WO2022045655A1 - Filtre diélectrique et filtre en cascade - Google Patents

Filtre diélectrique et filtre en cascade Download PDF

Info

Publication number
WO2022045655A1
WO2022045655A1 PCT/KR2021/010712 KR2021010712W WO2022045655A1 WO 2022045655 A1 WO2022045655 A1 WO 2022045655A1 KR 2021010712 W KR2021010712 W KR 2021010712W WO 2022045655 A1 WO2022045655 A1 WO 2022045655A1
Authority
WO
WIPO (PCT)
Prior art keywords
dielectric
resonant cavity
filter
metal
transmission line
Prior art date
Application number
PCT/KR2021/010712
Other languages
English (en)
Inventor
Ming XIONG
Original Assignee
Samsung Electronics Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co., Ltd. filed Critical Samsung Electronics Co., Ltd.
Publication of WO2022045655A1 publication Critical patent/WO2022045655A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/2002—Dielectric waveguide filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/207—Hollow waveguide filters
    • H01P1/208—Cascaded cavities; Cascaded resonators inside a hollow waveguide structure
    • H01P1/2088—Integrated in a substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P7/00—Resonators of the waveguide type
    • H01P7/10—Dielectric resonators

Definitions

  • the application relates to filter technologies, and more particularly, to a dielectric filter and a cascade filter.
  • the application provides a dielectric filter and a cascade filter, which uses a direct coupling between a dielectric resonant cavity and a metal transmission line to achieve a transmission zero point.
  • Cross-coupling between multiple cavities is not needed, which can greatly simplify the structure of the dielectric filter.
  • a dielectric filter which includes a dielectric resonant cavity, a metal transmission line and a coupling structure, wherein the dielectric resonant cavity includes a dielectric body, and a metal plating layer covering an outer surface of the dielectric body; the metal transmission line and the dielectric resonant cavity are separated by a dielectric material; and, the coupling structure is connected between the dielectric resonant cavity and the metal transmission line, wherein the dielectric resonant cavity is coupled with the metal transmission line through the coupling structure, so as to form a transmission zero point on either side of a transmission channel.
  • a first end of the coupling structure is embedded into the dielectric body; the first end is not electrically connected to the metal plating layer on a surface of the dielectric resonant cavity, so as to form a capacitive transmission zero point; or, the first end is electrically connected to the metal plating layer on the surface of the dielectric resonant cavity, so as to form an inductive transmission zero point.
  • the metal transmission line is arranged on a side surface of the dielectric resonant cavity away from a circuit board.
  • a second end of the coupling structure penetrates the circuit board from a side surface of the circuit board facing the dielectric resonant cavity, so as to electrically connect to the metal transmission line.
  • the side surface of the circuit board facing the dielectric resonant cavity further comprises an insulating layer, the insulating layer surrounds the second end, so as to insulate the coupling structure from a signal of the circuit board.
  • the circuit board further includes a metal hole penetrating the circuit board, the second end of the coupling structure is electrically connected to the side surface of the circuit board facing the dielectric resonant cavity, so as to be in a signal connection with the metal transmission line through the metal hole.
  • the second end of the coupling structure is connected with a midpoint of the metal transmission line.
  • the dielectric filter further includes a debug hole, wherein the debug hole is opened on a side surface of the dielectric resonant cavity, the debug hole and the circuit board are respectively located on opposite surfaces of the dielectric resonant cavity.
  • the debug hole is opened on a top surface of the dielectric body, the first end of the coupling structure extends into the dielectric body from a bottom surface of the dielectric body.
  • the application also provides a cascade filter, including multiple above-mentioned dielectric filters; wherein the dielectric resonant cavities of multiple dielectric filters are arranged at intervals along a straight line, one end or both ends of a metal transmission line of each dielectric filter is electrically connected with a metal transmission line of other dielectric filters, so as to form multiple transmission zero points, the number of transmission zero points of the cascade filter corresponds to the number of transmission zero points of the dielectric filter.
  • the coupling method is not to establish cross-coupling between different resonant cavities, but to use a mutual coupling between such resonant cavity and a non-resonant cavity, by coupling the dielectric resonant cavity with the metal transmission line (microstrip line, etc).
  • the metal transmission line is open at both ends to form a non-closed resonance node.
  • a resonance peak is formed in the transmission channel, and a transmission zero point is formed on either side of the transmission channel.
  • the metal transmission line is usually a metalized line set on the surface of the circuit board, which may be formed on the same circuit board with the input and output circuits of the dielectric filter, etc. That is, in the embodiment, the dielectric filter may form an independent transmission zero point, by using a dielectric resonant cavity and its auxiliary circuit. Subsequently, the filtering performance of the filter may be optimized. In the embodiment, the dielectric filter has a simple structure, and the transmission zero point may be achieved without cross-coupling structure. Thus, the volume and structure of the dielectric filter may be simplified to a great extent. And, the whole machine space can be reasonably arranged, based on the single cavity structure.
  • an independent transmission zero point is generated, by using the single resonant cavity. Subsequently, the frequency and position of the transmission zero point are not affected by the characteristics of the resonant cavity of other filters.
  • Each resonant cavity may be manufactured separately, so as to improve the performance of each dielectric filter, reduce the processing accuracy requirements of each dielectric filter. Subsequently, the product performance may be improved, while reducing costs thereof.
  • FIG.1 is a schematic diagram illustrating structure of a dielectric filter, in accordance with a first embodiment of the application.
  • FIG.2 is a section view of the dielectric filter, in accordance with the first embodiment of the application.
  • FIG.3 is a schematic diagram illustrating structure of a dielectric filter, in accordance with a second embodiment of the application.
  • FIG.4 is a section view of the dielectric filter, in accordance with the second embodiment of the application.
  • FIG.5 is a schematic diagram illustrating structure of a cascade filter, in accordance with an embodiment of the application.
  • FIG.6 is a waveform diagram of the cascade filter illustrated with FIG.5.
  • the application provides a dielectric filter and a cascade filter, which may implement a transmission zero point, by using a direct coupling between a dielectric resonant cavity and a metal transmission line. Cross-coupling among multiple cavities is not needed, thereby greatly refining the structure of the dielectric filter.
  • FIG.1 is a schematic diagram illustrating structure of a dielectric filter, in accordance with a first embodiment of the application.
  • FIG.2 is a section view of the dielectric filter, in accordance with the first embodiment of the application.
  • an embodiment of the application provides a dielectric filter 1, which includes a dielectric resonant cavity 10, a metal transmission line 30 and a coupling structure 40.
  • the dielectric resonant cavity 10 includes a dielectric body 11 and a metal plating layer 12, which covers the outer surface of the dielectric body 11.
  • the metal transmission line 30 and the dielectric resonant cavity 10 are separated by a dielectric material.
  • the coupling structure 40 is connected between the dielectric resonant cavity 10 and the metal transmission line 30.
  • the dielectric resonant cavity 10 is coupled with the metal transmission line 30 through the coupling structure 40, so as to form a transmission zero point on either side of the transmission channel.
  • the space between the metal transmission line 30 and the dielectric resonant cavity 10 may be an air layer or a plate of a circuit board.
  • the dielectric filter 1 only includes one dielectric resonant cavity 10.
  • the coupling method adopts a mutual coupling between such resonant cavity and a non- resonant cavity, by coupling the dielectric resonant cavity 10 and the metal transmission line 30 (microstrip line, etc), instead of establishing a cross-coupling between different resonant cavities.
  • the two ends of the metal transmission line 30 are open to form a non-closed resonance node.
  • a resonance peak is formed in the transmission channel, and a transmission zero point is formed on either side of the transmission channel.
  • a transmission zero point may be achieved, by using a coupling structure between non-adjacent resonant cavities. That is, one transmission zero point needs to be implemented, by using a dielectric filter with three resonant cavities and a cross-coupling structure (mostly negative coupling) set between resonant cavities. Since the transmission zero point needs to be implemented between two non-adjacent resonant cavities, most of the resonant cavities of traditional dielectric filters are arranged in a Z-shaped, S-shaped, or U-shaped form. Taking a dielectric filter with three resonant cavities as an example, three resonant peaks can be formed in the transmission channel, but there is only one transmission zero point.
  • the metal transmission line 30 is usually a metallized line arranged on the surface of the circuit board 20, which may be formed on the same circuit board 20 as the filter circuit of the dielectric filter 1, etc. That is, in the embodiment, the dielectric filter 1 may form an independent transmission zero point, by using the dielectric resonant cavity 10 and its auxiliary circuit, so as to optimize the filtering performance of the filter.
  • the dielectric filter 1 has a simple structure, and may implement a transmission zero point without cross-coupling structure. Subsequently, the volume and structure of the dielectric filter 1 may be simplified to a great extent. Besides, the whole machine space may be reasonably arranged, based on the single cavity structure.
  • each resonant cavity may be manufactured separately, so as to improve the performance of each dielectric filter, and reduce processing accuracy requirements of each dielectric filter. Subsequently, the product performance may be improved while reducing costs thereof.
  • the dielectric body 11 of the dielectric resonant cavity 10 is a solid structure, and its surface is covered with a metal plating layer.
  • the dielectric body 11 is made of solid dielectric material.
  • a first end 41 of the coupling structure 40 is embedded in the dielectric body 11. Besides, the first end 41 is not electrically connected to the metal plating layer 12 on the surface of the dielectric resonant cavity 10, so as to form a capacitive transmission zero point on the left side of the transmission channel.
  • the coupling structure 40 may be a columnar solid metal structure, or may be in the form of a metalized blind hole formed in the dielectric body 11.
  • the first end 41 of the coupling structure 40 is embedded in the dielectric body 11, and is not electrically connected to the metal plating layer 12 on the surface of the dielectric resonant cavity 10.
  • a second end 42 of the coupling structure 40 is connected to the metal transmission line 30 (electrical connection or signal connection). Subsequently, the dielectric resonant cavity 10 and the metal transmission line 30 may implement a negative coupling (electrical coupling), by using the coupling structure 40, so as to form the capacitive transmission zero point on the left side of the transmission channel.
  • the dielectric resonant cavity 10 further includes a debug hole 50.
  • the debug hole 50 is opened on the surface at one side of the dielectric resonant cavity 10.
  • the metal plating layer 12 also covers the surface of the debug hole 50.
  • the debug hole 50 is a blind hole used to adjust the resonance frequency.
  • the debug hole 50 and the circuit board 20 are respectively located on opposite surfaces of the dielectric resonant cavity 10.
  • the debug hole 50 is opened on the top surface of the dielectric body 11.
  • the first end 41 of the coupling structure 40 extends into the dielectric body 11 from the bottom surface of the dielectric body 11.
  • the metal transmission line 30 is arranged on the surface of the circuit board 20 away from the dielectric resonant cavity 10. Subsequently, the dielectric resonant cavity 10 may fix its bottom surface to the circuit board 20. The dielectric material of the circuit board 20 may form a gap between the dielectric resonant cavity 10 and the metal transmission line 30. The bottom surface of the dielectric resonant cavity 10 is also covered with a metal plating layer 12, and the gap between it and the circuit board or metal transmission line 30 may be filled with solder.
  • the second end 42 of the coupling structure 40 penetrates the circuit board 20 from the side surface of the circuit board 20 facing the dielectric resonant cavity 10, so as to from an electrical connection with the metal transmission line 30.
  • the surface of the circuit board 20 facing the dielectric resonant cavity 10 further includes an insulating layer 21.
  • the insulating layer 21 surrounds the second end 42, so as to insulate the coupling structure 40 from the signal of the circuit board 20.
  • FIG.3 is a schematic diagram illustrating structure of a dielectric filter, in accordance with a second embodiment of the application.
  • FIG.4 is a section view of the dielectric filter, in accordance with the second embodiment of the application.
  • one embodiment of the application provides a dielectric filter 1, including: one dielectric resonant cavity 10, a metal transmission line 30 and a coupling structure 40.
  • the dielectric resonant cavity 10 includes a solid dielectric body 11, and a metal plating layer 12 covering the outer surface of the dielectric body 11.
  • the metal transmission line 30 and the dielectric resonant cavity 10 are separated by a dielectric material.
  • the coupling structure 40 is connected between the dielectric resonant cavity 10 and the metal transmission line 30.
  • the dielectric resonant cavity 10 couples with the metal transmission line 30 through the coupling structure 40, so as to form a transmission zero point on either side of the transmission channel.
  • the space between the metal transmission line 30 and the dielectric resonant cavity 10 may be an air layer or a plate of the circuit board
  • a first end 41 of the coupling structure 40 is embedded in the dielectric body 11. Besides, the first end 41 is electrically connected with the metal plating layer 12 on the surface of the dielectric resonant cavity 10, so as to form an inductive transmission zero point on the right side of the transmission channel.
  • the coupling structure 40 may be a columnar solid metal structure, or may be in the form of a metalized hole formed in the dielectric body 11.
  • the first end 41 of the coupling structure 40 is embedded in the dielectric body 11, and is grounded by being electrically connected to the metal plating layer 12 on the surface of the dielectric resonant cavity 10.
  • the second end 42 of the coupling structure 40 is connected to the metal transmission line 30 (electrical connection or signal connection). Subsequently, the dielectric resonant cavity 10 and the metal transmission line 30 may form a positive coupling (magnetic coupling) through the coupling structure 40, so as to form an inductive transmission zero point on the right side of the transmission channel.
  • the dielectric resonant cavity 10 may further include a debug hole 50.
  • the debug hole 50 is opened on one side surface of the dielectric resonant cavity 10, and the metal plating layer 12 also covers the surface of the debug hole 50.
  • the debug hole 50 is a blind hole used to adjust the resonance frequency.
  • the debug hole 50 and the circuit board 20 are respectively located on opposite surfaces of the dielectric resonant cavity 10.
  • the debug hole 50 is opened on the top surface of the dielectric body 11.
  • the first end 41 of the coupling structure 40 extends into the dielectric body 11 from the bottom surface of the dielectric body 11.
  • the first end 41 of the coupling structure 40 is not electrically connected to the metal plating layer 12 covering the top surface of the dielectric resonant cavity 10. Instead, the first end 41 of the coupling structure 40 is electrically connected to the metal plating layer 12, which covers the side surface of the dielectric resonant cavity 10. Thus, the first end 41 of the coupling structure 40 may have a bend in the dielectric body 11.
  • the metal transmission line 30 is arranged on the surface of the circuit board 20 away from the dielectric resonant cavity 10. Subsequently, the dielectric resonant cavity 10 may fix its bottom surface to the circuit board 20, while the dielectric material of the circuit board 20 may form a gap between the dielectric resonant cavity 10 and the metal transmission line 30. The bottom surface of the dielectric resonant cavity 10 is also covered with the metal plating layer 12. And the gap between the bottom surface of the dielectric resonant cavity 10 and the circuit board, or metal transmission line 30 may be filled with solder.
  • the circuit board 20 may further include a metal hole 22 penetrating the circuit board 20.
  • the second end 42 of the coupling structure 40 is electrically connected to the surface of the circuit board 20 facing the dielectric resonant cavity 10, so as to be in a signal connection with the metal transmission line 30 through the metal hole 22.
  • the surface of the circuit board 20 facing the dielectric resonant cavity 10 further includes an insulating layer 21.
  • the insulating layer 21 surrounds the second end 42, so as to insulate the coupling structure 40 from the signals of a side surface of the circuit board 20 facing the dielectric resonant cavity 10.
  • the second end 42 of the coupling structure 40 may be connected (electrical connection or signal connection) to a specific position (for example, the midpoint) of the metal transmission line 30.
  • the shape, width, and extension direction of the metal transmission line 30 may affect the amplitude and frequency of the resulting transmission zero point.
  • the shape of the metal transmission line 30 is not limited to the shape shown in FIG. 1 and FIG. 3.
  • an independent transmission zero point is generated, by using a single resonant cavity. Subsequently, the frequency and position of the transmission zero point is not affected by the characteristics of resonant cavity of other filters.
  • Each resonant cavity may be manufactured independently, so as to improve the performance of each dielectric filter, and reduce the processing accuracy requirements of each dielectric filter. Subsequently, the product performance may be improved while reducing costs thereof.
  • the dielectric filter of the application is not limited to a single resonant cavity solution. As shown in FIG.5, the application also provides a cascade filter 2, which includes the dielectric filter provided by the application.
  • the cascade filter 2 includes multiple dielectric filters 1 as show in FIG.1 to FIG.4.
  • the dielectric resonant cavities 10 of multiple dielectric filters 1 are arranged at intervals along a straight line. One end or both ends of the metal transmission line 30 of each dielectric filter 1 are electrically connected to the metal transmission lines 30 of other dielectric filters 1, so as to form multiple transmission zero points.
  • the number of transmission zero points of the cascade filter 2 corresponds to that of the dielectric filter 1.
  • the dielectric filter 1 may generate an independent transmission zero point by using the single resonant cavity, and may adjust the position of the transmission zero point, by adjusting the connection method between the coupling structure and the resonant cavity. Subsequently, it is convenient to combine dielectric filters 1, so as to form the cascade filter 2 with multiple transmission zero points.
  • connection method of the dielectric filter 1 is to connect the metal transmission line 30 of each dielectric filter 1, while the dielectric resonant cavity 10 of each dielectric filter 1 is independent of each other.
  • each dielectric filter 1 forming the cascade filter 2 may form the transmission zero point independently.
  • FIG.5 is a schematic diagram illustrating structure of a cascade filter, in accordance with an embodiment of the application.
  • FIG.6 is a waveform diagram of the cascade filter illustrated with FIG.5.
  • the cascade filter 2 may arrange multiple dielectric filters 1 in a straight line.
  • a convenient connection may be achieved, by arranging the end of the metal transmission line 30 at a corresponding position.
  • the type of the dielectric filter 1 may be selected, according to requirements. For example, the number of dielectric filters 1, which generate capacitive transmission zero points and inductive transmission zero points, may be selected, based on the frequency of the transmission zero point.
  • the cascade filter 2 further includes a dual cavity filter 3, which includes a first resonant cavity 31 and a second resonant cavity 32.
  • the first resonant cavity 31 and the second resonant cavity 31 are coupled through a window.
  • the dual cavity filter 3 does not generate a transmission zero point, due to the limitations of the number and setting positions of the cavities.
  • the cascade filter 2 in FIG.5 includes three dielectric filters generating the capacitive transmission zero point, a dielectric filter generating the inductive transmission zero point, and a dual cavity filter not generating the transmission zero point.
  • three capacitive transmission zero points are generated on the left side of the transmission channel, and one inductive transmission zero point is generated on the right side of the transmission channel.
  • the dielectric filter 1 and cascade filter 2 formed by the dielectric filter 1 may have the following advantages, such as, a simple structure, an independent transmission zero point without interference, and a compact layout, which are especially suitable for equipment with small space in the whole machine, and may be arranged at the long and narrow edge.
  • a traditional band pass filter in order to generate four transmission zero points as shown in FIG.6, a solution of more than four resonant cavities is needed.
  • the arrangement of resonant cavities needs to meet the cross-coupling solution.
  • the dielectric filter only includes one dielectric resonant cavity.
  • the coupling method is not to establish cross-coupling between different resonant cavities, but to use a mutual coupling between such resonant cavity and a non-resonant cavity, by coupling the dielectric resonant cavity with the metal transmission line (microstrip line, etc).
  • the metal transmission line is open at both ends to form a non-closed resonance node.
  • a resonance peak is formed in the transmission channel, and a transmission zero point is formed on either side of the transmission channel.
  • the metal transmission line is usually a metallized line set on the surface of the circuit board, which may be formed on the same circuit board as the filter circuit of the dielectric filter, etc. That is, in the embodiment, the dielectric filter may form an independent transmission zero point, by using a dielectric resonant cavity and its auxiliary circuit, so as to optimize filtering performance of the filter. In the embodiment, the dielectric filter has a simple structure, which may implement the transmission zero point without the cross-coupling structure. Thus, the volume and structure of the dielectric filter may be simplified to a great extent. And, the whole machine space may be reasonably arranged, based on the single cavity structure
  • each resonant cavity may be manufactured separately, so as to improve the performance of each dielectric filter, reduce the processing accuracy requirements of each dielectric filter. Subsequently, the product performance may be improved, while reducing costs thereof.
  • the dielectric filter and the cascade filter formed by the dielectric filter have the advantages, such as, a simple structure, an independent transmission zero point without interference, and a compact layout, which are especially suitable for equipment with small space in the whole machine, and may be arranged at the long and narrow edge.

Landscapes

  • Control Of Motors That Do Not Use Commutators (AREA)

Abstract

L'invention concerne un filtre diélectrique, comprenant une cavité résonante diélectrique, une ligne de transmission métallique et une structure de couplage, la cavité résonante diélectrique comprenant un corps diélectrique solide, et une couche de placage métallique, qui recouvre une surface externe du corps diélectrique ; la ligne de transmission métallique et la cavité résonante diélectrique sont séparées par un matériau diélectrique ; la structure de couplage est connectée entre la cavité résonante diélectrique et la ligne de transmission métallique, la cavité résonante diélectrique est couplée à la ligne de transmission métallique par l'intermédiaire de la structure de couplage, de manière à former un point zéro de transmission de chaque côté d'un canal de transmission. L'invention concerne également un filtre diélectrique et un filtre en cascade, qui peut mettre en œuvre un point zéro de transmission, en utilisant un couplage direct entre une cavité résonante diélectrique et la ligne de transmission métallique, sans couplage croisé parmi de multiples cavités, ce qui simplifie considérablement la structure du filtre diélectrique.
PCT/KR2021/010712 2020-08-27 2021-08-12 Filtre diélectrique et filtre en cascade WO2022045655A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202010877651.4 2020-08-27
CN202010877651.4A CN112164845B (zh) 2020-08-27 2020-08-27 一种介质滤波器和级联滤波器

Publications (1)

Publication Number Publication Date
WO2022045655A1 true WO2022045655A1 (fr) 2022-03-03

Family

ID=73860278

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2021/010712 WO2022045655A1 (fr) 2020-08-27 2021-08-12 Filtre diélectrique et filtre en cascade

Country Status (2)

Country Link
CN (1) CN112164845B (fr)
WO (1) WO2022045655A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130053104A1 (en) * 2011-08-23 2013-02-28 Mesaplexx Pty Ltd Multi-mode filter
CN108183292A (zh) * 2017-11-30 2018-06-19 成都华为技术有限公司 介质滤波器及通信设备
CN110739510A (zh) * 2019-10-29 2020-01-31 摩比科技（深圳）有限公司 一种具有跨腔耦合结构的介质波导滤波器
CN210074110U (zh) * 2019-07-12 2020-02-14 苏州捷频电子科技有限公司 电容耦合结构和介质滤波器
CN111384555A (zh) * 2018-12-31 2020-07-07 深圳市大富科技股份有限公司 介质滤波器、通信设备、制备介质块及介质滤波器的方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5864468B2 (ja) * 2013-03-29 2016-02-17 東光株式会社 誘電体導波管入出力構造
WO2019154496A1 (fr) * 2018-02-08 2019-08-15 Huawei Technologies Co., Ltd. Résonateur diélectrique solide, filtre haute puissance et procédé

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130053104A1 (en) * 2011-08-23 2013-02-28 Mesaplexx Pty Ltd Multi-mode filter
CN108183292A (zh) * 2017-11-30 2018-06-19 成都华为技术有限公司 介质滤波器及通信设备
CN111384555A (zh) * 2018-12-31 2020-07-07 深圳市大富科技股份有限公司 介质滤波器、通信设备、制备介质块及介质滤波器的方法
CN210074110U (zh) * 2019-07-12 2020-02-14 苏州捷频电子科技有限公司 电容耦合结构和介质滤波器
CN110739510A (zh) * 2019-10-29 2020-01-31 摩比科技（深圳）有限公司 一种具有跨腔耦合结构的介质波导滤波器

Also Published As

Publication number Publication date
CN112164845B (zh) 2022-04-12
CN112164845A (zh) 2021-01-01

Similar Documents

Publication Publication Date Title
WO2017030336A1 (fr) Filtre à cavités
WO2017052046A1 (fr) Carte de circuit imprimé souple à durabilité en flexion améliorée
WO2009104882A2 (fr) Filtre accordable en fréquence utilisant un système coulissant
WO2018066790A1 (fr) Filtre radiofréquence
WO2010071304A2 (fr) Diviseur de puissance utilisant un couplage
WO2021060633A1 (fr) Filtre dielectrique
WO2016072659A2 (fr) Duplexeur
CN104919647A (zh) 一种可调谐耦合装置及射频通信装置
WO2014157809A1 (fr) Guide d'onde intégré à substrat ondulé plié
WO2022103224A1 (fr) Filtre diélectrique multimode et filtre en cascade multimode
WO2022045655A1 (fr) Filtre diélectrique et filtre en cascade
WO2021034177A1 (fr) Filtre passe-bas à zéro de transmission
WO2019235708A1 (fr) Filtre à guide d'ondes diélectrique
WO2016072647A1 (fr) Duplexeur
WO2013118938A1 (fr) Filtre passe-bande multiple
WO2016089015A1 (fr) Boîtier de filtre
WO2023080456A1 (fr) Structure d'emballage ayant un entrefer
WO2016072643A2 (fr) Filtre
WO2019194668A1 (fr) Guide d'ondes de transmission de signaux à ondes électromagnétiques
WO2016117834A1 (fr) Guide d'ondes pour la communication entre puces et emballage semi-conducteur le comprenant
WO2016148429A1 (fr) Carte de circuit imprimé souple
WO2021256688A1 (fr) Procédé et système de fabrication de filtre à cavité haute fréquence
WO2021256611A1 (fr) Filtre de guide d'ondes
WO2020054964A1 (fr) Filtre de guide d'ondes en céramique
WO2023287046A1 (fr) Gabarit de connexion pour le test d'un petit connecteur

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21861952

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21861952

Country of ref document: EP

Kind code of ref document: A1