WO2022062959A1 - Dispositif de levage pouvant être commandé et pouvant effectuer des mesures de précision, et appareil de photolithographie le contenant - Google Patents

Dispositif de levage pouvant être commandé et pouvant effectuer des mesures de précision, et appareil de photolithographie le contenant Download PDF

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Publication number
WO2022062959A1
WO2022062959A1 PCT/CN2021/118176 CN2021118176W WO2022062959A1 WO 2022062959 A1 WO2022062959 A1 WO 2022062959A1 CN 2021118176 W CN2021118176 W CN 2021118176W WO 2022062959 A1 WO2022062959 A1 WO 2022062959A1
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WO
WIPO (PCT)
Prior art keywords
air
hole
fixed base
guide
guide rod
Prior art date
Application number
PCT/CN2021/118176
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English (en)
Chinese (zh)
Inventor
成荣
朱煜
张鸣
杨开明
刘相波
Original Assignee
清华大学
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Application filed by 清华大学 filed Critical 清华大学
Publication of WO2022062959A1 publication Critical patent/WO2022062959A1/fr

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece

Definitions

  • the invention relates to the technical field of lithography, in particular to a controllable lifting device with precise measurement and a lithography apparatus including the same.
  • the silicon wafer handover device of the lithography equipment cooperates with the transfer manipulator to realize the handover function of the silicon wafer.
  • the device used for controllable lifting and lowering of silicon wafers in lithography equipment is usually called E-pin.
  • the E-pin is installed on the wafer stage, and the lithography equipment needs to perform loading and unloading operations on the silicon wafer during operation.
  • the wafer is transferred to the set position by the robot, and the pin bar of the E-pin extends to remove the wafer from the robot, and then the pin bar retracts to place the wafer on the wafer stage.
  • the pin rod extends to lift the wafer from the wafer stage to the set height, and then is taken away by the robot. Therefore, E-pin not only needs a retractable function for lifting and lowering the silicon wafer, but also needs a function of position measurement to prevent the silicon wafer and components from being damaged due to improper lifting of the silicon wafer.
  • the present invention provides a controllable lifting device with precise measurement, including a fixed base, a guide seat, a moving component, and a driving component,
  • the fixed base is fixedly connected with the guide seat, and a guide sleeve with a vertical axis is installed on the fixed base,
  • the mobile components include:
  • the guide rod has a mounting hole coaxial with the guide sleeve at the upper end, the guide rod passes through the guide sleeve coaxially, and the upper part of the guide rod and the guide sleeve, the lower part of the guide rod and the fixed base and the guide seat form an air-floating contact surface ;
  • the magnetic steel, the magnetic steel and the lifting head are sequentially installed into the installation holes of the guide rod, so that the lifting head extends out of the upper end of the guide sleeve,
  • the drive components include:
  • the motor coil and the iron core, the iron core is coaxially arranged in the annular space between the guide rod and the guide sleeve, the motor coil is wound on the iron core,
  • an air hole penetrating to the upper end of the lifting head is coaxially opened in the center of the moving assembly, an air inlet hole and an air passage connecting the air inlet hole and the air hole are arranged on the guide rod, and an air hole is opened on the fixed base.
  • Air source hole and air outlet hole the air source hole is communicated with the air source, the air outlet hole is communicated with the air inlet hole on the guide rod through a hose, and the air source hole provides positive or negative pressure to the air hole gas.
  • the moving assembly further includes a first rubber ring, a support rod, and a fixing sleeve, and the fixing sleeve, the support rod, the first rubber ring, and the lifting head are sequentially connected and installed into the installation holes of the guide rod.
  • a cooling water groove for cooling the motor coil is opened on the fixed base, a cooling water fixing sleeve surrounds the periphery of the fixed base to seal the cooling water groove, and a cooling water groove is provided on the fixed base to communicate with the cooling water groove water inlet and outlet.
  • the fixed base is provided with a grating scale reading head mounting hole penetrating the fixed base to the guide rod, the grating scale reading head is installed on the fixed base through the grating scale reading head mounting hole, and the guide rod There is a grating ruler on it.
  • a vertical limit groove is provided on the guide rod
  • a limit rod installation hole is provided on the fixing base
  • the limit rod passes through the limit rod installation hole and is fixed to the guide seat by screw connection
  • the end of the limit rod passing through the guide seat is inserted into the limit groove, and the end of the limit rod passing through the guide seat is sleeved with a second rubber ring.
  • the guide rod is provided with two air inlet holes and air passages respectively communicated with the air holes by the air inlet holes, and two air source holes are opened on the fixed base, one air source hole is connected to the positive pressure The air source is communicated, and the other air source hole is communicated with the negative pressure air source.
  • the fixed base is also provided with two air outlet holes, and the two air outlet holes are respectively communicated with the corresponding air inlet holes on the guide rod through hoses.
  • the upper and lower ends of the magnetic steel are respectively provided with iron core disks, and an adjustment pad is also provided between the iron core disk at the upper end and the fixing sleeve.
  • the guide rod comprises a cylinder and a block coaxially connected under the cylinder, an air-floating contact surface is formed between the upper part of the cylinder and the guide sleeve, and the two opposite sides of the block are in contact with each other.
  • One side is formed by protruding a plurality of first vertical planes parallel to each other and the guide seat to form an air-floating contact surface, and the other side of the two opposite sides of the square body is formed by two relatively inclined extending first.
  • An air-floating contact surface is formed between the two vertical planes and the fixed base.
  • At least three positioning support rods extend from the fixed base, and coplanar positioning planes are formed at the ends of all positioning support rods, and positioning pin holes are provided on the positioning planes.
  • the present invention also provides a lithography apparatus, which includes a wafer-bearing stage for carrying silicon wafers, and also includes the above-mentioned controllable lifting device with precise measurement, wherein the controllable lifting device is installed on the wafer-bearing stage.
  • the first rubber ring prevents the silicon wafer from directly contacting the pin rigidly, prevents the silicon wafer from being damaged when it contacts the structural member with high rigidity, and can realize Rx, Ry, Z direction (the vertical direction is the Z axis) of Cartesian coordinates) minor adjustments to the degrees of freedom.
  • the rise and fall of the silicon wafer can be monitored in real time, and the position of the silicon wafer can be precisely controlled.
  • FIG. 1 is a front sectional view showing a controllable lifting device with precise measurement according to an embodiment of the present invention
  • FIG. 2 is a side cross-sectional view showing a controllable lifting device with precise measurement according to an embodiment of the present invention
  • FIG. 3 is a schematic structural diagram showing the connection between the lifting head, the first rubber ring and the support rod according to the embodiment of the present invention
  • FIG. 4 is a schematic diagram showing pores and air passages according to an embodiment of the present invention.
  • FIG. 5 is a perspective view showing a fixed base according to an embodiment of the present invention.
  • FIG. 6 is a perspective view showing a moving assembly according to an embodiment of the present invention.
  • FIG. 7 is a bottom view showing a controllable lift device with precise measurement according to an embodiment of the present invention.
  • the figure includes: lifting head 1, first rubber ring 2, support rod 3, fixing sleeve 4, E-pin guide rod 5, guide sleeve 6, adjusting pad 7, iron core plate 8, magnetic steel 9, cooling water fixing sleeve 10. Cooling water sealing ring 11, coil iron core 12, motor coil 13, fixed base 14, grating scale reading head 15, grating scale 16, guide seat 17, limit rod 18, limit rod second rubber ring 19, Flexible air pipe 20, air pipe joint 21, screw 22, limit slot 23, air hole 400, air intake hole 51, air passage 52, air outlet hole 141, screw hole 142, limit rod mounting hole 143, cylinder 55, block body 56 , a first vertical plane 300 , a second vertical plane 200 , a connecting vertical plane 561 , a positioning plane 147 , a positioning strut 146 , and a positioning pin hole 148 .
  • the controllable lifting device with precise measurement includes a fixed base 14, a guide base 17, a moving component, and a driving component, wherein the fixed base 14 is fixedly connected with the guide base 17, and FIG. 5 shows the fixed base A three-dimensional schematic diagram, wherein a screw hole 142 is processed on the fixing base 14 , and the guide base 17 is fixedly connected to the fixing base 14 through the screw hole 142 .
  • a guide sleeve 6 with a vertical axis is mounted on the fixed base 14 .
  • the moving assembly includes a lifting head 1, a guide rod 5, and a magnetic steel 9. The upper end of the guide rod 5 has a mounting hole coaxial with the guide sleeve 6.
  • the guide rod 5 passes through the guide sleeve 6 coaxially and penetrates into the fixed position. In the space enclosed by the base 14 and the guide seat 17 . An annular space is formed between the guide sleeve 6 and the guide rod 5 . Moreover, air-floating contact is formed between the guide rod 5 and the guide sleeve 6, the fixed base 14, and the guide seat 17 to limit the freedom of the guide rod 5 in five directions and retain its vertical freedom.
  • the air-floating contact means that there is a certain gap between the two contact surfaces, and there is air between the gaps, which makes the two contact surfaces have a certain guiding effect, and has the characteristics of small friction coefficient and smooth sliding. . Of course, the gap should not be too large, otherwise it will not play a guiding role.
  • the moving assembly also includes a first rubber ring 2, a support rod 3, and a fixed sleeve 4.
  • the lifting head 1 is connected with the first rubber ring 2
  • the first rubber ring 2 is connected with the support rod 3
  • the support rod 3 is connected with the fixing sleeve 4 below
  • the fixing sleeve 4 is installed in the mounting hole of the guide rod 5.
  • the function of the first rubber ring 2 is to ensure that the lifting head 1 can have certain flexibility in the Rx, Ry and Z directions.
  • the upper and lower ends of the magnetic steel 9 are provided with iron core disks 8 , and the function of the iron core disk 8 is to optimize the magnetic field of the magnetic steel 9 itself, so that the magnetic field lines in the magnetic steel 9 form a closed loop.
  • An iron core disc 8 is inserted into the mounting hole, then the magnetic steel 9 is inserted, and then the iron core disc 8 is inserted.
  • An adjustment pad 7 can also be arranged above the iron core disc 8, and the adjustment pad 7 is used to adjust the overall height. Then, install the fixing sleeve 4, the support rod 3, the first rubber ring 2, and the lifting head 1 into the installation holes in sequence.
  • the drive assembly includes a motor coil 13 and a coil iron core 12, and the guide sleeve 6 has an annular inner shoulder, so that an annular space with different gaps is formed between the guide rod 5 and the guide sleeve 6, and the upper annular space has a relatively larger gap.
  • the guide rod 5 and the guide sleeve are the air-floating contact surface
  • the lower annular space has a large gap
  • the coil iron core 12 is coaxially arranged in the lower annular space
  • the motor coil 13 is wound on the coil iron core 12.
  • the guide sleeve and the fixed base are provided with threading holes through which the two ends of the motor coil 13 are connected to the power supply.
  • an air hole 400 is coaxially opened in the center of the moving component, that is to say, the air hole 400 penetrates the lifting head 1, the first rubber ring 2, the support rod 3, the fixing sleeve 4, the adjustment pad 7, the iron The core disc 8 and the magnetic steel 9 enter the guide rod 5, and the air hole is closed at the lower end of the guide rod 5.
  • the air hole 400 is coaxially opened in the center of the moving component, that is to say, the air hole 400 penetrates the lifting head 1, the first rubber ring 2, the support rod 3, the fixing sleeve 4, the adjustment pad 7, the iron The core disc 8 and the magnetic steel 9 enter the guide rod 5, and the air hole is closed at the lower end of the guide rod 5.
  • An air inlet hole 51 and an air passage 52 connecting the air inlet hole 51 and the air hole 400 are provided on the guide rod 5 , and an air source hole is opened on the fixed base 14 , and the air source hole communicates with the air source , the fixed base is also provided with an air outlet 141, the air outlet 141 communicates with the air inlet 51 on the guide rod 5 through the flexible air pipe 20 and the air pipe joint 21, and provides positive pressure or pressure to the air hole 400 through the air source hole. Negative pressure gas.
  • the guide rod 5 is provided with two air inlet holes and air passages respectively communicated with the air holes by the air inlet holes, and two air source holes are opened on the fixed base, and one air source hole is connected with the positive air hole.
  • the pressure air source is connected, the other air source hole is connected with the negative pressure air source, and the fixed base is also provided with two air outlet holes, and the two air outlet holes are respectively connected with the air inlet holes on the guide rod 5 through the hose.
  • the air source holes can be processed at the bottom of the fixed base 14, respectively, to realize the functions of vacuum extraction and back blowing of the silicon wafer.
  • the fixing base 14 is provided with a cooling water groove for cooling the motor coil, and the cooling water fixing sleeve 10 seals the cooling water groove around the periphery of the fixing base.
  • the cooling water fixing sleeve 10 is connected to the fixing base 14 by screws 22 , and the fixing base 14 is provided with a water inlet and a water outlet communicating with the cooling water tank.
  • the cooling water fixing sleeve 10 is connected to the fixing base 14
  • Cooling water sealing rings 11 are installed on the upper and lower sides of the room to seal the cooling water.
  • a grating ruler reading head mounting hole is provided on the fixed base 14, and the grating ruler reading head 15 is installed on the fixed base 14 through the grating ruler reading head mounting hole, on the outer circumference of the guide rod 5.
  • a vertical grating ruler is provided, and the grating ruler reading head 15 can read the reading of the grating ruler 16 during the upward and downward movement of the guide rod 5 .
  • the guide rod 5 is provided with a vertical limit groove 23
  • the fixed base 14 is provided with a limit rod installation hole 143
  • the limit rod 18 passes through the limit rod installation hole 143 and passes through
  • the threaded connection is fixed on the guide seat 17, the end of the limit rod 18 passing through the guide seat 17 is inserted into the limit groove 23, and the end of the limit rod 18 passing through the guide seat 17 is sleeved with a limit rod
  • the second rubber ring 19 avoids the direct rigid contact between the limit rod 18 and the limit groove 23 of the guide rod, and at the same time acts as a limiter for the guide rod.
  • the guide rod 5 includes a cylinder 55 and a block 56 coaxially connected to the bottom of the cylinder, and an air-floating contact surface is formed between the upper part of the cylinder 55 and the guide sleeve 6,
  • One of the opposite sides of the block body 56 is formed by protruding a plurality of mutually parallel first vertical planes 300 and the guide seat 17 to form an air-floating contact surface.
  • two first vertical planes are used. towards plane 300.
  • this embodiment does not limit the number of the first vertical planes 300 , and may also be one.
  • the other side of the two opposite sides of the block body 56 forms an air-floating contact surface between the two second vertical planes 200 extending relatively obliquely and the fixed base.
  • the two second vertical planes 200 may also be vertical cut planes with different inclination angles.
  • the air-floating contact surface between the cylinder 55 and the guide sleeve can be only a part of the outer diameter of the cylinder and the guide sleeve for air-floating contact, while the outer diameter of other parts can be relatively reduced to make the sliding smooth. .
  • the outer diameter of the annular boss 100 is larger than the outer diameter of the cylinder 55 , and the annular boss 100 and the guide sleeve 6 are in air-floating contact.
  • the second vertical plane 200 may be two symmetrical vertical planes that are vertically cut from the horizontal ends of the side at a certain inclination angle, as shown in FIG.
  • a concave connecting vertical plane 561 is formed between the two second vertical planes 200.
  • the grating ruler 16 is installed on the connecting vertical plane 561, which can protect the grating scale from collision during the up and down movement. damage. This embodiment is not used to limit the number of the floating contact surfaces.
  • At least three positioning struts 146 extend from the fixed base 14 , the ends of all the positioning struts 146 are formed with coplanar positioning planes 147 , and positioning pin holes 148 are provided on the positioning planes 147 .
  • the fixing base 14 is mounted on the reference plane.
  • the present invention also provides a lithography apparatus, which includes a wafer-bearing stage for carrying silicon wafers, and also includes the above-mentioned controllable lifting device with precise measurement, wherein the controllable lifting device is installed on the wafer-bearing stage.
  • the assembled controllable lifting device is fixed on the reference plane through the positioning surface 147 on the fixed base 14 , and its position is fixed by the positioning pin through the positioning pin hole 148 processed on the fixed base 14 .
  • the lifting head 1 When working, when the silicon wafer needs to be removed from the fork manipulator, in order to prevent the silicon wafer from slipping off, the lifting head 1 provides back vacuum suction, so that the silicon wafer is adsorbed on the lifting head 1. When the silicon wafer is adsorbed on the lifting head 1
  • the motor coil 13 When the motor coil 13 is controlled, the motor coil 13 interacts with the magnetic force of the magnetic steel 9, so that the part of the guide rod 5 with the lifting head 1 moves down as a whole.
  • Real-time monitoring of the falling height of the silicon wafer when reaching the designated position, turn off the air source that provides the vacuum environment, and provide back blowing gas to the lifting head 1 to make the silicon wafer detach from the lifting head 1, and the detached silicon wafer will fall on the suction cup at this time. , and perform subsequent operations.
  • the air hole in the lift head 1 provides back vacuum suction again, and the silicon wafer is adsorbed on the lift head, and then through the interaction between the motor coil 13 and the magnetic steel 9, the lift 1 drives the silicon wafer The wafer moves upwards and reaches the designated position.
  • the wafer manipulator needs to remove the wafer, the back vacuum suction is stopped, and the wafer can be removed.
  • the device provides air-floating guide structure, cooling water cooling structure, limit structure and real-time position detection to ensure the smooth and safe process of the silicon wafer from the fork manipulator to the suction cup or from the suction cup to the fork manipulator. operation.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

L'invention concerne un dispositif de levage pouvant être commandé et pouvant effectuer des mesures de précision, ainsi qu'un appareil de photolithographie le contenant. Le dispositif comprend une base de fixation, une base de guidage, un ensemble de déplacement et un ensemble d'entraînement. La base de fixation est en liaison fixe avec la base de guidage. La base de fixation est pourvue d'une douille de guidage ayant un axe vertical. L'ensemble de déplacement comprend une tête de levage, une tige de guidage et un acier magnétique. Un trou de montage est disposé sur l'extrémité supérieure de la tige de guidage. La tige de guidage traverse la douille de guidage et forme des surfaces de contact à palier à air avec la douille de guidage, la base de fixation et la base de guidage. L'acier magnétique et la tête de levage sont successivement montés dans le trou de montage de la tige de guidage de telle sorte que la tête de levage dépasse de l'extrémité supérieure de la douille de guidage. L'ensemble d'entraînement comprend une bobine de moteur et un noyau de fer. Le noyau de fer est disposé dans l'espace annulaire situé entre la tige de guidage et la douille de guidage. La bobine de moteur est enroulée sur le noyau de fer. Un trou d'air est prévu au centre de l'ensemble de déplacement. La base de fixation fournit un gaz à pression positive ou à pression négative au trou d'air au moyen d'un passage d'air de la tige de guidage. Selon la présente invention, des surfaces de contact à palier d'air sont utilisées pour effectuer un guidage directionnel. Le frottement entre les pièces est réduit, aucune particule n'est générée, la précision de mouvement est améliorée, et les exigences de force d'entraînement du moteur sont réduites.
PCT/CN2021/118176 2020-09-28 2021-09-14 Dispositif de levage pouvant être commandé et pouvant effectuer des mesures de précision, et appareil de photolithographie le contenant WO2022062959A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202011040473.6 2020-09-28
CN202011040473.6A CN112051715A (zh) 2020-09-28 2020-09-28 带精密测量的可控升降装置以及包含其的光刻设备

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WO2022062959A1 true WO2022062959A1 (fr) 2022-03-31

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112051715A (zh) * 2020-09-28 2020-12-08 清华大学 带精密测量的可控升降装置以及包含其的光刻设备

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0129732A1 (fr) * 1983-06-15 1985-01-02 The Perkin-Elmer Corporation Ensemble de préhension pour le transport de plaquettes semi-conductrices
WO2005087969A1 (fr) * 2004-03-11 2005-09-22 Ulvac, Inc. Equipement d’alignement et equipement de formation de couche
CN109597279A (zh) * 2017-09-30 2019-04-09 上海微电子装备（集团）股份有限公司 真空吸附手、基底交接装置及光刻机
CN110824850A (zh) * 2018-08-10 2020-02-21 上海微电子装备（集团）股份有限公司 硅片交接机械手及硅片交接装置
CN112051715A (zh) * 2020-09-28 2020-12-08 清华大学 带精密测量的可控升降装置以及包含其的光刻设备

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0129732A1 (fr) * 1983-06-15 1985-01-02 The Perkin-Elmer Corporation Ensemble de préhension pour le transport de plaquettes semi-conductrices
WO2005087969A1 (fr) * 2004-03-11 2005-09-22 Ulvac, Inc. Equipement d’alignement et equipement de formation de couche
CN109597279A (zh) * 2017-09-30 2019-04-09 上海微电子装备（集团）股份有限公司 真空吸附手、基底交接装置及光刻机
CN110824850A (zh) * 2018-08-10 2020-02-21 上海微电子装备（集团）股份有限公司 硅片交接机械手及硅片交接装置
CN112051715A (zh) * 2020-09-28 2020-12-08 清华大学 带精密测量的可控升降装置以及包含其的光刻设备

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