WO2022057590A1 - 冰箱 - Google Patents

冰箱 Download PDF

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Publication number
WO2022057590A1
WO2022057590A1 PCT/CN2021/114766 CN2021114766W WO2022057590A1 WO 2022057590 A1 WO2022057590 A1 WO 2022057590A1 CN 2021114766 W CN2021114766 W CN 2021114766W WO 2022057590 A1 WO2022057590 A1 WO 2022057590A1
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WO
WIPO (PCT)
Prior art keywords
cold
air
compartment
refrigerator
cooling
Prior art date
Application number
PCT/CN2021/114766
Other languages
English (en)
French (fr)
Inventor
崔展鹏
李佳明
姬立胜
吕鹏
Original Assignee
重庆海尔制冷电器有限公司
青岛海尔电冰箱有限公司
海尔智家股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 重庆海尔制冷电器有限公司, 青岛海尔电冰箱有限公司, 海尔智家股份有限公司 filed Critical 重庆海尔制冷电器有限公司
Priority to AU2021343158A priority Critical patent/AU2021343158B2/en
Priority to EP21868418.1A priority patent/EP4206560A4/en
Priority to US18/025,236 priority patent/US20240011699A1/en
Publication of WO2022057590A1 publication Critical patent/WO2022057590A1/zh

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
    • F25D11/02—Self-contained movable devices, e.g. domestic refrigerators with cooling compartments at different temperatures
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
    • F25D17/04—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
    • F25D17/04—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection
    • F25D17/042—Air treating means within refrigerated spaces
    • F25D17/045—Air flow control arrangements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
    • F25D17/04—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection
    • F25D17/06—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection by forced circulation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D23/00—General constructional features
    • F25D23/006—General constructional features for mounting refrigerating machinery components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D23/00—General constructional features
    • F25D23/02—Doors; Covers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D23/00—General constructional features
    • F25D23/02—Doors; Covers
    • F25D23/025—Secondary closures
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/021—Control thereof
    • F25B2321/0212—Control thereof of electric power, current or voltage
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/025—Removal of heat
    • F25B2321/0252—Removal of heat by liquids or two-phase fluids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2700/00—Sensing or detecting of parameters; Sensors therefor
    • F25B2700/21—Temperatures
    • F25B2700/2104—Temperatures of an indoor room or compartment
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D2317/00—Details or arrangements for circulating cooling fluids; Details or arrangements for circulating gas, e.g. air, within refrigerated spaces, not provided for in other groups of this subclass
    • F25D2317/06—Details or arrangements for circulating cooling fluids; Details or arrangements for circulating gas, e.g. air, within refrigerated spaces, not provided for in other groups of this subclass with forced air circulation
    • F25D2317/067—Details or arrangements for circulating cooling fluids; Details or arrangements for circulating gas, e.g. air, within refrigerated spaces, not provided for in other groups of this subclass with forced air circulation characterised by air ducts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D2323/00—General constructional features not provided for in other groups of this subclass
    • F25D2323/02—Details of doors or covers not otherwise covered
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D2323/00—General constructional features not provided for in other groups of this subclass
    • F25D2323/02—Details of doors or covers not otherwise covered
    • F25D2323/023—Door in door constructions

Definitions

  • the invention relates to the technical field of refrigeration and freezing, in particular to a refrigerator.
  • the traditional refrigerator door is used to open and close the refrigerating compartment of the box.
  • a bottle seat is provided at the inner lining of the refrigerator door for placing bottled items.
  • the composite door refrigerator improves the structure and function of the door, so that the door includes a main door and an auxiliary door, and the main door is used to open and close the refrigeration compartment.
  • the main door defines a door body compartment whose front side is open, and the sub door is used to open and close the door body compartment.
  • the auxiliary door remains closed.
  • the door body compartment can be used for storage, and when picking and placing, only the auxiliary door needs to be opened, and the main door is not opened. Not only makes the operation more convenient and quick, but also avoids excessive cooling loss caused by frequent opening of the main door.
  • the purpose of the present invention is to solve at least one of the above-mentioned defects in the prior art, and to provide a refrigerator capable of independently controlling the internal temperature of the door compartment.
  • Another object of the present invention is to improve the energy efficiency of semiconductor refrigeration components.
  • the present invention provides a refrigerator comprising:
  • a box the front side of which is open to define a first compartment
  • a door body including a main door and an auxiliary door
  • the main door is used for opening and closing the first room and defines a second room
  • the auxiliary door is used for opening and closing the second room
  • the semiconductor refrigeration component is arranged outside the second compartment.
  • the refrigerator further includes a first fan, which is arranged in the cold-end air supply air passage, and is used to promote the cold air of the cold-end air supply air passage to the second compartment.
  • a first fan which is arranged in the cold-end air supply air passage, and is used to promote the cold air of the cold-end air supply air passage to the second compartment.
  • two vents are formed on the rear wall of the main door, and the refrigerator is configured to: when the main door is closed, the ports of the cold-end supply air duct and the cold-end return air duct are respectively sealed with one vent. , so as to transmit air flow with the second room; when the main door is open, keep the two air supply ports away from the ports of the cold-end supply air duct and the cold-end return air duct.
  • the hot end is formed with a cooling cavity, and the air in it is used to cool the hot end; and the refrigerator further includes an air outlet air passage of the hot end, which communicates with the cooling cavity and the cooling chamber of the refrigerator for producing cold air, and is used for cooling the hot end. It is used to deliver the air heated by the hot end to the cooling chamber.
  • the refrigerator further includes: a hot-end air inlet air passage, which is connected to the cooling chamber and the cooling cavity, so that the cooling indoor air enters the cooling chamber through the hot-end air inlet air passage, cools the hot end, and then exits through the hot end.
  • the air duct returns to the cooling chamber.
  • the refrigerator of the present invention is a composite door refrigerator.
  • the door body includes a main door and an auxiliary door.
  • the main door is used to open or close the first compartment defined by the box body, and the auxiliary door is used to open and close the second compartment defined by the main door.
  • a semiconductor refrigeration component is specially arranged to refrigerate the second compartment independently, so that the temperature of the second compartment is independently controllable and not affected by the first compartment.
  • the second compartment can be formed into a completely different storage environment from that of the first compartment, and the temperature of the second compartment can be higher than or lower than that of the first compartment.
  • there is no air exchange between the second room and the first room which can be specially used to store some special items that are not suitable for storing in the temperature range of the first room.
  • the second compartment does not need to introduce cold air from the first compartment for cooling, the two compartments are isolated from each other, and the problem of odor in the two compartments is also avoided.
  • the semiconductor refrigeration component is arranged outside the second compartment. In this way, on the one hand, it does not occupy the limited storage space of the second room, and on the other hand, it is beneficial to the heat dissipation of the hot end of the semiconductor refrigeration component.
  • the refrigerator of the present invention is provided with an air outlet air passage at the hot end to transport the air heated by the hot end to the cooling chamber of the refrigerator.
  • an air outlet air passage at the hot end to transport the air heated by the hot end to the cooling chamber of the refrigerator.
  • FIG. 1 is a schematic structural diagram of a refrigerator according to an embodiment of the present invention.
  • Fig. 2 is the schematic diagram of air duct circulation of the refrigerator shown in Fig. 1;
  • the refrigerator according to the embodiment of the present invention will be described below with reference to FIGS. 1 to 4 .
  • the orientation or positional relationship is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention .
  • the semiconductor refrigeration component 300 includes a cold end 310 and a hot end 320 .
  • the semiconductor refrigeration component 300 utilizes the thermoelectric effect of semiconductors to produce cooling capacity. After the semiconductor refrigeration component 300 is powered on, the temperature of the cold end 310 decreases, and the temperature of the hot end 320 increases.
  • the semiconductor refrigeration unit 300 is configured such that the cold end 310 provides cooling to the second compartment 201 .
  • the semiconductor refrigeration component 300 is specially provided to refrigerate the second compartment 201 independently, so that the temperature of the second compartment 201 is independently controllable and is not affected by the first compartment 101 . Therefore, the second compartment 201 can be formed into a completely different storage environment from that of the first compartment 101, and the temperature of the second compartment 201 can be higher than that of the first compartment 101 or lower than that of the first compartment 101.
  • the cold air in the first room 101 does not need to be used for cooling, there is no air exchange between the second room 201 and the first room 101 , which can be specially used to store some parts that are not suitable for storage in the first room 101 . Special items in the temperature range, such as pharmaceuticals, cosmetics, etc.
  • the second compartment 201 since the second compartment 201 does not need to introduce cold air from the first compartment 101 for cooling, the two compartments are isolated from each other, and the problem of odor between the two compartments is also avoided.
  • the refrigerator may include a temperature sensor 600 and a controller 700 .
  • the temperature sensor 600 is used to detect the temperature of the second compartment 201
  • the controller 700 is used to receive the detection signal of the temperature sensor 600 and control the operating state of the semiconductor refrigeration unit 300 according to the temperature of the second compartment 201 .
  • the operating state of the semiconductor refrigeration component 300 includes opening, closing timing, operation time, etc., so as to finally realize the adjustment of the cooling capacity of the second compartment 201 .
  • the semiconductor refrigeration component 300 may be disposed outside the second compartment 201 .
  • it can be mounted on the case 100 . In this way, on the one hand, it does not occupy the limited storage space of the second compartment 201 , and on the other hand, it is beneficial to the heat dissipation of the hot end 320 of the semiconductor refrigeration component 300 .
  • the cold end 310 of the semiconductor refrigeration component 300 is formed with a refrigeration cavity 312 , and the cold end 310 cools the air in the refrigeration cavity 312 .
  • the refrigerator further includes a cold-end air supply air passage 410 , and the cold-end air supply air passage 410 communicates with the refrigeration cavity 312 and the second compartment 201 , and is used for conveying the cold air produced by the cold end 310 to the second compartment 201 .
  • a complete cooling cycle of the second room 201 is formed as follows: the cold air formed by the cold end 310 refrigerating the air in the cooling cavity 312 enters the second room 201 through the cold end air supply air passage 410, and the second room 201 is cooled to the second room 201. After the cooling temperature rises, the air returns from the cold end return air passage 420 to the refrigeration cavity 312 , receives the cooling from the cold end 310 again, and then enters the cold end air supply air passage 410 again. As a result, the air circulates in the cooling chamber 312 , the cold-end supply air passage 410 , the second compartment 201 and the cold-end return air passage 420 , forming an efficient cooling cycle and improving the cooling capacity of the second compartment 201 . cooling speed.
  • the refrigerator further includes a hot-end air inlet air passage 520 .
  • the hot end air inlet air passage 520 is connected to the cooling chamber 102 and the cooling chamber 322, so that the air in the cooling chamber 102 enters the cooling chamber 322 through the hot end air inlet air passage 520, and after cooling the hot end 320, the air is discharged through the hot end.
  • Road 510 returns to cooling chamber 102 . That is, the hot end 320 is cooled by the cold air introduced into the cooling chamber 102 by the hot end air inlet air passage 520, and the hot air formed by the heating of the heated end 320 is returned to the cooling chamber 102 through the hot end air outlet air passage 510 again, so as to prevent it from affecting the cooling chamber 102.
  • the entire refrigerator can be refrigerated by a vapor compression refrigeration cycle system, and an evaporator 900 is provided in the cooling chamber 102 of the refrigerator.
  • the various compartments inside the refrigerator can be divided into refrigerating compartment, freezing compartment and changing room.
  • the temperature in the refrigerator is generally controlled between 2°C and 10°C, preferably 4°C to 7°C.
  • the temperature range in the freezer is generally controlled at -22°C to -14°C.
  • the variable temperature chamber can be adjusted between -18°C to 8°C to achieve a variable temperature effect.
  • the optimal storage temperature for different types of items is different, and the storage compartments suitable for storage are also different. For example, fruit and vegetable foods are suitable for storage in the refrigerator compartment, and meat foods are suitable for storage in the freezer compartment.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Cold Air Circulating Systems And Constructional Details In Refrigerators (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)

Abstract

一种冰箱，包括箱体，其前侧敞开以限定出第一间室；门体，包括主门和副门，主门用于开闭第一间室且限定有第二间室，副门用于开闭第二间室；和半导体制冷部件，其包括冷端和热端，并配置成使冷端对第二间室提供冷量。本发明的冰箱能够独立控制门体间室内部温度。

Description

冰箱 技术领域
本发明涉及冷藏冷冻技术领域，特别涉及一种冰箱。
背景技术
随着技术的进步和人们生活水平的提升，用户对于冰箱的要求越来越高。传统的仅设置冷藏室、冷冻室和变温室的冰箱已经不能满足用户对于存储空间多样化的需求。
近年来，冰箱领域出现了一种复合门体技术。众所周知，传统的冰箱门体用于开闭箱体的制冷间室，最多在冷藏门体的内衬处设置瓶座用于放置瓶装物。而复合门体的冰箱则对门体结构和功能进行改进，使门体包括主门和副门，主门用于开闭制冷间室。并且，主门限定出前侧敞开的门体间室，副门用于开闭门体间室。主门转动过程中，副门保持关闭状态。门体间室可供放置存储物，且取放时仅需打开副门，无打开主门。不仅使操作更加方便快捷，而且避免频繁打开主门引起冷量过多损耗。
但是，现有技术的复合门冰箱也存在很多缺陷，例如，现有技术通常将第一间室的冷气输送至第二间室内，对第二间室进行制冷。这种方式使得第二间室的温度受到第一间室的影响，且容易引起串味等问题。这些问题都会对用户体验产生负面影响，阻碍了复合门冰箱技术的进一步发展。
发明内容
本发明的目的在于至少解决现有技术存在的上述缺陷之一，提供一种能够独立控制门体间室内部温度的冰箱。
本发明的另一目的是要解决门体间室与箱体间室的串味问题。
本发明的另一目的是要提高半导体制冷部件的能效。
特别地，本发明提供了一种冰箱，其包括：
箱体，其前侧敞开以限定出第一间室；
门体，包括主门和副门，主门用于开闭第一间室且限定有第二间室，副门用于开闭第二间室；和
半导体制冷部件，其包括冷端和热端，并配置成使冷端对第二间室提供冷量。
可选地，半导体制冷部件设置于第二间室外部。
可选地，冷端形成有制冷腔，冷端对制冷腔内的空气进行制冷；且冰箱还包括冷端送风风路，其连通制冷腔和第二间室，用于将冷端制取的冷气输送至第二间室。
可选地，冰箱还包括冷端回风风路，其连通第二间室和制冷腔，以便第二间室的空气经冷端回风风路回流至制冷腔，接受冷端制冷形成冷气后，再进入冷端送风风路。
可选地，冰箱还包括第一风机，设置在冷端送风风路内，用于促使冷端送风风路的冷气流向第二间室。
可选地，主门的后壁形成有两个通风口，冰箱配置成：在主门关闭时，使冷端送风风路和冷端回风风路的端口分别与一个通风口密封相接，以便与第二间室传输气流；在主门打开时，使两个送风口远离冷端送风风路和冷端回风风路的端口。
可选地，热端形成有冷却腔，其内空气用于对热端进行冷却；且冰箱还包括热端出风风路，其连通冷却腔和冰箱的用于制取冷气的冷却室，用于将被热端加热的空气输送至冷却室。
可选地，冰箱还包括：热端进风风路，其连通冷却室和冷却腔，以便冷却室内空气经热端进风风路进入冷却腔，对热端进行冷却后，再经热端出风风路返回冷却室。
可选地，冰箱还包括：第二风机，设置在热端进风风路内，用于促使冷却室内的冷气流向冷却腔。
可选地，第一间室为冷藏室，冷却室设置在冷藏室后方。
本发明的冰箱为复合门冰箱，门体包括主门和副门，主门用于打开或关闭箱体限定的第一间室，副门用于开闭主门限定的第二间室。本发明专门设置了半导体制冷部件对第二间室进行单独制冷，使得第二间室的温度独立可控，不受第一间室的影响。由此，可使第二间室形成与第一间室完全不同的存储环境，其温度可高于第一间室，也可低于第一间室。并且，第二间室与第一间室之间没有空气交换，能够专门用于保存一些不适于存储于第一间室内温度范围的特殊物品。
并且，由于第二间室并不需要从第一间室引入冷气用于制冷，两个间室彼此隔绝，也避免产生两个间室的串味问题。
进一步地，本发明的冰箱中，半导体制冷部件设置在第二间室的外部。这样一来，一方面使其不占据第二间室有限的存储空间，又有利于半导体制冷部件的热端散热。
进一步地，本发明的冰箱设置了冷端送风风路和冷端回风风路，使其均与冷端的制冷腔和第二间室连通。冷端对制冷腔内空气进行制冷形成的冷气经冷端送风风路进入第二间室，对第二间室进行制冷温度升高后，从冷端回风风路回流至制冷腔内，重新接受冷端的制冷，然后再次进入冷端送风风路。由此，空气在制冷腔、冷端送风风路、第二间室和冷端回风风路中循环流动，形成一个高效的供冷循环，提高了第二间室的制冷速度。
进一步地，本发明的冰箱设置了热端出风风路，将被热端加热的空气输送至冰箱的冷却室。如此，不仅及时排出了热端的热量，避免热量影响箱各个间室的正常制冷和半导体制冷部件的正常工作，而且是直接将热空气输送回冷却室而非冰箱的风道，避免热空气被风道重新进入箱体的各个间室。
此外，本发明还设置了热端进风风路，并使热端进风风路和热端出风风路均与热端的冷却腔连通。即利用热端进风风路引入冷却室的冷气来冷却热端，并使受热端加热形成的热风重新经热端出风风路回到冷却室，避免其影响各箱体间室的制冷。总之，本发明特别利用冷却室的冷气来冷却热端，使热端降温更快，提高了半导体制冷部件的能效，使冷端的制冷量更高。
进一步地，本发明的冰箱中，主门的后壁形成有两个通风口，主门关闭时，使冷端送风风路和冷端回风风路的端口分别与一个通风口密封相接，以便通过两个通风口与第二间室传输气流(即，冷端送风风路通过一个通风口向第二间室提供冷气，第二间室的空气经另一通风口回流至冷端回风风路)。在主门打开时，使两个送风口远离冷端送风风路和冷端回风风路的端口(没有固定连接关系，开门导致连接断开)。这种结构非常简单，不需要在主门的壁体内嵌设任何管路，也完全不影响主门的开闭。
根据下文结合附图对本发明具体实施例的详细描述，本领域技术人员将会更加明了本发明的上述以及其他目的、优点和特征。
附图说明
后文将参照附图以示例性而非限制性的方式详细描述本发明的一些具体实施例。附图中相同的附图标记标示了相同或类似的部件或部分。本领域 技术人员应该理解，这些附图未必是按比例绘制的。附图中：
图1是本发明一个实施例的冰箱的结构示意图；
图2是图1所示冰箱的风路循环示意图；
图3是图2的A处放大图；
图4是本发明一个实施例的冰箱的示意性框图。
具体实施方式
下面参照图1至图4来描述本发明实施例的冰箱。其中，“前”、“后”、“上”、“下”、“顶”、“底”、“内”、“外”、“横向”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。
图1是本发明一个实施例的冰箱的结构示意图；图2是图1所示冰箱的风路循环示意图，图中用箭头示意了风向；图3是图2的A处放大图；图4是本发明一个实施例的冰箱的示意性框图。
如图1至图4所示，本发明实施例的冰箱一般性地可包括箱体100、门体200和半导体制冷部件。箱体100的前侧(本发明以门体200所在侧作为冰箱的前侧，前后方向已经在图中示出)敞开以限定出第一间室101。门体200包括主门210和副门220，主门210用于开闭第一间室101且限定有第二间室201，副门220用于开闭第二间室201。
可使主门210在箱体100前侧可转动地安装于箱体100，主门210前侧敞开以限定出前述的第二间室201，使副门220在主门210前侧可转动地安装于主门210。主门210打开时，用户从第一间室101存取物品。主门210关闭，副门220打开时，用户可从第二间室201存取物品。
半导体制冷部件300包括冷端310和热端320。半导体制冷部件300利用半导体的热电效应制取冷量。半导体制冷部件300通电后，冷端310温度降低，热端320温度温升高。半导体制冷部件300配置成使冷端310对第二间室201提供冷量。
本发明实施例专门设置了半导体制冷部件300对第二间室201进行单独制冷，使得第二间室201的温度独立可控，不受第一间室101的影响。由此，可使第二间室201形成与第一间室101完全不同的存储环境，其温度可高于 第一间室101，也可低于第一间室101。并且，由于不需要利用第一间室101的冷气进行制冷，使得第二间室201与第一间室101之间没有空气交换，能够专门用于保存一些不适于存储于第一间室101内温度范围的特殊物品，例如药品，化妆品等。并且，由于第二间室201并不需要从第一间室101引入冷气用于制冷，两个间室彼此隔绝，也避免产生两个间室的串味问题。
如图2和图4所示，冰箱可包括温度传感器600和控制器700。温度传感器600用于检测第二间室201的温度，控制器700用于接收温度传感器600的检测信号，并根据第二间室201的温度来控制半导体制冷部件300的运行状态。半导体制冷部件300的运行状态包括开启、关闭时机、运行时间等，从而最终实现对第二间室201的制冷量的调节。
在一些实施例中，如图2所示，可使半导体制冷部件300设置于第二间室201外部。例如可安装于箱体100上。这样一来，一方面使其不占据第二间室201有限的存储空间，又有利于半导体制冷部件300的热端320散热。
在一些实施例中，如图2和图3所示，半导体制冷部件300的冷端310形成有制冷腔312，冷端310对制冷腔312内的空气进行制冷。冰箱还包括冷端送风风路410，冷端送风风路410连通制冷腔312和第二间室201，用于将冷端310制取的冷气输送至第二间室201。
优选地，冰箱还可进一步包括冷端回风风路420。冷端回风风路420连通第二间室201和制冷腔312，以便第二间室201的空气经冷端回风风路420回流至制冷腔312内，接受冷端310的制冷形成冷气后，再重新进入冷端送风风路410。
由此形成完整的第二间室201供冷循环如下：冷端310对制冷腔312内空气进行制冷形成的冷气经冷端送风风路410进入第二间室201，对第二间室201进行制冷温度升高后，从冷端回风风路420回流至制冷腔312内，重新接受冷端310的制冷，然后再次进入冷端送风风路410。由此，空气在制冷腔312、冷端送风风路410、第二间室201和冷端回风风路420中循环流动，形成一个高效的供冷循环，提高了第二间室201的制冷速度。
冰箱还可包括第一风机412，第一风机412设置在冷端送风风路410内，用于促使冷端送风风路410的冷气流向第二间室201。第一风机412实现气流的强制循环，加快供冷循环的运行速度。
在一些实施例中，可使主门210的后壁形成有两个通风口(未图示)。 并使冰箱配置成：在主门210关闭时，使冷端送风风路410和冷端回风风路420的端口分别与一个通风口密封相接，以便与第二间室201传输气流(即，冷端送风风路410通过一个通风口向第二间室201提供冷气，第二间室201的空气经另一通风口回流至冷端回风风路420)。主门210打开时，使两个送风口远离冷端送风风路410和冷端回风风路420的端口(没有固定连接关系，开门导致连接断开)。这种结构非常简单，不需要在主门210的壁体内嵌设任何管路，也完全不影响主门210的开闭。冷端送风风路410和冷端回风风路420的端口可位于第一间室101侧壁或顶壁，并朝前敞开，以便在关门时，与主门210后壁上的通风口相对。
在一些替代性实施例中，也可利用使冷端送风风路410和冷端回风风路420直接伸入主门210内部。伸入部位可靠近主门210的铰接端，且可设置为软管等可变形管路，以便不影响主门210的枢转。
在一些实施例中，如图2和图3所示，半导体制冷部件300的热端320形成有冷却腔322，冷却腔322内空气用于对热端320进行冷却，以保证热端320散热，使半导体制冷部件300能够正常工作。并且，冰箱还包括热端出风风路510。热端出风风路510连通冷却腔322和冰箱的用于制取冷气的冷却室102，用于将被热端320加热的空气输送至冷却室102。如此，不仅及时排出了热端320的热量，避免热量影响箱各个间室的正常制冷和半导体制冷部件300的正常工作，而且是直接将热空气输送回冷却室102而非冰箱的风道，避免热空气被风道重新进入箱体100的各个间室。
进一步地，在一些实施例中，冰箱还包括热端进风风路520。热端进风风路520连通冷却室102和冷却腔322，以便冷却室102内空气经热端进风风路520进入冷却腔322，对热端320进行冷却后，再经热端出风风路510返回冷却室102。即，利用热端进风风路520引入冷却室102的冷气来冷却热端320，并使受热端320加热形成的热风重新经热端出风风路510回到冷却室102，避免其影响各箱体100间室的制冷。总之，本发明实施例特别利用冷却室102的冷气来冷却热端320，使热端320降温更快，提高了半导体制冷部件300的能效，使冷端310的制冷量更高。
冰箱还可包括第二风机522，第二风机522可设置在热端进风风路520内，用于促使冷却室102内的冷气流向冷却腔322，实现热端进风风路520的气流的强制流动，加快热端320的散热速度，提升半导体制冷量的能效。
冰箱整体可通过蒸气压缩制冷循环系统进行制冷，其冷却室102内设置有蒸发器900。根据制冷温度的不同，冰箱内部的各间室可划分为冷藏室、冷冻室和变温室。例如冷藏室内的温度一般控制在2℃至10℃之间，优先为4℃至7℃。冷冻室内的温度范围一般控制在-22℃至-14℃。变温室可在-18℃至8℃之间调节，以实现变温效果。不同种类的物品的最佳存储温度并不相同，适宜存放的储物间室也并不相同。例如果蔬类食物适宜存放于冷藏室，而肉类食物适宜存放于冷冻室。
本发明实施例的第一间室101优选为冷藏室。冷却室102优选设置在第一间室101后方，以距离第一间室101更近，方便与半导体制冷部件300的连通。半导体制冷部件300、冷端送风风路410、冷端回风风路420、热端进风风路520以及热端进风风路520可贴靠于第一间室101的内壁设置或者嵌设在第一间室101内壁的壁体内。
至此，本领域技术人员应认识到，虽然本文已详尽示出和描述了本发明的多个示例性实施例，但是，在不脱离本发明精神和范围的情况下，仍可根据本发明公开的内容直接确定或推导出符合本发明原理的许多其他变型或修改。因此，本发明的范围应被理解和认定为覆盖了所有这些其他变型或修改。

Claims (10)

  1. 一种冰箱，包括：
    箱体，其前侧敞开以限定出第一间室；
    门体，包括主门和副门，所述主门用于开闭所述第一间室且限定有第二间室，所述副门用于开闭所述第二间室；和
    半导体制冷部件，其包括冷端和热端，并配置成使所述冷端对所述第二间室提供冷量。
  2. 根据权利要求1所述的冰箱，其中，
    所述半导体制冷部件设置于所述第二间室外部。
  3. 根据权利要求2所述的冰箱，其中，
    所述冷端形成有制冷腔，所述冷端对所述制冷腔内的空气进行制冷；且
    所述冰箱还包括冷端送风风路，其连通所述制冷腔和所述第二间室，用于将所述冷端制取的冷气输送至所述第二间室。
  4. 根据权利要求3所述的冰箱，还包括：
    冷端回风风路，其连通所述第二间室和所述制冷腔，以便所述第二间室的空气经所述冷端回风风路回流至所述制冷腔，接受所述冷端制冷形成冷气后，再进入所述冷端送风风路。
  5. 根据权利要求3所述的冰箱，还包括：
    第一风机，设置在所述冷端送风风路内，用于促使所述冷端送风风路的冷气流向所述第二间室。
  6. 根据权利要求5所述的冰箱，其中，
    所述主门的后壁形成有两个通风口，所述冰箱配置成：
    在所述主门关闭时，使所述冷端送风风路和所述冷端回风风路的端口分别与一个所述通风口密封相接，以便与所述第二间室传输气流；在所述主门打开时，使两个所述送风口远离所述冷端送风风路和所述冷端回风风路的端口。
  7. 根据权利要求2所述的冰箱，其中，
    所述热端形成有冷却腔，其内空气用于对所述热端进行冷却；且
    所述冰箱还包括热端出风风路，其连通所述冷却腔和所述冰箱的用于制取冷气的冷却室，用于将被所述热端加热的空气输送至所述冷却室。
  8. 根据权利要求7所述的冰箱，还包括：
    热端进风风路，其连通所述冷却室和所述冷却腔，以便所述冷却室内空气经所述热端进风风路进入所述冷却腔，对所述热端进行冷却后，再经所述热端出风风路返回所述冷却室。
  9. 根据权利要求8所述的冰箱，还包括：
    第二风机，设置在所述热端进风风路内，用于促使所述冷却室内的冷气流向所述冷却腔。
  10. 根据权利要求7所述的冰箱，其中，
    所述第一间室为冷藏室，所述冷却室设置在所述第一间室后方。
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