WO2022057866A1 - Module optique - Google Patents

Module optique Download PDF

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Publication number
WO2022057866A1
WO2022057866A1 PCT/CN2021/118850 CN2021118850W WO2022057866A1 WO 2022057866 A1 WO2022057866 A1 WO 2022057866A1 CN 2021118850 W CN2021118850 W CN 2021118850W WO 2022057866 A1 WO2022057866 A1 WO 2022057866A1
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WO
WIPO (PCT)
Prior art keywords
laser
film resistor
optical
thin film
optical module
Prior art date
Application number
PCT/CN2021/118850
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English (en)
Chinese (zh)
Inventor
孙飞龙
张俊红
张晓廓
张加傲
王欣南
慕建伟
Original Assignee
青岛海信宽带多媒体技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202022052192.4U external-priority patent/CN213302589U/zh
Priority claimed from CN202011223403.4A external-priority patent/CN112398541B/zh
Application filed by 青岛海信宽带多媒体技术有限公司 filed Critical 青岛海信宽带多媒体技术有限公司
Publication of WO2022057866A1 publication Critical patent/WO2022057866A1/fr

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/40—Transceivers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/50—Transmitters
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/50—Transmitters
    • H04B10/516—Details of coding or modulation

Definitions

  • the present disclosure relates to the technical field of optical communication, and in particular, to an optical module.
  • Optical communication technology will be used in new business and application modes such as cloud computing, mobile Internet, and video.
  • the optical module realizes the function of photoelectric conversion in the field of optical communication technology, and is one of the key components in optical communication equipment.
  • the optical signal intensity input by the optical module to the external optical fiber directly affects the quality of optical fiber communication.
  • the present disclosure provides an optical module, comprising: a circuit board; a light emitting sub-module electrically connected to the circuit board for converting an electrical signal into an optical signal; the first signal pin and the second signal pin; the first signal pin and the second signal pin penetrate through the upper and lower surfaces of the tube seat; the TEC is arranged on the surface of the tube seat and is used to adjust the temperature of the edge-emitting laser; the base, It is arranged on the surface of the TEC to support the edge-emitting laser; the edge-emitting laser is arranged on the surface of the base to emit light signals from the side; the reflector is arranged on the front of the laser in the light-emitting direction, and is provided with a slope for The signal beam from the laser is reflected; the ceramic substrate is vertically arranged on the surface of the socket and between the laser and the first signal pin; wherein: the base has a first metal area and a second metal area; the ceramic substrate has interconnected The top metal area and the side metal area of It is connected
  • the present disclosure provides an optical module, including: a circuit board; a light emission sub-module electrically connected to the circuit board for converting an electrical signal into an optical signal; the light emission sub-module includes: a ceramic substrate , used to carry devices; EML laser, carried by the ceramic substrate, including a light-emitting area and an electro-absorption modulation area, used to convert electrical signals into optical signals; a first capacitor; a first thin film resistor, set on the ceramic substrate The surface is connected in series with the first capacitor to form an RC circuit, and the RC circuit is connected in parallel with the electro-absorption modulation region; the second thin-film resistor is arranged on the surface of the ceramic substrate and is connected in parallel with the first thin-film resistor, using for compensating the deviation resistance of the first thin film resistor.
  • FIG. 1 is a connection diagram of an optical communication system according to some embodiments
  • FIG. 2 is a structural diagram of an optical network terminal according to some embodiments.
  • FIG. 3 is a structural diagram of an optical module according to some embodiments.
  • FIG. 4 is an exploded structural diagram of an optical module according to some embodiments.
  • FIG. 5 is a schematic diagram of an internal structure of an optical module according to some embodiments.
  • FIG. 6 is a schematic structural diagram of a light emission sub-module according to some embodiments.
  • FIG. 7 is a schematic diagram of an exploded structure of a light emission sub-module according to some embodiments.
  • FIG. 8 is another exploded schematic diagram of a light emission sub-module according to some embodiments.
  • FIG. 9 is a schematic structural diagram of an optical module with a tube base and pins provided on the tube base removed according to some embodiments.
  • FIG. 10 is a schematic structural diagram of a socket and pins provided on the socket according to some embodiments.
  • FIG. 11 is a schematic diagram of a light path corresponding to a mirror according to some embodiments.
  • FIG. 12 is a schematic diagram of an exploded structure of another light emission sub-module according to some embodiments.
  • FIG. 13 is a schematic diagram of a partial structure of a light emission sub-module according to some embodiments.
  • FIG. 14 is a schematic diagram of an equivalent circuit of the connection of components in a light emitting sub-module according to some embodiments.
  • 15 is a graph of a laser high frequency reflection test according to some embodiments.
  • optical communication technology light is used to carry the information to be transmitted, and the optical signal carrying the information is transmitted to information processing equipment such as computers through information transmission equipment such as optical fibers or optical waveguides to complete the transmission of information. Since optical signals have passive transmission characteristics when transmitted through optical fibers or optical waveguides, low-cost and low-loss information transmission can be achieved.
  • the signals transmitted by information transmission equipment such as optical fibers or optical waveguides are optical signals, while the signals that can be recognized and processed by information processing equipment such as computers are electrical signals. To establish an information connection between them, it is necessary to realize the mutual conversion of electrical signals and optical signals.
  • the optical module realizes the mutual conversion function of the above-mentioned optical signal and electrical signal in the technical field of optical fiber communication.
  • the optical module includes an optical port and an electrical port.
  • the optical module realizes optical communication with information transmission equipment such as optical fibers or optical waveguides through the optical port, and realizes electrical connection with an optical network terminal (for example, an optical cat) through the electrical port. It is mainly used to realize power supply, I2C signal transmission, data signal transmission and grounding; optical network terminals transmit electrical signals to information processing equipment such as computers through network cables or wireless fidelity technology (Wi-Fi).
  • Wi-Fi wireless fidelity technology
  • FIG. 1 is a connection diagram of an optical communication system according to some embodiments.
  • the optical communication system mainly includes a remote server 1000, a local information processing device 2000, an optical network terminal 100, an optical module 200, an optical fiber 101 and a network cable 103;
  • the optical fiber 101 is connected to the remote server 1000 , and the other end is connected to the optical network terminal 100 through the optical module 200 .
  • the optical fiber itself can support long-distance signal transmission, such as signal transmission of several kilometers (6 kilometers to 8 kilometers). On this basis, if repeaters are used, ultra-long distance transmission can theoretically be achieved. Therefore, in a common optical communication system, the distance between the remote server 1000 and the optical network terminal 100 can usually reach several kilometers, tens of kilometers or hundreds of kilometers.
  • the local information processing device 2000 may be any one or more of the following devices: a router, a switch, a computer, a mobile phone, a tablet computer, a television, and the like.
  • the physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing device 2000 and the optical network terminal 100 .
  • the connection between the local information processing device 2000 and the remote server 1000 is completed by the optical fiber 101 and the network cable 103 ; and the connection between the optical fiber 101 and the network cable 103 is completed by the optical module 200 and the optical network terminal 100 .
  • the optical module 200 includes an optical port and an electrical port.
  • the optical port is configured to be connected to the optical fiber 101, so that the optical module 200 and the optical fiber 101 can establish a two-way optical signal connection; electrical signal connection.
  • the optical module 200 realizes the mutual conversion of optical signals and electrical signals, so as to establish a connection between the optical fiber 101 and the optical network terminal 100 .
  • the optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input into the optical network terminal 100
  • the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and input into the optical fiber 101 .
  • the optical network terminal 100 includes a substantially rectangular housing, and an optical module interface 102 and a network cable interface 104 disposed on the housing.
  • the optical module interface 102 is configured to access the optical module 200, so that the optical network terminal 100 and the optical module 200 can establish a bidirectional electrical signal connection;
  • the network cable interface 104 is configured to access the network cable 103, so that the optical network terminal 100 and the network cable 103 are connected.
  • a connection is established between the optical module 200 and the network cable 103 through the optical network terminal 100 .
  • the optical network terminal 100 transmits the electrical signal from the optical module 200 to the network cable 103, and transmits the signal from the network cable 103 to the optical module 200.
  • the optical network terminal 100 as the host computer of the optical module 200, can monitor the optical module 200. work.
  • the host computer of the optical module 200 may also include an optical line terminal (Optical Line Terminal, OLT) and the like.
  • OLT Optical Line Terminal
  • a bidirectional signal transmission channel is established between the remote server 1000 and the local information processing device 2000 through the optical fiber 101 , the optical module 200 , the optical network terminal 100 and the network cable 103 .
  • FIG. 2 is a structural diagram of an optical network terminal according to some embodiments.
  • the optical network terminal 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on the surface of the PCB circuit board 105 , and an electrical connector disposed inside the cage 106 .
  • the electrical connector is configured to be connected to the electrical port of the optical module 200 ; the heat sink 107 has protrusions such as fins that increase the heat dissipation area.
  • the optical module 200 is inserted into the cage 106 of the optical network terminal 100 , and the optical module 200 is fixed by the cage 106 .
  • the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106 , so that the optical module 200 and the optical network terminal 100 establish a bidirectional electrical signal connection.
  • the optical port of the optical module 200 is connected to the optical fiber 101 , so that the optical module 200 and the optical fiber 100 establish a bidirectional electrical signal connection.
  • FIG. 3 is a structural diagram of an optical module according to some embodiments
  • FIG. 4 is an exploded structural diagram of an optical module according to some embodiments.
  • the optical module 200 includes a casing, a circuit board 300 disposed in the casing, and an optical transceiver;
  • the casing includes an upper casing 201 and a lower casing 202.
  • the upper casing 201 is covered on the lower casing 202 to form the above casing with two openings 204 and 205; the outer contour of the casing generally presents a square body.
  • the lower casing 202 includes a bottom plate and two lower side plates located on both sides of the bottom plate and perpendicular to the bottom plate;
  • the upper casing 201 includes a cover plate, and two side plates located on both sides of the cover plate and perpendicular to the cover plate.
  • An upper side plate is combined with the two side plates by two side walls, so as to realize that the upper casing 201 is covered on the lower casing 202 .
  • the direction of the connection between the two openings 204 and 205 may be consistent with the length direction of the optical module 200 , or may be inconsistent with the length direction of the optical module 200 .
  • the opening 204 is located at the end of the light module 200 (the left end of FIG. 3 ), and the opening 205 is also located at the end of the light module 200 (the right end of FIG. 3 ).
  • the opening 204 is located at the end of the optical module 200
  • the opening 205 is located at the side of the optical module 200 .
  • the opening 204 is an electrical port, and the golden fingers of the circuit board 300 protrude from the electrical port 204 and are inserted into the host computer (such as the optical network terminal 100 );
  • the optical fiber 101 is connected to the optical transceiver device inside the optical module 200 .
  • the combination of the upper case 201 and the lower case 202 is used to facilitate the installation of the circuit board 300, optical transceivers and other devices into the case, and the upper case 201 and the lower case 202 can form encapsulation protection for these devices.
  • the upper case 201 and the lower case 202 can form encapsulation protection for these devices.
  • the upper casing 201 and the lower casing 202 are generally made of metal material, which is beneficial to achieve electromagnetic shielding and heat dissipation.
  • the optical module 200 further includes an unlocking component 203 located on the outer wall of the housing thereof, and the unlocking component 203 is configured to realize a fixed connection between the optical module 200 and the upper computer, or release the connection between the optical module 200 and the upper computer fixed connection.
  • the unlocking components 203 are located on the outer walls of the two lower side panels 2022 of the lower casing 202, and include engaging components matching with the cage of the upper computer (eg, the cage 106 of the optical network terminal 100).
  • the optical module 200 is inserted into the cage of the upper computer, the optical module 200 is fixed in the cage of the upper computer by the engaging part of the unlocking part 203; when the unlocking part 203 is pulled, the engaging part of the unlocking part 203 moves accordingly, thereby changing the The connection relationship between the engaging member and the host computer is used to release the engaging relationship between the optical module 200 and the host computer, so that the optical module 200 can be pulled out from the cage of the host computer.
  • the circuit board 300 includes circuit traces, electronic components (such as capacitors, resistors, triodes, MOS tubes) and chips (such as MCU, laser driver chip, limiter amplifier chip, clock data recovery CDR, power management chip, data processing chip DSP) Wait.
  • electronic components such as capacitors, resistors, triodes, MOS tubes
  • chips such as MCU, laser driver chip, limiter amplifier chip, clock data recovery CDR, power management chip, data processing chip DSP) Wait.
  • the circuit board 300 connects the above-mentioned devices in the optical module 200 together according to the circuit design through circuit traces, so as to realize functions such as power supply, electrical signal transmission, and grounding.
  • the circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the bearing function. For example, the rigid circuit board can carry chips smoothly; the rigid circuit board can also be inserted into the electrical connector in the upper computer cage. , in some embodiments of the present disclosure, metal pins/gold fingers are formed on one end surface of the rigid circuit board for connecting with the electrical connector; these are inconvenient to be realized by the flexible circuit board.
  • Flexible circuit boards are also used in some optical modules; flexible circuit boards are generally used in conjunction with rigid circuit boards.
  • flexible circuit boards can be used to connect the rigid circuit boards and optical transceivers as a supplement to the rigid circuit boards.
  • the optical transceiver device 400 includes two parts, an optical transmitting sub-module and an optical receiving sub-module, which are respectively used for transmitting and receiving optical signals.
  • the emission sub-module generally includes a light emitter, a lens and a light detector, and the lens and the light detector are located on different sides of the light emitter. The front and back sides of the light emitter emit light beams respectively.
  • the lens is used to converge the front of the light emitter.
  • the emitted light beam makes the light beam emitted by the light transmitter a convergent light so as to be easily coupled to an external optical fiber; the light detector is used to receive the light beam emitted from the reverse side of the light transmitter to detect the optical power of the light transmitter.
  • the light emitted by the optical transmitter enters the optical fiber after being condensed by the lens, and the light detector detects the luminous power of the optical transmitter to ensure the constancy of the emitted optical power of the optical transmitter.
  • the optical transceiver device 400 will be described in detail below.
  • FIG. 5 is a schematic diagram of the internal structure of an optical module according to some embodiments; as shown in FIG. 5 , the optical transceiver device 400 in the foregoing embodiment includes an optical transmitting sub-module 500 and an optical receiving sub-module 700 , and the optical module further includes a round square The tube body 600 and the optical fiber adapter 800.
  • the optical transceiver submodule is preferably connected to the optical fiber by the optical fiber adapter 800, that is, the optical fiber adapter 800 is inlaid on the circular square tube body 600 for connecting the optical fiber.
  • the round tube body 600 is provided with a third nozzle 603 into which the optical fiber adapter 800 is inserted.
  • the sub-module 700 establishes an optical connection with the optical fiber adapter 800 respectively, and the light emitted and received in the optical transceiver device are both transmitted through the same optical fiber in the optical fiber adapter, that is, the same optical fiber in the optical fiber adapter is the optical transceiver device.
  • the transmission channel, the optical transceiver device realizes the single-fiber bidirectional optical transmission mode.
  • the square tube body 600 is used to carry the light emitting sub-module 500 and the light receiving sub-module 700.
  • the round tube body 600 is made of metal material, which is beneficial to realize electromagnetic shielding and heat dissipation.
  • the round tube body 600 is provided with a first nozzle 601 and a second nozzle 602 , and the first nozzle 601 and the second nozzle 602 are respectively disposed on the adjacent side walls of the round tube body 600 .
  • the first orifice 601 is provided on the side wall of the circular square tube body 600 in the length direction
  • the second orifice 602 is provided on the side wall of the circular square tube body 600 in the width direction.
  • the light-emitting sub-module 500 is embedded in the first nozzle 601, and through the first nozzle 601, the light-emitting sub-module 500 thermally contacts the round tube body 600; the light-receiving sub-module 700 is embedded in the second nozzle 602, and passes through the second pipe The port 602 , the light receiving sub-module 700 thermally contacts the round tube body 600 .
  • the light emitting sub-module 500 and the light receiving sub-module 700 are directly press-fitted into the round tube body 600, and the round tube body 600 is directly or Contact via a thermally conductive medium.
  • the round and square tube body can be used for the heat dissipation of the light emitting sub-module 500 and the light receiving sub-module 700 , so as to ensure the heat dissipation effect of the light emitting sub-module 500 and the light receiving sub-module 700 .
  • FIG. 6 is a schematic structural diagram of a light emitting sub-module according to some embodiments
  • FIG. 7 is a schematic diagram of an exploded structure of a light emitting sub-module according to some embodiments
  • FIG. 8 is another exploded structure of a light emitting sub-module according to some embodiments Schematic.
  • the light emission sub-module 500 provided by the embodiment of the present disclosure will be described below with reference to FIG. 6 , FIG. 7 and FIG. 8 . As shown in FIGS.
  • the light emission sub-module 500 includes a tube base 501, a TEC 502 disposed on the surface of the tube base, a base 503 disposed on the surface of the TEC 502, an edge-emitting laser 504 disposed on the surface of the base 503, and a reflector 505;
  • the light emitting sub-module 500 adopts a TO coaxial package, and the tube base 501 is used to support and carry the TEC502, the base 503, the edge-emitting laser 504, and the reflector 505; the lower surface of the TEC502 and the tube base
  • the top surface of TEC501 is in direct contact with the bottom surface of base 503, that is, one heat exchange surface of TEC502 is directly attached to the top surface of tube base 501, and the other heat exchange surface is directly attached to the base 503.
  • the lower surface; the base 503 is used to support and carry the edge-emitting laser 504 and the mirror 505.
  • the edge-emitting laser 504 is placed horizontally on the surface of the base 503, and the reflector 505 is arranged on one side of the base 503.
  • the base 503 is pasted on the TEC 502 using silver glue, and the optoelectronic devices such as the edge-emitting laser 504 and the mirror 505 are pasted on the base 503 using glue.
  • the material of the base 503 includes but is not limited to tungsten copper, raftable alloy, SPCC (Steel Plate Cold rolled Commercial, cold-rolled carbon steel), copper, etc., so as to facilitate the transfer of heat generated by the optoelectronic device to the TEC 502 for heat dissipation.
  • the laser in the present disclosure adopts an edge-emitting form, which emits optical signals from the side, and emits optical signals through the reflection of the mirror 505.
  • the edge-emitting laser 504 includes a laser chip and a laser ceramic heat sink. The laser chip is welded on the laser ceramic heat sink with gold-tin solder for emitting the signal beam.
  • the edge-emitting laser 504 is very sensitive to temperature changes, and the edge-emitting laser 504 needs to be heated or cooled by the TEC 502 to adjust the edge-emitting laser 504 to be at a constant operating temperature.
  • the light emitting sub-module 500 of the present disclosure further includes a thermistor 508 .
  • the thermistor 508 is arranged on the base 503 and is used to collect the operating temperature of the edge-emitting laser 504 to realize the adjustment of the operating temperature of the opposite-edge-emitting laser 504 . monitor.
  • the temperature of the edge-emitting laser 504 is collected in real time through the thermistor 508, and the collected temperature of the edge-emitting laser 504 is fed back to the drive circuit of the thermoelectric cooler.
  • the temperature of the edge emitting laser 504 is determined, and the heating or cooling current is input into the TEC 502 to realize the heating or cooling of the edge emitting laser 504, so that the temperature of the edge emitting laser 504 can be controlled within the target temperature range.
  • the thermistor 508 is disposed on the near side of the edge-emitting laser 504 .
  • the edge-emitting laser 504 In order to couple the signal beam emitted by the edge-emitting laser 504 into the external optical fiber along the light-transmitting direction of the tube base 501 , the edge-emitting laser 504 is usually installed vertically, that is, the setting direction is parallel to the tube base 501 , and the heat conduction surface of the TEC502 is At this time, in order to adjust the working temperature of the edge-emitting laser 504 by the TEC502, the heat conduction surface needs to be turned over by the L-shaped heat sink.
  • the L-shaped heat sink has a lower thermal conductivity coefficient, which will reduce the temperature control effect of the edge-emitting laser 504 and the TEC 502.
  • the edge-emitting laser 504 in the present disclosure is placed horizontally on the surface of the base 503, and the heat-conducting surface of the edge-emitting laser 504 is also a horizontal plane.
  • the base 503 is used as a heat transfer medium between the TEC502 and the edge-emitting laser 504, and the thermal conductivity of the base 503 is relatively large, and the setting method shortens the distance between the TEC502 and the edge-emitting laser 504, and the TEC502 and the base 503 supporting the laser are The contact area between them increases, and when the contact area increases, the heat flux transferred increases, so that the temperature control effect of the TEC 502 opposite the edge-emitting laser 504 can be increased.
  • heat can be transferred between the TEC 502 and the edge-emitting laser 504 , so as to adjust the temperature of the edge-emitting laser 504 .
  • the signal transmission of the edge-emitting laser 504 will be described.
  • the wire bonding length between the laser and signal pins is very important to the performance of high-speed devices.
  • the longer the wire bonding length the greater the parasitic inductance, which is not conducive to the transmission of high-frequency signals. Therefore, in the packaging of high-speed devices, it is hoped that the wire bonding length should be as long as possible.
  • the purpose is to reduce parasitic inductance and optimize the transmission performance of high-frequency signals.
  • the ceramic substrate 506 is selected to realize the connection between the positive and negative electrodes of the laser and the first signal pin and the second signal pin.
  • FIG. 9 is a schematic structural diagram of an optical module according to some embodiments in which the socket and the pins provided on the socket are removed.
  • the base 503 has a first metal area and a second metal area;
  • the ceramic substrate has a top metal area and a side metal area that communicate with each other.
  • the high-frequency signals emitted by the first signal pin and the second signal pin can be transmitted to the edge-emitting laser.
  • Such a connection method can shorten the length of the gold wire between the laser and the signal pin, which is conducive to the transmission of high-frequency signals and optimizes the high-frequency performance of the optical module.
  • the base 503 in the present disclosure is a ceramic base, and specifically, alumina ceramics, aluminum nitride ceramics, etc. can be selected.
  • the ceramic substrate 506 can be selected from alumina ceramics, aluminum nitride ceramics, and the like.
  • the surface of the base 503 is plated with a first metal region and a second metal region, the surface of the ceramic substrate 506 is plated with a third metal region and a fourth metal region, the first metal region, the second metal region, the third metal region and the fourth metal region
  • the regions can be specifically the first copper layer, the second copper layer, the third copper layer and the fourth copper layer, and the first metal region, the second metal region, the third metal region and the fourth metal region are all engraved with the laser chip. Functional circuit for signal transmission.
  • FIG. 10 is a schematic structural diagram of a header and pins provided on the header according to some embodiments.
  • the circumference of the socket 501 in addition to the first signal pin 511 and the second signal pin 512 , the circumference of the socket 501 also includes a laser pin 514 , a base pin 513 , a TEC pin 517 , and a thermistor.
  • Pin 516 and backlight detector pin 515, laser pin 514, base pin 513, TEC pin 517, thermistor pin 516 and backlight detector pin 515 are functional pins whose main function is to supply power.
  • each pin is electrically connected to the corresponding electrical device through a wire.
  • each pin is electrically connected to a corresponding electrical device through a gold wire.
  • the laser, the base, the TEC, the thermal surface resistance, and the backlight detector are respectively connected to the corresponding laser pins 514 , base pins 513 , TEC pins 517 , thermistor pins 516 and the backlight through gold wires.
  • the positive and negative electrodes of the laser are connected to the first signal pin and the second signal pin through the ceramic substrate 506, rather than the positive and negative electrodes of the laser and the first signal pin through the gold wire.
  • the positive and negative electrodes of the laser are selected to be connected to the first signal pin and the second signal pin through the ceramic substrate 506. , and the functional pins have lower requirements for efficient signal transmission, so in this disclosure, the laser, the base, the TEC, the thermal surface resistance and the backlight detector are respectively connected to the corresponding laser pins 514 and base pins 513 through gold wires. , TEC pin 517, thermistor pin 516 and backlight detector pin 515.
  • the present disclosure is further provided with a column 509, which is in direct contact with the ceramic substrate 506 and can support the ceramic substrate 506, thereby increasing the ceramic substrate 506. The stability of the substrate 506 .
  • the light emission sub-module 500 further includes a backlight detector 507, and the backlight detector 507 is arranged on one side of the edge-emitting laser 504, that is, the backlight detector 507 and the mirror 505 are respectively located on the side of the laser 504.
  • the mirror 505 is located on the light-emitting light path on the front of the edge-emitting laser 504
  • the backlight detector 507 is located on the light-emitting light path on the back of the laser 504
  • the backside of the edge-emitting laser 504 emits light beams into the backlight Detector 507.
  • the light power of the light beam emitted from the back side of the edge-emitting laser 504 is detected by the backlight detector 507, thereby detecting the light power of the light beam emitted by the front side of the laser 504.
  • the laser 504 can be dynamically adjusted. If the backlight detector 507 detects that the optical power becomes larger, the emitted optical power of the edge-emitting laser 504 becomes larger, which can be controlled by controlling the laser.
  • the drive circuit reduces the driving power applied to the laser to make the edge-emitting laser 504 emit less light; if the backlight detector 507 detects that the optical power becomes smaller, the edge-emitting laser 504 emits less light, which can be driven by controlling the laser.
  • the circuit increases the driving current of the laser to make the edge-emitting laser 504 emit less light, thereby ensuring the constant light-emitting power of the laser.
  • the light-emitting direction of the edge-emitting laser 504 is inconsistent with the light-transmitting direction of the socket 501.
  • the light path of the beam emitted by the laser 504 is arranged on the optical path.
  • the main optical axis of the signal beam is perpendicular to the stem 501 .
  • the reflector 505 in the embodiment of the present disclosure is used to provide a reflective surface for light reflection, so as to change the transmission direction of the light beam emitted by the edge-emitting laser 504, so that the light-emitting direction of the edge-emitting laser 504 is inconsistent with the light-transmitting direction of the tube base 501 In this case, the signal beam can still be transmitted through the light window of the socket 501 .
  • the reflector 505 is provided with a bottom platform, a top platform and a slope connecting the bottom platform and the top platform, the bottom platform is fixed on the surface of the base 503, the top platform is parallel to the surface of the base 503, and the slope is used to reflect the reflection from the side
  • the signal beam of the light-emitting laser 504 is emitted so that the light-emitting direction of the signal beam after reflection is perpendicular to the socket 501 .
  • FIG. 11 is a schematic diagram of an optical path corresponding to a mirror according to some embodiments.
  • the reflecting mirror 505 can be a 45-degree reflecting prism, and in some embodiments of the present disclosure, it is composed of a bottom platform, a top platform, three side surfaces and an inclined surface, the bottom platform is pasted on the base 503, and the top platform is parallel to the base 503, the three sides are perpendicular to the base 503, the inclined plane connects the top platform and the bottom platform, and the inclined plane is located in the emission direction of the edge-emitting laser 504, and the inclined surface is coated with a reflective film for reflecting the signal emitted by the edge-emitting laser 504 light beam, so that the outgoing direction of the reflected signal beam is perpendicular to the tube base 501.
  • a flat glass coated with a reflective film is arranged on the inclined surface of the base, and is used to reflect the light emitted by the edge-emitting laser 504. signal beam, so that the light-emitting direction of the reflected signal beam is perpendicular to the socket 501 .
  • the reflector 505 can also be composed of a bottom platform, a top platform, three side surfaces and two inclined surfaces.
  • the bottom platform is pasted on the base 503
  • the top platform is parallel to the base 503
  • the three sides are perpendicular to the base 503
  • one side is connected to the bottom platform and is close to the light-emitting surface of the edge-emitting laser 504, the other two sides are respectively connected to the top platform and the bottom platform, one slope is connected to the top platform and the bottom platform, and the other slope is connected to the top platform of the mirror 505.
  • the side of the light-emitting surface of the edge-emitting laser 504, and the inclined plane connecting the top platform and the side near the light-emitting surface of the edge-emitting laser 504 is located in the emission direction of the edge-emitting laser 504, and the inclined surface is coated with a reflective film for reflecting the edge-emitting laser 504
  • the light-emitting direction of the reflected signal beam is consistent with the light-transmitting direction of the tube base 501 .
  • the flat glass coated with the reflective film can be pasted on the inclined surface with glue, and the glue includes but is not limited to silver glue, UV glue, epoxy glue, UV epoxy glue and the like.
  • the shape of the reflector provided by the embodiment of the present disclosure is not limited to the above-mentioned shape, as long as it satisfies assembly and total reflection, and can convert the light-emitting direction of the signal beam to be consistent with the light-transmitting direction of the tube base 501 , that is, The main optical axis of the reflected signal beam is perpendicular to the tube base 501 , which all belong to the protection scope of the embodiments of the present disclosure.
  • the present disclosure provides an optical module including a circuit board and a light emitting sub-module.
  • the light emitting sub-module includes a tube base.
  • the TEC is arranged on the surface of the tube base, the base is arranged on the surface of the TEC, and the laser is placed on the side of the base.
  • the signal beam emitted by the laser is reflected by the mirror, and then the signal beam is emitted in the direction perpendicular to the tube base, and the TEC realizes heat transfer between the base and the laser;
  • the light emission sub-module also includes a ceramic substrate, and the laser can communicate with the signal through the ceramic substrate. Signal transmission between pins.
  • the heat transfer between the TEC and the laser does not need to be realized through the heat sink L-shaped heat sink substrate, and the TEC can realize the heat transfer between the TEC and the laser through the base disposed horizontally with it.
  • the heat transfer method shortens the distance between the TEC and the laser, thereby increasing the temperature control effect of the TEC on the laser.
  • FIG. 12 is a schematic diagram of an exploded structure of another light emission sub-module according to some embodiments
  • FIG. 13 is a schematic diagram of a partial structure of a light emission sub-module according to some embodiments; as shown in FIGS. 12 and 13 , in the embodiments of the present disclosure
  • the light emission sub-module 500 includes a tube base 501, a TEC 502 disposed on the surface of the tube base, a base 503 disposed on the surface of the TEC 502, and a ceramic substrate 504A disposed on the surface of the base 503.
  • the light emission sub-module 500 adopts TO coaxial package, the tube base 501 is used to support and carry the TEC502, the base 503, and the ceramic substrate 504A; That is, one heat exchange surface of the TEC502 is directly attached to the upper surface of the tube base 501, and the other heat exchange surface is directly attached to the lower surface of the base 503; the base 503 is used to support the ceramic substrate 504A.
  • the base 503 mainly plays the role of fan heat and bearing.
  • the material of the base 503 includes but is not limited to tungsten copper, raftable alloy, SPCC (Steel Plate Cold rolled Commercial, cold-rolled carbon steel), copper, etc.
  • the heat generated is transferred to the TEC502 for heat dissipation;
  • the ceramic substrate 504A is selected from alumina ceramics, aluminum nitride ceramics, etc.
  • the surface of the ceramic substrate 504A is engraved with the functional circuit of the laser chip for signal transmission.
  • the surface of the ceramic substrate 504A is provided with EML
  • the laser 505A and the EML laser 505A are integrated devices of the laser DFB and the electro-absorption modulator EA.
  • the laser DFB converts the electrical signal into an optical signal
  • the electro-absorption modulator EA encodes and modulates the optical signal and outputs it, so that the output optical signal carries information.
  • Optical converters and optical modulators, electro-absorption modulators are one of the commonly used optical modulators. They are widely used in the transmission of high-speed optical signals due to their fast response speed and low power consumption.
  • the EML laser 505A is very sensitive to temperature changes, and the EML laser 505A needs to be heated or cooled by the TEC 502 to adjust the EML laser 505A to be at a constant operating temperature.
  • the light emission sub-module 500 of the present disclosure further includes a thermistor, which is arranged on the base 503 and is used to collect the working temperature of the EML laser 505A to monitor the working temperature of the EML laser 505A.
  • the temperature of the EML laser 505A is collected in real time through the thermistor, and the collected temperature of the EML laser 505A is fed back to the drive circuit of the thermoelectric cooler, and the drive circuit of the thermoelectric cooler is based on the received EML laser
  • the temperature of 505A determines the heating or cooling current input to the TEC 502 to achieve heating or cooling of the EML laser 505A, so that the temperature of the EML laser 505A can be controlled within the target temperature range.
  • the golden finger introduces the electrical signal into the laser driver chip, and the laser driver chip transmits the electrical signal to the EML laser 505A, and then uses the EML laser 505A to convert the electrical signal into an optical signal, where the laser driver
  • the chip and the EML laser 505A are connected by a wire, and the wire has a certain characteristic impedance. Since the output impedance of the laser driver chip is rated, when the output impedance of the EML laser 505A does not match the characteristic impedance, there will be a gap between the laser driver chip and the laser. The transmission signal will be lost, reducing the integrity of the signal.
  • the output impedance of the EML laser 505A matches the characteristic impedance. It should be noted that the meaning of matching here refers to the EML laser 505A.
  • the output impedance value reaches the characteristic impedance value, that is, the impedance value output by the EML laser 505A is consistent with the characteristic impedance value.
  • the first thin film resistor 506A is connected in parallel at the EML laser 505A.
  • the first thin film resistor 506A has an impedance matching function, and finally the impedance output by the EML laser 505A is consistent with the characteristic impedance. Therefore, the first thin film resistor 506A can be It is called a matched resistor; because the space of the ceramic substrate 504A is small, generally the first thin film resistor 506A adopts a thin film resistor, which is sintered through a region of the ceramic substrate 504A.
  • the process is complicated, but because the first thin film resistor 506A is in the During processing, a deviation impedance that deviates from the ideal impedance by 5%-10% towards the upper limit will be generated.
  • the deviation impedance is a force majeure factor.
  • the existence of the deviation impedance will reduce the impedance matching performance of the first thin film resistor 506A. Therefore, a second thin film resistor is provided in the present disclosure. 507A, the second thin film resistor 507A is connected in parallel with the first thin film resistor 506A to compensate the deviation impedance deviating from the upper limit.
  • the second thin film resistor 507A has Similarly to the upper limit characteristic, the impedance of the second thin film resistor 507A is 1375 ⁇ after the upper limit is offset.
  • the equivalent resistance of the first thin film resistor 506A and the second thin film resistor 507A in parallel is 52.88 ⁇ , which is closer to the ideal impedance value of 50 ⁇ , so that The impedance matching performance of the first thin film resistor 506A is improved, wherein the second thin film resistor 507A can be in the form of a thin film resistor.
  • the first thin film resistor 506A is used to make the impedance value output by the EML laser 505A consistent with the characteristic impedance value
  • the second thin film resistor 507A is used to compensate for the deviation generated by the first thin film resistor 506A during processing
  • the impedance can eliminate the deviation impedance as much as possible, so that the impedance of the first thin film resistor 506A can be restored to the ideal impedance value as much as possible
  • the EML laser 505A in the present disclosure includes a light emitting region 505A1 and an electroabsorption modulation region 505A2, and the first thin film resistor 506A and The electro-absorption modulation area 505A2 is connected in parallel
  • the second thin-film resistor 507A is connected in parallel with the first thin-film resistor 506A
  • the second thin-film resistor 507A is also connected in parallel with the electro-absorption modulation area 505A2, that is, the first thin-film resistor 506A
  • the EML laser 505A when the impedance output by the EML laser 505A cannot be well matched with the characteristic impedance, the EML laser 505A will reflect part of the signal, and the signal will return to the EML laser 505A along the original path, reducing the performance of the signal, and may even cause the signal
  • the first thin film resistor 506A and the second thin film resistor in the present disclosure can absorb the reflected part of the signal at the same time, and the second thin film resistor in the present disclosure is disposed in front of the EML laser 505A, which can further suppress the EML laser 505A reflected signal.
  • FIG. 15 is a test chart of the high frequency reflection of the laser according to some embodiments, and the test results are shown in FIG. 15 , FIG. 15 There are two curves in it. For the convenience of description, the thinner curve is called the first curve, and the thicker curve is called the second curve. The first curve is the result of not connecting the second thin film resistor 507A in parallel in front of the EML laser 505A.
  • the second curve is a schematic diagram of the result of connecting a second thin film resistor 507A in parallel in front of the EML laser 505A. It can be seen from Figure 14 that adding a parallel resistor in the 5-13GHZ frequency band has a better effect of suppressing reflection, which corresponds to the laser Has better signal integrity.
  • the optical module provided in the embodiment of the present disclosure further includes a first capacitor 508 and a second capacitor 509A, wherein the first capacitor 508 and the second capacitor 509A are both disposed on the surface of the base 503 , that is, the ceramic substrate 504A, the first capacitor 508 and the second capacitor 509A are all disposed on the surface of the base 503, wherein the first capacitor 508 and the first thin film resistor 506A are connected in series to form an RC circuit, and the RC circuit, the second thin film resistor and the electro-absorption modulation region are three They are connected in parallel with each other.
  • the circuit is arranged on the periphery of the EML laser 505A.
  • the surface of the base 503 has a first circuit area that can transmit signals.
  • the first circuit area is a signal line transmission layer formed of a metal material.
  • the negative electrode is arranged on two opposite surfaces, wherein the lower surface (bottom surface) is provided with a negative electrode, the upper surface (top surface) is provided with a positive electrode, the negative electrode of the first capacitor 508 is connected to the first circuit area, the first The anode of the capacitor 508 is connected to one end of the first thin film resistor 506A.
  • the first capacitor 508 has the function of passing AC and blocking DC, thereby reducing power consumption.
  • the second capacitor 509A has the function of filtering, specifically, it can reduce the amplitude of the voltage fluctuation of the EML laser 505A.
  • the second capacitor 509A also has a positive electrode and a negative electrode, and the positive electrode and the negative electrode are arranged on two opposite surfaces, wherein The lower surface (bottom surface) is provided with a negative electrode, the upper surface (top surface) is provided with a positive electrode, the negative electrode of the second capacitor 509A is also connected to the first circuit area, and the positive electrode of the second capacitor 509A is connected to the light emitting area 505A1.
  • both ends of the first thin film resistor 506A are respectively provided with a first pad and a second pad, and a third pad is also provided next to the second pad, the first pad and the second pad are The area formed by the third pad and the area occupied by the EML laser 505A is arranged next to the area occupied by the EML laser 505A.
  • the metal wire between the first capacitor 508 and the first thin film resistor 506A is defined as the first metal wire, and the first thin film
  • the metal wire between the resistor 506A and the EML laser 505A is defined as the second metal wire
  • the metal wire between the second capacitor 509A and the EML laser 505A is defined as the third metal wire
  • one end of the first metal wire is welded to the first capacitor.
  • the other end is welded on the first pad, one end of the second metal wire is welded on the second pad, the other end is welded on the positive electrode of the electro-absorption modulation area 505A2, and one end of the third metal wire is welded on the
  • the positive pole of the second capacitor 509A is soldered to a node of the third pad, and a fourth metal wire is drawn from the other node of the third pad, and one end of the fourth metal wire is welded to the third pad, The other end is welded to the positive electrode of the light-emitting area 505A1.
  • first wire between the positive electrode of the first capacitor and the first thin-film resistor
  • second wire is provided between the first thin-film resistor and the positive electrode of the electro-absorption modulation region
  • the second capacitor and the third wire between the light-emitting regions
  • a fourth wire is arranged between the positive electrode of the electro-absorption modulation region and the fourth pad
  • the first wire, the second wire, the third wire and the fourth wire can be gold
  • the made gold wire of course, can also be made of other metal materials.
  • FIG. 14 is a schematic diagram of an equivalent circuit of the connection of components in the light emission sub-module according to some embodiments; as shown in FIG. 14 , the first thin film resistor and the first capacitor are connected in series to form an RC circuit, where the RC circuit and the electro-absorption modulation area are located The branch where the second thin film resistor is located is connected in parallel with each other, and the second capacitor is connected in parallel with the branch where the light-emitting area is located.
  • the surface of the ceramic substrate 504A has a second circuit area and a third circuit area.
  • the second circuit area and the third circuit area are signal line transmission layers formed of metal materials, wherein the negative electrode of the EML laser 505A is connected to the second circuit area.
  • the EML laser The fifth metal wire is connected between 505A and the third circuit area, which mainly provides power signals for the EML laser 505A.
  • the first pad, the second pad, the third pad, the first thin film resistor 506A, the third circuit area and the EML laser 505A have less space on the surface of the ceramic substrate 504A for the second thin film resistor.
  • the resistance value is often relatively large, usually between 1000 ⁇ -1500 ⁇ , but the space available for it is small, when the resistance with such a large resistance value is arranged in a small space, the second thin film resistor 507A is arranged in the broken line in the present disclosure.
  • One end of the second thin film resistor 507A is grounded, and the other end is connected to the pad formed in the third circuit area.
  • the present disclosure provides an optical module including a circuit board and a light emitting sub-module.
  • the light emitting sub-module includes a ceramic substrate, an EML laser, a first capacitor, a second capacitor, a first thin film resistor and a second thin film resistor.
  • the EML laser is composed of The ceramic substrate carries a laser and an electro-absorption modulator, wherein the first capacitor is used to control communication, AC and DC blocking to reduce power consumption, the second capacitor is used to reduce the voltage fluctuation of the laser, and the first thin film resistor is used to make the
  • the output impedance of the laser matches the characteristic impedance between the laser driver chip and the laser, but the first thin film resistor will produce a deviation impedance of 5%-10% from the ideal impedance to the upper limit during processing, so the second thin film resistor is used to It is possible to eliminate the deviation impedance of the first thin film resistor and restore it to the vicinity of the ideal impedance of the first thin film resistor as much as possible, wherein the respective connection modes are: the first thin film resistor and the electro-absorption modulator are connected in parallel, and the second thin film resistor and the first thin film resistor are connected in parallel.
  • the resistors are connected in parallel, the positive electrode of the first capacitor is connected to one end of the first thin-film resistor, the other end of the first thin-film resistor is connected to the positive electrode of the electro-absorption modulator, and the second capacitor is electrically connected to the laser. Match with the characteristic impedance to ensure the signal integrity between the laser driver chip and the laser; at the same time, when the laser impedance does not match the characteristic impedance, part of the signal reflected by the laser will return along the original path, causing signal distortion.
  • the first thin film resistor and the second thin film resistor can absorb the reflected signal, and the second thin film resistor is located in front of the EML laser and has a strong effect of suppressing the reflected signal of the EML laser, so the first thin film resistor and the second thin film resistor in the present disclosure.
  • the thin film resistor can not only match the output impedance of the laser with the characteristic impedance, but also absorb the signal reflected by the EML laser.

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)

Abstract

L'invention concerne un module optique (200), comprenant une carte de circuit imprimé (300) et un émetteur de lumière (500). L'émetteur de lumière (500) comprend un siège de tube (501). Un TEC (502) est disposé sur la surface du siège de tube (501), une base (503) est disposée sur la surface du TEC (502), et un laser (504) est un laser à émission latérale, qui émet un signal lumineux au moyen de la réflexion d'un miroir (505). Le TEC (502) met en œuvre un transfert de chaleur avec le laser (504) au moyen de la base (503). En même temps, l'émetteur de lumière (500) comprend en outre un substrat en céramique (506). Le laser (504) peut transmettre des signaux avec des broches de signal (511, 212) au moyen du substrat en céramique (506). Le TEC (502) peut réaliser le transfert de chaleur avec le laser (504) à travers sa base disposée horizontalement (503). La manière de transfert de chaleur raccourcit la distance entre le TEC (502) et le laser (504), de telle sorte que l'effet de régulation de température du TEC (502) sur le laser (504) peut être augmentée, et la longueur du fil d'or entre les broches de signal (511, 212) et le laser (504) peut être raccourcie, optimisant la performance haute fréquence.
PCT/CN2021/118850 2020-09-17 2021-09-16 Module optique WO2022057866A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CN202022052192.4U CN213302589U (zh) 2020-09-17 2020-09-17 一种光模块
CN202022052192.4 2020-09-17
CN202011223403.4A CN112398541B (zh) 2020-11-05 2020-11-05 一种光模块
CN202011223403.4 2020-11-05

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CN115933070A (zh) * 2022-07-21 2023-04-07 青岛海信宽带多媒体技术有限公司 一种光模块及激光组件
CN116990916A (zh) * 2023-09-26 2023-11-03 武汉钧恒科技有限公司 一种基于铌酸锂调制器和硅光探测器的光模块
WO2023240949A1 (fr) * 2022-06-14 2023-12-21 青岛海信宽带多媒体技术有限公司 Module optique
WO2024093058A1 (fr) * 2022-11-02 2024-05-10 青岛海信宽带多媒体技术有限公司 Module optique

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WO2023240949A1 (fr) * 2022-06-14 2023-12-21 青岛海信宽带多媒体技术有限公司 Module optique
CN115933070A (zh) * 2022-07-21 2023-04-07 青岛海信宽带多媒体技术有限公司 一种光模块及激光组件
WO2024093058A1 (fr) * 2022-11-02 2024-05-10 青岛海信宽带多媒体技术有限公司 Module optique
CN116990916A (zh) * 2023-09-26 2023-11-03 武汉钧恒科技有限公司 一种基于铌酸锂调制器和硅光探测器的光模块

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