 is first cut, and the functional wiring 11 may be cut after a period of time. Therefore, the cutting process can be pre-warned through the pre-warning line 13. When the pre-warning state is detected, the functional wiring 11 has not been cut, and the circuit board 10 is still intact. At this time, by adjusting the relative position of the milling cutter and the circuit board veneer 10, after moving the milling cutter to the outside of the circuit board veneer 10 for a certain distance, the auxiliary splicing structure 20 can be cut to complete the final cutting process. In this way, the warning line 13 is used to warn the cutting process, which can avoid cutting to the functional wiring 11. By adjusting the position and continuing to cut, the generation of waste boards can be avoided, high-precision board separation can be achieved, and the board separation yield can be significantly improved.

Further, in the embodiment of the present application, the distance between the early warning line 13 and the edge 12 of the shape to be cut is d1, and the distance between the function wiring 11 and the edge 12 of the shape to be cut is d2, and 0.02mm≤d2-d1≤0.5mm, that is, Set the distance between the function wiring and the warning line to meet a certain range. Continuing to refer to FIG. 6A , the distance between the functional wiring 11 and the pre-warning line 13 is Δd, 0.02 mm≤Δd≤0.5 mm. Ensure that there is a certain distance between the function wiring and the pre-warning line, and avoid the short circuit between the functional wiring and the pre-warning line from affecting the performance of the functional wiring. At the same time, it is avoided that the distance between the function trace and the warning line is too large, which will affect the size of the circuit board.

In another embodiment, FIG. 6B is a simplified schematic diagram of a cross-section at the position of the tangent line A-A′ in FIG. 2 . As shown in FIG. The insulating layer 101 , the second insulating layer 102 and the third insulating layer 103 , wherein the warning line 13 is located on the first insulating layer 101 and covered by the second insulating layer 102 , and the functional wiring 11 is located between the second insulating layer 102 and covered by the third insulating layer 103 . The distance between the warning line 13 and the edge 12 of the shape to be cut is d1, the distance between the function line 11 and the edge 12 of the shape to be cut is d2, and the distance between the function line 11 and the warning line 13 is Δd. In this embodiment, the pre-warning wire 13 and the functional wiring 11 are located on different layers, and a second insulating layer 102 is spaced between the pre-warning wire 13 and the functional wiring 11 . In another embodiment, two, three or more insulating layers are separated between the functional wiring 11 and the warning line 13, which are not shown in the drawings herein.

In an embodiment, FIG. 7 is another partial schematic diagram of the circuit board puzzle provided by the embodiment of the application, and FIG. 8A is a cross-sectional schematic diagram at the position of the tangent line B-B′ in FIG. 7 . In the embodiment of FIG. 7 , the distance between the functional wiring 11 and the edge 12 of the outline to be cut and the distance between the warning line 13 and the edge 12 of the outline to be cut are approximately the same. It is marked at the same position close to the edge 12 of the shape to be cut. As shown in FIG. 8A , the circuit board veneer 10 includes a first insulating layer 101 , a second insulating layer 102 and a third insulating layer 103 stacked in the thickness direction of the circuit board veneer 10 . The warning lines 13 are located on the first insulating layer 101 and covered by the second insulating layer 102 , and the functional traces 11 are all located on the second insulating layer 102 and covered by the third insulating layer 103 . The distance between the warning line 13 and the edge 12 of the shape to be cut is d1, and the distance between the function wiring 11 and the edge 12 of the shape to be cut is d2, and d1 and d2 are approximately equal. In this embodiment, d1 and d2 are approximately equal, that is, the distance between the warning line and the functional wiring is very close. When dividing the board, the change of the electrical performance of the early warning circuit is detected during the cutting process of the auxiliary splicing structure. According to the change of the electrical performance, it can be judged whether the cutting process has cut the warning line. When it is judged that the cutting process has cut the warning line, Because the distance between the warning line and the functional line is close, the functional line is also cut in a high probability, and the circuit board where the function line is located is defective, and the board can be judged to be a waste board and stop. The circuit board veneer is cut to avoid the waste of board separation man-hours and milling cutter head wear. In addition, after the circuit board is assembled and divided, there is no need to set up an additional manual inspection process, which can release manpower and save labor costs.

In another embodiment, FIG. 8B is another schematic cross-sectional view at the position of the tangent line B-B′ in FIG. 7 . As shown in FIG. 8B , only a partial circuit board veneer 10 and a partial auxiliary splicing structure 20 are simplified and illustrated. The circuit board veneer 10 includes a first insulating layer 101 , a second insulating layer 102 , a third insulating layer 103 and a fourth insulating layer 104 stacked in the thickness direction of the circuit board veneer 10 . The functional trace 11 is located on the second insulating layer 102 and covered by the third insulating layer 103, an early warning line 13 is located on the first insulating layer 101 and covered by the second insulating layer 102, and an early warning line 13 is located on the third insulating layer 102. above layer 103 and covered by a fourth insulating layer 104 . The difference between this embodiment and the embodiment of FIG. 8A is that, in the thickness direction of the circuit board veneer, an early warning line is respectively provided on both sides of the functional wiring 11 . Due to the influence of the production process of the circuit board assembly, there may be layer deviations between the layers of the circuit board veneer. Once a layer deviation occurs, the process of lamination and then lamination during fabrication will result in the greater the distance from the first functional layer, the greater the interlayer deviation. In this embodiment, an early warning line is respectively set on both sides of the functional trace, which can reduce the influence of layer deviation in the manufacturing process on the yield of the sub-board. Even in the case of layer deviation, it can be ensured that at least one of the two pre-warning lines is located on the side of the functional trace close to the edge of the shape to be cut, or the distance between at least one pre-warning line and the edge of the shape to be cut and the function of the edge The lines are equidistant from the edge of the shape to be cut.

The embodiments of FIG. 8A and FIG. 8B are illustrated with an insulating layer spaced between the functional wiring and the warning line. In some optional embodiments, two or more insulating layers may be spaced between the warning line and the functional wiring, which are not illustrated in the drawings herein.

In another embodiment, FIG. 9 is a partial top schematic view of the circuit board assembly provided by the embodiment of the present application. As shown in FIG. 9 , the width of the warning line 13 is D, where D≧0.02 mm. The pre-warning line is set to have a certain width, and when the milling cutter cuts to the pre-warning line during the cutting process, it can ensure that the pre-warning line is not cut off. In the process of dividing the board, when it is judged that the warning line is cut by the milling cutter but not cut off according to the detection value, it is judged as a warning state. Specifically, the pre-warning line is connected to the detection power supply to form a circuit loop as an early-warning circuit to describe the cutting and cutting process of the board, and the cutting state of the pre-warning line is judged by detecting the current change in the early-warning circuit. In the initial state, that is, before starting to cut the auxiliary splicing structure, the pre-warning line is complete, and the initial value of the electrical performance of the pre-warning circuit is the voltage value of the detection power supply divided by the total resistance of the circuit elements in the pre-warning circuit, and the initial value is I0 . When the milling cutter cuts to the pre-warning line, the pre-warning line has a certain width and is not cut off, but a part of the pre-warning line is cut off, resulting in a smaller resistance of the pre-warning line, then the total resistance in the pre-warning circuit becomes smaller, and the corresponding detection power supply voltage is constant. In the case of , the current in the early warning circuit becomes smaller, and the detection value at this time is I′, and I′<I0. That is to say, when the detected value is smaller than the initial value, it is judged that the warning line is cut by the milling cutter but not cut off, and the cutting state is judged to be the warning state.

When it is determined to be an early warning state, by adjusting the relative position of the milling cutter and the circuit board veneer, the milling cutter is moved to the outside of the circuit board veneer for a certain distance, and then the auxiliary splicing structure is continued to be cut. In the last warning process, if the warning line was not cut off, the warning line can continue to warn the cutting process in the subsequent cutting process until the final cutting process is completed. Setting the pre-warning line to have a certain width can realize early-warning during the cutting process, achieve high-precision board separation, and avoid the generation of waste boards.

Further, D≤1mm. Avoid the width of the warning line is too large, resulting in a waste of space and affecting the size of the circuit board.

In one embodiment, FIG. 10 is another partial top schematic view of the circuit board assembly provided by the embodiment of the present application. As shown in FIG. 10 , the circuit board 10 includes an early warning port 17 , and two ends of the early warning line 13 are respectively connected to an early warning port 17 . When the circuit board is divided into boards, the early warning line 13 can be electrically connected to the detection power supply through the early warning port 17 . One early warning port 17 is connected to the positive pole of the detection power supply, and the other early warning port 17 is connected to the negative pole of the detection power supply, thereby forming a conductive loop, which can be used as an early warning circuit. In the process of plate separation, the cutting process can be pre-warned according to the change of the electrical performance of the conductive loop. The specific implementation will be described in the following embodiments of the plate separation method.

In another embodiment, FIG. 11 is another partial top schematic view of the circuit board panel provided by the embodiment of the present application. As shown in FIG. 11 , the circuit board 10 includes an early warning port 17 , and one end of the early warning line 13 is connected to an early warning port 17 . When splitting the circuit board, the warning port 17 and the milling cutter can be respectively connected to the two poles of the detection power supply, for example, the warning port 17 is connected to the positive pole of the detection power supply, and the milling cutter is charged to the negative pole of the detection power supply. When a single circuit board includes a plurality of early warning ports 17 and a plurality of early warning lines 13 corresponding to them, the plurality of early warning ports 17 are all connected to one pole (such as the positive pole) of the detection power supply when the board is divided. In order to realize the early warning in the process of sub-board cutting. The pre-warning line, the milling cutter and the detection circuit in the sub-board method to which this embodiment can be applied together constitute an early-warning circuit. In the initial state, the pre-warning line 13 is an open circuit, and when the milling cutter touches the pre-warning line 13, a conductive loop is formed. In the process of dividing the plate, the cutting process can be pre-warned according to the change of the electric performance of the pre-warning line. The specific implementation will be described in the following embodiment of the dividing method.

Wherein, the early warning port includes a power supply plate exposed on the outer layer of the single board of the circuit board. During detection, it is electrically connected to the power supply plate through a power supply pin, so that the early warning line is connected to the detection power supply. As shown in FIG. 12, FIG. 12 is a schematic cross-sectional view at the position of the tangent line C-C' in FIG. 10, which shows the power supply pad 18 exposed on the outer layer of the circuit board 10, and the power supply pad 18 is connected through the micro-holes 19 between the layers. to the conductive traces 133 in the circuit board veneer 10 . Continuing to refer to the illustration in FIG. 10 , the extension direction of the pre-warning line 13 and the edge 12 of the shape to be cut is approximately the same, the pre-warning line 13 extends in the second direction x, the conductive trace 133 extends in the third direction y, and the third direction y Cross the second direction x. The conductive trace 133 is connected to the early warning wire 13, so that the early warning wire 13 is connected to the power supply board 18 through the conductive trace 133, thereby realizing the connection of the early warning line 13 to the detection power supply through the power supply board 18 during sub-board. Wherein, the pre-warning wire 13 and the conductive trace 133 may be located between two adjacent insulating layers at the same time, and the pre-warning wire 13 and the conductive trace 133 are directly connected to each other. In another embodiment, an insulating layer is spaced between the warning wire 13 and the conductive wire 133, and the warning wire 13 and the conductive wire 133 are connected through a via hole on the insulating layer, which is not shown in the drawings.

In another embodiment, FIG. 13 is another partial top schematic view of the circuit board panel provided by the embodiment of the present application. As shown in FIG. 13 , the warning line 13 is an inductance coil. When the circuit board is divided, the inductive coil is connected to the detection power supply to form a conductive loop. When the milling cutter cuts off the inductive coil, the conductive loop becomes an open circuit, which can realize the early warning of the cutting process.

In an embodiment, FIG. 14 is a partial top schematic view of the circuit board assembly provided by the embodiment of the present application. As shown in FIG. 14 , the extension direction of the outline edge 12 to be cut is the first direction e, wherein the outline edge 12 to be cut is equivalent to the virtual boundary between the auxiliary splicing structure 20 and the circuit board veneer 10 , then the outline edge to be cut The length of 12 is the length of the connecting part between the auxiliary splicing structure 20 and the circuit board veneer 10. The figure shows that the length of the outline edge 12 to be cut is L1, and the length of the functional wiring 11 in the first direction e is L2, L2≥ L1; Fig. 14 illustrates the case where L2 is greater than L1. That is to say, according to the design of the circuit structure in the circuit board, in some embodiments, the length of the functional trace 11 that is closer to the edge 12 of the outline to be cut is longer than the length of the edge 12 of the outline to be cut; in other embodiments , the length of the functional wiring 11 that is closer to the edge 12 of the shape to be cut is equal to the length of the edge 12 of the shape to be cut. In the embodiment of the present invention, when L2≥L1, the length of the warning line 13 in the first direction e is set to be L3, and L3>L1. That is, the length of the pre-warning line 13 is set greater than the length of the outline edge 12 to be cut, so that the pre-warning line 13 can perform a cutting pre-warning when cutting the auxiliary imposition structure 20 along the outline edge 12 to be cut. Optional, L3>L1+0.5mm.

In another embodiment, FIG. 15 is another partial top schematic view of the circuit board panel provided by the embodiment of the present application. As shown in FIG. 15 , the extension direction of the outline edge 12 to be cut is the first direction e, the length of the outline edge 12 to be cut is L1, and the length of the functional wiring 11 in the first direction e is L2, L2<L1; wherein, The length of the warning line 13 in the first direction e is L3, L3>L2. In this embodiment, when the length of the functional wiring 11 is less than the length of the outline edge 12 to be cut, the length of the warning line 13 is set to be greater than the length of the functional wiring 11, that is, the auxiliary imposition structure 20 can be aligned along the outline edge 12 to be cut. A cutting warning is given when cutting is performed. Optional, L3>L2+0.5mm.

In another embodiment, the circuit board veneer further includes connecting wires, and the warning wires and the connecting wires are connected end to end in sequence to form a closed wiring. An induction circuit and a monitoring module are arranged outside the circuit board panel. When the circuit board is divided into panels, after the induction circuit is energized, an induced current can be generated on the closed early warning line, and the monitoring module can not be connected with the closed early warning line. By setting the sensing module in the monitoring module, the sensing module can The change of the induction current on the induction warning line generates a corresponding induction signal, wherein the induction signal can be an optical signal, a thermal signal or a magnetic signal. Then, the cutting state of the warning line can be judged by detecting the change of the induction signal. When the board is divided in this way, the monitoring module does not need to be electrically connected to the pre-warning line, and the pre-warning line does not need to be connected to the power supply, which can ensure the safety of the circuit board.

The above-mentioned embodiments describe the structure of the circuit board assembly provided by the present application. The following will take a specific assembly structure as an example to describe the plate splitting method and the plate splitting device provided by the embodiments of the present application. FIG. 16 is another flowchart of the method for splitting a board provided by an embodiment of the present application. The method for splitting a board provided in the embodiment of FIG. 16 can split the circuit board panel provided by any of the above embodiments. As shown in Figure 16, the sub-board method includes:

Step S201 : cutting an auxiliary splicing structure 20 connected to the circuit board veneer 10 , and simultaneously detecting the electrical performance of the early warning circuit to obtain a detection value, wherein the early warning line 13 is located in the early warning circuit.

Step S202: Compare the detection value with the calibration value, and when the detection value is different from the calibration value, determine that the cutting state is an early warning state, and the calibration value is a detection threshold for judging whether it is an early warning state.

The calibration value may be an initial value obtained by detecting the electrical performance of the early warning circuit before cutting the auxiliary splicing structure. In some embodiments, the pre-warning wire is energized to form a conductive loop before cutting, and the conductive loop is used as the pre-warning circuit, then in the cutting of the auxiliary splicing structure, when the milling cutter cuts the pre-warning line and when the milling cutter does not cut the pre-warning line, The electrical properties of the conductive loops are different. Specifically, when the early warning circuit is a conductive loop, the current in the early warning circuit is detected as an example of electrical performance detection. In the initial state, the early warning circuit is a loop, and there is a certain current value in the early warning circuit, and the initial current value is used as the calibration. value. When the milling cutter does not cut to the pre-warning line, the current in the pre-warning circuit is basically unchanged, and the detection value of the current is equal to the initial current value, that is, the detection value is equal to the calibration value. The cutting method cuts the auxiliary splicing structure. When the milling cutter cuts to the warning line, when the warning line is a narrow line, the milling cutter easily cuts the warning line, the warning circuit changes from a loop to an open circuit, and the current value is 0, then the detection value of the current is 0, when the detected value is different from the calibration value, it is judged as an early warning state. When the pre-warning line is a line with a certain width, when the milling cutter cuts to the pre-warning line, the pre-warning line is cut but not cut off, but after the pre-warning line is cut, the current in the pre-warning circuit will increase, and the detection value will be greater than the calibration value, that is to say, when the detection value is greater than the calibration value, it is judged that the cutting state is an early warning state, and in the early warning state, the warning line is cut but not cut off.

The monitoring and early warning of the sub-board process are realized through the cooperation of the sub-board method and the early warning circuit. Corresponding to different sub-board methods, the setting method of the warning circuit may be different, and the corresponding calibration value is different, then when the warning occurs, the cutting state of the warning line will also be different.

Step S203 : when it is determined to be an early warning state, adjust the cutting method of the auxiliary splicing structure 20 currently being cut.

In addition, in the process of cutting the auxiliary splicing structure, when the pre-warning line is not cut or the milling cutter is far away from the pre-warning line and the pre-warning line is temporarily safe, the change value obtained by the corresponding detected detection value will be different from that of the pre-warning line. When comparing the warning thresholds, a non-warning state will be judged. In a non-warning state, there is no need to adjust the cutting method of the currently cut auxiliary splicing structure.

In this embodiment of the present application, an early warning circuit is set in a single board of a circuit board, and when the above steps S201 to S203 are used to split the circuit board, the cutting state of the warning line is judged according to the change of the electrical performance of the early warning circuit during the splitting process. , when the cutting state of the warning line is the warning state, adjust the cutting method of the auxiliary splicing structure of the current cutting. That is to say, the present application can adjust the cutting method in real time according to the cutting state, instead of using a fixed cutting method to cut all the auxiliary splicing structures. The present application can improve the precision of plate separation and reduce the burr of plate separation.

FIG. 17 is a block diagram of a main control system in a sub-board apparatus further provided by an embodiment of the present invention. As shown in FIG. 17 , the main control system 400 includes a judgment unit 421 and a cutting control unit 422 . In this sub-board device, the monitoring module is used to electrically connect with the pre-warning circuit during sub-board, and when cutting an auxiliary splicing structure 20 connected to the circuit board veneer 10, the electrical performance of the pre-warning circuit is detected to obtain a detection value, The detection value is sent to the main control system 400 .

Among them, the judgment unit 421 is used to receive the detection value, compare the detection value with the calibration value, the calibration value is the detection threshold value of whether it is an early warning state when judging, and when the detection value is different from the calibration value, it is judged whether the cutting state is an early warning state, when When it is determined to be an early warning state, the judgment result of the early warning state is sent to the cutting control unit 422 . The cutting control unit 422 is configured to adjust the cutting method of the auxiliary splicing structure currently cut according to the judgment result of the warning state.

The board separation device provided in the embodiment of FIG. 17 can use the board separation method provided in the embodiment of FIG. 16 to perform board separation on the circuit board puzzle.

In some embodiments, when cutting the auxiliary splicing structure connected to the circuit board veneer, the electrical performance change of the early warning circuit is detected at the same time; when it is detected that the cutting state of the early warning line is that the early warning line is cut off, it is determined to be an early warning state ; When the warning line is cut off, control the milling cutter to stop cutting the auxiliary splicing structure currently being cut.

FIG. 18 is another flowchart of the method for splitting a board provided by an embodiment of the application. As shown in FIG. 18 , the method for splitting a board includes:

Step S301 : cutting an auxiliary splicing structure 20 connected to the circuit board veneer 10 , and simultaneously detecting the electrical performance of the early warning circuit to obtain a detection value, and the early warning line 13 is located in the early warning circuit.

Step S302: Determine whether the cutting state is an early warning state according to the detection value. When it is judged that the warning line 13 is cut off, it is judged that the cutting state is an early warning state. Specifically, when the detected value is different from the calibration value, it is determined that the pre-warning line 13 is cut off, and the pre-warning state is determined.

Step S303 : when the warning line 13 is cut, the milling cutter is controlled to stop cutting the auxiliary splicing structure 20 currently being cut.

The method of dividing the board can be suitable for dividing the circuit board panel with little difference between d1 and d2 in the single board of the circuit board. Because the distance between the warning line and the functional wiring is relatively short, when it is judged that the cutting process cuts to the warning line, the functional wiring is also cut with a high probability, and the circuit board where the functional wiring is located is defective. The veneer is a waste board, and the cutting of the veneer of the circuit board is stopped, so as to avoid waste of man-hours for dividing the board and wear of the milling cutter. In addition, the cutting waste board can be accurately detected during the cutting process, which ensures the detection accuracy. There is no need for additional manual inspection in the follow-up, which frees up manpower and saves labor costs.

In one embodiment, before step S301 cuts an auxiliary splicing structure connected to the single board of the circuit board, the method for splitting the board further includes: connecting the two ends of the pre-warning line to the positive and negative electrodes of the detection power supply, respectively, to form a conductive circuit, the circuit where the pre-warning line and the detection power supply are located is the pre-warning circuit. Specifically, the initial value obtained by detecting the initial electrical performance in the early warning circuit may be used as the calibration value. For example, before starting to cut, the initial current value I ₀ in the early warning circuit is detected as the calibration value, and the early warning circuit where the early warning line is located before the cutting starts is a channel. Once the pre-warning line is cut off by the milling cutter in the process of dividing the board, the pre-warning circuit will be changed from a circuit to an open circuit, and the current on the pre-warning line will be 0. When the detected current value is different from the initial value, it can be judged that the pre-warning line is cut off and a cutting pre-warning will be performed. . Optionally, it is also possible to detect the initial resistance value in the early warning circuit as the calibration value before starting cutting. Once the early warning line is cut off by the milling cutter in the process of dividing the board, the early warning circuit will change from the circuit to the open circuit, and it will be detected that the resistance value changes. for infinity. It can also be judged whether the warning line is cut off during the cutting process by detecting the change of the resistance.

In another embodiment, before the step S301 cuts an auxiliary splicing structure connected to the single board of the circuit board, the method for dividing the board further includes: controlling the milling cutter to be electrified, and electrically connecting one of the milling cutter and the pre-warning line to the circuit board. If the positive pole of the detection power supply is electrically connected to the negative pole of the detection power supply, the milling cutter, the warning line, and the circuit where the detection power supply is located are the warning circuit. Take the milling cutter connected to the positive pole of the detection power supply and the warning line connected to the negative pole of the detection power supply as an example, the milling cutter is charged before starting to cut. Before starting to cut, the milling cutter, the warning line, and the warning circuit where the power supply is detected are open, and there is no current in the warning circuit. Then, when performing current detection, the initial current value is 0, that is, the calibration value is 0. During the cutting process, when the milling cutter touches the pre-warning line, the pre-warning circuit changes from an open circuit to a passage, and there is a certain current value in the pre-warning circuit. When the change of the current value is detected, it can be judged that the milling cutter has cut the warning line, and the cutting state of the warning line can be judged correspondingly as the warning state. Furthermore, according to the warning state, the milling cutter is controlled to stop cutting the auxiliary splicing structure currently being cut.

In another embodiment, the early warning line is an inductive coil. Before cutting an auxiliary splicing structure connected to the single board of the circuit board in step S301, the method for splitting the board further includes: connecting the two ends of the inductance coil to the positive pole and the negative pole of the detection power supply respectively to form a conductive loop, then the warning line and the detection The circuit where the power supply is located is an early warning circuit. The pre-warning circuit where the pre-warning line is located before the cutting is started is the passage, and once the pre-warning wire is cut off by the milling cutter during the sub-board process, the pre-warning circuit will change from the passage to the open circuit. By detecting the current, resistance or voltage in the pre-warning circuit, it can be determined whether the pre-warning wire is cut off, and then it can be judged whether the cutting state of the pre-warning wire is in the pre-warning state.

In another embodiment, an induction circuit is provided outside the circuit board panel, wherein, after the induction circuit is energized, an induction current can be generated on the pre-warning line. Before cutting an auxiliary splicing structure connected to the single board of the circuit board in step S301, the method for dividing a board further includes: energizing the induction circuit outside the splicing of the circuit board, and the pre-warning line is not connected to the power supply. After the external induction circuit is energized before starting cutting, an induced current will be generated on the warning line, then the current on the warning line will be detected, and a certain current value can be detected. After the induction circuit is energized, the current on the warning line will be detected. The initial current value obtained from the value is used as the calibration value. During the cutting process, if the milling cutter cuts off the warning line, a current loop cannot be formed, and the current on the warning line is zero. By detecting the change of the current on the warning wire, it can be judged whether the warning wire is cut off, and then it can be judged whether the cutting state of the warning wire is the warning status. In this embodiment, the warning line does not need to be connected to the power supply during cutting, which can ensure the safety of the circuit board.

In another embodiment, the circuit board veneer further includes connecting wires, and the warning wires and the connecting wires are connected end to end in sequence to form a closed wiring. An induction circuit is arranged outside the circuit board panel, wherein, after the induction circuit is energized, an induction current can be generated on the warning line. An induction module is arranged in the monitoring module, and the induction module can generate a corresponding induction signal according to the induction current on the early warning line, wherein the induction signal is any one of an optical signal, an electrical signal or a magnetic signal. After the external induction circuit is energized before starting to cut, an induction current will be generated on the warning line, and the induction module will generate a corresponding induction signal. During the cutting process, if the milling cutter cuts off the pre-warning line, the pre-warning line cannot form a current loop, and the current on the pre-warning line is zero. The sensing signal generated by the corresponding sensing module will also change. Through the change of the sensing signal, it can be judged whether the warning line is cut off, and then it can be judged whether the cutting state of the warning line is the warning state. In this embodiment, the pre-warning wire does not need to be connected to the power supply during cutting, nor does the monitoring module need to be connected to the pre-warning wire, which can ensure the safety of the circuit board. It should be noted that, in this embodiment, after the induction circuit provided outside the circuit board is energized, the induction module in the monitoring module may also generate a corresponding induction signal, that is, the magnetic field generated by the induction circuit and the magnetic field generated by the warning line. It will affect the induction module at the same time. In practice, the detection signal can be calculated and processed through the change law of the multi-field coupling signal, and the change of the power-on performance of the early warning line can be finally judged.

Further, in the sub-board device provided by the embodiment of the present application, on the basis of the main control system provided by the above-mentioned embodiment of FIG. 17 , the judgment unit 421 is also used for, when the detected value is different from the calibration value, the pre-warning line is The cutting state of cutting is judged as an early warning state; the cutting control unit 422 is further configured to control the milling cutter to stop cutting the auxiliary splicing structure currently cut when the warning line is cut off. Specifically, an alarm is also provided in the de-paneling device. When it is judged to be an early warning state, the milling cutter is controlled to stop rotating, and at the same time, the milling cutter or the de-panel tool is controlled to move to the initial position, and the de-panel action is stopped. The alarm sounded an alarm, and the veneer has been cut to the warning line.

In the following, the method for dividing the board further includes: connecting the two ends of the pre-warning line to the positive and negative poles of the detection power supply respectively to form a conductive loop, and the circuit where the pre-warning line and the detection power supply are located is an early-warning circuit as an example. The working process is explained. The following working process takes the judgment of the cutting state of the pre-warning wire by detecting the change of the current on the pre-warning wire as an example.

FIG. 19 is a circuit diagram of a sub-board device and an early warning circuit in a sub-board process, and FIG. 20 is a working flowchart of the sub-board device provided by the embodiment of the application. Reference is made to FIGS. 19 and 20 simultaneously for understanding. Before starting to cut, the control end of the milling cutter 300 is energized, the pre-warning line 13 is connected to the detection power supply 600, and the pre-warning line 13 is energized to form an early-warning circuit, and the detection power supply is turned on. The monitoring module 800 is connected to the early warning circuit, and realizes the detection of the electrical performance of the early warning circuit. By detecting the current on the pre-warning line 13, it is judged whether the pre-warning circuit is turned on. When a certain current value is detected on the pre-warning line 13, it is judged that the pre-warning circuit is in a conductive state, and the milling cutter 300 cuts the auxiliary splicing structure; When the circuit is in a non-conducting state, the cutting is stopped. When the milling cutter cuts the auxiliary splicing structure, the monitoring module 800 simultaneously detects the current on the pre-warning circuit to determine whether the pre-warning circuit is open. The specific monitoring module 800 detects the current on the pre-warning circuit to obtain the detection value, and then sends the detection value to the judgment unit 421 for judgment. When the judgment unit 421 judges that the cutting state of the pre-warning line is the pre-warning state according to the detection value, the pre-warning circuit is open circuit , and then perform a cutting warning to stop the cutting of the current auxiliary splicing structure. When the milling cutter cuts the auxiliary splicing structure, the monitoring module 800 simultaneously detects the current on the early warning circuit and judges that the early warning circuit is turned on, then the milling cutter continues to cut the auxiliary splicing structure until along the extension direction of the edge of the shape to be cut The auxiliary splicing structure is completely cut off to form the final outline edge of the circuit board veneer.

When the board separation device provided by the embodiment of the present invention is used to perform board separation, it can be quickly and accurately judged whether the warning line is cut through an electrical signal. When it is judged that the cutting is to the warning line, the sub-board device can automatically stop the sub-board to avoid the waste of sub-board man-hours and the waste of milling cutters. The plate separation device can automatically identify the waste plates generated by cutting, and has high accuracy in identifying the waste plates, and no additional manual detection process is required in the follow-up, which can release manpower and save labor costs.

In some embodiments, when it is determined to be an early warning state, the cutting position is adjusted to continue cutting the currently cut auxiliary splicing structure. FIG. 21 is another flow chart of the board splitting method provided by the embodiment of the present application. The board splitting method provided by the embodiment of FIG. 21 can split the circuit board panel provided by the embodiment of FIG. 9 . The pre-warning line set in the circuit board has a certain width. Optionally, the width of the pre-warning line is D, and D ≥ 0.02 mm. As shown in Figure 21, the sub-board method includes:

Step S401 : cutting an auxiliary splicing structure 20 connected to the circuit board veneer 10 , and simultaneously detecting the electrical performance of the early warning circuit to obtain a detection value, and the early warning line 13 is located in the early warning circuit.

Step S402: Determine whether the cutting state is an early warning state according to the detected value. When it is detected that the warning line 13 is cut by the milling cutter but not cut, it is judged to be an early warning state. Specifically, the detection value is compared with the calibration value; when the detection value is different from the calibration value, it is judged that the warning line 13 is cut by the milling cutter but not cut, and it is judged as a warning state.

Step S403 : when the warning line 13 is cut by the milling cutter but not cut, adjust the cutting position, and then continue to cut the currently cut auxiliary splicing structure 20 .

The pre-warning line is set to have a certain width, and when the milling cutter cuts to the pre-warning line during the cutting process, it can ensure that the pre-warning line is not cut off. In the process of dividing the board, when it is judged that the warning line is cut by the milling cutter but not cut off according to the detection value, it is judged as a warning state. When it is determined to be an early warning state, by adjusting the relative position of the milling cutter and the circuit board veneer, the milling cutter is moved to the outside of the circuit board veneer for a certain distance, and then the auxiliary splicing structure is continued to be cut. In the last warning process, if the warning line was not cut off, the warning line can continue to warn the cutting process in the subsequent cutting process until the final cutting process is completed. Setting the pre-warning line to have a certain width can realize early-warning during the cutting process and ensure that the sub-board cutting will not cut the functional wiring. The high-precision board separation can be realized, the generation of waste boards can be avoided, and the production cost can be saved.

Wherein, in step S403, adjusting the cutting position may be manually adjusting the cutting position when it is determined to be an early warning state. For example, manually move the milling cutter to the outside of the circuit board by a certain distance, so that the distance between the milling cutter and the warning line becomes larger. In another way, the system can control the milling cutter to move a certain distance to the outside of the circuit board veneer. This way needs to edit the corresponding control logic in the main control system of the sub-board device to realize.

Further, the plate-splitting device provided by the embodiment of the present application can use the plate-splitting method provided in the embodiment of FIG. 21 to perform the plate-splitting. On the basis of the main control system provided by the above-mentioned embodiment of FIG. 17, the plate separating device has a judging unit 421, which is also used for judging the cutting state that the warning line is cut by the milling cutter but not cut when the detected value is different from the calibration value. It is an early warning state; the cutting control unit 422 is also used for controlling to continue cutting the currently cutting auxiliary splicing structure after adjusting the cutting position when the warning line is cut by the milling cutter but not cut.

Further, different forms of pre-warning circuits can be used to cooperate with the plate-splitting method provided in the above-mentioned embodiment of FIG. 21 to realize the pre-warning state when the pre-warning line is cut by the milling cutter but not cut off.

Specifically, in an embodiment, FIG. 22 is another flow chart of the method for dividing a board provided by the embodiment of the application. As shown in FIG. 22 , the method for dividing a board includes:

Step S501 : control the milling cutter to be electrified, and electrically connect one of the milling cutter and the pre-warning line to the positive pole of the detection power supply, and the other to the negative pole of the detection power supply, and the circuit where the milling cutter, the pre-warning line and the detection power supply are located is the pre-warning circuit .

Step S502: Before cutting the auxiliary splicing structure, obtain an initial value according to the electrical performance of the early warning circuit.

Step S503 : cutting an auxiliary splicing structure connected to the single board of the circuit board, and simultaneously detecting the electrical performance of the early warning circuit to obtain a detection value.

Step S504: Compare the detection value with the calibration value, wherein the initial value is used as the calibration value; when the detection value is different from the calibration value, it is judged as an early warning state, in which the warning line is cut by the milling cutter but not cut off.

Step S505 : when the warning line is cut by the milling cutter but not cut off, adjust the cutting position, and then continue to cut the auxiliary splicing structure currently being cut.

The depaneling method provided in the embodiment of FIG. 22 can depanel the circuit board panel provided in the embodiment of FIG. 9, and the pre-warning line is set to have a certain width, which can ensure that the pre-warning line is cut by the milling cutter but not by the pre-warning line during the cutting process. cut off. Connect the milling cutter to the negative pole of the detection power supply and the warning line to the positive pole of the detection power supply, then the circuit where the milling cutter, the warning line and the detection power supply are located is an early warning circuit. In the initial state (that is, before starting to cut), the milling cutter If there is no contact with the pre-warning line, the pre-warning circuit is open. In the process of cutting the auxiliary splicing structure, when the milling cutter is cutting, the state of the early warning circuit is detected at the same time. When it is detected that the early warning circuit is a passage, it is judged that the milling cutter cuts to the warning line, which is an early warning state. Since the pre-warning line has a certain width, the pre-warning line is cut by the milling cutter but not cut off, and the functional wiring in the circuit board is also intact at this time. After judging the warning state, adjust the relative position of the milling cutter and the circuit board, and move the milling cutter to the outside of the circuit board by a certain distance. After moving the position, the milling cutter does not contact the warning line, and the warning circuit is re-connected from the circuit. becomes open circuit. Then continue to cut the current auxiliary splicing structure, and at the same time continue to detect the state of the early warning circuit. When it is detected that the early warning circuit is a channel again, the above process is repeated, and the current auxiliary splicing structure is continued to be cut after the position is adjusted. When the detection and warning circuit is open during cutting, cut at the current cutting speed until the auxiliary splicing structure is completely cut off along the extending direction of the contour edge to be cut, forming the final contour edge of the circuit board. By adopting the above-mentioned plate separation method, high-precision plate separation can be realized, and generation of waste plates can be avoided, thereby saving production costs.

Optionally, by detecting the current of the pre-warning circuit, it is determined whether the pre-warning circuit is open or open. In the initial state, if the pre-warning circuit is open, the initial current value is 0, that is, the calibration value is 0. When the milling cutter cuts to the pre-warning line, the pre-warning circuit is a channel, and the current value in the pre-warning circuit is non-zero, and the detection value is a certain current value. When the position is adjusted and the milling cutter does not contact the warning line, the warning circuit becomes open circuit again. When the warning circuit is open, the detection value is equal to the calibration value.

Further, the plate-splitting device provided by the embodiment of the present application can use the plate-splitting method provided in the above-mentioned embodiment of FIG. 22 to conduct the plate-splitting. On the basis of the main control system provided by the above-mentioned embodiment of FIG. 17 , the sub-board device, the monitoring module 800, is also used to detect the electrical performance of the early warning circuit to obtain the initial value before cutting the auxiliary splicing structure, and send the initial value to the board. Judging unit 421 . The judging unit is further configured to use the initial value as the calibration value when judging whether it is in an early warning state. When the detected value is different from the calibration value, the cutting state in which the warning line is cut by the milling cutter but not cut off is judged as the warning state. The cutting control unit 422 is further configured to control to continue cutting the currently cut auxiliary splicing structure after adjusting the cutting position when the warning line is cut by the milling cutter but not cut.

FIG. 23 is another circuit diagram of the sub-board device and the early warning circuit in the sub-board process. In FIG. 23, it is shown that the warning line 13 has a certain width. FIG. 24 is another working flow chart of the board separation device provided by the embodiment of the present application. The embodiments in FIGS. 23 and 24 use the method for dividing a board provided in the embodiment in FIG. 22 to perform board separation.

23 and 24 at the same time, before starting to cut, the control milling cutter 300 is charged, the milling cutter 300 is connected to the negative pole of the detection power supply 600, the warning line 13 is connected to the positive pole of the detection power supply 600, the milling cutter 300, the warning line 13. The circuit where the detection power supply 600 is located is an early warning circuit. The monitoring module 800 is connected to the early warning circuit, and realizes the detection of the electrical performance of the early warning circuit. The control end of the milling cutter 300 is powered on, and the detection power is turned on. In the initial state, it is detected whether the pre-warning circuit is open, and whether it is open is determined by detecting the current on the pre-warning line. When the pre-warning circuit is open, it means that the milling cutter is not in contact with the pre-warning line 13, and the auxiliary splicing structure can be cut. When it is not detected that the pre-warning circuit is open, it returns to the stage of detecting that the power is turned on.

When the milling cutter 300 cuts the auxiliary splicing structure, the monitoring module 800 simultaneously detects the current on the pre-warning circuit to determine whether the pre-warning circuit is a channel. The specific monitoring module 800 detects the current on the early warning circuit to obtain a detection value, and then sends the detection value to the judgment unit 421 for judgment. Wherein, when the milling cutter 300 does not cut the pre-warning line 13, the determination unit 421 determines that the detection value is the same as the initial value, and the pre-warning circuit is still open, then the milling cutter 300 continues to cut the auxiliary splicing structure.

When the milling cutter 300 cuts to the pre-warning line 13, the pre-warning circuit forms a passage. At this time, the judgment unit 421 judges that the detected value is different from the initial value, and judges that the cutting state is an early warning state. The cutting control unit 422 controls and adjusts the cutting position according to the judgment result of the warning state, for example, controls the milling cutter 300 to move a certain distance to the outside of the circuit board veneer. Then, the cutting control unit 422 controls the milling cutter 300 to continue cutting the current auxiliary splice structure.

When the milling cutter 300 moves to the outside of the circuit board for a certain distance, the pre-warning circuit is changed from a passage to an open circuit again. During the process of the milling cutter 300 continuing to cut the auxiliary splicing structure, the monitoring module 800 simultaneously detects the current value on the pre-warning circuit. , the judging unit continues to follow up the detection value to judge whether the early warning circuit is a channel. In the process of cutting the auxiliary splicing structure by the milling cutter, the above judgment process is repeated until the auxiliary splicing structure is completely cut off along the extending direction of the outline edge to be cut to form the final outline edge of the circuit board veneer.

FIG. 25 is a schematic diagram of a cutting trajectory of a milling cutter in the process of splitting cutting. After two pre-warning states in the split-board cutting shown in FIG. 25 , the cutting position is adjusted to continue cutting the auxiliary splicing structure after it is judged to be an early-warning state, until the split-board cutting is completed.

Specifically, in another embodiment, FIG. 26 is another flowchart of the method for dividing a board provided by the embodiment of the present application. As shown in FIG. 26 , the method for dividing a board includes:

Step S601: Connect the two ends of the pre-warning line to the positive pole and the negative pole of the detection power supply respectively, and the circuit where the pre-warning line and the detection power supply are located is an early-warning circuit.

Step S602: Before cutting the auxiliary splicing structure, obtain an initial value according to the electrical performance of the early warning circuit.

Step S603 : cutting an auxiliary splicing structure connected to the single board of the circuit board, and simultaneously detecting the electrical performance of the early warning circuit to obtain a detection value.

Step S604: Compare the detected value with the calibration value to determine whether the cutting state is an early warning state. In the early warning state, the warning line is cut by the milling cutter but not cut off; wherein, when judging whether it is an early warning state for the first time, use The initial value is used as the calibration value; in the subsequent judgment of whether it is an early warning state, the process value is used as the calibration value, and the process value is the detection value used when the cutting state was judged to be an early warning state last time.

Step S605 : when the warning line is cut by the milling cutter but not cut, adjust the cutting position, and then continue to cut the auxiliary splicing structure currently cut.

The depaneling method provided in the embodiment of FIG. 26 can depanel the circuit board panel provided in the embodiment of FIG. 9 , and the pre-warning line is set to have a certain width, which can ensure that the pre-warning line is cut by the milling cutter but not by the pre-warning line during the cutting process. cut off. Connect the two ends of the pre-warning line to the negative and positive poles of the detection power supply respectively, then the circuit where the pre-warning line and the detection power supply are located is an early-warning circuit. The electrical properties in the pre-warning circuit, such as current, voltage and resistance, are related to the cutting state of the pre-warning wire. When the detection power source is a constant voltage source, in the initial state, the electrical properties of the current, voltage and resistance in the early warning circuit all have initial values.

Take the detection of the current value to judge the warning state as an example. When the milling cutter does not cut to the warning line, the warning line is intact, and the detection value of the current is the same as the initial value, which is a non-warning state. After the milling cutter cuts the warning line, a part of the warning line is cut off, and the resistance on the warning line becomes smaller. In the process of sub-board cutting auxiliary splicing structure, when the milling cutter cuts to the warning line for many times (such as two, three or more times), each time the warning line is cut, the resistance on the warning line changes once. Taking the current value of a certain magnitude in the early warning circuit in the initial state as an example, record the initial value as I0. When the milling cutter cuts to the warning line for the first time, because the warning line is cut off by the milling cutter, the resistance on the warning line will be reduced. becomes smaller, the current in the corresponding pre-warning circuit increases, that is to say, when the detection value I1 is greater than the initial value I0, it is judged that the pre-warning line is cut, and the relative position of the milling cutter and the circuit board is adjusted at this time, and then continue Cut the current auxiliary panel structure. At this time, the milling cutter has not touched the warning line. When the current value in the warning circuit is detected in real time, the detected value is still I1. Assuming that the detected value is still compared with the initial value, the judgment result is still that the detected value I1 is greater than The initial value is I0, which will be misjudged as an early warning state. However, if in the subsequent judgment, the detection value I1 when it is judged as the warning state for the first time is used as the calibration value, when the milling cutter does not touch the warning line, when the current value in the warning circuit is detected in real time, the detection value is still If it is I1, it will judge that the detected value is equal to the calibration value, and it will be judged as a non-warning state. Thus, misjudgment can be avoided, and high-precision sub-board can be realized.

When judging whether it is an early warning state for the first time, the initial value of the current is used as the calibration value. At this time, the detection value of the current is different from the calibration value, and it is judged as an early warning state. After it is judged as an early warning state for the first time, the relative position is adjusted to continue cutting the current auxiliary splicing structure. Then, when judging whether it is an early warning state next time, the detection value used for the first judging to be an early warning state is used as the calibration value. If the result of the next judgment is a non-warning state, the detection value used when the previous successful judgment is an early warning state is still used as the calibration value. That is to say, every time the warning line is cut once, a part of the warning line will be cut off, and the resistance size of the warning line will change once. When judging whether the warning state is the next time, the detection value detected when the warning line was cut by the milling cutter last time is used as the calibration value. By adopting the above-mentioned plate separation method, high-precision plate separation can be realized, and generation of waste plates can be avoided, thereby saving production costs.

Further, the plate-splitting device provided by the embodiment of the present application can use the plate-splitting method provided in the embodiment of FIG. 26 to perform the plate-splitting. On the basis of the main control system provided by the above-mentioned embodiment of FIG. 17 , the sub-board device, the monitoring module 800, is also used to detect the electrical performance of the early warning circuit to obtain the initial value before cutting the auxiliary splicing structure, and send the initial value to the board. Judging unit 421 . The judging unit 421 is further configured to judge the cutting state in which the warning line is cut by the milling cutter but not cut as the warning state when the detected value is different from the calibration value. Among them, when judging whether it is an early warning state for the first time, the initial value is used as the calibration value; in the subsequent judgment whether it is an early warning state, the process value is used as the calibration value, and the process value is used to judge the cutting state of the warning line as an early warning last time. The detection value to be used when the state is used. The cutting control unit 422 is also used for controlling to continue cutting the currently cut auxiliary splicing structure after adjusting the cutting position when the warning line is cut by the milling cutter but not cut.

FIG. 27 is another circuit diagram of the sub-board device and the early warning circuit in the sub-board process. In FIG. 27, it is shown that the warning line 13 has a certain width. FIG. 28 is another working flow chart of the board separation device provided by the embodiment of the present application. The embodiments in FIGS. 27 and 28 use the method for dividing the board provided in the embodiment in FIG. 26 to perform board separation.

27 and 28 at the same time, before starting the cutting, the two ends of the pre-warning line 13 are connected to the positive and negative poles of the detection power supply 600 respectively, and the circuit where the pre-warning line 13 and the detection power supply 600 are located is an early-warning circuit. The monitoring module 800 is connected to the early warning circuit, and realizes the detection of the electrical performance of the early warning circuit. It is detected that the power supply 600 is turned on, and the control terminal of the milling cutter 300 is powered on. The description is made by judging whether it is in an early warning state by detecting the current value on the warning circuit.

First, the monitoring module 800 detects the initial current value of the early warning circuit to determine whether it is in an initial state, and sends the detected initial value to the judging unit 421 . When the initial current value is detected, it is determined as the initial state, and the milling cutter starts to cut the auxiliary splicing structure. When the initial current value is not detected, it returns to the stage of detecting the power-on.

When the milling cutter 300 cuts the auxiliary splicing structure, the monitoring module 800 simultaneously detects the current on the warning circuit to determine whether it is in the warning state. Specifically, the monitoring module 800 detects the current on the early warning circuit to obtain a detection value, and then sends the detection value to the judgment unit 421 for judgment. Among them, before the milling cutter 300 cuts to the warning line 13 for the first time, when judging whether it is in the warning state, the initial current value is used as the calibration value. Since the warning line 13 has not been cut by the milling cutter, the warning circuit The current is still equal to the initial current value. When the milling cutter 300 cuts to the warning line 13 for the first time, since a part of the warning line 13 is cut off, the current in the warning circuit changes, and the judging unit 421 can judge that the detected value is different from the calibration value, so as to judge for the first time for the warning state. After the first judgment of the pre-warning state and before the milling cutter 300 cuts to the pre-warning line 13 for the second time, the detection value used when the pre-warning state is judged for the first time is used as the calibration value in the pre-warning judgment. After the second judgment of the pre-warning state and before the milling cutter 300 cuts the pre-warning line 13 for the third time, the detection value used when the pre-warning state is judged the second time is used as the calibration value in the pre-warning judgment. And so on until the cut is completed.

Specifically, in another embodiment, FIG. 29 is another flowchart of the method for dividing a board provided by the embodiment of the application. As shown in FIG. 29 , the method for dividing a board includes:

Step S701 : energize the external induction circuit of the circuit board panel, wherein the induction circuit can generate an induction current on the pre-warning line after the inductive circuit is energized, and the circuit where the pre-warning line is located is the pre-warning circuit.

Step S702: Before cutting the auxiliary splicing structure, obtain an initial value according to the electrical performance of the early warning circuit. When the induction circuit is energized, a certain amount of induced current can be generated on the corresponding warning line, and the current value in the initial state is detected as the initial value.

Step S703 : cutting an auxiliary splicing structure connected to the single board of the circuit board, and simultaneously detecting the electrical performance of the early warning circuit to obtain a detection value.

Step S704: Compare the detected value with the calibration value to determine whether the cutting state is an early warning state. In the early warning state, the warning line is cut by the milling cutter but not cut off; wherein, when judging whether it is an early warning state for the first time, use The initial value is used as the calibration value; in the subsequent judgment of whether it is an early warning state, the process value is used as the calibration value, and the process value is the detection value used when the cutting state was judged to be an early warning state last time.

Step S705 : when the warning line is cut by the milling cutter but not cut, adjust the cutting position, and then continue to cut the auxiliary splicing structure currently cut.

The depaneling method provided in the embodiment of FIG. 29 can depanel the circuit board panel provided in the embodiment of FIG. 9 , and the pre-warning line is set to have a certain width, which can ensure that the pre-warning line is cut by the milling cutter but not cut by the milling cutter during the cutting process. cut off. By arranging an induction circuit outside the circuit board, after the induction circuit is energized, a certain induction current can be generated on the warning line. The current value in the initial state is detected as the initial value. When the milling cutter does not cut to the warning line, the warning line is intact, and the detection value of the current is basically the same as the initial value, which is a non-warning state. When the milling cutter cuts to the pre-warning line, since the pre-warning line is cut off by the milling cutter, the resistance of the pre-warning line is changed, and the induced current in the corresponding pre-warning circuit also changes. Before the milling cutter cuts to the warning line for the first time, the initial value of the current is used as the calibration value to compare with the detection value to determine whether it is in the warning state. When the milling cutter cuts the warning line for the first time, the initial value is also used as the calibration value. At this time, since the warning line is cut off part of its resistance changes, the current in the warning circuit also changes. At this time, the detection value of the current Different from the calibration value, it is judged as an early warning state. After it is judged as an early warning state for the first time, the relative position is adjusted to continue cutting the current auxiliary splicing structure. Then, when judging whether it is an early warning state next time, the detection value used for the first judging to be an early warning state is used as the calibration value. If the result of the next judgment is a non-warning state, the detection value used when the previous successful judgment is an early warning state is still used as the calibration value. That is to say, every time the warning line is cut once, a part of the warning line will be cut off, and the resistance size of the warning line will change once. When judging whether the warning state is the next time, the detection value detected when the warning line was cut by the milling cutter last time is used as the calibration value. By adopting the above-mentioned plate separation method, high-precision plate separation can be realized, and generation of waste plates can be avoided, thereby saving production costs. In addition, this method of dividing the board does not need to connect the warning line to the power supply when performing the cutting warning, which can ensure the safety of the single board of the circuit board.

The embodiment of the present application further provides a plate-splitting device, which can use the plate-splitting method provided in the above-mentioned embodiment of FIG. 29 to perform the plate-splitting. The sub-board device further includes an auxiliary early-warning module, and the auxiliary early-warning module includes an induction circuit, and the induction circuit is used to generate an induction current on the pre-warning circuit during the sub-board process after power-on. Wherein, the induction circuit can be arranged on the sub-board tooling, or the induction circuit can also be arranged near the milling cutter. When the induction circuit is set on the sub-board tooling, the position of the induction circuit is fixed. During the cutting process of the sub-board, the induced current on the pre-warning line due to the power-on of the inductive circuit is only affected by the resistance change of the pre-warning line. When the induction circuit is set near the milling cutter, as the milling cutter approaches the warning line, the distance between the induction circuit and the warning line will change, and the distance between the induction circuit and the warning line will change, and the warning line will also be energized due to the induction circuit. The size of the induced current has a certain influence, and in practice, a compensation algorithm can be used to eliminate the influence of this factor on the size of the induced current.

FIG. 30 is another circuit diagram of the sub-board device and the early warning circuit in the sub-board process. FIG. 30 shows the auxiliary early warning module 700 and the sensing circuit 710 in the auxiliary early warning module 700 . FIG. 31 is a working flow chart of the board separation device provided by the embodiment of the present application. The embodiments in FIG. 30 and FIG. 31 use the method for dividing the board provided in the embodiment in FIG. 29 to perform board separation.

30 and 31 at the same time, before starting to cut, the control terminal of the milling cutter 300 is energized and the induction circuit 710 is energized. The circuit where the pre-warning line 13 is located is an early-warning circuit, wherein the pre-warning line may not be connected to the power supply. The monitoring module 800 is connected to the early warning line to realize the detection of the electrical performance of the early warning circuit. The description will be made by judging whether it is in an early warning state by detecting the current value on the warning line.

After the induction circuit 710 is powered on, a certain induction current can be generated on the warning wire 13 . Before cutting, the monitoring module 800 detects the initial current value of the early warning circuit to determine whether it is in the initial state, and sends the detected initial value to the judging unit 421 . When the initial current value is detected, it is determined as the initial state, and the milling cutter starts to cut the auxiliary splicing structure. When the initial current value is not detected, it returns to the stage where the induction circuit is energized.

This embodiment can realize high-precision board separation, avoid the generation of waste boards, and save production costs. In addition, the main control system, monitoring module, and auxiliary early warning module in the sub-board device are independent of each other, and the system coupling is low, which can reduce the probability of system failure. safety.

In another embodiment, FIG. 32 is another circuit diagram of the sub-board device and the early warning circuit in the sub-board process. 32 shows that the warning line 13 has a certain width, and the circuit board veneer also includes a connecting wire 77, and the warning wire 13 and the connecting wire 77 are connected end to end to form a closed wiring. The difference between the embodiment in FIG. 32 and the embodiment in FIG. 30 is that the monitoring module 800 is not electrically connected to the early warning line 13 . An induction module is set in the monitoring module 800, and the induction module can generate a corresponding induction signal according to the induction current on the warning wire, and judge the cutting state of the warning wire through the change of the induction signal. For the workflow of the sub-board device, reference may be made to the description of FIG. 31 , which will not be repeated here. In this embodiment, the pre-warning wire does not need to be connected to the power supply during cutting, nor does the monitoring module need to be connected to the pre-warning wire, which can ensure the safety of the circuit board. It should be noted that, in this embodiment, after the induction circuit provided outside the circuit board is energized, the induction module in the monitoring module may also generate a corresponding induction signal, that is, the magnetic field generated by the induction circuit and the magnetic field generated by the warning line. It will affect the induction module at the same time. In practice, the detection signal can be calculated and processed through the change law of the multi-field coupling signal, and the change of the power-on performance of the early warning line can be finally judged.

Optionally, in the above-mentioned embodiments of FIGS. 22 to 32 , when it is judged as an early warning state according to the detection value, the relative position of the milling cutter and the circuit board veneer can be manually adjusted, for example, manually moving the milling cutter to the outside of the circuit board veneer. Move a certain distance to make the distance between the milling cutter and the warning line larger.

Optionally, the milling cutter is controlled to move a certain distance to the outside of the circuit board veneer through the control signal of the system, so as to realize the automatic control of the sub-board cutting process, realize the high-precision sub-board, avoid the generation of waste boards, and improve the sub-board efficiency. Specifically, adjusting the cutting position includes: adjusting the relative position of the milling cutter and the auxiliary splicing structure currently being cut according to the position adjustment signal.

Further, FIG. 33 is another flowchart of the method for dividing a board provided by an embodiment of the present application, and FIG. 34 is another block diagram of a main control system in the dividing device provided by an embodiment of the present application. Figure 33 shows the steps after it is judged to be an early warning state according to the detected value. As shown in Figure 33, the sub-board method further includes:

Step S801: While adjusting the cutting position, reduce the cutting speed and the rotation speed of the milling cutter according to the control of the first cutting parameter adjustment signal. Wherein, the first cutting parameter signal includes the control signal of the cutting speed and the control signal of the rotation speed of the milling cutter. The rotation speed of the milling cutter is controlled by the control signal of the milling cutter rotation speed. Through the control signal of the cutting speed, the cutting speed is controlled to reduce the cutting speed when cutting the plate. In a plate separation device, when the movement mode of the plate separation is that the milling cutter is fixed and the stage moves, the control signal of the cutting speed controls the movement of the stage to reduce the cutting speed when the plate is cut. In another plate dividing device, when the moving mode of the plate is milling cutter movement and the stage is fixed, the control signal of the cutting speed controls the movement of the milling cutter to reduce the cutting speed when the plate is cut. When adjusting the cutting position, it is not necessary to close the control end of the milling cutter. By reducing the rotation speed of the milling cutter and reducing the cutting speed, it can be ensured that when the cutting position is adjusted, the cutting of the auxiliary splicing structure by the milling cutter will not produce large deviation, so as to ensure the accuracy of the sub-board.

Step S802 : according to the control of the position adjustment signal, the distance between the milling cutter and the warning line adjacent to the auxiliary splicing structure currently being cut is adjusted and increased, wherein the adjusted distance change is a preset value. In one embodiment, the preset value is 0.05mm. Among them, the preset value can be set with reference to the cutting speed and the rotation speed of the milling cutter during normal cutting to ensure that the milling cutter does not contact the warning line after adjusting the position.

Step S803 : when the distance variation reaches the preset value, the cutting speed and the milling cutter rotation speed are increased according to the control of the second cutting parameter adjustment signal, and the current cutting auxiliary splicing structure is continued to be cut. After the cutting position is adjusted, increase the cutting speed and the rotating speed of the milling cutter, and return to the normal high cutting speed and the normal rotating speed of the milling cutter for cutting, so as to ensure the cutting efficiency of the plate.

The board separation device provided in the embodiment of FIG. 34 can use the board separation method provided in the embodiment of FIG. 33 to perform board separation. As shown in FIG. 34 , the cutting control unit 422 includes a first subunit 4221 and a second subunit 4222 .

The first subunit 4221 is used to generate a position adjustment signal, and the position adjustment signal is specifically used to control and adjust the distance between the milling cutter and the warning line adjacent to the auxiliary splicing structure of the current cutting, wherein the adjusted distance change is a predetermined amount. set value.

The cutting control signal includes a first cutting parameter adjustment signal and a second cutting parameter adjustment signal.

The second subunit 4222 is further configured to generate a first cutting parameter adjustment signal when adjusting the cutting position, and the first cutting parameter control signal is used to control the reduction of the cutting speed and the rotational speed of the milling cutter. It is also used to generate a second cutting parameter adjustment signal after the distance change reaches a preset value, and the second cutting parameter adjustment signal is used to control the increase of the cutting speed and the rotation speed of the milling cutter, and continue to cut the auxiliary splicing structure currently being cut.

Specifically, the first cutting parameter signal includes a control signal of the cutting speed and a control signal of the rotation speed of the milling cutter. The rotation speed of the milling cutter is controlled by the control signal of the milling cutter rotation speed. The cutting speed is controlled to reduce the cutting speed when cutting the plate by the control signal of the cutting speed. In a plate separation device, the movement mode of the plate separation is that the milling cutter is fixed and the stage moves, and the control signal of the cutting speed controls the movement of the stage to reduce the cutting speed during the cutting of the plate. In another plate dividing device, the moving mode of the plate is that the milling cutter moves and the stage is fixed, and the control signal of the cutting speed controls the movement of the milling cutter to reduce the cutting speed when cutting the plate.

Likewise, the second cutting parameter signal includes a control signal of the cutting speed and a control signal of the rotation speed of the milling cutter. The rotation speed of the milling cutter is increased through the control signal of the milling cutter rotation speed. Through the control signal of the cutting speed, the cutting speed is improved when the cutting board is cut. In the plate-partitioning device in which the milling cutter is fixed and the stage is moved in the plate-parting movement mode, the control signal of the cutting speed controls the movement of the stage to improve the cutting speed during plate-parting cutting. In the plate-partitioning device whose plate-parting movement mode is the milling cutter moving and the stage fixed, the control signal of the cutting speed controls the milling cutter to move, so as to improve the cutting speed during plate-parting cutting.

In this embodiment, the cutting speed and the rotating speed of the milling cutter are reduced while the cutting position is adjusted, so as to prevent the occurrence of uncontrollable cutting and cause the warning line to lose the warning function for cutting.

The above are only specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention. should be included within the protection scope of the present invention.

Claims

A circuit board assembly, characterized in that the circuit board assembly includes: an auxiliary splicing structure and N circuit boards spliced to each other, N is a positive integer, and N≥2, wherein at least part of the auxiliary The splicing structure is used to connect two adjacent circuit boards;

The circuit board veneer includes a functional wiring and an outline edge to be cut, the auxiliary splicing structure is connected to the outline edge to be cut, and the functional wiring is adjacent to the outline edge to be cut; wherein,

The circuit board veneer includes at least one warning line, and the extending direction of the at least one warning line is the same as the extending direction of the outline edge to be cut;

The distance between the at least one warning line and the edge of the shape to be cut is d1, and the distance between the functional wiring and the edge of the shape to be cut is d2, where d1≤d2.
The circuit board panel according to claim 1, wherein,

The extension direction of the edge of the shape to be cut is the first direction, the length of the edge of the shape to be cut is L1, the length of the functional wiring in the first direction is L2, L2≥L1; wherein, the warning The length of the line in the first direction is L3, and L3>L1.
The circuit board panel according to claim 1, wherein,

The extension direction of the outline edge to be cut is the first direction, the length of the outline edge to be cut is L1, the length of the functional wiring in the first direction is L2, L2<L1; wherein,

The length of the early warning line in the first direction is L3, and L3>L2.
The circuit board panel according to claim 1, wherein,

The warning line is located on the side of the functional wiring that is close to the edge of the shape to be cut.
The circuit board panel according to claim 4, wherein 0.02mm≤d2-d1≤0.5mm.
The circuit board panel according to claim 1, wherein,

The width of the warning line is D, wherein D≥0.02mm.
The circuit board panel according to claim 6, wherein D≤1mm.
The circuit board panel according to claim 4, wherein,

The circuit board veneer includes a first insulating layer and a second insulating layer, the warning wire and the functional wiring are both located on the first insulating layer, and the second insulating layer covers the warning wire and the function trace.
The circuit board panel according to claim 1, wherein,

At least one insulating layer is spaced between the functional wiring and the warning line.
The circuit board panel according to claim 9, wherein,

One of the functional traces corresponds to at least two of the pre-warning traces, and in the thickness direction of the circuit board, one of the pre-warning traces, the functional trace, and the other pre-warning trace are stacked and arranged.
The circuit board panel according to claim 1, wherein,

The circuit board single board includes an early warning port, and at least one end of the early warning line is electrically connected to the early warning port.
The circuit board panel according to claim 1, wherein the early warning line is an inductance coil.
The circuit board assembly according to claim 1, wherein the circuit board veneer further comprises connecting wires,

The pre-warning wire and the connecting wire are connected end to end to form a closed wiring.
The circuit board panel according to claim 1, wherein,

The circuit board assembly includes at least one process edge, and part of the auxiliary splicing structure is used to connect the process edge and the adjacent circuit board veneer.
A method for dividing a board, which is used for dividing a circuit board assembly, the circuit board assembly comprising: an auxiliary splicing structure and N circuit boards spliced to each other, N is a positive integer, and N≥2, wherein , at least a part of the auxiliary splicing structure is used to connect two adjacent circuit boards; the circuit board veneer includes functional wiring and an outline edge to be cut, and the auxiliary splicing structure is connected to the outline to be cut. Edges are connected, and the functional wiring is adjacent to the edge of the shape to be cut; wherein, the circuit board veneer includes at least one warning line, and the extension direction of the at least one warning line is the same as the edge of the shape to be cut. The extension directions are the same; the distance between the at least one warning line and the edge of the shape to be cut is d1, and the distance between the functional wiring and the edge of the shape to be cut is d2, and d1≤d2; Plate methods include:

Cutting one of the auxiliary splicing structures connected to the single board of the circuit board, and simultaneously detecting the electrical performance of the early warning circuit to obtain a detection value, wherein the early warning line is located in the early warning circuit;

According to the detection value, it is determined that the cutting state is an early warning state, and the cutting mode of the auxiliary splicing structure of the current cutting is adjusted.
The method according to claim 15, wherein determining that the cutting state is an early warning state according to the detected value, comprising:

comparing the detected value with a calibration value, the calibration value being a detection threshold determined as an early warning state;

When the detected value is different from the calibration value, it is determined as an early warning state.
The method of claim 16, wherein,

The warning line is cut off in the warning state;

The adjusting the cutting mode of the auxiliary splicing structure of the current cutting includes: controlling the milling cutter to stop cutting the auxiliary splicing structure of the current cutting.
A depaneling device is characterized in that, it is applied to depaneling a circuit board assembly, and the depaneling device comprises: a depaneling tool, a loading table, a milling cutter, a monitoring module and a main control system; wherein,

The sub-board tooling is used for fixing the circuit board assembly;

the object stage is used for carrying the sub-board tool;

the milling cutter, which is used for cutting the auxiliary splicing structure connected with the circuit board veneer;

The monitoring module of the main control system, the monitoring module is used to detect the electrical performance of the early warning circuit to obtain a detection value during sub-board, and send the detection value to the main control system, wherein the circuit board The pre-warning line in the puzzle is located in the pre-warning circuit;

The main control system includes: a judgment unit and a cutting control unit; wherein,

The judging unit is configured to receive the detection value, and when it is determined that the cutting state is an early warning state according to the detection value, send an adjustment instruction to the cutting control unit;

The cutting control unit is configured to adjust the cutting mode of the auxiliary splicing structure currently being cut in response to the adjustment instruction.
The plate dividing device according to claim 18, wherein,

The judging unit is configured to compare the detection value with a calibration value, the calibration value is a detection threshold value determined as an early warning state, and when the detection value is different from the calibration value, it is determined as an early warning state.
The plate dividing device according to claim 19, wherein,

The warning line is cut off in the warning state;

The cutting control unit is further configured to, in response to the adjustment instruction, control the milling cutter to stop cutting the auxiliary splice structure currently being cut.
The plate separating device according to claim 19, wherein the width of the warning line is D, and D≥0.02mm;

In the pre-warning state, the pre-warning line is cut by the milling cutter but not cut off;

The cutting control unit is further configured to, in response to the adjustment instruction, control to continue cutting the currently cut auxiliary splicing structure after adjusting the cutting position.
The plate dividing device according to claim 19, wherein,

The monitoring module is further configured to obtain an initial value according to the electrical performance of the early warning circuit before cutting the auxiliary splicing structure, and send the initial value to the judgment unit;

The judging unit is configured to use the initial value as the calibration value when it is determined to be an early warning state.
The plate dividing device according to claim 22, wherein,

The judging unit is also used to use the initial value as the calibration value when the cutting state is determined to be an early warning state for the first time; it is also used to determine that the cutting state is an early warning state after it is determined to be an early warning state for the first time. , the process value is used as the calibration value, wherein the process value is the detection value used when the cutting state of the warning line was determined as the warning state last time.
The plate dividing device according to claim 21, wherein,

The cutting control unit includes a first subunit and a second subunit;

The first subunit is used to generate a position adjustment signal in response to the adjustment instruction, and the position adjustment signal is used to control and adjust the relative position of the milling cutter and the auxiliary splicing structure currently being cut;

The second subunit is used to generate a cutting control signal after adjusting the relative position, and the cutting control signal is used to control to continue cutting the currently cut auxiliary splicing structure.
The plate dividing device according to claim 24, wherein,

The position adjustment signal is specifically used to control and adjust the distance between the milling cutter and the warning line adjacent to the auxiliary splicing structure currently being cut, wherein the adjusted distance change is a preset value;

The cutting control signal includes a first cutting parameter adjustment signal and a second cutting parameter adjustment signal;

The second subunit is also used to generate the first cutting parameter adjustment signal when adjusting the cutting position, and the first cutting parameter control signal is used to control the reduction of the cutting speed and the rotational speed of the milling cutter; When the distance change reaches the preset value, the second cutting parameter adjustment signal is generated, and the second cutting parameter adjustment signal is used to control the increase of the cutting speed and the rotation speed of the milling cutter, and continue to perform the auxiliary splicing structure for the current cutting. cut.
The plate dividing device according to claim 18, wherein,

The depaneling device further includes an auxiliary pre-warning module, and the auxiliary pre-warning module includes an induction circuit, and the induction circuit is used to generate an inductive current on the pre-warning circuit during the depaneling process after power-on.