WO2021218463A1 - Module optique - Google Patents

Module optique Download PDF

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Publication number
WO2021218463A1
WO2021218463A1 PCT/CN2021/080965 CN2021080965W WO2021218463A1 WO 2021218463 A1 WO2021218463 A1 WO 2021218463A1 CN 2021080965 W CN2021080965 W CN 2021080965W WO 2021218463 A1 WO2021218463 A1 WO 2021218463A1
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WO
WIPO (PCT)
Prior art keywords
optical module
light
circuit board
electrically connected
module according
Prior art date
Application number
PCT/CN2021/080965
Other languages
English (en)
Chinese (zh)
Inventor
张晓磊
慕建伟
吴彦甫
李永勃
黄绪杰
葛建平
王扩
于琳
Original Assignee
青岛海信宽带多媒体技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202020661340.XU external-priority patent/CN212647079U/zh
Priority claimed from CN202020661750.4U external-priority patent/CN212083735U/zh
Priority claimed from CN202020661336.3U external-priority patent/CN212083733U/zh
Priority claimed from CN202010340708.7A external-priority patent/CN113552674B/zh
Application filed by 青岛海信宽带多媒体技术有限公司 filed Critical 青岛海信宽带多媒体技术有限公司
Publication of WO2021218463A1 publication Critical patent/WO2021218463A1/fr

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements

Definitions

  • the present disclosure relates to the field of optical communication technology, and in particular to an optical module.
  • optical modules are generally used in this field to transmit and receive light of different wavelengths.
  • an optical module including: a circuit board; a light emitting component, electrically connected to the circuit board, for emitting data optical signals;
  • the light emitting component includes: a housing including a cover plate And a hollow lower casing, wherein the surface of the cover plate close to the lower casing includes: a first lower surface, a second lower surface located on the outer periphery of the first lower surface, the first lower surface protruding from the second lower surface, and the cover
  • the board is welded on the lower casing through the second lower surface; the light emitting device is arranged in the casing and is used for converting the data electrical signal from the circuit board into the data optical signal.
  • another optical module including: a circuit board; a light receiving component electrically connected to the circuit board for receiving data optical signals; the light receiving component includes: a housing including a cover A plate and a hollow lower shell, wherein the surface of the cover plate close to the lower shell includes: a first lower surface, a second lower surface located on the outer periphery of the first lower surface, and the first lower surface protrudes from the second lower surface, The cover plate is welded on the lower casing through the second lower surface; the light receiving device is arranged in the casing and is used for converting the data optical signal into the data electrical signal. .
  • another optical module including: a circuit board; a light emitting component, connected to the circuit board, for emitting data optical signals; the light emitting component includes: a gasket, including insulation and heat conduction Layer, the first grounded metal layer arranged on the upper surface of the insulating and heat-conducting layer, and the high-speed signal line; the first end of the high-speed signal line is electrically connected to the circuit board through wire bonding, and is used to transmit the data electrical signal from the circuit board to the laser Chip, wherein the width of the first end is gradually widened along the opposite direction of the data electrical signal transmission; the laser chip, the cathode is fixed on the first grounded metal layer, and the anode is electrically connected to the second end of the high-speed signal line through wire bonding , Used to transmit data light signals based on data electrical signals.
  • a gasket including insulation and heat conduction Layer, the first grounded metal layer arranged on the upper surface of the insulating and heat-conducting layer, and the high-speed signal line
  • another optical module including: a circuit board; a light emitting component, electrically connected to the circuit board, for emitting data optical signals;
  • the light emitting component includes: a housing, one end portion A light window is provided, and the light window is arranged obliquely with respect to the vertical direction;
  • the light emitting device is arranged in the housing and is electrically connected to the circuit board for converting the data electrical signal from the circuit board into the data light signal, which emits The data light signal is irradiated to the light window along the horizontal direction, and the data light signal is transmitted to the outside of the housing through the light window.
  • another optical module including: a circuit board; a light emitting component electrically connected to the circuit board; the light emitting component includes: a laser chip electrically connected to the circuit board, including a light emitting surface And the backlight surface, the light signal generated by it is emitted through the light emitting surface; the backlight detector is arranged on the backlight surface side of the laser chip and is electrically connected to the circuit board. Collect the light emitted from the backlight surface.
  • Figure 1 is a schematic diagram of the connection relationship of an optical communication terminal
  • Figure 2 is a schematic diagram of the structure of an optical network unit
  • FIG. 3 is a schematic structural diagram of an optical module provided in this embodiment
  • FIG. 4 is a schematic diagram of an exploded structure of an optical module provided in this embodiment
  • FIG. 6 is a schematic diagram of a cross-sectional structure of a light emitting component provided by this embodiment
  • FIG. 7 is a schematic diagram of an exploded structure of the light emitting component provided by this embodiment.
  • FIG. 8 is a schematic diagram of the overall structure of the housing provided by this embodiment.
  • FIG. 9 is a schematic diagram of a first exploded structure of the housing provided by this embodiment.
  • FIG. 10 is a schematic diagram of a second exploded structure of the housing provided by this embodiment.
  • Figure 11 is a schematic diagram of the structure of the cover provided by this embodiment.
  • FIG. 12 is a schematic diagram of the first cross-sectional structure of the housing provided by this embodiment.
  • FIG. 13 is a schematic diagram of the sealing and welding method of the cover plate and the lower casing provided by this embodiment
  • Figure 14 is a cross-sectional view taken along the A-A direction of the cover plate in Figure 11;
  • 15 is a schematic diagram of a second cross-sectional structure of the housing provided by this embodiment.
  • 16 is a schematic diagram of the split structure of the light window sheet, the light window fixing part, and the isolator provided by this embodiment;
  • FIG. 17 is a schematic diagram of an exploded structure of a light emitting device and a housing provided by an embodiment of the disclosure.
  • FIG. 18 is a schematic diagram of an assembly structure of a light emitting device and a housing provided by an embodiment of the disclosure
  • FIG. 19 is a schematic diagram of an exploded structure of a light emitting device provided by an embodiment of the disclosure.
  • 20 is a schematic diagram of the structure of the spacer and the laser chip provided by the embodiment of the disclosure.
  • FIG. 21 is a schematic diagram of an exploded structure of a gasket provided by an embodiment of the disclosure.
  • FIG. 22 is a schematic diagram of the backside structure of a first ceramic substrate provided by an embodiment of the disclosure.
  • FIG. 23 is a simulation result of the insertion loss of the gasket provided by the embodiment of the disclosure.
  • FIG. 24 is a simulation result of the return loss of the gasket provided by the embodiment of the disclosure.
  • FIG. 25 is a schematic structural diagram of a laser chip provided by an embodiment of the disclosure.
  • FIG. 26 is a schematic diagram of the structure of the spacer and the pin provided by the embodiment of the disclosure.
  • FIG. 27 is a schematic structural diagram of a laser chip and a third diode provided by an embodiment of the disclosure.
  • FIG. 28 is a first structural schematic diagram of a gasket, a laser chip, and a backlight detector provided by an embodiment of the disclosure
  • FIG. 29 is a schematic diagram of a second structure of a spacer, a laser chip, and a backlight detector provided by an embodiment of the disclosure.
  • FIG. 30 is a schematic diagram of a first structure of a backlight detector provided by an embodiment of the disclosure.
  • FIG. 31 is a schematic diagram of a first structure of a backlight detector provided by an embodiment of the disclosure.
  • optical fiber communication uses information-carrying optical signals to be transmitted in optical fibers/optical waveguides, and the passive transmission characteristics of light in optical fibers can realize low-cost and low-loss information transmission.
  • information processing equipment such as computers uses electrical signals, which requires mutual conversion between electrical signals and optical signals in the signal transmission process.
  • the optical module implements the above-mentioned photoelectric conversion function in the field of optical fiber communication technology, and the mutual conversion of optical signals and electrical signals is the core function of the optical module.
  • the optical module realizes the electrical connection with the external host computer through the golden finger on the circuit board.
  • the main electrical connections include power supply, I2C signal, data signal transmission and grounding, etc.
  • the electrical connection method realized by the golden finger has become the optical module industry.
  • the standard method, based on this, the circuit board is an essential technical feature in most optical modules.
  • Figure 1 is a schematic diagram of the connection relationship of an optical communication terminal.
  • the connection of an optical communication terminal mainly includes an optical network unit 100, an optical module 200, an optical fiber 101, and a network cable 103;
  • One end of the optical fiber is connected to the remote server, and the other end of the network cable is connected to the local information processing equipment.
  • the connection between the local information processing equipment and the remote server is completed by the connection of the optical fiber and the network cable; and the connection between the optical fiber and the network cable is performed by the optical network with the optical module The unit is complete.
  • the optical port of the optical module 200 is connected to the optical fiber 101 to establish a two-way optical signal connection with the optical fiber; the electrical port of the optical module 200 is connected to the optical network unit 100 to establish a two-way electrical signal connection with the optical network unit; the optical module implements optical signals Mutual conversion with electrical signals, thereby realizing the establishment of a connection between the optical fiber and the optical network unit; in an embodiment of the present disclosure, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network unit 100, The electrical signal from the optical network unit 100 is converted into an optical signal by the optical module and input into the optical fiber.
  • the optical module 200 is a tool for realizing the mutual conversion of photoelectric signals, and does not have the function of processing data. During the foregoing photoelectric conversion process, the information has not changed.
  • the optical network unit has an optical module interface 102, which is used to connect to the optical module and establish a two-way electrical signal connection with the optical module; the optical network unit has a network cable interface 104, which is used to connect to a network cable and establish a two-way electrical signal connection with the network cable; A connection is established between the module and the network cable through the optical network unit.
  • the optical network unit transmits the signal from the optical module to the network cable, and transmits the signal from the network cable to the optical module, and the optical network unit serves as the optical module
  • the upper computer monitors the work of the optical module.
  • the remote server establishes a two-way signal transmission channel with the local information processing equipment through optical fibers, optical modules, optical network units, and network cables.
  • Common information processing equipment includes routers, switches, electronic computers, etc.; the optical network unit is the upper computer of the optical module, which provides data signals to the optical module and receives data signals from the optical module.
  • the common optical module upper computer also has optical lines Terminal and so on.
  • FIG 2 is a schematic diagram of the optical network unit structure.
  • the optical network unit 100 has a circuit board 105, and a cage 106 is provided on the surface of the circuit board 105; an electrical connector is provided in the cage 106 for accessing optical module electrical ports such as golden fingers;
  • a radiator 107 is provided on the cage 106, and the radiator 107 has a convex structure such as fins to increase the heat dissipation area.
  • the optical module 200 is inserted into the optical network unit. Specifically, the electrical port of the optical module is inserted into the electrical connector in the cage 106, and the optical port of the optical module is connected to the optical fiber 101.
  • the cage 106 is located on the circuit board and wraps the electrical connectors on the circuit board in the cage; the optical module is inserted into the cage, and the optical module is fixed by the cage. The heat generated by the optical module is conducted to the cage through the optical module housing, and finally passes through the cage.
  • the radiator 107 is diffused.
  • FIG. 3 is a schematic structural diagram of an optical module 200 according to an embodiment of the disclosure
  • FIG. 4 is an exploded structural schematic diagram of an optical module 200 according to this embodiment.
  • the optical module 200 provided by the embodiment of the present disclosure includes an upper housing 201, a lower housing 202, an unlocking handle 203, a circuit board 30, a light emitting component 50 and a light receiving component 60.
  • the upper casing 201 is covered on the lower casing 202 to form a wrapping cavity with two openings; the outer contour of the wrapping cavity generally presents a square shape.
  • the lower casing includes a main board and a On both sides of the main board, there are two side plates arranged perpendicularly to the main board; the upper casing includes a cover plate, and the cover plate covers the two side plates of the upper casing to form a wrapping cavity; the upper casing may also include a cover The two side walls on both sides of the plate and the two side walls arranged perpendicular to the cover plate are combined with the two side plates to realize that the upper shell is covered on the lower shell.
  • the two openings can be two openings (204, 205) in the same direction, or two openings in different directions; one of the openings is the electrical port 204, and the gold finger of the circuit board protrudes from the electrical port 204 , Inserted into the upper computer such as the optical network unit; the other opening is the optical port 205, which is used for external optical fiber access to connect the light emitting component 50 and the light receiving component 60 inside the optical module; the circuit board 30, the light emitting component 50 and the light receiving component 60 and other optoelectronic devices are located in the package cavity.
  • the assembly method of the upper shell and the lower shell is used to facilitate the installation of the circuit board 30, the light emitting assembly 50 and the light receiving assembly 60 into the shell.
  • the upper shell and the lower shell form the outermost layer of the optical module.
  • Encapsulation and protection shell; the upper shell and the lower shell are generally made of metal materials, which is conducive to electromagnetic shielding and heat dissipation; generally, the shell of the optical module is not made into an integrated structure, so that when assembling circuit boards and other devices, positioning parts, The heat dissipation and electromagnetic shielding structure cannot be installed, and it is not conducive to production automation.
  • the unlocking handle 203 is located on the outer wall of the wrapping cavity/lower housing 202, and is used to realize the fixed connection between the optical module and the upper computer, or to release the fixed connection between the optical module and the upper computer.
  • the unlocking handle 203 has an engaging structure that matches the cage of the host computer; pulling the end of the unlocking handle can make the unlocking handle move relative to the surface of the outer wall; the optical module is inserted into the cage of the host computer, and the optical module is locked by the engaging structure of the unlocking handle. Fixed in the cage of the host computer; by pulling the unlocking handle, the locking structure of the unlocking handle moves accordingly, and then the connection relationship between the locking structure and the host computer is changed, so as to release the optical module and the upper computer. The optical module is withdrawn from the cage of the host computer.
  • the circuit board 30 is provided with circuit traces, electronic components (such as capacitors, resistors, transistors, MOS tubes) and chips (such as microprocessor MCU2045, laser driver chips, limiting amplifiers, clock data recovery CDR, power management chips, and data Processing chip DSP) and so on.
  • electronic components such as capacitors, resistors, transistors, MOS tubes
  • chips such as microprocessor MCU2045, laser driver chips, limiting amplifiers, clock data recovery CDR, power management chips, and data Processing chip DSP
  • the circuit board 30 connects the electrical components in the optical module according to the circuit design through circuit wiring to achieve electrical functions such as power supply, electrical signal transmission, and grounding.
  • the circuit board 30 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also carry out the carrying function. For example, the rigid circuit board can carry the chip smoothly; when the light emitting component 50 and the light receiving component 60 are on the circuit board, The rigid circuit board can also provide a stable load; the rigid circuit board can also be inserted into the electrical connector in the upper computer cage.
  • a metal pin/gold is formed on one end surface of the rigid circuit board. Fingers are used to connect with electrical connectors; these are not easy to implement with flexible circuit boards.
  • Some optical modules also use flexible circuit boards as a supplement to rigid circuit boards; flexible circuit boards are generally used in conjunction with rigid circuit boards, for example, flexible circuit boards can be used to connect between rigid circuit boards and optical transceiver devices.
  • the light emitting component 50 and the light receiving component 60 are respectively used to implement the transmission of optical signals and the reception of optical signals.
  • the light emitting component 50 in this embodiment adopts a coaxial package, which is physically separated from the circuit board 30, and is electrically connected through a flexible board 40; The boards are physically separated, and electrical connections are achieved through flexible boards.
  • FIG. 5 is a schematic diagram of the overall structure of the light emitting component provided by this embodiment
  • FIG. 6 is a schematic cross-sectional structure diagram of the light emitting component provided by this embodiment
  • FIG. 7 is a schematic diagram of an exploded structure of the light emitting component provided by this embodiment.
  • the light emitting assembly in this embodiment mainly includes a housing 51, a sealing pipe body 52, an adjusting sleeve 53 and an optical fiber adapter 54.
  • the housing 51 is generally made of a metal material.
  • the housing 51 is provided with a light emitting device 70.
  • One end of the housing 51 is electrically connected to the flexible board 40 through pins, and the other end is connected to one end of the sealed pipe body 52.
  • a focusing lens can be arranged in the sealed pipe body 52, and , The other end of the sealing pipe body 52 abuts against one end of the adjusting sleeve 53, and the sealing pipe body 52 and the adjusting sleeve 53 are welded together by solder.
  • the other end of the adjusting sleeve 53 is sleeved on the optical fiber adaptor 54.
  • the relative position of the optical fiber adaptor 54 and the adjusting sleeve 53 is adjusted so that the focus of the focusing lens in the sealing pipe body 52 is located at the entrance of the optical fiber adaptor 54.
  • the optical fiber adapter 54 and the adjusting sleeve 53 are welded together.
  • the light emitting device 70 in the housing 51 receives the electrical signal transmitted by the flexible board 40, it converts the electrical signal into an optical signal, and then the optical signal passes through the sealing pipe body 52 and The adjusting sleeve 53 enters the optical fiber adapter 54 and emits to the outside of the optical module.
  • FIG. 8 is a schematic diagram of the overall structure of the casing provided by this embodiment
  • FIG. 9 is a schematic diagram of the first exploded structure of the casing provided by this embodiment.
  • the housing 51 in this embodiment includes a cover plate 511 and a lower housing 512.
  • the lower housing 512 is designed as a cavity structure with an open top, and the cover plate 511 is buckled on the lower housing 512.
  • the light emitting device 70 in the housing 51 is connected to an external circuit board through a pin 514, wherein the pin 514 is designed to be compatible with the lower housing 512 Shape, the first end of the pin 514 is inserted into the lower housing 512, and metal traces are plated on the first end, the light emitting device 70 can be electrically connected to the corresponding metal trace by wire bonding, the pin 514
  • One end of the housing 512 is provided with a plurality of pins electrically connected to the metal wiring.
  • the pins are inserted into the flexible board 40 and welded together, and then the flexible board 40 and the circuit board 30 are welded together to realize the housing
  • the light emitting device 70 in the body 51 is electrically connected to the circuit board 30.
  • the pins on the pins 514 can be directly welded to the circuit board 30 to realize the electrical connection between the light emitting device 70 and the circuit board 30. connect.
  • a housing 51 is provided in order to allow the signal emitted by the light emitting device 70 to pass through the housing 51 and transmit to the outside of the housing.
  • a housing 51 is provided in the light emitting direction of the light emitting device 70.
  • the other end of the lower housing 512 is provided with a light window fixing part 513 in this embodiment, and the light window is arranged in the light window fixing part 513.
  • FIG. 10 is a schematic diagram of a second exploded structure of the housing provided by this embodiment.
  • the lower housing 512 is configured by the frame body 512a and the lower housing 512 in this embodiment.
  • the cavity 512b is composed of a cavity 512b.
  • One end of the lower cavity 512b is provided with a notch for mounting the pin 514.
  • the pin 514 is inserted into the notch opened on the lower cavity 512b in the direction indicated by the arrow in FIG.
  • the body 512a is fixed on the lower cavity 512b.
  • the upper surface of the pins 514 is flush with the upper surface of the side wall of the lower cavity 512b, and the frame 512a
  • the lower surface can be designed as a flat surface.
  • FIG. 11 is a schematic diagram of the structure of the cover plate provided by this embodiment.
  • the lower surface of the cover plate 511 is configured as a stepped structure.
  • this embodiment defines the surface of the cover plate 511 close to the lower housing 512 as the lower surface and away from the lower housing.
  • the surface of 512 is defined as the upper surface.
  • the lower surface of the cover plate 511 includes a first lower surface 511b and a second lower surface 511a located on the outer periphery of the first lower surface 511b, and the first lower surface 511b protrudes from the second lower surface 511a.
  • the second lower surface 511a is in contact with the lower housing 512, that is, the cover plate 511 is welded to the lower housing 512 through the second lower surface 511a.
  • the surface 511b is placed in the cavity of the lower housing 512, and at the same time, the step structure formed by the first lower surface 511b and the second lower surface 511a can be used to realize the positioning of the cover plate 511 on the lower housing 512.
  • a step surface 511c formed between the inner wall of the lower housing 512 and the first lower surface 511b and the second lower surface 511a is provided in this embodiment.
  • the distance between is greater than 0 and less than the preset distance value.
  • the surface connecting the first lower surface 511b and the second lower surface 511a is called the step surface 511c.
  • the thickness and the alignment accuracy of the cover plate 511 and the lower housing 512 are required to be set, for example, it is designed to be 0.1 mm, 0.5 mm, and so on.
  • FIG. 12 is a schematic diagram of the first cross-sectional structure of the casing provided by this embodiment
  • FIG. 13 is a schematic diagram of the sealing and welding method of the cover plate and the lower casing provided by this embodiment.
  • solder such as indium solder with a relatively low melting point
  • FIG. 13 the two electrodes of the welding device are placed on the upper surface of the cover plate 511, and the two electrodes are respectively arranged at two parallel sides of the cover plate 511, thus forming parallel sealing welding.
  • the principle of sealing welding belongs to resistance welding. The electrode rotates under the drive of the electrode wheel while moving.
  • the step formed by the first lower surface 511b and the second lower surface 511a is used to realize the positioning of the buckling position of the cover plate 511 on the lower housing 512, thereby effectively preventing the cover plate 511 from sliding relative to the lower housing 512 during welding, especially
  • the torsion of the electrode easily causes the cover plate to slide relative to the lower housing, which leads to the problem of sealing and welding misalignment.
  • the edge thickness of the stepped cover plate is thinner, so the resistance at the edge position is greater.
  • the cover plate 511 and the lower housing The temperature at the 512 contact is higher, which makes it easier to weld the two together. Therefore, the stepped cover plate structure provided by this embodiment can effectively improve the welding quality of the tube and shell, and realize effective sealing and protection of the light emitting device contained therein.
  • Fig. 14 is a cross-sectional view taken along the A-A direction of the cover plate in Fig. 11.
  • a step surface 511c is formed between the first lower surface 511b and the second lower surface 511a, and the included angle ⁇ between the step surface 511c and the second lower surface 511a is greater than 90° and less than 180°, That is, the step between the first lower surface 511b and the second lower surface 511a is designed to have a certain chamfer structure, so that it is convenient to buckle the cover plate 511 to the lower housing 512, and in addition, it can prevent the step surface 511c from interacting with The included angle between the second lower surfaces 511a is too small, resulting in the accumulation of electric charges during sealing.
  • the cover plate 511 is also designed as a square structure, and the cover plate 511 is also designed as a square structure.
  • the corners of the first lower surface 511b are designed as arc-shaped corners; in order to realize the positioning of the cover plate 511 on the lower housing 512, the first lower surface 511b is also designed as a square structure, and the corners of the first lower surface 511b are designed arc-shaped corners;
  • the corner between the surface 511b and the step surface 511c is also designed as an arc corner, that is, the first lower surface 511b to the step surface 511c is a circular arc transition.
  • the method of assembling between the cover plate 511 and the lower housing 512 in the housing 51 is not only suitable for the light emitting assembly, but also for the light receiving assembly, that is, the housing of the light emitting assembly also includes the cover and
  • the lower casing is hollow, and the surface of the cover close to the lower casing also includes a first lower surface and a second lower surface located on the outer periphery of the first lower surface, and the first lower surface protrudes from the second lower surface.
  • the cover plate is welded to the upper housing through the second lower surface; the light receiving device is arranged in the sealed cavity formed by the cover plate and the lower housing to convert the data optical signal received by the optical module into data The electrical signal, and the data electrical signal is transmitted to the circuit board.
  • the cover plate and the lower housing reference may be made to the above-mentioned embodiments.
  • the light emitting device 70 is arranged in the sealed cavity formed by the cover plate 511 and the lower casing 512.
  • the light emitting device 70 receives the data electrical signal transmitted from the circuit board 30, and connects The data light signal is converted into a data light signal, and the data light signal is emitted through the light window sheet 55 provided in the light window fixing part 513.
  • the light window sheet 55 can also be directly fixed to the housing. ⁇ 51 ⁇ Body 51 on.
  • the light window 55 can be made of sapphire glass with better light permeability, of course, it can also be made of other materials, such as quartz glass.
  • the light window 55 is arranged obliquely with respect to the vertical direction in this embodiment, and at the same time, the data light signal emitted by the light emitting device 70 is irradiated to the horizontal direction Light windows 55.
  • the propagation direction of the light emitted by the light emitting device 70 is defined as the horizontal direction
  • the direction perpendicular to the propagation direction of the light is defined as the vertical direction.
  • the incident direction of the light signal emitted by the light emitting device 70 on the light window sheet 55 has a certain angle with respect to the normal of the light window sheet 55, the light reflected by the light window sheet 55 is not It will then return to the light emitting device 70 along the path where the light signal is incident, so that the influence of the reflected light on the light emitting device 70 can be effectively avoided.
  • the inclination angle of the optical surface of the light window 55 with respect to the vertical direction is set to be greater than 0 in this embodiment. ° and less than or equal to 10°. In an embodiment of the present disclosure, the inclination angle of the optical surface of the optical window sheet 55 with respect to the vertical direction is greater than 0° and less than or equal to 4°.
  • FIG. 16 is a schematic diagram of the split structure of the light window sheet, the light window fixing part and the isolator provided by this embodiment.
  • the light window fixing member 513 is also provided with a light window sheet accommodating cavity 513 a for placing the light window sheet 55 and an isolator accommodating cavity 513 b for placing the isolator 56.
  • the isolator 56 is a passive device that allows light to pass in one direction but prevents it from passing in the opposite direction. It is used to restrict the propagation direction of light so that light can only be transmitted in one direction. The light reflected by the optical fiber can be reflected by the isolator. 56 very good isolation, improve the efficiency of light wave transmission.
  • the inner diameter of the isolator accommodating cavity 513b matches the outer diameter of the isolator 56, for example, the inner diameter of the isolator accommodating cavity 513b is equal to the outer diameter of the isolator 56, or the isolator contains The inner diameter of the cavity 513b is slightly larger than the outer diameter of the isolator 56.
  • the isolator 56 is inserted into the isolator accommodating cavity 513b, the outer wall of the isolator 56 is in contact with the inner wall of the isolator accommodating cavity 513b, and then the two are welded together with glue.
  • the length of the isolator 56 can be set to be longer than the depth of the isolator accommodating cavity 513b, that is, after the isolator 56 is installed in the isolator accommodating cavity 513b, a part of the isolator 56 is placed outside the isolator accommodating cavity 513b. On the other hand, if necessary, the isolator 56 is taken out from the isolator accommodating cavity 513b. On the other hand, it is convenient for the installation and positioning of the isolator 56 in the optical axis direction.
  • the light window sheet 55 is arranged to be inclined to the direction away from the light emitting device 70, that is, to the direction of the isolator 55, in this embodiment.
  • the cavity wall for fixing the light window 55 in the light window accommodating cavity 513a in this embodiment is also designed as a surface with a certain inclination angle relative to the vertical direction, which is specifically inclined The angle can be set according to the inclination angle requirement of the light window 55.
  • the cavity wall of the light window accommodating cavity 513a is also set to be inclined 2°, so that the light window 55 can be directly attached to the cavity wall.
  • a through hole is opened on the cavity wall, and the through hole is covered by the light window 55 to ensure the air tightness of the housing 51 and make the light emitting device
  • the light signal emitted by 70 passes through the light window 55 and the through hole in sequence, and then is emitted to the outside of the housing 51.
  • FIG. 17 is a schematic diagram of an exploded structure of a light emitting device and a housing provided by an embodiment of the disclosure
  • FIG. 18 is a schematic diagram of an assembly structure of a light emitting device and the housing provided by an embodiment of the disclosure.
  • the light emitting device 70 in the embodiment includes a TEC (Thermoelectric Cooler) 71, a heat sink 72, a gasket 73, a collimating lens 74, a laser core 75, and a backlight detector 77.
  • TEC Thermoelectric Cooler
  • FIG. 19 is a schematic diagram of an exploded structure of a light emitting device provided by an embodiment of the disclosure.
  • the bottom plate 512c of the housing 51 is provided with a TEC71
  • the upper surface of the TEC71 is provided with a heat sink 72
  • the upper surface of the heat sink 72 is provided with a collimating lens 74 and a gasket 73
  • a laser chip 75 is provided on the surface.
  • the TEC71 is used to guide the heat generated by the laser chip 75 from the bottom plate 512c.
  • the TEC 71 includes an upper heat exchange surface 711, a structural member 712 and a lower heat exchange surface 713.
  • a heat sink 72 is provided on the top of the upper heat exchange surface 711, and the upper heat exchange surface 711 is used to absorb the heat generated by the laser chip 75 transferred from the gasket 73 on the heat sink 72.
  • a structural member 712 is connected to the bottom of the upper heat exchange surface 711.
  • the structural member 712 is fixed on the lower heat exchange surface 713.
  • the structural member 712 is used to transfer the heat absorbed by the upper heat exchange surface 711 to the lower heat exchange surface 713.
  • the exchange surface 713 is fixed on the bottom plate 512c.
  • the bottom plate 512c can conduct the heat of the lower heat exchange surface 713 to the outside of the casing 51.
  • the TEC71 further includes an electrode 714, and the electrode 714 is used to supply power to the TEC71 to achieve a heat dissipation effect.
  • One end of the electrode 714 is electrically connected to the circuit board 30, and the other end of the electrode 714 is fixed on the lower heat exchange surface 713.
  • the circuit board 30 transmits electric energy to the electrode 714, so that the electrode 714 ensures the normal operation of the TEC71.
  • the heat sink 72 can be made of ceramic materials with good thermal conductivity and processing accuracy. Of course, it is not limited to ceramics. It is used to provide a flat bearing surface for the collimating lens 74 and the spacer 73, and also to adjust the laser chip 75. And the height of the collimating lens 74 in the optical path transmission, so that the optical axes of the two coincide, and coincide with the optical axis of the isolator 56 and the optical axis of the optical fiber ferrule in the optical fiber adapter 54 to improve the optical coupling efficiency. The optical signal from the laser chip 75 is transformed into parallel light by the collimator lens 74 to avoid light loss during long-distance transmission, and then enters the isolator 56. Of course, in other embodiments, the heat sink 72 may not be provided.
  • FIG. 20 is a schematic diagram of the structure of a gasket and a laser chip provided by an embodiment of the disclosure.
  • the gasket 73 includes an insulating and thermally conductive layer 731 and a metal layer.
  • the insulating and thermally conductive layer 731 can be made of ceramic materials with good thermal conductivity, good insulation performance and processing accuracy, and of course it is not limited to ceramics.
  • the metal layer provided on the upper surface of the insulating and thermally conductive layer 731 includes a first grounded metal layer 733 and a high-speed signal line 734.
  • the lower surface of the insulating and thermally conductive layer 731 is opposite to the heat sink 72. touch.
  • the first ground metal layer 733 can be laid on both sides of the high-speed signal line 734.
  • the first ground metal layer 733 is connected to the ground pin on the pin 514, and the ground pin on the pin 514 is connected to the ground layer on the circuit board 30 through the flexible board 40.
  • the first end of the high-speed signal line 734 is connected to the high-speed signal pin on the pin 514, and the pin 514 is connected to the circuit board 30 through the flexible board 40, and the high-frequency data transmitted from the circuit board 30 can be transmitted through the pin 514
  • the signal is transmitted to the high-speed signal line 734; the second end of the high-speed signal line 734 is electrically connected to the anode of the laser chip 75; at the same time, the cathode of the laser chip 75 can be welded on the first grounded metal layer 733 by welding or conductive glue; in addition,
  • the laser chip 75 can also be electrically connected to the DC bias pin on the pin 514 to drive the laser chip 75 to emit light. In this way, when the laser chip 75 is working, it can emit a data optical signal based on the high-frequency data electrical signal transmitted by the high-speed signal line 734.
  • the laser chip 75 Since the laser chip 75 generates heat during operation, we record the highest temperature reached by the laser chip 75 as Ton; when the laser chip 75 stops working, it does not emit light, so the temperature of the laser chip 75 begins to decrease , The temperature of the laser chip 75 is denoted as Toff. Generally, there is a temperature drift coefficient between the temperature of the laser chip and the working wavelength. This coefficient is different from different types of laser chips, but it is generally between 0.1 and 0.15 nm/°C, that is, every increase or decrease At one point, its emission wavelength will drift by 0.1 to 0.15 nm. Therefore, each time the laser chip 75 is turned on, it emits light and generates heat. The temperature of the laser chip 75 starts to rise from Toff, and then maintains a stable temperature to Ton.
  • a heating resistor 761 is provided on the gasket 73, and the heating resistor 761 is arranged close to the laser chip. At the same time, the heating resistor 761 is set to heat the laser chip 75 when the laser chip 75 is turned off, so as to stabilize the temperature of the laser chip 75 and reduce the temperature difference caused by the temperature difference between the on and off of the laser chip 75. The emission wavelength drift caused by the drift.
  • the high-speed signal line 734 is designed as two With a straight and long strip structure, even if the high-speed signal line 734 is designed without bending, it can reduce the parasitic at the bend of the signal line compared with the existing L-shaped and M-shaped signal lines with corners.
  • the inductance in turn, can reduce the insertion loss and help improve the high-frequency performance of the optical module.
  • the high-speed signal line 734 and the pin 514 can be connected by wire bonding, that is, connected by a metal wire.
  • the metal wire is usually set to be relatively thin, that is, the diameter is small, and the parasitic inductance introduced by it will be relatively large. With the increase of module communication rate, the parasitic inductance introduced by metal wires is also increasing, and its impact on the high-speed photoelectric performance of the optical module is becoming more and more obvious.
  • the impedance matching requirements between the high-speed signal line 734 and the laser chip 75 And the area of the spacer 73 is getting smaller and smaller, and the width of the high-speed signal line 734 cannot be increased arbitrarily.
  • this embodiment can gradually widen the width of the first end of the high-speed signal line 734 used to connect with the pin 514 in the opposite direction of the transmission of the high-frequency data electrical signal, that is, the first end is set It has a horn shape, which increases the area of the first end of the high-speed signal line 734. Therefore, the number of bonding wires can be increased at the first end of the high-speed signal line 734, thereby increasing the total diameter of the metal wire. The inductance generated during the working process of the optical module can be reduced, and the high-speed photoelectric performance of the optical module can be improved.
  • the width of the first end is a gently widened structure, compared with setting the first end as a rectangular or square signal line with corners, the parasitic capacitance and inductance at the bend of the signal line can be reduced. In turn, the insertion loss can be reduced, and the high-frequency performance of the optical module can be improved.
  • the first end of the high-speed signal line 734 in this embodiment includes a first sub-end 734a and a second sub-end 734b, wherein one end of the first sub-end 734a is connected to the high-speed signal line
  • the middle part of the 734 is connected, and the other end is connected to the second sub-end 734b, and its width is gradually widened along the opposite direction of the data electrical signal transmission, that is, the first sub-end 734a is designed as a trapezoidal structure, and at the same time, the second sub-end
  • the design is a rectangular structure. In this way, the area of the first end portion can be increased, and the problem of sharp corners at the end of the high-speed signal line 734 can be avoided.
  • a matching resistor 762 is also provided on the gasket 73, wherein the first end of the matching resistor 762 is electrically connected to the anode of the laser chip 75, the second end is connected to the first grounded metal layer 733, and the matching resistor 762 is electrically connected to the anode of the laser chip 75.
  • the resistance value of the resistor 762 is equal to the resistance value of the high-speed signal line 734 to achieve impedance matching between the laser chip 75 and the high-speed signal line 734.
  • the laser chip 75 is an electro-absorption modulated laser chip
  • the anode pad of the electro-absorption modulated laser chip includes an electro-absorption modulator pad and a laser pad
  • the electro-absorption modulator pad can be connected to the high-speed circuit by wire bonding and separation.
  • the second end of the signal line 734 is electrically connected to the matching resistor 762, and the laser pad is electrically connected to the laser driving chip on the circuit board 30 through wire bonding.
  • the matching resistor 762 is designed to be composed of a first matching resistor and a second matching resistor connected in series, wherein the first end of the first matching resistor is connected to the anode of the laser chip 75, and the second end is connected to the anode of the laser chip 75.
  • the first end of the second matching resistor is connected, the second end of the second matching resistor is connected to the first grounded metal layer 733, and the resistance values of the first matching resistance and the second matching resistance are both the resistance values of the high-speed signal line 734 One-half of that. In this way, not only the impact of the resistance accuracy of the resistance on the impedance matching can be reduced, but there is also an important factor. If the resistance parasitic of the weak resistance is considered, the above-mentioned series design of the first matching resistance and the second matching resistance is equivalent to the distribution Parasitic capacitance, which in turn will be beneficial to high frequency effects in high frequency bands.
  • a filter capacitor 763 is further provided on the gasket 73, wherein the first end of the filter capacitor 763 is connected to the anode of the laser chip 75 The second end is connected to the first grounded metal layer 733.
  • the first end of the filter capacitor 763 can also be connected to The first ends of the matching resistor 762 are connected together.
  • FIG. 21 is a schematic diagram of an exploded structure of a gasket provided by an embodiment of the disclosure.
  • the insulating and heat-conducting layer 731 in this embodiment includes a first insulating and heat-conducting layer 731a and a second insulating and heat-conducting layer 731b, wherein a first insulating and heat-conducting layer 731a and the second insulating and heat-conducting layer 731b are provided between the Two grounding metal layers 732, the second grounding metal layer 732 may be coated on the lower surface of the first insulating and thermally conductive layer 731a.
  • the upper surface of the first insulating and thermally conductive layer 731a is provided with a high-speed signal line 734 and a first ground metal layer 733 located on both sides of the high-speed signal line 734.
  • the first ground metal layer 733 is provided with a ground hole 735 through which the ground hole 735 passes After the first insulating and thermally conductive layer 731a, it is connected to the second grounded metal layer 732.
  • grounding holes 735 are opened around the high-speed signal line 734 and electrically connected to the second ground metal layer 732, which not only increases the grounding area, but also provides the shortest signal return path for the high-speed signal line 734 and reduces the difference.
  • the area surrounded by the return path of the signal can reduce the electromagnetic interference radiation of the signal, thereby reducing signal loss, ensuring signal integrity, and increasing high-frequency performance.
  • the insulating and thermally conductive layer 731 is designed to sandwich the second grounded metal layer 732, and the ground hole 735 can directly pass through the first insulating and thermally conductive layer 731a and connect to the second grounded metal layer 732, so that the signal-to-ground circuit can be further improved. Short, increase the grounding effect.
  • FIG. 22 is a schematic diagram of the backside structure of the first ceramic substrate provided by an embodiment of the disclosure.
  • the ground holes 735 on both sides of the high-speed signal line 734 are designed to be symmetrically distributed in this embodiment, that is, the left and right sides are arranged symmetrically.
  • the direction of the signal flow is the left-right direction.
  • FIG. 23 is a simulation result of insertion loss of a gasket provided by an embodiment of the disclosure
  • FIG. 24 is a simulation result of return loss of a gasket provided by an embodiment of the disclosure.
  • the area of the grounding metal layer 732 is smaller than the area of the first insulating and heat-conducting layer 731a, that is, the edge of the second grounding metal layer 732 has a certain distance from the edge of the first insulating and heat-conducting layer 731a.
  • the third grounded metal layer is prepared on the sidewall of the first insulating and thermally conductive layer 731a, there is no need to precisely control the height of the third grounded metal layer, for example, even if the third grounded metal layer is plated on the second insulating and thermally conductive layer On the sidewalls of the 731b layer, there will be no problem of connecting the third grounding metal layer and the second grounding metal layer 732 together.
  • the thickness direction of the first insulating and thermally conductive layer 731a is referred to as the height of the third grounded metal layer.
  • the direct modulation method can be adopted, that is, the high-frequency data electrical signal is directly loaded on the laser.
  • the dispersion tolerance limit is low and the transmission distance is relatively long. Short, generally less than 80 kilometers. Therefore, the external modulation method is adopted in this implementation to obtain a larger dispersion tolerance limit.
  • the laser chip 75 is set as an integrated device composed of an electro-absorption modulator (EAM) and a DFB laser (tunable wavelength laser), also known as an electric Absorption modulation (EML) laser, which uses the quantum confinement Stark effect of the electro-absorption modulator and the internal grating coupling to determine the wavelength of the DFB laser integrated in a chip, and then can reduce its volume to reduce the housing 51
  • EAM electro-absorption modulator
  • EML electric Absorption modulation
  • the laser chip 75 can also be composed of two independent chips: a laser that outputs laser light that does not carry a signal, and an electro-absorption modulator that modulates the wavelength output by the laser.
  • FIG. 25 is a schematic structural diagram of a laser chip provided by an embodiment of the disclosure.
  • the electrodes on the upper surface include an active area electrode 751, a grating reflection area electrode 752, a GND ground 753, and an electro-absorption modulator electrode 754.
  • the electrode on the lower surface of the laser chip that is, its cathode, is fixed on the first grounded metal layer 733 of the gasket 73 by welding or conductive glue.
  • the active area electrode 751 and the grating reflection area electrode 752 are respectively It is connected to the laser driving pin and connection on the pin 514, the GND ground 753 is connected to the first ground metal layer 733, and the electro-absorption modulator electrode 754 is connected to the high-speed signal line 734.
  • the DFB laser is used to output light that does not carry a signal, and the continuous output light of the DFB laser is amplitude modulated by the electro-absorption modulator to generate a data optical signal; in addition, the grating reflection area electrode 752 of the DFB laser is changed to inject The current can change the Bragg wavelength, so that the lasing wavelength can be changed, so as to realize the modulation of the output wavelength of the DFB laser.
  • FIG. 26 is a schematic diagram of the structure of the spacer and the pin provided by the embodiment of the disclosure.
  • a first diode 764 is provided on the spacer 73.
  • the anode of the first diode 764 is electrically connected to the electrode of the grating reflection area of the laser chip 75.
  • the laser chip 75 includes a tunable wavelength laser and an electro-absorption modulator.
  • the anode includes an active area electrode and a grating reflection area electrode.
  • the cathode of the first diode 764 is fixed on the first grounded metal layer 733 of the gasket 73 by welding or conductive glue to achieve grounding.
  • the first diode 764 can be set as a clamping diode.
  • the first diode 764 can clamp the voltage from several hundred volts to several tens of volts, and at the same time bear a large amount of voltage to flow away from the ground loop of the first diode 764.
  • a first capacitor 766 is also provided on the gasket 73, wherein one end of the first capacitor 766 is connected to the laser chip 75 respectively.
  • the grating reflection area electrode of 75 is electrically connected to the anode of the first diode 764, and the other end is fixed to the first grounding metal layer 733 of the gasket 73 by welding or conductive glue to achieve grounding.
  • the first capacitor 766, the laser chip 75 and the first diode 764 can be electrically connected by wire bonding.
  • the laser chip 75 can be connected to the laser chip 75 by wire bonding.
  • the first terminal of the first capacitor 766 is connected, and then, the first terminal of the first capacitor 766 is connected to the anode of the first diode 764 through wire bonding.
  • the first capacitor 766 is connected in parallel with the laser chip 75 and the first diode 764. On the one hand, it can filter out the clutter in the signal transmitted to the laser chip 75, and on the other hand, the first diode 764 protects the first capacitor. A capacitor 766 is broken down.
  • this embodiment is further provided with a second diode 765, wherein the anode of the second diode 765 is electrically connected to the active area electrode of the laser chip 75
  • the cathode of the second diode 765 is fixed on the grounding wiring layer of the pin 514 by welding or conductive glue, etc., to achieve grounding.
  • the second diode 765 is fixed on the pin 514, which can make full use of the internal space of the housing 51 to prevent too many components on the gasket 73, resulting in insufficient space.
  • other components can also be fixed on the ground routing layer of the pin 514, for example, the first diode 764 is welded to it, and the second diode 765 is welded to the pad. 73 on the first ground metal layer 733.
  • the second diode 765 can clamp the voltage from hundreds of volts to tens of volts, and at the same time bear a large amount of energy to flow away from the ground loop of the second diode 765, and input the clamped voltage to the laser chip 75.
  • the source electrode in turn, can implement an overvoltage and electrostatic surge protection circuit for the laser chip 75.
  • a second capacitor 767 is also provided on the pad 73, wherein one end of the first capacitor 767 is connected to the active area electrode of the laser chip 75 and the second capacitor respectively.
  • the anode of the diode 765 is electrically connected, and the other end is welded to the first grounding metal layer 733 of the gasket 73 for grounding.
  • the first capacitor 766 is connected in parallel with the laser chip 75 and the second diode 765. On the one hand, it can filter out the clutter in the signal transmitted to the laser chip 75, and on the other hand, the first diode 764 protects the first capacitor. A capacitor 766 is broken down.
  • the electro-absorption modulator is an intensity modulator
  • the absorption of the optical signal output by the laser by the modulator is controlled by adjusting the voltage.
  • a semiconductor optical amplifier is added to the laser chip 75 to amplify the optical signal output by the electro-absorption modulator.
  • FIG. 27 is a schematic diagram of the structure of a laser chip and a third diode provided by an embodiment of the disclosure. As shown in FIG. 27, this embodiment adopts a laser, an electro-absorption modulator, and a semiconductor optical amplifier integrated on the same substrate, and the laser chip integrating the above three devices is collectively referred to as a semiconductor optical amplifier laser.
  • the laser electrode 755 can be electrically connected to the laser driving pin on the circuit board 30 through the pin 514
  • the electro-absorption modulator electrode 756 can be electrically connected through the pin 514 is electrically connected to the high-frequency data signal pin on the circuit board 30
  • the semiconductor optical amplifier electrode 757 can be electrically connected to the semiconductor optical amplifier driving pin on the circuit board 30 through the pin 514.
  • the semiconductor optical amplifier modulates the electro-absorption modulation
  • the optical signal output by the amplifier is amplified and then output.
  • the laser, the electro-absorption modulator, and the semiconductor optical amplifier may be configured as three independent devices, or the laser and the electro-absorption modulator may be integrated on a chip, and the semiconductor optical amplifier may be independently configured.
  • a third diode 768 is provided in the housing 51, wherein the anode of the third diode 768 is connected to the electrode of the semiconductor optical amplifier. 757 is electrically connected, and the cathode of the third diode 768 is fixed on the first grounding metal layer 733 of the pad 73, or can be welded on the grounding wiring layer of the pin 514 to achieve grounding.
  • the third diode 768 can be set as a clamping diode.
  • the third diode 768 can clamp the voltage from hundreds of volts to several tens of volts, and at the same time bear a large amount of energy to flow away from the ground loop of the third diode 768. , And input the clamped voltage to the semiconductor optical amplifier, so as to realize the overvoltage and electrostatic surge protection circuit for the semiconductor optical amplifier.
  • a third capacitor is also provided on the housing 51, wherein one end of the third capacitor is connected to the anode and the third capacitor of the semiconductor optical amplifier respectively.
  • the anode of the diode is electrically connected, and the other end of the third capacitor is welded to the first grounding metal layer 733 of the pad 73, or it can be welded to the grounding wiring layer of the pin 514 to achieve grounding.
  • the third capacitor is connected in parallel with the laser chip 75 and the third diode. On the one hand, it can filter out the clutter in the signal transmitted to the laser chip 75, and on the other hand, the third capacitor is protected by the third diode. breakdown.
  • the laser chip 75 can output high-quality optical signals while working safely.
  • the high-power optical signals propagate in the direction of the optical fiber adapter 54 (forward propagation).
  • the stability of the optical power of the optical signal output by the laser chip 75 to ensure the stability of the optical power of the optical signal output by the laser chip 75.
  • a backlight detector 77 is also provided on the backlight surface side of the laser chip 75, wherein the light emitting surface of the laser chip 75 faces the fiber adapter 54.
  • the light sensing surface of the backlight detector 77 corresponds to the light exit port of the laser chip 75 that emits light signals backward.
  • the high-power optical signals propagate in the direction of the optical fiber adapter 54 (forward propagation)
  • the low-power optical signals propagate in the direction of the backlight detector 77 (backward propagation).
  • the low-power optical signal emitted by the laser chip 75 is received by the backlight detector 77.
  • the backlight detector 77 is used to monitor the power of the low-power optical signal emitted by the laser chip 75.
  • the optical power entering the backlight detector 77 is generally much smaller than that of the laser.
  • the total power of the light waves emitted by the chip 75 is usually set to 1/10 of the total power that enters the backlight detector 77 for power detection, so as to monitor the front-emitting light power of the laser chip 75.
  • a planar structure of the photosensitive component of the backlight detector 77 in FIG. 26 is mounted on the ceramic base, the photosensitive component will reflect light, and the reflected light will affect the forward optical path of the laser chip 75.
  • FIG. 28 is a first structural schematic diagram of a gasket, a laser chip, and a backlight detector provided by an embodiment of the disclosure
  • FIG. 29 is a second structural schematic diagram of a gasket, a laser chip, and a backlight detector provided by an embodiment of the disclosure.
  • the backlight detector 77 is arranged on the spacer 73 and is arranged on the backlight surface side of the laser chip 75.
  • FIG. 30 is a first structural diagram of a backlight detector provided by an embodiment of the disclosure
  • FIG. 31 is a first structural diagram of a backlight detector provided by an embodiment of the disclosure.
  • the photosensitive surface 772 of the backlight detector 77 is designed as a concave arc structure, and the photosensitive surface 772 faces the backlight surface of the laser chip 75 to collect the light emitted from the backlight surface of the laser chip 75.
  • the backlight detector 77 is electrically connected to the circuit board 30, and can send the collected data to related devices arranged on the circuit board 30, such as MCU, to monitor the light power of the laser chip 75.
  • the photosensitive surface 772 of the backlight detector 77 has a concave arc structure. Compared with a planar structure, the reflected light of the photosensitive surface 772 can be effectively reduced, thereby reducing the crosstalk of the reflected light on the front light of the laser chip 75. Therefore, when packaging There is no need to strictly control the angle between the position of the backlight detector 77 and the position of the laser chip 75. In addition, the curved surface structure can increase the area of the photosensitive surface 772, thereby effectively increasing the amount of backlight received by the backlight detector 77 and improving its optical power detection accuracy.
  • this embodiment sets the normal line of the photosensitive surface 772 and the laser chip 75.
  • the normal line of the backlight surface has a certain included angle, and the included angle is best 4-8°. Of course, it is not limited to changing the value.
  • an anode 771 is provided on the upper surface of the backlight detector 77, and an anode 771 is provided on the lower surface.
  • a cathode 774 so that it is convenient for the anode 771 to connect the backlight detector 77 to the pin 514 by wire bonding.
  • the cathode 774 can be directly welded or conductively fixed to the first grounded metal layer of the gasket 73 by means of conductive glue.
  • the electrical connection between the backlight detector 77 and the circuit board 30 is further realized.
  • the photosensitive surface 772 of this embodiment is arranged close to the bottom of the backlight detector 77, that is, the end surface of the backlight detector 77 close to the laser chip 75 It includes a photosensitive surface 772 and a side wall surface 773 located above the photosensitive surface.
  • the side wall surface 773 may be a vertical surface, or of course, an inclined surface.
  • the distance between the photosensitive surface 772 and the backlight surface of the laser chip 75 is gradually increased along the direction from the top to the bottom of the backlight detector 77.
  • the photosensitive surface 772 is designed to have a quarter-arc or elliptical-arc structure. In order to reduce the crosstalk of the light reflected from the photosensitive surface 772 to the front light of the laser chip 75.
  • the surface of the backlight detector 77 that is in contact with the spacer 73 is called its lower surface, and the surface opposite to the lower surface is called the upper surface; in addition, the backlight detector 77 and the laser chip 75 are also It is not limited to the packaging method provided on the spacer 73, and may also be other packaging methods, for example, TO packaging.

Abstract

L'invention concerne un module optique (200), comprenant une plaque de recouvrement (511) et un boîtier inférieur (202). La surface de la plaque de recouvrement (511) proche du boîtier inférieur (202) comprend une première surface inférieure (511b) et une seconde surface inférieure (511a) située à la périphérie de la première surface inférieure (511b). La première surface inférieure (511b) fait saillie à partir de la seconde surface inférieure (511a). La plaque de recouvrement (511) est soudée au boîtier inférieur (202) au moyen de la deuxième surface inférieure (511a). Un joint d'étanchéité (73) dans un ensemble de transmission (70) du module optique (200) utilisé pour transporter une puce laser (75) comprend une couche conductrice de chaleur isolante (731), une première couche de métal de masse (733) disposée sur la surface supérieure de la couche conductrice de chaleur isolante (731), et une ligne de signal à grande vitesse (734). La première extrémité de la ligne de signal à grande vitesse (734) est électriquement connectée à une carte de circuit imprimé (30) au moyen d'un fil de liaison, pour transmettre un signal de données à partir de la carte de circuit imprimé (30) à la puce laser (75), la seconde extrémité de la ligne de signal à grande vitesse (734) est électriquement connectée à l'anode de la puce laser (75), et la cathode de la puce laser (75) est fixée sur la première couche de métal de masse (733). La largeur de la première extrémité de la ligne de signal à grande vitesse (734) augmente progressivement dans la direction opposée de la transmission de signal électrique de données, de sorte que la zone de la première extrémité de la ligne de signal à grande vitesse (734) est augmentée, et le nombre de fils de liaison peut être augmenté sur la première extrémité de la ligne de signal à grande vitesse (734), afin d'augmenter le diamètre total du fil métallique, et de réduire l'inductance générée pendant le fonctionnement du module optique (200), ce qui permet d'améliorer les performances à grande vitesse du module optique (200).
PCT/CN2021/080965 2020-04-26 2021-03-16 Module optique WO2021218463A1 (fr)

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CN202020661340.XU CN212647079U (zh) 2020-04-26 2020-04-26 一种光模块
CN202010340708.7 2020-04-26
CN202020661340.X 2020-04-26
CN202020661750.4 2020-04-26
CN202020661336.3 2020-04-26
CN202020661750.4U CN212083735U (zh) 2020-04-26 2020-04-26 一种光模块
CN202020661336.3U CN212083733U (zh) 2020-04-26 2020-04-26 一种光模块
CN202010340708.7A CN113552674B (zh) 2020-04-26 2020-04-26 一种光模块

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CN115145323A (zh) * 2022-06-27 2022-10-04 之江实验室 一种探测器芯片温控方法
WO2023083244A1 (fr) * 2021-11-11 2023-05-19 成都旭创科技有限公司 Module optique étanche à l'air
WO2023202610A1 (fr) * 2022-04-21 2023-10-26 青岛海信宽带多媒体技术有限公司 Module optique
WO2023236425A1 (fr) * 2022-06-10 2023-12-14 青岛海信宽带多媒体技术有限公司 Module optique

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