WO2022065979A1 - Dispositif électronique comprenant un dispositif d'affichage flexible et une carte de circuit imprimé - Google Patents

Dispositif électronique comprenant un dispositif d'affichage flexible et une carte de circuit imprimé Download PDF

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Publication number
WO2022065979A1
WO2022065979A1 PCT/KR2021/013222 KR2021013222W WO2022065979A1 WO 2022065979 A1 WO2022065979 A1 WO 2022065979A1 KR 2021013222 W KR2021013222 W KR 2021013222W WO 2022065979 A1 WO2022065979 A1 WO 2022065979A1
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WIPO (PCT)
Prior art keywords
circuit board
printed circuit
electronic device
electronic component
disposed
Prior art date
Application number
PCT/KR2021/013222
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English (en)
Korean (ko)
Inventor
최봉석
이태경
조중연
최종철
허창룡
Original Assignee
삼성전자 주식회사
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Publication of WO2022065979A1 publication Critical patent/WO2022065979A1/fr

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/0206—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings
    • H04M1/0208—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings characterized by the relative motions of the body parts
    • H04M1/0235—Slidable or telescopic telephones, i.e. with a relative translation movement of the body parts; Telephones using a combination of translation and other relative motions of the body parts
    • H04M1/0237—Sliding mechanism with one degree of freedom
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
    • H04M1/0268—Details of the structure or mounting of specific components for a display module assembly including a flexible display panel
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0274—Details of the structure or mounting of specific components for an electrical connector module
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]

Definitions

  • Various embodiments disclosed in this document relate to an electronic device including a flexible display and a printed circuit board.
  • a display using an organic light emitting diode or the like may secure a portability of an electronic device while providing a larger screen.
  • a display using an organic light emitting diode (or an electronic device equipped with the same) may realize stable operation even if it is manufactured to be quite thin.
  • the display may be mounted on the electronic device in a form that is foldable or bendable or rollable.
  • the electronic device may include a movable device (eg, a housing).
  • a movable device eg, a housing
  • the devices may move relative to each other by a sliding operation or a rolling operation.
  • the electronic components positioned in each appliance that move relative to each other may also move relative to each other.
  • Electronic components must remain stable and connected to the printed circuit board for normal operation.
  • connection structure for electronic components positioned in an electronic device including a movable device.
  • An electronic device includes a first mechanism, a second mechanism slidably positioned with respect to the first mechanism, a first printed circuit board, and a first surface of the first printed circuit board to face A first electronic component disposed to face and moved by sliding of the second mechanism, a second surface opposite to the first surface of the first printed circuit board, and disposed to face the first surface by sliding of the second mechanism a second electronic component moving in a direction opposite to the moving direction of the electronic component, a second stacked on a first surface of the first printed circuit board and including a third surface facing the first surface of the first printed circuit board a printed circuit board, a first connector electrically connected to the first electronic component and electrically connected to a first surface of the first printed circuit board, and a first connector electrically connected to the second electronic component and electrically connected to the second printed circuit board It may include a second connector electrically connected to the third surface.
  • the electronic device includes a first mechanism, a second mechanism that is slidably installed with respect to the first mechanism, a printed circuit board, and a first surface of the printed circuit board to face the electronic device.
  • a first electronic component moved by sliding of a second mechanism is disposed to face a second surface that is opposite to the first surface of the printed circuit board, and the movement direction of the first electronic component is determined by sliding of the second mechanism a second electronic component moving in the opposite direction, a first connector electrically connected to the first electronic component and electrically connected to the first surface of the printed circuit board, and a second electronic component electrically connected to the printed circuit It may include a second connector electrically connected to the second surface of the substrate.
  • connection structure of electronic components configured to stably maintain electrical connection even when electronic components located in the device move together with the device in an electronic device including a movable device.
  • a connection state with the printed circuit board may be stably maintained.
  • the thickness of the electronic device may be reduced by increasing the usability of the space inside the electronic device.
  • FIG. 1 is a block diagram of an electronic device in a network environment, according to various embodiments of the present disclosure
  • FIG. 2A is a perspective view of an electronic device in a first state according to various embodiments disclosed herein.
  • FIG. 2B is a perspective view of the electronic device shown in FIG. 2A in a second state according to various embodiments of the present disclosure
  • FIG. 2C is an exploded perspective view of the electronic device illustrated in FIG. 2A according to various embodiments of the present disclosure
  • FIG. 2D is a view in which at least some components of the electronic device illustrated in FIG. 2A are removed, according to various embodiments of the present disclosure
  • FIG. 3A is a cross-sectional view taken along line A-A of the electronic device illustrated in FIG. 2A according to various embodiments of the present disclosure
  • 3B is a cross-sectional view taken along line B-B of the electronic device illustrated in FIG. 2B according to various embodiments of the present disclosure
  • FIG. 4A is a perspective view of a first printed circuit board and a second printed circuit board and peripheral configurations thereof according to various embodiments disclosed herein.
  • FIG. 4B is a rear view of the diagram shown in FIG. 4A according to various embodiments.
  • FIG. 5A is a cross-sectional view taken along the line C-C of the drawing shown in FIG. 4A according to various embodiments of the present disclosure
  • FIG. 5B is a cross-sectional view taken along line D-D of the drawing shown in FIG. 4A according to various embodiments of the present disclosure
  • FIG. 6A is a perspective view of a first printed circuit board and a second printed circuit board and peripheral configurations thereof according to various embodiments disclosed herein.
  • FIG. 6B is a rear view of the view shown in FIG. 4A according to various embodiments.
  • FIG. 7A is a cross-sectional view of an electronic device in a first state according to various embodiments disclosed herein.
  • FIG. 7B is a cross-sectional view of the electronic device illustrated in FIG. 7A in a second state according to various embodiments of the present disclosure
  • a or B at least one of A and B”, “or at least one of B,” “A, B or C,” “at least one of A, B and C,” and “B; or “at least one of C” may include any one of, or all possible combinations of, items listed together in the corresponding one of the phrases.
  • Terms such as “first”, “second”, or “first” or “second” may be used simply to distinguish the element from other elements in question, and may refer to elements in other aspects (e.g., importance or order) is not limited.
  • one (eg first) component is “coupled” or “connected” to another (eg, second) component, with or without the terms “functionally” or “communicatively”
  • one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.
  • FIG. 1 is a block diagram of an electronic device 101 in a network environment 100 according to various embodiments.
  • an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • a first network 198 eg, a short-range wireless communication network
  • a second network 199 e.g., a second network 199
  • the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • the electronic device 101 includes a processor 120 , a memory 130 , an input module 150 , a sound output module 155 , a display module 160 , an audio module 170 , and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or an antenna module 197 may be included.
  • at least one of these components eg, the connection terminal 178
  • may be omitted or one or more other components may be added to the electronic device 101 .
  • some of these components are integrated into one component (eg, display module 160 ). can be
  • the processor 120 for example, executes software (eg, a program 140) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120 . It can control and perform various data processing or operations. According to one embodiment, as at least part of data processing or operation, the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 . may be stored in the volatile memory 132 , and may process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 .
  • software eg, a program 140
  • the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 .
  • the volatile memory 132 may be stored in the volatile memory 132 , and may process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 .
  • the processor 120 is the main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit) a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor).
  • the main processor 121 e.g, a central processing unit or an application processor
  • a secondary processor 123 eg, a graphic processing unit, a neural network processing unit
  • NPU neural processing unit
  • an image signal processor e.g., a sensor hub processor, or a communication processor.
  • the main processor 121 e.g, a central processing unit or an application processor
  • a secondary processor 123 eg, a graphic processing unit, a neural network processing unit
  • NPU neural processing unit
  • an image signal processor e.g., a sensor hub processor, or a communication processor.
  • the main processor 121 e.g, a central processing unit or an application processor
  • a secondary processor 123
  • the auxiliary processor 123 is, for example, on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states.
  • the co-processor 123 eg, an image signal processor or a communication processor
  • may be implemented as part of another functionally related component eg, the camera module 180 or the communication module 190. there is.
  • the auxiliary processor 123 may include a hardware structure specialized for processing an artificial intelligence model.
  • Artificial intelligence models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself on which artificial intelligence is performed, or may be performed through a separate server (eg, the server 108).
  • the learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but in the above example not limited
  • the artificial intelligence model may include a plurality of artificial neural network layers.
  • Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the above example.
  • the artificial intelligence model may include, in addition to, or alternatively, a software structure in addition to the hardware structure.
  • the memory 130 may store various data used by at least one component of the electronic device 101 (eg, the processor 120 or the sensor module 176 ).
  • the data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto.
  • the memory 130 may include a volatile memory 132 or a non-volatile memory 134 .
  • the program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .
  • the input module 150 may receive a command or data to be used in a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 .
  • the input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).
  • the sound output module 155 may output a sound signal to the outside of the electronic device 101 .
  • the sound output module 155 may include, for example, a speaker or a receiver.
  • the speaker can be used for general purposes such as multimedia playback or recording playback.
  • the receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.
  • the display module 160 may visually provide information to the outside (eg, a user) of the electronic device 101 .
  • the display module 160 may include, for example, a control circuit for controlling a display, a hologram device, or a projector and a corresponding device.
  • the display module 160 may include a touch sensor configured to sense a touch or a pressure sensor configured to measure the intensity of a force generated by the touch.
  • the audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input module 150 , or an external electronic device (eg, a sound output module 155 ) connected directly or wirelessly with the electronic device 101 . A sound may be output through the electronic device 102 (eg, a speaker or headphones).
  • an external electronic device eg, a sound output module 155
  • a sound may be output through the electronic device 102 (eg, a speaker or headphones).
  • the sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, user state), and generates an electrical signal or data value corresponding to the sensed state. can do.
  • the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.
  • the interface 177 may support one or more designated protocols that may be used by the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ).
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card
  • the connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 may manage power supplied to the electronic device 101 .
  • the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101 .
  • battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.
  • the communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication performance through the established communication channel.
  • the communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication.
  • the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a LAN (local area network) communication module, or a power line communication module).
  • GNSS global navigation satellite system
  • a corresponding communication module among these communication modules is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (eg, a telecommunication network such as a LAN or a WAN).
  • a first network 198 eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)
  • a second network 199 eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (eg, a telecommunication network such as a LAN or a WAN).
  • a telecommunication network
  • the wireless communication module 192 uses the subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 .
  • the electronic device 101 may be identified or authenticated.
  • the wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, a new radio access technology (NR).
  • NR access technology includes high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency) -latency communications)).
  • eMBB enhanced mobile broadband
  • mMTC massive machine type communications
  • URLLC ultra-reliable and low-latency
  • the wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example.
  • a high frequency band eg, mmWave band
  • the wireless communication module 192 includes various technologies for securing performance in a high-frequency band, for example, beamforming, massive multiple-input and multiple-output (MIMO), all-dimensional multiplexing. It may support technologies such as full dimensional MIMO (FD-MIMO), an array antenna, analog beam-forming, or a large scale antenna.
  • the wireless communication module 192 may support various requirements specified in the electronic device 101 , an external electronic device (eg, the electronic device 104 ), or a network system (eg, the second network 199 ).
  • the wireless communication module 192 may include a peak data rate (eg, 20 Gbps or more) for realizing eMBB, loss coverage (eg, 164 dB or less) for realizing mMTC, or U-plane latency for realizing URLLC ( Example: downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less).
  • a peak data rate eg, 20 Gbps or more
  • loss coverage eg, 164 dB or less
  • U-plane latency for realizing URLLC
  • the antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device).
  • the antenna module 197 may include an antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern.
  • the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 . can be selected. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna.
  • other components eg, a radio frequency integrated circuit (RFIC)
  • RFIC radio frequency integrated circuit
  • the antenna module 197 may form a mmWave antenna module.
  • the mmWave antenna module comprises a printed circuit board, an RFIC disposed on or adjacent to a first side (eg, bottom side) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, an array antenna) disposed on or adjacent to a second side (eg, top or side) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.
  • peripheral devices eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • GPIO general purpose input and output
  • SPI serial peripheral interface
  • MIPI mobile industry processor interface
  • the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 .
  • Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 .
  • all or a part of operations executed in the electronic device 101 may be executed in one or more external electronic devices 102 , 104 , or 108 .
  • the electronic device 101 may perform the function or service itself instead of executing the function or service itself.
  • one or more external electronic devices may be requested to perform at least a part of the function or the service.
  • One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 .
  • the electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request.
  • cloud computing distributed computing, mobile edge computing (MEC), or client-server computing technology may be used.
  • the electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing.
  • the external electronic device 104 may include an Internet of things (IoT) device.
  • Server 108 may be an intelligent server using machine learning and/or neural networks.
  • the external electronic device 104 or the server 108 may be included in the second network 199 .
  • the electronic device 101 may be applied to an intelligent service (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.
  • FIG. 2A is a perspective view of an electronic device in a first state according to various embodiments disclosed herein.
  • FIG. 2B is a perspective view of the electronic device shown in FIG. 2A in a second state.
  • FIG. 2C is an exploded perspective view of the electronic device shown in FIG. 2A .
  • FIG. 2D is a view in which at least some components of the electronic device shown in FIG. 2A are removed.
  • connection structure of the electronic component may be applied to an electronic device including movable housings.
  • the electronic component may include at least one electronic device accompanying an electrical signal and a device (eg, a housing, a plate, and a bracket) supporting the electronic device.
  • the electronic component may include an electronic device, an integrated circuit including a connection relationship between the electronic devices, or a module configured to perform a specific function.
  • the components of the electronic device 101 illustrated in FIG. 1 may be various examples of electronic components.
  • the electronic device 200 is a type of electronic device 200 (eg, a slideable electronic device) in which the display area of the display 210 is expanded by a sliding operation or a rolling operation. , a rollable electronic device).
  • the display area of the display 210 may mean an area in which information in a visual form displayed on the display 210 is exposed to the outside of the electronic device 200 .
  • the first area 210A exposed to the outside of the electronic device 200 in the first state illustrated in FIG. 2A may be the display area of the display 210 .
  • the display area of the display 210 may be the first area 210A and the second area 210B exposed to the outside of the electronic device 200 .
  • the electronic device 200 may be switched from the first state to the second state by the relative movement (eg, sliding) of the second appliance with respect to the first appliance. By switching from the first state to the second state, the display area of the display 210 may be expanded.
  • the electronic device 200 shown in FIGS. 2A to 2D may be the electronic device 200 including at least one component of the electronic device 101 shown in FIG. 1 .
  • the electronic device 200 includes a display 210 (eg, the display module 160 of FIG. 1 ), a first housing 220 , a moving member 260 , a second housing 230 , and printing. It may include a circuit board 270 , a third housing 240 , and a rear cover 250 .
  • the components of the electronic device 200 described above are merely examples, and it is possible to omit at least one of the above-described components. In the electronic device 200 illustrated in FIGS.
  • the second mechanism may be coupled to the first mechanism to be movable relative to the first mechanism.
  • the second mechanism may include, for example, the first housing 220 and/or the second housing 230 of the electronic device 200 .
  • the first mechanism may include, for example, the third housing 240 of the electronic device 200 .
  • the second mechanism will be described as the second housing 230
  • the first mechanism will be described as the third housing 240 .
  • the display 210 may be a flexible display.
  • the display 210 may include a plurality of regions.
  • the display 210 may be divided into a first area 210A and a second area 210B.
  • the area of the display 210 is only conceptually divided for explanation, and the area of the display 210 is not always visually divided.
  • FIG. 2A in a first state where there is no relative movement between the first and second devices, the first region 210A is exposed to the outside of the electronic device 200 and the second region 210B is the electronic device. It may be housed inside the device 200 . As illustrated in FIG.
  • portions of the first region 210A and the second region 210B may be exposed to the outside of the electronic device 200 .
  • the portion exposed to the outside of the electronic device 200 may increase while the second region 210B is converted from the first state to the second state.
  • a transparent area 211 may be formed in the first area 210A of the display 210 .
  • the transparent region 211 may be formed of a transparent material.
  • External light may be transmitted to a camera (eg, the camera lens unit 331 of FIG. 3A ) of the camera module (eg, the camera module 330 of FIG. 3A ) through the transparent region 211 .
  • operation control of the display 210 may be performed through a display driver IC (eg, the display driving circuit 340 of FIG. 3A ).
  • the display 210 may be a chip on plastic (COP) type display 210 .
  • the COP-type display 210 is a display 210 in which the panel part, which is a part that actually displays visual information, and the display driving circuit are disposed on a substrate made of a polymer material (eg, polyimide) having flexible properties.
  • the display driving circuit may be disposed in the second area 210B of the display 210 accommodated inside the electronic device 200 in the first state.
  • the first housing 220 may support at least a portion of the display 210 .
  • the first housing 220 may be fixed to the first area 210A of the display 210 to support the display 210 .
  • the second housing 230 may support the first housing 220 and some of various electronic components included in the electronic device 200 .
  • the second housing 230 may be a second mechanism that slides with respect to the first mechanism. Due to the sliding of the second housing 230 , the first housing 220 supported by the second housing 230 and some of the electronic components may be moved together with the second housing 230 .
  • the printed circuit board may include a processor (eg, the processor 120 of FIG. 1 ), a memory (eg, the memory 130 of FIG. 1 ), and a communication module (eg, 190 of FIG. 1 ).
  • the moving member 260 may guide the movement of the second housing 230 .
  • the moving member 260 may include a multi-bar structure that moves by interlocking a plurality of hinges and a plurality of bars.
  • the moving member 260 may include at least one elastic member 261 that provides an elastic force to the moving member 260 .
  • the elastic member 261 may provide an elastic force so that the second mechanism slides with respect to the first mechanism in a direction in which the electronic device 200 is switched from the second state to the first state.
  • the third housing 240 may constitute an exterior of the electronic device 200 .
  • the third housing 240 may be a first mechanism.
  • the position of the third housing 240 may be fixed while the second mechanism is slid.
  • the first housing 220 and the second housing 230 may move relative to the third housing 240 .
  • the rear cover 250 may be coupled to at least a portion of the third housing 240 to block the internal space of the electronic device 200 from the external space.
  • FIG. 2D is a plan view with the display 210 and the first housing 220 removed
  • (b) of FIG. 2D is the display 210, the first housing 220, and the second housing 230. This is a plan view with the .
  • the electronic device may include a plurality of camera modules 290 and 330 .
  • the plurality of camera modules 290 and 330 may include cameras facing in different directions, respectively.
  • the first camera module 290 may include at least one camera facing the rear of the electronic device (eg, the -Y direction of FIG. 3A ).
  • the second camera module 330 may include at least one camera 331 facing the front side of the electronic device (eg, the +Y direction of FIG. 3A ).
  • the second camera module 330 will be referred to as a camera module 330 to be described.
  • the first electronic component may be disposed in a recess formed in the second housing 230 .
  • the first electronic component may be moved together with the second housing 230 which is a second mechanism.
  • the first electronic component may be, for example, the camera module 330 (eg, the camera module 180 of FIG. 1 ).
  • FIG. 3A is a cross-sectional view of the electronic device shown in FIG. 2A taken along line A-A.
  • 3B is a cross-sectional view of the electronic device shown in FIG. 2B taken along line B-B.
  • 4A is a perspective view of a first printed circuit board and a second printed circuit board and peripheral configurations thereof according to various embodiments disclosed herein.
  • Fig. 4B is a rear view of the view shown in Fig. 4A;
  • FIG. 5A is a cross-sectional view taken along line C-C of the drawing shown in FIG. 4A.
  • FIG. 5B is a cross-sectional view taken along the line D-D of the drawing shown in FIG. 4A.
  • the electronic device may include a plurality of printed circuit boards 310 and 320 .
  • the electronic device 200 may include a first printed circuit board 310 and a second printed circuit board 320 .
  • the first printed circuit board 310 and the second printed circuit board 320 overlap at least partially when viewed from the display with a predetermined distance (eg, the +Y direction in FIG. 3A ). can be placed.
  • the first printed circuit board 310 may include a first surface 310A facing the second printed circuit board 320 and a second surface 310B opposite to the first surface 310A.
  • the second printed circuit board 320 may include a third surface 320A facing the first printed circuit board 310 .
  • the first electronic component 330 may be disposed at a position facing the first surface 310A of the first printed circuit board 310 .
  • the second electronic component 340 may be disposed at a position facing the second surface 310B of the first printed circuit board 310 .
  • the first electronic component 330 may include the camera module 330
  • the second electronic component 340 may include the display driving circuit 340 .
  • the first printed circuit board 310 when the electronic device 200 is in the first state (eg, the state of FIG. 3A ), the first printed circuit board 310 is disposed between the first area 210A and the second area 210B of the display. ) and the second printed circuit board 320 may be disposed.
  • the camera lens unit 331 of the camera module 330 that is the first electronic component 330 may be disposed at a position corresponding to the transparent area 211 formed in the first area 210A of the display 210 .
  • the transparent region 211 may be formed of a transparent material. External light may be transmitted to the camera of the camera module through the transparent area 211 .
  • a second device slides with respect to the first device (eg, the third housing 240 of FIG. 2A ), so that the first electronic component 330 is ) and the second electronic component 340 may move in opposite directions.
  • the electronic device 200 may be switched from a first state (eg, the state of FIG. 3A ) to a second state (eg, the state of FIG. 3B ).
  • the first state is changed to the second state
  • the first area 210A of the display may move in the first direction 300A (eg, the -X direction of FIG. 3A ).
  • the first electronic component 330 positioned on the second device may also be moved in the first direction 300A together with the second device.
  • the second area 210B of the display may move in the second direction 300B (eg, the +X direction of FIG. 3A ).
  • the second electronic component 340 including the display driving circuit 340 positioned in the second area 210B of the display may also move in the second direction 300B according to the movement of the second area 210B.
  • the first electronic component 330 may be connected to the first printed circuit board 310 using the first connector 350 .
  • the first connector 350 is electrically connected to the first surface 310A of the first printed circuit board 310 , is connected to the first electronic component 330 , and is connected to the first printed circuit board 310 with the first electronic Components 330 may be electrically connected.
  • the first connector 350 is flexible so that the connection state between the first electronic component 330 and the first printed circuit board 310 can be maintained. It may be formed of a material.
  • the first connector 350 may be a flexible printed circuit board (FPCB) that allows bending of at least a partial region.
  • FPCB flexible printed circuit board
  • the second electronic component 340 may be connected to the second printed circuit board 320 through the second connector 360 as shown in FIGS. 3A and 5B .
  • the second connector 360 is electrically connected to the third surface 320A of the second printed circuit board 320 and is a second electronic component via the second surface 310B of the first printed circuit board 310 .
  • the second electronic component 340 may be electrically connected to the second printed circuit board 320 .
  • the second connector 360 is flexible so that the connection state between the second electronic component 340 and the second printed circuit board 320 can be maintained. It may be formed of a material.
  • the second connector 360 may be a flexible printed circuit board (FPCB) that allows bending of at least a partial region.
  • FPCB flexible printed circuit board
  • connection between the first connector 350 and the first printed circuit board 310 and the second connector 360 and the second printed circuit board 320 may be connected in various ways.
  • the connector and the printed circuit board may be connected by various connection methods such as a socket method, a clip method, and a welding method.
  • the second connector 360 is connected to the first
  • the shielding member 301 disposed on the second surface 310B of the printed circuit board 310 may be spaced apart from the second surface 310B.
  • the shielding member 301 disposed on the second surface 310B of the first printed circuit board 310 may be, for example, a shielding can for shielding electromagnetic interference (EMI).
  • Electronic components such as a processor and a memory may be disposed inside the shielding member 301 .
  • At least a portion of the second connector 360 passing through the second surface 310B of the first printed circuit board 310 may pass through the shielding member 301 (eg, see FIG. 7A ). In this case, in a direction facing the second surface 310B of the first printed circuit board 310 , at least a portion of the second connector 360 may overlap the shielding member 301 .
  • connection area 320B which is a portion where the second connector 360 is connected to the second printed circuit board 320 , is outside the first printed circuit board 310 . It may be formed to extend so as to protrude to the side. As shown in FIG. 4B , in the direction facing the second surface 310B of the first printed circuit board 310 , the connection region 320B may extend to protrude toward the outer surface of the first printed circuit board 310 . .
  • the second printed circuit board 320 is disposed spaced apart from the first surface 310A of the first printed circuit board 310 at a predetermined interval, and a connection area of the second printed circuit board 320 is provided. Since 320B is a portion protruding from the outer surface of the first printed circuit board 310, as shown in FIG. 3A, the third surface ( The distance L1 between 320A is greater than the distance L2 between the second electronic component 340 and the second surface 310B of the first printed circuit board 310 . In order to maintain the connection between the second electronic component 340 and the printed circuit board while the electronic device 200 is switched from the first state to the second state and the second electronic component 340 is moved, the 360) must have a space where it can be deformed.
  • the second connector 360 When the second connector 360 is connected to the third surface 320A of the second printed circuit board 320 , it is disposed between the third surface 320A of the second printed circuit board 320 and the second electronic component 340 .
  • the space may be used as a space for deformation of the second connector 360 .
  • an electronic component may be disposed in an area where the first printed circuit board 310 and the second printed circuit board 320 overlap.
  • the electronic component disposed in the overlapping area may be disposed on the first surface 310A of the first printed circuit board 310 or may be disposed on the third surface 320A of the second printed circuit board 320 .
  • an interposer 370 surrounding the overlapping area is disposed between the first printed circuit board 310 and the second printed circuit board 320 in order to shield EMI of electronic components disposed in the overlapping area.
  • the interposer 370 may include a shielding-can.
  • the interposer 370 may electrically connect the first printed circuit board 310 and the second printed circuit board 320 to each other.
  • FIG. 6A is a perspective view of a first printed circuit board and a second printed circuit board and peripheral configurations thereof according to various embodiments disclosed herein.
  • Fig. 6B is a rear view of the view shown in Fig. 4A; Since the structure shown in FIGS. 6A and 6B is similar to the structure shown in FIG. 5A , detailed descriptions of similar or identical components will be omitted.
  • connection area 320B of the second printed circuit board 320 is a portion corresponding to the cut-out portion 311-1 of the first printed circuit board 311 . It may be formed by extending. As shown in FIG. 6B , in the direction facing the second surface 311B of the first printed circuit board 311 , the connection region 320B overlaps the cutout portion 311-1 of the first printed circuit board 311 . can be The other corner portions except for one of the corner portions of the connection area 320B may overlap the first printed circuit board 311 so that the connection area 320B can be stably supported by the first printed circuit board 311 . there is.
  • FIG. 7A is a cross-sectional view of an electronic device in a first state according to various embodiments disclosed herein.
  • FIG. 7B is a cross-sectional view of the electronic device shown in FIG. 7A in a second state. Since the structure shown in FIGS. 7A and 7B is similar to the structure shown in FIGS. 3A and 3B , descriptions of the same or similar components will be omitted.
  • the printed circuit board 710 of the electronic device may include a first surface 710A and a second surface 710B opposite to the first surface 710A.
  • the first electronic component 330 may be disposed at a position facing the first surface 710A of the printed circuit board 710 .
  • the second electronic component 340 may be disposed at a position facing the second surface 710B of the printed circuit board 710 .
  • the first electronic component 330 may include the camera module 330
  • the second electronic component 340 may include the display driving circuit 340 .
  • the first device slides with respect to the third housing 240 of FIG. 2C ).
  • the electronic device may be switched from the first state (eg, the state of Fig. 7A) to the second state (eg, the state of Fig. 7B)
  • the display 210 The first region 210A of may move in a first direction 700A (eg, the -X direction of Fig. 7A)
  • the first electronic component 330 positioned in the second device may also move in the first direction along with the second device.
  • the second area 210B of the display 210 is moved in the second direction 700B (eg, FIG. 7A ). in the +X direction of the display 210.
  • the second electronic component 340 including the display driving circuit 340 disposed in the second area 210B of the display 210 is also affected by the movement of the second area 210B. Accordingly, it may move in the second direction 700B.
  • the first electronic component 330 may be connected to the printed circuit board 710 through the first connector 350 .
  • the first connector 350 is electrically connected to the first surface 710A of the printed circuit board 710 , and is connected to the first electronic component 330 to connect the first electronic component 330 to the printed circuit board 710 . can be electrically connected. Even if the first electronic component 330 is moved, the first connector 350 may be formed of a flexible material so that the connection state between the first electronic component 330 and the printed circuit board 710 can be maintained.
  • the first connector 350 may be a flexible printed circuit board (FPCB) that allows bending of at least a partial region.
  • FPCB flexible printed circuit board
  • the second electronic component 340 may be connected to the printed circuit board 710 through the second connector 360 .
  • the second connector 360 is electrically connected to the second surface 710B of the printed circuit board 710 , and is connected to the second electronic component 340 to connect the second electronic component 340 to the printed circuit board 710 . can be electrically connected.
  • the second connector 360 may be formed of a flexible material so that the connection between the second electronic component 340 and the second printed circuit board can be maintained even when the second electronic component 340 is moved.
  • the second connector 360 may be a flexible printed circuit board (FPCB) that allows bending of at least a partial region.
  • FPCB flexible printed circuit board
  • At least a portion of the second connector 360 passing through the second surface 710B of the printed circuit board 710 may pass through the shielding member 301 .
  • at least a portion of the second connector 360 may overlap the shielding member 301 .
  • Various electronic components such as a processor and a memory may be disposed inside the shielding member 301 .
  • the first electronic component includes the camera module and the second electronic component includes the display driving circuit, but the first electronic component and the second electronic component may include various other electronic components.
  • the electronic device of a type in which the display area of the display is expanded by sliding has been described above, various electronic devices in which the first electronic component and the second electronic component move relative to each other due to the relative movement of the first and second structures.
  • the structure disclosed in the present invention can be applied to
  • An electronic device includes a first mechanism, a second mechanism slidably positioned with respect to the first mechanism, a first printed circuit board, and a first surface of the first printed circuit board to face A first electronic component disposed to face and moved by sliding of the second mechanism, a second surface opposite to the first surface of the first printed circuit board, and disposed to face the first surface by sliding of the second mechanism a second electronic component moving in a direction opposite to the moving direction of the electronic component, a second stacked on a first surface of the first printed circuit board and including a third surface facing the first surface of the first printed circuit board a printed circuit board, a first connector electrically connected to the first electronic component and electrically connected to a first surface of the first printed circuit board, and a first connector electrically connected to the second electronic component and electrically connected to the second printed circuit board It may include a second connector electrically connected to the third surface.
  • the flexible display may further include a flexible display that is switched from a first state to a second state in which a display area that is a region exposed to the outside of the electronic device is expanded by sliding of the second device, wherein the flexible display includes: a first region exposed to the outside of the electronic device in the first state, a second region accommodated inside the electronic device in the first state and at least partially exposed to the outside of the electronic device in the second state; and It may include a display driver IC (DDI) disposed on at least a portion of the second area.
  • DPI display driver IC
  • the first electronic component may include a camera module.
  • the second electronic component may include a display driving circuit of the flexible display.
  • the camera module may include a camera disposed at a position corresponding to the transparent area formed in the first area of the flexible display.
  • the second printed circuit board may include a connection region that is a portion to which the second connector is connected.
  • connection region of the second printed circuit board may extend to protrude from an outer surface of the first printed circuit board in a direction facing the second surface of the first printed circuit board.
  • connection region of the second printed circuit board may be formed to extend in a direction facing the second surface of the first printed circuit board to correspond to a portion in which at least a portion of the first printed circuit board is cut. there is.
  • connection area of the second printed circuit board the remaining portion except for one of the corner portions of the connection area viewed in a direction facing the second surface of the first printed circuit board overlaps the first printed circuit board can be
  • first printed circuit board and the second printed circuit board may be spaced apart from each other by a predetermined distance, and in a direction facing the second surface of the first printed circuit board, the first printed circuit board and the second printed circuit board
  • An electronic component may be disposed in the area where the 2 printed circuit boards overlap, the overlapping area may be shielded, and an interposer for electrically connecting the first printed circuit board and the second printed circuit board may be disposed.
  • a processor, a memory, and a shielding member for shielding the processor and memory are disposed on the second surface of the first printed circuit board, and the second connector includes the shielding member and the second surface of the first printed circuit board may be spaced apart.
  • first connector and the second connector may be a flexible printed circuit board (FPCB) allowing bending of at least a partial region.
  • FPCB flexible printed circuit board
  • the electronic device includes a first mechanism, a second mechanism that is slidably installed with respect to the first mechanism, a printed circuit board, and a first surface of the printed circuit board to face the electronic device.
  • a first electronic component moved by sliding of a second mechanism is disposed to face a second surface that is opposite to the first surface of the printed circuit board, and the movement direction of the first electronic component is determined by sliding of the second mechanism a second electronic component moving in an opposite direction, a first connector electrically connected to the first electronic component and electrically connected to the first surface of the printed circuit board, and a second electronic component electrically connected to the printed circuit It may include a second connector electrically connected to the second surface of the substrate.
  • the flexible display may further include a flexible display that is switched from a first state to a second state in which a display area that is a region exposed to the outside of the electronic device is expanded by sliding of the second device, wherein the flexible display includes: A first region exposed to the outside of the electronic device in the first state, a second region accommodated inside the electronic device in the first state and exposed to the outside of the electronic device in the second state, and the second region It may include a display driver IC (DDI) disposed in the.
  • DPI display driver IC
  • the first electronic component may include a camera module.
  • the second electronic component may include a display driving circuit of the flexible display.
  • the camera module of the first electronic component may include a camera disposed at a position corresponding to the transparent area formed in the first area of the flexible display.
  • a processor, a memory, and a shielding member for shielding the processor and memory may be disposed on the second surface of the printed circuit board, and the first connector is spaced apart from the shielding member and the second surface of the printed circuit board can be
  • a processor, a memory, and a shielding member for shielding the processor and memory may be disposed on the second surface of the printed circuit board, and at least a portion of the first connector may be disposed to overlap the shielding member.
  • first connector and the second connector may be a flexible printed circuit board (FPCB) allowing bending of at least a partial region.
  • FPCB flexible printed circuit board

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
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Abstract

Un dispositif électronique selon divers modes de réalisation décrits dans le présent document comprend : un premier dispositif ; un second dispositif situé de manière coulissante par rapport au premier dispositif ; une première carte de circuit imprimé ; une première partie électronique qui est agencée pour faire face à une première surface de la première carte de circuit imprimé et déplacée par coulissement du second dispositif ; une seconde partie électronique qui est agencée pour faire face à une seconde surface opposée à la première surface de la première carte de circuit imprimé et déplacée dans la direction opposée à la direction de déplacement de la première partie électronique par le coulissement du second dispositif ; une seconde carte de circuit imprimé qui est empilée sur la première surface de la première carte de circuit imprimé et comprend une troisième surface faisant face à la première surface de la première carte de circuit imprimé ; un premier connecteur électriquement connecté à la première partie électronique et connecté électriquement à la première surface de la première carte de circuit imprimé ; et un second connecteur connecté électriquement à la seconde partie électronique et connecté électriquement à la troisième surface de la seconde carte de circuit imprimé. Divers autres modes de réalisation sont possibles.
PCT/KR2021/013222 2020-09-28 2021-09-28 Dispositif électronique comprenant un dispositif d'affichage flexible et une carte de circuit imprimé WO2022065979A1 (fr)

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KR1020200126270A KR20220042892A (ko) 2020-09-28 2020-09-28 플렉서블 디스플레이 및 인쇄 회로 기판을 포함하는 전자 장치
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010154291A (ja) * 2008-12-25 2010-07-08 Nec Corp スライド型電子機器
KR20100136463A (ko) * 2008-03-11 2010-12-28 스미토모 베이클리트 컴퍼니 리미티드 커넥터 유닛 및 전자 기기
KR20190029215A (ko) * 2017-09-12 2019-03-20 삼성전자주식회사 인터포저를 포함하는 전자 장치
KR20190115888A (ko) * 2018-04-04 2019-10-14 삼성전자주식회사 무선 충전 모듈 및 플렉서블 디스플레이를 포함하는 전자 장치
KR20190128843A (ko) * 2018-05-09 2019-11-19 삼성전자주식회사 확장 가능한 화면 영역의 콘텐츠 표시 방법 및 이를 지원하는 전자 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100136463A (ko) * 2008-03-11 2010-12-28 스미토모 베이클리트 컴퍼니 리미티드 커넥터 유닛 및 전자 기기
JP2010154291A (ja) * 2008-12-25 2010-07-08 Nec Corp スライド型電子機器
KR20190029215A (ko) * 2017-09-12 2019-03-20 삼성전자주식회사 인터포저를 포함하는 전자 장치
KR20190115888A (ko) * 2018-04-04 2019-10-14 삼성전자주식회사 무선 충전 모듈 및 플렉서블 디스플레이를 포함하는 전자 장치
KR20190128843A (ko) * 2018-05-09 2019-11-19 삼성전자주식회사 확장 가능한 화면 영역의 콘텐츠 표시 방법 및 이를 지원하는 전자 장치

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