WO2022062842A1

WO2022062842A1 - Sensor assembly and heat exchange device

Info

Publication number: WO2022062842A1
Application number: PCT/CN2021/115342
Authority: WO
Inventors: 万霞; 黄隆重; 黄宁杰
Original assignee: 杭州三花研究院有限公司
Priority date: 2020-09-26
Filing date: 2021-08-30
Publication date: 2022-03-31
Also published as: CN112432716A

Abstract

A sensor assembly, comprising a housing (20), a circuit assembly and a heat conducting member (13), wherein the housing (20) is provided with an inner cavity (30) and a through hole (220); the circuit assembly comprises a circuit board (14) and a first sensing portion (141) electrically connected to the circuit board (14); the housing (20) comprises a bottom wall (211), and at least part of the circuit board (14) is located on the side where an inner side surface (400) of the bottom wall (211) is located; the heat conducting member (13) comprises a first portion (131) and a second portion (132), the second portion (132) being located on the side where an outer side surface (300) of the bottom wall (211) is located; the first portion (131) extends toward the inner cavity (30) from the second portion (132); the bottom wall (211) is arranged around at least part of a peripheral wall of the first portion (131); and the first portion (131) is in direct contact with the first sensing portion (141), or the minimum distance between the first portion (131) and the first sensing portion (141) is L, and 0＜L≤5 mm. The sensor assembly is simple in overall structure, and has a good sensing effect for the surface temperature of an object to be measured. A heat exchange device having the sensor assembly is further disclosed.

Description

Sensor Assemblies and Heat Exchangers

This application claims the priority of the Chinese patent application filed on September 26, 2020 with the application number of 202011029216.2 and the invention-creation title of "sensor assembly and heat exchange device", the entire contents of which are incorporated into this application by reference .

technical field

The present application relates to the technical field of sensors, in particular to a sensor assembly and a heat exchange device.

Background technique

The fog sensing device in the related art is mainly used on the window glass, the temperature and humidity sensing module is installed on the surface of the flexible printed circuit board, and the temperature and humidity sensing module is integrated with a glass surface temperature sensor and a glass surface humidity sensor; flexible The printed circuit board is connected to the connection terminals provided on the base assembly, the base assembly is provided with a through hole, the temperature and humidity sensing module extends into the through hole, the casing covers the base assembly, and the base assembly is located between the casing and the flexible printed circuit board . The fog-sensing device can be attached to the window glass by means of an adhesive layer.

However, for the temperature and humidity sensing module, a flexible circuit board and an adhesive layer are also spaced between the temperature and humidity sensing module and the window glass. It is less effective at sensing the temperature of the window surface.

SUMMARY OF THE INVENTION

The present application provides a sensor assembly with a good effect of sensing the surface temperature of an object to be measured, and a heat exchange device having the sensor assembly.

A first aspect of the present application provides a sensor assembly, the sensor assembly includes a casing, a circuit assembly and a heat-conducting member; the casing has an inner cavity, and the outer casing is further provided with a through hole communicating with the inner cavity;

The circuit assembly includes a circuit board and a first sensing part; the first sensing part is electrically connected to the circuit board; the first sensing part is used for sensing the surrounding environment of the first sensing part temperature; wherein, the first sensing part and at least part of the circuit board are accommodated in the inner cavity;

The housing includes a bottom wall, the bottom wall has an inner surface and an outer surface respectively located on opposite sides in the thickness direction thereof, the at least part of the circuit board is located on the side where the inner surface of the bottom wall is located; The first part and the second part are connected, and the second part of the heat-conducting member is located on the side where the outer surface of the bottom wall is located; extending in a direction; the bottom wall is disposed around at least a portion of the peripheral wall of the first portion;

Wherein, the first portion of the heat conducting member is in direct contact with the first sensing portion, or the minimum distance between the first portion of the heat conducting member and the first sensing portion is L, and 0<L ≤5mm.

A second aspect of the present application further provides a heat exchange device, comprising a heat exchanger and at least one sensor assembly described above, the heat exchanger comprising at least one header, a plurality of heat exchange tubes and at least one fin , the heat exchange tube is fixed with the collector tube, the inner cavity of the heat exchange tube is communicated with the inner cavity of the collector tube; the fins are located between two adjacent heat exchange tubes;

The sensor assembly is fixed to the heat exchanger, and the second portion of the heat-conducting member is in direct contact with at least part of the surface of the fin and/or the surface of the heat exchange tube or is disposed adjacent to it.

In the sensor assembly provided by the present application, the second portion of the heat-conducting member is located on the side of the outer surface of the bottom wall away from the inner cavity, so that the second portion of the heat-conducting member can be closer to the surface of the object to be detected. A sensing part is in direct contact, or the minimum distance L between the first part of the heat-conducting member and the first sensing part satisfies 0<L≤5mm, so that the first sensing part can obtain a more accurate measurement of the object to be detected. The surface temperature, accordingly, helps to improve the accuracy of the frost determination of the object to be inspected.

Description of drawings

FIG. 1 is a schematic three-dimensional structure diagram of a sensor assembly of the present application in one embodiment;

FIG. 2 is a perspective exploded view of the sensor assembly in FIG. 1 of the application;

FIG. 3 is a perspective exploded view of the sensor assembly in FIG. 1 of the application;

FIG. 4 is a three-dimensional cross-sectional structural schematic diagram of the sensor assembly of the present application;

5 is a schematic diagram of a connection method between the circuit board of the sensor assembly and the heat conducting member of the present application;

6 is a schematic diagram of another connection method between the circuit board of the sensor assembly and the heat conducting member of the present application;

7 is a schematic structural diagram of a first shell of the sensor assembly of the present application;

FIG. 8 is a schematic diagram of the assembly structure of the first shell and the heat conducting member of the sensor assembly of the present application;

9 is a schematic cross-sectional structure diagram of FIG. 8 of the application along the A-A direction;

FIG. 10 is a schematic view of the structure of the second shell of the sensor assembly of the present application;

FIG. 11 is a schematic structural diagram of another viewing angle of the second shell of the sensor assembly of the present application;

FIG. 12 is a schematic diagram of another three-dimensional cutaway structure of the sensor assembly of the present application;

13 is a schematic diagram of the assembly structure of the second shell and the circuit board of the present application;

FIG. 14 is a schematic three-dimensional structure diagram of a filter part of the present application;

15 is a schematic three-dimensional structure diagram of the heat exchange device of the present application;

FIG. 16 is a schematic diagram of a partial three-dimensional cutaway structure of the heat exchange device of FIG. 15 of the application.

detailed description

The exemplary embodiments of the present application will be described in detail below with reference to the accompanying drawings. If several specific embodiments exist, the features of these embodiments may be combined with each other without conflict. When the description refers to the drawings, the same numbers in different drawings refer to the same or similar elements unless otherwise indicated. What is described in the following exemplary embodiments does not represent all embodiments consistent with the present application; rather, they are merely consistent with some aspects of the present application as recited in the claims of the present application Examples of devices, products and/or methods.

The terms used in this application are only for the purpose of describing specific embodiments, and are not intended to limit the protection scope of this application. As used in the specification and claims of this application, the singular forms "a," "the," or "the" are intended to include the plural forms as well, unless the context clearly dictates otherwise.

It should be understood that words such as "first", "second" and similar words used in the description and claims of the present application do not indicate any order, quantity or importance, but are only used to distinguish the naming of features . Likewise, "a" or "an" and the like do not denote a quantitative limitation, but rather denote the presence of at least one. Unless otherwise specified, words such as "front", "rear", "left", "right", "upper", "lower" and other similar words appearing in this application are only for the convenience of description, and are not limited to a specific position or a type of spatial orientation. "includes" or "comprising" and the like are open-ended expressions, meaning that elements appearing before "including" or "including" encompass elements appearing after "including" or "including" and their equivalents, This does not exclude that elements appearing before "including" or "comprising" can also include other elements. In this application, if "several" appears, it means two or more.

The water vapor content in the air remains unchanged and the air pressure is kept constant, and the temperature when the air is cooled to saturation is called the dew point temperature. During the working process of the heat exchanger, when the surface temperature of the heat exchanger is lower than the dew point temperature and the ambient temperature is lower than When the temperature is zero, frost will occur in the heat exchanger, and the frost layer will cover the surface of the heat exchanger, such as the surface of the heat exchange tube and the surface of the fin, etc. The frost layer not only increases the structural participation of the heat exchange tube and fin, etc. The thickness of the heat exchange wall also easily blocks the gaps between adjacent heat exchange tubes, resulting in a reduction in the air circulation area, which reduces the overall heat exchange capacity of the heat exchanger and affects the working efficiency of the thermal management system.

In the related art, it is determined whether the heat exchanger will be frosted by comparing the temperature of the surface of the heat exchanger with the preset temperature. However, due to the environment in which the heat exchanger is located, the temperature of the air and the water vapor in the air The content is not a definite value, but is in a state of dynamic change. Therefore, the dew point temperature of the environment is also changing all the time. It is easy to judge whether the heat exchanger is about to frost by comparing with the preset value, that is, it may be in the The defrosting mode of the thermal management system is turned on when the heat exchanger does not need to be frosted, resulting in an increase in the energy consumption of the thermal management system. Therefore, how to accurately detect the surface temperature of the heat exchanger and the dew point temperature of the environment is more important.

The present application provides a sensor assembly with a compact and simple structure. In some embodiments, the sensor assembly can detect ambient temperature, ambient humidity and the surface temperature of the object to be measured at the same time, so as to facilitate the work of the sensor assembly itself or in a thermal management system The controller can more accurately judge whether the heat exchanger is about to frost. Please refer to FIG. 1 and FIG. 2 , a sensor assembly 10 provided by the present application includes a housing 20 , a circuit assembly and a heat conducting member 13 . The outer casing 20 has an inner cavity 30 , and the outer casing 20 is further provided with a through hole 220 connecting the inner cavity 30 and the outside.

The circuit assembly includes the circuit board 14 , the first sensing part 141 and the second sensing part 142 . At least part of the circuit components are accommodated in the inner cavity 30 , wherein the first sensing part 141 and at least part of the circuit board 14 are accommodated in the inner cavity 30 . In the embodiment provided in this application, the circuit board 14 , the second sensing portion 142 and the first sensing portion 141 are all accommodated in the inner cavity 30 . In some other embodiments, the second sensing part 142 and part of the circuit board 14 may be located outside the inner cavity 30 . Or in some other embodiments, the sensor assembly 10 may not have the second sensing portion 142 .

Both the second sensing portion 142 and the first sensing portion 141 are electrically connected to the circuit board 14 . The second sensing part 142 is used to sense at least one of temperature and humidity of the environment around the second sensing part 142 , and the first sensing part 141 is used to sense the temperature of the environment around the first sensing part 141 . The sensor assembly 10 can generate a corresponding signal based on the temperature sensed by the first sensing part 141 (for example, a corresponding temperature signal is generated by conversion, calculation, etc.). The sensor assembly 10 can generate a corresponding signal based on the temperature and/or humidity sensed by the second sensing part 142 (eg, generate a corresponding temperature and/or humidity signal through conversion, calculation, etc.). In a specific embodiment of the present application, the second sensing part 142 integrates both temperature sensing and humidity sensing functions, which can sense the temperature and humidity of the air entering the inner cavity 30 . 4 , 5 and 6 , the first sensing part 141 can be a sensing unit with a temperature sensing function, which can sense the temperature of its surrounding environment. The first sensing portion 141 and the second sensing portion 142 may be sensing chips that are independent of each other and mounted on the circuit board 14 . In the illustrated embodiment, the first sensing portion 141 and the second sensing portion 142 use surface soldering technology. (SMT) surface welding and on the circuit board 14, the first sensing part 141 and the second sensing part 142 of the surface welding technology are small in volume, which is conducive to the miniaturization of the product, and is conducive to the realization of automatic welding, simplifying the processing and preparation difficulty.

2, 4 and 9, the housing 20 includes a bottom wall 211 having an inner side surface 300 and an outer side surface 400 located on opposite sides in the thickness direction thereof, respectively, the inner side surface 300 is disposed toward the inner cavity 30, and the outer side surface 400 is away from The inner cavity 30 is provided, and at least part of the circuit board 14 is located on the side where the inner surface 300 of the bottom wall 211 is located. The thermally conductive member 13 includes a first portion 131 and a second portion 132 . The first portion 131 of the thermally conductive member 13 is closer to the inner cavity 30 than the second portion 132 , and the second portion 132 of the thermally conductive member 13 is located on the side where the outer surface 400 of the housing 20 is located. . For the boundary line between the first portion 131 and the second portion 132 of the thermally conductive member 13 , reference may be made to the dotted line in FIG. 4 .

In an embodiment provided in the present application, the housing 20 is provided with a cavity 24 , specifically, the cavity 24 is provided on the bottom wall 211 , and the inner surface 300 of the housing 20 facing the inner cavity 30 is provided with a first cavity 241 . The outer side surface 400 of the 20 away from the inner cavity 30 is provided with a second cavity opening 242 . The first cavity 241 and the second cavity 242 are located on both sides of the cavity 24 respectively. That is, the cavity 24 penetrating the shell of the housing 20 is formed between the first cavity 241 and the second cavity 242 . The cavity 24 may be formed by providing a through hole penetrating the housing 20 . The cross section of the through hole, that is, the cross section of the cavity 24 may be circular, oval, rectangular or other irregular shapes. The first portion 131 of the thermally conductive member 13 is at least partially accommodated in the cavity 24 and the first portion 131 is located on the side of the second cavity opening 242 close to the inner cavity 30 , and the second portion 132 of the thermally conductive member 13 is located away from the second cavity opening 242 one side of cavity 30 . During assembly, the heat-conducting member 13 can extend into the cavity 24 from the side where the cavity 30 is located, and is finally fixed with the housing 20. The first portion 131 of the heat-conducting member 13 can be completely located in the cavity 24, and the first portion 131 of the heat-conducting member 13 can be completely located in the cavity 24. One part 131 may also be partially located in the cavity 24 and partially located in the inner cavity 30 .

Specifically, as shown in FIG. 9 , the first portion 131 of the thermally conductive member 13 includes a top portion 136 and a first cylindrical portion 137 . The second portion 132 of the thermally conductive member 13 includes a second cylindrical portion 138 and a tip portion 139 . The first column portion 137 is connected between the top end portion 136 and the second column portion 138 , and the second column portion 138 is connected between the first column portion 137 and the end portion 139 . The first cylindrical portion 137 and the second cylindrical portion 138 may be cylindrical, the top portion 136 may also be cylindrical, and the size of the end portion 139 may be gradually reduced from the side connected to the second cylindrical portion 138 , thereby The tip portion 139 has a relatively sharp free end so that when the sensor assembly 10 is applied to a heat exchanger, the tip portion 139 can be more easily inserted into the slits of the fins of the heat exchanger. The radial dimension of the first cylindrical portion 137 and the radial dimension of the second cylindrical portion 138 may be equal, and both are smaller than the radial dimension of the top portion 136 , which is larger than the diameter of the cavity 24 . to size. In this way, after the heat-conducting member 13 is assembled with the housing 20 , the top portion 136 and the casing around the cavity 24 can be positioned along the assembly direction, and the heat-conducting member 13 will not come out of the cavity 24 . The radial dimension of the first cylindrical portion 137 may be slightly smaller than the radial dimension of the cavity 24 , and the first cylindrical portion 137 and the bottom wall 21 may be in a clearance fit relationship. In addition, an interference fit or an interference fit may also be adopted between the first cylindrical portion 137 and the bottom wall 21 , and in this case, the first cylindrical portion 137 can at least partially fill the cavity 24 .

In other embodiments of the present application, the cavity 24 may not be provided, and at least part of the shell of the outer shell 20 may be manufactured by injection molding, that is, at least part of the shell of the outer shell 20 may be injection-molded with the heat-conducting member 13 as an injection-molded insert Insert molding, so that at least part of the shell of the housing 20 and the heat conducting member 13 are integrated into a structure. The stability of the connection between the housing 20 and the heat-conducting member 13 is facilitated.

The first portion 131 of the thermally conductive member 13 is in direct contact with the first sensing portion 141 . Specifically, as shown in FIG. 5 , the top end portion 136 of the first portion 131 is away from the end face of the first cylindrical portion 137 and the first sensing portion 141 . The direct contact between the parts 141 is beneficial for the surface temperature of the object to be measured to be transmitted to the first sensing part 141 through the end part 139 of the heat conducting member 13 through the second cylinder part 138, the first cylinder part 137 and the top part 136, so that the first The temperature sensed by a sensing portion 141 is closer to the surface temperature of the object to be tested.

Of course, the first portion 131 of the heat-conducting member 13 may not be in direct contact with the first sensing portion 141, and the two may be disposed close to each other with a certain distance, or other thermally conductive materials may be passed between the two. Materials such as thermally conductive paste 40 enable indirect thermal contact. The minimum distance L between the first portion 131 of the thermally conductive member 13 and the first sensing portion 141 satisfies 0<L≤5mm. Generally speaking, the heat-conducting member 13 is usually made of metal, while the size of the first sensing portion 141 is small, and the metal pins of the first sensing portion 141 need to be welded to the circuit board 14 , and the circuit board 14 itself is usually also mounted with There are many metal circuit components, such as pads, leads, etc., if the thermally conductive member 13 is in direct contact with the first sensing portion 141, there are metal pins between the thermally conductive member 13 and the first sensing portion 141 and the circuit board 14. The risk of short circuit caused by the direct connection of metal components, etc., therefore, when assembling the sensor assembly, it can be considered that the minimum distance L between the first portion 131 of the heat conducting member 13 and the first sensing portion 141 satisfies 0<L≤5mm, so that a On the one hand, the reliability of safe use of the product is improved, and on the other hand, it is avoided that the minimum distance L is too large to affect the accuracy of temperature sensing by the first sensing part 141 . In some embodiments, the minimum distance L between the first portion 131 of the thermally conductive member 13 and the first sensing portion 141 satisfies 0.2 mm≤L≤0.5 mm. The relatively close distance between the first portion 131 of the thermally conductive member 13 and the first sensing portion 141 can reduce heat loss as much as possible and improve the accuracy of temperature sensing by the first sensing portion 141 .

Referring to the exploded view shown in FIG. 2 and FIG. 4 , the sensor assembly 10 further includes a thermally conductive adhesive 40 , and the thermally conductive adhesive 40 is at least partially located on the side where the second side 149 of the circuit board 14 is located. A sensing portion 141 and the first portion 131 of the thermally conductive member 13 are bonded and fixed by the thermally conductive adhesive 40 . The thermally conductive adhesive 40 is a non-conductive material, and the thermal conductivity of the thermally conductive adhesive 40 is relatively good. The thermally conductive adhesive 40 includes a polymer bonding material and a thermally conductive material, and the bonding material and the thermally conductive material are mixed with each other. The polymer bonding material is filled with the thermally conductive material, and the thermally conductive adhesive 40 is at least partially located between the first sensing portion 141 and the first portion 131, so as to avoid the first sensing portion 141 and the first portion 131 is in direct contact to reduce the risk of short circuit, and the thermal conductive adhesive 40 can improve the stability of the relative position between the first sensing part 141 and the first part 131, so that the minimum distance L between the two is not too far to meet the requirements, and also not in direct contact.

The material of the thermally conductive member 13 can be selected from a metal material. Of course, in other embodiments, the material of the thermally conductive member 13 can also be selected from a non-metallic material. For example, the thermally conductive member 13 is a thermally conductive aluminum column, or the thermally conductive member 13 can be made of graphene and filled with nitrogen. Thermally conductive rubber of ceramic particles such as boron, alumina, etc.

Referring to FIGS. 2 , 5 and 6 , the circuit board 14 has a first side 148 and a second side 149 on opposite sides in the thickness direction thereof. At least part of the second sensing part 142 and the through hole 220 are located on the side where the first side surface 148 is located, and at least part of the first sensing part 141 and the cavity 24 are located on the side where the second side surface 149 is located. That is to say, the second sensing portion 142 and the first sensing portion 141 may be located on opposite sides of the circuit board 14 in the thickness direction, respectively, and the second sensing portion 142 may be disposed closer to the through hole 220 . In this way, the second sensing portion 142 Temperature and/or humidity in the environment can be sensed more accurately. The first sensing portion 141 may be disposed closer to the cavity 24 , so that the first sensing portion 141 and the heat conducting member 13 are close to each other, and the temperature sensed by the first sensing portion 141 is closer to the temperature transmitted by the heat conducting member 13 . In addition, the temperature of the surrounding environment of the first sensing portion 141 is isolated from the second sensing portion 142 by the circuit board 14. The circuit board 14 may be a poor thermal conductor, which is beneficial to increase the surface temperature of the object to be measured by the first sensing portion 141. The accuracy of the measurement is not easy to transfer heat to the second sensing part 142 , and the ambient temperature sensed by the second sensing part 142 is also relatively more accurate.

Referring to FIGS. 1 , 2 , 3 , 7 , 8 and 9 , the housing 20 includes a first case 21 and a second case 22 . Both the first shell 21 and the second shell 22 can be made of plastic material, which is not only convenient for processing, but also can reduce costs, and the plastic material also has good heat insulation ability, which can play a role in isolating the heat of the object to be tested, such as a heat exchanger. . In the direction along the height H of the sensor assembly 10 , the second shell 22 is above the first shell 21 , and the inner cavity 30 is located between the first shell 21 and the second shell 22 . The first shell 21 and the second shell 22 may each have a portion of the inner cavity 30 , or only one of the two shells may have the inner cavity 30 . In a specific embodiment, the first shell 21 includes a bottom wall 211 and several side walls 212 , the side walls 212 extend from the bottom wall 211 to the second shell 22 , and the side walls 212 may be perpendicular to the bottom wall 211 . The second shell 22 is fixed to the side wall 212 of the first shell 21 . The first shell 21 and the second shell 22 can be fixedly connected, such as by laser welding or thermal fusion welding, or can be detachably connected by means of snaps or the like. The circuit board 14 is fixedly mounted on the first shell 21 , the bottom wall 211 of the first shell 21 is located on the side where the second side 149 of the circuit board 14 is located, and the second shell 22 is located on the side where the first side 148 of the circuit board 14 is located.

The first shell 21 is provided with a stepped portion 214 . The stepped portion 214 protrudes from the bottom wall 211 toward the side close to the circuit board 14 . At least a part of the stepped surface 2141 of the stepped portion 214 is in contact with the second side surface 149 of the circuit board 14 , so that the circuit board 14 can be supported on the stepped portion 214 for easy installation. The stepped portion 214 is disposed around the thermally conductive adhesive 40 , and the circuit board 14 and the bottom wall 211 are bonded and fixed by the thermally conductive adhesive 40 . The stepped portion 214 can form a circumferentially closed structure around the thermally conductive adhesive 40 . The stepped portion 214 is conducive to applying glue at the bottom wall 211 of the first shell 21 , and can ensure a certain glue thickness, so as not to make the circuit board 14 press down. During the process, the thermal conductive adhesive 40 is extruded to affect the fixing strength between the circuit board 14 and the bottom 211 of the first shell 21 .

In order to facilitate the positioning of the heat conducting member 13 , the first shell 21 is further provided with a boss portion 215 . The boss portion 215 protrudes from the bottom wall 211 to the side close to the inner cavity 30 , and the boss portion 215 circumferentially surrounds the heat conducting member 13 . The top end portion 136 is provided.

Referring to FIG. 4 , FIG. 10 , FIG. 11 and FIG. 12 , the through hole 220 is provided in the second shell 22 , the number of the through hole 220 is at least one, and the second sensing portion 142 and the through hole 220 are along the thickness of the circuit board 14 . In the direction, at least part of the area is relatively set. In this way, the air entering the inner cavity 30 from the through hole 220 can reach the second sensing portion 142 more quickly, which is beneficial to improve the sensing accuracy of the second sensing portion 142 .

The sensor assembly 10 further includes a filter part 50, and the filter part 50 is bonded with the second shell 22. Referring to FIG. 14, the filter part 50 has an edge area 501 and a center filter area 502. The part 50 can be in the shape of a film, and the shape of the filter part 50 can be a rectangle, a circle, an ellipse, or other anomalous shapes. The edge area 501 of the filter part 50 is bonded to the second shell 22 , and the central filter area 502 of the filter part 50 is at least partially covered on the side of the through hole 220 close to the second sensing part 142 , or the center of the filter part 50 At least a part of the filter area 502 is covered on a side of the through hole 220 away from the second sensing portion 142 . In the present application, it is exemplified that the filter part 50 is entirely located inside the second shell 22 close to the cavity 30 . The central filter area 503 of the filter part 50 may have several small holes, the pore size of the small holes can block solid or liquid foreign matter, and only allow gaseous matter to enter the inner cavity 30, and the filter part 50 may be a waterproof and dustproof breathable membrane.

For example, when the heat exchange device assembled with the sensor assembly 10 and the heat exchanger is installed in an environment such as a vehicle, in rainy days, car washing or some wading scenarios, there will be more liquid water in the vicinity of the sensor assembly 10. If When the liquid water enters the cavity 30 through the through hole 220, when the second sensing part 142 senses the humidity around it, the measurement result will be larger based on the factor of the liquid water, which will affect the accuracy of calculating the dew point temperature. Therefore, arranging the filter part 50 near the through hole 220 can reduce the influence of the local sudden humidity environment on the accuracy of the real humidity detection in the air environment. Solid foreign objects are generally dust, impurities and other substances, and liquid foreign objects can be water droplets, other liquid fluids, etc., which can improve the impact on the detection of the second sensing portion 142 and help prolong the sensing portion of the second sensing portion 142. Test life.

In some embodiments provided in the present application, the second shell 22 includes a base portion 221 and a cap 222 protruding from the base portion 221 to a side away from the inner cavity 30 . The through hole 220 is disposed through the base 221 , the cap 222 has a first sub-cavity 224 and an opening 225 communicating with the first sub-cavity 224 , the first sub-cavity 224 communicates with the through hole 220 , and the opening direction of the opening 225 is the axis of the through hole 220 . direction does not coincide. The axial direction of the through hole 220 may be generally disposed along the height H direction of the sensor assembly 10 . The opening direction of the opening 225 may be perpendicular to the height H direction of the sensor assembly 10 and be horizontally arranged. The cap 222 has a certain protective effect on the filter part 50 . In this way, a strong water flow such as rainwater or car washing water can be prevented from washing away the membrane-like filter part 50 and affecting the measurement accuracy of temperature and humidity.

As shown in FIGS. 2 , 3 and 12 , the first side surface 148 of the circuit board 14 is further provided with a number of circuit elements 143 that are electrically connected to the circuit board 14 . In some embodiments, the circuit elements 143 may include a control computing unit, The control computing unit can be a single chip microcomputer, and the control computing unit is installed on the circuit board 14. The control computing unit can enable the sensor assembly 10 to have the ability to process data autonomously, making the sensor assembly more intelligent. The circuit element 143 can connect the second sensing part 142 and the first The electricity generated by a sensing part 141 is converted into more intuitive and easy to identify, such as numbers. In a specific embodiment, the control and calculation unit can directly output the ambient temperature, ambient humidity and objects to be tested such as heat exchange tubes and /or the data of the surface temperature of the fins, or the dew point temperature can be obtained by calculating the ambient temperature and ambient humidity sensed by the second sensing part 142 through the control and calculation unit, and the dew point temperature can be compared with the first sensing part 141 The sensed surface temperatures of the heat exchange tubes and/or fins are compared, and the output can be a judgment result of whether the heat exchange tubes and/or fins are frosted, or a work instruction that needs to adjust the working state of the heat exchanger .

The second shell 22 is provided with a partition 226 , and the partition 226 protrudes from the base 221 to the side close to the inner cavity 30 . The free end of the spacer 226 away from the base 221 is in contact or clearance fit with the circuit board 14 . At least a part of the circuit element 143 and the second sensing part 142 are separated from each other by the spacer 226 . That is to say, at least some of the circuit elements 143 and the second sensing portion 142 are located on opposite sides of the separator 226 in the thickness direction, respectively.

The spacer 226 separates at least part of the circuit elements 143 from the second sensing part 142. Some circuit elements 143 may generate heat during operation. The spacer 226 can reduce the heat generated by the circuit elements 143 during operation and directly transfer to The possibility of the location of the second sensing portion 142 further reduces the influence of the heat generated by the circuit element 143 such as the control computing unit on the detection result of the second sensing portion 142, and improves the accuracy of the detection result.

The partition plate 226 can circumferentially surround some of the circuit elements 143 that generate more heat, and the partition plate 226 can be provided with a gap 2261 . In some embodiments, the sensor assembly 10 further has a wire portion 145 adapted to the wire harness fitting hole 223 , the wire portion 145 is electrically connected to the circuit board 14 , and the wire portion 145 extends into the second shell 22 away from the inside of the second housing 22 through the wire harness fitting hole 223 . outside of cavity 30 . A part of the wire portion 145 may be located in the notch 2261 . Referring to FIGS. 12 and 13 , the wire portion 145 may extend from the circuit board to the outside of the second shell 22 through the notch 2261 and the wire harness fitting hole 223 . The root portion of the lead portion 145 may be located on both sides in the thickness direction of the spacer 226 with the part of the circuit element 143 .

7, the first shell 21 is further provided with at least one pin 26, the pin 26 extends from the bottom wall 221 to the side away from the inner cavity 30, and at least part of the surface of the pin 26 forms a plurality of convex serrated structures. The extension direction of the pin 26 is the same as that of the second portion 132 of the heat conducting member 13 .

During processing, the pins 26 may be integrally formed with the second shell 21 of the housing 20 , or the pins 26 and the second shell 21 may be assembled and fixed after being formed separately. The second portion 132 and the pins 26 of the heat-conducting member 13 are arranged at intervals along the length direction of the bottom wall 221 , and the second portion 132 and the pins 26 of the heat-conducting member 13 may be distributed in a straight line. In some specific implementations, the first shell 21 may be provided with a plurality of pins 26, and each pin 26 and the second portion 132 may be arranged in one direction, which facilitates the relative fixation of the positions of the sensor assembly 10 and the heat exchanger.

Referring to FIGS. 15 and 16 , an embodiment of the present application further provides a heat exchange device 100, including a heat exchanger 101 and at least one sensor assembly 10 in the above-mentioned embodiments, the heat exchanger 101 includes at least one One header 102, a plurality of heat exchange tubes 103 and at least one fin 104, the heat exchange tube 101 is fixed with the header 102, the inner cavity of the heat exchange tube 101 communicates with the inner cavity of the header 102, and the fins 104 is located between two adjacent heat exchange tubes 103 .

The sensor assembly 10 is fixed to the heat exchanger 101 , and the second portion 132 of the heat-conducting member 13 is in direct contact with the surface of the fin 104 and/or the surface of the heat exchange tube 103 at least in part or is disposed adjacent thereto. The "adjacent arrangement" refers to that the second portion 132 of the heat element 13 may not be in direct contact with the surface of the fin 104 and/or the surface of the heat exchange tube 103 . Taking the fin 104 as an example, the second portion 132 of the heat conducting member 13 may be adjacent to the fin 104, and the minimum distance between the two may be greater than 0 and less than or equal to 5 mm. At this time, the heat of the fins 104 may be transferred through air or indirectly through a thermally conductive material, and finally the heat is transferred to the thermally conductive member 13 . Correspondingly, the thickness of the thermally conductive material may be less than or equal to 5 mm, and the thermally conductive material may be thermally conductive glue.

Specifically, the fins 104 may be corrugated fins, the sensor assembly 10 may extend into the gaps of the fins 104 through the pins 26 thereof, and the second portion 132 of the heat conducting member 13 may also extend into the gaps of the fins 104 . The heat exchange tube 103 may be a microchannel flat tube, and the length of the second portion 132 may be greater than, equal to or less than the width of the heat exchange tube 103 . Of course, the second portion 132 of the heat-conducting member 13 may also be in direct contact with the surface of the heat exchange tube 103 to detect the surface temperature of the heat exchange tube 103 .

In some other embodiments, the sensor assembly 10 provided in this application can also be used to sense the surface temperature of other products, or to determine whether other products are frosted, and is not limited to the application scenario of the heat exchanger 101, such as this The sensor assembly 10 provided by the application can also be combined with the window glass of the vehicle, so as to sense and determine whether the window glass is frosted.

The above embodiments are only used to illustrate the present application rather than limit the technical solutions described in the present application. The understanding of this specification should be based on those skilled in the art, such as "front", "rear", "left", " Directional descriptions such as "right", "up", "down", etc., although this specification has described the application in detail with reference to the above-mentioned embodiments, those of ordinary skill in the art should understand that those skilled in the art The application can still be modified or equivalently replaced, and all technical solutions and improvements that do not depart from the spirit and scope of the application should be covered within the scope of the claims of the application.

Claims

A sensor assembly, characterized in that the sensor assembly comprises a casing (20), a circuit assembly and a heat conducting member (13); the casing (20) has an inner cavity (30), and the casing (20) is further provided with a through hole (220) communicating with the inner cavity (30);

The circuit assembly includes a circuit board (14) and a first sensing part (141); the first sensing part (141) is electrically connected to the circuit board (14); the first sensing part ( 141) for sensing the temperature of the environment around the first sensing part (141); the first sensing part (141) and at least part of the circuit board (14) are both accommodated in the inner cavity (30);

The housing (20) includes a bottom wall (211), the bottom wall (211) has an inner side surface (300) and an outer side surface (400) on opposite sides in the thickness direction thereof, the at least part of the circuit board ( 14) Located on the side where the inner side surface (300) of the bottom wall (211) is located; the thermally conductive member (13) includes a first portion (131) and a second portion (132), the first portion of the thermally conductive member (13) is The second part (132) is located on the side where the outer surface (400) of the bottom wall (211) is located; the first part (131) of the heat conducting member (13) approaches the inner part from the second part (132). the direction of the cavity (30) extends; the bottom wall (211) is arranged around at least part of the peripheral wall of the first part (131);

Wherein, the first portion (131) of the heat-conducting member (13) is in direct contact with the first sensing portion (141), or the first portion (131) of the heat-conducting member (13) is in direct contact with the first sensing portion (141). The minimum distance between the sensing parts (141) is L, and 0<L≤5mm.
The sensor assembly according to claim 1, wherein the bottom wall (211) is provided with a cavity (24) and a first cavity (241) and a second cavity (242) located on both sides of the cavity (24) , the first cavity (241) is provided on the inner surface (300) of the bottom wall (211), and the second cavity (242) is provided on the outer surface (400) of the bottom wall (211) ; the first part (131) of the heat conducting member (13) is at least partially accommodated in the cavity (24) and the first part (131) is located at the second cavity opening (242) close to the inner cavity On one side of (30), the second portion (132) of the heat conducting member (13) is located on the side of the second cavity opening (242) away from the inner cavity (30).
The sensor assembly according to claim 2, wherein the first portion (131) of the thermally conductive member (13) comprises a top portion (136) and a first cylindrical portion (137), and the first portion (131) of the thermally conductive member (13) The second part (132) includes a second cylinder part (138) and a tip part (139); the first cylinder part (137) is connected to the top part (136) and the second cylinder part (138) ), the second cylinder part (138) is connected between the first cylinder part (137) and the end part (139);

The top end portion (136) is accommodated in the inner cavity (30), and the first cylinder portion (137) is accommodated in the cavity (24); the radial direction of the first cylinder portion (137) Both the size and the radial size of the second cylindrical body portion (138) are smaller than the radial size of the top end portion (136), and the radial size of the top end portion (136) is larger than that of the cavity (24). Radial dimension.
The sensor assembly according to claim 3, wherein the circuit assembly further comprises a second sensing part (142), the second sensing part (142) is electrically connected with the circuit board (14); the The second sensing part (142) is used for sensing at least one of the temperature and humidity of the surrounding environment of the second sensing part (142); the circuit board (14) has the a first side surface (148) and a second side surface (149); at least part of the second sensing portion (142) and the through hole (220) are located on the side where the first side surface (148) is located; the At least part of the first sensing portion (141) and the cavity (24) are located on the side where the second side surface (149) is located.
The sensor assembly according to claim 4, wherein the sensor assembly further comprises a thermally conductive adhesive (40); the thermally conductive adhesive (40) is at least partially located on the side where the second side (149) of the circuit board (14) is located; The first sensing portion (141) and the first portion (131) of the thermally conductive member (13) are bonded and fixed by the thermally conductive adhesive (40).
The sensor assembly according to claim 5, wherein the thermally conductive glue (40) comprises a polymer bonding material and a thermally conductive material, the thermally conductive material being mixed with the polymer bonding material.
The sensor assembly according to claim 5, wherein the housing (20) comprises a first housing (21) and a second housing (22); the first housing (21) comprises the bottom wall (211) and several a side wall (212), the second shell (22) is fixed to the side wall (212) of the first shell (21); the circuit board (14) is fixed to the first shell (21); The bottom wall (211) is located on the side where the second side surface (149) of the circuit board (14) is located, and the second shell (22) is located on the side where the first side surface (148) of the circuit board (14) is located .
The sensor assembly according to claim 7, wherein the first housing (21) is provided with a stepped portion (214), the stepped portion (214) protruding from the bottom wall (211); and the stepped portion (214) is provided along the intersection of the bottom wall (211) and the side wall (212); at least a part of the stepped surface (2141) of the stepped portion (214) and the first part of the circuit board (14) The two side surfaces (149) are in contact; the step portion (214) is arranged around the thermally conductive adhesive (40), and the thermally conductive adhesive (40) passes between the circuit board (14) and the bottom wall (211) Adhesive fixation.
The sensor assembly according to claim 8, wherein the first housing (21) is further provided with a boss portion (215), the boss portion (215) protruding from the bottom wall (211), the A stepped portion (214) surrounds the boss portion (215), and the boss portion (215) circumferentially surrounds the top end portion (136).
The sensor assembly according to claim 7, wherein the through hole (220) is provided in the second shell (22), the number of the through hole (220) is at least one, and the second sensing portion ( 142) and the through hole (220) are disposed opposite to at least a part of the area along the thickness direction of the circuit board (14).
The sensor assembly of claim 10, wherein the sensor assembly further comprises a filter portion (50), the filter portion (50) having an edge region (501) and a central filter region (502), the edge region (501) ) is located on the outer periphery of the central filter area (502); the edge area (501) of the filter part (50) is bonded to the second shell (22), and the center filter area of the filter part (50) (502) at least partially overlaid on the side of the through hole (220) close to the second sensing portion (142), or overlaid at least partially in the central filter area (502) of the filter portion (50) On the side of the through hole (220) away from the second sensing part (142); the central filter area (502) of the filter part (50) is used for blocking solid or liquid foreign matter.
The sensor assembly according to claim 10, wherein the second housing (22) comprises a base (221) and a cap (222) protruding from the base (221) to a side away from the inner cavity (30); the The through hole (220) is arranged through the base (221); the cap (222) has a first sub-cavity (224) and an opening (225), and the first sub-cavity (224) communicates with the through hole (225). 220) and the opening (225); the opening direction of the opening (225) does not coincide with the axial direction of the through hole (220).
The sensor assembly according to claim 12, wherein the first side (148) of the circuit board (14) is further provided with a plurality of circuit elements (143) electrically connected to the circuit board (14), the The second shell (22) is provided with a partition (226), the partition (226) protrudes from the base (221) to the side close to the inner cavity (30); the partition (226) is far away from the The free end of the base portion (221) is in contact with at least part of the first side surface (148) of the circuit board (14); at least part of the circuit element (143) and the second sensing portion (142) pass through the The partitions (226) are separated from each other.
The sensor assembly according to claim 7, wherein the first shell (21) is further provided with at least one pin (26), the pin (26) extending from the bottom wall (211) away from the inner cavity ( 30) One side extends, and at least part of the surface of the pin (26) forms a plurality of convex zigzag structures;

The second casing (22) is further provided with a wire harness fitting hole (223), and the wire harness fitting hole (223) is provided through the second casing (22); the sensor assembly (10) also has a wiring harness that is connected to the wire harness A lead portion (145) adapted to the fitting hole (223), the lead portion (145) is electrically connected to the circuit board (14), and the lead portion (145) passes through the wire harness fitting hole (223) It extends to the side of the second shell (22) away from the inner cavity (30).
A heat exchange device, characterized by comprising a heat exchanger (101) and at least one sensor assembly according to any one of claims 1 to 14, the heat exchanger (101) comprising at least one header (102) ), a plurality of heat exchange tubes (103) and at least one fin (104), the heat exchange tubes (103) are fixed with the collector tube (102), and the inner cavity of the heat exchange tube (103) communicated with the inner cavity of the header (102); the fins (104) are located between two adjacent heat exchange tubes (103);

The sensor assembly is fixed to the heat exchanger (101), and the second portion (132) of the heat conducting member (13) is connected to the surface of the fin (104) and/or the heat exchange tube (103) ) are in direct contact with or adjacent to at least part of the surface.
The heat exchange device according to claim 15, wherein the second portion (132) of the heat conducting member (13) and the surface of the fin (104) and/or the surface of the heat exchange tube (103) are at least The minimum spacing between partial areas is greater than 0 and less than or equal to 5mm.
The heat exchange device according to claim 16, wherein the heat exchange device comprises a surface between the second portion (132) of the heat conducting member (13) and the fin (104) and/or the heat exchange device The medium between at least part of the surface of the tube (103) is air or a thermally conductive material.