WO2022052638A1 - 盖板组件及电子设备 - Google Patents

盖板组件及电子设备 Download PDF

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Publication number
WO2022052638A1
WO2022052638A1 PCT/CN2021/107463 CN2021107463W WO2022052638A1 WO 2022052638 A1 WO2022052638 A1 WO 2022052638A1 CN 2021107463 W CN2021107463 W CN 2021107463W WO 2022052638 A1 WO2022052638 A1 WO 2022052638A1
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WO
WIPO (PCT)
Prior art keywords
layer
conductive layer
cover plate
color
substrate
Prior art date
Application number
PCT/CN2021/107463
Other languages
English (en)
French (fr)
Inventor
王雷
Original Assignee
Oppo广东移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Priority to EP21865694.0A priority Critical patent/EP4161228A4/en
Publication of WO2022052638A1 publication Critical patent/WO2022052638A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/15—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on an electrochromic effect
    • G02F1/153—Constructional details
    • G02F1/155—Electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0217—Mechanical details of casings
    • H05K5/0243—Mechanical details of casings for decorative purposes
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/15—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on an electrochromic effect
    • G02F1/153—Constructional details
    • G02F1/1533—Constructional details structural features not otherwise provided for
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/15—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on an electrochromic effect
    • G02F1/163—Operation of electrochromic cells, e.g. electrodeposition cells; Circuit arrangements therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/03—Covers
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G02F1/133331—Cover glasses
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/15—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on an electrochromic effect
    • G02F1/153—Constructional details

Definitions

  • the present application relates to the technical field of electronic devices with a color-changing function, and in particular, to a cover plate assembly and an electronic device.
  • the color or pattern of the shell can be very dazzling, it cannot be changed, even if some special texture effects show different at different angles color, but the colors and patterns displayed by the shell are still not rich enough.
  • cover plate assembly including:
  • the electrochromic module is stacked and arranged with the transparent cover plate.
  • the electrochromic module includes an encapsulation part, a discoloration part and a metal wiring; the encapsulation part encapsulates the outer peripheral side of the discolored part, and the metal wiring a wire is disposed within the encapsulation portion or within the discoloration portion at a position close to the encapsulation portion; and
  • the shielding layer is located between the transparent cover plate and the electrochromic module, and the encapsulation part and the metal wiring are located in the orthographic projection area of the shielding layer in the electrochromic module.
  • Embodiments of the present application further provide an electronic device, the electronic device includes a display module, a middle frame, a main board and the above-mentioned cover plate assembly, the display module and the cover plate assembly are respectively located in the middle frame The two sides of the back are fixedly connected with the middle frame, the electrochromic module is closer to the display module than the transparent cover plate, and the main board is coupled to the electrochromic module , the main board is used for receiving control instructions to control the color change of the electrochromic module.
  • the present application uses a shielding layer to shield the encapsulation portion and the metal wiring, so that structures such as the metal wiring and the encapsulation portion are not displayed on the cover plate assembly, so that the appearance of the cover plate assembly is enhanced.
  • FIG. 2 discloses a schematic cross-sectional view of the electrochromic module I-I shown in FIG. 1 in an embodiment of the present application;
  • FIG. 3 discloses a circuit connection diagram of the first conductive layer, the second conductive layer and the flexible circuit board shown in FIG. 1 in an embodiment of the present application;
  • FIG. 4 discloses a schematic cross-sectional view of the electrochromic module I-I shown in FIG. 1 in another embodiment of the present application;
  • FIG. 6 discloses a schematic cross-sectional view of the electrochromic module I-I shown in FIG. 1 in another embodiment of the present application;
  • FIG. 7 discloses a circuit connection diagram of the first conductive layer, the second conductive layer and the flexible circuit board shown in FIG. 1 in another embodiment of the present application;
  • FIG. 11 , FIG. 12 , FIG. 13 and FIG. 14 respectively disclose cross-sectional schematic diagrams of the electrochromic module I-I shown in FIG. 1 in another embodiment of the present application;
  • FIG. 18 discloses a schematic cross-sectional view of the cover plate assembly II-II shown in FIG. 17 in an embodiment of the present application
  • FIG. 19 , FIG. 20 and FIG. 21 respectively disclose structural schematic diagrams of cover plates in different embodiments of the present application.
  • Figure 22 discloses a top view of a cover plate assembly in another embodiment of the present application.
  • Figure 23 discloses a top view of a cover plate assembly in another embodiment of the present application.
  • FIG. 24 discloses a III-III cross-sectional view of the cover plate assembly shown in FIG. 22 in an embodiment of the present application
  • FIG. 25 discloses a III-III cross-sectional view of the cover plate assembly shown in FIG. 22 in another embodiment of the present application;
  • FIG. 26 discloses a III-III cross-sectional view of the cover plate assembly shown in FIG. 22 in another embodiment of the present application;
  • FIG. 27 discloses a III-III cross-sectional view of the cover plate assembly shown in FIG. 22 in another embodiment of the present application;
  • FIG. 28 discloses a structural block diagram of an implementation manner of an electronic device in an embodiment of the present application.
  • FIG. 29 discloses a structural block diagram of an electronic device in another implementation of the present application.
  • FIG. 31 and FIG. 32 respectively disclose schematic diagrams of an operation state of an electronic device in an embodiment of the present application
  • FIG. 33 discloses a schematic structural diagram of an electronic device in another embodiment of the present application.
  • “electronic equipment” (which may also be referred to as “terminal” or “mobile terminal” or “electronic device”) includes, but is not limited to, being configured to be connected via a wired line (eg, via a public switched telephone network (PSTN). ), digital subscriber line (DSL), digital cable, direct cable connection, and/or another data connection/network) and/or via (eg, for cellular networks, wireless local area networks (WLAN), digital such as DVB-H networks Television network, satellite network, AM-FM broadcast transmitter, and/or another communication terminal's) wireless interface to receive/transmit communication signals.
  • PSTN public switched telephone network
  • DSL digital subscriber line
  • WLAN wireless local area networks
  • DVB-H networks Television network satellite network
  • AM-FM broadcast transmitter AM-FM broadcast transmitter
  • a communication terminal arranged to communicate through a wireless interface may be referred to as a "wireless communication terminal", “wireless terminal” or “mobile terminal”.
  • mobile terminals include, but are not limited to, satellite or cellular telephones; Personal Communication System (PCS) terminals that may combine cellular radio telephones with data processing, fax, and data communication capabilities; may include radio telephones, pagers, Internet/Intranet access , a PDA with a web browser, memo pad, calendar, and/or a global positioning system (GPS) receiver; and conventional laptop and/or palm receivers or other electronic devices including radiotelephone transceivers.
  • PCS Personal Communication System
  • a mobile phone is an electronic device equipped with a cellular communication module.
  • FIG. 1 discloses a top view of an electrochromic module (also called an electrochromic device) in an embodiment of the present application
  • FIG. 2 discloses an embodiment of the present application
  • 1 shows a schematic cross-sectional view of the electrochromic module I-I in the embodiment
  • FIG. 3 discloses the circuit of the first conductive layer, the second conductive layer and the flexible circuit board (FPC) shown in FIG. 1 in an embodiment of the present application
  • FPC flexible circuit board
  • FIG. 4 discloses a cross-sectional schematic diagram of the electrochromic module I-I shown in FIG. 1 in another embodiment of the present application.
  • the electrochromic module 100 may include a first substrate 10 , a first conductive layer 20 , a color-changing material layer 30 , a second conductive layer 40 , a second substrate 50 , a plastic frame 60 , a water and oxygen barrier unit 70 and a flexible circuit board 80.
  • the first substrate 10 , the first conductive layer 20 , the color-changing material layer 30 , the second conductive layer 40 , the second substrate 50 and the water-oxygen barrier unit 70 are stacked in sequence.
  • the plastic frame 60 is arranged around the side edge of the color-changing material layer 30 .
  • the plastic frame 60 is surrounded by the first conductive layer 20 and the second conductive layer 40 to form a chamber for filling the color-changing material to form the color-changing material layer 30 .
  • the first substrate 10 is used to support and carry the first conductive layer 20 .
  • the second substrate 50 is used to support and carry the second conductive layer 40 .
  • the first substrate 10 and the second substrate 50 make the electrochromic module 100 form a complete product, so that the electrochromic module 100 can be used normally.
  • the plastic frame 60 and/or the water-oxygen blocking unit 70 are used to completely isolate the electrochromic module 100 such as the color-changing material layer 30 from the external water-oxygen environment, so as to avoid oxidation failure of the color-changing material.
  • the flexible circuit board 80 is used to be electrically connected to the first conductive layer 20 and the second conductive layer 40 respectively, so as to energize the first conductive layer 20 and the second conductive layer 40, and drive the connection between the first conductive layer 20 and the second conductive layer 40.
  • the intervening color-changing material layer 30 is discolored (colored or faded).
  • first conductive layer and “second conductive layer” can be converted to each other in different embodiments.
  • first conductive layer can also be called “first conductive layer”. Referred to as the "second conductive layer”.
  • the material of the first substrate 10 can be glass or a transparent resin material with a certain hardness, such as PET (Polyethylene terephthalate referred to as PET or PEIT, commonly known as polyester resin, polycondensate of terephthalic acid and ethylene glycol), PMMA (polyethylene terephthalate). Polymethyl methacrylate (PMMA), also known as acrylic, acrylic (English Acrylic or plexiglass), polycarbonate PC, polyimide PI, cyclic cyclic olefin copolymer, etc. More material types of the first substrate 10 are within the understanding of those skilled in the art, and will not be listed and described in detail here.
  • the first conductive layer 20 is located between the first substrate 10 and the color-changing material layer 30 .
  • the first conductive layer 20 is respectively bonded to the first substrate 10 and the color-changing material layer 30 .
  • the first conductive layer 20 is made of transparent conductive material.
  • the transparent conductive material may be indium tin oxide (ITO), zinc aluminum oxide (AZO), or a graphene film.
  • a first metal trace 21 and a first ground trace 22 are disposed on the side of the first conductive layer 20 facing the color-changing material layer 30 .
  • the first metal wiring 21 is used for electrical connection with the first conductive layer 20, can be energized to the first conductive layer 20, and can be used to drive the color change (coloring or fading) of the color changing material layer 30.
  • the first metal trace 21 and the first ground trace 22 are arranged at intervals to avoid short circuit between the first metal trace 21 and the first ground trace 22 , and the first ground trace 22 is used for electrostatic protection of the electrochromic module 100 .
  • the first ground trace 22 may be omitted.
  • the first metal traces 21 are used for electrical connection with the flexible circuit board 80 so as to supply power to the electrochromic module 100 .
  • the first metal wiring 21 can be a full-circumference wiring.
  • the first metal traces 21 are disposed close to the plastic frame 60 .
  • the routing range of the first metal traces 21 is arranged as far as possible according to the circumference of the color-changing material layer 30 .
  • the material impedance of the first metal trace 21 can be selected within 5 ohms, of course, the smaller the better.
  • the first metal trace 21 may be formed by disposing a metal film and then etching, or by using a local metal coating, that is, the position of the trace needs to be metal coated.
  • the material used for the first metal wiring 21 may be a metal material with good electrical conductivity such as molybdenum, aluminum, silver, gold, and copper.
  • the first metal traces 21 can be screen-printed to form metal wires on the first conductive layer 20, and the resistance value thereof is extremely low, for example, about 1.6 ⁇ 10-6 ⁇ cm.
  • the first metal traces 21 may be silver paste traces formed at the edge of the first conductive layer 20 by a silver paste trace device. Therefore, the first metal traces 21 can also be referred to as silver paste traces.
  • the first ground traces 22 are surrounded by the periphery of the first metal traces 21 for electrostatic protection of the first metal traces 21 , so as to realize the flexibility of connection with the first metal traces 21 .
  • Circuit board 80 protection of electronic equipment.
  • the first ground traces 22 may be made of the same material as the first metal traces 21 , or may be set in the same manner as the first metal traces 21 .
  • the first ground trace 22 is disposed close to the plastic frame 60 .
  • the first conductive layer 20 defines a first isolation slot between the first metal trace 21 and the first ground trace 22 23.
  • the first isolation groove 23 runs through the first conductive layer 20, so that the first conductive layer 20 is divided into two parts that are not connected to each other, so as to realize the separation of the first metal trace 21 and the first ground trace 22, avoiding The first metal trace 21 and the first ground trace 22 are short-circuited.
  • insulating glue may be filled in the first isolation trench 23 to achieve the integrity of the first conductive layer 20 .
  • the first isolation trench 23 may be omitted, and an insulating layer is provided between the first ground trace 22 and the first conductive layer 20 to prevent the first ground trace 22 from being electrically connected to the first conductive layer 20 , Thus, the short circuit between the first metal trace 21 and the first ground trace 22 is avoided.
  • an insulating protective layer 211 may be provided on the surface of the first metal trace 21 in contact with the color-changing material layer 30 to block the direct contact between the first metal trace 21 and the color-changing material layer 30 and prevent the first metal trace 21 from directly contacting the color-changing material layer 30 .
  • a metal trace 21 is short-circuited with the first ground trace 22 .
  • the color-changing material layer 30 is respectively bonded to the first conductive layer 20 and the second conductive layer 40 for realizing color changing (coloring or fading) when a voltage is applied.
  • the electrochromic materials included in the color-changing material layer 30 may be organic polymers (including polyaniline, polythiophene, etc.), inorganic materials (Prussian blue, transition metal oxides, such as tungsten trioxide), and small organic molecules (viologens). )Wait. Wherein, when the color changing material layer 30 is an organic polymer or an inorganic material, it has a similar structure.
  • the color-changing material in the color-changing material layer 30 may be a solid or gel state material.
  • the second conductive layer 40 is similar to the first conductive layer 20 , and the second conductive layer 40 is provided with a second metal trace 41 , a second ground trace 42 , and a second isolation trench 43.
  • the second conductive layer 40 has the same function as the first conductive layer 20, and the general structure and material are similar. Please refer to FIG. 2, FIG. 3 and FIG. 4 for details.
  • the line 41 , the second ground trace 42 , and the second isolation groove 43 have been described too much, and only the main components thereof are listed.
  • the introduction of the first conductive layer 20 In one embodiment, at most one of the first ground trace 22 and the second ground trace 42 may be omitted.
  • insulating glue may be filled in the second isolation trench 43 .
  • the first ground traces 22 and the second ground traces 42 are disposed opposite to each other or in a staggered position.
  • the first isolation trenches 23 and the second isolation trenches 43 are disposed opposite to each other or in a staggered manner.
  • the first metal traces 21 and the second metal traces 41 are disposed opposite to each other or in a staggered position.
  • the second isolation trench 43 may be omitted, and an insulating layer is provided between the second ground trace 42 and the second conductive layer 40 to prevent the second ground trace 42 from being electrically connected to the second conductive layer 40 , Thus, the short circuit between the second metal trace 41 and the second ground trace 42 is avoided.
  • an insulating protective layer 411 may be provided on the surface of the second metal trace 41 in contact with the color-changing material layer 30 to prevent the second metal trace 11 from directly contacting the color-changing material layer 30 to prevent the The two metal traces 41 and the second ground traces 42 are short-circuited.
  • the second metal traces 41 and the second ground traces 42 are disposed close to the plastic frame 60 .
  • first metal trace can be converted to each other in different embodiments.
  • the "first metal trace” may also be referred to as the "second metal trace”, and may also be referred to as the "metal trace”.
  • first ground trace may also be referred to as the "second ground trace”, and may also be referred to as the "ground trace”.
  • the first conductive layer 20, the color-changing material layer 30 and the second conductive layer 40 can be formed by physical vapor deposition (PVD, Physical Vapor Deposition), specifically including vacuum evaporation, sputtering Radiation, ion plating (hollow cathode ion plating, hot cathode ion plating, arc ion plating, active reactive ion plating, radio frequency ion plating, DC discharge ion plating), etc.
  • PVD physical vapor deposition
  • the second substrate 50 is similar to the first substrate 10 and has the same function, and the general structure and material are similar.
  • the second substrate 50 will not be described too much, and the specific cooperation relationship and functions can be referred to the introduction of the first substrate 10 .
  • the second substrate 50 can be replaced by a process protection layer, and the process protection layer can be directly disposed on the second conductive layer 40 .
  • the process protection layer can be in the form of a one-layer or multi-layer structure formed by physical vapor deposition, and the material of the process protection layer can be dense metal oxide or inorganic non-metal, specifically silicon oxide, aluminum oxide, titanium oxide, etc.
  • the process protection layer By disposing the process protection layer on the second conductive layer 40, in the process of the electrochromic module 100, water vapor can be prevented from penetrating into the inside of the electrochromic module 100 (especially the color-changing material layer 30), and other The ions in the layer penetrate into the electrochromic module 100 , which can form a barrier protection for the electrochromic module 100 to prevent the ion penetration from damaging the color-changing material layer 30 , thereby improving the reliability of the electrochromic module 100 . It can be understood that the first substrate 10 can also be replaced by a process protection layer.
  • the plastic frame 60 can be arranged around the sides of the first substrate 10 , the first conductive layer 20 , the color-changing material layer 30 , the second conductive layer 40 and the second substrate 50 , and They are respectively bonded to the first substrate 10 , the first conductive layer 20 , the color-changing material layer 30 , the second conductive layer 40 and the second substrate 50 .
  • the plastic frame 60 is used for bonding the first conductive layer 20 and the second conductive layer 40 , so that a chamber is formed between the first conductive layer 20 and the second conductive layer 40 for filling the color-changing material to form the color-changing material layer 30 .
  • the plastic frame 60 can also prevent water vapor from penetrating from the side of the electrochromic module 100 to the inside of the electrochromic module 100 , such as the color-changing material layer 30 .
  • the performance requirements of the glue used in the glue frame 60 are: A. The content of Na + and K + in the glue material is low; B. The glue has high adhesion to the glass surface, the water-oxygen barrier unit 70 and the PET surface; C , The viscosity is between 30,000-150,000 mPa*s; D. The water vapor transmission rate WVTR value is below 1x10 -2 g/m 2 /day; E.
  • the curing conditions are UV (ultraviolet light) curing and UV + low temperature ( ⁇ 90 °C) thermosets are mainly, and have certain flexibility after curing.
  • the glue frame 60 may be formed by using UV-curable glue.
  • the material of the plastic frame 60 is usually selected from UV-curable and heat-curable sealants and mixed together according to certain components to make a UV-heat-cured hybrid sealant.
  • the color-changing material layer 30 in the electrochromic module 100 undergoes a redox reaction under a certain voltage, manifesting as coloring and fading Variety.
  • the change process will experience some unstable chemical states, and is sensitive to water and oxygen, that is, a small amount of water and oxygen mixed into it will cause irreversible side reactions, causing the electrochromic module 100 to fail. Therefore, in order to encapsulate the electrochromic module 100 well, the color-changing material layer 30 is strictly isolated from water and oxygen, and water is adhered to the end of the second substrate 50 and the plastic frame 60 on the side away from the first substrate 10 .
  • the water and oxygen blocking unit 70 is used to completely isolate the electrochromic module 100 from the external water and oxygen environment.
  • the water and oxygen blocking unit 70 may include a water and oxygen blocking layer 71 and a third substrate 72 .
  • the water and oxygen barrier layer 71 is plated on the third substrate 72 .
  • the material of the third base material 72 may be similar to that of the first base material 10 . For details, reference may be made to the first base material 10 , which will not be repeated here.
  • the water and oxygen barrier layer 71 may be a dense inorganic layer (SiO 2 or Al 2 O 3 ) and an organic layer plated on the third substrate 72 by flash evaporation or ALD (atomic layer deposition) process, or Organic-inorganic superimposed composite layers.
  • the water and oxygen barrier layer 71 is interposed between the second substrate 50 and the third substrate 72 .
  • the water-oxygen blocking unit 70 may be omitted.
  • the third substrate 72 may be omitted, and the water-oxygen barrier layer 71 may be directly disposed on the second substrate 50 .
  • a transparent optical adhesive OCA, Optically Clear Adhesive, OCA optical adhesive
  • OCA optical adhesive layer may also be disposed between the second substrate 50 and the water-oxygen blocking unit 70 .
  • a first metal trace 21 and a first ground trace 22 are disposed on the first conductive layer 20
  • a second metal trace 41 and a second ground trace 42 are disposed on the second conductive layer 40 .
  • the first metal traces 21 , the first ground traces 22 , the second metal traces 41 and the second ground traces 42 are electrically connected to the flexible circuit board 80 , so that the electrochromic module 100 can communicate with electronic devices through the flexible circuit board 80 . Electrical connection of equipment.
  • a first circuit trace 81 and a second circuit trace 85 are disposed on the flexible circuit board 80 , and the first circuit trace 81 is respectively connected to the first circuit trace 81 on the first conductive layer 20 .
  • the first metal trace 21 and the first ground trace 22 are electrically connected.
  • the second circuit traces 85 are respectively electrically connected to the second metal traces 41 and the second ground traces 42 on the second conductive layer 40 .
  • the first circuit trace 81 on the flexible circuit board 80 is a first ground wire 82 , a control trace 83 and a second ground wire 84 which are arranged side by side in sequence.
  • the first ground wire 82 is electrically connected to one end of the first ground wire 22
  • the second ground wire 84 is electrically connected to the other end of the first ground wire 22 .
  • the control wiring 83 is electrically connected to the first metal wiring 21 .
  • the second circuit trace 85 on the flexible circuit board 80 is a first ground wire 86 , a control trace 87 and a second ground wire 88 which are arranged side by side in sequence.
  • the first ground wire 86 is electrically connected to one end of the second ground wire 42
  • the second ground wire 88 is electrically connected to the other end of the second ground wire 42 .
  • the control wire 87 is electrically connected to the second metal wire 41 .
  • FIG. 5 discloses a circuit connection diagram of the first conductive layer, the second conductive layer and a flexible circuit board (FPC) in another embodiment of the present application.
  • the connection relationship between the first conductive layer 20, the second conductive layer 40 and the flexible circuit board 80 shown in FIG. 5 is similar to that shown in FIG. 3, the difference is that the second ground wire 84 and the first ground wire 86 are short-circuited to form a third ground wire 89.
  • the flexible circuit board 80 is provided with a first ground wire 82 , a control wire 83 , a third ground wire 89 , a control wire 87 and a second ground wire 88 arranged side by side in sequence.
  • FIG. 5 discloses a circuit connection diagram of the first conductive layer, the second conductive layer and a flexible circuit board (FPC) in another embodiment of the present application.
  • the connection relationship between the first conductive layer 20, the second conductive layer 40 and the flexible circuit board 80 shown in FIG. 5 is similar to that shown in FIG. 3, the difference is that the
  • the first ground wire 82 is electrically connected to one end of the first ground wire 22
  • the third ground wire 89 is electrically connected to the other end of the first ground wire 22
  • One end of the ground trace 42 is electrically connected
  • the second ground wire 88 is electrically connected to the other end of the second ground trace 42
  • the control trace 83 is electrically connected to the first metal trace 21
  • the control trace 87 is electrically connected to the second metal trace 42
  • Line 41 is electrically connected.
  • the first circuit trace may also be referred to as the "second circuit trace”, and may also be referred to as the "circuit trace”.
  • first ground wire may also be referred to as “second ground wire”, and may also be referred to as “ground wire”.
  • the first substrate 10 is further provided with a trace connection end adjacent to the first metal trace 21 and/or the first ground trace 22 and provided with insulation
  • the second metal trace 41 and/or Or the second ground trace 42 is electrically connected to the trace connection terminal on the first substrate 10
  • the flexible circuit board 80 is respectively connected to the trace connection terminal and the first metal trace 21 and/or the first ground trace 22 Electrical connections.
  • the second metal trace 41 and the trace connection end on the first substrate 10 may be connected by conductive silver paste.
  • the second conductive layer 40 is provided with a through hole at a position corresponding to the second metal trace 41 , and the conductive silver paste is connected to the second metal trace 41 through the through hole.
  • FIG. 6 discloses a schematic cross-sectional view of the electrochromic module I-I shown in FIG. 1 in another embodiment of the present application
  • FIG. 7 discloses the first embodiment shown in FIG. 1 in the present application.
  • the electrochromic module 100 may include the first substrate 10 , the first conductive layer 20 , the color-changing material layer 30 , the second conductive layer 40 , the second substrate 50 , the plastic frame 60 and the water oxygen described in the above embodiments.
  • Blocking unit 70 is a schematic cross-sectional view of the electrochromic module I-I shown in FIG. 1 in another embodiment of the present application
  • FIG. 7 discloses the first embodiment shown in FIG. 1 in the present application.
  • the electrochromic module 100 may include the first substrate 10 , the first conductive layer 20 , the color-changing material layer 30
  • the first substrate 10 , the first conductive layer 20 , the color-changing material layer 30 , the second conductive layer 40 , the second substrate 50 and the water-oxygen barrier unit 70 are stacked in sequence.
  • the plastic frame 60 is arranged around the side edge of the color-changing material layer 30 .
  • the plastic frame 60 is surrounded by the first conductive layer 20 and the second conductive layer 40 to form a chamber for filling the color-changing material to form the color-changing material layer 30 .
  • the first substrate 10 is used to support and carry the first conductive layer 20 .
  • the second substrate 50 is used to support and carry the second conductive layer 40 .
  • the first substrate 10 and the second substrate 50 make the electrochromic module 100 form a complete product, so that the electrochromic module 100 can be used normally.
  • the plastic frame 60 and/or the water-oxygen blocking unit 70 are used to completely isolate the electrochromic module 100 such as the color-changing material layer 30 from the external water-oxygen environment, so as to avoid oxidation failure of the color
  • the first metal wiring 21 adopts a local wiring method. For example, it is only arranged on one side of the first conductive layer 20 , and the first ground trace 22 surrounds the periphery of the first metal trace 21 .
  • the second metal wiring 41 adopts a local wiring method. For example, it is only arranged on one side of the second conductive layer 40 , and the second ground trace 42 surrounds the periphery of the second metal trace 41 .
  • the first metal traces 21 extend along an edge position close to the surface of the first conductive layer 20
  • the second metal traces 41 extend along an edge position close to the surface of the second conductive layer 40 .
  • the first ground trace 22 can be surrounded by a full-circumference trace around the first metal trace 21, or a partial trace can be used, for example, the first ground trace 22 can be surrounded by the first metal trace Part of the circumference of 21 is, for example, one side, two adjacent sides, and three sides.
  • the second ground trace 84 may be omitted.
  • FIG. 8 discloses a schematic cross-sectional view of the electrochromic module I-I shown in FIG. 1 in another embodiment of the present application.
  • the electrochromic module 100 may include the first substrate 10 , the first conductive layer 20 , the color-changing material layer 30 , the second conductive layer 40 , the second substrate 50 , the plastic frame 60 and the water-oxygen barrier unit in the above embodiment 70.
  • the first substrate 10 , the first conductive layer 20 , the color-changing material layer 30 , the second conductive layer 40 , the second substrate 50 and the water-oxygen barrier unit 70 are stacked in sequence.
  • the plastic frame 60 is arranged around the side edge of the color-changing material layer 30 .
  • the plastic frame 60 is surrounded by the first conductive layer 20 and the second conductive layer 40 to form a chamber for filling the color-changing material to form the color-changing material layer 30 .
  • the first substrate 10 is used to support and carry the first conductive layer 20 .
  • the second substrate 50 is used to support and carry the second conductive layer 40 .
  • the first substrate 10 and the second substrate 50 make the electrochromic module 100 form a complete product, so that the electrochromic module 100 can be used normally.
  • the plastic frame 60 and/or the water-oxygen blocking unit 70 are used to completely isolate the electrochromic module 100 such as the color-changing material layer 30 from the external water-oxygen environment, so as to avoid oxidation failure of the color-changing material.
  • the plastic frame 60 is placed between the first conductive layer 20 and the second conductive layer 40 .
  • the plastic frame 60 is arranged around the side edge of the color-changing material layer 30 .
  • the plastic frame 60 can cover the first metal traces 21 , the first ground traces 22 and the first isolation trench 23 to avoid short circuit between the first metal traces 21 and the first ground traces 22 .
  • the plastic frame 60 can cover the second metal trace 41 , the second ground trace 42 and the second isolation groove 43 to avoid short circuit between the second metal trace 41 and the second ground trace 42 .
  • FIG. 9 discloses a cross-sectional schematic diagram of the electrochromic module I-I shown in FIG. 1 in another embodiment of the present application.
  • the electrochromic module 100 may include the first substrate 10 , the first conductive layer 20 , the color-changing material layer 30 , the second conductive layer 40 , the second substrate 50 , the plastic frame 60 and the water-oxygen barrier unit in the above embodiment 70.
  • the first substrate 10 , the first conductive layer 20 , the color-changing material layer 30 , the second conductive layer 40 , the second substrate 50 and the water-oxygen barrier unit 70 are stacked in sequence.
  • the plastic frame 60 is arranged around the side edge of the color-changing material layer 30 .
  • the plastic frame 60 is surrounded by the first conductive layer 20 and the second conductive layer 40 to form a chamber for filling the color-changing material to form the color-changing material layer 30 .
  • the first substrate 10 is used to support and carry the first conductive layer 20 .
  • the second substrate 50 is used to support and carry the second conductive layer 40 .
  • the first substrate 10 and the second substrate 50 make the electrochromic module 100 form a complete product, so that the electrochromic module 100 can be used normally.
  • the plastic frame 60 and/or the water-oxygen blocking unit 70 are used to completely isolate the electrochromic module 100 such as the color-changing material layer 30 from the external water-oxygen environment, so as to avoid oxidation failure of the color-changing material.
  • the plastic frame 60 can be arranged around the sides of the first substrate 10 , the first conductive layer 20 , the color-changing material layer 30 , the second conductive layer 40 and the second substrate 50 , and are respectively connected with The first substrate 10 , the first conductive layer 20 , the color-changing material layer 30 , the second conductive layer 40 and the second substrate 50 are bonded.
  • the plastic frame 60 is partially interposed between the first conductive layer 20 and the second conductive layer 40 .
  • the plastic frame 60 can cover the first metal traces 21 , the first ground traces 22 and the first isolation trench 23 to avoid short circuit between the first metal traces 21 and the first ground traces 22 .
  • the plastic frame 60 can cover the second metal trace 41, the second ground trace 42 and the second isolation trench 43, so as to prevent the second metal trace 41 and the second ground trace 42 from being short-circuited.
  • FIG. 10 is a schematic cross-sectional view of the electrochromic module I-I shown in FIG. 1 in another embodiment of the present application.
  • the electrochromic module 100 may include the first substrate 10 , the first conductive layer 20 , the color-changing material layer 30 , the second conductive layer 40 , the second substrate 50 , the plastic frame 60 and the water-oxygen barrier unit in the above embodiment 70.
  • the first substrate 10 , the first conductive layer 20 , the color-changing material layer 30 , the second conductive layer 40 , the second substrate 50 and the water-oxygen barrier unit 70 are stacked in sequence.
  • the plastic frame 60 is arranged around the side edge of the color-changing material layer 30 .
  • the plastic frame 60 is surrounded by the first conductive layer 20 and the second conductive layer 40 to form a chamber for filling the color-changing material to form the color-changing material layer 30 .
  • the first substrate 10 is used to support and carry the first conductive layer 20 .
  • the second substrate 50 is used to support and carry the second conductive layer 40 .
  • the first substrate 10 and the second substrate 50 make the electrochromic module 100 form a complete product, so that the electrochromic module 100 can be used normally.
  • the plastic frame 60 and/or the water-oxygen blocking unit 70 are used to completely isolate the electrochromic module 100 such as the color-changing material layer 30 from the external water-oxygen environment, so as to avoid oxidation failure of the color-changing material.
  • the plastic frame 60 can be arranged around the sides of the first conductive layer 20 , the color-changing material layer 30 , the second conductive layer 40 and the second substrate 50 .
  • the end of the plastic frame 60 on the side away from the second substrate 50 is bonded to the side of the first substrate 10 facing the color-changing material layer 30 .
  • the end of the plastic frame 60 on the side away from the first substrate 10 is bonded to the side of the water-oxygen barrier unit 70 such as the water-oxygen barrier layer 71 facing the color-changing material layer 30 .
  • the electrochromic module 100 may include the first substrate 10 , the first conductive layer 20 , the color-changing material layer 30 , the second conductive layer 40 , the second substrate 50 , the plastic frame 60 and the water-oxygen barrier unit in the above embodiment 70.
  • the first substrate 10 , the first conductive layer 20 , the color-changing material layer 30 , the second conductive layer 40 , the second substrate 50 and the water-oxygen barrier unit 70 are stacked in sequence.
  • the plastic frame 60 is arranged around the side edge of the color-changing material layer 30 .
  • the plastic frame 60 is surrounded by the first conductive layer 20 and the second conductive layer 40 to form a chamber for filling the color-changing material to form the color-changing material layer 30 .
  • the first substrate 10 is used to support and carry the first conductive layer 20 .
  • the second substrate 50 is used to support and carry the second conductive layer 40 .
  • the first substrate 10 and the second substrate 50 make the electrochromic module 100 form a complete product, so that the electrochromic module 100 can be used normally.
  • the plastic frame 60 and/or the water-oxygen blocking unit 70 are used to completely isolate the electrochromic module 100 such as the color-changing material layer 30 from the external water-oxygen environment, so as to avoid oxidation failure of the color-changing material.
  • the plastic frame 60 can be arranged around the sides of the first conductive layer 20 , the color-changing material layer 30 , the second conductive layer 40 and the second substrate 50 .
  • the end of the plastic frame 60 on the side away from the second substrate 50 is bonded to the side of the first substrate 10 facing the color-changing material layer 30 .
  • the end of the plastic frame 60 on the side away from the first substrate 10 is bonded to the side of the water-oxygen barrier unit 70 such as the water-oxygen barrier layer 71 facing the color-changing material layer 30 .
  • a portion of the surface of the first conductive layer 20 facing the color-changing material layer 30 is bonded to the plastic frame 60 .
  • the part of the plastic frame 60 and the first conductive layer 20 facing the color-changing material layer 30 can be covered on the part of the first metal trace 21 , the first ground trace 22 and the first isolation groove 23 to avoid the first The metal trace 21 and the first ground trace 22 are short-circuited.
  • the part of the surface of the first conductive layer 20 facing the color changing material layer 30 is bonded to the plastic frame 60 .
  • the adhesive part of the plastic frame 60 and the surface of the first conductive layer 20 facing the color-changing material layer 30 can cover all of the first metal traces 21 , the first ground traces 22 and the first isolation grooves 23 to avoid the first The metal trace 21 and the first ground trace 22 are short-circuited.
  • FIG. 12 the part of the surface of the first conductive layer 20 facing the color changing material layer 30 is bonded to the plastic frame 60 .
  • the adhesive part of the plastic frame 60 and the surface of the first conductive layer 20 facing the color-changing material layer 30 can cover all of the first metal traces 21 , the first ground traces 22 and
  • the portion of the surface of the first conductive layer 20 facing the color changing material layer 30 is bonded to the plastic frame 60 .
  • the part of the surface of the second conductive layer 40 facing the color changing material layer 30 is bonded to the plastic frame 60 .
  • the adhesive part of the plastic frame 60 and the surface of the first conductive layer 20 facing the color-changing material layer 30 can cover all of the first metal traces 21 , the first ground traces 22 and the first isolation grooves 23 to avoid the first The metal trace 21 and the first ground trace 22 are short-circuited.
  • the part of the plastic frame 60 and the second conductive layer 40 facing the color-changing material layer 30 can be covered on the part of the second metal trace 41 , the second ground trace 42 and the second isolation groove 43 to avoid the second The metal trace 41 and the second ground trace 42 are short-circuited.
  • the first circuit trace 21 , the first ground trace 22 , the second circuit trace 41 and the second ground trace 42 can all adopt the trace layout shown in FIG. 7 , so that the first circuit trace
  • the wire 21 and the first ground wire 22 are covered by the plastic frame 60, so that the second circuit wire 41 and the second ground wire 42 are located between the color-changing material layer 30 and the second conductive layer 40, for example, as shown in FIG. 14 ,
  • the part of the surface of the first conductive layer 20 facing the color changing material layer 30 is bonded to the plastic frame 60 .
  • the part of the surface of the second conductive layer 40 facing the color changing material layer 30 is bonded to the plastic frame 60 .
  • the adhesive part of the plastic frame 60 and the surface of the first conductive layer 20 facing the color-changing material layer 30 can cover all of the first metal traces 21 , the first ground traces 22 and the first isolation grooves 23 to avoid the first The metal trace 21 and the first ground trace 22 are short-circuited.
  • the second metal trace 41 , the second ground trace 42 and the second isolation trench 43 are located between the color-changing material layer 30 and the second conductive layer 40 .
  • the second metal trace 41 , the second ground trace 42 and the first The two isolation grooves 43 can also be completely covered by the plastic frame 60 .
  • the electrochromic module 100 may include the first substrate 10 , the first conductive layer 20 , the color-changing material layer 30 , the second conductive layer 40 , the second substrate 50 , the plastic frame 60 and the water-oxygen barrier unit in the above embodiment 70.
  • the first substrate 10 , the first conductive layer 20 , the color-changing material layer 30 , the second conductive layer 40 , the second substrate 50 and the water-oxygen barrier unit 70 are stacked in sequence.
  • the plastic frame 60 is arranged around the side edge of the color-changing material layer 30 .
  • the plastic frame 60 is surrounded by the first conductive layer 20 and the second conductive layer 40 to form a chamber for filling the color-changing material to form the color-changing material layer 30 .
  • the first substrate 10 is used to support and carry the first conductive layer 20 .
  • the second substrate 50 is used to support and carry the second conductive layer 40 .
  • the first substrate 10 and the second substrate 50 make the electrochromic module 100 form a complete product, so that the electrochromic module 100 can be used normally.
  • the plastic frame 60 and/or the water-oxygen blocking unit 70 are used to completely isolate the electrochromic module 100 such as the color-changing material layer 30 from the external water-oxygen environment, so as to avoid oxidation failure of the color-changing material.
  • the first conductive layer 20 and the second conductive layer 40 are dislocated.
  • the first conductive layer 20 and the second conductive layer 40 are orthographically overlapped with each other, and the color-changing material layer 30 is provided.
  • the first metal trace 21 , the first ground trace 22 and the first isolation trench 23 are located outside the orthographic projection of the second conductive layer 40 on the first conductive layer 20 .
  • the second metal trace 41 , the second ground trace 42 and the second isolation trench 43 are located outside the orthographic projection of the first conductive layer 20 on the second conductive layer 40 .
  • the plastic frame 60 can be arranged around the sides of the first substrate 10 , the first conductive layer 20 , the color-changing material layer 30 , the second conductive layer 40 and the second substrate 50 .
  • the plastic frame 60 can cover the first metal traces 21 , the first ground traces 22 and the first isolation trench 23 to avoid short circuit between the first metal traces 21 and the first ground traces 22 . In one embodiment, the plastic frame 60 can cover the second metal trace 41 , the second ground trace 42 and the second isolation groove 43 to avoid short circuit between the second metal trace 41 and the second ground trace 42 .
  • the dislocation of the first conductive layer 20 and the second conductive layer 40 can ensure the traces on the first conductive layer 20 and the second conductive layer 40 (the first metal trace 21 and the first ground trace 22, The second metal traces 41 and the second ground traces 42) do not have the risk of contacting each other, and the routing step can be easily achieved by spotting silver paste after the first conductive layer 20 and the second conductive layer 40 are assembled, reducing the risk of short circuit
  • the shape of the wire can be straight, L-shaped, or mouth-shaped.
  • the plastic frame 60 can cover the side edges of the plastic frame 60 of the first metal trace 21 , the first ground trace 22 and the first isolation groove 23 and the first substrate 10 side edges are flush. In one embodiment, the plastic frame 60 can cover the side edges of the plastic frame 60 of the second metal traces 41 , the second ground traces 42 and the second isolation grooves 43 so as to be flush with the side edges of the second substrate 50 together.
  • the cover plate assembly includes the electrochromic module 100 described in the above embodiments, which can realize the active change of the appearance effect of the cover plate assembly, so that the appearance expressiveness is obviously improved.
  • FIGS. 17 and 18 FIG. 17 shows a top view of the cover plate assembly in an embodiment of the present application, and FIG. 18 discloses a schematic cross-sectional view of the cover plate assembly II-II shown in FIG. 17 in an embodiment of the present application.
  • the cover plate assembly 200 may include an electrochromic module 100 , a cover plate 300 and a decoration unit (also referred to as an “appearance film layer”) 400 .
  • the cover plate 300 , the electrochromic module 100 and the decoration unit 400 are stacked in sequence, and the display and shielding of the decoration unit 400 can be realized through the discoloration (coloring or fading) of the electrochromic module 100 , so that the cover plate assembly 200
  • the appearance effect is actively changed, which makes the appearance expressiveness significantly improved.
  • the electrochromic module 100 may include a color changing portion 101 and an encapsulating portion 102 in an integrated structure.
  • the encapsulation part 102 can be arranged around the discoloration part 101 .
  • the encapsulation part 102 can be formed by encapsulating the discoloration part 101 by the plastic frame 60 in the above-mentioned embodiment or the plastic frame 60 and other materials in the electrochromic module 100 , that is, the electrochromic module 100 will neither be colored nor faded after the electrochromic module 100 is powered on.
  • the discoloration part 101 is an area that can be discolored (colored or faded) by controlling the voltage after the electrochromic module 100 is powered on.
  • the traces such as the first metal trace 21 , the second metal trace 41 , the first ground trace 22 , the second ground trace 42
  • the isolation groove may be provided in the discoloration part 101 and/or the encapsulation part 102 .
  • the function of the electrochromic module 100 needs to be driven by an electrical signal (ie, a control voltage), so there is a packaging portion 102 such as a plastic frame 60 on the edge of the electrochromic module 100 (ideally transparent, with a slight whitening). phenomenon), traces (the first metal trace 21, the second metal trace 41, the first ground trace 22, the silver-white metal wire of the second ground trace 42), the yellow-brown flexible circuit board 80, these components Some parts are inconsistent with the appearance of the electrochromic module 100 , and are completely exposed under the transparent cover plate 300 , which affects the appearance of the cover plate assembly 200 .
  • an electrical signal ie, a control voltage
  • the cover plate assembly 200 it is necessary to set a shielding layer in the cover plate assembly 200 to protect the structures that are not suitable to be displayed through the cover plate 300, such as the plastic frame 60, the traces (the first metal trace 21, the second metal trace 41, the first ground trace 22 , the silver-white metal wire of the second grounding trace 42 ), isolation groove, etc. for shielding.
  • FIG. 19 , FIG. 20 and FIG. 21 respectively disclose structural schematic diagrams of the cover plate 300 in different embodiments of the present application.
  • the cover plate 300 can be bonded to the electrochromic module 100 such as the first substrate 10 .
  • a transparent optical adhesive may be used in order to realize the bonding between the cover plate 300 and the electrochromic module 100 such as the first substrate 10. That is, an OCA optical adhesive layer may also be disposed between the cover plate 300 and the electrochromic module 100 such as the first substrate 10 .
  • the cover plate 300 can be made of light-transmitting materials such as glass (transparent glass, AG glass, etc.), plastic, transparent PC (polycarbonate), transparent PC/PMMA composite plate, etc.
  • Light material and opaque material are spliced together (that is, partially transparent).
  • the opaque material may be a mixture of a translucent material and other materials, or it may simply be an opaque material.
  • the opaque material can be plastic, glass and other materials. Of course, as long as the materials with a certain hardness are classified according to light transmittance, they are divided into light transmittance materials and opaque materials.
  • the cover plate 300 is transparent as a whole, so the cover plate 300 may also be referred to as a "transparent cover plate". In one embodiment, referring to FIGS.
  • the cover plate 300 may include a transparent area 301 and a non-transparent area 302 .
  • the transparent area 301 and the non-transparent area 302 can be arranged arbitrarily, and can also be arranged in various patterns as required.
  • the transparent area 301 may be made of a light-transmitting material
  • the non-transparent area 302 may be made of an opaque material.
  • the light transmittance of the transparent region 301 may be determined by the difference of the light-transmitting materials.
  • the non-transparent area 302 is surrounded around the transparent area 301 , as shown in FIG. 19 and FIG. 20 .
  • the transparent area 301 can be divided into two parts, and the non-transparent area 302 is surrounded by the transparent area 301, as shown in FIG. 21 .
  • the transparent area 301 can also be divided into other parts, which will not be limited here.
  • the non-transparent area 302 may also be divided into at least one part, which will not be limited here.
  • the non-transparent area 302 may have a camera hole 303 for cooperating with the camera module, as shown in FIG. 20 , FIG. 21 , and FIG. 23 , and FIG. 23 discloses a cover plate assembly in another embodiment of the present application. top view. It can be understood that the arrangement of the transparent region 301 and the non-transparent region 302 is not limited by the arrangement listed here, which is only an example, and other arrangements are also possible.
  • FIG. 24 discloses a III-III cross-sectional view of the cover plate assembly shown in FIG. 22 in an embodiment of the present application.
  • the cover plate 300 is provided with a shielding layer 90 on the side facing the electrochromic module 100, such as the first substrate 10, for shielding the encapsulation portion 102 and the wiring of the electrochromic module 100.
  • the shielding layer 90 may be partially located in the non-transparent area 302 and partially located in the transparent area 301 in the orthographic projection area of the cover plate 300 .
  • the setting of the shielding layer 90 is set according to the encapsulation part 102 and the wiring in the electrochromic module 100, so the orthographic projection area of the shielding layer 90 on the cover plate 300 can be completely transparent
  • the region 301 may also be entirely in the non-transparent region 302 .
  • the shielding layer 90 cannot play a shielding role, so it can be omitted.
  • a matte surface 304 is provided on the surface of the cover plate 300 close to the electrochromic module 100 , such as the first substrate 10 .
  • the fog surface 304 By arranging the fog surface 304 on the surface of the cover plate 300, the light transmittance of the cover plate 300 is changed, so that the user cannot observe the structure that affects the appearance, such as wrinkles, different color spots, etc., through the fog surface 304, without affecting the appearance.
  • Other structures are imaged through the electrochromic module 100 .
  • the surface of the cover plate 300 away from the electrochromic module 100 such as the first substrate 10 , may also be provided with a matte surface.
  • the fog surface may only be disposed on the portion of the cover plate 300 opposite to the transparent area 301 .
  • the haze of the haze surface 304 may be 65-85%.
  • the roughness of the cover plate 300 at the part of the matte surface 304 may be 0.1-2.0 microns, and of course, it may preferably be 0.2-0.3 microns.
  • the matte surface 304 on the cover plate 300 is made by the surface of the cover plate 300 through a process such as a frosting process, a frosting process, a hydrofluoric acid etching process, a sand blasting process, or a liquid sand process.
  • the shielding layer 90 may be a coating, for example, the coating may be one of a mixed layer consisting of an indium layer, a silicon dioxide layer and a titanium pentoxide layer, and a mixed layer consisting of a silicon dioxide layer and a niobium oxide layer. kind.
  • the coating may be a graded coating, and the coating is graded from the middle of the coating to the edge or from one edge of the coating to the other opposite side edge.
  • vacuum evaporation or magnetron sputtering can be used for the coating, and a metal film or oxide thin film is plated on the area of the cover plate 300 that needs to be shielded (generally the outer edge of the cover plate 300 and the area of the camera hole 303 ). , the encapsulation portion 102 and the traces are shielded by the almost opaque film (the width, thickness, color, solid color or gradient effect of the film can be adjusted according to design requirements).
  • the shielding layer 90 can be a colored ink layer, and the ink or pigment with rich colors can be attached to the area of the cover plate 300 that needs to be shielded (the outer edge of the cover plate 300) by spraying, silk screen printing, pad printing or electroplating. and the camera hole 303 area), and shield the encapsulation part 102 and the traces with an opaque material (the width, thickness, color, solid color or gradient effect of the material can be adjusted according to design requirements).
  • the colored oil film layer may have black borders, such as silk screen black borders.
  • the shielding layer 90 may include a first shielding portion 91 and a second shielding portion 92 .
  • the first light shielding portion 91 and the second light shielding portion 92 may be an integral structure.
  • the first light-shielding portion 91 is annular, the first light-shielding portion 91 surrounds the periphery of the second light-shielding portion 92 , and the first light-shielding portion 91 and the second light-shielding portion 92 are in contact with each other.
  • the first light-shielding portion 91 is coated on the surface of the cover plate 300 by using a non-conductive electroplating technology, and then yellow light coating, exposure, development, and etching are performed on the area film layer in the first light-shielding portion 91, and the light is faded. resistance formation.
  • a highly transparent anti-fingerprint film made of one of TIO 2 , TA 2 O 5 , NB 2 O 5 , ZRO 2 and other materials can also be evaporated on the surface of the cover plate 300 .
  • the last formed first light shielding portion 91 may be a black border.
  • the first light shielding portion 91 may also be the colored oil film layer mentioned in the above embodiments.
  • the second light shielding portion 92 can be formed by indium plating, aluminum plating powder or pad printing aluminum powder, and its color can be the same as the color of the electrochromic module after coloring, so as to enhance the appearance expression. In one embodiment, one of the first light shielding portion 91 and the second light shielding portion 92 may be omitted.
  • FIG. 25 discloses a III-III cross-sectional view of the cover plate assembly shown in FIG. 22 in another embodiment of the present application.
  • a fourth substrate 500 is also stacked between the electrochromic module 100 and the cover plate 300, and the shielding layer 90 may include a coating film, such as an indium layer, a silicon dioxide layer and a titanium pentoxide layer.
  • a coating film such as an indium layer, a silicon dioxide layer and a titanium pentoxide layer.
  • the coating may be a graded coating, and the coating is graded from the middle of the coating to the edge or from one edge of the coating to the other opposite side edge.
  • the coating film is disposed on the side of the fourth substrate 500 away from the first substrate 10 .
  • the fourth base material 500 is bonded to the first base material 10 , for example, using a transparent optical adhesive for bonding, that is, an OCA optical adhesive layer may also be disposed between the first base material 10 and the second base material 50 .
  • the coating film is disposed on the side of the fourth substrate 500 away from the cover plate 300 .
  • the cover plate 300 and the fourth base material 500 are bonded, for example, by using transparent optical glue, that is, an OCA optical glue layer can be further arranged between the cover plate 300 and the fourth base material 500 .
  • the fourth substrate 500 may also serve as a part of the shielding layer 90 .
  • the shielding layer 90 shown in FIG. 25 can also be arranged according to the shielding layer 90 described in FIG. 24 including the first light shielding portion 91 and the second light shielding portion 92 .
  • the shielding layer 90 shown in FIG. 25 can also be arranged according to the shielding layer 90 described in FIG. 24 including the first light shielding portion 91 and the second light shielding portion 92 .
  • first substrate can also be referred to as the “second substrate”, and can also be referred to as the “substrate”.
  • vacuum evaporation or magnetron sputtering can be used for the coating, and a metal film or a thin oxide layer is plated on the area of the fourth substrate 500 that needs to be shielded.
  • the thickness, color, solid color or gradient effect can be adjusted according to design requirements) to cover the package portion 102 and the wiring and the like.
  • the shielding layer 90 can be a colored ink layer, and the ink or pigment with rich colors can be attached to the area of the fourth substrate 500 that needs to be shielded by spraying, silk screen printing, pad printing or electroplating.
  • the light material (the width, thickness, color, solid color, or gradient effect of the material can be adjusted according to design requirements) blocks the package portion 102 and the traces and the like.
  • the shielding layer 90 may be a coating film, for example, the coating film may be one of a mixed layer consisting of an indium layer, a silicon dioxide layer and a titanium pentoxide layer, and a mixed layer consisting of a silicon dioxide layer and a niobium oxide layer.
  • the coating may be a graded coating, and the coating may be graded from the middle of the coating to the edge or from one edge of the coating to the other opposite edge.
  • the shielding layer 90 is disposed on the electrochromic module 100 such as the first substrate 10 .
  • vacuum evaporation or magnetron sputtering can be used for the coating, and a metal film or a thin oxide layer is coated on the area of the first substrate 10 that needs to be shielded.
  • the thickness, color, solid color or gradient effect can be adjusted according to design requirements) to cover the package portion 102 and the wiring and the like.
  • the shielding layer 90 shown in FIG. 26 can also be provided according to the shielding layer 90 described in FIG. 24 including the first light shielding portion 91 and the second light shielding portion 92 .
  • the shielding layer 90 described in FIG. 24 can also be provided according to the shielding layer 90 described in FIG. 24 including the first light shielding portion 91 and the second light shielding portion 92 .
  • the shielding layer 90 may include a first light shielding portion 91 and a second light shielding portion 92 .
  • the first light shielding portion 91 and the second light shielding portion 92 are arranged side by side and are in contact with each other.
  • the shielding layer 90 can be a strip-shaped, irregular non-closed-loop structure; therefore, the first shading portion 91 is arranged on one side of the second shading portion 92, and the first shading portion 91 and the second shading portion 92 in the orthographic projection area on the electrochromic module 100, the first light shielding portion 91 is closer to the encapsulation portion 102 than the second light shielding portion 92, and the second light shielding portion 92 is closer to the discoloration portion than the first light shielding portion 91. 101.
  • the decoration unit 400 may include a nano-imprint layer 401 , a color layer 402 and a primer 403 .
  • the nano-imprint layer 401 , the color layer 402 and the primer 403 are stacked in sequence.
  • the side of the nano-imprint layer 401 away from the color layer 402 can be bonded to the side of the electrochromic module 100 such as the second substrate 50 or the third substrate 72 away from the color-changing material layer 30 .
  • the nano-imprint layer 401 can also be placed between the color layer 402 and the primer 403 , that is, the color layer 402 , the nano-imprint layer 401 and the primer 403 are stacked in sequence.
  • the side of the third substrate 72 of the water-oxygen blocking unit 70 close to the color-changing material layer 30 has a water-oxygen blocking layer 71 .
  • the water-oxygen barrier layer 71 is disposed on the side of the third substrate 72 close to the color-changing material layer 30 instead of the side facing away from the color-changing material layer 30, in order to prevent some scratches caused by the water-oxygen barrier layer 71 facing outward.
  • the water-oxygen barrier layer 71 cannot be disposed between the third substrate 72 and the nano-imprint layer 401.
  • the water-oxygen barrier layer 71 affects the bonding force between the nano-imprint layer 401 and the third substrate 72, and the nano-pressure If the printing process directly contacts the water and oxygen barrier layer 71 , the water and oxygen barrier layer 71 may be damaged.
  • the water vapor transmission rate WVTR of the water and oxygen barrier layer 71 is less than 1 ⁇ 10 ⁇ 2 g/m 2 /day (20° C./100% RH).
  • a nano-imprint layer 401 and a color layer 402 are provided on the side of the third substrate 72 facing away from the water-oxygen barrier layer 71 .
  • the color layer 402 can be realized by optical coating or printing or printing and coating.
  • the nano-imprint layer 401 and the color layer 402 are the main carriers for the decoration unit 400 to limit the decoration effect.
  • a primer 403 (ink).
  • the nanoimprint layer 401 and the color layer 402 are structured and exchanged.
  • FIG. 27 discloses a III-III cross-sectional view of the cover plate assembly shown in FIG. 22 according to another embodiment of the present application.
  • the cover plate assembly 200 may not be provided with the shielding layer 90 .
  • the decoration unit 400 may include a nano-imprint layer 401 , a color layer 402 and a primer 403 .
  • the nano-imprint layer 401 and the color layer 402 can be stacked on the side of the first substrate 10 in the electrochromic module 100 away from the color-changing material layer 30 , that is, the nano-imprint layer 401 , the color layer 402 and the first substrate 10 are stacked in sequence, or the color layer 402 , the nano-imprint layer 401 and the first substrate 10 are stacked in sequence.
  • the nano-imprint layer 401 and the color layer 402 may also be stacked on the fourth substrate 500 in the cover plate assembly 200 .
  • the primer 403 is laminated on the second substrate 50 or the third substrate 72 in the electrochromic module 100 .
  • a fourth base material is additionally added between the first base material 10 and the cover plate 300 , and by performing a gradient nano-printing texture effect on the fourth base material, the sealant and the traces can be shielded.
  • the fourth base material, the cover plate 300 and the first base material 10 are respectively bonded by transparent optical glue.
  • the additionally added edge-shielding gradient texture of the fourth substrate and the nano-imprint layer 401 and the color layer 402 on the water-oxygen blocking unit 70 together constitute the appearance effect decoration for the package and wiring areas.
  • the electronic device may be a mobile terminal, or other electronic device with display and camera functions, specifically a mobile phone, a tablet computer, a notebook computer, a smart bracelet, a smart watch, a smart helmet, and smart glasses.
  • a mobile phone is used as an example for description. It can be understood that the specific form of the electronic device may also be other, which is not limited herein.
  • FIG. 28 discloses a structural block diagram of an implementation manner of an electronic device in an embodiment of the present application.
  • the electronic device 600 may include a middle frame (not shown), a display module (not shown), a control circuit 601 and a cover plate assembly 200 .
  • the middle frame and the cover plate assembly 200 are assembled into a casing, and an accommodation space is provided inside the casing, that is, the middle frame and the cover plate 300 are fixedly connected to form the accommodation space.
  • the casing is used to carry the display module and the control circuit 601 .
  • the control circuit 601 (which may include the flexible circuit board 80 in the above embodiment) is coupled and connected to the electrochromic module 100 of the cover plate assembly 200 , and the control circuit 601 is used to receive control commands, which are used to control the electrochromic module 100 discoloration.
  • the accommodating space of the housing can also be used for accommodating the battery, the main board 606, the processor (the processor can be arranged on the main board 606), various types of sensors (the sensors can also be arranged on the main board 606 and other positions in the accommodating space) , such as temperature sensors) and other electronic parts.
  • the display module and the cover plate assembly 200 are respectively located on opposite sides of the middle frame and are fixedly connected to the middle frame, and the electrochromic module 100 is closer to the display module than the cover plate 300 .
  • the main board 606 is used as the main hardware, so the above-mentioned control circuit 601 can be set on the main board 606, and the main board 606 can be electrically connected to the electrochromic module 100 through the flexible circuit board 80 (it can also be said to be a coupling), when using the layout of the first ground trace 22 and the second ground trace 42 described in FIG. 2, FIG. 3 and FIG. , the electronic device 600 can be prevented from being damaged by static electricity.
  • FIG. 29 discloses a structural block diagram of an electronic device 600 in another implementation of the present application.
  • the electronic device 600 in this implementation further includes a signal input device. 602 , wherein the signal input device 602 is coupled and connected to the control circuit 601 .
  • the control circuit 601 is configured to receive a control command input through the signal input device 602, and control the working state of the electrochromic module 100 according to the control command.
  • the working state of the electrochromic module 100 includes controlling and changing its voltage or current signal state to achieve the purpose of controlling the color change (coloring or fading state) of the electrochromic module 100 .
  • the signal input device 602 may include a touch display screen 603 (also referred to as a display module), an operation key 604, a trigger sensor 605, etc.
  • the detailed structure and signal input method are as follows.
  • FIG. 30 discloses a schematic structural diagram of an electronic device 600 in an embodiment of the present application, wherein the signal input device 602 may be a touch display screen 603 (ie, the display module in the above embodiment) , the control instruction input by the signal input device 602 may be a touch operation received by the touch display screen 603 , including at least one of sliding, clicking and long pressing.
  • FIG. 31 and FIG. 32 respectively disclose schematic diagrams of an operation state of the electronic device 600 according to an embodiment of the present application. Among them, in Fig.
  • the operator can be represented as the operator (the label 607 in the figure can be represented as the operator's hand) to input control commands by sliding the touch screen 603;
  • the input process of the control command is performed according to the diagram or a specific position on the touch screen 603 .
  • the signal input device 602 may be an operation key 604, and the control instruction may also be a trigger instruction of the operation key 604, wherein the operation key 604 may be a separate key, or may be a Other functional buttons of the device 600, such as the multiplexing of the power button, the volume button, etc., are defined as different control commands received by the control circuit 601 according to different button triggering methods, and then the control circuit 601 can realize different operations on the electrochromic module 100. signal control.
  • the control instruction is a usage scenario that requires the electronic device 600 to change color, which may specifically include at least one of an image capture requirement, a flash turning on requirement, an automatic timing discoloration requirement, and other functional component requirements.
  • the image capture requirements may be applied to the user's shooting requirements, such as scenarios such as photography, videography, video calls, unlocking requirements of the electronic device 600, payment, encryption, answering calls, or other confirmation requirements.
  • the demand for turning on the flashlight may be when the user has a need to turn on the flashlight.
  • the control circuit 601 controls the electrochromic module 100 to change the transparent state, and the electronic device 600 can also display the structure of the decoration unit 400 in combination with other structures. A discolored appearance effect.
  • the signal input device 602 can be a trigger sensor 605, wherein the trigger sensor 605 can be a proximity sensor, a temperature sensor, an ambient light sensor, etc.
  • the trigger sensor 605 collects peripheral signals of the electronic device 600, and passes
  • the control circuit 601 controls the casing to change the appearance color. That is, the change of the exterior color of the casing can enable the user to actively control the operation, similar to the control method through the touch screen 603 and the operation keys 604; it is also possible to detect the environmental signal by the trigger sensor 605 in this embodiment. , which automatically controls the way the shell changes its appearance color.
  • the electronic device 600 provided by the embodiment of the present application has the appearance effect of color-changing display, has a very good appearance aesthetic feeling, and can also have an anti-static effect.
  • FIG. 33 discloses a schematic structural diagram of an electronic device 600 in another embodiment of the present application.
  • the electronic device 600 may further include a camera module 608 .
  • the camera module 608 is installed at the camera hole 303 of the cover plate 300 for shooting.
  • the camera module 608 can be exposed from the camera hole 303 of the cover plate 300 .
  • the electrochromic module 100 is a ring-shaped structure and can be arranged around the camera hole 303 on the cover plate 300 .
  • the electrochromic module 100 is used as a decorative component and is matched with the camera module 608 to improve the appearance expression of the cover plate 300 , so that the appearance integrity of the electronic device 600 is not broken.
  • the electrochromic module 100 can be used as a decoration to play a matching effect when the camera module 608 is working.
  • the electrochromic module 100 when the camera module 608 is activated, the electrochromic module 100 is immediately controlled by the control voltage to start coloring, and the control voltage can be between 0.6- 2.0V, until it is completely colored and stop powering. If the camera module 608 is turned off before or after the coloring is completed, the electrochromic module 100 is immediately controlled by the control voltage to start fading, and the control voltage can be 0.6-2.0V, and the electrochromic module 100 begins to fade. Turn off the power until the fading is completed.
  • the electrochromic module 100 when the camera module 608 is activated, the electrochromic module 100 is immediately controlled by the control voltage to start coloring, and the control voltage can be between 0.6- 2.0V until fully colored and powered on. After the camera module 608 is turned off, the application of the control voltage is stopped or the electrodes of the electrochromic module 100 are short-circuited, so that the electrochromic module 100 is discolored.
  • the camera module 608 is in the long exposure mode, for the electrochromic module 100 with memory effect, the electrochromic module 100 is immediately controlled by the control voltage to start coloring; after the exposure, the electrochromic The module 100 is immediately controlled by the control voltage and begins to fade; the control voltage can be 0.6-2.0V.
  • the electrochromic module 100 is immediately controlled by the control voltage to start coloring; after the exposure is completed, the application of the control voltage is stopped or the two poles of the electrochromic module 100 are short-circuited, so that the electric The color of the photochromic module 100 is faded.
  • the electrochromic module 100 can clearly indicate the activation and deactivation of the camera module 608 during photographing.
  • the interaction between the electrochromic module 100 and the exposure process can increase the fun and playability of the electronic device 600 and enhance the differentiation and competitiveness of the products.
  • the disclosed method and device may be implemented in other manners.
  • the device implementations described above are only illustrative.
  • the division of modules or units is only a logical function division.
  • there may be other divisions for example, multiple units or components may be combined or Can be integrated into another system, or some features can be ignored, or not implemented.
  • Units described as separate components may or may not be physically separated, and components shown as units may or may not be physical units, that is, may be located in one place, or may be distributed to multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution in this implementation manner.
  • each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically alone, or two or more units may be integrated into one unit.
  • the above-mentioned integrated units may be implemented in the form of hardware, or may be implemented in the form of software functional units.

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Abstract

本申请提供了一种盖板组件及电子设备，涉及具有变色功能的电子设备的技术领域。本申请中电致变色模组与透明盖板层叠设置，电致变色模组包括封装部、变色部和金属走线，封装部用于对变色部的外周侧进行封装，金属走线设置在封装部内或变色部内靠近封装部的位置；遮蔽层位于透明盖板和电致变色模组之间，封装部和金属走线位于遮蔽层在电致变色模组的正投影区域内。本申请利用遮蔽层对封装部和金属走线进行遮蔽，使得盖板组件上不展示金属走线、封装部等结构，使得盖板组件外观展现力增强。

Description

盖板组件及电子设备 【技术领域】
本申请涉及具有变色功能的电子设备的技术领域，具体是涉及一种盖板组件及电子设备。
【背景技术】
对于内置装饰膜片或者直接在透明盖板上做镀膜的装饰方案，外壳的颜色或图案虽然可以做的非常炫丽，但是无法实现变化，即使某些特殊的纹理效果在不同的角度下展现出不同的颜色，但是外壳展现出的色彩及图案仍然不够丰富。
【发明内容】
本申请实施方式一方面提供了一种盖板组件，包括：
透明盖板；
电致变色模组，与所述透明盖板层叠设置，所述电致变色模组包括封装部、变色部和金属走线，所述封装部封装所述变色部的外周侧，所述金属走线设置在所述封装部内或所述变色部内靠近所述封装部的位置；以及
遮蔽层，位于所述透明盖板和所述电致变色模组之间，所述封装部和所述金属走线位于所述遮蔽层在所述电致变色模组的正投影区域内。
本申请实施方式又提供了一种电子设备，所述电子设备包括显示模组、中框、主板和上述的盖板组件，所述显示模组和所述盖板组件分别位于所述中框相背的两侧，并与所述中框固定连接，所述电致变色模组相较于所述透明盖板更靠近所述显示模组，所述主板与所述电致变色模组耦接，所述主板用于接收控制指令以控制所述电致变色模组变色。
本申请利用遮蔽层对封装部和金属走线进行遮蔽，使得盖板组件上不展示金属走线、封装部等结构，使得盖板组件外观展现力增强。
【附图说明】
为了更清楚地说明本申请实施方式中的技术方案，下面将对实施方式描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施方式，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1揭露了本申请一实施例中电致变色模组的俯视图；
图2揭露了本申请一实施例中图1所示电致变色模组Ⅰ-Ⅰ截面示意图；
图3揭露了本申请一实施例中图1所示第一导电层、第二导电层与柔性电路板的电路连接图；
图4揭露了本申请另一实施例中图1所示电致变色模组Ⅰ-Ⅰ截面示意图；
图5揭露了本申请另一实施例中第一导电层、第二导电层与柔性电路板的电路连接图；
图6揭露了本申请另一实施例中图1所示电致变色模组Ⅰ-Ⅰ截面示意图；
图7揭露了本申请另一实施例中图1所示第一导电层、第二导电层与柔性电路板的电路连接图；
图8揭露了本申请另一实施例中图1所示电致变色模组Ⅰ-Ⅰ截面示意图；
图9揭露了本申请另一实施例中图1所示电致变色模组Ⅰ-Ⅰ截面示意图；
图10揭露了本申请另一实施例中图1所示电致变色模组Ⅰ-Ⅰ截面示意图；
图11、图12、图13和图14分别揭露了本申请另一实施例中图1所示电致变色模组Ⅰ-Ⅰ截面示意图；
图15和图16分别揭露了本申请另一实施例中图1所示电致变色模组Ⅰ-Ⅰ截面示意图；
图17揭露了本申请一实施例中盖板组件的俯视图；
图18揭露了本申请一实施例中图17所示盖板组件Ⅱ-Ⅱ截面示意图；
图19、图20和图21分别揭露了本申请不同实施例中盖板的结构示意图；
图22揭露了本申请另一实施例中盖板组件的俯视图；
图23揭露了本申请另一实施例中盖板组件的俯视图；
图24揭露了本申请一实施例中图22所示盖板组件的Ⅲ-Ⅲ截面图；
图25揭露了本申请另一实施例中图22所示盖板组件的Ⅲ-Ⅲ截面图；
图26揭露了本申请另一实施例中图22所示盖板组件的Ⅲ-Ⅲ截面图；
图27揭露了本申请另一实施例中图22所示盖板组件的Ⅲ-Ⅲ截面图；
图28揭露了本申请一实施例中电子设备一实施方式的结构组成框图；
图29揭露了本申请另一实施中电子设备的结构组成框图；
图30揭露了本申请一实施例中电子设备的结构示意图；
图31和图32分别揭露了本申请一实施例中电子设备的一种操作状态的示意图；
图33揭露了本申请另一实施例中电子设备的结构示意图。
【具体实施方式】
下面结合附图和实施方式，对本申请作进一步的详细描述。特别指出的是，以下实施方式仅用于说明本申请，但不对本申请的范围进行限定。同样的，以下实施方式仅为本申请的部分实施方式而非全部实施方式，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施方式，都属于本申请保护的范围。
在本文中提及“实施方式”意味着，结合实施方式描述的特定特征、结构或特性可以包含在本申请的至少一个实施方式中。在说明书中的各个位置出现该短语并不一定均是指相同的实施方式，也不是与其它实施方式互斥的独立的或备选的实施方式。本领域技术人员显式地和隐式地理解的是，本文所描述的实施方式可以与其它实施方式相结合。
作为在此使用的“电子设备”(也可被称为“终端”或“移动终端”或“电子装置”)包括，但不限于被设置成经由有线线路连接(如经由公共交换电话网络(PSTN)、数字用户线路(DSL)、数字电缆、直接电缆连接，以及/或另一数据连接/网络)和/或经由(例如，针对蜂窝网络、无线局域网(WLAN)、诸如DVB-H网络的数字电视网络、卫星网络、AM-FM广播发送器，以及/或另一通信终端的)无线接口接收/发送通信信号的装置。被设置成通过无线接口通信的通信终端可以被称为“无线通信终端”、“无线终端”或“移动终端”。移动终端的示例包括，但不限于卫星或蜂窝电话；可以组合蜂窝无线电电话与数据处理、传真以及数据通信能力的个人通信系统(PCS)终端；可以包括无线电电话、寻呼机、因特网/内联网接入、Web浏览器、记事簿、日历以及/或全球定位系统(GPS)接收器的PDA；以及常规膝上型和/或掌上型接收器或包括无线电电话收发器的其它电子装置。手机即为配置有蜂窝通信模块的电子设备。
请参阅图1、图2、图3和图4，图1揭露了本申请一实施例中电致变色模组(也可被称为电致变色器件)的俯视图，图2揭露了本申请一实施例中图1所示电致变色模组Ⅰ-Ⅰ截面示意图，图3揭露了本申请一实施例中图1所示第一导电层、第二导电层与柔性电路板(FPC)的电路连接图，图4揭露了本申请另一实施例中图1所示电致变色模组Ⅰ-Ⅰ截面示意图。电致变色模组100可包括第一基材10、第一导电层20、变色材料层30、第二导电层40、第二基材50、胶框60、水氧阻隔单元70及柔性电路板80。其中，第一基材10、第一导电层20、变色材料层30、第二导电层40、第二基材50及水氧阻隔单元70依次层叠设置。胶框60围设在变色材料层30的侧边环周。胶框60与第一导电层20、第二导电层40围设成一容室，用于填充变色材料，以形成变色材料层30。第一基材10用于支撑、承载第一导电层20。第二基材50用于支撑、承载第二导电层40。第一基材10和第二基材50使得电致变色模组100形成一个完整的产品，以便电致变色模组100正常使用。胶框60和/或水氧阻隔单元70用于使电致变色模组100例如变色材料层30完全隔绝外界的水氧环境，避免变色材料氧化失效。柔性电路板80用于分别与第一导电层20、第二导电层40电连接，实现给第一导电层20与第二导电层40通电，驱动第一导电层20与第二导电层40之间的变色材料层30变色(上色或褪色)。
需要指出的是，此处以及下文中的术语“第一”、“第二”等仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。
可以理解地，对于“第一导电层”和“第二导电层”等名称，在不同的实施例中名称之间可以相互转换，在一实施例中，例如“第一导电层”也可以被称为“第二导电层”。
请参阅图2，第一基材10和第一导电层20粘接，用于支撑第一导电层20。第一基材10的材质可以为玻璃或者具有一定硬度的透明树脂材料，譬如PET(Polyethylene terephthalate简称PET或PEIT，俗称涤纶树脂，对苯二甲酸与乙二醇的缩聚物)、PMMA(聚甲基丙烯酸甲酯(Polymethyl methacrylate)，简称PMMA)，又称做压克力、亚克力(英文Acrylic)或有机玻璃)、聚碳酸酯PC、聚酰亚胺PI、环状环烯烃共聚物等。关于第一基材10的更多材料类型，在本领域技术人员的理解范围内，此处不再一一列举并详述。
请参阅图2和图3，第一导电层20位于第一基材10和变色材料层30之间。第一导电层20分别与第一基材10、变色材料层30粘接。第一导电层20由透明导电材料制成。透明导电材料可以为铟锡氧化物(ITO)、锌铝氧化物(AZO)或者石墨烯薄膜等。
第一导电层20朝向变色材料层30的一侧设置第一金属走线21和第一接地走线22。其中，第一金属走线21用于与第一导电层20电连接，可给第一导电层20通电，可用于驱动变色材料层30的变色(上色 或褪色)。第一金属走线21与第一接地走线22间隔设置，避免第一金属走线21与第一接地走线22短路，第一接地走线22用于对电致变色模组100进行静电防护。在一实施例中，第一接地走线22可以省略。
在一实施例中，第一金属走线21用于与柔性电路板80电连接，以便实现为电致变色模组100的供电。第一金属走线21可以采用全周走线。在一实施例中，如图2所示，第一金属走线21靠近胶框60设置。第一金属走线21走线范围按照变色材料层30的周围尽量布局最大。第一金属走线21的材料阻抗可选在5欧姆以内，当然是越小越好。第一金属走线21具体可以是通过设置金属膜然后蚀刻形成，或者是采用局部金属镀层的方式，即需要走线的位置做金属镀层。第一金属走线21所采用的材质可以是钼、铝、银、金、铜等导电性能好的金属材料。在一实施例中，第一金属走线21可通过丝网印刷的方式在第一导电层20上形成金属导线，其阻值极低，例如可达到1.6×10-6Ω·cm左右。在一实施例中，第一金属走线21可以是通过银浆走线设备形成于第一导电层20的边缘位置的银浆走线。所以第一金属走线21也可以被称为银浆走线。
在一实施例中，第一接地走线22围设在第一金属走线21的外围，用于对第一金属走线21进行静电防护，以便实现对与第一金属走线21连接的柔性电路板80、电子设备的保护。第一接地走线22可以采用和第一金属走线21一样的材料，也可以采用和第一金属走线21一样的设置方式设置。对于第一接地走线22的材料和设置方式可以参考第一金属走线21。在一实施例中，如图2所示，第一接地走线22靠近胶框60设置。
在一实施例中，为了避免第一金属走线21和第一接地走线22的短路，第一导电层20在第一金属走线21和第一接地走线22之间开设第一隔离槽23，第一隔离槽23贯穿第一导电层20，使得第一导电层20分为互不相连接的两部分，以此实现第一金属走线21和第一接地走线22的分离，避免第一金属走线21和第一接地走线22短路。在一实施例中，第一隔离槽23内可填充绝缘胶，以实现第一导电层20的完整性。在一实施例中，第一隔离槽23可以省略，在第一接地走线22与第一导电层20之间设置绝缘层，以避免第一接地走线22与第一导电层20电连接，进而避免第一金属走线21与第一接地走线22短路。在一实施例中，请参阅图4，第一金属走线21与变色材料层30接触的表面可设置绝缘保护层211，以阻隔第一金属走线21与变色材料层30直接接触，避免第一金属走线21与第一接地走线22短路。
请参阅图2和图4，变色材料层30分别与第一导电层20、第二导电层40粘接，用于在电压施加时实现变色(上色或褪色)。变色材料层30中包括的电致变色材料可以是有机聚合物(包括聚苯胺、聚噻吩等)、无机材料(普鲁士蓝、过渡金属氧化物，如三氧化钨)以及有机小分子(紫罗精)等。其中，变色材料层30为有机聚合物或者无机材料时，具有相类似的结构。在一实施例中，变色材料层30中变色材料可以为固态或者凝胶态材料。
请参阅图2、图3和图4，第二导电层40与第一导电层20类似，第二导电层40上设置了第二金属走线41、第二接地走线42、第二隔离槽43。第二导电层40与第一导电层20具有相同的作用，并且大体结构、材料相类似，具体可参阅图2、图3和图4，在此就不对第二导电层40以及第二金属走线41、第二接地走线42、第二隔离槽43做过多赘述，仅将其主要元件罗列出来，具体配合关系以及功能参考第一导电层20的介绍。在一实施例中，第一接地走线22和第二接地走线42可以至多省略一个。在一实施例中，第二隔离槽43内可填充绝缘胶。在一实施例中，第一接地走线22与第二接地走线42相对设置或者错位设置。在一实施例中，第一隔离槽23与第二隔离槽43相对设置或者错位设置。在一实施例中，第一金属走线21与第二金属走线41相对设置或者错位设置。在一实施例中，第二隔离槽43可以省略，在第二接地走线42与第二导电层40之间设置绝缘层，以避免第二接地走线42与第二导电层40电连接，进而避免第二金属走线41与第二接地走线42短路。在一实施例中，请参阅图4，第二金属走线41与变色材料层30接触的表面可设置绝缘保护层411，以阻隔第二金属走线11与变色材料层30直接接触，避免第二金属走线41与第二接地走线42短路。在一实施例中，如图2所示，第二金属走线41、第二接地走线42靠近胶框60设置。
可以理解地，对于“第一金属走线”、“第二金属走线”和“金属走线”等名称，在不同的实施例中名称之间可以相互转换，在一实施例中，例如“第一金属走线”也可以被称为“第二金属走线”，也可以被称为“金属走线”。
可以理解地，对于“第一接地走线”、“第二接地走线”和“接地走线”等名称，在不同的实施例中名称之间可以相互转换，在一实施例中，例如“第一接地走线”也可以被称为“第二接地走线”，也可以被称为“接地走线”。
请参阅图2、图3和图4，第一导电层20、变色材料层30以及第二导电层40的形成方法则可以是物理气相沉积(PVD，Physical Vapor Deposition)，具体包括真空蒸发、溅射、离子镀(空心阴极离子镀、热阴极离子镀、电弧离子镀、活性反应离子镀、射频离子镀、直流放电离子镀)等。
请参阅图2和图4，第二基材50与第一基材10类似，并且具有相同的作用，而且大体结构、材料相 类似，具体可参阅图2、图3和图4，在此就不对第二基材50做过多赘述，具体配合关系以及功能参考第一基材10的介绍。在一实施例中，第二基材50可用制程防护层替代，制程防护层可直接设于第二导电层40上。制程防护层可以是通过物理气相沉积法形成的一层或者多层结构形式，制程防护层的材质则可以为致密金属氧化物或者无机非金属，具体可以为氧化硅、氧化铝、氧化钛等。通过在第二导电层40上设置制程防护层，在电致变色模组100的制程中，能够防止水汽渗透到电致变色模组100的内部(尤其是变色材料层30)，以及可以防止其他层中离子渗透到电致变色模组100的内部，可以对电致变色模组100形成阻隔保护，防止离子渗透破坏变色材料层30，进而提高电致变色模组100的可靠性。可以理解地，第一基材10也可以用制程防护层替代。
请参阅图2和图4，胶框60可围设在第一基材10、第一导电层20、变色材料层30、第二导电层40和第二基材50的侧边环周，并分别与第一基材10、第一导电层20、变色材料层30、第二导电层40和第二基材50粘接。胶框60用于粘接第一导电层20以及第二导电层40，使得第一导电层20和第二导电层40之间形成容室，以用于填充变色材料形成变色材料层30。另外，胶框60也可以阻隔水汽从电致变色模组100的侧边渗透到电致变色模组100内部例如变色材料层30内。在一实施例中，胶框60采用的胶水的性能要求：A、胶水材料中Na +、K +含量低；B、胶水与玻璃表面、水氧阻隔单元70、PET面粘附力高；C、粘度在3万-15万mPa*s之间；D、水汽透过率WVTR数值在1x10 -2g/m 2/day以下；E、固化条件以UV(紫外光)固化和UV+低温(＜90℃)热固类为主，且固化后具有一定柔韧性。在一实施例中，胶框60可采用紫外光固化胶形成。胶框60的材料通常也选择紫外固化型和热固化型框胶按照一定的组分混合在一起，制作成紫外加热固化混合型框胶。
请参阅图2和图4，电致变色模组100中的变色材料层30(包含电致变色功能材料、电解质和离子储存层等混合物)在一定电压下发生氧化还原反应，表现为着色和褪色变化。变化过程会经历一些不稳定的化学状态，对水氧及其敏感，即少量的水氧混入其中将会引发不可逆的副反应，造成电致变色模组100失效。因此为了对电致变色模组100进行良好的封装，使变色材料层30与水氧严格隔离，在第二基材50以及胶框60远离第一基材10一侧的端部上粘接水氧阻隔单元70。水氧阻隔单元70用于使电致变色模组100完全隔绝外界的水氧环境。水氧阻隔单元70可包括水氧阻隔层71和第三基材72。水氧阻隔层71镀设在第三基材72上。其中，第三基材72的材质可与第一基材10类似，具体可以参考第一基材10，在此就不做过多赘述。在一实施例中，水氧阻隔层71可为通过闪蒸或者ALD(原子层沉积镀膜)工艺在第三基材72上镀致密的无机层(SiO 2或Al 2O 3)和有机层或者有机无机叠加复合层。在一实施例中，水氧阻隔层71置于第二基材50与第三基材72之间。在一实施例中，水氧阻隔单元70可以省略。在一实施例中，第三基材72可以省略，水氧阻隔层71可以直接设置在第二基材50上。
在一实施例中，为了实现第二基材50与水氧阻隔单元70的粘接，可以采用透明光学胶(OCA，Optically Clear Adhesive，OCA光学胶)。即第二基材50与水氧阻隔单元70之间还可设置一层OCA光学胶层。
请参阅图3，第一导电层20上设置第一金属走线21和第一接地走线22，第二导电层40上设置第二金属走线41和第二接地走线42。第一金属走线21、第一接地走线22、第二金属走线41和第二接地走线42与柔性电路板80电连接，以实现电致变色模组100通过柔性电路板80与电子设备的电连接。
在一实施例中，请参阅图1和图3，柔性电路板80上设置了第一电路走线81及第二电路走线85，第一电路走线81分别与第一导电层20上的第一金属走线21及第一接地走线22电连接。第二电路走线85分别与第二导电层40上的第二金属走线41及第二接地走线42电连接。
其中，柔性电路板80上的第一电路走线81为依次并排设置的第一接地线82、控制走线83和第二接地线84。第一接地线82与第一接地走线22的一端电连接，第二接地线84与第一接地走线22的另一端电连接。控制走线83与第一金属走线21电连接。
柔性电路板80上的第二电路走线85为依次并排设置的第一接地线86、控制走线87和第二接地线88。第一接地线86与第二接地走线42的一端电连接，第二接地线88与第二接地走线42的另一端电连接。控制走线87与第二金属走线41电连接。
在一实施例中，请参阅图5，其揭露了本申请另一实施例中第一导电层、第二导电层与柔性电路板(FPC)的电路连接图。图5与图3所示的第一导电层20、第二导电层40与柔性电路板80连接关系相似，不同之处在于第二接地线84与第一接地线86短接形成第三接地线89。请参阅图5，柔性电路板80上设置有依次并排设置的第一接地线82、控制走线83、第三接地线89、控制走线87和第二接地线88。在一实施例中，请参阅图5，第一接地线82与第一接地走线22的一端电连接，第三接地线89与第一接地走线22的另一端电连接，且与第二接地走线42的一端电连接，第二接地线88与第二接地走线42的另一端电连接，控制走线83与第一金属走线21电连接，控制走线87与第二金属走线41电连接。
可以理解地，对于“第一电路走线”、“第二电路走线”和“电路走线”等名称，在不同的实施例中名称之间可以相互转换，在一实施例中，例如“第一电路走线”也可以被称为“第二电路走线”，也可以 被称为“电路走线”。
可以理解地，对于“第一接地线”、“第二接地线”、“第三接地线”和“接地线”等名称，在不同的实施例中名称之间可以相互转换，在一实施例中，例如“第一接地线”也可以被称为“第二接地线”，也可以被称为“接地线”。
在一实施例中，第一基材10上还设有与第一金属走线21和/或第一接地走线22相邻且绝缘设置的走线连接端，第二金属走线41和/或第二接地走线42与第一基材10上的走线连接端电性导通连接，柔性电路板80分别与走线连接端以及第一金属走线21和/或第一接地走线22电连接。在一实施例中，第二金属走线41与第一基材10上的走线连接端可通过导电银浆连接。例如第二导电层40对应第二金属走线41的位置设有通孔，导电银浆通过通孔与第二金属走线41连接。
请参阅图6和图7，图6揭露了本申请另一实施例中图1所示电致变色模组Ⅰ-Ⅰ截面示意图，图7揭露了本申请另一实施例中图1所示第一导电层、第二导电层与柔性电路板的电路连接图。电致变色模组100可包括上述实施例中所述的第一基材10、第一导电层20、变色材料层30、第二导电层40、第二基材50、胶框60及水氧阻隔单元70。其中，第一基材10、第一导电层20、变色材料层30、第二导电层40、第二基材50及水氧阻隔单元70依次层叠设置。胶框60围设在变色材料层30的侧边环周。胶框60与第一导电层20、第二导电层40围设成一容室，用于填充变色材料，以形成变色材料层30。第一基材10用于支撑、承载第一导电层20。第二基材50用于支撑、承载第二导电层40。第一基材10和第二基材50使得电致变色模组100形成一个完整的产品，以便电致变色模组100正常使用。胶框60和/或水氧阻隔单元70用于使电致变色模组100例如变色材料层30完全隔绝外界的水氧环境，避免变色材料氧化失效。
在一实施例中，第一金属走线21采用局部走线的方式。例如仅布置在第一导电层20的一侧，而第一接地走线22围绕在第一金属走线21的外围。
在一实施例中，第二金属走线41采用局部走线的方式。例如仅布置在第二导电层40的一侧，而第二接地走线42围绕在第二金属走线41的外围。
在一实施例中，第一金属走线21沿靠近第一导电层20表面的边沿位置延伸设置，第二金属走线41沿靠近第二导电层40表面的边沿位置延伸设置。
可以理解地，第一接地走线22既可以采用全周走线环绕在第一金属走线21的周围，也可以采用局部走线，例如第一接地走线22可环绕在第一金属走线21的局部周围例如一侧、相邻两侧、三面环绕。而在第一接地走线22采用局部走线时，第二接地线84可以省略。
请参阅图8，图8揭露了本申请另一实施例中图1所示电致变色模组Ⅰ-Ⅰ截面示意图。电致变色模组100可包括上述实施例中的第一基材10、第一导电层20、变色材料层30、第二导电层40、第二基材50、胶框60及水氧阻隔单元70。其中，第一基材10、第一导电层20、变色材料层30、第二导电层40、第二基材50及水氧阻隔单元70依次层叠设置。胶框60围设在变色材料层30的侧边环周。胶框60与第一导电层20、第二导电层40围设成一容室，用于填充变色材料，以形成变色材料层30。第一基材10用于支撑、承载第一导电层20。第二基材50用于支撑、承载第二导电层40。第一基材10和第二基材50使得电致变色模组100形成一个完整的产品，以便电致变色模组100正常使用。胶框60和/或水氧阻隔单元70用于使电致变色模组100例如变色材料层30完全隔绝外界的水氧环境，避免变色材料氧化失效。
在一实施例中，胶框60置于第一导电层20和第二导电层40之间。胶框60围设在变色材料层30的侧边环周。在一实施例中，胶框60可覆盖在第一金属走线21、第一接地走线22和第一隔离槽23上，避免第一金属走线21和第一接地走线22短路。在一实施例中，胶框60可覆盖在第二金属走线41、第二接地走线42和第二隔离槽43上，避免第二金属走线41和第二接地走线42短路。
请参阅图9，图9揭露了本申请另一实施例中图1所示电致变色模组Ⅰ-Ⅰ截面示意图。电致变色模组100可包括上述实施例中的第一基材10、第一导电层20、变色材料层30、第二导电层40、第二基材50、胶框60及水氧阻隔单元70。其中，第一基材10、第一导电层20、变色材料层30、第二导电层40、第二基材50及水氧阻隔单元70依次层叠设置。胶框60围设在变色材料层30的侧边环周。胶框60与第一导电层20、第二导电层40围设成一容室，用于填充变色材料，以形成变色材料层30。第一基材10用于支撑、承载第一导电层20。第二基材50用于支撑、承载第二导电层40。第一基材10和第二基材50使得电致变色模组100形成一个完整的产品，以便电致变色模组100正常使用。胶框60和/或水氧阻隔单元70用于使电致变色模组100例如变色材料层30完全隔绝外界的水氧环境，避免变色材料氧化失效。
在一实施例中，胶框60可围设在第一基材10、第一导电层20、变色材料层30、第二导电层40和第二基材50的侧边环周，并分别与第一基材10、第一导电层20、变色材料层30、第二导电层40和第二基材50粘接。胶框60部分置于第一导电层20和第二导电层40之间。在一实施例中，胶框60可覆盖在第一金属走线21、第一接地走线22和第一隔离槽23上，避免第一金属走线21和第一接地走线22短路。在一实施例中，胶框60可覆盖在第二金属走线41、第二接地走线42和第二隔离槽43上，避免第二金属走 线41和第二接地走线42短路。
请参阅图10，图10揭露了本申请另一实施例中图1所示电致变色模组Ⅰ-Ⅰ截面示意图。电致变色模组100可包括上述实施例中的第一基材10、第一导电层20、变色材料层30、第二导电层40、第二基材50、胶框60及水氧阻隔单元70。其中，第一基材10、第一导电层20、变色材料层30、第二导电层40、第二基材50及水氧阻隔单元70依次层叠设置。胶框60围设在变色材料层30的侧边环周。胶框60与第一导电层20、第二导电层40围设成一容室，用于填充变色材料，以形成变色材料层30。第一基材10用于支撑、承载第一导电层20。第二基材50用于支撑、承载第二导电层40。第一基材10和第二基材50使得电致变色模组100形成一个完整的产品，以便电致变色模组100正常使用。胶框60和/或水氧阻隔单元70用于使电致变色模组100例如变色材料层30完全隔绝外界的水氧环境，避免变色材料氧化失效。
在一实施例中，胶框60可围设在第一导电层20、变色材料层30、第二导电层40和第二基材50的侧边环周。胶框60远离第二基材50一侧的端部与第一基材10朝向变色材料层30的一侧粘接。胶框60远离第一基材10一侧的端部与水氧阻隔单元70例如水氧阻隔层71朝向变色材料层30的一侧粘接。
请参阅图11、图12、图13和图14，分别揭露了本申请另一实施例中图1所示电致变色模组Ⅰ-Ⅰ截面示意图。电致变色模组100可包括上述实施例中的第一基材10、第一导电层20、变色材料层30、第二导电层40、第二基材50、胶框60及水氧阻隔单元70。其中，第一基材10、第一导电层20、变色材料层30、第二导电层40、第二基材50及水氧阻隔单元70依次层叠设置。胶框60围设在变色材料层30的侧边环周。胶框60与第一导电层20、第二导电层40围设成一容室，用于填充变色材料，以形成变色材料层30。第一基材10用于支撑、承载第一导电层20。第二基材50用于支撑、承载第二导电层40。第一基材10和第二基材50使得电致变色模组100形成一个完整的产品，以便电致变色模组100正常使用。胶框60和/或水氧阻隔单元70用于使电致变色模组100例如变色材料层30完全隔绝外界的水氧环境，避免变色材料氧化失效。
在一实施例中，胶框60可围设在第一导电层20、变色材料层30、第二导电层40和第二基材50的侧边环周。胶框60远离第二基材50一侧的端部与第一基材10朝向变色材料层30的一侧粘接。胶框60远离第一基材10一侧的端部与水氧阻隔单元70例如水氧阻隔层71朝向变色材料层30的一侧粘接。在一实施例中，请参阅图11，第一导电层20朝向变色材料层30一侧表面的部分与胶框60粘接。胶框60与第一导电层20朝向变色材料层30一侧表面粘接的部分可覆盖在第一金属走线21、第一接地走线22及第一隔离槽23的部分上，避免第一金属走线21和第一接地走线22短路。在一实施例中，请参阅图12，第一导电层20朝向变色材料层30一侧表面的部分与胶框60粘接。胶框60与第一导电层20朝向变色材料层30一侧表面粘接的部分可覆盖在第一金属走线21、第一接地走线22及第一隔离槽23的全部上，避免第一金属走线21和第一接地走线22短路。在一实施例中，请参阅图13，第一导电层20朝向变色材料层30一侧表面的部分与胶框60粘接。第二导电层40朝向变色材料层30一侧表面的部分与胶框60粘接。胶框60与第一导电层20朝向变色材料层30一侧表面粘接的部分可覆盖在第一金属走线21、第一接地走线22及第一隔离槽23的全部上，避免第一金属走线21和第一接地走线22短路。胶框60与第二导电层40朝向变色材料层30一侧表面粘接的部分可覆盖在第二金属走线41、第二接地走线42及第二隔离槽43的部分上，避免第二金属走线41和第二接地走线42短路。
可以理解地，这里的第一电路走线21、第一接地走线22、第二电路走线41及第二接地走线42均可采用图7所示的走线布置，使得第一电路走线21、第一接地走线22被胶框60覆盖，使得第二电路走线41及第二接地走线42位于变色材料层30与第二导电层40之间，例如如图14所示，第一导电层20朝向变色材料层30一侧表面的部分与胶框60粘接。第二导电层40朝向变色材料层30一侧表面的部分与胶框60粘接。胶框60与第一导电层20朝向变色材料层30一侧表面粘接的部分可覆盖在第一金属走线21、第一接地走线22及第一隔离槽23的全部上，避免第一金属走线21和第一接地走线22短路。第二金属走线41、第二接地走线42及第二隔离槽43位于变色材料层30与第二导电层40之间，当然，第二金属走线41、第二接地走线42及第二隔离槽43也可以被胶框60全部覆盖。
请参阅图15和图16，分别揭露了本申请另一实施例中图1所示电致变色模组Ⅰ-Ⅰ截面示意图。电致变色模组100可包括上述实施例中的第一基材10、第一导电层20、变色材料层30、第二导电层40、第二基材50、胶框60及水氧阻隔单元70。其中，第一基材10、第一导电层20、变色材料层30、第二导电层40、第二基材50及水氧阻隔单元70依次层叠设置。胶框60围设在变色材料层30的侧边环周。胶框60与第一导电层20、第二导电层40围设成一容室，用于填充变色材料，以形成变色材料层30。第一基材10用于支撑、承载第一导电层20。第二基材50用于支撑、承载第二导电层40。第一基材10和第二基材50使得电致变色模组100形成一个完整的产品，以便电致变色模组100正常使用。胶框60和/或水氧阻隔单元70用于使电致变色模组100例如变色材料层30完全隔绝外界的水氧环境，避免变色材料氧化失效。
在一实施例中，第一导电层20和第二导电层40错位设置。第一导电层20和第二导电层40相互正投 影重叠部分设置变色材料层30。第一金属走线21、第一接地走线22和第一隔离槽23位于第二导电层40在第一导电层20上正投影之外。第二金属走线41、第二接地走线42和第二隔离槽43位于第一导电层20在第二导电层40上正投影之外。胶框60可围设在第一基材10、第一导电层20、变色材料层30、第二导电层40和第二基材50的侧边环周。在一实施例中，胶框60可覆盖在第一金属走线21、第一接地走线22和第一隔离槽23上，避免第一金属走线21和第一接地走线22短路。在一实施例中，胶框60可覆盖在第二金属走线41、第二接地走线42和第二隔离槽43上，避免第二金属走线41和第二接地走线42短路。
可以理解地，第一导电层20和第二导电层40错位设置，可以保证第一导电层20和第二导电层40上的走线(第一金属走线21和第一接地走线22、第二金属走线41、第二接地走线42)没有相互接触的风险，走线步骤可以在第一导电层20和第二导电层40组装完成后通过点银浆轻易实现，降低了短路风险和生产工艺的难度，根据结构设计导线外形可以是直线形、L形走线、口字形走线等。
在一实施例中，请参阅图16，胶框60可覆盖在第一金属走线21、第一接地走线22和第一隔离槽23的胶框60的侧边边缘与第一基材10的侧边边缘平齐。在一实施例中，胶框60可覆盖在第二金属走线41、第二接地走线42和第二隔离槽43的胶框60的侧边边缘与第二基材50的侧边边缘平齐。
接下来阐述一种盖板组件，该盖板组件中包含了上述实施例中所述的电致变色模组100，可实现盖板组件外观效果的主动变化，使得外观表现力明显提升。请参阅图17和图18，图17揭露了本申请一实施例中盖板组件的俯视图，图18揭露了本申请一实施例中图17所示盖板组件Ⅱ-Ⅱ截面示意图。盖板组件200可包括电致变色模组100、盖板300以及装饰单元(也可被称为“外观膜层”)400。其中，盖板300、电致变色模组100和装饰单元400依次层叠设置，可通过电致变色模组100的变色(上色或褪色)实现装饰单元400的展示以及遮蔽，使得盖板组件200外观效果进行主动变化，使得外观表现力明显提升。
请参阅图17和图18，电致变色模组100可包括呈一体结构的变色部101和封装部102。封装部102可围设在变色部101的四周。封装部102可由上述实施例中胶框60或者胶框60与电致变色模组100中其他材料对变色部101进行封装形成，也就是电致变色模组100通电后既不上色也不褪色的区域。变色部101就是可在电致变色模组100通电后通过控制电压进行变色(上色或褪色)的区域。由上述实施例中电致变色模组100的介绍可知走线(例如第一金属走线21、第二金属走线41、第一接地走线22、第二接地走线42)及隔离槽(例如第一隔离槽23、第二隔离槽43)可设置在变色部101和/或封装部102内。
可以理解地，电致变色模组100的功能需要电信号(即控制电压)来驱动，因此在电致变色模组100边缘有封装部102例如胶框60(理想状态为透明，有轻微泛白现象)、走线(第一金属走线21、第二金属走线41、第一接地走线22、第二接地走线42的银白色金属导线)、黄褐色的柔性电路板80，这些组成部分与电致变色模组100外观表现不一致，在透明的盖板300下暴露无遗，影响盖板组件200的外观表现力。所以需要在盖板组件200内设置遮蔽层以对不宜透过盖板300显示的结构例如胶框60、走线(第一金属走线21、第二金属走线41、第一接地走线22、第二接地走线42的银白色金属导线)、隔离槽等进行遮蔽。
请参阅图19、图20和图21，图19、图20和图21分别揭露了本申请不同实施例中盖板300的结构示意图。盖板300可与电致变色模组100例如第一基材10粘接。在一实施例中，为了实现盖板300与电致变色模组100例如第一基材10的粘接，可以采用透明光学胶。即盖板300与电致变色模组100例如第一基材10之间还可设置一层OCA光学胶层。
在一实施例中，盖板300可以由玻璃(透明玻璃、AG玻璃等)、塑料、透明PC(聚碳酸酯)、透明PC/PMMA复合板等透光性材料制成，当然也可以由透光性材料和不透光材料拼接而成(即局部为透明)。在这里不透光材料可以是由透光性材料与其他材料混合而成，也可以单纯为不透光材料。不透光材料可以为塑胶、玻璃等材料。当然只要具有一定的硬度的材料按照透光性来分类，就分为透光性材料和不透光材料。盖板300整体为透明的，所以盖板300也可以被称为“透明盖板”。在一实施例中，请参阅图19、20和图21，盖板300可包括透明区域301和非透明区域302。其中，透明区域301和非透明区域302可以任意排布，也可以根据需要进行各种图案排布。可以理解地，透明区域301可以由透光性材料制成，而非透明区域302可以由不透光材料制成。而透明区域301的光透过率可以由透光性材料的不同决定。在一实施例中，非透明区域302围设在透明区域301的四周，如图19和图20所示。在一实施例中，透明区域301可以分为两部分，非透明区域302围设在透明区域301的四周，如图21所示。当然，透明区域301还可以分为其他部分，在此不做过多限制，同样，非透明区域302也是可以分为至少一个部位，在此不做过多限制。在一实施例中，非透明区域302可以开设摄像孔303，用于与摄像头模组配合，如图20和图21、图23所示，图23揭露了本申请另一实施例中盖板组件的俯视图。可以理解地，透明区域301和非透明区域302的布置方式并不受在此列举的布置形式的限制，在此列举的布置形式仅仅只是示例，其还可以为其他布置形式。
请参阅图22和图23、图24，图24揭露了本申请一实施例中图22所示盖板组件的Ⅲ-Ⅲ截面图。盖板 300在朝向电致变色模组100例如第一基材10的一侧的设置遮蔽层90，用于对电致变色模组100的封装部102以及走线等进行遮蔽。在一实施例中，遮蔽层90在盖板300的正投影区域部分可位于非透明区域302，部分位于透明区域301。当然，可以理解地，遮蔽层90的设置是依据电致变色模组100中的封装部102以及走线等来设置的，所以，遮蔽层90在盖板300上的正投影区域可以全部在透明区域301、也可以全部在非透明区域302。而遮蔽层90在盖板300上的正投影区域全部在非透明区域302时，遮蔽层90起不到遮蔽的作用，所以可以省略。
在一实施例中，请参阅图24，电致变色模组100以及其他结构在形成过程中，也会产生褶皱、异色点等影响美观的结构，进而褶皱、异色点等影响美观的结构也会在透明的盖板300下暴露。为了解决褶皱、异色点等影响美观的结构的问题，盖板300靠近电致变色模组100例如第一基材10一侧的表面设置雾面304。通过在盖板300的表面上设置雾面304，改变盖板300的光透过率，使得用户在外界无法透过雾面304观察到褶皱、异色点等影响美观的结构，而又不影响其他结构透过电致变色模组100的成像。当然，盖板300远离电致变色模组100例如第一基材10一侧的表面也可以设置雾面。在一实施例中，雾面可仅设置在盖板300的与透明区域301相对的部位。在一实施例中，雾面304的雾度可以在65-85％。在一实施例中，盖板300在雾面304部位的粗糙度可以为0.1-2.0微米，当然也可以优选0.2-0.3微米。在一实施例中，盖板300上的雾面304是盖板300表面经磨砂工艺、蒙砂工艺、氢氟酸蚀刻工艺、喷砂工艺或药水砂工艺等工艺制成。
在一实施例中，遮蔽层90可以为镀膜，例如镀膜可以为铟层、二氧化硅层和五氧化三钛层组成的混合层及二氧化硅层和氧化铌层组成的混合层中的一种。在一实施例中，镀膜可以为渐变镀膜，镀膜自镀膜中部向边缘或自镀膜一侧边缘向另一相对侧边缘渐变。
在一实施例中，镀膜可采用真空蒸镀或者磁控溅射，在盖板300需要遮蔽的区域(一般为盖板300的外边缘及摄像孔303区域)镀一层金属薄膜或者氧化物薄，通过几乎不透光的薄膜(膜的宽度、厚度、颜色、纯色或渐变效果可以根据设计需要调整)遮挡住封装部102和走线等。
在一实施例中，遮蔽层90可以为有色油墨层，可采用喷涂、丝印、移印或者电镀的方式，将颜色丰富的油墨或者颜料附着在盖板300需要遮蔽的区域(盖板300外边缘及摄像孔303区域)，通过不透光的材料(材料的宽度、厚度、颜色、纯色或渐变效果可以根据设计需要调整)遮挡住封装部102和走线等。在一实施例中，有色油膜层可为黑边，例如丝印黑边。
在一实施例中，请参阅图22和图24，遮蔽层90可包括第一遮光部91和第二遮光部92。其中，第一遮光部91和第二遮光部92可为一体结构。第一遮光部91呈环状，第一遮光部91环绕在第二遮光部92外围，且第一遮光部91和第二遮光部92相接。在一实施例中，第一遮光部91为采用不导电电镀技术在盖板300的表面镀膜，然后进行黄光涂布、曝光、显影、蚀刻第一遮光部91内的区域膜层，退光阻形成。当然也可以接着在盖板300的表面蒸镀TIO 2、TA 2O 5、NB 2O 5、ZRO 2等材料中的一种制成的高透防指纹膜。最后形成的第一遮光部91可为黑边。当然，第一遮光部91也可以为上述实施例中提到的有色油膜层。第二遮光部92可以采用镀铟、镀铝粉或移印铝粉形成，其颜色可以与电致变色模组上色后的颜色一致，以增强外观表现力。在一实施例中，第一遮光部91和第二遮光部92中的一个可以省略。
在一实施例中，请参阅图25，其揭露了本申请另一实施例中图22所示盖板组件的Ⅲ-Ⅲ截面图。盖板组件200中电致变色模组100与盖板300之间还层叠设置有第四基材500，遮蔽层90可包括镀膜，例如镀膜可以为铟层、二氧化硅层和五氧化三钛层组成的混合层及二氧化硅层和氧化铌层组成的混合层中的一种。在一实施例中，镀膜可以为渐变镀膜，镀膜自镀膜中部向边缘或自镀膜一侧边缘向另一相对侧边缘渐变。在一实施例中，镀膜设置在第四基材500远离第一基材10一侧。第四基材500与第一基材10粘接，例如采用透明光学胶进行粘接，即第一基材10与第二基材50之间还可设置一层OCA光学胶层。在一实施例中，镀膜设置在第四基材500远离盖板300一侧。盖板300与第四基材500粘接，例如采用透明光学胶进行粘接，即盖板300与第四基材500之间还可设置一层OCA光学胶层。在一实施例中，第四基材500也可以作为遮蔽层90的一部分。
在一实施例中，图25中所述的遮蔽层90也可以按照图24所述的遮蔽层90包括第一遮光部91和第二遮光部92设置。具体可参阅图24所述的实施方式，在此不做过多赘述。
可以理解地，对于“第一基材”、“第二基材”、“第三基材”、“第四基材”、“第五基材”和“基材”等名称，在不同的实施例中名称之间可以相互转换，在一实施例中，例如“第一基材”也可以被称为“第二基材”，也可以被称为“基材”。
在一实施例中，镀膜可采用真空蒸镀或者磁控溅射，在第四基材500需要遮蔽的区域镀一层金属薄膜或者氧化物薄，通过几乎不透光的薄膜(薄膜的宽度、厚度、颜色、纯色或渐变效果可以根据设计需要调整)遮挡住封装部102和走线等。
在一实施例中，遮蔽层90可以为有色油墨层，可采用喷涂、丝印、移印或者电镀的方式，将颜色丰 富的油墨或者颜料附着在第四基材500需要遮蔽的区域，通过不透光的材料(材料的宽度、厚度、颜色、纯色或渐变效果可以根据设计需要调整)遮挡住封装部102和走线等。
在一实施例中，请参阅图26，其揭露了本申请另一实施例中图22所示盖板组件的Ⅲ-Ⅲ截面图。遮蔽层90可以为镀膜，例如镀膜可以为铟层、二氧化硅层和五氧化三钛层组成的混合层及二氧化硅层和氧化铌层组成的混合层中的一种。在一实施例中，镀膜可以为渐变镀膜，镀膜自镀膜中部向边缘或自镀膜一侧边缘向另一相对侧边缘渐变。遮蔽层90设置在电致变色模组100例如第一基材10上。
在一实施例中，镀膜可采用真空蒸镀或者磁控溅射，在第一基材10需要遮蔽的区域镀一层金属薄膜或者氧化物薄，通过几乎不透光的薄膜(膜的宽度、厚度、颜色、纯色或渐变效果可以根据设计需要调整)遮挡住封装部102和走线等。
在一实施例中，图26中所述的遮蔽层90也可以按照图24所述的遮蔽层90包括第一遮光部91和第二遮光部92设置。具体可参阅图24所述的实施方式，在此不做过多赘述。
可以理解地，当盖板300设置有透明区域301和非透明区域302时，透明区域301和非透明区域302可类似于图20和图21中透明区域301和非透明区域302的设置。此时，遮蔽层90可包括第一遮光部91和第二遮光部92。其中，第一遮光部91和第二遮光部92并排设置且相接。为了遮蔽走线即封装部102，遮蔽层90可以为条形、不规则非闭环结构；所以第一遮光部91设置在第二遮光部92的一侧，第一遮光部91和第二遮光部92在电致变色模组100上的正投影区域，第一遮光部91相较于第二遮光部92更靠近封装部102，第二遮光部92相较于第一遮光部91更靠近变色部101。
请参阅图18、图24、图25和图26，装饰单元400可包括纳米压印层401、色彩层402以及底漆403。纳米压印层401、色彩层402以及底漆403依次层叠设置。纳米压印层401远离色彩层402的一侧可与电致变色模组100例如第二基材50或第三基材72远离变色材料层30一侧粘接。可以理解，纳米压印层401也可以置于色彩层402和底漆403之间，即，色彩层402、纳米压印层401以及底漆403依次层叠设置。
可以理解地，水氧阻隔单元70的第三基材72靠近变色材料层30的一面具有水氧阻隔层71。水氧阻隔层71设置在第三基材72靠近变色材料层30的一面而不是背离变色材料层30的一面，是为了防止水氧阻隔层71朝外产生的一些刮伤。另外，水氧阻隔层71不能设置在第三基材72和纳米压印层401之间，一方面水氧阻隔层71影响纳米压印层401和第三基材72的结合力，而且纳米压印工艺如果直接接触水氧阻隔层71，可能破坏水氧阻隔层71。水氧阻隔层71的水汽透过率WVTR<1x10-2g/m 2/day(20℃/100％RH)。在第三基材72背离水氧阻隔层71的一面，具有纳米压印层401和色彩层402。色彩层402可以通过光学镀膜或者印刷或印刷加镀膜等工艺实现。纳米压印层401和色彩层402是装饰单元400体限装饰效果的主要载体。纳米压印层401和色彩层402之下为底漆403(油墨)。纳米压印层401和色彩层402结构和调换。
请参阅图27，其揭露了本申请另一实施例中图22所示盖板组件的Ⅲ-Ⅲ截面图。盖板组件200也可以不设置遮蔽层90。装饰单元400可包括纳米压印层401、色彩层402以及底漆403。其中纳米压印层401和色彩层402可以层叠设置在电致变色模组100中第一基材10远离变色材料层30的一侧，即纳米压印层401、色彩层402和第一基材10依次层叠设置，或者色彩层402、纳米压印层401和第一基材10依次层叠设置。当然也可以是盖板组件200中的第四基材500上层叠设置纳米压印层401和色彩层402。在一实施例中，底漆403层叠设置在电致变色模组100中第二基材50或第三基材72上。
可以理解地，在第一基材10与盖板300之间额外增加第四基材，通过在该第四基材上做渐变纳米印刷纹理效果，实现对框胶和走线的遮蔽。该第四基材和盖板300以及第一基材10之间分别通过透明光学胶粘接。额外增加的第四基材边缘遮蔽渐变纹理和水氧阻隔单元70上的纳米压印层401和色彩层402共同组成了对封装、走线区域的外观效果装饰。至此，依托于水氧阻隔单元70、盖板300和边缘胶框60的封装稳定循环，依靠纳米压印层401、色彩层402、纳米印刷纹理效果对走线和胶框60等不美观的区域进行遮蔽，持续性的提供令人赏心悦目的可变色彩外观效果。
接下来阐述一种电子设备，该电子设备利用了上述实施例中的电致变色模组100或盖板组件200作为壳体的一部分。电子设备可以为移动终端，或者其它具有显示和摄像功能的电子装置，具体可以是手机、平板电脑、笔记本电脑、智能手环、智能手表、智能头盔、智能眼镜等。本申请实施例中以手机为例进行描述。可以理解地，电子装置的具体形式还可以是其他，在此不作限制。请参阅图28，其揭露了本申请一实施例中电子设备一实施方式的结构组成框图。该电子设备600可包括中框(图未示)、显示模组(图未示)、控制电路601以及盖板组件200。具体地，中框与盖板组件200组装成壳体，壳体内部设置容纳空间，即中框与盖板300固定连接形成容纳空间。壳体用于承载显示模组和控制电路601。控制电路601(可包括上述实施例中的柔性电路板80)与盖板组件200的电致变色模组100耦合连接，控制电路601用于接收控制指令，控制指令用于控制电致变色模组100变色。当然，壳体的容纳空间还可以用于容纳电池、主板606、处理器(处理器可设置在主板606上)、各种类型的传感器(传感器也可设置在主板606和容纳 空间内的其他位置上，例如温度传感器)等电子零件。在一实施例中，显示模组和盖板组件200分别位于中框相背的两侧，并与中框固定连接，电致变色模组100相较于盖板300更靠近显示模组。
可以理解地，在电子设备600中，主板606作为主要硬件，所以，主板606上可设置上述控制电路601，主板606可通过柔性电路板80与电致变色模组100电连接(也可以说是耦接)，在利用图2、图3和图7所述的第一接地走线22、第二接地走线42布局时，可以避免主板及主板606上的电子零件、控制电路601被静电损坏，即可避免电子设备600被静电损坏。
在一实施例中，请参阅图29，其揭露了本申请另一实施中电子设备600的结构组成框图，与上一实施方式不同的是，本实施方式中的电子设备600还包括信号输入装置602，其中，信号输入装置602与控制电路601耦合连接。具体而言，控制电路601用于接收通过信号输入装置602输入的控制指令，并根据控制指令控制电致变色模组100的工作状态。其中，电致变色模组100的工作状态包括控制改变其电压或者电流信号状态来达到控制电致变色模组100变色(上色或褪色状态)的目的。其中，信号输入装置602可以包括触控显示屏603(也可被称为显示模组)、操作键604、触发传感器605等，详细结构以及信号输入方式如下。
可选地，请参阅图30，图30揭露了本申请一实施例中电子设备600的结构示意图，其中，信号输入装置602可以为触控显示屏603(即上述实施例中的显示模组)，信号输入装置602输入的控制指令可以为触控显示屏603接收到的触控操作，包括滑动、点击以及长按中的至少一种。请参阅图31和图32，分别揭露了本申请一实施例中电子设备600的一种操作状态的示意图。其中，图31中可以表示为操作者(图中标注607可以表示为操作者的手)通过触控显示屏603滑动来输入控制指令；而图32中的状态则可以表示操作者通过点击或者长按触控显示屏603上的图表或者特定位置来进行控制指令的输入过程。
在一实施例中，请继续参阅图29，信号输入装置602可以为操作键604，控制指令还可以为操作键604的触发指令，其中，操作键604可以是单独的按键，也可以是与电子设备600的其他功能按键，譬如电源键、音量键等的复用，根据不同的按键触发方式定义为控制电路601接收的不同控制指令，进而控制电路601可以实现对电致变色模组100进行不同的信号控制。
可选地，控制指令为需要电子设备600进行变色的使用场景，具体可以包括图像采集需求、闪光灯开启需求、自动定时变色需求以及其他功能组件需求中的至少一种。具体来讲，图像采集需求可以是应用在使用者有拍摄需求，譬如拍照、摄像、视频通话等场景、电子设备600解锁需求、支付、加密、接听来电或者其他的确认需求等场景。而闪光灯开启需求则可以是在使用者有对闪光灯开启有需要的情况，具体为控制电路601控制电致变色模组100改变透明状态，还可以结合装饰单元400等结构，使电子设备600可以呈现出变色的外观效果。
进一步地，请继续参阅图29，信号输入装置602可以为触发传感器605，其中，触发传感器605可以为接近传感器、温度传感器、环境光传感器等，触发传感器605采集电子设备600的周边信号，并通过控制电路601控制壳体改变外观颜色。即，壳体外观颜色的改变可以使使用者主动进行操作式的控制，类似通过触控显示屏603以及操作键604的控制方式；还可以为本实施方式中的通过触发传感器605自行检测环境信号，自动控制壳体改变其外观颜色的方式。
本申请实施方式提供的电子设备600，具有变色显示的外观效果，具有非常好的外观美感，另外也可具有防静电的作用。
在一实施例中，请参阅图33，其揭露了本申请另一实施例中电子设备600的结构示意图。该电子设备600还可包括摄像头模组608。其中，摄像头模组608安装在盖板300的摄像孔303处，用于拍摄。摄像头模组608可从盖板300的摄像孔303露出。电致变色模组100为环状结构，可环设在盖板300上的摄像孔303周围。电致变色模组100作为装饰件，与摄像头模组608进行搭配，提高盖板300的外观表现力，使电子设备600的外观整体性不被割裂。另外，电致变色模组100作为装饰件可在摄像头模组608工作时起到搭配的效果。
在一些场景中，例如拍照场景：对于有记忆效应的电致变色模组100，当启动摄像头模组608时，电致变色模组100即刻被控制电压控制开始上色，控制电压可在0.6-2.0V，直至完全上色停止通电。如果在上色完成之前或上色完成后关闭摄像头模组608，则电致变色模组100即刻被控制电压控制开始褪色，控制电压可在0.6-2.0V，电致变色模组100开始褪色，直至完成褪色则停止通电。
在一些场景中，例如拍照场景：对于无记忆效应的电致变色模组100，当启动摄像头模组608时，电致变色模组100即刻被控制电压控制开始上色，控制电压可在0.6-2.0V，直至完全上色并一直通电。关闭摄像头模组608后，则停止施加控制电压或者将电致变色模组100两极短路，以使电致变色模组100褪色。
在一些场景中，例如摄像头模组608处于长曝光模式下，对于有记忆效应的电致变色模组100，电致变色模组100即刻被控制电压控制开始上色；曝光结束后，电致变色模组100即刻被控制电压控制开始褪色；控制电压可在0.6-2.0V。对于无记忆效应的电致变色模组100，电致变色模组100即刻被控制电压控 制开始上色；曝光结束后，则停止施加控制电压或者将电致变色模组100两极短路，以使电致变色模组100褪色。
在拍照场景中，电致变色模组100可以非常明显地指示拍照时摄像头模组608的启动和关闭。在长曝光模式下，电致变色模组100与曝光过程的交互；可增加电子设备600的趣味性和可玩性，提升产品的差异化与竞争力。
在本申请所提供的几个实施方式中，应该理解到，所揭露的方法以及设备，可以通过其它的方式实现。例如，以上所描述的设备实施方式仅仅是示意性的，例如，模块或单元的划分，仅仅为一种逻辑功能划分，实际实现时可以有另外的划分方式，例如多个单元或组件可以结合或者可以集成到另一个系统，或一些特征可以忽略，或不执行。
作为分离部件说明的单元可以是或者也可以不是物理上分开的，作为单元显示的部件可以是或者也可以不是物理单元，即可以位于一个地方，或者也可以分布到多个网络单元上。可以根据实际的需要选择其中的部分或者全部单元来实现本实施方式方案的目的。
另外，在本申请各个实施方式中的各功能单元可以集成在一个处理单元中，也可以是各个单元单独物理存在，也可以两个或两个以上单元集成在一个单元中。上述集成的单元既可以采用硬件的形式实现，也可以采用软件功能单元的形式实现。
以上所述仅为本申请的部分实施方式，并非因此限制本申请的保护范围，凡是利用本申请说明书及附图内容所作的等效装置或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本申请的专利保护范围内。

Claims (20)

  1. 一种盖板组件，其特征在于，包括：
    透明盖板；
    电致变色模组，与所述透明盖板层叠设置，所述电致变色模组包括封装部、变色部和金属走线，所述封装部封装所述变色部的外周侧，所述金属走线设置在所述封装部内或所述变色部内靠近所述封装部的位置；以及
    遮蔽层，位于所述透明盖板和所述电致变色模组之间，所述封装部和所述金属走线位于所述遮蔽层在所述电致变色模组的正投影区域内。
  2. 根据权利要求1所述的盖板组件，其特征在于，所述透明盖板靠近所述电致变色模组一侧的表面设置雾面，所述雾面的雾度在65-85％。
  3. 根据权利要求1所述的盖板组件，其特征在于，所述遮蔽层设于所述透明盖板或所述电致变色模组上，所述遮蔽层为镀膜或有色油墨层。
  4. 根据权利要求3所述的盖板组件，其特征在于，所述镀膜为铟层、二氧化硅层和五氧化三钛层组成的混合层、二氧化硅层和氧化铌层组成的混合层中的一种。
  5. 根据权利要求3所述的盖板组件，其特征在于，所述镀膜为渐变镀膜，所述镀膜自所述镀膜中部向边缘或自所述镀膜一侧边缘向另一相对侧边缘渐变。
  6. 根据权利要求1至5中任一项所述的盖板组件，其特征在于，所述遮蔽层包括为一体结构的第一遮光部和第二遮光部，所述第一遮光部呈环状，所述第一遮光部环绕在所述第二遮光部外围，且所述第一遮光部和所述第二遮光部相接，所述第二遮光部呈现的颜色与所述变色部上色后的颜色一致。
  7. 根据权利要求1至5中任一项所述的盖板组件，其特征在于，所述电致变色模组包括第一基材、第一导电层、变色材料层、第二导电层、第二基材以及胶框，所述第一基材、所述第一导电层、所述变色材料层、所述第二导电层以及所述第二基材依次层叠设置，所述第一导电层与所述第二导电层分别设有所述金属走线，所述胶框用于对所述第一导电层、所述变色材料层和所述第二导电层的外侧面进行封装，
    其中，所述胶框所在区域为所述封装部，所述变色材料层所在区域为所述变色部。
  8. 根据权利要求7所述的盖板组件，其特征在于，所述胶框围设于所述第一导电层、所述变色材料层、所述第二导电层以及所述第二基材的侧边环周并与所述第一基材设置所述第一导电层的表面粘接，或者围设于所述第一基材、所述第一导电层、所述变色材料层、所述第二导电层以及所述第二基材的侧边环周。
  9. 根据权利要求8所述的盖板组件，其特征在于，所述电致变色模组还包括水氧阻隔单元，所述水氧阻隔单元的面积大于所述第二基材的面积，所述水氧阻隔单元与所述第二基材背离所述第二导电层的一侧表面以及所述胶框远离所述第一基材的端面粘接。
  10. 根据权利要求7所述的盖板组件，其特征在于，所述第一导电层与所述第二导电层相互投影重叠的部分之间设有所述变色材料层，所述第一导电层与所述第二导电层相互投影不重叠的部分分别设有所述金属走线。
  11. 根据权利要求10所述的盖板组件，其特征在于，所述电致变色模组还包括水氧阻隔单元，所述水氧阻隔单元与所述第二基材背离所述第二导电层的表面贴合。
  12. 根据权利要求9或11所述的盖板组件，其特征在于，所述水氧阻隔单元包括第三基材以及镀设于所述第三基材至少一侧表面的水氧阻隔层。
  13. 根据权利要求7所述的盖板组件，其特征在于，所述金属走线包括第一金属走线以及第二金属走线；所述第一金属走线与所述第一导电层连接，所述第二金属走线与所述第二导电层连接；所述第一金属走线沿靠近所述第一导电层表面的边沿位置延伸设置，所述第二金属走线沿靠近所述第二导电层表面的边沿位置延伸设置。
  14. 根据权利要求13所述的盖板组件，其特征在于，所述电致变色模组还包括FPC，所述FPC分别与所述第一金属走线以及所述第二金属走线连接。
  15. 根据权利要求13所述的盖板组件，其特征在于，所述电致变色模组还包括FPC，所述第一基材上还设有与所述第一金属走线相邻且绝缘设置的走线连接端，所述第二金属走线与所述第一基材上的走线连接端电性导通连接，所述FPC分别与所述走线连接端以及所述第一金属走线连接。
  16. 根据权利要求13至15中任一项所述的盖板组件，其特征在于，所述第一金属走线以及所述第二金属走线的外表面设有绝缘保护层，所述绝缘保护层用于阻隔所述第一金属走线以及所述第二金属走线与变色材料层。
  17. 一种电子设备，其特征在于，所述电子设备包括显示模组、中框、主板和盖板组件，所述盖板组件包括：
    透明盖板；
    电致变色模组，与所述透明盖板层叠设置，所述电致变色模组包括封装部、变色部和金属走线，所述封装部封装所述变色部的外周侧，所述金属走线设置在所述封装部内或所述变色部内靠近所述封装部的位置；以及
    遮蔽层，位于所述透明盖板和所述电致变色模组之间，所述封装部和所述金属走线位于所述遮蔽层在所述电致变色模组的正投影区域内；
    其中，所述显示模组和所述盖板组件分别位于所述中框相背的两侧，并与所述中框固定连接，所述电致变色模组相较于所述透明盖板更靠近所述显示模组，所述主板与所述电致变色模组耦接，所述主板用于接收控制指令以控制所述电致变色模组变色。
  18. 根据权利要求17所述的电子设备，其特征在于，所述控制指令为所述显示模组接收到的触控操作，所述触控操作包括滑动、点击、长按中的至少一种；
    或者，所述电子设备还包括操作按键，所述控制指令为所述操作按键的触发指令；
    或者，所述电子设备还包括触发传感器，所述控制指令为所述触发传感器的触发指令。
  19. 根据权利要求17或18所述的电子设备，其特征在于，所述电子设备还包括外观膜层，所述外观膜层设于所述电致变色模组远离所述透明盖板的一侧。
  20. 根据权利要求17所述的电子设备，其特征在于，所述电致变色模组包括第一基材、第一导电层、变色材料层、第二导电层、第二基材以及胶框，所述第一基材、所述第一导电层、所述变色材料层、所述第二导电层以及所述第二基材依次层叠设置，所述第一导电层与所述第二导电层分别设有所述金属走线，所述胶框用于对所述第一导电层、所述变色材料层和所述第二导电层的外侧面进行封装，
    其中，所述胶框所在区域为所述封装部，所述变色材料层所在区域为所述变色部。
PCT/CN2021/107463 2020-09-11 2021-07-20 盖板组件及电子设备 WO2022052638A1 (zh)

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