WO2019154496A1 - Résonateur diélectrique solide, filtre haute puissance et procédé - Google Patents

Résonateur diélectrique solide, filtre haute puissance et procédé Download PDF

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Publication number
WO2019154496A1
WO2019154496A1 PCT/EP2018/053153 EP2018053153W WO2019154496A1 WO 2019154496 A1 WO2019154496 A1 WO 2019154496A1 EP 2018053153 W EP2018053153 W EP 2018053153W WO 2019154496 A1 WO2019154496 A1 WO 2019154496A1
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WIPO (PCT)
Prior art keywords
solid dielectric
dielectric resonator
conductive coating
transmission line
plane
Prior art date
Application number
PCT/EP2018/053153
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English (en)
Inventor
Michael Guess
Original Assignee
Huawei Technologies Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co., Ltd. filed Critical Huawei Technologies Co., Ltd.
Priority to PCT/EP2018/053153 priority Critical patent/WO2019154496A1/fr
Publication of WO2019154496A1 publication Critical patent/WO2019154496A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P7/00—Resonators of the waveguide type
    • H01P7/10—Dielectric resonators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/2002—Dielectric waveguide filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/201—Filters for transverse electromagnetic waves
    • H01P1/203—Strip line filters
    • H01P1/20309—Strip line filters with dielectric resonator
    • H01P1/20318—Strip line filters with dielectric resonator with dielectric resonators as non-metallised opposite openings in the metallised surfaces of a substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H01P5/087—Transitions to a dielectric waveguide

Definitions

  • Implementations described herein generally relate to a solid dielectric resonator configured to operate in one or more modes in conjunction with a coaxial transmission line, external to and electrically isolated from the solid dielectric resonator.
  • solid dielectric multi-mode resonator filters comprise several multi-mode resonators, with each resonator coupling energy to the next resonator by means of an inter-resonator coupling elements that are formed as integral physical features in the part.
  • a pin within the ceramic filter creates other manufacturing concerns and tolerance issues.
  • the position, diameter and depth of the pin is controlled by a drilled hole. This is typically machined in the green - or pre-fired - state. All three parameters can vary during the firing process, as the part shrinks, resulting in deviation from the intended performance.
  • the complexity of the parts also means that deviation occurs in secondary variables as a result of variation in a first parameter.
  • the drilled hole must also be completely covered or filled with a highly conductive coating.
  • the hole In order to ensure adequate coating, the hole must also be of sufficient size to avoid air bubbles restricting the flow of the coating on application. This requirement conflicts with the general demand to miniaturise the filter.
  • a metallic probe to couple energy into a microwave filter is well-known to those skilled in the art.
  • the probe inserts into the air space internal to the resonator.
  • the probe is formed by the inclusion of a typically cylindrical feature in the material of the resonator that is produced by moulding or drilling.
  • the cylindrical void is then conductively coated to provide the complete probe, with an area of no conductive coating around the end of the probe, to provide insulation from the electrical ground, formed on the exterior of the resonator completely covered in conductive coating.
  • the probe couples energy into a resonant mode of the block, with the electrical field vector being co-axial with the probe and the magnetic field being circumferential about the pin.
  • the strength or magnitude of the input coupling can be measured in a variety of ways.
  • One figure of merit for a one-port measurement of the coupled energy is the reflected group delay.
  • a lower group delay corresponds with a greater input coupling.
  • Greater input coupling enables a larger overall filter bandwidth for a given return loss and, conversely, a narrow band filter requires a smaller input coupling, for a given return loss.
  • the length is practically limited by the diameter of the hole, otherwise conductively coating the hole during manufacture is difficult.
  • the physical size of the hole requires space within the resonator and contributes several variables to be controlled and considered in the manufacturing tolerance stack-up.
  • the filter After manufacture, the filter must be connected to the rest of the system - namely the antenna and power amplifier. This may typically be achieved in two ways. The first is to use a separate, physical connector, such a Quick disconnect SubMiniature version A (QMA), or similar, soldered to the filter. This then pushes or screws to a receptacle on the PCB. This method provides the highest reliability, as the filter can move sufficiently and independently of the board during thermal expansion. It is also the most expensive method, requiring additional parts and their fitting. Additional space in the system must also be provided to accommodate the connectors.
  • QMA Quick disconnect SubMiniature version A
  • the alternative is to directly solder the filter to the PCB or PCBs that host the amplifier and antenna.
  • This requires a solder joint between the ground on the filter and the ground on the PCB, as well as a second solder joint, between the probe metallisation and a track on the PCB that carries the signal.
  • This is a significantly cheaper and lower volume solution, but suffers from requiring the joining of several different materials that have vastly different coefficients of thermal expansions (solder, ceramic, ceramic metallisation, PCB copper, PCB substrate). Inspection of joint after manufacture is difficult and, after many temperature cycles, the solder joint itself will crack owing to the fatigue of the joint from the Coefficient of Thermal Expansion (CTE) mismatch.
  • CTE Coefficient of Thermal Expansion
  • a solid dielectric resonator configured to operate in one or more modes in conjunction with a coaxial transmission line, external to and electrically isolated from the solid dielectric resonator.
  • the solid dielectric resonator comprises a closed cavity covered by a conductive coating.
  • the conductive coating has an opening in a first plane of the conductive coating.
  • the first plane is parallel with a second plane outside the closed cavity, which second plane comprises the coaxial transmission line.
  • the opening in the conductive coating enables energy from an electromagnetic field generated by the coaxial transmission line to be coupled magnetically to a resonant mode generated inside the closed cavity of the solid dielectric resonator of the solid dielectric resonator.
  • a solid dielectric resonator is provided, without any inserted pin.
  • the solid dielectric resonator could be fixed directly to a dielectric substrate such as a PCB.
  • a dielectric substrate such as a PCB.
  • the previously mentioned problems associated with using a pin within the ceramic filter are omitted, leading to a solid dielectric resonator less prone to mechanical failure, which is easier and thereby cheaper to produce.
  • a more compact filter, occupying less space may be constructed, which is attractive from e.g. a design point of view.
  • the opening in the first plane of the conductive coating may be arranged as at least one slot, extending substantially perpendicular to the coaxial transmission line of the second plane.
  • the at least one slot may be applied symmetrically in relation to the distant coaxial transmission line in some embodiments.
  • the opening in the first plane of the conductive coating may comprise at least one slot extending substantially perpendicular to the coaxial transmission line, and one slot extending substantially in parallel with the coaxial transmission line.
  • each involved slot may be reduced, which may be an advantage when space is limited on the mounting board, or when an alternative is required to avoid unwanted couplings or resonances caused by a particular slot/dielectric/substrate combination.
  • the opening in the first plane of the conductive coating may comprise a conductive element.
  • the conductive element may be isolated from the conductive coating by a by an area of removed conductive coating.
  • the opening in the first plane of the conductive coating may comprise two substantially perpendicular slots having a common intersection, which common intersection comprises the conductive element.
  • the maximum possible coupling is further increased.
  • the described implementation may be applied when size is important or spurious couplings and resonances are problematic.
  • the opening in the first plane of the conductive coating is separated from the coaxial transmission line by a Printed Circuit Board (PCB) and an air gap.
  • PCB Printed Circuit Board
  • the conductive element may be arranged in the slot substantially parallel with the coaxial transmission line.
  • the conductive coating and / or the conductive element comprises a metal plating.
  • a high-power filter comprises a plurality of solid dielectric resonators, according to the first aspect, or any implementation thereof. Further, the high-power filter comprises a coaxial transmission line, connecting the plurality of solid dielectric resonators.
  • a high-power filter is provided, without any inserted pin into solid dielectric resonators of the high-power filter.
  • the solid dielectric resonator could be fixed directly to a dielectric substrate such as a PCB.
  • a more compact filter, occupying less space may be constructed, which is attractive from e.g. a design point of view.
  • a method for manufacturing a solid dielectric resonator according to the first aspect, or any implementation thereof.
  • the method comprises applying a conductive coating on a closed cavity. Further, the method comprises creating an opening in a first plane of the conductive coating. Also, the method furthermore comprises arranging a coaxial transmission line in a second plane, external to the solid dielectric resonator, which is parallel with the first plane of the conductive coating. The method additionally comprises arranging a dielectric medium between the first plane of the conductive coating of the closed cavity, and the second plane comprising the coaxial transmission line.
  • a method of manufacture of a solid dielectric resonator is provided, without requiring any inserted pin into the solid dielectric resonator.
  • the solid dielectric resonator could be fixed directly to a dielectric substrate such as a PCB.
  • a dielectric substrate such as a PCB.
  • Figure 1 illustrates a useful dual-mode electromagnetic field configurations, according to an example.
  • Figure 2 illustrates magnetic fields of the transmission line (into the page) providing the signal and the coupled mode inside the resonator.
  • Figure 3A illustrates a single slot in ceramic resonator with transmission line coupling, according to an example.
  • Figure 3B illustrates a single slot in ceramic resonator with transmission line coupling, according to an example.
  • Figure 3C illustrates a single slot in ceramic resonator with transmission line coupling, according to an example.
  • Figure 4 illustrates a reflected group delay/ input coupling for various lengths of a single slot, according to an example.
  • Figure 5 illustrates a double slot in ceramic resonator with transmission line coupling, according to an example.
  • Figure 6 illustrates a reflected group delay/ input coupling for various lengths of a double slot, according to an example.
  • Figure 7 illustrates a maximum input coupling (reflected group delay) versus slot length for single and dual slots, according to an example.
  • Figure 8 illustrates a single slot coupling with surface director for increasing coupling, according to an example.
  • Figure 9 illustrates a slot and director formed on ceramic by selective removal of conductive coating, according to an example.
  • Figure 10 illustrates a magnetic field configuration for slot coupling using transmission line and conductive director, according to an example.
  • Figure 11 illustrates a reflected group delay /input coupling for various lengths of a single slot with 3 mm director, according to an example.
  • Figure 12 illustrates a maximum input coupling versus slot length for various director lengths, according to an example.
  • Figure 13 illustrates a double slot coupling with surface director for increasing coupling, according to an example.
  • Figure 14 illustrates a reflected group delay/ input coupling for various lengths of a double slot with 1 1 mm director, according to an example.
  • Figure 15 illustrates a maximum input coupling versus slot length for various director lengths, according to an example.
  • Figure 16 illustrates an example of an embodiment in full filter.
  • Figure 17 illustrates an example of an embodiment, showing only circuit board assembly and bottom surface of conductive coating on filter, according to an embodiment of the invention.
  • Figure 18 illustrates an example of an embodiment, showing only circuit board assembly and bottom surface of conductive coating on filter (top view).
  • Figure 19 is a flow chart illustrating a method according to an embodiment of the inv- ention.
  • Embodiments of the invention described herein are defined as a solid dielectric resonator, a high-power filter and a method for manufacturing a solid dielectric resonator, which may be put into practice in the embodiments described below. These embodiments may, however, be exemplified and realised in many different forms and are not to be limited to the examples set forth herein; rather, these illustrative examples of embodiments are provided so that this disclosure will be thorough and complete.
  • Figure 1 is a schematic illustration over Magnetic and Electric field vectors for orthogonal modes in a solid dielectric multimode resonator 12.
  • the dimensions of the part and the dielectric properties of the material may be chosen to determine the resonance frequency of each mode, where each mode is orthogonal to the next.
  • the embodiments disclosed herein provide a means to couple energy into one of the resonant modes of the filter. It may be applicable to all cases of mode usage in the resonator 12 without limitation, but examples in this document will be shown for use in dual-mode resonators 12, where it is deemed most useful and practical. These are shown in an example of a standard configuration in Figure 1.
  • the dielectric resonator 12 comprises a piece of dielectric (i.e. nonconductive) material, such as e.g. ceramic, that is designed to function as an electro-magnetic resonator in radio-frequency, microwave bands.
  • the microwaves are confined inside the resonator material by the abrupt change in permittivity and/or conductivity at the surface, and bounce back and forth between the sides.
  • the resonant frequencies the microwaves form standing waves in the resonator 12, oscillating with large amplitudes.
  • the dielectric resonator 12 may comprise a block of ceramic that has a large dielectric constant and a low dissipation factor.
  • the resonant frequency is determined by the overall physical dimensions of the resonator 12 and the dielectric constant of the material.
  • the dielectric resonator 12 may be used as bandpass filters and/or in conjunction with antennas.
  • transverse electric transverse magnetic
  • hybrid electromagnetic modes there are three types of resonant modes that can be excited in the dielectric resonator 12: transverse electric, transverse magnetic and/or hybrid electromagnetic modes. Theoretically, there is an infinite number of modes in each of the three groups, and desired mode may be selected based on application requirements.
  • the energy is coupled magnetically to the orthogonal mode, from an adjacent, but otherwise unconnected, transmission line.
  • an opening in the conductive ground plane is instead provided to allow the magnetic fields of the transmission line to transfer to the resonator 12, thereby effecting the coupling. These fields are shown in Figure 2.
  • the coupled mode is orthogonal to the coupled mode using a pin and that no direct connection between signal paths are required to achieve the coupling. Instead only the ground planes of the signal transmission line and the resonator 12 need to be connected.
  • the transmission line may terminate in a short circuit where only one filter is connected, or can continue to subsequent filters where multiplexing is required. All examples in this document assume a short-circuit termination of the line, for simplicity, but no limitation is implied.
  • embodiments of the invention enable a solid dielectric resonator 12 to be fixed directly to a PCB, using only the ground plane as the electrical connection.
  • the signal path from adjacent components may be carried on a PCB track and couple magnetically through and to metallic features on the surface of the resonator 12.
  • the exterior ground area requires the only physical connection.
  • manufacturing can be easily done using existing planar multi-layer PCB methods to connect the resonator 12 to the board with glue, and chemical plating to provide the ground connection.
  • a single solder joint on the ground only (not the signal path) can be used and also inspected.
  • Figure 3A depicts a single slot in ceramic resonator 12 with transmission line coupling, according to an embodiment.
  • a coaxial transmission line 9 carrying a signal and terminating, in some embodiments, in a short circuit at one end 10.
  • the line can be in air, or some other dielectric substrate 11 such as PCB, provided that there is a ground plane provided.
  • the solid dielectric resonator 12 is completely covered in conductive coating 13, except for an uncovered area or opening 14, which in the illustrated embodiment comprises a slit, perpendicular to the direction of the transmission line 9, but parallel to the magnetic fields of both the line 9 and the intended mode to be coupled to.
  • the resonator 12 is electrically attached to the top surface of the transmission line ground 15, where an identical slot may be cut in some embodiments, allowing the transmission line 9 to be seen.
  • the attachment can be made by solder joint or, if the assembly is made as part of a multi-layer PCB, by a glued PCB that is subsequently copper-plated to connect the grounds.
  • a physical connection between the transmission line signal path 9 and the resonator 12 is not required; i.e. the resonator 12 and the transmission line signal path 9 are electrically isolated from each other.
  • the slot width of the opening 14 may with advantage be as small as possible to enable magnetic flux to pass whilst still being possible to manufacture. This may e.g. be about 10% of the shortest resonator dimension, but other dimensions can be made to work, where spurious transmissions or resonance are avoided.
  • the opening 14 may have another shape, different from a slit, and / or elongated in another direction than perpendicular to the direction of the transmission line 9.
  • the optional short-circuit termination 10 at one end of the transmission line 9 can be provided by metal plating, soldering, plated through vias, or any other practical means, provided good electrical contact is made.
  • the width of the track will also affect the resultant coupling, this can be fixed to match a convenient impedance for the signal transmission line 9.
  • the required coupling to the resonator 12 can then be achieved by varying the length of the opening 14, from zero / no coupling, to the maximum length of the resonator 12/ maximum coupling.
  • the resultant coupling is similar to that obtained by the pin (according to prior art) and is shown for comparison and various slot lengths in Figure 4.
  • FIG. 5 illustrates another embodiment of the resonator 12.
  • the opening 14 in this embodiment comprises a first slot 16, and a second slot 17, which are separated by a gap 18, which gap 18 comprises conductive coating 13.
  • the first slot 16 may ideally be offset in the opposite direction to the second slot 17, so that they are symmetrically positioned.
  • the two slots 16, 17 may be parallel and typically, but not necessarily, of equal length.
  • the gap 18 between the slots 16, 17 can be any size practical such that two distinct slots are retained, and is ideally as small as possible to reduce spurious coupling.
  • the resultant coupling for the case where both slots 16, 17 are equal is shown in Figure 6. Although the maximum possible coupling is very similar to that possible with the first embodiment, it can be seen that all other coupling values are achieved with much smaller slots 16, 17. This may be of particular usefulness when space is limited on the mounting board, or when an alternative is required to avoid unwanted couplings or resonances caused by a particular slot / dielectric/ substrate combination.
  • An improvement can be made by reducing the distance between the transmission line 9 and the opening 14, i.e. the slot opening (i.e. the thickness of the substrate), but this has practical limitations determined by the manufacturing process.
  • the opening 14 of the resonator 12 comprises a slot 19 of removed metallisation, which is removed from both the resonator coating 20 and the transmission line ground plane, as in previously illustrated embodiments.
  • an additional area 21 of metal is removed from the conductive coating 20 of the resonator 12 to produce a small conductive element 22 open-circuit at each end.
  • the element 22 may be substantially perpendicular to the slot 19 of the opening 14, and substantially parallel to the transmission line 9 and may serve as a field director to enable a greater coupling of the magnetic fields between the transmission line 9 and resonator 12.
  • the slot and director pattern on the resonator 12 is shown in Figure 9 and the field resultant field configurations are shown in Figure 10.
  • the director length may be chosen in conjunction with the slot length so as to provide the required input coupling without any spurious resonances or couplings occurring for a given combination of geometry and materials.
  • the width of the coupling should be similar to the width of the perpendicular slot, and typically slightly smaller to minimise the overall size of the coupling structure and filter.
  • the area of removed metallisation around the slot may be chosen to avoid spurious couplings and unnecessary loss, whilst being practical to produce. As the feature does not need to be repeated on the mounting surface, a gap of ⁇ 0.5mm may be possible.
  • the operation of the coupling may otherwise be as previously, with the slot length determining the overall coupling for a given director length. This can be seen in Figures 11 , where input coupling is shown for various slot lengths, for director lengths of 3mm.
  • Figure 12 shows the maximum input coupling possible versus slot length for a variety of director lengths. It can be seen that the maximum possible coupling is greatly increased over previous embodiments.
  • a fourth embodiment is a combination of the previously described embodiment two and three, and is shown in Figure 13.
  • a director 22 is utilised in conjunction with a double slot, forming an opening 14.
  • the implementation of both director 22 and dual slots 14 may be performed as described in the previous embodiments.
  • This combination allows for a slight increase in the overall maximum coupling possible, but also provides alternative combinations for achieving the same coupling, where size is important or spurious couplings and resonances are problematic.
  • the function of the coupling structure can be seen to be similar to previous embodiments and is shown in Figure 14 for a director length of 1 1 mm.
  • FIG. 17 A version of the same assembly is also shown in Figure 17.
  • This embodiment realises a strongly-coupled fourth-order filter, directly mounted on to a circuit board, without a physical connection to the signal path.
  • a suspended coaxial transmission line 9 can be routed from the two board inputs 25/26.
  • the ground planes can be connected to form one single ground plane.
  • the plated through-vias 28 can be used to provide the short-circuit terminations 29 of the transmission line 9 after the input coupling slots 30, which may be applied in this design example.
  • the opening in the ground on the circuit board 23 is larger than the slots on the ceramic. This is acceptable as the conductive coating on the ceramic 31 provides the ground once joined to the PCB 23 and eliminates alignment errors.
  • the director 22 and opening 14, which may comprise a slot pattern, on the conductive coating 31 of the ceramic can be seen more clearly in relation to the transmission line 9 in Figure 18.
  • Figure 19 is a flow chart illustrating embodiments of a method 1900 for manufacturing a solid dielectric resonator 12.
  • the method 1900 aims at manufacturing the previously described solid dielectric resonator 12.
  • the method 1900 may comprise a number of method steps 1901-1904. It is however to be noted that any, some or all of the described steps 1901-1904, may be performed in a somewhat different chronological order than the enumeration indicates, be performed simultaneously or in a somewhat adjusted order according to different embodiments. Further, it is to be noted that some method steps may be performed in a plurality of alternative manners according to different embodiments, and that some such alternative manners may be performed only within some, but not necessarily all embodiments.
  • the method 1900 may comprise the following steps:
  • Step 1901 comprises applying a conductive coating 13 on a closed cavity.
  • the closed cavity may comprise a ceramic block which may be cubic, cuboidic, parallelepipedic, rhombohedronic, hexahedronic, polyhedronic, etc.
  • the conductive coating 13 may comprise a thin layer of metal such as e.g. copper, silver, etc.
  • Step 1902 comprises creating an opening 14 in a first plane of the conductive coating 13.
  • the opening 14 may be created by removing a subset of the applied 1901 conductive coating 13 of the closed cavity.
  • the conductive coating 13 may be removed by laser, in some embodiments.
  • the opening 14 may for example comprise one singular, or a plurality of slots, extending substantially perpendicular to the coaxial transmission line 9.
  • the opening 14 may have many different shapes in different embodiments, such as e.g. a plus sign like shape wherein one of the slots is extending substantially in parallel with the coaxial transmission line 9; or an H-like shape wherein one of the slots is extending substantially in parallel with the coaxial transmission line 9.
  • the opening 14 in the conductive coating 13 comprises a conductive element 22.
  • the conductive element 22 may comprise a piece of conductive coating 13 which has not been removed from the closed cavity.
  • the conductive element 22 may be isolated from the conductive coating 13 by a by an area of removed conductive coating 13. Thereby, the conductive element 22 comprises an island of conductive material inside the opening 14.
  • the opening 14 in the first plane of the conductive coating 13 comprises two substantially perpendicular slots having a common intersection, which common intersection comprises the conductive element 22.
  • Step 1903 comprises arranging a coaxial transmission line 9 in a second plane, external to the solid dielectric resonator 12, which is parallel with the first plane of the conductive coating 13.
  • Step 1904 comprises arranging a dielectric medium between the first plane of the conductive coating 13 of the closed cavity, and the second plane comprising the coaxial transmission line 9.
  • the dielectric medium may comprise e.g. a PCB layer and/or an air layer.
  • the term “and / or” comprises any and all combinations of one or more of the associated listed items.
  • the singular forms “a”, “an” and “the” are to be int erpreted as“at least one”, thus also possibly comprising a plurality of entities of the same kind, unless expressly stated otherwise.
  • the terms “includes”, “comprises”, “including” and / or “comprising”, specifies the presence of stated features, actions, integers, steps, operations, elements, and/ or components, but do not preclude the presence or addition of one or more other features, actions, integers, steps, operations, elements, components, and / or groups thereof.
  • a single unit such as e.g.
  • a processor may fulfil the functions of several items recited in the claims.
  • a computer program may be stored/ distributed on a suitable medium, such as an optical storage medium or a solid- state medium supplied together with or as part of other hardware, but may also be distributed in other forms such as via Internet or other wired or wireless communication system.

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Abstract

L'invention concerne un résonateur diélectrique solide (12) qui est configuré pour fonctionner dans un ou plusieurs modes conjointement avec une ligne de transmission coaxiale (9), et un procédé (1900) pour coupler de l'énergie au résonateur diélectrique solide (12). Le résonateur diélectrique solide (12) comprend : un bloc céramique recouvert d'un revêtement conducteur (13), ayant une zone non recouverte (14) dans le revêtement conducteur (13) sur le côté du résonateur diélectrique solide (12) faisant face à la ligne de transmission coaxiale (9). La zone non recouverte (14) dans le revêtement conducteur (13) permet à l'énergie de la ligne de transmission coaxiale (9) d'être couplée magnétiquement au résonateur diélectrique solide (12) dans un mode résonant.
PCT/EP2018/053153 2018-02-08 2018-02-08 Résonateur diélectrique solide, filtre haute puissance et procédé WO2019154496A1 (fr)

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CN112117518A (zh) * 2019-06-19 2020-12-22 楼氏卡泽诺维亚公司 介质腔体陷波滤波器
CN112164845A (zh) * 2020-08-27 2021-01-01 深圳三星通信技术研究有限公司 一种介质滤波器和级联滤波器
CN112542665A (zh) * 2020-11-16 2021-03-23 深圳三星通信技术研究有限公司 一种多模介质滤波器和多模级联滤波器
CN113451728A (zh) * 2021-05-31 2021-09-28 西南电子技术研究所（中国电子科技集团公司第十研究所） 小型化t型双模谐振器
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US20230155267A1 (en) * 2020-03-04 2023-05-18 Commscope Italy S.R.L. Metallized dielectric waveguide filters having irregular shaped resonant cavities, slanted metallized openings and/or spurious coupling windows

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CN112117518A (zh) * 2019-06-19 2020-12-22 楼氏卡泽诺维亚公司 介质腔体陷波滤波器
CN112117518B (zh) * 2019-06-19 2022-04-05 楼氏卡泽诺维亚公司 带阻滤波器和用于设置带阻滤波器的方法
US11431067B2 (en) * 2019-06-19 2022-08-30 Knowles Cazenovia, Inc. Dielectric cavity notch filter
US20230155267A1 (en) * 2020-03-04 2023-05-18 Commscope Italy S.R.L. Metallized dielectric waveguide filters having irregular shaped resonant cavities, slanted metallized openings and/or spurious coupling windows
CN112164845A (zh) * 2020-08-27 2021-01-01 深圳三星通信技术研究有限公司 一种介质滤波器和级联滤波器
CN112164845B (zh) * 2020-08-27 2022-04-12 深圳三星通信技术研究有限公司 一种介质滤波器和级联滤波器
CN112542665A (zh) * 2020-11-16 2021-03-23 深圳三星通信技术研究有限公司 一种多模介质滤波器和多模级联滤波器
CN113451728A (zh) * 2021-05-31 2021-09-28 西南电子技术研究所（中国电子科技集团公司第十研究所） 小型化t型双模谐振器
CN115377636A (zh) * 2022-08-19 2022-11-22 昆山立讯射频科技有限公司 滤波器及其制造方法
CN115377636B (zh) * 2022-08-19 2023-12-15 苏州立讯技术有限公司 滤波器及其制造方法

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