WO2022061769A1 - 指纹识别模组、其制作方法及显示装置 - Google Patents

指纹识别模组、其制作方法及显示装置 Download PDF

Info

Publication number
WO2022061769A1
WO2022061769A1 PCT/CN2020/117904 CN2020117904W WO2022061769A1 WO 2022061769 A1 WO2022061769 A1 WO 2022061769A1 CN 2020117904 W CN2020117904 W CN 2020117904W WO 2022061769 A1 WO2022061769 A1 WO 2022061769A1
Authority
WO
WIPO (PCT)
Prior art keywords
light
layer
transmitting
base substrate
shielding layer
Prior art date
Application number
PCT/CN2020/117904
Other languages
English (en)
French (fr)
Inventor
海晓泉
王雷
梁轩
王迎姿
Original Assignee
京东方科技集团股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to PCT/CN2020/117904 priority Critical patent/WO2022061769A1/zh
Priority to CN202080002117.7A priority patent/CN116075869A/zh
Priority to US17/419,835 priority patent/US20220320170A1/en
Publication of WO2022061769A1 publication Critical patent/WO2022061769A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14685—Process for coatings or optical elements
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/1462—Coatings
    • H01L27/14623—Optical shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H01L27/14627—Microlenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
    • H01L27/14612—Pixel-elements with integrated switching, control, storage or amplification elements involving a transistor
    • H01L27/14616—Pixel-elements with integrated switching, control, storage or amplification elements involving a transistor characterised by the channel of the transistor, e.g. channel having a doping gradient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14678—Contact-type imagers

Definitions

  • the present disclosure relates to the field of display technology, and in particular, to a fingerprint identification module, a manufacturing method thereof, and a display device.
  • biometric identification technology has been more and more widely used.
  • fingerprint identification technology has been widely used in mobile terminals and smart homes. and many other fields to provide security for user information.
  • Optical fingerprint recognition is one of the means to realize fingerprint recognition.
  • the principle of optical fingerprint recognition is as follows: when the finger is placed above the display product, the emitted light from the light source contained in the display product irradiates the position of the valleys and ridges of the finger, and is reflected by the valleys and ridges of the finger before entering the display product. Included optical fingerprint identification device. Since the light intensity reflected by the positions of the valley and the ridge is different, the photosensitive device generates different electrical signals according to the difference of the reflected light intensity, so as to realize fingerprint recognition.
  • an embodiment of the present disclosure provides a fingerprint identification module, including:
  • an image sensing layer including a plurality of photosensitive devices on the base substrate
  • the collimating optical layer is located on the light incident side of the plurality of photosensitive devices;
  • the collimating optical layer includes a plurality of light-transmitting holes, and the plurality of light-transmitting holes are arranged in a one-to-one correspondence with some of the photosensitive devices, and
  • the orthographic projection of the light-transmitting hole on the base substrate is located in the orthographic projection of the correspondingly arranged photosensitive device;
  • the light guide layer is located on the side of the collimating optical layer away from the plurality of photosensitive devices; the light guide layer includes a plurality of microlenses, and the orthographic projection of each of the microlenses on the base substrate is completely Covering one of the light-transmitting holes and the orthographic projections of at least two of the photosensitive devices, and each of the microlenses is configured to condense the light reflected by the finger and transmit it to the light-transmitting holes covered by the light-transmitting holes. Covered one of the photosensitive devices.
  • the orthographic projection center of the microlens on the base substrate is coincident with the orthographic projection center of the light-transmitting hole completely covered by the microlens.
  • the collimating optical layer includes a first light shielding layer, a first light transmitting layer, a second light shielding layer and a second light transmitting layer arranged in layers, and the first light-shielding layer is adjacent to the plurality of photosensitive devices, and the second light-transmitting layer is adjacent to the plurality of microlenses;
  • the distance between the second light-shielding layer and the layer where the plurality of microlenses are located is less than or equal to the focal length of the microlenses, and the thickness of the second light-transmitting layer
  • the ratio to the thickness of the first light-transmitting layer is greater than or equal to 1 and less than or equal to 10.
  • the orthographic projection of the first light-transmitting hole on the base substrate completely coincides with the orthographic projection of the second light-transmitting hole.
  • the collimating optical layer further includes: a third light shielding layer located between the second light transmitting layer and the layer where the plurality of microlenses are located Floor;
  • the orthographic projection of the third light shielding layer on the base substrate covers the gaps between the microlenses and overlaps with the orthographic projection edge regions of the plurality of microlenses.
  • the light-transmitting hole includes: a first light-transmitting hole located in the first light-shielding layer, and a light-transmitting hole located in the second light-shielding layer. the second light-transmitting hole; wherein,
  • the first light shielding layer, the second light shielding layer and the third light shielding layer in a direction perpendicular to the base substrate, the first light shielding layer, the second light shielding layer and the third light shielding layer The thickness is greater than 0 ⁇ m and less than or equal to 3 ⁇ m.
  • the first light-transmitting layer and/or the second light-transmitting layer are multiplexed into a filter layer.
  • the fingerprint identification module provided in the embodiment of the present disclosure further includes: a filter layer, the filter layer is located between the layer where the plurality of microlenses are located and the collimating optical layer, or It is located between the collimating optical layer and the layers where the plurality of photosensitive devices are located, or between the adjacent light-shielding layers and the light-transmitting layers.
  • the filter layer is configured to filter out ambient light of more than 600 mm.
  • the above fingerprint identification module provided by the embodiment of the present disclosure, it further comprises: an optical adhesive layer in contact with the surface of the plurality of photosensitive devices on the side away from the base substrate.
  • an embodiment of the present disclosure also provides a display device, comprising a display module, a fingerprint recognition module located on the opposite side of the display surface of the display module, and a fingerprint recognition module located on the display module and the fingerprint recognition module. Adhesive layer between modules; wherein,
  • the fingerprint identification module is the above-mentioned fingerprint identification module
  • the orthographic projection of the adhesive layer on the display module is located in the frame area of the display module.
  • an embodiment of the present disclosure provides a method for manufacturing a fingerprint identification module, including:
  • An image sensing layer including a plurality of photosensitive devices, a collimating optical layer and a light guide layer including a plurality of microlenses are sequentially fabricated on the base substrate;
  • the collimating optical layer includes a plurality of light-transmitting holes, and the plurality of light-transmitting holes are arranged in a one-to-one correspondence with some of the photosensitive devices, and the orthographic projections of the light-transmitting holes on the base substrate are located in a corresponding setting. within the orthographic projection of the photosensitive device;
  • each of the microlenses on the base substrate completely covers one of the light-transmitting holes and the orthographic projections of at least two of the photosensitive devices, and each of the microlenses is configured to reflect the finger After the light is converged, the light is transmitted to one of the photosensitive devices covered by the light transmission hole covered by the light transmission hole.
  • a filter layer, a collimation optical layer and a light guide layer including a plurality of microlenses are fabricated on the second base substrate; wherein, the collimation optical layer includes a plurality of light-transmitting holes, each of the microlenses The orthographic projection on the base substrate completely covers one of the light-transmitting holes;
  • manufacturing a filter layer, a collimating optical layer and a plurality of microlenses on the second base substrate specifically includes:
  • a plurality of the micro-lenses are fabricated on the second light-transmitting layer, and the orthographic projection of each micro-lens on the second substrate completely covers one of the second light-transmitting holes and at least two of the second light-transmitting holes. the orthographic projection of the photosensitive device;
  • a plurality of the microlenses are fabricated on the second light-transmitting layer, and the orthographic projection of each microlens on the second base substrate completely covers one light-transmitting hole and at least one light-transmitting hole contained in the light-shielding layer to be fabricated. an orthographic projection of two of the photosensors;
  • a second light-shielding layer, a first light-transmitting layer, and a first light-shielding layer are sequentially fabricated on the side of the second base substrate away from the light-shielding layer; wherein, the first light-shielding layer and the second light-shielding layer are It includes a plurality of the light-transmitting holes that are completely overlapped in the direction perpendicular to the second substrate, and the first light-shielding layer, the first light-transmitting layer, the second light-shielding layer and the first light-shielding layer The two light-transmitting layers constitute the collimating optical layer.
  • a filter layer, a first light-shielding layer, a first light-transmitting layer, a second light-shielding layer, a second light-transmitting layer and a plurality of prisms are sequentially fabricated on the second base substrate;
  • the orthographic projection of each of the microlenses on the second base substrate completely covers one of the light-transmitting holes and the orthographic projections of at least two of the photosensitive devices.
  • Fig. 2 is a kind of sectional structure schematic diagram along line I-II in Fig. 1;
  • FIG. 4 is a schematic diagram of another plane structure of a fingerprint identification module provided by an embodiment of the present disclosure.
  • Fig. 6 is another kind of cross-sectional structure schematic diagram along line I-II in Fig. 1;
  • Fig. 7 is another kind of cross-sectional structure schematic diagram along line III-IV in Fig. 4;
  • Fig. 9 is another kind of cross-sectional structure schematic diagram along line III-IV in Fig. 4;
  • Fig. 11 is another kind of cross-sectional structure schematic diagram along line III-IV in Fig. 4;
  • Fig. 13 is another kind of cross-sectional structure schematic diagram along line III-IV in Fig. 4;
  • Fig. 14 is another kind of cross-sectional structure schematic diagram along the line I-II in Fig. 1;
  • FIG. 19 is a flowchart of a method for making the fingerprint identification module described in FIG. 5;
  • Fig. 20 is the flow chart of the manufacturing method of the fingerprint identification module described in Fig. 6;
  • FIG. 21 is a flowchart of a method for making the fingerprint identification module described in FIG. 7;
  • FIG. 22 is a flowchart of a method for making the fingerprint identification module described in FIG. 8;
  • FIG. 25 is a flowchart of a method for making the fingerprint identification module described in FIG. 11;
  • FIG. 27 is a flowchart of a method for manufacturing the fingerprint identification module described in FIG. 13;
  • FIG. 28 is a flowchart of a method for manufacturing the fingerprint identification module described in FIG. 14;
  • one microlens corresponds to one photosensitive device, and in the process of fingerprint recognition, the reflected light of the valley or ridge is converged by the microlens and then irradiated onto the corresponding photosensitive device.
  • the reflected light signal received by the photosensitive device is weak, which affects the accuracy of fingerprint recognition.
  • an embodiment of the present disclosure provides a fingerprint identification module, as shown in FIG. 1 and FIG. 2 , including:
  • the image sensing layer 02 includes a plurality of photosensitive devices 201 located on the first base substrate 01;
  • the collimating optical layer 03 is located on the light incident side of the plurality of photosensitive devices 201; the collimating optical layer 03 includes a plurality of light-transmitting holes H, and the plurality of light-transmitting holes H are arranged in a one-to-one correspondence with some of the photosensitive devices 201, and transmit light.
  • the orthographic projection of the hole H on the first base substrate 01 is located in the orthographic projection of the correspondingly arranged photosensitive device 201;
  • a microlens 401 is arranged to cover a plurality of photosensitive devices 201 correspondingly, so that the microlens 401 can concentrate the reflected light that should be transmitted to the plurality of photosensitive devices 201 to a On one of the photosensitive devices 201, the intensity of the reflected light received by the photosensitive device 201 is effectively improved, and the accuracy of fingerprint identification is improved.
  • the drain or source of the transistor 204 is electrically connected, the light-transmitting electrode 2013 is electrically connected to the bias voltage line 208 through a via hole penetrating the first flat layer 206 and the second insulating layer 207, and the photoelectric conversion layer 2012 is composed of a stacked P-type It consists of a semiconductor layer, an intrinsic semiconductor layer and an N-type semiconductor layer.
  • the present disclosure may also include a first gate insulating layer 202 located between the gate electrode of the first transistor 204 and the active layer, and a first gate insulating layer 202 disposed in sequence on the side of the bias voltage line 208 away from the base substrate.
  • Three insulating layers 209 and scintillator layers 210 are insulating layers 209 and scintillator layers 210 .
  • the first transistor 204 may be a semiconductor (a-Si) transistor, a low temperature polysilicon (LTPS) transistor or an oxide (Oxide) transistor;
  • the first substrate substrate 01 may be a silicon-based substrate or a glass-based substrate, This is not limited.
  • the light-transmitting hole H in the collimating optical layer 03 has a collimation effect on the reflected light of the fingerprint, and in order to ensure a better collimation effect, the light-transmitting hole H should not be too large.
  • the light-transmitting hole H with a smaller size can also completely concentrate the light collected by the microlens 401 . It is transmitted to the photosensitive device 201, so that the collimation effect of the fingerprint reflected light is effectively guaranteed on the basis of improving the fingerprint reflected light intensity received by the photosensitive device 201.
  • the microlens 401 covers X*X (X is an odd number greater than 1) photosensitive devices 201 .
  • the distance L 1 between the second light shielding layer 303 and the layer where the plurality of micro lenses 401 are located is less than or equal to the focal length L 2 of the micro lenses 401 .
  • the ratio of the thickness to the thickness of the second light-transmitting layer 304 may be greater than or equal to 1 and less than or equal to 10, for example, may be specifically 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, etc.; preferably greater than or equal to 3 and less than or equal to 5.
  • the distance L 1 between the second light-shielding layer 303 and the layers where the plurality of micro lenses 401 are located is set to be less than or equal to the focal length L 2 of the micro lenses 401 , and the ratio of the thickness of the second light-transmitting layer 304 to the thickness of the first light-transmitting layer 302 is greater than or equal to or equal to 1 and less than or equal to 10.
  • the first transparent layer 302 and the second transparent layer 304 can be made of transparent resin such as polyimide (PI), so as to avoid the loss of the fingerprint reflected light on the transmission path as much as possible.
  • the orthographic projection of the first light-transmitting hole H1 on the first base substrate 01 and the second light-transmitting hole may be set.
  • the orthographic projections of H 2 are completely coincident, that is, the sizes of the first light-transmitting hole H 1 and the second light-transmitting hole H 2 are set to be the same.
  • the stray light passing through the gaps between adjacent microlenses 401 may be irradiated to the adjacent first light-transmitting holes H 1 through the second light-transmitting holes H 2 , thereby affecting the fingerprint recognition effect.
  • the first light-shielding layer 301 between the first light-transmitting holes H1 can be used to effectively block stray light, thereby improving fingerprint imaging. quality.
  • the diameter d 1 of the first light-transmitting hole H 1 and the diameter d 2 of the second light-transmitting hole H 2 can be determined by the difference between the second light shielding layer 303 and the layers where the plurality of microlenses 401 are located.
  • the collimating optical layer 03 may further include: a location where the second light-transmitting layer 304 and the plurality of microlenses 401 are located.
  • the orthographic projection of the third light shielding layer 305 on the first base substrate 01 covers the gaps between the microlenses 401 and overlaps with the orthographic projection edge regions of the plurality of microlenses 401; exemplarily, the edge region may occupy 0.5%-20% of the area of the microlens 401 itself.
  • the circular shape of the microlenses 401 causes a gap between adjacent microlenses 401.
  • the stray light passing through the gap may be illuminated. to the photosensitive device 201, affecting fingerprint recognition.
  • the third light shielding layer 305 that completely covers the gap, stray light can be effectively shielded, thereby improving the accuracy of fingerprint identification.
  • the thickness of the first light shielding layer 301, the second light shielding layer 303, and the third light shielding layer 305 may be greater than 0 ⁇ m and less than or equal to 3 ⁇ m, preferably 1 ⁇ m, Of course, it can also be 0.5 ⁇ m, 1.5 ⁇ m, 2 ⁇ m, 3 ⁇ m, and the like.
  • the first light shielding layer 301, the second light shielding layer 303 and the third light shielding layer 305 may be made of black matrix (BM) material, molybdenum oxide, aluminum oxide or It is made of light-absorbing or low-reflectivity materials such as chrome metal to reduce the degree of reflection of large-angle stray light on the light-shielding layer and improve the accuracy of fingerprint identification.
  • BM black matrix
  • the light-transmitting hole H includes: a first light-transmitting hole H 1 in the first light shielding layer 301 , and a second light-transmitting hole H 1 in the second light shielding layer 301 . the second light-transmitting hole H2 in the light-shielding layer 303; wherein,
  • the orthographic projection of the second light-transmitting hole H 2 on the first base substrate 01 is located within the orthographic projection of the first light-transmitting hole H 1 .
  • the size of the first light transmission hole H1 can be appropriately increased (for example, it is about 10% larger than the size of the second light transmission hole H2 ) , so as to further increase the intensity of the fingerprint reflected light incident on the photosensitive device 201 .
  • the size of the first light transmission hole H1 can be appropriately increased (for example, it is about 10% larger than the size of the second light transmission hole H2 ) , so as to further increase the intensity of the fingerprint reflected light incident on the photosensitive device 201 .
  • the thickness of the first light-transmitting layer 302 M 1 and the thickness M 2 of the second light-transmitting layer 304 satisfy the following relationship: (d 1 -d 2 )/M 1 ⁇ (M 1 +M 2 )/(N+d 2 /2), where N is the phase The distance between the centers of adjacent microlenses 401 .
  • 1 ⁇ M 2 /M 1 ⁇ 10 can be set, preferably 3 ⁇ M 2 /M 1 ⁇ 5.
  • At least one of the first light-transmitting layer 302 and the second light-transmitting layer 304 is multiplexed into the light filter layer 05, which is shown in FIG. 2 and FIG. 5 .
  • the first transparent layer 302 is multiplexed into the filter layer 05 . Since the light above 600nm in ambient light can be irradiated onto the microlens 401 through the finger, at least one of the first light-transmitting layer 302 and the second light-transmitting layer 304 is multiplexed into the light filter layer 05, which can effectively avoid ambient light interference, and improve the fingerprint imaging effect.
  • the filter layer 05 may also be provided separately. Specifically, the filter layer 05 may be provided between the layers where the photosensitive devices 201 shown in FIG. 6 and FIG. 7 are located and the collimating optical layer 03, or It is disposed between the adjacent second light-transmitting layer 304 and the second light-shielding layer 303 shown in FIG. 8 and FIG. 9 , or between the collimating optical layer 03 and the layers where the plurality of microlenses 401 are located.
  • the filter layer 05 may be composed of a plurality of high refractive index film layers and a plurality of low refractive index film layers, and the thickness of the filter layer 05 may be 1 ⁇ m.
  • the image sensing layer 02 , the collimating optical layer 03 , the light guide layer 04 and the filter layer 05 is a film layer stacked on the first base substrate 01; or, as shown in FIG.
  • the image sensing layer 02 is a film layer on the first base substrate 01, and the plurality of photosensitive devices 201 are laminated with the above-mentioned second base substrate 06 through the optical adhesive layer 07 to fit.
  • the present disclosure also provides a set of comparison data between the fingerprint identification module in the related art and the fingerprint identification module provided by the embodiments of the present disclosure.
  • the lamination relationship of each film layer in the fingerprint recognition module structure in the related art is the same as the lamination relationship of each film layer shown in FIG. 2
  • the length/width of the photosensitive device 201 is both 3.5 ⁇ m
  • the light-transmitting hole is 3.5 ⁇ m.
  • the light-receiving angle ⁇ of H is ⁇ 4.5°.
  • one microlens 401 corresponds to one photosensitive device 201 , and the diameter of the microlens 401 is 3.5 ⁇ m, the arch height is 1 ⁇ m, the thickness of the first light-transmitting layer 302 is 6 ⁇ m, and the second light-transmitting layer 304
  • the thickness of the microlens 401 is 3 ⁇ m; in FIG. 2 , one microlens 401 corresponds to three photosensitive devices 201 , and the diameter of the microlens 401 is 10 ⁇ m, the arch height is 3.5 ⁇ m, the thickness of the first light-transmitting layer 302 is 10 ⁇ m, and the second light-transmitting layer
  • the thickness of 304 is 2 ⁇ m.
  • the transmittance of the fingerprint reflected light in the related art is 22%, and the total energy of the reflected light received by a single photosensitive device 201 is 0.023; the transmittance of the fingerprint reflected light in FIG.
  • the total energy of the received reflected light is 0.191. It can be seen that, when the thicknesses of the fingerprint identification modules are similar, the fingerprint identification module provided by the embodiment of the present disclosure increases the reflected light intensity received by the photosensitive device 201, thereby improving the fingerprint identification accuracy.
  • the present disclosure also provides comparison data for the fingerprint identification module in the aforementioned related art and the fingerprint identification module provided in the present disclosure that multiplexes the first light-transmitting layer 302 into the filter layer 05 .
  • the signal quantity (Signal) of the fingerprint identification module in the aforementioned related art is 28.87
  • the signal-to-noise ratio (SNR) is 15.68
  • the fingerprint imaging is shown in FIG. 16 ;
  • the present disclosure multiplexes the first light-transmitting layer 302 as
  • the signal quantity (Signal) of the fingerprint recognition module of the filter layer 05 is 38.19
  • the signal-to-noise ratio (SNR) is 26.83.
  • the fingerprint image is shown in Figure 17. By comparison, it can be seen that after adding the filter function of the filter layer 05 in the present disclosure, the signal quantity and the signal-to-noise ratio are significantly improved, and the fingerprint image is clearer.
  • An image sensing layer including a plurality of photosensitive devices, a collimating optical layer and a light guide layer including a plurality of microlenses are sequentially fabricated on the base substrate;
  • the collimating optical layer includes a plurality of light-transmitting holes, and the plurality of light-transmitting holes are arranged in a one-to-one correspondence with some photosensitive devices, and the orthographic projections of the light-transmitting holes on the substrate are located in the orthographic projections of the correspondingly arranged photosensitive devices;
  • each microlens on the substrate completely covers one light-transmitting hole and the orthographic projections of at least two photosensitive devices, and the microlenses are configured to collect the light reflected by the finger and transmit it to the photosensitive devices through the light-transmitting hole.
  • the above-mentioned specific steps can be used to manufacture, as shown in FIG. 18 and FIG. 19 .
  • the filter layer 05 needs to be fabricated on the image sensing layer 02 including the plurality of photosensitive devices 201 .
  • FIG. 8 and FIG. 9 as shown in FIG. 22 and FIG. 23 , after the second light shielding layer 303 is fabricated and before the second light transmission layer 304 is fabricated, it is also necessary to fabricate the second filter The optical filter layer 05 is formed on the optical layer 303 .
  • a filter layer, a collimating optical layer, and a light guide layer containing a plurality of microlenses are fabricated on the second base substrate; wherein, the collimating optical layer includes a plurality of light-transmitting holes, and each microlens is located on the base substrate.
  • the orthographic projection completely covers a light-transmitting hole;
  • the second substrate with the filter layer, the collimating optical layer and the plurality of microlenses is bonded to the light incident side of the plurality of photosensitive devices by using optical glue, so that the plurality of light-transmitting holes and part of the photosensitive devices are bonded after bonding. They are arranged in a one-to-one correspondence, and the orthographic projection of the light-transmitting holes on the substrate is located in the orthographic projection of the correspondingly arranged photosensitive devices, and the orthographic projection of each microlens on the substrate completely covers the orthographic projections of at least two photosensitive devices. projection, and each microlens is configured to collect the light reflected by the finger and transmit it to a photosensitive device covered by the light transmission hole covered by it.
  • a filter layer, a collimating optical layer and a plurality of microlenses are fabricated on the second substrate, which can be implemented in the following ways:
  • a first light-transmitting layer 302, a second light-shielding layer 303 and a second light-transmitting layer 304 are sequentially fabricated on the second base substrate 06; wherein, the first light-transmitting layer 302 is multiplexed into a filter layer 05, the thickness of the second light-transmitting layer 304 perpendicular to the second base substrate 06 is less than or equal to the focal length of the microlens 401 to be fabricated, and the second light-shielding layer 303 includes a plurality of second light-transmitting holes;
  • a plurality of microlenses 401 are fabricated on the second light-transmitting layer 304, and the orthographic projection of each microlens 401 on the second base substrate 06 completely covers a second light-transmitting hole and the orthographic projection of at least two photosensitive devices 201;
  • a first light-shielding layer 301 is formed on the side of the second base substrate 06 away from the first light-transmitting layer 302 .
  • the first light-shielding layer 301 includes a plurality of second light-transmitting holes in a direction perpendicular to the second base substrate 06 A plurality of completely overlapping first light-transmitting holes, and the first light-shielding layer 301 , the first light-transmitting layer 302 , the second light-shielding layer 303 and the second light-transmitting layer 304 constitute the collimating optical layer 03 .
  • the manufacturing method of the fingerprint identification module shown in FIG. 11 is similar to the manufacturing method of the fingerprint identification module shown in FIG. 10 , the only difference is: as shown in FIG. After 304 , and before fabricating the plurality of microlenses 401 , a third light shielding layer 305 needs to be fabricated, wherein the third light shielding layer 304 covers the gaps between the microlenses 401 and the edge area of each microlens 401 .
  • the filter layer 05 and the second light-transmitting layer 304 are sequentially fabricated on the second base substrate 06 .
  • the filter layer In the direction perpendicular to the second base substrate 06 , the second base substrate 06 , the filter layer The sum of the thicknesses of the layer 05 and the second light transmission/304 is less than or equal to the focal length of the microlens 401 to be fabricated;
  • a plurality of microlenses 401 are fabricated on the second light-transmitting layer 304, and the orthographic projection of each microlens 401 on the second base substrate 304 completely covers one light-transmitting hole and at least two photosensitive devices contained in the light-shielding layer to be fabricated Orthographic projection of 201;
  • a second light-shielding layer 303 , a first light-transmitting layer 302 and a first light-shielding layer 301 are sequentially fabricated on the side of the second base substrate 06 away from the light-shielding layer 05 ; wherein the first light-shielding layer 301 and the second light-shielding layer 302 include A plurality of light-transmitting holes are completely overlapped in the direction perpendicular to the second base substrate 06, and the first light-shielding layer 301, the first light-transmitting layer 302, the second light-shielding layer 303 and the second light-transmitting layer 304 constitute collimating optics Layer 03.
  • the manufacturing method of the fingerprint identification module shown in FIG. 13 is similar to the manufacturing method of the fingerprint identification module shown in FIG. 12 , the only difference is: as shown in FIG. After 304 , and before fabricating the plurality of microlenses 401 , a third light shielding layer 305 needs to be fabricated, wherein the third light shielding layer 304 covers the gaps between the microlenses 401 and the edge area of each microlens 401 .
  • a filter layer, a collimating optical layer and a plurality of microlenses are fabricated on the second substrate, which can be implemented in the following ways:
  • the filter layer 05 , the first light-shielding layer 301 , the first light-transmitting layer 302 , the second light-shielding layer 303 , the second light-transmitting layer 304 and a plurality of prisms are sequentially fabricated on the second base substrate 06 04; of which,
  • each microlens 401 on the second base substrate 06 completely covers one light-transmitting hole and the orthographic projection of the at least two photosensitive devices 201 .
  • the manufacturing method of the fingerprint identification module shown in FIG. 15 is similar to the manufacturing method of the fingerprint identification module shown in FIG. 14 , the only difference is: as shown in FIG. After 304 , and before fabricating the plurality of microlenses 401 , a third light shielding layer 305 needs to be fabricated, wherein the third light shielding layer 304 covers the gaps between the microlenses 401 and the edge area of each microlens 401 .
  • the adhesive layer 09 may be optical adhesive (OCA) or photosensitive adhesive (OCR).
  • the display module 08 can be an organic electroluminescence (OLED) display module, a quantum dot (QLED) light-emitting display module or a micro-light-emitting diode (Micro-LED) display module.
  • the display module 08 may be an organic electroluminescence (OLED) display module, as shown in FIG. 30 , the display module 08 may specifically include: a third base substrate 801 and a second gate insulating layer 802 , an interlayer insulating layer 803 , a second transistor 804 , an anode 806 , a pixel definition layer 807 , a light-emitting functional layer R/G/B, a support layer 808 , a cathode 809 , an encapsulation layer 810 , an adhesive layer 811 and a protective cover 812 .
  • OLED organic electroluminescence
  • the reflected light of the fingerprint F is transmitted to the microlens 401 through the area between the anodes 806 , and is condensed by the microlens 401 and then transmitted to a photosensitive device 201 through the collimating optical layer 03 . Since one microlens 401 covers a plurality of photosensitive devices 201 correspondingly, the microlens 401 can concentrate the reflected light that should be transmitted to the plurality of photosensitive devices 201 to one of the photosensitive devices 201, thereby effectively improving the acceptance of the photosensitive device 201. The obtained reflected light intensity improves the accuracy of fingerprint identification.
  • the display device may be any product or component with display function, such as a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, a smart watch, a fitness wristband, a personal digital assistant, etc.
  • Other essential components of the display device should be understood by those of ordinary skill in the art, and will not be described in detail here, nor should it be regarded as a limitation of the present invention.
  • the implementation of the display device can refer to the above-mentioned embodiment of the fingerprint identification module, and the repetition will not be repeated.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • Multimedia (AREA)
  • Theoretical Computer Science (AREA)
  • Image Input (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)

Abstract

一种指纹识别模组、其制作方法及显示装置，包括：衬底基板01；图像传感层02，包括位于衬底基板01之上的多个光敏器件201；准直光学层03，位于多个光敏器件201的入光侧；准直光学层03包括多个透光孔H，多个透光孔H与部分光敏器件201一一对应设置，且透光孔H在衬底基板01上的正投影位于对应设置的光敏器件201的正投影内；导光层04，位于准直光学层03背离多个光敏器件201的一侧；导光层04包括多个微透镜401，每一个微透镜401在衬底基板01上的正投影完全覆盖一个透光孔H及至少两个光敏器件201的正投影，且每一个微透镜401被配置为将手指反射的光线汇聚后经其所覆盖的透光孔H传输至其所覆盖的一个光敏器件201。

Description

指纹识别模组、其制作方法及显示装置 技术领域
本公开涉及显示技术领域，尤其涉及一种指纹识别模组、其制作方法及显示装置。
背景技术
随着信息行业的高速发展，生物识别技术受到了越来越广泛的应用，特别地，由于不同用户的指纹不同，便于进行用户身份确认，因此，指纹识别技术已经广泛应用在移动终端、智能家居等多个领域，为用户信息提供安全保障。
光学式指纹识别是实现指纹识别的手段之一。光学式指纹识别的原理如下：当手指置于显示产品上方时，显示产品所含光源的发射光线照射到手指的谷和脊的位置，并经手指的谷和脊的反射后再入射到显示产品所含光学式指纹识别器件。由于谷和脊的位置反射的光强不同，光敏器件根据上述反射光强的差异生成不同电信号，实现指纹识别。
发明内容
一方面，本公开实施例提供了一种指纹识别模组，包括：
衬底基板；
图像传感层，包括位于所述衬底基板之上的多个光敏器件；
准直光学层，位于所述多个述光敏器件的入光侧；所述准直光学层包括多个透光孔，所述多个透光孔与部分所述光敏器件一一对应设置，且所述透光孔在所述衬底基板上的正投影位于对应设置的所述光敏器件的正投影内；
导光层，位于所述准直光学层背离所述多个光敏器件的一侧；所述导光层包括多个微透镜，每一个所述微透镜在所述衬底基板上的正投影完全覆盖一个所述透光孔及至少两个所述光敏器件的正投影，且每一个所述微透镜被 配置为将手指反射的光线汇聚后经其所覆盖的所述透光孔传输至其所覆盖的一个所述光敏器件。
可选地，在本公开实施例提供的上述指纹识别模组中，所述微透镜在所述衬底基板上的正投影中心与其完全覆盖的所述透光孔的正投影中心重合。
可选地，在本公开实施例提供的上述指纹识别模组中，所述准直光学层包括层叠设置的第一遮光层、第一透光层、第二遮光层和第二透光层，且所述第一遮光层与所述多个光敏器件邻近，所述第二透光层与所述多个微透镜邻近；其中，
在垂直于所述衬底基板的方向上，所述第二遮光层与所述多个微透镜所在层之间的距离小于或等于所述微透镜的焦距，所述第二透光层的厚度与所述第一透光层的厚度之比大于或等于1且小于或等于10。
可选地，在本公开实施例提供的上述指纹识别模组中，所述透光孔包括：位于所述第一遮光层中的第一透光孔，以及位于所述第二遮光层中的第二透光孔；其中，
所述第一透光孔在所述衬底基板上的正投影与所述第二透光孔的正投影完全重合。
可选地，在本公开实施例提供的上述指纹识别模组中，所述准直光学层还包括：位于所述第二透光层与所述多个微透镜所在层之间的第三遮光层；
所述第三遮光层在所述衬底基板上的正投影覆盖各所述微透镜之间的空隙并与所述多个微透镜的正投影边缘区域相互交叠。
可选地，在本公开实施例提供的上述指纹识别模组中，所述透光孔包括：位于所述第一遮光层中的第一透光孔，以及位于所述第二遮光层中的第二透光孔；其中，
所述第二透光孔在所述衬底基板上的正投影位于所述第一透光孔的正投影内。
可选地，在本公开实施例提供的上述指纹识别模组中，在垂直于所述衬底基板的方向上，所述第一遮光层、所述第二遮光层和所述第三遮光层的厚 度大于0μm且小于或等于3μm。
可选地，在本公开实施例提供的上述指纹识别模组中，所述第一遮光层、所述第二遮光层和所述第三遮光层的材料为黑矩阵材料、氧化钼、氧化铝或铬金属。
可选地，在本公开实施例提供的上述指纹识别模组中，所述第一透光层和/或所述第二透光层复用为滤光层。
可选地，在本公开实施例提供的上述指纹识别模组中，还包括：滤光层，所述滤光层位于所述多个微透镜所在层与所述准直光学层之间，或位于所述准直光学层与所述多个光敏器件所在层之间，或位于相邻所述遮光层与所述透光层之间。
可选地，在本公开实施例提供的上述指纹识别模组中，所述滤光层被配置为滤除600mm以上的环境光。
可选地，在本公开实施例提供的上述指纹识别模组中，所述图像传感层、所述准直光学层、所述导光层和所述滤光层为在所述衬底基板上层叠设置的膜层。
可选地，在本公开实施例提供的上述指纹识别模组中，还包括：与所述多个光敏器件背离所述衬底基板一侧的表面接触的光学胶层。
另一方面，本公开实施例还提供了一种显示装置，包括显示模组，位于所述显示模组显示面的相对侧的指纹识别模组，以及位于所述显示模组与所述指纹识别模组之间的胶粘层；其中，
所述指纹识别模组为上述指纹识别模组；
所述胶粘层在所述显示模组上的正投影位于所述显示模组的边框区域。
另一方面，本公开实施例提供了一种指纹识别模组的制作方法，包括：
提供一个衬底基板；
在所述衬底基板上依次制作包含多个光敏器件的图像传感层、准直光学层和包含多个微透镜的导光层；其中，
所述准直光学层包括多个透光孔，所述多个透光孔与部分所述光敏器件 一一对应设置，且所述透光孔在所述衬底基板上的正投影位于对应设置的所述光敏器件的正投影内；
每一个所述微透镜在所述衬底基板上的正投影完全覆盖一个所述透光孔及至少两个所述光敏器件的正投影，且每一个所述微透镜被配置为将手指反射的光线汇聚后经其所覆盖的所述透光孔传输至其所覆盖的一个所述光敏器件。
另一方面，本公开实施例提供了一种指纹识别模组的制作方法，包括：
提供一个第一衬底基板；
在所述第一衬底基板上制作包含多个光敏器件的图像传感层；
提供一个第二衬底基板；
在所述第二衬底基板上制作滤光层、准直光学层和包含多个微透镜的导光层；其中，所述准直光学层包括多个透光孔，每一个所述微透镜在所述衬底基板上的正投影完全覆盖一个所述透光孔；
采用光学胶将具备所述滤光层、所述准直光学层和所述多个微透镜的所述第二衬底基板与所述多个光敏器件的入光侧进行贴合，使得贴合后所述多个透光孔与部分所述光敏器件一一对应设置，且所述透光孔在所述衬底基板上的正投影位于对应设置的所述光敏器件的正投影内，同时每一个所述微透镜在所述衬底基板上的正投影完全覆盖至少两个所述光敏器件的正投影，且每一个所述微透镜被配置为将手指反射的光线汇聚后经其所覆盖的所述透光孔传输至其所覆盖的一个所述光敏器件。
可选地，在本公开实施例提供的上述制作方法中，在所述第二衬底基板上制作滤光层、准直光学层和多个微透镜，具体包括：
在所述第二衬底基板上依次制作第一透光层、第二遮光层和第二透光层；其中，所述第一透光层复用为滤光层，所述第二透光层在垂直于所述第二衬底基板上的厚度小于或等于待制作微透镜的焦距，所述第二遮光层包括多个第二透光孔；
在所述第二透光层上制作多个所述微透镜，每一个所述微透镜在所述第 二衬底基板上的正投影完全覆盖一个所述第二透光孔及至少两个所述光敏器件的正投影；
在所述第二衬底基板背离所述第一透光层的一侧制作第一遮光层，所述第一遮光层包括与所述多个第二透光孔在垂直于所述第二衬底基板的方向上完全重合的多个第一透光孔，且所述第一遮光层、所述第一透光层、所述第二遮光层和所述第二透光层构成所述准直光学层。
可选地，在本公开实施例提供的上述制作方法中，在所述第二衬底基板上制作滤光层、准直光学层和多个微透镜，具体包括：
在所述第二衬底基板上依次制作滤光层和第二透光层，在垂直于所述第二衬底基板的方向上，所述第二衬底基板、所述滤光层和所述第二透光层的厚度之和小于或等于待制作微透镜的焦距；
在所述第二透光层上制作多个所述微透镜，每一个所述微透镜在所述第二衬底基板上的正投影完全覆盖待制作的遮光层所含一个透光孔及至少两个所述光敏器件的正投影；
在所述第二衬底基板背离所述滤光层的一侧依次制作第二遮光层、第一透光层和第一遮光层；其中，所述第一遮光层和所述第二遮光层包括在垂直于所述第二衬底基板方向上完全重合的多个所述透光孔，且所述第一遮光层、所述第一透光层、所述第二遮光层和所述第二透光层构成所述准直光学层。
可选地，在本公开实施例提供的上述制作方法中，在所述第二衬底基板上制作滤光层、准直光学层和多个微透镜，具体包括：
在所述第二衬底基板上依次制作滤光层、第一遮光层、第一透光层、第二遮光层、第二透光层和多个棱镜；其中，
所述第一遮光层和所述第二遮光层包括在垂直于所述第二衬底基板方向上的多个所述透光孔，且所述第一遮光层、所述第一透光层、所述第二遮光层和所述第二透光层构成所述准直光学层；
每一个所述微透镜在所述第二衬底基板上的正投影完全覆盖一个所述透光孔及至少两个所述光敏器件的正投影。
可选地，在本公开实施例提供的上述制作方法中，在制作所述第二透光层之后，且在制作所述多个微透镜之间，还包括：
在所述第二透光层上制作第三遮光层，所述第三遮光层在所述第二衬底基板上的正投影覆盖各所述微透镜之间的空隙并与所述多个微透镜的正投影边缘区域相互交叠。
附图说明
图1为本公开实施例提供的指纹识别模组的一种平面结构示意图；
图2为沿图1中I-II线的一种剖面结构示意图；
图3为图2中A区域的放大结构示意图；
图4为本公开实施例提供的指纹识别模组的又一种平面结构示意图；
图5为沿图4中III-IV线的一种剖面结构示意图；
图6为沿图1中I-II线的又一种剖面结构示意图；
图7为沿图4中III-IV线的又一种剖面结构示意图；
图8为沿图1中I-II线的又一种剖面结构示意图；
图9为沿图4中III-IV线的又一种剖面结构示意图；
图10为沿图1中I-II线的又一种剖面结构示意图；
图11为沿图4中III-IV线的又一种剖面结构示意图；
图12为沿图1中I-II线的又一种剖面结构示意图；
图13为沿图4中III-IV线的又一种剖面结构示意图；
图14为沿图1中I-II线的又一种剖面结构示意图；
图15为沿图4中III-IV线的又一种剖面结构示意图；
图16为相关技术中指纹识别模组的指纹图像；
图17为本公开实施例提供的指纹识别模组的指纹图像；
图18为图2所述指纹识别模组的制作方法的流程图；
图19为图5所述指纹识别模组的制作方法的流程图；
图20为图6所述指纹识别模组的制作方法的流程图；
图21为图7所述指纹识别模组的制作方法的流程图；
图22为图8所述指纹识别模组的制作方法的流程图；
图23为图9所述指纹识别模组的制作方法的流程图；
图24为图10所述指纹识别模组的制作方法的流程图；
图25为图11所述指纹识别模组的制作方法的流程图；
图26为图12所述指纹识别模组的制作方法的流程图；
图27为图13所述指纹识别模组的制作方法的流程图；
图28为图14所述指纹识别模组的制作方法的流程图；
图29为图15所述指纹识别模组的制作方法的流程图；
图30为本公开实施例提供的显示装置的结构示意图。
具体实施方式
为使本公开实施例的目的、技术方案和优点更加清楚，下面将结合本公开实施例的附图，对本公开实施例的技术方案进行清楚、完整地描述。需要注意的是，附图中各图形的尺寸和形状不反映真实比例，目的只是示意说明本公开内容。并且自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。显然，所描述的实施例是本公开的一部分实施例，而不是全部的实施例。基于所描述的本公开实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其它实施例，都属于本公开保护的范围。
除非另作定义，此处使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开说明书以及权利要求书中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。“内”、“外”、“上”、“下”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可 能相应地改变。
当前利用微透镜(Microlens)将指纹反射光线聚焦至光敏器件(Sensor)来实现指纹识别的方案中，一个微透镜对应一个光敏器件，在指纹识别过程中，谷或脊的反射光经微透镜汇聚后照射至对应的光敏器件上。然而上述方案中光敏器件接受到的反射光信号较弱，导致指纹识别的准确性受到影响。
针对相关技术中存在的上述问题，本公开实施例提供了一种指纹识别模组，如图1和图2所示，包括：
第一衬底基板01；
图像传感层02，包括位于第一衬底基板01之上的多个光敏器件201；
准直光学层03，位于多个述光敏器件201的入光侧；准直光学层03包括多个透光孔H，多个透光孔H与部分光敏器件201一一对应设置，且透光孔H在第一衬底基板01上的正投影位于对应设置的光敏器件201的正投影内；
导光层04，位于准直光学层03背离多个光敏器件201的一侧；导光层04包括多个微透镜401，每一个微透镜401在第一衬底基板01上的正投影完全覆盖一个透光孔H及至少两个光敏器件201的正投影，且每一个微透镜401被配置为将手指反射的光线汇聚后经其所覆盖的透光孔H传输至其所覆盖的一个光敏器件201；
在本公开实施例提供的上述指纹识别模组中，通过设置一个微透镜401对应覆盖多个光敏器件201，使得该微透镜401可将本应传输至多个光敏器件201上的反射光汇聚至了其中一个光敏器件201上，因此有效提高了光敏器件201接受到的反射光强度，提高了指纹识别的准确性。
具体地，可选用聚碳酸酯(PC)、液晶聚合物(LCP)等透光性好且性质稳定的材料来制作微透镜401。另外，如图3所示，每一个光敏器件201可以包括层叠设置的金属电极2011、光电转换层2012和透光电极2013；其中，金属电极2011通过贯穿第一绝缘层203的过孔与第一晶体管204的漏极或源极电连接，透光电极2013通过贯穿第一平坦层206和第二绝缘层207的过孔与偏置电压线208电连接，光电转换层2012由层叠设置的P型半导体层、本 征半导体层和N型半导体层构成。一般地，在本公开中还可以包括位于第一晶体管204的栅极与有源层之间的第一栅绝缘层202，以及在偏置电压线208背离衬底基板的一侧依次设置的第三绝缘层209和闪烁体层210。可选地，第一晶体管204可以为半导体(a-Si)晶体管、低温多晶硅(LTPS)晶体管或氧化物(Oxide)晶体管；第一衬底基板01可以为硅基衬底或玻璃基衬底，在此不做限定。
可选地，在本公开实施例提供的上述指纹识别模组中，如图1和图4所示，微透镜401在第一衬底基板01上的正投影中心与其完全覆盖的透光孔H的正投影中心重合。
准直光学层03中的透光孔H对指纹反射光具有准直效果，而为保证准直效果较好，透光孔H不宜过大。通过设置微透镜401在第一衬底基板01上的正投影中心与其完全覆盖的透光孔H的正投影中心重合，使得较小尺寸的透光孔H也可以将微透镜401的汇聚光线完全透射至光敏器件201上，从而在提高光敏器件201接受到的指纹反射光强的基础上，有效保证了对指纹反射光的准直效果。
需要说明的是，图1中仅示例性地给出了透光孔H的形状为圆形，在具体实施时，透光孔H的形状还可以为正方形等，在此不做限定。另外，图1具体示出了微透镜401紧密排列，且一个微透镜401覆盖3*3个光敏器件201，当然，在具体实施时，一个微透镜401还可以覆盖光敏器件201的数量可以根据实际需要进行设计，在此不做限定。然而为有效保证微透镜401的汇聚光线可经透光孔H传输至一个光敏器件201上，优选微透镜401覆盖X*X(X为大于1的奇数)个光敏器件201。此时，微透镜401的汇聚光线优选传输至第(X+1)/2个光敏器件201上，微透镜401的孔径D与光敏器件201的长/宽尺寸P满足以下关系：D＝X*P。
可选地，在本公开实施例提供的上述指纹识别模组中，如图2所示，准直光学层03包括：层叠设置的第一遮光层301、第一透光层302、第二遮光层303和第二透光层304，且第一遮光层301与多个光敏器件201邻近，第二 透光304层与多个微透镜401邻近；其中，
在垂直于第一衬底基板01的方向上，第二遮光层303与多个微透镜401所在层之间的距离L 1小于或等于微透镜401的焦距L 2，第一透光层302的厚度与第二透光层304厚度之比可以大于或等于1且小于或等于10，例如具体可以为1、2、3、4、5、6、7、8、9、10等；优选大于或等于3且小于或等于5。
由于指纹反射光被微透镜401汇聚至焦点后发生扩散，因此为使得第一遮光层301的第一透光孔H 1和第二遮光层303的第二透光孔H 2均较小，可以设置第二遮光层303与多个微透镜401所在层之间的距离L 1小于或等于微透镜401的焦距L 2，第二透光层304的厚度与第一透光层302厚度之比大于或等于1且小于或等于10。另外，第一透光层302和第二透光层304可以由聚酰亚胺(PI)等透明树脂制作，以尽可能避免指纹反射光在传输路径上的损耗。
可选地，在本公开实施例提供的上述指纹识别模组中，如图2所示，可以设置第一透光孔H 1在第一衬底基板01上的正投影与第二透光孔H 2的正投影完全重合，即设置第一透光孔H 1与第二透光孔H 2的大小相同。
在相邻微透镜401之间的间隙处透过的杂散光，可能会经第二透光孔H 2照射至相邻的第一透光孔H 1，影响指纹识别效果。通过将第一透光孔H 1与第二透光孔H 2的大小相同，使得可以利用第一透光孔H 1之间的第一遮光层301来有效遮挡杂散光，从而提高了指纹成像质量。在具体实施时，如图2所示，第一透光孔H 1的直径d 1与第二透光孔H 2的直径d 2可以由第二遮光层303与多个微透镜401所在层之间的距离L 1、微透镜401的焦距L 2和要实现的收光角θ决定，具体的，d 1＝d 2＝2*(L 2-L 1)*tanθ。
可选地，在本公开实施例提供的上述指纹识别模组中，如图4和图5所示，准直光学层03还可以包括：位于第二透光层304与多个微透镜401所在层之间的第三遮光层305；其中，
第三遮光层305在第一衬底基板01上的正投影覆盖各微透镜401之间的 空隙并与多个微透镜401的正投影边缘区域相互交叠；示例性的，该边缘区域可以占微透镜401本身面积的0.5％-20％。
由图4可见，虽然各微透镜401紧密排列，但微透镜401的圆形形状致使相邻微透镜401之间还是存在间隙，在指纹识别过程中，该间隙处透过的杂散光可能会照射至光敏器件201上，影响指纹识别。通过设置完全覆盖该间隙处的第三遮光层305，可以对杂散光进行有效遮挡，从而提高指纹识别的准确性。
可选地，在本公开实施例提供的上述指纹识别模组中，第一遮光层301、第二遮光层303、第三遮光层305的厚度可以大于0μm且小于或等于3μm，优选为1μm，当然也可以为0.5μm、1.5μm、2μm、3μm等。可选地，在本公开实施例提供的上述指纹识别模组中，第一遮光层301、第二遮光层303和第三遮光层305可以由黑矩阵(BM)材料、氧化钼、氧化铝或铬金属等吸光或低反射率的材料制作，以降低大角度的杂散光在遮光层上发生反射的程度，提高指纹识别准确性。
可选地，在本公开实施例提供的上述指纹识别模组中，如图5所示，透光孔H包括：位于第一遮光层301中的第一透光孔H 1，以及位于第二遮光层303中的第二透光孔H 2；其中，
第二透光孔H 2在第一衬底基板01上的正投影位于第一透光孔H 1的正投影内。
由于图5中的第三遮光层305可以对杂散光进行有效遮挡，故可以将第一透光孔H 1的尺寸适当增大(例如比第二透光孔H 2的尺寸大10％左右)，以进一步提高入射至光敏器件201上的指纹反射光的强度。可选地，如图5所示，第二透光孔H 2的直径d 2可以由第二遮光层303与多个微透镜401所在层之间的距离L 1、微透镜401的焦距L 2和要实现的收光角θ决定，具体的，d 2＝2*(L 2-L 1)*tanθ，相应地，第一透光孔H 1的直径d 1≈2.2*(L 2-L 1)*tanθ。另外，在图5所示指纹识别模组中，若以第一遮光层301、第二遮光层303和第三遮光层305为平面(即厚度忽略不计)，则第一透光层302的厚度M 1与第二透 光层304的厚度M 2满足以下关系式：(d 1-d 2)/M 1≤(M 1+M 2)/(N+d 2/2)，其中N为相邻微透镜401的中心之间的距离。在具体实施时可以设置1≤M 2/M 1≤10，优选3≤M 2/M 1≤5。
可选地，在本公开实施例提供的上述指纹识别模组中，第一透光层302和第二透光层304至少之一复用为滤光层05，图2和图5中具体示出了第一透光层302复用为滤光层05。由于环境光中600nm以上的光线可透过手指照射至微透镜401上，因此将第一透光层302和第二透光层304至少之一复用为滤光层05，可以有效避免环境光的干扰，提高指纹成像效果。并且，将第一透光层302和第二透光层304至少之一复用为滤光层05，避免了在指纹识别模组中增设滤光层05，利于实现轻薄化。当然，在具体实施时，还可以单独设置滤光层05，具体地，滤光层05可以设置在图6和图7所示多个光敏器件201所在层与准直光学层03之间，或者设置在图8和图9所示相邻的第二透光层304与第二遮光层303之间，或者设置在准直光学层03与多个微透镜401所在层之间。可选地，滤光层05可以由多个高折射率膜层与多个低折射率膜层构成，滤光层05的厚度可以为1μm。
可选地，在本公开实施例提供的上述指纹识别模组中，如图2、图5至图9所示，图像传感层02、准直光学层03、导光层04和滤光层05为在第一衬底基板01上层叠设置的膜层；或者，如图10至图15所示，准直光学层03、导光层04和滤光层05为在第二衬底基板06上层叠设置的膜层，而图像传感层02为在第一衬底基板01上的膜层，并且通过光学胶层07将多个光敏器件201与上述第二衬底基板06上的叠层进行贴合。
另外，本公开还提供了一组相关技术中指纹识别模组与本公开实施例提供的指纹识别模组的对比数据。具体的，相关技术中的指纹识别模组结构中各膜层的叠层关系与图2所示各膜层的叠层关系相同，光敏器件201的长/宽尺寸均为3.5μm，透光孔H的收光角θ均为±4.5°。不同之处在于：相关技术中一个微透镜401对应一个光敏器件201，且微透镜401的口径为3.5μm，拱高为1μm，第一透光层302的厚度为6μm，第二透光层304的厚度为3μm； 图2中一个微透镜401对应三个光敏器件201，且微透镜401的口径为10μm，拱高为3.5μm，第一透光层302的厚度为10μm，第二透光层304的厚度为2μm。结果表明，相关技术中指纹反射光的透过率为22％，单个光敏器件201接受到的反射光的总能量为0.023；图2中指纹反射光的透过率为19％，单个光敏器件201接受到的反射光的总能量为0.191。由此可见，在指纹识别模组的厚度相近的情况下，本公开实施例提供的指纹识别模组提高了光敏器件201接受到的反射光强度，从而提升了指纹识别准确性。
此外，本公开还提供了针对前述相关技术中的指纹识别模组与本公开提供的将第一透光层302复用为滤光层05的指纹识别模组的对比数据。具体地，前述相关技术中的指纹识别模组的信号量(Signal)为28.87，信噪比(SNR)为15.68，指纹成像如图16所示；本公开将第一透光层302复用为滤光层05的指纹识别模组的信号量(Signal)为38.19，信噪比(SNR)为26.83，指纹成像如图17所示。对比可见，本公开中增加滤光层05的滤光功能后，信号量和信噪比显著提升，指纹图像更清晰。
相应地，本公开实施例还针对上述指纹识别模组提供了制作方法，由于该制作方法解决问题的原理与上述指纹识别模组解决问题的原理相似，因此，该制作方法的实施可以参见上述指纹识别模组的实施例，重复之处不再赘述。
具体地，对于图2、图5至图9所示指纹识别模组的制作方法，如图18至图23所示，可以包括以下步骤：
提供一个衬底基板；
在衬底基板上依次制作包含多个光敏器件的图像传感层、准直光学层和包含多个微透镜的导光层；其中，
准直光学层包括多个透光孔，多个透光孔与部分光敏器件一一对应设置，且透光孔在衬底基板上的正投影位于对应设置的光敏器件的正投影内；
每一个微透镜在衬底基板上的正投影完全覆盖一个透光孔及至少两个光敏器件的正投影，且微透镜被配置为将手指反射的光线汇聚后经透光孔传输至光敏器件。
在具体实施时，针对图2和图5所示的指纹识别模组，由于第一透光层302复用为滤光层05，因此可采用上述具体步骤进行制作，如图18和图19所示。针对图6和图7所示的指纹识别模组，如图20和图21所示，在衬底基板上制作包含多个光敏器件201的图像传感层02之后，且制作准直光学层03之前，还需要在包含多个光敏器件201的图像传感层02上制作滤光层05。针对图8和图9所示的指纹识别模组，如图22和图23所示，在制作第二遮光层303之后，且在制作第二透光层304之前，还需要制作在第二滤光层303上制作滤光层05。
具体地，对于图10至图15所示指纹识别模组的制作方法，如图24至图29所示，可以包括以下步骤：
提供一个第一衬底基板；
在第一衬底基板上制作包含多个光敏器件的图像传感层；
提供一个第二衬底基板；
在第二衬底基板上制作滤光层、准直光学层和包含多个微透镜的导光层；其中，准直光学层包括多个透光孔，每一个微透镜在衬底基板上的正投影完全覆盖一个透光孔；
采用光学胶将具备滤光层、准直光学层和多个微透镜的第二衬底基板与多个光敏器件的入光侧进行贴合，使得贴合后多个透光孔与部分光敏器件一一对应设置，且透光孔在衬底基板上的正投影位于对应设置的光敏器件的正投影内，同时每一个微透镜在衬底基板上的正投影完全覆盖至少两个光敏器件的正投影，且每一个微透镜被配置为将手指反射的光线汇聚后经其所覆盖的透光孔传输至其所覆盖的一个光敏器件。
在具体实施时，针对图10所示的指纹识别模组，在第二衬底基板上制作滤光层、准直光学层和多个微透镜，具体可以通过以下方式进行实现：
如图24所示，在第二衬底基板06上依次制作第一透光层302、第二遮光层303和第二透光层304；其中，第一透光层302复用为滤光层05，第二透光层304在垂直于第二衬底基板06上的厚度小于或等于待制作微透镜401的 焦距，第二遮光层303包括多个第二透光孔；
在第二透光层304上制作多个微透镜401，每一个微透镜401在第二衬底基板06上的正投影完全覆盖一个第二透光孔及至少两个光敏器件201的正投影；
在第二衬底基板06背离第一透光层302的一侧制作第一遮光层301，第一遮光层301包括与多个第二透光孔在垂直于第二衬底基板06的方向上完全重合的多个第一透光孔，且第一遮光层301、第一透光层302、第二遮光层303和第二透光层304构成准直光学层03。
在具体实施时，图11所示指纹识别模组的制作方法与图10所示的指纹识别模组的制作方法相似，不同之处仅在于：如图25所示，在制作第二透光层304之后，且在制作多个微透镜401之前，还需要制作第三遮光层305，其中第三遮光层304覆盖各微透镜401之间的间隙及各微透镜401的边缘区域。
在具体实施时，针对图12所示的指纹识别模组，在第二衬底基板上制作滤光层、准直光学层和多个微透镜，具体可以通过以下方式进行实现：
如图26所示，在第二衬底基板06上依次制作滤光层05和第二透光层304，在垂直于第二衬底基板06的方向上，第二衬底基板06、滤光层05和第二透光/304的厚度之和小于或等于待制作微透镜401的焦距；
在第二透光层304上制作多个微透镜401，每一个微透镜401在第二衬底基板304上的正投影完全覆盖待制作的遮光层所含一个透光孔及至少两个光敏器件201的正投影；
在第二衬底基板06背离滤光层05的一侧依次制作第二遮光层303、第一透光层302和第一遮光层301；其中，第一遮光层301和第二遮光层302包括在垂直于第二衬底基板06方向上完全重合的多个透光孔，且第一遮光层301、第一透光层302、第二遮光层303和第二透光层304构成准直光学层03。
在具体实施时，图13所示指纹识别模组的制作方法与图12所示的指纹识别模组的制作方法相似，不同之处仅在于：如图27所示，在制作第二透光层304之后，且在制作多个微透镜401之前，还需要制作第三遮光层305，其 中第三遮光层304覆盖各微透镜401之间的间隙及各微透镜401的边缘区域。
在具体实施时，针对图14所示的指纹识别模组，在第二衬底基板上制作滤光层、准直光学层和多个微透镜，具体可以通过以下方式进行实现：
如图28所示，在第二衬底基板06上依次制作滤光层05、第一遮光层301、第一透光层302、第二遮光层303、第二透光层304和多个棱镜04；其中，
第一遮光层301和第二遮光层302包括在垂直于第二衬底基板06方向上的多个透光孔，且第一遮光层301、第一透光层302、第二遮光层303和第二透光层304构成准直光学层03；
每一个微透镜401在第二衬底基板06上的正投影完全覆盖一个透光孔及至少两个光敏器件201的正投影。
在具体实施时，图15所示指纹识别模组的制作方法与图14所示的指纹识别模组的制作方法相似，不同之处仅在于：如图29所示，在制作第二透光层304之后，且在制作多个微透镜401之前，还需要制作第三遮光层305，其中第三遮光层304覆盖各微透镜401之间的间隙及各微透镜401的边缘区域。
基于同一发明构思，本公开实施例提供了一种显示装置，如图30所示，包括显示模组08，位于显示模组08显示面的相对侧的指纹识别模组，以及位于显示模组08与指纹识别模组之间的胶粘层09；其中，指纹识别模组为上述指纹识别模组，胶粘层09在显示模组08上的正投影位于显示模组08的边框区域(即显示区域AA的周边区域)，使得多个微透镜401与显示模组08之间具有胶粘层09围成的空气层(air gap)。可选地，胶粘层09可以为光学胶(OCA)或光敏胶(OCR)。显示模组08可以为有机电致发光(OLED)显示模组、量子点(QLED)发光显示模组或微发光二极管(Micro-LED)显示模组。
具体地，在显示模组08可以为有机电致发光(OLED)显示模组时，如图30所示，该显示模组08具体可以包括：第三衬底基板801、第二栅绝缘层802、层间绝缘层803、第二晶体管804、阳极806、像素界定层807、发光功能层R/G/B、支撑层808、阴极809、封装层810、粘合层811和保护盖板812。 在指纹识别过程中，指纹F的反射光经阳极806之间的区域透射至微透镜401上，并由微透镜401汇聚后经准直光学层03传输至一个光敏器件201。由于一个微透镜401对应覆盖多个光敏器件201，使得该微透镜401可将本应传输至多个光敏器件201上的反射光汇聚至了其中一个光敏器件201上，因此有效提高了光敏器件201接受到的反射光强度，提高了指纹识别的准确性。
可选地，该显示装置可以为：手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪、智能手表、健身腕带、个人数字助理等任何具有显示功能的产品或部件。对于显示装置的其它必不可少的组成部分均为本领域的普通技术人员应该理解具有的，在此不做赘述，也不应作为对本发明的限制。另外，由于该显示装置解决问题的原理与上述指纹识别模组解决问题的原理相似，因此，该显示装置的实施可以参见上述指纹识别模组的实施例，重复之处不再赘述。
显然，本领域的技术人员可以对本发明实施例进行各种改动和变型而不脱离本发明实施例的精神和范围。这样，倘若本发明实施例的这些修改和变型属于本发明权利要求及其等同技术的范围之内，则本发明也意图包含这些改动和变型在内。

Claims (20)

  1. 一种指纹识别模组，其中，包括：
    衬底基板；
    图像传感层，包括位于所述衬底基板之上的多个光敏器件；
    准直光学层，位于所述多个述光敏器件的入光侧；所述准直光学层包括多个透光孔，所述多个透光孔与部分所述光敏器件一一对应设置，且所述透光孔在所述衬底基板上的正投影位于对应设置的所述光敏器件的正投影内；
    导光层，位于所述准直光学层背离所述多个光敏器件的一侧；所述导光层包括多个微透镜，每一个所述微透镜在所述衬底基板上的正投影完全覆盖一个所述透光孔及至少两个所述光敏器件的正投影，且每一个所述微透镜被配置为将手指反射的光线汇聚后经其所覆盖的所述透光孔传输至其所覆盖的所述光敏器件。
  2. 如权利要求1所述的指纹识别模组，其中，所述微透镜在所述衬底基板上的正投影中心与其完全覆盖的所述透光孔的正投影中心重合。
  3. 如权利要求1所述的指纹识别模组，其中，所述准直光学层包括层叠设置的第一遮光层、第一透光层、第二遮光层和第二透光层，且所述第一遮光层与所述多个光敏器件邻近，所述第二透光层与所述多个微透镜邻近；其中，
    在垂直于所述衬底基板的方向上，所述第二遮光层与所述多个微透镜所在层之间的距离小于或等于所述微透镜的焦距，所述第二透光层的厚度与所述第一透光层的厚度之比大于或等于1且小于或等于10。
  4. 如权利要求3所述的指纹识别模组，其中，所述透光孔包括：位于所述第一遮光层中的第一透光孔，以及位于所述第二遮光层中的第二透光孔；其中，
    所述第一透光孔在所述衬底基板上的正投影与所述第二透光孔的正投影完全重合。
  5. 如权利要求3所述的指纹识别模组，其中，所述准直光学层还包括：位于所述第二透光层与所述多个微透镜所在层之间的第三遮光层；
    所述第三遮光层在所述衬底基板上的正投影覆盖各所述微透镜之间的空隙并与所述多个微透镜的正投影边缘区域相互交叠。
  6. 如权利要求5所述的指纹识别模组，其中，所述透光孔包括：位于所述第一遮光层中的第一透光孔，以及位于所述第二遮光层中的第二透光孔；其中，
    所述第二透光孔在所述衬底基板上的正投影位于所述第一透光孔的正投影内。
  7. 如权利要求5所述的指纹识别模组，其中，在垂直于所述衬底基板的方向上，所述第一遮光层、所述第二遮光层和所述第三遮光层的厚度大于0μm且小于或等于3μm。
  8. 如权利要求5所述的指纹识别模组，其中，所述第一遮光层、所述第二遮光层和所述第三遮光层的材料为黑矩阵材料、氧化钼、氧化铝或铬金属。
  9. 如权利要求3所述的指纹识别模组，其中，所述第一透光层和/或所述第二透光层复用为滤光层。
  10. 如权利要求3所述的指纹识别模组，其中，还包括：滤光层，所述滤光层位于所述多个微透镜所在层与所述准直光学层之间，或位于所述准直光学层与所述多个光敏器件所在层之间，或位于相邻所述遮光层与所述透光层之间。
  11. 如权利要求9或10所述的指纹识别模组，其中，所述滤光层被配置为滤除600mm以上的环境光。
  12. 如权利要求9或10所述的指纹识别模组，其中，所述图像传感层、所述准直光学层、所述导光层和所述滤光层为在所述衬底基板上层叠设置的膜层。
  13. 如权利要求1-12任一项所述的指纹识别模组，其中，还包括：与所述多个光敏器件背离所述衬底基板一侧的表面接触的光学胶层。
  14. 一种显示装置，其中，包括显示模组，位于所述显示模组显示面的相对侧的指纹识别模组，以及位于所述显示模组与所述指纹识别模组之间的胶粘层；其中，
    所述指纹识别模组为如权利要求1-13任一项所述的指纹识别模组；
    所述胶粘层在所述显示模组上的正投影位于所述显示模组的边框区域。
  15. 一种指纹识别模组的制作方法，其中，包括：
    提供一个衬底基板；
    在所述衬底基板上依次制作包含多个光敏器件的图像传感层、准直光学层和包含多个微透镜的导光层；其中，
    所述准直光学层包括多个透光孔，所述多个透光孔与部分所述光敏器件一一对应设置，且所述透光孔在所述衬底基板上的正投影位于对应设置的所述光敏器件的正投影内；
    每一个所述微透镜在所述衬底基板上的正投影完全覆盖一个所述透光孔及至少两个所述光敏器件的正投影，且每一个所述微透镜被配置为将手指反射的光线汇聚后经其所覆盖的所述透光孔传输至其所覆盖的一个所述光敏器件。
  16. 一种指纹识别模组的制作方法，其中，包括：
    提供一个第一衬底基板；
    在所述第一衬底基板上制作包含多个光敏器件的图像传感层；
    提供一个第二衬底基板；
    在所述第二衬底基板上制作滤光层、准直光学层和包含多个微透镜的导光层；其中，所述准直光学层包括多个透光孔，每一个所述微透镜在所述衬底基板上的正投影完全覆盖一个所述透光孔；
    采用光学胶将具备所述滤光层、所述准直光学层和所述多个微透镜的所述第二衬底基板与所述多个光敏器件的入光侧进行贴合，使得贴合后所述多个透光孔与部分所述光敏器件一一对应设置，且所述透光孔在所述衬底基板上的正投影位于对应设置的所述光敏器件的正投影内，同时每一个所述微透 镜在所述衬底基板上的正投影完全覆盖至少两个所述光敏器件的正投影，且每一个所述微透镜被配置为将手指反射的光线汇聚后经其所覆盖的所述透光孔传输至其所覆盖的一个所述光敏器件。
  17. 如权利要求16所述的制作方法，其中，在所述第二衬底基板上制作滤光层、准直光学层和多个微透镜，具体包括：
    在所述第二衬底基板上依次制作第一透光层、第二遮光层和第二透光层；其中，所述第一透光层复用为滤光层，所述第二透光层在垂直于所述第二衬底基板上的厚度小于或等于待制作微透镜的焦距，所述第二遮光层包括多个第二透光孔；
    在所述第二透光层上制作多个所述微透镜，每一个所述微透镜在所述第二衬底基板上的正投影完全覆盖一个所述第二透光孔及至少两个所述光敏器件的正投影；
    在所述第二衬底基板背离所述第一透光层的一侧制作第一遮光层，所述第一遮光层包括与所述多个第二透光孔在垂直于所述第二衬底基板的方向上完全重合的多个第一透光孔，且所述第一遮光层、所述第一透光层、所述第二遮光层和所述第二透光层构成所述准直光学层。
  18. 如权利要求16所述的制作方法，其中，在所述第二衬底基板上制作滤光层、准直光学层和多个微透镜，具体包括：
    在所述第二衬底基板上依次制作滤光层和第二透光层，在垂直于所述第二衬底基板的方向上，所述第二衬底基板、所述滤光层和所述第二透光层的厚度之和小于或等于待制作微透镜的焦距；
    在所述第二透光层上制作多个所述微透镜，每一个所述微透镜在所述第二衬底基板上的正投影完全覆盖待制作的遮光层所含一个透光孔及至少两个所述光敏器件的正投影；
    在所述第二衬底基板背离所述滤光层的一侧依次制作第二遮光层、第一透光层和第一遮光层；其中，所述第一遮光层和所述第二遮光层包括在垂直于所述第二衬底基板方向上完全重合的多个所述透光孔，且所述第一遮光层、 所述第一透光层、所述第二遮光层和所述第二透光层构成所述准直光学层。
  19. 如权利要求16所述的制作方法，其中，在所述第二衬底基板上制作滤光层、准直光学层和多个微透镜，具体包括：
    在所述第二衬底基板上依次制作滤光层、第一遮光层、第一透光层、第二遮光层、第二透光层和多个棱镜；其中，
    所述第一遮光层和所述第二遮光层包括在垂直于所述第二衬底基板方向上的多个所述透光孔，且所述第一遮光层、所述第一透光层、所述第二遮光层和所述第二透光层构成所述准直光学层；
    每一个所述微透镜在所述第二衬底基板上的正投影完全覆盖一个所述透光孔及至少两个所述光敏器件的正投影。
  20. 如权利要求17-19任一项所述的制作方法，其中，在制作所述第二透光层之后，且在制作所述多个微透镜之间，还包括：
    在所述第二透光层上制作第三遮光层，所述第三遮光层在所述第二衬底基板上的正投影覆盖各所述微透镜之间的空隙并与所述多个微透镜的正投影边缘区域相互交叠。
PCT/CN2020/117904 2020-09-25 2020-09-25 指纹识别模组、其制作方法及显示装置 WO2022061769A1 (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
PCT/CN2020/117904 WO2022061769A1 (zh) 2020-09-25 2020-09-25 指纹识别模组、其制作方法及显示装置
CN202080002117.7A CN116075869A (zh) 2020-09-25 2020-09-25 指纹识别模组、其制作方法及显示装置
US17/419,835 US20220320170A1 (en) 2020-09-25 2020-09-25 Fingerprint recognition module, fabricating method thereof and display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2020/117904 WO2022061769A1 (zh) 2020-09-25 2020-09-25 指纹识别模组、其制作方法及显示装置

Publications (1)

Publication Number Publication Date
WO2022061769A1 true WO2022061769A1 (zh) 2022-03-31

Family

ID=80844684

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2020/117904 WO2022061769A1 (zh) 2020-09-25 2020-09-25 指纹识别模组、其制作方法及显示装置

Country Status (3)

Country Link
US (1) US20220320170A1 (zh)
CN (1) CN116075869A (zh)
WO (1) WO2022061769A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113076854A (zh) * 2021-03-30 2021-07-06 武汉华星光电技术有限公司 显示面板

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8204283B2 (en) * 2009-01-16 2012-06-19 Gingy Technology Inc. Fingerprint input module
CN210605739U (zh) * 2019-07-12 2020-05-22 深圳市汇顶科技股份有限公司 指纹检测装置和电子设备
CN210924598U (zh) * 2019-09-30 2020-07-03 指纹卡有限公司 生物识别成像装置和电子装置
CN111523440A (zh) * 2020-04-21 2020-08-11 上海思立微电子科技有限公司 屏下光学指纹识别装置
CN111626100A (zh) * 2020-03-26 2020-09-04 北京迈格威科技有限公司 屏下指纹装置及显示模组

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8204283B2 (en) * 2009-01-16 2012-06-19 Gingy Technology Inc. Fingerprint input module
CN210605739U (zh) * 2019-07-12 2020-05-22 深圳市汇顶科技股份有限公司 指纹检测装置和电子设备
CN210924598U (zh) * 2019-09-30 2020-07-03 指纹卡有限公司 生物识别成像装置和电子装置
CN111626100A (zh) * 2020-03-26 2020-09-04 北京迈格威科技有限公司 屏下指纹装置及显示模组
CN111523440A (zh) * 2020-04-21 2020-08-11 上海思立微电子科技有限公司 屏下光学指纹识别装置

Also Published As

Publication number Publication date
US20220320170A1 (en) 2022-10-06
CN116075869A (zh) 2023-05-05

Similar Documents

Publication Publication Date Title
CN107799541B (zh) 集成化感测模块及其制造方法以及集成化感测组件
CN108734073B (zh) 一种检测装置及终端设备
US11003886B2 (en) Display apparatus including a fingerprint identification device
CN112001337B (zh) 一种指纹识别基板及显示装置
US10691916B1 (en) Pattern recognition device, array substrate and display apparatus
WO2018153068A1 (zh) 指纹识别器件和oled显示装置
US12105306B2 (en) Texture image acquiring device, display device, and collimator
CN111291710B (zh) 指纹识别模组及显示装置
CN110720106B (zh) 指纹识别的装置和电子设备
CN108764147B (zh) 一种显示面板及显示装置
WO2020192117A1 (en) Array substrate and fabricating method thereof, and display apparatus
CN211349383U (zh) 指纹识别的装置和电子设备
CN114625264B (zh) 显示装置
WO2018188670A1 (zh) 一种检测装置及终端设备
WO2022016547A1 (zh) 指纹识别装置和电子设备
CN112699761A (zh) 一种指纹识别面板和指纹识别显示模组
CN112364760A (zh) 一种显示装置
WO2022061769A1 (zh) 指纹识别模组、其制作方法及显示装置
CN115171168A (zh) 电子设备
CN112993184A (zh) 一种显示基板及显示装置
CN114019707B (zh) 一种显示基板、显示面板及显示装置
CN115835733A (zh) 一种显示面板及显示装置
WO2021258941A1 (zh) 纹路识别装置以及电子装置
WO2022174448A1 (zh) 显示基板及显示装置
CN212783451U (zh) 具有抗杂光干扰结构的光学生物特征感测器

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20954621

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 10.07.2023)

122 Ep: pct application non-entry in european phase

Ref document number: 20954621

Country of ref document: EP

Kind code of ref document: A1